CA2606964A1 - Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes - Google Patents

Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes Download PDF

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Publication number
CA2606964A1
CA2606964A1 CA 2606964 CA2606964A CA2606964A1 CA 2606964 A1 CA2606964 A1 CA 2606964A1 CA 2606964 CA2606964 CA 2606964 CA 2606964 A CA2606964 A CA 2606964A CA 2606964 A1 CA2606964 A1 CA 2606964A1
Authority
CA
Canada
Prior art keywords
semiconductor component
capacitor plate
dielectric film
semiconductor
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA 2606964
Other languages
English (en)
Other versions
CA2606964C (fr
Inventor
J. Devin Mackenzie
Vikram Pavate
James Montague Cleeves
Joerg Rockenberger
Fabio Zurcher
Christopher Gudeman
Max Davis
Dan Good
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ensurge Micropower ASA
Original Assignee
Kovio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kovio Inc filed Critical Kovio Inc
Priority to CA2606964A priority Critical patent/CA2606964C/fr
Publication of CA2606964A1 publication Critical patent/CA2606964A1/fr
Application granted granted Critical
Publication of CA2606964C publication Critical patent/CA2606964C/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
CA2606964A 2007-10-18 2007-10-18 Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes Expired - Fee Related CA2606964C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA2606964A CA2606964C (fr) 2007-10-18 2007-10-18 Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA2606964A CA2606964C (fr) 2007-10-18 2007-10-18 Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes

Publications (2)

Publication Number Publication Date
CA2606964A1 true CA2606964A1 (fr) 2009-04-18
CA2606964C CA2606964C (fr) 2013-08-13

Family

ID=40560103

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2606964A Expired - Fee Related CA2606964C (fr) 2007-10-18 2007-10-18 Surveillance d'articles electroniques mos, etiquette/dispositif rf et/ou d'identification rf, et procedes de fabrication et methodes d'utilisation connexes

Country Status (1)

Country Link
CA (1) CA2606964C (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112523610A (zh) * 2019-09-18 2021-03-19 南京日杰通信科技有限公司 Rf8.2m电子开锁器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112523610A (zh) * 2019-09-18 2021-03-19 南京日杰通信科技有限公司 Rf8.2m电子开锁器

Also Published As

Publication number Publication date
CA2606964C (fr) 2013-08-13

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20211018