CA2866813A1

CA2866813A1 - Plated plastic chassis

Info

Publication number: CA2866813A1
Application number: CA2866813A
Authority: CA
Inventors: Masahito Nakamoto; Hideichiro Kawaguchi; Hiroshi Sakai
Original assignee: UMG ABS Ltd
Current assignee: Techno UMG Co Ltd
Priority date: 2012-03-14
Filing date: 2013-03-14
Publication date: 2013-09-19
Also published as: KR20140138708A; CN104206039A; CN104206039B; WO2013137375A1; JP5965684B2; JP2013189690A

Abstract

Provided is a plastic chassis which, through resinification, can be made lighter, thinner and more complex in shape, which, even when made thinner and lighter, has durability under high-temperature conditions and rigidity equivalent to that of magnesium metal chasses, and which can ensure product safety by suppressing decreased dimensional precision and warpage due to being thinner and lighter. Also provided is an electrical product component formed by adhering a component substrate configured from a thermoplastic resin to the aforementioned plastic chassis. This invention relates to a plated plastic chassis having a plastic chassis body formed from a filler reinforced plastic with a 4,000-22,000MPa flexural modulus according to ISO 178:2001, and a 5-50µm thick plating layer formed on at least a portion of the surface of the plastic chassis body.

Description

[DESCRIPTION]
[Title of Invention]
PLATED PLASTIC CHASSIS
[Technical Field]
[00011 The present invention relates to a plated plastic chassis which is used as an internal chassis, etc. of an electrical product.
Priority is claimed on Japanese Patent Application No. 2012-057957, filed March 14, 2012, the content of which is incorporated herein by reference.
IBackground Art]

High rigidity is required for a cabinet for a light electric product such as a cellular phone or a notebook computer as a product is thin-walled. In this application, various metal chassis formed by a die casting or thixomolding is conventionally used.
Recently, as an alternative product to a metal chassis, it becomes common to use a plastic chassis formed from a polycarbonate resin or a polycarbonate/ABS resin on which a metal is plated by an electroplating method to improve rigidity thereof.

Moreover, high rigidity is required for an intrinsic chassis installed inside an electronic product, and thus, a metal chassis formed from magnesium, etc. is used as an intrinsic chassis. Recently, it has been considered to use a plastic chassis as an alternative product to a metal chassis for an intrinsic chassis of an electronic product.
The reason is because a complicated shape can be formed and also thin-walling and weight reducing are possible.
[0004]

Meanwhile, high rigidity, strength and durability, which are equivalent to those of a metal chassis formed from magnesium, are required even for a plastic chassis with a complicated shape, and ensuring safety is required with the achievement of thin-walling and weight-reducing by resinification. Ilowever, a conventional plastic chassis does not sufficiently satisfy these requirements.
[0005]
Patent Literature 1 proposes the plastic cabinet obtained by double-molding an ABS resin and a resin other than an ABS resin so as to obtain a plastic cabinet body and plating the ABS resin part thereof. However, this plastic cabinet is intended to shield an electronic component mounted on a printed circuit board and has nothing to do with a plastic chassis.
10006_1 Also, Patent Literature 2 proposes the method of improving rigidity and hardness by depositing a plating layer with thickness of 5-30 pm on a plastic cabinet.
llowever, this method is not considered for an intrinsic chassis of an electronic product, and this method alone is not sufficient for ensuring safety associated with shape-complicating, thin-walling and weight-reducing by resinification of an intrinsic chassis.
[Citation List]
[Patent Literature]

'Patent Literature 11 Japanese Fxamined Utility Model Application Publication No. Hei 7-1833 [Patent Literature 21 Japanese Unexamined Patent Application, First Publication No. 2005-154864 [Summary of Invention]
[Technical Problem]
[0008]
The present invention provides a plastic chassis which can be shape-complicated, thin-walled and weight-reduced by resinification, and has rigidity and durability under a high-temperature condition, which are equivalent to those of a metal chassis formed from magnesium even if thin-walled and weight-reduced, and can ensure product safety by suppressing warpage and reduction in dimensional accuracy associated with thin-walling and weight-reducing. Also, the present invention provides a component for an electrical product which is obtained by making a component substrate formed from a thermoplastic resin adhere to the plastic chassis.
[Solution to Problem]
[0009]
An aspect of a plated plastic chassis of the present invention including: a plastic chassis body obtained by molding a filler reinforced plastic in which flexural modulus according to ISO 178:2001 is within a range from 4,000 to 22,000 MPa; and a plating layer with thickness of 5 to 50 pm which is formed on at least a portion of surface of the plastic chassis body.
[0010]
An aspect of a plated plastic chassis of the present invention preferably satisfies the following condition:
flexural modulus according to ISO 178:2001 of a plated test piece, which is obtained by forming a plating layer under the same condition as the plating layer on the surface of a test piece (12.5 mm x 127 mm x 1 mm thickness) obtained by molding the filler reinthrced plastic, is within a range from 25,000 to 60,000 MPa.

In other words, an aspect of a plated plastic chassis of the present invention preferably satisfies the following condition:
flexural modulus according to ISO 178:2001 of a plated test piece, which is obtained by forming a plating layer under the same condition as the plating layer on surface of a test piece with 12.5 mm x 127 mm x 1 mm thickness obtained by molding the filler reinforced plastic, is within a range from 25,000 to 60,000 MPa.
[0011]
An aspect of a component for an electrical product of the present invention includes: an aspect of a plated plastic chassis of the present invention; and a component substrate which is formed from a thermoplastic resin and adheres to the plated plastic chassis.
[Advantageous LIThets of Invention]
[0012]
An aspect of a plated plastic chassis of the present invention can be shape-complicated, thin-walled and weight-reduced by resinification, has rigidity and durability under a high-temperature condition, which are equivalent to those of a metal chassis formed from magnesium even if thin-walled and weight-reduced, and can ensure product safety by suppressing warpage and reduction in dimensional accuracy associated with thin-walling and weight-reducing.
Also, an aspect of a component for an electrical product of the present invention is obtained by making a component substrate lbrmed from a thermoplastic resin adhere to an aspect of a plated plastic chassis of the present invention. Thus, an aspect of a component for an electrical product of the present invention is completed as the component which is much similar to a product incorporating an internal chassis, and an assembling process can be simplified.

[Description of Embodiments]
[00131 In the present specification, a chassis refers to a base member which fixes a printed wiring board and an electronic component, and is distinguished from a cabinet 5 (also referred to as a case or housing) which houses the aforementioned base member.
In the present specification, flexural modulus of a filler reinforced plastic is obtained by measuring a test piece with 12.5 mm x 127 mm x 4 mm thickness according to ISO 178:2001.
In the present specification, flexural modulus of a plated test piece is obtained by measuring a plated test piece, which is obtained by plating a test piece with 12.5 mm x 127 mm x 1 mm thickness, according to ISO 178:2001.
[0014]
<Plated Plastic Chassis>
An aspect of a plated plastic chassis of the present invention includes a plastic chassis body obtained by molding a filler reinforced plastic; and a plating layer which is tbrmcd on at least a portion of surface of the plastic chassis body.
1.0015]
(Filler Reinforced Plastic) A filler reinforced plastic contains a thermoplastic resin, a filler, and other components as necessary.

The kind of a thermoplastic resin is not particularly limited. Examples of a thermoplastic resin include polyamide (such as nylon 6 or nylon 6,6), polyolefin (such as polyethylene or polypropylene), polyester (such as polyethylene terephthalate or polybutylene terephthalate), polycarbonate, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polyethersulfone, polyether ether ketone, polyetherimicie, styrene-based resin (such as polystyrene or ABS resin), or liquid-crystalline polyester.
Also, a thermoplastic resin may be a copolymer (such as a copolymer of acrylonitrile and styrene, or a copolymer of nylon 6 and nylon 6,6), or a mixture of the thermoplastic resin (including an alloy).
[00171 The kind of a filler is not particularly limited. Examples of a filler include an inorganic filler, an organic filler and a plant-based filler.
Examples of an inorganic filler include an inorganic fiber (such as a glass fiber or a carbon fiber), an inorganic fiber coated with a metal, an inorganic matter (such as Wollastonite, talc, mica, glass flake, glass beads, potassium titanate, calcium carbonate, magnesium carbonate, carbon black or Ketjenblack), a metal and alloy (such as iron, copper, zinc or aluminum), a fiber of a metal oxide, and a powder of a metal oxide.
Examples of an organic filler include a polyethylene terephthalate fiber, a polyethylene naphthalate fiber, an aramid fiber and an acrylic fiber.
Examples of a plant-based filler include kenaf and a bamboo fiber.
A fiber may be a chopped fiber or a long fiber.
As a filler, a glass filler or a carbon filler is preferable because high rigidity can be obtained even at a small blending amount.
10018) Examples of other components include an antistatic agent, a flame retardant (such as a bromine-based, a phosphorus-based, a hydroxide), a flame retardant aid (such as antimony trioxide or polytetralluoroethylene), a surface appearance improving agent, a weather resistance improving agent, an antioxidant, a thermal stabilizer, an ultraviolet absorber, an antibacterial agent, a tackifier, a plasticizer, a lubricant, a colorant, a compatibilizer, a conductive filler, an anti-ageing agent and an anti-fog agent.

A filler reinforced plastic can be obtained by mixing a thermoplastic resin, a -filler, and other components as necessary using a mixer (such as Henschel mixer, a tumbler mixer or Nauta mixer). In addition, kneading can be carried out using a kneader (a single screw extruder, a twin screw extruder, Banbury mixer, Konida).

The blending amounts of a thermoplastic resin and a filler are set such that flexural modulus of a filler reinforced plastic is within a range from 4,000 to 22,000 MPa.
Flexural modulus of a filler reinforced plastic is 4,000 MPa or higher and preferably 8,000 MPa or higher. Also, flexural modulus of a filler reinforced plastic is 22,000 MPa or lower and preferably 21,000 MPa or lower. In more detail, flexural modulus of a filler reinforced plastic is within a range from 4,000 to 22,000 MPa and preferably from 8,000 to 21,000 MPa. When flexural modulus of a filler reinforced plastic is 4,000 MPa or higher, warpage of a plated plastic chassis can be suppressed, and heat cycle property thereof becomes excellent. When flexural modulus of a filler reintbreed plastic is 22,000 MPa or lower, molding processability becomes good.

(Plastic Chassis Body) A plastic chassis body is obtained by molding a filler reinforced plastic.
Examples of a molding process include an injection molding process, an injection compression molding process, a press molding process, an extrusion molding process, a blow molding process, a vacuum molding process, a pressure molding process, a calender molding process, an inflation molding process. Among these molding processes, an injection molding process and an injection compression molding process are preferable because mass productivity is excellent and a molded product with high dimensional accuracy can be obtained.
[0022]
(Plating Layer) Thickness of a plating layer is 5 pm or higher, preferably 10 p.m or higher, more preferably 15 pm, and much more preferably 25 pm. Also, thickness of a plating layer is 50 kim or lower, preferably 45 jam or lower and more preferably 40 1,.tm or lower. In more detail, thickness of a plating layer is within a range from 5 to 50 11111, preferably from 10 to 45 pm, more preferably from 15 to 40 pm and much more preferably 25 to 40 Jim. When thickness of a plating layer is 5 Am or higher, rigidity of a plated plastic chassis becomes sufficiently high rigidity. When thickness of a plating layer is 50 vim or lower, warpage is suppressed, and heat cycle property becomes excellent.
[0023]
Examples of a measurement method of thickness of a plating layer include a method using an electrolytic film thickness meter and cross-sectional observation of a plating layer using a scanning electron microscope.
A method using an electrolytic film thickness meter is based on Faraday's law in which a dissolution amount of a plating layer is proportional to an amount of' conducted electricity when electrolysis is carried out using a plating layer as an anode. A
dissolution amount is represented by a product of a dissolution area [A] and thickness [t], and an amount of conducted electricity is represented by a product of a conduction time [Ti and a current RI.
Dissolution Amount = Axt=KxIxT

In the above equation, K is a constant which is different by each plating layer.

Cross-sectional observation of a plating layer using a scanning electron microscope is a method in which a cross-section of a plated plastic chassis is cut out and observed using a scanning electron microscope. Examples of a method of cutting out a cross-section include a method using a fine cutter, a method using a laser cutter and a method using FIB. In a method using a fine cutter, cutting surface has to be polished, and boundary of a multilayer coating can be clarified by subjecting boundary after polishing (multilayer coating (such as copper, nickel or chrome)) to nitric acid etching.
In an aspect of the present invention, a method using an electrolytic film thickness meter is preferable because thickness of a plating layer can be measured precisely.

Ixamples of a plating method include a wet type plating method (such as electroless plating, direct plating or electroplating) and a dry type plating method (such as vacuum deposition, a sputtering method or an ion plating method). In an aspect of the present invention, a wet type plating method is preferable because flexural modulus of a plastic chassis is excellent and good plating property can be obtained.
[0026]
Electroless plating is the method in which a reducing agent (such as sodium hypophosphite or sodium borohydride) is added in an aqueous solution containing a metal ion such as nickel or copper, the aqueous solution is heated to a range of 40 C to 100 C, and a plastic chassis body is immersed to the aqueous solution to thereby uniformly deposit a metal on the surface of the plastic chassis and form a plating layer.
In electroless plating, it is preferable that surface of a plastic chassis body be chemically roughened by an etching treatment (mixed solution of sulfuric acid / chrome) and made sensitive (catalyzed).
[0027]
Electroplating is the method in which a conductive film is formed on surface of 5 a plastic chassis body by an electroless plating method, a body to be plated is used as a cathode, an insoluble anode such as plating metal or platinum is used as an anode, DC
power supply is connected between both electrodes, and an appropriate potential difference is given to thereby deposit a metal obtained by reducing a metal ion on the surface of the cathode and form a plating layer. Examples of a metal to be deposited 10 include copper, nickel, chrome, gold, silver and an alloy.
[0028]
(Flexural Modulus of Plated Test Piece) A plated plastic chassis preferably satisfies the following condition.
Flexural modulus of a plated test piece, which is obtained by forming a plating layer with an intended thickness under the same condition as a plating layer of a product on surface of a test piece obtained by molding the filler reinforced plastic, is 25,000 MPa or higher and preferably 30,000 MPa or higher. Also, flexural modulus or a plated test piece is 60,000 MPa or lower and preferably 50,000 MPa or lower. In more detail, flexural modulus of a plated test piece is within a range from 25,000 to 60,000 MPa and preferably from 30,000 to 50,000 MPa.
[00291 When, flexural modulus of a plated test piece is 25,000 MPa or higher, it is possible to obtain flexural modulus corresponding to a metal chassis formed from magnesium, etc. When, flexural modulus of a plated test piece is 60,000 MPa or lower, dimensional accuracy is improved. Flexural modulus of a plated test piece is preferably II
within a range from 30,000 to 50,000 MPa.

(Functions and Effects) In an aspect of a plated plastic chassis of the present invention described above, a filler reinforced plastic is used as a raw material, and thus, shape-complication, thin-walling and weight-reducing can be achieved by resinification.
Also, a plating layer with thickness of 5 to 50 gm is formed on at least a portion of surface of a plastic chassis body obtained by molding a filler reinforced plastic in which flexural modulus is within a range from 4,000 to 22,000 MPa, and thus, a plated plastic chassis has rigidity which is equivalent to that of a metal chassis formed from magnesium even if thin-walled and weight-reduced.
Also, a plastic chassis body obtained by molding a filler reinforced plastic in which flexural modulus is within a range from 4,000 to 22,000 MPa is used as a base, and thus, a plated plastic chassis has durability under a high-temperature condition In the aforementioned plated plastic chassis, product safety can be ensured by suppressing warpage and reduction in dimensional accuracy associated with thin-walling and weight-reducing.
[00311 <Component for Electrical Product>
An aspect of a component for an electrical product of the present invention includes: an aspect of a plated plastic chassis of the present invention; and a component substrate which is formed from a thermoplastic resin and adheres to the plated plastic chassis.
[00321 (Component Substrate) A component substrate is obtained by molding a thermoplastic resin. Because adhesiveness for a plated plastic chassis is excellent, a component substrate which is unified with a plated plastic chassis by an in-mold process is preferable.
[0033]
The kind of a thermoplastic resin is not particularly limited. Examples of a thermoplastic resin include polyamide (such as nylon 6 or nylon 6,6), polyolefin (such as polyethylene or polypropylene), polyester (such as polyethylene terephthalate or polybutylene terephthalate), polycarbonate, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysultbne, polyethersulfone, polyether ether ketone, polyetherimide, styrene-based resin (such as polystyrene or ABS resin), or liquid-crystalline polyester.
Also, a thermoplastic resin may be a copolymer (such as a copolymer of acrylonitrile and styrene, or a copolymer of nylon 6 and nylon 6,6), urethane, a soft material or elastomer. In addition, a thermoplastic resin may be a mixture of the aforementioned materials (including an alloy) or a filler reinforced material [0034]
(In-Mold Process) An in-mold process is the molding process in which an aspect of a plated plastic chassis of the present invention is installed in a molding die, and a thermoplastic resin is injected into the molding die to thereby make a component substrate formed from a thermoplastic resin and a plated plastic chassis adhere to each other and obtain a composite component.
[00351 (Functions and Effects) As described above, an aspect of a component for an electrical product of the present invention is obtained by making a component substrate formed from a thermoplastic resin adhere to an aspect of a plated plastic chassis of the present invention.
Thus, an aspect of a component for an electrical product of the present invention is completed as the component which is much similar to a product incorporating an internal chassis, and an assembling process can be simplified.
I Examples]
10036]
Hereinafter, the present invention is described in detail with reference to Examples and Comparative Examples. The present invention is not limited to these specific examples.
10037]
<Measurements and [valuations>
Respective measurements and evaluation in Examples and Comparative Examples were carried out by the following methods.
[0038]
(Flexural Modulus of Filler Reinforced Plastic) Regarding the plastic and filler reinforced plastic shown in Table I, the test pieces with 12.5 mm x 127 mm x 4 mm thickness were produced, and the flexural modulus of the test pieces was measured according to ISO 178:2001.
10039]
(Flexural Modulus or Filler Reinforced Plastic) Regarding the plastic and filler reinforced plastic shown in Table 1, the test pieces with 12.5 mm x 127 mm x 1 mm thickness were produced, the plating layers were !brined with the compositions and the intended total thickness shown in 'Fable 2, and then, the flexural modulus of the plated test pieces was measured according to 1S0 178:2001.

[0040]
(Thickness of Plating Layer) The thickness of the plating layer was measured by the following method using the electrolytic film thickness meter (DENSOKU Instruments Co., Ltd., CT-2).
The plated plastic chassis was set in the electrolytic film thickness meter.
Firstly, in order to measure the thickness of chrome electroplating, the R-51 electrolyte solution (DENSOKU Instruments Co., Ltd.) was injected into the gasket, and the thickness of the chrome electroplating. Subsequently, in order to measure the thickness of nickel electroplating, the R-54 electrolyte solution (DENSOKU Instruments Co., Ltd.) .. was injected into the gasket, and the thickness of the nickel electroplating.
Subsequently, in order to measure the thickness of copper electroplating, the electrolyte solution (DENSOKU Instruments Co., Ltd.) was injected into the gasket, and the thickness of the copper electroplating.
[00411 (Warpage) The plated plastic chassis was left on a smooth standard stand, the presence or absence of the warpage was checked by visual observation, and the plated plastic chassis was evaluated by the followin2, criteria.
S: the absence of the warpage A: the presence of the slight warpage B: the presence of the warpage C: the presence of the large warpage [00421 (Dimensional Accuracy) The metal nut (the outer diameter: y 4 mm) was pressed into the boss part (the inner diameter: (p 4 mm, wall thickness: I mm) of the plated plastic chassis, the presence or absence of the crack of the plating film of the boss part was checked by visual observation, and the plated plastic chassis was evaluated by the following criteria.
S: the absence of the crack 5 A: the occurrence of the small crack in a portion of the boss part B: the occurrence of the crack C: the occurrence of the crack in the range including the plastic side 10043 j (Heat Cycle Property) 10 The plated plastic chassis was subjected the test under the following heat cycle condition, the presence or absence of the bulge of the plating Film was checked by visual observation, and the plated plastic chassis was evaluated by the following criteria.
A: the absence of the bulge AB: the presence of the small crack at the contact part 15 B: the presence of the small bulge in the vicinity of the gate C: the presence of the bulge at the gate part Heat Cycle Condition' The sequence of -30 C x 1 hour ¨> 23 C x 15 minutes 80 C x 1 hour 23 C x 1 hour was defined as one cycle, and five cycles were defined as one set, and three sets were carried out.
[00441 <Plastic and Filler Reinforced Plastic>
The plastics and the -filler reinforced plastics used in Examples and Comparative Examples were as follows.

'Table 11 Material Company Name Product Name Composition containing OF
at 10 mass%

containing OF
at 45 mass% _______________________________________________________ containing CF
_______________________________________________________ at 10 mass%

containing G17 at 20 mass%
F DuPont ZYTEL HTN PPA
containing GF at 50 mass%
Mitsubishi MXD6/PPE containing Engineering-Plastics NX05945S
GI: at 45 mass%
Corporation II UMGABS FA-860C1)PC/ASA containing CF
at 30 mass%

The abbreviations in the Table represent the following meanings.
PC: polycarbonate ASA: acrylonitrile-styrene-acrylate resin PPA: polyphthalamide MXD6: nylon MXD6 PPE: polyphenylene ether OF: glass fiber CF: carbon liber <Plating Process>
The compositions and the total thickness of the plating layer in Examples and , Comparative Examples are shown in 'fable 2.
Also, the conditions for the plating processes for respective materials are described in Plating Processes 1 and 2.
[0048]
[Table 21 Intended Intended Intended..Intended Intended Intended Ital "Iota!
, Total Thickness "Fhickness Thickness 'thickness 'rhickness Plating Layer Thickness of. Cu of Ni of Cr of Thick of Composition of Plating Electro- Electro-Electro-Electroless Electroless Layer Plating Plating Ni Plating Ni PlatingPlating Lam) 1}11111 [tun] 1111111 [um] [um] __ Electroless Ni a 5 0.5 4 0.5 r ¨1 Electroless Ni h 10 0.5 9 0.5 iNi/Cr . Flectroless Ni c 15 0.5 14 0.5 /Ni/Cr Electroless Ni d 20 0.5 19 0.5 /Ni/Cr Thick Electroless Ni e20 10 9 0.5 /Ni/Cr f Thick Electroless Ni 23 23 g Thick Electroless Ni 30 30 _,.
, , Electroless Ni h 35 ! ¨ 0.5 15 19 0.5 !Cu/Ni/Cr Electroless Ni 1 i 40 1 0.5 20 19 0.5 /Cu/Ni/Cr I
Electroless Ni . 1 /Cu/Ni/Cr 45 0.5 20 24 0.5 Electroless Ni k 50 0.5 25 24 0.5 /Cu/Ni/Cr Flectroless Ni , 1 60 0.5 30 29 0.5 /Cu/Ni/Cr --, : m Electroless Ni 0.5 0.5 , [0049]

(Plating Process 1) Target materials: materials A-E and El 10050]
Electroless nickel plating [1] degreasing (68 C x 5 minutes), processing solution: ENILEX WE
manufactured by Ebara Udylite Co., Ltd.
[21 water washing [3] pre-etching (40 C x 5 minutes), processing solution: ENILEX PE-300A,13 manufactured by Ebara Udylite Co., Ltd.
141 water washing 151 etching (68 C x 10 minutes), processing solutions: chromic acid 400 g/L
and sulfuric acid 200 cc/I.
161 recovery [7] water washing.
181 neutralization (room temperature x 1 minute), processing solution: ENILEX
RD manufactured by Ebara Udylite Co., Ltd.
191 water washing.
1101 special neutralization (room temperature x 2 minutes), processing solution:
ENILEX LEX NW manufactured by Ebara Udylite Co., Ltd.

[11] water washing 112] pre-dip (room temperature x 1 min), processing solution: 35 wt%
hydrochloric acid 100 cc/I.
1131 catalyzing treatment (30 C x 4 minutes), processing solution: ENILEX
CT-580 manufactured by Ebara Udylite Co., Ltd.
1141 water washing [15] activation treatment (40 C x 3 minutes), processing solution: 35 wt%
hydrochloric acid 100 cc/1.
[161 water washing 1171 electroless nickel plating (40 C x 5 minutes, intended thickness: 0.5 um), processing solution: ENILEX NI-100 manufactured by Ebara Udylite Co., Ltd.
1181 water washing [00511 Thick electroless nickel plating 111 degreasing (68 C x 5 minutes), processing solution: ENILEX WE
manufactured by Ebara Udylite Co., Ltd.

12] water washing [3] pre-etching (40 C x 5 minutes), processing solution: ENILEX PE-300A,B
manufactured by Ebara Udylite Co., Ltd.
[4] water washing 151 etching (68 C x 10 minutes), processing solutions: chromic acid 400 g/L
and sulfuric acid 200 cc/I.
161 recovery 171 water washing.
[8] neutralization (room temperature x 1 minute), processing solution: ENILEX
RI) manufactured by Ebara Udylite Co., Ltd.
[9] water washing.
1101 special neutralization (room temperature x 2 minutes), processing solution:
ENILEX LEX NW manufactured by Ebara Udylite Co., Ltd.
[11] water washing 112] pre-dip (room temperature x 1 min), processing solution: 35 wt%

hydrochloric acid 100 cc/L
1131 catalyzing treatment (30 C x 4 minutcs), processing solution: ENILEX
CT-580 manufactured by Ebara tidylite Co., Ltd.
1141 water washing 5 [15] activation treatment (40 C x 3 minutes), processing solution: 35 wt%
hydrochloric acid 100 cc/L
[16] water washing 1171 thick electroless nickel plating (90 C x 60 minutes in the case where the intended thickness is 20 tint), processing solution: EN1PAC MM manufactured by Ebara 10 tidy] ite Co., 1.td.
[18] water washing [00521 Electroplating:
[1.1 copper sulfate plating (25 C x 4 A/dm2 x 20 minutes in the case where the 15 intended thickness is 20 pm), processing solutions: copper sulfate 200 g/L and sulfuric acid 60 g/L, brightening agent of an appropriate amount [2] bright nickel plating (55 C x 3.5 A/dm2 x 30 minutes in the case where the intended thickness is 20 um), processing solutions: nickel sulfate 300 g/L, nickel chloride 50g/1, and boric acid 40 g/l.õ brightening agent of an appropriate amount 20 131 chrome plating (45 C x 30 A/dm2 x 2 minutes, intended thickness:
0.5 m), processing solutions: chromic acid anhydride 200 g/I. and sulfuric acid 2 WI., additive of an appropriate amount [0053]
(Plating Process 2) Target materials: materials F and G

[0054]
Electrolcss nickel plating 111 degreasing (68 C x 5 minutes), processing solution: EN1LEX WE
manufactured by [Mara Udylite Co., Ltd.
121 water washing [3] etching (35 C x 7 minutes), processing solutions: 35 mass% hydrochloric acid 220 cc/L and TN etch ant 200 cc/1_, 141 post-etching (25 C x 2 minutes), processing solution: 35 mass%
hydrochloric acid 60 cc/I.
[5] water washing [6] catalyzing treatment (25 C x 3 minutes), processing solution: EN1LEX
CT-580 manufactured by Ebara Udylite Co., Ltd.
171 water washing 181 accelerator (40 C X 3 minutes), processing solution: 98 mass% sulfuric acid 50 cc/1, 191 water washing 1101 post-accelerator (40 C x 2 minutes), processing solution: sodium hydroxide g/L
111] water washing 20 1121 electroless nickel plating (40 C x 5 minutes, intended thickness:
0.5 um), processing solution: ENILEX NI-100 manufactured by Ebara Udylite Co., Ltd.

[13] water washing Electroplating:
111 copper sulfate plating (25 C x 4 A/dm2 20 minutes in the case where the intended thickness is 20 lam), processing solutions: copper sulfate 200 g/L
and sulfuric acid 60 g/L, brightening agent of an appropriate amount [2] bright nickel plating (55 C x 3.5 A/dm2 x 30 minutes in the case where the intended thickness is 20 um), processing solutions: nickel sulfate 300 g/L, nickel chloride 50g/L and boric acid 40 g/L, brightening agent of an appropriate amount [3] chrome plating (45 C x 30 A/dm2 x 2 minutes in the case where the intended thickness is 0.5 um), processing solutions: chromic acid anhydride 200 g/L and sulfuric acid 2 R/1õ additive of an appropriate amount [Example 11 (Flexural Modulus of Filler Reinforced Plastic) The material F was molded by the injection molding machine so as to obtain the test piece with 12.5 mm x 127 mm x 4 mm thickness. The flexural modulus of the test piece was measured. The results are shown in Table 3.
10057]
(Flexural Modulus of Filler Reinforced Plastic) The material F was molded by the injection molding machine so as to obtain the test piece with 12.5 mm x 127 mm x 1 mm thickness. The plating layer was formed in accordance with the composition and the intended total thickness a shown in Table 2, so as to obtain the plated test piece. The flexural modulus of the plated test piece was measured. The results are shown in Table 3.
[00581 (Plated Plastic Chassis) The material F was molded by the injection molding machine so as to obtain the plastic chassis body (the internal chassis test piece for a mobile device) with 80 mm 125 mm x 1.5 mm thickness. 'fhe plating layer was formed in accordance with the composition and the intended total thickness a shown in Table 2, so as to obtain the plated plastic chassis. The flexural modulus of the plated plastic chassis was measured, and the warpage, dimensional accuracy and heat cycle property were evaluated.
The results are shown in Table 3.
[0059]
'Examples 2-25 and Comparative Examples 1-51 The test pieces, plated test pieces and the plated plastic chassis were obtained in the same manner as Example I except that the material F was changed with the material shown in Tables 3 and 4 and the composition and intended total thickness a were changed with the composition and intended total thickness shown in Tables 3 and 4. The results are shown in Tables 3 and 4.

. 7 ' Conipo-P
. Plating Layer (gm) Evaluation salon o-, Flexural l, and ' Flexural FT
' , . ! , Modulus Measured It..../
Modulus : Intended Measured Measured Measured _ , Mate- of Plated Measured Value of . Heat Cycle Property _ of ' Total Value of Value of Value of C
, rial 1 Material Thick- Cu Ni Cr Test i Value of Thick Dimon- C
! .
Piece Total Electro- Warpage tional (MPa) ness of Elcctro- Elcctro- Elcctro-Plating C
' iN Plating Plating Plating IPal Thick- less Ni Accuracy .
First 1 Second Third ---, [gnu] [pm] [
Layer ]
ness*11 Plating : Time Time Time , pm , 1 F 17900 a 25000 . 6 5.5 0.5 A
S A A B
i 1 .
, , . 2 C 14300 ; b 25500 , 11 10 0.5 S
S A A B
_____________________________________________________________________________ I-----, P
3 E 14800 b 26000 12 11 0.5 S
S A A B tv 0, 0, Exam-1-4 C 14300 c 29700 16 15 0.5 S
S A A AB L.
ple I I

1., A.

E 14800 c 30200 '' 16 15 0.5 S S A

,.0 6 F 17900 c 33300 15 14 0.5 A
S A A A

_______________________________________________________________________________ __________________ 7 G 13500 c 28900 16 l - - 1 15 0.5 A S .A A AB

_______________________________________________________________________________ __________________ *1.) The thickness of all the usual electroless Ni plating was considered as 0.5 p.m.
*2) The measured value of the thick electro-less Ni plating was considered as the sum of the thick electro-less Ni plating and the Ni electroplating.

-, Plating Layer (pm) Evaluation o--sition Flexural F.:
, Flexural and 1 Modulus i Measured c...,...) ' Modulus Intended , Measured Measured Measured Mate- of Plated Measured Value of , Heat Cycle Property <1:, , of Total Value of Value of Value of , rial Material Thick- C Cr Test Value of Thick Dunce-PieceElectro- 0 . u : Ni =
Total Warpaae tional (MPa) ness of . Electro- Electro- Elcctro-Plating ( MPa) ¨.
Thick- less Ni - Plating Plating Plating Accuracy First Second Third 72.' =
ness" Plating Time Time Time n Lay er [um] I ttin]
[tun] ra..
[tunl :
8 D 8300 e 27900 21 20*2) - ,k2) . - ' 0.5 S
S A A AB

, , 9 D 8300 f 30400 23 23 S S A A A
, P
D 8300 g 36200 30 30 , S S A A
A

0, ' 11 B 4300 h 36400 36 16 19 0.5 A

L.
Exam- I
I1., pie , A.
12 C I 14300 h 46400 35 15 19 0.5 S S A A A , ,.0 , ,.0 13 D 8300 h 40400 37 16 20 0.5 S
S A A A
, 14 E 14800 h 46900 36 15 20 0.5 S
S A A A
, , , , ' 15 F 17900 h 50000 37 15 21 0.5 S
S A A A
*1) The thickness of all the usual electroless Ni plating was considered as 0.5 rim.
*2) The measured value of the thick electro-less Ni plating was considered as the sum of the thick electro-less Ni plating and the Ni electroplating.
_ :
Compo- ,1 Plating Layer Olin) Evaluation P
cr saion . Flexural F;
Flexural and Modulus , ______________ , , Measured ' -F
Modulus Intended : Measured Measured i Measured !
, Mate- Material Thick-Total hick- Cu Ni Cr of Plated , Measured Value of : Heat Cycle Property ¨ _ :
C
1 rial T Value of Value of Value of lest Value of Thick Dimen- C
Piece ' Total Electro-Warpage tional C"5 , (MPa) ness of i Elcctro- i Elect-0- Electro-¨i I \Val Thick- less Ni Accurae First Plating Plating Plating Plating Second Third ness" g , Time Time Time Layer [tun] [um] [urn]
' Platin1111-111 :
' 16 G 13500 h 45600 36 IS 20 0.5 S S '. A A A
, 17 H 20500 h i 52600 37 1 - 15 21 i 0.5 S
S A A A
18 C 14300 i 50600 41 20 20 0.5 S S
A ' A A I.) Q
as .
1., 0, 19 E 14800 i 51100 42 21 20 0.5 S I
S A A A 0, L.
__________________________ ¨
-H--_______________________________________________________________________________ ________________________________ 1., 20 I F 17900 i 54200 42 21 20 0.5 S S A ' A A
.i.
I
Exam-LI

,.0 ple 21 G 13500 i 49800 41 21 19 0.5 S S A ' A A
, '221 C 14300-54800 46 20 /5 0.5 S
A A A A
'r--i' 23 E 14800 j 55300 45 20 24 0.5 S A
' A A A
, 24 C 14300 k 58900 50 25 24 0.5 A A
A A A
L __________________________ = 15 E 14800 k 59400 50 /5 24 0.5 A A .A , A A
I
*1) The thickness of all the usual electroless Ni plating was considered as 0.5 pm.
_ ^:.
' Compo- :
I'lating Laver Gun) Evaluation sition , ' FlexuralF-7 Flexural and . , , , ==
Modulus Intended Modulus Measured Measured ', Measured Measured Mate- of Plated Measured Value of Heat Cycle Property (1-:
of Total Test Value of I Value of Value of .
' rial Value of Thick , Dimen- 0 Material Thick- Piece Cu Ni Cr =
Total Electro- Warpage ' tional ' (MPal ness of ' ova.) Electro- Elcctro-Elcctro-. Accurael,, First 1 Second Third "5.
Thick- less Ni Plating Platinu Plating Plating ness*I.1 Plating *- Time I Time Time et;
, Layer [Ka] 1.1.tm]
[um] C,...
T ________________________________________ 1lT1111 , ¨
, ' 1 C 14300 m , 17600 0.5 - -I S
S A A A

. .
2 E 14800 , m 18100 0.5 S , S A A A
:
Coin-' parati VC 3 F 17900 m 21200 0.5 A A A
S A IV p Exam- I
--A

' _______________________________________________________________________________ _______________________________ Iv pie -----ix, ,os 4 A 2300 ' h 34400 36 15 19 0.5 B
B C 0, ,..
1., 1 5 A 2300 ! 1 63580 62 31 30 0.5 C
C C .,.
, ,.0 , ,.0 *I) The thickness of all the usual electroless Ni plating was considered as 0.5 n.m.
_ !Discussion]
In the plated plastic chassis of Examples 1-25, the flexural modulus was 25,000 MPa or higher, and the high rigidity was ensured. In addition, the plating properties such as the warpage, dimensional accuracy and heat cycle property were excellent.
By contrast, in Comparative Examples 1-3 wherein the plating layers were thin, the flexural modulus was 25,000 MPa or lower, and the rigidity was insufficient. In the plated plastic chassis of Comparative Examples 4 and Sin which the rigidity of the materials was less than 4,000 MPa, the flexural modulus was 25,000 MPa or higher, and the high rigidity was ensured. However, the plating properties were very poor.
[Industrial Applicability"
[00631 A plated plastic chassis of the present invention can be used as an internal chassis of various electrical products such as a notebook type PC, a tablet type PC, a personal digital assistance, a cellular phone, a smart phone, a portable game machine, an electronic dictionary, an electronic book terminal, a portable audio/video player, and a car navigation system. Therelbre, the present invention is very useful in industry.
In addition, a component for an electrical product obtained by installing a plated plastic chassis in a molding die and making a plated plastic chassis adhere to a component substrate is completed as the component which is much similar to a product incorporating an internal chassis, and an assembling process can be simplified.
Therefore, the present invention is very useful in industry.

Claims

[Claim 1]
A plated plastic chassis comprising:
a plastic chassis body obtained by molding a tiller reinforced plastic in which flexural modulus according to ISO 178:2001 is within a range from 4,000 to 22,000 MPa; and a plating layer with thickness of 5 to 50 um which is formed on at least a portion of surface of the plastic chassis body.
[Claim 2]
The plated plastic chassis according to claim I which satisfies a following condition:
flexural modulus according to ISO 178:2001 of a plated test piece, which is obtained by forming a plating layer under the same condition as the plating layer on surface of a test piece with 12.5 mm x 127 mm x 1 mm thickness obtained by molding the filler reinforced plastic, is within a range from 25,000 to 60,000 MPa.
[Claim 3]
A component for an electrical product comprising:
the plated plastic chassis according to claim 1 or 2; and a component substrate which is formed from a thermoplastic resin and adheres to the plated plastic chassis.