CA3150325C - Lic module - Google Patents
Lic module Download PDFInfo
- Publication number
- CA3150325C CA3150325C CA3150325A CA3150325A CA3150325C CA 3150325 C CA3150325 C CA 3150325C CA 3150325 A CA3150325 A CA 3150325A CA 3150325 A CA3150325 A CA 3150325A CA 3150325 C CA3150325 C CA 3150325C
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- Canada
- Prior art keywords
- lic
- frame
- electrode
- biasing member
- stacking direction
- Prior art date
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Links
- 239000000969 carrier Substances 0.000 claims abstract description 24
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003990 capacitor Substances 0.000 claims abstract description 4
- 229910001416 lithium ion Inorganic materials 0.000 claims abstract description 4
- 239000013013 elastic material Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/04—Hybrid capacitors
- H01G11/06—Hybrid capacitors with one of the electrodes allowing ions to be reversibly doped thereinto, e.g. lithium ion capacitors [LIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
- H01G11/76—Terminals, e.g. extensions of current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Battery Mounting, Suspending (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
Abstract
An lithium ion capacitor (LiC) module including: LiC cells each of which includes an electrode, the electrode being located at an upper portion of the LiC cell; carriers each of which includes a holding frame holding at least one of the LiC cells, the carriers being stacked in a predetermined stacking direction; and a circuit board located above the stacked carriers to electrically connect the LiC cells to one another. The electrode of each LiC cell includes a horizontal contact surface. The holding frame of each carrier includes: a frame upper portion including an electrode through hole receiving the electrode therethrough; a frame lower portion located below and facing the frame upper portion; and a biasing member disposed on the frame lower portion and biasing the LiC cell upward to bring the contact surface of the electrode of the LiC cell into surface contact with the circuit board.
Description
DESCRIPTION
Title: LiC MODULE
Technical Field [0001] The present invention relates to a lithium-ion capacitor (LiC) module.
Background Art
Title: LiC MODULE
Technical Field [0001] The present invention relates to a lithium-ion capacitor (LiC) module.
Background Art
[0002] An LiC module is made up of LiC cells connected together into a modular form. The LiC is an electricity storage device combining a negative electrode of a lithium-ion secondary battery and a positive electrode of an electrical double layer capacitor and is characterized by a considerably high power density.
Citation List Patent Literature
Citation List Patent Literature
[0003] PTL 1: Japanese Laid-Open Patent Application Publication No. 2017-Summary
[0004] The LiC cells forming the LiC module are held by carriers, and the carriers holding the LiC cells are stacked on one another. The LiC cells held by the carriers are connected to one another via a circuit board. The LiC cells have a considerably low internal resistance and allow for instantaneous flow of high currents.
However, the quality of contact between the LiC cells and the circuit board could vary due to dimensional errors of the components of the LiC module. Poor contact between the LiC
cells and the circuit board lead to increased contact resistance between the LiC cells and the circuit board and therefore to reduced performance of the LiC module.
However, the quality of contact between the LiC cells and the circuit board could vary due to dimensional errors of the components of the LiC module. Poor contact between the LiC
cells and the circuit board lead to increased contact resistance between the LiC cells and the circuit board and therefore to reduced performance of the LiC module.
[0005] The present invention has been made in view of the above circumstances, and an object of the present disclosure is to provide an LiC module capable of maintaining good quality of contact between LiC cells and a circuit board.
[0006] An LiC module according to one aspect of the present disclosure includes:
LiC cells each of which includes an electrode, the electrode being located at an upper portion of the LiC cell; carriers each of which includes a holding frame holding at least one of the LiC cells, the carriers being stacked in a predetemiined stacking direction; and a Date Recue/Date Received 2023-07-18 circuit board located above the stacked carriers to electrically connect the LiC cells to one another, wherein the electrode of each LiC cell includes a horizontal contact surface, and the holding frame of each carrier includes: a frame upper portion including an electrode through hole receiving the electrode therethrough; a frame lower portion located below and facing the frame upper portion; and a biasing member disposed on the frame lower portion and biasing the LiC cell upward to bring the contact surface of the electrode of the LiC cell into surface contact with the circuit board.
LiC cells each of which includes an electrode, the electrode being located at an upper portion of the LiC cell; carriers each of which includes a holding frame holding at least one of the LiC cells, the carriers being stacked in a predetemiined stacking direction; and a Date Recue/Date Received 2023-07-18 circuit board located above the stacked carriers to electrically connect the LiC cells to one another, wherein the electrode of each LiC cell includes a horizontal contact surface, and the holding frame of each carrier includes: a frame upper portion including an electrode through hole receiving the electrode therethrough; a frame lower portion located below and facing the frame upper portion; and a biasing member disposed on the frame lower portion and biasing the LiC cell upward to bring the contact surface of the electrode of the LiC cell into surface contact with the circuit board.
[0007] With this configuration, the electrodes of the LiC cells can be brought into and kept in surface contact with the circuit board. Thus, good quality of contact between the LiC cells and the circuit board can be maintained.
[0008] In the LiC module, the biasing member may be a flat spring made of an elastic material.
[0009] With this configuration, the biasing member can be formed easily.
[0010] In the LiC module, each carrier may be shaped such that in assembly of the LiC module, the LiC cell is inserted into the holding frame through one side of the holding frame, the one side facing in the stacking direction, and the biasing member may be shaped such that an end portion of the biasing member in the stacking direction is lower in height than a central portion of the biasing member in the stacking direction, the end portion of the biasing member being located toward the one side of the holding frame.
[0011] With this configuration, the LiC cells are prevented from being blocked by the biasing members in assembly of the LiC module. This facilitates the assembly of the LiC
cell.
cell.
[0012] In the LiC module, one end portion of the biasing member in the stacking direction may be fixed to the frame lower portion, and the other end portion of the biasing member in the stacking direction may be spaced from the frame lower portion.
[0013] With this configuration, the biasing member can be integral with the frame lower portion, and the movable range of the biasing member can be widened.
[0014] In the LiC module, the frame lower portion may include an interference avoidance hole extending through a region of the frame lower portion in an up-down direction, the region of the frame lower portion being located in correspondence with the biasing member.
[0015] With this configuration, interference between the biasing member and the Date Recue/Date Received 2023-07-18 frame lower portion can be avoided during movement of the biasing member in the up-down direction.
Advantageous Effects of Invention
Advantageous Effects of Invention
[0016] The configuration as described above makes it possible to provide an LiC
module capable of maintaining good quality of contact between LiC cells and a circuit board.
Brief Description of Drawings
module capable of maintaining good quality of contact between LiC cells and a circuit board.
Brief Description of Drawings
[0017] FIG. 1 is an exploded view of an LiC module.
FIG. 2 is a perspective view of LiC cells and a carrier.
Description of Embodiments
FIG. 2 is a perspective view of LiC cells and a carrier.
Description of Embodiments
[0018] <Overall configuration>
The following will describe an LiC module 100 according to an exemplary embodiment. The overall configuration of the LiC module 100 will be described first.
FIG. 1 is an exploded view of the LiC module 100. FIG. 2 is a perspective view of LiC
cells 10 and a carrier 20. As shown in FIG. 1, the LiC module 100 according to the present embodiment includes LiC cells 10, carriers 20, and a circuit board 30.
The following will describe an LiC module 100 according to an exemplary embodiment. The overall configuration of the LiC module 100 will be described first.
FIG. 1 is an exploded view of the LiC module 100. FIG. 2 is a perspective view of LiC
cells 10 and a carrier 20. As shown in FIG. 1, the LiC module 100 according to the present embodiment includes LiC cells 10, carriers 20, and a circuit board 30.
[0019] As shown in FIG. 2, each LiC cell 10 includes a plate-shaped cell main body 11 having a given thickness and two electrodes 12 (positive and negative electrodes) located at an upper portion of the LiC cell 10. The electrodes 12 are disposed on the upper surface of the cell main body 11. Each electrode 12 includes a cylindrical bolt 13 having a threaded outer circumference and a base 14 to which the bolt 13 is fixed. The base 14 includes a horizontal contact surface 15, which is the upper surface of the base 14.
The bolt 13 and base 14 are integral with each other.
The bolt 13 and base 14 are integral with each other.
[0020] The carriers 20 serve to hold the LiC cells 10. As shown in FIG. 1, the carriers 20 hold the LiC cells 10 in such a manner that the electrodes 12 project out of the carries 20. In the present embodiment, one carrier 20 holds three LiC cells 10, and the carriers 20 holding the LiC cells 10 are stacked in a predetermined direction.
