CA2440354A1 - Non-halide water-soluble cored flux for soldering of stainless steel and nickel - Google Patents
Non-halide water-soluble cored flux for soldering of stainless steel and nickel Download PDFInfo
- Publication number
- CA2440354A1 CA2440354A1 CA 2440354 CA2440354A CA2440354A1 CA 2440354 A1 CA2440354 A1 CA 2440354A1 CA 2440354 CA2440354 CA 2440354 CA 2440354 A CA2440354 A CA 2440354A CA 2440354 A1 CA2440354 A1 CA 2440354A1
- Authority
- CA
- Canada
- Prior art keywords
- acid
- flux
- solder
- soldering
- cored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3611—Phosphates
Abstract
A non-halide, non-toxic water-soluble flux for cored solders comprises ortho-phosphoric acid, adipic acid and formic acid. The flux of the invention produces solder joints of high metallic luster and excellent quality. The formula is particularly suitable for the soldering of stainless steel and/or nickel onto copper substrate. Clean-up of flux residues is accomplished using water or iso-propyl alcohol.
Description
Non-Halide Water-Soluble Cored Flux For Soldering Of Stainless Steel And Nickel Background of the Invention 1. Field of the Invention The present invention is directed to a solid solder flux, and, more particularly, to an organic acid activated solid solder flux specifically formulated for soldering of stainless steel andlor nickel onto copper substrates. Present invention is formulation that combine a soldering flux with a thickening agent maintained within a hollow tube of solder.
dVhat is desired is a simple, non-halide, non-toxic, environmentally-safe solder flux for cored solders that produces solder joints of (1). Stainless steel with copper substrate, and/or (2). Nickel with copper substrate.
dVhat is desired is a simple, non-halide, non-toxic, environmentally-safe solder flux for cored solders that produces solder joints of (1). Stainless steel with copper substrate, and/or (2). Nickel with copper substrate.
2. Description of the Prior. Art Soldering with a soft solder, such as till-lead or Pb-free based alloy melting at between 200°C to 260°C, is widely employed in the electrical and electronics industries.
However, hand soldering stainless steel or nickel with a soft solder requires a super strength fluxing power.
Fluxes now in use include mixtures of inorganic acids in inorganic vehicles or solvents such as water, inorganic acids in petrolatum pastes, salts in water, organic halogens in water. All of these fluxes require post-cleaning of the soldered joint.
Fluxing can also be carried out in a reducing environment, as by accomplishing the soldering process in a hydrogen gas atmosphere. Post-cleaning i.s not required, but maintenance and use of a pure hydrogen atmosphere in large scale production operations is difficult, and can lead to related hydrogen embrittlement. In sum, there is known no effective, generally applicable approach to fluxing which avoids the need for post-cleaning of the soldered parts.
There exists a need for an improved approach to soldering, and particularly to the fluxing operation, which increases the reliability of the joining process by promoting effective wetting of the solder to the piece during the tinning step, and also reduces the incidence of post-soldering failures due to corrosion or related causes. Work continues in an effort to develop suitable fluxes that permit making a solder joint faster and better, in a manner that is both environmentally acceptable and also does not require special precautions to protect the health and productivity of production line workers.
Summary of the Invention The flux of the invention eliminates harmful environmental emissions normally associated with rosin-based fluxes, flux thinner and defluxing solvents (such as: CFCs).
The flux of the invention is environmentally safe, non-toxic, and easy to use.
Soldered assemblies can be cleaned by either deionized water or iso-propanol, thus eliminating the high capital costs associated with vapor degreasing equipment.
The resulting soldered joint exhibits high metallic luster and excellent elf;ctrical quality.
Further, the purpose of the foregoing Abstract is to enable the Canadian Intellectual Property Office (CIPO) and the public generally, and especially the scientists, engineers and practitioners in the art who are not familiar with patent or legal terms of phraseology, to determine quickly from a cursory inspection the nature and essence of the technical disclosure of the application. Accordingly, the Abstract is neither intended to define the invention or the application, which only is measured by the claims, nor is it intended to be limiting as to the scope of the invention in any way.
It is therefore an object of the present invention to provide a new and improved composition for cleaning the surface of various soldered articles and which has all of the advantages of the prior art and none of the disadvantages.
It is another object of the present invention to pro vide a new composition for tinning the surface of stainless steel and/or nickel articles Which may be efficiently manufactured and marketed.
An even further object of the present invention is to provide a new composition for tinning the surface of stainless steel and nickel articles which is susceptible of a iow cost of manufacture with regard to both materials and labor, and which accordingly is then susceptible of low prices of sale to the consuming public, tlhereby making such composition available to the buying public.
Still yet a further object of the present invention is to provide a new composition for tinning the surface of stainless steel and nickel articles and which is adapted to be topically applied to such articles in a hand soldering form.
These together with still other objects of the invention, along with the various features of novelty which characterize the invention, are pointed out with particularity in the claims forming a part of this disclosure. For a better understanding of the invention, its operating advantages and the specific objects attained by its uses, reference should be made to the following detailed description of the preferred embodiments of the invention.
Description of the preferred Embodiment In accordance with the invention, a non-halide water-soluble cored flux for stainless steel or nickel soldering is provided, comprising ortho-phosphoric acid, adipic acid and formic acid. The mixture is heated to liquid and is co-extruded with a hollow cylinder of solder to form the composite cored solder.
The present invention is embodied in a flux used in conjunction with solder.
The flux preferably is a mixture of ortho-phosphoric acid, adipic acid and formic acid, with the ratio of acids being from about 50:50:1 (v/v/v), respectively. The mixture is then heated up to 110°C for 20 minutes. The resulting colorless transparent liquid is transferred to the flux tank, which is attached to the wire extnzsion machine, waiting for co-extrude with the hollow cylinder of solder. The composition should be without impurities that would not evaporate during heating. Consequently, the preparation of the flux mixture should be accomplished by a person skilled in making acid mixtures, using good ventilation and appropriate safety equipment including at least goggles, a rubber apron, and rubber gloves.
It is recommended that any flux touching the skin be washed away as soon as possible. Nevertheless, the flux mixture is much safer than many other commercial fluxes, which quickly burn the skin. The flux is safe to handle in ordinary conditions of good ventilation and a reasonably safe working enviromnent. It is seen that the flux and approach of the present invention yield important advantages in soldering.
Good tinning and soldering of stainless steel and/or nickel are achieved, without the need for cleaning and post-cleaning.
While the present invention has been fully described above with particularity and detail in connection with what is of ordinary skill in the art that many modifications thereof may be made without departing from the principles and concepts set forth herein. Hence, the proper scope of the present invention should be determined only by the broadest interpretation of the appended claims so as to encompass all such modifications.
However, hand soldering stainless steel or nickel with a soft solder requires a super strength fluxing power.
Fluxes now in use include mixtures of inorganic acids in inorganic vehicles or solvents such as water, inorganic acids in petrolatum pastes, salts in water, organic halogens in water. All of these fluxes require post-cleaning of the soldered joint.
Fluxing can also be carried out in a reducing environment, as by accomplishing the soldering process in a hydrogen gas atmosphere. Post-cleaning i.s not required, but maintenance and use of a pure hydrogen atmosphere in large scale production operations is difficult, and can lead to related hydrogen embrittlement. In sum, there is known no effective, generally applicable approach to fluxing which avoids the need for post-cleaning of the soldered parts.
There exists a need for an improved approach to soldering, and particularly to the fluxing operation, which increases the reliability of the joining process by promoting effective wetting of the solder to the piece during the tinning step, and also reduces the incidence of post-soldering failures due to corrosion or related causes. Work continues in an effort to develop suitable fluxes that permit making a solder joint faster and better, in a manner that is both environmentally acceptable and also does not require special precautions to protect the health and productivity of production line workers.
Summary of the Invention The flux of the invention eliminates harmful environmental emissions normally associated with rosin-based fluxes, flux thinner and defluxing solvents (such as: CFCs).
The flux of the invention is environmentally safe, non-toxic, and easy to use.
Soldered assemblies can be cleaned by either deionized water or iso-propanol, thus eliminating the high capital costs associated with vapor degreasing equipment.
The resulting soldered joint exhibits high metallic luster and excellent elf;ctrical quality.
Further, the purpose of the foregoing Abstract is to enable the Canadian Intellectual Property Office (CIPO) and the public generally, and especially the scientists, engineers and practitioners in the art who are not familiar with patent or legal terms of phraseology, to determine quickly from a cursory inspection the nature and essence of the technical disclosure of the application. Accordingly, the Abstract is neither intended to define the invention or the application, which only is measured by the claims, nor is it intended to be limiting as to the scope of the invention in any way.
It is therefore an object of the present invention to provide a new and improved composition for cleaning the surface of various soldered articles and which has all of the advantages of the prior art and none of the disadvantages.
It is another object of the present invention to pro vide a new composition for tinning the surface of stainless steel and/or nickel articles Which may be efficiently manufactured and marketed.
An even further object of the present invention is to provide a new composition for tinning the surface of stainless steel and nickel articles which is susceptible of a iow cost of manufacture with regard to both materials and labor, and which accordingly is then susceptible of low prices of sale to the consuming public, tlhereby making such composition available to the buying public.
Still yet a further object of the present invention is to provide a new composition for tinning the surface of stainless steel and nickel articles and which is adapted to be topically applied to such articles in a hand soldering form.
These together with still other objects of the invention, along with the various features of novelty which characterize the invention, are pointed out with particularity in the claims forming a part of this disclosure. For a better understanding of the invention, its operating advantages and the specific objects attained by its uses, reference should be made to the following detailed description of the preferred embodiments of the invention.
Description of the preferred Embodiment In accordance with the invention, a non-halide water-soluble cored flux for stainless steel or nickel soldering is provided, comprising ortho-phosphoric acid, adipic acid and formic acid. The mixture is heated to liquid and is co-extruded with a hollow cylinder of solder to form the composite cored solder.
The present invention is embodied in a flux used in conjunction with solder.
The flux preferably is a mixture of ortho-phosphoric acid, adipic acid and formic acid, with the ratio of acids being from about 50:50:1 (v/v/v), respectively. The mixture is then heated up to 110°C for 20 minutes. The resulting colorless transparent liquid is transferred to the flux tank, which is attached to the wire extnzsion machine, waiting for co-extrude with the hollow cylinder of solder. The composition should be without impurities that would not evaporate during heating. Consequently, the preparation of the flux mixture should be accomplished by a person skilled in making acid mixtures, using good ventilation and appropriate safety equipment including at least goggles, a rubber apron, and rubber gloves.
It is recommended that any flux touching the skin be washed away as soon as possible. Nevertheless, the flux mixture is much safer than many other commercial fluxes, which quickly burn the skin. The flux is safe to handle in ordinary conditions of good ventilation and a reasonably safe working enviromnent. It is seen that the flux and approach of the present invention yield important advantages in soldering.
Good tinning and soldering of stainless steel and/or nickel are achieved, without the need for cleaning and post-cleaning.
While the present invention has been fully described above with particularity and detail in connection with what is of ordinary skill in the art that many modifications thereof may be made without departing from the principles and concepts set forth herein. Hence, the proper scope of the present invention should be determined only by the broadest interpretation of the appended claims so as to encompass all such modifications.
Claims (7)
1. A solid cored flux, consisting essentially of a mixture of an evaporative organic acids selected from the group consisting of carboxylic acid and its derivatives of short-chain phosphoric acid, the acid being present in an effective amount less than the limit in the solubility of the resulting organic compound.
2. The composition of claim 1 comprising, by weight of the total composition of i). 10 to 60% of organic acid selected from the class consisting short-chain dibasic fatty acids, ii). 1 to 10% of evaporative organic acid containing formic acid, iii). 20 to 50% of organic acid containing adipic acid, v). 20 to 70% of organic acid containing ortho-phosphoric acid.
3. A composite cored solder comprising a hollow cylinder of solder, said hollow filled with solid cored flux, said flux comprising claim 1.
4. The flux of claim 1, wherein the acid is adipic acid, and the ratio of adipic acid to the rest of organic compound is from about 50 parts of adipic acid, to about 51 parts of the remaining organic compound.
S. The flux of claim 1, wherein the acid is ortho-phosphoric acid, and the ratio of acid to the rest of the organic compound is about 50 parts of acid to about 51 parts of the rest of the organic compound.
6. The flux of claim 1, wherein the acids are adipic acid and ortho-phosphoric acid, and the ratio of acid to acid is from about 50 parts of adipic acid, to about 50 parts of ortho-phosphoric acid.
7. The flux of claim 1, wherein the acid is formic acid, and the ratio of formic acid to the rest of the organic composition is from about 1 part of formic acid, to about 100 parts of the rest of organic composition.
8. The composite cored solder of claim 3 wherein said solder consists essentially of a tin-based solder.
9. The composite cored solder of claim 3 wherein said solder consists essentially of Pb-free solder (Sn/0.7Cu/3.0Ag).
10. The composite cored solder of claim 3 wherein said solder consists essentially of Pb-free solder (Sn/0.7Cu).
11. The composite cored solder of claim 3 wherein said solder consists essentially of a tin-lead solder.
12. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of claim 4.
13. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
S. The flux of claim 1, wherein the acid is ortho-phosphoric acid, and the ratio of acid to the rest of the organic compound is about 50 parts of acid to about 51 parts of the rest of the organic compound.
6. The flux of claim 1, wherein the acids are adipic acid and ortho-phosphoric acid, and the ratio of acid to acid is from about 50 parts of adipic acid, to about 50 parts of ortho-phosphoric acid.
7. The flux of claim 1, wherein the acid is formic acid, and the ratio of formic acid to the rest of the organic composition is from about 1 part of formic acid, to about 100 parts of the rest of organic composition.
8. The composite cored solder of claim 3 wherein said solder consists essentially of a tin-based solder.
9. The composite cored solder of claim 3 wherein said solder consists essentially of Pb-free solder (Sn/0.7Cu/3.0Ag).
10. The composite cored solder of claim 3 wherein said solder consists essentially of Pb-free solder (Sn/0.7Cu).
11. The composite cored solder of claim 3 wherein said solder consists essentially of a tin-lead solder.
12. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of claim 4.
13. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
claim 5.
14. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
14. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
claim 6.
15. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
15. A method of soldering a metal comprising applying to a surface thereof a cored solder containing a flux therein and heating said metal to a desired soldering temperature, characterized in that said soldering flux consists essentially of
claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2440354 CA2440354A1 (en) | 2003-09-15 | 2003-09-15 | Non-halide water-soluble cored flux for soldering of stainless steel and nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2440354 CA2440354A1 (en) | 2003-09-15 | 2003-09-15 | Non-halide water-soluble cored flux for soldering of stainless steel and nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2440354A1 true CA2440354A1 (en) | 2005-03-15 |
Family
ID=34318731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2440354 Abandoned CA2440354A1 (en) | 2003-09-15 | 2003-09-15 | Non-halide water-soluble cored flux for soldering of stainless steel and nickel |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2440354A1 (en) |
-
2003
- 2003-09-15 CA CA 2440354 patent/CA2440354A1/en not_active Abandoned
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |