CA2212901C - Polish composition - Google Patents
Polish composition Download PDFInfo
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- CA2212901C CA2212901C CA002212901A CA2212901A CA2212901C CA 2212901 C CA2212901 C CA 2212901C CA 002212901 A CA002212901 A CA 002212901A CA 2212901 A CA2212901 A CA 2212901A CA 2212901 C CA2212901 C CA 2212901C
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- Prior art keywords
- wipe
- polish composition
- weight percent
- emulsion
- water
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- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 239000000839 emulsion Substances 0.000 claims abstract description 49
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 38
- 239000003085 diluting agent Substances 0.000 claims abstract description 21
- -1 hydrocarbon radical Chemical class 0.000 claims description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 239000003995 emulsifying agent Substances 0.000 claims description 21
- 238000009835 boiling Methods 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 239000004215 Carbon black (E152) Substances 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 9
- 229930195733 hydrocarbon Natural products 0.000 claims description 9
- 239000002518 antifoaming agent Substances 0.000 claims description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007764 o/w emulsion Substances 0.000 claims description 5
- 150000003254 radicals Chemical class 0.000 claims description 5
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical group C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 4
- 239000003623 enhancer Substances 0.000 claims description 4
- OSWPMRLSEDHDFF-UHFFFAOYSA-N methyl salicylate Chemical compound COC(=O)C1=CC=CC=C1O OSWPMRLSEDHDFF-UHFFFAOYSA-N 0.000 claims description 4
- 239000002304 perfume Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000004711 α-olefin Substances 0.000 claims description 3
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical group [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 claims description 2
- 229960001047 methyl salicylate Drugs 0.000 claims description 2
- 239000012875 nonionic emulsifier Substances 0.000 claims description 2
- 230000002209 hydrophobic effect Effects 0.000 abstract description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 19
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 description 17
- 238000002156 mixing Methods 0.000 description 13
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 8
- 229960003504 silicones Drugs 0.000 description 7
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 6
- VJYAJQFKKLYARJ-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 VJYAJQFKKLYARJ-UHFFFAOYSA-N 0.000 description 6
- 239000003082 abrasive agent Substances 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 239000001993 wax Substances 0.000 description 6
- LBCZOTMMGHGTPH-UHFFFAOYSA-N 2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCO)C=C1 LBCZOTMMGHGTPH-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- QYYMDNHUJFIDDQ-UHFFFAOYSA-N 5-chloro-2-methyl-1,2-thiazol-3-one;2-methyl-1,2-thiazol-3-one Chemical compound CN1SC=CC1=O.CN1SC(Cl)=CC1=O QYYMDNHUJFIDDQ-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- SLRMQYXOBQWXCR-UHFFFAOYSA-N 2154-56-5 Chemical compound [CH2]C1=CC=CC=C1 SLRMQYXOBQWXCR-UHFFFAOYSA-N 0.000 description 1
- MTJGVAJYTOXFJH-UHFFFAOYSA-N 3-aminonaphthalene-1,5-disulfonic acid Chemical compound C1=CC=C(S(O)(=O)=O)C2=CC(N)=CC(S(O)(=O)=O)=C21 MTJGVAJYTOXFJH-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004166 Lanolin Substances 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- BFKVXNPJXXJUGQ-UHFFFAOYSA-N [CH2]CCCC Chemical compound [CH2]CCCC BFKVXNPJXXJUGQ-UHFFFAOYSA-N 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- RMRFFCXPLWYOOY-UHFFFAOYSA-N allyl radical Chemical compound [CH2]C=C RMRFFCXPLWYOOY-UHFFFAOYSA-N 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- 150000005840 aryl radicals Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 150000002194 fatty esters Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 150000005165 hydroxybenzoic acids Chemical class 0.000 description 1
- TUJKJAMUKRIRHC-UHFFFAOYSA-N hydroxyl Chemical compound [OH] TUJKJAMUKRIRHC-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229940039717 lanolin Drugs 0.000 description 1
- 235000019388 lanolin Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 235000012976 tarts Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical class CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/06—Other polishing compositions
- C09G1/14—Other polishing compositions based on non-waxy substances
- C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Detergent Compositions (AREA)
Abstract
The present invention relates to a wipe-on polish composition which contains no wax or abrasive components. The polish requires minimal effort to wipe out to a thin, glossy, streak-free, hydrophobic film. The polish is comprised of an emulsion that contains an organopolysiloxane and a volatile diluent.
Description
Docket; WS 9508 CIP
Paper No. l POLISH COMPOSTTION
Field of Invention The present invention relates to compositions useful as polishes for paint and plastic surfaces and in particular for automotive surfaces. The compositions are in the form of an emulsion and are typically comprised of a fluid organo-polysiloxane, a volatile diluent, an emulsifier and water. The compositions are easily applied and removed from paint and plastic surfaces with minimal wip-ing leaving a dust-free, streak-free, glossy finish.
Back»round of Invention Typically polish compositions used to polish automotive surfaces, espe-cially automotive paint surfaces, contain a wax and an abrasive component Application of these polish compositions require allowing the polish to dry and removing the film by buffing. US 4,398,953 discloses an improved silicone con-taining polish containing a montan wax, an emulsifier, silicone oil, amino sili-cones, finely divided abrasive, water and a volatile aliphatic hydrocarbon liquid where the hydrocarbon has an evaporation rate three to five times faster than water. The polish composition is applied to the surface of an automobile, allowed to dry to a haze and buffed off. The amount of time and effort to apply these conventional polishes has discouraged many consumers from using these products.
In addition to the effort involved in removing the dried abrasive con-taining compositions, there are other disadvantages. Paint technology has changed significantly and at present, abrasives are in many cases too aggressive and tend to scratch the paint surface. However, simply removing the abrasives from formulations is not a viable alternative. Abrasives aid in the even distri-bution of silicone film forming components thereby reducing the tendency to streak. Removing them tends to increase streaking which is not desirable from a consumer's point of view. A great deal of research has gone into developing polish compositions that are free from abrasives yet do not streak or smear.
US 4,013,475 discloses a water-in-oil double emulsion for treating hard surfaces that consists of an organic solvent, an organopolysiloxane, a water-in-oil emulsifier mixed with an oil-in-water emulsion containing wax particles dispersed throughout a continuous aqueous phase.
US 4,354,871, developed as a polish for furniture, discloses an emulsion that contains a film-former such as a silicone, wax, resin, non-drying oil and mixtures thereof, a hydrocarbon solvent having a boiling point range of from 80° to 200°C, water and an alpha-olefin having from 10 to 18 carbon atoms.
Two related patents US 4,936,914 and US 5,112,394 disclose polish com-positions requiring a combination of specific siloxane copolymers, hydrocarbon solvents having boiling point ranges between 60° and 210°C, a surfactant and water.
US 5,470,504 discloses a non-aqueous, wax free polish composition that cleans without abrasives. The composition consists of a low viscosity siloxane polymer, a surface bonding enhancer, a lower alkyl alcohol and d-limonene.
It is the object of the present invention to provide a polish composition that is easy to apply and wipes off with little or no buffing, and provides a streak free, glossy finish.
It is a further object of the present invention to provide a composition that is relatively simple to prepare.
The foregoing objects and any others that become apparent were accomplished by the discovery of a silicone confiaining wipe-on polish composi-tion that can be easily applied and requires minimal effort to wipe out to a thin, glossy, streak free, hydrophobic film. There is no need to wait for the polish to dry and no dusty residues are formed.
Summary of Invention The present invention relates to a wipe-on polish composition which contains no wax or abrasive component, containing an emulsion comprising, p, 0.25 to 20 weight percent of a fluid organopolysiloxane of the formula 3p (I~SiO~~z)n R is independently a monovalent hydrocarbon radical having from 1 to 18 carbon atoms, an hydroxyl radical or a hydrocarbonoxy radi-cal having from 1 to 18 carbon atoms, a is on average from 0.7 to 2.6 per unit of the organopolysiloxane of formula ()], and n is from 2 to 400 B. 0.6 to 30 weight percent of a volatile diluent having a boiling point of 205° to 350°C at atmospheric pressure and in which the organopolysilox-ane of formula (1] is soluble, C. 0.2 to 8 weight percent of an emulsifier, D. 30 to 96.75 weight percent water, and E. 0 to 20 weight percent of additives selected from the group consisting of:
gloss enhancers, antifoam agents, perfumes, bacteriostats and coloring agents, where the weight percent is based on the total weight of the pol ish composition. The polish composition may comprise from 100% by weight to 4% by weight of the emulsion, any remainder being water.
The fluid organopolysiloxanes of formula (1] are all corresponding silox-anes known in the art and are prepared by conventional means. The fluid organopolysiloxanes of formula (1] are characterized as having a low viscosity, which does not exceed 1,000 centistokes at 25°C. Examples where R is a hydro-carbon having from 1 to 18 carbon atoms include alkyl radicals, such as the methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, tart-butyl, n-pentyl, iso-pentyl, neo-pentyl and tart pentyl radical, hexyl radicals, such as the n-hexyl radical, heptyl radicals such as the n-heptyl radical, octyl radicals, such as the n-octyl radical and iso-octyl radicals, such as the 2,2,4-trimethylpentyl radical, nonyl radicals, such as the n-nonyl radical, decyl radicals , such as the n-decyl radical, dodecyl radicals, such as the n-dodecyl radical, and octadecyl radicals, such as the n-octadecyl radical; alkenyl radicals, such as the vinyl and the allyl radical; cycloalkyl radicals, such as cyclopentyl, cyclohexyl and cycloheptyl radicals and methylcyclohexyl radicals; aryl radicals such as the phenyl, naphthyl and anthryl and phenanthryl radical; alkaryl radicals, such as o-, m-and p-tolyl radicals, xylyl radicals and ethylphenyl radicals and arallryl radicals, such as the benzyl radical and the a- and the ~i-phenylethyl radical.
Examples where R is a hydrocarbonoxy radical having from 1 to 18 car-bon atoms include all of the above examples given for R as a hydrocarbon where the hydrocarbon is attached to a silicon atom via an oxygen atom.
Preferred organopolysiloxanes are those consisting of units of formula HORzSiO (RzSiO)n H
where R is an alkyl radical and n is from 2 to 400. It is especially preferred when R is a methyl radical.
The organopolysiloxanes (A) are prepared by methods well known to those skilled in the art General methods for preparing organopolysiloxanes are found in "Chemistry and Technology of Silicones", ch. 5 pp 190 - 245; Noll (1968).
Component (B) of the emulsion is a diluent The diluent used in the emulsion has a boiling point range at atmospheric pressure of from 205°
to 350°C. A preferred range is from 205° to 275°C. Another preferred range is from about 213°C to 275°C. If the boiling point of the diluent is less than 200°C
or greater than 350°C, a streaky film is obtained. According to the invention, the organopolysiloxane (A) must be soluble in the diluent (B). If the silicone is not soluble in the diluent, a streaky film will result Diluents suitable for use in the present invention include, but are not limited to, cyclic methylsiloxanes having more than 4 silicon atoms such as decamethylcyclopentasiloxane, having a boiling point of about 205°C, alpha olefins having 12 to 18 carbon atoms such as 1-dodecene or 1-tetradecene, where the dodecene has a boiling point of about 213°C and hydroxybenzoic acid esters such as methyl salicylate having a boiling point of 223.3°C.
The emulsifiers used in the present invention may be any type known to be useful in preparing oil-in-water type emulsions and include commercially available nonionic, anionic and cationic type emulsifiers. Examples of the non-ionic emulsifiers include, but are not limited to, polyoxyethylene nonylphenols, polyoxyethylene fatty alcohols, polyoxyethylene fatty esters and oils, polyoxy-propylene/polyoxyethylene block copolymers, sorbitan fatty esters, and lanolin derivatives. Commercially available nonionic emulsifiers include Igepal~
polyoxyethylene alkylphenols, PLURO1VIC~ polyoxypropylene/polyoxy-ethylene block copolymers and SPAN~ sorbitan fatty esters. Anionic emulsifi-ers include alkyl-aryl sulphonates, such as the ALKANOL~ type emulsifiers from DuPont, Inc. Cationic emulsifiers include high molecular weight fatty amine blends and tertiary amines such as polyoxyethylene fatty amines. The HLB of the emulsifier system should in most instances be from about 10.5 to about 14. When emulsions containing more polar compositions such as a hydroxy end-blocked dimethylpolysiloxane are prepared, an HLB of 11 is pre ferred. For emulsions containing the less polar trimethylsiloxy endblocked dimethylpolysiloxanes and HLB of 13 is preferred. In order to achieve the desired emulsion characteristics, a single emulsifier may be used, or more pref erably, a combination of emulsifiers is used. A nonionic emulsifier or mixture of nonionic emulsifiers is preferred.
Additives to improve or enhance appearance characteristics such as darkness and gloss, include silicone T-resins, organofunctional silicones such as;
aminofunctional silicone fluids, carboxylic acid functional silicones and mer-captofunctional silicones; silicone MQ resins, silicone fluids having more than 400 repeating siloxy groups, and silicone gums. The addition of these products increases the propensity of the wipe-on polish emulsion to leave streaks and is therefore not preferred.
Antifoam compositions are those known in the art and include silicones, mineral oils, fatty acids and glycerol, alcohols, esters, salts of organic acids and tributyl phosphate. Perfumes, bacteriostats such as formalin and coloring agents may also be included.
If additives are present in the wipe-on polish emulsion, the total amount should not exceed 20 weight percent of the total emulsion including the addi-tives.
The emulsions of the present invention are useful as polished for auto-motive surfaces. The compositions contain no waxes or abrasives. There is no waiting for the emulsion to dry after applying and the emulsion can be wiped out to a thin streak-free glossy filin with little effort. There is no dry film to buff out or dusty residue to remove.
The emulsions of the present invention may be made using common techniques known in the art for preparing emulsions. A typical technique involves mixing the surfactants with 19% to 27% of the water. Silicone and diluent are then added to the mixture. The remaining water is added with mixing. Any of several well known mixers may be used to effect the emulsifi-cation, e.g., Hobart~ mixer or a Turrax~ mixer. Another common technique involves mixing the surfactant, diluent and silicone fluid. An amount of water sufficient to form a dry grease is then added with mixing. The remaining water is added incrementally with mixing. Any additives are then added to the emul-sion.
Having thus described the invention, the following examples are illustra-five in nature and should not be construed as limiting the scope of the invention.
In the following examples all parts are by weight unless otherwise stated.
Igepal~ CA 887 and CA 420 are octylphenol oxethylates available from RhBne Poulenc Inc. SE 24 is a silicone containing antifoam available from Wacker Sili-cones Corp., I<athon~ CG/ICP is a bacteriostat available from Rohm d= Haas.
Example 1 Emulsion Preparation:
An emulsion (A) of an OH endblocked dimethylpolysiloxane having an OH weight percent of about 1.2% and diluent is prepared by mixing 226 parts Igepal CA 887 with 343 parts of Igepal CA 420. After mixing the two emulsifiers adding 3,431 parts of the dimethylpolysiloxane. Then adding 300 parts water with mixing to form a grease. An additional 2,561 parts water is added to form a milky white emulsion with a particle size of 292 nm.
An emulsion (B) of an OH endblocked dimethylpolysiloxane and dffuent;
is prepared by mixing 130 parts of the dimethylpolysiloxane, 21.45 parts Igepal CA 887, 32.50 parts Igepal CA 420 and 195 parts of 1-tetradecene. 56.23 parts water is added and the mixture stirred until a dry grease is formed. An addi-tional 213.53 parts water is added in 2 additions and mixed to form an oil-in-water emulsion. 0.65 parts each of a silicon antifoam, SE 24 and a bacteriostat Kathon CG/ICP are added to the emulsion with stirring. An milky white emul-lion having a particle size of 440 nm is obtained.
An emulsion (C) of an OH endblocked dimethylpolysiloxane and diluent;
is prepared by mixing 227.5 parts of the dimethylpolysiloxane, 325 parts Igepal CA 420, 21.45 parts Igepal 887 and 97.5 parts 1-tetradecene. 56.23 parts water is added and the mixttue is stirred until a dry grease if formed. An additional 213.53 parts water is added in 2 additions and mixed to form an oil-in-water emulsion 0.65 parts each of a silicon antifoam, SE24 and a bacteriostat Kathon CG/ICP are added to the emulsion with stirring. A milky white emulsion hav-ing a particle size of 298 nm is obtained.
Evaluation A 1992 Ford Lincoln Town car hood is cut up into sections about 70 cm long and 21 cm wide. The color is dark green The cut section is cleaned with anionic detergent and then rinsed thoroughly with water. .2 cc of wipe-on polish candidate prepared by adding a predetermined amount of emulsion to water with stirring, is added to one-half or one third of the hood section The polish is applied with a 4" x 6" cotton cloth. After the polish is distributed in a circular motion, the cloth is inverted and the treated area is polished. The gloss is measured, before and after application, using a Progloss'~ instrument manu-factored by Hunter Laboratories. The level of streaks are evaluated by rotating the panel in incidental sunlight. The level of streaks was judged on a 0 - 3 scale, 0 = no streaks, 3 = very streaky. The same OH endblocked dimethylpolysilox-ane is used in emulsions A, B and C.
The results are shown in Table 1.
Wi n Polish InitialPost StreakHood Emulsion% Emulsion% Water% Silicone% DiluentGloss Gloss RatinSection A 4 96 2 0 90.3 76 3 1 B 4 96 0.8 1.2 90.3 88.3 0 1 A 4 96 2 0 70.3 74.6 3 2 B 10 90 2 3 70.3 79 0 2 B 4 96 0.8 1.2 70.3 80.5 0 2 A 4 96 2 0 89 85.9 3 3 B 10 90 2 3 89 89.4 0 3 B 4 96 0.8 1.2 89 89.5 0 3 A 4 96 2 0 87.9 89.9 20 4 C 4 96 1.4 0.6 87.9 86 0 4 Example 2 The emulsions made in example 1 are evaluated on a 1992 GM red/-silver truck They are applied using a cotton terry cloth. The wipe-on polish is sprayed on both the terry cloth and the truck surface. The same streak rating system was used as in Example 1. The ease of application was evaluated by a scale of 0 -where 0 = difficult to remove and 3 = easily removed.
The results are shown in Table 2 Wipe.on Polish Emulsion% Emulsion% Water% Silicone% DiluenkStreak Ease of application Rating B 4 96 0.8 1.2 0 3 C 4 96 1.4 0.6 0 3 Example 3 Several solutions of volatile diluents and OH endblocked dimethylpoly-siloxanes are applied to hood sections described in example 1. Comparison is made to an emulsion of a solution of a diluent and an OH endblocked dimethyl-polysiloxane. They are also compared to emulsion of the OH endblocked dimethylpolysiloxane. The OH endblocked dimethylpolysiloxane used has OH
content of approximately 1.2%. Each formula contains 20% OH endblocked dimethylpolysiloxane.
The results are shown in Table 3.
X EmulsionDiluent x Silicone% DiluentStreak Rating 0% Heptane 20 80 3 0% Tetradecene20 80 2 40% (A) None 20 0 25 100% (B) Tetradecene20 30 0 Example 4 Emulsion Preparation:
An emulsion (D) of a solution consisting of an OH endblocked dimethyl-polysiloxane and octamethylcyclotetrasiloxane is prepared by mixing 37.5 part of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 parts of water. To the re-sultant viscous thixotropic mixture is added 375 part of a solution consisting of 150 parts of an OH endblocked dimethylpolysiloxane having an OH weight per-cent of about 1.2% and 225 of octamethylcyclotetrasiloxane. 246.4 part of water are added slowly. A milky white-emulsion is obtained.
An emulsion (E) of a solution consisting of an OH endblocked dimethyl-polysiloxane and heptane is prepared by mixing 37.5 parts of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 parts of water. To the resultant viscous thixo-tropic mixture is added 375 parts of a solution consisting of 150 part of an OH
endblocked dimethylpolysfloxane having an OH weight percent of about 1.2%
and 225 of heptane. 246.4 parts of water are added slowly. A milky white emulsion is obtained.
An emulsion (~ of a solution consisting of an OH endblocked dimethyl-polysiloxane and decamethylcyclopentasiloxane is prepared by mixing 37.5 part of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 part of water. To the 2i0 resultant viscous thixotropic mixture is added 375 parts of a solution consisting of 150 part of an OH endblocked dimethylpolysiloxane having an OH weight percent of about 1.2% and 225 of decamethylcyclopentasiloxane. 246.4 parts of water are added slowly. A milky white emulsion is obtained.
Four wipe-on polish compositions are evaluated for streaks in accordance to the procedure in example 1.
The results are shown in Table 4.
x EmulsionDiluent ~X SiliconeX DiluentRating Streak 100X B Tetradecene20 30 0 l00 X D D4 2p 3p 2 100X E Heptane 20 3p 100X F DS 20 3p 0,
Paper No. l POLISH COMPOSTTION
Field of Invention The present invention relates to compositions useful as polishes for paint and plastic surfaces and in particular for automotive surfaces. The compositions are in the form of an emulsion and are typically comprised of a fluid organo-polysiloxane, a volatile diluent, an emulsifier and water. The compositions are easily applied and removed from paint and plastic surfaces with minimal wip-ing leaving a dust-free, streak-free, glossy finish.
Back»round of Invention Typically polish compositions used to polish automotive surfaces, espe-cially automotive paint surfaces, contain a wax and an abrasive component Application of these polish compositions require allowing the polish to dry and removing the film by buffing. US 4,398,953 discloses an improved silicone con-taining polish containing a montan wax, an emulsifier, silicone oil, amino sili-cones, finely divided abrasive, water and a volatile aliphatic hydrocarbon liquid where the hydrocarbon has an evaporation rate three to five times faster than water. The polish composition is applied to the surface of an automobile, allowed to dry to a haze and buffed off. The amount of time and effort to apply these conventional polishes has discouraged many consumers from using these products.
In addition to the effort involved in removing the dried abrasive con-taining compositions, there are other disadvantages. Paint technology has changed significantly and at present, abrasives are in many cases too aggressive and tend to scratch the paint surface. However, simply removing the abrasives from formulations is not a viable alternative. Abrasives aid in the even distri-bution of silicone film forming components thereby reducing the tendency to streak. Removing them tends to increase streaking which is not desirable from a consumer's point of view. A great deal of research has gone into developing polish compositions that are free from abrasives yet do not streak or smear.
US 4,013,475 discloses a water-in-oil double emulsion for treating hard surfaces that consists of an organic solvent, an organopolysiloxane, a water-in-oil emulsifier mixed with an oil-in-water emulsion containing wax particles dispersed throughout a continuous aqueous phase.
US 4,354,871, developed as a polish for furniture, discloses an emulsion that contains a film-former such as a silicone, wax, resin, non-drying oil and mixtures thereof, a hydrocarbon solvent having a boiling point range of from 80° to 200°C, water and an alpha-olefin having from 10 to 18 carbon atoms.
Two related patents US 4,936,914 and US 5,112,394 disclose polish com-positions requiring a combination of specific siloxane copolymers, hydrocarbon solvents having boiling point ranges between 60° and 210°C, a surfactant and water.
US 5,470,504 discloses a non-aqueous, wax free polish composition that cleans without abrasives. The composition consists of a low viscosity siloxane polymer, a surface bonding enhancer, a lower alkyl alcohol and d-limonene.
It is the object of the present invention to provide a polish composition that is easy to apply and wipes off with little or no buffing, and provides a streak free, glossy finish.
It is a further object of the present invention to provide a composition that is relatively simple to prepare.
The foregoing objects and any others that become apparent were accomplished by the discovery of a silicone confiaining wipe-on polish composi-tion that can be easily applied and requires minimal effort to wipe out to a thin, glossy, streak free, hydrophobic film. There is no need to wait for the polish to dry and no dusty residues are formed.
Summary of Invention The present invention relates to a wipe-on polish composition which contains no wax or abrasive component, containing an emulsion comprising, p, 0.25 to 20 weight percent of a fluid organopolysiloxane of the formula 3p (I~SiO~~z)n R is independently a monovalent hydrocarbon radical having from 1 to 18 carbon atoms, an hydroxyl radical or a hydrocarbonoxy radi-cal having from 1 to 18 carbon atoms, a is on average from 0.7 to 2.6 per unit of the organopolysiloxane of formula ()], and n is from 2 to 400 B. 0.6 to 30 weight percent of a volatile diluent having a boiling point of 205° to 350°C at atmospheric pressure and in which the organopolysilox-ane of formula (1] is soluble, C. 0.2 to 8 weight percent of an emulsifier, D. 30 to 96.75 weight percent water, and E. 0 to 20 weight percent of additives selected from the group consisting of:
gloss enhancers, antifoam agents, perfumes, bacteriostats and coloring agents, where the weight percent is based on the total weight of the pol ish composition. The polish composition may comprise from 100% by weight to 4% by weight of the emulsion, any remainder being water.
The fluid organopolysiloxanes of formula (1] are all corresponding silox-anes known in the art and are prepared by conventional means. The fluid organopolysiloxanes of formula (1] are characterized as having a low viscosity, which does not exceed 1,000 centistokes at 25°C. Examples where R is a hydro-carbon having from 1 to 18 carbon atoms include alkyl radicals, such as the methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, tart-butyl, n-pentyl, iso-pentyl, neo-pentyl and tart pentyl radical, hexyl radicals, such as the n-hexyl radical, heptyl radicals such as the n-heptyl radical, octyl radicals, such as the n-octyl radical and iso-octyl radicals, such as the 2,2,4-trimethylpentyl radical, nonyl radicals, such as the n-nonyl radical, decyl radicals , such as the n-decyl radical, dodecyl radicals, such as the n-dodecyl radical, and octadecyl radicals, such as the n-octadecyl radical; alkenyl radicals, such as the vinyl and the allyl radical; cycloalkyl radicals, such as cyclopentyl, cyclohexyl and cycloheptyl radicals and methylcyclohexyl radicals; aryl radicals such as the phenyl, naphthyl and anthryl and phenanthryl radical; alkaryl radicals, such as o-, m-and p-tolyl radicals, xylyl radicals and ethylphenyl radicals and arallryl radicals, such as the benzyl radical and the a- and the ~i-phenylethyl radical.
Examples where R is a hydrocarbonoxy radical having from 1 to 18 car-bon atoms include all of the above examples given for R as a hydrocarbon where the hydrocarbon is attached to a silicon atom via an oxygen atom.
Preferred organopolysiloxanes are those consisting of units of formula HORzSiO (RzSiO)n H
where R is an alkyl radical and n is from 2 to 400. It is especially preferred when R is a methyl radical.
The organopolysiloxanes (A) are prepared by methods well known to those skilled in the art General methods for preparing organopolysiloxanes are found in "Chemistry and Technology of Silicones", ch. 5 pp 190 - 245; Noll (1968).
Component (B) of the emulsion is a diluent The diluent used in the emulsion has a boiling point range at atmospheric pressure of from 205°
to 350°C. A preferred range is from 205° to 275°C. Another preferred range is from about 213°C to 275°C. If the boiling point of the diluent is less than 200°C
or greater than 350°C, a streaky film is obtained. According to the invention, the organopolysiloxane (A) must be soluble in the diluent (B). If the silicone is not soluble in the diluent, a streaky film will result Diluents suitable for use in the present invention include, but are not limited to, cyclic methylsiloxanes having more than 4 silicon atoms such as decamethylcyclopentasiloxane, having a boiling point of about 205°C, alpha olefins having 12 to 18 carbon atoms such as 1-dodecene or 1-tetradecene, where the dodecene has a boiling point of about 213°C and hydroxybenzoic acid esters such as methyl salicylate having a boiling point of 223.3°C.
The emulsifiers used in the present invention may be any type known to be useful in preparing oil-in-water type emulsions and include commercially available nonionic, anionic and cationic type emulsifiers. Examples of the non-ionic emulsifiers include, but are not limited to, polyoxyethylene nonylphenols, polyoxyethylene fatty alcohols, polyoxyethylene fatty esters and oils, polyoxy-propylene/polyoxyethylene block copolymers, sorbitan fatty esters, and lanolin derivatives. Commercially available nonionic emulsifiers include Igepal~
polyoxyethylene alkylphenols, PLURO1VIC~ polyoxypropylene/polyoxy-ethylene block copolymers and SPAN~ sorbitan fatty esters. Anionic emulsifi-ers include alkyl-aryl sulphonates, such as the ALKANOL~ type emulsifiers from DuPont, Inc. Cationic emulsifiers include high molecular weight fatty amine blends and tertiary amines such as polyoxyethylene fatty amines. The HLB of the emulsifier system should in most instances be from about 10.5 to about 14. When emulsions containing more polar compositions such as a hydroxy end-blocked dimethylpolysiloxane are prepared, an HLB of 11 is pre ferred. For emulsions containing the less polar trimethylsiloxy endblocked dimethylpolysiloxanes and HLB of 13 is preferred. In order to achieve the desired emulsion characteristics, a single emulsifier may be used, or more pref erably, a combination of emulsifiers is used. A nonionic emulsifier or mixture of nonionic emulsifiers is preferred.
Additives to improve or enhance appearance characteristics such as darkness and gloss, include silicone T-resins, organofunctional silicones such as;
aminofunctional silicone fluids, carboxylic acid functional silicones and mer-captofunctional silicones; silicone MQ resins, silicone fluids having more than 400 repeating siloxy groups, and silicone gums. The addition of these products increases the propensity of the wipe-on polish emulsion to leave streaks and is therefore not preferred.
Antifoam compositions are those known in the art and include silicones, mineral oils, fatty acids and glycerol, alcohols, esters, salts of organic acids and tributyl phosphate. Perfumes, bacteriostats such as formalin and coloring agents may also be included.
If additives are present in the wipe-on polish emulsion, the total amount should not exceed 20 weight percent of the total emulsion including the addi-tives.
The emulsions of the present invention are useful as polished for auto-motive surfaces. The compositions contain no waxes or abrasives. There is no waiting for the emulsion to dry after applying and the emulsion can be wiped out to a thin streak-free glossy filin with little effort. There is no dry film to buff out or dusty residue to remove.
The emulsions of the present invention may be made using common techniques known in the art for preparing emulsions. A typical technique involves mixing the surfactants with 19% to 27% of the water. Silicone and diluent are then added to the mixture. The remaining water is added with mixing. Any of several well known mixers may be used to effect the emulsifi-cation, e.g., Hobart~ mixer or a Turrax~ mixer. Another common technique involves mixing the surfactant, diluent and silicone fluid. An amount of water sufficient to form a dry grease is then added with mixing. The remaining water is added incrementally with mixing. Any additives are then added to the emul-sion.
Having thus described the invention, the following examples are illustra-five in nature and should not be construed as limiting the scope of the invention.
In the following examples all parts are by weight unless otherwise stated.
Igepal~ CA 887 and CA 420 are octylphenol oxethylates available from RhBne Poulenc Inc. SE 24 is a silicone containing antifoam available from Wacker Sili-cones Corp., I<athon~ CG/ICP is a bacteriostat available from Rohm d= Haas.
Example 1 Emulsion Preparation:
An emulsion (A) of an OH endblocked dimethylpolysiloxane having an OH weight percent of about 1.2% and diluent is prepared by mixing 226 parts Igepal CA 887 with 343 parts of Igepal CA 420. After mixing the two emulsifiers adding 3,431 parts of the dimethylpolysiloxane. Then adding 300 parts water with mixing to form a grease. An additional 2,561 parts water is added to form a milky white emulsion with a particle size of 292 nm.
An emulsion (B) of an OH endblocked dimethylpolysiloxane and dffuent;
is prepared by mixing 130 parts of the dimethylpolysiloxane, 21.45 parts Igepal CA 887, 32.50 parts Igepal CA 420 and 195 parts of 1-tetradecene. 56.23 parts water is added and the mixture stirred until a dry grease is formed. An addi-tional 213.53 parts water is added in 2 additions and mixed to form an oil-in-water emulsion. 0.65 parts each of a silicon antifoam, SE 24 and a bacteriostat Kathon CG/ICP are added to the emulsion with stirring. An milky white emul-lion having a particle size of 440 nm is obtained.
An emulsion (C) of an OH endblocked dimethylpolysiloxane and diluent;
is prepared by mixing 227.5 parts of the dimethylpolysiloxane, 325 parts Igepal CA 420, 21.45 parts Igepal 887 and 97.5 parts 1-tetradecene. 56.23 parts water is added and the mixttue is stirred until a dry grease if formed. An additional 213.53 parts water is added in 2 additions and mixed to form an oil-in-water emulsion 0.65 parts each of a silicon antifoam, SE24 and a bacteriostat Kathon CG/ICP are added to the emulsion with stirring. A milky white emulsion hav-ing a particle size of 298 nm is obtained.
Evaluation A 1992 Ford Lincoln Town car hood is cut up into sections about 70 cm long and 21 cm wide. The color is dark green The cut section is cleaned with anionic detergent and then rinsed thoroughly with water. .2 cc of wipe-on polish candidate prepared by adding a predetermined amount of emulsion to water with stirring, is added to one-half or one third of the hood section The polish is applied with a 4" x 6" cotton cloth. After the polish is distributed in a circular motion, the cloth is inverted and the treated area is polished. The gloss is measured, before and after application, using a Progloss'~ instrument manu-factored by Hunter Laboratories. The level of streaks are evaluated by rotating the panel in incidental sunlight. The level of streaks was judged on a 0 - 3 scale, 0 = no streaks, 3 = very streaky. The same OH endblocked dimethylpolysilox-ane is used in emulsions A, B and C.
The results are shown in Table 1.
Wi n Polish InitialPost StreakHood Emulsion% Emulsion% Water% Silicone% DiluentGloss Gloss RatinSection A 4 96 2 0 90.3 76 3 1 B 4 96 0.8 1.2 90.3 88.3 0 1 A 4 96 2 0 70.3 74.6 3 2 B 10 90 2 3 70.3 79 0 2 B 4 96 0.8 1.2 70.3 80.5 0 2 A 4 96 2 0 89 85.9 3 3 B 10 90 2 3 89 89.4 0 3 B 4 96 0.8 1.2 89 89.5 0 3 A 4 96 2 0 87.9 89.9 20 4 C 4 96 1.4 0.6 87.9 86 0 4 Example 2 The emulsions made in example 1 are evaluated on a 1992 GM red/-silver truck They are applied using a cotton terry cloth. The wipe-on polish is sprayed on both the terry cloth and the truck surface. The same streak rating system was used as in Example 1. The ease of application was evaluated by a scale of 0 -where 0 = difficult to remove and 3 = easily removed.
The results are shown in Table 2 Wipe.on Polish Emulsion% Emulsion% Water% Silicone% DiluenkStreak Ease of application Rating B 4 96 0.8 1.2 0 3 C 4 96 1.4 0.6 0 3 Example 3 Several solutions of volatile diluents and OH endblocked dimethylpoly-siloxanes are applied to hood sections described in example 1. Comparison is made to an emulsion of a solution of a diluent and an OH endblocked dimethyl-polysiloxane. They are also compared to emulsion of the OH endblocked dimethylpolysiloxane. The OH endblocked dimethylpolysiloxane used has OH
content of approximately 1.2%. Each formula contains 20% OH endblocked dimethylpolysiloxane.
The results are shown in Table 3.
X EmulsionDiluent x Silicone% DiluentStreak Rating 0% Heptane 20 80 3 0% Tetradecene20 80 2 40% (A) None 20 0 25 100% (B) Tetradecene20 30 0 Example 4 Emulsion Preparation:
An emulsion (D) of a solution consisting of an OH endblocked dimethyl-polysiloxane and octamethylcyclotetrasiloxane is prepared by mixing 37.5 part of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 parts of water. To the re-sultant viscous thixotropic mixture is added 375 part of a solution consisting of 150 parts of an OH endblocked dimethylpolysiloxane having an OH weight per-cent of about 1.2% and 225 of octamethylcyclotetrasiloxane. 246.4 part of water are added slowly. A milky white-emulsion is obtained.
An emulsion (E) of a solution consisting of an OH endblocked dimethyl-polysiloxane and heptane is prepared by mixing 37.5 parts of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 parts of water. To the resultant viscous thixo-tropic mixture is added 375 parts of a solution consisting of 150 part of an OH
endblocked dimethylpolysfloxane having an OH weight percent of about 1.2%
and 225 of heptane. 246.4 parts of water are added slowly. A milky white emulsion is obtained.
An emulsion (~ of a solution consisting of an OH endblocked dimethyl-polysiloxane and decamethylcyclopentasiloxane is prepared by mixing 37.5 part of Igepal CA 887, 24.8 parts Igepal CA 420 and 64.9 part of water. To the 2i0 resultant viscous thixotropic mixture is added 375 parts of a solution consisting of 150 part of an OH endblocked dimethylpolysiloxane having an OH weight percent of about 1.2% and 225 of decamethylcyclopentasiloxane. 246.4 parts of water are added slowly. A milky white emulsion is obtained.
Four wipe-on polish compositions are evaluated for streaks in accordance to the procedure in example 1.
The results are shown in Table 4.
x EmulsionDiluent ~X SiliconeX DiluentRating Streak 100X B Tetradecene20 30 0 l00 X D D4 2p 3p 2 100X E Heptane 20 3p 100X F DS 20 3p 0,
Claims (12)
1. A wipe-on polish composition which contains no wax or abrasive component consisting essentially of; an oil-in-water emulsion having, (A) 0.25 to 20 weight percent of a fluid organopolysiloxane with a viscosity which does not exceed 1000 centistokes at 25°C of the formula (R a SiO4-a/2)n (I) where R is independently a monovalent hydrocarbon radical having from 1 to 18 carbon atoms, an hydroxy radical or a hydro-carbonoxy radical having from 1 to 18 carbon atoms, a is on average per unit of the organopolysiloxane of formula (1) from 0.7 to 2.6, and n is from 2 to 400, (B) 0.6 to 30 weight percent of a volatile diluent having a boiling point of about 213°C to about 350°C at atmospheric pressure and in which the organopolysiloxane of formula (I) is soluble, (C) 0.2 to 8 weight percent of an emulsifier, (D) 30 to 96.75 weight percent water, and (E) 0 to 20 weight percent of additives or mixtures of additives selected from the group consisting of: gloss enhancers, antifoam agents, perfumes, bacteriostats and coloring agents, where the weight percent of the emulsion is based on the total weight of the wipe-on polish composition.
2. A wipe-on polish composition as claimed in claim 1, wherein the fluid organopolysiloxane has the formula HOR2SiO (R2SiO)n H (II) where R is an alkyl radical, and n is from 2 to 400.
3. A wipe-on polish composition as claimed in claim 2, wherein R is a methyl radical.
4. A wipe-on polish composition as claimed in claim 1, wherein the diluent has a boiling point at atmospheric pressure of from 213°C to 275°C.
5. A wipe-on polish composition as claimed in claim 1, wherein the diluent is an alpha-olefin having 12 to 18 carbon atoms or a hydroxybenzoic acid ester.
6. A wipe-on polish composition as claimed in claim 1, where the diluent is 1-betradecene or methylsalicylate.
7. A wipe-on polish composition as claimed in claim 1, wherein the emulsifier is a nonionic emulsifier or mixture of nonionic emulsifiers.
8. A wipe-on polish composition as claimed in claim 7, wherein the emulsifier is a mixture of polyoxyethylene alkyl phenols.
9. A wipe-on polish composition which contains no wax or abrasive component, comprising, A from 0% to 96% by weight water, and B from 4% to 100% by weight of an emulsion as claimed in claim 1.
10. A wipe-on polish composition which contains no wax or abrasive component consisting essentially of; an oil-in-water emulsion having, (A) 0.25 to 20 weight percent of a fluid organopolysiloxane with a viscosity which does not exceed 1000 centistokes at 25°C of the formula (R a SiO4-a/2)n~~(I) where R is independently a monovalent hydrocarbon radical having from 1 to 18 carbon atoms, an hydroxy radical or a hydrocarbonoxy radical having from 1 to 18 carbon atoms, a is on average per unit of the organopolysiloxane of formula (I) from 0.7 to 2.6, and n is from 2 to 400, (B) 0.6 to 30 weight percent of a volatile cyclic methylsiloxane having more than 4 silicon atoms diluent having a boiling point of about 205°C to about 350°C at atmospheric pressure and in which the organopolysiloxane of formula (1) is soluble, (C) 0.2 to 8 weight percent of an emulsifier,
11 (D) 30 to 96.75 weight percent water, and (E) 0 to 20 weight percent of additives or mixtures of additives selected from the group consisting of: gloss enhancers, antifoam agents, perfumes, bacteriostats and coloring agents, where the weight percent of the emulsion is based on the total weight of the wipe-on polish composition.
11. A wipe-on polish composition of claim 10, where the diluent is decamethylcyclopentasiloxane.
11. A wipe-on polish composition of claim 10, where the diluent is decamethylcyclopentasiloxane.
12 A wipe-on polish composition which contains no wax or abrasive component, comprising;
(A) from 0% to 96% by weight water, and (B) from 4% to 100% by weight of an emulsion as claimed in claim 10.
(A) from 0% to 96% by weight water, and (B) from 4% to 100% by weight of an emulsion as claimed in claim 10.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US70327496A | 1996-08-26 | 1996-08-26 | |
| US08/703,274 | 1996-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2212901A1 CA2212901A1 (en) | 1998-02-26 |
| CA2212901C true CA2212901C (en) | 2001-03-27 |
Family
ID=24824737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002212901A Expired - Fee Related CA2212901C (en) | 1996-08-26 | 1997-08-13 | Polish composition |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5882387A (en) |
| CA (1) | CA2212901C (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9901850D0 (en) * | 1998-06-27 | 1999-03-17 | Woolard Trevor | Killing microorganisms |
| GB2338651A (en) * | 1998-06-27 | 1999-12-29 | Woollard Trevor P | Liquid polymer composition |
| US6685765B1 (en) | 2001-12-28 | 2004-02-03 | Vahid Ghodoussi | Water based protectant containing UV absorbers |
| US6669763B1 (en) | 2001-12-28 | 2003-12-30 | Vahid Ghodoussi | Water based protectant containing a reaction product of two ionic surfactants |
| US7381231B2 (en) * | 2004-01-29 | 2008-06-03 | 3M Innovative Properties Company | Finishing compositions with reduced volatile organic compounds |
| US20070213252A1 (en) * | 2006-01-27 | 2007-09-13 | Simplyclean Industries Llc, An Ohio Limited Liability Corporation | Hard surface cleaning agent |
| DE102007047907A1 (en) * | 2007-11-30 | 2009-06-04 | Wacker Chemie Ag | Aqueous dispersions of organosilicon compounds |
| US20180214908A1 (en) * | 2016-01-19 | 2018-08-02 | Wyatt B. Klingerman | Method for applying wax to a vehicle |
| US11046912B2 (en) | 2018-07-12 | 2021-06-29 | Sipka Inc. | Cleaning solution |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4874547A (en) * | 1985-04-02 | 1989-10-17 | Dow Corning Corporation | Bi-modal silicone emulsions, silicone emulsification process and emulsions therefrom |
| GB8512483D0 (en) * | 1985-05-17 | 1985-06-19 | Dow Corning Ltd | Polish compositions |
-
1997
- 1997-08-06 US US08/906,849 patent/US5882387A/en not_active Expired - Fee Related
- 1997-08-13 CA CA002212901A patent/CA2212901C/en not_active Expired - Fee Related
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| CA2212901A1 (en) | 1998-02-26 |
| US5882387A (en) | 1999-03-16 |
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