CA2354181A1 - Modular computer system with passive backplane modules - Google Patents
Modular computer system with passive backplane modules Download PDFInfo
- Publication number
- CA2354181A1 CA2354181A1 CA 2354181 CA2354181A CA2354181A1 CA 2354181 A1 CA2354181 A1 CA 2354181A1 CA 2354181 CA2354181 CA 2354181 CA 2354181 A CA2354181 A CA 2354181A CA 2354181 A1 CA2354181 A1 CA 2354181A1
- Authority
- CA
- Canada
- Prior art keywords
- backplane
- modules
- module
- connectors
- backplane modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004744 fabric Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 102100021633 Cathepsin B Human genes 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 101000933173 Homo sapiens Pro-cathepsin H Proteins 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1459—Circuit configuration, e.g. routing signals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
- H05K7/1441—Back panel mother boards with a segmented structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Multi Processors (AREA)
Abstract
A computer system wherein an assembly of passive backplane modules allows a variety of active boards of the same or of different architectures to be used in the same chassis. This technology differs from any others in that it presents a second level of modularity in addition of the usual one, which is putting active boards in a passive backplane. In addition, several backplane modules of different types allow different architectures to be used on a slot by slot basis and wiring requirements to link said backplane modules are minimized.
Description
MODULAR COMPUTER SYSTEM WITH PASSIVE BACKPLANE
MODULES
Field of the invention This invention relates to computer systems and methods for interconnecting active boards together using one or more passive backplane modules. In particular, it focuses on reduced cabling, high modularity, high density and high-speed interconnections.
Background of the invention A typical computer system is generally built using a passive backplane with removable active boards. The backplane allows using predefined bus architectures in a predefined system configuration.
For example, a PCI passive backplane has a slot for a host controller board and five slots for PCI peripheral expansion cards. In this case, the architecture is defined by the backplane to be a PCI bus and cannot be changed. Each time the architecture or the system configuration changes, such as the number of PCI
expansion slots in this example, a whole new backplane is required.
In many cases, different interconnected backplanes may be used to manage the different types of architecture and configuration required in a same chassis. In such case power and other type of signals are provided to each backplanes using wires. This huge amount of wires is a penalty for system reliability and ease of maintenance. If wires need to be cleanly installed in the system to minimize the inconvenience, the assembly cost is impacted.
Therefore, what is needed is a generic solution for backplane interconnections eliminating almost all wires and still providing high performance communications between the circuit boards. Such a solution provides a common ground for very fast prototyping and allows easy customization and cost reduction for the high volume production phase.
Summary of invention This invention consists of a set of backplane modules. The main module is called the Power and Signal Distribution Module (further called PSDM or PSD
Module). The PSDM is used as a signal distributor and a receptacle for a variable set of auxiliary backplane modules (ABM or AB Module). This PSD Module provides the infrastructure to implement power distribution, management signal distribution and high-speed point to point signal distribution between several node slots and one or more switch slots.
Auxiliary backplane modules designed to mate on the PSDM are also passive but allow inserting active devices in a system. These are the actual backplane modules that determine the kind of active boards or devices that may be used in a particular slot. These AB Modules may be of any kind: Compact PCI, VME, H.110, CPSB, SCSI etc. Expected AB Modules for the preferred embodiment are related to, but not limited to the Compact PCI architecture.
When the PSD Modules and a selected set of auxiliary modules are used together, the assembly constitutes one logical backplane to be used in a chassis.
MODULES
Field of the invention This invention relates to computer systems and methods for interconnecting active boards together using one or more passive backplane modules. In particular, it focuses on reduced cabling, high modularity, high density and high-speed interconnections.
Background of the invention A typical computer system is generally built using a passive backplane with removable active boards. The backplane allows using predefined bus architectures in a predefined system configuration.
For example, a PCI passive backplane has a slot for a host controller board and five slots for PCI peripheral expansion cards. In this case, the architecture is defined by the backplane to be a PCI bus and cannot be changed. Each time the architecture or the system configuration changes, such as the number of PCI
expansion slots in this example, a whole new backplane is required.
In many cases, different interconnected backplanes may be used to manage the different types of architecture and configuration required in a same chassis. In such case power and other type of signals are provided to each backplanes using wires. This huge amount of wires is a penalty for system reliability and ease of maintenance. If wires need to be cleanly installed in the system to minimize the inconvenience, the assembly cost is impacted.
Therefore, what is needed is a generic solution for backplane interconnections eliminating almost all wires and still providing high performance communications between the circuit boards. Such a solution provides a common ground for very fast prototyping and allows easy customization and cost reduction for the high volume production phase.
Summary of invention This invention consists of a set of backplane modules. The main module is called the Power and Signal Distribution Module (further called PSDM or PSD
Module). The PSDM is used as a signal distributor and a receptacle for a variable set of auxiliary backplane modules (ABM or AB Module). This PSD Module provides the infrastructure to implement power distribution, management signal distribution and high-speed point to point signal distribution between several node slots and one or more switch slots.
Auxiliary backplane modules designed to mate on the PSDM are also passive but allow inserting active devices in a system. These are the actual backplane modules that determine the kind of active boards or devices that may be used in a particular slot. These AB Modules may be of any kind: Compact PCI, VME, H.110, CPSB, SCSI etc. Expected AB Modules for the preferred embodiment are related to, but not limited to the Compact PCI architecture.
When the PSD Modules and a selected set of auxiliary modules are used together, the assembly constitutes one logical backplane to be used in a chassis.
Brief description of drawings Figure 1 represents the interconnections in the preferred embodiment.
Normal lines represent serial point to point bus connections. Dashed lines represent management connections. Bold lines represent power distribution.
Figure 2 is a front view of the modular interconnection system showing some backplanes mated on the PSDB for a Compact PCI implementation.
Figure 3 is a rear view of the modular interconnects system showing the high-density interconnection system and some different auxiliary backplane modules for the preferred embodiment.
Figure 4 shows how this modular system is implemented in the Compact PCI architecture.
Figure S is a three-dimension view of an assembly of the PSD Module with some AB Modules.
Description of the invention The passive backplane modules system consists of a main backplane module, the PSDM, and a number of auxiliary backplane modules specific to the devices to be used in the system. The PSDM allows distribution of power, management signals and high-speed serial bus to each selected slot within a chassis. The number of slots is dependent of the selected embodiment. In a typical Compact PCI implementation, the preferred embodiment, 21 slots are supported.
Figure 1 to 5 shows how the AB Modules are attached to the PSDM. This infrastructure opens the door to two types of data path. One is a parallel bus self contained in a multi-slot AB Module and the other is a serial point to point bus routed through the PSD Module from each slot to a dedicated switch fabric slot.
The PSDM may host one or more serial links per node slot and one or more switch fabric slot.
Connector/Bus bar In order to connect the PSDM to the AB Module, each slot has a high density connector and/or direct connection to a high current copper bus bar sitting on the PSDM. The connector is used to provide power and other signals. Direct copper connections may be used mainly for the power supply backplane module(s), which require more current. Other connectors may be used on the PSDM for active boards, like the Management Card shown on figure 1.
PSDM slot particularities Some slots may have particularities. For example, power supplies may have dedicated slots with a special pinout. Serial bus connections are point to point and must connect to a switch fabric. This switch fabric must be located in a particular slot that has a special pinout to accommodate the higher number of connections to the PSDM.
Serial Bus High-speed differential pairs are provided to selected slots on the PSDM.
What defines the exact nature of the signals is the chosen architecture. For example, the preferred embodiment distributes PICMG2.16 compliant signals. It consists of Ethernet signaling requiring 100 Ohms CATS cabling. A second serial channel may be provided that consists of 100 Ohms differential pairs supporting mufti-gigabit rate. Once the physical medium is fixed, the specific active boards used in the system will define the exact nature of the serial bus in term of protocol.
Normal lines represent serial point to point bus connections. Dashed lines represent management connections. Bold lines represent power distribution.
Figure 2 is a front view of the modular interconnection system showing some backplanes mated on the PSDB for a Compact PCI implementation.
Figure 3 is a rear view of the modular interconnects system showing the high-density interconnection system and some different auxiliary backplane modules for the preferred embodiment.
Figure 4 shows how this modular system is implemented in the Compact PCI architecture.
Figure S is a three-dimension view of an assembly of the PSD Module with some AB Modules.
Description of the invention The passive backplane modules system consists of a main backplane module, the PSDM, and a number of auxiliary backplane modules specific to the devices to be used in the system. The PSDM allows distribution of power, management signals and high-speed serial bus to each selected slot within a chassis. The number of slots is dependent of the selected embodiment. In a typical Compact PCI implementation, the preferred embodiment, 21 slots are supported.
Figure 1 to 5 shows how the AB Modules are attached to the PSDM. This infrastructure opens the door to two types of data path. One is a parallel bus self contained in a multi-slot AB Module and the other is a serial point to point bus routed through the PSD Module from each slot to a dedicated switch fabric slot.
The PSDM may host one or more serial links per node slot and one or more switch fabric slot.
Connector/Bus bar In order to connect the PSDM to the AB Module, each slot has a high density connector and/or direct connection to a high current copper bus bar sitting on the PSDM. The connector is used to provide power and other signals. Direct copper connections may be used mainly for the power supply backplane module(s), which require more current. Other connectors may be used on the PSDM for active boards, like the Management Card shown on figure 1.
PSDM slot particularities Some slots may have particularities. For example, power supplies may have dedicated slots with a special pinout. Serial bus connections are point to point and must connect to a switch fabric. This switch fabric must be located in a particular slot that has a special pinout to accommodate the higher number of connections to the PSDM.
Serial Bus High-speed differential pairs are provided to selected slots on the PSDM.
What defines the exact nature of the signals is the chosen architecture. For example, the preferred embodiment distributes PICMG2.16 compliant signals. It consists of Ethernet signaling requiring 100 Ohms CATS cabling. A second serial channel may be provided that consists of 100 Ohms differential pairs supporting mufti-gigabit rate. Once the physical medium is fixed, the specific active boards used in the system will define the exact nature of the serial bus in term of protocol.
Optical Bus In some future embodiments, it should be possible to use optical data paths in the PSDM and ABM and using special optical connectors for that purpose. In such a case, the same modular approach will consist also of optical point to point bus.
Other components The PSDM not only accepts ABM on a slot per slot basis, it can also accept directly some predefined active boards or other devices like fans.
Definitions Active componentAny electrical component that performs computing functions or is capable of electrical signal amplification.
Active BackplaneA backplane which contains logical circuitry that performs computing functions or is capable of electric signal amplification.
Architecture A set of electrical and mechanical characteristics that devices or components have in common and that makes them compatible with each other.
AB Module, Auxiliary Backplane Module. Further described or in the text.
ABM
Backplane A circuit board, or set of circuit boards, part of computer system which is usually passive and not installable by the system end user. Its function is to receive and interconnect two or several active boards that are usually installable by the system end user.
Other components The PSDM not only accepts ABM on a slot per slot basis, it can also accept directly some predefined active boards or other devices like fans.
Definitions Active componentAny electrical component that performs computing functions or is capable of electrical signal amplification.
Active BackplaneA backplane which contains logical circuitry that performs computing functions or is capable of electric signal amplification.
Architecture A set of electrical and mechanical characteristics that devices or components have in common and that makes them compatible with each other.
AB Module, Auxiliary Backplane Module. Further described or in the text.
ABM
Backplane A circuit board, or set of circuit boards, part of computer system which is usually passive and not installable by the system end user. Its function is to receive and interconnect two or several active boards that are usually installable by the system end user.
Backplane A passive circuit board that consists of a part of the whole Module backplane. Two or mode backplane modules are used together to make a complete usable backplane.
Circuit board,A printed circuit board with any type of electrical or component Board, or Cardassembly. May be removable or not by the end user.
Compact PCI, A standardized computer system architecture compliant or to one cPCl or several of the PICMG 2.x standards.
CPU Central Processing Unit H.110 Refers to the H.l 10 specification of PICMG, or to an application directly derived from it.
Host controllerCPU board that is the central resource in the system.
Node slot Location in the system to insert a board that is considered a node in relation to a switch fabric architecture.
Passive A backplane which contains no logical circuitry that performs Backplane computing functions or that does not perform electrical signal amplification.
PCI Peripheral Component Interconnect. Underlying bus architecture of a cPCI system.
PICMG PCI Industrial Manufacturer Group.
PSD Module, Power and Signal Distribution Module. Further or described in PSDM the text.
Slot Refers to a location in a chassis intended to receive a removable circuit board. In this document, generally refers to a cPCI slot as defined in the PICMG2.0 standard.
Switch Fabric A computer system architecture where circuit boards communicate to each others using point-to-point connections going through a switch, or a network of switches, instead of, or in addition to using a set of bussed signals.
Switch Slot Location in the system to insert a board that is considered a switch in regard to a switch fabric architecture.
System Refers to the quantity, dimension, type, and position of the configuration active boards, fans, hard disks or any other configurable device in a system.
Circuit board,A printed circuit board with any type of electrical or component Board, or Cardassembly. May be removable or not by the end user.
Compact PCI, A standardized computer system architecture compliant or to one cPCl or several of the PICMG 2.x standards.
CPU Central Processing Unit H.110 Refers to the H.l 10 specification of PICMG, or to an application directly derived from it.
Host controllerCPU board that is the central resource in the system.
Node slot Location in the system to insert a board that is considered a node in relation to a switch fabric architecture.
Passive A backplane which contains no logical circuitry that performs Backplane computing functions or that does not perform electrical signal amplification.
PCI Peripheral Component Interconnect. Underlying bus architecture of a cPCI system.
PICMG PCI Industrial Manufacturer Group.
PSD Module, Power and Signal Distribution Module. Further or described in PSDM the text.
Slot Refers to a location in a chassis intended to receive a removable circuit board. In this document, generally refers to a cPCI slot as defined in the PICMG2.0 standard.
Switch Fabric A computer system architecture where circuit boards communicate to each others using point-to-point connections going through a switch, or a network of switches, instead of, or in addition to using a set of bussed signals.
Switch Slot Location in the system to insert a board that is considered a switch in regard to a switch fabric architecture.
System Refers to the quantity, dimension, type, and position of the configuration active boards, fans, hard disks or any other configurable device in a system.
Claims (3)
1. A computer system comprising a plurality of distinct backplane modules wherein:
a) a first backplane module comprises a plurality of connectors to receive power from one or several power supply backplane modules to distribute said power to the backplane modules other than first module and than said power backplane modules, and b) said first backplane module may also comprise a plurality of connectors to establish high-speed point-to-point connections to distribute data to some, or all other backplane modules, and c) same first backplane module may also comprise a plurality of connectors to establish connections between an active management card and some, or all the other backplane modules to distribute management signals from said card, and d) all the backplane modules may be passive, and e) all the backplane modules except the power backplane modules may receive power and data through the connectors of the first backplane module, and f) all the backplane modules may receive management signals through the connectors of the first backplane module.
a) a first backplane module comprises a plurality of connectors to receive power from one or several power supply backplane modules to distribute said power to the backplane modules other than first module and than said power backplane modules, and b) said first backplane module may also comprise a plurality of connectors to establish high-speed point-to-point connections to distribute data to some, or all other backplane modules, and c) same first backplane module may also comprise a plurality of connectors to establish connections between an active management card and some, or all the other backplane modules to distribute management signals from said card, and d) all the backplane modules may be passive, and e) all the backplane modules except the power backplane modules may receive power and data through the connectors of the first backplane module, and f) all the backplane modules may receive management signals through the connectors of the first backplane module.
2. The computer system of claim 1 where the high-speed point-to-point data connections are being routed to one, or several switched fabric backplane modules, and/or to one or several active switch fabric cards using one or more connectors of said first backplane module.
3. The computer system of claim 2 where said high-speed point-to-point data connections use optical links and connectors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2354181 CA2354181A1 (en) | 2001-07-26 | 2001-07-26 | Modular computer system with passive backplane modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA 2354181 CA2354181A1 (en) | 2001-07-26 | 2001-07-26 | Modular computer system with passive backplane modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2354181A1 true CA2354181A1 (en) | 2003-01-26 |
Family
ID=4169586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2354181 Abandoned CA2354181A1 (en) | 2001-07-26 | 2001-07-26 | Modular computer system with passive backplane modules |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2354181A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006013206A1 (en) * | 2006-03-22 | 2007-09-27 | Adva Ag Optical Networking | Backplane for electronic subrack, has base backplane comprising contact strips, expansion space provided on base backplane, and additional backplane that is insertable into expansion space |
| US9295169B1 (en) | 2013-09-16 | 2016-03-22 | Advanced Testing Technologies, Inc. | Common chassis for instrumentation |
| US9488673B1 (en) | 2013-09-16 | 2016-11-08 | Advanced Testing Technologies, Inc. | Multi-standard instrumentation chassis |
-
2001
- 2001-07-26 CA CA 2354181 patent/CA2354181A1/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006013206A1 (en) * | 2006-03-22 | 2007-09-27 | Adva Ag Optical Networking | Backplane for electronic subrack, has base backplane comprising contact strips, expansion space provided on base backplane, and additional backplane that is insertable into expansion space |
| US8456857B2 (en) | 2006-03-22 | 2013-06-04 | Adva Optical Networking Se | Backplane for an electronic mounting rack |
| US9295169B1 (en) | 2013-09-16 | 2016-03-22 | Advanced Testing Technologies, Inc. | Common chassis for instrumentation |
| US9480184B1 (en) | 2013-09-16 | 2016-10-25 | Advanced Testing Technologies, Inc. | Instrumentation chassis within a module |
| US9488673B1 (en) | 2013-09-16 | 2016-11-08 | Advanced Testing Technologies, Inc. | Multi-standard instrumentation chassis |
| US9961787B1 (en) | 2013-09-16 | 2018-05-01 | Advanced Testing Technologies, Inc. | Multi-standard instrumentation chassis |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20040141285A1 (en) | Modular computer system with passive backplane modules | |
| US5603044A (en) | Interconnection network for a multi-nodal data processing system which exhibits incremental scalability | |
| US6677687B2 (en) | System for distributing power in CPCI computer architecture | |
| US7315456B2 (en) | Configurable IO subsystem | |
| US8009438B2 (en) | Server infrastructure having independent backplanes to distribute power and to route signals | |
| US5122691A (en) | Integrated backplane interconnection architecture | |
| US20060206647A1 (en) | Advanced mezzanine card adapter | |
| US7083422B2 (en) | Switching system | |
| US20080218987A1 (en) | Monolithic backplane having a first and second portion | |
| US20050186807A1 (en) | Apparatus inteconnecting circuit board and mezzanine card or cards | |
| US20080201515A1 (en) | Method and Systems for Interfacing With PCI-Express in an Advanced Mezannine Card (AMC) Form Factor | |
| WO2001093650A1 (en) | Modular backplane | |
| US20070124529A1 (en) | Subrack with front and rear insertion of AMC modules | |
| US20070230148A1 (en) | System and method for interconnecting node boards and switch boards in a computer system chassis | |
| US9160686B2 (en) | Method and apparatus for increasing overall aggregate capacity of a network | |
| US7433987B2 (en) | Computer apparatus for interconnecting an industry standard computer to a proprietary backplane and its associated peripherals | |
| EP2672793B1 (en) | Backplane configuration for use in electronic crate systems | |
| CN113009987A (en) | Network security server | |
| CA2354181A1 (en) | Modular computer system with passive backplane modules | |
| US8713228B2 (en) | Shared system to operationally connect logic nodes | |
| CN101741711A (en) | Fabric switch card independent from MCH and Micro Telecommunications Computing Architecture system | |
| US7064961B2 (en) | Communication device | |
| US20040257781A1 (en) | Mounting power handling components on printed circuit boards near high density routing channels | |
| EP4220422A1 (en) | System and method for distributed console server architecture | |
| CN214201838U (en) | Mixed signal interconnection connector based on VITA protocol |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |