CA2719316A1 - Heat dissipating structure of semiconductor lighting lamp - Google Patents
Heat dissipating structure of semiconductor lighting lamp Download PDFInfo
- Publication number
- CA2719316A1 CA2719316A1 CA2719316A CA2719316A CA2719316A1 CA 2719316 A1 CA2719316 A1 CA 2719316A1 CA 2719316 A CA2719316 A CA 2719316A CA 2719316 A CA2719316 A CA 2719316A CA 2719316 A1 CA2719316 A1 CA 2719316A1
- Authority
- CA
- Canada
- Prior art keywords
- heat dissipating
- heat conducting
- type heat
- conducting pipe
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/101—Outdoor lighting of tunnels or the like, e.g. under bridges
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
A heat dissipating structure of a semiconductor lighting lamp is provided which includes a plurality of heat dissipating fins and ~-type heat conducting pipes. The ~-type heat conducting pipes are provided in a number corresponding to the number of the semiconductor light sources arranged on the circuit board of the lamp. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged.
One arm is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp. The plurality of heat dissipating fins are provided with inserting holes corresponding to both opening end terminals of the ~-type heat conducting pipe. Each heat dissipating fin is inserted onto and welded on both opening end terminals of the ~-type heat conducting pipe.
One arm is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp. The plurality of heat dissipating fins are provided with inserting holes corresponding to both opening end terminals of the ~-type heat conducting pipe. Each heat dissipating fin is inserted onto and welded on both opening end terminals of the ~-type heat conducting pipe.
Description
TITLE
[001] HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR LIGHTING
LAMP
FIELD
[001] HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR LIGHTING
LAMP
FIELD
[002] The present utility model relates to a heat dissipating structure of a semiconductor (such as a light emitting diode (LED)) lighting lamp, in particular to a heat dissipating structure of a LED street lamp or a LED tunnel lamp.
BACKGROUND
[0031 A semiconductor lighting lamp generally includes a semiconductor light source, a wiring board and a substrate. The semiconductor light sources are provided on the wiring board in a linear arrangement with the wiring board fixed on the substrate, and the heat generated by the semiconductor light source upon light emitting is gradually conducted and dissipated to the outer environment via radiation through the substrate. However, heat dissipation in such a manner is not very good Presently, a problem that commonly exists with semiconductor lighting lamps is that severe light attenuation occurs due to poor heat dissipation and thus the service life of a lamp is affected. For improving heat dissipation of the semiconductor lighting lamp to lengthen the service life of the semiconductor lighting lamp, a heat dissipating structure is normally added on the substrate. The heat dissipating structure of the semiconductor lighting lamp includes a substrate, a plurality of heat dissipating fins and copper made fl-type heat conducting pipes. The plurality of heat dissipating fins are fixed under the substrate side by side.
Flutes are provided on each of the heat dissipating fins in a longitudinal direction. The substrate is provided with grooves corresponding to the flutes on the heat dissipating fins. The width of the groove and the flute is the same as the pipe diameter of the heat conducting pipe. The distance from the bottom of the groove to the bottom of the flute is consistent with the distance between both arms of the heat conducting pipe. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged. The heat conducting pipe is laterally embedded within the space defined by the groove of the substrate and the flute of each heat dissipating fin, with one arm thereof abutting against the top portion of the groove of the substrate, and the other arm abutting against the bottom and wall of the flute of each heat dissipating fin. The heat conducting pipes, the substrate and the heat dissipating fins are connected in an embedding connection manner by adopting such a heat dissipating structure, thus poor contact easily occurs between the substrate and the heat dissipating fins. In operation, the heat generated by the semiconductor light source on the substrate is unable to be sufficiently transferred to the heat dissipating fins in a timely manner, thus the effect of heat dissipating thereof is still undesirable, thus the service life of the semiconductor light source is shortened.
SUMMARY
[004] There is provided a new-type heat dissipating structure of a semiconductor lighting lamp that transfers heat fast and has a good performance of heat dissipation.
[005] The technical solution of the present utility model provides a new-type heat dissipating structure of a semiconductor lighting lamp that includes a plurality of heat dissipating fins and fl-type heat conducting pipes. The above described fl-type heat conducting pipes are provided in a number which corresponds to the number of the semiconductor light sources arranged on the circuit board of the lamp. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged.
One arm of the above described fl-type heat conducting pipe is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp. The above described plurality of heat dissipating fins are provided with inserting holes that correspond to both opening end terminals of the "fl" shape of the above described fl-type heat conducting pipe. Each heat dissipating fin is inserted onto and welded on both opening end terminals of the "fl" shape of the above described fl-type heat conducting pipe.
[006] Said heat dissipating fin is of a sector or trapezoid shape.
[007] Said heat dissipating fin is provided thereon with hollowed-out portions [008] The hole diameter of said inserting hole is slightly larger than or equal to the pipe diameter of the heat conducting pipe.
BACKGROUND
[0031 A semiconductor lighting lamp generally includes a semiconductor light source, a wiring board and a substrate. The semiconductor light sources are provided on the wiring board in a linear arrangement with the wiring board fixed on the substrate, and the heat generated by the semiconductor light source upon light emitting is gradually conducted and dissipated to the outer environment via radiation through the substrate. However, heat dissipation in such a manner is not very good Presently, a problem that commonly exists with semiconductor lighting lamps is that severe light attenuation occurs due to poor heat dissipation and thus the service life of a lamp is affected. For improving heat dissipation of the semiconductor lighting lamp to lengthen the service life of the semiconductor lighting lamp, a heat dissipating structure is normally added on the substrate. The heat dissipating structure of the semiconductor lighting lamp includes a substrate, a plurality of heat dissipating fins and copper made fl-type heat conducting pipes. The plurality of heat dissipating fins are fixed under the substrate side by side.
Flutes are provided on each of the heat dissipating fins in a longitudinal direction. The substrate is provided with grooves corresponding to the flutes on the heat dissipating fins. The width of the groove and the flute is the same as the pipe diameter of the heat conducting pipe. The distance from the bottom of the groove to the bottom of the flute is consistent with the distance between both arms of the heat conducting pipe. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged. The heat conducting pipe is laterally embedded within the space defined by the groove of the substrate and the flute of each heat dissipating fin, with one arm thereof abutting against the top portion of the groove of the substrate, and the other arm abutting against the bottom and wall of the flute of each heat dissipating fin. The heat conducting pipes, the substrate and the heat dissipating fins are connected in an embedding connection manner by adopting such a heat dissipating structure, thus poor contact easily occurs between the substrate and the heat dissipating fins. In operation, the heat generated by the semiconductor light source on the substrate is unable to be sufficiently transferred to the heat dissipating fins in a timely manner, thus the effect of heat dissipating thereof is still undesirable, thus the service life of the semiconductor light source is shortened.
SUMMARY
[004] There is provided a new-type heat dissipating structure of a semiconductor lighting lamp that transfers heat fast and has a good performance of heat dissipation.
[005] The technical solution of the present utility model provides a new-type heat dissipating structure of a semiconductor lighting lamp that includes a plurality of heat dissipating fins and fl-type heat conducting pipes. The above described fl-type heat conducting pipes are provided in a number which corresponds to the number of the semiconductor light sources arranged on the circuit board of the lamp. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged.
One arm of the above described fl-type heat conducting pipe is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp. The above described plurality of heat dissipating fins are provided with inserting holes that correspond to both opening end terminals of the "fl" shape of the above described fl-type heat conducting pipe. Each heat dissipating fin is inserted onto and welded on both opening end terminals of the "fl" shape of the above described fl-type heat conducting pipe.
[006] Said heat dissipating fin is of a sector or trapezoid shape.
[007] Said heat dissipating fin is provided thereon with hollowed-out portions [008] The hole diameter of said inserting hole is slightly larger than or equal to the pipe diameter of the heat conducting pipe.
3 [009] By adopting the above technical solution, the copper made heat conducting pipe is fixedly connected by welding with the heat dissipating fin in the heat dissipating structure of the semiconductor fighting lamp of the present utility model, the contact of the heat conducting pipe and the heat dissipating fin is well by fixing the heat conducting pipe and the heat dissipating fin through welding as compared with the prior art, thus the heat generated during operation of the semiconductor light source on the circuit board may be sufficiently transferred to the middle upper portion of each heat dissipating fin rapidly, so the function of the heat dissipation through radiation of the heat dissipating fin is attained, and the light attenuation of the semiconductor lighting lamp is reduced so as to lengthen the service life thereof; by adopting a sector-shaped heat dissipating fin the width of which is widened from the top down, the heat dissipating area of the sector-shaped heat dissipating fin is larger than the square-shaped heat dissipating fin in case the areas thereof welded to the circuit board are the same, thus the effect of heat dissipation is improved.
[0010] Further, the hollowed-out portions (through-holes) on the heat dissipating fin are provided to further facilitate the longitudinal convection of air, thus the effect of heat dissipation is improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] These and other features will become more apparent from the following description in which reference is made to the appended drawings, the drawings are for the purpose of illustration only and are not intended to be in any way limiting, wherein:
FIG. 1 is a partial three-dimensional exploded view of the present utility model FIG. 2 is a combined three-dimensional illustration view of the present utility model.
DETAILED DESCRIPTION
[0012] A heat dissipating structure of a semiconductor (such as a light emitting diode LED) lighting lamp generally identified by reference numeral 10, will now be described with reference to FIG.1 through 2.
[0010] Further, the hollowed-out portions (through-holes) on the heat dissipating fin are provided to further facilitate the longitudinal convection of air, thus the effect of heat dissipation is improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] These and other features will become more apparent from the following description in which reference is made to the appended drawings, the drawings are for the purpose of illustration only and are not intended to be in any way limiting, wherein:
FIG. 1 is a partial three-dimensional exploded view of the present utility model FIG. 2 is a combined three-dimensional illustration view of the present utility model.
DETAILED DESCRIPTION
[0012] A heat dissipating structure of a semiconductor (such as a light emitting diode LED) lighting lamp generally identified by reference numeral 10, will now be described with reference to FIG.1 through 2.
4 A new-type heat dissipating structure of a semiconductor lighting lamp (such as a LED street lamp, a LED tunnel lamp and the like) of the present utility model as shown in Fig. I and Fig. 2, comprises a plurality of sector-shaped heat dissipating fins 2 and fl-type heat conducting pipes 3. The circuit board 1 of the lamp is a planar plate-shaped structure, made of materials good at heat conduction (such as aluminium substrate, ceramic substrate, and other metal substrates), fixed thereon with regularly arranged semiconductor light sources 11. The fl-type heat conducting pipes 3 are provided in a number corresponding to the number of the semiconductor light sources 11 arranged on the circuit board 1, and the length of both arms of the heat conducting pipe 3 is larger than or equal to the length with which the plurality of heat dissipating fins 2 are arranged. One arm of the fl-type heat conducting pipe 3 is welded under the circuit board 1, and the other arm protrudes out of the circuit board 1. The plurality of heat dissipating fins 2 are provided with inserting holes 21, 22 corresponding to both opening end terminals of the "fl" shape of the fl-type heat conducting pipe 3. Each heat dissipating fin 2 is inserted onto both opening end terminals of the "fl" shape of the fl-type heat conducting pipe 3 through the inserting holes 21, 22 and is fixed through welding. Thus, the heat conducting pipe 3 is fixed together with the circuit board 1, and the sector-shaped heat dissipating fin 2 through welding, thus they mutually are with a good contact and merges into one piece, so the heat generated during operation of the semiconductor light source 11 on the circuit board I
may be sufficiently transferred to the middle upper portion of each heat dissipating fin 2 rapidly, thus the function of heat dissipation in a timely manner is attained. The hollowed-out portions 23 on the sector-shaped heat dissipating fin 2 are provided to facilitate the circulation of air, thus the effect of heat dissipation is improved.
[0013] In this patent document, the word "comprising" is used in its non-limiting sense to mean that items following the word are included, but items not specifically mentioned are not excluded. A reference to an element by the indefinite article "a" does not exclude the possibility that more than one of the element is present, unless the context clearly requires that there be one and only one of the elements.
[0014] The following claims are to be understood to include what is specifically illustrated and described above, what is conceptually equivalent, and what can be obviously substituted.
Those skilled in the art will appreciate that various adaptations and modifications of the described embodiments can be configured without departing from the scope of the claims. The
may be sufficiently transferred to the middle upper portion of each heat dissipating fin 2 rapidly, thus the function of heat dissipation in a timely manner is attained. The hollowed-out portions 23 on the sector-shaped heat dissipating fin 2 are provided to facilitate the circulation of air, thus the effect of heat dissipation is improved.
[0013] In this patent document, the word "comprising" is used in its non-limiting sense to mean that items following the word are included, but items not specifically mentioned are not excluded. A reference to an element by the indefinite article "a" does not exclude the possibility that more than one of the element is present, unless the context clearly requires that there be one and only one of the elements.
[0014] The following claims are to be understood to include what is specifically illustrated and described above, what is conceptually equivalent, and what can be obviously substituted.
Those skilled in the art will appreciate that various adaptations and modifications of the described embodiments can be configured without departing from the scope of the claims. The
5 illustrated embodiments have been set forth only as examples and should not be taken as limiting the invention. It is to be understood that, within the scope of the following claims, the invention may be practiced other than as specifically illustrated and described.
Claims (4)
1. A new-type heat dissipating structure of a semiconductor lighting lamp, comprising a plurality of heat dissipating fins and ~-type heat conducting pipes, the above described ~-type heat conducting pipes are provided in a number corresponding to the number of the semiconductor light sources arranged on the circuit board of the lamp, and the length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged, characterized in that, one arm of the above described ~-type heat conducting pipe is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp, the above described plurality of heat dissipating fins are provided with inserting holes corresponding to both opening end terminals of the "~" shape of the above described ~-type heat conducting pipe, and each heat dissipating fin is inserted onto and welded on both opening end terminals of the "~" shape of the above described ~-type heat conducting pipe.
2. The new-type heat dissipating structure of the semiconductor lighting lamp according to claim 1, characterized in that, said heat dissipating fin is of a sector or trapezoid shape.
3. The new-type heat dissipating structure of the semiconductor lighting lamp according to claim 1, characterized in that, said heat dissipating fin is provided thereon with hollowed-out portions.
4. The new-type heat dissipating structure of the semiconductor lighting lamp according to claim 1, characterized in that, the hole diameter of said inserting hole is slightly larger than or equal to the pipe diameter of the heat conducting pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2719316A CA2719316A1 (en) | 2010-10-29 | 2010-10-29 | Heat dissipating structure of semiconductor lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2719316A CA2719316A1 (en) | 2010-10-29 | 2010-10-29 | Heat dissipating structure of semiconductor lighting lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2719316A1 true CA2719316A1 (en) | 2012-04-29 |
Family
ID=46020946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2719316A Abandoned CA2719316A1 (en) | 2010-10-29 | 2010-10-29 | Heat dissipating structure of semiconductor lighting lamp |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2719316A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105900293A (en) * | 2013-11-11 | 2016-08-24 | 安费诺有限公司 | Heat dissipating electrical connector |
-
2010
- 2010-10-29 CA CA2719316A patent/CA2719316A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105900293A (en) * | 2013-11-11 | 2016-08-24 | 安费诺有限公司 | Heat dissipating electrical connector |
| CN105900293B (en) * | 2013-11-11 | 2019-02-12 | 安费诺有限公司 | Radiate electric connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20141029 |