CA2896661A1 - Process for producing high solids colloidal silica - Google Patents
Process for producing high solids colloidal silica Download PDFInfo
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- CA2896661A1 CA2896661A1 CA2896661A CA2896661A CA2896661A1 CA 2896661 A1 CA2896661 A1 CA 2896661A1 CA 2896661 A CA2896661 A CA 2896661A CA 2896661 A CA2896661 A CA 2896661A CA 2896661 A1 CA2896661 A1 CA 2896661A1
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- Prior art keywords
- colloid
- solids
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- separation
- filtration
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 61
- 239000008119 colloidal silica Substances 0.000 title claims abstract description 29
- 239000007787 solid Substances 0.000 title claims description 50
- 230000008569 process Effects 0.000 title claims description 32
- 239000000084 colloidal system Substances 0.000 claims abstract description 66
- 239000002245 particle Substances 0.000 claims abstract description 43
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 27
- 239000012535 impurity Substances 0.000 claims abstract description 24
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 10
- 238000001914 filtration Methods 0.000 claims description 29
- 238000000926 separation method Methods 0.000 claims description 24
- 239000012895 dilution Substances 0.000 claims description 21
- 238000010790 dilution Methods 0.000 claims description 20
- 238000000108 ultra-filtration Methods 0.000 claims description 19
- 235000012239 silicon dioxide Nutrition 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 229910052681 coesite Inorganic materials 0.000 claims description 7
- 229910052906 cristobalite Inorganic materials 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 7
- 125000005372 silanol group Chemical group 0.000 claims description 7
- 229910052682 stishovite Inorganic materials 0.000 claims description 7
- 229910052905 tridymite Inorganic materials 0.000 claims description 7
- 125000002091 cationic group Chemical group 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 6
- 230000001965 increasing effect Effects 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 5
- 238000007865 diluting Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 239000008394 flocculating agent Substances 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 229920002472 Starch Polymers 0.000 claims description 3
- 239000000701 coagulant Substances 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 27
- 239000012071 phase Substances 0.000 description 20
- 239000002253 acid Substances 0.000 description 15
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000011859 microparticle Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 9
- 230000005484 gravity Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 150000007513 acids Chemical class 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 150000003839 salts Chemical group 0.000 description 5
- 239000008234 soft water Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 4
- -1 as anti-soilants Substances 0.000 description 4
- 239000003729 cation exchange resin Substances 0.000 description 4
- 238000011026 diafiltration Methods 0.000 description 4
- 239000003456 ion exchange resin Substances 0.000 description 4
- 229920003303 ion-exchange polymer Polymers 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000001471 micro-filtration Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 238000003113 dilution method Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000001728 nano-filtration Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241001101988 Proxys Species 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000009300 dissolved air flotation Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000004508 fractional distillation Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000009291 froth flotation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000000622 liquid--liquid extraction Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000007885 magnetic separation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005374 membrane filtration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000002414 normal-phase solid-phase extraction Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000004537 pulping Methods 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- XREXPQGDOPQPAH-QKUPJAQQSA-K trisodium;[(z)-18-[1,3-bis[[(z)-12-sulfonatooxyoctadec-9-enoyl]oxy]propan-2-yloxy]-18-oxooctadec-9-en-7-yl] sulfate Chemical compound [Na+].[Na+].[Na+].CCCCCCC(OS([O-])(=O)=O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(CCCCCC)OS([O-])(=O)=O)COC(=O)CCCCCCC\C=C/CC(CCCCCC)OS([O-])(=O)=O XREXPQGDOPQPAH-QKUPJAQQSA-K 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/146—After-treatment of sols
- C01B33/148—Concentration; Drying; Dehydration; Stabilisation; Purification
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
- D21H17/63—Inorganic compounds
- D21H17/67—Water-insoluble compounds, e.g. fillers, pigments
- D21H17/68—Water-insoluble compounds, e.g. fillers, pigments siliceous, e.g. clays
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/06—Paper forming aids
- D21H21/10—Retention agents or drainage improvers
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Paper (AREA)
Abstract
The invention provides a method for improving the effectiveness of colloidal silica. The method involves removing enough charged impurities from the colloid to prevent the charged particles from causing the colloid to become a viscous gel. The method however also involves not removing too many charged particles so the silica material doesn't gel by cross-linking with itself. This method is quite effective because it recognizes that materials that have accumulated during the formation of the colloid do perform an important function, but they can perform better at a lower concentration.
Description
PROCESS FOR PRODUCING HIGH SOLIDS COLLOIDAL SILICA
Background of the Invention This invention relates to compositions of matter, methods, and apparatuses useful in producing stable high solids colloidal silica and uses thereof.
As described in US Patents 6,486,216, 6,361,653, 5,840,158, 6,361,652, 6,372,805, and US Published Patent Application 2011/0250341 Al, Colloidal silicas, are aqueous systems with silica microparticles suspended within them. Colloidal silicas have been found to be useful in numerous fields of application dependent on the particle size including the manufacture of silicon wafers and carbonless papers, as anti-soilants, lubricants, high temperature binders, abrasives, moisture absorbers, and abrasion resisters. In particular as described for example in US Patents 4,753,710, 4,913,775, 4,388,150, 4,385,961, 5,182,062, and 5,098,520, colloidal silicas have been found to have an especially useful number of applications in the papermaking industry, especially in enhancing the retention and drainage of paper pulps.
The nature of colloidal silicas unfortunately subjects them to a number of limiting constraints. When dosing a colloidal silica two factors are of large significance, average particle size (usually measured in surface area) and the percentage of the aqueous system that the particles comprise (solids %). For a given application there is an ideal particle size at which the colloidal silica will be most effective. Often a user would prefer to apply as high a solids % at that particle size as possible. However applying that ideal particle size is often impractical because the colloidal silica is not stable at that size at a high solids % for a sufficient length of time.
Stability of colloidal silicas is very important. If the colloids are not stable they can only be used during a very narrow window of time. This narrowness forces numerous costs and inconveniences on users in terms of among other things:
storage costs, preparation costs, equipment requirements, and the need to constantly replace no longer stable colloids. The stability of colloidal silica is inversely proportional to both solids% and to particle size. As a result a silica colloid of a given particle size will only be stable for a significant period of time (for example >3-6 months) up to a particular solids % which is usually lower than the ideal amount. When a colloid's solids % exceeds that level, the silanol groups on various microparticles interact with each other and form interlocked complexes which cause the aqueous system to become a highly viscous sludge which is no longer effective for its intended use. In addition, other factors can impair the stability of the microparticles. As a result users are often forced to choose between more stable colloidal silicas that have a lower solids % than they want or they must use colloidal silicas having a desired solids % but which are less stable than desirable.
Thus there is a clear need for and utility in an improved method of producing stable high solids colloidal silica. The art described in this section is not intended to constitute an admission that any patent, publication or other information referred to herein is "prior art" with respect to this invention, unless specifically designated as such. In addition, this section should not be construed to mean that a search has been made or that no other pertinent information as defined in 37 C.F.R.
Background of the Invention This invention relates to compositions of matter, methods, and apparatuses useful in producing stable high solids colloidal silica and uses thereof.
As described in US Patents 6,486,216, 6,361,653, 5,840,158, 6,361,652, 6,372,805, and US Published Patent Application 2011/0250341 Al, Colloidal silicas, are aqueous systems with silica microparticles suspended within them. Colloidal silicas have been found to be useful in numerous fields of application dependent on the particle size including the manufacture of silicon wafers and carbonless papers, as anti-soilants, lubricants, high temperature binders, abrasives, moisture absorbers, and abrasion resisters. In particular as described for example in US Patents 4,753,710, 4,913,775, 4,388,150, 4,385,961, 5,182,062, and 5,098,520, colloidal silicas have been found to have an especially useful number of applications in the papermaking industry, especially in enhancing the retention and drainage of paper pulps.
