CA2202055A1 - Process to provide material connections for absorbent articles by soldering - Google Patents
Process to provide material connections for absorbent articles by solderingInfo
- Publication number
- CA2202055A1 CA2202055A1 CA2202055A CA2202055A CA2202055A1 CA 2202055 A1 CA2202055 A1 CA 2202055A1 CA 2202055 A CA2202055 A CA 2202055A CA 2202055 A CA2202055 A CA 2202055A CA 2202055 A1 CA2202055 A1 CA 2202055A1
- Authority
- CA
- Canada
- Prior art keywords
- materials
- soldering
- absorbent articles
- connections
- disposable absorbent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 5
- 230000002745 absorbent Effects 0.000 title abstract 3
- 239000002250 absorbent Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 238000005476 soldering Methods 0.000 title abstract 3
- 206010021639 Incontinence Diseases 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010924 continuous production Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Absorbent Articles And Supports Therefor (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Abstract
The present invention relates to a process for providing connections of the materials making up disposable absorbent articles. In particular baby diapers, incontinence products and sanitary napkins which are fabricated in continuous processes are beneficially held together by soldering the materials where connections of them are desired. Replacing the currenlty used technique of adhesively attaching materials by soldering materials has the benefit of having non sticky surfaces once the solder is cooled to a temperature below its solidifying temperature. This is highly desirable where the otherwise sticky surface comes into contact with the skin of users of disposable absorbent articles or could cause adhesive build up on machine parts during the manufacturing of such articles.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP94203040.4 | 1994-10-20 | ||
| EP94203040A EP0707841B2 (en) | 1994-10-20 | 1994-10-20 | Process to provide material connections for absorbent articles by soldering |
| PCT/US1995/013654 WO1996012461A1 (en) | 1994-10-20 | 1995-10-19 | Process to provide material connections for absorbent articles by soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2202055A1 true CA2202055A1 (en) | 1996-05-02 |
| CA2202055C CA2202055C (en) | 2000-08-29 |
Family
ID=29421921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2202055 Expired - Fee Related CA2202055C (en) | 1994-10-20 | 1995-10-19 | Process to provide material connections for absorbent articles by soldering |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2202055C (en) |
-
1995
- 1995-10-19 CA CA 2202055 patent/CA2202055C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2202055C (en) | 2000-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |