CA2196265C - Assembly circuit board with plug connector - Google Patents
Assembly circuit board with plug connector Download PDFInfo
- Publication number
- CA2196265C CA2196265C CA002196265A CA2196265A CA2196265C CA 2196265 C CA2196265 C CA 2196265C CA 002196265 A CA002196265 A CA 002196265A CA 2196265 A CA2196265 A CA 2196265A CA 2196265 C CA2196265 C CA 2196265C
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- multilayers
- bores
- assembly circuit
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
In order to accommodate more connections, an assembly circuit board has two multilayers secured in a stacked manner and separated by an insulating film. Each of the multilayers has a plurality of through-connecting press-in bores to receive press-in pins of plug connectors. The dual multilayer arrangement facilitates plug connectors to be concurrently mounted in mirror-image fashion on both sides of the circuit board.
Description
ASSEMBLY CIRCUIT BOARD WITH PLUG CONNECTOR --The present invention generally relates to an assembly circuit board having a plug connector operably connected thereto. More particularly, the present invention relates to an assembly circuit board which facilitates the press-fit of plug connectors on both sides.
Previously, press-fit plug connectors were essentially used only on one side on an assembly circuit board. Aa computer technology continually advances, a -demand also increases on the need to arrange more components on an assembly circuit board within a confined space. Such components must be arranged on the assembly circuit board within the capacity of the plug connectors -attached to the assembly circuit board. Unfortunately, it has been found that previous system arrangements cannot provide sufficient connections from the-assembly circuit board to other assemblies to meet the ever-increasing signal and supply demands. -In an attempt to solve this problem with known systems, the number of poles of plug connectors has been -increased. However, this solution has been found insufficient in certain-cases. Therefore, plug ' connectors have been attached to both sides of a circuit board in a surface mount, or SMD, manner. Unfortunately, the attachment of SMD-type plug connectors disadvantageously involves a heat treatment process.
Accordingly, an object of the present invention is -to provide an assembly circuit board having a plug i 219b265 connector connected fixedly with it, which can be connected with the rest of the system with a high number of poles of plug connections, without the disadvantage of requiring a heat treatment.
~m?NLARY OF THE INVENTION
According to the invention, the aforementioned object is achieved by providing an the.assembly circuit board having two multilayers with an insulating film disposed between them. The film serves for galvanic separation and also has an adhesive surfaces on both sides which bond the multilayers together. The two multilayers of the circuit board each have a terminal region which is pre-bored to receive plug connectors and is correspondingly through-contacted. Plug connectors with relatively short or shortened terminal pins can be pressed into the multilayers by inserting the pins into the respective bores, so that at least one of such connectors is connectably installable onto each of the opposite sides of the circuit board. The invention also provides a combined arrangement of the circuit board with its connectors.
In an embodiment, an assembly circuit board according to the invention includes two planar multilayers and an insulating film. The insulating film is secured between the multilayers in a stacked manner so that the multilayers define opposite planar aides of the circuit board. Each of the multilayers has a plurality of press-in bores adapted to connectably receive plug connector press-in pins from each of said opposite sides., In an embodiment, the two multilayers are -approximately equal in thickness. Preferably, each of the multilayers is approximately 2.4 mm thick.
In an assembly circuit board according to an -embodiment of the invention, in order to increase the pole number for the external terminals the plug connectors are arranged in mirror-image fashion. For example, the bores of the respective multilayers can be commonly aligned, so that each aligned pair of bores forms a single bore extending through the circuit board.
Preferably, in the embodiments disclosed herein, the connector pins have a length slightly less than a thickness of the respective multilayer. For example, where the multilayer is 2.4 mm thick, the pin may be 2.0 mm long.
An advantage of the present invention is that the circuit board is adapted to receive plug connectors of a press-fit type, eliminating a disadvantageous heat treatment Yequired for other connector types, such as SMD
connectors.
In an advantageous embodiment of the inventive assembly circuit board, vias are provided in the region of the plug connectors for the predetermined connection ___ of determined multilayer layers with one another. In this way, a simple and easy galvanic connection between determined multilayer layers can be achieved.
Another embodiment of the inventive circuit board provides that the lower multilayer is sized and shaped so that it extends on7_y in the terminal region of the plug connectors. In such an embodiment, one of the multilayers is fashioned only as a multilayer segment, connected electrically with the main multi_layer in the terminal region of the plug connector via through-contacts. An advantage of this embodiment is that it eliminates a need for a one of the multilayers to be full-sized, thus saving materials and expense.
A further embodiment of the assembly circuit board according to the px-esent invention provides the circuit board such that a space c>r free region is formed between the plug connectors in front: of an end face of the circuit board. This space is adapted to receive a coding apparatus.
In accordance with the present invention there is provided an assembly circuit board adapted for connectably receiving a plurality of plug connectors, the assembly circuit board comprising: two multilayers; an insulating film disposed between said multil.ayers, said film having opposite adhesive surfaces bonding said multilayers together in a stacked manner, said film providing a galvanic separation between the multilayers; a plurality of through-contacted bores in each of said multilayers af.apted for respectively receiving plug connector pins, so that at least two plug connectors are installable into said bores on opposite sides of said assembly circuit board.
In accordance with the present invention there is further provided an. assembly circuit board comprising two planar multi7_ayers and an insulating film, the insulating film being secured between the multilayers in a stacked manner so that the multilayers define opposite planar sides of the circuit board, each of the multilayers including a plurality of press-in bores adapted to connectably receive plug connector press-in pins from each of said opposite sides.
In accordance with the present invention there is further provided a circuit board arrangement comprising: an 4a assembly circuit board having two opposing sides, the circuit board including: t:wo multilayers; an insulating film disposed between the two layers, the multilayers and insulating film being secured together in a stacked manner so that the two multilayers are define opposite sides of the circuit board; a plurality of bores in each of the multilayers; two plug connectors, each of: said connectors including a plurality of press-in pins, each of said pins having a length to fit within said bores and pin:> being pressed respectively into said bores, so that said connectors are mounted to said opposite sides of said circuit board.
Additional features and advantages of the present invention are shown in, and will be apparent from, the detailed description of the preferred embodiments, the drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 i~; a sectional view through an assembly circuit board consisting of two multilayers equipped with two plug connectors according to an embodiment of the invention.
FIG. 2 is. a sectional view through an assembly circuit board consisting of a multilayer and a multilayer segment equipped with two plug connectors according to an embodiment of the invention.
s nFTnrrFn nF~~RrpTrnN nF THE PREFERRED EMBODIMENTS
FIG. 1 illustrates an assembly circuit board 1 having an upper multilayer 2 and a lower multilayer 3.
The two multilayers 2 and 3 are separated by an insulating film 4, both sides of which have an adhesive surfaces. The two multilayers 2 and 3 and the adhesive , insulating film 4 (also called "prepreg"), are pressed.
together to form a unit. Plug connectors 5 and 6 are provided. These plug connectors 5 and 6 have terminal-regions with short conductive terminal pins 7. The _ assembly circuit board I is provided with bores 8 serving as via holes, press-fit holes and fastening holes. -Selected bores 8 are adapted to receive the terminal pins 7.
FIG. 2 illustrates an embodiment similar to FIG. 1, but wherein the lower multilayer 3 is a multilayer segment which is reduced in size. In this FIG. 2 embodiment, the lower multilayer 3 is sized and shaped to reside substantially only in the region of the plug connectors 5 and 6.
In FIGS. 1 and 2, the plug connectors 5 and 6 are shown with shielded individual contacts, but the invention is not limited to plug connectors of this type;
the invention can generally be used for all press-fit plug connectors.
Previously, the attaching of press-fit plug connectors essentially ensued on only one side on an assembly circuit board, which, as a general rule had a thickness of no more than 1.6 mm. Thepress-fit zone of -i mounting pins and contacts could thus also be constructed longer than the through-contacting of the assembly circuit board.
In plug connectors having shielded individual contacts, the assembly circuit board must be a multilayer, due to the arrangement of the signal pins and the shielding pins in an offset grid. Since 10-layer multilayers can already be manufactured with a thickness of 1.6 mm, multilayers with still higher numbers of layers having the required wave state can also be realized, usually having a maximum thickness of 2.4 mm.
According to an embodiment of the present invention, -two of the above-described multilayera (each preferably 2.4 mm thick), separated by a prepreg, are pressed together, whereby the terminal region for the plug connectors is correspondingly bored and through-contacted. One of the multilayers can be only a multilayer segment which is electrically connected with the other, a main multilayer, inside the terminal region of the plug connectors via through-contacts. _ The terminal holes for the plug connectors, arranged _ on both sides on a pressed circuit board 1 that is, for example, 5 mm thick, can also be bored as blind holes and produced in a metallized fashion.
The plug connectors, with individual contacts shielded all around, are then pressed into these blind holes. The press-fit zone for the contacts and for the shielding plates with the run-in tips, is here about 2 mm long, i.e. smaller than half the thickness of a 2196265 _ multilayer. In thicker multilayers, the press-fit zone can be correspondingly matched (longer).
As mentioned, a space remaining between the two plug connectors 5 and 6 can be operably adapted-to facilitate components such as coding elements.
In sum, the present invention provides that the press-fit zones defined by the through-contacted bores-are shortened to a minimized dimension; accommodating correspondingly short press-in connector pins. In a preferred embodiment, the-dimension is halved over conventional press-fit mounting pins and though-contacted bores the mounting pins shortened to a minimum, enabling a mirror-image arrangement of back-to-back multilayers with aligned terminal regions and being insulated against one another, receiving plug connectors opposite sides of -the circuit board. This inventive arrangement is compact and provides effective component connection without a need to reduce a number of pins and without sacrificing -shielding quality.
It should be understood that various changes and modifications to the preferred embodiments will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the present invention and without diminishing its attendant advantages. Accordingly, the appended claims are intended to cover such changes and modifications.
Previously, press-fit plug connectors were essentially used only on one side on an assembly circuit board. Aa computer technology continually advances, a -demand also increases on the need to arrange more components on an assembly circuit board within a confined space. Such components must be arranged on the assembly circuit board within the capacity of the plug connectors -attached to the assembly circuit board. Unfortunately, it has been found that previous system arrangements cannot provide sufficient connections from the-assembly circuit board to other assemblies to meet the ever-increasing signal and supply demands. -In an attempt to solve this problem with known systems, the number of poles of plug connectors has been -increased. However, this solution has been found insufficient in certain-cases. Therefore, plug ' connectors have been attached to both sides of a circuit board in a surface mount, or SMD, manner. Unfortunately, the attachment of SMD-type plug connectors disadvantageously involves a heat treatment process.
Accordingly, an object of the present invention is -to provide an assembly circuit board having a plug i 219b265 connector connected fixedly with it, which can be connected with the rest of the system with a high number of poles of plug connections, without the disadvantage of requiring a heat treatment.
~m?NLARY OF THE INVENTION
According to the invention, the aforementioned object is achieved by providing an the.assembly circuit board having two multilayers with an insulating film disposed between them. The film serves for galvanic separation and also has an adhesive surfaces on both sides which bond the multilayers together. The two multilayers of the circuit board each have a terminal region which is pre-bored to receive plug connectors and is correspondingly through-contacted. Plug connectors with relatively short or shortened terminal pins can be pressed into the multilayers by inserting the pins into the respective bores, so that at least one of such connectors is connectably installable onto each of the opposite sides of the circuit board. The invention also provides a combined arrangement of the circuit board with its connectors.
In an embodiment, an assembly circuit board according to the invention includes two planar multilayers and an insulating film. The insulating film is secured between the multilayers in a stacked manner so that the multilayers define opposite planar aides of the circuit board. Each of the multilayers has a plurality of press-in bores adapted to connectably receive plug connector press-in pins from each of said opposite sides., In an embodiment, the two multilayers are -approximately equal in thickness. Preferably, each of the multilayers is approximately 2.4 mm thick.
In an assembly circuit board according to an -embodiment of the invention, in order to increase the pole number for the external terminals the plug connectors are arranged in mirror-image fashion. For example, the bores of the respective multilayers can be commonly aligned, so that each aligned pair of bores forms a single bore extending through the circuit board.
Preferably, in the embodiments disclosed herein, the connector pins have a length slightly less than a thickness of the respective multilayer. For example, where the multilayer is 2.4 mm thick, the pin may be 2.0 mm long.
