CA2449309C - Cmos circuit with analog and digital portions for transmitting over a communication network - Google Patents

Abstract

A hybrid monolithic IC that is standardized for controlling various types of electrical equipment, such as circuit breakers, motor controllers and the like. The IC
is a hybrid monolithic IC, fabricated in CMOS technology, The shortcomings of utilizing CMOS technology for linear or analog circuitry is overcome by the implementation of the IC to provide a monolithic IC that is relatively less expensive than using multiple ICs or a single IC
fabricated from biCMOS technology.

Description

. ~

CMOS CIRCUIT WITH ANALOG AND
DIGITAL PORTIONS FOR TRANSMITTING
OVER A COMMUNICATION NETWORK

This application is a divisional of Canadian patent application serial number 2,057,941 filed December 18, 1991.

1. Field of the Invention The present invention relates to an integrated circuit (IC) and more particularly, to a complementary metal oxide semiconductor (CMOS) IC which includes an on-board microprocessor, an analog-to-digital (A/D) subsys-tein, a communications controller and various input/output devices on a single monolithic chip for use in various types of electrical equipment, such as circuit breakers, motor controllers, contactors and the like for converting analog signals, such as electrical voltages and currents to digital signals for monitoring and control. It also relates to electrical overcurrent circuitry for protecting electrical equipment, such as electrical motors and the like, and more particularly, to electrical overcurrent circuitry for protecting conductors within such equipment from damage due to overheating which includes digital and analog modeling of the conductor temperature which enables the circuitry to simulate a conductor cooling condition following a trip of the electrical equipment or loss of electrical power to the electrical overcurrent circuitry.

2. Description of the Prior Art There has been a recent=trend over the years to utilize digital logic circuitry to control and monitor various types of electrical equipment, such as circuit breakers, motor controllers, and the like, in various industrial, commercial and utility applications. Such circuitry generally consists of four parts or function blocks. One function block generally consists of power supply circuitry to provide a relatively stable voltage to the IC. Another function block generally consists of a microprocessor for allowing the control function to be programmed by a unique set of user generated instructions.
Since many of the conditions to be monitored are analog (e.g., electrical voltages and currents), an (A/D) con-verter is necessary to convert these analog values to dig-ital values. The magnitudes of such electrical voltages and currents can be on the order of 120 volts and 5 am-peres, respectively. Because such magnitudes would be de-structive to most IC's, signal conditioning circuitry is provided to produce usable values for the IC.
Whether the four function blocks are included on a single IC or multiple IC's depends on the state of the art of the IC processing technologies available. Because of the ability to match transistors within an IC, for example, for forming operational amplifiers, for example, bipolar technology, is generally favored for analog or linear circuits. CMOS is generally used for digital ap-plications. However, the current inability to match tran-sistors relatively closely utilizing a CMOS process has heretofore made it rather impractical for use in analog circuits because of the relatively large differential off-sets created by this inability. Accordingly, given the superior performance characteristics of the bipolar pro-cess for analog circuits, the hybrid control analog digi-tal circuitry for the four function blocks identified above is generally accomplished with two or more IC's.
However, the use of two or more IC's greatly increases the cost of the circuitry and also the space requirements be-cause of the number of components and the interconnections required therebetween. In many applications, such as in circuit breakers and motor controllers, space requirements are at a premium. Thus, the use of a plurality of IC's dictates that either the circuitry be located external to the device or the size of the device has to be increased.
Both options are relatively expensive.
In order to take advantage of the performance characteristics of a bipolar process for analog or linear circuitry and CMOS for digital circuitry on a monolithic chip, a hybrid bipolar-CMOS (biCMOS) process for manufac-turing a single IC has evolved. However, due to the com-plexity of the biCMOS process, it is relatively expensive.
Another problem with designing hybrid circuitry for use in control and monitoring electrical equipment is that such circuitry is often application specific. Thus, such IC's cannot be readily adapted for use in applica-tions other than those for which they are designed. For example, an IC having predetermined functions that are de-signed for use in a circuit breaker, may be inappropriate for use in a motor controller or the like. Thus, for various end users with different types of electrical equipment, separate custom IC's have to be utilized for each different type of equipment. This can be relatively expensive.
Various devices are known in the art for protecting electrical equipment, such as electrical motors and the like, from damage due to conductor overheating.
Examples of such devices include circuit breakers, overload relays, motor protectors, and the like. Such devices are intended to limit the temperature rise of the conductors within the electrical equipment (e.g., rotor and stator windings of an electrical motor) to prevent damage due to overheating. More specifically, current based time curves, known as overload protection curves, are normally provided by electrical equipment manu-facturers which provide the maximum tripping times as a function of the electrical current that the conductors can withstand without exceeding the maximum temperature rise of the conductors and thereby damaging the electrical equipment.
Overcurrent devices are normally provided with a tripping characteristic adapted to trip the electrical equipment before the maximum temperature rise is exceeded.
The tripping characteristics of the various overcurrent devices are provided by various mechanical and electrical means. For example, some known overcurrent devices, such as circuit breakers, incorporate bimetals disposed in series with the line conductors feeding the equipment which disconnect the electrical equipment from the source of electrical power in accordance with predetermined heating characteristics of the bimetals.
Other known overcurrent devices utilize elec-tronic tripping and may incorporate a microprocessor to generate a current based time function based on the maximum temperature rise of the conductors in the elec-trical equipment to be protected. Such devices normally include sensors for sensing the electrical current to the electrical equipment in order to approximate the conductor temperature. In such devices for a given overcurrent value, known as a pick up value, a timing function is initiated. If the overcurrent condition persists for a sufficient period of time, the electrical equipment is tripped. If, however, the current drops below the pick up level during the time out period, the timer is generally decreased to a value corresponding to the value at the pick up level to simulate a conductor cooling condition.
This allows the overcurrent device to provide protection based on the actual conductor temperature. Should the power supply to the electrical overcurrent device be lost following a trip of the electrical equipment, all timing functions executed by the microprocessor are generally lost.
Analog timing circuits including a capacitor have been used to keep track of the time that the elec-trical power supply has been lost. More specifically, in such known devices, every time a trip is initiated a trip flag is set by the microprocessor and stored. While power is available, the capacitor is charged to a fixed value. On power up of such an overcurrent device, the trip flag is normally checked to determine if a trip occurred. If so, the voltage across the capacitor is sensed and used to calculate the elapsed time that the power supply to the overcurrent device was lost. Once the elapsed time is calculated, the microprocessor then 5 calculates the cool down temperature in order to adjust its timing function to correspond to a conductor cooling condition.
Under certain conditions, the power supply to the electrical overcurrent device may be lost without a corresponding trip of the electrical equipment. Such conditions may include a trip of an upstream circuit breaker in a radial feed system. In other known applica-tions, the overcurrent circuitry is powered by the circuit breaker being protected. Thus, in such applica-tions, the power supply to the overcurrent circuitry is lost when the circuit breaker is tripped. Under such conditions, the circuitry heretofore described would be unable to simulate a conductor cooling condition which could result in damage to the electrical equipment to be protected.
SUMMARY OF THE INVENTION
It is an object of the present invention to solve the problems associated with the prior art.
It is another object of the present invention to provide circuitry capable of controlling and monitoring various types of electrical equipment, such as circuit breakers, motor controllers, and the like.
It is a further object of the present invention to provide analog and digital circuitry for controlling and monitoring electrical equipment with no interconnec-tions therebetween.
It is yet a further object of the present inven-tion to provide analog digital control circuitry for con-trolling and monitoring electrical equipment, which can rather easily be located in existing space in such equip-ment.

It is yet a further object of the present inven-tion to provide monolithic circuitry for controlling and monitoring various types of electrical equipment.
It is yet another function of the present inven-tion to provide monolithic CMOS circuitry for controlling and monitoring various types of electrical equipment.
It is yet another object of the present inven-tion to provide standardized circuitry which can be uti-lized with various types of electrical equipment.
It is yet another object of the present inven-tion to provide electrical overcurrent circuitry that is adapted to simulate a conductor cooling condition follow-ing a loss of electrical power to an electrical overcur-rent device during an overload or subsequent to a trip of the electrical equipment.
It is yet another object of the present inven-tion to provide overcurrent circuitry which includes analog circuitry which simulates both a conductor warming condition and a conductor cooling coridition while power is available to the overcurrent circuitry.
Briefly, the present invention relates to a monolithic IC.that is standardized for controlling various types of electrical equipment, such as circuit breakers, motor controllers, contactors and the like. The IC is a monolithic IC, fabricated in CMOS technology. The short-comings of utilizing CMOS technology for linear or analog circuitry is overcome by the implementation of the IC to provide a monolithic IC that is relatively less expensive than using multiple ICs or a single IC fabricated from biCMOS technology. Also, by utilizing a single IC, such control and monitoring circuitry can be located in exist-ing electrical equipment. The IC in accordance with the present invention includes an on-board microprocessor, an A/D subsystem, a communications controller and various input/output devices which make it suitable for use in various types of electrical equipment. In order to improve the resolution of the A/D subsystem, circuitry is provided, which includes current and voltage ranging amplifiers for ranging analog input voltage and current signals and compensating internal offsets in such amplifiers inherent in CMOS linear circuits which can affect the accuracy of the least significant bits. The ranging circuitry is controlled either automatically or by software to provide additional resolution of the A/D
subsystem. The current ranging circuit includes a divider for dividing analog input signals into a plurality of composite portions in parallel between an input and output of the current divider. Novel auto-zero circuitry is provided for controlling the offsets in the ranging amplifiers. More specifically, the auto-zero circuitry in accordance with the present invention controls internal bias currents within the amplifiers without the need or expense of,precision resistors as is known in the art.
The communications controller allows the IC to be con-figured in either a master mode or a slave mode. Thus, multiple IC's, configured in different modes, can be used to communicate over different communications networks.
Another important aspect of the invention relates to the various types of network instructions to which the communications controller may respond. For example, the communications controller may respond to FAST STATUS
commands. When such a command is received by the communi-cations controller, it may respond independent of the on board microprocessor to improve network response time.
The communications controller is also adapted to receive UNIVERSAL and BLOCK instructions. UNIVERSAL instructions are instructions which all devices on the network receive simultaneously. BLOCK instructions are instructions in which a block of predetermined devices on the network are adapted to receive simultaneously.
Briefly, the present invention also relates to electrical overcurrent circuitry for protecting electrical conductors in electrical equipment, such as motors and the like, from damage due to overheating. The electrical overcurrent circuitry provides both digital based modeling and analog based modeling of the temperature of an electrical conductor to simulate the conductor temperature during all expected operating conditions including a condition when electrical power is unavailable to the electrical overcurrent circuitry. When electrical power is available to the circuitry, the conductor temperature is calculated from the sensed load currents to form the digital based model. During such a condition, the analog based model is forced to track the digital based model. Once the temperature of the electrical conductor exceeds its maximum safe operating temperature, the electrical overcurrent circuitry initiates a trip of the circuit breaker. Since the overcurrent circuitry is powered either by the sensed load currents or derived from the circuit breaker output, the circuit breaker trip will result in a loss of electrical power to the electrical overcurrent circuitry.
This causes the digital based model to be reset to a cold conductor temperature value. However, the analog based model continues to operate to simulate the conductor temperature during this condition. When electrical power is restored to the circuit, for example, when the circuit breaker is closed, the digital model is initialized with the value from the analog model.
Accordingly, in one aspect, the present invention provides a CMOS monolithic circuit for communicating over a communications network comprising:
an analog subsystem including means for receiving analog signals; a digital subsystem including means for receiving digital message signals comprised of a predetermined number of serial bits and including an 8a instruction portion and an address portion; processor means for producing digital output signals responsive to said analog subsystem or said digital subsystem; and means for transmitting said digital output signals over said communications network, and including means for transmitting a predetermined digital message over said communication network in response to a preselected instruction portion of a received message signal independently of said processor means.
In a further aspect, the present invention provides a device which includes a CMOS monolithic circuit for monitoring analog signals from an electrical device having an operate mode and a trip mode and generating an output signal and communication said output signal over a predetermined communications network, said CMOS monolithic circuit comprising: means for receiving analog signals; processor means for generating digital output signals as a function of said analog signals and including a digital status signal indicating a status of said device; and means for communicating said digital output signals over a predetermined communications network, and including means for storing said digital status signal generated by said processor means and transmitting the stored digital status signal over the predetermined communication network independent of said processor means in response to a message received over said predetermined communications network having a preselected instruction portion.
In a still further aspect, the present invention provides a CMOS monolithic circuit comprising:
an analog subsystem including analog receiving means for receiving analog signals; a digital subsystem including digital receiving means for receiving digital signals;
producing means interconnected with said analog receiving 8b means and said digital receiving means for producing an output signal responsive to said analog subsystem or said digital subsystem; and means for resetting said digital subsystem responsive to said analog subsystem and said digital subsystem.
In a further aspect, the present invention provides an electrical device comprising: a CMOS
monolithic circuit having an analog portion and a digital portion, said digital portion having a digital generator which generates digital output signals as a function of analog signals received from said analog portion; a circuit for receiving a differential input signal, a generator for generating an output signal that is a function of said differential input signal and an offset, said offset being a function of bias current within said generator, a controller for controlling the bias current to reduce said offset, said controller including a divider for dividing said bias current into a plurality of composite portions, a summer for summing said one or more of said composite portions of said bias current, and application means for applying said one or more of said composite portions of said bias current to said generator to reduce said offset.
In a further aspect, the present invention provides a CMOS monolithic circuit comprising: means for receiving analog input signals including analog-to-digital converter means and voltage ranging means for ranging said analog input signals to a predetermined range to improve the resolution of said analog-to-digital converter means; and means at least for producing digital output signals as a function of said analog input signals.

8c In a still further aspect, the present invention provides an electrical device comprising: a CMOS monolithic circuit having an analog portion and a digital portion, said digital portion having a digital generator which generates digital output signals as a function of analog signals received from said analog portion; a circuit for receiving a differential input signal, a generator for generating an output signal that is a function of said differential input signal and an offset, said offset being a function of bias current within said generator, a controller for controlling the bias current to reduce said offset, said controller including a divider for dividing said bias current into one or more composite portions, a summer for summing said one or more composite portions of said bias current, and application means for applying said one or more composite portions of said bias current to said generator to reduce said offset.

DESCRIPTION OF THE DRAWINGS

These and other objects and advantages of the present invention will be more easily understood with reference to the accompanying description and drawings, wherein:

FIG. 1 is a functional representation of an application of the IC in accordance with the present invention;

FIG. 2 is a functional block diagram of the IC
in accordance with the present invention;
FIG. 3 is a functional block diagram of a portion of the analog portion of the IC in accordance with the present invention;

8d FIGS. 4(a)-4(d) are diagrams of alternate clock generator connections for the IC in accordance with the present invention;

FIG. 5 is a memory address map for the IC in accordance with the present invention;
FIG. 6 is a format diagram for configuration registers CFR and ACFR which form a portion of the IC in accordance with the present invention;
FIG. 7 is a format diagram for an EEPROM control register NVCR which forms a portion of the IC in accord-ance with the present invention;
FIG. 8 is a format diagram for a dead-man con-trol register DMC which forms a portion of the IC in*
accordance with the present invention;
FIG. 9 is a format diagram for A/D conversion interface registers ADZ, AMZ, ADCR, AMUX, ACSF, AVSF and ADC wtiich form a portion of the IC in accordance with the present invention;
FIG. 10 is a format diagram for comparator mode control registers CMPI and CMPST and the pulse width modu-lated output control register PWM which form a portion of the IC in accordance with the present invention;
FIG. 11 is a block diagram of a programmable timer which forms a portion of the IC in accordance with the present invention;
FIGS. 12(a)-12(d) are timing diagrams for the timer of FIG. 11;
FIG. 13 is a format diagram for programmable timer registers TCRH, TCRL, TARH, TARL, TICH, TICL, TOCH, TOCL, TCR and TSR which form a portion of the IC in accor-dance with the present invention;
FIG. 14 is a connection diagram of a serial peripheral interface (SPI), single master, which forms a portion of the present invention;
FIG. 15 is a connection diagram of a typical SPI
with multiple masters;
FIG. 16 are clock and data timing diagrams for the SPI illustrated in FIG. 15;
FIG. 17 is a format diagram for the SPI inter-face registers SPD, SPSR and SPCR which form a portion of the IC in accordance with the present invention;

FIG. 18 is a format diagram, for the PORT D
interface registers PDC and PDD which form a portion of the IC in accordance with the present invention;
FIG. 19 is a block diagram of a parallel port 5 which forms a portion of the IC in accordance with the present invention;
FIG. 20 is a format diagram for PORT B interface registers PBC and PBD which form a portion of the IC in accordance with the present invention;

10 FIG. 21 is a format diagram for PORT C interface registers PCC and PCD which form a portion of the IC in accordance with the present invention;
FIG. 22 is a format diagram for PORT D interface registers PDC and PDD which form a portion of the IC in accordance with the present invention;
FIG. 23 is a format diagram for the communica-tions controller interface registers ICAH, ICAL, ICM3, ICM2, ICM1, ICMO, ICSR and ICCR which form a portion of the IC in accordance with the present invention;
FIG. 24 illustrates the control message and data message format diagrams for the communication controller which forms a portion of the IC iLn accordance with the present invention;
FIG. 25 is an overall block diagram of the com-parator subsystem and AJD input subsystems of the IC in accordance with the present invention;
FIG. 26 is a schematic diagram of the quadcom-parator subsystem in accordance with the present inven-tion;
FIG. 27 is a schematic diagram of the address decode logic for the comparator control registers CMPST
and CMPI and the configuration register CFR in accordance with the present invention;
FIG. 28 is a block diagram of the analog subsys-tem in accordance with the present invention;
FIG. 29 is a schematic diagram of the micropro-cessor bus interface logic in accordance with the present invention;

FIG. 30 is a{schematic diagram of the address decode logic for the microprocessor bus interface regis-ters in accordance with the present invention;
FIG. 31 is a schematic diagram of control and status registers in accordance with the present invention;
FIG. 32 is a block diagram of the analog digital control logic portions of the IC in accordance with the present invention;
FIG. 33 is a block diagram of the analog control logic in accordance with the present invention;
FIG. 34 is a schematic diagram of the current multiplexer (MUX) control logic in accordance with the present invention;
FIG. 35 is a schematic diagram of the voltage MUX control logic in accordance with the present inven-tion;
FIG. 36 is a schematic diagram of the auto-zero registers in accordance with the present invention;
FIG. 37 is a schematic diagram of a five microsecond timer in accordance with the present inven-tion;
FIG. 38 is a schematic diagram of the auto-zero control logic in accordance with the present invention;
FIG. 39 is a schematic diagram of the auto-range control logic in accordance with the present invention;
FIG. 40 is a schematic diagram of the auto-range state machine in accordance with the present invention;
FIG. 41 is an overall block diagram of the analog circuitry in accordance with the present invention;
FIG. 42 is a schematic diagram of the input MUX
system in accordance with the preserit invention;
FIG. 43 is a block diagram of the quad compara-tor system in accordance with the present invention;
FIG. 44 is a schematic diagram of a band gap regulator in accordance with the present invention;
FIG. 45A is a schematic diagram of a shunt regu-lator, B+ comparator and a power monitor in accordance with the present invention;

FIG. 45B is a schematic diagram of exemplary external conditioning circuitry and power supply circuitry for use with the IC in accordance with the present inven-tion;
FIG. 45C is a schematic diagram of an exemplary external regulator circuit for use with the IC in accor-dance with the present invention;
FIG. 46 is a schematic diagram of a biasing circuit in accordance with the present invention;
FIG. 47 is a schematir, diagram of another biasing circuit in accordance with the present invention;
FIG. 48 is a schematic diagram of an analog temperature sensing circuit in accordance with the present invention;
FIG. 49 is a schematic dliagram of the ranging circuitry for the voltage amplifier in accordance with the present invention;
FIG. 50 is a schematic diagram of the current mirror and amplifier in accordance with the present inven-tion;
FIG. 51 is a schematic diagram of the current mirror in accordance with the present invention;
FIG. 52 is a schematic diagram of the offset correction circuitry in accordance with the present inven-tion;
FIG. 53 is a schematic diagram of the auto-zeroable voltage and current amplifiers in accordance with the present invention;
FIG. 54 is a block diagram of the communication controller which forms a portion of the IC in accordance with the present invention;
FIG. 55 is a block diagram of a digital demodu-lator which forms a portion of t:he communication con-troller in accordance with the present invention;
FIG. 56 is a schematic diagram of a master clock generator which forms a portion of =the communication con-troller in accordance with the present invention;

FIG. 57 is a schematic diagram of a bit phase timing generator which forms a portion of the communica-tion controller in accordance with the present invention;
FIG. 58 is a schematic diagram of a receiver correlator which forms a portion of the communication con-troller in accordance with the present invention;
FIG. 59 is a partial schematic diagram of a correlator counter which forms a portion of the communica-tion controller in accordance with the present invention;
FIG. 60 is the remaining portion of the sche-matic diagram of a borrelator counter which forms a portion of the communication contro7ller in accordance with the present invention;
FIG. 61 is a schematic diagram of the demodula-tor control logic which forms a portion of the communica-tion controller in accordance with the present invention;
FIG. 62 is a schematic diagram of a bit counter which forms a portion of the communication controller in accordance with the present invention;
FIG. 63 is a schematic diagram of bus interface logic circuit for the communications controller which forms a portion of the communications controller in accor-dance with the present invention;
FIG. 64 is a schematic diagram of an address decode logic circuit for the communications controller's bus interface register in accordance with the present invention;
FIG. 65 is a schematic diagram of the address registers which forms a portion of the communication con-troller in accordance with the present invention;
FIG. 66 is a schematic diagram of a message register ICM1 which forms a portion of the communication controller in accordance with the present invention;
FIG. 67 is a schematic diagram of a message register ICM2 which forms a portion of the communication controller in accordance with the present invention;

FIG. 68 is a schematic diagram of a message register ICM3 which forms a portion of the communication controller in accordance with the present invention;
FIG. 69 is a schematic diagram of a message register ICMO which forms a portion of the communication controller in accordance with the present invention;
FIG. 70 is a schematic diagram of control and status registers which forms a portion of the communica-tion controller in accordance with the present invention;
FIG.. 71' is a schematic diagram of bits 26-19 of a shift register which forms a portion of the communica-tion controller in accordance with the present invention;
FIG. 72 is a schematic diagram of bits 18-2 of the shift register of FIG. 71;
FIG. 73 is a block diagram of the communication controller control logic which forms a portion of the IC
in accordance with the present invention;
FIG. 74 is a schematic diagram of the transmit-ter control logic circuit which forms a portion of the communication controller in accordance with the present invention;
FIG. 75 is a schematic diagram of a BCH computer which forms a portion of the commuziication controller in accordance with the present invention;
FIG. 76 is a schematic diagram of an address comparator circuit which forms a portion of the communica-tion controller in accordance with the present invention;
FIG. 77 is a schematic diagram of an instruction decoder circuit which forms a portion of the communication controller in accordance with the present invention;
FIG. 78 is a schematic diagram of a control and status logic circuit which forms a portion of the communi-cation controller in accordance with. the present inven-tion;
FIG. 79 is a continuation of FIG. 78;
FIG. 80 is a timing diagram of various strobe signals utilized in the communication controller in accor-dance with the present invention;

FIG. 81 is a timing diagram of a reset signal utilized in the communication controller in accordance with the present ipvention;
FIG. 82 is a pin out diagram of the IC in accor-5 dance with the present invention;
FIG. 83 is an exemplary current based time curve for a cold conductor condition;
FIG. 84 is an exemplary current based time curve for a warm conductor condition;
10 FIG. 85A is an exemplary curve illustrating the simulated conductor temperature as a function of time for an entire operational cycle illustrating a digital model shown in dashed line and an analog model shown in solid line;

15 FIG. 85B is an exemplary curve illustrating the load current as a function of time which corresponds to the operational cycle illustrated in FIG. 85A;
FIG. 85C illustrates exemplary curves represent-ing a thermal model of a conductor cooling condition and a conductor warming condition;
FIG. 86 is an electronic overcurrent circuit in accordance with the present invention;
FIG. 87A is a graph which illustrates a simpli-fied curve of the voltage on the capacitor Cl superimposed on the calculated temperature rise as a function of time;
FIG. 87B is an enlarged portion of the curves illustrated in FIG. 87A;
FIG. 88 is a flow chart for charging the capacitor Cl which forms a portion of the electronic overcurrent circuitry in accordance with the present invention;
FIG. 89 is a graph similar to FIG. 87A which illustrates a detailed curve of the voltage on the capacitor;
FIG. 90 is a schematic diagram which illustrates the circuitry during a condition when electrical power is unavailable to the SURE CHIP integrated circuit;

FIG. 91 is a flow chart for the circuitry illustrated in FIG. 86;
DETAILED DESCRIPTION
DEFINITIONS
The following definitions are to be used throughout:
Bit designations: Bits within a register will be designated by placing the bit number within square brackets. For example, bit 5 of register ABC is desig-riated as: ABC[5]. Bits 5 through 0 of register ABC are designated: ABC[5...0]. Bits 4 and 5 of register ABC are designated as ABC(5,4], etc.
Hexadecimal. Base 16 numbers written with a dollar sign prefix. For example, $0100 = 256 decimal.
High-true: These signals are designated with the suffix "h" and are defined to be asserted (true or logical 1) when their electrical level is at or near the +VDD supply and are defined to be negated false or a logi-cal zero) when their electrical level is at or near zero volts direct current (Vdc).
Low-true: These signals are designated by the suffix "b" and are defined to be asserted (true, or a logical 1) when their electrical level is at or near zero Vdc and are defined to be negated (false or a logical zero) when their electrical level is at or near +VDD
supply.
Input: An input signal is received by the IC
10.
Output: An output signal is driven by the IC
10.
Referring to the drawings, the IC in accordance with the present invention is generally identified with the reference numeral 10. The circuitry of the IC 10 has been standardized to enable it to be utilized with various types of electrical equipment including circuit breakers, motor controllers, and the like. For illustration and discussion purposes only, the IC 10 is shown utilized in a circuit breaker 12 in FIG. 1. The circuit breaker 12 is shown as a three phase circuit breaker having phases iden-tified as 01A", "B" and "C". It is to be understood by those of ordinary skill in the art that the IC 10 is capable of being utilized with various other types of electrical equipment, such as motor controllers, con-tactors and the like.
The circuit breaker 12 does not form a portion of the present invention. As shoum, the circuit breaker 12 is provided with three current transformers 14, 16 and 10. 18. These current transformers 14, 16 and 18 are disposed on a load side 20 of the circuit breaker 12 to allow the circuit breaker 12 to be monitored and controlled. The line side 22 of the circuit breaker 12 is generally con-nected to a three phase source of electrical energy (not shown). The load side 20 is generally connected to a three phase load (not shown), such as an electrical. motor.
An important aspect of=the invention relates to the fact that the IC 10 is current driven as will be dis-cussed below. More specifically, electrical current from the current transformers 14, 16 and 18 is applied to the IC 10 by way of conditioning circuitry 19 (FIGS. 1 and 45B). The conditioning circuitry 19 is used to provide an electrical current of about 20 microamperes ( A) to the IC
10.
Another important aspect of the invention relates to an on-board communication controller 29. This controller allows the IC 10 to communicate with devices, such as a panel meter 31 as illustrated in FIG. 1 by way of a communications network link, such as a twisted pair 33. Another IC 10 or an INCOM chip, as disclosed in U.S.
Patent No. 4,644,566, can be disposed in the remote meter 31 to allow the remote panel meter 31 to be connected in another network, by way of another communications network link 35 which includes its own master controller (not shown). A general description of a similar communication controller connected in a network with a master controller is described in detail in U.S. Patent No. 4,644,566, assigned to the same assignee as the present invention.
A block diagram of the digital portion of an exemplary embodiment of the IC 10 is shown in FIG. 2.
Various configuration options are selectable by software programming and mask options for specific applications as will be discussed below. In order to provide an IC 10 with universal application for controlling and monitoring various types of electrical equipnient, such as circuit breakers, motor controllers, contactors and the like, various peripherals may be provided. These peripheral devices may include a microprocessor 30 with a multiply instruction, for example, a Motorola type MC68HO5. The microprocessor 30 communicates with the various other peripherals and external pins on the chip 10 by way of an internal address, data and control bus 34 and an external bus controller 31. A clock generator 36 provides timing for the microprocessor 30. An on-board memory subsystem is provided which may include read only memory (ROM) 38, electrically erasable read only memory (EEPROM) 40 and random access memory (RAM) 42. The EEPROM may be provided with an internal charge pump 44 for obviating the need to provide an external high voltage source for erasure in programming of the EEPROM 40.
Exemplary memory sizes are provided for illustration and discussion purposes only. For example, 256 bytes of EEPROM 40 and 208 bytes of RAM 42 may be provided. The ROM 38 may include 4,096 bytes of mask programmable user instruction memory and 240 bytes of self-test memory.

18a The IC 10 has separate digital and analog power supply systems. These power supply systems are segregated to prevent digital noise from affecting the analog circuitry. The digital power supply is directed to a VDD
pin on the IC 10 formed from an external voltage regulator(FIG. 45C). The analog power supply is directed to a AVDD pin. In many applications, an external transistor, diode and resistor are adequate.

Power monitor circuitry 47 is provided, which includes an internal voltage level detector for monitoring the gate drive to the shunt regulator associated with the AVDD pin. The power monitor circuitry 47 deactivates a SHUNT output pin which, when connected to the RESN input pin, provides a reset when the analog supply voltage AVDD
begins to fall below a preset threshold. Dead-man cir-cuitry 46 is provided which monitors operation of the microprocessor 30 and activates a reset upon detection of spurious operation.
An analog power supply subsystem 48 is provided for the analog circuitry. This subsystem 48 includes a +1.25 Vdc band gap regulator and a buffer amplifier to generate a +2.5 Vdc reference. An external current source is used to power the analog power supply subsystem 48.
The current source is directed to an external pin AVDD.
An adjustment pin VADJ is provided to allow the voltage reference to be trimmed to exactly +2.5 Vdc. Trimming may be provided by a voltage divider circuit, for example, two series connected resistors connected between the VREF pin and an analog ground pin AVSS, as illustrated in FIG. 44.
The interface between the series connected resistors is connected to the VADJ pin. A shunt regulator provides a nominal +5.0 Vdc source at the AVDD pin based on the reference voltage at the VREF pin. The buffer amplifier is provided with an open drain output such that it can only source current. This will perrait multiple devices to be paralleled. ' The regulator can also be slaved to another IC. This is accomplished by connecting the VADJ
pin to the VREF pin on the slave IC and connecting the VREF pin on the slave IC to the VREF pin on the master IC.
A comparator subsystem is provided which includes an A comparator 49, a B+ comparator 50 and quadcomparators 58. The A comparator 49 is for use with the communication controller 29. A B+ comparator 50 is provided for external power supply generation as illustrated in FIG. 45B and discussed below. The invert-ing input of the comparator 50 is referenced to the VREF

,:.:.

pin (nominally, +2.5 Vdc). The input signal is applied to a non-inverting input pin BSENSE of the comparator 50.
The B+ comparator 50 output is connected to an external pin BDRIVE. The quadcomparators 58 include four com-5 parators referenced to a fixed voltage, for example +1.25 Vdc.
Various special functions may also be provided, such as a timer 60 and a pulse width modulated output 61.
The timer 60 may be used for time base or waveform genera-10 tion periodic measurement or other periodic functions.
The PWM output is a periodic signal whose period may be controlled by the microprocessor's phase 2 clock divided by 4.
Various other peripheral devices may also be 15 provided on the IC 10 to allow it to be adapted for various applications, such as circuit breakers, motor con-trollers and the like. For example, these peripheral devices may include four general purpose 8-bit bidi-rectional ports; Port A (52), Port B (53), Port C (56) and 20 Port D (57). A serial peripheral interface 54 (SPI) may also be provided to allow for efficient connection of peripheral devices that communicate over a serial bus.
The SPI 54 may also be used for interprocessor communica-tion in a multiprocessor system. The SPI 54 supports several operating modes that permit connection of devices that communicate using various protocols.
An important aspect of the invention relates to an analog subsystem, identified by the function blocks 62 and 64 in FIG. 2. A block diagram for this subsystem is illustrated in FIG. 3. The analog subsystem includes, for example, eight analog input channels for receiving analog voltage and current signals and converting these signals to an 8-bit digital signal with 12--bit resolution. Four of the input channels 62 can be selected by the software to operate as either voltage inputs or current inputs.
The other input channels 64 can only be operated as volt-age inputs. Current and-voltage input operation of the input channels 62 and 64 is controlled by multiplexers (MUXes) 66 and 68, which are selected by the software.
The voltage input channels can accept positive voltages in the range of 0-2.5 Vdc: and are applied to an auto-zeroable voltage adjustable gain amplifier 80. These signals can be processed in either an auto-ranging mode or a fixed gain mode, selectable by the software. If the auto-ranging mode is selected, the selected voltage input channel 62 or 64 is ranged by values stored in an internal auto-ranging register to allow the gain to be automati-cally adjusted until the signal is at least one-half of full scale but not in overflow. The ranged signal is then converted directly to an 8-bit digital value by an A/D 78 and stored in an internal register. If fixed ranging is selected, the voltage mode inputs 62 or 64 can be operated at preselected gain settings, for example, 1, 2, 4, 8 or 16. The preselected gain settings are provided by gain circuitry which includes a resistor network 84, connected to an inverting terminal of the voltage amplifier 80 by way of a MUX 86. The MUX 86 is controlled by the soft-ware. The output of the voltage amplifier 80 is connected to the A/D circuitry 78 by way of another MUX 88. The MUX
88 is in the position shown in FIG. 3 when voltage gains other than one have been selected. However, when a gain of one is selected, the voltage amplifier 80 is discon-nected from the ranging circuitry and the input voltage channel 62 or 64 is applied directly to the A/D 78.
Current mode inputs 62 accept negative currents (e.g., currents flowing out of a MXO pin) with a -1.6 mA, for example, representing full scale. Unselected current input channels are tied to a digital ground pin (VSS) by the MUXes 68 which provide for make-before-break switch-ing. The selected input current channel is connected to an inverting input of an auto-zeroable current amplifier 90, referenced to analog ground (AVSS). The source follower output is configured to maintain the inverting input at a virtual ground by providing current to the selected channels through an adjustable current mirror 92.

The current mirror 92 can be set by auto-ranging cir-cuitry, which can be overwritten by the software, to one of the following exemplary ratios: 1/1, 1/2, 1/4, 1/8 or 1/16. The ratioed mirror output current is directed to the MXO pin. Thus, the current flowing out of the MXO pin will be a programmable fraction of the sum of the currents flowing out of the selected current input channel pin.
Two modes of operation are possible:
Non-integrating mode. An external resistor (not shown) may be connected between the analog ground pin (AVSS) and the MXO pin to convert the ratioed current to a voltage. This voltage may then be converted to a digital value in a similar manner as discussed above. In this mode of operation, the default amplifier gain is set at times one unless overwritten by the software.
Integrating mode. An external capacitor (not shown) may be connected between the analog ground pin (AVSS) and the MXO pin to integrate the ratioed current.
A shorting switch 96 is provided to discharge this capaci-tor under program control. Integra=ted voltages are then converted by the A/D 78 as discussed above.
The voltage and current amplifiers 80 and 90 have offset voltage compensation circuitry 98 to compen-sate for offsets inherent in CMOS amplifiers. These off-sets can be on the order of, for example, 20 millivolt (mV) which can affect the accuracy of the least signifi-cant bits of the converted digital value. This circuitry 98 assures that the offset is always a negative voltage between 0.0 and 0.5 mV and forces the amplifier 80, 90 to have a positive output when the differential input voltage is zero. This offset correction can be done either auto-matically by the hardware or controlled by the software.
Sample and hold capability is provided for the input channels 62 and 64. More specifically, the eight analog input channels 62 and 64 are grouped into four pairs of channels 102, 104, 106 and 107. Each pair of channels 102, 104, 106 and 107 can be used as a single channel with sample and hold capability. A capacitor (not shown) may be connected between one channel input and the analog ground pin AVSS while the other channel of the pair is connected to a voltage input. A sample command permits the software to connect the two channels of each pair together by way of sample and hold MUXes 108, 110, 112 and 114, thus storing the input voltage on the capacitor of the adjacent channel. Only channel pairs in which both channels are configured for voltage mode operate in this fashion. All four channel pairs 102, 104, 106 and 108 may be sampled simultaneously.
There are other important aspects of the inven-tion. For example, the IC 10 is adapted to respond to either analog signals or digital signals and provide a digital output signal. Another important aspect relates to the fact that the IC 10 is provided with circuitry which enables it to sense the ambient temperature in which it is disposed and generate a corresponding electrical signal.
OPERATING MODES
The IC 10 has five modes of operation. Two normal operating modes are single-chip and expanded.
These are selected by strapping an EXPN pin to either the VSS or VDD pins. The three special operating modes are:
emulation, test and self-check. These modes can only be selected by connecting certain pins to a voltage level twice VDD when the reset line is negated. They cannot be enabled by normal product operation. The operating mode of the IC 10 is determined by the electrical input levels of EXPN, IRQN, and TCAP pins when the device comes out of reset. These pins are sampled when the RESN pin transi-tions from an electrical low to high. Table 1 defines the pin input levels for various operating modes.
The operating mode determines the function of certain device pins: ALE, PSEN, REN, WEN and PH2. The following sections discuss the behavior of the IC 10 in these different operating modes.

OPERATING MODE SELECTION
Mode EXPN IRON TCAP
Single-Chip VDD VSS tO VDD VSg to VDD
Expanded VSS VSS to VDD VSS to VDD
Emulation VDD*2 VSS to VDD VSS to VDD
Test VSS VDD*2 VDD
Self-Check VSS VDD*2 VSS
1. Single-chip Mode The single-chip mode is selected when the RESN
pin changes from an electrical low to high and the EXPN
pin is at VDD. In this mode, Ports A and B operate as normal bidirectional I/O ports and the microprocessor executes code from internal mask-programmed ROM. See Table 2 for operation of variable function device pins.

PIN DEFINITION FOR OPERATING MODES
Single- Ex- Emula- Test Self-Pad chip panded tion check ALE low ALE ALE ALE low PSEN high PSEN LIR LIR high REN high REN R/W R/W high WEN high WEN E E high PH2 low PH2 PH2 PH2 low 2. Expanded Mode The expanded mode is selected when the RESN pin changes from an electrical low to high and the EXPN pin is at VSS. In this mode, Port A becomes a multiplexed data/address bus and Port B becomes the high-order address bus. This mode requires program code to reside in an external memory device. The internal code ROM is not available and all memory locations above $4000 must be implemented with external devices. See Table 2 for operation of variable function device pins.

3. Emulation Mode The emulation mode is a special operating mode that is selected by setting the EXPN pin to a voltage level twice VDD when the RESN pin changes from an electri-5 cal low to high. This mode operates similar to the expanded mode, except that certain pin definitions change.
See Table 2 for operation of variable function device pins.
4. Test Mode 10 The test mode is.used for production testing of the IC 10. It is selected by setting IRQN at twice VDD
and TCAP at VDD when the RESN pin iziput rises. See Table 2 for operation of variable function device pins.
5. Self-check Mode 15 The self-check mode is used for production burnin. It is selected by setting IRQN at twice VDD and TCAP at VSS when the RESN pin input rises. See Table 2 for operation of variable function device.
CONFIGURATION METHODS
20 Since the IC 10 is intended for universal appli-cation of various types of electrical equipment, certain configuration information is required to tailor the IC 10 for a specific application. The configuration information is defined by either mask options, software, constants or 25 run time configuration.
Regarding mask options, the contents of the ROM
38 may be specified at the time the IC 10 is manufactured.
Certain other mask configuration options may be determined by modification of a single mask. These other configura-tion options include the dead-man subsystem 46, IRQN trig-gering, an oscillator option, comparator hysteresis option and an SPI option. A predetermined hysteresis, for example, 20 millivolts (mV) or no hysteresis at all can be selected on an individual comparator basis.
A mask programmable option also permits selec-tion of the type of interrupt generated associated with an IRQN pin. One of two triggering methods may be selected as follows: 1) negative edge sensitive triggering only, -.. e.

or 2) both negative edge-sensitive and low level-sensitive triggering. If option 2) is selected, either type of input to the IRQN pin will produce an interrupt. The IC
can be configured to accept either a crystal/ceramic 5 resonator input or an RC network to control the internal oscillator. More specifically, the IC 10 can be con-figured by mask option to accept either a crystal/ceramic resonator input or an RC network to control the internal oscillator. The internal clocks are derived by a divide-10 by-two of an internal oscillator, which operates with an AT-cut parallel resonant quartz crystal resonator in the frequency range of 1 MHz to 8 MHz. Use of an external oscillator is recommended when crystals outside the specified range are to be used. The crystal and com-ponents are be mounted as close as possible to the input pins to minimize start-up and stability problems. Table 1 shows recommended parameters for crystal resonators.
A ceramic resonator may be used in place of the crystal in cost-sensitive applications. The circuit shown in FIG. 4(a) is recommended when using a ceramic resonator. Its equivalent circuit is shown in FIG. 4(b).
Table 3 shows the recommended parameters for various resonators.

CRYSTAL/CERAMIC RESONATOR P'ARAMETERS
CRYSTAL CERAMIC
PARAMETER 2 MHz 4 MHz 2-4 MHz UNITS
RS 400 75 10 ohms CO 5 7 40 pF
Cl 8000 12000 4.3 pF
COSCi 15-40 15-30 30 pF
COSC2 15-30 15-25 30 pF
Rp 10 10 1-10 megohms Q 30 40 1.25 10 A mask programmable oscillator option may be selected to permit the use of a single external resistor R
between external oscillator pins OSC1 and OSC2 as illu-strated in FIG. 4(c). With this option, frequencies between 5 MHz and 70 KHz are practical. An external clock input should be used with either mask oscillator option.
This external clock is connected to the OSC1 pin with the OSC2 pin unconnected as shown in FIG. 4(d).
Two mask options are available for the SPI.
This mask option selects one of two serial peripheral interface data pin (MOSI, MISO) configurations.
~ Bidirectional Data Pins: This configuration causes the EPI data pins to change direction when master or slave operation is selected. The MoSI pin is an output when in the master mode and an input when in the slave mode. The MISO
pin is an input when in =the master mode and an output when in the slave mode.
~ Unidirectional Data Pins: This configuration forces the SPI data pins to operate indepen-dently of the mode of the SPI. When this con-figuration is selected, MOSI is always an output and MISO is always an input.
In addition to the mask options, software con-stants are also used for configuration of the IC 10. More specifically, internal configuration registers are loaded by the microprocessor software from application dependent software constants stored in the program ROM 38 or the EEPROM 40. A pair of internal configuration registers (CFR, ACFR) are used to control these options in the IC
10. The CFR and ACFR registers are loaded on program initialization and are not intended to be altered during normal program operation and will be discussed in detail below.
Lastly, the IC 10 can be configured by run time configuration. With this option, configuration data is read from external devices through the microprocessor's I/O subsystem. This can be done by utilizing the input/output ports A, B, C or D in either a parallel or serial fashion.
CONFIGURATION REGISTERS
The configuration registers CFR and ACFR are used to specify various software configuration options available in the IC 10 architecture. These registers CFR, ACFR are programmed during software initialization to con-figure input/output pins to their appropriate function as well as setting other major configuration parameters. In order to avoid improper operation of the IC 10, the CFR
and ACFR registers should not be altered during normal operation.
The CFR register is a write only register. The ACFR register is a read-write register. The bit format 10- for. the CFR and ACFR registers is illustrated in FIG. 6.
Both the CFR and ACFR configuration registers are initial-ized to zeros on power-up or reset. This defines the state of the IC 10 after power has been applied and before the microprocessor 30 alters it for the application.
CFR REGISTER
The CFR register is a write-only register used' to configure the comparator output'options. Bits 4 and 5 are unimplemented. The remainder of the bits in the CFR
register are defined below.
CFR[7]: Communication Subsystem Master Enable.
This is a permissive bit that allows the communication controller subsystem 29 to be switched into a master mode.
A zero in this configuration bit prevents the communica-tion controller subsystem 29 from entering into a master mode of operation. A one permits master operation. This bit is set to zero on reset.
CFR[6]: SPIOFF. This is a. disable bit for the SPI subsystem. When set, the SPI subsystem is disabled.
This bit is set to zero on reset.
CFR[3...0]: Comparator Mode Control. These four configuration bits enable the comparator outputs to be "ORed" with the least significant four bits of port C.
A zero in these configuration bits enables the OR opera-tion for the associated port pin. In this mode, each out-put pin will be low during device reset if the respective comparator input is above the threshold voltage (+1.25 V).
Reset will clear the microprocessor's PORT C output regis-ter, making the output pin only a function of the compara-tor input. When the microprocessor writes a"1" into the port output register, the output pin will be forced high independent of the state of the comparator input.
A one in these configuration bits disables the 'OR' operation. In this mode, the port pins are in a high impedance state after reset. The configuration bits are assigned in sequential order with CFR[0] controlling scan PCO/CMPO and CFR[3] controlling PC3/CMP3.
ACFR REGISTER
The ACFR register is a 7-bit read-write register and is used to configure the analog subsystem. This register is set to zero on device reset or power-up. Bit 4 is unimplemented. Bit definitions of the ACFR register are as follows:
ACFR[7]: Clock Source. This bit selects the clock source for the A/D 78 and the communication con-troller subsystem 29 as well as the EEPROM charge pump 44.
They can be configured to use either an internally gener-ated clock or a clock derived from an external crystal oscillator of the IC 10. If the crystal oscillator is selected (ACFR[73 = 1), the oscillator frequency must be in the range of 2-8 MHz. Other crystal values must use the internal clock source option (ACFR[7] = 0)0. If the communication controller subsystem is used, the external crystal option must be selected (ACFR7] = 1). This bit is set to 0 (internal clock source) by reset. A delay of 10 milliseconds (ms) is required after selecting the internal clock to permit,the oscillator to stabilize. During the stabilization time, A/D 78 and EEPROM 40 operations should be performed.
ACFR[6]: Divider ratio. This bit selects the clock divider ratio for the A/D 78 and the communication controller subsystem 29. There are two considerations when selecting external crystals and the ACFR[6] setting.
These considerations are; first, the clock input to the A/D 78 must be in the range of 1-2 MHz; and second, the clock input to the communication controller subsystem 29 must be 1.8432 MHz if the communication controller carrier and bit rate standards are to be met.
This bit selects a divider ratio of 1/2 or 1/4, permitting crystals in the range of 2-8 MHz to be used.
5 If the communication controller subsystem 29 is active, either a 7.3728 MHz or 3.6864 MHz crystal must be used.
The selection of the external crystal and the state of ACFR[7] will determine the A/D conversion, autoranging and autozero times. Table 4 defines the configuration bit and 10 demonstrates the effect on conversion times.

A/D CONVERTER CLOCK SOURCE
ACFR Crystal A/D Conv.* Auto-zero**
[7,6] Divider (MHz) ( s) ( s) 15 0 X Internal NA 48 - 96 13 - 1,537 1 0 1/2 2 48 - 96 25 - 1,537 1 0 1/2 3.6864 26 - 52 15 - 884 1 1 1/4 4 48 - 96 25 - 1,537 20 1 1 1/4 7.3728 26 =- 52 25 - 884 1 1 1/4 8 24 =- 48 13 - 769 * The auto-range time depends on the number of gain steps required to range.

** The auto-zero time depends on the amount of offset '25 correction required.

ACFR[5]: A/D power-down. This bit controls power down operation of the A/D subsystem 78. When set, it will power up the A/D subsystem 78. When the bit is reset, the A/D subsystem 78 will power down. This bit is 30 set to zero by reset on power-on. At least 100 s should be allowed for the converter to stabilize after power-up.
ACFR[3...0]: MUX3...MUXO mode select. These configuration bits control the input mode of the analog input channels 62 and 64. The input channels 62 (MUXO...MUX3) can be placed in either a voltage input mode or a current input mode. A zero in these configuration bits selects the voltage mode, while a one selects the current mode. These bits are assigned sequentially with ~.w31 ACFR[0] controlling MUXO and ACFR[3] controlling MUX3 as shown in Table 5.

ANALOG INPUT MODE DEFINITIONS
ACFR[0] = 0 = voltage mode, 1 = current mode ACFR[1] = 0 = voltage mode, 1= current mode ACFR[2] = 0 = voltage mode, 1 = current mode ACFR[3] = 0 = voltage mode, 1 = current mode The microprocessor 30 is based on a Motorola type MC68HCO5 architecture, a Von Neumann type machine, which places all data, program and I/0 interfaces into a single address map. This reduces the number of special purpose instructions that must be supported and therefore results in a relatively small and easy to remember instruction set.
The microprocessor 30 is described in detail in M6805 HMOS/M146805 CMOS FAMILY USERS MANUAL by Motorola, Inc., copyrighted 1983.
The microprocessor 30 architecture is based on five regis-ters: an accumulator (A), an index register (X), a pro-gram counter (PC), a stack pointer (SP) and a condition code register (CC).
The accumulator is a general purpose 8-bit register used by the program for arithmetic calculation and data manipulations. A full set of read/modify/write instructions operate on this register. The accumulator is used in the register/memory instructions for data manipu-lation and arithmetic calculation. The index register is used in the index mode of addressing or as an auxiliary accumulator. It is an 8-bit register that can be loaded either directly or from memory, having its contents stored in memory, or its contents compared to memory. In index instructions, the index register provides an 8-bit value that is added to an instruction provided value to create an effective address. The index register is also used for limited calculations and data manipulation.

The program counter is a 16-bit register and contains the memory address of the next instruction that is to be fetched and executed. Normally, the program counter points to the next sequential instruction, how-ever, it may be altered by interrupts or certain instruc-tions. During an interrupt, the program counter is loaded with the appropriate interrupt vector. Jump and branch instructions may modify the program counter so that the next instruction to be executed is not necessarily the next instruction in memory.
The stack array or stack is an area in memory used for the temporary storage of important information.
It is essentially a sequence of RAM locations used in a last-in-first-out (LIFO) fashion. The stack pointer al-ways points to the next free location on the stack. In-terrupts and subroutines make use of the stack to tem-porarily save important information. The stack pointer is used to automatically store the return address (2 byte program counter) on subroutine calls and to automatically store all registers (5 bytes: A, X, PC and CC) during in-terrupts. The stack starts at location $OOFF and extends downward 64 locations.
The condition code register is a 5-bit register that indicates the results of the instruction just exe-cuted, as well as the state of the processor. These bits can be individually tested by a program instruction and specified action taken as a result of their state. The following condition code bits are defined: half-carry (H), interrupt mask (I), negative (N), zero (Z) and carry/borrow (C).
MEMORY MAPPING
The microprocessor 30 is capable of addressing 65,536 bytes of memory. Thus, the memory space ranges from $0000 to $FFFF. FIG. 5 is a diagram of memory allo-cation for the IC 10.
1. ROM 38 The IC 10 memory map has three sections of mask programmable ROM 38 and accommodate up to 32,768 bytes of external ROM in the expanded mode at locations $8000 to $FFFF. This memory 38 is program.med at device manufac-ture. The three sections of the ROM 38 are located as de-fined in Table 6.

ROM ASSIGNMENTS
ADDRESS RANGE SIZE FUNCTION
$EFOO-$FEFF 4096 bytes User instruction memory $FFOO-$FFEF 240 bytes Self-check program $FFFO-$FFFF 16 bytes Vectors 2. RAM 42 The IC 10 is configured with 208 bytes of RAM
starting at location $0030 extending to $OOFF and can ac-commodate 16,384 bytes of external RAM at locations $4000 to $7FFF. The top of this internal RAM $0030 to $OOFF
area is reserved for the stack. The stack starts at loca-tion $OOFF and extends downward a maximum of 64 locations to $OOCO. Unused stack locations may be used by the pro-gram for general storage. However, care must be exercised to avoid data being stored in these locations being over-written by stack operations.
3. EPROM 40 The IC 10 has 256 bytes of EEPROM 40 located at addresses $0100 through $O1FF.
4. INTERRUPT AND RESET VECTORS
The upper 16-bytes of =the memory map are re-served for interrupt vectors. The address assignments for each are described below:
$FFFE-FFFF: RESET VECTOR
This vector is used on processor reset. It has the highest priority of the eight interrupts.
$FFFC-FFFD: SOFTWARE INTERRUPT
This vector is used during execution of the SWI
instruction. It has the second-highest priority of the eight interrupts.

SFFFA-FFFB: EXTERNAL ASYNCHRONOUS INTERRUPT
This interrupt is assigned the third-highest priority of the eight interrupts. The external interrupt (IRQN pin) uses this vector.
$FFF8-FFF9: TIMER INTERRUPT
This interrupt is assigned the fourth-highest priority of the eight interrupts. It is used by the timer 60.
SFFF6-FFF7: COMPARATOR SUBSYSTEM INTERRUPT
This interrupt is assigned the fifth-highest priority of the eight interrupts. It is used by the com-parator subsystem 58.
$FFF4-FFF5: Af D SUBSYSTEM INTERRUPT
This interrupt is assigined the sixth-highest priority of the eight interrupts. It is used by the A/D
78.
$FFF2-FFF3: SERIAL PERIPHERAL INTERRUPT
This interrupt is assigned the seventh-highest priority of the eight interrupts. It is used by the SPI
subsystem 54.
$FFFO-FFF1: INCOM COMMUNICATION CONTROLLER INTERRUPT
This interrupt is assigned the lowest priority of the eight interrupts. It is used by the communication controller 29.
5. DATA TRANSFER AND CONTROL
Data transfer and control functions are imple-mented using byte-wide register interfaces accessed by the microprocessor 30 in its memory address space as defined in Table 7.
EEPROM CONTROL
The microprocessor 30 controls the operation of the EPROM 40 by a single read-write register NVCR, located in memory address space. FIG. 7 shows the format of this register. Reset clears this register to zero. This will configure the EEPROM 40 for normal read operation. A de-scription of the bit assignments for the NVCR register is provided below:

<~.

REGISTER ADDRESS MAP
ADDR REGISTER ADDR REGISTER ADDR REGISTER
$0000 PAD $0010 TSCH $0020 ADCR
5 $0001 PBD $0011 TSCL $0021 AMUX
$0002 PCD $0012 TCR $0022 ADC
$0003 PDD $0013 TSR $0023 ACFR
$0004 PAC $0014 TICH $0024 ADZ
$0005 PBC $0015 TICL $0025 AMZ
10 $0006 PCC $0016 TOCH $0026 AVSF
$0007 PDC $0017 TOCL $0027 ACSF
$0008 CMPST $0018 TCRH $0028 ICAH
$0009 CMPI $0019 TCRL $0029 ICAL
$000A SPCR $OO1A TARH $002A ICMO
15 $000B SPSR $001B TARL $002B ICM1 $000C SPD $OO1C NVCR $002C ICM2 $000D $OO1D PWM $002D ICM3 $000E $OO1E CFR $002E ICCR
$000F $OO1F TEST $002F ICSR
20 $OFFO DMC

NVCR[7...5]: Unused. These bits are reserved for device testing.
NVCR[4]: Byte Erase Select (BYTE). This bit selects byte erase operations. When set, it overrides the 25 row bit. If BYTE is set to a 1, erase operations effect the selected byte. If BYTE is set to zero, erase opera-tions are either row or bulk.
NVCR(3]: Row Erase Select (ROW). This bit selects row or bulk erase operations. If BYTE is set, 30 this bit is ignored. If ROW is set to a 1, erase opera-tions effect the selected row. If ROW is set to a 0, bulk erase is selected.
NVCR[2]: EEPROM Erase (ERASE). This bit con-trols erase operations in the following manner: If ERASE
35 is set to a 1, erase mode is selected. If ERASE is set to a 0, normal read or program mode is selected.
NVCR[1]: EEPROM Latch Control (EELAT). This bit controls EEPROM address and data latch operations as follows: If EELAT is set to a 1, address and data can be latched into the EEPROM 40 for programming or an erase operation. If EELAT is set to a 0, data can be read from the EEPROM 40. If an attempt is made to set both the EELAT and EEPGM bits in the same write cycle, neither will be set.
NVCR[0]: EEPROM Program V'oltage Enable (EEPGN).
This bit determines the operating mode of the EEPROM 40 as follows: If the EEPGM is set to a 1, the charge pump 44 is on and the resulting high voltage is applied to the EEPROM array. If EEPGM is set to 0, the charge pump generator is off. If an attempt is made to set both the EELAT and the EEPGM in the same write cycle, neither will be set. If a write to a EEPROM address is performed while the EEPGM bit is set, the write is ignored and the pro-gramming operation currently in progress is not disturbed.
These two safeguards prevent acciden'tal EEPROM 40 changes.
EEPROM OPERATION
Specifications for the EEPROM 40 are provided in Appendix A. An internal charge pump 44 avoids the neces-sity of supplying a high voltage 'for erase and program-ming. To reduce programming time, bulk, row and byte erase operations are supported.
The erase state of an EPROM byte is $FF. Pro-gramming changes ones to zeros. If any bit in a location needs to be changed from a zero to a one, the byte must be erased in a separate operation before it is reprogrammed.
If a new byte has no ones in bit positions which were al-ready programmed to zero, it is acceptable to program the new data without erasing the EEPROM byte first.
Programming and erasure of the EEPROM 40 relies on an internal,high voltage charge pump 44. The clock source for the charge pump 44 is the same as the A/D sub-system and is selected by ACFR[7,63 as discussed above.
Clock frequencies below 2 MHz reduce the efficiency of the charge pump 44 which increases the time required to pro-gram or erase a location. The recommended program and erase time is 10 ms when the selected clock is 2 MHz and should be increased to as much as 20 ms when the clock is between 1 MHz and 2 MHz. At least 10 ms should be allowed after changing the clock source for the charge pump 44 to stabilize.

~ ~.

The EEPROM 40 operation is controlled by the NVCR register. Various operations are performed by the EEPROM 40 as described below. Other processor operations can continue to be performed during EEPROM programming and erasure provided these operations do not require a read of the data from the EEPROM 40. The EEPROM 40 is discon-nected from the internal read/data bus 34 during program and erase operations.
To read data,from the EEPROM 40, the EELAT bit must be zero. When this, bit is cleared, the remaining bits in the NVCR register have no meaning or effect and the EEPROM 40 may be read as if it were a normal ROM.
During EEPROM 40 programming, the ROW and BYTE
bits are not used. The zero bits in a byte must be erased by a separate erase operation prior to programming. The following sequence of operations is required to initiate a programming cycle as follows:
1. Set the EELAT bit with EEPGM = 0 2. Store data to the EEPROM memory location 3. Set the EEPGM bit to turn on the high voltage 4. Wait 10 ms 5. Reset both EEPGM and EELAT bits to return to normal operation (clear NVCR) The following sequence of operations is required to initiate a bulk erase of the EEPROM memory as follows:
1. Set the ERASE and EELAT bits with EEPGM = 0 2. Write any data to any EEPROM address 3. Set the EEPGM bit to turn on the high voltage 4. Wait 10 ms 5. Reset ERASE, EELAT and EEPGM bit to return to normal operation (clear NVCR).
A row in the EEPROM 40 is a group of 16 bytes whose starting address is $xxNO and whose ending_address is $xxNF. The x's indicate don't care address bits. The N is the row number. This type of erase operation saves time compared to byte erase operations when large sections of EEPROM are to be erased. The sequence of operations required to initiate a row erase in the EEPROM 40 is as follows:
1. Set the ROW, ERASE and EELAT bits with EEPGM = 0 2. Write any data to any EEPROM address in the selected row 3. Set the EEPGM bit to turn on the high voltage 4. Wait 10 ms 5. Reset ROW, ERASE, EELAT and EEPGM bit to return to normal operation (clear NVCR) The dead-man circuitry 46 monitors the micropro-cessor 30 for proper operation. This function is a mask-enabled option that interacts with the microprocessor 30 through a single register (DMC) located at address $OFFO.
The dead-man circuitry may implemented as a 17-bit ripple counter that provides a timeout period of 32.8 milli-seconds at a bus rate of 4 MHz (262,144 oscillator cycles). If the counter overflows, a processor reset will occur and the device will be reinitialized.
The dead-man timer is reset by writing a zero to DMC[0]. This will reset the counter and begin the timeout period again. The location of the DMC register was chosen such that a normal bit manipulation instruction cannot re-set the timer. Only extended or indexed, 16-bit offset addressing modes can access this location.
DEAD-MAN INTERFACE REGISTER
The dead-man subsystem is controlled by a 1-bit register (DMC) located in memory address space. FIG. 8 defines the register's format.
DMC[O]: Dead-man Reset. This write-only bit is used to reset the dead-man timer. Writing a zero to it will reset the dead-man counter and restart the dead-man timeout time.
ANALOG SUBSYSTEM INTERFACE REGISTERS
The microprocessor 30 interface consists of seven registers (ADZ, AMZ, AMUX, ACSF, AVSF, ADC, and ADCR) located in the memory address space. The format of these registers is shown in FIG. 9.

ADZ: AjD Auto-zero Value. This 6-bit read-write register contains the offset correction value for the voltage input amplifier 80. The ADZ register is loaded with the correction value at the completion of an auto-zero sequence. A value of zero represents the in-trinsic positive offset built into the amplifier 80. As the ADZ value increases, the offset decreases. A least-significant-bit represents approximately 0.5 mV offset.
The correction value may be changed by writing to this regist'er. Write operations to the ADZ register are in-tended for diagnostic and verification purposes and are not intended in normal operation. The auto-zero sequence should provide the proper offset value for nominal device operation. At the completion of the auto-zero, the offset of the amplifier 80 should be in the range of 0 to -0.5 mV.
AMZ: Amplifier Auto-zero Value. This 6-bit read-write register contains the offset correction value for the current amplifier 90. The AMZ register will be loaded with the correction value at the completion of an auto-zero sequence. As the AMZ value increases, the off-set decreases. A least-significant-bit represents ap-proximately 0.5 mV offset. The correction value may be changed by writing into this register. Write operations to this register are intended for diagnostic and verifica-tion purposes and are not intended in normal operation.
The auto-zero sequence should provide the proper offset value for nominal device operation. At the completion of the auto-zero, the offset of the amplifier should be in the range of 0 to -0.5 mV.
ACSF: Current Scale Factor. This read-write register is used to control operation of the current input auto-ranging. The value written into this register deter-mines the current subsystem auto-ranging operating mode.
If a zero is written, the current subsystem is placed in auto-ranging mode. A nonzero value inhibits auto-ranging and sets the current mirror 92 into a fixed scale value.
Table 8 defines possible values for ACSF write operations.

Values other than these will cause unpredictable opera-tion.
This register is not a true read-write register.
The value read from it is not necessarily the value that 5 was written into it. Writing a zero into ACSF enables auto-ranging, however, a zero will never be read from the ACSF register. There are only five possible values that will be read: $10, $08, $04, $02, and $01.
The value read from this register is one of the 10 scale factors required to properly scale the 8-bit A/D
output. Five values are possible: xl, x2, x4, x8 and x16. Scale factors are shown in Table 8.

CURRENT SCALE FACTOR CONTROL VALUES

ACSF L7...0] MODE SCALE FACTOR
$00 Auto-ranging enable $10 Divide by 16 x 16 $08 Divide by 8 x 8 20 $04 Divide by 4, x 4 $02 Divide by 2 x 2 $01 Divide by 1 x 1 AVSF: Voltage Scale Factor. This read-write register is used to control operation of the voltage input 25 auto-ranging. The value written into this register deter-mines the voltage amplifier 80 auto-ranging operating mode. If a zero is written, the voltage amplifier 80 is placed in auto-ranging mode. A nonzero value inhibits auto-ranging and sets the voltage amplifier 80 in a fixed-30 gain mode of operation. Table 9 defines legal values for AVSF wri.te operations. Values other than these will cause unpredictable operation.
This register is not a true read-write register.
The value read from it is not necessarily the value that 35 was written into it. Writing a zero into AVSF enables auto-ranging, however, a zero will never be read from AVSF. There are only five possible values that will be read: $10, $08, $04, $02 and $01.

A/D VOLTAGE AMPLIFIER CONTROL VALUES
HARDWARE SOFTWARE
ACSF[7...01 MODE SCALE FACTOR
$00 Auto-ranging enable $01 x 16 gain x 1 $02 x 8 gain x 2 $04 x 4 gain x 4 $08 x 2 gain x 8 $10 x 1 gain x 16 The value read from this register is one of the scale factors required to properly scale the A/D output.
Five values are possible: xl, x2, x4, x8 and x16. Scale factors are shown in Table 9. This register should not be read or written to while a conversion is in progress.
AMUX: Input Multiplexer Controls. This 8-bit read-write register is used to select the MUXes 66 and 68 connected to the voltage and current input channels 62 and 64. The register is divided into two 4-bit fields; one for controlling the voltage input channels and the other for controlling the current input channels. It is also used to initiate the A/D conversion process. Writing to this register will initiate an A/D conversion.
AMUX[3...0]: A/D Channel Select. These four bits control operation of the voltage input channels 62 and 64. These bits are decoded as shown in Table 10.
Values indicated as "reserved" are dedicated to test and verification and should not be selected during normal operation. When the current channels 62 are selected (AMUX[3...0] = 1000), auto-ranging of the voltage ampli-fier 80 will be inhibited and the gain set to xl. If a nonzero value has previously been written into the AVSF
register, the selected gain will be used instead of an xl gain factor.

AID CHANNEL SELECT DECODE
AMUX AMUX
[3...0] SOURCE j3...01 SOURCE
0000 MUXO 1000 MXO (Current Channel) 0001 MUXi 1001 Reserved 0010 MUX2 1010 Reserved 0011 MUX3 1011 Reserved 0100 MUX4 1100 Reserved 0101 MUX5 1101 Reserved 0110 MUX6 1110 Temp. Sensor 0111 MUX7 1111 AVSS (0 volts) AMUX[7...4]: Current MUX Select. These four bits control operation of the current input channels 62.
Each bit controls a channel independent of the other three bits. Bits are assigned sequentially with AMUX[4] as-signed to input pin MUXO and AMUX[7] assigned to input pin MUX3. These bits have no effect if the associated channel is configured for voltage mode by the CFR register. A
zero in AMUX[7...4] connects the appropriate input pin(s) to digital ground (VSS), while a one connects the pin(s) to the current mirror 92 output. The currents can be summed by selecting multiple current inputs. If all four bits of this field are zero, no input channels are con-nected to the current mirror 92 output. Since the invert-ing input of the current amplifier 90 remains connected to the current mirror 92 output, the current amplifier 90 output will be low, and the current mirror 92 will have no current flowing out of it.
ADC: AID CONVERTER OUTPUT This read-only register is used to return the 8-bit output value. The least-significant bit is in ADC[0]. This value must be multiplied by the voltage and current scale factors found in ACSF and AVSF. Depending on the mode of operation, both scale factors may not be needed:
Voltage Inputs: The ADC register should be mul-tiplied by AVSF for all voltage inputs. The contents of ACSF register should not be used to scale a voltage read-ing.
Current Inputs: The ADC register should be mul-tiplied by the value in the ACSF register and then the AVSF register for scaling of the current subsystem output (MSO). If the voltage amplifier 80 is set to auto-rang-ing, the AVSF software scale factor will always be x16, since the voltage hardware gain will be forced to xl by the selection of MXO.
If an input voltage is converted that is not in the range of AVSS to VREF, the A/D converter will return either $00 (voltages less than AGND) or $FF (voltages greater than VREF). No additional indication is provided.
ADCR: A/D Subsystem Control This byte-wide register is used to control operation of the A/D 78. it is implemented as a read-write register to permit read-modify-write instructions to properly manipulate bits.
All command bits will read as zero. Control bits will read the current value of the control bit.
ADCR[0]: Unused. This bit is not used. The ADCR[0] bit will always read zero.
ADCR[1]: Sample Inputs. This control bit is used to close the four MUXes 108, 1:10, 112 and 114 that connect the pairs of channels 102, 104, 106 and 108 to-gether to form the sample and hold function. The channels are closed when ADCR[1] = 1 and open when ADCR[1] = 0.
ADCR[1] is set to zero by device reset. Each of the sample and hold switches 108, 110, 112 and 114 will close only if both channels it is associated with are configured in the voltage mode.
ADCR[2]: Initiate Auto--Zero Sequence. When this command bit is written with a one, the voltage and current amplifiers 80 and 90 will initiate an autozero se-quence. When the sequence is completed, the ADCR[6] bit will be set to a one. An interrupt will be generated, if enabled, at the completion of the autozero sequence. The ADCR[2] bit will always read 'zero'.

ADCR[3]: Integrator Reset. When this control bit is written with a one, the MUX 96 disconnects the MXO
pin from the current mirror 92 and shorts MXO to analog ground. The MUX 96 will remain shorted as long as this bit remains set. To open the MUX 96 a zero must be writ-ten to ADCR(3]. This bit will read the present state of the MUX 96.
ADCR(4]: Enable Interrupt. This control bit enables interrupts from the A/D subsystem 78. When the ADCR[4] bit is set to one, interrupts are enabled. The ADCR[4] bit will read the present state of the interrupt enable.
ADCR[5]: Acknowledge Interrupt And Operation Complete. This command bit resets the operation complete flags when written with a one. It will reset ADCR[6...7], removing the interrupt request from the processor.
ADCR[5] should be written with a one prior to initiation of another conversion. This bit will always read as a zero.
ADCR[6]: Auto-Zero Sequence Complete. This read-only status bit indicates the completion of an auto-zero sequence. It will be set to a one after completion of the auto-zero cycle. Registers ADZ and AMZ will be up-dated with the new value of offset correction calculated by the auto-zero sequence. This bi=t is reset by writing to the ADCR[5] bit with a one. The ADCR[6] bit cannot be written.
ADCR[7]: Conversion Complete. This read-only status bit indicates the completion of an A/D conversion cycle. It will be set to a one after completion of the A/D conversion and indicates that data is available in the ADC, ACSF, and AVSF registers. It is reset by writing the ADCR[5] bit with a one. This bit caiinot be written.
Af D SUBSYSTEM OPERATION
The A/D subsystem should be initialized during the power-up routine. The following initialization opera-tions are required.

The ACFR register should be written with the appropriate value to select the proper operating mode of the MUX4...MUX1 inputs. Care should be used when placing an input channel in the current mode, since this will 5 produce a low-impedance on the input pin.
The clock source and divider ratio should be selected with the ACFR[7,6] bits based on the applica-tion's crystal value. If the RC oscillator mask option is selected, the clock source should be set to internal 10 (ACFR[7] = 0). The ACFR(5] bit should be written with a one to enable A/D operation.
The control register (ADCR) should be written with an appropriate value. Bits 1, 3 and 4 should be set to establish initial operation conditions. An auto-zero 15 sequence should be initiated by setting the bit ADCR[2] =
1. This will cause the offset voltages in the voltage and current amplifiers 80 and 90 to be canceled and the ADZ
and AMZ registers to be set to the correct values.
The two scale factor registers (ACSF and AVSF) 20 should be initialized. If auto-ranging is desired, a zero should be written into both registers, otherwise the re-quired scale factors should be selected.
OPERATION WITH VOLTAGE INPUTS
To initiate a conversion of a voltage input, the 25 AMUX register should be written with a value that contains the desired input channel in the low-order four bits and the present current switch selection in the high-order four bits. This will start the conversion of the selected voltage input. When the conversion is complete, an in-30 terrupt will be generated (if enableci) and the ADCR[7] bit will be set. The ADCR[5] bit should be written with a one to clear the interrupt and acknowledge the operation com-plete flag. This will reset the ADCR[7] bit. The conver-sion value is read from ADC register and then multiplied 35 by the value in the AVSF register to produce a 12-bit value. It should be noted that a voltage gain factor of xl produces a scale factor of x16. Moreover, it is not intended to write to the AVSF register prior to each conversion. The ADCR[7] bit must be cleared after every conversion operation by writing to the ADCR[5] bit with a one.
OPERATION WITH CURRENT INPUTS
To initiate a conversion of a current input, the AMUX register should be written with a value that contains $8 in the low-order four bits and the present current switch selection in the high-order four bits. This will start the conversion of the MXO input. When the conver-sion is complete, an interrupt will be generated (if en-abled) and ADCR[7] will be set. ADCR[5] should be written with a one to clear the interrupt and acknowledge the operation complete flag. This will reset ADCR[7]. The conversion value is read from the ADC register and then multiplied by AVSF and ACSF to produce a 16-bit value. If voltage auto-ranging has been,enabled by writing AVSF with a zero, it is not necessary to multiply the result by AVSF
as long as a 12-bit result is desired. It should be noted that a voltage gain factor of Xl produces a scale factor of X16. As long as AVSF is not written with an overriding gain factor, the X16 scale factor can be ignored for cur-rent conversiqns.
There is no need to write AVSF or ACSF prior to each conversion. ADCR[7] must be cleared after every con-version operating by writing ADCR[5] with a one.
The A/D subsystem generates a synchronous inter-rupt at vector address $1FF4-1FF5. The interrupt must be acknowledged prior to resetting the 1 bit in order to not reprocess the interrupt.
OUADCOMPARATOR SUBSYSTEM OPERATION
1. OUADCOMPARATORS SUBSYSTEM
Four individual inverting comparators are avail-able. The non-inverting input of each is referenced to +1.25 volts. The comparators are discussed in detail be-low. Specifications for the subsystem are provided in Ap-pendix B. The comparator output states can be read from a register (CMPST) and can also be directly connected to the least significant four output pins of port C. One com-parator, 200 interrupts on both rising and falling output signals while the other three comparators interrupt only on rising outputs.
The quadcomparator subsystem 58 is controlled by 4 bits of the Configuration Register as defined in FIG. 6.
CFR[3...0]: Comparator Mode Control. These four configuration bits enable the comparator outputs to be ORed with the least-significant four bits of port C. A
zero in a configuration bit enables the OR operation for the associated port pin. In this mode, each output pin will be low during device reset if the respective compara-tor input is above the threshold vol'tage (+1.25 V). A re-set will clear the port C output register making the out-put pin only a function of the comparator input. When the microprocessor 30 writes a 1 into this port output regis-ter bit, the corresponding output pin will be forced high independent of the state of the comparator input.
A one in these configuration bits disables the OR operation. In this mode, the port pins behave as nor-mal port pins. The configuration bits are assigned se-quentially, with CFR[0] controlling PCO/CMPO and CFR[3]
controlling PC3/CMP3. See Table 11 for assignments.

COMPARATOR MODE CONTROL
CFR[3]: PC3/CMP3 CFR[2]: PC2/CMP2 CFR[1]: PC1/CMP:1 CFR[0]: PCO/CMPO
The comparator subsystem 58 communicates with the microprocessor 30 through a set of two control and status registers (CMPI and CMPST) :Located in memory ad-dress space. The state of each comparator output can be read through the CMPST register. An external interrupt facility is provided to generate interrupts on selected edges of the comparator outputs. These comparators have approximately 20 mV of hysteresis. FIG. 10 shows the for-mat of these registers.

CMPI REGISTER
CMPI[7...4]: Interrupt Acknowledge. These four command bits are used to reset the interrupt request generated by the quadcomparator subsystem 58. They always read as zero. When a one is written into a command bit, the corresponding interrupt request is cleared. These four bits are not read-write registers. The interrupt re-quest must be reset prior to clearing the 1-bit to prevent reprocessing the interrupt. Bit assignments are defined in Table 12.

CMPIj7...41 BIT ASSIGNMENTS
CMPI[4]: CPO
CMPI[5]: CP1 CMPI[6]: CP2 CMPI[7]: CP3 CMPI[3...0]: Interrupt Enable. These four con-trol bits are used to enable the comparator interrupts. A
one enables a comparator interrupt, while a zero disables it. They are true enables in that transitions prior to the enable will be ignored. Clearing the enable with an interrupt pending will remove the interrupt request.
These four bits are implemented as true read-write regis-ters. Bit assignments are defined in Table 13.

CMP[3...01 BIT ASSIGNMENTS
CMP[0]: CPO
CMP[1]: CP1 CMP[2]: CP2 CMP[3]: CP3 CMPST REGISTER
CMPST[7...4]: Interrupt Request. These four read-only status bits indicate which comparator inter-rupt(s) are active. They are read to determine the cause of the microprocessor interrupt. A one indicates an in-terrupt request for its respective comparator output. Bit assignments are defined in Table 14.

CMPST[4]: CPO
CMPST[5]: CP1 CMPST[6]: CP2 CMPST[7]: CP3 CMPST[3...0]: Comparator Output. These four read-only status bits indicate the state of the four com-parator outputs. A one indicates the comparator output is high and that the comparator input is below the threshold.
Bit assignments are defined in Table 15.

CMPST[0]: CPO
CMPST[1]: CP1 CMPST[2]: CP2 CMPST[3]: CP3 The comparator subsystem 30 generates a syn-chronous interrupt at vector address $FFF6-$FFF7.
2. B+ COMPARATOR 50 The B+ comparator 50 is discussed in detail be-low. This comparator is provided for power supply genera-tion (see FIG. 45B). The negative input of this compara-tor is connected to the VREF pin (+2.5 V nominal). The positive pin is BSENSE. The comparator output is located at BDRIVE. Comparator specifications are provided in Ap-pendix B.
3. A COMPARATOR 49 The A comparator 49 is utilized with the com-munication controller 29 receiver circuits. Both invert-ing (ANEG) and non-inverting (APOS) inputs are available as input pins. The output is AOUT. This comparator pri-marily operates at input voltages near VREF. Specifica-tions for this comparator are provided in Appendix C.
4. PWM SUBSYSTEM 61 A pulse width modulated output 61 may be pro-vided by circuitry on output pin PWM. This output is a periodic signal whose high-to-low ratio is controlled by the 8-bit value stored in the PWM register. The input to the 8-bit pulse width modulator is the processor's phase 2 clock divided by 4, which results in a PWM period of 0.2778 ms when the 3.6864 MHz crystal is used. The PWM
base frequency is the crystal frequency divided by 1024.
The PWM subsystem is not controlled by the Configuration 5 Control Register.
INTERFACE REGISTERS
The PWM subsystem 61 is controlled by a single 8-bit register (PWM) located in memory address space.
FIG. 10 defines the register's format.
10 PWM: PULSE WIDTH MODULATOR RATIO
The ratio of high-to-low signal levels on the PWM pin is determined by the value in the PWM register.
The eight bits of the PWM are taken as the numerator (N) of a fraction whose denominator is 256. This fraction de-15 termines what proportion of the time the PWM pin will be high. If N = 0, the PWM pin will remain low. If N = $80, the duty cycle will be 50%. After a reset, both the PWM
register and the internal counter register will be set to zero and the PWM output will be low. When the PWM regis-20 ter is written with a non-zero value, the PWM output will go high two PH2 cycles after the write is completed. The output will remain high for the specified width and then go low for the remainder of the PWM cycle. The output pulse will repeat itself continuous:Ly within the PWM cycle 25 until a new value is written to the PWM register. The new pulse width will become valid after the completion of the current PWM cycle. The PWM register is double-buffered such that a new value written into the PWM register will take effect. only at the start of a PWM count sequence.
30 This will prevent producing spurious output pulse widths.
If the value written to the PWM register is zero, the output will stay low after the current PWM cycle is completed. A zero value in the PWM register will dis-able the PWM until a non-zero value is written. Start-up 35 of the PWM after a non-zero value is written will always be two PH2 clock cycles after completion of the write to the PWM register. This will ensur.e the start of the PWM
cycle at a defined point in time.

5. PROGRAMMABLE TIMER 60 The IC 10 contains a single 16-bit programmable timer 60 with dual output compare registers. The timer is driven by the output of a fixed divide-by-four prescaler operating from the microprocessor 30 phase 2 clock. It can be used for many purposes, including input waveform measurements, while simultaneously generating an output waveform. Pulse widths can vary from several microseconds to many seconds. The timer 60 is also capable of generat-ing periodic interrupts or indicating passage of an arbi-trary number of internal clock cycles. A block diagram of the timer is shown in FIG. 11. Timing diagrams are shown in FIGS. 12(a)-12(d).
Because the timer has a 16-bit architecture, each specific functional capability is represented by two registers. These registers contain the high and low byte of that function. Generally, accessing the low byte of a specific timer function allows full control of that func-tion; however, an access of the high byte inhibits that specific timer function until the low byte is also ac-cessed. The 1-bit in the condition code register should be set while manipulating both the high and low byte register of a specific timer function to ensure that an interrupt does not occur. This prevents interrupts from occurring between the time that the high and low bytes are accessed.
The key element in the programmable timer is a 16-bit free running counter preceded by a prescaler which divides the microcontroller internal phase 2 clock by four. The prescaler gives the timer a resolution of 2.00 s assuming a crystal frequency of 4 MHz. The counter is clocked to increasing values during the low portion of the internal phase 2 clock. Software can read the counter at any time without affecting its value.
The double byte free running counter can be read from either of two locations: the counter register (TCRH, TCRL), or the alternate counter register (TARH, TARL). A
read sequence containing only a read of the least signifi-cant byte of the counter register will receive the counter value at the time of the read. If a read of the counter at either location first addresses the most significant byte, it causes the least significant byte to be trans-ferred to a buffer. This buffer value remains fixed after the first most significant byte read, even if the user reads the most significant byte several times. The buffer is accessed when reading the counter register (TCRL) or alternate counter register (TARL) least significant byte, .10 and thus completes a read sequence of the total counter value. In reading either the counter register or alter-nate counter register, if the most significant byte is read, the least significant byte must also be read in or-der to complete the sequence.
The free running counter cannot be loaded or stopped by the program. During a power-on-reset or device reset, the counter is set to $FFFC and begins running af-ter the oscillator start-up delay. Because the counter is 16 bits and is preceded by a fixed divide-by-four pre-scaler, the value in the counter repeats every 262,144 MPU phase 2 clock cycles. When the counter rolls over from $FFFF to $0000, the timer overflow flag bit (TOF) is set. An interrupt can also be enabled when counter rollover occurs by setting its interrupt enable bit (TOIE).
The programmable timer capabilities are provided by using the following twelve addressable 8-bit registers.
Note that the names high and low represent the signifi-cance of the byte. The format of these registers is shown in FIG. 13.
The timer has two 16-bit output compare regis-ters. Each consists of two 8-bit registers. The primary output compare register consists of TOCH and TOCL, with TOCH the most significant byte. The secondary output com-pare register is TSCH and TSCL. These output compare registers can be used for several purposes such as con-trolling output waveforms or indicating when a period of time has elapsed. These registers are unique in that all ,..

bits are readable and writeable and are not altered by the timer hardware. Reset does not affect the contents of these registers, and if the compare function(s) are not utilized, the four bytes of these registers can be used as storage locations.
The contents of each output compare register is compared with the contents of the free running counter every fourth rising edge of the phase 2 clock. If a match is found, the corresponding output compare flag (POCF or SOCF) bit is set and the corresponding output level (PLVL
or SLVL) bit is clocked to the appropriate output level latch. The values in the output compare register and the output level bit should be changed after each successful comparison in order to control an output waveform or es-tablish a new elapsed timeout. An interrupt can also ac-company a successful output compare, provided the cor-responding interrupt enable bit, OC:CE, is set.
After a processor write cycle to the output com-pare register containing the most significant byte (TOCH
or TSCH), the corresponding output compare function is in-hibited until the least significant byte is also written.
The user must,write both bytes if the most significant byte'is written. A write made only to the least signifi-cant byte will not inhibit the compare function. The free running counter is updated every four internal phase 2 clock cycles due to the internal prescaler. The minimum time required to update the output compare register is a function of the software program rather than the internal hardware.
A processor write may be made to either byte of the output compare register without affecting the other byte. A valid output compare must occur before the output level bit becomes available at the output compare pin:
TCMP.
Because neither the output compare flag (POCF
SOCF) or output compare registers are affected by reset, care must be exercised when initializing the output compare function with software. Ttie following procedure is recommended:
1. Write to the high byte of the output compare register to inhibit further compares until the low byte is written.
2. Read the timer status register to clear the output compare flag if it is already set.
3. Write to the low byte of the output compare register to enable the output compare function with the output compare flag clear.
The objective of this procedure is to prevent the output compare flag from being set between the time it is read and the write to the output compare register. A
software example is shown below.

INHIBIT OUTPUT COMPARE

OCF BIT IF SET

READY FOR NEXT COMPARE
The two 8-bit registers (TICH, TICL) which make up the 16-bit input capture register, are read-only and are used to latch the value of the free running counter after a defined transition is sensed by the input capture edge detector. The level transition which triggers the counter transfer is defined by the input edge bit (IEDG).
Reset does not affect the contents of the input capture registers.
The result obtained by an input capture will be one more than the value of the free running counter on the rising edge of the phase 2 processor clock preceding the external transition (refer to the timing diagram shown in FIG. 12). This delay is required for internal syn-chronization. Resolution is affected by the prescaler al-lowing the timer to only increment every four phase 2 clock cycles.
The free running counter contents are trans-ferred to the input capture register on the proper signal transition regardless of whether the input capture flag (ICF) is set or clear. The input capture register always contains the free running counter value which corresponds to the most recent input capture.
5 After a read of the most significant byte (TICH) of the input capture register, counter transfer is in-hibited until the least significant byte of the register is also read. This characteristic forces the minimum pulse period attainable to be determined by the time used 10 in the capture software routine and its interaction with the main program. For example, a polling routine using instructions such as BRSET, BRA, LDA, STA, INCX, CMPX, and BEQ might take 34 internal phase 2 cycles to complete.
The free running counter increments every four processor 15 clock cycles due to the prescaler.
A read of the least significant byte (TICL) of the input capture register does not inhibit the free run-ning counter transfer. Minimum pulse periods are ones which allow software to read the least significant byte 20 and perform needed operations. There is no conflict be-tween the read of the input capture register and the free running counter transfer since they occur on opposite edges of the internal processor clock.
TIMER CONTROL REGISTER
25 The timer control register (TCR) is a read-write register which contains five control bits. Three of these bits control interrupts associated with each of the three flag bits found in the timer status register. The other two bits control: 1) which edge is significant to the 30 capture edge detector; and 2) the next value to be clocked to the output level latch in response to a successful out-put compare. The timer control register and the free run-ning counter are the only sections of the time affected by reset. The output compare pin (SCMP) is forced low during 35 external reset and stay low until a valid compare changes it. The timer control register bit assignment is defined in FIG. 13.

TCR[0]: Primary Output Level (PLVL). The value of the primary output level bit (PLVL) is clocked into its output level latch by a successful output compare and will appear on the output compare pin PCMP. PLVL and the pri-mary output level latch are cleared by reset. A zero in PLVL produces a low output level on PCMP.
TCR[1]: Input Edge Polarity (IEDG). The value of the input edge (IEDG) bit determines which level tran-sition on the PD7/TCAP pin will trigger a free running counter transfer to the input capture register. Reset.
does not affect the IEDG bit. A zero selects the falling edge.
TCR[2]: Secondary Output Level (SLVL). The value of the secondary output level bit (SLVL) is clocked into its output level latch by a successful output compare and will appear on the secondary output compare pin SCMP.
SLVL and the primary output level latch are cleared by re-set. A zero in SLVL produces a low output level on SCMP.
TCR[4]: Secondary Output Compare Interrupt En-able (SCIE). If the secondary output compare interrupt enable (SCIE) bit is set, a timer interrupt is enabled whenever the SOCF status flag is set. If the SCIE bit is clear, the interrupt is inhibited. This bit is cleared by reset.
TCR[5]: Timer Overflow Interrupt Enable (TOIE).
If the timer overflow interrupt enable (TOIE) bit is set, a timer interrupt is enabled whenever the TOF status flag (in the timer status register) is set. If the TOIE bit is clear, the interrupt is inhibited. The TOIE bit is cleared by reset.
TCR[6]: Primary Output Compare Interrupt Enable (OCIE). If the primary output compare interrupt enable (OCIE) bit is set, a timer interrupt is enabled whenever the POCF status flag is set. If the OCIE bit is clear, the interrupt is inhibited. This bit is cleared by reset.
TCR[7]: Input Capture Interrupt Enable (ICIE).
If the input capture interrupt enable (ICIE) bit is set, a timer interrupt is enabled when the ICF status flag (in the timer status register) is set. If the ICIE bit is clear, the interrupt is inhibited. The ICIE bit is cleared by reset.
TIMER STATUS REGISTER
The timer status register (TSR) is a 4-bit register containing read-only status information. These four bits indicate the following:
~ A proper transition has taken place at the TCAP
pin with an accompanying transfer of the free running counter contents to the input capture register.
~ A match has been found between the free running counter and one of the output compare registers.
~ The free running counter contains $FFFF (timer overflow).
The timer status register is illustrated in FIG.
13. The timing diagrams shown in FIG. 12 illustrate the timing relationships to the timer status register bits.
TSR[4]: Secondary Output: Compare Flag (SOCF).
The secondary output compare flag (SOCF) is set when the primary output compare register matches the contents of the free running counter. The SOCF is cleared by access-ing the timer status register (with SOCF set) and then writing the low byte of the secondary output compare register. Reset does not affect the: secondary output com-pare flag.
TSR[5]: Timer Overflow Flag (TOF). The timer overflow flag (ROF) bit is set by a transition of the free running counter from $FFFF to $0000. It is cleared by ac-cessing the timer status register (with TOF set) followed by an access of the free running counter least significant byte. Reset does not affect the TOF bit.
TSR[6]: Primary Output Compare Flag (POCF).
The primary output compare flag (POCF) is set when the primary output compare register matches the contents of the free running counter. The POCF is cleared by access-ing the timer status register (with POCF set) and then writing the low byte of the primary output compare regis-ter. Reset does not affect the primary output compare flag.
TSR[7]: Input Capture F'lag (ICF). The input capture flag.(ICF) is set when the selected edge has been sensed by the input capture edge detector. It is cleared by a processor access of the timer status register (with ICF set) followed by accessing the low byte of the input capture register. Reset does not affect the input compare flag.
Accessing the timer status register.satisfies the first condition required to clear 'any status bits which happen to be set during the access. The only re-maining step is to provide an access of the register which is associated with the status bit. Typically, this pre-sents no problem for the input capture and output compare function.
A problem can occur when using the timer over-flow function and reading the free running counter at ran-dom times to measure an elapsed time. Without incorporat-ing the proper precautions into software, the timer over-flow flag could unintentionally be cleared if: 1) the timer status register is read or written when TOF is set;
and 2) the least significant byte of the free running counter is read but not for the purpose of servicing the flag. The counter alternate register contains the same value as the free running counter; therefore, this alter-nate register can be read at any time without affecting the timer overflow flag in the timer status register.
During the WAIT instruction, the programmable timer continues to operate normally and may generate an interrupt to trigger the CPU out of the wait state. The STOP instruction has been disabled in the IC 10.
5. SERIAL PERIPHERAL INTERFACE 54 The serial peripheral interface (SPI) subsystem 54 is designed to provide efficient connection of peri-pheral devices that communicate over a serial bus. It may also be used for interprocessor communication in a multi-processor system. The SPI supports several versatile operating modes that permit connection of devices that communicate using various protocols. The SPI is essen-tially an 8-bit shift register with separate pins for in-coming and outgoing data, a pin for clock, and a fourth pin for device select functions. The following features are supported by the SPI: full duplex, three-wire syn-chronous transfers; master or slave operation; four pro-grammable master bit rates; programmable clock polarity and phase; end of transmission interrupt flag; write col-lision flag protection; and master--master mode fault pro-tection capability.
The SPI is controlled by three registers SPD, SPSR and SPCR located at memory addresses: $OC, $OB and $OA, respectively.
The SPI can be used in two basic types of sys-tems: single master and multi-master. FIG. 14 illus-trates the basic connections for both of these system types. As shown, the MOSI, MISO and SCK pins are all wired to equivalent pins on each of the four devices. The master device generates the SCK clock, and the slaves all receive it. Slave device selection is accomplished by three port pins wired to the three individual slave select pins on the slave devices. A slave device is selected when the master pulls its SSN pin low. As the master transmits data on MOSI (output), selected slaves receive it on MOSI (input). Care must be taken if multiple slaves are selected to avoid bus contention on MISO. Only one slave device can drive the MISO pin. As data is shifted out of the master on MOSI, it is shifted in on MISO. if the slave device is receive only, it needs no connection to MISO.
A more complex multi-master system is shown in FIG. 15. Here the slave select lines are generated by more than one potential master device. Only one master may control the select lines at any one time. An exchange of master control must be implemented using a handshake method through the I/O ports or by an exchange of coded messages through the serial peripheral interface system.

The major device control that is used in this system is the MSTR bit in the SPCR and the MODF bit in the SPSR.
Four pins are connected to the serial peripheral interface subsystem 54. Operation of two of these pins 5 (MOSI and MISO) is dependent on the SPI data pin mask op-tion selected.
MOSI; Master Out Slave In. Operation of this pin is determined by the SPI data pin mask option selected. If the bidirectional option is selected, the 10 MOSI pin is bidirectional and is coinfigured as a data out-put in a master mode device and as a data input in a slave mode device. If the unidirectional option is selected, the MOSI pin is always an output. Data is transferred serially from a master to a slave device on this line;
15 most significant bit first. The timing diagrams of FIG.
16 show the relationship between data and clock (SCK). As shown, four possible timing relationships may be chosen by using control bits CPOL and CPHA. The master device al-ways allows data to be applied ozz the MOSI pin a half-20 cycle before the clock edge in order for the slave de-vice(s) to latch the data. It should be noted that both the master and slave devices must be programmed for simi-lar timing modes for proper data transfer.
When the master device transmits data to a slave 25 device via the MOSI line, the slave responds by sending data to the master device using its MISO pin if the bi-directional option is selected; or its MOSI pin, if the unidirectional option is selected. This full duplex transmission is synchronized with the same clock edge for 30 both transmission and reception of data. The internal data strobe always uses the opposite phase of the clock from the edge used to shift data in and out. The byte transmitted is replaced by the byte received and elimi-nates the need for separate transmit-empty and receiver-35 full status bits. A single status bit (SPIF) is used to signify that the I/O operation is complete.
Configuration of the MOSI pin is a function of the MSTR bit in the SPCR and the selected SPI data pin mask option. If the mask option selected is unidirec-tional, the MOSI pin is always an output. If the mask op-tion selected is bidirectional, the MOSI pin is an output when the MSTR bit is a one and an input when the MSTR bit is a zero.
MISO: Master In Slave Out. Operation of this pin is determined by the SPI data pin mask option. If the bidirectional mask option is se:lected, the MIXO pin is bidirectional and is configured as a data input in a mas-ter mode device and as a data output in a slave mode de-vice. If the unidirectional mask option is selected, the MISO pin is always an input. 7Cn this manner, data is transferred serially from a slave to a master, most sig-nificant bit first. When configured as a slave, the MISO
and MOSI pins are placed in the hiLgh-impedance state if not selected by a low on the SSN pin. As shown in FIG.
16, four timing relationships are possible by using the control bits CPOL and CPHA. The master device always ap-plies data on the MOSI line a half-cycle before the selected clock edge on SCK in order for the slave to have adequate data setup time.
When the master mode device transmits data to a slave mode device via the master's MOSI pin, the slave de-vice responds by sending data to the master via the master's MISO pin. This full duplex transmission synchro-nizes both data out and data in with the same clock edge of the SCK supplied by the master device. A single status bit (SPIF) in the SPSR is used to signify that the I/O
operation is complete.
In the master mode device, the MSTR control bit in the SPCR is set to a one by the program to configure the device to receive data on its MISO pin. In the slave device, its MISO pin (or MOSI pin of unidirectional mask option is selected) is enabled by the low level on the SSN
pin. If SSN is high in a slave mode device, the MISO and MOSI pins are placed in the high-impedance state.
SCK: Serial Clock. The serial clock is used to synchronize the movement of data both in and out of the device through its MOSI and MISO pins. The master and slave devices are capable of exchanging a data byte of in-formation during a sequence of eight clock pulses. Since the SCK is generated by the master mode device, the SCK
pin becomes an input on all slave devices and synchronizes slave data transfer. The type of c:Lock and its relation-ship to data are controlled by the CPOL and CPHA bits in the SPCR discussed below. Refer to FIG. 16 for timing.
The master mode device generates the SCK through a circuit driven by the interna:l processor clock. Two bits (SPRO and SPR1) in the SPCR of the master device select the clock rate. The master device uses the SCK to latch incoming slave device data on the MISO line and shifts out data to the slave mode device on the MOSI pin.
Both master and slave mode devices must be operated in the same timing mode as controlled by the CPOL and CPHA bits in the SPCR. In the slave mode device, SPRO and SPR1 have no effect on the operation of the SPI.
SSN: Slave Select. This low-true input pin is used to enable slave mode device data transfer. To ensure that data will be accepted by a slave mode device, the SSN
pin must be low prior to occurrence of SCK and must remain low until after the last (eighth) SCK cycle. FIG. 16 il-lustrates the relationship between SCK and the data for different combinations of CPHA and CPOL. When SSN is first pulled low in a slave mode device, the following events occur:
1. The appropriate output pin is driven with the first data bit. If the SPI data pin option is bidirectional, this is the. MISO pin. If the unidirectional option is selected, this is the MOSI pin.
2. The slave mode device is prevented from writing to its data register when CPHA = 0.
The description of the WCOL status flag in the SPSR contains more information of the effects that the SSN
input and CPHA have on the I/O data register. A high on SSN in the slave mode device forces the appropriate output r.W. , pin to the high-impedance state. Also, SCK and the appro-priate input pin are ignored by a slave mode device when its SSN pin is high.
When a device is in the master mode, it con-stantly monitors its SSN input for a low level. The master device will become a slave mode device any time its SSN input is driven low. This ensures that there is only one master controlling the SSN line for a particular sys-tem. When the SSN pin is detected to be low, it clears the MSTR bit in the SPCR. Also, control bit SPE in the SPCR is cleared, which causes the SPI to be disabled. The MODF flag bit in the SPSR is also set to indicate to the program that another device is attempting to become a master. Two devices attempting to be masters is normally the result of a software error; however, a system could be constructed which would employ this error detection to provide a 'backup master' to restart a faulted system.
INTERFACE REGISTERS
The SPI is controlled by three registers: SPD, SPSR, and SPCR. These registers provide control, status and data storage functions for the SPI. FIG. 17 defines the registers,formats.
SPD: Serial Data Register. This 8-bit read-write register is used to transmit and receive data on the synchronous serial bus. Only a write to this register will initiate transmission and reception of another byte and this will only occur in the master mode device. A
slave mode device writing to its SPD register will not initiate a transmission. At the completion of transmit-ting a byte of data, the SPIF status bit is set in both the master and slave's SPSR. A write or read of the SPD, after accessing the SPSR with SPIF set will clear the SPIF.
During the clock cycle that the SPIF bit is being set, a copy of the received data byte in the shift register is moved to a buffer. When the program reads the SPR, the buffer is actually read. During an overrun con-dition, when the master device has sent several bytes of data and the slave device has not internally responded to clear the first SPIF, only the first byte is contained in the receive buffer of the slave device; all others are lost. The program may read the buffer at any time. The first SPIF must be cleared by the time a second transfer of data from the shift register to the read buffer is ini-tiated, or an overrun condition will exist.
A write to the SPD is not buffered and places data directly into the shift register for transmission.
The ability to access the SPD is limited when a transmis-sion is in progress. It is important to read the discus-sion defining the WCOL and SPIF status bits to understand the limits on using the SPD.
SPSR: SPI Status Register. This 3-bit, read-only register is used to indicate the operational status of the SPI. Two of these status flags (SPIF and MODF) will generate an interrupt when set if interrupts are en-abled by the SPIE control bit in the SPCR.
SPSR[7] - SPIF: Transfer Flag. This status flag indicated that a data transfer between the device and an external device has been completed. With the comple-tion of the transfer. SPIF is set, and if SPIE = 1, an SPI
interrupt is generated. During the clock cycle that SPIF
is being set, a copy of the received data byte in the shift register is moved to the receive buffer register.
When the SPD is read, it is the receive buffer register that is actually read. During an overrun condition, when the master device has sent several. bytes of data and the slave device has not responded to the first SPIF, only the first byte sent is contained in the: receive buffer regis-ter and all others are lost.
The transfer of data is iniitiated by the master mode device writing to its SPD. Clearing the SPIF is ac-complished by a software sequence of accessing the SPSR
while SPIF is set, followed by a write or read of the SPD.
While SPIF is set, all writes to the SPD are inhibited un-til the SPSR is read. This occurs in the master device.
In the slave device, SPIF can be cleared using a similar sequence during a second transmission; however, it must be cleared before the second SPIF in order to prevent an overrun condition. The SPIF bit is cleared by reset.
SPSR[6] - WCOL: 'Write Collision. This opera-5 tion flag is set when an attempt is made to write to the SPI data register (SPD) while data transfer is taking place. The transfer continues uninterrupted, and the write operation will be unsuccessful. A read collision will never occur, since the received data byte is placed 10 in the receiver buffer register in which access is always synchronous with the processor operation. If a write col-lision occurs, WCOL is set, but no SPI interrupt is gener-ated until the transfer has been completed. The WCOL bit is a status flag only.
15 Clearing the SCOL is accomplished by a software sequence of accessing the SPSR while: WCOL is set, followed by 1) a read of the SPD prior to the SPIF bit being set, or 2) a read or write of the SPD after the SPIF bit is set. A write to the SPD prior to the SPIF bit being set 20 will result in generation of another WCOL status flag.
Both SPIF and WCOL bits will be cleared in the same se-quence. If a second transfer has started while trying to clear the previously set SPIF and WCOL bits with a clear-ing sequence containing a write to the SPD only the SPIF
25 bit will be cleared.
A collision of a write to the SPD, while an ex-ternal data transfer is taking place can occur in both the master mode and the slave mode of operation, although, with proper programming the master device should have suf-30 ficient information to preclude this collision. Collision in the master mode device is defined as a write of the SPD
while the internal clock (SCK) is in the process of trans-fer. The signal on the SSN pin must always be high on the master mode device.
35 A collision in a slave device is defined in two separate modes.
~ One problem arises in a slave device when the CPHA control bit is zero. When CPHA is zero, data is latched with the occurrence of the first clock transition. The slave device does not have any way of knowing when that transition will occur; therefore, the slave device colli-sion occurs when it attempts to write the SPD
after its SSN pin has been pulled low. The SSN
pin of the slave freezes the data in its SPD and does not allow it to be altered if the CPHA bit is zero. The master device must raise the SSN
pin of slave devices betwesen each byte it trans-fers.
~ The second collision mode is defined for the state of the CPHA equal to one. With CPHA set, the slave device will be receiving a clock (SCK) edge prior to the latch of the first data trans-fer. This first clock edge will freeze the data in the slave's SPD and drive the most signifi-cant bit of the register onto the MISO pin of the slave mode device. The SSN pin low state enables the slave device, but the MISO pin en-able does not take place until the first SCK
clock edge. The WCOL bit: will only be set if the SPD is accessed while a transfer is taking place. By definition of the second collision mode, a master device might hold a slave's SSN
pin low during a transfer of several bytes of data without a problem.
A special case of WCOL occurs in the slave de-vice. This happens when the master device starts a trans-fer sequence (an edge or SCK for CPHA = 1; or an active SSN transition for CPHA = 0) at the same time the slave device processor is writing to its SPD. In this case, the data byte written by the slave processor is lost and the previous contents of the SPD will be transferred to the master mode device's SPD. Because the master mode device receives back the last byte transmitted to the slave, the master device can detect that a fatal collision occurred if the software protocol is appropriately designed.

Since the slave mode device is operating asyn-chronously with the master device, the WCOL bit may be used as an indicator of a collision occurrence. The soft-ware communication protocol should be designed to accommo-date the collisions that may be generated by this asyn-chronous operation.
The WCOL bit is cleared by reset.
SPSR[4] - MODF: Mode Fault. The function of this flag is defined for the master mode of operation. If the device is a slave, the MODF bit will be prevented from toggling from a zero to a one; however, this does not pre-vent the device from being in the slave mode with MODF
set. The MODF bit is normally zero and is set only when the master device has its SSN pin pulled low. Setting the MODF bit affects the internal SPI subsystem in the follow-ing ways:
1. MODF is set and an SPI interrupt is generated if SPIE = 1.
2. The SPE bit is forced to zero. This blocks all output drive on the SCK, MOSI and MISO pins.
The SPI subsystem is disabled.
3. The MSTR bit is forced to zero, thus placing the device in the slave mode.
Clearing the MODF is accomplished by a software sequence of accessing the SPSR while MODF is set followed by a write to the SPCR. Control bits SPE and MSTR may be restored to their original set state during this clearing sequence, or after the MODF bit has been cleared. The hardware does not allow the program to set the SPI and MSTR bit while MODF is a one, unless it is during the proper clearing sequence. The MODF flag bit indicates that there might have been a multi-master conflict for system control and allows a proper exit from system opera-tion to a reset or default system state. The MODF bit is cleared by reset.
SPCR: SPI Control Register. This 7-bit is used to control operation of the SPI subsystem. It is imple-mented as a read/write register to permit read-modify-write instructions to properly manipulate bits.
SPCR[7] - SPIE: Interruipt Enable. When this bit is a one, it allows the occurrence of a processor in-terrupt. An interrupt will be generated when either SPIF
or MODF is set. If SPIE is zero,= it will not inhibit the setting of these status bits, but an interrupt will not be generated. The SPIE bit is cleared to zero by reset.
SPCR[6] - SPE: SPI Enable. When this bit is set to one, the SPI subsystem is enabled. SPI pins that are defined as outputs are enabled. When SPE is zero, all SPI pin drive is inhibited. This bit is cleared to zero by reset.
SPCR[4] - MSTR: Master Enable. The master en-able bit (MSTR) determines whether the SPI is in master or slave mode. If the MSTR bit is zero, the device is in slave mode. If the master mode is selected (MSTR = 1), the function of the SCK pin changes from an input to an output, and the function of the MISO and MOSI pins are re-versed. This allows multi-master systems to be con-structed without external logic to reconfigure I/O pins.
The MSTR bit is cleared by reset, ;placing the SPI in the slave mode 4 on power-up.
SPCR[3] - CPOL: Clock Polarity. The clock polarity bit controls the normal, or steady state, level of the clock when data is not being transferred. The CPOL
bit affects both the master and slave modes of operation.
It must be used in conjunction with the clock phase con-trol bit (CPHA) to produce the wanted clock-to-data rela-tionship between a master and slave device. When CPOL is zero, it produces a steady state low on the SCK pin of the master mode device. If CPOL is one, a high is output on SCK when not transferring data. The CPOL bit is not af-fected by reset.
SPCR[2] - CPHA: Clock Phase. This bit controls the relationship between the data on the MISO and MOSI
pins and the clock produced or received at the SCK pin.
This control bit has effect in both the master and slave modes of operation. It must be used in conjunction with the clock polarity control bit (CPOL) to produce the de-sired clock-to-data relationship. The CPHA bit selects the clock edge used to capture data in the shift register.
If CPHA is a zero, data is captured on the falling edge of SCK. If CPHA is a one, data is captured on the falling edge. See FIG. 16 for waveform details. CPHA is not af-fected by reset.
SPCR[L-0] - SPRL, SPRO: Bit Rate. These two control bits select one of four communication bit rates to be used as SCK if the device is in niaster mode. They have no effect in slave mode, since the clock is generated ex-ternally by the master device. The slave mode is capable of shifting data in and out at a maximum rate which is equal to the processor's P2 (bus) clock. Table 16 defines the encoding of these two control bits SPR1 and SPRO are not affected by reset.

SPI BIT RATE
Processor Crystal SPR1 SPRO Clock Divide By: Clock Divide By:

6. PORT D
In the non-expanded mode, Port D 57 is an 8-bit bidirectional input-output port. The eight Port D pins can be individually programmed as iriput or output. In the expanded memory mode, Port D 57 contains the external 8-bit data bus multiplexed with the low-order eight address lines.
NON-EXPANDED MODE
When the expansion control pin (EXPN) is high, Port D 57 operates as a fully programmable I/O port.
INTERFACE REGISTERS
The Port D subsystem 57 communicates with the microcontroller through a set of two registers (PDD, PDC) located in memory address space. The direction of each port bit is determined by PDC, while the state of the port pins is controlled by PDD. See FIG. 18.
PDCj7...01: PORT DIRECTION
5 These eight, read-write register bits are used to control the direction of the corresponding port pin.
The port pin is an input if the port direction bit is zero. At reset, the port direction bits are cleared to zero, defining the port pins as inputs.
10 PDDj7...01: PORT DATA
These eight, read-write register bits are used to read the state of the port pin if an input, and to con-trol the state of a port pin if it is an output. A zero corresponds to an electrical low on the port pin. Bits 15 are assigned sequentially, with PDD[0] controlling pin PDO. Device reset does not affect the data register.
FIG. 19 illustrates the parallel port I/O circuitry.
These bits are not true read-write register bits under all conditions. If the direction is out (PDC[n] = 1), the 20 PDD[n] bit operates as a true read-write register. If the direction is in (PDD[n) = 0), the read source is the port pin, not the port data register bit.
PORT OPERATION
Each of the eight bits of the port operates in-25 dependently of the others. The following paragraphs de-scribe the operation of a single port bit.
Each port pin can be programmed to be either an input or output as determined by the appropriate port direction register bit. A pin is configured as an input 30 if its associated port direction register bit is set to zero. At power-on or reset, all port direction register bits are cleared, which configure the eight port pins as inputs. When a port direction register bit is set, the port pin becomes an output, driving the state of the port 35 data register bit onto the port pin. A one in the port data register causes a high on the port pin. When the port data register is written, the eight data bits are latched in the port data register.

<fllA~

When the port data register is read, the source of the data is determined by the port direction register as follows:
~ If the port pin is configured as an output, the read operation data source is the port data register, not the port pin.
~ If the port pin is configured as an input, the read operation data source is the port pin it-self. This prevents read-modify-write opera-tions from altering the state of output pins that may be loaded by external circuitry.
Whenever a port pin's direction is changed to output, its data register should be loaded with the de-sired output state prior to direction change. Read-modify-write operations can alter the state of data regis-ter bits configured as inputs.
EXPANDED MODE
When the expansion control pin (EXPN) is low, Port D 57 is used to multiplex both the data bus and the low-order eight address bits. The Port D pins change de-finition on the falling edge of the OS1 signal. They are outputs and contain address information when PH2 is as-serted. When PH2 is negated, they are bidirectional and contain data.
Addresses should be latched on the falling edge of the address latch enable signal; ALE. The address latch should be implemented with a transparent latch that is transparent while in clock signal is high.
The port pins are driven with output data while PH2 is low. Output data may be latched on the rising edge of the low-true write strobe signal:; WEN. If the memory cycle is a read operation, the port pins are tri-stated while PH2 is low. External memory devices should use one of the low-true read strobe signals: REN or PSEN, to drive read data onto the Port D pins. Read data will be latched on the rising edge of REN or PSEN. The REN read strobe is used for memory resources (typically RAM) in the memory address range of $4000 to $7FFF. The PSEN read strobe is used for memory resources (typically PROM) in the memory address range of $8000 to $FFFF. If the read operation is from an internal memory resource, Port D will be driven with the contents of the internal data bus.
7. PORT B
In the non-expanded mode, Port B 53 is an 8-bit bidirectional input-output port. The eight Port B pins can be individually programmed as input or output. In the expanded memory mode, Port B contains the high-order eight address lines.
NON-EXPANDED MODE
If the IC 10 is in the non-expanded (single chip) mode, operation of this port is identical to the operation of Port D 57. In this mode, Port B is an 8-bit bidirectional input-output port. The eight Port B pins can be individually programmed as input or output.
INTERFACE REGISTERS
The Port B subsystem 53 communicates with the microcontroller through a set of two registers (PBD, PBC) located in memory address space. The direction of each port bit is determined by PBC, while the state of the port pins is controlled by PBD. See FIG. 20.
PBC[7...0]: Port Direction. These eight read-write register bits are used to control the direction of the corresponding port pin. The port pin is an input if the port direction bit is zero. At reset, the port direc-tion bits are cleared to zero, defining the port pins as inputs.
PBD[7...0]: Port Data. These eight read-write register bits are used to read the state of the port pin if an input, and to control the state of a port pin if it is configured as an output. A zero corresponds to an electrical low on the port pin. Bits are assigned sequen-tially, with PBD[0] controlling pin PBO. Device reset does not affect the data register.
EXPANDED MODE
If the IC 10 is in the expanded mode (EXPN low), Port B 53 is an output port containing the high-order address lines. Addresses will change at the rising edge of PH2.
8. PORT C
Port C 56 is an 8-bit bidirectional input-output port. The eight Port C pins can be individually pro-grammed as input or output. Four can be assigned spe-cialized output functions by the configuration register, CFR.
CONFIGURATION REGISTER
Four CFR bits control the function of the low-order four Port C pins as shown in FIG. 6.
CFR[3...0]: Comparator Mode Control. These four write-only configuration bits enable the comparator outputs to be ORed with the least-significant four bits of the Port C data register: PCD[3...0]. A zero in these configuration bits enables the OR operation and sets the respective port control register (PCC[3...O]) bit to a one. Device reset places the four port pins in output mode, clears the port data register, and OR's the four data register outputs with the respective comparator out-puts. Thus, the four least significant port pins will be driven low if.the comparator inputs are above the thresh-old of +1.25 V. Since the comparator's inverting input is connected to the comparator input pin, there will be an inversion between respective comparator input pins and Port C pins. If a one is written into a Port C data register bit; PCD[3...0], the port pin will be driven high independent of the comparator input level. A low-order Port C pin cannot be placed in the input mode (PCD[3...0]=0) if its corresponding comparator mode con-trol (CFR[3...0]) bit is reset.
A one in these configuration bits disables the OR operation. In this mode, the low order four port pins operate as normal bi-directional I/O pins and are only a function of the port data register (PCD) and port control register (PCC). The configuration bits are assigned in sequential order with CFR[0] controlling PCO/CMPO and CFR[3] controlling PC3/CMP3.

INTERFACE REGISTERS
The Port C subsystem communicates with the microcontroller through a set of two registers (PCC, PCD) located in memory address space. The direction of each port bit is determined by PCC, while the state of the port=
pins is controlled by PCD. See FIG. 21.
PCC[7...0]: Port C Direction. These eight read-write register bits are used to control the direction of the corresponding port pin. The port pin is an input if the port.direction bit is zero. At reset, PCC[7...4]
are set to zero and PCC[3...0] are set to one. This de-fines the low order four port pins as outputs and the high order four pins as inputs. Bit assignments are in ascend-ing order with PCC[0] assigned to pin PCO and PCC[7) as-signed to pin PC7.
PCC[7...4]. The high-order nibble of the port control register operates as a normal set of bidirectional port control bits. The following conditions apply:
~ Reset clears PCC[7...4].
~ Writing a zero to a PCC[7...4] bit will cause the corresponding port pin to become an input, with its state readable by the respective bit in the PCD register.
~ Writing a one to a PCC[7...4] bit will cause the corresponding port pin to become an output, with its state driven by the last state written to the respective bit in the PCD register.
~ Reading PCC[7...4] will reflect the current state of those bits allowing for bit manipula-tion using read-modify-wriLte instruction.
PCC[3...0]. The low-order nibble of the port control register operates differently from the high-order depending on the state of the configuration control regis-ter bits CFR[3...0]. The following conditions apply:
~ A zero in one of the lower four bits of the CFR
(CFR[3...0]) will set the corresponding bit in the PCC.

~ Since device reset clears CFR[3...0], the low-order nibble of the port control register (PCC[3...0]) will be set after reset.
~ Writing a zero to one of the lower four bits of 5 the PCC (with the corresponding CFR bit set), will cause the respective port pin to become an input, with the pin's state readable in the data register PCD.
~ Writing a one to one of the lower four bits of 10 the PCC (with the corresponding CFR bit set), will cause the respective port pin to become an output, with its state driven by the last state written to the appropriate PCD bit.
~ Writing a one to one of the lower four bits of 15 the PCC will be ignored if the respective bit in the CFR is clear.
~ Reading the lower four bits of the PCC will re-flect the current state of those bits as stored in the PCC allowing for bit manipulation using 20 read-modify-write instructions.
PCD[7...0]: Port C Data. These eight read/write register bits are used to read the state of the port pins if configured as an input, and to control the state of port pins if it is configured as an output. A
25 zero corresponds to an electrical low on the port pin.
Bits are assigned sequentially, with PCD[0] controlling pin PCO. Device reset clears the low order four bits of the data register: PCD[3...0]. The high order four bits are not changed by reset.
30 PCD[7...4]. The high-order nibble of PCD oper-ates as a normal bidirectional port data register. The following conditions apply:
~ Reset does not affect the upper four bits of the PCD register.
35 ~ A read of the upper four bits of the PCD will reflect the state of the respective port pin if the corresponding PCC bit is clear (input mode).

~ A read of the upper four bits of the PCD will reflect the last state of the respective bit in the PCD if the corresponding PCC bit is set (output mode).
9. PORT A
Port A 52 is an 8-bit bidirectional input-output port. The eight Port A pins can be individually pro-grammed as input or output. Operation of this port is identical to the operation of Port D in the non-expanded mode.
INTERFACE REGISTERS
The Port A subsystem 52 communicates with the microprocessor 30 through a set of two registers (PAC, PAD) located in memory address space. The direction of each port bit is determined by PAC, while the state of the port pins is controlled by PAD. See FIG. 22.
PAC[7...0]: Port Direction. These eight read-write register bits are used to control the direction of the corresponding port pin. The port pin is an input if the port direction bit is zero. At reset, the port direc-tion bits are cleared to zero, defining the port pins as inputs.
PAD(7...0): Port Data. These eight read-write register bits are used to read the state of the port pin if an input, and to control the state of a port pin if it is an output. A zero corresponds to an electrical low on the port pin. Bits are assigned secILientially, with PAD[0]
controlling pin PAO. Device reset does not affect the data register.
10. COMMUNICATION CONTROLLER 29 The communication controller 29 (hereinafter identified as ICC) provides the microprocessor 30 access to an INCOM network as defined in detail in U.S. Patent No. 4,644,566. It provides modern modulator/demodulator) functions, serialization/deserialization of messages, and implements the required network protocol. The microprocessor 30 communicates with the communication controller 29 through eight interface registers located in memory address space. Four registers are used to transfer INCOM messages between the controller and the microprocessor, while the other four are used to set the communication address, speed, modula-tion method and to control transmit/receive operations of the INCOM communication controller (ICC) 29.
The ICC is capable of operating both as a master and slave controller. Master operation is inhibited un-less a permissive flag is set in the configuration regis-ter.
The ICC supports the fast status request message that will reduce network response time. The transmit and receive registers for the ICC are independent of each other. This allows a message such as the fast status to be periodically updated in the transmit registers. Then, when a fast status request is received, the ICC can trans-mit the response without processor intervention.
Details of the INCOM network protocol are de-fined below.
CONFIGURATION REGISTER
The ICC 29 is configured by the CFR and ACFR as shown in FIG. 6.
CFR[7]: ICC Master Enable. This permissive bit allows the ICC 29 to be switched into the master mode. A
zero in this configuration bit prevents the ICC from en-tering the master mode of operation. A one permits master operation. This bit is set to zero on reset inhibiting the ICC from being placed in master mode.
ACFR[6]: Divider Ratio. This bit selects the clock divider ratio for the A/D and ICC subsystems. If the ICC subsystem is active, either a 7.3728 MHz or 3,6864 MHz crystal must be used. If a 7.3728 MHz crystal is em-ployed, ACFR[6] must be set to a one.
INTERFACE REGISTERS
The microprocessor 30 interface to the ICC 29 consists of eight registers (ICAH, ICAL, ICM3, ICM2, ICM1, ICMO, ICSR and ICCR) located in memory address space. The format of these registers is shown in FIG. 23.

ICAH, ICAL: Address Registers. These two byte-wide, read/write registers are used set the communication bit rate, modulation method and the 12-bit INCOM address for the ICC. FIG. 23 defines the bit assignments for these registers. Both of these registers are set to zero by reset and power-up. These registers should not be al-tered during normal ICC operation.
ICAH[7,6]: Bit Rate. These two bits determine the communication bit rate of the ICC. Table 17 defines the decoding of this field. These bits are set to zero on power-up or reset.

BAUD RATE DECODF
ICAH[7,61 ASK OPERATION BASEBAND OPERATION
0 0 300 bps 19.2 kbps 0 1 1200 bps 38.4 kbps 1 0 4800 bps 76.8 kbps 1 1 9600 bps 153.6 kbps ICAH[5...4]: Modulation Method. These two bits determine the modulation method used by the INCOM con-troller. Table 18 defines the meaning of this field.
These bits arq set to zero on power-up or reset.

MODULATION METHOD DECODE
ICAH[5,4] MODULATION

1 0 Baseband 1 1 Baseband ICAH[3...0]: INCOM Address Bits 11...8. These four bits determine the high-order four bits of the INCOM
address. They are set to zero by reset or power-up.
ICAL[7...0]: INCOM Address Bits 7..Ø This byte-wide register determines the low-order eight bits of the INCOM address. It is set to zero by reset or power-up.
ICM3...ICMO: Message Registers. These four byte-wide read/write registers are used to transfer INCOM

messages between the ICC 29 and the microprocessor 30.
They are not true read-write registers, since read opera-tions access the receive buffer register, while write operations write to the transmitter buffer register. The same value will not necessarily be read from a message register location that had previously been written to that register location. For this reason, the read-modify-write instructions should not be used to manipulate these regis-ters. The mapping of INCOM message bits is shown in FIG.
24. The transmitter buffer register is loaded when these registers are written. Reset clears the transmitter buffer register to all zeros.
ICM3[7...0]. This 8-bit register contains mes-sage bits 26 through 19.
ICM2[7...0]. This 8-bit register contains mes-sage bits 18 through 11.
ICM1[7...0). This 8-bit register contains mes-sage bits 10 through 3.
ICMO[7]. This is the control bit 2 of the INCOM
message. The register bit is not a true read-write regis-ter, since read operations access the receive buffer re-gister, while write operations write to the transmitter buffer register. The same value will not necessarily be read from this bit that had previously been written.
ICMO[6...2]. These five bits are reserved for test. During normal operation they will contain arbitrary bits patterns that should be ignored by the program.
Writing to them will have no effect on the operation of the INCOM subsystem unless the IC 10 is in the test mode.
ICMO[1...0]. These two bits contain the two status bits that are transmitted in B26(ICMO[1]) and B25 (ICMO[0]) of the reply message. These bits are imple-mented as a true read-write register. The same contents will be read from them as was previously written. These bits are cleared by reset.
ICSR: Status Register. This byte-wide, read-only register contains ICC status flags that the microcom-puter needs to communicate with the INCOM communication controller. FIG. 23 defines bit assignments in the status register.
ICSR[7]: Busy. This bit will read as a one whenever the ICC is busy, transmitting or receiving a mes-5 sage on the INCOM network.
ICSR[6]: Interface Enabled. This bit will read as a one when the ICC interface is enabled. An ICC in master mode will always have this bit set, since its in-terface is always capable of transmission.
10 ICSR[5]: Transmitter Active. This bit will read as a one when the ICC is in the process of transmit-ting a message. The transmission may have been initiated by software, or by the receipt of a message requiring re-ply or fast status request. A transmission request 15 (ICCR[0] = 1) should not be issued when ICSR[5] = 1.
Under these conditions, the transmission request will be ignored.
ICSR[4]: Fast Status Sent. This bit will read as a one after the completion of the fast status message 20 transmission. It is cleared by reset and by writing ICCR(3] = 1.
ICSR[3): Transmit Operation Complete. This bit will read as a one after the completion of a message transmission. It is cleared by reset and by writing 25 ICCR[2] = 1.
ICSR[2]: Receive Operation Complete. This bit will read as a one after a received message has been loaded into the receive message buffer. It is cleared by reset and writing ICCR[1] = 1. The ICC will not begin re-30 ceiving a new message until ICSR[2] = 0.
ICSR[1]: BCH Error. This bit will read as a one after the receipt of a message containing a BCH error.
It is cleared by reset and by writing ICCR[1] = 1.
ICSR[0]: Overrun. This bit will be set if the 35 message register has not been released (ICSR(2] = 1) when a new message is ready to be loaded into the message re-gister. This status bit is cleared by reset and by writ-ing ICCR[1] = 1.

ICCR: Control Register. This byte-wide, read-write register is used to control operation of the ICC 29.
It has been designed as a read-write register to permit read-modify-write instructions to operate on it correctly.
FIG. 23 defines bits assignments in the control register.
This register is implemented with two types of register bits: command and control. Command bits will initiate a function when written with a one. They will always read as zero. Control bits can be set and cleared by the soft-ware. They will read the current value of the control bit. All control bits are set to zero by reset.
ICCR[7]: Enable Interrupts. This control bit enables interrupt operation of the ICC. When set, trans-mit and receive operations will generate an interrupt.
ICCR[6]: Fast Status Transmit Enable. This control bit enables automatic response to the fast status request message type. When set, the message stored in the transmit buffer registers will be transmitted following the receipt of the fast status request. The fast status request message has the control bit set (B2=1), an in-struction field of 3, a command field of 0, and a subcom-mand field of either 0 or 1. The address must match the ICC address and the message BCH must be correct. Only de-vices configured as slaves will respond to the fast status request. Whenever the fast status message stored in the transmit buffer is being updated, ICCR[6] should be reset prior to any change in the buffer registers.
ICCR[5]: Master Mode. This bit, when set, places the INCOM communication controller in the master mode of operation. In the master mode, the ICC is permit-ted to transmit at any time and will receive all messages, independent of their address. Reply and fast status operations are disabled. ICCR[5] may only be set if CFR[7] = 1. Attempts to write a one into ICCR[5] with CFR(7] = 0 will fail. This bit is set to zero (slave mode) by reset or power-up ICCR[4]. This control bit is not used.

ICCR[3]: Acknowledge Fast Status Sent. This command bit is used to reset ISCR[4]. ICSR[4] will be re-set whenever ICCR[3] is written with a one. ICCR[3] will always read as zero.
ICCR[2]: Acknowledge Transmit Complete. This command bit is used to reset ICSR[3]. ICSR[3] will be re-set whenever ICCR[2] is written with a one. ICCR[2] will always read as zero.
ICCR[1]: Acknowledge Received Message. This command bit is used to reset ICSR[2]. ICSR[2] will be re-set whenever iCCR[1] is written with'a one. ICCR[1] will always read as zero.
ICCR[0]: Initiate Transmit. This command bit, when written with a one, will initiate transmission of the message stored in the transmilt buffer registers:
ICM3...ICMO. The transmitter must riot be busy (ICSR[5]=0) and the interface must be enabled (]:CSR[6]=1) in order to transmit a message.
INCOM NETWORK
All communication on the INCOM network is in 33-bit messages. The messages are asyrichronous transmissions that begin with two start bits and terminate with a single stop bit. Both carrier-based and baseband modulation modes are supported.
CARRIER MODULATION
If the carrier-based modulation method is selected, two compatible modulation schemes are possible:
frequency-shift keying (FSK), and amplitude-shift keying (ASK).
~ ASK: The amplitude-shift keying modulation scheme uses a 115.2 kHz carrier. A message bit is a one if carrier is present and a zero if carrier is not present.
~ FSK: The frequency-shift keying modulation scheme uses two carrier frequencies. A message bit is a one if the carrier frequency is 115.2 kHz and a zero if the carrier frequency is 92.16 kHz.

These modulation methods are compatible since the INCOM controller only uses FSK for transmission; the receiver's digital demodulator oinly correlates with the 115.2 kHz carrier. The presence of the 92.16 kHz carrier is not required for correct demodulation. The use of the second carrier frequency is to provide limiter capture in poorly terminated environments when operated at the higher bits rates. An INCOM controller in FSK mode will properly receive messages transmitted in ASK mode as long as echoes are properly terminated. The 'interval between messages must be a zero (no carrier).' During the following discus-sions, the terms one and zero will be used to denote the state of the communication line to eliminate confusion be-tween ASK/FSK and baseband modulation.
BASEBAND MODULATION
If baseband modulation is selected, the messages are transmitted without carrier in a non-return-to-zero format. If the receiver input (RX) is an electrical low, the message bit is a zero, and a one if an electrical high. The transmit output (TX) is an electrical high for a one and electrical low for a zero. The interval between messages must,be a zero (RX low). During the following discussions, the terms one and zero will be used to denote the state of the communication line to eliminate confusion between ASK and baseband modulation.
COMMUNICATION BIT RATES
INCOM networks may be configured to operate at a variety of bit rates depending on the transmission mode selected. Table 19 defines the possible communication bit rates of INCOM networks. Only one transmission mode and one bit rate may be selected for a given INCOM network.

INCOM TRANSMISSION MODES AND BIT RATES
ASK/FSK BASEBAND
300 B/S 19.2 KB/S
1200 B/S 38.4 KB/S
4800 b/s 76.8 kb/s 9600 b/s 153.6 kb/s As mentioned above, the ASK and FSK modulation methods are compatible. ASK systems may require network restrictions not applicable to FSK at the higher bit rates.
MESSAGE FORMAT
All INCOM messages are 33 bits in length and have the following characteristics:
~ The first two bits are start bits and must be ones.
~ The third bit is the control bit that determines the basic message type.
~ A five-bit BCH error check code is transmitted starting with the 29th bi.t.
~ The last bit of the message is a stop bit that must be a zero.
The bit rate and modulation method can vary de-pending on system options selected, however, the 33-bit, asynchronous message format is common. In the following discussions, the first transmitted bit is numbered BO, and the last bit of the message (stop bit) is B32. The INCOM
message format is shown in FIG. 24.
START BITS: B0, B1 Each network message begins with two start bits.
These bits are used to frame the message and must be ones.
The intermessage gap is filled with zeros. A new message may start immediately following the stop bit.
CONTROL BIT: B2 The control bit defines the meaning of message bits B3 through B26. If B2 is a one, the message is a control message and will be interpr+eted by the ICC. If B2 is a zero, the message is a data m+essage and will not be interpreted by the ICC. Transmission rights (bus master-ship token) can be exchanged only by control messages (B2=1).

The meaning of this message field is determined by the control bit B2.

~ A control bit set to one indicates that bits B3 through B26 contain instruction, command, sub-command, and address fields that are to be in-terpreted by the ICC.
5 ~ A zero control bit designates that bits B3 through B26 contain arbitrary data, and are part of a higher-level message protocol. These messages will not be interpreted by the ICC.
BCH ERROR CHECK CODE: B27-B31 10 Message bits B27 through B31 contain a five bit error check calculated using the BCH 31, 26 code. The ICC
computes a BCH remainder based upon bits B2 through B26 of the 33 bit message. The resulting message (B2...B30) will always have as a root the BCH generator polynomial: X5 +
15 X2 + 1. This error check code has a Hamming distance of 3 and will detect all random double bit errors and all burst errors up to 5 bits in length. Several examples of mes-sages with correct BCH follow:
s -bch- -sc- - addr - -cf- ins c st STOP BIT: B32 25 Each message ends with a stop bit that is always a zero.
CONTROL MESSAGES
Messages with the control bit (B2) set (one) are defined as control messages.
30 INSTRUCTION FIELD: B6-B3 The instruction field consists of message bits B6 through B3. This field provides for certain primitive slave'control functions and also implements the hardware-level transmission rights protocol. This field is inter-35 preted as shown in Table 20.
NETWORK ADDRESS: B22-B1l Message bits B11 through B22 contain the network address in control messages. B11 is the least significant INSTRUCTION DECODE

INSTRUCTION FIELD DEFINITIONS
B6 B5 B4 B3 $ INSTRUCTION
0 0 0 0 0 Shed Load 1 0 0 0 8 Shed Load With Reply 0 0 0 1 1 Restore Load 1 0 0 1 9 Restore Load With Reply 0 0 1 0 2 Disable Interface 1 0 1 0 A Disable Interface with Reply 0 0 1 1 3 Enable Interface 1 0 1 1 B Block Addressing 1 1 0 0 C Reserved, Block Addressing 0 1 0 0 4 Reserved, Block Shed 0 1 0 1 5 Block Restore 1 1 0 1 D Reserved, Universal Addressing 0 1 1 0 6 Reserved 1 1 1 0 E Reserved, Universal Addressing 0 1 1 1 7 No Operation 1 1 1 1 F No Operation With Reply byte of the address. Address comparisons in control mes-sages depend on the contents of the instruction field.
Most control message instructions use all twelve bits of address information to determine the recipient of the mes-sage. Certain instructions use fewer than twelve.
BLOCK ADDRESS INSTRUCTIONS
The following instructions use only B22 through B15 of the address field in address comparisons: $4-Block Shed, $C-Reserved, and $5-Block Restore. These three in-structions use block addressing iin which the low-order four bits of address information are ignored. These com-mands can be received by up to sixteen different non-master devices on the network.
UNIVERSAL ADDRESS INSTRUCTIONS
The following instructions employ no addressing:
$D-Reserved, $6-Scram, and $E-Reserved. These instruc-tions will be received by all devices on the network.

COMMAND FIELD: B7-BlO
This 4-bit field defines the command in control messages. It is .unused in all other control message types. The definition of the commands defined by this field is determined by a higher-level software protocol and will vary from product to product with the exception of two status commands. The fast status ICC hardware in-terprets and executes to status commands defined by a com-mand of zero with either subcommand of zero or one. These two status command control messages are universally de-fined for all product types as follows:
SINGLE MESSAGE STATUS
A control message with an instruction of $3, command of 0, and subcommand of 0 is defined to be a Single Message Status request. The addressed device is expected to respond as defined below.
EXTENDED STATUS
A control message with an instruction of $3, command of 0, and subcommand of 1 is defined to be an Ex-tended Status request. The addressed device is expected to respond as defined below.
SUBCOMMAND FIELD: B26-B23 This 4-bit field defines the subcommand in con-trol messages. It is unused in all other control message types. The definition of the subcommands defined by this field is determined by a higher-level software protocol and will vary from product to product with the exception of subcommands zero and one,in the status command.
COMMUNICATION NETWORK ARBITRATION
The INCOM network is a multi-drop communication bus on which a number of devices may transmit. Bus arbi-tration is performed by both hardware and software proto-cols. The network is arbitrated by a token-passing scheme in which control of bus transmission rights is defined by the message type and message contents. The arbitration protocol assumes a single network controller (network master) that is defined by system configuration. Multiple devices may be capable of performing the network master function, however, only one may be active at any given time.
The network master has several means of dis-tributing bus transmission rights:
= Sending a control message to a slave device re-questing a reply. If the message did not re-quest a reply, bus transmission rights remain with the network master. If the message re-quires reply, the slave will begin to transmit a single reply control message within one bit time of the receipt of the requesting message. In this case, bus transmission rights were granted to the slave for one message only. A slave is not able to transmit a message without receiving a control message requiring reply or having its interface enabled by the appropriate control message.
~ Sending a control message to a slave controller enabling its interface. In this case, bus transmission rights are passed to the enabled slave device. The slave may transmit as many messages as the software protocol requires. Its interface will remain enabled until it receives a disable interface control message or detects a control message (B2 set) to another address.
The software communication protocol determines when bus transmission rights are returned to the network master controller or, possibly, another slave device. The hardware-level arbitration protocol will prevent more than two slave de-vices with different address from having their interfaces enabled at any one time.
STATUS TRANSACTIONS
All slave devices conforming to the INCOM stan-dard protocol are required to reply to valid status re-quests. Three status request transaction sequences have been defined. All products are required to support the first type, and can optionally support all three.

REPLY
All slave devices are required to produce a re-ply when they receive control messages that require a re-ply. This assumes that the control message contains an address match and correct BCH. The reply status message will have bit B2 set and contain a two-bit status in bits B25 and B26. Bits B3 through B24 are undefined, but for many implementations, will be an echo of the status re-quest message. As expected, the BCIH will be computed on whatever bit pattern is sent in Bl through B26. The typi-cal definition of the two status bits is shown in Table 21.

STANDARD STATUS DEFINITIONS

0 0 Off or Ready (Normal, Inactive) 0 1 On or Running (Normal, Active) 1 0 Trip (Abnormal, Inactive) 1 1 Alarm (Abnormal, Active) The following INCOM control messages will pro-duce a reply:
0 aaa 0 8 1 Shed Load, Reply 0 aaa 0 9 1 Restore Load, Reply 0 aaa 0 A 1 Disable Interface, Reply 0 aaa 0 F 1 Status Reply Request Transmission rights are returned to the device that requested the status at the completion of the reply message.
SINGLE MESSAGE STATUS
Some slave devices are capable of responding to a single message status request. Microprocessor-based' slaves are generally able to respond to this request. The single status request message is: "0 aaa 0 3 111. This message consists of the enable interface instruction, a command of zero, and a subcommand of zero. The slave has two options for its response:
~ The slave can return a reply message containing two status bits as described above.

~ The slave can return a product status message as described below.
Transmission rights are returned to the device that requested the status at the completion of the single 5 response message.
PRODUCT STATUS MESSAGE
The product status message has the following format:
~ B2: 0 10 ~ B8-3: 6-bit Division Code ~ B12-9: 4-bit Communication Software Version ~ B18-13: 6-bit Product ID
~ B21-19: 3-bit Product Specific Status ~ B26-22: 5-bit Standard Status Code This 6-bit field identifies the product division or company. The following are exemplary codes:
B8-3 Division 00 Reserved 20 01 Westinghouse Electrical Components (Asheville) 04 Westinghouse Breaker Components (Beaver) COMMUNICATION SOFTWARE VERSION
This 4-bit field may be used to define the communication software code version number that the slave 25 product is using.
PRODUCT ID
This 6-bit field may be used to define the spe-cific product within the division or company code.
PRODUCT SPECIFIC STATUS
30 This 3-bit field may be used by each product to define status conditions that are unique to the product.
STANDARD STATUS CODE
This 5-bit field may be used as the standard status code as defined in Table 21. Each product should 35 attempt to define four operating states that best match these definitions.

EXTENDED STATUS
Some slave devices are capable of responding to an extended status request. Microprocessor-based slaves are generally able to respond to this request. The ex-tended status request message is: "1 aaa 0 3 1". This message consists of the enable interface instruction, a command of zero, and a subcommand of one. The slave should respond with two messages:
~ The first message should be a product status message as described above.
~ The second should be an acknowledge message of the following format: "0 aaa 1 3 1". The 12 address bits should be the address of the slave.
Transmission rights are returned to the device that requested the status at the completion of the second response message.
OPERATION
The INCOM communication controller 29 has two operational modes: Master and Slave. In general, a given application will configure the ICC 29 to operate in only one of those modes; although it is possible to use it with a system that permits multiple masters on a single com-munication network. The following sections describe a typical programming interface to the ICC.
INITIALIZATION
As part of the IC 10 initialization software, certain parameters must be set in the ICC 29;
~ Configuration: Appropriate values must be loaded into CFR[7] (ICC Master Enable) and ACFR[6] (Divider Ratio). CFR(7] must be set if the application is permitted to operate in the master mode. If it is not set, the ICC cannot be placed in the master mode. ACFR[6] must be set as a function of the crystal frequency.
~ Communication Parameters: ICAH[7...4] must be set for the appropriate bit rate and modulation method. These values should not be changed dur-ing normal operation of the IC 10.

~ INCOM Address: If the IC 10 is configured as a INCOM slave, ICAH[3...0] and ICAL[7...0) must be loaded with the network address of the slave.
INCOM masters do not need an address.
~ Mode: If the IC 10 is a master on the INCOM
network, ICCR[5] must be set. When ICCR[5] is set, the ICC will receive all messages on the network regardless of address. Setting ICCR[5]
will also permit the ICC to transmit messages.
This will be indicated by the interface enabled status bit being set (ICSR[6]).
~ Interrupts: If the ICC subsystem is to be in-terrupt driven, ICCR[7] must be set to enable the interrupt. ICSR[3] and ICSR[2] are used to indicate interrupt requests. They may be polled in non-interrupt driven systems.
Once these parameters have been set, the ICC can function correctly in the communication network.
RECEIVE OPERATION
= 20 Operation of the IC 10 depends on the operating mode of the ICC 29. The receiver operates differently de-pending on whether it is in the master mode.
MASTER MODE
If the IC 10 is in the master mode, it will re-ceive all INCOM network messages regardless of control message addressing. In the master mode, its interface is enabled (ICSR[6] = 1) at all times. This will cause all network messages to be received.
SLAVE MODE
If the IC 10 has been configured as a slave, it will only receive control messages that match its address.
Data messages will be received only if the ICC's interface is enabled (ICSR[6] = 1) when the message is processed. A
slave device's interface is enabled by a specific control message type containing the slave's address. Its inter-face will be disabled whenever a different slave device is enabled.' All control messages with the correct address match will be received.

MESSAGE PROCESSING
When a message is received by the ICC the fol-lowing events occur:
1. When two start bits are detected, the serial bit stream is framed and shifted into a buffer re-gister.
2. If the message is a control message, the BCH and address are checked and the instruction exe-cuted.
3. If ICSR[6] is set, or if the message is an in-struction message for this INCOM address, the message will be loaded irito the receive buffer registers addressed as ICM3 through ICMO. This will only take place if ICSR[2] is reset. if ICSR[2] is set, the message will be discarded and ICSR[O] (receiver overrun) set.
While a message is being received, ICSR[7]
(busy) will be read as a one. After the message has been processed, ICSR[2] will be set indicating that a new mes-sage has been placed into the receiver buffer. If an ad-ditional message that must be loaded into the receiver buffer registers is processed before the previous message has been acknowledged by the software, a receiver overrun will occur.
If interrupts are enabled, the setting of ICSR[2] will generate an interrupt. The software should read the ICC status register and retrieve the new message from the receive message registers. After the message has been read and status checked for overrun (ICSR[0]), BCH
error (ICSR[1]), and receive operation complete (ICSR[2]), the software should set ICCR[1] to acknowledge the re-ceived message. This will reset ICSR[2...0] and free the receive buffer for the next message. Clearing ICSR[2]
will reset the interrupt request.
TRANSMIT OPERATION
The IC 10 software is only permitted to transmit a message on the INCOM network when the ICC interface is enabled (ICSR[6] = 1). To transmit a message, the soft-ware should perform the following operations:
1. Reset ICCR[6] to disable fast status operation.
This is required since the transmitter buffer registers are also used for fast status opera-tion.
2. Load the message to be transmitted into the message registers ICM3 through ICM1. Load ICMO(7] with the transmitted message control bit. Read-modify-write instructions should not be used for the operation. ICMO[l...0] must contain the correct reply status information at all times during this load operation.
3. Read ICSR[5] to verify that the transmitter is not busy and initiate t]he transmission by set-ting ICCR[0]. This will cause the transmitter to begin operation. The transmitter buffer re-gisters can be changed as soon as the transmit-ter active bit (ICSR[5)) indicates the transmis-sion is in progress.
4. The software should poll :LCSR[3] for the trans-mitter complete flag or wait for the ICC inter-rupt at the end of the transmission. ICSR[3]
and the interrupt request are cleared by setting ICCR[2].
REPLY STATUS OPERATION
The ICC generates reply status messages auto-nomously in response to INCOM network reply requests.
The reply status message will contain ICMO[1,0] in message bits B26 and B25. The software should reload appropriate values in these two message register bits whenever the ap-plication's status changes.
FAST STATUS OPERATION
The IC 10 will transmit a fast status reply mes-sage automatically on receipt of the appropriate INCOM
control message if properly programmed by the application software. In order for the fast status to be transmitted, the software should do the following:

1. Reset ICCR[6] to disable the transmission of fast status.
2. Update the fast status message in the message registers (ICM3...ICMO).
5 3. Set ICCR[6] to enable the transmission of fast status.
Whenever a fast status request is processed by the ICC, the message in the transmitter buffer registers will be sent if ICCR[6] is set. Whienever a new message is 10 placed in the buffer registers, the ICCR[6] bit must be reset during the load operation to prevent 'data tearing' of the new message.
INTERRUPT VECTOR
The INCOM interrupts have the lowest priority in 15 the microcontroller. They are assigned with a vector ad-dress of $FFFO-FFF1. The interirupt(s) must be acknow-ledged set ICCR[1, 2 or 3] prior to resetting the I bit in the processor to avoid reprocessing the interrupt.
ANALOG SUBSYSTEM SCHEMATICS
20 The analog subsystem for the IC 10 is illus-trated in FIGS. 25-81. More specifically, FIGS. 25-40 il-lustrate the digital control logic while FIGS. 41-53 il-lustrate the analog circuitry. FIGS. 54-81 illustrate the digital logic for the ICC 29.

1. OUADCOMPARATOR SUBSYSTEM LOGIC
The quadcomparator subsystem 58 includes four individual comparators 200, 202, 204 and 206 (FIGS. 26 and 43). Each of these comparators 200, 202, 204 and 206 is 30 referenced to a predetermined voltage, for example, +1.25 Vdc connected to a non-inverting input (FIG. 43). Input signals are applied to external pins CPO, CP1, CP2 and CP3 illustrated in FIG. 25.
The comparator subsystem 58 communicates with 35 the microprocessor 30 through two registers CMPI and CMPST
located in memory address space. An internal interrupt facility is provided to generate interrupts on selected edges of the comparator outputs Q0, Ql, Q2 and Q3. The comparator outputs Q0, Ql, Q2 and Q3 are read at the data bus DATA[3...0]. More specifically, each of the compara-tor outputs Q0, Ql, Q2 and Q3 is connected to a pair of serially coupled inverters 208 and. 210 (FIG. 26); 212 and 214; 216 and 218; and 220 and 222, respectively, for high gain. The outputs of the inverters 210, 214, 218 and 222 are applied to tristate devices 224, 226, 228 and 230.
The outputs of these tristate devices are connected to the data bus DATA[3...0] as CMPST[3...0]. These comparator outputs comprise the CMPST[3...0] status bits. Reading of these status bits'is controlled by a read signal RDCMPSTh, which is active any time the microprocessor 30 addresses the CMPST register and initiates a read as discussed be-low.
The CMPI register is used for interrupt control.
More specifically, CMPI [3...0] is used to enable inter-rupts while CMPI[7...4] is used to reset the interrupt re-quest generated by the comparator subsystem 58. The in-terrupt request must be reset prior to clearing the I bit to prevent reprocessing the interrupt.
An interrupt request signal INTREQ is generated on selected edges of the comparator outputs Q0, Ql, Q2 and Q3. More specifically, the INTREQ signal is generated on rising and falling output states of the comparator 200 and on rising output states of the cornparators 202, 204 and 206. This INTREQ signal is available at the output of a quad NOR gate 232. Comparator interrupt request signals REQOh, REQlh, REQ2h and REQ3h are applied to the inputs of the NOR gate 232. These interrupt request signals are available as outputs at an OR gate 234 for the comparator 200 and flip-flops 236, 238 and 240 for the comparators 202, 204 and 206, respectively. More specifically, the interrupt request signal REQOh for the comparator 200 is generated at the output of the dual input OR gate 234.
The inputs to the OR gate 234 are from flip-flops 242 and 244. The output QO of the comparator 200 is applied to the clock input CK of the flip-flop 244 by way of the high gain inverters 208 and 210. The complement of this sig-nal, available at the output of the inverter 208 is ap-plied to the clock input CK of the flip-flop 242. The Q
outputs of the flip-flops 242 and 244 are applied to the OR gate 234 to generate the REQOh signal on rising and falling output states of the comparator 200. The Ql, Q2 and Q3 outputs of the comparators 202, 204 and 206 are ap-plied to clock inputs CK of the flip-flops 236, 238 and 240 to generate the REQlh, REQ2h and REQ3h signals.
These REQOh, REQlh, REQ2h and REQ3h signals may be read as status bits CMPST[7...4] by the microprocessor 30 on the data bus ' DATA[7...4]. More specifically, the REQOh, REQlh, REQ2h and REQ3h signals are applied to tristate devices 246, 248, 250 and 252. The outputs of these tristate devices 246, 248, 250 and 252 are connected to the data bus DATA[7...4]. The tristate devices 246, 248, 250 and 252 are under the control of the RDCMPSTh signal.
Four command bits CMPI[7...4] are used to reset the interrupt request. These command bits CMPI[7...4] are used to reset the flip-flops 236, 238, 240, 242 and 244, which generate the REQOh, REQlh, REQ2h and REQ3h signals.
These command bits CMPI[7...4] may be written by way of the data bus DATA[7...4] and are applied to dual input NAND gates 254, 256, 258 and 260 along with a WRCMPIh sig-nal. These NAND gates will only be enabled when the microprocessor 30 addresses the CMPI register and initi-ates a write. The outputs of the NAND gates 254, 256, 258 and 260 are applied to tri-input AAND gates 262, 264, 266 and 268. The outputs of these AND gates are applied to the reset inputs R of the flip-flops 236, 238, 240, 242 and 244. The other two inputs to the AND gates 262, 264, 266 and 268 are the reset signal RESETb from the micro-processor 30, available at the output of an inverter 270 and interrupt enable signals ENAOh, ENAlh, ENA2h and ENA3h, available at Q outputs of flip-flops 272, 274, 276 and 278. The ENAOh, ENAlh, ENA2h and ENA3h signals allow the interrupt request to be cleared once acknowledged.
The RESETb signal allows the microprocessor 30 to reset these flip-flops. In order to prevent reprocessing of the interrupt, a WRCMPIb signal, available at an output of an inverter 271, is applied to the D inputs of the interrupt enable flip-flops 272, 274, 276 and 278. These flip-flops are thus reset after the write signal WRCMPIh becomes in-active.
The command bits CMPI[7...4] are always read as zero on the data bus DATA[7...4]. More specifically, these command bits are read at the output of the tristate devices 278, 280, 282 and 284. The input to these tri-state devices is connected to digital ground. The tri-state devices 278, 280, 282 and 284 are under the control of a RDCMPIh signal which indicates that the microproces-sor 30 has addressed the CMPI register and initiated a read.
Four status bits CMPI[3...0] are used to read comparator interrupt enable signal:s ENAOh, ENAlh, ENA2h and ENA3h. These signals ENAOh, ENAlh, ENA2h and ENA3h are available at the Q outputs of the flip-flops 272, 274, 276 and 278. These outputs are corinected to tristate de-vices 286, 288, 290 and 292. The outputs of these tri-state devices are connected to the data bus DATA[3...0].
The tristate devices 286, 288, 290 and 292 are under the control of a RDCMPIh signal which indicates that the microprocessor 30 has addressed the CMPI register and has initiated a read.
The RDCMPSTh, RDCMPIh and WRCMPIh signals are generated by a comparator decode system 294. The compara-tor decode subsystem 294 decodes addresses applied to the internal address bus ADDR[4:0] tcr allow the registers CMPST and CMPI to be written to and read. More spe-cifically, as illustrated in Table 7' the CMPST register is located at address location $0008. Thus, when the address $0008 is placed on the internal address bus ADDR[4...0] an AND gate 296 (FIG. 27) is enabled. More specifically, the AND gate 296 is an eight input AND gate. The address in-puts ADDR[4,2,1,0], identified as A4h, A2h, Alh and AOh, are applied through inverters 298, 300, 302 and 304. The address bit ADDR[3], identified as A3h, is applied directly to an input of the AND gate 296. Also applied to the AND gate 296 are signals SELh, DISABLEb and PH2h from the microprocessor 30.
The hexadecimal address $0008 corresponds to bi-nary bits 00010. When the address 01000 is applied to the address inputs of A4h, A3h, A2h, Alh and AOh, the output of the AND gate 296 will be a logical one indicating that the CMPST register is being addressed by the microprooes-sor 30. More specifically, the RDCMPSTh signal is avail-.10- able at an output of a dual input AND gate 306 (FIG. 26).
The inputs to the AND gate 306 are Q outputs of flip-flops 308 and 310. The CMPSTh signal, available at the output of the AND gate 296, is applied to a D input of the flip-flop 310. Timing for this flip-flop is provided by the microprocessor's phase 2 clock signal PH2h. More spe-cifically, a PH2h signal is applied to a clock input CK of the flip-flop 310 by way of a pair of serially connected inverters 312 and 314. An inverted phase 2 clock signal, available at the output of the inverter 312 is applied to a CK input of the flip-flop 310. A READh signal, avail-able from the microprocessor internal control bus CPUCTL[3...0], is applied to a D input of a flip-flop 308.
The READh signal indicates that the microprocessor 30 is requesting a read operation. Timing signals are applied to the clock CK and CK inputs of the flip-flop 308 in the same manner as the flip-flop 310. Thus, whenever the microprocessor 30 addresses $0008, the signal RDCMPST is generated at the output of the AND gate 306, which indi-cates that the microprocessor 30 is reading the CMPST re-gister.
An RDCMPIh signal is available at the output of a dual input AND gate 316. The output of the flip-flop 308 is applied to one input of the AND gate 316 which in-dicates that the microprocessor 30 has initiated a read.
The other input to the AND gate 316 is a Q output of a flip-flop 318. A CMPIh decode signal is applied to a D
input of the flip-flop 318. Timing control for the flip-flop 318 is identical to the flip-flops 308 and 310. The <--.;

CMPIh signal is available at an output of an AND gate 320 (FIG. 22). The circuitry including the AND gate 320 and the inverters 298, 300, 302 and 304 generates the CMPIh signal whenever the microprocessor 30 addresses $0009.
The WRCMPIh signal is available at an output of a dual input AND gate 322 (FIG. 26)õ One input to the AND
gate 322 is the output of the flip-flop 318, which indi-cates that the CMPI register was addressed. The other in-put to the AND gate 322 is from a NOR gate 324. The NOR
gate 324 is used to develop a microprocessor write signal.
Specifically, the output of the flip-flop 308 is applied to one input of the NOR gate 324. The output signal from the NOR gate 324 will be low during write operations. The other input is from the phase 2 clock, available at the output of the inverter 278.
Four configuration bits CFR[3...0] from the con-figuration register CFR are used for comparator mode con-trol. These configuration bits CFR[3...0] allow the out-puts of the comparators 200, 202, 204, 206 to be ORed with port C. A zero enables the OR operation while a one dis-ables it. More specifically, the CFR register is a write only register, and includes the flip-flops 326, 328, 330 and 332. The D inputs of these flip-flops are connected to the data bus DATA[3...0]. The Q outputs of these flip-flops are tied to an internal bus CF]R[3...0] which allows the OR operation. These flip-flops 326, 328, 330 and 332 are under the control of a dual input NAND gate 334, which enables the write operation. One input to the NAND gate 334 is from the output of the NOR gate 324 which indicates a write operation. The other input is from a flip-flop 336. A CFRh signal, which indicates that the microproces-sor 30 addressed the CFR register is applied to the D in-put of the flip-flop 336.
The CFRh signal is a decode signal and is avail-able at the output of an AND gate 338 (FIG. 27). The AND
gate 338 and the inverter 298 decode the address bus ADDR[4...0] to enable the AND gate 338 and generate the CFRh signal any time the microprocessor 30 addresses $OO1E.
The microprocessor 30 is adapted to reset the comparator subsystem 58. More specifically, a reset sig-nal RESETb from the computer control bus CPUCTL[3...0] by way of the inverter 270 is applied to the AND gates 262, 264, 266 and 268 to reset the flip-flops 236, 238, 240, 242 and 244. The RESETb signal is also applied to the flip-flops 272, 274, 276, 278, 308, 310, 318, 326, 328, 330, 332 and 336 to allow the microprocessor 30 to reset the comparator subsystem 58.
2. PROCESSOR BUS INTERFACE LOGIC
The microprocessor 30 communicates with the ana-log control system by way of, for example, seven registers ADCR, AMUX, ACFR, ADZ, AMZ, AVSF and ACFR located in memory address space as identified in Table 7. The format of the registers is illustrated in FIG. 9. These regis-ters are selected by register select flip-flops 350, 352, 354, 356, 358, 360 and 362, illustrated in FIG. 29. These registers are all read-write registers and are decoded by a register decode subsystem 364 illustrated in FIG. 30.
These registers may be decoded in various manners, for example, seven programmable logic arrays (PLA) 366, 368, 370, 372, 374, 376 and 378 may be provided. Each of these PLA's includes address inputs ADDR[4...0] applied either directly or by way of inverters 366, 368, 370, 372 and 374 as shown in FIG. 30 and three control signals SELh, DIS-ABLE and PH2h. The SELh signal corresponds to the micro-processor's ANABSh signal. The ANABSh signal is a regis-ter select signal from the microprocessor master chip ad-dress decoder which enables address decoding on a block basis. The DISABLEb signal corresponds to the micropro-cessor's IOOFF signal, used to disable all I/O devices during a test mode. The IO0FF signal is available at the output of a buffer 375. The PH2 signal is the micropro-cessor's phase 2 clock.
The outputs of the PLA's 366, 368, 370, 372, 374, 376 and 378 represents register select signals ADZh, AMZh, AVSFh, ACSFh, ADCRh, ANUXh and ACFRh indicating that a particular register has been addressed by the micropro-cessor 30. For example if the address $0020 is placed on the address bus ADDR[4...0], the register ADCR will be selected. Similarly, when the addresses of the other registers are placed on the address bus ADDR[4...0] in ac-cordance with Table 7, those registers will be selected.
The output signals from the PLA's 366, 368, 370, 372, 374, 376 and 378 are applied to D inputs of the register select flip-flops 350, 352, 354, 356, 358, 360 and 362. Timing for these register select flip-flops is provided by the phase 2 clock signal PH2h, applied to the clock inputs CK of these flip-flops 350, 352, 354, 356, 358, 360 and 362 through a pair of inverters 380 and 382 and an inverted phase 2 clock signal, available at the output of the inverter 380, applied to the CK inputs of these flip-flops. A reset signal RESETh from the micro-processor control bus CPUCTL[3...0] is applied to the re-set inputs R of the flip-flops 350, 352, 354, 356, 358, 360 and 362 by way of an inverter. 384 to set these flip-flops to zero on reset. The output of the register select flip-flops 350, 352, 354, 356, 358, 360 and 362 are the register select signals ADCRh, AMU'Xh, ACFRh, ADZh, AMZh, AVSFh and ACSFh.
ACFR REGISTER
The ACFR register is a read-write register uti-lized by the A/D subsystem 78. This register includes the flip-flops identified by the reference numerals 386, 388, 390, 392, 394, 396 and 398 (FIG. 29).
The ACFR register can be read or written to by the microprocessor 30. More specifically, the D inputs of the flip-flops 386, 388, 390, 392, 394, 396 and 398 are tied respectively to the data bus DATA[7...0] to allow the microprocessor 30 to write to this register. The output Q
of these flip-flops' are also tied to the data bus DATA[7...0] by way of the tristate devices 408, 410, 412, 414, 416, 418, 420 and 422 to allow this register to be read.

During read operations the tristate devices 408, 410, 412, 414, 416, 418, 420 and 422 are under the control of a read control NAND gate 424 and a read-write control flip-flop 426 to allow the Q outputs of these flip-flops to be tied to the data bus DATA[7...0] and read by the microprocessor 30. The tristate device 422 for the ACFR[4] bit has its input tied to ground. Thus, this bit will always read zero.
A read signal is developed by the NAND gate 424.
The NAND gate 424 is a two input NAND gate and is under the control of the read-write control flip-flop 426 and the ACFR select flip-flop 354. A read signal READh from internal control bus CPUCTL[3...0] is applied to a D input of the read-write control flip-flop 426. Timing for this flip-flop is a phase 2 clock sign PH2h, applied to a clock input CK and an inverted phase 2 clock signal from the output of the inverter 380, applied to the CK input of a flip-flop 426. The Q output of the flip-flop 426 is a read clock signal RDCLKh, which is applied to the NAND
gate 424. Thus, any time the microprocessor 30 addresses the ACFR register (eg. $0023) and places a read signal READh on the computer control bus CPU'CTL[3...0], the flip-flops 386, 388, 390, 392, 394, 396 and 398 as well as the ACFR[4] bit will be read.
During write operations the tristate devices 408, 410, 412, 414, 416, 418 and 420 are normally in a high impedance state. A write control signal is applied to the D inputs of these flip-flops. The write control signal is under the control of a write control NOR gate 428 and a NAND gate 430. The NOR gate 428 is a two input NOR gate with a one input from the phase 2 clock PH2h and one input from the read-write control flip-flop 426. The output of the NOR gate 428 is a write signal WRCLKh. The write signal WRCLKh is applied to one input of the dual input NAND gate 430. The other input to the NAND gate 430 is the ACFR register select signal A.CFRh. The output of the NAND gate 430 is then applied inputs of the ACFR
flip-flops 386, 388, 390, 392, 394, 396 and 398. The data bus DATA[7...5] and DATA[3...0] are applied to the D in-puts of these flip-flops to allow the microprocessor 30 to write to them. The bit ACFR[4] is tied to digital ground.
The ACFR register may be reset by the micropro-cessor 30. More specifically, a reset signal RESETh from the control bus CPUCTL[3...0] is applied to the reset in-puts R of the flip-flops 386, 388, 390, 392, 394, 396 and 398 through an inverter 432.
As heretofore discussed, the ACFR register is a configuration register used to configure the A/D subsystem 78. Thus the Q outputs of the flip-flops 386, 388, 390, 392, 394, 396 and 398 are connected to inverters 434, 436, 438, 440, 442, 444 and 446. The outputs of the inverters 434, 436, 438 and 440 are tied to an internal bus ACFR[3...0]. The outputs of the inverters 444 and 446 are tied to an internal bus ACFR[7,6]. The output of the in-verter 442 is applied to an internal bus ACFR[5] and also is used as a signal ADPUh.
The RDCLKh signal, available at the output of the read write control flip-flop 426, is used to develop a state machine clock signal SMCLKh for use in auto-zero and auto-range state machines to be discussed below. The SMCLKh signal is available at the output of a buffer 447.
The input to the buffer is a MUX 448. The MUX 448 allows for inputs from an external clock source signal CLKSRCh under the control of test circuitry applied to its select input SL. During normal operation, the SMCLK signal is developed by a flip-flop 450. Timing for the flip-flop 450 is an inverted phase 2 clock signal, available at the output of the inverter 380. This flip-flop 450 may be re-set by the microprocessor 30. An output from a NAND gate 452 is applied to a D input of the flip-flop 450. The NAND gate 452 is a dual input NAND gate. One input to the NAND gate 452 is the RDCLKh signal. The other input to the NAND gate 452 is an output of an OR gate 454. The in-puts to the OR gate 454 are the ACSFh and AVSFh signals which indicate that the AVSF or ACSF registers have been addressed by the microprocessor 30 to allow the SMCLK

signal to be generated when autozero and autoranging operations are initiated.
ADCR REGISTER
The ADCR register is used to control the opera-tion of the A/D subsystem 78. This register is a byte wide read-write register. This register includes the flip-flops 458, 460, 462, 464 and 466 (FIG. 31). Three bits ADCR[5], ADCR[2] and ADCR[0] are tied to ground and will always read zero. More specifically, the bit ADCR[0]
is tied to ground and to the input of a tristate device 468. The output of the tristate device 468 is tied to the data bus DATA[0]. The bit ADCR[2] is also tied to ground and to a tristate device 470. The output of the tristate device 470 is tied to the data bus DATA[2]. Similarly, the bit ADCR[5] is also tied to ground and to a tristate device 472. The output of the tristate device 472 is con-nected to the data bus DATA[5].
The balance of the bits may also be read by the microprocessor 30. More specifically, the outputs of the flip-flops 458, 460, 462, 464 and 466 are coupled to tristate devices 474, 476, 478, 480 and 482. The outputs of these tristate devices are applied to the data bus DATA[1,3,4,6,7].
The tristate devices 468, 470, 472, 474, 476, 478, 480 and 482 for all the bits ADCR[7...0] are under the control of the read control NAND gate 484. Normally these tristate devices are in a high impedance state.
However, during a read operation the NAND gate 484 zables these tristate devices to connect the ADCR[7...0] bits the data bus DATA[7...0]. The NAND gate 484 is a two input NAND gate. A ADCRh signal is applied to one input. This signal is a decode signal for the ADCR register. More specifically, the ADCR register is located at memory address $0020. Thus, any time this address is written by the microprocessor 30 the ADCRh signal will be active.
The other input to the NAND gate 484 is the RDCLKh signal discussed above. Thus, any time the microprocessor 30 addresses the ADCR register and initiates a read, the NAND
gate 484 will be enabled.
The bits ADCR[1], ADCR(3] and ADCR[4] are con-trol bits which may be written by the microprocessor 30.
More specifically, the D inputs of the flip-flops 458, 460 and 462 are connected to the data bus DATA(1, 3, 4). The D inputs of these flip-flops are connected to an output of a dual input NAND gate 486. The ADCRh signal is applied to one input of the NAND gate 486 which indicates that the ADCR registers have been addressed by the microprocessor 30. A WRCLKh signal is applied to the other input. Thus, the NAND gate 486 will be enabled any time the micropro-cessor 30 addresses the ADCR register and initiates a write operation.
The bits ADCR(7) and ADCR[6] are read only sta-tus bits generated by the flip-flops 464 and 466. These bits indicate that the auto-zero sequence is complete and the A/D conversion is complete. These flip-flops 464 and 466 are clocked by the phase 2 clock signal PH2h by way of two inverters 488 and 490. Status signals EOCh and EOAZh, representative of the status of the A/D subsystem 78 and the auto-zero operation, are applied to the D inputs of these flip-flops 464 and 466 by way of control circuitry discussed below. More specifically, an end of auto-zero signal EOAZh, which indicates that the auto-zero process has finished is applied to an S input of a flip-flop 492 by way of an inverter 494. The Q output of the flip-flop 492 is applied to a D input of a delay flip-flop 496. The Q output of the flip-flop 496 is applied to the D input of the flip-flop 464 by way of a buffer amplifier 498. The Q
output of the flip-flop 464 is applied to the data bus DATA[6] by way of the tristate device 480 and a buffer am-plifier 500 to generate an end of auto-zero flag.
An EOCh signal is applied to the flip-flop 466, by way of an inverter 504 and control circuitry discussed below. The EOCh signal indicates the end of the A/D con-version process. The output of the inverter 504 is ap-plied to an S input of a flip-flop 502. A Q output of the flip-flop 502 is applied to a D input of a flip-flop 506.
The Q output of the delay flip-flop 506 is applied to the D input of the flip-flop 466 by way of a buffer amplifier 508. The output of the buffer 508 is applied to the D in-put of the flip-flop 466. The Q output of the flip-flop 466 is applied to the data bus DATA[7] by way of the tri-state device 482 and a buffer amplifier 510 to generate an A/D conversion complete flag.
Timing for the flip-flops 496 and 506 is an in-verted phase 2 clock signal available at the output of the inverter 488. The flip-flops 496 and 506 as well as the flip-flops 464 and 466 may be reset by the microprocessor 30 by way of a RESETb signal available at the output of an inverter 516.
ACFR[5] is a command bit wlzich resets the auto-zero complete and A/D conversion complete flags and resets the bits ACFR[6] and ACFR[7] to remove an A/D interrupt request SYIlb signal from the microprocessor 30. The com-mand bit ACFR[5] is available on the data bus DATA[5] and is applied to one input of a dual input NAND gate 512.
The other input to the NAND gate 57.2 is a non-inverting output of the NAND gate 486 which enables write operations to the ADCR register. The output of the NAND gate 512 is applied to one input of a dual input AND gate 514. The other input to the AND gate 514 is the microprocessor re-set signal RESETb available at the output of the inverter 516. The output of the AND gate 514 is applied to the re-set inputs R of the flip-flops 492 and 502 to reset the complete flag and remove the A/D interrupt SY1B.
The A/D interrupt signal SYIlb is generated at an output of a three input NAND gate 516 at the completion of the autozero sequence and the A/D conversion when the A/D interrupt ADCR(4] is enabled. One input to the NAND
gate 516 is an output of a two input OR gate 518. The in-puts to the OR gate 518 are status bits ADCR[6] and ADCR[7], available at outputs of buffers 517 and 519, which are connected to the Q outputs of the flip-flops 464 and 466. These bits ADCR[7,6] indicate that the autozero operation is complete and the A/D conversion is complete, respectively. Another input to NAND gate 516 is the ADCR[43 bit, which indicates an interrupt enable. The third input is from the test circuitry, normally used only during testing.
The ADCR[2] is a command bit which may be writ-ten by the microprocessor 30 and is used to initiate an A/D sequence. This bit is available on the data bus DATA[2] and is applied to dual input NAND gate 520. The other input to the NAND,gate 520 is from the ADCR register write control NAND gate 486. The output of the NAND gate 520 to an S input of a flip-flop 522. A Q output of the flip-flop 522 is applied to a D input of a flip-flop 524.
The output of the flip-flop 524 is applied to a D input of another flip-flop 526 by way of a buffer 525. A Q output of the delay flip-flop 526 is used to generate the start auto-zero signal STAZh. More specifically, the Q output of the flip-flop 526 is applied to one input of a dual in-put AND gate 528 by way of a buffer 530. The other input to the AND gate 528 is from test circuitry. The output of the AND gate 528 is the STAZh signal.
The STAZh signal is cleared when the auto-zero state machine is busy (AZBSYh). More specifically, a AZBSYh signal is applied to one input of a two input AND
gate 530 by way of an inverter 531. A RESETb signal from the microprocessor 30 is applied to the other input. The output of the AND gate 530 is applied to an R input of the flip-flop 522 to reset this flip-flop. Timing for the flip-flops 524 and 526 is provided by the SMCLKh signal available at an output of an inverter 527. The flip-flops 524 and 526 are reset by the microprocessor 30 by way of the RESETb signal applied to their reset inputs R.
The ADCR[1] bit is used to control the four sample and hold switches 108, 110, 112 and 114. Spe-cifically the D output of the flip-flop 458 is applied to one input of a AND gate 532. The other input to the AND
gate 532 is from the test circuit. The output of the AND

r,o gate 532 is a signal SAMPh which controls the sample and hold switches 108, 110, 112 and 114.
The ADCR[3] bit available at the Q output of the flip-flop 462. This bit ACDR[3] is used to control the integrator reset. More specifically, the output of the flip-flop 462 is applied to a two input AND gate 534. The other input to the AND gate 534 is from the test circuit.
The output of the AND gate 534 is an integrator reset sig-nal INTRESh. This signal is applied to a buffer 757 (FIG.
35) to generate a DISCHh signal and applied to the switch 96 (FIG. 50). When this signal is high, the switch 96 (FIG. 3) disconnects and MXO pin from the current mirror 92 and shorts the MXO pin to analog ground AVSS. The switch 96 remains shorted as long as this bit remains set.
The shorting switch 96 may be open by writing a zero to ADCR[3]. This signal is also representative of the pre-sent state of the switch 96.
INPUT MULTIPLEXER CONTROLS
An 8 bit read-write register AMUX[7...0] is used to control the voltage and current input MUXes 62 and 64.
This register is divided into 2 four bit fields, one field controls the voltage inputs and generates a signal VMUX[3...0] and the other controls the current inputs and generates a signal CMUX[3...0].
The VMUX[3...0] signal is developed by the flip-flops 536, 538, 540 and 542 (FIG. 31). The D inputs of these flip-flops are tied to the data bus DATA[3...0] to allow the microprocessor 30 to write to them. The output of these flip-flops are tied to the data bus DATA[3...0]
by way of tristate devices 544, 546, 548 and 550 to allow the contents of these flip-flops to be read by the micro-processor 30. The tristate devices 544, 546, 548 and 550 are normally in a high impedance state and are under the control of a NAND gate 552. The NAND gate 522 is a two input NAND gate. A read clock signal RDCLKh is applied to one input. The RDCLKh signal indicates a read operation by the microprocessor 30 as previously discussed. An AMUXh signal is applied to the other input. The AMUXh signal represents that this register has been addressed by the microprocessor 30. More specifically the AMUX regis-ter is located in memory at $0021. Thus any time the mi-croprocessor 30 addresses this location, the AMUXh signal will be active high. This allows the microprocessor 30 to read the contents of the flip-flops 536, 538, 540 and 542 by connecting the Q outputs of these flip-flops to the data bus DATA[3...0].
Write operations to the flip-flops 536, 538, 540 and 542, are controlled by a NAND gate 554. This NAND gate 554 generates a write WRMUXb that is applied to the in-puts of these flip-flops. The NAND gate 554 is a three input NAND gate. The write clock WRCLKh signal is applied to one input. An AMUXh signal is applied to another in-put. Lastly, a signal ARBSYh is applied to the NAND gate 554. The ARBSYh signal represents that the auto-ranging system is busy and will be discussed in detail below.
The flip-flops 536, 538, 540 and 542 are reset by a RESETb signal, applied to the reset inputs R of these flip-flops. The RESETb signal allows the microprocessor to reset these flip-flops.
The.CMUX[3...0] signal is developed by the flip-flops 556, 558, 560 and 562. The D inputs of these flip-flops are tied to the data bus DATA[7...4] to allow the 25 microprocessor 30 to write to them. The Q outputs of these flip-flops are connected to the data bus DATA[7...4]
by way of tristate devices 564, 566, 568 and 570 for read operations. The tristate devices 564, 566, 568 and 570 are normally in a high impedance state and are under the 30 control of the NAND gate 552 which allows these flip-flops to be read when the microprocessor 30 initiates a read operation and places the address $00;21 on the address bus ADDR[4...0]. Write operations to the flip-flops 556, 558, 560 and 562 are controlled by the NAND gate 554 in a simi-lar manner as the flip-flops 536, 538, 540 and 542.
The outputs of the flip-flops 536, 538, 540, 542, 556, 558, 560 and 562 are used to generate a MUX con-trol signal MUXCTL[26...0] to control the current and voltage MUXes 66 and 68 as shown iri FIGS. 3 and 42. More specifically, the voltage channel NUXes 66 and 68 are con-trolled by the control signal VMU'X[3... ] while current channel MUXes 66 are controlled by the CMUX[3...0] signal.
These signals are decoded by a series of inverters, OR
gates and AND gates (FIG. 29) to generate the MUX control signals MUXCTL to allow individual control of each of the voltage and current channel MUXes. More specifically, the CMUX[3...0] signal is applied to one input of dual input .10 AND gates 572, 574, 576 and 578.. The other inputs to these AND gates is a signal CAZh, which is applied to the AND gates 572,574,576 and 578 by way of an inverter 580.
The signal CAZh indicates that the current amplifier 90 is being auto-zeroed. The signal CAZh is also used to develop a= signal CSHRTh, used in the A/D subsystem 78.
The signal CSHRTh is available at the output of an in-verter 581, serially coupled to the inverter 580.
The output of the NAND gate 572 is coupled to a chain of serially connected inverters 582, 584, 586, 588, 590, 592 and 594. The output of the NAND gate 574 is coupled to a chain of serially corinected inverters 596, 598, 600, 602, 604, 606 and 608. Similarly, the output of the NAND gate 576 is coupled to a chain of serially con-nected inverters 610, 612, 614, 616, 618, 620 and 622.
Lastly, the NAND gate 578 is applied to a chain of seri-ally connected inverters 624, 626, 628, 630, 632, 634 and 636. The outputs of the inverters 594,608, 622 and 636 are coupled to inputs of dual input OR gates 638, 640, 642 and 644. The other inputs to these OR gates are the out-puts from the inverters 582, 596, 610 and 624. The out-puts of the NAND gates 572, 574, 576 and 578 are applied to inputs of dual input OR gates 646, 648, 650 and 652, respectively. The other inputs to these OR gates are from the outputs of the inverters 592, 606, 620 and 632, re-spectively. The outputs of the OR gates 638, 640, 642, 644, 646, 648, 650 and 652 are applied to inputs of dual input AND gates 654, 656, 658, 660, 662, 664, 666 and 668, respectively. The ACFR[3...0] bits from the internal bus ACFR[3...0] are applied to the other inputs of these AND
gates to control whether the input MUXes 66 (FIG. 3) are in a current mode or a voltage mode. A one in these bits selects the current mode. More specifically, the ACFR[3]
bit is applied to the inputs of the AND gates 654 and 656.
The ACFR[2] bit is applied to the inputs of the AND gates 658 and 660. The ACFR[1] bit is applied to the inputs of the AND gates 608 and 610. Lastly, the ACFR[0] bit is ap-plied to the inputs of the AND gatfas 666 and 668. The outputs of the AND gates 654, 656, 658, 660, 662, 664, 666 and 668 are decode signals MUXCTL[20...13] which allow for individual control of the current channel MUXes 66.
The sample and hold switches 108, 110, 112 and 114 may also be individually controlled by decode cir-cuitry (FIG. 34) which includes inverters 670, 672, 674, 676, 678 and 680 and three input AND gates 682 and 684.
More specifically, the inverters 670, 672, 674 and 676 are tied to the internal ACFR bus ACFR[3...0]. The outputs of the inverters 670 and 672 are applied to the AND gate 682 along with a SAMPh signal, available at its output of the NAND gate 532 (FIG. 31), which indicates that the command bit ACFR[1] has been set. The outputs of the inverters 674 and 676 are applied to the AND gate 684 along with the SAMPh signal. The SAMPh signal is also tied to the in-verters 678 and 680 and the AND gate 684 represent the signal MUXCTL[24...21] which allows individual control of the sample and hold switches 108, 110, 112 and 114.
The VMUX[3...0] bits of the AMUX register con-trol the voltage channel MUXes 66 and 68 to generate the MUXCTL[10...0] signals and to generate the MUXCTL[10...0]
signals (FIG. 35). The MUXCTL[26, 25, 12, 11] signals (also shown on FIG. 30) are used during a testing mode.
More specifically, the voltage channel MUXes 66 and 68 are selected by the VMUX[3...0] bits. These four bits are de-coded by circuitry (FIG. 35) consisting of buffer ampli-fiers 686, 688, 690 and 692; inverters 694, 696, 698 and 700; quad input AND gates 702; 704, 706, 708, 710, 712, 714, 716, 718, 720 and 722; and dual input AND gates 724, 726, 728, 730, 732, 734, 736, 738, 740, 742 and 744. More specifically, the VMUX[3...0] bits are applied to the in-puts of the buffer amplifiers 686, 688, 690 and 692 and the inverters 694, 696, 698 and 700. The output of the buffer amplifier 686 is applied to the inputs of the AND
gates 718, 720 and 722. The output of the inverter 694 is applied to the inputs of the AND gates 702, 704, 706, 708, 710, 712, 714 and 716. The output of the buffer amplifier 688 is applied to the inputs of the AND gates 710, 712, 714, 716, 718 and 722. The output of the inverter 696 is applied to the inputs of the AND gates 702, 704, 706, 708 and 720. The output of the buffer amplifier 690 is ap-plied to the inputs of the AND gates 706, 708, 714, 716, 718 and 722. The output of the inverter 698 is applied to the inputs of the AND gates 702, 704, 710, 712 and 720.
The output of the buffer amplifier 692 is applied to the inputs of the AND gates 704, 708, 712, 716 and 722.
Lastly, the output of the inverter 700 is applied to the inputs of the AND gates 702, 706, 710, 714, 718 and 720.
The output of the AND gates 702, 704, 706, 708, 710, 712, 714, 716, 718, 720 and 722 are a decode of the AMUX[3...0]
bits. The outputs of these AND gates are applied to the inputs of dual input AND gates 724, 726, 728, 730, 732, 734, 736, 738, 740, 742 and 744. The other input to these AND gates is an AND gate 746 which controls write opera-tion to the voltage channel MUXes. More specifically, the AND gate 746 is a two input AND gate. A WRMUXb signal is applied to one input. The other input to the AND gate 746 is a signal VAZh by way of an inverter 748. As will be discussed below, the signal VAZh is active high and indi-cates when the voltage amplifier 80 is being zeroed. This signal will be discussed in detail below. The outputs of the AND gates 724, 726, 728, 730, 732, 734, 736, 738 and 740 represent the signal MUXCTL[9...0].
As will be discussed in more detail below, auto-ranging is inhibited when the current channels are selected. Thus the output of the AND gate 720 is used to generate a signal MXOSELh by way of an inverter 750. More specifically, a signal MXOh, which indicates that a cur-rent channel has been selected, is generated at the output of an AND gate 752 and corresponds to an MUXCTL[9] signal.
The AND gate 752 is a two input AND gate. One input is from the test circuit. The other in;put is from an OR gate 754. The OR gate 754 is a two input OR gate. One input is from a test circuit. The other input is from the AND
gate 742 which indicates that the current channels have been selected.
A VNULLh signal is developed at the output of a buffer amplifier 756. This VNULLh signal controls the zero switch 86 (FIGS. 31 and 49) for auto-zeroing the voltage amplifier 80. The input to the buffer amplifier 756 is an output of a two input AND gate 758. One input to the AND gate 758 is the VAZh signal indicating that the amplifier 80 is being autozeroed. The other input to the AND gate 758 is the same signal VAZh applied by way of in-verters 748 and 760.
An AGNDh signal is developed at the output of a two-input OR gate 761. One input to the OR gate 761 is the output from the AND gate 744. The VNULLh signal is applied to the other input. The AGNDh signal is used to connect the voltage channels to ground (FIG. 3). The AGNDh signal is available as MUXCTL[l0].
Lastly, MUXCTL[26,25,12,11] are used in conjunc-tion with the test circuit.
AUTO-ZERO REGISTERS ADZ AND AMZ
The ADZ and AMZ registers are used in connection with the auto-zero logic 98 for the current and voltage amplifiers 80 and 90. The auto-zero logic corrects for the offsets in the amplifiers 80 and 90 created by using a CMOS process to fabricate these amplifiers.
ADZ REGISTER
The ADZ register (FIG. 36) is a 6 bit read-write register which contains the offset correction value for the voltage amplifier 80. As previously discussed, write operations to this register are intended for diagnostic and verification purposes only. This register is loaded with the correction value for the amplifier 80 at the com-pletion at the auto-zero sequence.
More specifically, the data bus DATA[7...0] is applied to this register, which includes the flip-flops 762, 764, 766, 768, 770 and 772. MUXes 774, 776, 778, 780, 782 and 784 allow the inputs of these flip-flops to be connected to either the data bus DATA[7...0] or to a zero bus ZERO[5...0). The ZERO[5...0] bus contains the offset correction value for the amplifier being zeroed and allows the offset correction value to be written to the-ADZ register. The data bus DATA[5...0] bits are applied to the A inputs of the MUXes 774, 776, 778, 780, 782 and 784. The ZERO[5...0] bus signal is applied to the B in-puts of these MUXes. A ZERSEL signal is applied to the select inputs SEL of these MUXes. The ZERSEL signal con-trols whether the ADZ register is loaded from the data bus or the zero bus. The outputs of the MUXes 774, 776, 778, 780 and 782 are applied to the D inputs of the flip-flops 762, 764, 766, 768, 770 and 772. The ZERSELh signal (FIG.
38), generated by the autozero state machine, indicates that the state machine is in state S3. In state S3, the offset correction value is latched into the ADZ register by the VZCLKh signal discussed below. The VZCLKh signal is developed by the auto-zero state rnachine and is avail-able at the output of a buffer 803. This signal VZCLKh is applied to the inputs of the flip--flops 762, 764, 766, 768, 770 and 772.
The Q outputs of the flip-flops 762, 764, 766, 768, 770 and 772 are applied to an internal bus VZERO[5...0) for the voltage amplifier 80. The Q outputs of these flip-flops are also connected to the data bus DATA[5...0] by way of tristate devices 786, 788, 790, 792, 794 and 796 to allow these flip-flops to be read by the microprocessor 30. The bits ADZ[7,6] will always read zero since these bits are tied to the data bus DATA[7,6) by way of tristate devices 798 and 800 which have grounded inputs.

The tristate devices 786, 788, 790, 792, 794, 796, 798 and 800 are normally in a high impedance state except during a read operation when these tristate devices allow the outputs of the flip-flops 762, 764, 766, 768, 770 and 772 to be tied to the data bus DATA[7...0]. These tristate devices are under the control of a NAND gate 802.
The output of the NAND gate 802 is a signal VZRDb signal, which represents a ADZ register read. The inputs to the NAND gate 802 are the signals RDCLKh and ADZh. The read signal RDCLKh is the read clock signal. The ADZh-signal represents a microprocessor 30 has placed the address $0024 on the address bus ADDR[4...0]. The ADZ register is loaded by a VZCLKh signal.
The ADZ register can also be reset by the micro-processor 30. More specifically, a RESb signal is applied to the reset inputs of the flip-flops 762, 764, 766, 768, 770 and 772.
AMZ REGISTER
The AMZ register is a 6 bit read-write register that contains the offset correction value for the current mirror amplifier 92. This register is loaded with the correction value at the completion of the auto-zero se-quence. Write operations to this register are diagnostic and verification purposes only.
The AMZ register includes the flip-flops 804, 806, 8'08, 810, 812 and 814. The Q-outputs of the flip-flops 804, 806, 808, 810, 812 and 814 are tied to an in-ternal bus CZERO[5...0].. The data bus DATA[7...0] is ap-plied to the inputs of these flip-flops by way of the MUXes 774, 776, 778, 780, 782 and 784. These flip-flops are clocked by a CZCLKb signal, developed by the auto-zero state machine to latch the offset correction value for the current amplifier 90 (FIG. 3) into the AMZ register in state S7 (see Appendix C) as discussed below. The CZCLKb signal is applied to D inputs of these flip-flops by way of a buffer 816. A RESb signal is applied to the reset inputs R of these flip-flops for reset. The Q outputs of the flip-flops 804, 806, 808, 810, 812 and 814 are applied to the data bus DATA[5...0] by way of tristate devices 818, 820, 822, 824, 826 and 828 The bits AMZ[7,6] are not used and will always read zero. More specifically, the data bus DATA[7, 6] are connected to the outputs of tri-state devices 830 and 832, respectively. The input to the tristate devices 830 and 832 are connected to ground.
Thus the AMZ[7, 6] bits will always read zero.
All of the tristate device.; 818, 820, 822, 824, 826, 828, 830 and 832 are under the control of a NAND gate 834. The output of the NAND gate 834 is :a signal CZRDb, which indicates an AMZ register read. 'The RDCLKh is ap-plied to one input of the NAND gate 834. An AMZh signal is applied to the other input. The AMZh represents that the microprocessor 30 has written to the address $0025.
The flip-flops 804, 806, 808, 810, 812 and 814 are reset by the microprocessor 30. More specifically, a RESb signal is applied to the reset inputs of these flip-flops.
AUTO-ZERO STATE MACHINE
An auto-zero state machine generates the se-quencing required to zero the voltage and current ampli-fiers 80 and 90 by adjusting the internal bias currents.
During an autozero sequence, the amplifier's inputs and output are isolated from associated circuitry and the in-puts are grounded. The autozero state machine differen-tially varies the bias currents in discrete steps by way of current divider (FIG. 52) until the amplifier's output changes states. The autozeroable amplifier is illustrated in FIG. 53. The number of steps corresponding to the change in state represents the offset correction value.
This correction value stored in the ADZ and AMZ registers is discussed above.
The auto-zero state machine is illustrated in Appendix C, Figure C-1. An auto-zero state transition table, state diagram and transition table state equations are provided in Appendix C.
The state machine includes three state register flip-flops 836, 838 and 840 as well as NAND gates 842, 844, 846, 848, 850, 852, 854, 856, 858, 860, 862, 864 and 866 and as shown in FIG. 38. There are also various in-puts to and outputs from the state machine as discussed below. The state register flip-flops produce state vari-ables ROh, ROb, Rlh, Rlb, R2h and R2b. These variables, along with the variables ROd, Rld and R2d, available at the outputs of the NAND gates 848, 856 and 866 are used in the development of the state equations in Appendix C.
Each of the state register flip-flops is clocked by the SMCLKh signal discussed.above. The reset signal RESETb, available at the output of an inverter 892 is ap-plied to the reset inputs R of these flip-flops.
The outputs of the state register flip-flops 836, 838 and 840 define the auto-zero state assignments for the auto-zero state machine in accordance with Table Cl, Appendix C. Eight permissible states S0-S7 are de-fined as follows:
SO - Idle. The state machine is in the idle state waiting for a start auto-zero signal STAZh to become active. The state machine also stays idle as long as the auto-range state machine is busy. This interlock betwee:;
the two state machines is implemented by an auto-range busy signal ARBSYh. When the STAZh signal is active, the ARBSYh signal is inactive to allow the state machine to transfer to state Sl.
Si - Five microsecond delay. States Si and S2 form a loop which is repeated until either the voltage am-plifier output changes state or a counter 868 reaches a final count. 'During state S1, a time request signal TIMREQh is active and a time out signal TIMOUTh is moni-tored. The act of the time request signal going active, which happens in state S1, triggers a five microsecond timer (FIG. 37). When the timer has timed five micro-seconds, the time out TIMOUTh=signal becomes active. This causes the state machine to transfer to either state S2 or state S3. The state machine proceeds to state S2 if the amplifier output VAMPh signal is still high indicating that the bias current is not yet high enough and the counter 868 has not yet reached the final count as indi-cated by a FULLb flag. The state machine transfers to state S3 if eitherthe amplifier output signal goes low or the counter 868 reaches the final count. The five microsecond delay permits the amplifier 80 to settle and reach a stable output.
S2 - clock counter. State S2 is entered when the counter 868 does not yet contain a full count and the count is not enough to generate a suitable bias current for zeroing the amplifier-80. The clock counter signal is active in state S2 incrementing the count value by one.
The state machine always transfers to state Si on the next clock pulse.
S3 - Latch ADZ value. State S3 is reached when either the voltage amplifier output has switched states or the counter 868 has reached the final count. The present count in the counter is latched into the ADZ register by activating the VZCLKh signal for one state time. The state machine always transfers to state S4.
S4 - Clear Counter. State S4 sets up the state machine for auto-zeroing the current amplifier 90. The counter is cleared via a ZERRESb signal and the MUXes 774, 776, 778, 780, 782 and 784 on the output of the counter switch to direct the count value to the AMZ register and the current amplifier 90. The state machine always trans-fers to state S5.
S5 - Five microsecond delay. State S5 and S6 are analogous to state Si and S2 except the counter is ap-plied to the current amplifier 90 and the output of the current amplifier CAMPh is examined to transfer from S5 to S7.
S6 - Clock Counter. This state is identical to state S2. The state machine always transfers to state S5.
S7 - Latch AMZ value. This state is analogous to state S3. Current contents of the counter 868 are latched in the AMZ register. Additionally the end of auto-zero signal EOAZh is active to indicate that the auto-zero operation has been complete.

AUTO-ZERO INPUTS
There are various input and on signals to the auto-zero machine identified as follows:
ARBSYh - Auto-Range Busy. This signal is active high when -the auto-range state machine is not idle. This signal is applied to the state machine by way of an in-verter 870. This signal is discussed in connection with the auto-range state machine.
STAZh - Start Auto-Zero. This signal is active high when the initiate auto-zero bit of a command register has been written. This signal is available at the output of the AND gate 528 (FIG. 31).
VAMPb - Voltage Amp Output. This signal is ac-tive low when the voltage amplifier 80 has been auto-zeroed. The VAMPh signal is the output signal of the voltage amplifier 80 and is applied to a flip-flop 889.
CAMPb - Current Amp Output. This signal is low when the current amplifier 90 has been auto-zeroed. The CAMPh signal is available at the output of the current am-plifier 90. This signal is applied to a flip-flop 891.
TIMOUTh - Time Out. This signal is active high when a five microsecond time delay has expired. The TIMOUTh signal is available at the output of a NAND gate 870 (FIG. 37). The NAND gate 870 is a two input NAND
gate. One input is active during the test mode. The other input is from a five microsecond timer comprised of flip-flops 872, 874, 876 and 878 and a NAND gate 880. The Q outputs of these flip-flops are tied to the inputs of the NAND gate 880. The flip-flops 842 and 846 are con-figured such that their Q outputs are connected to their D
inputs. The Q outputs of the flip-f'lops 872, 874 and 876 are applied to clock inputs CK of the flip-flops 874, 876 and 878, respectively. A TIMOUTb signal, available at an output of an inverter 871 (FIG. 38), is also applied to the auto-zero state machine. The TIMOUTb signal is ap-plied to the NAND gate 860. The SMCLKh signal is applied to an inverter 882, whose output is connected to the clock input CK of the flip-flop 872. The reset inputs R of the flip-flops 872, 874, 876 and 878 are controlled by an OR
gate 884. The OR gate 884 is a two input OR gate. Sig-nals AZTIMh and ARTIMh are applied to the inputs.
FULLb - Counter Full. This signal is active low when the counter 868, used to set a bias current, is at 111111 count. This is a maximum bias count value. The counter 868 includes the flip-flops 872, 874, 876, 878, 880 and 882 and a NAND gate 884 connected as shown in FIG.
33. The Q outputs of the flip-flops 872, 874, 876, 878, 880 and 882 are connected to the NAND gate 884, which is the FULLb flag and the internal ZERO[5...0] bus. The FULLb flag is applied to the inputs of the NAND gates 842 and 854. It is also applied to an OR gate 886 by way of an inverter 888. The other input to the OR gate 886 is from a flip-flop 889. The input to the flip-flop 889 is a signal VAMPh, which is the output of the voltage amplifier 80. This flip-flop is clocked by the complement of the SMCLKh signal, available at an inverter 890. The flip-flop 889 is reset by a RESETb signal available at the out-put of an inverter 892. The output of the OR gate 886 is applied to the NAND gate 858.
RESETh - Reset. This signal is active high to reset the state register flip-flops 836, 838 and 840 dur-ing system reset. This signal is available at the output of the inverter 892.
AUTO-ZERO OUTPUTS
ZERRESb - Zero Counter Reset. This signal is active low to reset the counter 868 used to generate the bias counter and is active in states SO and S4. This sig-nal is available at an output of a NfAND gate 894.
ZERCLKh - Zero Counter Clock. This signal is active high to increment the bias current counter 868.
This signal is active in states S2 and S6 and is available at an output of a NAND gate 896.
TIMREQh - Time Request. This signal is active high to request a five microsecond delay period and is ac-tive in states Si and S5. This signal is available at an output of a two input OR gate 898. Outputs from AND gates 900 and 902 are applied to inputs of the OR gate 898. In-puts to these AND gates are from the state machine.
AZBSYh - Auto-Zero Busy. This signal is active high to indicate when an auto-zero operation is active.
This signal is used to interlock the auto-zero and auto-range state machines. The AZBSYh signal also inhibits the microprocessor 30 from writing to the auto-zero registers by disabling NAND gates which decode the register select signals AMZh and ADZh and the write clock signal WRCLKh.
This signal is active in states Si, S2, S3, S4, S5, S6 and S7. This signal is available at an inverting output of a NAND gate 904. The output of the NAND gate 904 is also the ZERSELh signal.
EOAZh - End of Auto-Zero. This signal is in ac-tive high signal which sets the flip-flop 492 (FIG. 31) in the ADCR status register to indicate an auto-zero process has finished. It also clears a flip-flop which generates the STAZh signal and is active in S7. This signal is available at an output of an AND gate 906.
CAZh - Current Auto-Zero. This signal is active high to indicate when the current amplifier 90 is being auto-zeroed. This signal is active in states S4, S5 and S6. This signal is available at an inverting output of a two input NOR gate 908. Inputs to the NOR gate 908 are from AND gates 910 and 912 which is connected to the state machine.
VAZh - Voltage Auto-Zero. This signal is active high to indicate when the voltage amplifier 80 is being auto-zeroed and is active in state S1 and S2. This signal is available at a non-inverting output of a NAND gate 914.
CZCLKh - Current Zero Register Clock. This sig-nal is active low to clock the AMZ register for the cur-rent amplifier bias count. When the state machine is idle, this signal is generated by decoding the register select signal AMZh and the write clock signal WRCLKh.
When the state machine is active, S7 is decoded to gener-ate a clock pulse to the register. This signal is active in S7. This signal is available at an output of a two input AND gate 916. One input to the AND gate 916 is an inverting output from the NOR gate 908. The other input is from a three input NAND gate 918. One input to the NAND gate 918 is a non-inverting output of the NAND gate 904. The other inputs are the AMZh and WRCLKh signals.
VZCLKh - Voltage Zero Register Clock. This sig-nal is active low to clock the ADZ register for the volt-age amplifier bias count. When the state machine is idle, this signal is generated by decoding the register select signal ADZh and the write clock signal WRCLKh. When the state machine is active, S3 is decoded to generate a clock pulse to the register. This signal is active in S3. This signal is available at an output' of two input AND gate 920. An inverting output of the NAND gate 914 is applied to one input. The other input is from a three input NAND
gate 922. The ADZh and WRCLKh signals are applied to two inputs. A non-inverting output from the NAND gate 904 is applied to the other input.
AZST bus - Auto-Zero States. This three bit wide bus contains the auto-zero state machine flip-flops 836, 838 and 840. This bus is used to permit reading of these flip-flops during a test condition.
AUTO-ZERO STATE MACHINE OPERATION
The auto-zero state machine auto-zeros the volt-age 80 and current amplifier 90. The auto-zero function is initiated by the software setting a bit in the command register which includes the flip-flops 522, 524 and 526.
More specifically, referring to FIG. 31 when the command bit ADCR[2] is written to the NAND gate 520 this, in turn, controls the flip-flops 522, 524 and 526 to generate the start auto-zero signal STAZh at the output of the AND gate 528.
The voltage 80 and current 90 amplifiers are auto-zeroed in the following manner. After the generation of the start auto-zero signal STAZh. First, the six bit counter 868 (FIG. 36) is cleared. This counter 868 is cleared by the ZERRESb signal in states SO and S4. After the six bit counter 868 is cleared the voltage amplifier 80 is placed in the auto-zero state by shorting its nonin-verting input to ground by way of the MUXes 66 and 86.
This is accomplished by the VAZh signal which is active in states S1 and S2. This signal generates an AGNDh signal at the output of an OR gate 924, which shorts the nonin-verting input of the voltage amplifier 80 to ground by way of the MUXes 66 and 86. MUX 88 removes the internal com-pensation from the voltage amplifier 80. Next the output of the counter 868 is gated onto a lERO[5...0] bus for the amplifier being auto-zeroed. Subsequently, a five microsecond delay is timed. This is accomplished by the circuitry in FIG. 37 previously discussed. At the end of the five microsecond delay, a TIMOUTh signal is generated at the output of the NAND gate 870. At the end of the de-lay, the output signal VAMPh, which is the output signal of the voltage amplifier 80, is examined. Also, the counter 868 full counter count signal FULLb is examined.
If either of these signals is active, the count is latched into the ADZ register by the state machine. Otherwise, the counter 868 is incremented and the five microsecond delay is timed again. After the count is latched the se-quence is repeated with the current amplifier 90.
AVSF AND ACSF AUTO-RANGE REGISTERS
The voltage scale register AVSF (FIG. 39) is a read-write register that is used to control operation of the voltage input ranging circuitry 84 (FIGS. 3 and 49).
The value written into this register determines the volt-age amplifier 80 auto-ranging mode. If a zero is written to this register, the voltage amplifier 80 is placed in an auto-ranging mode. A nonzero value inhibits the auto-ranging and sets the voltage amplifier 80 in a fixed gain mode. The register is not a true read-write register.
The value read from it will not necessarily be the value that was written into it. Writing a zero into the AVSF
register enables auto-ranging. However, a zero cannot be read from this register. The possible values are provided in Table 9. The value read from this register is one of the scale factors to properly scale the 8 bit A-D output..
Five values are possible: xl, x2, x4, x8 and x16.
The AVSF register includes six flip-flops 944, 946, 948, 950, 952 and 954. The D inputs of these flip-flops are connected to the data bus DATA[5...0] operations during ranging. Any non-zero value written to the AVSF
register is detected by a NAND gate 998 which disables autoranging. The inputs of the flip-flops 944, 946, 948, 950, 952 and 954 are tied to the output of a buffer amplifier 955. The input to the buffer amplifier 955 is the signal VRCLKb. This signal will be defined in connec-tion with the auto-range state machine and is used to con-trol read and write operations of the AVSF register. The Q outputs of the flip-flops 944, 946, 948, 950 and 952 are tied to the B inputs of MUXes 956, 958, 960, 962 and 964, respectively. The D output of the flip-flop 954 is a sig-nal VGAIN32h. This signal VGAIN 32h along with GAIN[4...0] from autoranging circuit which includes counter 1170 (FIG. 40) are applied to ranging circuitry 84 and MUXes 86 of the voltage amplifier 80 (FIGS. 3 and 49) to control the voltage gain. The counter 1170 as will be discussed below, includes the ranged value as a result of autoranging of the voltage amplifier 80 and the current amplifier 90. More specifically, the MUXes 956, 958, 960, 962 and 964 allow the Q outputs of the flip-flops 944, 946, 948, 950, 952 and 954 to be connected to either to a gain bus GAIN[4...0] or to A inputs of MUXes 966, 968, 970, 972 and 974. The B inputs of the MUXes 966, 968, 970, 972 and 974 are connected to ground which allows the output signals of the flip-flops 944, 946, 948, 950, 952 and 954 to either be grounded or connected to the data bus DATA[5...0] by way of tristate devices 976, 978, 980, 982 and 984 for read operations. The tristate devices 976, 978, 980, 982 and 984 are under the control of a signal VRRDb (FIG. 40) which read operations of this AVSF regis-ter.
The output of the MUXes 966, 968, 970, 972 and 974 are also tied to one input of a plurality of AND gates 986, 988, 990, 992 and 994. The other input to the AND
gates 986, 988, 990, 992 and 994 is from an inverter 996.
The input to the inverter 996 is the VAZh signal (FIG.
38), the voltage auto-zero signal, which indicates the voltage amplifier 80 autoranging is active. The output of the AND gates 986, 988, 990, 992 and 994 are connected to the VGAIN[4...0] bus which controls the autoranging MUXes 86 (FIG. 491.
The MUXes 956, 958, 960, 962 and 964 are under the control of a NAND gate 998 which generates a signal VRZEROh. This signal indicates that the microprocessor 30 wrote a zero to the AVSF register to initiate voltage auto-ranging. The signal VRZEROh is active high and de-termines whether the voltage amplifier 80 is placed in an auto-ranging mode or a fixed gain mode. The input to the NAND gate 998 are the Q outputs of the flip-flops 944, 946, 948, 950 and 952. A zero written to the AVSF regis-ter will cause the Q outputs of the flip-flops 944, 946, 948, 950 and 952 to be high or true. This will, in turn, cause the signal VRZEROh to be active which, in turn, will cause the MUXes 956, 958, 960, 962 and 964 to connect the Q output signals from the flip-flops 944, 946, 948, 950, 952 and 954 to the VGAIN[4...0] bus for auto-ranging.
Non-zero values written to the register AVSF are detected by the NAND gate 998 will place the circuitry in a fixed gain mode. This will cause the MUXes 956, 958, 960, 962 and 964 to connect the Q output signals from the flip-flops 944, 946, 948, 950, 952 and 954 to the MUXes 966, 968, 970, 972 and 974. The MUXes 966, 968, 970, 972 and 974 either ground the Q outputs of the flip-flops 944, 946, 948, 950, 952 and 954 or allow them to be tied to the AND gates 986, 988, 990, 992 and 994 which, in turn, are connected to the VGAIN[4...0] bus. The MUXes 966, 968, 970, 972 and 974 are under the control of an AND gate 1000 which inhibits autoranging of the voltage amplifier 80 when the current mode has been selected and is being autoranged. The AND gate 1000 is a three input AND gate 1000. The VRZEROh, indicating voltage amplifier autorang-ing signal is applied to one input. The AZBSYb signal, which represents that the auto-zero signal is busy, is ap-plied to another input. The output of an AND gate 1002 is a signal CURRENTh, which represents that the current mode has been selected. The CURRENTh signal is applied to the third input of the AND gate 1000. The AZBSYb signal, used to inhibit the auto-range state machine when the auto-zero machine is active. The AND gate 1002 inhibits auto-ranging when the current subsystem is selected.
A REGRESb signal is applied to the reset inputs R of the flip-flops 944, 946, 948, 950, 952 and 954. The REGRESb signal is available at the output of an inverter 1004 (FIG. 40). The input to the inverter 1004 is the signal RESETh from the CPCTL[3...0] bus.
The current scale factor register ACSF is a read-write register used to control the operation of the current input auto-ranging circuitry. The value written to this register determines the current subsystem auto-ranging operating mode. The zero is written the current subsystem is placed in an auto-ranging mode. A non-zero value inhibits the auto-ranging mode and sets the current mirror into a fixed scale value. The register is not a true read-write register. In other words, the value read from it is not necessarily the value that was written into it. Although writing a zero into the ACSF register en-ables the auto-ranging mode, a zero will never be read from it.
The ACFR register (FIG. 39) includes the flip-flops 1006, 1008, 1010, 1012, 1014. The data bus DATA[4...0] is applied to the D inputs of these flip-flops for write operations in a fixed gain mode. A NAND gate 1048 detects non-zero values written to this register to enable a fixed gain mode. The D inputs of the flip-flops 1006, 1008, 1010, 1012 and 1014 are tied to a buffer am-plifier 1016. The input to the buffer amplifier 1016 is a signal CRCLKb, which will be discussed in connection with the auto-range state machine, latches the gain value in this register at the completion of autoranging. The sig-nal REGERSSb is applied to the reset inputs R. The MUXes 1018, 1020, 1022 and 1024 allow the Q outputs of the flip-flops 1006, 1008, 1010 and 1012 to be connected to the CGAIN[4...0] bus, indicating that the auto-range function has been selected, or to MUXes 1026, 1028, 1030 and 1032.
The CGAIN[3...0] bus is applied to the current mirror 92 (FIG. 50) to control the divider ratio of the current mir-ror 92. The MUXes 1026, 1028, 1030 and 1032 either allow the output signals Q from the flip-flops 1006, 1008, 1010 and 1012 to either be grounded or applied to the gain bus CGAIN[3...0] or tied to tristate devices 1034, 1036, 1038 and 1040 to allow the them to be read at the data bus DATA[3...0]. More specifically, the Q output of the flip-flop 1006 is applied to a B input of the MUX 1018. An A
input of the MUX 1018 is applied to the gain bus bit GAIN[3]. The Q output of the flip-flop 1006 is also ap-plied to inputs of OR gates 1042, 1044 and 1046. The Q
output of the flip-flop 1008 is also applied to other in-puts of the OR gates 1042, 1044 and 1046. Also, the Q
output of the flip-flop 1010 is ap:plied to the OR gates 1044 and 1046. Lastly, the Q output of the flip-flop 1012 is also applied to an input of the O:R gate 1046.
The outputs of the OR gates 1042, 1044 and 1046 are applied to the B inputs of the MUXes 1020, 1022 and 1024. The fixed gain bus bits GAIN[3...0] are applied to the A inputs of the MUXes 1018, 1020, 1022 and 1024. The MUXes 1018, 1020, 1022 and 1024 are under the control of a NAND gate 1048. The NAND gate 1048 generates a CRZEROh signal which indicates that the microprocessor 30 has written a zero to the ACSF register to initiate current auto-ranging. A non-zero value wri'tten to this register which places the current mirror 92 into a fixed scale value. The Q outputs of the flip-flops 1006, 1008, 1010, 1012 and 1014 are applied as inputs to the NAND gate 1048.
If a zero is written into the ACSF register the MUXes 1018, 1020, 1022 and 1024 connect the Q output of the flip-flop 1006 and the Q outputs of the flip-flops 1008, 1010 and 1012 to the gain bus GAIN[4...0]. Non-zero values written into the ACSF register causes the MUXes 1018, 1020, 1022 and 1024 to be connected to the A inputs of the MUXes 1026, 1028, 1030 and 1032. The B inputs of the MUXes 1026, 1028, 1030 and 1032 are grounded. The MUXes 1026, 1028, 1030 and 1032 are: under the control of an AND gate 1049 which disables the auto-ranging of the current amplifier 70 when the system is in a voltage mode.
In this condition, the output signals from the flip-flops 1006, 1008, 1010 and 1012 are grounded. There are two in-puts to the AND gate 1049. One input to-the AND gate 1049 is from the NAND gate 1048. The output of a NAND gate 1048 indicates that auto-ranging has not been selected.
The Q outputs of the flip-flops 1006, 1008, 1010, 1012 and 1014 are applied as inputs to the NAND gate 1048. The other input to the AND gate 1049 is an inverter 1050.
The output of the inverter is a VOLTAGEh signal which indicates that the MUX 66 is in a voltage mode. The input to the inverter 1050 is the output of the AND gate 1002 which indicates that the MUX 66 is in a current mode. The inputs to the AND gate 1002 is a MXOSELh signal (FIG. 35) which indicates that a current mode has been selected.
The outputs of the MUXes 1026, 1028, 1030 and 1032 are connected to a pair of serially coupled inverter ampli-fiers 1052, 1054, 1056, 1058, 1060, 1062, 1064 and 1066.
The outputs of the inverters 1054, 1058, 1062 and 1066 are applied to the gain bus CGAIN[3...0] as well as to the tristate devices 1034, 1036, 1038, 1040 either directly or by way of AND gates, 1068, 1070 and 1072. More spe-cifically, the output of the inverter amplifier 1054 is applied to the tristate device 1034. The output of the inverter amplifier 1058 is applied ito an AND gate 1068 along with the output of the inverter amplifier 1052. The output of the inverter amplifier 1062 is applied to the AND gate 1070 along with the output of the inverter ampli-fier 1056. The output of the inverter amplifier 1066 is applied to the input of the AND gate 1072 along with the inverter amplifier 1060.

These tristate devices 1034, 1036, 1038 and 1040 are also applied to the data bus DATA[3...0] to allow the ACSF register to be read. The output of the inverter am-plifier 1064 is applied to a tristate device 1068. This tristate device 1068 is applied to the DATA[4] bit. The tristate devices 1034, 1036, 1038, 1040 and 1068 are con-trolled by a signal CRRDb. This signal will be identified in connection with the auto-range state machine.
A signal AZST[2...0], representative of the states of the auto-zero state machine, is applied to AND
gates 1070, 1072 and 1074 (FIG. 36). This signal repre-sents the Q output signals of the auto-zero state register flip-flops 836, 838 and 840 (FIG. 38). Also applied to the AND gates 1070, 1072 and 1074 are test signals. The TEST signals are also applied to the reset input R of the flip-flop 954. The outputs of the AND gates 1070, 1072 and 1074 are applied to tristate devices 1076, 1078 and 1080. The outputs of the tristate devices 1076, 1078 and 1080 are applied to the data bus DATA[7...5] to allow these signals to be read by the microprocessor 30. The tristate devices 1076, 1078 and 1080 are under the control of a signal CRRDb.
The states of the auto--range state machine ARST[2...0] are applied to the inputs of AND gates 1082, 1084 and 1086. Test signals are also applied to the in-puts of the AND gates 1082, 1084 and 1086. The ARST[2...0] signal represents the states of the auto-rang-ing state register flip-flops and will be discussed in connection with the auto-ranging state machine. The out-puts of the AND gates 1082, 1084 and 1086 are applied to tristate devices 1088, 1090 and 1092. The outputs of these tristate devices are applied to the data bus DATA[7...5]. The tristate devices 1088, 1090 and 1092 are under the control of a VRRDb signal. This signal controls the reading of the auto-range state register flip-flops states by the microprocessor 30 and will be discussed in connection with the auto-range state machine.

AUTO-RANGE STATE MACHINE
The auto-range state machine is illustrated in FIG. 40. A state transition table, state diagram and transition state equations are provided in Appendix D.
This state machine auto-ranges the voltage 80 and current 90 amplifier gains before initiating an analog to digital conversion. During voltage autoranging, the output signals of the voltage amplifier 80 is compared with a predetermined value by the comparator 74 (FIG. 3) to determine if the amplifier output is either too large or out of range of the A/D. At the start of the autorang-ing a gain shift register 1170 (FIG. 40) is initialized and incremented during a predetermined time period (TIMOUTh). When either the comparator 74 switches state or the time period expires, the value of the gain shift register will represent the gain. This gain value is stored in the AVSF register and is used to control the ranging circuitry 84.
During current autoranging, ranged currents are directed out of the MXO pin and applied to an external register. The voltage across the external resister is then applied to a voltage input. Ranging is then accom-plished in a similar manner as the voltage autoranging.
Gain values in this mode are stored in the ACSF register.
The auto-range state machine includes three state register flip-flops 1128, 1130 and 1132; NAND gates 1134, 1136, 1138, 1140, 1142, 1144, 1146; AND gates 1148, 1150, 1152, 1154, 1156, 1158, 1160 and 1162; OR gate 1164 and various output gates connected as shown in FIG. 40.
The Q outputs of the state flip-flops 1128, 1130 and 1132 indicate the state variables ROh, Rlh and R2h. The Q
output of the state register flip-flops 1128, 1130 and 1132 generate the state variables ROb, R1b and R2b. The state variable ROd is generated at the output of the NAND
gate 1138. The state variable R1d is generated at the output of the NAND gate 1146. The state variable R2d is generated at the output of the OR gate 1164.

Each of the state register flip-flops 1128, 1130 and 1132 is clocked by the SMCLKh signal. The reset sig-nal REGRESb, available at the output of the inverter 1004, is applied to the reset inputs R of these state register flip-flops.
The outputs of the state register flip-flops 1128, 1130 and 1132 define permissible output states for the auto-range state machine in accordance with Table D-1, Appendix D. The state register flip-flops 1128, 1130 and 1132 allow for eight states. However, only seven are necessary and are defined as follows:
SO - Idle. The state machine is in the idle state waiting for a start auto-range signal (STADCh) to be active. The state machine also stays in the idle state as long as the auto-zero state machine is busy. This inter-lock between the two independent state machines is imple-mented by the auto-range busy signal (ARBSYh). When the state start auto-range signal is active and the auto-range busy signal is inactive the auto-zerc' state machine moves to state S1.
Si - Reset shift register. State S1 initializes a shift register 1170 for the type of conversion. For a voltage conversion the shift register 1170 is initialized to the binary value 0001 where the least significant set bit is set. This corresponds to a Voltage gain of 1. For a current conversion the shift register 1170 is set to the binary value 00000. This corresponds to a current gain of 1. Only the four least significant bits are used for set-ting the current gain. The least significant bit is set or cleared by the GRESh signal by additional decoding of the VOLTAGEh and CURRENTh signals.
S2 - Five microsecond delay. State S2 and S3 form a loop that is repeated until either the comparator 74 (FIG. 3) output switches or the shift register 1170 reaches the final gain. During S2, the time request sig-nal (TIMREQh) is active in the time-out (TIMOUTh) signal is monitored. When the time request signal goes active, the state machine enters the state Si, this triggers the five microsecond time delay. When the time delay has timed out, the time-out signal becomes active. This causes the state machine to transfer either to state S3 or S4. State S3 is entered if the RANGEh signal is inactive indicating that either the gain setting is not high enough yet or the shift register 1170 has not yet reached the final gain setting. The final gain setting is detected by decoding the VOLTh and CURRh signals with the fourth and fifth bits of the shift register 1170. For a current channel,-indicated by an active CURRh signal, a fourth bit indicates that a maximum gain has been reached. Maximum gain for a voltage channel is decoded by a fifth bit of the shift register 1170 and an active VOLTh signal.
The state machine transfers to state S4 when the RANGEh signal is active, if the auto-range function is ac-tive. If the auto-range function is disabled indicated by an inactive ATORNGh signal, the state machine transfers to state S4 after the five microsecond time delay. This five microsecond time delay permits the amplifier 80, 90 to settle and reach a stable output value.
S3 - Clock shift register. State S3 is entered when the shift register 1170 does not yet contain a maxi-mum gain and the gain is not enough to generate a suffi-ciently high input signal. The clock signal is active in state S3 causing the shift register 1170 to shift one bit.
For voltage channel signals a zero is shifted into the least significant bit of the shift register 1170. This causes the shift register to shift a one across the regis-ter generating the following sequence of values: 00001, 00010, 00100, 01000, 10000.
For current channels a 1 is shifted into the least significant bit which results in the following se-quence of values: 00000, 00001, 00011, 00111, 01111.
Only the four bits of the gain are used in setting the current amplifier 90. The state machine always transfers to the state S2 on the next clock pulse.
S4 - General SOC pulse. State S4 is used to generate a start of conversion pulse to the analog digital converter. The state machine stays in state S4 until the SOC3b signal becomes active at which time the state machine moves to state S5. The SOC3b signal is active when the start of conversion pulse has been active for three state machine clock periods.
S5 - Wait for conversion. The state machine is waiting for the analog end of comrersion signal while in state S5. When the analog end of conversion goes high in-dicating that the conversion has finished, the state machine transfers to state S6.
S6 - EOC pulse. End of Conversion EOAZh is ac-tive in state S6. This indicates to the commands/status register section that the conversion process has been com-pleted.
AUTO-RANGE INPUTS
The inputs to the auto-range state machine are as follows:
AZBSYh - Auto-Zero Busy. This signal is active high when the auto-zero state machine is not idle. This signal is applied to the state machine by way of an in-verter 1171.
ATORNGH - Auto-range Active. The auto-range ac-tive signal ATORNG represents that the auto-ranging has been activated when the microprocessor 30 writes a zero into a shift register 1170. More specifically, the ATORNGh signal is available at the output of an inverter 1164 (FIG. 39) while the ATORNGb signal is available at the output of a dual input NOR gate 1166 (FIG. 39). The .NOR gate 1166 is controlled by two AND gates 1168 and 1002. The VOLTAGEh signal is applied to one input of the AND gate 1116. The signal VRZEROh is applied to the other input. The output of the AND gate 1002 in applied to the other input of the NOR gate 1166. The output of the AND
gate 1002 indicates that the current mode has been selected and that the microprocessor has a zero to the ASCF register to initiate auto-ranging.
. The ATORNGb and ATORNGh signals are applied to the state machine by way of circuitry which includes an AND gate 1172, an inverter 1173, an OR gate 1174 and an AND gate 1176. The OR gate 1174 is a two-input OR gate.
One input is from the AND gate 1172. The AND gate 1172 is a three-input AND gate. The ATORNGb, TIMOUTh and RANGEh signals are applied to'the AND gate 1172. The other input to the OR gate 1174 is from a two input AND gate 1176.
One input to the AND gate 1176 is the ATORNGb signal. The other input is the TIMOUTh signal.
RANGEh - In Range Signal. This signal is active high to indicate that either the comparator 74 output sig-nal COMPb has gone low or that the gain shift register 1170 has reached the maximum gain setting for the operat-ing mode selected. The auto-ranging sequencing circuitry 76 includes the gain register 1170, an OR gate 1178, AND
gates 1180 and 1182 and a flip-flop 1184. The RANGEh sig-nal is available at the output of the NOR gate 1178.
The gain shift register 1170 is comprised of the flip-flops 1188, 1190, 1192, 1194 and 1196. The Q outputs of these flip-flops are tied to the D input of the next flip-flop in succession. The Q outputs are also tied to the gain bus GAIN[4...0]. A GCLKh signal is applied to the clock CK inputs of each of these flip-flops. The GCLKh signal is available at the output of an AND gate 1198. The inputs to the AND gate 1198 are the state register signals ROb, Rlh and R2b which indicate the auto-range state machine is in S3. Also applied to the AND
gate 1194 is the signal SNCLKb.
The GCLKh signal is used to shift a zero into the flip-flop 1188 when a voltage channel has been selected and to shift a 1 into the flip-flop 1188 when a current channel has been selected. More specifically, OR
gates 1200, 1202, AND gate 1204 and a NAND gate 1206 con-trol this function. A CURRENTh signal which is active high is applied to the input of the OR gate 1200. The other input to the OR gate 1200 is a signal GRESb avail-able at the output of the AND gate 1204. The output of the OR gate 1200 is applied to the preset input of the flip-flop 1188 to shift a 1 into this flip-flop. This ,-.x.-N..

value is shifted across the shift register by the GCLKh signal.
Similarly, a VOLTAGEh signal is applied to one input of the OR gate 1202. The other input to the OR gate 1202 is a GRESb signal. The output of the OR gate 1202 is applied to the reset input R of the flip-flop 1188 to shift a zero into this flip-flop when the voltage channel is selected.
The comparator 74 output signal COMPb is moni-tored by the flip-flop 1184. The SMCLKb signal is applied to the clock CK input of this flip-flop. The REGRESb sig-nal is applied to the reset input R. The output of this flip-flop indicates that the comparator 74 output signal has not yet switched which means that the comparator 74 output sigrlal is less than, for example, 1.25 Vdc to indi-cate that one-half the maximum has not been reached. This signal is applied to one input of the OR gate 1178. The other inputs to the OR gate 1206 are from the outputs of the AND gates 1180 and 1182. These AND gates indicate that the shift register 1170 has reached the maximum gain setting for the operation modes specified. More spe-cifically, the AND gate 1180 relates to the current mode.
The CURRENTh signal is applied to one input of the AND
gate 1188. The other input is from the output of the shift register flip-flop 1194 which when active indicates the highest gain setting when the current mode is selected.
Similarly, the VOLTAGEh signal is applied to an input of the AND gate 1182. The other input to the AND
gate 1182 is the output of the shift register flip-flop 1196 which represents the highest gain setting when the voltage mode is selected.
The outputs of the AND gates 1180 and 1182 are applied to the inputs of the OR gate 1178 along with the Q
output of the flip-flop 1184 to generate the RANGEh sig-nal. The RANGEh signal indicates that either the compara-tor 74 output signal COMPb has gone low or that the gain shift register 1170 has reached the maximum gain setting for the operating mode selected.
TIMOUTh - Time Out. This signal is active high when the five microsecond time delay has expired. This signal is available at the output of the NAND gate 870 (FIG. 37).
SOC3b - Start of Conversion Three. This signal is active low when the start of conversion pulse has been active for three clock periods.
ANAEOCh - Analog End Of Conversion. This signal is active high when the A/D 78 has finished the conver-sion. This signal is applied to the AND gate 1140 and to the AND gate 1162 by way of an inverter 1208.
RESETh - Reset. This signal is active high to reset the state register flip-flops during system reset.
STADCh - Start Conversion. This signal is ac-tive high when the AMUX register is written. This signal is discussed below.
AUTO-RANGE OUTPUTS
The output signals of the auto-range state machine are as follows:
GRESh - Gain Shift Register Reset. This signal is active high to reset the shift register 1170 used to generate the gain. This signal is active in state Si.
GCLKh - Gain Shift Register Clock. This signal is active high to shift the shift register and is active in state S3.
TIMREQh - Time Request. This signal is active high to request a five microsecond delay period. This signal is active in state S2. The TIMREQh signal is generated at the output of an AND gate 1210. The signals ROb, Rlh and R2h are applied to the input of the AND gate 1210 to generate the TIMREQh signal when the auto-range state machine is in state S2.
ARBSYh - Auto-Range Busy. This signal is active high to indicate when a conversion operation is active.
This signal is also used to interlock the auto-zero and auto-range state machines. The ARBSYh also inhibits the microprocessor 30 from writing to the gain registers by disabling the NAND gates which decode the register select signals (AVSFh, ACSFh) and the write clock WRCLKh signal.
This signal is active in states S1, S2, S3, S4, S5 and S6 and is available at an inverting output of a NAND gate 1212. The state variables ROb, R1B, R2b are applied to the inputs to the NAND gate 1212 to generate the ARBSYh signal in states S1, S2, S3, S4, S5 and S6.
The signal ARBSYb is used to control write and read operations to the ASCF and AVSF registers. More specifically, ARBSYb signals inhibits the microprocessor 30 from reading or writing to the ASCF or AVSF registers when the auto-range state machine is active. The signal ARBSYb is generated at a non-inverting output of the NAND
gate 1212. A non-inverting output of this NAND gate is applied to inputs of NAND gates 1214 and 1216. The AVSFh signal, which is generated when the microprocessor 30 places the address $0026 on the address bus ADDR[5...0], is applied to the NAND gate 1214 and an AND gate 1218. An ACSFh signal is applied to the inputs of the NAND gate 1216 and a NAND gate 1220. This ACSFh signal is generated any time the microprocessor 30 places the address $0027 on the address bus ADDR[5...0]. The RDCLKh signal is applied to the inputs of the NAND gates 1218 and 1220. The WRCLKh signal is applied to the inputs of the NAND gates 1214 and 1216. The outputs of the NAND gates 1214 and 1218 are the VRRDb and VRCLKb signals, which are used to control read and write operations to the AVSF register. The outputs of the NAND gates 1216 and 1220 are the CRRDb and CRCLKb sig-nals which are used to control read and write operations to the ACFS register.
EOCh - End of Conversion. This signal is active high which sets a flip-flop in the status register to in-dicate that the conversion process has finished. It also clears the flip-flop 1246 (FIG. 3].) which generates the STADCh signal and is active in state S6. This signal is available at an output of an AND gate 1222. The signals ROh, Rlb and R2b are applied to the inputs of this AND

gate to generate the EOCh signal only when the state machine is in state S6.
ANASOCh - Analog Start of Conversion. This sig-nal is active high to initiate an analog to digital con-version and is active for three clock cycles. This signal is active in state S4. The analog of start of conversion signal ANSOCh is generated by circuitry which includes flip-flops 1224, 1226 and 1228, buffer amplifiers 1230, 1232 and 1234 and an AND gate 1236. This signal is active high for three clock cycles and is active in state S4. A
signal representing that the auto-range state machine is in state S4 is available at the AND gate 1156 and applied to the D input of the flip-flop 1224. The state machine clock signal SMCLKh is applied to the clock input of the flip-flop 1224. The Q output of the flip-flop 1170 is ap-plied to the D input of the flip-flop 1226. The Q output of the flip-flop 1226 is applied to the input of a buffer amplifier 1230. The output of the buffer amplifier 1230 is applied to the D input of the flip-flop 1228. The Q
output of the flip-flop 1228 is applied to the buffer am-plifier 1232 and represents the analog start of conversion ANASOCh. The AND gate 1236 controls resetting the flip-flops 1224 and 1226 after the flip-flop 1228 is reset.
More specifically, the REGRESb signal is applied to one input of the AND gate 1226 as well as to the reset input of the flip-flop 1228. The Q output of flip-flop 1228 is applied to the other input of the AND gate 1236. The out-put of the AND gate 1180 is applied to the R reset inputs of the flip-flops 1224 and 1226.
The clock inputs of the flip-flops 1226 and 1228 are controlled by the microprocessor 30 interrupt signal INTEh. More specifically, the interrupt signal INTEh, which is active high is applied to the input of an in-verter 1234. The output of inverter 1234 is applied to the clock CK inputs of the flip-flops 1226 and 1228.
AUTO-RANGE STATE MACHINE OPERATION
The auto-range function is initiated by the software writing to the AMUX register. More specifically, a STADCH signal (FIG. 31) is active high whenever the register AMUX is written to by the microprocessor 30.
This signal STADCH is available at the output of an AND
gate 1238. One input to the AND gate 1238 is a test cir-cuit. The other input to the AND gate 1238 is from cir-cuitry which includes buffer amplifiers 1240, 1242, 1244;
flip-flops 1246, 1248, 1250; a NAND gate 1252 and AND
gates 1254 and 1256. The WRCLKh signal is applied to one input of the AND gate 1254. This signal indicates that the microprocessor 30 is writing to one of the registers.
An AMUXh signal is applied to the other input-of the AND
gate 1254. The AMUXh signal represents that the micropro-cessor 30 has written to the AMUX register by writing the address $0021 on the ADDR[5...0) bus. The output of the AND gate 1254 is a begin conversion signal BEGCONh which indicates that the AMUX register has been written to.
This BEGCONh signal is applied to the input of the NAND
gate 1252. The other input to the NAND gate 1252 is from the TEST[4...0] bus. The output of the NAND gate 1254 is applied to the D input of the flip-flop 1250 by way of the NAND gate 1252. The other input to the NAND gate 1252 is from test circuitry. The output of the flip-flop 1250 is applied to the input of a flip-flop 1248. The R input of the flip-flop 1250 is connected to the output of the AND
gate 1256. The AND gate 1256 is a two input AND gate.
The RESETb signal available at the output of the inverter amplifier 516 is applied to one input. An ARBSYh signal is applied to the other input by way of the inverter am-plifier 1244. The AND gate 1256 resets the flip-flop 1250 when the auto-range state machine is busy. A Q output of the flip-flop 1250 is applied to a D input of the flip-flop 1248. The output of the flip-flop 1248 is applied to the input of the buffer amplifier 1242. The output of the buffer amplifier 1242 is applied to the input of the flip-flop 1246. The clock inputs of the flip-flops 1246 and 1248 are tied to the output of the inverter 527. The SMCLKb is applied to the input of the inverter 527. The reset inputs R of both of the flip-flops 1246 and 1248 are controlled by the RESETb signal. The output of the flip-flop 1246 is applied to the input of a buffer amplifier 1240. The output of the buffer ampl:Lfier 1240 is applied to the other input of the AND gate 1236 to generate the STADCh signal to indicate that the microprocessor 30 has written to the AMUX register.
When the ANUX register has been written to, the control circuitry requests that the auto-range operation be performed followed by an analog digital conversion.
More specifically, the auto-range state machine performs the following functions. First, the shift register 1170 is initialized. The output of the shift register 1170 is tied to a GAIN[4...0] bus which sets the gain for the am-plifier. The initial state of the shift register 1170 de-pends on whether the voltage or current channel has been selected for conversion. If a voltage channel has been selected, the initial value is a binary 00001. If a cur-rent channel has been selected the initial value of the = shift register 1170 will be a binary 0000. Next a five microsecond setting delay is timed. The TIMOUTh signal will be active high at the output of the five microsecond delay. When the TIMOUTh signal is active, the output of a comparator 74 is checked. If the comparator 74 has switched or if the maximum gain setting has been reached, a start of conversion signal is generated. Otherwise the gain is increased and the delay is timed again.
After the conversion has been initiated, the auto-range state machine waits for an end of conversion signal ANAEOCh to inform the microprocessor 30 to generate a processor interrupt.
AID CONTROL LOGIC
The A/D converter 78 is an eight bit successive approximation A/D converter. The ranging circuitry for the voltage 80 and current amplifier 90 provides an addi-tional four bits of dynamic range. The A/D converter 78 is described in detail in Section 7 of MC68HC11A8 HCMOS
SINGLE-CHIP MICROCOMPUTER by Motorola, copyright 1987.

ANALOG CONTROL LOGIC
The function block diagram for the analog con-trol logic is shown in FIG. 3. This figure, in connection with the block diagram shown in FIG. 41 will be used to explain the analog control logic.
These figures illustrate the control logic for the current and voltage channel MUXes 66 and 68, zeroing of the voltage amplifier 80 and the current amplifier 90 and ranging of the voltage amplifier 80 and the current mirror 92. Also illustrated is. an analog power supply subsystem 48 which consists of a band gap regulator sub-system 1400, a shunt regulator 1402 and the power monitor portion of subsystem 47. Biasing circuitry 1404 is illus-trated for the quadcomparator subsystem 58 (FIG. 43), the band gap regulator 1400, the B+ comparator subsystem 50, the power monitor subsystem 47, the voltage amplifier 80 and the current amplifier 90. Lastly, temperature moni-toring circuitry 1406 is illustrated which allows the microprocessor 30 to read the ambieni:. temperature.
MUX CONTROL
The MUXes 66 and 68 are illustrated in FIG. 42.
The input channels MUXO, MUX1, MUX2 and MUX3 can be used for either voltage inputs or current inputs. The input channels MUX4, MUX5, MUX6 and MUX7 can only be used for voltage channels. The channel MUX8 is for temperature sensing while the MUX 66K is tied to analog ground. More specifically, the input channels are configured by MUXes 66a-66g. The MUXes 68a-68d allow the input channels MUX1, MUX2, MUX3 and MUX4 to be tied to the current channel IMUX. The MUXes 68e-68h allow the input channels to be tied to digital ground VSS.
Sample and hold MUXes 108, 110, 112 and 114 are connected between the channels MUXO and MUX1, MIIX2 and MUX3, MUX4 and MUX5 and MUX6 and MUX7, respectively.
ANALOG POWER SUPPLY
The analog supply pins AVDD and AVSS are used to provide power to the analog portion of the IC 10. The analog supply pin AVDD is designed to be connected to a current source. The IC 10 contains an internal shunt regulator (FIG. 45) to regulate the voltage on the AVDD
pin to approximately 5.0 Vdc. More specifically, the ana-log power supply consists of a 2.5 Vdc reference and a shunt regulator subsystem 1402. The 2.50 Vdc reference contains a +1.25 Vdc band gap regulator reference circuit 1406 (FIG. 44) and a buffer amplifier 1412 to generate a +2.50 Vdc reference: VREF. An adjustment pin VADJ is provided to allow the voltage to be trimmed to exactly +2.5 Vdc 0.5 Vdc. In order to trim the reference, a two resistor voltage divider 1410 which includes resistors 1414 and 1416 is connected between 'the VREF and AVSS pins with the mid-point connected to VADJ. The buffer ampli-fier 1412 has a source follower output such that it can only source current. This will permit multiple devices to be paralleled. Also, the regulator of the IC 10 can be slaved to another by connecting its VADJ pin to the VREF
pin.
The band gap regulator subsystem 1406 is illus-trated in FIG. 44. A band gap reference is a precision .voltage reference. In general, the band gap reference circuit utilizes as a reference the base-to-emitter volt-age of a parasitic transistor which has a negative tem-perature coefficient (-TC) connected in series with a re-sistor which has a voltage developed across it with a pos-itive temperature coefficient (+TC). The voltage de-veloped across the resistor is a function of a predeter-mined current supplied to the resistor from circuitry in-ternal to the band gap regulated reference. The differ-ence in temperature coefficients between the base-to-emit-ter voltage of the parasitic transistor and the voltage across the series connected resistor provides a voltage reference signal having essentially a zero temperature coefficient. As the base-to-emitter voltages of the para-sitic transistors decreases with an increase in tempera-ture, the voltage across the current-fed series connected resistor increases generally proportionally to provide an output reference voltage which remains relatively con-stant. This reference voltage is then applied to a non-inverting input of an amplifier; an inverting input of the amplifier is connected to an externally divided portion of the output of theamplifier. The output of the amplifier is a voltage proportional to the reference voltage, rela-tively independent of temperature.
More specifically, the output of the band gap regulator reference circuit 1406 is nominally 1.25 Vdc.
This output voltage is doubled by a buffer comparator 1412 and the external resistors 1414 and 1416 to produce a +2.5 Vdc reference at the external pin VREF. The external re-sistors 1414 and 1416 are connected in series between the output of the buffer comparator 1412 and an analog ground pin AVSS. The midpoint of these resistors 1414 and 1416 is connected to the inverting input of the buffer compara-tor 1412 to allow the reference voltage VREF to be ad-justed. The band gap regulator circuit includes diode connected parasitic transistors 1426 and 1428, a transis-tor 1418, resistors 1420, 1422 and 1424 and a comparator 1441. Start-up circuitry 1432 is provided for the condi-tion when power is first applied to the IC 10. The start-up circuitry 1432 includes the transistors 1434, 1436 and 1438. During this condition, voltages begin to rise from a zero level to a level that will ultimately be regulated by the band gap reference circuit 1406. Initially there is no current in any of the devices. In this condition, the transistor 1438 is biased on by a PBIAS circuit 1440 which will be discussed below. This, in turn, turns on the transistor 1434 to generate a current that flows into a diode connected parasitic transistor 1428. This pro-duces a voltage at the transistor 1428 which is applied to a non-inverting input of the comparator 1441. That gener-ates a positive signal at the output of the comparator 1440 which, in turn, turns on the transistor 1418 and pro-duces currents in the transistors 1426 and 1428. Conse-quently, the band gap reference approaches a stable regu-lating point based upon the voltages across the diode con-nected transistors 1426 and 1428. When these voltages reach a steady state value, the transistor 1436 is turned on which turns off the transistor 1.434, in which case all of the current is generated by the transistor 1418.
During regulation, the current applied to the emitters of the transistors 1426 and 1428 is essentially equal. This is because the resistors 1420 and 1424 are the same value and are relatively large compared to the other voltage drops. The base emitter voltage across transistors 1426 and 1428 is dependent upon the current density through these transistors. The current density is the total current divided by the area of the transistors.
The current densities of the transistors 1426 and 1428 are different by a factor of 11 to 1, thus, their base emitter voltages will be different. The difference in base emit-ter voltages appears across the resistor 1422. Since the temperature coefficient is a function of the voltage across the device, as the base emitter voltage across the transistors 1426 and 1428 goes down, their negative tem-perature coefficient increases. Due to the relative cur-rent density in the transistor 1426 relative to the cur-.rent density in the transistor 1428, the series combina-tion of the resistor 1422 and transistor 1426 will have a positive temperature coefficient (+TC) and is applied to an inverting terminal of comparator 1441. The base emit-ter voltage of the transistor 1428, which has a negative temperature coefficient (-TC), is applied to a non-invert-ing terminal of the comparator 1441. As the temperature changes voltage across the base emitter junctions of the transistors 1426 and 1428, the voltage across the resistor 1422 will change by a proportional amount, thus yielding an output signal from the comparator 1441 that is rela-tively temperature independent.
SHUNT REGULATOR
The shunt regulator 1400 (FIG. 45) provides a nominal +5.0 Vdc at the AVDD pin based on the reference voltage at VREF. The shunt regulator 1400 includes an am-plifier 1443 and resistors 1444 and 1446. More specifi-cally, the VREF from the buffer comparator 1412 is applied to a non-inverting input of an amplifier 1443. The AVDD
bus is the regulated 5.0 Vdc supply. The inverting termi-nal of the amplifier 1443 is connected to the AVDD bus by way of the resistor 1444. The inverting terminal of the amplifier 1443 is also connected to the AVSS bus by way of the resistor 1446. The resistors 1444 and 1446 have equal value which causes the output of the amplifier 1443 to be twice VREF. Since VREF is nominally 2.5 volts, the regu-lated supply bus AVDD will nominally be 5.0 volts. A
shunt element transistor 1447 is connected between AVDD
and AVSS. The gate of the shunt element is controlled by output of the amplifier 1443. When the regulated supply AVDD becomes a little too high, the negative terminal of the amplifier 1443 will be a little higher than VREF.
This will drive the output of the amplifier 1443 negative.
This, in turn, will cause a shunt transistor 1447 to turn on a little bit more. This draws current away from the supply bus AVDD and brings the voltage down until the two inputs to the amplifier 1443 are essentially identical.
The circuitry which includes the transistors 1448, 1450 and 1452 is part of the start-up circuitry.
Transistors 1448, 1450 and 1452 turn off the shunt tran-sistor 1447 during start-up to avoid sinking a lot of cur-rent away from AVDD.
An important aspect of the: invention relates to the fact that the IC 10 is current driven. This provides immunity to voltage spikes typical in applications in the automotive industry. More specifically, the IC 10 is driven by an input current, developed by an external re-sistor 1453 and an external voltage identified as VEXT ap-plied to the AVDD bus.
POWER MONITOR SUBSYSTEM
The circuitry which consists of the transistors 1454, 1456, 1458 and 1460 and the comparator 1462 (FIG.
45) performs the power on reset and loss of +5.0 Vdc func-tion. Power on reset is a delay of 8128 oscillator cycles plus an additional lms from the time the reset is removed by clearing the external control pin RESN.

The series connected transistors 1454, 1456, 1458 and 1460 form a voltage divider circuit. The drain of the transistor 1454 is applied to a non-inverting input of the comparator 1462. The output of the amplifier 1443 is applied to an inverting input of the comparator 1462.
The output of the comparator 1462 is a signal SHUNT which is an output pin which may be applied to the RESN pin of the microprocessor 30 for the power monitor function to reset the microprocessor 30 upon detection of an under-voltage.
The comparator 1462 monitors the conductive state or gate voltage of the shunt transistor 1447. When-ever the shunt transistor 1447 is determined to be off, as indicated by the amplifier 1442 output being at a more positive voltage than the divided voltage at the drain of the transistor 1454, the comparator 1462 output signal shunt will be driven negative, indicating insufficient current available to maintain the AVDD bus regulated at 5.0 volts.
B+ COMPARATOR SUBSYSTEM 50 The B+ comparator subsystem (FIG. 45A) is used for power supply generation and includes the following circuitry, resistors 1462, 1464, a comparator 1466 and a transistor 1468. VREF is applied to an inverting input of the comparator 1466 providing a +2.5 Vdc reference. The output of the comparator 1466 is an external pin BDRIVE.
Inputs to the comparator 1466 are applied to a non-invert-ing terminal of the comparator 1466 by way of an external pin BSENSE. The resistor 1464 and the transistor 1468 are exemplary of the hysteresis mask option, available for all comparators. The resistor 1464 and the transistor 1468 are connected in series to provide feedback from the output of the comparator 1466 to the inverting terminal.
FIGS. 45B and 45C illustrate exemplary circuitry for power supply generation and power supply regulation for the IC 10, respectively. FIG. 45B also illustrates the conditioning circuitry 19.

Referring first to FIG. 45B, the IC 10 is used to monitor the condition of the circuit breaker 12 (FIG.
1) by way of the current transformers (CT) 14, 16 and 18.
These CT's may be of the donut type which consist of a secondary winding disposed about the A, B and C phase conductors of the circuit breaker 12. During certain loading conditions, the output from the CT's may be of the order of 100 milliamps (mA). In order to reduce this out-put current to a level suitable for the IC 10, for example, 20 microamps, the signal conditioning circuitry 19 is provided. Various conditioning circuitry may be utilized. It should be understood that the conditioning circuitry illustrated in FIG. 45B is merely exemplary.
The CT's 14, 16 and 18 may be connected to the diode bridge 1467 in various ways. For example, the CT's 14, 16 and 18 may be connected in series with the output connected to the terminals 1469 and 1471. Also, only a single CT, for example, the B phase CT 16, may be tied to the bridge 1467 or the CT's may be paralleled.
The conditioning circuitry 19 includes a full wave diode bridge 1467 defining a pair of alternating cur-rent terminals 1469 and 1471 and a pair of rectified ter-minals 1473 and 1475; the positive terminal identified as 1473 and the negative terminal identified as 1475. The conditioning circuitry 19 also includes a resistor 1477 and a resistor 1479. Exemplary values for the resistors 1477 and 1479 are 10 ohms and 50 kilohms, respectively.
The resistor 1477 is connected between the nega-tive terminal 1475 on the bridge 1467 and ground. one side of the resistor 1479 is also tied to the negative terminal 1475. The other side of the resistor 1479 is then connected to one of the MUX inputs MUXO, MUX1, MUX2 or MUX3.
In operation, the current from the current transformers 14, 16 and 18 will flow through the resistor 1477 from ground to the negative terminal 1475 of the bridge 1469 to produce a negative voltage across the re-sistor 1477. If the value of the resistor 1477 is, for example, 10 ohms, a -1.0 volt will be produced across the resistor 1477 for a CT current of about 10 mA. This will, in turn, cause a -1.0 volt drop across the resistor 1479.
If the resistor 1479 has a value of, for example, 50 kilo-ohms, this will, in turn, produce a current of 20 micro-amps to be applied to one of the current inputs 62 (e.g., MUXO, MUX1, MUX2 or MUX3) of the IC 10 as discussed below.
The exemplary circuitry illustrated in FIG. 45B, identified within the dashed box 1481, in conjunction with the B+ comparator system 50 (FIG. 45A) is used for power supply generation. More specifically, the power supply circuitry 1481 includes a transistor 1483, connected be-tween the positive terminal 1473 of the bridge 1469 and ground with its gate terminal connected to BDRIVE (FIG.
45A). Also connected to the positive terminal 1473 is the anode of a diode 1485. The cathode of the diode 1485 is connected to a terminal, identified in'FIG. 45B as B+. A
power supply capacitor 1487 is connected between the B+
terminal and ground. A pair of series connected resistors 1489 and 1491 are also connected between the B+ terminal and ground with the junction between the resistors 1489 and 1491 identified as BSENSE.
In operation, the comparator 1466 (FIG. 45A) is used to monitor the voltage at the BSENSE junction. A
fraction of the voltage at the B+ junction, for example, 2.5 volts, and compare it with the voltage available at the VREF terminal. When the BSENSE voltage is greater than the VREF voltage, the output of the comparator 1466 goes high and turns on the transistor 1483 to shunt excess current to ground. When the voltage at the BSENSE junc-tion drops below VREF, the comparator goes low which al-lows the transistor 1483 to be turned off to allow the ca-pacitor 1487 to be charged up to the desired value, for example, 30 volts.
FIG. 45C illustrates exemplary circuitry for regulating the voltages at the VDD and AVDD pins and does not form a portion of the present invention.

BIASING CIRCUITRY FOR OPERATIONAL AMPLIFIER OFFSET
CORRECTION
Biasing signal PBIAS 1440 for the comparators 1412, 1440 (FIG. 44) and 1442 (FIG. 45) is illustrated in FIG. 46. Biasing signals PBIAS and NBIAS for the quadcom-parator 200, 202, 204 and 206 (FIG. 43), the B+ comparator 1466 (FIG. 45), the power monitor comparator 1462 (FIG.
45), the voltage amplifier 80 (FIG. 49) and the current amplifier 90 (FIG. 50) are illustrated in FIG. 47. The PBIAS and NBIAS signals from such circuitry are reference voltages that are used to set the operating current of the particular operational amplifier to which they are ap-plied. The above-mentioned biasing circuitry is in addi-tion to the auto-zeroing circuitry for the voltage ampli-fier 80 arid the current amplifier 90 are illustrated in FIG. 52 and identified as IOUT.
The circuitry illustrated in FIG. 46 is identi-fied by the function block 1440. The PBIAS circuit 1440 includes a transistor 1470 and a resistor 1493, connected in series between AVDD and AVSS, forming a voltage di-vider. The voltage divider produces a gate to source .voltage across the transistor 1470, identified as PBIAS.
The circuitry illustrated in FIG. 47 is used to generate the signals PBIAS and NBIAS for the quadcompara-tors 200, 202, 204 (FIG. 43), the voltage amplifier 80 and the current amplifier 90. This circuitry includes its own band gap regulator reference circuit which includes diode connected parasitic transistors 1472, 1474, resistors 1476, 1478, a comparator 1480 and capacitors 1482 and 1484. These signals are identified as PBIAS/I and NBIAS/I
to indicate that the signals are temperature independent since the circuitry includes the band gap reference. This band gap reference operates in a manner similar to the band gap reference 1406 described above with the exception of the additional capacitors 1482 and 1484 are used to control the biasing time of the circuitry. The output of the comparator 1480 is applied to the gates of transistors 1486, 1488 and 1490, forming current mirrors. The current mirrors 1486 and 1488 are used to source the band gap regulator portion of the circuitry. The output current mirror 1490 is the NBIAS/I signal. The current mirror 1490 turns on transistors 1492 and 1494 which develop a gate to source voltage across a transistor 1496 which is the PBIAS/I reference. The transistors 1498, 1500 and 1502 form start-up circuitry for the band gap regulator portion of the circuit.
TEMPERATURE SENSING
The circuitry illustrated in FIG. 48 allows the microprocessor 30 to sense the ambient temperature in which the IC 10 is located. This circuitry includes a transistor 1504 and a diode connected parasitic transistor 1506. The voltage of the parasitic transistors is tem-perature dependent as previously discussed. The resulting TEMP signal is applied to a MUX 66j and converted to a digital value and read by the microprocessor 30.
VOLTAGE AMPLIFIER RANGING
The voltage amplifier 80 and ranging circuitry is illustrated in FIG. 49. This circuitry includes the voltage amplifier 80, gain circuitry 84 and a plurality of MUXes 86 to produce a voltage signal for A/D conversion that is at least half scale. The voltage ranging may be controlled either automatically or manually to provide gains of 1, 2, 4, 8 or 16 of the input voltage signal VMUX
applied to a non-inverting input of the voltage amplifier 80. The gain circuitry includes resistors 84a-84h and MUXes 86a-86f. The gain circuitry is controlled by the VGAIN[4...0] bus and the gain signal VGAIN 32h as pre-viously discussed. The resistor 84i and 1512 form test circuitry.
If the gain is one, the voltage signal is ap-plied directly to the A/D converter 78 by way of a MUX
88a. In this condition the MUXes 86e and 88b disconnect the voltage amplifier 80 from the A/D circuitry 78 and the signal is connected directly to the A/D 78 by the MUX 88a.
During ranging, the MUXes 86a-86f connect the gain cir-cuitry 84 to an inverting terminal. of the voltage ampli-fier 80. For gains other than one, the MUX 88b connects the output of the voltage amplifier 80 to the A/D 78. The MUXes 88a and 88b are selected by the AVSF register.
The comparator 74 is used for auto-ranging.
This comparator is referenced to a fixed voltage, for example +1.25 Vdc, developed by a pair of serially coupled resistors 1508 and 1510, connected between VREF and AVSS.
The midpoint of these resistors 1508 and 1510 is applied to a non-inverting terminal of the comparator 74. The output of the comparator 74 is a CAMPH signal, which is monitored by the flip-flop 1184 (FIG. 40) and forms a por-tion of the auto-range logic as discussed above. The MUX
86f is used for auto-zeroing. This MUX 86f shorts the in-verting and non-inverting terminals of the voltage ampli-fier 80 together to determine the offset correction value.
During this condition, the offset value of the voltage am-plifier 80 is loaded into the flip-flop 888 (FIG. 38).
The MUX 86f is controlled by the VNULL signal available at-the output of the buffer amplifier 756 (FIG. 35).
CURRENT AMPLIFIER RANGING
Current amplifier 90 ranging is accomplished by the current mirror 92 (FIG. 50) as previously discussed.
Current inputs are applied to the current channel IMUX
(FIG. 42). This channel IMUX is tied to the current mir-ror 92 and to an inverting input of the current amplifier 90. A non-inverting terminal of the amplifier 90 is tied to analog ground to maintain the current input channels MUXO, MUX1, MUX2 and MUX3 at virtual ground. Negative currents (e.g., currents flowing out of the MXO pin) to be ranged are generated, for example, by connecting an exter-nal resistor (not shown) between the MUXO pin and a nega-tive voltage source. This causes ranged currents to flow out of the MUXO, MUX1, MUX2 or MUX 3 pins since these pins are maintained at virtual ground.
The MUXes 96a and 96b connect the output signal IOUT/I from the current mirror 92 either to the output pin MXO or to the analog ground bus AVSS. More specifically, the MUX 96a is used to connect the output signal IOUT/I of the current mirror 92 to the MXO pin under~the control of a signal IOUTONh; available at the output of a NAND gate 759 (FIG. 35). The signal IOUTONh indicates that the in-tegrator is not in a reset mode. An INTRESh signal as well as test signals are applied to the NAND gate 759.
The MUX 96b is used to connect the current mirror 92 out-put signal IOUT/I to the analog ground bus under the con-trol of a signal DISCHh, available at the output of a buffer 757. The input to the buffer. 757 is an integrator reset signal INTRESh, available at the output of the AND
gate 534 (FIG. 31).
The MUX lila is used for auto-zeroing the cur-rent amplifier 90. Specifically, the MUX 111a connects both the inverting and non-invertinq inputs of the current amplifier 90 to the analog ground bus AVSS under the con-trol of a signal CSHRTh, available at the output of an in-verter 581 (FIG. 34). The inverter 581 is serially con-nected to the output of the inverter 580. The input to the inverter 580 is the signal CAZh, which indicates the current amplifier 90 is being auto-zeroed.
The MUX ilib is used to connect the inverting input of the amplifier 90 to the IMUX output of the MUXes 68 (FIG. 42) whenever the amplifier 90 is not being auto-zeroed.
The ranged current froni the current mirror 92 may then be dropped across an e:xternal resistor (not shown) to convert the signal to a voltage and converted by the A/D converter 78 as discussed above.
The current mirror 92 is illustrated in FIG. 51.
The current mirror 92 includes current divider transistors 1512, 1514, 1516, 1518 and 1520, shunt transistors 1522, 1524, 1526 and 1528 and current mirrors 1530, 1532, 1534 and 1536. MUXes 1538, 1540, 1542 and 1544 control current shunting while MUXes 1546, 1548, 1550 and 1552 control the gain of the circuitry. These MUXes are controlled by the CGAIN[3...0] bus discussed above.
Negative currents are directed into the current mirror 92 at IIN/I. This input current is divided into five parts by the current divider transistors 1512, 1514, 1516, 1518 and 1520 which are all connected in parallel.
More specifically, the sizes of the transistors 1512 and 1514 are maintained equal at a value, for example, A. The sizes of transistors 1516, 1518 and 1520 are 2A, 4A and 8A, respectively. Since the transistors 1512, 1514, 1516, 1518 and 1520 are connected as current mirrors, the cur-rent through each of the transistors will be a function of the size of the transistor. Thus, the output of transis-tors 1512 and 1514 each will be 1/16 of IIN/I. The output of transistor 1516 will be 1./8 IIN/_C. The output of tran-sistor 1518 will be 1/4 IIN/I. The output of the transis-tor 1520 will be 1/2 IIN/I. These fractions of the input current IIN/I are either summed together to produce the desired gain which is controlled by the MUXes 1546, 1548, 1550 and 1552 and directed to the output by way of the current mirrors 1530, 1532, 1534 and 1536 or shunted around the mirrors 1530, 1532, 1534 and 1536 by way of the transistors 1522, 1524, 1526 and 1528 and the MUXes 1538, 1540, 1542 and 1544.
This is an important aspect of the invention.
Specifically,,in known bipolar current ranging circuitry (for example, as disclosed in U.S. Patent No. 4,626,831), the current dividers are cascaded. However, cascading of the current dividers is not viable for the IC 10 because of the relatively small operatirig voltage (e.g., +5.0 Vdc).
CURRENT AND VOLTAGE AMPLIFIER ZEROING
Representative circuitry for the voltage and current amplifier 80 and 90 is illustrated in FIG. 53.
These amplifiers are differential i.nput amplifiers defin-ing an internal bias current ITRIM/I. The differential inputs are identified as PLUS/I and MINUS/I. This inter-nal bias current flows through resistors 1546 and 1548 which controls the offset voltage that appears at the am-plifier 80 and 90 output. Known techniques have attempted to control the offset voltage by externally adjusting the resistor values of resistors 1546 and 1548, which requires precision variable resistors, such as digital-to-analog converter (DAC). Such DACs are relatively expensive. The auto-zeroing circuitry in accordance with the embodiment of the present invention, obviates the need for DACs and instead controls the bias current ITRIM/I to control the voltage across the resistors 1546 and 1548 to control the offset voltage. The bias current is ranged by a current dividing circuitry illustrated in Fig. 52. The ranged bias current is then applied to the amplifietr 80 or 90 to control the bias current and the offset voltage.
The bias current ranging circuitry includes the MUXes 1600, 1602, 1604, 1606, 1608 and 1610, the current mirrors 1612, 1614, 1616, 1618, 1620, 1622 and 1624 and the transistors 1626 and 1628. The MUXes 1600, 1602, 1604, 1606, 1608 and 1610 are controlled by the VZERO[5...0] bus for the voltage amplifier 80 and the CZERO[5...03 bus for the current amplifier 90 as discussed above. These current mirrors are connected in parallel to allow the bias current to be divided into composite values and allow selected portions to be added together to gener-ate the ranged current and operate in a similar manner as the current mirror 92.

The INCOM communication coritroller (ICC) 29 pro-vides the microprocessor 30 access to a two way communica-tion network, known as INCOM, described in detail in U.S.
Patent No. 4,644,566.
This controller 29 provides modem functions, serializa-tion/deserialization of messages and implements the re-' quired network protocol. The ICC 29 is capable of operat-ing both as a master and slave controller. Master opera-tion is inhibited unless a permissive flag is set in the configuration register CFR.
The microprocessor 30 communicates with the ICC
29 through eight interface registers located in memory ad-dress space. Four registers are used to transfer INCOM
messages between the ICC 29 and the microprocessor 30, while the other four are used for setting the communica-tion address, speed, modulation method and control of transmit/receive operations.
The ICC -29 supports a fast status request mes-sage which will reduce network response time. Since the transmit and receive registers for the ICC 29 are indepen-dent of each other, a message, such as the fast status, can be periodically updated in the transmit registers.
This allows the ICC 29 to transmit the response without the microprocessor 30 intervention when a fast status re-quest is received.
A general block diagram of the ICC 29 is illus-trated in FIG. 54. The ICC 29 includes a processor bus interface 1690, illustrated in FIGS. 63-70; a transceiver serial shift register 1692, illustrated in FIGS. 71 and 72; a digital demodulator 1694, illustrated in FIGS. 55-61 and control logic circuitry 1696, illustrated in FIGS. 73-79.
PROCESSOR BUS INTERFACE
The microprocessor 30 communicates with the ICC
29 by way of interface registers ICAH, ICAL, ICM3, ICM2, ICM1, ICMO, ICSR and ICCR located in memory address space as illustrated in Table 7. The configuration of these registers is illustrated in FIGS. 63-70.
The registers ICAL and ICAH are address regis-ters, identified with the reference numeral 1700. The registers ICMO, ICM1, ICM2 and ICM3 are message registers, identified with the reference numeral 1702. The registers ICCR and ICSR are control and status registers, identified with the reference numeral 1704.
All of these registers are addressed by the microprocessor 30 by placing the appropriate address on the address bus ADDR[3...0]. The address is decoded by decoding circuitry, identified with the reference numeral 1706 (FIG. 63). The address decoding circuitry 1706 gen-erates decoding signals DECAH, DECAL, DECM3, DECM2, DECM1, DECMO, DECSR and DECCR that are applied to D inputs of flip-flops 1708, 1710, 1712, 1714, 1716, 1718, 1720 and 1722. Register select signals SELAH, SELAL, SELM3, SELM3, SELM1, SELMO, SELSR and SELCR are available at Q outputs of these flip-flops.
All of these registers are read write registers with the exception of the ICSR status register, which is a read only register. Read and write operations are con-trolled by RDCLK and WRCLK signals, which are generated by circuitry which includes a read write control flip-flop 1724, a NOR gate 1726 and an inverter 1728. The WRCLK
signal is available at the output of the NOR gate 1726.
The RDCLK signal is available at the output of the in-verter 1728. A READ signal generated by the microproces-sor 30 is applied to a D input of the flip-flop 1724 by way of the internal control bus CPUCTL[3...0]. A Q output from the flip-flop 1724 is applied to one input of the dual input NOR gate 1726 to develop the WRCLK signal. The other input to the NOR gate 1726 is the phase 2 clock sig-nal PH2, available at a non-inverting output of the an in-verter 1730. A Q output of the flip-flop 1724 is applied to an input of the inverter 1728 to generate the RDCLK
signal.
Timing for the read write control flip-flop 1724 as well as for the address decode flip-flops 1708, 1710, 1712, 1714, 1716, 1718, 1720 and 1722 is provided by the PH2 and PH2 signal, available at the outputs of the in-verter 1730. More specifically, the PH2 signal, available at the non-inverting output of the inverter 1730, is ap-plied to E inputs of the flip-flops 1708, 1710, 1712, 1714, 1716, 1718, 1720, 1722 and 1724. The PH2 signal, available at the inverting output of the inverter 1730, is applied to EN inputs of these flip-flops.
These flip-flops are all reset by the micropro-cessor 30. More specifically, a RESET signal is applied to CDN inputs of these flip-flops. The RESET signal is available at the output of an inverter 1732. The RESET
signal is generated from a RESET signal, applied to the input of the inverter 1732 by way of high gain inverters 1734 and 1736. The RESET signal is also applied to the address register 1700, the message register 1702 and the control and status register 1704. This allows the regis-ters to be set to zero on system reset.
The address decoding circuitry 1706 for all of the above-identified registers is illustrated in FIG. 64.
This circuitry consists of AND gates 1738, 1740, 1742, 1744, 1746, 1748, 1750 and 1752 arid inverters 1754, 1756, 1758, 1760, 1762, 1764, 1766, 1768, 1770, 1772 and 1774.
The outputs of the AND gates 1738, 1740, 1742, 1744, 1746, 1748, 1750 and 1752 are the address decode signals DECSR, 10: DECCR, DECM3, DECM2, DECM1, DECMO, DECAL and DECAH, re-spectively. More specifically, the address signals ADDRO, ADDR1, ADDR2 and ADDR3 from the address bus ADDR[3...0]
are applied to high gain inverter pairs 1754 and 1756;
1758 and 1760; 1762 and 1764; and 1766 and 1768. The out-put of the inverter 1756 is applied to inputs of AND gates 1738, 1742, 1746 and 1750. The output of the inverter 1754 is applied to inputs of the AND gates 1740, 1744, 1748 and 1752. The output of the inverter 1760 is applied to the inputs of the AND gates 1738, 174a, 1746 and 1748.
The output of the inverter 1758 is applied to the inputs of the AND gates 1742, 1744, 1750 and 1752. The output of the inverter 1764 is applied to the inputs of the AND
gates 1738, 1740, 1742 and 1744. The output of the in-verter 1762 is applied to the inputs of the AND gates 1746, 1748, 1750 and 1752. The output of the inverter 1768 is applied to the inputs of the AND gates 1738, 1740, 1742, 1744, 1746, 1748, 1750 and 1752.
Control signals IO0FF and ANABS from the micro-processor 30 are used to enable or disable the address decoder 1706. The IO0FF signal is used to disable I/O de-vices during a test mode. The ANABS signal is a register select signal from the microprocessor 30 master chip ad-dress decoder which enables address decoding on a block basis. The IO0FF signal is available at the output of the inverter 1770 and is applied to the inputs of the AND
gates 1738, 1740, 1742, 1744, 1746, 1748, 1750 and 1752.
The ANABS signal is applied to a pair of high gain inver-ters 1772 and 1774. The output of the inverter 1774 is applied to the AND gates 1738-1752.
The ICAH and ICAL address registers 1700 are shown in FIG. 65. These registers are byte wide read-write registers, used to set the communication bit rate, modulation method and the 12-bit INCOM address for the ICC
29. Both of these registers are set to zero on reset and power up.
Referring first to the ICAH register, bits ICAH[7,6] determine the communication bit rate of the ICC
29. Bits ICAH[5,4] determine the modulation method used by the ICC 29. Bits ICAH[3...0] determine the higher order 4 bits of the INCOM address.
The ICAH register includes the flip-flops 1776, 1778, 1780, 1782, 1784, 1786, 1788 and 1790. The data bus DATA[7...0] is connected to D inputs of these flip-flops to allow the microprocessor 30 to write to this register.
Q outputs of these flip-flops are connected to the data bus DATA[7...0] by way of tristate devices 1792, 1794, 1796, 1798, 1800, 1802, 1804 and 1806 for read operations.
The Q outputs of these flip-flops are also attached to an internal control bus ICAH[7...0].
The tristate devices 1792, 1794, 1796, 1798, 1800, 1802, 1804 and 1806 are under the control of a two input NAND gate 1808. A RDCLK signal is applied to one input along with the address decode signal SELAH to allow the microprocessor 30 to read this register by initiating a read operation and addressing $0028.
Write operations to the ICAH register are con-trolled by a two input NAND gate 1810. One input to the NAND gate 1810 is the address decode signal SELAH. The other input to the NAND gate 1810 is a WRCLK signal. The output of the NAND gate 1810 is applied to an inverter 1812. A non-inverting output from the inverter 1812 ap-plied to EN inputs of the flip-flops 1792, 1794, 1796, 1798, 1800, 1802, 1804 and 1806. An inverting output of the inverter 1812 is applied to E inputs for timing.

The ICAH register flip-flops (1776-1790) are set to zero on reset. More specifically, an IRESET signal, available at the output of an inverter 1814 is applied to CDN inputs to set these flip-flops to zero on reset.
The ICAL register is a byte wide register that determines the lower order 8 bits of the INCOM address.
This register includes the flip-flops 1816, 1818, 1820, 1822, 1824, 1826, 1828 and 1830. The data bus DATA[7...0]
is applied to D inputs of these flip-flops to provide for write operations. Q outputs of these flip-flops are tied to the data bus DATA[7...0] for read operations by way of tristate devices 1832, 1834, 1836, 1840, 1842, 1844 and 1846. The Q outputs of these flip-flops are also tied to an internal control bus ICAL[7...0].
Read operations of this register are controlled by a two input NAND gate 1848. One input to the NAND gate 1848 is the address decode signal SELAL. The read clock RDCLK signal is applied to the other input. The output of the NAND gate 1848 is applied to a control terminal OEN of each of the tristate devices.
Write operations to this register are controlled by a two input NAND gate 1850. One input to the NAND gate 1850 is the write clock WRCLK signal. The register select signal SELAL is applied to the other input. The output of the NAND gate 1850 is applied to an inverter 1852. A non-inverting output of the inverter 1852 is applied to EN in-puts of these flip-flops. An inverting output of the in-verter 1852 is applied to E inputs.
This register is set to zero on device reset and power up. More specifically, the IRESET signal is applied to the CDN inputs of these flip-flops.
The registers ICM3, ICM2, ICM1 and ICMO, illus-trated in FIGS. 66-69, are byte wide read write registers which include a transmit buffer and a receive buffer.
These registers are used to transfer INCOM messages be-tween the ICC 29 and the microprocessor 30. These regis-ters are not true read write registers since read opera-tions access the receive buffer and write operations write to the transmit buffer.
The ICM1 register is an 8-bit register and con-tains the INCOM message bits 10 through 3. The transmit buffer for this register includes the flip-flops 1854, 1856, 1858, 1860, 1862, 1864, 1866 and 1868. The receive buffer for this register includes the flip-flops 1870, 1872, 1874, 1876, 1878, 1880, 1882 and 1884.
The transmit buffer flip-flops 1854, 1856, 1858, 1860, 1862, 1864, 1866 and 1868, can only be written to by the microprocessor 30. More specifically, the data bus DATA[7...0] is applied to D inputs of these flip-flops. Q
outputs of these flip-flops contain INCOM message bits TDATA[10...3].
Write operations to the transmit buffer are con-trolled by a two input NAND gate 1866. The write clock WRCLK signal is applied to one input. An address decode signal SELM1 is applied to the other input. The output of the NAND gate 1866 is applied to an inverter 1888. A non-inverting output of the inverter 1888 is applied to EN in-puts of these flip-flops. An inverting output of the in-verter 1888 is applied to E inputs of these flip-flops.
The receive buffer of the ICM1 register includes the flip-flops 1870, 1872, 1874, 1876, 1878, 1880, 1882 and 1884. INCOM messages, received on a receive data bus RDATA[10...3] are applied to D inputs of these flip-flops.
The contents of these flip-flops may be read by the micro-processor 30 on the data bus DATA[7...0] by way of tri-state devices 1892, 1894, 1896, 1898, 1900, 1902, 1904 and 1906. These tristate devices are under the control of a two input NAND gate 1908. The read clock RDCLK signal is applied to one input. An address decode signal SELM1 is applied to the other input.
Timing for the receive buffer and transmit buffer flip-flops is provided by a signal SRTOMR (FIG. 78) which will be discussed below. This signal SRTOMR is ap-plied to an inverter 1910. A non-inverting output of the inverter 1910 is applied E inputs of these flip-flops. An inverting output of the inverter 1910 is applied to EN in-puts.
The receive and transmit buffers are set to zero on reset and power up. More particularly, an IRESET sig-nal available at the output of an inverter 1890 is applied to CDN inputs of these flip-flops. The IRESET signal is applied to an inverter 1889 to generate an MRCLR signal, used to reset the registers ICM2, ICM3 and ICMO registers, as discussed below.
The ICM2 register is an 8-bit register and con-tains the INCOM message bits 18 through 11. The transmit buffer of the ICM2 register includes the flip-flops 1912, 1914, 1916, 1918, 1920, 1922, 1924 and 1926. - The receive buffer of the ICM2 register includes the flip-flops 1928, 1930, 1932, 1934, 1936, 1938, 1940 and 1942.
The transmit buffer may only be written to by the microprocessor 30. More particularly, the data bus DATA[7...0] is applied to D inputs of the flip-flops 1912, 1914, 1916, 1918, 1920, 1922, 1924 and 1926. Q outputs of these flip-flops are tied to a transmit data bus TDATA[18...11].
Write operations to the transmit buffer are under the control of a two input NAND gate 1944. The write clock WRCLK signal is applied to one input. The ad-dress decode signal SELM2 is applied to the other input.
The output of the NAND gate 1944 is applied to an inverter 1946. A non-inverting output of the inverter 1946 is ap-plied to EN inputs of the flip-flops 1912, 1914, 1916, 1918, 1920, 1922, 1925 and 1926. An inverting output of the inverter 1946 is applied to E inputs of these flip-flops.
The receive buffer of the ICM2 register includes the flip-flops 1928, 1930, 1932, 1934, 1936, 1938, 1940 and 1942. INCOM messages, received on an internal bus RDATA[18...11], are applied to D inputs of these flip-f2ops. The message bits contained in these flip-flops may be read by the microprocessor 30 on the data bus DATA[7...0] by way of tristate devices 1950, 1952, 1954, 3 :.

1956, 1958, 1960, 1962 and 1964. These tristate devices are under the control of a two input: NAND gate 1966. The register decode signal SELM2 is applied to one input. The read clock RDCLK signal is'applied to the other input to allow the microprocessor 30 to read the contents of this buffer by initiating a read operaticin and placing the ad-dress $002C on the address bus ADDR[3...0].
Timing for the receive buffer flip-flops is pro-vided by the SRTOMR signal and an inverter 1968. More specifically, the SRTOMR signal is applied to an input of the inverter 1968. A non-inverting output of the ;inverter 1966 is applied to E inputs of these flip-flops. An in-verting output of the inverter 1968 is applied to EN in-puts of these receive buffer flip-flops.
The transmit and receive buffer flip-flops are set to zero by the MRCLR signal available at the output of the inverter 1969. This signal NItCLR is applied to CDN
inputs of each of these flip-flops.
The ICM3 message register contains the INCOM
message bits 26 through 19. The transmit buffer for the register ICM3 includes the flip-flops 1970, 1972, 1974, 1976, 1978, 1980, 1982 and 1984. The receive buffer for this register includes the flip-flops 1986, 1988, 1990, 1992, 1994, 1996, 1998 and 2000.
The microprocessor 30 writes to the transmit buffer by way of the data bus DATA,[7...0], applied to D
inputs of the flip-flops 1970, 1972, 1974, 1976, 1978, 1980, 1982 and 1984. Q outputs of these flip-flops are applied to the transmit data bus TDATA[26...19].
Write operations to the: transmit buffer are under the control of a two input NAND gate 2002. The write clock WRCLK signal is applied to one input. The register select signal SELM3 is applied to the other in-put. The output of the NAND gate 2002 is applied to an inverter 2004. A non-inverting output of the inverter 2004 is applied to the two EN inputs of these flip-flops.
An inverting output of the inverter 2004 is applied to E
inputs of these flip-flops.

The receive buffer includes the flip-flops 1986, 1988, 1990, 1992, 1994, 1996, 1998 and 2000. INCOM mes-sage bits received from the INCOM network are transmitted by the receive data bus RDATA[26...19] and applied to D
inputs of these flip-flops. The microprocessor 30 can read the contents of these flip-flops on the data bus DATA[7...0] by way of tristate devices 2008, 2010, 2012, 2014, 2016, 2018, 2020 and 2022. These tristate devices are under the controi of a two input NAND gate 2024. The read clock RDCLK signal is applied to one input. The re-gister select signal SELM3 is applied to.the other input to allow the microprocessor 30 to read the contents of this buffer any time it initiates a read operation and it places the address $002D on the address bus ADDR[3...0].
Timing for the ICM3 receive buffer is provided by the SRTOMR signal and an inverter 2026. More spe-cifically, the SRTOMR signal is applied to an input of the inverter 2026. A non-inverting output of the inverter 2026 is applied to E inputs of these flip-flops. An in-verting output of the inverter 2026 is applied to EN in-puts of these flip-flops.
The,ICM3 transmit and receive buffers are set to zero by the MRCLR signal. This signal MRCLR is available at the output of the inverter 2006. This signal MRCLR is applied to CDN inputs of these flip-:flops.
The ICMO register is for transmitting and re-ceiving a control and status bits of the INCOM message.
The transmit buffer for this register includes the flip-flops 2028, 2030 and 2032 and the tristate devices 2034, 2036, 2038, 2040, 2042, 2044, 2046 and 2048. The receive buffer includes one flip-flop 2029.
Bit ICMO[7] corresponds to bit 2 of the INCOM
message. For transmit operations, this bit is written by the microprocessor 30 over the data bus DATA(7] and ap-plied to a D input of the flip-flop 2028. Write opera-tions to this flip-flop 2028 are under the control of a two input NAND gate 2050. A write clock WRCLK signal is applied to one input. A register select signal SELMO is applied to the other input. The output of the NAND gate 2050 is applied to an inverter 2052. A non-inverting out-put of the inverter 2052 is applied to an EN input of the flip-flop 2028. An inverting output of the inverter 2052 is applied to an E input of the flip-flop 2052. A Q out-put of the flip-flop 2028 is applied to the transmit data bus TDATA[2].
Bit 2 of an incoming INCOM message is received along an internal receive data bus R.DATA[2] and applied to a D input of a flip-flop 2029. Timing for this flip-flop 2029 is provided by the SRTOMR signal. The SRTOMR signal is applied to an inverter 2031. A non-inverting output of the inverter 2031 is applied to an E input of the flip-flop 2029. An inverting output of the inverter 2031 is applied to'an EN input of this flip-flop. In order to.al-low the contents of this flip-flop to be read by the microprocessor 30, a Q output of the flip-flop 2029 is ap-plied to the data bus DATA[7] by way of a tristate device 2033. The tristate device 2034 is under the control of the NAND gate 2054.
ICMO bits ICMO[6...2] are reserved for test.
These bits are read by the microprocessor 30 on the data bus DATA[6...2]. More specifically, a read test bus RTB[6...2] is tied to the data bus DATA[6...2] by way of tristate devices 2036, 2038, 2040, 2042 and 2044. These tristate devices are under the control of the NAND gate 2054. One input to the NAND gate signal 2054 is the read clock signal RDCLK. The SELMO regis=ter select decode sig-nal is applied to the other input.
Two AND gates 2055 and 2056 are also part of the test circuitry. More specifically, the AND gate2055 is a three input AND gate. A write clock signal WRCLK is ap-plied to one input. An IMCO register decode signal SELMO
is applied to another input. A test signal TEST is ap-plied to the other input. The output of the AND gate 2055 is applied to the AND gate 2056 along with DATA[2]. The output of the AND gate 2056 is applied to a write test bus WTB[2...0].

The bits ICMO[1,0] are status bits. Both of these bits are true read write bits. The microprocessor 30 can write these bits by way of the data bus DATA[1,0], which is tied to D inputs of.the flip-flops 2030 and 2032.
Write operations to these flip-flops are controlled by the NAND gate 2050 and the inverter 2052. More specifically, the non-inverting output of the inverter 2052 is applied to an EN input of the flip-flops 2030 and 2032. The in-verting output of the inverter 2052 is applied to E inputs of these flip-flops. Q outputs of these flip-flops are tied to an internal status bit read bus RSB[26,25]. The Q
outputs are also tied to the data bus DATA[1,0] by way of the tristate devices 2046 and 2048 to allow the micropro-cessor 30 to read the contents of these flip-flops. The tristate devices 2046 and 2048 are under the control of the read control NAND gate 2054.
The flip-flops 2028, 2029, 2030 and 2032 are all set to zero on system reset. More specifically, the MRCLR
signal is applied to CDN inputs of these flip-flops. This signal MRCLR is available at the output of an inverter 2057.
The ICCR register is a byte wide read write con-trol register used to control operation of the ICC 29.
This register is illustrated in FIG. 70 and includes the flip-flops 2058, 2060, 2062 and 2064 as well as the AND
gates 2066, 2068, 2070 and 2072. More particularly, the data bus DATA[7...4] 4 ..s applied to D inputs of the flip-flops 2058, 2060, 2062 and 2064. Timing for these flip-flops 2058, 2060, 2062 and 2064 is provided by a write control NAND gate 2074 and an inverter 2076. More spe-cifically, an ICCR register decode signal SELCR is applied to one input of the NAND gate 2074. A write clock signal WRCLK is applied to the other input. The output of the NAND gate 2074 is applied to an input of an inverter 2076.
An inverting output of the inverter 2076 is applied to E
inputs of these flip-flops. A non-inverting output of the inverter 2076 is applied to EN inputs of these flip-flops.

Q outputs of these flip-flops 2058, 2060, 2062 and 2064 are applied to an internal control bus CR[7...4]
for the control bits ICCR[7...4] di-scussed below. These Q
outputs are also connected to the data bus DATA[7...4] by way of tristate devices 2078, 2080, 2082 and 2084 to allow the contents of these flip-flops 2058, 2060, 2062 and 2064 to be read by the microprocessor 30. The tristate devices 2078, 2080, 2082 and 2084 are under the control of a two input NAND gate 2086. One input to the NAND gate 2086 is an ICCR register decode signal SELCR. The write clock signal WRCLK is applied to the other input.
The flip-flops 2058, 2060, 2062 and 2064 are set to zero on system reset. More particularly, an IRESET
signal is applied to CDN inputs of these flip-flops. This signal is available at the output of an inverter 2088.
The bits ICCR[7...4] are control bits. Bit ICCR[7] enables the interrupt operation of the ICC 29.
Bit ICCR[6] enables automatic response to a fast status request message. The control bit ICCR[4] is not used.
The bit ICCR[5] is a permissive bit that allows the INCOM communication controller 29 to be switched into the master mode. A zero in this bit prevents the ICC 29 from entering the master mode whil+e a one permits it.
This bit is also set to zero on system reset. This is ac-complished by a two input AND gate 2089. One input to the AND gate 2089 is a permissive bit from the CFR status register bit CFR[7J. The other input to the AND gate 2089 is the IRESET signal. The output of the AND gate 2089 is applied to a CDN input of the flip-flop 2062.
The bits ICCR[3...0] are command bits and are defined below. These command bits are written by the microprocessor 30 on the data bus DATA[3...0] and applied to inputs of the AND gates 2066, 2068, 2070 and 2072. A
write control signal, available at the output of the in-verter 2086, is applied to the inputs of the AND gates 2066, 2068, 2070 and 2072 along with the data bus DATA[3...0]. The input of the inverter 2086 is connected to the output of the write control NAND gate 2074. The outputs of the AND gates 2066, 2068, 2070 and 2072 are ap-plied to the internal ICCR register bus CR[3...0].
These bits ICCR[3...0] are not true read write bits. These bits will always read zero when read by the microprocessor 30. More specifically, the bits ICCR[3...0] are tied to the data bus DATA[3...0] by way of tristate devices 2090, 2092, 2094 and 2096. The inputs to these tristate devices are grounded. These tristate de-vices are under the control of the NAND gate 2086.
The ICSR is a byte wide read only status regis-ter which .contains the ICC 29 status flags that the micro-processor 30 communicates to the INCOM communication con-troller 29. This register includes the tristate devices 2098, 2100, 2102, 2104, 2106, 2108, 2110 and 2112. An in-ternal ICSR control register bus SR[7...0] is applied to the inputs of these tristate devices. The outputs of these tristate devices are applied to the data bus DATA[7...0]. These tristate devices are under the control of a two input NAND gate 2114. An ICSR register select decode signal SELSR is applied to one input. A read clock signal RDCLK is applied to the other input.
DIGITAL DEMODULATOR
The digital demodulator 1694 demodulates incom-ing INCOM messages and provides a demodulated output bits identified as a signal DEMODAT. T'his demodulator 1694 is illustrated in FIGS. 55-62. A block diagram for the digi-tal demodulator 1694 is illustrated in FIG. 55. The digi-tal demodulator 1694 includes a timing generator 2116, a receiver correlator 2118, demodulator control circuitry 2120 and a bit counter 2122.
The timing generator 2116 is illustrated in FIGS. 56 and 57. Timing diagrams for the various outputs of the timing generator are illustrated in FIGS. 80 and 81. The timing generator 2116 includes a master clock generator 2117, illustrated in FIG. 56 and a bit phase timing generator 2119, illustrated in FIG. 57.
The ICC 29 may be configured to operate at a variety of bit rates depending on the transmission mode selected. Exemplary bit rates are delineated in Table 19.
The master clock generator 2117 provides the various clock signals for the selectable bit rates. The ICAH register bits ICAH[7,6] determine the bit rate, while the bit ICAH(5] determines the modulation method. As discussed above, since the ASK and FSK modulation schemes are com-patible, thus only one bit ICAH(5) is necessary to select between baseband and FSK/ASK. The selected bit rate is available at the output of a MUX 2124. A Z output of the MUX 2124 is a bit phase clock signal BITPHCK which cor-responds to the selected bit rate and modulation method in accordance with Table 19. The command bit ICAH[5] is ap-plied to a select input S of the MUX 2124. The inputs to the M[TX 2124 are from a baseband MUX 2126 and an ASK/FSK
MUX 2128.
The various baseband bit rates in accordance with Table 19 are applied to the inputs of the MUX 2126.
The various ASK/FSK bit rates, also in accordance with Table 19, are applied to the inputs of the FSK MUX 2128.
The various bit rates are selectable by the command bits ICAH[7,6] which are applied to select inputs of the MUXes 2126 and 2128. The various bit rates are all derived from the IC 10 crystal and the timing generator 2116 which in-cludes counters 2130 and 2132.
The counter 2130 is used to generate the base-band bit rates. This counter 2130 includes the flip-flops 2132, 2134, 2136, a MUX 2138, an inverter 2140 and an ex-clusive OR gate 2142. If the ICC 29 is active, either a 7.3728 MHz or a 3.6864 MHz crystal must be used. Depend-ing on the crystal selected, one of these frequencies will be available at the output of the exclusive OR gate 2142 based upon the phase 2 clock signal PH2 and an E02 signal applied to inputs of the exclusive OR gate 2142. The E02 is a signal that is 90 out of phase with PH2.
The flip-flops 2132, 2134 and 2136 are connected as divide by two ripple counters. More specifically, Q
outputs'of these flip-flops are applied to D inputs. The Q output of the previous flip-flop is also applied to a clock input CP of the succeeding flip-flop. The outputs of the flip-flops 2132, 2134 and 2136 thus are divided by two of the input. Because of the option of crystals, the output of the exclusive OR gate 2142 is applied to one in-put of the MUX 2138. The Q output of the flip-flop 2132 is applied to the other input of the MUX 2138. If a 7.3728 MHz crystal is used, the flip-flop 2132 divides this frequency by two to produce a 3.6864 MHz signal at a Z output of the MUX 2138. If a 3.6864 MHz crystal is 10_ used, this signal is applied directly to another input of the MUX 2138 for a baud rate of 153.6 Kbps. The MUX 2138 is controlled by the configuration register bit ACFR[6], which is applied to an S input of the MUX 2138. The bit ACFR(6] selects the divider ratio. The Z output of the MUX 2138 is a 3.6864 MHz signal. This signal is applied to one input of the baseband MUX 2126 and also to a clock input CP of another divide by two counter 2134 to produce a 1.83432 MHz signal at its Q output. The 1.8232 MHz sig-nal is applied to another input of the baseband MUX 2126 for a baud rate of 76.8 Kbps. A Q output of the counter 2134 is also applied to a clock input of another divide by two counter 2136. The output of this counter is applied to an inverter 2140. The output of the inverter 2140 is a 921.6 kHz signal. This signal is applied to another input of the baseband MUX 2126 for a baud rate of 38.4 Kbps sig-nal.
The 19.2 Kbps baseband baud rate signal is gen-erated by the circuitry which includes an exclusive OR
gate 2142, and flip-flops 2144 and 2146. More spe-cifically, the 921.6 kHz signal, available at the output of the inverter 2140, is applied to a Johnson counter, which includes the flip-flops 2144 and 2146. More spe-cifically, the output of the inverter 2140 is applied to clock inputs CP of the flip-flops 2144 and 2146. A Q out-put of the flip-flop 2144 is applied to a D input of the flip-flop 2146. A Q output of the flip-flop 2146 is ap-plied to a D input of the flip-flop 2144. A Q output of the flip-flop 2146 is a 230.4 kHz signal. This signal is applied to one input of the exclusive OR gate 2142. The other input to the exclusive OR gate 2142 is the Q output signal from the flip-flop 2144. The output of the exclu-sive OR gate 2142 is a 460.8 kHz signal, equivalent to a bit rate of 19.2 Kbps.
The ASK/FSK bit rates s:ignals are developed by the counter 2132 and an OR gate 2148. More specifically, the Q output of the flip-flop 2144 is applied to one input of the OR gate 2148. This signal represents a 230.4 kHz ..=10 signal. The Q output of the flip-flop 2146 is also ap-plied to another input of the OR gate 2148. Lastly, the output of the inverter 2140 is applied to a third input of the OR gate 2148. The output of the OR gate 2148 is ap-plied to the counter 2132, which includes the flip-flops 2150, 2152; 2156 and 2158, all connected as divide by two counters with their Q outputs connected to their D inputs.
More specifically, the output of the OR gate 2148 is a 230.4 kHz signal whic:i is applied to a clock input CP of the flip-flop 2150. This flip-flop 2150 divides the input frequency by two to generate a 115.2 kHz signal at its Q
output which is applied to one input the ASK/FSK MUX 2128 to generate a bit rate signal of 9600 bps. A Q output of the counter 2150 is applied to a clock input of the counter 2152 to generate a 57.6 k.Hz signal at its Q out-put. This signal is applied to a clock input CP of the counter 2154 to generate a 28.8 kHz signal at its Q out-put. This 28.8 kHz signal is applied to a clock input CP
of the counter 2156 to generate a 14.4 kHz signal at its Q
output. The 14.4 kHz signal is applied to a clock input CP of the counter 2158 to generate a 7.2 kHz signal at its Q output. This 7.2 kHz signal is applied to the ASK/FSK
MUX 2128 to generate a 300 bps signal.
The counters 2130, 2132 and the Johnson counter which includes the flip-flops 2144 and 2146 are set to zero by reset and during test. More particularly, an IRESET reset signal is applied to one input of a two input OR gate 2160. A signal from the write test bus WTB2 is applied to the other input. The output of the OR gate 2160 is applied to an input of an inverter 2162. Output of the inverter 2162 is applied to CDN inputs of the flip-flops 2132, 2134, 2136, 2144, 2146, 2150, 2152, 2154, 2156 and 2158.
The FSK modulation scheme uses two carrier fre-quencies; 115.2 kHz and 92.16 kHz. The 92.16 kHz signal is available at the output of a decade counter 2164. This decade counter includes the flip-flops 2166, 2168, 2170 and 2172, as well as the NOR gate 2174 and an AND gate 2176. The 92.16 kHz signal is available as a signal FCA, available at a Q output of the flip-flop 2172. A 921.6 kHz signal is applied to clock inputs of the flip-flops 2166 and 2170. A Q output of the flip-flop 2166 is ap-plied to a clock input CP of the flip-flop 2168. A Q out-put of the flip-flop 2166 is applied to one input of a two input NOR gate 2174. The other input to the NOR gate 2174 is a Q output from the flip-flop 2170. The output of the NOR gate 2174 is applied to a D input of the flip-flop 2166. A Q output of the flip-flop 2168 is applied to a D
input of this flip-flop. A Q output of the flip-flop 2168 is applied to one input of a two input AND gate 2176. The other input to the AND gate 2176 is the Q output of the flip-flop 2166. The output of the AND gate 2176 is ap-plied to a D input of the flip-flop 2170. The ' output of the flip-flop 2170 is applied to a clock input of the flip-flop 2172. A Q output of the flip-flop 2172 is ap-plied to its D input. The Q output of the flip-flop 2172 is thus a divide by ten of the input signal 921.6 kHz.
The decade counter flip-=flops 2166, 2168, 2170 and 2172 are set to zero during reset and also during the test mode. More specifically, the output of the inverter 2162 is applied to the CDN inputs of these flip-flops.
The 92.16 kHz FSK signal FCA as well as a 115.2 kHz carrier signal FC are used for FSK modulation. The FC
signal is available at the output of the counter 2150. A
115.2 kHz baseband signal CARR is available at the output of a NOR gate 2174. One input to the NOR gate 2174 is the output of the OR gate 2148. Another input to the NOR gate 2174 is the output of the counter 2150. The output of the NOR gate 2174 is a 115.2 kHz signal.
Signals FDC and CK10 are used for demodulation control. The signal FDC is a 230.4 kHz signal , available at the output of an inverter 2176. A 230.4 kHz signal from the output of the counter 2146 is applied to the in-put of the inverter 2176. This frequency is selected as a sampling frequency at twice the carrier frequency of 115.2 kHz.
The CK10 signal is used to reset the bit phase timing generator 2119, illustrated in FIG. 57. This CK10 signal is available at the output of an OR gate 2178.
There are three inputs to the OR gate 2178. One input is from the Q output of the counter 2146. The other input is from the output of the inverter 2140. Lastly, a Q output of the flip-flop 2144 is applied to the OR gate 2178. The inputs to the OR gate 2178 are thus signals representative of twice the carrier frequency (230.4 kHz), four times the carrier frequency (460.8 kHz) and eight times the carrier frequency (921.6 kHz). As illustrated in FIG. 81, the CK10 signal available at the output of the OR gate 2178 will thus produce a one-zero-one pattern every one half cycle at 115.2 kHz, equivalent to 230.42 kHz; the sampling frequency.
The bit phase timing generator 2119 is used to count the phase coherence of the carrier frequency. The bit phase timing generator 2119 produces timing control signals PHCKAD, PHCKB, PHCKBD, PHCKCD, PHCKDD, PHCKD, PHCK
and PHRST. These signals are illustrated in the form of timing diagrams in FIGS. 80 and 81. These timing signals are developed by flip-flops 2182, 2184 and 2186; NOR gates 2188, 2190, 2192, 2194, 2196, 2198 and 2200 and inverters 2202, 2204, 2206, 2208, 2210, 2212, 2214 and 2216.
The bit phase clock signal BITPHCK is applied to the bit phase timing generator 2119. The BITPHCK signal is available at a Z output of the MUX 2124 (FIG. 56). The BITPHCK signal corresponds to the selected baseband or ASK/FSK baud rate. This BITPHCK signal is applied to the bit phase timing generator 2119 by way of high gain in-verters 2202 and 2204. The output of the inverter 2204 is applied to clock inputs CP of the flip-flops 2182 and 2184, which are configured as a Johnson counter 2185.
More specifically, a Q output of the flip-flop 2182 is ap-plied to a D input of the flip-flop 2184. A Q output of the flip-flop 2184 is applied to a D input of the flip-flop 2182. The Q output of the flip-flops 2182 and 2184 are used to generate the timing signals. More spe-cifically, a Q output of the flip-flop 2182 is applied to an inverter 2206. A Q output of the flip-flop 2182 is ap-.
plied to an inverter 2208. A Q output of the flip-flop 2184 is applied to an inverter 2210. A Q output of the flip-flop 2184 is applied to the inmrerter 2212. An output of the inverter 2206 is applied to inputs of the NOR gates 2190, 2192 and 2194. An output of the inverter 2208 is applied to inputs of the OR gates 2188, 2196 and 2198. An output from the inverter 2210 is applied to inputs of the inverters 2194, 2196 and 2198. An output of the inverter 2212 is applied to inputs of the NOR gates 2188, 2190 and 2192. The output of the inverter 2212 is also applied to an input of an inverter 2214 to generate the PHCK signal.
The BITPHCK signal, available at the output of the in-verter 2204, is also applied to inputs of the NOR gates 2188, 2192, 2194 and 2196. The outputs of the NOR gates 2188, 2190, 2192, 2194, 2196 and 2198 are the bit phase timing signals PHCKAD, PHCKB, PHCKBD, PHCKCD, PHCKDD, PHCKD and PHCK.
A bit phase reset signal PHRST is generated every one-sixth bit at the output of a NOR gate 2200. A
timing diagram for this signal is illustrated in FIG. 81.
The NOR gate 2200 is a two input NOR gate. One input is from an output of an inverter 2216. A reset signal IRESET
is applied to the input of the inverter 2216. A D input of the flip-flop 2186 is normally grounded. This flip-flop 2186 is clocked by the Q signal, available at the output of the Johnson counter 2185. The CK10 signal is applied to the CDN input of the flip-flop 2186 to clear this flip-flop every one-half carrier cycle. A Q output of the flip-flop 2186 is applied to an input of the NOR
gate 2200 to generate the pulse signal PHRST at every one-sixth bit or 64 carrier cycles at 300 baud.
The carrier input signal is applied to a RXIN
terminal on the IC 10 by way of a buffer amplifier 2218 (FIG. 54). This signal is then applied to a pair of car-rier confirmation circuits 2220 and 2222, which form a portion of the receiver correlator 2118. These circuits operate at 90 out of phase with respect to each other.
Each of these carrier confirmation circuits 2220 and 2222 examines the input carrier signal to determine if it is within the acceptable band of frequencies centered about the carrier. This is done on a cycle by cycle basis.
Each carrier confirmation circuit 2220 and 2222 has two outputs. One output produces a pulse if the signal is within the pass band and the sample phase of the input signal is a logic 1. The other produces a pulse if the signal is within the pass band and the sample phase of the input signal is a logic 0. The four outputs ONEA, ZEROA, ONEB and ZEROB are used as inputs to a series of phase counters 2224., 2226, 2228 and 2230 (FIG. 59) which are re-set by the PHRST signal, which resets these counters every one-sixth of a bit.
The digital demodulator 1694 requires phase co-herence over the short term, i.e., over one and one-half cycles for frequency detection and is able to determine continued phase coherence in the longer term, i.e., one-sixth of a bit or 64 carrier cycles at 300 baud to dis-criminate against noise. The digital demodulator 1694 thus senses both frequency and phase of an incoming signal over a one-sixth of a bit interval. If the input fre-quency is correct and maintains phase coherence for at least three-fourths of the one-sixth bit interval, a counter 2338 is incremented. After six of these one-sixth bit intervals are processed, the contents are examined.
If the counter counts up to four or more, a demodulated output bit DEMODAT is outputted.

Each of the carrier confirmation circuits 2220 and 2222 stores its three most recent samples of the in-coming carrier by way of two stage shift registers 2224 (with stages 2223 and 2225) and 2226 (with stages 2227 and 2229). The incoming carrier frequency is applied to a D
input of these shift registers 2224 and 2226. The shift registers 2224 is clocked at twice the carrier frequency by the signal FDC. The shift register 2226 is also clocked at twice the carrier frequency with a signal FDC.
The signal FDC is available at the output of an inverter 2243. The output of each stage of the shift registers 2224 and 2226 is exclusive ORed wi.th its input by way of the exclusive OR gates 2228, 2230, 2232 and 2234. The outputs of the exclusive OR gates 2228, 2230 and 2232 and 2234 are ANDed by AND gates 2236 and 2238. The outputs of the AND gates 2236 and 2238 are applied to D inputs of a third stage shift register 2240 and 2242.
Assuming a 1-0-1 pattern exists on a D input to the first stage 2223, 2227 of the shift registers 2224 and 2226, the Q output of the first stage 2223, 2227 of the shift registers 2224 and 2226 and the Q output of the second stage 2225, 2229, this means that the past sample, which is zero, is stored in the first stage 2223, 2227 and the sample before that, which is a one, is stored in the second stage 2225, 2229. The present sample at the input of the first stage 2223, 2227 is stored on the next clock pulse.
The outputs of the first stage 2223, 2227 and the third stage 2240, 2242 of the shift registers are ap-plied to NAND gates 2244, 2246, 2248 and 2250 to generate the confirmation signals ONEA, ZEROA, ONEB and ZEROB. A
pulse on either the ONEA or ZEROA output means that over a relatively short term of one and one-half carrier cycles, the input carrier is generally in phase with the timing signals developed through crystal oscillator. More specifically, a Q output of the first stage 2223 of the shift register 2224 is applied to one input of the NAND
gate 2244. Another input to the NAND gate 2244 is a Q

output of the third stage 2240. The Q output of the third stage 2240 is also applied to an input of the NAND gate 2246 along with a Q output of the first stage 2223. The outputs of the NAND gates 2244 and 2246 are'the signals ONEA and ZEROA. These NAND gates 2244 and 2246 will pro-duce a pulse on every other sample provided the three stored samples form a 1-0-1 pattern. If the most recent sample is a logical 1, output of the NAND gate 2244 will be a logical 1. If the most recent sample is a 0, the output of the NAND gate 2246 will'.be a logical 1. The NAND gates 2248 and 2250 of the carrier confirmation cir-cuit 2222 operate in a similar manner to produce to ONEB
and ZEROB signals.
The shift registers 2224, 2226, 2240 and 2242 are set to zero on reset. More specifically a IRESET sig-nal available at the output of an inverter 2252 is applied to CDN inputs of these shift registers.
The phase counters 2224, 2226, 2228 and 2230 are used to separately count the number of pulses developed on the four outputs (e.g., NAND gates 2244, 2246, 2248 and 2250) of the confirmation circuits 2220 and 2222 during a time interval equal to one-sixth of a bit. If any of these counters reaches and count of 48 during 64 carrier cycles which occur during one-sixth bit intervals at 300 baud or 12 out of 16 at 1200 baud, it is assumed that a valid carrier signal existed for that one-sixth bit inter-val.
The output signals ONEA, ZEROA, ONEB and ZEROB
signals from the carrier confirmation circuits 2220 and 2222 are applied to the inputs of the phase counters 2224, 2226, 2228 and 2230. These phase counters illustrated in FIGS. 59 and 60 are used to separately count the number of pulses developed at the outputs of the phase confirmation circuits 2220 and 2222 during a time interval of one-sixth of a bit at the various baud rates of 300 baud, 1200 baud and 4800 baud. At 9600 baud, the counters count the num-ber of pulses on the confirmation circuit 2220 and 2222 during a one-third bit interval. Each of the counters 2224, 2226, 2228 and 2230 includes six stages: 2254a-2254d, 2256a-2256d, 2258a-2258d, 2260a-2260d, 2262a-2262d and 2264a-2264d. The-output signals ONEA, ZEROA, ONEB and ZEROB are applied to inputs of exclusive OR gates 2266, 2268, 2270 and 2272. These carrier confirmation output signals are also applied to inverters 2274, 2276, 2278 and 2280. The outputs of the inverters 2274, 2276, 2278 and 2280 are applied to three input AND gates 2282, 2284, 2286 and 2288 along with output signals from the first two stages 2254 and 2256. The outputs of these AND gates 2282, 2284, 2286 and 2288.are applied to MUXes 2290, 2292, 2294 and 2296. These AND gates are used to generate the 1200 baud signals at the MUXes 2290, 2292, 2294 and 2296.
The third and fourth stages 2258 and 2260 of each of the counters 2224, 2226, 2228 and 2230 are applied to AND
gates 2298, 2300, 2302 and 2304 along with the outputs of the AND gates 2282, 2284, 2286 and 2288 to develop the 300 baud signal available at the MUXes 2290, 2292, 2294 and 2296. The output of the inverters 2274, 2276, 2278 and 2280 is applied directly to the MUXes 2290, 2292, 2294 and 2296 for the 4800 baud and 9600 baud signals.
As previously mentioned, the baud rate is selected by the bits ICAH[7,6]. The complements of these signals are available at the outputs of inverters 2306 and 2308. These complemented signals are applied to select inputs SO, S1 of the MUXes 2290, 2292, 2294 and 2296 to select the proper baud rate and generate signals ONEACRY, ZEROACRY, ONEBCRY and ZEROBCRY at Z outputs of the MUXes 2290, 2292, 2294 and 2296. These output signals are ap-plied to the fifth stages 2262a-2262d of the phase coun-ters 2224, 2226, 2228 and 2230 by way of NAND gates 2310, 2312, 2314 and 2316 and exclusive OR gates 2318, 2320, 2322 and 2324. The outputs of the fifth and sixth stages 2262 and 2264 are applied to AND gates 2326, 2328, 2330 and 2332. These NAND gates 2326, 2328, 2330 and 2332 gen-erate a pulse every one-sixth of a bit at baud rates 300, 1200 and 4800 and at one-third bit intervals at 9600 baud.
The output of these NAND gates are applied to a NAND gate 2334 which, in turn, is applied to an input of a MUX 2336 along with a baseband signal available at the RX pin of the IC 10.
The ICAH5 bit selects between ASK/FSK and base-band. The baseband carrier signal CARR, available at the output of the NOR gate 2174, is applied to clock inputs CP
of the first stage 2254 of each of the phase counters 2224, 2226, 2228 and 2230.
Each of the counter stages 2254, 2256, 2258, 2260, 2262 and 2264..are reset by the phase reset signal PHRST by way of inverters 2338, 2340, 2342, 2344 and 2346.
The outputs of the inverters 2340, 2342, 2344 and 2346 are the signals ONEACLR, ZEROACLR, ONEBCLR and ZEROBCLR.
These signals are applied to reset inputs of stages five and six 2262 and 2264.
The output of the phase counters 2224, 2226, 2228 and 2230 is a signal DPH, which indicates correlation of the carrier signal, available at the output of the MIIX
2336. This signal DPH is applied to a demodulator counter 2338 by way of a flip-flop 2340. The strobe signal PHCK
is also applied to the flip-flop 2340. The strobe signal PHCK is six times the bit rate except at 9600 baud where it is only three times the bit rate. The output of the flip-flop 2340 is applied to the demodulator counter 2338 and a flip-flop 2342 to generate a demodulator reset sig-nal DEMODRST. The demodulator counter 2338 counts the number of outputs from the phase counters 2224, 2226, 2228 and 2230. The demodulator counter 2338 includes three stage flip-flops 2346, 2348 and 2350. The demodulated output signals DEMODAT from the demodulator counter 2338 are applied to an OR gate 2352 which, in turn, is applied to a message shift register and BCH computer discussed be-low.
In order to account for the various selectable baud rates, circuitry is provided which includes an exclu-sive OR gate 2354, a flip-flop 2356, an OR gate 2358 and a MUX 2360 is used. This circuitry is applied to the de-modulator counter 2338 by way of an exclusive OR gate 2362 along with a stage one output signal from the flip-flop 2346. The output of the MUX 2360 provides a strobe signal which is either three or six times the bit rate. More specifically, a Q output of the flip-flop 2340 is applied to one input of the exclusive OR gate 2354. A Q output of the flip-flop 2356 is applied to the other input of the exclusive or gate 2354. The output of the exclusive OR
gate 2354 is applied to an input of the flip-flop 2356.
This flip-flop 2356 is clocked by a strobe signal PHCHAD
at six times the bit rate. The output of the flip-flop 2356 along with the output of the flip-flop 2340 are ap-plied to inputs of the OR gate 2358,. The output of the OR
gate 2358 is applied to one input of the MUX 2360 to gen-erate a signal that is three times the bit rate when 9600 baud is selected. The output of the flip-flop 2340 is also applied directly to another input of the MUX 2360 to generate a signal that is six times the bit rate.
The bit rates are selected by the command bits ICAH[7,6,5] as well as circuitry which includes a NAND
gate 2364 and an inverter 2366. The NAND gate 2364 and the inverter 2366 decode the baud rate and modulation method command bits ICAH[7,6,5]. The output of the NAND
gate 2364 is applied to a select input S of the MUX 2360.
A bit framing counter 2344 is used to count 12 one-sixth bit intervals to provide a frame of reference to determine whether the incoming signal comprises two start bits; both logic one's. Should the phase counters 2224, 2226, 2228 and 2230 count to eight during the 2-bit inter-val, a valid start bit is assumed and a signal BRCK is generated. The bit framing counter 2344 is a four stage counter and includes the flip-flops 2368, 2370, 2372 and 2374 as well as AND gates 2376, 2378 and 2380. This counter 2344 is clocked by the strobe signal PHCKAD. The first, second, third and fourth stages outputs are applied to the AND gate 2376 to provide a divide by twelve signal DIV12. The first, second and third stage outputs are ap-plied to the AND gate 2378 to provide a divide by six DIV6 signal. The first and second stage outputs are applied to the AND gate 2380 to provide a divide by three DIV3 sig-nal. The DIV12, DIV6 and DIV3 signals are applied to a MUX 2382. These signals are selected by inputs applied to SO and S1 inputs on the MUX 2382.
A command bit decode signal from the NAND gate 2364 is applied to an SO input. The other input Si is under the control of a NAND gate 2384. The NAND gate 2384 is a two input NAND gate. The NAND gate 2384 allows the bit framing counter 2344 to be adjusted after a valid start bit has been detected. More particularly, RCVDET
and TXON signals are applied to inputs of the NAND gate 2384. The RCVDET signal at the output of an inverter 2377, which is serially connected to a receive detect latch 2379. If during the first two bit interval, the de-modulator -counter 2338 has counted to eight indicating that eight of the twelve one sixth bit intervals cor-responding to the two start bits of a received message have been received, the RCVDET latch 2379 is set. When this latch 2379 is set, the signal RCVDET is low for the remainder of the message. Since the bit framing counter 2344 is also used for transmitting messages, the other in-put to NAND gate 2384 is a TXON. This signal is active low when the ICC 29 is transmitting a message.
The output of the NAND gate 2384 is then applied to the select input S1 of the MUX 2382 to select one of the four inputs of the MUX from the bit counter 2344. The output of the MUX 2382 is applied to a D input of the flip-flop 2386. This flip-flop 2386 is clocked by the strobe signal PHCKAD. The output of the flip-flop 2386 is applied to an input of the inverter 2388. The output of the inverter 2388 is a frame signa2. FRAME which produces a pulse after each bit is detected.
Circuitry is also provided to reset the system each time the demodulator counter 2338 counts to eight during the 2 start interval. This circuitry includes the NAND gates 2397 and 2398 and AND gates 2400 and 2402. The output of the AND gate 2402 is a reset word signal RSTWORD
that is applied to a CDN input of the flip-flop 2340. The RSTWORD signal is active at the end of a message as will be discussed below. This RSTWORD signal is also applied to a CDN input of the flip-flop 2342 used to generate the demodulator counter reset signal DEMODRST which, in turn, resets the demodulator counter 2338. The DEMODRST signal is generated by circuitry which includes inverters 2381 and 2385, an OR gate 2383 and an AND gate 2387 is-used to generate the DEMODRST. This signal is available at an output of the inverter 2381. An output of the OR gate .2383 is tied to the input of the inverter 2381. The OR
gate 2383 is a three input OR gate. An IRESET signal is applied to one input, available at the output of high gain inverters 2385 and 2405, to allow the circuitry to be re-set on system reset. An output from the AND gate 2400 is applied to another input of the OR gate 2383. The FRAME
signal is ANDed with the strobe signal PHCKCD to produce a pulse at the start of each bit. Lastly, an output of the AND gate 2387 is applied to the OR gate 2383. The AND
gate 2387 is a three input AND gate. A TXON signal, indi-cating that the transmitter is off is applied to one in-put. The RCVDET signal, indicating that the start bits have been detected, is applied to another input. Thirdly, a Q output from the flip-flop 2342 is applied to an input.
The flip-flop 2342 is used to release the reset on the de-modulator counter 2338 near the end of each one-sixth bit interval.
The AND gate 2402 is a three input AND gate. An IRESET signal is applied to one input. This signal is available at the output of an inverter 2404. The other inputs are from the NAND gates 2396 and 2398. The output of the NAND gate 2398 represents an end of message. More specifically, the ENDMSG signal is applied to an end of message latch 2404, which includes the NOR gates 2406 and 2408. The other input to the end of message latch 2404 is a strobe signal PHCKDD. The other input to the NAND gate 2398 is a strobe signal PHCKD.
The NAND gate 2396 is a two input NAND gate.
One input is the receive detection signal RCVDET, which is active when a signal is being received by the ICC 29 as discussed above. The other signal is from the AND gate 2400. The AND gate 2400 is a two input AND gate. One in-put is the strobe signal PHCKCD. The other signal is the frame signal FRAME available at the output of the inverter 2388.
Circuitry which includes a NAND gate 2410 and an inverter 2412 is used to develop a bit clock signal BRCK.
This signal is used to clock a bit counter 2414. The NAND
gate 2410 is a three input NAND gate. One input is a strobe signal PHCKBD. A bit frame signal FRAME is applied to another input. The output of the NAND gate 2384 is ap-plied to the third input. The NAND gate 2384 represents that a message is being received. The output of the NAND
gate 2410 is applied to the input of the inverter 2412.
The output of the inverter 2412 is the signal BRCK.
A DRCK signal is generated at the output of an AND gate 2416. This signal is used in conjunction with the ICC 29 transmitter as will be discussed below. The AND gate 2416 is a two input AND gate. One input is the strobe signal PHCKCD. The other input is the FRAME sig-nal.
The bit counter 2414 is illustrated in FIG. 62.
This bit counter 2414 is a six stage counter and includes the flip-flops 2430, 2432, 2434, 2436, 2438 and 2440. The bit rate clock signal BRCK is applied to the input of the first stage 2430. The output of the last stage of the bit counter 2414 is the end of message signal ENDMSG.
The output of the outputs of the first five stages 2430, 2432, 2434, 2436 and 2438 are applied to a six input NAND gate 2442 along with a BRCK signal, avail-able at the output of an inverter 2444. The output of the NAND gate 2442 is applied to a latch 2446, which includes the NAND gates 2448 and 2450. The other input to the latch 2446 is an output from an inverter 2452. The output of the latch 2446 is a signal 026, which is applied to a BCH computer to be discussed below. The 026 signal latches when the bit counter counts to 26.

Since this counter 2414 is used both for receiv-ing messages and transmitting messages to determine the end of a word, after a word is counted, the counter 2414 as well as the latch 2446, is reset by circuitry which in-cludes the inverter 2452 and inverter 2454 and NAND gates 2456 and 2458. When messages are being received by the ICC 29, a receive detection signal RCVDET and TXON, ap-plied to the inputs of the NAND gate 2456, are active.
The output of this NAND gate 2456 indicates that a message is being received by the ICC 29. During conditions when the ICC 29 is transmitting messages an INITX signal, ap-plied to another input of the NAND gate 2458, is active.
The INITX signal indicates that a message transmission has been initiated. Lastly, a reset signal IRESET, available at the output of the inverter 2054, is applied to the third input. The output of the NAND gate 2458 indicates that either a message is being received or that the ICC 29 is transmitting a message. The output of the NAND gate 2458 is applied to an input of the inverter 2452. The output of the inverter 2452 is used to reset the bit counter 2414 as well as the latch 2446. More speci-fically, the output of the inverter 2452 is applied to CDN inputs of all six stages of the bit counter 2414. The output of the inverter 2414 is also applied to one input of the 026 signal latch 2446. The output of the NAND gate 2458 is also used to reset the BCH computer which will be discussed later.
Circuitry which includes a flip-flop 2460 and a NOR gate 2463 is used to develop a transmitter signal identified as TXOFF. This signal is used in conjunction with the transmitter control circuits discussed below.
More particularly, a Q output of the sixth stage of the 2440 of the bit counter 2414 is applied to one input of the two input NOR gate 2462. The TXON signal is applied to the other input. The TXON signal is active low indi-cates that the transmitter is on. The output of the NOR
gate 2462 is applied to a D input of the flip-flop 2460.
The flip-flop 2460 is clocked by the frame signal FRAME.

The TXOFF signal is available at a QN output of the flip-flop 2460. This flip-flop is reset by an INITX signal, which is applied to a CDN input of the flip-flop 2460.
INCOM SHIFT REGISTER
A 32 stage serial shift register 2462 is used for INCOM messages in both receive and transmit opera-tions. This shift register 2462 includes the flip-flops 2464-2514, illustrated in FIGS. 71 and 72. Each stage of the shift register 2462 is adapted to receive two inputs which are selected by a LOAD signal used for loading mes-sages into the shifted register 2462. More specifically, as discussed previously, a transmit data bus TDATA[26...0]
which allows the microprocessor 30 to communicate with the ICC 29, is applied to DA inputs of each stage of the shift register 2462. The demodulated output bits DEMODAT for received messages are applied to DB inputs of the first stage 2464 of the shift register 2462 for received mes-sages. Received messages are then shifted through the shift register 2462. The receive data bus RDATA[26...0]
is applied to Q outputs of each of the stages. The RDATA[26...0] bus allows demodulated incoming messages to be communicated to the microprocessor 30.
A LOAD signal is applied to the select inputs SA
of each stage to allow the shift register 2462 to select between received messages and transmitted messages. The LOAD signal is available at the outputs of parallel con-nected inverters 2516 and 2518. The output of the in-verter 2520 is connected to the input of the parallel con-nected inverters 2516 and 2518. The LOAD signal, dis-cussed in conjunction with FIG. 78 'below, is applied to the input of the inverter 2520. The LOAD signal is avail-able at the output of the parallel connected inverters 2516 and 2518.
A shift register clock signal SRCK, discussed in conjunction with FIG. 79, is applied to the clock inputs of each stage of the shift register 2462. The SRCK signal is available at the outputs of the parallel connected inverters 2520 and 2522. The input to the parallel con-nected inverters 2520 and 2522 is an SRCK signal.
Except for stage one 2464 and stage two 2466, which are the status bits for the reply message, the bal-ance of the stages 2468-2514 are set to zero on system re-set. More particularly, a IRESET signal available at the output of the parallel connected inverters 2524 and 2526 is applied to CDN reset inputs of the third through thirty-second stage. The inputs to these inverters 2524 and 2526 are tied together and to the output of an in-verter 2528. The input of the inverter 2528 is connecte.d to the output of an inverter 2530. The IRESET signal is applied to the input of the inverter 2530.
The status bits for the reply message are avail-able on an internal reply status bit bus RSB[2.6,25].
These status bits are available at the Q outputs of the flip-flops 2030 and 2032 which form a portion of the ICMO
message register. Definitions for the status bits are provided in Table 21. These status bits RSB[26,25] are applied to either the set SDN or reset CDN inputs of the first and second stage flip-flops 2464 and 2466. More particularly, these bits RSB[26,25) are applied to inputs of dual input NAND gates 2532 and 2534 along with a STSLD
signal, which indicates that a reply message is being for-mulated. The outputs of the NAND gates 2532 and 2534 are applied to the select inputs SDN of the stage one and stage two shift register flip-flops 2464 and 2466 to shift ones into these flip-flops when selected. These reply status bits RSB[26,25] are also applied to inputs of in-verters 2536 and 2538. The output of these inverters are applied to two input NAND gates 2540 and 2542 along with the STSLD signal. The outputs of the NAND gates 2540 and 2542 are applied to the reset inputs CDN of the flip-flops 2464 and 2466 to set these flip-flops to zero when selected.
ICC CONTROL LOGIC
The control logic for the ICC 29 is illustrated in block diagram form in FIG. 73. The control logic includes transmitter control logic circuitry 2516, illus-trated in FIG. 74, a BCH computer 2518 illustrated in FIG.
75, address and command decoder logic 2520, illustrated in FIGS. 76 and 77 and control and status logic 2522 illus-trated in FIGS. 78 and 79.
Referring first to the transmitter control logic 2516, the ICC 29 transmitter output is a signal TXOUT.
This signal is applied to a tristate device 2524 (FIG. 54) whose output is tied to the external pin TX. The TXOUT
pin is available at the output of a NOR gate 252_6 (FIG.
74). When the ICC 29 is operated in the master mode, it can transmit any time. When the ICC 29 is operated in the slave mode, it can only transmit if a reply is requested by the initiating controller. In the slave mode, the ICC
29 is under the control of an AND gate 2528 (FIG. 79).
The AND gate 2528 is a two input AND gate. One input is an interface enable signal ENAINT. This signal is avail-able from the address/command decoder 2520, which will be discussed below. The other input is a slave mode signal available at the output of an inverter 2530. The input to the inverter 2530 is the command bit ICCR[5]. When this command bit is a logical zero, the ICC 29 will be in the slave mode. The output of the AND gate 2528 is applied to the input of an interface enable latch 2532, which in-cludes the NAND gates 2534 and 2536. The output of the latch 2532 is the control bit ICSR[6] which indicates that the communication controller 29 interface is enabled. The latch 2532 is also used to generate an ENAB signal, avail-able at an output of a flip-flop 2533. More particularly, the output of the latch 2532 is applied to a D input of the flip-flop 2533. The signal ENAB is available at a Q
output of this flip-flop. The strobe signal PHCKAD, available at the output of the inverter 2590, is applied to a clock input CP of this flip-flop.
The interface enable latch 2532 may be disabled by a two input AND gate 2538. One input to the AND gate 2538 is a reset signal RESET. The other input is a dis-able interface signal DISINT, available at the output of the address/command decoder 2520. The DISINT signal dis-ables the interface enable latch 2532 when a reply is not necessary.
In the master mode, the ICC 29 can transmit any time. Initiation of transmissions is under the control of a three input NAND gate 2540 (FIG. 78). The command bit ICCR[0], which indicates a transmission command, is ap-plied to one input. The control bits ICSR[6,5] are ap-plied to the other inputs. The control bit ICSR[6] indi-cates that the interface is enabled. The control bit ICSR[5] is active low when the transmitter is'inactive to allow the message start bits (e.g., two 1's) to be gener-ated. More particularly, the output of the NAND gate 2540 is applied to a start bit latch 2542, which includes the NAND gates 2544 and 2546. The output of the start bit latch 2542 is applied to a pair of flip-flops 2548 and 2550 to generate the start bits. A Q output of the flip-flop 2550 is applied to an input of a message transmit AND
gate 2552. The other input to the AND gate 2552 is from a FAST STATUS AND gate 2572, which wi17L be discussed below.
The output of the AND gate 2552 is a transmit message sig-nal TXMSG. The TXMSG signal is applied to a SDN input of the flip-flop 2574 (FIG. 74) to set this flip-flop to one during the start bit interval. A D:input of the flip-flop 2574 is grounded. The flip-flop 2574 is strobed by a transmitter control strobe signal DRCK, available at the output of the AND gate 2416 (FIG. 61).
After the two start bits are generated, an AND
gate 2554 resets the flip-flops 2548 and 2550 and the start bit latch 2542. The AND gate 2554 is a two input AND gate. One input is from the output of the flip-flop 2550. A IRESET signal is applied to the other input to allow the flip-flops to be set to zero on system reset.
The IRESET signal is available at the output of an in-verter 2556. The flip-flops 2548 and 2550 are strobed by PHCK signal which strobes the flip-flops every bit.
In both the master mode and the slave mode, a reply latch 2558, which includes the NAND gates 2560 and 2562, is set. The reply latch 2558 is under the control of the two input NOR gate 2526. One input to the NOR gate 2526 is the REPLY signal, which indicates that a reply is required. The command bit ISCR[5] is applied to the other input. The output of the latch 2558 is applied to one in-put of a two input NAND gate 2564. The other input to the NAND gate 2564 is a fast status latch 2566 which includes the NAND gates 2568 and 2570. The output of the NAND gate 2564 is applied to one input of a two input NAND gate 2572 along with a strobe signal PHCKDD., The output of the NAND
gate 2572 is applied to the NAND gate 2552 along with the output of the flip-flop 2550 to generate a transmit mes-sage signal TXMSG.
Signals INITX and TXON are also generated by the transmitter control logic circuitry 2516. More particu-larly, a Q output of the flip-flop 2574 is applied to the inverter 2576. The output of the inverter 2576 is an ini-tiate transmit signal INITX. This signal INITX is inter-locked with the BCH computer 2518 as will be discussed be-low.
A Q output of the flip-flop 2574 is applied to a transmitter latch 2578 which include;s the NAND gates 2580 and 2582 to generate a TXON signal. The transmitter latch 2578 is reset by the TXOFF signal. This signal is avail-able at a Q output of the flip-flop ;2460 (FIG. 62) and in-dicates that the message counter has counted 32 bits. The output of the transmitter latch 2578 is applied to an in-put of an inverter 2584. The output of the inverter 2584 is the TXON signal, active low, indicates that the trans-mitter is on. This TXON is used to develop the control bit ICSR[5], which indicates that the transmitter is ac-tive. More particularly, the TXON signal is applied to an inverter 2586 (FIG. 79). The output of the inverter 2586 is applied to a D input of a flip-flop 2588. A Q output of the flip-flop 2588 is the control bit ICSR[5]. Flip-flop 2588 is strobed by a PHCKAD signal, available at the output of an inverter 2590. The input to the inverter 2590 is the strobe signal PHCKAD.

A Q output of the flip-flop 2588 is also used to generate a BUSY signal as well as the SR5 signal, which is active low. More specifically, a u output of the flip-flop 2588 is applied to one input of a two input NAND gate 2591. The other input is the RCVDET signal which indi-cates that a message is being received. The output of the NAND gate 2591 is the BUSY signal.
TRANSMITTER CONTROL
Various modulation methods are. available: ASK, FSK and baseband. The start.bits are shifted into a flip-flop 2592 by tying a Q output of the flip-flop 2574 to a SDN input of the flip-flop 2592 as discussed above. The signal MODIN, available from the BCH computer 2518, which will be discussed below, is applied to a D input of the flip-flop 2592. The flip-flop 2592 is strobed by the BRCK
signal available at the output of the inverter 2412 (FIG.
61). The baseband signal, available at a Q output of the flip-flop 2592, is applied to an input of a MUX 2594. it is also applied to an FSK modulator MUX 2596. More par-ticularly, 115.2 kHz (FC) and 92.16 kHz (FCA) signals are applied to the inputs of the MUX 2596. The Q output of the flip-flop.2592 is applied to the select S input of the MUX 2596 to shift between 115.2 kHz and 92.16 kHz for FSK
modulation. The output of the MUX 2596 is applied to an inverter 2598 which, in turn, is applied as an FSK input of the MUX 2594. A Q output of the flip-flop 2592 is ap-plied to one input of a two input NAND gate 2600, used for ASK modulation along with the carrier signal FC. The out-put of the ASK modulator 2600 is applied to another input of the MUX 2594. The control bits ICAH[5,4] are applied to the select inputs S1 and SO of the MUX 2594 to select between ASK, FSK or baseband. The output of the MUX 2594 is applied to the OR gate 2526 along with an intermessage spacing generator latch 2602 output. The intermessage spacing latch 2602 includes the NAND gates 2604 and 2606 and provides zeros between messages. The output of the intermessage spacing latch 2602 is applied to another in-put of the OR gate 2526. The output of the OR gate 2526 is the TXOUT signal.
The intermessage spacing latch 2602 is under the control of a two input NAND gate 2604. The NAND gate 2604 is a two input NAND gate. One input is from the counter signal BRCK. The other input is the Q output of the flip-flop 2574. Thus, whenever a transmission is initiated, the BRCK signal times the transmission and provides zeros at the end of a message.
CONTROL AND STATUS LOGIC
Various control and status signals are generated by the control and status logic circuitry 2522. The con-trol bits ICSR[7...5] have previously been discussed.
Status bits ICSR[4...0] are derived from the circuitry il-lustrated in FIG. 78.
The status bit ICSR[0] indicates a receiver (RX) overrun. This status bit is developed by the circuitry which includes a flip-flop 2620, NAND gates 2622 and 2624 and inverters 2626, 2628, 2630 and 2632. A receive signal RCV, available from the instruction decoder 2520, is ap-plied to a clock input CP of the flip-flop 2620 by way of inverters 2626 and 2628. A Q output of the flip-flop 2620 is NANDed with the status bit ICSR[;'], by way of the NAND
gate 2622 and applied to a D input of the flip-flop 2620.
The bit ICSR[0] is set if the message register has not been released (ICSR[2] = 1) when a new message is ready to be loaded into the message register. This status bit is cleared by system reset or writing to ICCR[1] = 1. More specifically, reset is under the control of the AND gate 2624. The NAND gate 2624 is a two input NAND gate. One input is the bit ICCR[1] which is applied by way of the inverter 2630. The other input is the IRESET signal, available at the output of an inverter 2636. The output of the AND gate 2624 is applied to a reset input CDN of the flip-flop 2620 by way of the inverter 2632.
The RCV signal is also used to generate a mes-sage register receive buffer strobe signal SRTOMR. This signal is applied to an AND gate 2638 along with a Q out-put of the flip-flop 2634, indicating that the receive operation is not complete.
The bit ICSR[1] indicates a BCH error which is set after a message containing an error is received. This bit is generated by circuitry which includes a flip-flop 2640, an OR gate 2642 and an inverter. 2644. A BCHOK sig-nal, indicating an error, is available at the output of the inverter 2644. This signal is applied to one input of the OR gate 2642 along with a Q output of the flip-flop 2640. The flip-flop 2640 is clocked by the RCV signal.
The f;lip-flop 2640 is reset in the same manner as the flip-flop 2620.
The bit ICSR[2] when set, indicates that a re-ceived message has been loaded into receive message buffer. This bit is available at the output of the flip-flop 2634. A D input of this flip-f'lop is grounded. The flip-flop 2634 is clocked by the RC%F signal and is reset in the same manner as the flip-flops 2620 and 2640.
The bit ICSR[3] when set indicates the comple-tion of a message transmission. Circuitry for generating this bit includes the flip-flop 2644, a transmitter latch 2646, which includes NAND gates 2648 and 2650 and an AND
gate 2652. The transmitter latch 2646 output is applied to a D input of the flip-flop 2644. This latch 2646 is latched while the transmitter is active. More spe-cifically, a TXOFF signal, available at an output of an inverter 2654 is applied to a clock input of the flip-flop 2644. The TXOFF signal is active high and indicates that the transmitter is off. A Q output of the flip-flop 2660, which is low after the message start bits are generated.
Thus, the bit will be set at the end of message after the TXOFF signal becomes high, indicating that the transmitter is off.
The bit ICSR[3] is cleared on reset by the AND
gate 2652. The IRESET signal is applied to one input.
The bit can also be reset by writing to ICCR[2] = 1. The ICCR[2] signal is available at an output of an inverter 2654. An output from the NAND gate 2540 is also applied to another input of the AND gate 2652 to reset the flip-flop 2644 when a new transmission is initiated.
The bit ICSR[4] is set after completion of a fast status message transmission. Circuitry for generat-ing this bit includes a flip-flop 2656, a latch 2658 which includes the NAND gates 2660 and 2662 and an AND gate 2664. The latch 2658 is set by the fast status enable latch 2566. The fast status enable latch 2566 is under the control of a three input OR gate 2665. The command bit ICCR[5] indicating master mode is applied to one in-put. The bit ICCR[6), which indicates a fast status en-able, available at an output of an inverter 2567 is ap-plied to another input. Lastly, a signal FAST is applied to the third input. The FAST sigrial indicates that a fast status reply message has been requested in an incoming message. The fast status enable latch is strobed by the strobe signal PCKAD, available at an output of an inverter 2669.
An output of the latch 2658 is applied to a D
input of the flip-flop 2656. The TXOFF signal is applied to the clock input CP to set this bit: when the transmitter is off after the fast status enable latch 2566 is set. A
Q output of the flip-flop 2656 is applied to an input of the latch 2658 to reset it after the status bit ICSR[4] is set.
Reset of this bit is under the control of the two input AND gate 2664. The IRESET . signal is applied to one input. The bit may also be reset by writing to ICCR[3]. The bit ICCR[3] is available at an output of an inverter 2666.
An interrupt signal INT is generated at an out-put of an AND gate 2670. When set, this bit will generate an interrupt on receive and transmit operations. More specifically, the bit ICCR[7], which indicates interrupt enable is applied to one input of the AND gate 2670. An output of a NAND gate 2672 is applied to another input.
The NAND gate 2672 is a three input NAND gate Q outputs from the flip-flops 2634, 2644 and 2656 are applied to the inputs to generate interrupts during receive and transmit operations.
The LOAD signal, used to load messages into the shift register 2462 is generated by a NAND gate 2574. The NAND gate 2574 is a two input NAND gate. One input is from the fast status enable latch 2566. The other input is from the flip-flop 2550, which indicates the message start bits have been generated.
The signal STSLD, is used to enable the AND
gates 2532 and 2534 (FIG. 71). This signal is a status bit load signal and is used to allow the status bits to be loaded into the first two stages 2464, 2466 of the shift register 2462. This signal STSLD is available at an out-put of an inverter 2572. The output of the NOR gate 2526, previously discussed is applied to the input of the in-verter 2672.
Lastly, the SRCK signal, used to strobe the shift register 2462, is generated by circuitry which in-cludes an AND gate 2674, NAND gates 2676 and 2678 and an inverter 2680 (FIG. 79). Outputs of the NAND gates 2676 and 2678 are applied to inputs of the AND gate 2674. The signal 026, available at an output of the inverter 2680, indicates that the bit counter 2414 has not yet counted 26 bits, is applied to one input of the NAND gate 2676 along with the bit rate clock signal BRCK and the INITX signal.
The strobe signal PHCKCD and the LOAD signal are applied to inputs of the NAND gate 2678.
BCH COMPUTER
The BCH computer 2518 is illustrated in FIG. 75 and computes a five bit error code based upon the first 27 message bits. The BCH computer 2518 is implemented as a five stage shift register 2674, which includes flip-flops 2676, 2678, 2680, 2682 and 2684 and an exclusive OR gate 2686.
In the message receive mode, as the demodulated bits DEMODAT are loaded into the shift register 2462, they are simultaneously applied to a receive/transmit MUX 2686.
The input signals to the MUX 2686 are selected by the TXON signal, applied to a select input S of the MIIX 2686.
Before the 26th message bi't is received, the de-modulated message bits DEMODAT are applied to an exclusive OR gate 2688 by circuitry, which includes an AND gate 2690, an inverter 2692 and a NOR gate 2694. More spe-cifically, an 026 signal is applied to the inverter 2692, whose output is applied to one input of the AND gate 2690.
The demodulated message bits DEMODAT are applied to the other input of the AND gate 2690. The output of the AND
gate 2690 is applied to an input of the exclusive OR gate 2688 along with an output of the NOR gate 2694 to allow the first 26 message bits to be shifted into the shift register 2674 to generate the error code. After the first 26 message bits are received, the error code stored in the shift register is shifted out under the control of the NOR
gate 2694. The NOR gate 2694 is a two input NOR gate.
The 026 signal is applied to one input. A Q signal from the last stage 2684 of the shift register 2674 is applied to the other input.
The error code is compared with the error code in the received message by way of an exclusive OR gate 2696. The output of the exclusive OR gate 2696 is applied to a two input NAND gate 2698. The output of the NAND
gate 2698 is applied to a DA input of a flip-flop 2700 which selects the DA input after the 26 message bits are.
received to generate a BCHOK signal if the error codes match. The BCHOK signal is fed back as an input to the AND gate 2698. While the error code is being computed, the previous BCKOK signal is latched by tying a Q output of the flip-flop 2700 to a DB input.
The BCH shift register 2674 is clocked by a BCH
clock signal BCHCLK, generated by circuitry which includes a NAND gate 2702 and an inverter 2704. More particularly, the bit rate clock signal BRCK along with the INITX are applied to the inputs of the NAND gate 2702. The output of the NAND gate 2702 is applied to an input to the in-verter 2704. The BCHCLK signal is available at the output of the inverter 2704.
The BCH shift register 2674 is cleared by a BCHCLR signal, available at an output of an inverter 2706. The input to this inverter 2706 is a BCHCLR signal, which is available at the output of the NAND gate 2458 (FIG. 62), which indicates that a message has been received. Clearing of the flip-flop 2700 is under the control of a two input AND gate 2708. One input to the AND' gate 2708 is the TXON signal indicating that the transmitter is off. The other input is the BCHCLR signal.
It is also necessary to compute a BCH error code for reply messages. Thus, the TXD output of the message shift register 2462 is applied to the MUX 2686. This in-put is selected by the TXON signal during transmission of a message. The message bits are shifted into the shift register 2674 to generate a BCH error code in the same manner as before. In the meantime, the message bits are also applied to a MUX 2708 to develop a MODIN signal which is applied to the transmitter (FIG. 74). After 26 message bits, the signal 026 selects another input of the MUX 2708 to allow the error code to be added at the end of the mes-sage.
ADDRESS COMMAND DECODER
The address command decoder 2520 is illustrated in FIG 76. The INCOM address, stored in the ICAH[3...0]
register and the ICAL[7...0], is compared with the address received on the receive data bus RDATA[22...11] by way of exclusive OR gates 2710, 2712, 2714, 2716, 2718, 2720, 2722, 2724, 27265, 2728, 2730 and 2732; NOR gates 2734, 2736 and 2738 and NAND gates 2740, 2472 and 2744 to gener-ate an ADDROK signal if the received address matches the address in the ICAH and ICAL registers.
The address bit comparisons of the bits B22-B19 are applied to the NOR gate 2734. The address bit compar-isons of the bits B18-B15 are applied to the NOR gate 2736. Lastly, the address bit comparisons of the bits B14-B11 are applied to the NOR gate 2738.

The outputs of the NOR gates 2734 and 2736 for bit comparisons are applied to the NAND gate 2240 along with a BLOCK signal, available at an output of an inverter 2746. When block instructions are employed, the lower four order bits B11-B14 are ignored. The output of the NAND gate 2740 is applied to one input of the NAND gate 2744.
When no BLOCK instructions are employed, the NAND gate 2744 is under the control of the NAND gate 2742.
The NAND gate 2742 receives inputs from the NOR gates 2734, 2736 and 2738 and provides address comparisons for all of the address bits B22-B11. The NAND gate 2744 is also controlled by the UNIV address signal. This signal allows messages to be received by all devices on the net-work.
The command field B10-B7 is used to define the command in enable interface control messages. These bits B10-B7 are decoded by a four input NOR gate 2748. A sub-command field I defines the subcommand in enable interface control messages. These bits are decoded by a NOR gate 2750. The outputs of the NOR gates 2748 and 2750 are ap-plied to an AND gate 2762 whose output is a command signal CMNDO.
A receive message strobe signal RCVMSGSTB, used to generate the receive message signal RCV, is developed by the circuitry which includes a flip-flop 2754, on AND
gate 2756, a NOR gate 2758 and an inverter 2760. A
TXON and end of message signal ENDMSG are ANDed by the AND gate 2756 and applied to a D input of the flip-flop to indicate that a message has been received and the trans-mitter is not on. This signal is shifted into the flip-flop on a BRCK signal available at an output of the inverter 2760.
The flip-flop 2754 is reset by the NOR gate 2758. The strobe signal PHCKCD is applied to one input of the NOR gate 2758 while the RESET signal is applied to the other input to reset the RCVMSGSTB signal on system reset and by the strobe signal PHCKCD.

I S~ TRUCTION DECODER
Instruction decoder circuitry 2760 is illus-trated in FIG. 77. The instruction field consists of the message bits B6-B3. Message bit B2 defines the meaning of the message bits. These bits are applied to decoder cir-cuitry which includes inverters 2762-2780; NAND gates 2782-2810; AND gates 2812, 2814 and 2816 and exclusive OR
gates 2818 and 2820.
The instruction field B6-B2 definitions are de-fined in Table 20 along with the control bit B2. These bits are applied to the inverters 2762, 2766, 2770, 2774 and 2778 which, in turn, are connected to serially coupled inverters 2764, 2768, 2772 and 2776, respectively. The output signals from the inverters 2762-2780 are connected to the various NAND gates, AND gates and exclusive OR
gates as shown to generate the signals RCV, FAST, DISINT, ENAINT, REPLY, BLOCK and UNIV available at outputs of the AND gate 2812 and the NAND gates 2782, 2783, 2786, 2788, 2804 and 2810, respectively. These signals are all active low.
More particularly, the UNIV addressing type is available at an output of the four input NAND gate 2810.
Bits B6, B5 and B2 are applied to the NAND gate 2810 along with an output of the exclusive OR gate 2820. Bits B3 and B4 are compared by the exclusive OR gate 2820. B2 is a control bit and will both be a logical 1 for instruction decoding. Bits B5 and B6 will both be logical 1's for the instructions $C, $D, $E and $F (Table 20). The output of the exclusive OR gate 2820 will produce a logical 1 for instructions $1, $2, $5, $6, $9, $A, $D and $E. Thus, the output of the NAND gate 2810 will be low for instructions $6, $D and $E.
The BLOCK addressing type instruction is avail-able at the output of the NAND gate 2804. Bits B5, B'4 and B2 are applied to the inputs of the NAND gate 2804.
Since these bits must be a logical 1 in order to produce an active low signal at the output of the NAND gate 2804, this portion of the circuitry will decode instructions $4, $5, $C and $D as long as the output of the NAND gate 2808 is a logical 1. Bit B3 is applied to one input of the NAND gate 2808. An output of the NAND gate 2806 is applied to the other input. Bits 86 and B3 are applied to the inputs of the NAND gate 2806 to produce a logical 1 at the output of the NAND gate 2806 to produce a logical 1 at the output of the NAND gate 2808 for the instructions $4, $5, $B and $C to generate the BLOCK signal.
The REPLY, ENAINT, DISINT, FAST and RCF signals are all enabled by a three input AND gate 2814. The RCVMSGSTB, BCHOK and control bit B2 signals are ANDed to generate a permissive signal, identified as DECODE, indi-cating that a correct message has been received. The output of the AND gate 2814 is applied to inputs of the NAND gates'2782, 2784, 2786, 2788 and 2792.
The REPLY signal is available at an output of the NAND gate 2788. Also applied to the NAND gate 2788 are the control bit CR5, available at an output of an in-verter 2828, which indicates whether the ICC 29 is in the master mode, the ADDROK signal, bit B6 and the output of the NAND gate 2802. If the correct address has been de-coded and the ICC 29 is in the slave mode, an active low REPLY signal will be generated when bit B6 = 1, which oc-curs for instructions $8, $9, $A, $B, $C, $D, $E and $F, and the output of the NAND gate 2802 = 1. The inputs to NAND gate 2802 are outputs from the NAND gates 2709 and 2800. The circuitry which includes the NAND gates 2798, -_800 and 2802 and the exclusive OR gate 2818 will produce a 1 at the input of the NAND gate 2788 for the instruc-tions $8, $9, $A and $F.
The ENAINT signal is available at the output of the NAND gate 2786. In addition to the DECODE signal, An ADDROK and bits B3, B4, 85 and B6 are applied to its in-puts to generate the ENAINT signal for instruction $3.
The DISINT signal is available at an output of the NAND gate 2784 and decodes the instructions $2. One input to the NAND gate 2784 is the DECODE signal. The output of the NAND gate 2794 is applied to the other in-put. The NAND gate 2794 is a two input NAND gate. The ADDROK signal is applied to one input. The output of the NAND gate 2796 is applied to the other input. The CR5, ADDROK signals as well as bits B5, B4 and B3 are applied to the inputs of the NAND gate 2796.
The FAST signal is available at an output of the NAND gate 2782. If the control bit B2 is set, an instruction field of $3 is decoded and a command field CMDO of 0 exists, the FAST signal is generated. The CMDO
and DECODE signals as well as bits B2, B3, B5 and B6 are applied to the input of the NAND gate 2782 to generate the FAST signal.
The RCV signal is available at an output of the AND gate 2812. The outputs of the NAND gates 2790 and 2792 are applied to the inputs. The NAND gate 2790 is a two input NAND gate. The signals RCVMSGTB and ENAB are applied to its inputs to generate this active low signal anytime a message with the interface enable instruction.
During other conditions, the signal RCV is under the con-trol of the two input NAND gate 2792. In order to gener-ate an active low RCV under these conditions, the output of the input of the NAND gate 2782 to generate the FAST signal.
The RCV signal is available at an output of the AND gate 2812. The outputs of the NAND gates 2790 and 2792 are applied to the inputs. The NAND gate 2790 is a two input NAND gate. The signals RCVMSGTB and ENAB are applied to its inputs to generate this active low signal anytime a message with the interface enable instruction.
During other conditions, the signal RCV is under the con-trol of the two input NAND gate 2792. In order to gener-ate an active low RCV under these conditions, the output of the NAND gate 2792 must be low which requires its in-puts to both be high. The inputs to the NAND gate 2792 are the outputs from the AND gates 2814 and 2816. The output of the AND gate 2814 is the DECODE signal which indicates that a correct message has been received and the control bit B2 is set. The AND gate 2816 is a two input AND gate. The ENAB and ADDROK signals are applied to its inputs. The AND gate 2792 produces a high output when the ICC 29 has been addressed and a message has been received with an enable interface instruction.

In the illustrated embodiment, the IC 10 is housed in an 80 pin quad plastic flat package (QPFP), gull wing, surface mount package. The IC 10 is a hybrid device fabricated utilizing CMOS technology and implemented in a way to overcome the shortcomings: of utilizing CMOS for analog functions. Various ratings, operating conditions and dc characteristics are provided in Appendix A.
A detailed pin assignment for the IC 10 is shown in FIG. 82. Some pins have a dual function. For example, a pin may have one function in one configuration and a different function in another configuration as will be discussed in more detail below.
The following is a brief description of the sig-nal definitions for each of the pins illustrated in FIG.
82. A pin summary is provided in Table 22.
PA7...PAO: Port A - These eight bidirectional port pins can be individually programmed to be inputs or outputs by the software.
PB7...PBO: Port B - These eight bidirectional port pins have multiple functions depending on the operat-ing mode of the IC 10. In the single-chip mode, these port pins can be individually programmed as inputs or out-puts by the software. In the expanded, emulation, or test modes, these eight port pins contain the high-order ad-dress bus.
PC7...PCO: Port C - These eight bidirectional port pins can be individually programmed to be inputs or outputs by the software. The low-order four pins can also be configured to be the logical OR of the outputs of the four comparators.
PD7...PDO: Port D - These eight bidirectional port pins have multiple functions depending on the operat-ing mode of the IC 10. In the single-chip mode, these SIGNAL DEFINITIONS
SIGNAL PIN DIRECTION TYPE
BSYN 1 Output CMOS
PD7...PDO 2...9 Bi-directional CMOS
SCK 10 Bi-directional Schmitt MISO 11 Bi-directional CMOS
MOSI 12 Bi-directional CMOS
SSN 13 Input CMOS
PH2 14 Output CMOS
PB7...PBO 15...22 Bi-directional CMOs PA7...PAO 23...30 Bi-directional CMOS
VDD 31 supply Digital + supply VSS 32 Supply Digital + Supply PC7...PCO 33...40 Bi-Directional CMOS
CPO...CP3 41...44 Input Analog BDRIVE 45 Output Analog BSENSE 46 Input Analog APOS 47 Input Analog ANEG 48 Input Analog AOUT 49 Output Analog AVDD 50 supply Analog + supply AVSS 51 Supply Analog + Supply MUX7...MUXO 52...59 Input Analog MXO 60 Output Analog NC (not connected) 61 VREF 62 Output Analog Reference VADJ 63 Input Analog REN 64 Output CMOS
WEN 65 Output CMOS
ALE 66 Output CMOS
PWM 67 Output CMOS
TCMP 68 Output CMOS
SHUNT 69 Output CMOS
VSS 70 Supply Digital - Supply VDD 71 Supply Digital TCAP 72 + Supply Input CMOS
PSEN 73 Output CMOS
OSC2 74 Output Analog oSC1 75 Input Analog RESN 76 Input Schmitt IRQN 77 Input CMOS
EXPN 78 Input CMOS
TX 79 Output CMOS
RX 80 Input Schmitt port pins can be individually programmed as inputs or outputs by the software. In the expanded, emulation, or test modes, these eight bidirectional port pins form a multiplexed data and address bus. When PH2 is asserted, these pins are outputs and contain the least-significant 8-bits of the address. When PH2 is negated, these pins are bidirectional and contain read or write data.
EXPN - This low-true signal enables the expanded mode of operation. The single-chip mode is enabled by connecting EXPN to VDD. This input is sampled when RESN
changes from an electrical low level to an electrical high level. The operating mode of the IC 10 is determined when the device leaves the reset state. Table 1 defines the pin input levels for various operating modes.
PH2 - The function of this output pin depends on the operating mode of the IC 10. In single-chip and self-test modes it will remain low. In all others, it is theprocessor's phase 2 clock. Phase 2 is the oscillator output divided by two, and changes on the falling edge of OSC2. Table 2 defines the output of PH2 for various oper-ating modes.
REN.- The function of this output pin depends on the operating mode of the IC 10.
~ In single-chip and self-test modes it is used as a diagnostic pin. It will remain high except during internal read operations between $4000-$7FFF.
~ In expanded mode, it is used as the write strobe for external memory devices mapped in the address range of $4000 to $7FFF. When low, the memory device can strobe data from the Port D
pins.
~ In emulation and test modes, it becomes the processor's internal E clock signal. E clock is PH2 delayed by 90 .
Table 2 defines the output of REN for various operating modes.

WEN - The function of this output pin depends on the operating mode of the IC 10.
~ In single-chip and self-test modes it is used as a diagnostic pin. It will remain high except during internal read operations between $4000-$7FFF.
~ In expanded mode, it is used as the write strobe for external memory devices mapped in the address range of $4000 to $7FFF. When low, the memory device can strobe data from the Port D
pins.
~ In emulation and test modes, it becomes the processor's internal E clock signal. E clock is PH2 delayed by 90".
Table 2 defines the output of WEN for various operating modes.
PSEN - The function of this output pin depends on the operating mode of the IC 10.
~ In single-chip and self-test modes it is used as a diagnostic pin. It will remain high except during internal read operations between $8000-$EEFF.
~ In expanded mode, it is used as the read strobe for external read-only-memory devices mapped in the address range of $8000 to $FFFF. When low, the memory device should place read data on the Port D pins.
~ In emulation and test modes, it becomes the processor's internal LIR signal. This pin then indicates when the processor is reading an in-struction from the external data bus. A high indicates that the instruction register is being loaded.
Table 2 defines the output of PSEN for various operating modes.
ALE - The function of this output pin depends on the operating mode of the IC 10.

~ In single-chip and self-test modes it will remain low.
~ In all other modes, it is used to latch the least-significant 8 bits of the address present on Port A.
Table 2 defines the output of ALE for various operating modes.
TX - This digital output is the transmitter out-put from the ICC subsystem.
RX - This digital Schmitt input is the receiver input to the ICC subsystem.
BUSYN - This low-true digital output is the busy output from the ICC subsystem.
SCK - This bidirectional pin is the serial clock for the SPI subsystem.
MISO - This bidirectional pin is the 'master in, serial out' for the SPI subsystem.
MOSI - This bidirectional pin is the 'master out, serial in' for the SPI subsystem.
SSN - This low-true input pin is the 'slave select' input for the SPI subsystem.
PWM - This digital output is the pulse-width modulated output from the PWM subsystem.
TCMP - This digital output is the timer primary output compare.
TCAP - This digital input is the timer input capture signal.
IRQN - This low-true digital input is the asyn-chronous external input to the microcontroller. A mask programmable option permits selection of two triggering methods: 1) negative edge-sensitive triggering only, or 2) both negative edge-sensitive and low level-sensitive triggering. In the latter case, either type of input to the IRQN pin will produce an interrupt. The interrupt re-quest must be present at least 125 ns in edge-triggered mode.

If the level-sensitive mask option is selected, the IRQN pin requires an external resistor to VDD for wire-OR' operation.
The IRQN pin also puts the IC 10 in a test mode when placed at +9 V during reset. This mode is for test only and should not be used during normal operation.
RESN - This low-true input provides an external method of initializing the IC 10. When using the external reset, RESN must stay low for a minimum of 1.5 processor phase 2 cycles. RESN is received by a Schmitt receiver.
BSENSE - This analog input is the non-inverting input to the B+ comparator.
BDRIVE - This analog output is the output of the B+ comparator.
APOS, ANEG - These analog inputs are the invert-ing and non-inverting inputs of the comparator.
AOUT - This analog output is the comparator out-put pin. In many applications, this comparator is used as the input receiver for the ICC subsystem and is connected to RX.
MUX3...MUXO - These four analog input pins are one half of the A/D subsystem inputs. They can be indi-vidually programmed to operate in either the voltage or current modes. In the voltage mode, they are high impedance inputs.
In the current mode, an active current source maintains a virtual ground level for currents out of the device pin. When unselected in the current mode, each pin is connected to digital ground.
MUX7...MUX4 - These four analog input pins are the other half of the A/D subsystem inputs. They can operate only in the voltage input mode. They are always high impedance inputs.
MXO - This analog output is used by the A/D sub-system in the current mode of operation. An external re-sistor or capacitor between this pin and analog ground converts the mirrored and ratioed current from the selected input into a voltage for A/D conversion. If an external capacitor is used, the internal amplifier is con-figured as an integrator and current autoranging must be disabled.
CP3...CPO - These four high-impedance analog in-puts are the inverting inputs of four comparators.
These pins are also used during testing to select various test modes.
VADJ - This analog input is used to adjust the analog reference voltage: VREF.
VREF - This analog output is the internal +2.5 V
reference. It is the output of the reference buffer am-plifier and must be connected to the external reference trim resistor network.
AVDD - This pin is the +5 V analog supply volt-age. An external resistor is used to create a current source for the shunt-regulated power supply. AVDD will be regulated to approximately 2 * VREF.
AVSS - This pin is the analog ground reference.
OSC1 - This is the. input of the oscillator circuit.
OS2 - this pin is the output of the crystal os-cillator circuit. It is the inversion of the OS1 input.
VDD - these pins are the digital +5 volt DC sup-ply.
VSS - these pins are the digital negative sup-ply. They should be connected externally to the AVSS pin.
SHUNT - This output pin is high when the power supply is shunting current from AVDD.
NC - Not connected.
The electrical overcurrent circuitry in accor-dance with the present invention is adapted to provide overload protection for various types of electrical equipment, such as electrical motors and the like, during various operating conditions. An important aspect of the invention relates to the ability of the circuitry to simulate a conductor cooling condition during a loss of electrical power to the circuitry subsequent to a trip of the electrical equipment to be protected. Another important aspect of the invention relates to the ability of the circuitry to simulate both a conductor cooling condition and a conductor warming condition while electri-cal power is available to the circuit.
The electrical overcurrent circuitry in accor-dance with the present invention is illustrated in FIG. 86 and includes a multi-purpose microcontroller illustrated in FIGS. 1-82 and described below. This circuitry is adapted to be disposed within various devices which utilize electronic tripping, such as circuit breakers and the like, to provide a signal to trip the electrical equipment under various overload conditions to limit the maximum temperature rise of the equipment conductors to prevent damage due to overheating.
FIGS. 83 and 84 represent exemplary overload protection curves for a typical motor under different operating conditions as will be discussed below. These overload protection curves provide the maximum tripping times as a function of electrical current at the maximum allowable temperature rise of the motor conductors (e.g., rotor and stator conductors). Each of the overload protection curves contains an iristantaneous portion 1A, an inverse time portion 2A and may include a very inverse time portion 3A and a constant current portion 4A.
The instantaneous portion 1A allows the motor to be tripped virtually instantaneously for electrical overcurrent values above a predetermined level. The instantaneous tripping level is normally selected to be greater than the maximum expected motor starting current, known as the locked rotor current, to avoid tripping the motor during starting.
The inverse time portion 2A is adapted to protect the motor during normal transient overcurrent conditions, such as during motor starting. More specifi-cally, when electrical power is first applied to an electrical motor, the stator windings will often draw 400 percent or more of the nominal motor full load current (e.g., locked rotor current) until the rotor begins to turn. As the rotor begins turning, the electrical current to the motor tapers off to its nominal full load current as the rotor reaches its rated speed. The inverse time portion 2A of the overload protection curve allows the motor to be started while at the same time protecting it in the event that the transient starting current becomes excessive due to mechanical problems or fluctuations in the source voltage. Since motors are commonly available with different conductor temperature ratings, a family of curves is provided for this portion 2A, which correspond to various motor overload classes. The overload class for the particular motor to be protected dictates the appro-priate curve.
For relatively short duration overcurrents, for example, during motor starting, the temperature rise of the motor conductors is primarily due to resistive heating, which is proportional to the time integrated value of the electrical energy applied to the conductor.
In other words, for a relatively constant voltage, the temperature rise of the motor conductors is proportional to the square of the electrical current to the motor conductors. In order to limit the maximum temperature rise of the motor conductors to avoid damage, the inverse time portion 2A is generally provided with the following characteristic:
12T = a constant, where I corresponds to the value of the conductor current, and T corresponds to the maximum time period to avoid exceed-ing the maximum temperature rise.
The overload protection curves may also include a very inverse time portion 3A. This portion 3A, in general, permits higher values of overcurrent relative to the inverse time portion 2A for longer periods of time for relatively low level overcurrent conditions due to, for example, transient mechanical loading conditions after the motor has started.
The continuous portion 4A of the overload protection curve corresponds to the minimum current level for which the overcurrent circuitry will respond. This portion 4A is based on the continuous electrical current rating of the circuit breaker or other device which utilizes the electrical overcurrent circuitry for tripp-ing. In order to avoid spurious tripping, this value may be selected, for example, at 110 percent of the continuous current rating of the motor being protected.
The overload protection curve illustrated in FIG. 83 is utilized during a cold conductor condition (e.g., a condition where the coriductor temperature i5 assumed ambient at the initiation of motor starting). The warm overload protection curve, illustrated in FIG. 84, is utilized for the condition where the conductors are at a temperature greater than ambient when the motor is started; for example, at the rated conductor operating temperature but below the maximum temperature. This condition may occur when the motor is tripped and subse-quently restarted while the conductors are at their rated operating temperature.
During all anticipated operating conditions of the motor, it is necessary that the conductor temperature be simulated such that the overload protection curve is relatively closely matched with the actual conductor temperature. Otherwise, damage to the motor conductors can result. For example, if a motor operating at its rated operating temperature is tripped and subsequently restarted before the conductor temperature returned to a lower temperature, a subsequent overload could damage the motor conductors if the cold overload protection curve illustrated in FIG. 83 is used during this condition. On the other hand, if the motor was tripped for a sufficient period of time for its conductors to return to ambient temperature and then restarted, a subsequent overload could cause spurious tripping of the motor assuming the warm overload protection curve of FIG. 84 is utilized in this condition. Repeated trips under the above-mentioned conditions could cause damage to the motor conductors since the overload protection would not be based on actual conductor temperature. Accordingly it is necessary to be able to approximate the temperature of the motor con-ductors during all anticipated operating conditions including temperatures between the cold and warm tempera-tures upon which the overload protection curves illus-trated in FIGS. 83 and 84 are based.
In order to simulate the conductor temperature during all operating conditions, the electrical current to the motor is sensed to approximate the conductor tempera-ture, for example, by a current transformer or the like.
For relatively short duration overloads, for example, during motor starting, the conductor temperature rise is proportional to the time integrated value of the electri-cal energy applied to the conductor. Assuming a rela-tively constant voltage, the temperature rise is thus proportional to product of the time and the square of the current to the conductor. Accordingly, the conductor temperature can thus be calculated.
The power supply for the electrical overcurrent circuitry may be derived from either sensed load currents or from the output of the circuit breaker. However, once the circuit breaker is tripped, the power supply to the overcurrent circuitry will be lost. The overcurrent circuitry, in accordance with the present invention, includes both digital based modeling and analog based modeling to enable the circuitry to simulate the conductor temperature even when the power supply to the circuit is lost.
The digital based model and the analog based model in accordance with the present invention, are best understood with reference to FIGS. 85A and 85B. FIG. 85A
is an exemplary curve illustrating the simulated digital based and analog based conductor temperature models as a function of time for the electrical current values illustrated in FIG. 85B. The digital model is represented with a dashed line while the analog model is represented by a solid line in FIG. 85A.

The operational characteristics of the digital and analog models illustrated in FIG. 85A have been broken up into seven sections, identified with the reference Roman numerals I-VII for discussion. It should also be understood that the operational characteristics illus-trated in FIG. 85A correspond with the load current profile illustrated in FIG. 85B.
Initially, in section I, the electrical over-current circuitry is unpowered, for example, due to the circuit breaker being tripped or because the load current is below a predetermined minimum value, Imin= In this situation, the digital model is reset and the analog model is at a value which corresponds to a cold conductor temperature. Once the load current rises above a pre-determined current, Imin or the power becomes available to the electrical overcurrent circuitry, for example, when the circuit breaker is closed, as illustrated in section II, the digital model calculates the temperature rise of the conductor to track the conductor temperature from a cold to a warm value. During this condition, the cir-cuitry forces the analog model to track the digital model as shown in FIG. 85A. When the load current rises above the overload pick up value, Ipu, for example, 2/3 the trip limit, as shown in section III, the digital model tracks the conductor temperature at a rate proportional to the square of the load current. During this condition, the analog model is still forced to track the digital model.
Once the simulated conductor temperature exceeds the trip limit value, the circuit breaker :is tripped. This, in turn, causes the power supply to the electrical over-current circuitry to be lost which, in turn, causes the digital model to be reset to zero (the cold conductor value) as illustrated in section IV. As will be discussed in more detail below, the analog based model continues to operate even when power is unavailable, as illustrated in the section identified with the Roman numeral V. Once the electrical power supply is restored to the overcurrent circuitry, for example, when the breaker is reclosed, as illustrated in the section identified with the Roman numeral VI, the digital model is initialized with a value obtained from the analog model. After initialization, the digital model tracks the conductor temperature and forces the analog model to track the digital model.
As will be discussed below, the digital modeling of the conductor temperature is provided by digital circuitry which includes a microprocessor. The analog model is formed from analog circuitry which includes a capacitor which is forced to track the digital model while electrical power is available. Thus, while power is available to the overcurrent circuitry, the voltage across the capacitor will be representative of the conductor temperature during a conductor warming condition assuming the motor was not tripped. The charging time constant is selected to correspond to a maximum conductor warming condition with a minimum charging time. The discharge time constant of the capacitor is selected to correspond to the conductor cooling time. Thus, should the motor be tripped, the voltage decay across the capacitor will simulate the conductor temperature during a cooling condition when power is unavailable to the overcurrent circuitry.
As discussed above, the overload protection curves illustrated in FIGS. 83 and 84 for a cold conductor condition or for a warm conductor condition. In order to provide overload tripping characteristics which correspond to the actual conductor temperature between the tempera-tures upon which the overload protection curves in FIG. 83 and FIG. 84 are based, a model, illustrated in FIG. 85C, is provided to adjust the tripping times for both a cold-to-warm transition and a warm-to-cold transition. More specifically, the model includes a conductor warming curve 5A and a conductor cooling curve 6A. The warming curve 5A
is provided by the digital based raodel while the cooling curve 6A is provided by the analog based model. These curves 5A and 6A are used to adjust the maximum tripping times provided in FIGS. 83 and 84 for both cold-to-warm and warm-to-cold transitions. More specifically, FIG. 85C
illustrates the modeled conductor temperature (MCT) in terms of a fraction of the trip limit, as a function of time, which can be used to adjust the tripping charac-teristics during cold-to-warm and warm-to-cold transi-tions.
The MCT varies between zero, which represents a cold conductor condition and two-thirds, which represents a warm conductor condition. Thus, during a conductor warming condition, as illustrated by the curve 5A, the MCT
is initially zero and increases to a final value of two-thirds. During a conductor cooling condition, as illus-trated by the curve 6A, the MCT is initially two-thirds and increases to a final value of zero. The tripping times for' conditions between warm and cold can thus be computed, for example, by multiplying the cold trip time as indicated in FIG. 83 by the one minus the multiplica-tion factor from FIG. 85C. The warm trip time is thus (1-2/3) or 1/3 of the cold trip time.
The cold-to-warm transition is generated by the digital model and normally active whenever the current to the electrical conductor is above the minimum pickup value imin (FIG. 85B) and below 110 percent of the continuous current rating of the circuit breaker and has a final multiplication factor of one-third. The warm-to-cold transition is active whenever the circuit breaker current is below the pickup value Imin and has a final multiplica-tion factor of one.
The model set forth in FIG. 85A, 85B, 85C may be implemented by the circuitry illustrated in FIG. 86. This circuitry includes an integrated circuit, which includes a multi-function microcontroller, identified with the reference numeral 10 as was described previously. The circuitry also includes resistors R1, R2, R3, R4, R5 and R6 and a capacitor Cl. As discussed below, the IC 10 includes an on-board microprocessor as well as a plurality of current and voltage analog input ports, digital input/output ports and an on-board A/D converter circuit.

The capacitor Cl may be electrically coupled to one of the digital input/output ports, for example, port PC1, by way of the resistor R2. The resistor R3 is connected in parallel with the capacitor C1. The R3C1 discharge time constant is selected to simulate a conductor cooling condition. The voltage of the capacitor Cl may be sensed by connecting the capacitor Cl to an analog voltage input, such as MUX 5 by way of the resistor R1.
The electrical current to the device to be protected may be sensed by current sensors 7A, such as current transformers, normally provided within the overcurrent device. These current sensors 7A may be applied to an analog current input, for example, MUX 1, of the IC 10 as shown. The current in the secondary of the current sensor 7A is applied to the resistor R4, connected as a shunt. The resistor R5, connected between the resistor R4 and the analog input port MUX 1, converts the voltage across the resistor R4 to a current through the resistor R5. The internal circuitry in the integrated circuit 10 maintains the voltage at the analog input MUX 1 at a virtual ground for current flowing from MUX 1. As discussed below, internal circuitry within the SURE CHIP
integrated circuit 10 ranges the electrical current applied to the integrated circuit 10 to improve the resolution of the analog-to-digital conversion circuitry.
The ranged current may then be dropped across the resistor R6 and applied to an analog voltage input (e.g., MUX 4) and converted to a digital value by analog-to-digital converter circuitry within the integrated circuit 10 in a manner as discussed in detail below.
The electrical current sensed by the current sensors 7A is used by the microprocessor within the integrated circuit 10 to calculate the conductor tempera-ture rise MCT. During an overload condition, the voltage Vcap across the capacitor Cl is charged to a value proportional to the computed value MCT. During a cold-to-warm transition when no overload is present, the voltage Vcap across the capacitor Cl is controlled to be proportional to the computed value MCT. In order to force the warm tripping times to be about one-third of the cold tripping times, the voltage Vcap across the capacitor Cl during such a condition is controlled to a value that is proportional to about two-thirds of the trip level with a time constant, for example, of about three minutes as illustrated in FIG. 87A. More specifically, if the trip level for the microprocessor is selected, for example, as $FF or 255 and a corresponding voltage Vcap on the capacitor Cl is selected, for example, as 156 millivolts, the voltage Vcap is controlled to a value of about 104 millivolts. By selecting a discharge time constant for the capacitor Cl of about three minutes to simulate a conductor cooling condition the model illustrated in FIGS.
85A, 85B, 85C can be formed wherein the warm tripping times are about one-third of the cold tripping times.
More specifically, with reference to FIG. 85C, the curves 5A and 6A relate to the voltage Vcap across the capacitor Cl during a cold-to-warm and a warm-to-cold transition, respectively. A voltage of about 0 volts across the capacitor C1 is used to simulate the multiplication factor one while a voltage of about 104 millivolts is used to simulate the multiplication factor of one-third. During a cold-to-warm transition, the capacitor Cl is charged to a value which is proportional to two-thirds of the tripping level (e.g., 104 millivolts) with about a three minute time constant, as illustrated by the curve 5A in FIG. 85C, to simulate a conductor warming condition. The discharge time constant of the capacitor Cl is selected to simulate a conductor cooling condition, for example, three minutes as illustrated by the curve 6. By selecting such a discharge time constant and charging the capacitor Cl to a value, proportional to two-thirds of the trip level during a conductor warming condition when no overload is present, the warm tripping times will be about one-third of the cold tripping times as illustrated in FIG. 85C. Moreover, by selecting the R3 Cl discharge time constant to be representative of a conductor cooling condition, the voltage Vcap across the capacitor Cl will be representa-tive of the conductor temperature when electrical power to the overcurrent circuitry is lost. Thus, on power up, the voltage Vcap across the capacitor Cl can be sensed to preset the computed value MCT.
The voltage Vcap across the capacitor Cl may be controlled, for example, by port PCi which may be con-figured as an output at either +5.0 volts or 0 volts or as an input (e.g., high impedance state) to hold the voltage Vcap on the capacitor Cl. More specifically, with reference to FIGS. 87A and 87B, the capacitor Cl is charged according to an R2 Cl time constant. The capaci-tor Cl is discharged according to an, R3 C1 time constant.
The circuitry is thus able to control the voltage Vcap to be proportional to the computed value MCT as shown in FIG.
87A.
The control of the voltage across the capacitor Cl is best understood with reference to the flow chart in FIG. 88 and the exemplary graph illustrated in FIG. 89.
Initially, after the system is. powered up, the analog thermal value is measured by reading the voltage Vcap across the capacitor Cl. The digital model is then set at the analog thermal value. Next, the sensed voltage Vcap is compared with the value MCT. More specifically, as discussed above, when power becomes available, the digital model calculates the temperature rise of the conductor during a cold-to-warm transition as discussed above and forces the voltage Vcap across the capacitor Cl to track the calculated value. Thus, if the voltage Vcap across the capacitor Cl is less than the computed value, the output port PCi is set at +5 volts for a predetermined time. If the measured voltage Vcap is not less than the computed value (i.e., Vcap = MCT), the output port PCi is configured as an input. If the sensed voltage Vcap is greater than the calculated value, the output port PC1 is set to zero for a fixed time and then configured as an input. In this way the voltage Vcap is controlled to :;.'J3s:=:, 218 track the model conductor temperature as illustrated in FIG. 87A.
In order to limit the discharge of the capacitor Cl through internal protection diodes within the inte-grated circuit 10 during a condition when electrical power is not available to the SURE CHIP integrated circuit 10, the maximum voltage corresponding to a trip condition is limited to about 156 millivolts. More specifically, FIG. 90 illustrates the circuitry during a condition when power is unavailable to the SURE CHIP integrated circuit 10. In order to insure that the resistor R3 is the only discharge path for the capacitor Cl during such a condi-tion, the voltage across the capacitor Cl is limited to a relatively small value, for example, 156 millivolts. If the resistors Ri and R2 are selected, for example, as 47 kilohms, the discharge current through the protection diodes will be nearly zero and thus can be ignored.
The overload protection curves illustrated in FIGS. 83 and 84 as well as the thermal model illustrated in FIG. 85A, 85B, 85C, can be used to generate tripping signals at conductor temperatures at all expected conduc-tor temperatures including conductor temperatures between the temperatures upon which the curves of FIGS. 83 and 84 are based. More specifically, the tripping times based on the cold and warm conductor temperatures can be generated in various ways, all of which are considered to be within the teachings of the present invention. For example, the cold overload protection curve illustrated in FIG. 83 can be generated by programming the continuous time portion 4A
and instantaneous portion 1A. The inverse time portion 2A
can be generated by utilizing the equation 12T = constant, as discussed above. The very inverse time portion 3A has the same characteristics but utilizes a different constant to vary the temperature rise for relatively low level overload conditions. The cold overload protection curve can also be stored in a look-up table. The warm overload protection curve can be generated by multiplying the tripping times of FIG. 83 by a predetermined factor, for example, one-third. For conductor temperatures between cold and warm, the thermal model, illustrated in FIG. 85C, can be used to generate tripping times as a function of conductor temperature as discussed above. Thus, the circuitry is able to provide overload tripping charac-teristics based on the actual conductor temperature during various operating conditions.
FIG. 91 represents an exemplary flow chart which illustrates the operation of the electrical overcurrent circuitry in accordance with the present invention. On power up'the voltage Vcap across the capacitor Cl is read as discussed above. After a trip timer and trip limit is initialized, the electrical current sensed by the current transformer 7A is compared with the pick up value, I.
If the sensed current is greater than the pick up current Ipu, the trip timer is incremented. Next, a determination is made whether the timer has reached the trip limit. If so, a trip flag is set and the circuit breaker is tripped.
If the trip timer has not reached its trip limit, the voltage Vcap across the capacitor Cl is adjusted as discussed above. The steps are then repeated. If the sensed electrical current is not greater than the pick up value, the trip timer is decremented and the voltage Vcap is adjusted as discussed above.
Thus, the overcurrent circuitry in accordance with the present invention is able to simulate both a conductor warm up and a conductor cool down condition while power is available to the circuitry. Upon loss of power to the circuitry, irrespective of whether the equipment was tripped, the voltage across the capacitor Cl is adapted to simulate the conductor temperature.

A
APPENDIX

The lollowinq specifications apply to the EEPROM
40 memory under the conditions that VDD - S.0 Vdc f10t and the ambient temperature TA is between -406C and +8!S=C.
The specifications are'indicated in Table Al.
TABLE 1_11 EEPRO![ SPECIFICATION3 AXNM m ~18x M=
BEPitOK Erase Time ERA 10 ms EEP'Rm Program PROG 10 ms Time 2 ldHs osc.
EEP'RM Program PROG 20 ms Time 1- Z MHz osc.
NriteJErase 10,000 cycles ls Bndurance APPMiDIX 8 H+ COlYtPARATOR SPECIFIGATIONS
SYKBs YAM.
S VIO Input oltset voltage t20 mV max VR Hysteresis 20 mV sin IIO Input o!lset current 1 nA max i=g Input bias current 20 Na max V~ Input voltage range V S to'VRgg +.5V
l0 AVp Voltage amplification 8~ dB min VOL Output voltage IIOL - 3 mA 700 mV max VOR Output voltage 116k - -3 mA VDD -700 mV min tR Response tim0 VDIpF - 100 mV 1 s max TABLB H~ ' 15 OIIADCOIlPARATOR SPECIFICATIONB
$Yt~ P1-BAN= ffii~ lY8 M88 UNITS
VIO Input offset voltage t20 mV
I=p Input offset current 0 - 11 nA
=IH Input bias current 20 nA
20 VIN Input voltage range V S - VDD V
V. Negative threshold 182 1.25 1.3 V
(output high) AVD Voltage amplitiaation 80 dB
VOL Output voltage 0 - 700 mV
25 esCH-3mA
VOH Outyut voltage VDD -700 - VDD mV
eI0g-3mA
tR Response time 1 s VpI ~100 mV
30 tR H'ys~eresis 20 - 80 mV

TABLE
A CO~IPARATOR SPECIFICATIONS
$m,. P.8881~TFi8 3t8LII8 V10 Input offset voltage 120 mV max 35 2I0 Input offset current 1 nA.max IIg Input bias current 20 nA max VIN Input voltage range V 8 to VREF +.5 V
AVD Voltage amplification 88 dB min VOL Output voltage lIOV3mA 700 mV max 40 VOH Output voltage eIOH--3mA VDD-700 mV min tR Response time VOIW300 mV lps max APPENDIX C
AUTO-ZERO STATE MACHINE
STATE DIAGRAM
FIG. C-1 is a state diagram for the auto-zero function. Each bubble represents an operating state. The arrows between state show permissible transitions and the conditions required for the transition. Table C-1 shows the transitions from state to state in table form.

STATE ASSIGNMENT
AUTO-ZERO STATE ASSIGNMENT
State RO R1 R2 ~A~h*A~'cESTh SO
IDLE

; Mc.U n S T A n Yh S:
uSEC TiucuThx DELAY (vaMPb=FULUb) TiMOUThY ~ S3 VAhlPbx CLDCK LATCH
FULLb CLK CLCCX CLCC-e CNTR

CLR

TjMOUTh= LATCH
CAMPb~ CLOCK Ay1Z
F'ULLb CLK 5 USEC TIKnUTh.
CNTR DELAY
CLOCK

FIG. C-1 STATE TRANSITION TABLE
FIG. C-2 shows the state assignment on the 3-bit Karnaugh map along with the allowable state transitions.

0 Sa S3 E1-- si~
RO I T

_ F.~..' FIG. C-2. Auto-Zero Karnaugh Mapping The logic equations for RO, Ri and R2 are given in the following sections. The equations are written for the states in the transition table where the resulting state is a logic 1. For example, in the first line of the transition table, the only equation that needs to be written is the equation for R1 resulting from the transi-tion from state SO to S1. The equations below are referenced to the transition table by the originating state.
The following notation is used:
not operator * and operator + or operator h suffix high true signal b suffix low true signal d suffix flip-flop D input signal The * operator has precedence over the +
operator.

SO ---=---> SO 000 ---=---> 000 =-- > S1 +---> 010 S1 ------- > 51 010 ---+---> 010 +---> S2 =---> 110 =---> S3 =---> 011 SZ -------> SI 110 -------> 010 S3 -------> Si 011 ------- > 001 S4 -------> SS 001 -------> 101 SS --- > SS 101 --- > 101 I t =---> Sa =---> 111 I I
+---> Sy =---> 100 Sd -------:t SS 111 -------> 101 S7 ------- > SO 100 -------> 000 FIG. C-3. Auto-Zero State Transition Table STATE EOUATIONS FOR ROd state SO No terms needed for this state.
state Si ROd = !ROh * Rlh * !R2h * '.CIMOUTh * VAMPb *
FULLb state S2 No terms needed for this state.
state S3 No terms needed for this state.
state S4 ROd = !ROh * !Rlh * R2h state S5 ROd = lROh * !Rlh * R2h state S6 ROd = ROh * Rlh * R2h state S7 No terms needed for this state REDUCED STATE EQUATIONS FOR RO
Reducing the terms which only involve ROh, Rlh and R2h, using Karnaugh map techniques, and combining with terms which cannot be reduced yields the following equa-tion for ROd.
ROd = !ROh * Rlh * !R2h * TIMOUTh * VAMPb & FULLb +
!Rlh * R2h ROH * R2h state SO R1d = !ROh * !Rlh * !R2h * STAZh * !ARBSYh state S1 R1d = !ROh * Rlh * !R2h state S2 R1d = ROh * Rlh *!R2h state S3 No terms needed for this state.
state S4 No terms needed for this-state.
state S5 Rid = ROh & /!Rlh * R2h * TIMOUTh * CAMPb *
FULLb state S6 No terms needed for this state.
state S7 No terms needed for this state.

Rid = !ROh * !R1h * !R2h * STAZh * !ARBSYh + ROh *
!Rih * R2h * TIMOUTh * CAMPb & FULLb + R1 * !R2 state SO No terms needed for this state.
state Si R2d = !ROh * Rlh * !R2h * TIMOUTh * (!VAMPb +
!FULLb) state S2 No terms needed for this state.
state S3 R2d = !ROh * R1h * R2h state S4 R2d = !ROh *!R1h * R2h state S5 R1d = ROh * !R1h * R2h * (!TIMOUTh + TIMOUTh *
CAMPb * FULLb) state S6 R2d = ROh & Rlh * R2h state S7 No terms needed for this state.

R2d = !ROh * Rih * !R2h * TIMOUTh * (!VAMPb + !FULLb) + ROh * !R1h * R2h * ITIMOUTh + ROh * !Rlh * R2h * TIMOUTh * CAMPb * FULLb + !ROh * R2h + Rih *
R2h OUTPUT EOUATIONS
!ZERRESb = !ROh * !Rlh ZERCLKh = ROh * Rlh TIMREQh = !ROh * Rlh * !R2h + ROh * !Rlh * R2h AZBSYh = !(!ROh * !Rlh * !R2h) EOAZh = ROh * !Rlh * !R2h CAZh = ROh * R2h + !Rlh * R2h VAZh = Rlh * !R2h CZCLKh = !CAZh VZCLKh = !VAZh D-1.
APPENDIX D
AUTO-RANGE STATE MACHINE
STATE DIAGRAM
FIG. D-1 is the state diagram for the auto-range function. Each bubble represents an operating state. The arrows between state show permissible transitions and the conditions required for the transiLtion. Table D-1 shows the transitions from state to state in table form.

STATE ASSIGNMEN7' AUTO-ZERO STATE ASSIGNMENT
State RO Rl R2 S4 ill 3'TADCh+A1BSYh So IDLE
CLOCx STaDCr.wAZBS7h S6 Sl EOC
RESET PULSE
SHIFT
REG
ANAEOCh CLecx uSEC (TIMOUThXATORNGhx DELAY RANGEh)+ ANAEOCh TIMOt1ThxATQRNGn SOC3b TJMOUTh~
ATORNGhx CLOCK S4 AN h S3 SQr SHIF T PULSE
CLK scc3b STATE TRANSITION TABLE
FIG D-2 shows the state assignment on the 3-bit Karnaugh map along with the allowable state transitions.

I
0 So S1 2 S3 ~ S6 5 4 FIG. D-2. Auto-Range Karnaugh Mapping TRANSITION TABLE STATE EOUATIONS
The logic equations for R0, Ri and R2 are given in the following sections.
STATE EQUATIONS FOR RO
state SO No terms needed for this state.
state Si No terms needed for this state.
state S2 ROd = !ROh * Rlh * R2h * (TIMOUTh * ATORNGh *
RANGEh + TIMOUTh * !ATORNGh) state S3 No terms needed for this state.
state S4 ROd = ROh * Rlh * R2h state S5 ROd = ROh * !Rlh * R2h state S6 No terms needed for this state REDUCED STATE EOUATIONS FOR RO
Reducing the terms which only involve ROh, Rih and R2h, using Karnaugh map techniques, and combining with terms which cannot be reduced yields the following equa-tion for ROd.
ROd = !ROh * Rih * R2h * TIMOU'.rh * ATORNGh * RANGEh +
!ROh * Rlh * R2h * TIMOUTh * !ATORNGh + ROH * R2h state SO No terms needed for this state.
state Si Rld = !ROh * !Rlh * R2h state S2 Rld = !ROh * Rlh * !R2h state S3 Rid = !ROh * Rlh * !R2h state S4 Rld = ROh * Rlh * R2h * SOC3b state S5 No terms needed for this state.
state S6 No terms needed for this state.

R1d = ROh * Rih * R2h *SOC3b +
!ROh * Rlh +
ROh * R2 state SO R2d = !ROh * !Rlh * !R2h * !AZBSYh * STADCh state S1 R2d = !ROh * !Rlh * R2h state S2 R2d = !ROh * Rih * R2h * (!TIMOUTh + TIMOUTh *
ATORNGh * RANGEh) state S3 R2d = !ROh * Rlh * !R2h state S4 R2d = ROh * Rlh * R2h state S5 R2d = ROh *!R1h * R2h * !ANAEOCh state S6 No terms needed for this state.

Reducing the terms which only involve ROh, R1h and R2h, using Karnaugh map techniques, and combining with terms which cannot be reduced yields the following equa-tion for R2d.
R2d = !ROh * !Rlh * !R2h * !AZBSYh * STADCh +
!ROh * !Rlh * R2h +
!ROh * Rlh * R2h * !TIMOU'Th !ROh * Rlh * R2h * TIMOUTh * ATORNGh * RANGEh +
!ROh * Rlh * R2h * TIMOUTh * !ATORNGh +
!ROh * R1h * !R2h +
ROh * Rlh * R2h +
ROH * !R1h * R2h * !ANAEOCh OUTPUT EOUATIONS
GRESh = !ROh * !Rlh * R2h * !SMCLKh GCLKh = !ROh * Rlh * !R2h * !SMCLKh TIMREQh = !ROh * Rlh * R2h ARBSYh = !(!ROh * !Rlh * !R2h) EOCh = ROh * !Rlh * !R2h ANASOCh = ROh * Rlh * R2h APPENDIX E
Stress ratings for the IC 10 are provided in Table El. Stresses above ratings provided in Table Al can cause permanent damage to the device.
TABLE El Supply Voltage Range -0.3V to +7.OV
Temperature Under Bias -55 C to +125 C
Storage Temperature -65 C to +150 C
Input Diode Current 1-mA
Input Voltage (not IRQN or EXPN) VSS - 0.3V to VDD + 0.3V
Input Voltage IRQN & EXPN VSS -0.3V to 2 x VDD + 0.3V
Continuous Output Current 25 mA
Continuous Supply Current 100 mA
Dissipation 0.5W
Normal operating conditions for the IC 10 are provided in Table E2. These limits apply for normal oper-ations of the IC 10.

RECOMMENDED OPERATING CONDITIONS
SYM PARAMETER MIN TYP MAX UNITS
TA Ambient Temperature -40 +85 C
VDD Supply Voltage 4.5 5.0 5.5 V
VIN Input Voltage 0.0 VDD V
fOSC Oscillator 0.0 7.3728 8.0 MHz The DC characteristics of the IC 10 are provided in Table A3. The characteristics :Listed in Table A3 are valid over the operating range of temperature and voltage as defined in Table Al unless otheriaise specified.

DC CHARACTERISTICS
TEST SYM PARAMETER MIN MAX UNITS
1 VIL Input Low Voltage 0.0 0.2 X VDD V
2 VIH Input high voltage 0.7 X VDD VDD V
3 V+ + Schmitt 2.7 4.1 V
4 V- - Schmitt 1.1 2.1 V
5 VH Hysteresis 0.6 - V
6 IIN Input Current - 1 A
7 IOZ Tri-state Leakage - 10 A
8 VCOL Output Voltage - 0.10 V
1 = -lO A
9 VCOH Output Voltage VDD-0.10 - V
1 = lO A
10 VOL Output Voltage - 0.4 V
1 = 1.6mA
11 VOH Output Voltage VDD'-0.8 - V
12 COUT Capacitance, output - 12 pF
13 CIN Capacitance, input - 8 pF
14 IDD Supply Current 0 10 mA
@ 4 MHz ..;;ar+

F-i APPENDIX F
TABLE Fl CURRENT SUBSYSTEM AMPLIFIER SPECIFICATIONS
SYMB. PARAMETER VALUE
VOS Offset Voltage 0 to -1.0 mV max IIO Input offset current 1 nA max UIB Input bias current 1 nA max VIC1õi Input common mode VSS to 1.5V
AVD Voltage Amplification 80 dB min 10 Output Current 100 A max BW Unity gain bandwidth 80 kHz rnin A/D CONVERTER SUBSYSTEM SPECIFICATIONS
SYMB. PARAMETER VALUE
Vos Offset Voltage 0 to -1.0 mV max IIO Input offset current 1 nA max IIB Input bias current 1 nA max VICR Input common mode range VSS to VREF
-0.5 V
VIN Input range VSS to VREF
+0.5 V
Resolution 8 bits min Linearity 1 LSB min Differential non-linearity 0.5 LSB max TCR Conversion Time 24 s max IDENTIFICATION OF REFERENCE NUMERALS USED IN THE DRAWINGS
LEGEND REF. N0. FIGURE

AN ANALOG VALUE

:MAIN FF5 88 VCAP ACTUAL > VCAP DESIRED FF6 88 VCAP ACTUAL < VCAP DESIRED FF7 88 TIME

SET PC1 = 0 FOR FIXED TIME FF9 88 TRIP LIMIT

I > PICKUP CURRENT FF14 91 TIMER > TRIP LIMIT FF17 91

Claims (11)

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1. A CMOS monolithic circuit for communicating over a communications network comprising:
an analog subsystem including means for receiving analog signals;
a digital subsystem including means for receiving digital message signals comprised of a predetermined number of serial bits and including an instruction portion and an address portion;
processor means for producing digital output signals responsive to said analog subsystem or said digital subsystem; and means for transmitting said digital output signals over said communications network, said means for transmitting said digital output signals including means for transmitting a predetermined digital message over said communication network in response to a preselected instruction portion of a received message signal independently of said processor means.

2. A CMOS monolithic circuit as recited in claim 1, further including means for storing said predetermined digital message for transmission by said means for transmitting in response to said preselected instruction portion; and wherein the predetermined digital message is formulated by said processor means.

3. The CMOS monolithic circuit as recited in claim 2, wherein said predetermined message comprises a status message and said processor means periodically updates said status message and places it in said means for storing said predetermined message for transmission over said communication network in response to said preselected instruction portion of said received message independent of said processor means.

4. A device which includes a CMOS monolithic circuit for monitoring analog signals from an electrical device having an operate mode and a trip mode and generating an output signal and communicating said output signal over a predetermined communications network, said CMOS monolithic circuit comprising:
means for receiving analog signals;
processor means for generating digital output signals as the function of said analog signals and including a digital status signal indicating a status of said device; and means for communicating said digital output signals over the predetermined communications network, and including means for storing said digital status signal generated by said processor means and transmitting the stored digital status signal over the predetermined communication network independent of said processor means in response to a message received over said predetermined communications network having a preselected instruction portion.

5. A device as recited in claim 4, wherein said analog signals are electrical currents.

6. A device as recited in claim 4, wherein said analog signals are electrical voltages.

7. A device as recited in claim 4, further including means for displaying said output signal.

8. A device as recited in claim 4, further including means for controlling said electrical device as a function of said output signal.

9. A device as recited in claim 4, further including means for displaying said output signal and controlling said electrical device as a function of said output signal.

10. A device as recited claim 8, wherein said controlling means includes means for initiating a trip of said electrical device under predetermined conditions.

11. A device as recited in claim 10, wherein said predetermined conditions include overcurrent.