CA2645658A1 - Recyclable blister pack and process of making - Google Patents

Abstract

A recyclable blister pack system is provided, including a substrate having a dry tack cohesive adhesive layer deposited on one of its surfaces and a blister layer for receiving a product. The properties of the dry tack cohesive are selected so the blister layer is separable from the substrate without leaving substantial substrate residue on the blister layer. This improves the recyclability of the blister layer.

Description

Recyclable Blister Pack And Process of Making Field of the Invention.

The present invention relates to an easily recyclable blister pack system and to the process of making.

Description of the Related Art.

Consumer packaging has evolved from simple cartons that protected the product, but which required opening the carton to view the contents, to blister/card packages that encapsulate the product while still allowing viewing the product, to thermoformed clamshell containers that allow tamper-proof viewing of the finished product. Each step in the evolution of the packaging has increased the cost of the package, the amount of hydrocarbons required for manufacture, and reduced the opportunity for recycling the packaging materials following removal of the product.

In the case of card/blister packages, the product is inserted into a thermoplastic blister that is then heat-sealed (at elevated temperature and pressure) to a printed chipboard card that has been coated with a heat-sensitive adhesive. When the product is removed from the package, the adhesive and fibers bond to the blister, and prevent efficient re-cycling of the blister material. In addition, the card/blister packages are subject to size and 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) weight limitations because the assembled package must fit into heat-sealing machines.

In the case of clamshell packages, the product is inserted into a transparent thermoplastic shell that fully encloses it. The shell consists of two halves joined by a hinge made of the material found in the shell. The clamshell is folded in half to form an enclosure that completely encloses the packaged product. The two halves of the assembled clamshell can be held together by a friction-fit between the assembled halves, or by means of a mechanical fastener such as a staple. For heavy or high value products, the shell may be heat or radio frequency (RF) sealed for tamper resistance, but the heat-sealing operation frequently causes customer dissatisfaction due to the extreme difficulty in opening the pack to use the product. In addition, the clamshell package uses two to three times the hydrocarbons required for a card/blister package. The clamshell materials are not easily separable for recycling.

Consumers are increasingly concerned with the excessive amounts of plastic, cardboard and paper associated with the packaging of consumer products, as are various environmental conservation groups. Some major consumer product retailers have also expressed dissatisfaction with currently 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) available consumer product packaging options, especially those with a high impact to the environment.

One such national retailer has developed a "sustainability scorecard" that measures the environmental impact of the packaging used for consumer products. The sustainability scorecard is used to reward suppliers that have developed or utilized sustainable packaging products and technology.
Suppliers that do not utilize sustainable packaging will be at a competitive disadvantage.

By way of example, the sustainability scorecard includes the following factors that are considered: greenhouse gasses (e.g., carbon dioxide (CO2) created per ton of packaging production, material value, product-to-package ratio, cube utilization, cost of transportation, total recycled content, recovery value, renewable energy use in production, and innovativeness.

Accordingly, there is a recognized need for new packaging products and packaging manufacturing techniques that minimize impact to the environment throughout the entire life cycle of the product from manufacture through sale, use, and ultimate disposal.

It is an object of the invention to provide a packaging system that meets the sustainability scorecard targets and offers significantly improved recyclability.

2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) Summary of the Invention The present invention provides an easily and efficiently recyclable packaging system for consumer products capable of incorporating full color graphics, tamper and theft resistance, use of recycled materials (RPET blister and post-consumer corrugate), and a dry tack cohesive adhesive. The packaging consists of three components: a die-cut substrate (a corrugate body in the preferred embodiment), a thermoformed RPET blister layer, and a dry tack cohesive adhesive.

In its simplest form, the invention comprises a substrate having first and second regions, a dry tack cohesive layer applied to the first and second regions, and a blister layer for accepting a product and having a surface along its periphery capable in use of capture between the dry tack cohesive layers The adhesive properties of the cohesive layer are selected such that it is capable of forming a seal only with itself and the substrate, and so it is separable from the blister layer without leaving substrate residue to facilitate recyclability.

In the preferred embodiment, the invention comprises a blister pack system including a substrate having first and second regions with at least one of the 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) regions having an opening formed therein for receiving a product, a dry tack cohesive layer applied to the first and second regions, and a blister layer shaped to accept a product and having a surface along its periphery capable in use of capture between the dry tack adhesive layer on the first and second regions. The adhesive properties of the cohesive layer are selected such that it is capable of forming a seal only with itself and the substrate, and so that it is separable from the blister layer without leaving substrate residue to facilitate recyclability.

The process for assembling the blister pack system includes the steps of forming a dry tack cohesive layer above a substrate having first and second regions, with one of the regions having an opening formed therein, the substrate is folded along a line dividing the first and second regions and the blister layer positioned between the first and second regions of the substrate so the shaped portion of the blister layer accepts a product and passes through the opening formed in the substrate, and so that its peripheral surface is between the first and second regions having the dry tack cohesive layer formed thereon. The system is sealed by applying pressure to the substrate along the peripheral surface of the first and second regions. The cohesive adhesive adheres to itself thereby holding the blister layer securely in place. The adhesive properties of the cohesive layer are selected such that it is capable of forming a seal only with itself and the substrate, and so it 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) is separable from the blister layer without leaving substrate residue to facilitate recyclability.

Brief Description of the Drawings Fig. 1 is a top view of the die-cut substrate or corrugate body.
Fig. 2 depicts the thermoformed RPET blister layer.

Fig. 3 is a schematic representation of the bottom single roll coating process.
Fig. 4 shows an assembled blister pack system with the product s installed in the blister layer, and the blister layer installed in the corrugate body.
Detailed Description of the Invention Fig. 1 shows a planar substrate 10, which in the preferred embodiment is corrugate body having a generally rectangular shape, but which can also be a chipboard material. Although not shown in Fig. 1, substrate 10 may be pre-printed with a color graphic label describing the product (also not shown).
The substrate is generally divided into two halves or regions 12 and 14 separated by a centerline 16 which, to facilitate folding of the substrate, may be formed by scoring or perforation. A pair of die-cut openings 18 and 20 are formed, respectively, in regions 12 and 14 of the substrate. While two openings 18 and 20 are shown in Fig. 1, not all packaging applications require both openings. The die-cut openings generally approximate the 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) outline of the product being packaged. Substrate 10 is sized to allow approximately a one inch sealing area 22 along the perimeter of the substrate and surrounding the die cut openings, as suggested by dotted line 24. The width and shape of sealing area 22 can be varied to suit the size and weight of the product to be packaged. Larger, heavier products typically require a wider sealing area to ensure integrity of the package.

The thermoformed blister layer 30, shown in Fig. 2, is produced preferably from recycled polyethylene terephthalate (RPET) resin with a nominal thickness of 10-15 mils (.010 - 0.015 in.). The blister layer is produced in a well known manner by placing RPET film into a forming die (not shown) under heat and pressure. In the preferred embodiment, the die closely approximates the shape of the product or products to be packaged and forms regions or volumes 32 for receiving the product. The blister layer design incorporates a flange 34 disposed generally between perimeter 36 of the blister layer and edges 38 of regions 32. In the preferred embodiment, flange 34 is approximately 0.38 in. wide. The flange serves to contain the blister layer and product(s) within the substrate lamination formed when the corrugate body is folded along line 16 (Fig.1) and sealed as described hereinafter. In those instances when it is desirable that the packaged product be viewable from both sides, a second blister layer (a mirror image of the 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) first) needs to be formed. One blister layer is installed into substrate openings 18 and 20 (Fig. 1).

The unique properties of the dry tack adhesive are a critical element of the package. The adhesive is a formulated latex rubber product that is applied in aqueous (water-based) liquid form, but which dries as a dry tack adhesive (also referred to as a cohesive) which adheres to itself and the substrate, but not to most other surfaces such as the blister layer. This selective adherence property enables the blister layer to be removed or separated for recycling without adhesive residue or fibrous residue material from the substrate, especially a corrugate substrate, remaining on it. This facilitates efficient recycling of the RPET material. The adhesive properties are carefully controlled to create an environmentally acceptable adhesive with unique cohesive properties that also enable handling and transportation of the coated, unsealed substrates without blocking (i.e., the sticking of substrates to one another).

In the preferred embodiment, the physical properties of the adhesive are:
aqueous solution; solids 66% by weight viscosity (dry aged) of approximately 4000 CPS (Centipoise) in 3 months; rheology -- highly pseudo-plastic and thixotropic, with a ratio of viscosity at one RPM (revolution per minute) to viscosity at 50 RPM of approximately 14: 1; pH -- alkaline approximately 10.5 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) ammonical; viscosity (liquid form) -- 1330 CPS. The viscosity is controlled at application by thinning with water.

The adhesive is applied to the substrate using a conventional roll coating machine. In the preferred embodiment, the single bottom roller coating process is utilized. Fig. 3 shows a typical arrangement. Substrate 10 is positioned for linear movement between rollers 38 and 40. Adhesive is dispensed onto unprinted substrate surface 42 and is spread uniformly by roller 38, as the substrate advances in the direction indicated by arrow 48.
The single bottom roll coating process is used to ensure a uniform coating on the unprinted side 42 of the substrate. Care must be taken to prevent transfer of the cohesive to the printed (finished) side 46 of the substrate.
Once the substrate has been coated, it is air-dried or heat-dried to produce a tack-free surface. Finished adhesive-coated substrates should be stored in a dry, temperature controlled area maintained at between 40-100 degrees Fahrenheit, and protected from dust and light, especially ultraviolet (UV) light.
Actual packaging of products using the blister pack system is relatively straight forward and typically occurs at a location different from where the substrate coating and blister layer operations occurred. Referring now to Figs. 1-4, the products 50 to be packaged and blister layers 30 (assuming the products are to be viewed from both sides) are placed into die-cut 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) openings 18 and 20 of the substrate, and the substrate folded along line 16.
Substrate body 10 is folded so that the cohesive-coated surfaces 42 on each substrate region 12 and 14 are brought together in sealing area 52 (Fig. 4) lying generally outside blister layer perimeter 36 and the outside edges of the substrate 10 and hold flange 34 there-between. Once the substrate has been folded to contain the blister layers and products, area 52 must be pressure-sealed to ensure a complete bond between the two substrate surfaces along area 52 to firmly hold flange 34 of the blister layer in place. Adequate pressure is required to develop the bond. This pressure can be produced by the use of a manual or mechanical weighted roller, or other mechanical means (including commercially available card/blister sealing machines), as long as the resulting pressure is sufficient to bond the cohesive, thereby producing a finished laminated package which contains the products and blisters between the substrate, as shown in Fig. 4.

It will be appreciated that utilization of perimeter sealing of the substrate, as disclosed, results in a tamper-resistant package and enables packaging of heavy products.

The invention has been disclosed with reference to its preferred embodiment.
It will be recognized, however, that variations are possible. For example, different types of substrate materials such as corrugate or chipboard may be 2008-12-02 BLISTER PACK PATENT APPLICATION - CANADA (2) used. Similarly, substrates of different thicknesses may be used based upon the size and weight of the product to be packaged. Different printing techniques may also be used to create the graphics on the substrate.
Different adhesive formulations may be used instead of the specific cohesive formulation disclosed herein, but the selective adherence properties and ability to handle and ship coated substrates prior to assembly is a critical element of the package.

The foregoing description of one of the embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above description, without fundamentally deviating from the essence of the present invention. It is intended that the scope of the invention not be limited by this description.

2008-12.02 BLISTER PACK PATENT APPLICATION - CANADA

Claims (16)

1. An article comprising:

a substrate having first and second regions, a dry tack cohesive layer applied to first and second regions of the substrate, and a blister layer for accepting a product, the blister layer having a surface along its periphery capable of capture between the dry tack cohesive layer.

2. The article of claim 1 wherein the properties of the cohesive layer are selected so it is separable from the blister layer without leaving substrate residue on the blister layer.

3. The article of claim 1 wherein the properties of the cohesive are selected so that it is capable of forming a seal only with itself and the substrate.

4. The article of claim 3 wherein the substrate comprises a corrugate body.

5. The article of claim 3 wherein the substrate comprises a chipboard body.

6. The article of claim 3 wherein the blister layer is formed to accept a product and at least one of the regions having at least one opening formed therein for receiving the formed blister layer.

7. The article of claim 6 wherein the substrate body is capable of being folded along a line separating the first and second regions, and wherein the blister layer is positioned in the fold between the first and second regions such that the formed region thereof is accepted through the opening in the one substrate region.

8. The article of claim 3 wherein each of first and second regions has an opening formed therein and further including an additional blister layer formed for accepting the product.

9. A blister pack system comprising:

a substrate having first and second regions, at least one of the regions having at least one opening formed therein, a dry tack cohesive layer applied to the first and second regions, a blister layer formed to accept a product and having a surface along its periphery capable of capture between the first and second regions.

10. The article of claim 9 wherein, the properties of the cohesive are selected so that it is capable of forming a seal only with itself and the substrate.

11. The article of claim 10 wherein the substrate body is capable of being folded along a line separating the first and second regions, and wherein the blister layer is capable of being positioned in the fold between the first and second regions such that the formed region thereof is accepted through the at least one opening in the one substrate region.

12. The article of claim 10 wherein the substrate body is capable of being folded along a line separating the first and second regions and wherein each of first and second regions has at least one opening formed therein, and further including a second blister layer formed for accepting the product.

13. The article of claim 10 wherein the substrate comprises a corrugate body.

14. The article of claim 10 wherein the substrate comprises a chipboard body.

15. A process comprising:

forming a dry tack cohesive layer on the first and second regions of a substrate, at least one of the regions having at least one opening formed therein, folding the substrate along a line dividing the first and second regions, positioning a blister layer between the first and second regions of the substrate, the blister layer formed to accept a product and positioned such that the formed portion thereof passes through the at least one opening formed in the one region of the substrate, and such that a peripheral surface of the blister layer is positioned between the first and second regions having the dry tack cohesive layer formed thereon, applying pressure to capture the blister layer between the first and second regions, and wherein the properties of the dry tack cohesive layer are selected so that it is capable of forming a seal only with itself and the substrate.

16. An article formed in accordance with the process of claim 15.