The number of the stacked carriers 20 is not limited to a particular number. For example, one LiC module 100 includes a stack of 40 carriers 20. In this case, one LiC
module 100 Date Recue/Date Received 2023-07-18 includes 120 LiC cells 10. The details of the carriers 20 will be described later.
The number of the stacked carriers 20 is not limited to a particular number. For example, one LiC module 100 includes a stack of 40 carriers 20. In this case, one LiC
module 100 Date Recue/Date Received 2023-07-18 includes 120 LiC cells 10. The details of the carriers 20 will be described later.
[0021] The circuit board 30 serves to electrically connect the LiC cells 10 to one another. The circuit board 30 is located above the stacked carriers 20. The lower surface of the circuit board 30 is provided with wiring to connect all or some of the LiC
cells 10 in series, and the electrodes 12 of the LiC cells 10 are in contact with the wiring.
The circuit board 30 includes mounting holes 31 that receive the bolts 13 of the LiC cells therethrough. Nuts 32 are brought toward the circuit board 30 from above and fastened to the bolts 13 received through the mounting holes 31. The fastening torque of the nuts 32 is controlled to or below a certain level so as not to deform the circuit board 30.
cells 10 in series, and the electrodes 12 of the LiC cells 10 are in contact with the wiring.
The circuit board 30 includes mounting holes 31 that receive the bolts 13 of the LiC cells therethrough. Nuts 32 are brought toward the circuit board 30 from above and fastened to the bolts 13 received through the mounting holes 31. The fastening torque of the nuts 32 is controlled to or below a certain level so as not to deform the circuit board 30.
[0022] <Details of carriers>
Hereinafter, the details of the carriers 20 will be described. In the following description, the direction in which the carriers 20 are stacked will be simply referred to as "stacking direction". The near side in the stacking direction of the carriers 20 in FIG. 2 (lower left side in the plane of the figure) will be referred to as "front"
side, and the far side in the stacking direction in FIG. 2 (upper right side in the plane of the figure) will be referred to as "back" side. The direction perpendicular to the stacking direction and up-down direction will be referred to as "width direction", and the right and left sides with respect to the front side will be referred to as "right" and "left" sides, respectively.
Hereinafter, the details of the carriers 20 will be described. In the following description, the direction in which the carriers 20 are stacked will be simply referred to as "stacking direction". The near side in the stacking direction of the carriers 20 in FIG. 2 (lower left side in the plane of the figure) will be referred to as "front"
side, and the far side in the stacking direction in FIG. 2 (upper right side in the plane of the figure) will be referred to as "back" side. The direction perpendicular to the stacking direction and up-down direction will be referred to as "width direction", and the right and left sides with respect to the front side will be referred to as "right" and "left" sides, respectively.
[0023] Each carrier 20 includes a holding frame 40 holding the LiC cells 10. As shown in FIG. 2, the holding frame 40 of the present embodiment is rectangular. The holding frame 40 includes: an frame upper portion 41 located at the top of the holding frame 40 and extending in the width direction; a frame lower portion 42 located at the bottom of the holding frame 40 and extending in the width direction; a frame right portion 43 located at the right end of the holding frame 40 in the width direction and extending in the up-down direction; a frame left portion 44 located at the left end of the holding frame 40 in the width direction and extending in the up-down direction; a first frame intermediate portion 45 located closer to the right end than the center of the holding frame 40 in the width direction and extending in the up-down direction; and a second frame intermediate portion 46 located closer to the left end than the center of the holding frame 40 in the width direction and extending in the up-down direction. The frame upper portion 41 and the frame lower portion 42 face each other in the up-down direction. The Date Recue/Date Received 2023-07-18 frame right portion 43 and the first frame intermediate portion 45 face each other in the width direction. The frame left portion 44 and the second frame intermediate portion 46 face each other in the width direction. The first frame intermediate portion 45 and the second frame intermediate portion 46 face each other in the width direction.
[0024] The holding frame 40 includes: a first holding area 47 defined by the frame upper portion 41, frame lower portion 42, frame right portion 43, and first frame intermediate portion 45; a second holding area 48 defined by the frame upper portion 41, frame lower portion 42, first frame intermediate portion 45, and second frame intermediate portion 46; and a third holding area 49 defined by the frame upper portion 41, frame lower portion 42, frame left portion 44, and second frame intermediate portion 46.
One LiC
cell 10 is inserted into each of the first, second, and third holding areas 47, 48, and 49.
One LiC
cell 10 is inserted into each of the first, second, and third holding areas 47, 48, and 49.
[0025] All of the first, second, and third holding areas 47, 48, and 49 are open at their front and back sides. The size of the front opening of each of the holding areas 47, 48, and 49 is larger than the size of a cross-section of the cell main body 11 of the LiC cell 10 taken perpendicular to the stacking direction. The size of the back opening of each of the holding areas 47, 48, and 49 is smaller than the size of the cross-section of the cell main body 11 of the LiC cell 10 taken perpendicular to the stacking direction. The dimension of each of the holding areas 47, 48, and 49 in the width direction is substantially equal to the dimension of the LiC cell 10 in the width direction, and the dimension of each of the holding areas 47, 48, and 49 in the up-down direction is larger than the dimension of the LiC cell 10 in the up-down direction. In assembly of the LiC module 100, the LiC cells are inserted into the holding frames 40 through the front sides of the holding frames 40.
[0026] The frame upper portion 41 of the holding frame 40 includes electrode through holes 50 located in correspondence with the electrodes 12 of the LiC
cells 10. In the present embodiment, two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the first holding area 47, two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the second holding area 48, and two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the third holding area 49. Thus, the frame upper portion 41 includes a total of six electrode through holes 50. The electrode through holes 50 are shaped to receive therethrough not only the bolts 13 but the bases 14 of the electrodes 12. The height (thickness) of the bases 14 is greater than the thickness Date Recue/Date Received 2023-07-18 of the frame upper portion 41. Thus, the contact surfaces 15 of the bases 14 received through the electrode through holes 50 can be located above the upper surface of the frame upper portion 41.
cells 10. In the present embodiment, two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the first holding area 47, two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the second holding area 48, and two electrode through holes 50 are located in the region of the frame upper portion 41 that defines a part of the third holding area 49. Thus, the frame upper portion 41 includes a total of six electrode through holes 50. The electrode through holes 50 are shaped to receive therethrough not only the bolts 13 but the bases 14 of the electrodes 12. The height (thickness) of the bases 14 is greater than the thickness Date Recue/Date Received 2023-07-18 of the frame upper portion 41. Thus, the contact surfaces 15 of the bases 14 received through the electrode through holes 50 can be located above the upper surface of the frame upper portion 41.
[0027] As shown in FIG. 2, the holding frame 40 includes biasing members 51 disposed on the frame lower portion 42. The biasing members 51 are located at both ends of each of the holding areas 47, 48, and 49 in the width direction. The biasing members 51 are so-called flat springs and bias the LiC cells 10 upward. The entire holding frame 40 is made of an elastic resin material, and the biasing members 51 are made of the same elastic resin material as the rest of the holding frame 40.
[0028] The biasing members 51 are shaped such that their front and back end portions in the stacking direction are lower in height than their central portions in the stacking direction. That is, the biasing members 51 are bent such that they are convex upward when viewed in the width direction. The back end portions of the biasing members 51 in the stacking direction are fixed to the frame lower portion 42, and the front end portions of the biasing member 51 are spaced from the frame lower portion 42. That is, one end of each biasing member 51 is a fixed end, and the other end of each biasing member 51 is a free end. Further, the frame lower portion 42 includes interference avoidance holes 52 extending through regions of the frame lower portion 42 in the up-down direction, the regions of the frame lower portion 42 being located in correspondence with the biasing members 51. The biasing members 51 enter the interference avoidance holes 52 when moved downward.
[0029] In assembly of the LiC module 100, as previously stated, the LiC
cells 10 are inserted into the holding areas 47,48, and 49 of the holding frame 40 through the front sides of the holding areas 47, 48, and 49. The insertion of each LiC cell 10 is done as follows. The LiC cell 10 is held in a tilted position, the upper portion of the tilted LiC
cell 10 is inserted into a corresponding one of the holding areas 47, 48 and 49, and the electrodes 12 are fitted into the electrode through holes 50 from inside the holding area 47, 48, or 49 such that the electrodes 12 project out of the electrode through holes 50.
Subsequently, the lower portion of the LiC cell 10 is inserted into the holding area 47, 48, or 49. During this insertion, the lower surface of the LiC cell 10 is subjected to an upward force applied from the biasing member 51. The lower surface of the LiC
cell 10 is pressed on the biasing member 51 against the upward force to push the biasing member Date Recue/Date Received 2023-07-18 51 downward and thus insert the lower portion of the LiC cell 10 into the holding area 47, 48, or 49.
cells 10 are inserted into the holding areas 47,48, and 49 of the holding frame 40 through the front sides of the holding areas 47, 48, and 49. The insertion of each LiC cell 10 is done as follows. The LiC cell 10 is held in a tilted position, the upper portion of the tilted LiC
cell 10 is inserted into a corresponding one of the holding areas 47, 48 and 49, and the electrodes 12 are fitted into the electrode through holes 50 from inside the holding area 47, 48, or 49 such that the electrodes 12 project out of the electrode through holes 50.
Subsequently, the lower portion of the LiC cell 10 is inserted into the holding area 47, 48, or 49. During this insertion, the lower surface of the LiC cell 10 is subjected to an upward force applied from the biasing member 51. The lower surface of the LiC
cell 10 is pressed on the biasing member 51 against the upward force to push the biasing member Date Recue/Date Received 2023-07-18 51 downward and thus insert the lower portion of the LiC cell 10 into the holding area 47, 48, or 49.
[0030] <Advantages>
In the LiC module 100 according to the present embodiment, the biasing members 51 bias the LiC cells 10 upward as described above, and thus the contact surfaces 15 of the electrodes 12 of the LiC cells 10 are brought into and kept in surface contact with the circuit board 30. As such, good quality of contact between the LiC cells and the circuit board 30 can be maintained. Additionally, the biasing members 51 of the present embodiment are easy to form because they are so-called flat springs. Further, one end of each biasing member 51 of the present embodiment is a fixed end, and the other end of each biasing member 51 is a free end. Thus, the biasing members 51 are movable over a wide range.
In the LiC module 100 according to the present embodiment, the biasing members 51 bias the LiC cells 10 upward as described above, and thus the contact surfaces 15 of the electrodes 12 of the LiC cells 10 are brought into and kept in surface contact with the circuit board 30. As such, good quality of contact between the LiC cells and the circuit board 30 can be maintained. Additionally, the biasing members 51 of the present embodiment are easy to form because they are so-called flat springs. Further, one end of each biasing member 51 of the present embodiment is a fixed end, and the other end of each biasing member 51 is a free end. Thus, the biasing members 51 are movable over a wide range.
[0031] In the LiC module 100 according to the present embodiment, the front end portions of the biasing members 51 in the stacking direction are lower in height than the central portions of the biasing members 51 in the stacking direction. Thus, during insertion of the LiC cells 10 into the holding frame 40 (holding areas 47, 48, and 49), the lower portions of the LiC cells 10 are not blocked by the biasing members 51.
Further, since the biasing members 51 enter the interference avoidance holes 52 of the frame lower portions 42 when pushed downward, namely when moved downward, interference between the biasing members 51 and the frame lower portion 42 can be avoided.
Further, since the biasing members 51 enter the interference avoidance holes 52 of the frame lower portions 42 when pushed downward, namely when moved downward, interference between the biasing members 51 and the frame lower portion 42 can be avoided.
[0032] In the LiC module 100 according to the present embodiment, the back end of each biasing member 51 in the stacking direction is a fixed end, and the front end of each biasing member 51 in the stacking direction is a free end. However, the back end in the stacking direction may be a free end, and the front end in the stacking direction may be a fixed end. Further, the biasing members 51 may be other than flat springs although the biasing members 51 of the present embodiment are flat springs. For example, the biasing members 51 may be so-called coil springs.
Reference Signs List
Reference Signs List
[0033] 10 LiC cell 12 Electrode contact surface Date Recue/Date Received 2023-07-18 20 carrier 30 circuit board 40 holding frame 41 frame upper portion 42 frame lower portion 50 electrode through hole 51 biasing member 52 interference avoidance hole 100 LiC module Date Recue/Date Received 2023-07-18
Claims (5)
1. A lithium ion capacitor (LiC) module, the LiC module comprising:
LiC cells each of which includes an electrode, the electrode being located at an upper portion of the LiC cell;
carriers each of which includes a holding frame holding at least one of the LiC
cells, the carriers being stacked in a predetermined stacking direction; and a circuit board located above the stacked carriers to electrically connect the LiC cells to one another, wherein the electrode of each LiC cell includes a horizontal contact surface, and the holding frame of each carrier includes:
a frame upper portion including an electrode through hole receiving the electrode therethrough, a frame lower portion located below and facing the frame upper portion, and a biasing member disposed on the frame lower portion and biasing the LiC
cell upward to bring the contact surface of the electrode of the LiC cell into surface contact with the circuit board.
LiC cells each of which includes an electrode, the electrode being located at an upper portion of the LiC cell;
carriers each of which includes a holding frame holding at least one of the LiC
cells, the carriers being stacked in a predetermined stacking direction; and a circuit board located above the stacked carriers to electrically connect the LiC cells to one another, wherein the electrode of each LiC cell includes a horizontal contact surface, and the holding frame of each carrier includes:
a frame upper portion including an electrode through hole receiving the electrode therethrough, a frame lower portion located below and facing the frame upper portion, and a biasing member disposed on the frame lower portion and biasing the LiC
cell upward to bring the contact surface of the electrode of the LiC cell into surface contact with the circuit board.
2. The LiC module according to claim 1, wherein the biasing member is a flat spring made of an elastic material.
3. The LiC module according to claim 2, wherein each carrier is shaped such that in assembly of the LiC module, the LiC cell is inserted into the holding frame through one side of the holding frame, the one side facing in the stacking direction, and the biasing member has a first end portion located toward the one side of the holding frame in the stacking direction and a second end portion opposite to the first end portion in the stacking direction and is shaped such that the first end portion of the biasing member in the stacking direction is lower in height than a central portion of the biasing member in the stacking direction.
4. The LiC module according to claim 3, wherein one of the first end portion or the second end portion of the biasing member in the stacking direction is fixed to the Date Recue/Date Received 2023-07-18 frame lower portion and the other of the first end portion or the second end portion of the biasing member in the stacking direction is spaced from the frame lower portion.
5. The LiC module according to claim 4, wherein the frame lower portion includes an interference avoidance hole extending through a region of the frame lower portion in an up-down direction, the region of the frame lower portion being located in correspondence with the biasing member.
Date Recue/Date Received 2023-07-18
Date Recue/Date Received 2023-07-18
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/036385 WO2021053719A1 (en) | 2019-09-17 | 2019-09-17 | LiC MODULE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA3150325A1 CA3150325A1 (en) | 2021-03-25 |
| CA3150325C true CA3150325C (en) | 2024-05-21 |
Family
ID=74884033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3150325A Active CA3150325C (en) | 2019-09-17 | 2019-09-17 | Lic module |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7142170B2 (en) |
| CA (1) | CA3150325C (en) |
| NO (1) | NO20220439A1 (en) |
| WO (1) | WO2021053719A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173167B2 (en) * | 2006-08-25 | 2013-03-27 | トヨタ自動車株式会社 | Power storage module |
| JP5146092B2 (en) | 2008-05-09 | 2013-02-20 | 株式会社Ｇｓユアサ | Battery assembly spacer and battery assembly using the same |
| JP5271890B2 (en) * | 2009-12-24 | 2013-08-21 | 三菱重工業株式会社 | Battery module and battery pack |
| JP6417856B2 (en) | 2014-10-31 | 2018-11-07 | 住友電気工業株式会社 | Power storage device module |
| WO2016129473A1 (en) | 2015-02-12 | 2016-08-18 | 株式会社豊田自動織機 | Battery pack |
| JP2016189393A (en) | 2015-03-30 | 2016-11-04 | 日本ケミコン株式会社 | Capacitor |
-
2019
- 2019-09-17 WO PCT/JP2019/036385 patent/WO2021053719A1/en active Application Filing
- 2019-09-17 JP JP2021546081A patent/JP7142170B2/en active Active
- 2019-09-17 CA CA3150325A patent/CA3150325C/en active Active
- 2019-09-17 NO NO20220439A patent/NO20220439A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO20220439A1 (en) | 2022-04-12 |
| JP7142170B2 (en) | 2022-09-26 |
| JPWO2021053719A1 (en) | 2021-03-25 |
| WO2021053719A1 (en) | 2021-03-25 |
| CA3150325A1 (en) | 2021-03-25 |
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