The nature of colloidal silicas unfortunately subjects them to a number of limiting constraints. When dosing a colloidal silica two factors are of large significance, average particle size (usually measured in surface area) and the percentage of the aqueous system that the particles comprise (solids %). For a given application there is an ideal particle size at which the colloidal silica will be most effective. Often a user would prefer to apply as high a solids % at that particle size as possible. However applying that ideal particle size is often impractical because the colloidal silica is not stable at that size at a high solids % for a sufficient length of time.
Stability of colloidal silicas is very important. If the colloids are not stable they can only be used during a very narrow window of time. This narrowness forces numerous costs and inconveniences on users in terms of among other things:
storage costs, preparation costs, equipment requirements, and the need to constantly replace no longer stable colloids. The stability of colloidal silica is inversely proportional to both solids% and to particle size. As a result a silica colloid of a given particle size will only be stable for a significant period of time (for example >3-6 months) up to a particular solids % which is usually lower than the ideal amount. When a colloid's solids % exceeds that level, the silanol groups on various microparticles interact with each other and form interlocked complexes which cause the aqueous system to become a highly viscous sludge which is no longer effective for its intended use. In addition, other factors can impair the stability of the microparticles. As a result users are often forced to choose between more stable colloidal silicas that have a lower solids % than they want or they must use colloidal silicas having a desired solids % but which are less stable than desirable.
Thus there is a clear need for and utility in an improved method of producing stable high solids colloidal silica. The art described in this section is not intended to constitute an admission that any patent, publication or other information referred to herein is "prior art" with respect to this invention, unless specifically designated as such. In addition, this section should not be construed to mean that a search has been made or that no other pertinent information as defined in 37 C.F.R.
2 1.56(a) exists.
Brief Summary of the Invention At least one embodiment of the invention is directed towards a method for improving the performance of colloidal silica. The method comprises the steps of: providing a colloidal silica, and separating charged particles from the colloid. The separation is conducted to a degree such that cross-linkage inducing interactions between charged particles and silanol groups on the silica decreases but not to such a degree that cross-linkage inducing interactions between silanol groups increases. The separation increases the particle size of the colloid by at least 5%
without impairing the S-Value, or stability of the colloid.
The colloid may be applied to a papermaking system and it may be at least as effective in its application as a similar colloid that has not undergone the separation. The separated particles may be particles that were introduced to the colloid during a heel or resin based formation process. The colloidal particles may have has a surface area of from about 700 m2 /g to about 1100 m2 /g, and may have a percent by weight 5i02 solids level of at least 15. The separation may be accomplished using a dilution filtration process in which the filtration is at least in part ultrafiltration. The dilution may occur at a different time than the filtration and/or may overlap at least in part. The rate of the dilution may be such that fluid passes through a filter in the filtration process at a net rate no faster than the rate the net rate that the charged particles dissociate from colloidal droplets. The method may comprise repeatedly diluting then filtering the colloid, the diluting characterized by decreasing the solids % by between 30 to 80% of the solids %
Brief Summary of the Invention At least one embodiment of the invention is directed towards a method for improving the performance of colloidal silica. The method comprises the steps of: providing a colloidal silica, and separating charged particles from the colloid. The separation is conducted to a degree such that cross-linkage inducing interactions between charged particles and silanol groups on the silica decreases but not to such a degree that cross-linkage inducing interactions between silanol groups increases. The separation increases the particle size of the colloid by at least 5%
without impairing the S-Value, or stability of the colloid.
The colloid may be applied to a papermaking system and it may be at least as effective in its application as a similar colloid that has not undergone the separation. The separated particles may be particles that were introduced to the colloid during a heel or resin based formation process. The colloidal particles may have has a surface area of from about 700 m2 /g to about 1100 m2 /g, and may have a percent by weight 5i02 solids level of at least 15. The separation may be accomplished using a dilution filtration process in which the filtration is at least in part ultrafiltration. The dilution may occur at a different time than the filtration and/or may overlap at least in part. The rate of the dilution may be such that fluid passes through a filter in the filtration process at a net rate no faster than the rate the net rate that the charged particles dissociate from colloidal droplets. The method may comprise repeatedly diluting then filtering the colloid, the diluting characterized by decreasing the solids % by between 30 to 80% of the solids %
3 present at the start of the process, the filtering, except for a final filtration step, comprises returning the solids % to within 10-60% of the solids % present at the start of the process. The dilution may not commence until the rate of the fluid passing through the filter slows. The colloid may be applied to a papermaking process as part of a retention and drainage program and/or may be used in conjunction with polymeric flocculants and/or cationic starch with or without the addition of a coagulant and there is no loss of effectiveness or unwanted side effects when compared to a similar colloid that has not undergone the separation. The degree to which impurities have been removed from the colloid may be measured by correlating it to a measurement of the change in the conductivity of the colloid. The removal of impurities may proceed until the colloidal system has a conductivity of between 40001AS/cm to 70001AS/cm.
Additional features and advantages are described herein, and will be apparent from, the following Detailed Description.
Detailed Description of the Invention The following definitions are provided to determine how terms used in this application, and in particular how the claims, are to be construed.
The organization of the definitions is for convenience only and is not intended to limit any of the definitions to any particular category "Colloid" or "Colloidal System" means a substance containing ultra-small particles substantially evenly dispersed throughout another substance, the colloid consists of two separate phases: a dispersed phase (or internal phase) and a continuous phase (or dispersion medium) within which the dispersed phase particles
Additional features and advantages are described herein, and will be apparent from, the following Detailed Description.
Detailed Description of the Invention The following definitions are provided to determine how terms used in this application, and in particular how the claims, are to be construed.
The organization of the definitions is for convenience only and is not intended to limit any of the definitions to any particular category "Colloid" or "Colloidal System" means a substance containing ultra-small particles substantially evenly dispersed throughout another substance, the colloid consists of two separate phases: a dispersed phase (or internal phase) and a continuous phase (or dispersion medium) within which the dispersed phase particles
4 are dispersed, the dispersed phase particles may be solid, liquid, or gas, the dispersed-phase particles have a diameter of between approximately 1 and 1,000,000 nanometers, the dispersed-phase particles or droplets are affected largely by the surface chemistry present in the colloid.
"Colloidal Silica" means a colloid in which the primary dispersed-phase particles comprise silicon containing molecules, this definition includes the full teachings of the reference book: The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties and Biochemistry of Silica, by Ralph K Iler, John Wiley and Sons, Inc., (1979) generally and also in particular pages 312-599, in general when the particles have a diameter of above 100 nm they are referred to as sols, aquasols, or nanoparticles.
"Colloidal Stability" means the tendency of the components of the colloid to remain in colloidal state and to not either cross-link, divide into gravitationally separate phases, and/or otherwise fail to maintain a colloidal state its exact metes and bounds and protocols for measuring it are elucidated in The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties and Biochemistry of Silica, by Ralph K Iler, John Wiley and Sons, Inc., (1979).
"Microparticle" means a dispersed-phase particle of a colloidal system, generally microparticle refers to particles that have a diameter of between 1 nm and 100 nm which are too small to see by the naked eye because they are smaller than the wavelength of visible light.
"S-Value" means the measure of the degree of microaggregation of colloidal materials, it can be obtained from measurements of viscocity of the colloidal system and is often related to the performance of the colloidal end product,
"Colloidal Silica" means a colloid in which the primary dispersed-phase particles comprise silicon containing molecules, this definition includes the full teachings of the reference book: The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties and Biochemistry of Silica, by Ralph K Iler, John Wiley and Sons, Inc., (1979) generally and also in particular pages 312-599, in general when the particles have a diameter of above 100 nm they are referred to as sols, aquasols, or nanoparticles.
"Colloidal Stability" means the tendency of the components of the colloid to remain in colloidal state and to not either cross-link, divide into gravitationally separate phases, and/or otherwise fail to maintain a colloidal state its exact metes and bounds and protocols for measuring it are elucidated in The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties and Biochemistry of Silica, by Ralph K Iler, John Wiley and Sons, Inc., (1979).
"Microparticle" means a dispersed-phase particle of a colloidal system, generally microparticle refers to particles that have a diameter of between 1 nm and 100 nm which are too small to see by the naked eye because they are smaller than the wavelength of visible light.
"S-Value" means the measure of the degree of microaggregation of colloidal materials, it can be obtained from measurements of viscocity of the colloidal system and is often related to the performance of the colloidal end product,
5 its exact metes and bounds and protocols for measuring it are elucidated in The Chemistry of Silica: Solubility, Polymerization, Colloid and Surface Properties and Biochemistry of Silica, by Ralph K Iler, John Wiley and Sons, Inc., (1979).
"Solids %" means the portion of an aqueous system by weight that is silica bearing particles of the continuous phase.
"Silanol" means a functional group on a silicon bearing molecule with the connectivity of Si¨O¨H.
"Separation" means a mass transfer process that converts a mixture of substances into two or more distinct product mixtures, at least one of which is enriched in one or more of the mixture's constituents, it includes but is not limited to such processes as: Adsorption, Centrifugation, cyclonic separation, density based separation, Chromatography, Crystallization, Decantation, Distillation, Drying, Electrophoresis, Elutriation, Evaporation, Extraction, Leaching extraction, Liquid-liquid extraction, Solid phase extraction, Flotation, Dissolved air flotation, Froth flotation, Flocculation, Filtration, Mesh filtration, membrane filtration, microfiltration, ultrafiltration, nanofiltration, reverse osmosis, Fractional distillation, Fractional freezing, Magnetic separation, Precipitation, Recrystallization, Sedimentation, Gravity separation, Sieving, Stripping, Sublimation, Vapor-liquid separation, Winnowing, Zone refining, and any combination thereof.
"Ultrafiltration" means a process of filtration in which hydrostatic pressure forces a filtrate liquid against a semipermeable membrane, suspended solids and solutes of high molecular weight are retained, while water and low molecular weight solutes pass through the membrane, it is used in industry and research for purifying and concentrating macromolecular (103 - 106 Da) solutions, it
"Solids %" means the portion of an aqueous system by weight that is silica bearing particles of the continuous phase.
"Silanol" means a functional group on a silicon bearing molecule with the connectivity of Si¨O¨H.
"Separation" means a mass transfer process that converts a mixture of substances into two or more distinct product mixtures, at least one of which is enriched in one or more of the mixture's constituents, it includes but is not limited to such processes as: Adsorption, Centrifugation, cyclonic separation, density based separation, Chromatography, Crystallization, Decantation, Distillation, Drying, Electrophoresis, Elutriation, Evaporation, Extraction, Leaching extraction, Liquid-liquid extraction, Solid phase extraction, Flotation, Dissolved air flotation, Froth flotation, Flocculation, Filtration, Mesh filtration, membrane filtration, microfiltration, ultrafiltration, nanofiltration, reverse osmosis, Fractional distillation, Fractional freezing, Magnetic separation, Precipitation, Recrystallization, Sedimentation, Gravity separation, Sieving, Stripping, Sublimation, Vapor-liquid separation, Winnowing, Zone refining, and any combination thereof.
"Ultrafiltration" means a process of filtration in which hydrostatic pressure forces a filtrate liquid against a semipermeable membrane, suspended solids and solutes of high molecular weight are retained, while water and low molecular weight solutes pass through the membrane, it is used in industry and research for purifying and concentrating macromolecular (103 - 106 Da) solutions, it
6 includes but is not limited to microfiltration, nanofiltration or gas separation, it may be applied in cross-flow or dead-end mode and separation in ultrafiltration may undergo concentration polarization the exact metes and bounds and protocols for applying and categorizing ultrafiltration are elucidated in the scientific reference:
Ultrafiltration and Microfiltration Handbook, Second Edition, by Munir Cheryan, Published by CRC Press LLC, (1998).
"Droplet" means a mass of dispersed phase matter surrounded by continuous phase liquid, it may be suspended solid or a dispersed liquid.
"Particle Size" means the surface area of a single droplet.
"Dilution Filtration" means a process in which a material undergoing a filtration process is also being diluted by the addition of liquid to the material, dilution filtration can be simultaneous (the filtration and dilution occur at the same time) staged (the dilution and filtration processes occur one after the other, and/or both and can have one or more relative rates (liquid can be removed from the material by the filtration process faster, slower and/or at the same rate as liquid is added by the dilution process).
"Interface" means the surface forming a boundary between two or more phases of a liquid system.
"Papermaking process" means any portion of a method of making paper products from pulp comprising forming an aqueous cellulosic papermaking furnish, draining the furnish to form a sheet and drying the sheet. The steps of forming the papermaking furnish, draining and drying may be carried out in any conventional manner generally known to those skilled in the art. The papermaking process may also include a pulping stage, i.e. making pulp from a lignocellulosic
Ultrafiltration and Microfiltration Handbook, Second Edition, by Munir Cheryan, Published by CRC Press LLC, (1998).
"Droplet" means a mass of dispersed phase matter surrounded by continuous phase liquid, it may be suspended solid or a dispersed liquid.
"Particle Size" means the surface area of a single droplet.
"Dilution Filtration" means a process in which a material undergoing a filtration process is also being diluted by the addition of liquid to the material, dilution filtration can be simultaneous (the filtration and dilution occur at the same time) staged (the dilution and filtration processes occur one after the other, and/or both and can have one or more relative rates (liquid can be removed from the material by the filtration process faster, slower and/or at the same rate as liquid is added by the dilution process).
"Interface" means the surface forming a boundary between two or more phases of a liquid system.
"Papermaking process" means any portion of a method of making paper products from pulp comprising forming an aqueous cellulosic papermaking furnish, draining the furnish to form a sheet and drying the sheet. The steps of forming the papermaking furnish, draining and drying may be carried out in any conventional manner generally known to those skilled in the art. The papermaking process may also include a pulping stage, i.e. making pulp from a lignocellulosic
7 raw material and bleaching stage, i.e. chemical treatment of the pulp for brightness improvement.
In the event that the above definitions or a description stated elsewhere in this application is inconsistent with a meaning (explicit or implicit) which is commonly used, in a dictionary, or stated in a source incorporated by reference into this application, the application and the claim terms in particular are understood to be construed according to the definition or description in this application, and not according to the common definition, dictionary definition, or the definition that was incorporated by reference. In light of the above, in the event that a term can only be understood if it is construed by a dictionary, if the term is defined by the Kirk-Othmer Encyclopedia of Chemical Technology, 5th Edition, (2005), (Published by Wiley, John & Sons, Inc.) this definition shall control how the term is to be defined in the claims.
At least one embodiment of the invention is a stable silica colloid whose dispersed phase microparticle has a surface area of from about 700 m2 /g to about 1100 m2 /g, and having a percent by weight 5i02 solids level of from about 10 percent to 30 percent preferably 15 percent to about 25 percent. The dispersed phase microparticle differs from prior art microparticles by undergoing a separation process which improves its stability.
Colloidal silica contains a number of compositions of matter other than silica bearing molecules, the carrier fluid of the continuous phase, and additives such as emulsifiers or flocculants that aid in the maintenance of the colloid.
These particles include salt ions, acids, and bases, which were used to create the silica bearing compounds and/or to condition them to remain in a colloidal state.
Once
In the event that the above definitions or a description stated elsewhere in this application is inconsistent with a meaning (explicit or implicit) which is commonly used, in a dictionary, or stated in a source incorporated by reference into this application, the application and the claim terms in particular are understood to be construed according to the definition or description in this application, and not according to the common definition, dictionary definition, or the definition that was incorporated by reference. In light of the above, in the event that a term can only be understood if it is construed by a dictionary, if the term is defined by the Kirk-Othmer Encyclopedia of Chemical Technology, 5th Edition, (2005), (Published by Wiley, John & Sons, Inc.) this definition shall control how the term is to be defined in the claims.
At least one embodiment of the invention is a stable silica colloid whose dispersed phase microparticle has a surface area of from about 700 m2 /g to about 1100 m2 /g, and having a percent by weight 5i02 solids level of from about 10 percent to 30 percent preferably 15 percent to about 25 percent. The dispersed phase microparticle differs from prior art microparticles by undergoing a separation process which improves its stability.
Colloidal silica contains a number of compositions of matter other than silica bearing molecules, the carrier fluid of the continuous phase, and additives such as emulsifiers or flocculants that aid in the maintenance of the colloid.
These particles include salt ions, acids, and bases, which were used to create the silica bearing compounds and/or to condition them to remain in a colloidal state.
Once
8
9 PCT/US2014/015456 colloidal however many of these vestiges are impurities that are no longer required and to an extent impair the stability of the colloid. As a result, at least partial removal of the impurities helps to reduce reactivity between the impurities and the silanol groups on the silica bearing compounds.
In at least one embodiment the separation process is only a partial removal of impurities. While some impurities have a tendency to react with or facilitate reaction with the silanol groups they also tend to mediate and impair silanol-silanol reactions on adjacent silica-bearing compounds. As a result a fine equilibrium is achieved by removing some but not all of the impurities from the colloidal system.
The separation may be achieved by any form of separation known in the art. In at least one embodiment the separation method is an ultrafiltration method conducted during filtration-dilution conditions. Many of the impurities are so fine in size that they can only be removed utilizing ultrafiltration techniques.
Unfortunatley, as can be seen in the provided Examples, applying an ultrafiltration process to the colloid results in a less stable colloid. This is because the charge balancing environment results in their disassociating and flowing into the filtration membrane slower than the carrier fluid of the continuous phase does. As a result additional fluid must be added to the continuous phase to facilitate the removal In at least one embodiment the distinct filtration and dilution applications applied to the colloid are conducted: simultaneously, sequential, and/or are performed with differing rates of filtration and dilution. In at least one embodiment a stable colloid having a starting solids % is diluted so the solids %
decreases by between 30 to 80%. Then the colloid is concentrated/filtered until the solids percent returns to within 10% of the starting solids %. Then it is again diluted to decrease by between 30 to 80%. And finally it is filtered again to achieve a weight % which is between 30 to 80% greater than the starting solids % and which is less likely to gel than it was at the starting solids % and it is no less stable.
In at least one embodiment the microparticle surface area is greater than 700 m2/g.
In at least one embodiment the degree of removal of charged impurities present in the colloid can be accomplished by measuring the conductivity of the colloid both before and after any filtration or concentration step is performed.
As many of the impurities are ionic, removal of impurities should correspond with lower conductivity. In at least one embodiment removal impurities proceed until the colloidal system has a conductivity of between 40000/cm to 70000/cm.
In at least one embodiment at least one of the impurities removed are one or more items that entered the colloid during a heel based formation process.
These impurity items include but are not limited to alkali metal salts such as potassium or sodium based salts and acids or acid residues and acid derivatives. In a heel based process an initial composition, known as a "heel" is formed into which is added a source of active silica, usually in the form of silicic acid or polysilicic acid, over a specified time. The heel may be composed of water, any of a number of commercially available silicates or alkali water glasses, and an acid and/or a corresponding salt thereof in a prescribed ratio. A detailed example of a heel based formation process is:
(a) forming a heel, with said heel containing water, an alkali metal silicate wherein the molar ratio of Si02 to Na20 or K20 is greater than about 1:1 and is less than about 15:1; an acid (and/or a corresponding salt thereof), wherein said heel has a pH of at least 10, wherein the alkali metal silicate and acid are initially present in a ratio by weight of at least 63:1, wherein the temperature of the heel is below degrees F.;
(b) adding to the initial composition an aqueous silicic acid composition typically having a Si02 content in the range of from about 5.0 to about 7.2 percent by weight, while maintaining the temperature of the composition below 100 degrees F., wherein the aqueous silicic acid composition is added slowly and continuously until from about one-half to about three-quarters of the silicic acid composition has been added to the initial composition;
(c) increasing the temperature of the composition from below 100 degrees F.
to between about 115 degrees F. and about 125 degrees F. in a time period of from about 10 to about 35 minutes, and maintaining the temperature until the addition of all the silicic acid composition is complete;
(d) optionally, maintaining the temperature of the composition below 125 degrees F for about an hour; and (e) discontinuing the heating and (f) optionally removing water from the resulting composition until the solids content based on Si02 of the resulting aquasol is at least about 7.00 percent by weight.
Acids which may used in a heel based process can be any number of organic or mineral acids. Examples of such acids include, but are not limited to:
mineral acids such as hydrochloric, phosphoric or sulfuric or such materials as carbon dioxide. Organic acids include but are not limited to: acetic acid, formic acid and propionic acid. Examples of suitable salts include: sodium sulfate, sodium acetate, potassium sulfate, potassium acetate, trisodium phosphate and sodium monohydrogen phosphate.
Once the heel is prepared, the temperature of the composition is reduced to 85 degrees F. or lower, typically to 80 degrees F. or lower, and usually in a range of from 60 to 85 degrees F. At this point, silicic acid or poly silicic acid is slowly added to the composition, for example over a total period of about 4 hours.
Silicic acid suitable for the present invention can be prepared via known methods in the art, such as the cation exchange of dilute solutions of alkali water glasses.
Typically, the dilute solutions contain from 3.0 to 9.0 percent by weight solids based on Si02, typically from 5.0 to 7.2 percent by weight, and preferably from 6.0 to 6.8 percent by weight. Representative commercial preparations are outlined in US
Patents 3,582,502 and 2,244,335. While the ratio by weight of the alkali metal silicate to acid can vary, typically the ratio is at least 63:1. The silicic acid or poly silicic acid is slowly and continuously added to the composition with stirring, until from about one-half to about three-quarters of the silicic acid or poly silicic acid has been added to the composition while maintaining the temperature of the composition below 85 degrees F., typically from about 60-85 degrees F. Thereafter, the temperature of the composition is slowly raised, for example over a period of from
In at least one embodiment the separation process is only a partial removal of impurities. While some impurities have a tendency to react with or facilitate reaction with the silanol groups they also tend to mediate and impair silanol-silanol reactions on adjacent silica-bearing compounds. As a result a fine equilibrium is achieved by removing some but not all of the impurities from the colloidal system.
The separation may be achieved by any form of separation known in the art. In at least one embodiment the separation method is an ultrafiltration method conducted during filtration-dilution conditions. Many of the impurities are so fine in size that they can only be removed utilizing ultrafiltration techniques.
Unfortunatley, as can be seen in the provided Examples, applying an ultrafiltration process to the colloid results in a less stable colloid. This is because the charge balancing environment results in their disassociating and flowing into the filtration membrane slower than the carrier fluid of the continuous phase does. As a result additional fluid must be added to the continuous phase to facilitate the removal In at least one embodiment the distinct filtration and dilution applications applied to the colloid are conducted: simultaneously, sequential, and/or are performed with differing rates of filtration and dilution. In at least one embodiment a stable colloid having a starting solids % is diluted so the solids %
decreases by between 30 to 80%. Then the colloid is concentrated/filtered until the solids percent returns to within 10% of the starting solids %. Then it is again diluted to decrease by between 30 to 80%. And finally it is filtered again to achieve a weight % which is between 30 to 80% greater than the starting solids % and which is less likely to gel than it was at the starting solids % and it is no less stable.
In at least one embodiment the microparticle surface area is greater than 700 m2/g.
In at least one embodiment the degree of removal of charged impurities present in the colloid can be accomplished by measuring the conductivity of the colloid both before and after any filtration or concentration step is performed.
As many of the impurities are ionic, removal of impurities should correspond with lower conductivity. In at least one embodiment removal impurities proceed until the colloidal system has a conductivity of between 40000/cm to 70000/cm.
In at least one embodiment at least one of the impurities removed are one or more items that entered the colloid during a heel based formation process.
These impurity items include but are not limited to alkali metal salts such as potassium or sodium based salts and acids or acid residues and acid derivatives. In a heel based process an initial composition, known as a "heel" is formed into which is added a source of active silica, usually in the form of silicic acid or polysilicic acid, over a specified time. The heel may be composed of water, any of a number of commercially available silicates or alkali water glasses, and an acid and/or a corresponding salt thereof in a prescribed ratio. A detailed example of a heel based formation process is:
(a) forming a heel, with said heel containing water, an alkali metal silicate wherein the molar ratio of Si02 to Na20 or K20 is greater than about 1:1 and is less than about 15:1; an acid (and/or a corresponding salt thereof), wherein said heel has a pH of at least 10, wherein the alkali metal silicate and acid are initially present in a ratio by weight of at least 63:1, wherein the temperature of the heel is below degrees F.;
(b) adding to the initial composition an aqueous silicic acid composition typically having a Si02 content in the range of from about 5.0 to about 7.2 percent by weight, while maintaining the temperature of the composition below 100 degrees F., wherein the aqueous silicic acid composition is added slowly and continuously until from about one-half to about three-quarters of the silicic acid composition has been added to the initial composition;
(c) increasing the temperature of the composition from below 100 degrees F.
to between about 115 degrees F. and about 125 degrees F. in a time period of from about 10 to about 35 minutes, and maintaining the temperature until the addition of all the silicic acid composition is complete;
(d) optionally, maintaining the temperature of the composition below 125 degrees F for about an hour; and (e) discontinuing the heating and (f) optionally removing water from the resulting composition until the solids content based on Si02 of the resulting aquasol is at least about 7.00 percent by weight.
Acids which may used in a heel based process can be any number of organic or mineral acids. Examples of such acids include, but are not limited to:
mineral acids such as hydrochloric, phosphoric or sulfuric or such materials as carbon dioxide. Organic acids include but are not limited to: acetic acid, formic acid and propionic acid. Examples of suitable salts include: sodium sulfate, sodium acetate, potassium sulfate, potassium acetate, trisodium phosphate and sodium monohydrogen phosphate.
Once the heel is prepared, the temperature of the composition is reduced to 85 degrees F. or lower, typically to 80 degrees F. or lower, and usually in a range of from 60 to 85 degrees F. At this point, silicic acid or poly silicic acid is slowly added to the composition, for example over a total period of about 4 hours.
Silicic acid suitable for the present invention can be prepared via known methods in the art, such as the cation exchange of dilute solutions of alkali water glasses.
Typically, the dilute solutions contain from 3.0 to 9.0 percent by weight solids based on Si02, typically from 5.0 to 7.2 percent by weight, and preferably from 6.0 to 6.8 percent by weight. Representative commercial preparations are outlined in US
Patents 3,582,502 and 2,244,335. While the ratio by weight of the alkali metal silicate to acid can vary, typically the ratio is at least 63:1. The silicic acid or poly silicic acid is slowly and continuously added to the composition with stirring, until from about one-half to about three-quarters of the silicic acid or poly silicic acid has been added to the composition while maintaining the temperature of the composition below 85 degrees F., typically from about 60-85 degrees F. Thereafter, the temperature of the composition is slowly raised, for example over a period of from
10 to 35 minutes, to from 115-125 degrees F. and held in this temperature range until the addition of the remainder of the silicic acid or poly silicic acid to the composition is complete.
As described in US Patent 6,486,216 a heel based colloidal silica can be concentrated and remain stable until the final colloidal product contains from about 7.00 percent to about 16.8 percent by weight Si02. If however the various compositions that were acquired during the heel process are removed in an amount such that the impurity-silonol reactivity decreases while the silanol-silanol reactivity does not increase, colloids with a higher weight% can be prepared.
In at least one embodiment at least one of the impurities removed are one or more items that entered the colloid during a resin based formation process.
These impurity items include but are not limited to cationic resin exchange material, weak acids, and alkali metal based salts. In a resin based formation process a cationic ion exchange resin, preferably a weak acid cationic ion exchange resin, is used to to initiate the reaction of an alkali metal silicate to produce the colloidal silica. The reaction is controlled by the rate of addition and the ratio of alkali metal silicate to ion exchange resin during the polymerization to produce the colloidal silica. Heat treatment of the colloidal silica product is optional.
A detailed example of a resin based formation process includes the steps of:
(a) charging a reaction vessel with a cationic ion exchange resin having at least 40 percent of its ion exchange capacity in the hydrogen form wherein the reaction vessel has means for separating the colloidal silica formed during the process from the ion exchange resin;
(b) charging the reaction vessel with an aqueous alkali metal silicate having a mole ratio of Si02 to alkali metal oxide in the range of from about 1:1 to about 15:1 and a pH of at least 10.0, (c) stirring the contents of the reaction vessel until the pH of the contents of the vessel is in the range of from about 8.5 to about 11.0;
(d) adjusting the pH of the contents of the reaction vessel to above about 10.0, using an additional amount of the alkali metal silicate; and (e) separating the resulting colloidal silica of the invention from the ion exchange resin while removing the colloidal silica from the reaction vessel.
A reaction may be controlled by the rate of addition (for example, from 0 to 30 minutes, typically less than 15 minutes) and the ratio of alkali metal silicate to ion exchange resin during the polymerization to produce the colloidal silica. The molar ratio of hydrogen ion in the cationic ion exchange resin to alkali metal ion in the alkali metal silicate ranges from 40 to 100 percent, preferably from 50 to 100 percent. The temperature during colloidal silica formation in this alternative embodiment of the invention generally ranges from 50 degrees F. to degrees F., preferably from 70 degrees F. to 90 degrees F. Heat treatment of the colloidal silica product (i.e., post treatment) is optional in this embodiment of the process of the invention. The adjustment of pH in step (d) can be carried out either in the reaction vessel or after the resulting colloidal silica has been removed from the reaction vessel. This adjustment of pH typically is carried out within 10 minutes to 3 hours from when step (e) has been completed.
In at least one embodiment the separation step results in a solids %
content of the colloid which is increases by up to 25% without any corresponding loss or impairment in stability, S-Value, and/or particle surface area. In at least one embodiment the increased solids colloid is used in a papermaking process without any loss in effectiveness. For example the increased solids colloid can be used in conjunction with polymeric flocculants and/or cationic starch with or without the addition of a coagulant as part of a retention and drainage program without any loss of effectiveness or unwanted side effect.
EXAMPLES
The foregoing may be better understood by reference to the following Examples, which are presented for purposes of illustration and are not intended to limit the scope of the invention:
A number of colloidal silica samples were produced according to a resin based formation process. Various properties of the samples were measured.
S-Value, surface area, and solids % are proxys for predicting the sample's effectiveness in industrial applications. The samples were derived from commercially available colloidal silicas (POSITEK 8699 by Nalco Company, Naperville, IL) and were modified according to one of the following treatment protocols:
I) No modification II) Cationic Resin added to reduce conductivity III) Ultra-filtration applied IV) Di-filtration applied Properties of these samples are listed below.
Table I
Sample Solids% Surface S-Value pH
Number Area (%) (Indicates (na2/g) Treatment Type) 1-I 14.36 739.3 39.1 11.04 2-I 19.70 728.1 38.9 10.97 3-II 19.54 721.1 40.1 10.80 4-I 14.46 727.4 36.5 11.03 5-I 19.76 712.4 36.5 11.02 6-I 10.77 761.1 33.5 19.97 7-II 14.58 747.5 34.5 10.99 8-IV 19.76 716.3 34.4 11.02 9-III 19.75 732.5 33.5 10.98 10-I 19.75 716.3 33.5 10.98 The stabilities of these colloids were as follows:
Table 2 Elapsed Sample Sample Sample Sample Sample Sample Time 2-I 3-II 4-I 10-I 9-III 8-IV
(Weeks) Viscosity Viscosity Viscosity Viscosity Viscosit Viscosit (cps) (cps) (cps) (cps) Y Y
(cps) (cps) 0 9.5 9.5 12.4 26.9 33.2 19.7 1 17.3 11.9 19.3 256.0 47.2 21.7 2 135.0 17.6 29.1 >4000 80.3 26.7 3 >4000 31.6 69.5 Gel 289.0 36.6 4 >4000 72.6 301.5 Gel >2000 81.4 The data shows that initial charge variability in colloids will lead to differing initial values and stability of colloid. It also shows that using a cationic resin may negate some of the charge based colloidal stability issues but does so at the expense of desirable properties in the colloid. Sample 8-IV however shows that when properly using difilitration, equilibrium can be reached in which the charge based effects on stability can be achieved without sacrificing desirable colloidal properties.
A number of other colloids were produced using the inventive method which illustrates the stability (via viscosity) of the colloids. These samples demonstrate that some removal of impurities does not significantly decrease colloidal stability by not significantly increasing the viscosity but that too much removal causes the viscosity to significantly increase because of greater silanol-silanol interactions.
Equipment used to prepare the high solids colloidal silica is comprised of a 60 gallon jacketed stainless steel reactor vessel, PCI
ultrafiltration unit with PVDF membranes. Charge 254 lb. of a standard commercial silica, Nalco 8699, into the 60 gallon reactor, followed by 254 lb. of soft water (-2600/cm conductivity). Mix reactor contents, heat the diluted solution to 100 F, then open the ultrafiltration loop valve, allowing the solution to recirculate through the ultrafiltration unit. Maintain pump outlet pressure at 100 ¨ 110 psi throughout the entire process. As the silica solution concentrates, measure the flow rate, mass, and conductivity of ultrafiltration unit permeate to estimate silica solids.
Stop ultrafiltration when solution actives reach ¨15.0%. Charge an additional 128 lb. of soft water into the reactor, lowering silica concentration to ¨10.0%. Mix reactor contents, heat to 100 F, then recirculate through the ultrafiltration unit the same as in the previous paragraph, with the goal of concentrating the silica solution to ¨21.0% actives. Maintain pump outlet pressure at 100 ¨ 110 psi. Collect silica solution aliquots at select times during the entire diafiltration process. Characterize samples in terms of pH, conductivity, specific gravity, Brookfield viscosity, and percent solids.
Table 3 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.30 1.0474 7.74 n/a n/a Dilution A 14.66 1.0980 14.69 10.67 5.5 B 9.63 1.0626 9.82 10.63 3.3 C 14.64 1.0976 14.63 10.59 5.6 D 16.78 1.1134 16.80 10.57 7.9 E 18.04 1.1229 18.10 10.56 10.0 F 19.17 1.1316 19.30 10.54 12.4 G 20.12 1.1387 20.27 10.54 15.6 H 21.18 1.1467 21.37 10.53 20.8 The same procedure was then performed for diafiltration with no changes in the first dilution-concentration step. Charge 253 lb. of soft water into the reactor for the second dilution, instead of 128 lb. in example 1, and stop ultrafiltration when solution actives reach -15.0%. Charge an additional 138 lb. of soft water into the reactor for a third dilution, lowering silica concentration to -10.0%. Mix reactor contents, heat to 100 F, then recirculate through the ultrafiltration unit, with the goal of concentrating the silica solution to -21.0%
actives. Maintain pump outlet pressure at 100 - 110 psi.
Collect silica solution aliquots at select times during the entire diafiltration process. Characterize samples in terms of pH, conductivity, specific gravity, Brookfield viscosity, and percent solids.
Table 4 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.19 1.0463 7.59 n/a n/a Dilution A 14.49 1.0964 14.47 10.74 5.3 B 7.05 1.0453 7.45 10.66 2.9 C 14.63 1.0968 14.52 10.59 5.8 D 9.71 1.0633 9.92 10.56 3.6 E 15.21 1.1006 15.04 10.50 6.7 F 17.61 1.1183 17.47 10.46 10.0 G 19.55 1.1334 19.55 10.44 14.8 H 20.23 1.1386 20.26 10.43 17.5 I 21.16 1.1456 21.22 10.41 22.5 The same procedure was performed for diafiltration with no changes in the two dilution-concentration steps, except the substitution of deionized water (<10/cm) for soft water.
Table 5 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.32 1.0470 7.68 n/a n/a Dilution A 14.60 1.0976 14.63 10.84 5.6 B 9.65 1.0625 9.81 10.81 3.6 C 14.65 1.0975 14.62 10.74 6.0 D 16.88 1.1138 16.85 10.72 8.3 E 18.16 1.1233 18.16 10.71 10.7 F 19.22 1.1313 19.26 10.70 12.9 G 20.20 1.1388 20.29 10.69 16.2 H 21.14 1.1459 21.26 10.68 20.7 While this invention may be embodied in many different forms, there are shown in the drawings and described in detail herein specific preferred embodiments of the invention. The present disclosure is an exemplification of the principles of the invention and is not intended to limit the invention to the particular embodiments illustrated. All patents, patent applications, scientific papers, and any other referenced materials mentioned herein are incorporated by reference in their entirety. Furthermore, the invention encompasses any possible combination of some or all of the various embodiments described herein and incorporated herein.
Any ranges given either in absolute terms or in approximate terms are intended to encompass both, and any definitions used herein are intended to be clarifying and not limiting. All ranges and parameters disclosed herein are understood to encompass any and all subranges (including all fractional and whole values) subsumed therein, and every number between the endpoints. For example, a stated range of "1 to 10" should be considered to include any and all subranges between (and inclusive of) the minimum value of 1 and the maximum value of 10;
that is, all subranges beginning with a minimum value of 1 or more, (e.g. 1 to 6.1), end ending with a maximum value of 10 or less, (e.g. 2.3 to 9.4, 3 to 8, 4 to 7), and finally to each number 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10 contained within the range.
Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
The above disclosure is intended to be illustrative and not exhaustive.
This description will suggest many variations and alternatives to one of ordinary skill in this art. All these alternatives and variations are intended to be included within the scope of the claims where the term "comprising" means "including, but not limited to". Those familiar with the art may recognize other equivalents to the specific embodiments described herein which equivalents are also intended to be encompassed by the claims.
This completes the description of the preferred and alternate embodiments of the invention. Those skilled in the art may recognize other equivalents to the specific embodiment described herein which equivalents are intended to be encompassed by the claims attached hereto.
As described in US Patent 6,486,216 a heel based colloidal silica can be concentrated and remain stable until the final colloidal product contains from about 7.00 percent to about 16.8 percent by weight Si02. If however the various compositions that were acquired during the heel process are removed in an amount such that the impurity-silonol reactivity decreases while the silanol-silanol reactivity does not increase, colloids with a higher weight% can be prepared.
In at least one embodiment at least one of the impurities removed are one or more items that entered the colloid during a resin based formation process.
These impurity items include but are not limited to cationic resin exchange material, weak acids, and alkali metal based salts. In a resin based formation process a cationic ion exchange resin, preferably a weak acid cationic ion exchange resin, is used to to initiate the reaction of an alkali metal silicate to produce the colloidal silica. The reaction is controlled by the rate of addition and the ratio of alkali metal silicate to ion exchange resin during the polymerization to produce the colloidal silica. Heat treatment of the colloidal silica product is optional.
A detailed example of a resin based formation process includes the steps of:
(a) charging a reaction vessel with a cationic ion exchange resin having at least 40 percent of its ion exchange capacity in the hydrogen form wherein the reaction vessel has means for separating the colloidal silica formed during the process from the ion exchange resin;
(b) charging the reaction vessel with an aqueous alkali metal silicate having a mole ratio of Si02 to alkali metal oxide in the range of from about 1:1 to about 15:1 and a pH of at least 10.0, (c) stirring the contents of the reaction vessel until the pH of the contents of the vessel is in the range of from about 8.5 to about 11.0;
(d) adjusting the pH of the contents of the reaction vessel to above about 10.0, using an additional amount of the alkali metal silicate; and (e) separating the resulting colloidal silica of the invention from the ion exchange resin while removing the colloidal silica from the reaction vessel.
A reaction may be controlled by the rate of addition (for example, from 0 to 30 minutes, typically less than 15 minutes) and the ratio of alkali metal silicate to ion exchange resin during the polymerization to produce the colloidal silica. The molar ratio of hydrogen ion in the cationic ion exchange resin to alkali metal ion in the alkali metal silicate ranges from 40 to 100 percent, preferably from 50 to 100 percent. The temperature during colloidal silica formation in this alternative embodiment of the invention generally ranges from 50 degrees F. to degrees F., preferably from 70 degrees F. to 90 degrees F. Heat treatment of the colloidal silica product (i.e., post treatment) is optional in this embodiment of the process of the invention. The adjustment of pH in step (d) can be carried out either in the reaction vessel or after the resulting colloidal silica has been removed from the reaction vessel. This adjustment of pH typically is carried out within 10 minutes to 3 hours from when step (e) has been completed.
In at least one embodiment the separation step results in a solids %
content of the colloid which is increases by up to 25% without any corresponding loss or impairment in stability, S-Value, and/or particle surface area. In at least one embodiment the increased solids colloid is used in a papermaking process without any loss in effectiveness. For example the increased solids colloid can be used in conjunction with polymeric flocculants and/or cationic starch with or without the addition of a coagulant as part of a retention and drainage program without any loss of effectiveness or unwanted side effect.
EXAMPLES
The foregoing may be better understood by reference to the following Examples, which are presented for purposes of illustration and are not intended to limit the scope of the invention:
A number of colloidal silica samples were produced according to a resin based formation process. Various properties of the samples were measured.
S-Value, surface area, and solids % are proxys for predicting the sample's effectiveness in industrial applications. The samples were derived from commercially available colloidal silicas (POSITEK 8699 by Nalco Company, Naperville, IL) and were modified according to one of the following treatment protocols:
I) No modification II) Cationic Resin added to reduce conductivity III) Ultra-filtration applied IV) Di-filtration applied Properties of these samples are listed below.
Table I
Sample Solids% Surface S-Value pH
Number Area (%) (Indicates (na2/g) Treatment Type) 1-I 14.36 739.3 39.1 11.04 2-I 19.70 728.1 38.9 10.97 3-II 19.54 721.1 40.1 10.80 4-I 14.46 727.4 36.5 11.03 5-I 19.76 712.4 36.5 11.02 6-I 10.77 761.1 33.5 19.97 7-II 14.58 747.5 34.5 10.99 8-IV 19.76 716.3 34.4 11.02 9-III 19.75 732.5 33.5 10.98 10-I 19.75 716.3 33.5 10.98 The stabilities of these colloids were as follows:
Table 2 Elapsed Sample Sample Sample Sample Sample Sample Time 2-I 3-II 4-I 10-I 9-III 8-IV
(Weeks) Viscosity Viscosity Viscosity Viscosity Viscosit Viscosit (cps) (cps) (cps) (cps) Y Y
(cps) (cps) 0 9.5 9.5 12.4 26.9 33.2 19.7 1 17.3 11.9 19.3 256.0 47.2 21.7 2 135.0 17.6 29.1 >4000 80.3 26.7 3 >4000 31.6 69.5 Gel 289.0 36.6 4 >4000 72.6 301.5 Gel >2000 81.4 The data shows that initial charge variability in colloids will lead to differing initial values and stability of colloid. It also shows that using a cationic resin may negate some of the charge based colloidal stability issues but does so at the expense of desirable properties in the colloid. Sample 8-IV however shows that when properly using difilitration, equilibrium can be reached in which the charge based effects on stability can be achieved without sacrificing desirable colloidal properties.
A number of other colloids were produced using the inventive method which illustrates the stability (via viscosity) of the colloids. These samples demonstrate that some removal of impurities does not significantly decrease colloidal stability by not significantly increasing the viscosity but that too much removal causes the viscosity to significantly increase because of greater silanol-silanol interactions.
Equipment used to prepare the high solids colloidal silica is comprised of a 60 gallon jacketed stainless steel reactor vessel, PCI
ultrafiltration unit with PVDF membranes. Charge 254 lb. of a standard commercial silica, Nalco 8699, into the 60 gallon reactor, followed by 254 lb. of soft water (-2600/cm conductivity). Mix reactor contents, heat the diluted solution to 100 F, then open the ultrafiltration loop valve, allowing the solution to recirculate through the ultrafiltration unit. Maintain pump outlet pressure at 100 ¨ 110 psi throughout the entire process. As the silica solution concentrates, measure the flow rate, mass, and conductivity of ultrafiltration unit permeate to estimate silica solids.
Stop ultrafiltration when solution actives reach ¨15.0%. Charge an additional 128 lb. of soft water into the reactor, lowering silica concentration to ¨10.0%. Mix reactor contents, heat to 100 F, then recirculate through the ultrafiltration unit the same as in the previous paragraph, with the goal of concentrating the silica solution to ¨21.0% actives. Maintain pump outlet pressure at 100 ¨ 110 psi. Collect silica solution aliquots at select times during the entire diafiltration process. Characterize samples in terms of pH, conductivity, specific gravity, Brookfield viscosity, and percent solids.
Table 3 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.30 1.0474 7.74 n/a n/a Dilution A 14.66 1.0980 14.69 10.67 5.5 B 9.63 1.0626 9.82 10.63 3.3 C 14.64 1.0976 14.63 10.59 5.6 D 16.78 1.1134 16.80 10.57 7.9 E 18.04 1.1229 18.10 10.56 10.0 F 19.17 1.1316 19.30 10.54 12.4 G 20.12 1.1387 20.27 10.54 15.6 H 21.18 1.1467 21.37 10.53 20.8 The same procedure was then performed for diafiltration with no changes in the first dilution-concentration step. Charge 253 lb. of soft water into the reactor for the second dilution, instead of 128 lb. in example 1, and stop ultrafiltration when solution actives reach -15.0%. Charge an additional 138 lb. of soft water into the reactor for a third dilution, lowering silica concentration to -10.0%. Mix reactor contents, heat to 100 F, then recirculate through the ultrafiltration unit, with the goal of concentrating the silica solution to -21.0%
actives. Maintain pump outlet pressure at 100 - 110 psi.
Collect silica solution aliquots at select times during the entire diafiltration process. Characterize samples in terms of pH, conductivity, specific gravity, Brookfield viscosity, and percent solids.
Table 4 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.19 1.0463 7.59 n/a n/a Dilution A 14.49 1.0964 14.47 10.74 5.3 B 7.05 1.0453 7.45 10.66 2.9 C 14.63 1.0968 14.52 10.59 5.8 D 9.71 1.0633 9.92 10.56 3.6 E 15.21 1.1006 15.04 10.50 6.7 F 17.61 1.1183 17.47 10.46 10.0 G 19.55 1.1334 19.55 10.44 14.8 H 20.23 1.1386 20.26 10.43 17.5 I 21.16 1.1456 21.22 10.41 22.5 The same procedure was performed for diafiltration with no changes in the two dilution-concentration steps, except the substitution of deionized water (<10/cm) for soft water.
Table 5 Microparticle Solids% Specific Specific pH Brookfield Gravity Gravity % Viscosity Solids (#1 @ 60) 1-I 14.49 1.0979 14.67 10.79 5.4 Initial 7.32 1.0470 7.68 n/a n/a Dilution A 14.60 1.0976 14.63 10.84 5.6 B 9.65 1.0625 9.81 10.81 3.6 C 14.65 1.0975 14.62 10.74 6.0 D 16.88 1.1138 16.85 10.72 8.3 E 18.16 1.1233 18.16 10.71 10.7 F 19.22 1.1313 19.26 10.70 12.9 G 20.20 1.1388 20.29 10.69 16.2 H 21.14 1.1459 21.26 10.68 20.7 While this invention may be embodied in many different forms, there are shown in the drawings and described in detail herein specific preferred embodiments of the invention. The present disclosure is an exemplification of the principles of the invention and is not intended to limit the invention to the particular embodiments illustrated. All patents, patent applications, scientific papers, and any other referenced materials mentioned herein are incorporated by reference in their entirety. Furthermore, the invention encompasses any possible combination of some or all of the various embodiments described herein and incorporated herein.
Any ranges given either in absolute terms or in approximate terms are intended to encompass both, and any definitions used herein are intended to be clarifying and not limiting. All ranges and parameters disclosed herein are understood to encompass any and all subranges (including all fractional and whole values) subsumed therein, and every number between the endpoints. For example, a stated range of "1 to 10" should be considered to include any and all subranges between (and inclusive of) the minimum value of 1 and the maximum value of 10;
that is, all subranges beginning with a minimum value of 1 or more, (e.g. 1 to 6.1), end ending with a maximum value of 10 or less, (e.g. 2.3 to 9.4, 3 to 8, 4 to 7), and finally to each number 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10 contained within the range.
Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements.
The above disclosure is intended to be illustrative and not exhaustive.
This description will suggest many variations and alternatives to one of ordinary skill in this art. All these alternatives and variations are intended to be included within the scope of the claims where the term "comprising" means "including, but not limited to". Those familiar with the art may recognize other equivalents to the specific embodiments described herein which equivalents are also intended to be encompassed by the claims.
This completes the description of the preferred and alternate embodiments of the invention. Those skilled in the art may recognize other equivalents to the specific embodiment described herein which equivalents are intended to be encompassed by the claims attached hereto.
Claims (14)
1. A method for improving the performance of colloidal silica, the method comprising the steps of:
providing a colloidal silica, and separating impurity particles from the colloidal silica wherein the separation is conducted to a degree such that cross-linkage inducing interactions between impurity particles and silanol groups on dispersed-phase particles decreases but not to such a degree that cross-linkage inducing interactions between silanol groups increases, the separation increasing the particle size of the dispersed-phase particles of the colloid by at least 5% without impairing the S-Value, or stability of the colloid.
providing a colloidal silica, and separating impurity particles from the colloidal silica wherein the separation is conducted to a degree such that cross-linkage inducing interactions between impurity particles and silanol groups on dispersed-phase particles decreases but not to such a degree that cross-linkage inducing interactions between silanol groups increases, the separation increasing the particle size of the dispersed-phase particles of the colloid by at least 5% without impairing the S-Value, or stability of the colloid.
2. The method of claim 1 in which the colloid is applied to a papermaking system and is at least as effective in its application as a similar colloid that has not undergone the separation.
3. The method of claim 1 in which the separated particles are particles that were introduced to the colloid during a heel or resin based formation process.
4. The method of claim 1 in which the dispersed-phase particle of the colloid have a surface area of from about 700 m2 /g to about 1100 m2 /g, and the colloid has a percent by weight SiO2 solids level of at least 15.
5. The method of claim 1 in which the separation is accomplished using a dilution filtration process in which the filtration is at least in part ultrafiltration.
6. The method of claim 5 in which the dilution occurs at different time than the filtration.
7. The method of claim 5 in which the time of the dilution and filtration overlap at least in part.
8. The method of claim 5 in which the rate of the dilution is such that fluid passes through a filter in the filtration process at a net rate no faster than the rate the net rate that the charged particles dissociate from colloidal droplets.
9. The method of claim 5 in which the process comprises repeatedly diluting then filtering the colloid, the diluting characterized by decreasing the solids % by between 30 to 80% of the solids % present at the start of the process, the filtering, except for a final filtration step, comprises returning the solids % to within 10-60% of the solids % present at the start of the process.
10. The method of claim 9 in which dilution does not commence until the rate of the fluid passing through the filter slows.
11. The method of claim 1 in which the colloid is applied to a papermaking process as part of a retention and drainage program and is used in conjunction with polymeric flocculants and/or cationic starch with or without the addition of a coagulant and there is no loss of effectiveness or unwanted side effects when compared to a similar colloid that has not undergone the separation.
12. The method of claim 1 in which the degree to which the impurity particles have been removed is measured by correlating it to a measurement of the change in conductivity of the colloid.
13. The method of claim 12 in which the separation of impurity particles proceed until the colloidal system has a conductivity of between 4000 µS/cm to 7000 µS/cm.
14. The method of claim 1 in which the impurity particles are at least in part charged particles.
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AR072689A1 (en) | 2008-07-14 | 2010-09-15 | Akzo Nobel Nv | SOLES BASED ON SILICE METHOD TO PRODUCE USE AND METHOD TO PRODUCE PAPER THAT USES THEM |
JP5530672B2 (en) * | 2008-08-18 | 2014-06-25 | 株式会社フジミインコーポレーテッド | Method for producing boehmite particles and method for producing alumina particles |
US8790608B2 (en) | 2008-09-12 | 2014-07-29 | Nalco Company | Siliceous materials having tunable porosity and surface morphology and methods of synthesizing same |
US8936772B2 (en) | 2010-04-08 | 2015-01-20 | Ecolab Usa Inc. | Silica containing particle |
US9073759B2 (en) * | 2010-08-10 | 2015-07-07 | Massachusetts Institute Of Technology | Silica aerogels and their preparation |
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2013
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WO2014137539A1 (en) | 2014-09-12 |
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BR112015017517B1 (en) | 2022-01-11 |
CN105008279A (en) | 2015-10-28 |
BR112015017517A2 (en) | 2017-07-11 |
US10087081B2 (en) | 2018-10-02 |
CA2896661C (en) | 2019-09-24 |
KR20150126006A (en) | 2015-11-10 |
EP2964576C0 (en) | 2023-08-09 |
US20140251565A1 (en) | 2014-09-11 |
EP2964576A1 (en) | 2016-01-13 |
JP6440638B2 (en) | 2018-12-19 |
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