An advantage of the present invention is that the circuit board is adapted to receive plug connectors of a press-fit type, eliminating a disadvantageous heat treatment Yequired for other connector types, such as SMD
connectors.
In an advantageous embodiment of the inventive assembly circuit board, vias are provided in the region of the plug connectors for the predetermined connection ___ of determined multilayer layers with one another. In this way, a simple and easy galvanic connection between determined multilayer layers can be achieved.
Another embodiment of the inventive circuit board provides that the lower multilayer is sized and shaped so that it extends on7_y in the terminal region of the plug connectors. In such an embodiment, one of the multilayers is fashioned only as a multilayer segment, connected electrically with the main multi_layer in the terminal region of the plug connector via through-contacts. An advantage of this embodiment is that it eliminates a need for a one of the multilayers to be full-sized, thus saving materials and expense.
A further embodiment of the assembly circuit board according to the px-esent invention provides the circuit board such that a space c>r free region is formed between the plug connectors in front: of an end face of the circuit board. This space is adapted to receive a coding apparatus.
In accordance with the present invention there is provided an assembly circuit board adapted for connectably receiving a plurality of plug connectors, the assembly circuit board comprising: two multilayers; an insulating film disposed between said multil.ayers, said film having opposite adhesive surfaces bonding said multilayers together in a stacked manner, said film providing a galvanic separation between the multilayers; a plurality of through-contacted bores in each of said multilayers af.apted for respectively receiving plug connector pins, so that at least two plug connectors are installable into said bores on opposite sides of said assembly circuit board.
In accordance with the present invention there is further provided an. assembly circuit board comprising two planar multi7_ayers and an insulating film, the insulating film being secured between the multilayers in a stacked manner so that the multilayers define opposite planar sides of the circuit board, each of the multilayers including a plurality of press-in bores adapted to connectably receive plug connector press-in pins from each of said opposite sides.
In accordance with the present invention there is further provided a circuit board arrangement comprising: an 4a assembly circuit board having two opposing sides, the circuit board including: t:wo multilayers; an insulating film disposed between the two layers, the multilayers and insulating film being secured together in a stacked manner so that the two multilayers are define opposite sides of the circuit board; a plurality of bores in each of the multilayers; two plug connectors, each of: said connectors including a plurality of press-in pins, each of said pins having a length to fit within said bores and pin:> being pressed respectively into said bores, so that said connectors are mounted to said opposite sides of said circuit board.
Additional features and advantages of the present invention are shown in, and will be apparent from, the detailed description of the preferred embodiments, the drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 i~; a sectional view through an assembly circuit board consisting of two multilayers equipped with two plug connectors according to an embodiment of the invention.
FIG. 2 is. a sectional view through an assembly circuit board consisting of a multilayer and a multilayer segment equipped with two plug connectors according to an embodiment of the invention.
s nFTnrrFn nF~~RrpTrnN nF THE PREFERRED EMBODIMENTS
FIG. 1 illustrates an assembly circuit board 1 having an upper multilayer 2 and a lower multilayer 3.
The two multilayers 2 and 3 are separated by an insulating film 4, both sides of which have an adhesive surfaces. The two multilayers 2 and 3 and the adhesive , insulating film 4 (also called "prepreg"), are pressed.
together to form a unit. Plug connectors 5 and 6 are provided. These plug connectors 5 and 6 have terminal-regions with short conductive terminal pins 7. The _ assembly circuit board I is provided with bores 8 serving as via holes, press-fit holes and fastening holes. -Selected bores 8 are adapted to receive the terminal pins 7.
FIG. 2 illustrates an embodiment similar to FIG. 1, but wherein the lower multilayer 3 is a multilayer segment which is reduced in size. In this FIG. 2 embodiment, the lower multilayer 3 is sized and shaped to reside substantially only in the region of the plug connectors 5 and 6.
In FIGS. 1 and 2, the plug connectors 5 and 6 are shown with shielded individual contacts, but the invention is not limited to plug connectors of this type;
the invention can generally be used for all press-fit plug connectors.
Previously, the attaching of press-fit plug connectors essentially ensued on only one side on an assembly circuit board, which, as a general rule had a thickness of no more than 1.6 mm. Thepress-fit zone of -i mounting pins and contacts could thus also be constructed longer than the through-contacting of the assembly circuit board.
In plug connectors having shielded individual contacts, the assembly circuit board must be a multilayer, due to the arrangement of the signal pins and the shielding pins in an offset grid. Since 10-layer multilayers can already be manufactured with a thickness of 1.6 mm, multilayers with still higher numbers of layers having the required wave state can also be realized, usually having a maximum thickness of 2.4 mm.
According to an embodiment of the present invention, -two of the above-described multilayera (each preferably 2.4 mm thick), separated by a prepreg, are pressed together, whereby the terminal region for the plug connectors is correspondingly bored and through-contacted. One of the multilayers can be only a multilayer segment which is electrically connected with the other, a main multilayer, inside the terminal region of the plug connectors via through-contacts. _ The terminal holes for the plug connectors, arranged _ on both sides on a pressed circuit board 1 that is, for example, 5 mm thick, can also be bored as blind holes and produced in a metallized fashion.
The plug connectors, with individual contacts shielded all around, are then pressed into these blind holes. The press-fit zone for the contacts and for the shielding plates with the run-in tips, is here about 2 mm long, i.e. smaller than half the thickness of a 2196265 _ multilayer. In thicker multilayers, the press-fit zone can be correspondingly matched (longer).
As mentioned, a space remaining between the two plug connectors 5 and 6 can be operably adapted-to facilitate components such as coding elements.
In sum, the present invention provides that the press-fit zones defined by the through-contacted bores-are shortened to a minimized dimension; accommodating correspondingly short press-in connector pins. In a preferred embodiment, the-dimension is halved over conventional press-fit mounting pins and though-contacted bores the mounting pins shortened to a minimum, enabling a mirror-image arrangement of back-to-back multilayers with aligned terminal regions and being insulated against one another, receiving plug connectors opposite sides of -the circuit board. This inventive arrangement is compact and provides effective component connection without a need to reduce a number of pins and without sacrificing -shielding quality.
It should be understood that various changes and modifications to the preferred embodiments will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the present invention and without diminishing its attendant advantages. Accordingly, the appended claims are intended to cover such changes and modifications.
Claims (15)
1. An assembly circuit board adapted for connectably receiving a plurality of plug connectors, the assembly circuit board comprising:
two multilayers;
an insulating film disposed between said multilayers, said film having opposite adhesive surfaces bonding said multilayers together in a stacked manner, said film providing a galvanic separation between the multilayers;
a plurality of through-contacted bores in each of said multilayers adapted for respectively receiving plug connector pins, so that at least two plug connectors are installable into said bores on opposite sides of said assembly circuit board.
two multilayers;
an insulating film disposed between said multilayers, said film having opposite adhesive surfaces bonding said multilayers together in a stacked manner, said film providing a galvanic separation between the multilayers;
a plurality of through-contacted bores in each of said multilayers adapted for respectively receiving plug connector pins, so that at least two plug connectors are installable into said bores on opposite sides of said assembly circuit board.
2. An assembly circuit board according to claim 1, further comprising:
a via in the region of the plug connectors adapted for the predetermined connection of multilayer layers with one another.
a via in the region of the plug connectors adapted for the predetermined connection of multilayer layers with one another.
3. An assembly circuit board according to claim 1, wherein the lower multilayer having dimensions such that it generally defines only a terminal region surrounding the bores.
4. An assembly circuit board according to claim 1, further comprising:
a space between the plug connectors in front of an end face of the circuit board adapted to receive a coding apparatus.
a space between the plug connectors in front of an end face of the circuit board adapted to receive a coding apparatus.
5. An assembly circuit board according to claim 1, wherein said the bores of the respective multilayers are commonly aligned.
6. An assembly circuit board comprising two planar multilayers and an insulating film, the insulating film being secured between the multilayers in a stacked manner so that the multilayers define opposite planar sides of the circuit board, each of the multilayers including a plurality of press-in bores adapted to connectably receive plug connector press-in pins from each of said opposite sides.
7. An assembly circuit board according to claim 6, wherein the two multilayers are approximately equal in thickness .
8. An assembly circuit board according to claim 6, wherein each of the multilayers are approximately 2.4 mm thick.
9. An assembly circuit board according to claim 6, wherein the one of the multilayers has dimensions such that occupies only a region surrounding the bores,
10. An assembly circuit board according to claim 6, wherein the bores of the respective multilayers are commonly aligned.
11. A circuit board arrangement comprising:
an assembly circuit board having two opposing sides, the circuit board including:
two multilayers;
an insulating film disposed between the two layers, the multilayers and insulating film being secured together in a stacked manner so that the two multilayers are define opposite sides of the circuit board;
a plurality of bores in each of the multilayers;
two plug connectors, each of said connectors including a plurality of press-in pins, each of said pins having a length to fit within said bores and pins being pressed respectively into said bores, so that said connectors are mounted to said opposite sides of said circuit board.
an assembly circuit board having two opposing sides, the circuit board including:
two multilayers;
an insulating film disposed between the two layers, the multilayers and insulating film being secured together in a stacked manner so that the two multilayers are define opposite sides of the circuit board;
a plurality of bores in each of the multilayers;
two plug connectors, each of said connectors including a plurality of press-in pins, each of said pins having a length to fit within said bores and pins being pressed respectively into said bores, so that said connectors are mounted to said opposite sides of said circuit board.
12. A circuit board arrangement according to claim 11, wherein the two multilayers are approximately equal in thickness.
13. A circuit board arrangement according to claim 11, wherein each of the multilayers is approximately 2.4 mm thick.
14 An assembly circuit board according to claim 11, wherein the one of the multilayers has dimensions such that it occupies only a region generally surrounding the bores
15. An assembly circuit board according to claim 11, wherein the bores of the respective multilayers are commonly aligned.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29601655U DE29601655U1 (en) | 1996-01-31 | 1996-01-31 | Module circuit board with connector |
| DE29601655.1 | 1996-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2196265A1 CA2196265A1 (en) | 1997-08-01 |
| CA2196265C true CA2196265C (en) | 2000-07-18 |
Family
ID=8018802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002196265A Expired - Fee Related CA2196265C (en) | 1996-01-31 | 1997-01-29 | Assembly circuit board with plug connector |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0788197B1 (en) |
| JP (1) | JPH09214101A (en) |
| AT (1) | ATE217735T1 (en) |
| CA (1) | CA2196265C (en) |
| DE (2) | DE29601655U1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3066570B2 (en) * | 1996-07-26 | 2000-07-17 | モレックス インコーポレーテッド | Method of manufacturing connector assembly for PC card |
| EP2290753B1 (en) | 2009-08-31 | 2012-12-05 | ERNI Electronics GmbH | Connector and multilayer circuit board |
| DE202012002352U1 (en) | 2011-05-17 | 2012-04-18 | Erni Electronics Gmbh | Arrangement of plug connector and circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909743A (en) * | 1988-10-14 | 1990-03-20 | Teradyne, Inc. | Electrical connector |
| JP2516117Y2 (en) * | 1990-09-28 | 1996-11-06 | 日本電気株式会社 | Connector for PCB edge mounting |
-
1996
- 1996-01-31 DE DE29601655U patent/DE29601655U1/en not_active Expired - Lifetime
-
1997
- 1997-01-15 DE DE59707246T patent/DE59707246D1/en not_active Expired - Fee Related
- 1997-01-15 AT AT97100486T patent/ATE217735T1/en not_active IP Right Cessation
- 1997-01-15 EP EP97100486A patent/EP0788197B1/en not_active Expired - Lifetime
- 1997-01-28 JP JP9013859A patent/JPH09214101A/en not_active Withdrawn
- 1997-01-29 CA CA002196265A patent/CA2196265C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ATE217735T1 (en) | 2002-06-15 |
| CA2196265A1 (en) | 1997-08-01 |
| EP0788197A1 (en) | 1997-08-06 |
| DE59707246D1 (en) | 2002-06-20 |
| DE29601655U1 (en) | 1996-03-28 |
| EP0788197B1 (en) | 2002-05-15 |
| JPH09214101A (en) | 1997-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |