CA2851000C - Subfloor component and method for manufacturing same - Google Patents
Subfloor component and method for manufacturing same Download PDFInfo
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- CA2851000C CA2851000C CA2851000A CA2851000A CA2851000C CA 2851000 C CA2851000 C CA 2851000C CA 2851000 A CA2851000 A CA 2851000A CA 2851000 A CA2851000 A CA 2851000A CA 2851000 C CA2851000 C CA 2851000C
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- panel
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- subfloor component
- pedestals
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/185—Underlayers in the form of studded or ribbed plates
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- Civil Engineering (AREA)
- Structural Engineering (AREA)
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Abstract
A subfloor component comprises an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves in the first face to define, in cross-section, a plurality of pedestals having at least one wall extending toward the second face, a moisture-resistant layer formed on the first face of the panel that conforms to the pedestals, and a hardboard layer on the second face of the panel.
Description
SUBFLOOR COMPONENT AND METHOD FOR MANUFACTURING SAME
Field of the Invention [0001] The following is directed in general to building construction and renovation, and more particularly to a subfloor component and a method of manufacturing a subfloor component.
Background of the Invention 100021 A subfloor component is a panel or other component meant to be placed on top of a concrete floor or other foundation before a finished floor of, for example, hardwood or tile is installed. The subfloor component may have projections for permitting the flow of moisture underneath the component so as to prevent moisture from standing underneath the subfloor component and causing problems with mold. While subfloor components of varying types are known, improvements are desirable.
Summary of the Invention [0003] According to an aspect, there is provided a subfloor component comprising: an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves in the first face to define, in cross-section, a plurality of pedestals having at least one wall extending toward the second face; a moisture-resistant layer formed on the first face of the panel that conforms to the pedestals; and a hardboard layer on the second face of the panel, wherein the subfloor component is formed by heating or chemically treating the first face of the insulating foam panel, wherein the moisture-resistant layer may be formed by heating or chemically treating the first face of the insulating foam panel.
[0004] The moisture-resistant layer may comprise a layer of melted or fused insulating foam. The layer of melted or fused insulating foam may extend partially into the insulating foam panel from the first face. The moisture-resistant layer may be substantially moisture-impervious. The moisture-resistant layer may conform to the tops and walls of the pedestals and to the bottoms of the grooves.
[0005] The panel may comprise expanded polystyrene (EPS).
[0006] The hardboard layer may comprise material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement
Field of the Invention [0001] The following is directed in general to building construction and renovation, and more particularly to a subfloor component and a method of manufacturing a subfloor component.
Background of the Invention 100021 A subfloor component is a panel or other component meant to be placed on top of a concrete floor or other foundation before a finished floor of, for example, hardwood or tile is installed. The subfloor component may have projections for permitting the flow of moisture underneath the component so as to prevent moisture from standing underneath the subfloor component and causing problems with mold. While subfloor components of varying types are known, improvements are desirable.
Summary of the Invention [0003] According to an aspect, there is provided a subfloor component comprising: an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves in the first face to define, in cross-section, a plurality of pedestals having at least one wall extending toward the second face; a moisture-resistant layer formed on the first face of the panel that conforms to the pedestals; and a hardboard layer on the second face of the panel, wherein the subfloor component is formed by heating or chemically treating the first face of the insulating foam panel, wherein the moisture-resistant layer may be formed by heating or chemically treating the first face of the insulating foam panel.
[0004] The moisture-resistant layer may comprise a layer of melted or fused insulating foam. The layer of melted or fused insulating foam may extend partially into the insulating foam panel from the first face. The moisture-resistant layer may be substantially moisture-impervious. The moisture-resistant layer may conform to the tops and walls of the pedestals and to the bottoms of the grooves.
[0005] The panel may comprise expanded polystyrene (EPS).
[0006] The hardboard layer may comprise material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement
- 2 -board, metal sheeting, and magnesium oxide board. The hardboard layer and the panel may be attached to each other with glue.
[00071 The pedestals may be shaped as at least one of circles, ellipses, rectangles, diamonds, squares, and hexagons. Each of the plurality of pedestals may have a single wall. The pedestals may be generally uniformly distributed across the first face of the panel.
[0008] The subfloor component may be shaped to connect to another subfloor component. The hardboard layer may comprise a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The hardboard layer may include a groove that is open along at least one side-facing surface of the hardboard layer, further comprising: a connector dimensioned to insert into the groove. The connector may comprise: a central body; and tongues extending outwards from the central body, wherein each tongue is dimensioned to be inserted into a respective groove in a hardboard layer of a subfloor component.
[0009] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing heat-expandable beads into the mold against the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
removing the panel from the mold; forming a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; and attaching a hardboard layer to the second face of the panel.
[00010] The forming may comprise applying heat to the first face of the panel to melt or fuse the insulating foam. Applying heat to the first face of the panel may comprise placing a heat source in contact with and/or in non-contact proximity with the first face of the panel.
[00011] The forming may comprise applying a chemical treatment to the first face of the panel to partially dissolve or fuse the insulating foam.
[00071 The pedestals may be shaped as at least one of circles, ellipses, rectangles, diamonds, squares, and hexagons. Each of the plurality of pedestals may have a single wall. The pedestals may be generally uniformly distributed across the first face of the panel.
[0008] The subfloor component may be shaped to connect to another subfloor component. The hardboard layer may comprise a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The hardboard layer may include a groove that is open along at least one side-facing surface of the hardboard layer, further comprising: a connector dimensioned to insert into the groove. The connector may comprise: a central body; and tongues extending outwards from the central body, wherein each tongue is dimensioned to be inserted into a respective groove in a hardboard layer of a subfloor component.
[0009] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing heat-expandable beads into the mold against the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
removing the panel from the mold; forming a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; and attaching a hardboard layer to the second face of the panel.
[00010] The forming may comprise applying heat to the first face of the panel to melt or fuse the insulating foam. Applying heat to the first face of the panel may comprise placing a heat source in contact with and/or in non-contact proximity with the first face of the panel.
[00011] The forming may comprise applying a chemical treatment to the first face of the panel to partially dissolve or fuse the insulating foam.
- 3 -[00012] The heat-expandable beads may be expandable polystyrene (EPS) beads.
[00013] Attaching the hardboard layer may comprise applying adhesive to one or both of the hardboard layer and the second face of the panel. The hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
[00014] The method may further comprise: shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The method may further comprise: forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector. Each connector may be a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00015] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing heat-expandable beads into the mold against the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
applying additional heat to a portion of the mold to melt or fuse the insulating foam to form a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
[00016] The heat-expandable beads may be expandable polystyrene (EPS) beads.
A
[00013] Attaching the hardboard layer may comprise applying adhesive to one or both of the hardboard layer and the second face of the panel. The hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
[00014] The method may further comprise: shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The method may further comprise: forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector. Each connector may be a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00015] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing heat-expandable beads into the mold against the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
applying additional heat to a portion of the mold to melt or fuse the insulating foam to form a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
[00016] The heat-expandable beads may be expandable polystyrene (EPS) beads.
A
- 4 -[00017] Attaching the hardboard layer may comprise applying adhesive to one or both of the hardboard layer and the second face of the panel. The hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
[00018] The method may further comprise: shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The method may further comprise: forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector. Each connector may be a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00019] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing an insulating foam body; providing a mold configured to shape the insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing the insulating foam body into the mold against the pedestal-forming structures; applying heat and pressure to the mold, wherein the application of heat and pressure causes the insulating foam body to conform to the pedestal-forming structures and thereby form the pedestals of an insulating foam panel and a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
1000201 The heat-expandable beads may be expandable polystyrene (EPS) beads.
[00021] Attaching the hardboard layer may comprise applying adhesive to one or both of the hardboard layer and the second face of the panel. The hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
[00018] The method may further comprise: shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The method may further comprise: forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector. Each connector may be a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00019] In another aspect, there is provided a method of manufacturing a subfloor component, comprising: providing an insulating foam body; providing a mold configured to shape the insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel; placing the insulating foam body into the mold against the pedestal-forming structures; applying heat and pressure to the mold, wherein the application of heat and pressure causes the insulating foam body to conform to the pedestal-forming structures and thereby form the pedestals of an insulating foam panel and a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
1000201 The heat-expandable beads may be expandable polystyrene (EPS) beads.
[00021] Attaching the hardboard layer may comprise applying adhesive to one or both of the hardboard layer and the second face of the panel. The hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
- 5 -[00022] The method may further comprise: shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component. The method may further comprise: forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector. Each connector may be a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00023] A subfloor component may be fabricated according to any one of the above-described methods.
