CA545179A - Bonding of metals to ceramics - Google Patents
Bonding of metals to ceramicsInfo
- Publication number
- CA545179A CA545179A CA545179A CA545179DA CA545179A CA 545179 A CA545179 A CA 545179A CA 545179 A CA545179 A CA 545179A CA 545179D A CA545179D A CA 545179DA CA 545179 A CA545179 A CA 545179A
- Authority
- CA
- Canada
- Prior art keywords
- ceramics
- metals
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA545179T |
Publications (1)
Publication Number | Publication Date |
---|---|
CA545179A true CA545179A (en) | 1957-08-20 |
Family
ID=35702356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA545179A Expired CA545179A (en) | Bonding of metals to ceramics |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA545179A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4129243A (en) * | 1975-07-30 | 1978-12-12 | General Electric Company | Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof |
US5108026A (en) * | 1991-05-14 | 1992-04-28 | Motorola Inc. | Eutectic bonding of metal to ceramic |
US5653379A (en) * | 1989-12-18 | 1997-08-05 | Texas Instruments Incorporated | Clad metal substrate |
-
0
- CA CA545179A patent/CA545179A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4129243A (en) * | 1975-07-30 | 1978-12-12 | General Electric Company | Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof |
US5653379A (en) * | 1989-12-18 | 1997-08-05 | Texas Instruments Incorporated | Clad metal substrate |
US5108026A (en) * | 1991-05-14 | 1992-04-28 | Motorola Inc. | Eutectic bonding of metal to ceramic |
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