CA2189043A1 - Multipart sealed housing - Google Patents
Multipart sealed housingInfo
- Publication number
- CA2189043A1 CA2189043A1 CA002189043A CA2189043A CA2189043A1 CA 2189043 A1 CA2189043 A1 CA 2189043A1 CA 002189043 A CA002189043 A CA 002189043A CA 2189043 A CA2189043 A CA 2189043A CA 2189043 A1 CA2189043 A1 CA 2189043A1
- Authority
- CA
- Canada
- Prior art keywords
- casing
- multipoint connector
- multipoint
- cunisi
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
- H05K5/0265—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of PCMCIA type
- H05K5/0269—Card housings therefor, e.g. covers, frames, PCB
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Separation By Low-Temperature Treatments (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention relates to a multi-part PCMCIA-casing for accommodating electrical components, which casing has a multipoint connector with which it can be electrically and mechanically connected to a counterpart plug in an electrical apparatus. The particularity of the proposed casing is that it comprises at least two different materials of which at least one comprises copper material, preferably copper alloys with good thermal conductivity and a good level of strength. The multipoint connector preferably has hermetically sealing metal lead-through means and comprises either pressure-englazable copper material or a highly insulating ceramic with hermetically sealing metal lead-through means.
Description
~-`'LE,~tP~ T~ 7-~E~: 2 18 9 0 4 3 DP 1499 ~5 ~ T~ TRA~SI ATI~
Ho/ma Diehl GmbH & Co, 90478 Nuremberg Multi-part sealing casing The invention relates to a multi-part sealing casing for accommodating electrical comFonents, wherein the casing comprises a frame, a bottom, a top and a multipoint connector fitted at one side of the frame, wherein by being pushed in, by means of the multipoint connector, the casing can be electrically and mechanically connected to a counterpart plug in an electrical apparatus.
-Such casings which are made from plastic material have been on the market for some years under the standardisation of the Personal -Computer Memory Card International Association (PCMCIA), under the technical designation of PCMC~A-cards. Those cards have between 35- to 88-pole sockets or plugs respectively, wherein in terms of quantity 68-pole plug connectors have acquired particular significance. In their interior such casings accommodate electronic circuits, in particular memory circuits which serve for PC-memories and fax or modem control arrangements. However hard disc drives have also already been fitted into such casings. The particular advantages thereof are that the structural groups disposed therein are protected from external influences on the one hand while on the other hand they can be easily replaced by being fitted into plug-in mc~ of electrical apparatuses. For PCs or fax devices for example but also for machine control systems, that affords major options in regard to expansion of their technical capabilities, and in particul æ also easier adaptability to differing customer requirements.
~ ~futurc`thc n~,~cr o~ cl~ al ~L ~c~ul~l y~-~u~ L~ 1.~
be disposed in such a casing will increase, with t~ . L~It that on the one hand the packing de~ y ~l~ on the other hand the heat generated by th~ components will increase more and more. Packing iiL~-c~ bc i..~.c~os~d ~ hc ao c~ll~d clli~ ~ b~rd tcchno~lo~g~
- 21 8~043 1 av -In future the number of electrical structural groups which are to be disposed in such a casing will increase, with the result that on the one hand the packing denslty and on the other hand the heat genera~ed by those ccnFonents will increase more and more. Packing density can be increased by the so-called chip-on-board technology AMENDED PA OE
..
Ho/ma Diehl GmbH & Co, 90478 Nuremberg Multi-part sealing casing The invention relates to a multi-part sealing casing for accommodating electrical comFonents, wherein the casing comprises a frame, a bottom, a top and a multipoint connector fitted at one side of the frame, wherein by being pushed in, by means of the multipoint connector, the casing can be electrically and mechanically connected to a counterpart plug in an electrical apparatus.
-Such casings which are made from plastic material have been on the market for some years under the standardisation of the Personal -Computer Memory Card International Association (PCMCIA), under the technical designation of PCMC~A-cards. Those cards have between 35- to 88-pole sockets or plugs respectively, wherein in terms of quantity 68-pole plug connectors have acquired particular significance. In their interior such casings accommodate electronic circuits, in particular memory circuits which serve for PC-memories and fax or modem control arrangements. However hard disc drives have also already been fitted into such casings. The particular advantages thereof are that the structural groups disposed therein are protected from external influences on the one hand while on the other hand they can be easily replaced by being fitted into plug-in mc~ of electrical apparatuses. For PCs or fax devices for example but also for machine control systems, that affords major options in regard to expansion of their technical capabilities, and in particul æ also easier adaptability to differing customer requirements.
~ ~futurc`thc n~,~cr o~ cl~ al ~L ~c~ul~l y~-~u~ L~ 1.~
be disposed in such a casing will increase, with t~ . L~It that on the one hand the packing de~ y ~l~ on the other hand the heat generated by th~ components will increase more and more. Packing iiL~-c~ bc i..~.c~os~d ~ hc ao c~ll~d clli~ ~ b~rd tcchno~lo~g~
- 21 8~043 1 av -In future the number of electrical structural groups which are to be disposed in such a casing will increase, with the result that on the one hand the packing denslty and on the other hand the heat genera~ed by those ccnFonents will increase more and more. Packing density can be increased by the so-called chip-on-board technology AMENDED PA OE
..
-which however presupposes that such casings are hermetically sealed as the components are no longer themselves encapsulated in the casing. On the other hand the increased packing density means that the heat output per unit of volume rises.
Plastic casings are not hermetlcally sealing and are no longer satisfactory for such future uses. In addition their heat emission to the exterior is slight. Metal casings are therefore a choice means for meeting the above-mentioned future requirements. Casings of high-quality steel which initially present themselves for purposes of that kind however can no longer be adequately equal to higher levels of requirements in regard to thermal conductivity.
- It is already known from Patent Abstracts of Japan, Volume 15, No 2 (M-1065), corresponding to JP-A-2 255 394 of 07.01.91, in an IC-card, ~ to provide a frame of aluminium alloy, and to mount thereon a respective metal plate comprising a bottom and a top. The housing is closed off by a multipoint connector in the frame.
The aim of the present invention is therefore that of proposing a casing for such uses, which affords the possibility of hermetic sealing integrity, with at the same time a high level of thermal conductivity and good casing strength.
To attain that object the invention proposes the features characterised in claim 1.
The invention is based on the notion that optimum properties in respect of such a casing are afforded if its two main technical requirements are met by use of materials which are optimised for the respectively intended purpose. In other words, those parts of the casing in regard to which the important consideration is radiation of heat are made from a material with a high thermal conductivity capability, namely a copper alloy, AMENDED PAGE
h h ~'~ r~ ~9~^ th~ ~~ cn~jr~C ~ h^~tic~ll~
the components are no longer themselves encapsulated in the casing ~On the other hand the increased packing density means that th ~ heat output per unit of volume rises.
Plastic casings are not hermetically sealing and ~ no longer satisfactory for such future uses. In addition their ~ t emission to the exterior is slight. Metal casings are therefore~ choice means for meeting the above-mentioned future requiremen ~ Casings of high-quality steel which initially present themse ~ s for purposes of that kind however can no longer be adequately/equal to higher levels of requirements in regard to thermal condu ~ vity.
The aim of the present invention~ s therefore that of proposing a casing for such uses, which af~ rds the possibility of hermetic ~ sealing integrity, with at ~ same time a high level of thermal conductivity and good casin ~strength.
To attain that o ~ ct the invention proposes the features characterised in clai~ l;
The inventio ~ s based on the notion that optimum properties in respect of s ~ a casing are afforded if its two main technical requirement~are met by use of materials which are optimised for the respecti ~ y intended purpose. In other words, those parts of the casin ~in regard to which the important consideration is radiation of hea~ ~ are made from a material with a high thermal conductivity ~ y, name~ m~ al~ whereas those parts of the casing which electrically connect the structural groups in its interior to the outside world, namely the multipoint connector, are formed from another material which permits a good sealing action and in particular a hermetic sealing effect.
In accordance with a development of the invention it is provided that the second material, that is to say the material for the multipoint connector, comprises a second copper material which is pressure-englazable. That makes it possible to achieve hermetic sealing integrity for the metal lead-through means in the multipoint connector. The other parts of the casing, namely the frame, the bottom and the top are hermetically sealingly closed to each other and to the multipoint connector by soldering or by laser welding together.
In accordance with another development the invention provides that the multipoint connector comprises a ceramic, such as for example A12~3 in a high state of purity. In this case there is no need for the mutual insulation of the metal lead-through means by the multipoint connector as the ceramic is a very good insulator.
In accordance with the invention it is immaterial whether at its outward side of the casing the multipoint connector has sockets or plug portions. For mechanical reasons however the arrangement of sockets is preferred as the mechanical loading is lower when the connector is fitted together with the counterpart plug member.
A further embodiment of the invention provides that the casing is hermetically sealing and has tw~ multipoint connectors which are arranged one behind the other and of which the multipoint connector which is inward of the casing comprises the second copper material or the ceramic, has hermetically sealing metal lead-through means and is electrically connected to a multipoint connector which is outward of the casing, the latter ccmprising ~lQotio ~-tori~ ~vllly ~ c~ g properties and carrying the external plugs - or sockets - ~ are operatively connected to the counterpart plug. The c ~ 11 be of such a design configuration when the casi ~ very frequently plugged in and unplugged, that is to s ~ rticularly high and/or frequent mechanical loading occu ~ the region of the multipoint connector. Here the se ~ on of the function of affording hermetic sealing int ~ y and the aspect of carrying mechanical forces, to all ~ e them to two multipoint connectors, is advantageous ~
In ~ rdance with a further development of the invention the fjv~ p~r m~Gri~l ca.~ oomr~;C^ ~ry pure co~er or a copper alloy 21 8qO43 3~, plastic material, having no sealing properties and carrying the external plugs - or sockets - which are operatively connected to the counterpart plug. The casing will be of such a design conflguration when the casing is very frequently plugged in and unplugged, that is to say a particularly high and/or frequent mechanical loading occurs in the region of the multipoint connector. Here the separation of the function of affording hermetic sealing integrity and the aspect of carrying mechanical forces, to allocate them to two multipoint connectors, is advantageous.
In accordance with a further development of the invention the first copper material can comprise very pure copper or a copper alloy which affords good thermal conductivity such as for example CuFe2P or a commercially available copper-nickel-silicon alloy (CuNiSi).
As a further preferred embodiment of the invention it is provided that the second copper material comprises a pressure-englazable alloy, such as for example CuNi9Sn8, CuCrZr or a CuNiSi-alloy produced in accordance with a new method, with properties which differ from the commercially available CuNiSi-alloys.
The invention will be described in greater detail hereinafter with reference to the drawing in which:
Figure 1 is a view of a casing according to the invention, Figure 2 is a view of a multipoint connector from above, Figure 3 is a view of the multipoint connector looking in the direction indicated by the arrow A in Figure 2, AMENDED PA OE
~. ,.
h ~ffor~ n~ tivity such ~ f~r ~"~ ~ 6r a co~mercially av~ hle copper-nickel-silicon alloy (CuNi ~
As a further preferred embodiment of the invention ~ is provided that the second copper material camprises a f sure-engl a7.~l e alloy, such as for ex~l~le CuNi9Sn8, Cu ~ or a CuNiSi-alloy produced in accordance with a new me ~ d, with properties which differ fram the c~,l"eLcially av~ ~ C~NiSi-alloys, as is described for example in our patent app ~ ion No P .... .
The invention wil ~ described in greater detail hereinafter with reference to ~ drawing in which:
Figure 1 ~ view of a casing according to the invention, Figu ~ is a view of a multipoint connector fram above, e 3 is a view of the multipoint connector looking in the ~t~ dlcated ~y ~he~~ .. R in Figuro 2,1 Figure 4 is a view of a hermetically sealing multipoint connector when two multipoint connectors are provided in the casing, Figure 5 is a view of the multipoint connector of Figure 4 viewing in the direction indicated by the arrow B, Figure 6 shows a frame portion for receiving a single multipoint connector, Figure 7 shows a frame portion for receiving two multipoint connectors, Figure 8 shows the frame portion with an inserted multipoint connector, Figure 9 shows the frame portion with two inserted multipoint connectors, Figure 9a is a view on an enlarged scale of the connection of the two multipoint connectors of Figure 9, and Figure 10 is a view in section taken along line X-X in Figure 3 when using a ceramic multipoint connector.
Figure 1 is a perspective view of such a casing 1 camprising a frame 2, a top 3, a multipoint connector 4 and a bottom portion 5 21 8~043 -(not visible). Although not visible in the drawing, arranged in the casing on a circuit board are electronic structural groups which are electrically connected to the multipoint connector 4, in particular the sockets 6 arranged thereon.
The frame 2, the top 3 and the bottom 5 are optimised in regard to a high level of thermal conductivity, by the selection of -~ ~e ~' ~ cc ~;Lee ~UII~OnellL~ L \~ely ~ULë ~
~ ant consideration is the best level of th~rm~l conductivity and not a ~ h level of strength. However copper alloys with good thermal conductiv ~y and high strength are preferably used. In this case, it is possible ~ use commercially avAilAhle alloys such as CuFe2P or CuNiSi but als ~ other copper alloys which are suitable as conductor material for elec ~onic components.
The purpose of ~ multipoint connector, as a part of the casing, is on the one hand~to carry the mechanical loading with the counterpart plug portion ~not shown) of an electrical apparatus, and on the other hand to provl~e for a sealing electrical lead-through effect, preferably however a ~ ermetically sealing electrical lead-through effect. Therefore, a mat ~ ial which is optimised in terms of that function is to be selected for~ uch a multipoint connector. That can be either copper alloys with spec ~ 1 properties or ceramics with a high insulation effect. Suitable co~ er alloys which have the desired properties are those which are ~ ressure-englazable. The pressure-englazing operation makes it possib ~ for metal conductors to be passed through a wall of the casing in ~ rmetically sealing relationship. Alloys having properties of that kl` ~ are for example CuNi9Sn8, CuCrZr and CuNiSiCr, as are cull~leLcially ~ vAilAhle, or however special CuNiSi-alloys which are produced in acco ~ance with a particular method as are described in patent ~rp1icAtion No~P .... .
Figure 2 is a view from above of a multipoint connector 4 ~ igure 3 is a view of the multipoint connector looking in the dire~ ion indicated by the arrow A in Figure 2. It will be seen that sockets\
-5 ~
material. Those three components could be of very pure copper if the important consideration is the best level of thermal conductivity and not a high level of strength. According to the invention however copper alloys with gocd thermal conductivity and high strength are used. In this case, it is possible to use commercially available alloys such as CuFe2P or CuNiSi but also other copper alloys which are suitable as conductor material for electronic components.
The purpose of the multipoint connector, as a part of the casing, is on the one hand to carry the mechanical loading with the counterpart plug portion (not shown) of an electrical apparatus, and on the other hand to provide for a sealing electrical lead-through effect, preferably - however a hermetically sealing electrical lead-through effect.
Therefore, a material which is optimised in terms of that function is to be selected for sucn a multipoint connector. That can be either copper alloys with special properties or ceramics with a high insulation effect. Suitable copper alloys which have the desired properties are those which are pressure-englazable. The pressure-englazing operation makes it possible for metal conductors to be passed through a wall of the casing in hermetically sealing relationship. Alloys having properties of that kind are for example CuNi9Sn8, CuCrZr and CuNiSiCr, as are commercially available, or however special CuNiSi-alloys which are produced in accordance with a particular method.
Figure 2 is a view from above of a multipoint connector 4. Figure 3 is a view of the multipoint connector looking in the direction indicated by the arrow A in Figure 2. It will be seen that sockets 6 AMENDED PA OE
....
are arranged on the side of the multipoint connector, which is outward of the casing, whereas metal plugs 7 project on the side which is inward of the casing, the plugs 7 being electrically connected to the sockets 6 in the interior of the multipoint connector.
The described multipoint connector, in this case comprising ceramic A12O3, has 68 sockets and an equal number of plugs. The arrangement of the sockets 6 and the plugs 7 in the multipoint connector 4 is produced by soldering, thereby permitting hermetically sealing integrity in respect of the locations where the metal cc~ponents pass through the multipoint connector. The procedure for producing that soldering effect is however not subject-matter of this invention.
In those cases in which the loading on the multipoint connector 4 by virtue of being frequently plugged into and unplugged frc,m an apparatus is particularly high, it may be expedient for the multipoint connector to be specifically designed for a high mechanical loading at the outward side of the casing, but to take away from it the function of affording sealing integrity. In such a case it may be desirable to provide in the casing a second multipoint connector 8 which performs the function of affording hermetic sealing integrity. For that purpose, the multipoint connector which comprises one of the above-mentioned pressure-englazable materials has an equal number of metal leao-through means 9 which are hermetically sealingly disposed in the multipoint connector 8. Presure englazing of the metal lead-through means 9 in the multipoint connector 8 is effected in the usual manner and is also not subject-matter of this invention.
Figure 6 shows a frame portion 2 which is prepared to receive an individual multipoint connector when the multipoint connector simultaneously permits hermetic sealing integrity to be achieved, as was described on the multipoint connector with reference to Figures 2 and 3. Figure 7 shows a frame portion 2 which is suitable for AMENDED PA OE
receiving two multipoint connectors, namely a multipoint connector 8 in the position inwardly of the casing and a multipoint connector 4 in the position outwardly of the casing, the multipoint connector 4 comprising plastic material and not having any sealing metal lead-through means. Multipoint connectors of that kind are ccmmerciallyavailable and do not need to be described in greater detail.
Figure 8 shows a multipoint connector 4 fitted into the frame portion 2. In Figure 9 multipoint connectors 4 and 8 are fitted into the frame portion. Figure 9a shows on an enlarged scale that the plugs of the multipoint connectors 4 and 8 are connected together by wires.
As already described, the multipoint connector 4 can ccmprise ceramic material. That material has the advantage that it is a goc~
insulator and therefore insulation problems as between the various metal lead-through means do not occur. However in order that the metal lead-through means can be hermetically sealingly fitted in the bores in the multipoint connector, it is necessary for those bores to be metallised so that it is possible to solder the socket and the plug in the bore. Figure 10 is a view in section taken along line X-X
in Figure 3, showlng how such a lead-through means looks. The insides of the bores 12 in the ceramic body 4 are metallised, the socket 10 on which a metal wire 11 serving as a plug is arranged is pushed into the bore 12 and it is hermetically sealingly secured there by soldering. So that the multipoint connector 4 of ceramic can be hermetically sealingly connected to the rest of the casing, that is to say the frame 2, the bottom 5 and the top 3, the corresponding contact surfaces of the multipoint connector 4 must also be metallised. In that case a hermetically sealing connection is possible between those cc~onents, by means of soldering or laser welding. Met~ ation of the ceramic body can be effected for example with tungsten or molybdenum.
-r.
Plastic casings are not hermetlcally sealing and are no longer satisfactory for such future uses. In addition their heat emission to the exterior is slight. Metal casings are therefore a choice means for meeting the above-mentioned future requirements. Casings of high-quality steel which initially present themselves for purposes of that kind however can no longer be adequately equal to higher levels of requirements in regard to thermal conductivity.
- It is already known from Patent Abstracts of Japan, Volume 15, No 2 (M-1065), corresponding to JP-A-2 255 394 of 07.01.91, in an IC-card, ~ to provide a frame of aluminium alloy, and to mount thereon a respective metal plate comprising a bottom and a top. The housing is closed off by a multipoint connector in the frame.
The aim of the present invention is therefore that of proposing a casing for such uses, which affords the possibility of hermetic sealing integrity, with at the same time a high level of thermal conductivity and good casing strength.
To attain that object the invention proposes the features characterised in claim 1.
The invention is based on the notion that optimum properties in respect of such a casing are afforded if its two main technical requirements are met by use of materials which are optimised for the respectively intended purpose. In other words, those parts of the casing in regard to which the important consideration is radiation of heat are made from a material with a high thermal conductivity capability, namely a copper alloy, AMENDED PAGE
h h ~'~ r~ ~9~^ th~ ~~ cn~jr~C ~ h^~tic~ll~
the components are no longer themselves encapsulated in the casing ~On the other hand the increased packing density means that th ~ heat output per unit of volume rises.
Plastic casings are not hermetically sealing and ~ no longer satisfactory for such future uses. In addition their ~ t emission to the exterior is slight. Metal casings are therefore~ choice means for meeting the above-mentioned future requiremen ~ Casings of high-quality steel which initially present themse ~ s for purposes of that kind however can no longer be adequately/equal to higher levels of requirements in regard to thermal condu ~ vity.
The aim of the present invention~ s therefore that of proposing a casing for such uses, which af~ rds the possibility of hermetic ~ sealing integrity, with at ~ same time a high level of thermal conductivity and good casin ~strength.
To attain that o ~ ct the invention proposes the features characterised in clai~ l;
The inventio ~ s based on the notion that optimum properties in respect of s ~ a casing are afforded if its two main technical requirement~are met by use of materials which are optimised for the respecti ~ y intended purpose. In other words, those parts of the casin ~in regard to which the important consideration is radiation of hea~ ~ are made from a material with a high thermal conductivity ~ y, name~ m~ al~ whereas those parts of the casing which electrically connect the structural groups in its interior to the outside world, namely the multipoint connector, are formed from another material which permits a good sealing action and in particular a hermetic sealing effect.
In accordance with a development of the invention it is provided that the second material, that is to say the material for the multipoint connector, comprises a second copper material which is pressure-englazable. That makes it possible to achieve hermetic sealing integrity for the metal lead-through means in the multipoint connector. The other parts of the casing, namely the frame, the bottom and the top are hermetically sealingly closed to each other and to the multipoint connector by soldering or by laser welding together.
In accordance with another development the invention provides that the multipoint connector comprises a ceramic, such as for example A12~3 in a high state of purity. In this case there is no need for the mutual insulation of the metal lead-through means by the multipoint connector as the ceramic is a very good insulator.
In accordance with the invention it is immaterial whether at its outward side of the casing the multipoint connector has sockets or plug portions. For mechanical reasons however the arrangement of sockets is preferred as the mechanical loading is lower when the connector is fitted together with the counterpart plug member.
A further embodiment of the invention provides that the casing is hermetically sealing and has tw~ multipoint connectors which are arranged one behind the other and of which the multipoint connector which is inward of the casing comprises the second copper material or the ceramic, has hermetically sealing metal lead-through means and is electrically connected to a multipoint connector which is outward of the casing, the latter ccmprising ~lQotio ~-tori~ ~vllly ~ c~ g properties and carrying the external plugs - or sockets - ~ are operatively connected to the counterpart plug. The c ~ 11 be of such a design configuration when the casi ~ very frequently plugged in and unplugged, that is to s ~ rticularly high and/or frequent mechanical loading occu ~ the region of the multipoint connector. Here the se ~ on of the function of affording hermetic sealing int ~ y and the aspect of carrying mechanical forces, to all ~ e them to two multipoint connectors, is advantageous ~
In ~ rdance with a further development of the invention the fjv~ p~r m~Gri~l ca.~ oomr~;C^ ~ry pure co~er or a copper alloy 21 8qO43 3~, plastic material, having no sealing properties and carrying the external plugs - or sockets - which are operatively connected to the counterpart plug. The casing will be of such a design conflguration when the casing is very frequently plugged in and unplugged, that is to say a particularly high and/or frequent mechanical loading occurs in the region of the multipoint connector. Here the separation of the function of affording hermetic sealing integrity and the aspect of carrying mechanical forces, to allocate them to two multipoint connectors, is advantageous.
In accordance with a further development of the invention the first copper material can comprise very pure copper or a copper alloy which affords good thermal conductivity such as for example CuFe2P or a commercially available copper-nickel-silicon alloy (CuNiSi).
As a further preferred embodiment of the invention it is provided that the second copper material comprises a pressure-englazable alloy, such as for example CuNi9Sn8, CuCrZr or a CuNiSi-alloy produced in accordance with a new method, with properties which differ from the commercially available CuNiSi-alloys.
The invention will be described in greater detail hereinafter with reference to the drawing in which:
Figure 1 is a view of a casing according to the invention, Figure 2 is a view of a multipoint connector from above, Figure 3 is a view of the multipoint connector looking in the direction indicated by the arrow A in Figure 2, AMENDED PA OE
~. ,.
h ~ffor~ n~ tivity such ~ f~r ~"~ ~ 6r a co~mercially av~ hle copper-nickel-silicon alloy (CuNi ~
As a further preferred embodiment of the invention ~ is provided that the second copper material camprises a f sure-engl a7.~l e alloy, such as for ex~l~le CuNi9Sn8, Cu ~ or a CuNiSi-alloy produced in accordance with a new me ~ d, with properties which differ fram the c~,l"eLcially av~ ~ C~NiSi-alloys, as is described for example in our patent app ~ ion No P .... .
The invention wil ~ described in greater detail hereinafter with reference to ~ drawing in which:
Figure 1 ~ view of a casing according to the invention, Figu ~ is a view of a multipoint connector fram above, e 3 is a view of the multipoint connector looking in the ~t~ dlcated ~y ~he~~ .. R in Figuro 2,1 Figure 4 is a view of a hermetically sealing multipoint connector when two multipoint connectors are provided in the casing, Figure 5 is a view of the multipoint connector of Figure 4 viewing in the direction indicated by the arrow B, Figure 6 shows a frame portion for receiving a single multipoint connector, Figure 7 shows a frame portion for receiving two multipoint connectors, Figure 8 shows the frame portion with an inserted multipoint connector, Figure 9 shows the frame portion with two inserted multipoint connectors, Figure 9a is a view on an enlarged scale of the connection of the two multipoint connectors of Figure 9, and Figure 10 is a view in section taken along line X-X in Figure 3 when using a ceramic multipoint connector.
Figure 1 is a perspective view of such a casing 1 camprising a frame 2, a top 3, a multipoint connector 4 and a bottom portion 5 21 8~043 -(not visible). Although not visible in the drawing, arranged in the casing on a circuit board are electronic structural groups which are electrically connected to the multipoint connector 4, in particular the sockets 6 arranged thereon.
The frame 2, the top 3 and the bottom 5 are optimised in regard to a high level of thermal conductivity, by the selection of -~ ~e ~' ~ cc ~;Lee ~UII~OnellL~ L \~ely ~ULë ~
~ ant consideration is the best level of th~rm~l conductivity and not a ~ h level of strength. However copper alloys with good thermal conductiv ~y and high strength are preferably used. In this case, it is possible ~ use commercially avAilAhle alloys such as CuFe2P or CuNiSi but als ~ other copper alloys which are suitable as conductor material for elec ~onic components.
The purpose of ~ multipoint connector, as a part of the casing, is on the one hand~to carry the mechanical loading with the counterpart plug portion ~not shown) of an electrical apparatus, and on the other hand to provl~e for a sealing electrical lead-through effect, preferably however a ~ ermetically sealing electrical lead-through effect. Therefore, a mat ~ ial which is optimised in terms of that function is to be selected for~ uch a multipoint connector. That can be either copper alloys with spec ~ 1 properties or ceramics with a high insulation effect. Suitable co~ er alloys which have the desired properties are those which are ~ ressure-englazable. The pressure-englazing operation makes it possib ~ for metal conductors to be passed through a wall of the casing in ~ rmetically sealing relationship. Alloys having properties of that kl` ~ are for example CuNi9Sn8, CuCrZr and CuNiSiCr, as are cull~leLcially ~ vAilAhle, or however special CuNiSi-alloys which are produced in acco ~ance with a particular method as are described in patent ~rp1icAtion No~P .... .
Figure 2 is a view from above of a multipoint connector 4 ~ igure 3 is a view of the multipoint connector looking in the dire~ ion indicated by the arrow A in Figure 2. It will be seen that sockets\
-5 ~
material. Those three components could be of very pure copper if the important consideration is the best level of thermal conductivity and not a high level of strength. According to the invention however copper alloys with gocd thermal conductivity and high strength are used. In this case, it is possible to use commercially available alloys such as CuFe2P or CuNiSi but also other copper alloys which are suitable as conductor material for electronic components.
The purpose of the multipoint connector, as a part of the casing, is on the one hand to carry the mechanical loading with the counterpart plug portion (not shown) of an electrical apparatus, and on the other hand to provide for a sealing electrical lead-through effect, preferably - however a hermetically sealing electrical lead-through effect.
Therefore, a material which is optimised in terms of that function is to be selected for sucn a multipoint connector. That can be either copper alloys with special properties or ceramics with a high insulation effect. Suitable copper alloys which have the desired properties are those which are pressure-englazable. The pressure-englazing operation makes it possible for metal conductors to be passed through a wall of the casing in hermetically sealing relationship. Alloys having properties of that kind are for example CuNi9Sn8, CuCrZr and CuNiSiCr, as are commercially available, or however special CuNiSi-alloys which are produced in accordance with a particular method.
Figure 2 is a view from above of a multipoint connector 4. Figure 3 is a view of the multipoint connector looking in the direction indicated by the arrow A in Figure 2. It will be seen that sockets 6 AMENDED PA OE
....
are arranged on the side of the multipoint connector, which is outward of the casing, whereas metal plugs 7 project on the side which is inward of the casing, the plugs 7 being electrically connected to the sockets 6 in the interior of the multipoint connector.
The described multipoint connector, in this case comprising ceramic A12O3, has 68 sockets and an equal number of plugs. The arrangement of the sockets 6 and the plugs 7 in the multipoint connector 4 is produced by soldering, thereby permitting hermetically sealing integrity in respect of the locations where the metal cc~ponents pass through the multipoint connector. The procedure for producing that soldering effect is however not subject-matter of this invention.
In those cases in which the loading on the multipoint connector 4 by virtue of being frequently plugged into and unplugged frc,m an apparatus is particularly high, it may be expedient for the multipoint connector to be specifically designed for a high mechanical loading at the outward side of the casing, but to take away from it the function of affording sealing integrity. In such a case it may be desirable to provide in the casing a second multipoint connector 8 which performs the function of affording hermetic sealing integrity. For that purpose, the multipoint connector which comprises one of the above-mentioned pressure-englazable materials has an equal number of metal leao-through means 9 which are hermetically sealingly disposed in the multipoint connector 8. Presure englazing of the metal lead-through means 9 in the multipoint connector 8 is effected in the usual manner and is also not subject-matter of this invention.
Figure 6 shows a frame portion 2 which is prepared to receive an individual multipoint connector when the multipoint connector simultaneously permits hermetic sealing integrity to be achieved, as was described on the multipoint connector with reference to Figures 2 and 3. Figure 7 shows a frame portion 2 which is suitable for AMENDED PA OE
receiving two multipoint connectors, namely a multipoint connector 8 in the position inwardly of the casing and a multipoint connector 4 in the position outwardly of the casing, the multipoint connector 4 comprising plastic material and not having any sealing metal lead-through means. Multipoint connectors of that kind are ccmmerciallyavailable and do not need to be described in greater detail.
Figure 8 shows a multipoint connector 4 fitted into the frame portion 2. In Figure 9 multipoint connectors 4 and 8 are fitted into the frame portion. Figure 9a shows on an enlarged scale that the plugs of the multipoint connectors 4 and 8 are connected together by wires.
As already described, the multipoint connector 4 can ccmprise ceramic material. That material has the advantage that it is a goc~
insulator and therefore insulation problems as between the various metal lead-through means do not occur. However in order that the metal lead-through means can be hermetically sealingly fitted in the bores in the multipoint connector, it is necessary for those bores to be metallised so that it is possible to solder the socket and the plug in the bore. Figure 10 is a view in section taken along line X-X
in Figure 3, showlng how such a lead-through means looks. The insides of the bores 12 in the ceramic body 4 are metallised, the socket 10 on which a metal wire 11 serving as a plug is arranged is pushed into the bore 12 and it is hermetically sealingly secured there by soldering. So that the multipoint connector 4 of ceramic can be hermetically sealingly connected to the rest of the casing, that is to say the frame 2, the bottom 5 and the top 3, the corresponding contact surfaces of the multipoint connector 4 must also be metallised. In that case a hermetically sealing connection is possible between those cc~onents, by means of soldering or laser welding. Met~ ation of the ceramic body can be effected for example with tungsten or molybdenum.
-r.
Claims (8)
1. A multi-part sealing casing (PCMCIA-casing) for accommodating electrical components, wherein the casing comprises a frame, a bottom, a top and a multipoint connector fitted at one side of the frame, wherein by being pushed in, by means of the multipoint connector, the casing can be electrically and mechanically connected to a counterpart plug in an electrical apparatus, wherein the casing (1) comprises at least two different materials of which at least one is of metal characterised in that the frame (2), the bottom (5) and the top (3) comprise a copper alloy with good thermal conductivity and high strength.
8.alpha.
8.alpha.
2. A casing according to claim 1 characterised in that the casing (1) is hermetically sealing and that the multipoint connector into which metal lead-through means (6, 9) are embedded comprises a second copper material which is pressure-englazable.
3. A casing according to claim 1 characterised in that the casing (1) is hermetically sealing and that the multipoint connector (4) into which metal lead-through means (6, 9) are embedded comprises a ceramic, such as for example Al2O3 in a high state of purity.
4. A casing according to claim 2 or claim 3 characterised in that the casing (1) is hermetically sealing and has two multipoint connectors (4, 8) which are arranged one behind the other and of which the multipoint connector which is inward of the casing comprises the second copper material or the ceramic, has hermetically sealing metal lead-though means (9) and is electrically connected to a multipoint connector (4) which is outward of the casing, the multipoint connector (4) comprising plastic material, having no sealing properties and carrying the external plugs (6) which are operatively connected to the counterpart plug.
5. A casing according to claim 3 or claim 4 characterised in that the multipoint connector (4) of ceramic is metallised at its surfaces which bear against the casing (1) (bottcm, top, frame).
6. A casing according to one of claims 1 to 5 characterised in that the second copper material comprises a pressure-englazable alloy such as for example CuNi9Sn8, CuCrZr or a CuNiSi-alloy produced in accordance with a new method, with properties which differ from conventional CuNiSi-alloys.
7. A casing according to one of claims 1 to 5 characterised in that the first copper material comprises a copper alloy which has good thermal conductivity such as for example CuFe2P or conventional CuNiSi.
8. A casing according to one of claims 1 to 5 characterised in that the second copper material comprises a pressure-englazable alloy such as for example CuNi9Sn8, CuCrZr or a CuNiSi-alloy produced in accordance with a new method, with properties which differ from commercially available CuNiSi-alloys.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4415066.0 | 1994-04-29 | ||
| DE4415066A DE4415066A1 (en) | 1994-04-29 | 1994-04-29 | Multi-part sealed housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2189043A1 true CA2189043A1 (en) | 1995-11-09 |
Family
ID=6516821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002189043A Abandoned CA2189043A1 (en) | 1994-04-29 | 1995-04-27 | Multipart sealed housing |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0757825B1 (en) |
| JP (1) | JPH09512666A (en) |
| AT (1) | ATE167942T1 (en) |
| CA (1) | CA2189043A1 (en) |
| DE (2) | DE4415066A1 (en) |
| IL (1) | IL113527A0 (en) |
| WO (1) | WO1995030207A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19624631C2 (en) * | 1996-06-20 | 2002-06-27 | Zentr Mikroelekt Dresden Gmbh | Card arrangement |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3402256A1 (en) * | 1984-01-24 | 1985-08-01 | Brown, Boveri & Cie Ag, 6800 Mannheim | Housing for accommodating electronic components |
| JPH02255394A (en) * | 1989-03-29 | 1990-10-16 | Mitsubishi Electric Corp | Memory card, ic card |
| DE3936906C2 (en) * | 1989-11-06 | 1995-02-02 | Telefunken Microelectron | Housing for automotive electronics |
| US5061845A (en) * | 1990-04-30 | 1991-10-29 | Texas Instruments Incorporated | Memory card |
| DE4115998C2 (en) * | 1991-05-16 | 1999-02-25 | Diehl Stiftung & Co | Process for the production of copper alloys |
| CA2057518C (en) * | 1991-12-09 | 1996-11-19 | Albert John Kerklaan | Jacketted circuit card |
-
1994
- 1994-04-29 DE DE4415066A patent/DE4415066A1/en not_active Ceased
-
1995
- 1995-04-27 AT AT95918616T patent/ATE167942T1/en not_active IP Right Cessation
- 1995-04-27 JP JP7527991A patent/JPH09512666A/en active Pending
- 1995-04-27 DE DE59502690T patent/DE59502690D1/en not_active Expired - Fee Related
- 1995-04-27 IL IL11352795A patent/IL113527A0/en unknown
- 1995-04-27 EP EP95918616A patent/EP0757825B1/en not_active Expired - Lifetime
- 1995-04-27 CA CA002189043A patent/CA2189043A1/en not_active Abandoned
- 1995-04-27 WO PCT/EP1995/001599 patent/WO1995030207A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| EP0757825B1 (en) | 1998-07-01 |
| ATE167942T1 (en) | 1998-07-15 |
| DE59502690D1 (en) | 1998-08-06 |
| DE4415066A1 (en) | 1995-11-02 |
| JPH09512666A (en) | 1997-12-16 |
| EP0757825A1 (en) | 1997-02-12 |
| WO1995030207A1 (en) | 1995-11-09 |
| IL113527A0 (en) | 1995-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |