CA2409435C - Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes - Google Patents

Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes Download PDF

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Publication number
CA2409435C
CA2409435C CA2409435A CA2409435A CA2409435C CA 2409435 C CA2409435 C CA 2409435C CA 2409435 A CA2409435 A CA 2409435A CA 2409435 A CA2409435 A CA 2409435A CA 2409435 C CA2409435 C CA 2409435C
Authority
CA
Canada
Prior art keywords
circuit
test
ring oscillator
sub
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2409435A
Other languages
English (en)
Other versions
CA2409435A1 (fr
Inventor
Brian Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scanimetrics Inc
Original Assignee
Scanimetrics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CA002308820A external-priority patent/CA2308820A1/fr
Application filed by Scanimetrics Inc filed Critical Scanimetrics Inc
Priority to CA2409435A priority Critical patent/CA2409435C/fr
Publication of CA2409435A1 publication Critical patent/CA2409435A1/fr
Application granted granted Critical
Publication of CA2409435C publication Critical patent/CA2409435C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

La présente invention concerne un appareil et un procédé d'essai sans fil de circuits intégrés et de plaquettes. L'appareil comprend une unité d'essai à l'extérieur de la plaquette et au moins un circuit d'essai fabriqué sur la plaquette contenant le circuit intégré. L'unité d'essai transmet un signal RF pour alimenter le circuit d'essai. Le circuit d'essai qui comprend un oscillateur en anneau variable effectue une série d'essais paramétriques à la fréquence d'exploitation normale du circuit intégré et transmet les résultats d'essai à l'unité d'essai pour analyse.
CA2409435A 2000-05-15 2001-05-15 Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes Expired - Fee Related CA2409435C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA2409435A CA2409435C (fr) 2000-05-15 2001-05-15 Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CA2,308,820 2000-05-15
CA002308820A CA2308820A1 (fr) 2000-05-15 2000-05-15 Conception d'une technique sans fil a frequences radioelectriques et methode d'essai de circuits integres et de tranches
PCT/CA2001/000688 WO2001088976A2 (fr) 2000-05-15 2001-05-15 Conception d'une technique radio frequence sans fil et procede d'essai de circuits integres et de plaquettes
CA2409435A CA2409435C (fr) 2000-05-15 2001-05-15 Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes

Publications (2)

Publication Number Publication Date
CA2409435A1 CA2409435A1 (fr) 2001-11-22
CA2409435C true CA2409435C (fr) 2010-07-20

Family

ID=25681815

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2409435A Expired - Fee Related CA2409435C (fr) 2000-05-15 2001-05-15 Conception et methode de technique a radiofrequence sans fil permettant l'essai de circuits integres et de plaquettes

Country Status (1)

Country Link
CA (1) CA2409435C (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014222203B3 (de) * 2014-10-30 2016-03-10 Infineon Technologies Ag Überprüfung von Randschäden
CN117785590B (zh) * 2024-02-27 2024-05-28 深圳市纽创信安科技开发有限公司 芯片及芯片数据保护方法

Also Published As

Publication number Publication date
CA2409435A1 (fr) 2001-11-22

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MKLA Lapsed

Effective date: 20160516