CA2259910C - Extraction de matiere par application d'un rayonnement suivant un angle oblique - Google Patents

Extraction de matiere par application d'un rayonnement suivant un angle oblique Download PDF

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Publication number
CA2259910C
CA2259910C CA002259910A CA2259910A CA2259910C CA 2259910 C CA2259910 C CA 2259910C CA 002259910 A CA002259910 A CA 002259910A CA 2259910 A CA2259910 A CA 2259910A CA 2259910 C CA2259910 C CA 2259910C
Authority
CA
Canada
Prior art keywords
substrate
treatment surface
radiation
gas
undesired material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002259910A
Other languages
English (en)
Other versions
CA2259910A1 (fr
Inventor
Audrey C. Engelsberg
Andrew W. Johnson
William P. Parker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cauldron LP
Original Assignee
Cauldron LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/686,523 external-priority patent/US5800625A/en
Application filed by Cauldron LP filed Critical Cauldron LP
Publication of CA2259910A1 publication Critical patent/CA2259910A1/fr
Application granted granted Critical
Publication of CA2259910C publication Critical patent/CA2259910C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Cette invention se rapporte à un appareil (10) et à un procédé d'extraction de matière indésirable de la surface d'un substrat (12). Ledit procédé consiste à amener un courant (18) de gaz inerte à la surface du substrat comportant la matière indésirable tout en irradiant (11) ladite matière indésirable avec des photons énergétiques suivant une direction formant un angle (8) oblique avec le substrat (12). Cette invention permet d'extraire la matière indésirable sans modifier les caractéristiques physiques de la matière sous-jacente ou adjacente à ladite matière indésirable. Dans certains cas, l'incidence non perpendiculaire permet une extraction efficace là où une incidence perpendiculaire endommageait le substrat et/ou ne permettait qu'une extraction faible de matière indésirable.
CA002259910A 1996-07-26 1997-07-22 Extraction de matiere par application d'un rayonnement suivant un angle oblique Expired - Fee Related CA2259910C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/686,523 US5800625A (en) 1996-07-26 1996-07-26 Removal of material by radiation applied at an oblique angle
US08/686,523 1996-07-26
PCT/US1997/013317 WO1998004366A1 (fr) 1996-07-26 1997-07-22 Extraction de matiere par application d'un rayonnement suivant un angle oblique

Publications (2)

Publication Number Publication Date
CA2259910A1 CA2259910A1 (fr) 1998-02-05
CA2259910C true CA2259910C (fr) 2006-10-10

Family

ID=37114332

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002259910A Expired - Fee Related CA2259910C (fr) 1996-07-26 1997-07-22 Extraction de matiere par application d'un rayonnement suivant un angle oblique

Country Status (1)

Country Link
CA (1) CA2259910C (fr)

Also Published As

Publication number Publication date
CA2259910A1 (fr) 1998-02-05

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