CA2245817A1 - Arrangement made up of an electrical circuit board and an electrical pressure transducer - Google Patents

Arrangement made up of an electrical circuit board and an electrical pressure transducer

Info

Publication number
CA2245817A1
CA2245817A1 CA002245817A CA2245817A CA2245817A1 CA 2245817 A1 CA2245817 A1 CA 2245817A1 CA 002245817 A CA002245817 A CA 002245817A CA 2245817 A CA2245817 A CA 2245817A CA 2245817 A1 CA2245817 A1 CA 2245817A1
Authority
CA
Canada
Prior art keywords
electrical
circuit board
pressure transducer
housing
arrangement made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002245817A
Other languages
French (fr)
Other versions
CA2245817C (en
Inventor
Norbert Normann
Andreas Kuhnle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BorgWarner Ludwigsburg GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2245817A1 publication Critical patent/CA2245817A1/en
Application granted granted Critical
Publication of CA2245817C publication Critical patent/CA2245817C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609—Pressure pulsation damping arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

An arrangement made up of an electrical circuit board (7) and an electrical pressure transducer (1) which has, in a housing (2), a pressure sensor onto which the pressure to be measured is transferred by means of a fluid through a channel (5) leading into the housing (2), and from which there proceed electrical lines which project out of the housing (2) as leads (4) and are connected to the circuit board (7). The channel (5) is shielded on the outer side of the housing (2) so that the flow resistance for fluid entering and leaving the channel (5) increases.
CA002245817A 1996-02-16 1997-02-15 Arrangement made up of an electrical circuit board and an electrical pressure transducer Expired - Fee Related CA2245817C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19605795.7 1996-02-16
DE19605795A DE19605795A1 (en) 1996-02-16 1996-02-16 Arrangement of an electrical circuit board and an electrical pressure sensor
PCT/EP1997/000724 WO1997030334A1 (en) 1996-02-16 1997-02-15 Arrangement comprising an electrical printed-circuit board and an electrical pressure pick-up

Publications (2)

Publication Number Publication Date
CA2245817A1 true CA2245817A1 (en) 1997-08-21
CA2245817C CA2245817C (en) 2005-09-20

Family

ID=7785605

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002245817A Expired - Fee Related CA2245817C (en) 1996-02-16 1997-02-15 Arrangement made up of an electrical circuit board and an electrical pressure transducer

Country Status (6)

Country Link
US (1) US6155119A (en)
EP (1) EP0880687B1 (en)
CA (1) CA2245817C (en)
DE (2) DE19605795A1 (en)
ES (1) ES2147979T3 (en)
WO (1) WO1997030334A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6161430A (en) * 1998-10-16 2000-12-19 Bridgestone/Firestone Research Inc. Device to encapsulate a substrate containing sensitive electronic components and a pressure sensor pack
EP3978888A3 (en) * 2021-11-24 2022-06-15 Melexis Technologies NV Pressure sensor module apparatus and method of manufacturing the same

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1311270B1 (en) * 1999-12-22 2002-03-12 Bitron Spa PRESSURE DETECTOR DEVICE, PARTICULARLY FOR AN AIR CONDITIONING SYSTEM.
DE10022124B4 (en) * 2000-05-06 2010-01-14 Wabco Gmbh Electronic control unit
US8266465B2 (en) 2000-07-26 2012-09-11 Bridgestone Americas Tire Operation, LLC System for conserving battery life in a battery operated device
US7161476B2 (en) 2000-07-26 2007-01-09 Bridgestone Firestone North American Tire, Llc Electronic tire management system
US6739042B2 (en) 2000-12-15 2004-05-25 Siemens Vdo Automotive Corporation Method for assembling a mechatronics sensor
US6441503B1 (en) * 2001-01-03 2002-08-27 Amkor Technology, Inc. Bond wire pressure sensor die package
US6420967B1 (en) 2001-01-31 2002-07-16 Lear Corporation System and method for shared vehicle tire pressure monitoring, remote keyless entry, and vehicle immobilization
GB0302271D0 (en) * 2003-01-31 2003-03-05 Melexis Nv Integrated pressure and acceleration measurement device and a method of manufacture thereof
JP3846437B2 (en) * 2003-03-17 2006-11-15 株式会社日立製作所 Automotive control unit
JP2004309212A (en) * 2003-04-03 2004-11-04 Denso Corp Pressure sensor, and suction system pressure measuring apparatus
GB0315489D0 (en) * 2003-07-02 2003-08-06 Melexis Nv Pressure sensor
US7028541B2 (en) * 2003-11-04 2006-04-18 Lear Corporation Tire pressure sensing component for detecting air pressure and related method
US7518495B2 (en) 2003-11-18 2009-04-14 Lear Corporation Universal tire pressure monitor
JP2007078461A (en) * 2005-09-13 2007-03-29 Denso Corp Pressure sensor
KR101552264B1 (en) 2007-07-03 2015-09-09 컨티넨탈 오토모티브 시스템즈 인코포레이티드 Universal tire pressure monitoring sensor
DE102008004358A1 (en) 2008-01-15 2009-07-16 Robert Bosch Gmbh Pressure compensation unit
DE102008017871B4 (en) * 2008-04-09 2014-09-25 Hella Kgaa Hueck & Co. Pressure sensor module and method for its production
US20110079085A1 (en) * 2009-10-06 2011-04-07 Robert John Kanda Integrated fluid pressure sensor system
US8751092B2 (en) 2011-01-13 2014-06-10 Continental Automotive Systems, Inc. Protocol protection
US9322600B2 (en) 2011-03-17 2016-04-26 Olive Tree Patents 1 Llc Thermosyphon heat recovery
CN103826879B (en) 2011-08-09 2017-10-10 大陆汽车系统公司 Apparatus and method for transmitting tire pressure signal
US9676238B2 (en) 2011-08-09 2017-06-13 Continental Automotive Systems, Inc. Tire pressure monitor system apparatus and method
US8502655B2 (en) 2011-08-09 2013-08-06 Continental Automotive Systems, Inc. Protocol misinterpretation avoidance apparatus and method for a tire pressure monitoring system
CN103874592B (en) 2011-08-09 2018-01-30 大陆汽车系统公司 For the apparatus and method for the position fixing process for activating tire pressure monitor
EP2741928B1 (en) 2011-08-09 2019-10-09 Continental Automotive Systems, Inc. Tire pressure monitoring apparatus and method
US9446636B2 (en) 2014-02-26 2016-09-20 Continental Automotive Systems, Inc. Pressure check tool and method of operating the same
DE102014223984A1 (en) 2014-11-25 2016-05-25 Robert Bosch Gmbh Freeze-resistant pressure sensor arrangement, in particular as differential pressure sensor arrangement for diesel particulate filter
US9517664B2 (en) 2015-02-20 2016-12-13 Continental Automotive Systems, Inc. RF transmission method and apparatus in a tire pressure monitoring system
DE102016213290A1 (en) 2015-08-03 2017-02-09 Continental Automotive Systems, Inc. Apparatus, system and method for configuring a tire information sensor with a transmission protocol based on vehicle trigger characteristics
KR101871896B1 (en) * 2016-12-02 2018-07-03 인팩일렉스 주식회사 Tire sensor and manufacturing method thereof
DE102016124270A1 (en) * 2016-12-13 2018-06-14 Infineon Technologies Ag SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
JP6838461B2 (en) * 2017-03-30 2021-03-03 日本電産トーソク株式会社 Hydraulic sensor mounting structure

Family Cites Families (14)

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JPS5817421B2 (en) * 1979-02-02 1983-04-07 日産自動車株式会社 semiconductor pressure sensor
DE3028657A1 (en) * 1980-07-29 1982-02-11 Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen HYDRAULIC FILTER FOR FILTERING SLOW PRESSURE VARIATIONS
US4413524A (en) * 1982-03-26 1983-11-08 Dresser Industries, Inc. Pulsation throttling device for a pressure gauge
DE3337978A1 (en) * 1983-10-19 1985-05-15 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5000 Köln DEVICE FOR MEASURING PRESSURES AND PRESSURE TIMES
DE3713236A1 (en) * 1987-04-18 1988-11-03 Parker Ermeto Gmbh DEVICE FOR MEASURING PRESSURES
JPH0812123B2 (en) * 1987-11-27 1996-02-07 日本碍子株式会社 Pressure sensor
US5125275A (en) * 1991-06-19 1992-06-30 Honeywell Inc. Pressure sensor package
DE4133061A1 (en) * 1991-10-04 1993-04-15 Bosch Gmbh Robert PRESSURE SENSOR
JPH06207870A (en) * 1993-01-11 1994-07-26 Mitsubishi Electric Corp Semiconductor pressure sensor
FR2705781B1 (en) * 1993-05-25 1995-08-25 Schlumberger Services Petrol Membrane pressure sensor comprising an anti-shock protection system, and gradiomanometer incorporating such a sensor.
DE4334123C2 (en) * 1993-10-07 2002-12-19 Bosch Gmbh Robert pressure sensor
CA2145696A1 (en) * 1994-04-15 1995-10-16 Michael F. Mattes Pressure sensor assembly and method of producing the pressure sensor assembly
US5708411A (en) * 1995-09-25 1998-01-13 D H Products, Llc Tire monitoring system, device and method
US5557049A (en) * 1995-11-09 1996-09-17 Mercury Enterprises, Inc. Disposable manometer for use with a CPR bag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6161430A (en) * 1998-10-16 2000-12-19 Bridgestone/Firestone Research Inc. Device to encapsulate a substrate containing sensitive electronic components and a pressure sensor pack
US6386254B1 (en) 1998-10-16 2002-05-14 Bridgestone/Firestone Research, Inc. Device to encapsulate a substrate containing sensitive electronic components and a pressure sensor pack
EP3978888A3 (en) * 2021-11-24 2022-06-15 Melexis Technologies NV Pressure sensor module apparatus and method of manufacturing the same

Also Published As

Publication number Publication date
DE19605795A1 (en) 1997-08-21
CA2245817C (en) 2005-09-20
WO1997030334A1 (en) 1997-08-21
ES2147979T3 (en) 2000-10-01
DE59701575D1 (en) 2000-06-08
EP0880687B1 (en) 2000-05-03
EP0880687A1 (en) 1998-12-02
US6155119A (en) 2000-12-05

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20170215