CA2268479A1 - Metalized paperboard - Google Patents

Metalized paperboard Download PDF

Info

Publication number
CA2268479A1
CA2268479A1 CA 2268479 CA2268479A CA2268479A1 CA 2268479 A1 CA2268479 A1 CA 2268479A1 CA 2268479 CA2268479 CA 2268479 CA 2268479 A CA2268479 A CA 2268479A CA 2268479 A1 CA2268479 A1 CA 2268479A1
Authority
CA
Canada
Prior art keywords
winding
cardboard
reactance
cross
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2268479
Other languages
French (fr)
Inventor
Vladimir G Kuznetsov
Anthony H Hoevenaars
Igor V Volkov
Michael I Levin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LES INDUSTRIES ALUBEC Inc
Original Assignee
LES INDUSTRIES ALUBEC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LES INDUSTRIES ALUBEC Inc filed Critical LES INDUSTRIES ALUBEC Inc
Priority to CA 2268479 priority Critical patent/CA2268479A1/en
Publication of CA2268479A1 publication Critical patent/CA2268479A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/02—Metal coatings
    • D21H19/08—Metal coatings applied as vapour, e.g. in vacuum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A harmonic mitigating device connected between the power distribution system and the load provides a flux shifting multiple-winding reactor with a capacitor bank connected between the reactor windings. At least one line winding is oriented in a first polarity on a core, and at least one compensating winding oriented in the opposite polarity on the core and connected between the output of the first winding and the load. The opposing fluxes generated by the line winding and the compensating winding cancel and thus reduce the through-reactance of the device between the load and the power supply. The input of a cross-link circuit comprising a capacitor is connected between the line winding and the compensating winding. The reactance through the cross-link circuit to the neutral (or another phase) is lower than the reactance through the line winding. Harmonic currents thus flow through the cross-link circuit, and are largely prevented from penetrating the power distribution system.

Description

CARTON MÉTALLISÉ
La présente invention à trait à une méthode de fabrication de carton métallisé.
La fabrication d'un carton métallisé présente certains problèmes techniques. La simple métallisation d'un carton ordinaire est susceptible de produire un carton mou, affaissé et/ou rugueux, de qualité médiocre et peu pratique.
La présente invention vise à fournir une méthode de fabrication de carton métallisé dont les qualités en font un matériau convenant à une multitude d'applications.
Selon l'invention, le carton subit divers traitements avant l'obtention du produit final. De plus, à la base, le carton doit avoir un niveau d'humidité
restreint.
La première étape du traitement consiste à appliquer des enduits sur le carton, avant sa métallisation. Les enduits recommandés sont des laques à
base' d'eau qui sèchent rapidement à des températures spécifiques. Les enduits permettent de couvrir les imperfections du carton pour obtenir en bout de ligne une métallisation des plus brillante.
La deuxième étape du traitement consiste à métalliser le carton. De préférence, la métallisation est effectuée par un procédé de dépôt sous vide d'aluminium, par effet joule.
La troisième étape du traitement consiste à appliquer un vernis d'accrochage sur le carton métallisé, afin de le rendre imprimable. Le vernis utilisé à cet effet est de préférence à base d'eau.
La quatrième étape du traitement consiste à réhumidifier le carton pour pouvoir le remettre dans son état initial. La réhumidification est appliquée à
une température prédéfinie avec des adjuvants spéciaux pour permettre une bonne répartition régulière de l'humidité à travers le carton.
Par l'entremise du traitement décrit précédemment, le carton est réhumidifié après le procédé de métallisation sous vide où la majeure partie du contenu en humidité est retirée et doit être renouvelée. Par conséquent, le pourcentage d'humidité du carton est rétabli, permettant ainsi au substrat de recouvrer son équilibre naturel.
Bien qu'une réalisation de l'invention a été décrite ci-dessus, il apparaîtra évident pour les personnes versées dans l'art que des changements et des modifications peuvent être apportés à cette réalisation sans s'écarter de l'essence de l'invention. METALLIC CARDBOARD
The present invention relates to a method of manufacturing cardboard metallic.
The production of metallized cardboard presents certain problems techniques. The simple metallization of ordinary cardboard is likely to produce soft, sagged and / or rough cardboard of poor quality and little convenient.
The present invention aims to provide a method of manufacturing metallic cardboard, the qualities of which make it a suitable material for multitude of applications.
According to the invention, the cardboard undergoes various treatments before obtaining the final product. In addition, at the base, the cardboard must have a humidity level restricted.
The first stage of treatment consists in applying coatings on the cardboard, before metallization. The recommended coatings are water-based that dries quickly at specific temperatures. The coatings allow to cover the imperfections of the cardboard to obtain of line a most brilliant metallization.
The second stage of treatment consists in metallizing the cardboard. Of preferably, the metallization is carried out by a vacuum deposition process aluminum, by joule effect.
The third stage of treatment consists in applying a varnish hanging on the metallic cardboard, in order to make it printable. The nailpolish used for this purpose is preferably water-based.
The fourth stage of treatment consists in rewetting the cardboard to be able to restore it to its original state. Rehumidification is applied to a predefined temperature with special additives to allow a good even distribution of moisture through the cardboard.
Through the processing described above, the cardboard is rewetted after the vacuum metallization process where most of moisture content is removed and must be renewed. Therefore, the moisture content of the cardboard is restored, allowing the substrate to regain its natural balance.
Although an embodiment of the invention has been described above, it will appear obvious to those skilled in the art that changes and modifications can be made to this realization without deviating of the essence of the invention.

CA 2268479 1999-04-20 1999-04-20 Metalized paperboard Abandoned CA2268479A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA 2268479 CA2268479A1 (en) 1999-04-20 1999-04-20 Metalized paperboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2268479 CA2268479A1 (en) 1999-04-20 1999-04-20 Metalized paperboard

Publications (1)

Publication Number Publication Date
CA2268479A1 true CA2268479A1 (en) 2000-10-20

Family

ID=29588726

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2268479 Abandoned CA2268479A1 (en) 1999-04-20 1999-04-20 Metalized paperboard

Country Status (1)

Country Link
CA (1) CA2268479A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102304870A (en) * 2011-06-29 2012-01-04 上海维凯化学品有限公司 Process for producing aluminized paper by using aluminum foil as transfer base material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102304870A (en) * 2011-06-29 2012-01-04 上海维凯化学品有限公司 Process for producing aluminized paper by using aluminum foil as transfer base material

Similar Documents

Publication Publication Date Title
US6570256B2 (en) Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
AU2020597A (en) Coating substrate
MY123962A (en) Tunable and removable plasma deposited antireflective coatings
JPS56156762A (en) Precipitation depositing method of hard metal coating , target therefor and hard metal coated decorative segment
DE69425255T2 (en) THIN LAYER OF Cu (In, Ga) Se 2 WITH IMPROVED QUALITY THROUGH VAPOR PHASE RECRISTALLIZATION FOR SEMICONDUCTOR DEVICES
CA2311494A1 (en) Modification of surfaces in order to increase surface tension
KR970030381A (en) Improved method for forming aluminum contacts
CA2268479A1 (en) Metalized paperboard
Li et al. Influence of pressure on the properties of AlN deposited by DC reactive magnetron sputtering on Si (100) substrate
FR2611402A1 (en) COMPOSITE RESISTANCE AND MANUFACTURING METHOD THEREOF
Fu et al. Single films and heat mirrors produced by plasma ion assisted deposition
DE3631758A1 (en) METHOD FOR PRODUCING THICK TUNGSTEN FILMS ON SUBSTRATES
KR900702075A (en) Photochemical Deposition of High Purity Gold Thin Films
Zhigunov et al. Effect of thermal annealing on structure and photoluminescence properties of silicon-rich silicon oxides
Razina Thermochromism of the semiconductor film system Pb-Se
FR2663806A1 (en) Plasma reactor of the triode type, usable in particular for etching, deposition or cleaning of surfaces
Alay et al. Optical properties of plasmonic metal nanoparticles on GaN surface
GB2079323A (en) Nitrogen-containing nickel coatings for solar collectors
KR960008148B1 (en) Green gold alloy coating and method therefor
Damour Sur l'algébricité des applications holomorphes
JPS61127863A (en) External parts
EP0095402A1 (en) Method and alloy for the hot dip galvanizing of silicon steel, and galvanized articles
JPH0730676Y2 (en) Gold exterior parts
JPS6217170A (en) Formation of black film by pvd method
KR970018038A (en) Wiring Formation Method for Highly Integrated Semiconductor Devices

Legal Events

Date Code Title Description
FZDE Dead