Forming grooves may comprise forming grooves on four sides of said hardboard layer.
[00023] A subfloor component may be fabricated according to any one of the above-described methods.
- 6 -Brief Description of the Drawings [00024] Embodiments will now be described more fully with reference to the accompanying drawings in which:
[00025] Figure 1 is a perspective view of the underside of one embodiment of a subfloor component;
[00026] Figure 2 is a bottom view of the subfloor component of Figure 1;
[00027] Figure 3 is a side view of the subfloor component of Figure 1;
[00028] Figure 4 is an end view of the subfloor component of Figure 1;
[00029] Figure 5 is a top view of the subfloor component of Figure 1;
[00030] Figure 6 is a perspective view of the underside of another embodiment of a subfloor component;
[00031] Figure 7 is a bottom view of the subfloor component of Figure 6;
[00032] Figure 8 is a side view of the subfloor component of Figure 6;
[00033] Figure 9 is an end view of the subfloor component of Figure 6;
[00034] Figure 10 is a top view of the subfloor component of Figure 6;
[00035] Figure 11 is a bottom view of another embodiment of a subfloor component;
[00036] Figure 12 is a side view of the subfloor component of Figure 11;
[00037] Figure 13 is an end view of the subfloor component of Figure 11;
[00038] Figure 14 is a top view of the subfloor component of Figure 11;
[00039] Figure 15 is a bottom view of another embodiment of a subfloor component;
[00040] Figure 16 is a side view of the subfloor component of Figure 15;
[00041] Figure 17 is an end view of the subfloor component of Figure 15;
[00042] Figure 18 is a top view of the subfloor component of Figure 15;
1000431 Figure 19 is a bottom view of another embodiment of a subfloor component;
[00044] Figure 20 is a side view of the subfloor component of Figure 19;
[00045] Figure 21 is an end view of the subfloor component of Figure 19;
[00046] Figure 22 is a top view of the subfloor component of Figure 19;
[00047] Figure 23 is a bottom view of another embodiment of a subfloor component;
=
[00025] Figure 1 is a perspective view of the underside of one embodiment of a subfloor component;
[00026] Figure 2 is a bottom view of the subfloor component of Figure 1;
[00027] Figure 3 is a side view of the subfloor component of Figure 1;
[00028] Figure 4 is an end view of the subfloor component of Figure 1;
[00029] Figure 5 is a top view of the subfloor component of Figure 1;
[00030] Figure 6 is a perspective view of the underside of another embodiment of a subfloor component;
[00031] Figure 7 is a bottom view of the subfloor component of Figure 6;
[00032] Figure 8 is a side view of the subfloor component of Figure 6;
[00033] Figure 9 is an end view of the subfloor component of Figure 6;
[00034] Figure 10 is a top view of the subfloor component of Figure 6;
[00035] Figure 11 is a bottom view of another embodiment of a subfloor component;
[00036] Figure 12 is a side view of the subfloor component of Figure 11;
[00037] Figure 13 is an end view of the subfloor component of Figure 11;
[00038] Figure 14 is a top view of the subfloor component of Figure 11;
[00039] Figure 15 is a bottom view of another embodiment of a subfloor component;
[00040] Figure 16 is a side view of the subfloor component of Figure 15;
[00041] Figure 17 is an end view of the subfloor component of Figure 15;
[00042] Figure 18 is a top view of the subfloor component of Figure 15;
1000431 Figure 19 is a bottom view of another embodiment of a subfloor component;
[00044] Figure 20 is a side view of the subfloor component of Figure 19;
[00045] Figure 21 is an end view of the subfloor component of Figure 19;
[00046] Figure 22 is a top view of the subfloor component of Figure 19;
[00047] Figure 23 is a bottom view of another embodiment of a subfloor component;
=
- 7 -[00048] Figure 24 is a side view of the subfloor component of Figure 22;
[00049] Figure 25 is an end view of the subfloor component of Figure 22;
[00050] Figure 26 is a top view of the subfloor component of Figure 22;
[00051] Figure 27 is a bottom view of another embodiment of a subfloor component;
[00052] Figure 28 is a side view of the subfloor component of Figure 27;
[00053] Figure 29 is an end view of the subfloor component of Figure 28;
[00054] Figure 30 is a top view of the subfloor component of Figure 29;
[00055] Figure 31 is a bottom view of another embodiment of a subfloor component;
[00056] Figure 32 is a side view of the subfloor component of Figure 31;
[00057] Figure 33 is an end view of the subfloor component of Figure 31;
[00058] Figure 34 is a top view of the subfloor component of Figure 31;
[00059] Figure 35 is a perspective view of expandable polystyrene beads being poured into a mold structure, and against pedestal-forming structures within the mold structure, during manufacture of the subfloor component of Figure 1;
[00060] Figure 36 is a perspective view of the mold structure of Figure 35 being closed prior to applying heat to the mold;
[00061] Figure 37 is a cutaway view of the end of the mold structure enclosing expandable polystyrene beads while the mold structure is being heated;
1000621 Figure 38 is a perspective view of the insulating foam panel having been formed with pedestals within the mold;
[00063] Figure 39 is a perspective view of the insulating foam panel of Figure 38 having been formed with a moisture-resistant layer on a face thereof;
[00064] Figure 40 is a perspective view of the hardboard layer being aligned with the face of the insulating foam panel of Figure 39 that is opposite to the panel's pedestals;
[00065] Figure 41 is a perspective view of the subfloor component having been formed;
[00066] Figure 42 is a flowchart of steps for manufacturing the subfloor component, according to the embodiment of Figures 35 to 41;
[00049] Figure 25 is an end view of the subfloor component of Figure 22;
[00050] Figure 26 is a top view of the subfloor component of Figure 22;
[00051] Figure 27 is a bottom view of another embodiment of a subfloor component;
[00052] Figure 28 is a side view of the subfloor component of Figure 27;
[00053] Figure 29 is an end view of the subfloor component of Figure 28;
[00054] Figure 30 is a top view of the subfloor component of Figure 29;
[00055] Figure 31 is a bottom view of another embodiment of a subfloor component;
[00056] Figure 32 is a side view of the subfloor component of Figure 31;
[00057] Figure 33 is an end view of the subfloor component of Figure 31;
[00058] Figure 34 is a top view of the subfloor component of Figure 31;
[00059] Figure 35 is a perspective view of expandable polystyrene beads being poured into a mold structure, and against pedestal-forming structures within the mold structure, during manufacture of the subfloor component of Figure 1;
[00060] Figure 36 is a perspective view of the mold structure of Figure 35 being closed prior to applying heat to the mold;
[00061] Figure 37 is a cutaway view of the end of the mold structure enclosing expandable polystyrene beads while the mold structure is being heated;
1000621 Figure 38 is a perspective view of the insulating foam panel having been formed with pedestals within the mold;
[00063] Figure 39 is a perspective view of the insulating foam panel of Figure 38 having been formed with a moisture-resistant layer on a face thereof;
[00064] Figure 40 is a perspective view of the hardboard layer being aligned with the face of the insulating foam panel of Figure 39 that is opposite to the panel's pedestals;
[00065] Figure 41 is a perspective view of the subfloor component having been formed;
[00066] Figure 42 is a flowchart of steps for manufacturing the subfloor component, according to the embodiment of Figures 35 to 41;
-8-1000671 Figure 43 is a perspective view is of a mold structure having expandable polystyrene beads poured therein being closed prior to applying heat to the mold, during manufacture of the subfloor component of Figure 1, according to another embodiment;
[00068] Figure 44 is a cutaway view of the end of the mold structure enclosing expandable polystyrene beads while the mold structure is being heated;
[00069] Figure 45 is a cutaway view of the end of the mold structure enclosing an insulating foam panel while additional heat is being applied to a bottom portion of the mold structure;
[00070] Figure 46 is a perspective view of the insulating foam panel having been formed with a moisture-resistant layer on a face thereof within the mold;
[00071] Figure 47 is a flowchart of steps for manufacturing the subfloor component, according to the embodiment of Figures 43 to 46;
[00072] Figure 48 is a perspective view of expandable polystyrene beads being poured into a first mold structure, during manufacture of the subfloor component of Figure 1, according to still another embodiment;
[00073] Figure 49 is a perspective view of an insulating foam body having been formed within the mold;
[00074] Figure 50 is a perspective view of the insulating foam body being placed against pedestal-forming structures within a second mold structure;
[00075] Figure 51 is a flowchart of steps for manufacturing a subfloor component, according to the embodiment of Figures 48 to 50; and 1000761 Figure 52 is an exploded side view of a portion two subfloor components according to another embodiment, and a connector strip therebetween.
Detailed Description of the Embodiments [00077] In Figures 1 through 5, there is shown a subfloor component 10 according to an embodiment. Subfloor component 10 is rectangular in shape, and comprises a hardboard panel 12 and an insulating foam panel 14. The insulating foam panel 14 includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 that have walls that extend toward the second face.
[00068] Figure 44 is a cutaway view of the end of the mold structure enclosing expandable polystyrene beads while the mold structure is being heated;
[00069] Figure 45 is a cutaway view of the end of the mold structure enclosing an insulating foam panel while additional heat is being applied to a bottom portion of the mold structure;
[00070] Figure 46 is a perspective view of the insulating foam panel having been formed with a moisture-resistant layer on a face thereof within the mold;
[00071] Figure 47 is a flowchart of steps for manufacturing the subfloor component, according to the embodiment of Figures 43 to 46;
[00072] Figure 48 is a perspective view of expandable polystyrene beads being poured into a first mold structure, during manufacture of the subfloor component of Figure 1, according to still another embodiment;
[00073] Figure 49 is a perspective view of an insulating foam body having been formed within the mold;
[00074] Figure 50 is a perspective view of the insulating foam body being placed against pedestal-forming structures within a second mold structure;
[00075] Figure 51 is a flowchart of steps for manufacturing a subfloor component, according to the embodiment of Figures 48 to 50; and 1000761 Figure 52 is an exploded side view of a portion two subfloor components according to another embodiment, and a connector strip therebetween.
Detailed Description of the Embodiments [00077] In Figures 1 through 5, there is shown a subfloor component 10 according to an embodiment. Subfloor component 10 is rectangular in shape, and comprises a hardboard panel 12 and an insulating foam panel 14. The insulating foam panel 14 includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17 that have walls that extend toward the second face.
-9-1000781 The insulating foam panel 14 has a moisture-resistant layer 16 or "skin" formed on the first face of the panel, and which generally conforms to the pedestals 17. In this embodiment, the moisture-resistant layer 16 is formed on the tops and walls of the pedestals 17 as well as on the bottom of the grooves, and is formed by heating the first face of the insulating foam panel 14 so as to cause the foam at and below the surface to melt or fuse. In this embodiment, the insulating foam panel 14 is formed of expanded polystyrene (EPS), and the moisture-resistant layer 16 is formed by heating the first face of the insulating foam panel 14 to a temperature near to or above the melting point of the EPS foam using a suitable heat source, such as for example a radiant heater, an infrared lamp, a hot air gun, a torch, and the like. Other suitable heat sources are known to those skilled in the art. As foam below the surface also fuses or melts, it will be understood that the moisture-resistant layer extends partially into the insulating foam panel from the first face.
[00079] The hardboard layer 12 is on the second face of the panel, which is opposite the panel 14 from the first face. In this embodiment, the hardboard panel 12 is oriented strand board (OSB), a material well-known to be employed in building construction. Also in this embodiment, the hardboard panel 12 is glued to the insulating foam panel 14.
1000801 The subfloor component 10 is to be placed on a foundation floor or other such structure with the pedestals 17 downwards and with the moisture-resistant layer 16 between the insulating foam layer 14 and the foundation floor.
Moisture on the foundation floor is able to pass between the pedestals 17 and can contact the moisture-resistant layer 16 in order to drain away from underneath the subfloor component 10. The moisture-resistant layer 16 effectively resists the passage of moisture into the insulating foam panel 14 from the foundation floor thereby keeping the insulating foam panel 14 suitably dry. Thus, it will be understood that the moisture-resistant layer 16 is substantially moisture-impervious, meaning that the moisture-resistant layer 16 permits only an insignificant amount of moisture, if any, to pass therethrough.
1000811 The formation of the moisture-resistant layer 16 on the insulating foam panel 14 enables the pedestals 17 to have increased resistance to breakage. As would be understood, as useful as expanded EPS is for insulation, it can be brittle.
In this
[00079] The hardboard layer 12 is on the second face of the panel, which is opposite the panel 14 from the first face. In this embodiment, the hardboard panel 12 is oriented strand board (OSB), a material well-known to be employed in building construction. Also in this embodiment, the hardboard panel 12 is glued to the insulating foam panel 14.
1000801 The subfloor component 10 is to be placed on a foundation floor or other such structure with the pedestals 17 downwards and with the moisture-resistant layer 16 between the insulating foam layer 14 and the foundation floor.
Moisture on the foundation floor is able to pass between the pedestals 17 and can contact the moisture-resistant layer 16 in order to drain away from underneath the subfloor component 10. The moisture-resistant layer 16 effectively resists the passage of moisture into the insulating foam panel 14 from the foundation floor thereby keeping the insulating foam panel 14 suitably dry. Thus, it will be understood that the moisture-resistant layer 16 is substantially moisture-impervious, meaning that the moisture-resistant layer 16 permits only an insignificant amount of moisture, if any, to pass therethrough.
1000811 The formation of the moisture-resistant layer 16 on the insulating foam panel 14 enables the pedestals 17 to have increased resistance to breakage. As would be understood, as useful as expanded EPS is for insulation, it can be brittle.
In this
- 10 -embodiment, the pedestals 17, which are shaped as squares, each have four (4) walls meeting at four (4) edges and four (4) top corners. Particularly the top corners and also the edges are most prone to being broken away during transportation, installation, or usage. The present inventor has discovered that, particularly for a subfloor component 10 that will be experiencing various physical pressures from above, advantages are gained by employing a moisture-resistant layer 16 that not only resists moisture reaching the insulating foam panel 14 but also increases the structural integrity of the pedestals 17. In this way, physical pressures both during construction (workers, wheel barrows, other machinery) and when construction is complete (home owners, employees, couches, filing cabinets etc.) can be better withstood by the pedestals 17.
[00082] In this embodiment, the walls of the intersecting grooves have a height of about 15 millimetres, giving the pedestals 17 a corresponding height.
However, other heights are possible. For example, other embodiments may provide heights of between about 15 millimetres to about 20 millimetres. Furthermore, in this embodiment, the intersecting grooves have a width of about 15 millimetres, giving the pedestals 17 a corresponding spacing. However, other widths are possible. For example, other embodiments may provide widths of between about 15 millimetres to about 20 millimetres. It will be understood that having all grooves have the same width is not required.
[00083] While the above-described subfloor component 10 can be useful for many purposes, the present inventor has also developed additional embodiments.
For example, Figures 6 through 10 show a subfloor component 10a according to another embodiment. Subtloor component 10a is square in shape, and comprises a hardboard panel 12a and an insulating foam panel 14a that has a moisture-resistant layer 16a formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14a includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17a that have walls that extend toward the second face. The moisture-resistant layer 16a is formed on the first face of the panel and conforms to the pedestals 17a. The hardboard layer 12a is on the second face of the panel, which is opposite the panel 14a from the first
[00082] In this embodiment, the walls of the intersecting grooves have a height of about 15 millimetres, giving the pedestals 17 a corresponding height.
However, other heights are possible. For example, other embodiments may provide heights of between about 15 millimetres to about 20 millimetres. Furthermore, in this embodiment, the intersecting grooves have a width of about 15 millimetres, giving the pedestals 17 a corresponding spacing. However, other widths are possible. For example, other embodiments may provide widths of between about 15 millimetres to about 20 millimetres. It will be understood that having all grooves have the same width is not required.
[00083] While the above-described subfloor component 10 can be useful for many purposes, the present inventor has also developed additional embodiments.
For example, Figures 6 through 10 show a subfloor component 10a according to another embodiment. Subtloor component 10a is square in shape, and comprises a hardboard panel 12a and an insulating foam panel 14a that has a moisture-resistant layer 16a formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14a includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17a that have walls that extend toward the second face. The moisture-resistant layer 16a is formed on the first face of the panel and conforms to the pedestals 17a. The hardboard layer 12a is on the second face of the panel, which is opposite the panel 14a from the first
- 11 -face. As can be seen, subfloor component 10a is similar to subfloor component 10, but is square instead of rectangular.
[00084] Figures 11 through 14 show a subfloor component 10b according to another embodiment. Subfloor component 10b is square in shape, and comprises a hardboard panel 12b and an insulating foam panel 14b that has a moisture-resistant layer 16b formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14b includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17b that have walls that extend toward the second face. The moisture-resistant layer 16b is formed on the first face of the panel and conforms to the pedestals 17b.
The hardboard layer 12b is on the second face of the panel, which is opposite the panel 14b from the first face. As can be seen, subfloor component 10b is similar to subfloor component 10, but is square instead of rectangular. Furthermore, each of the pedestals 17b are circular, rather than square. The pedestals 17b being circular means that each pedestal 17b only has one wall, and thus there are no top corners.
Because pedestal 17b does not have any top corners, breakage due to handling or use of the subfloor component 10b is even less likely.
[00085] Figures 15 through 18 show a subfloor component 10c according to another embodiment. Subfloor component 10c is square in shape, and comprises a hardboard panel 12c and an insulating foam panel 14c that has a moisture-resistant layer 16c formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14c includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17c that have walls that extend toward the second face. The moisture-resistant layer 16c is formed on the first face of the panel and conforms to the pedestals 17c.
The hardboard layer 12c is on the second face of the panel, which is opposite the panel 14c from the first face. As can be seen, subfloor component 10c is similar to subfloor component 10, but is square instead of rectangular. Furthermore, each of the pedestals 17c are oval-shaped, rather than square. The pedestals 17c being oval-shaped means that each pedestal 17c only has one wall, and thus there are no top corners. Because pedestal 17c does not have any top comers, breakage due to handling or use of the subfloor component 10c is less likely.
[00084] Figures 11 through 14 show a subfloor component 10b according to another embodiment. Subfloor component 10b is square in shape, and comprises a hardboard panel 12b and an insulating foam panel 14b that has a moisture-resistant layer 16b formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14b includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17b that have walls that extend toward the second face. The moisture-resistant layer 16b is formed on the first face of the panel and conforms to the pedestals 17b.
The hardboard layer 12b is on the second face of the panel, which is opposite the panel 14b from the first face. As can be seen, subfloor component 10b is similar to subfloor component 10, but is square instead of rectangular. Furthermore, each of the pedestals 17b are circular, rather than square. The pedestals 17b being circular means that each pedestal 17b only has one wall, and thus there are no top corners.
Because pedestal 17b does not have any top corners, breakage due to handling or use of the subfloor component 10b is even less likely.
[00085] Figures 15 through 18 show a subfloor component 10c according to another embodiment. Subfloor component 10c is square in shape, and comprises a hardboard panel 12c and an insulating foam panel 14c that has a moisture-resistant layer 16c formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14c includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17c that have walls that extend toward the second face. The moisture-resistant layer 16c is formed on the first face of the panel and conforms to the pedestals 17c.
The hardboard layer 12c is on the second face of the panel, which is opposite the panel 14c from the first face. As can be seen, subfloor component 10c is similar to subfloor component 10, but is square instead of rectangular. Furthermore, each of the pedestals 17c are oval-shaped, rather than square. The pedestals 17c being oval-shaped means that each pedestal 17c only has one wall, and thus there are no top corners. Because pedestal 17c does not have any top comers, breakage due to handling or use of the subfloor component 10c is less likely.
- 12 -100086] Figures 19 through 22 show a subfloor component 10d according to another embodiment. Subfloor component 10d is square in shape, and comprises a hardboard panel 12d and an insulating foam panel 14d that has a moisture-resistant layer 16d formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14d includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17d that have walls that extend toward the second face. The moisture-resistant layer 16d is formed on the first face of the panel and conforms to the pedestals 17d.
The hardboard layer 12a is on the second face of the panel, which is opposite the panel 14d from the first face. As can be seen, subfloor component 10d is similar to subfloor component 10, but is square instead of rectangular. Furthermore, there are two different sizes of pedestals 17d, namely a thin rectangle and a thick rectangle.
1000871 Figures 23 through 26 show a subfloor component 10d according to another embodiment. Subfloor component 10e is square in shape, and comprises a hardboard panel 12e and an insulating foam panel 14e that has a moisture-resistant layer 16e formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14e includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17e that have walls that extend toward the second face. The moisture-resistant layer 16e is formed on the first face of the panel and conforms to the pedestals 17e.
The hardboard layer 12e is on the second face of the panel, which is opposite the panel 14e from the first face. As can be seen, subfloor component 10e is similar to subfloor component 10, but is square instead of rectangular. Furthermore, the pedestals 17e are diamond-shaped.
1000881 Figures 27 through 30 show a subfloor component 10f according to another embodiment. Subfloor component 10f is square in shape, and comprises a hardboard panel 12f and an insulating foam panel 14f that has a moisture-resistant layer if formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14f includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17f that have walls that extend toward the second face. The moisture-resistant layer 16f is formed on the first face of the panel and conforms to the pedestals 17f. The CA 02851000,2014-05-02
The hardboard layer 12a is on the second face of the panel, which is opposite the panel 14d from the first face. As can be seen, subfloor component 10d is similar to subfloor component 10, but is square instead of rectangular. Furthermore, there are two different sizes of pedestals 17d, namely a thin rectangle and a thick rectangle.
1000871 Figures 23 through 26 show a subfloor component 10d according to another embodiment. Subfloor component 10e is square in shape, and comprises a hardboard panel 12e and an insulating foam panel 14e that has a moisture-resistant layer 16e formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14e includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17e that have walls that extend toward the second face. The moisture-resistant layer 16e is formed on the first face of the panel and conforms to the pedestals 17e.
The hardboard layer 12e is on the second face of the panel, which is opposite the panel 14e from the first face. As can be seen, subfloor component 10e is similar to subfloor component 10, but is square instead of rectangular. Furthermore, the pedestals 17e are diamond-shaped.
1000881 Figures 27 through 30 show a subfloor component 10f according to another embodiment. Subfloor component 10f is square in shape, and comprises a hardboard panel 12f and an insulating foam panel 14f that has a moisture-resistant layer if formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14f includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17f that have walls that extend toward the second face. The moisture-resistant layer 16f is formed on the first face of the panel and conforms to the pedestals 17f. The CA 02851000,2014-05-02
- 13 -hardboard layer 12f is on the second face of the panel, which is opposite the panel 14f from the first face. As can be seen, subfloor component 10f is similar to subfloor component 10, but is square instead of rectangular. Furthermore, the pedestals 17f are all rectangles.
[00089] Figures 31 through 34 show a subfloor component lOg according to another embodiment. Subfloor component lOg is square in shape, and comprises a hardboard panel 12g and an insulating foam panel 14g that has a moisture-resistant layer 16g formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14g includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17g that have walls that extend toward the second face. The moisture-resistant layer 16g is formed on the first face of the panel and conforms to the pedestals 17g.
The hardboard layer 12g is on the second face of the panel, which is opposite the panel 14g from the first face. As can be seen, subfloor component lOg is similar to subfloor component 10, but is square instead of rectangular. Furthermore, the pedestals 17g are all hexagons.
[00090] It will be understood that a subfloor component with pedestals of different shapes, including others not disclosed above, or mixtures of differently-shaped pedestals such as those described above, may be provided.
[00091] The various subfloor components described herein may generally be used alongside each other in a particular installation, provided that the overall thicknesses of two different panels are similar, and provided that using differently-shaped pedestals in two different subfloor components does not unduly impede the flow of moisture beneath the subfloor components. In one embodiment, subfloor components have tongue and groove configurations along the edges which abut against each other, such that the tongue of one panel can be received within the groove of the adjacent panel. The tongues/grooves may have square, rectangular configurations with or without rounded distal corners. The tongue and groove configuration may be formed prior to, or after, attaching the hardboard panel to the insulating foam panel.
[00092] Figure 42 shows a flowchart of steps of a method of manufacturing a subfloor component, such as subfloor component 10 described above. The treatment
[00089] Figures 31 through 34 show a subfloor component lOg according to another embodiment. Subfloor component lOg is square in shape, and comprises a hardboard panel 12g and an insulating foam panel 14g that has a moisture-resistant layer 16g formed thereon. Like the embodiment described in Figures 1 through 5, the insulating foam panel 14g includes first and second opposing faces. Multiple intersecting grooves in the first face define, in cross-section, multiple pedestals 17g that have walls that extend toward the second face. The moisture-resistant layer 16g is formed on the first face of the panel and conforms to the pedestals 17g.
The hardboard layer 12g is on the second face of the panel, which is opposite the panel 14g from the first face. As can be seen, subfloor component lOg is similar to subfloor component 10, but is square instead of rectangular. Furthermore, the pedestals 17g are all hexagons.
[00090] It will be understood that a subfloor component with pedestals of different shapes, including others not disclosed above, or mixtures of differently-shaped pedestals such as those described above, may be provided.
[00091] The various subfloor components described herein may generally be used alongside each other in a particular installation, provided that the overall thicknesses of two different panels are similar, and provided that using differently-shaped pedestals in two different subfloor components does not unduly impede the flow of moisture beneath the subfloor components. In one embodiment, subfloor components have tongue and groove configurations along the edges which abut against each other, such that the tongue of one panel can be received within the groove of the adjacent panel. The tongues/grooves may have square, rectangular configurations with or without rounded distal corners. The tongue and groove configuration may be formed prior to, or after, attaching the hardboard panel to the insulating foam panel.
[00092] Figure 42 shows a flowchart of steps of a method of manufacturing a subfloor component, such as subfloor component 10 described above. The treatment
- 14 -of the materials involved in the steps is illustrated in Figures 35 through 41. In Figure 35, a mold structure is shown to have a top portion 50 and a bottom portion 52. It will be understood that the Vitus top and bottom may be interchanged with left and right, for example, in the case of a mold structure that stands vertically.
[00093] First, heat-expandable beads 56 are placed into the mold structure within the bottom portion 52 on top of and therefore adjacent to pedestal-forming structures 54 (step 110), as shown in Figure 35. The pedestal-forming structures 54 are part of the bottom portion 52 of the mold structure, and have a shape corresponding to the shape of the desired pedestals 17. With the heat-expandable beads 56 within the mold structure between top 50 and bottom 52 portions, the mold structure is then closed, as shown in Figure 36. Heat is then applied to the mold structure (step 120) so as to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form the insulating foam panel 14, the pressure of the expansion causes the expanding beads 56 to enter into and conform to the pedestal-forming structures 54, as shown in the cutaway view of Figure 37.
1000941 With the insulating foam panel 14 having been formed with pedestals 17, the insulating foam panel 14 is then removed from the mold structure (step 130), as shown in Figure 38. Heat is then applied to the first face of the insulating foam panel 14 using a suitable heat source (not shown), such as for example a radiant heater, an infrared lamp, a hot air gun, and the like. The applied heat causes the foam at and below the surface to melt or fuse, so as to form the moisture-resistant layer 16 (step 140), shown in Figure 39.
1000951 With the moisture-resistant layer 16 having been formed on insulating foam panel 14, the hardboard layer 12 is then adhered to the insulating foam panel 14 (step 150) to thereby form the subfloor component 10.
1000961 Other methods may be used. For example, Figure 47 shows a flowchart of steps of a method of manufacturing a subfloor component, such as subfloor component 10 described above. The treatment of the materials involved in some of the steps is illustrated in Figures 43 through 46. In Figure 43, a mold structure is shown as having a top portion 50 and a bottom portion 52. It will be
[00093] First, heat-expandable beads 56 are placed into the mold structure within the bottom portion 52 on top of and therefore adjacent to pedestal-forming structures 54 (step 110), as shown in Figure 35. The pedestal-forming structures 54 are part of the bottom portion 52 of the mold structure, and have a shape corresponding to the shape of the desired pedestals 17. With the heat-expandable beads 56 within the mold structure between top 50 and bottom 52 portions, the mold structure is then closed, as shown in Figure 36. Heat is then applied to the mold structure (step 120) so as to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form the insulating foam panel 14, the pressure of the expansion causes the expanding beads 56 to enter into and conform to the pedestal-forming structures 54, as shown in the cutaway view of Figure 37.
1000941 With the insulating foam panel 14 having been formed with pedestals 17, the insulating foam panel 14 is then removed from the mold structure (step 130), as shown in Figure 38. Heat is then applied to the first face of the insulating foam panel 14 using a suitable heat source (not shown), such as for example a radiant heater, an infrared lamp, a hot air gun, and the like. The applied heat causes the foam at and below the surface to melt or fuse, so as to form the moisture-resistant layer 16 (step 140), shown in Figure 39.
1000951 With the moisture-resistant layer 16 having been formed on insulating foam panel 14, the hardboard layer 12 is then adhered to the insulating foam panel 14 (step 150) to thereby form the subfloor component 10.
1000961 Other methods may be used. For example, Figure 47 shows a flowchart of steps of a method of manufacturing a subfloor component, such as subfloor component 10 described above. The treatment of the materials involved in some of the steps is illustrated in Figures 43 through 46. In Figure 43, a mold structure is shown as having a top portion 50 and a bottom portion 52. It will be
- 15 -understood that the terms top and bottom may be interchanged with left and right, for example, in the case of a mold structure that stands vertically.
[00097] First, heat-expandable beads 56 are placed into the mold structure within the bottom portion 52 on top of and therefore adjacent to pedestal-forming structures 54 (step 210). With the heat-expandable beads 56 within the mold structure between top 50 and bottom 52 portions, the mold structure is then closed, as shown in Figure 43. Heat is then applied to the mold structure (step 220) so as to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form the insulating foam panel 14, the pressure of the expansion causes the expanding beads 56 to enter into and conform to the pedestal-forming structures 54, as shown in the cutaway view of Figure 44.
[00098] With the insulating foam panel 14 having been formed with pedestals 17, and with the insulating foam panel 14 still in the mold structure, additional heat is then applied to the bottom portion 52 of the mold structure (step 230). The additional heat causes the foam at and below the surface of the first face of the insulating foam panel 14 to melt or fuse, so as to form the moisture-resistant layer 16, as shown in the cutaway view of Figure 45.
[00099] With the moisture-resistant layer 16 having been formed on the insulating foam panel 14, the combination is then removed from the mold structure (step 240), as shown in Figure 46. The hardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 250), to thereby form the subfloor component 10.
[000100] Still other methods may be used. For example, Figure 51 shows a flowchart of steps of a method of manufacturing a subfloor component such as subfloor component 10 described above. The treatment of the materials involved in some of the steps is illustrated in Figures 48 through 50. In Figure 48, a first mold structure is shown to have a top portion 350 and a bottom portion 352.
[000101] First, heat-expandable beads 56 are placed within the bottom portion 352 of the first mold structure on top of and therefore adjacent to generally planar mold surface 355, as shown in Figure 48. With the heat-expandable beads 56 within the mold structure between top 350 and bottom 352 portions, the first mold structure is then closed, as shown in Figure 49. Heat is then applied to the mold structure so as
[00097] First, heat-expandable beads 56 are placed into the mold structure within the bottom portion 52 on top of and therefore adjacent to pedestal-forming structures 54 (step 210). With the heat-expandable beads 56 within the mold structure between top 50 and bottom 52 portions, the mold structure is then closed, as shown in Figure 43. Heat is then applied to the mold structure (step 220) so as to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form the insulating foam panel 14, the pressure of the expansion causes the expanding beads 56 to enter into and conform to the pedestal-forming structures 54, as shown in the cutaway view of Figure 44.
[00098] With the insulating foam panel 14 having been formed with pedestals 17, and with the insulating foam panel 14 still in the mold structure, additional heat is then applied to the bottom portion 52 of the mold structure (step 230). The additional heat causes the foam at and below the surface of the first face of the insulating foam panel 14 to melt or fuse, so as to form the moisture-resistant layer 16, as shown in the cutaway view of Figure 45.
[00099] With the moisture-resistant layer 16 having been formed on the insulating foam panel 14, the combination is then removed from the mold structure (step 240), as shown in Figure 46. The hardboard layer 12 is then adhered to the combination that was removed from the mold structure (step 250), to thereby form the subfloor component 10.
[000100] Still other methods may be used. For example, Figure 51 shows a flowchart of steps of a method of manufacturing a subfloor component such as subfloor component 10 described above. The treatment of the materials involved in some of the steps is illustrated in Figures 48 through 50. In Figure 48, a first mold structure is shown to have a top portion 350 and a bottom portion 352.
[000101] First, heat-expandable beads 56 are placed within the bottom portion 352 of the first mold structure on top of and therefore adjacent to generally planar mold surface 355, as shown in Figure 48. With the heat-expandable beads 56 within the mold structure between top 350 and bottom 352 portions, the first mold structure is then closed, as shown in Figure 49. Heat is then applied to the mold structure so as
- 16 -to cause the heat-expandable beads 56 to expand and fuse together. While the heat-expandable beads 56 are expanding to form an insulating foam body, the pressure of the expansion causes the expanding beads 56 to conform to the generally planar mold surface 355. The resulting insulating foam body has opposing faces that are generally planar.
[0001021 The insulating foam body is then removed from the first mold structure, as shown in Figure 49, to thereby provide the insulating foam body (step 310). The insulating foam body 315 is then placed within the bottom portion 52 of a second mold structure on top of and therefore adjacent to pedestal-forming structures 54 (step 320), as shown in Figure 50. With the insulating foam body within the second mold structure between top 50 and bottom 52 portions, the second mold structure is then closed. Heat and pressure are then applied to the second mold structure (step 330) so as to cause the insulating foam body 315 to enter into and conform to the pedestal-forming structures 54, and thereby form the insulating foam panel 14. Additionally, heat applied to the bottom portion 52 of the second mold structure causes the foam at and below the surface of the first face of the insulating foam panel 14 to melt or fuse, so as to form the moisture-resistant layer 16.
10001031 With the insulating foam panel 14 having been formed with the moisture-resistant layer 16 thereon, the combination is then removed from the second mold structure (step 340). The hardboard layer 12 is then adhered to the combination that was removed from the second mold structure (step 350), to thereby form the subfloor component 10.
[0001041 It will be understood that other approaches may alternatively be used to provide the insulating foam body referred to step 310.
10001051 Although in embodiments described above, the subfloor components have tongue and groove configurations along the edges which abut against each other, in other embodiments, other configurations may be used. For example, in other embodiments, the subfloor components may alternatively have grooves along the edges, and with each groove being configured to receive a connector for connecting adjacent subfloor components. The connector may be, for example, a longitudinal connector strip comprising opposing tongues, with each tongue being shaped to be received by a respective groove.
[0001021 The insulating foam body is then removed from the first mold structure, as shown in Figure 49, to thereby provide the insulating foam body (step 310). The insulating foam body 315 is then placed within the bottom portion 52 of a second mold structure on top of and therefore adjacent to pedestal-forming structures 54 (step 320), as shown in Figure 50. With the insulating foam body within the second mold structure between top 50 and bottom 52 portions, the second mold structure is then closed. Heat and pressure are then applied to the second mold structure (step 330) so as to cause the insulating foam body 315 to enter into and conform to the pedestal-forming structures 54, and thereby form the insulating foam panel 14. Additionally, heat applied to the bottom portion 52 of the second mold structure causes the foam at and below the surface of the first face of the insulating foam panel 14 to melt or fuse, so as to form the moisture-resistant layer 16.
10001031 With the insulating foam panel 14 having been formed with the moisture-resistant layer 16 thereon, the combination is then removed from the second mold structure (step 340). The hardboard layer 12 is then adhered to the combination that was removed from the second mold structure (step 350), to thereby form the subfloor component 10.
[0001041 It will be understood that other approaches may alternatively be used to provide the insulating foam body referred to step 310.
10001051 Although in embodiments described above, the subfloor components have tongue and groove configurations along the edges which abut against each other, in other embodiments, other configurations may be used. For example, in other embodiments, the subfloor components may alternatively have grooves along the edges, and with each groove being configured to receive a connector for connecting adjacent subfloor components. The connector may be, for example, a longitudinal connector strip comprising opposing tongues, with each tongue being shaped to be received by a respective groove.
- 17 -[000106] For example, Figure 50 shows two adjacent subfloor components 10, each subfloor component 10 including a hardboard panel 12, an insulating foam panel 14, and a moisture-resistant film (not shown). The insulating foam panel 14 includes first and second opposing faces, with multiple intersecting grooves in the first face defining, in cross-section, multiple pedestals (not shown), as in subfloor component described above and with reference to Figures 1 to 5. Each hardboard panel 12 has two (2) grooves 882 formed therein on opposing sides. In this embodiment, the adjacent subfloor components 10 are configured to be connected by a connector in the form of a longitudinal connector strip 890 having a length extending into the page.
The connector strip 890 comprises two (2) opposing tongues 894, with each tongue 894 being shaped to be received by a respective groove 882 and having a thickness that provides frictional engagement with the inside of the groove 882 for connecting the adjacent subfloor components 10.
[000107] The connector strip 890 may be made of plastic, metal, or one or more other suitable materials, and may be a unitary device or be made of two or more interconnected pieces.
[000108] The length of the connector strip 890 may be less than, the same as, or greater than the corresponding length of a particular subfloor component 10.
As will be understood, the connector strip 890 functions to align the hardboard layers 12 and to thereby keep the adjacent subfloor components 10 into which it is inserted from shifting relative to each other thereby providing a more unitary subfloor, and generally on the same plane as each other. In the embodiment shown in Figure 50, each side of the hardboard layer 12 is recessed slightly from the side of the corresponding foam panel 14 so as to accommodate the central body of the connector strip 890 in a way that permits the facing sides of the foam panels 14 to generally contact each other, despite the insertion of the connector strip 890 between the hardboard layers 12. That is, each hardboard layer 12 is recessed an amount corresponding to half the thickness of the central body of the connector strip 890.
10001091 In an alternative configuration, one of the hardboard layers 12 may be recessed an amount corresponding to the entire thickness of the central body of the connector strip 890, rather than just half of the thickness, while the hardboard layer 12 that faces the recessed layer is not recessed at all with respect to its corresponding
The connector strip 890 comprises two (2) opposing tongues 894, with each tongue 894 being shaped to be received by a respective groove 882 and having a thickness that provides frictional engagement with the inside of the groove 882 for connecting the adjacent subfloor components 10.
[000107] The connector strip 890 may be made of plastic, metal, or one or more other suitable materials, and may be a unitary device or be made of two or more interconnected pieces.
[000108] The length of the connector strip 890 may be less than, the same as, or greater than the corresponding length of a particular subfloor component 10.
As will be understood, the connector strip 890 functions to align the hardboard layers 12 and to thereby keep the adjacent subfloor components 10 into which it is inserted from shifting relative to each other thereby providing a more unitary subfloor, and generally on the same plane as each other. In the embodiment shown in Figure 50, each side of the hardboard layer 12 is recessed slightly from the side of the corresponding foam panel 14 so as to accommodate the central body of the connector strip 890 in a way that permits the facing sides of the foam panels 14 to generally contact each other, despite the insertion of the connector strip 890 between the hardboard layers 12. That is, each hardboard layer 12 is recessed an amount corresponding to half the thickness of the central body of the connector strip 890.
10001091 In an alternative configuration, one of the hardboard layers 12 may be recessed an amount corresponding to the entire thickness of the central body of the connector strip 890, rather than just half of the thickness, while the hardboard layer 12 that faces the recessed layer is not recessed at all with respect to its corresponding
- 18 -foam panel 14. In this way, the central body of the connector strip 890 is accommodated entirely by the recession of one of the hardboard layers 12.
Other configurations for accommodating the central body of the connector strip 890 are possible.
[000110] In another alternative configuration, one or both of the opposing tongues 894 of the connector strip may alternatively have barbs extending therefrom for frictionally engaging, or "gripping", the insides of the groove(s) 882 to help with resisting of sliding of the connector strip relative to the subfloor components. As will be understood, such a barbed configuration would make it easy for an installer to insert a connector strip into grooves.
[000111] In another alternative configuration, a connector may be provided that has no central body but that simply consists of tongues 894. With such a configuration, there may be a less rigid connection between hardboard layers 12.
Advantageously, however, there would be no requirement for recession of one or both hardboard layers 12 to accommodate a central body in this case, and the hardboard layers 12 could therefore be arranged to contact each other in a manner such as is described above for adjacent facing sides of the foam panels 14.
[000112] Although in the embodiment shown in Figure 50, there are grooves formed along two (2) opposing sides of the hardboard panel, in other embodiments, there may alternatively be grooves formed along the four (4) sides of the hardboard panel. The grooves may be formed prior to, or after, attaching the hardboard panel to the insulating foam panel.
10001131 Furthermore, while in the embodiments disclosed above the pedestals are generally uniformly distributed across the insulating foam panel, alternatives may be provided having pedestals that are not so uniformly distributed.
1000114] Although in the embodiments described above, the moisture resistant layer is formed by heating the first face of the insulating foam panel so as to cause the foam at and below the surface to melt or fuse, in other embodiments, the moisture resistant layer may alternatively formed by chemically treating the first face of the insulating foam panel. For example, in one such embodiment, a solvent may be applied to the first face to cause the foam at and below the surface to partially dissolve
Other configurations for accommodating the central body of the connector strip 890 are possible.
[000110] In another alternative configuration, one or both of the opposing tongues 894 of the connector strip may alternatively have barbs extending therefrom for frictionally engaging, or "gripping", the insides of the groove(s) 882 to help with resisting of sliding of the connector strip relative to the subfloor components. As will be understood, such a barbed configuration would make it easy for an installer to insert a connector strip into grooves.
[000111] In another alternative configuration, a connector may be provided that has no central body but that simply consists of tongues 894. With such a configuration, there may be a less rigid connection between hardboard layers 12.
Advantageously, however, there would be no requirement for recession of one or both hardboard layers 12 to accommodate a central body in this case, and the hardboard layers 12 could therefore be arranged to contact each other in a manner such as is described above for adjacent facing sides of the foam panels 14.
[000112] Although in the embodiment shown in Figure 50, there are grooves formed along two (2) opposing sides of the hardboard panel, in other embodiments, there may alternatively be grooves formed along the four (4) sides of the hardboard panel. The grooves may be formed prior to, or after, attaching the hardboard panel to the insulating foam panel.
10001131 Furthermore, while in the embodiments disclosed above the pedestals are generally uniformly distributed across the insulating foam panel, alternatives may be provided having pedestals that are not so uniformly distributed.
1000114] Although in the embodiments described above, the moisture resistant layer is formed by heating the first face of the insulating foam panel so as to cause the foam at and below the surface to melt or fuse, in other embodiments, the moisture resistant layer may alternatively formed by chemically treating the first face of the insulating foam panel. For example, in one such embodiment, a solvent may be applied to the first face to cause the foam at and below the surface to partially dissolve
- 19 -or fuse, and thereby form the moisture resistant layer. The solvent may be an organic solvent, such as acetone, for example.
[000115] Although in the embodiments described above, the moisture-resistant layer is formed on the tops and walls of the pedestals as well as on the bottom of the moves, in other embodiments, the moisture resistant layer may alternatively be formed on only a portion of the pedestals, such as for example on only the tops of the pedestals, or on only the tops and a portion of the sides.
[000116] Although embodiments have been described above with reference to the accompanying drawings, those of skill in the art will appreciate that variations and modifications may be made without departing from the scope thereof as defined by the appended claims.
[000115] Although in the embodiments described above, the moisture-resistant layer is formed on the tops and walls of the pedestals as well as on the bottom of the moves, in other embodiments, the moisture resistant layer may alternatively be formed on only a portion of the pedestals, such as for example on only the tops of the pedestals, or on only the tops and a portion of the sides.
[000116] Although embodiments have been described above with reference to the accompanying drawings, those of skill in the art will appreciate that variations and modifications may be made without departing from the scope thereof as defined by the appended claims.
Claims
What is claimed is:
1. A subfloor component comprising:
an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves in the first face to define, in cross-section, a plurality of pedestals having at least one wall extending toward the second face;
a moisture-resistant layer formed on the first face of the panel that conforms to the pedestals; and a hardboard layer on the second face of the panel, wherein the subfloor component and the moisture-resistant layer are formed by heating or chemically treating the first face of the insulating foam panel.
2. The subfloor component of claim 1, wherein the moisture-resistant layer comprises a layer of melted or fused insulating foam.
3. The subfloor component of claim 2, wherein the layer of melted or fused insulating foam extends partially into the insulating foam panel from the first face.
4. The subfloor component of any one of claims 1 to 3, wherein the moisture-resistant layer is substantially moisture-impervious.
5. The subfloor component of any one of claims 1 to 4, wherein the moisture-resistant layer conforms to tops and walls of the pedestals and to bottoms of the grooves.
6. The subfloor component of any one of claims 1 to 5, wherein the panel comprises expanded polystyrene.
7. The subfloor component of any one of claims 1 to 6, wherein the hardboard layer comprises material selected from the group consisting of:
oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
8. The subfloor component of any one of claims 1 to 7, wherein the hardboard layer and the panel are attached to each other with glue.
9. The subfloor component of any one of claims 1 to 8, wherein the pedestals are shaped as at least one of circles, ellipses, rectangles, diamonds, squares, and hexagons.
10. The subfloor component of claim 9, wherein each of the plurality of pedestals has a single wall.
11. The subfloor component of any one of claims 1 to 10, wherein the pedestals are uniformly distributed across the first face of the panel.
12. The subfloor component of any one of claims 1 to 11, wherein the subfloor component is shaped to connect to another subfloor component.
13. The subfloor component of claim 12, wherein the hardboard layer comprises a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
14. The subfloor component of claim 12, wherein the hardboard layer includes a groove that is open along at least one side-facing surface of the hardboard layer, further comprising:
a connector dimensioned to insert into the groove.
15. The subfloor component of claim 14, wherein the connector comprises:
a central body; and tongues extending outwards from the central body, wherein each tongue is dimensioned to be inserted into a respective groove in a hardboard layer of a subfloor component.
16. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
removing the panel from the mold;
forming a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; and attaching a hardboard layer to the second face of the panel.
17. The method of claim 16, wherein forming comprises applying heat to the first face of the panel to melt or fuse the insulating foam.
18. The method of claim 17, wherein applying heat to the first face of the panel comprises placing a heat source in contact with and/or in non-contact proximity with the first face of the panel.
19. The method of claim 16, wherein forming comprises applying a chemical treatment to the first face of the panel to partially dissolve or fuse the insulating foam.
20 The method of any one of claims 16 to 19, wherein the heat-expandable beads are expandable polystyrene beads.
21 The method of any one of claims 16 to 20, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel 22. The method of any one of claims 16 to 21, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
23 The method of any one of claims 16 to 22, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component 24 The method of any one of claims 16 to 22, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
25. The method of claim 24, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
26 The method of claim 24 or 25, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
27. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
applying additional heat to a portion of the mold to melt or fuse the insulating foam to form a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals, removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
28. The method of claim 27, wherein the heat-expandable beads arc expandable polystyrene (EPS) beads 79. The method of claim 27 or 28, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
30. The method of any one of claims 27 to 29, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
31. The method of any one of claims 27 to 30, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
32. The method of any one of claims 27 to 30, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
33. The method of claim 32, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
34. The method of claim 32 or 33, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
35. A method of manufacturing a subfloor component, comprising:
providing an insulating foam body;
providing a mold configured to shape the insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing the insulating foam body into the mold against the pedestal-forming structures, applying heat and pressure to the mold, wherein the application of heat and pressure causes the insulating foam body to conform to the pedestal-forming structures and thereby form the pedestals of an insulating foam panel and a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals;
removing the panel with the moisture-resistant layer formed thereon from the mold: and attaching a hardboard layer to the second face of the panel 36 The method of claim 35, wherein the insulating foam is expanded polystyrene.
37. The method of claim 35 or 36, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
38. The method of any one of claims 35 to 37, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
39. The method of any one of claims 35 to 38, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
40. The method of any one of claims 35 to 38, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
41. The method of claim 40, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
42. The method of claim 40 or 41, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
1. A subfloor component comprising:
an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves in the first face to define, in cross-section, a plurality of pedestals having at least one wall extending toward the second face;
a moisture-resistant layer formed on the first face of the panel that conforms to the pedestals; and a hardboard layer on the second face of the panel, wherein the subfloor component and the moisture-resistant layer are formed by heating or chemically treating the first face of the insulating foam panel.
2. The subfloor component of claim 1, wherein the moisture-resistant layer comprises a layer of melted or fused insulating foam.
3. The subfloor component of claim 2, wherein the layer of melted or fused insulating foam extends partially into the insulating foam panel from the first face.
4. The subfloor component of any one of claims 1 to 3, wherein the moisture-resistant layer is substantially moisture-impervious.
5. The subfloor component of any one of claims 1 to 4, wherein the moisture-resistant layer conforms to tops and walls of the pedestals and to bottoms of the grooves.
6. The subfloor component of any one of claims 1 to 5, wherein the panel comprises expanded polystyrene.
7. The subfloor component of any one of claims 1 to 6, wherein the hardboard layer comprises material selected from the group consisting of:
oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
8. The subfloor component of any one of claims 1 to 7, wherein the hardboard layer and the panel are attached to each other with glue.
9. The subfloor component of any one of claims 1 to 8, wherein the pedestals are shaped as at least one of circles, ellipses, rectangles, diamonds, squares, and hexagons.
10. The subfloor component of claim 9, wherein each of the plurality of pedestals has a single wall.
11. The subfloor component of any one of claims 1 to 10, wherein the pedestals are uniformly distributed across the first face of the panel.
12. The subfloor component of any one of claims 1 to 11, wherein the subfloor component is shaped to connect to another subfloor component.
13. The subfloor component of claim 12, wherein the hardboard layer comprises a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
14. The subfloor component of claim 12, wherein the hardboard layer includes a groove that is open along at least one side-facing surface of the hardboard layer, further comprising:
a connector dimensioned to insert into the groove.
15. The subfloor component of claim 14, wherein the connector comprises:
a central body; and tongues extending outwards from the central body, wherein each tongue is dimensioned to be inserted into a respective groove in a hardboard layer of a subfloor component.
16. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
removing the panel from the mold;
forming a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals; and attaching a hardboard layer to the second face of the panel.
17. The method of claim 16, wherein forming comprises applying heat to the first face of the panel to melt or fuse the insulating foam.
18. The method of claim 17, wherein applying heat to the first face of the panel comprises placing a heat source in contact with and/or in non-contact proximity with the first face of the panel.
19. The method of claim 16, wherein forming comprises applying a chemical treatment to the first face of the panel to partially dissolve or fuse the insulating foam.
20 The method of any one of claims 16 to 19, wherein the heat-expandable beads are expandable polystyrene beads.
21 The method of any one of claims 16 to 20, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel 22. The method of any one of claims 16 to 21, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
23 The method of any one of claims 16 to 22, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component 24 The method of any one of claims 16 to 22, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
25. The method of claim 24, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
26 The method of claim 24 or 25, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
27. A method of manufacturing a subfloor component, comprising:
providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing heat-expandable beads into the mold against the pedestal-forming structures;
applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
applying additional heat to a portion of the mold to melt or fuse the insulating foam to form a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals, removing the panel with the moisture-resistant layer formed thereon from the mold; and attaching a hardboard layer to the second face of the panel.
28. The method of claim 27, wherein the heat-expandable beads arc expandable polystyrene (EPS) beads 79. The method of claim 27 or 28, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
30. The method of any one of claims 27 to 29, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
31. The method of any one of claims 27 to 30, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
32. The method of any one of claims 27 to 30, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
33. The method of claim 32, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
34. The method of claim 32 or 33, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
35. A method of manufacturing a subfloor component, comprising:
providing an insulating foam body;
providing a mold configured to shape the insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a first face having a plurality of pedestals with walls that extend toward a second opposing face of the panel;
placing the insulating foam body into the mold against the pedestal-forming structures, applying heat and pressure to the mold, wherein the application of heat and pressure causes the insulating foam body to conform to the pedestal-forming structures and thereby form the pedestals of an insulating foam panel and a moisture-resistant layer on the first face of the panel, the moisture-resistant layer conforming to the pedestals;
removing the panel with the moisture-resistant layer formed thereon from the mold: and attaching a hardboard layer to the second face of the panel 36 The method of claim 35, wherein the insulating foam is expanded polystyrene.
37. The method of claim 35 or 36, wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel.
38. The method of any one of claims 35 to 37, wherein the hardboard layer comprises material selected from the group consisting of: oriented strand board, plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
39. The method of any one of claims 35 to 38, further comprising:
shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
40. The method of any one of claims 35 to 38, further comprising:
forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.
41. The method of claim 40, wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components.
42. The method of claim 40 or 41, wherein said forming grooves comprises forming grooves on four sides of said hardboard layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2851000A CA2851000C (en) | 2013-09-17 | 2014-05-02 | Subfloor component and method for manufacturing same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2827450A CA2827450C (en) | 2013-09-17 | 2013-09-17 | Subfloor component and method for manufacturing same |
| CA2,827,450 | 2013-09-17 | ||
| CA2851000A CA2851000C (en) | 2013-09-17 | 2014-05-02 | Subfloor component and method for manufacturing same |
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| Publication Number | Publication Date |
|---|---|
| CA2851000A1 CA2851000A1 (en) | 2015-03-17 |
| CA2851000C true CA2851000C (en) | 2018-06-12 |
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| CA2827450A Active CA2827450C (en) | 2013-09-17 | 2013-09-17 | Subfloor component and method for manufacturing same |
| CA2851000A Active CA2851000C (en) | 2013-09-17 | 2014-05-02 | Subfloor component and method for manufacturing same |
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| CA2827450A Active CA2827450C (en) | 2013-09-17 | 2013-09-17 | Subfloor component and method for manufacturing same |
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| CA (2) | CA2827450C (en) |
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| CA2827450A1 (en) | 2013-12-20 |
| CA2827450C (en) | 2014-10-21 |
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