CA2272017A1 - Lidding foil with conductive strips - Google Patents
Lidding foil with conductive strips Download PDFInfo
- Publication number
- CA2272017A1 CA2272017A1 CA 2272017 CA2272017A CA2272017A1 CA 2272017 A1 CA2272017 A1 CA 2272017A1 CA 2272017 CA2272017 CA 2272017 CA 2272017 A CA2272017 A CA 2272017A CA 2272017 A1 CA2272017 A1 CA 2272017A1
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- CA
- Canada
- Prior art keywords
- computer
- ohm
- conductive strips
- omega
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
- A61J7/00—Devices for administering medicines orally, e.g. spoons; Pill counting devices; Arrangements for time indication or reminder for taking medicine
- A61J7/04—Arrangements for time indication or reminder for taking medicine, e.g. programmed dispensers
- A61J7/0409—Arrangements for time indication or reminder for taking medicine, e.g. programmed dispensers with timers
- A61J7/0481—Arrangements for time indication or reminder for taking medicine, e.g. programmed dispensers with timers working on a schedule basis
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
- A61J1/00—Containers specially adapted for medical or pharmaceutical purposes
- A61J1/03—Containers specially adapted for medical or pharmaceutical purposes for pills or tablets
- A61J1/035—Blister-type containers
Abstract
Medicaments such as tablets are packaged in push-through or blister packs. The packaging exhibits a base with recesses each of which contains one tablet. The base part is covered over by a lidding foil. In order to remove a tablet, the lidding foil is penetrated by the tablet.
The push-through pack (1) here is medicinal packaging (1) which can be connected to a computer (5) where the packaging (1) contains a plurality of recesses (2) which are filled with contents such as tablets and at least one conductive strip (3) lies over each recess (2).
The overall electrical resistance in the case of one or a plurality of intact conductive strips (3) is from 100 to 100,000 .OMEGA. (Ohm) measured between the measuring points which are defined by the points of connection of the computer (5).
The push-through pack (1) here is medicinal packaging (1) which can be connected to a computer (5) where the packaging (1) contains a plurality of recesses (2) which are filled with contents such as tablets and at least one conductive strip (3) lies over each recess (2).
The overall electrical resistance in the case of one or a plurality of intact conductive strips (3) is from 100 to 100,000 .OMEGA. (Ohm) measured between the measuring points which are defined by the points of connection of the computer (5).
Description
Lidding Foil with Conductive Strips Lidding foil with conductive strips for medicinal packaging which can be connected to a computer where the medicinal packaging features a plurality of recesses that are filled with contents and at least one conductive strip lies over each recess.
These known medicinal containers represent a form of medicinal packaging known in the field as blister pack.
The conductive strips are provided in the lidding foil of such medicinal containers as impulse conductors. Medicinal packaging of this kind, i.e. blister packs in general, are pro-duced in large numbers in a continuous manner on packaging machines. As a rule, in that process a plastic monofilm or plastic film laminate is provided with recesses or cups by a deepening stretching process. The contents such as pills, tablets, capsules, ampoules or the like are placed in the recesses and then sealed in by the lidding foil. As a rule the blister packs are produced in a continuous manner from foils in strip form and, only after filling and lidding, cut to size ready for sale, and if desired placed in an additional form of pack-aging.
Known e.g. from EP-B 0 129 785 or EP-A 0 796 605 is a device for storage and for reminding a patient to take a require dose of medicament, said device comprising a med icinal pack and a signal generator. On removing a dose of medicament a signal is comm unicated to a transmitter via an impulse conductor. The impulse conductor is cast into a push-through second foil or the conductive strips are situated on a label which in turn covers the packaging.
Is has been found disadvantageous that the impulses created by interrupting a conductive strip on removing contents from the packaging cannot be reliably recognised by the com-puter or signal generator.
The object of the present invention is to propose a lidding foil with conductive strips which does not exhibit the above disadvantages, and to describe conductive strips which transmit a reliably recognisable signal to the computer.
That objective is achieved by way of the invention in that the overall electrical resistance at which one or more intact conductive strips is 100 to 100,000 S2 (Ohm), measured between the measuring points that are defined by the contact points of the computer.
case 2183 Usefully, the minimum overall electrical resistance is 200 52 (Ohm), preferably 2000 S2, (Ohm), especially preferably 10,000 S2 (Ohm) and in particular 20,000 SZ
(Ohm).
Usefully, the maximum overall electrical resistance is 80,000 SZ (Ohm), preferably 70,000 S2 (Ohm), especially preferably 60,000 S2 (Ohm) and in particular 50,000 52, (Ohm).
The overall electrical resistance may be achieved by the conductive strip or by the conductive strip and at least one additional resistance.
The contact points of the computer represents the interface between the lidding foil with the conductive strips and the contact points of the computer which make contact with the conductive strips.
The conductive strips are situated on a substrate material. The substrate material may be the lidding foil for closing off the base or a label to attach these to the lidding material. The material for supporting the label may be a support foil e.g. a very brittle plastic film such as e.g. a film of polyolefin, polyethylene or polyvinylchloride. The brittleness may be achieved e.g. by addition of filler materials such as e.g. talcum, mica etc.
Other plastic films may be films containing acrylnitrile-styrene.
Papers or semi-carton type materials may also find application as substrate material.
Further substrate materials are metal foils or metal foils which are coated on one or both sides with further layers such as organic coatings or plastic films and the like.
The foils/films and papers mentioned above as substrate materials may be employed as further material for protecting the conductive strips. These protective materials may be attached to the support material and cover the conductive strips. Usefully, the labels are made of the same material used for the support and protective layers, this in the interest of avoiding mixed materials.
The material for protecting the conductive strips may also be a in the form of a protective organic coating which is applied by spraying , rolling or brushing, or layers deposited by vapour deposition, vacuum vapour deposition or sputtering.
The conductive strips may be of electrically conductive foil or wires, or an electrically con-ductive lacquer or powder coating, or a vapour deposited or a vacuum vapour deposited case 2183 electrically conductive layer. The electrically conductive lacquer may contain substances that make electrical conductivity possible and lacquer substrates, solvents etc. The electric-ally conductive lacquer may also be solvent free. The electrical conductivity in lacquers may be achieved by inorganic compounds such as metals or semiconductors e.g.
metal powders or dusts in particular silver coated platelet shaped nickel, powders of nickel, iron copper silver etc. or by carbon e.g. in the form of soot, coke and preferably graphite or by oxide mixtures.
Preferred as conductive strips in the present invention are those containing an Si02/Sb203 hydroxide mixture on a mica substrate. Usefully the thickness of the layer of Si02/Sb203 hydroxide mixture on the mica particles is 8 to 20 nanometre advantageously 16 to 20 manometers. The Si02/Sb203 hydroxide mixture on the mica particles represents a conduct-ive pigment on the mica particles. The Sn/Sb ratio amounts to 95:5 to 75:25, a ratio of 85: 15 being preferred. The grain size of the mica may e.g. be from 10 to 100 Vim, usefully the grain size of the mica is less than 15 pm. In order that the desired conductive strips can be produced from the electrically conductive pigment, the said pigment must usefully be brought into the form of a lacquer. A lacquer may contain the electrically conductive pigment e.g. the Si02/Sb203 hydroxide mixture on the mica substrate and a binder. Binders that may be employed in such lacquers are e.g. melamine resins, acryl-melamine resins, polyurethane lacquers, nitrocellulose lacquers, acryl-nitrocellulose lacquers etc. The fract-ion of binder in the lacquer may be e.g. from 10 to 60 wt.%, advantageously from 10 to 25 wt.%. Correspondingly, the fraction of electrically conductive pigment in the lacquer may be 40 to 90 wt.%, advantageously 75 to 90wt.%.
Apart from the electrically conductive pigment use may be made of a filler such as Ti02, for example with a grain size equal to or less than 15 ~,m and in a ratio of electrically conductive pigment to filler of 1:1, or fillers in the form of porous spherical particles with a grain size larger than 30 p,m, known under the trade name of LiChrospher by Merck, the ratio of electrically conductive pigment to filler being 1:1.
Lacquers used to create conductive strips may be deposited on the substrate material by brushing, spraying etc. if desired using a mask, or by printing using offset, intaglio, relief or screen printing etc. Further methods for producing electrically conductive strips on the sub-strate material are electrostatic methods, methods using image etching principles, photo-chemical reproduction methods or photochemical printing methods such as e.g. by deposit-ing a fully covering lacquer layer, fixing the conductive strip pattern and dissolving the unrequired areas of lacquer. Other methods for creating conductive strips is to produce layers by vaporisation e.g. in vacuum (chemical vapour deposition, physical vapour case 2183 deposition, sputtering). The structuring of vapour deposited electrically conductive layers may be performed e.g. in a step prior to vapour deposition in which a layer is deposited locally and either prevents the adhesion of the electrically conductive layer or prevents the condensation of the vapour. Layers deposited as anti-bonding or anti-condensation layers are e.g. silicone oils deposited in vacuum. A vapour deposited layer may also be masked after deposition and then structure by etching processes. Structuring is also possible by local vapour deposition of the layer using laser or electron beams. A further form of struc-turing the vapour deposited electrically conductive layer is using a process in which a lacquer that dissolves in a solvent is deposited on the substrate, using e.g.
an intaglio, relief or screen printing method, prior to the vapour deposition process. After vapour deposition onto the lacquer coated substrate, the lacquer is removed using a solvent. The vapour deposited layer is of course also removed with the lacquer. The vapour deposited layer remains on the non-lacquered areas of the substrate thus providing the desired pattern of conductive strips.
Apart from the desired pattern of conductive strip or strips on the label, recognition and distance marks or circuits for application of the labels on the blister pack may be provided.
Apart from the conductive strips, it is also possible to provide circuits on the substrate material which contain information for the computer that can be evaluated e.g.
information concerning the contents of the pack, composition, dosage of the product, cycle in which the medicament is to be taken, expiry date etc.
The conductive strips may be laid in series or parallel over the recesses and, correspond-ingly, a conductive strip may be laid over all recesses, or one conductive strip may be laid over one or more series of recesses, or each recess may be covered by a single conductive strip and each conductive strip exhibits its own connection to the computer.
These con-ductive strips may communicate its information to the computer by way of a connection.
On the basis of the information from an interrupted conductive strip the computer may start up a time-interval programme that is pre-programmed in the computer or is initiated by a circuit on the label and shows the correct time to take the next tablet and the prescribed times according to the programme. The time at which the tablet was removed can also be registered by the computer and, based on that information the computer can determine the next time a tablet has to be taken and transmit this information via a signal generator. The details of the time of removal may be communicated by way of various commands such as a display showing the time, by coloured light diodes, acoustically by means of a warning signal and the like or by means of a combination of control commands.
case 2183 If each recess is covered by a conductive strip, the computer is able to determine whether the pack is still intact or, on the basis of the conductive strips that have been interrupted due to removal of medicament, it can calculate the situation regarding medication and from that continue with the appropriate interval of dispensing.
The conductive strips may be situated at least at one place on the medicinal packaging i.e.
grouped and arranged such that the computer makes contact there. This site may also be designated as the contact point for the computer. The conductive strips may also close flush with the medicinal pack at least on one side, or they may project over at least one side of the pack, and at this side the conductive strips may be led together i.e. grouped together in such a way that the computer can be locked onto the pack and/or to the label and the conductive strips and the computer contacts are able to make contact there.
The conductive strips in question may also be used on the lidding material for closing or covering over a part of the base for packaging small parts. For example, small parts of a technical nature may be placed in blister packs and the blister packs covered over with a lidding material with conductive strips. On removing individual small parts the conductive strip in the label is interrupted and a security system for unauthorised removal may be activated or, the impulse may be conducted to a computer for storage inventory purposes or the like.
By way of example figures 1 and 2 explain the present invention in greater detail. Figure 1 shows a plan view of a medicinal pack. Figure 2 shows a plan view of another arrangement of conductive strips on a lidding foil.
Figure 1 shows the plan view of a medicinal pack such as a blister pack 1 with recesses 2.
A computer 5 is connected to the blister pack 1 by inserting, clamping, locking, snap fitting or other means of contact. Using a slide 4 the clamping connection for example can be activ-ated and the conductive strips 3 terminating at the side-on edge 9 of the blister pack 1 are brought into contact with corresponding contacts in the computer.
The resistance of each conductive strip according to the present invention is measured between the measuring points which are defined by the contact points for the computer.
In the present example these contact points lie at the side-on edge 9. The computer 5 contains a clock function and represents a store for the changes in the measured overall resistance.
The computer 5 features e.g. a time display 6 and - as signal generator - e.g.
a display for the time to take the next dose of medicament and/or a generator for an acoustic signal. By means of light diodes 7 the process of reminding the patient may be effected or optically case 2183 reinforced. The computer 5 and with that the signal generator can be used several times and can for example be set to zero again by means of a button 8. The conductive strips 3 are situated on the lidding material 10. The connecting points for the computer 5 are provided at the edge 9. The conductive strips 3 on the lidding material 10 lie exactly over the recesses 2 in the blister pack 1. Each recess 2 is covered over by a conductive strip 3.
As a result, when a medicament is removed and thereby an interruption made in the conductive strip 3, an impulse can be emitted to the computer 5 or on the basis of the impulses from one, simultaneously a plurality, or all of the conductive strips, the computer 5 can recognise that the medicament has been removed , is due or overdue. The computer is arranged such that the contacts along the edge 9 of the blister pack 1 can be removed.
Figure 2 shows the plan view of a blister pack 1. In that figure the connectable computer is not shown. The blister pack 1 is closed off by a lidding foil 10. The recesses 2 are indicated by circles. A conductive strip 3 is situated over each recess 2. The connecting points 11 for the computer are provided at the edge 9 of the lidding material 10. The conductive strip 3 may be applied e.g. by a printing method. For that reason the conductor strip can have the same thickness over the whole of the lidding foil 10. In order to reach the overall resistance according to the invention, the conductive strips 3 are grouped together in the common broad section 13 and are divided up in narrow sections 14. The narrow sections 14 run over the recesses 2 as conductive strips 3. The resistance in the broad sections 13 is small compared with that of the narrow strips 14. In order to increase or control the resistance of a narrow section 14, the narrow section 14 may be increased in length by means of a loop shape. The narrow sections 14 exhibit a high resistance and on breaking through such a narrow strip 14 when removing a tablet from a recess 2 by pushing through the lidding foil 10, a large change in resistance or impulse is communicated to the computer (not shown) via the contact points 11 and definitely recognised by the computer.
case 2183
These known medicinal containers represent a form of medicinal packaging known in the field as blister pack.
The conductive strips are provided in the lidding foil of such medicinal containers as impulse conductors. Medicinal packaging of this kind, i.e. blister packs in general, are pro-duced in large numbers in a continuous manner on packaging machines. As a rule, in that process a plastic monofilm or plastic film laminate is provided with recesses or cups by a deepening stretching process. The contents such as pills, tablets, capsules, ampoules or the like are placed in the recesses and then sealed in by the lidding foil. As a rule the blister packs are produced in a continuous manner from foils in strip form and, only after filling and lidding, cut to size ready for sale, and if desired placed in an additional form of pack-aging.
Known e.g. from EP-B 0 129 785 or EP-A 0 796 605 is a device for storage and for reminding a patient to take a require dose of medicament, said device comprising a med icinal pack and a signal generator. On removing a dose of medicament a signal is comm unicated to a transmitter via an impulse conductor. The impulse conductor is cast into a push-through second foil or the conductive strips are situated on a label which in turn covers the packaging.
Is has been found disadvantageous that the impulses created by interrupting a conductive strip on removing contents from the packaging cannot be reliably recognised by the com-puter or signal generator.
The object of the present invention is to propose a lidding foil with conductive strips which does not exhibit the above disadvantages, and to describe conductive strips which transmit a reliably recognisable signal to the computer.
That objective is achieved by way of the invention in that the overall electrical resistance at which one or more intact conductive strips is 100 to 100,000 S2 (Ohm), measured between the measuring points that are defined by the contact points of the computer.
case 2183 Usefully, the minimum overall electrical resistance is 200 52 (Ohm), preferably 2000 S2, (Ohm), especially preferably 10,000 S2 (Ohm) and in particular 20,000 SZ
(Ohm).
Usefully, the maximum overall electrical resistance is 80,000 SZ (Ohm), preferably 70,000 S2 (Ohm), especially preferably 60,000 S2 (Ohm) and in particular 50,000 52, (Ohm).
The overall electrical resistance may be achieved by the conductive strip or by the conductive strip and at least one additional resistance.
The contact points of the computer represents the interface between the lidding foil with the conductive strips and the contact points of the computer which make contact with the conductive strips.
The conductive strips are situated on a substrate material. The substrate material may be the lidding foil for closing off the base or a label to attach these to the lidding material. The material for supporting the label may be a support foil e.g. a very brittle plastic film such as e.g. a film of polyolefin, polyethylene or polyvinylchloride. The brittleness may be achieved e.g. by addition of filler materials such as e.g. talcum, mica etc.
Other plastic films may be films containing acrylnitrile-styrene.
Papers or semi-carton type materials may also find application as substrate material.
Further substrate materials are metal foils or metal foils which are coated on one or both sides with further layers such as organic coatings or plastic films and the like.
The foils/films and papers mentioned above as substrate materials may be employed as further material for protecting the conductive strips. These protective materials may be attached to the support material and cover the conductive strips. Usefully, the labels are made of the same material used for the support and protective layers, this in the interest of avoiding mixed materials.
The material for protecting the conductive strips may also be a in the form of a protective organic coating which is applied by spraying , rolling or brushing, or layers deposited by vapour deposition, vacuum vapour deposition or sputtering.
The conductive strips may be of electrically conductive foil or wires, or an electrically con-ductive lacquer or powder coating, or a vapour deposited or a vacuum vapour deposited case 2183 electrically conductive layer. The electrically conductive lacquer may contain substances that make electrical conductivity possible and lacquer substrates, solvents etc. The electric-ally conductive lacquer may also be solvent free. The electrical conductivity in lacquers may be achieved by inorganic compounds such as metals or semiconductors e.g.
metal powders or dusts in particular silver coated platelet shaped nickel, powders of nickel, iron copper silver etc. or by carbon e.g. in the form of soot, coke and preferably graphite or by oxide mixtures.
Preferred as conductive strips in the present invention are those containing an Si02/Sb203 hydroxide mixture on a mica substrate. Usefully the thickness of the layer of Si02/Sb203 hydroxide mixture on the mica particles is 8 to 20 nanometre advantageously 16 to 20 manometers. The Si02/Sb203 hydroxide mixture on the mica particles represents a conduct-ive pigment on the mica particles. The Sn/Sb ratio amounts to 95:5 to 75:25, a ratio of 85: 15 being preferred. The grain size of the mica may e.g. be from 10 to 100 Vim, usefully the grain size of the mica is less than 15 pm. In order that the desired conductive strips can be produced from the electrically conductive pigment, the said pigment must usefully be brought into the form of a lacquer. A lacquer may contain the electrically conductive pigment e.g. the Si02/Sb203 hydroxide mixture on the mica substrate and a binder. Binders that may be employed in such lacquers are e.g. melamine resins, acryl-melamine resins, polyurethane lacquers, nitrocellulose lacquers, acryl-nitrocellulose lacquers etc. The fract-ion of binder in the lacquer may be e.g. from 10 to 60 wt.%, advantageously from 10 to 25 wt.%. Correspondingly, the fraction of electrically conductive pigment in the lacquer may be 40 to 90 wt.%, advantageously 75 to 90wt.%.
Apart from the electrically conductive pigment use may be made of a filler such as Ti02, for example with a grain size equal to or less than 15 ~,m and in a ratio of electrically conductive pigment to filler of 1:1, or fillers in the form of porous spherical particles with a grain size larger than 30 p,m, known under the trade name of LiChrospher by Merck, the ratio of electrically conductive pigment to filler being 1:1.
Lacquers used to create conductive strips may be deposited on the substrate material by brushing, spraying etc. if desired using a mask, or by printing using offset, intaglio, relief or screen printing etc. Further methods for producing electrically conductive strips on the sub-strate material are electrostatic methods, methods using image etching principles, photo-chemical reproduction methods or photochemical printing methods such as e.g. by deposit-ing a fully covering lacquer layer, fixing the conductive strip pattern and dissolving the unrequired areas of lacquer. Other methods for creating conductive strips is to produce layers by vaporisation e.g. in vacuum (chemical vapour deposition, physical vapour case 2183 deposition, sputtering). The structuring of vapour deposited electrically conductive layers may be performed e.g. in a step prior to vapour deposition in which a layer is deposited locally and either prevents the adhesion of the electrically conductive layer or prevents the condensation of the vapour. Layers deposited as anti-bonding or anti-condensation layers are e.g. silicone oils deposited in vacuum. A vapour deposited layer may also be masked after deposition and then structure by etching processes. Structuring is also possible by local vapour deposition of the layer using laser or electron beams. A further form of struc-turing the vapour deposited electrically conductive layer is using a process in which a lacquer that dissolves in a solvent is deposited on the substrate, using e.g.
an intaglio, relief or screen printing method, prior to the vapour deposition process. After vapour deposition onto the lacquer coated substrate, the lacquer is removed using a solvent. The vapour deposited layer is of course also removed with the lacquer. The vapour deposited layer remains on the non-lacquered areas of the substrate thus providing the desired pattern of conductive strips.
Apart from the desired pattern of conductive strip or strips on the label, recognition and distance marks or circuits for application of the labels on the blister pack may be provided.
Apart from the conductive strips, it is also possible to provide circuits on the substrate material which contain information for the computer that can be evaluated e.g.
information concerning the contents of the pack, composition, dosage of the product, cycle in which the medicament is to be taken, expiry date etc.
The conductive strips may be laid in series or parallel over the recesses and, correspond-ingly, a conductive strip may be laid over all recesses, or one conductive strip may be laid over one or more series of recesses, or each recess may be covered by a single conductive strip and each conductive strip exhibits its own connection to the computer.
These con-ductive strips may communicate its information to the computer by way of a connection.
On the basis of the information from an interrupted conductive strip the computer may start up a time-interval programme that is pre-programmed in the computer or is initiated by a circuit on the label and shows the correct time to take the next tablet and the prescribed times according to the programme. The time at which the tablet was removed can also be registered by the computer and, based on that information the computer can determine the next time a tablet has to be taken and transmit this information via a signal generator. The details of the time of removal may be communicated by way of various commands such as a display showing the time, by coloured light diodes, acoustically by means of a warning signal and the like or by means of a combination of control commands.
case 2183 If each recess is covered by a conductive strip, the computer is able to determine whether the pack is still intact or, on the basis of the conductive strips that have been interrupted due to removal of medicament, it can calculate the situation regarding medication and from that continue with the appropriate interval of dispensing.
The conductive strips may be situated at least at one place on the medicinal packaging i.e.
grouped and arranged such that the computer makes contact there. This site may also be designated as the contact point for the computer. The conductive strips may also close flush with the medicinal pack at least on one side, or they may project over at least one side of the pack, and at this side the conductive strips may be led together i.e. grouped together in such a way that the computer can be locked onto the pack and/or to the label and the conductive strips and the computer contacts are able to make contact there.
The conductive strips in question may also be used on the lidding material for closing or covering over a part of the base for packaging small parts. For example, small parts of a technical nature may be placed in blister packs and the blister packs covered over with a lidding material with conductive strips. On removing individual small parts the conductive strip in the label is interrupted and a security system for unauthorised removal may be activated or, the impulse may be conducted to a computer for storage inventory purposes or the like.
By way of example figures 1 and 2 explain the present invention in greater detail. Figure 1 shows a plan view of a medicinal pack. Figure 2 shows a plan view of another arrangement of conductive strips on a lidding foil.
Figure 1 shows the plan view of a medicinal pack such as a blister pack 1 with recesses 2.
A computer 5 is connected to the blister pack 1 by inserting, clamping, locking, snap fitting or other means of contact. Using a slide 4 the clamping connection for example can be activ-ated and the conductive strips 3 terminating at the side-on edge 9 of the blister pack 1 are brought into contact with corresponding contacts in the computer.
The resistance of each conductive strip according to the present invention is measured between the measuring points which are defined by the contact points for the computer.
In the present example these contact points lie at the side-on edge 9. The computer 5 contains a clock function and represents a store for the changes in the measured overall resistance.
The computer 5 features e.g. a time display 6 and - as signal generator - e.g.
a display for the time to take the next dose of medicament and/or a generator for an acoustic signal. By means of light diodes 7 the process of reminding the patient may be effected or optically case 2183 reinforced. The computer 5 and with that the signal generator can be used several times and can for example be set to zero again by means of a button 8. The conductive strips 3 are situated on the lidding material 10. The connecting points for the computer 5 are provided at the edge 9. The conductive strips 3 on the lidding material 10 lie exactly over the recesses 2 in the blister pack 1. Each recess 2 is covered over by a conductive strip 3.
As a result, when a medicament is removed and thereby an interruption made in the conductive strip 3, an impulse can be emitted to the computer 5 or on the basis of the impulses from one, simultaneously a plurality, or all of the conductive strips, the computer 5 can recognise that the medicament has been removed , is due or overdue. The computer is arranged such that the contacts along the edge 9 of the blister pack 1 can be removed.
Figure 2 shows the plan view of a blister pack 1. In that figure the connectable computer is not shown. The blister pack 1 is closed off by a lidding foil 10. The recesses 2 are indicated by circles. A conductive strip 3 is situated over each recess 2. The connecting points 11 for the computer are provided at the edge 9 of the lidding material 10. The conductive strip 3 may be applied e.g. by a printing method. For that reason the conductor strip can have the same thickness over the whole of the lidding foil 10. In order to reach the overall resistance according to the invention, the conductive strips 3 are grouped together in the common broad section 13 and are divided up in narrow sections 14. The narrow sections 14 run over the recesses 2 as conductive strips 3. The resistance in the broad sections 13 is small compared with that of the narrow strips 14. In order to increase or control the resistance of a narrow section 14, the narrow section 14 may be increased in length by means of a loop shape. The narrow sections 14 exhibit a high resistance and on breaking through such a narrow strip 14 when removing a tablet from a recess 2 by pushing through the lidding foil 10, a large change in resistance or impulse is communicated to the computer (not shown) via the contact points 11 and definitely recognised by the computer.
case 2183
Claims (3)
1. Lidding foil (10) with conductive strips (3) for medicinal packaging (1) that can be connected to a computer (5), where the medicinal packaging (1) contains a plurality of recesses (2) which are filled with contents and at least one conductive strip (3) lies over each recess characterised in that the overall electrical resistivity, in the case of one or a plurality of intact conductive strips (3), is from 100 to 100,000 .OMEGA. (Ohm) measured between the measuring points which are defined by the points of contact of the computer (5).
2. Lidding foil according to claim 1, characterised in that the minimum overall electrical resistance amounts to 200 .OMEGA. (Ohm), preferably 2000 .OMEGA.
(Ohm), especially preferably 10,000 .OMEGA. (Ohm) and in particular 20,000 .OMEGA. (Ohm).
(Ohm), especially preferably 10,000 .OMEGA. (Ohm) and in particular 20,000 .OMEGA. (Ohm).
3. Lidding foil according to claim 1, characterised in that the maximum overall electrical resistance amounts to 80.000 .OMEGA. (Ohm), preferably 70,000 .OMEGA. (Ohm), especially preferably 60,000 .OMEGA. (Ohm) and in particular 50,000 .OMEGA.
(Ohm).
(Ohm).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH118198 | 1998-05-29 | ||
| CH19981181/98 | 1998-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2272017A1 true CA2272017A1 (en) | 1999-11-29 |
Family
ID=4204400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2272017 Abandoned CA2272017A1 (en) | 1998-05-29 | 1999-05-11 | Lidding foil with conductive strips |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0972507A1 (en) |
| CA (1) | CA2272017A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7466230B2 (en) | 2003-07-28 | 2008-12-16 | Hueck Folien Gesellschaft M.B.H. | Device for the storage of solid and/or liquid and/or gaseous objects |
| US10479007B2 (en) | 2017-03-17 | 2019-11-19 | Rehrig Pacific Company | Injection molded component and method of injection molding |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2404805A1 (en) * | 2002-09-24 | 2004-03-24 | Allan Wilson | Analog packaging device and content use monitoring system |
| WO2006002667A1 (en) * | 2004-06-30 | 2006-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Blister packaging |
| EP2113235A1 (en) | 2008-04-28 | 2009-11-04 | Alcan Technology & Management AG | Lid and seal foil for an item of packaging and method for determining the opening state of an item of packaging |
| EP2113236A1 (en) | 2008-04-28 | 2009-11-04 | Alcan Technology & Management Ltd. | Lid and/or seal foil for an item of packaging and method for determining the opening state of an item of packaging |
| FR3007835B1 (en) * | 2013-06-28 | 2015-06-19 | Commissariat Energie Atomique | MEMBRANE AND SYSTEM FOR MONITORING OPENING OF THE MEMBRANE |
| AU2015253309B2 (en) | 2014-04-28 | 2021-02-25 | The Regents Of The University Of California | Unobtrusive wireless electronic systems for monitoring and facilitating patient compliance |
| DE102017214267A1 (en) * | 2017-08-16 | 2019-02-21 | Mahle International Gmbh | Cooling device and method of manufacturing the cooling device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4616316A (en) * | 1982-07-01 | 1986-10-07 | The United States Of America As Represented By The Administrator Of Veterans Affairs | Medication compliance monitoring device having conductive traces upon a frangible backing of a medication compartment |
| ATE40790T1 (en) | 1983-06-25 | 1989-03-15 | Udo Simon | MEDICATION CONTAINER. |
| US5313439A (en) * | 1992-07-17 | 1994-05-17 | Dan Albeck | Timer device for medications |
| EP0796605A1 (en) | 1996-03-21 | 1997-09-24 | Alusuisse Technology & Management AG | Lid foil with conductor tracks |
-
1999
- 1999-05-11 CA CA 2272017 patent/CA2272017A1/en not_active Abandoned
- 1999-05-19 EP EP99810435A patent/EP0972507A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7466230B2 (en) | 2003-07-28 | 2008-12-16 | Hueck Folien Gesellschaft M.B.H. | Device for the storage of solid and/or liquid and/or gaseous objects |
| US10479007B2 (en) | 2017-03-17 | 2019-11-19 | Rehrig Pacific Company | Injection molded component and method of injection molding |
| US11254035B2 (en) | 2017-03-17 | 2022-02-22 | Rehrig Pacific Company | Injection molded component and method of injection molding |
| US11766815B2 (en) | 2017-03-17 | 2023-09-26 | Rehrig Pacific Company | Injection molded component and method of injection molding |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0972507A1 (en) | 2000-01-19 |
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