CA2745301A1 - Cooling system for encased electronic devices - Google Patents
Cooling system for encased electronic devices Download PDFInfo
- Publication number
- CA2745301A1 CA2745301A1 CA2745301A CA2745301A CA2745301A1 CA 2745301 A1 CA2745301 A1 CA 2745301A1 CA 2745301 A CA2745301 A CA 2745301A CA 2745301 A CA2745301 A CA 2745301A CA 2745301 A1 CA2745301 A1 CA 2745301A1
- Authority
- CA
- Canada
- Prior art keywords
- heat exchanger
- cooling
- cooling system
- cooling air
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Abstract
The invention is directed to a cooling system for encased electronic devices, in particular computer racks, with a heat exchanger (1) and a closed cooling air duct (4) extending at least between the housing (2) of the devices and the heat exchanger (1), which cooling air duct feeds the heated cooling air (3) leaving the housing to the heat exchanger (1) before it is released to the environment (5).
Description
Cooling system for encased electronic devices The invention is related to a cooling system for cooling waste heat-producing electronic devices, in particular computer racks.
In order to assure functioning of electronic devices, these have to be cooled and the produced waste heat has to be discharged and/or dissipated. In known server racks, the cooling air is sucked in from the server room, led along the electronic devices for cooling and blown off again into the server room using a fan or a ventilator.
Because of this, a high heat load develops in the server rooms of data centres due to the waste heat produced by the servers. So far, heat discharge from such rooms has been carried out by transporting the heated air. However, since air is a very bad heat conductor, very high air mass flows have to be circulated in order to achieve the necessary cooling power. Transport efficiency for the circulated air or the driving power of the ventilators, respectively, and re-cooling the circulated air by means of cooling units constitute a considerable cost factor for data centres.
A problem to be solved by the present invention is to provide a more efficient cooling for encased electronic devices, in particular for computer racks.
This problem is solved by the subject-matter of claim 1, wherein the subclaims define preferred embodiments of the present invention.
Although the present invention is described in the following as to be used for cooling server racks, it is absolutely conceivable to cool other devices producing waste heat by means of the cooling system according to the invention.
The cooling system according to the invention comprises a heat exchanger and a closed cooling air duct which feeds the heated cooling air leaving the housing into the heat exchanger before it is released to the environment and which extends at least between a housing of the devices and the heat exchanger.
In other words, the heated cooling air is according to the invention no longer blown by the fan out from the device housing into the server room. Rather, the heated cooling air is directly led to a heat exchanger where the heat is extracted again from the cooling air. Only the cooled air is then blown into the server room again.
Thus, the heat is according to the invention discharged directly where it is generated.
The air in the server room is therefore no longer heated and thus does not need to be expensively cooled again. In this manner, energy may be saved which is necessary for transporting the air from the server room to a cooling unit and/or refrigerator and back again from the cooling unit to the server room.
Another advantage of the present invention consists in that it uses the anyway present cooling fan of the server to lead the cooling air past the heat exchanger.
Thus, no fan of its own has to be provided for the cooling system according to the invention which further reduces the energy expenditure for the cooling. Of course it is conceivable to provide an additional fan in order to, for example, compensate for a higher pressure loss during flow through the heat exchanger.
According to a preferred embodiment, a liquid cooling medium flows through the heat exchanger, water being particularly cost-efficient as a cooling medium, wherein it is absolutely conceivable to add additives to it such as for example anti-freeze agent. Of course, other liquid cooling media are also suitable for being employed in the cooling system according to the invention.
While with hitherto existing cooling systems the air heated by the devices and transported out of the server room has to be re-cooled again by refrigerators at high energy expense before being transported back into the server room, it suffices with the present invention to re-cool the liquid cooling medium heated in the heat exchanger outside of the server room in a further heat exchanger. This may happen for example in a wet or dry cooling tower which makes employment of energy-expensive refrigerators superfluous almost all-the-year.
According to a further preferred embodiment, the cooling medium flows through the heat exchanger transversely to the flow direction of the heated air. It therefore is a matter of a cross flow heat exchanger. Experiments have shown that this is a convenient design for the present invention.
With hitherto existing server racks, cooling air flows through them in their horizontal direction while with a particularly preferred embodiment of the present invention, the heat exchanger is provided at the rear side of the device housing or the server rack, respectively, at which the heated cooling air emanates. Because the density of the cooling medium in the heat exchanger decreases with increasing temperature and the cooling medium strives to rise upward in a vertical direction, transport of the cooling medium due to its natural buoyancy is supported with a vertical arrangement of the cooling medium duct. Thus, the cross flow design is the most suitable one with a heat exchanger arranged at the server rack on the rear side. It is, however, also conceivable to arrange the heat exchanger at another place in the device housing, such as for example at the upper or lower side of the server rack, such that counterflow or co-current designs may turn out to be suitable. It is further conceivable to provide the heat exchanger at a place different from the device housing or the server rack, respectively, as long as the heated cooling air escaping from the device housing is transported to the heat exchanger on the direct way in order to be released in a re-cooled state into the server room only after passing the heat exchanger. For this, for example, a cooling air tube extending from the server rack to the heat exchanger would be conceivable.
In order to assure functioning of electronic devices, these have to be cooled and the produced waste heat has to be discharged and/or dissipated. In known server racks, the cooling air is sucked in from the server room, led along the electronic devices for cooling and blown off again into the server room using a fan or a ventilator.
Because of this, a high heat load develops in the server rooms of data centres due to the waste heat produced by the servers. So far, heat discharge from such rooms has been carried out by transporting the heated air. However, since air is a very bad heat conductor, very high air mass flows have to be circulated in order to achieve the necessary cooling power. Transport efficiency for the circulated air or the driving power of the ventilators, respectively, and re-cooling the circulated air by means of cooling units constitute a considerable cost factor for data centres.
A problem to be solved by the present invention is to provide a more efficient cooling for encased electronic devices, in particular for computer racks.
This problem is solved by the subject-matter of claim 1, wherein the subclaims define preferred embodiments of the present invention.
Although the present invention is described in the following as to be used for cooling server racks, it is absolutely conceivable to cool other devices producing waste heat by means of the cooling system according to the invention.
The cooling system according to the invention comprises a heat exchanger and a closed cooling air duct which feeds the heated cooling air leaving the housing into the heat exchanger before it is released to the environment and which extends at least between a housing of the devices and the heat exchanger.
In other words, the heated cooling air is according to the invention no longer blown by the fan out from the device housing into the server room. Rather, the heated cooling air is directly led to a heat exchanger where the heat is extracted again from the cooling air. Only the cooled air is then blown into the server room again.
Thus, the heat is according to the invention discharged directly where it is generated.
The air in the server room is therefore no longer heated and thus does not need to be expensively cooled again. In this manner, energy may be saved which is necessary for transporting the air from the server room to a cooling unit and/or refrigerator and back again from the cooling unit to the server room.
Another advantage of the present invention consists in that it uses the anyway present cooling fan of the server to lead the cooling air past the heat exchanger.
Thus, no fan of its own has to be provided for the cooling system according to the invention which further reduces the energy expenditure for the cooling. Of course it is conceivable to provide an additional fan in order to, for example, compensate for a higher pressure loss during flow through the heat exchanger.
According to a preferred embodiment, a liquid cooling medium flows through the heat exchanger, water being particularly cost-efficient as a cooling medium, wherein it is absolutely conceivable to add additives to it such as for example anti-freeze agent. Of course, other liquid cooling media are also suitable for being employed in the cooling system according to the invention.
While with hitherto existing cooling systems the air heated by the devices and transported out of the server room has to be re-cooled again by refrigerators at high energy expense before being transported back into the server room, it suffices with the present invention to re-cool the liquid cooling medium heated in the heat exchanger outside of the server room in a further heat exchanger. This may happen for example in a wet or dry cooling tower which makes employment of energy-expensive refrigerators superfluous almost all-the-year.
According to a further preferred embodiment, the cooling medium flows through the heat exchanger transversely to the flow direction of the heated air. It therefore is a matter of a cross flow heat exchanger. Experiments have shown that this is a convenient design for the present invention.
With hitherto existing server racks, cooling air flows through them in their horizontal direction while with a particularly preferred embodiment of the present invention, the heat exchanger is provided at the rear side of the device housing or the server rack, respectively, at which the heated cooling air emanates. Because the density of the cooling medium in the heat exchanger decreases with increasing temperature and the cooling medium strives to rise upward in a vertical direction, transport of the cooling medium due to its natural buoyancy is supported with a vertical arrangement of the cooling medium duct. Thus, the cross flow design is the most suitable one with a heat exchanger arranged at the server rack on the rear side. It is, however, also conceivable to arrange the heat exchanger at another place in the device housing, such as for example at the upper or lower side of the server rack, such that counterflow or co-current designs may turn out to be suitable. It is further conceivable to provide the heat exchanger at a place different from the device housing or the server rack, respectively, as long as the heated cooling air escaping from the device housing is transported to the heat exchanger on the direct way in order to be released in a re-cooled state into the server room only after passing the heat exchanger. For this, for example, a cooling air tube extending from the server rack to the heat exchanger would be conceivable.
Especially preferably, capillary tubes are employed with the heat exchanger according to the invention for leading the cooling medium. In this manner, the heat exchanger generates only a very low pressure loss in the cooling air flow so that a sufficient cooling air flow can be maintained only by the fan present in the server and a separate fan for compensation of the pressure loss in the heat exchanger is not imperatively necessary. Just as advantageously, the heat exchanger with capillary tubes is not prone to soiling and therefore easy to maintain.
Further preferably, plural capillary tubes may be integrated to into a composition, wherein the capillary tubes can be switched in parallel and therefore have a common intake and a common drain and/or outlet. It would, however, also be conceivable to switch the capillary tubes serially so that the cooling medium passes through them one after the other.
Furthermore, a planar design of the capillary tubes composition is preferred in which the capillary tubes of one composition extend in parallel in a plane. Such a design is also called a capillary tube mat.
The heat exchanger according to the invention can according to an especially preferred embodiment have plural such compositions which are integrated to form a register, wherein it is possible to switch individual ones, plural ones or all of the compositions in parallel and/or serially. Especially preferred is a parallel switching of the compositions, though, such that the cooling medium having equal temperature passes through them. Also preferred is an alignment of the compositions transverse to the flow direction of the cooling air such that the cooling air flow passes the individual compositions one after the other after leaving the server rack.
However, an alignment of the compositions would be just as conceivable in which the cooling air flows against the individual compositions in parallel, flow of the cooling air thus running in the plane of the individual compositions.
Further preferably, plural capillary tubes may be integrated to into a composition, wherein the capillary tubes can be switched in parallel and therefore have a common intake and a common drain and/or outlet. It would, however, also be conceivable to switch the capillary tubes serially so that the cooling medium passes through them one after the other.
Furthermore, a planar design of the capillary tubes composition is preferred in which the capillary tubes of one composition extend in parallel in a plane. Such a design is also called a capillary tube mat.
The heat exchanger according to the invention can according to an especially preferred embodiment have plural such compositions which are integrated to form a register, wherein it is possible to switch individual ones, plural ones or all of the compositions in parallel and/or serially. Especially preferred is a parallel switching of the compositions, though, such that the cooling medium having equal temperature passes through them. Also preferred is an alignment of the compositions transverse to the flow direction of the cooling air such that the cooling air flow passes the individual compositions one after the other after leaving the server rack.
However, an alignment of the compositions would be just as conceivable in which the cooling air flows against the individual compositions in parallel, flow of the cooling air thus running in the plane of the individual compositions.
As far as according to a further preferred embodiment the cooling medium duct, in particular the capillary tubes, comprise a plastic material, in particular polypropylene (PP), polyethylene (PE), polyester or polyethylene terephthalate (PET), the cooling system according to the invention can be improved to be even more maintenance-friendly, because the capillary tubes made of polypropylene are corrosion-resistant and therefore clogging them by rust particles need neither be feared. Equally, such capillary tubes are dirt-repellent so that the heat exchanger may neither be clogged as easily by dirt introduced with the cooling air. Accordingly, capillary tubes completely made of polypropylene are especially preferred.
Furthermore, the heat exchanger of the cooling system according to the invention can be surrounded by a casing which is connected to the housing of the devices to be cooled or the server rack, respectively, wherein, as already suggested further above, the casing of the heat exchanger can be installed at an arbitrary location of the device housing, wherein a rear-side arrangement of the heat exchanger housing on the server rack is especially preferred. In order to improve access and therefore also the maintenance friendliness of the heat exchanger, the heat exchanger housing may be installed pivotably on the device housing such that the heat exchanger can be pivoted away from the device housing along with the casing for maintenance purposes.
According to a further preferred embodiment, the heat exchanger housing has the essentially same cross-section in the flow direction of the heated air as the device housing. In other words, the heat exchanger housing has the corresponding measurements of the respective side at the device housing at which the heat exchanger housing with the heat exchanger is attached.
The present invention is illustrated in more detail in the following by way of figures 1 to 3. It can comprise the features shown therein individually as well as in any sensible combination thereof.
It is shown in Fig. 1: a schematic side view of the cooling system according to the invention on a server rack Fig. 2: a side view of a capillary tube composition Fig. 3: three-side-view of a heat exchanger according to the invention In figure 1, a schematic side view of a server rack 2 with heat exchanger casing 11 attached to it is shown. The heat exchanger casing 11 is attached to the rear side of the device housing 2 and therefore at the location at which the air current 3 entering through the front side of the server rack 2 leaves the server rack 2 again or would enter the environment/the server room 5, respectively. The current of the cooling air 3 is illustrated in figure 1 by the parallel arrows. The heat exchanger seated in the in the casing 11 comprises a register 10 formed by plural capillary tube compositions switched in parallel. The cooling air duct 4 consists in the embodiment shown here of a circumferential lip seal arranged between heat exchanger casing 11 and server rack 2 and running on and stuck into the casing 11, which enables an airtight connection of sever rack 2 and the heat exchanger casing 11.
The internal, not shown cooling fans of the servers 2 convey the warm waste air 3 of the devices through the register 10 through which water flows and in which the waste heat is extracted from the air 3 and transferred onto the cooling medium water. The heated cooling water is transported to the outside in a closed pipe circuit and re-cooled there, wherein the cooling system according to the invention replaces the hitherto conventional ventilation equipment of the server room.
Not shown are the upper and lower side mountings with concealed pin hinges attached between the server rack 2 and the heat exchanger casing 11, which allow to pivot the heat exchanger casing 11 away from the server rack 2 without having to dismount the connectors for the cooling medium for maintenance jobs on the servers and/or the on the cooling register.
In figure 2 a planar composition 7, a so-called capillary tube mat with plural capillary tubes 6 is shown which extends in parallel in a vertical direction between two distribution lines. The length of the capillary tubes 6 is set in accordance with the respective height of the rack casing. The lower distribution line has an inlet 8 while the upper distribution line has a drain and/or outlet 9. In the example shown here, the flexible connecting tubes DN15 can thus be connected to the composition 7 so that the cooling water lows through the composition 7 from bottom to top.
In figure 3, a 3-side-view of a heat exchanger 1 according to the invention is shown which comprises a register 10 of 20 capillary tube mats 7 and a heat exchanger casing 11 which surrounds the capillary tube mat register 10 at four sides and leads the cooling air flow 3 running in direction S through the register 10. In the steel sheet casing 11 of the heat exchanger 1 mounting bores are provided into which the individual capillary tube mats 7 can be mounted and/or hung, wherein the casing 11 on the coupling side between server rack 2 and heat exchanger 1 is formed as a flange. Furthermore visible are the inlets 8 and the drains 9 which are formed separately for each capillary tube mat at opposing side walls of the casing 11. The inlets and drain (8, 9) provided separately for each capillary tube mat allow for an arbitrary switching of the capillary tube mats 7, wherein a parallel switching of the capillary tube mats 7 in the register 10 is preferred. By having a certain offset in height of the inlets and drain (8, 9), it is possible to reduce a distance and/or clearance between the capillary tube mats 7 in order to receive a more compact register 10.
In the concrete embodiment of figure 3, capillary tube mats manufactured by Clina having the type Orimat G10 are used, the capillary tubes of which have an outer diameter of 3.4 mm and an inner diameter of 2.3 mm. The capillary tubes are made of polypropylene and thermically welded together with an upper and a lower distribution line, wherein the number of capillary tube mats in a cooling register is variable and can be adapted to the actual heating power of a server rack. The shown capillary tube mats reach a cooling power of about 66 W per mat at a water entry temperature of ca. 18 C. In the example shown here, 20 capillary tube mats 7 are arranged behind one another, the inlets and drains of which are connected in parallel.
Because of this, the heat exchanger shown here reaches a total cooling power of 12 KW.
The cooling powers considerably increase with decreasing water entry temperatures.
Furthermore, the heat exchanger of the cooling system according to the invention can be surrounded by a casing which is connected to the housing of the devices to be cooled or the server rack, respectively, wherein, as already suggested further above, the casing of the heat exchanger can be installed at an arbitrary location of the device housing, wherein a rear-side arrangement of the heat exchanger housing on the server rack is especially preferred. In order to improve access and therefore also the maintenance friendliness of the heat exchanger, the heat exchanger housing may be installed pivotably on the device housing such that the heat exchanger can be pivoted away from the device housing along with the casing for maintenance purposes.
According to a further preferred embodiment, the heat exchanger housing has the essentially same cross-section in the flow direction of the heated air as the device housing. In other words, the heat exchanger housing has the corresponding measurements of the respective side at the device housing at which the heat exchanger housing with the heat exchanger is attached.
The present invention is illustrated in more detail in the following by way of figures 1 to 3. It can comprise the features shown therein individually as well as in any sensible combination thereof.
It is shown in Fig. 1: a schematic side view of the cooling system according to the invention on a server rack Fig. 2: a side view of a capillary tube composition Fig. 3: three-side-view of a heat exchanger according to the invention In figure 1, a schematic side view of a server rack 2 with heat exchanger casing 11 attached to it is shown. The heat exchanger casing 11 is attached to the rear side of the device housing 2 and therefore at the location at which the air current 3 entering through the front side of the server rack 2 leaves the server rack 2 again or would enter the environment/the server room 5, respectively. The current of the cooling air 3 is illustrated in figure 1 by the parallel arrows. The heat exchanger seated in the in the casing 11 comprises a register 10 formed by plural capillary tube compositions switched in parallel. The cooling air duct 4 consists in the embodiment shown here of a circumferential lip seal arranged between heat exchanger casing 11 and server rack 2 and running on and stuck into the casing 11, which enables an airtight connection of sever rack 2 and the heat exchanger casing 11.
The internal, not shown cooling fans of the servers 2 convey the warm waste air 3 of the devices through the register 10 through which water flows and in which the waste heat is extracted from the air 3 and transferred onto the cooling medium water. The heated cooling water is transported to the outside in a closed pipe circuit and re-cooled there, wherein the cooling system according to the invention replaces the hitherto conventional ventilation equipment of the server room.
Not shown are the upper and lower side mountings with concealed pin hinges attached between the server rack 2 and the heat exchanger casing 11, which allow to pivot the heat exchanger casing 11 away from the server rack 2 without having to dismount the connectors for the cooling medium for maintenance jobs on the servers and/or the on the cooling register.
In figure 2 a planar composition 7, a so-called capillary tube mat with plural capillary tubes 6 is shown which extends in parallel in a vertical direction between two distribution lines. The length of the capillary tubes 6 is set in accordance with the respective height of the rack casing. The lower distribution line has an inlet 8 while the upper distribution line has a drain and/or outlet 9. In the example shown here, the flexible connecting tubes DN15 can thus be connected to the composition 7 so that the cooling water lows through the composition 7 from bottom to top.
In figure 3, a 3-side-view of a heat exchanger 1 according to the invention is shown which comprises a register 10 of 20 capillary tube mats 7 and a heat exchanger casing 11 which surrounds the capillary tube mat register 10 at four sides and leads the cooling air flow 3 running in direction S through the register 10. In the steel sheet casing 11 of the heat exchanger 1 mounting bores are provided into which the individual capillary tube mats 7 can be mounted and/or hung, wherein the casing 11 on the coupling side between server rack 2 and heat exchanger 1 is formed as a flange. Furthermore visible are the inlets 8 and the drains 9 which are formed separately for each capillary tube mat at opposing side walls of the casing 11. The inlets and drain (8, 9) provided separately for each capillary tube mat allow for an arbitrary switching of the capillary tube mats 7, wherein a parallel switching of the capillary tube mats 7 in the register 10 is preferred. By having a certain offset in height of the inlets and drain (8, 9), it is possible to reduce a distance and/or clearance between the capillary tube mats 7 in order to receive a more compact register 10.
In the concrete embodiment of figure 3, capillary tube mats manufactured by Clina having the type Orimat G10 are used, the capillary tubes of which have an outer diameter of 3.4 mm and an inner diameter of 2.3 mm. The capillary tubes are made of polypropylene and thermically welded together with an upper and a lower distribution line, wherein the number of capillary tube mats in a cooling register is variable and can be adapted to the actual heating power of a server rack. The shown capillary tube mats reach a cooling power of about 66 W per mat at a water entry temperature of ca. 18 C. In the example shown here, 20 capillary tube mats 7 are arranged behind one another, the inlets and drains of which are connected in parallel.
Because of this, the heat exchanger shown here reaches a total cooling power of 12 KW.
The cooling powers considerably increase with decreasing water entry temperatures.
Claims (11)
1. A cooling system for encased electronic devices, in particular computer racks, with a heat exchanger (1) and a closed cooling air duct (4) extending at least between the housing (2) of the devices and the heat exchanger (1), which cooling air duct feeds heated cooling air (3) leaving the housing to the heat exchanger (1) before it is released to the environment (5).
2. The cooling system of claim 1, wherein a liquid cooling medium, in particular water flows through the heat exchanger (1).
3. The cooling system of claim 1 or 2, wherein the cooling medium flows through the heat exchanger (1) transversely to the flow direction (S) of the heated cooling air (3).
4. The cooling system of one of claims 1 to 3, wherein the heat exchanger comprises capillary tubes (6) for leading the cooling medium.
5. The cooling system of claim 4, wherein the capillary tubes (6) extend in a vertical or horizontal direction or in a crosswise arrangement of both directions.
6. The cooling system of claim 4 or 5, wherein plural capillary tubes (6) switched in parallel are integrated into a composition (7) with a common inlet (8) and outlet (9).
7. The cooling system of claim 6, wherein the composition (7) is a planar composition which extends in particular transversely to the flow direction (S) of the heated cooling air (3).
8. The cooling system of claim 6 or 7 with plural compositions (7) integrated into a register (10), through at least parts of which parallel and/or serially switched compositions (7) the cooling medium flows.
9. The cooling system of one of claims 1 to 8, wherein the cooling medium duct, in particular the capillary tubes (6) comprise a plastic material, in particular polypropylene, especially are made of it.
10. The cooling system of one of claims 1 to 9, wherein the heat exchanger (1) is surrounded by a casing (11) which is connected with the housing (2) of the devices to be cooled, in particular pivotably connected.
11. The cooling system of claim 10, wherein the the casing (11) essentially has the same cross-section in the flow direction of the heated cooling air (3) as the housing (2) of the devices to be cooled.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10170111.8 | 2010-07-20 | ||
| EP10170111A EP2410829B1 (en) | 2010-07-20 | 2010-07-20 | Cooling system for housed electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2745301A1 true CA2745301A1 (en) | 2012-01-20 |
Family
ID=43333859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2745301A Abandoned CA2745301A1 (en) | 2010-07-20 | 2011-07-05 | Cooling system for encased electronic devices |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120018125A1 (en) |
| EP (1) | EP2410829B1 (en) |
| CA (1) | CA2745301A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117295314A (en) * | 2023-10-13 | 2023-12-26 | 惠州瑞德新材料科技股份有限公司 | Heat dissipation system of server room |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113710068A (en) * | 2021-09-01 | 2021-11-26 | 房盼盼 | Novel capillary cooling net |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE208658T1 (en) * | 1993-07-28 | 2001-11-15 | Pe Corp Ny | APPARATUS AND METHOD FOR NUCLEIC ACID DUPLICATION |
| US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
| US7385810B2 (en) * | 2005-04-18 | 2008-06-10 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
| EP2053911B1 (en) * | 2007-10-22 | 2013-05-15 | Sanyo Electric Co., Ltd. | Electronic device cooling system |
| US8250877B2 (en) * | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
-
2010
- 2010-07-20 EP EP10170111A patent/EP2410829B1/en not_active Not-in-force
-
2011
- 2011-07-05 CA CA2745301A patent/CA2745301A1/en not_active Abandoned
- 2011-07-12 US US13/181,042 patent/US20120018125A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117295314A (en) * | 2023-10-13 | 2023-12-26 | 惠州瑞德新材料科技股份有限公司 | Heat dissipation system of server room |
| CN117295314B (en) * | 2023-10-13 | 2024-04-26 | 惠州瑞德新材料科技股份有限公司 | Heat dissipation system of server room |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2410829A1 (en) | 2012-01-25 |
| US20120018125A1 (en) | 2012-01-26 |
| EP2410829B1 (en) | 2012-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |
Effective date: 20150707 |