CA2461588C - Anti-microbial sanitary ware and method for making the same - Google Patents
Anti-microbial sanitary ware and method for making the same Download PDFInfo
- Publication number
- CA2461588C CA2461588C CA 2461588 CA2461588A CA2461588C CA 2461588 C CA2461588 C CA 2461588C CA 2461588 CA2461588 CA 2461588 CA 2461588 A CA2461588 A CA 2461588A CA 2461588 C CA2461588 C CA 2461588C
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- CA
- Canada
- Prior art keywords
- metal
- sputtering
- substrate
- microbial
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L15/00—Chemical aspects of, or use of materials for, bandages, dressings or absorbent pads
- A61L15/16—Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons
- A61L15/18—Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons containing inorganic materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L15/00—Chemical aspects of, or use of materials for, bandages, dressings or absorbent pads
- A61L15/16—Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons
- A61L15/42—Use of materials characterised by their function or physical properties
- A61L15/46—Deodorants or malodour counteractants, e.g. to inhibit the formation of ammonia or bacteria
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2300/00—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices
- A61L2300/10—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices containing or releasing inorganic materials
- A61L2300/102—Metals or metal compounds, e.g. salts such as bicarbonates, carbonates, oxides, zeolites, silicates
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2300/00—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices
- A61L2300/10—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices containing or releasing inorganic materials
- A61L2300/102—Metals or metal compounds, e.g. salts such as bicarbonates, carbonates, oxides, zeolites, silicates
- A61L2300/104—Silver, e.g. silver sulfadiazine
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L2300/00—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices
- A61L2300/40—Biologically active materials used in bandages, wound dressings, absorbent pads or medical devices characterised by a specific therapeutic activity or mode of action
- A61L2300/404—Biocides, antimicrobial agents, antiseptic agents
Abstract
An anti-microbial sanitary rare includes a substrate, and an anti-microbial film formed on the substrate and including a protective layer and anti-microbial metal particles that are dispersed in the protective layer. The protective layer is made from a compound selected from the group consisting of metal nitrides and metal carbides. The anti-microbial metal particles are made from a metal selected from the group consisting of silver, zinc, and copper.
Description
ANTI-MICROBIAL SANITARY WAF:E AND
METHOD FOR l~~IAhfiG THE SAME
BACKGROUND OF THE INVENTIOI\T
1. Field of the invention This invention relates to an anti-microbial sanitary ware and a method for making the same, more particularly to an anti-microbial sanitary ware with a metal particle-containing anti-microbial f.il.m and a method for making the same.
METHOD FOR l~~IAhfiG THE SAME
BACKGROUND OF THE INVENTIOI\T
1. Field of the invention This invention relates to an anti-microbial sanitary ware and a method for making the same, more particularly to an anti-microbial sanitary ware with a metal particle-containing anti-microbial f.il.m and a method for making the same.
2. Description of the related art Conventional sanitary wares, such as towel bars, robe hangers, faucets, shower heads, shelves, soap holders, paper holders, tumbler holders, door knobs etc., are normally coated with a protective film made from metal nitride or metal carbide so as to provide a smooth surface and resistance to corrosion and wearing for the sanitary wares. The protective film is formed on a substrate of the sanitary ware by sputtering techniques, such as unbalanced magnetron sputtering.
Since sanitary wares are constantly exposed to moisture-rich atmosphere, it is desirable to prevent or mitigate the growth of bacteria or fouling on the sanitary wares while maintaining the resistance to corrosion and wearing.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide an anti-microbial sanitary ware with an anti-microbial film that is capable of mitigating the growth of bacteria while maintaining the resistance to corrosion and wearing.
According to one aspect of the present invention, there is provided an anti-microbial sanitary ware that comprises: a substrate;
and an anti-microbial fit~n formed on the substrate and comprising a protective layer and anti-microbial metal particles that are dispersed in the protective layea-. The protective layer is made from a compound selected from the group consisting of metal nitrides and metal carbides. The anti-microbial metal particles are made from a metal selected from the group consisting of silver, zinc, and copper.
According to ano~:her aspect of the present invention, there; is provided a method for making an anti-microbial article. The method comprises the steps of: placing a substrate in a sputtering chamber in a sputter; and simultaneously sputtering a first metal target of a first metal and a second metal target of a second metal through closed-field unbalanced magnetron sputtering techniques, which form a continuously closed magnetic field around the substrate, so as to react the first metal into a metal compound which is subsequently deposited on the substrate to form a protective layer, and so as to generate metal particles of the second metal that are dispersed in the protective layer. The :second metal is selected from the group consisting of silver, zinc, and copper. The metal compound is selected from the group consisting of metal nitrides and metal carbides.
BRIEF DESCRIPTION OF THE DRAWINGS
In drawings which illustrate an embodiment of the invention, Fig. 1 is a block diagram illustrating consecutive steps of the preferred embodiment of a method for making an anti-microbial sanitary ware according to the present invention; and Fig. 2 is a cutaway view of the preferred embodiment of the z anti-microbial sanitary ware formed according to the method of this invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Fig. 2 illustrates the preferred embodiment of an S anti-microbial sanitary ware, such as the aforesaid sanitary wares, according to the present invention. The anti-microbial sanitary ware includes: a substrate 2; and an anti-microbial film formed oil the substrate 2 and comprising a protective layer 3 and anti-microbial metal particles 4 that are dispersed in the protective layer 3. The protective Iayer 3 is made from a metal compound selected from the group consisting of metal nitrides and metal carbides.
Referring to Fig. 1, in combination with Fig. 2, the method of forming the anti-microbial sanitary ware involves the use of closed-field unbalanced magnetron sputtering (CFUBMS) techniques, and includes the steps of: placing the substrate 3 in a sputter (not shown); and simultaneously sputtering a first metal target of a first metal and a second metal target of a second nnetal so as to react the first metal into the metal compound which is subsequently deposited on the substrate 2 to form the protective layer 3, and so as to generate the anti-microbial metal particles 4 of the second metal that are dispersed in the protective layer 3. The metal particles 4 thus formed have a particle size less than 104 nanometers.
Preferably, the second metal, which forms the anti-microbial metal particles 4, is selected from the group consisting of silver, zinc, and copper.
Preferably, the first metal is selected from the group consisting of zirconium, chromium, and titanium.
Since sanitary wares are constantly exposed to moisture-rich atmosphere, it is desirable to prevent or mitigate the growth of bacteria or fouling on the sanitary wares while maintaining the resistance to corrosion and wearing.
SUMMARY OF THE INVENTION
Therefore, the object of the present invention is to provide an anti-microbial sanitary ware with an anti-microbial film that is capable of mitigating the growth of bacteria while maintaining the resistance to corrosion and wearing.
According to one aspect of the present invention, there is provided an anti-microbial sanitary ware that comprises: a substrate;
and an anti-microbial fit~n formed on the substrate and comprising a protective layer and anti-microbial metal particles that are dispersed in the protective layea-. The protective layer is made from a compound selected from the group consisting of metal nitrides and metal carbides. The anti-microbial metal particles are made from a metal selected from the group consisting of silver, zinc, and copper.
According to ano~:her aspect of the present invention, there; is provided a method for making an anti-microbial article. The method comprises the steps of: placing a substrate in a sputtering chamber in a sputter; and simultaneously sputtering a first metal target of a first metal and a second metal target of a second metal through closed-field unbalanced magnetron sputtering techniques, which form a continuously closed magnetic field around the substrate, so as to react the first metal into a metal compound which is subsequently deposited on the substrate to form a protective layer, and so as to generate metal particles of the second metal that are dispersed in the protective layer. The :second metal is selected from the group consisting of silver, zinc, and copper. The metal compound is selected from the group consisting of metal nitrides and metal carbides.
BRIEF DESCRIPTION OF THE DRAWINGS
In drawings which illustrate an embodiment of the invention, Fig. 1 is a block diagram illustrating consecutive steps of the preferred embodiment of a method for making an anti-microbial sanitary ware according to the present invention; and Fig. 2 is a cutaway view of the preferred embodiment of the z anti-microbial sanitary ware formed according to the method of this invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Fig. 2 illustrates the preferred embodiment of an S anti-microbial sanitary ware, such as the aforesaid sanitary wares, according to the present invention. The anti-microbial sanitary ware includes: a substrate 2; and an anti-microbial film formed oil the substrate 2 and comprising a protective layer 3 and anti-microbial metal particles 4 that are dispersed in the protective layer 3. The protective Iayer 3 is made from a metal compound selected from the group consisting of metal nitrides and metal carbides.
Referring to Fig. 1, in combination with Fig. 2, the method of forming the anti-microbial sanitary ware involves the use of closed-field unbalanced magnetron sputtering (CFUBMS) techniques, and includes the steps of: placing the substrate 3 in a sputter (not shown); and simultaneously sputtering a first metal target of a first metal and a second metal target of a second nnetal so as to react the first metal into the metal compound which is subsequently deposited on the substrate 2 to form the protective layer 3, and so as to generate the anti-microbial metal particles 4 of the second metal that are dispersed in the protective layer 3. The metal particles 4 thus formed have a particle size less than 104 nanometers.
Preferably, the second metal, which forms the anti-microbial metal particles 4, is selected from the group consisting of silver, zinc, and copper.
Preferably, the first metal is selected from the group consisting of zirconium, chromium, and titanium.
Preferably, the metal compound is metal nitride, and is selected from the group COIISIStIng of zirconium nitride, chromium nitride, and titanium nitride.
Preferably, the substrate is made fro~ri a material selected from the group consisting of copper alloy, zinc: alloy, stainless steel, ceramics, and plastics.
The first metal sputtered from the first metal target reacts with a reactive gas, such as nitrogen, methane, or acetylene, in a sputtering chamber of the sputter (not shown) ao as to form the metal compound.
Preferably, the sputtering of the first metal target is conducted at a voltage ranging from 20-SOV, and a current ranging from 3.5-4.SA, whereas the sputtering of the second metal target is conducted at a voltage less than 20V, and a. current ranging from 0.3-O.SA. Preferably, a negative biased voltage of greater than -80V
is applied to the substrate 2.
Preferably, the sputtering is conducted at a temperature ranging from 80-I80°C , and a pressure ranging; from 0.1-20 mTorr for 3-13 minutes.
The present invention will be described in more detail in the following Example.
Example I
A substrate was subj ected to milling and polishing, followed by cleaning and drying. The cleaned substrate was then prepared for deposition of the anti-microbial film using CFUBMS techniques, and was placed in a sputtering chamber which was filled with nitrogen and argon gas and which was provided ~avith silver target and zirconium target. During the sputtering operation, a negative biased voltage of -S.OV was applied to the substrate, a positive biased voltage of less than 20~' (with 0.4A current) was applied to the silver target, and a positive biased voltage of 30V (vrith 4.0A current) was S applied to the zirconium target. The sputtering operation was conducted at a temperature of 1&0°C and a pressure of 1.1 mTorr for 13 minutes so as to form an anti-microbial film (Ag-ZrN) on the substrate.
The thus formed anti-microbial sanitary ware was then IO subjected to anti-microbial activity tests in accordance with JI S Z
2801:2000 (Japanese Industry Standard).
The results show that the anti-microbial activity of the thus formed anti-microbial sanitary ware for escherichia coli is above 99.999 % , and is above 99.9 % for staphylococcus aureus and 1S pseudomonas aeruginosa.
Since escape of the generated plasma in the sputtering chamber is effectively prevented by using CFUBMS techniques, which form a continuously closed magnetic field around the substrate, and since the generated plasma is confined in the continuously closed 20 magnetic field, collision and ionization of molecules in the chamber are considerably increased, which result in an increase in the deposition of the material to be deposited on the substrate, which, in turn, results in an increase in the compactness and bulk density of the anti-microbial film deposited on the substrate. As ,a consequence, 2S the resistance to corrosion and wearing of the anti-microbial sanitary ware of this invention is considerably enhanced.
The anti-microbial functions provided by the anti-microbial S
sanitary ware of this invention include one that interferes with the synthesis of the cell vjall of bacteria, one that damages the cell membrane of bacteria, and one that interferes with the synthesis of nucleic acid. As a result of ionization, the metal particles 4 in the protective Layer 3 of the anti-microbial sanitary ware of this invention tend to carry positive charges, which results in attraction of the bacteria, which, in torn, results in damage to the cell membrane and the enzyme system of the bacteria and the eventual destruction of the bacteria.
With the invention thus explained, it is apparent that various modifications and variations can be made without departing from the spirit of the present invention.
Preferably, the substrate is made fro~ri a material selected from the group consisting of copper alloy, zinc: alloy, stainless steel, ceramics, and plastics.
The first metal sputtered from the first metal target reacts with a reactive gas, such as nitrogen, methane, or acetylene, in a sputtering chamber of the sputter (not shown) ao as to form the metal compound.
Preferably, the sputtering of the first metal target is conducted at a voltage ranging from 20-SOV, and a current ranging from 3.5-4.SA, whereas the sputtering of the second metal target is conducted at a voltage less than 20V, and a. current ranging from 0.3-O.SA. Preferably, a negative biased voltage of greater than -80V
is applied to the substrate 2.
Preferably, the sputtering is conducted at a temperature ranging from 80-I80°C , and a pressure ranging; from 0.1-20 mTorr for 3-13 minutes.
The present invention will be described in more detail in the following Example.
Example I
A substrate was subj ected to milling and polishing, followed by cleaning and drying. The cleaned substrate was then prepared for deposition of the anti-microbial film using CFUBMS techniques, and was placed in a sputtering chamber which was filled with nitrogen and argon gas and which was provided ~avith silver target and zirconium target. During the sputtering operation, a negative biased voltage of -S.OV was applied to the substrate, a positive biased voltage of less than 20~' (with 0.4A current) was applied to the silver target, and a positive biased voltage of 30V (vrith 4.0A current) was S applied to the zirconium target. The sputtering operation was conducted at a temperature of 1&0°C and a pressure of 1.1 mTorr for 13 minutes so as to form an anti-microbial film (Ag-ZrN) on the substrate.
The thus formed anti-microbial sanitary ware was then IO subjected to anti-microbial activity tests in accordance with JI S Z
2801:2000 (Japanese Industry Standard).
The results show that the anti-microbial activity of the thus formed anti-microbial sanitary ware for escherichia coli is above 99.999 % , and is above 99.9 % for staphylococcus aureus and 1S pseudomonas aeruginosa.
Since escape of the generated plasma in the sputtering chamber is effectively prevented by using CFUBMS techniques, which form a continuously closed magnetic field around the substrate, and since the generated plasma is confined in the continuously closed 20 magnetic field, collision and ionization of molecules in the chamber are considerably increased, which result in an increase in the deposition of the material to be deposited on the substrate, which, in turn, results in an increase in the compactness and bulk density of the anti-microbial film deposited on the substrate. As ,a consequence, 2S the resistance to corrosion and wearing of the anti-microbial sanitary ware of this invention is considerably enhanced.
The anti-microbial functions provided by the anti-microbial S
sanitary ware of this invention include one that interferes with the synthesis of the cell vjall of bacteria, one that damages the cell membrane of bacteria, and one that interferes with the synthesis of nucleic acid. As a result of ionization, the metal particles 4 in the protective Layer 3 of the anti-microbial sanitary ware of this invention tend to carry positive charges, which results in attraction of the bacteria, which, in torn, results in damage to the cell membrane and the enzyme system of the bacteria and the eventual destruction of the bacteria.
With the invention thus explained, it is apparent that various modifications and variations can be made without departing from the spirit of the present invention.
Claims (8)
1. A method for making an anti-microbial sanitary ware, comprising the steps of:
placing a substrate in a sputtering chamber in a sputterer;
simultaneously sputtering a metal target of a first metal and a metal target of a second metal through closed-field unbalanced magnetron sputtering techniques, which form a continuously closed magnetic field around the substrate, so as to react the first metal with a reactive gas into a metal compound which is subsequently deposited on the substrate to form a protective layer, and so as to generate metal particles of the second metal that are dispersed in the protective layer, wherein the first metal is selected from the group consisting of zirconium, chromium, and titanium;
wherein the second metal is selected from the group consisting of silver, zinc, and copper;
wherein the metal compound is selected from the group consisting of metal nitrides and metal carbides;
wherein the substrate is made from a material selected from the group consisting of copper alloy, zinc alloy, stainless steel, ceramics, and plastics; and wherein the sputtering of the first metal is conducted at a voltage ranging from 20-50V, and a current ranging from 3.5-4.5A;
wherein the sputtering of the second metal is conducted at a voltage of less than 20V, and a current ranging from 0.3-0.5A; and wherein a negative biased voltage of greater than -80V is applied to the substrate during the sputtering.
placing a substrate in a sputtering chamber in a sputterer;
simultaneously sputtering a metal target of a first metal and a metal target of a second metal through closed-field unbalanced magnetron sputtering techniques, which form a continuously closed magnetic field around the substrate, so as to react the first metal with a reactive gas into a metal compound which is subsequently deposited on the substrate to form a protective layer, and so as to generate metal particles of the second metal that are dispersed in the protective layer, wherein the first metal is selected from the group consisting of zirconium, chromium, and titanium;
wherein the second metal is selected from the group consisting of silver, zinc, and copper;
wherein the metal compound is selected from the group consisting of metal nitrides and metal carbides;
wherein the substrate is made from a material selected from the group consisting of copper alloy, zinc alloy, stainless steel, ceramics, and plastics; and wherein the sputtering of the first metal is conducted at a voltage ranging from 20-50V, and a current ranging from 3.5-4.5A;
wherein the sputtering of the second metal is conducted at a voltage of less than 20V, and a current ranging from 0.3-0.5A; and wherein a negative biased voltage of greater than -80V is applied to the substrate during the sputtering.
2. The method of Claim 1, wherein the metal compound is selected from the group consisting of zirconium nitride, chromium nitride, and titanium nitride.
3. The method of Claim 2, wherein the metal compound is zirconium nitride.
4. The method of Claim 1, wherein the sputtering is conducted at a temperature ranging from 80-180°C.
5. The method of claim 1, wherein the sputtering is conducted at a pressure ranging from 0.1-20 mTorr.
6. The method of claim 1, wherein the sputtering time ranges from 3-13 minutes.
7. The method of claim 1, wherein the substrate is made from copper alloy.
8. A sanitary ware rendered anti-microbial according to the method of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2461588 CA2461588C (en) | 2004-03-22 | 2004-03-22 | Anti-microbial sanitary ware and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2461588 CA2461588C (en) | 2004-03-22 | 2004-03-22 | Anti-microbial sanitary ware and method for making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2461588A1 CA2461588A1 (en) | 2005-09-22 |
| CA2461588C true CA2461588C (en) | 2009-03-24 |
Family
ID=35006112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2461588 Expired - Fee Related CA2461588C (en) | 2004-03-22 | 2004-03-22 | Anti-microbial sanitary ware and method for making the same |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2461588C (en) |
-
2004
- 2004-03-22 CA CA 2461588 patent/CA2461588C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2461588A1 (en) | 2005-09-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20130322 |