CA2145870A1 - Process for treating plastic surfaces and swelling solution - Google Patents
Process for treating plastic surfaces and swelling solutionInfo
- Publication number
- CA2145870A1 CA2145870A1 CA002145870A CA2145870A CA2145870A1 CA 2145870 A1 CA2145870 A1 CA 2145870A1 CA 002145870 A CA002145870 A CA 002145870A CA 2145870 A CA2145870 A CA 2145870A CA 2145870 A1 CA2145870 A1 CA 2145870A1
- Authority
- CA
- Canada
- Prior art keywords
- swelling
- solution
- branched
- plastic surfaces
- swelling solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
The invention is directed to a process for treating polymer-containing workpiece surfaces to an aqueous non-aging solution. In addition to the swelling agents used for swelling, alkalizing agents and basic salts, the solution applied in the process contains at least one solubilizer for the swelling agent in the solution which is selected from the group of organic compounds having the general formula HO-A(OH)-R, where A represents a branched or unbranched alkene chain, R
represents a branched or unbranched alkyl group or hydrogen, and A and R
together contain at least three carbon atoms. The process and the swelling solution can be used for metallizing polymers.
represents a branched or unbranched alkyl group or hydrogen, and A and R
together contain at least three carbon atoms. The process and the swelling solution can be used for metallizing polymers.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4326079.9 | 1993-07-30 | ||
DE4326079A DE4326079A1 (en) | 1993-07-30 | 1993-07-30 | Process for the treatment of plastic surfaces and swelling solution |
PCT/DE1994/000877 WO1995004103A1 (en) | 1993-07-30 | 1994-07-22 | Process for treating plastic surfaces and swelling solution |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2145870A1 true CA2145870A1 (en) | 1995-02-09 |
CA2145870C CA2145870C (en) | 2004-08-31 |
Family
ID=6494383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2145870 Expired - Fee Related CA2145870C (en) | 1993-07-30 | 1994-07-22 | Process for treating plastic surfaces and swelling solution |
Country Status (6)
Country | Link |
---|---|
US (1) | US5591488A (en) |
EP (1) | EP0662984B1 (en) |
AT (1) | ATE172217T1 (en) |
CA (1) | CA2145870C (en) |
DE (2) | DE4326079A1 (en) |
WO (1) | WO1995004103A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19822075C2 (en) * | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Process for the metallic coating of substrates |
US6296897B1 (en) | 1998-08-12 | 2001-10-02 | International Business Machines Corporation | Process for reducing extraneous metal plating |
US20020123566A1 (en) * | 2000-12-20 | 2002-09-05 | Georgiev Emil M. | Flame retardant carbonate polymer composition |
FR2827310B1 (en) * | 2001-07-16 | 2004-07-09 | Cit Alcatel | PROCESS FOR PARTIAL GALVANIZATION OF A PART MADE BY INJECTION MOLDING |
KR20100025597A (en) * | 2005-05-23 | 2010-03-09 | 이비덴 가부시키가이샤 | Printed wiring board |
CN108929452B (en) * | 2018-07-31 | 2021-12-03 | 广东利尔化学有限公司 | Circuit board swelling agent and preparation method thereof |
CN115044891B (en) * | 2022-06-22 | 2024-02-06 | 江西超洋科技有限公司 | Aliphatic carboxylic ester copper precipitation swelling agent and preparation method and application thereof |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5133833B2 (en) * | 1973-03-19 | 1976-09-22 | ||
DE3584623D1 (en) * | 1984-05-29 | 1991-12-12 | Enthone | COMPOSITION AND METHOD FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES BEFORE METAL PLATING. |
DE3602800A1 (en) * | 1985-06-07 | 1986-12-11 | agru Alois Gruber + Sohn oHG, Bad Hall | METHOD FOR THE SURFACE MODIFICATION OF MOLDED BODIES MADE OF POLYVINYLIDEN FLUORIDE |
US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
DE3740369A1 (en) * | 1987-11-25 | 1989-06-08 | Schering Ag | METHOD FOR PRE-TREATING PLASTICS |
JPH0719959B2 (en) * | 1988-04-25 | 1995-03-06 | マクダーミツド インコーポレーテツド | Process and composition for printed circuit through holes for metallization |
US5049230A (en) * | 1988-11-07 | 1991-09-17 | Jp Laboratories, Inc. | Single step pre-swelling and etching of plastics for plating |
US4941940A (en) * | 1988-11-07 | 1990-07-17 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
DE3922477A1 (en) * | 1989-07-06 | 1991-01-17 | Schering Ag | SOURCING AGENT FOR PRE-TREATING SYNTHETIC RESIN BEFORE ELECTRICIZED METALIZATION |
DE4108461C1 (en) * | 1991-03-13 | 1992-06-25 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De |
-
1993
- 1993-07-30 DE DE4326079A patent/DE4326079A1/en not_active Ceased
-
1994
- 1994-07-22 WO PCT/DE1994/000877 patent/WO1995004103A1/en active IP Right Grant
- 1994-07-22 CA CA 2145870 patent/CA2145870C/en not_active Expired - Fee Related
- 1994-07-22 US US08/411,752 patent/US5591488A/en not_active Expired - Lifetime
- 1994-07-22 DE DE59407091T patent/DE59407091D1/en not_active Expired - Lifetime
- 1994-07-22 AT AT94922221T patent/ATE172217T1/en not_active IP Right Cessation
- 1994-07-22 EP EP94922221A patent/EP0662984B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1995004103A1 (en) | 1995-02-09 |
EP0662984B1 (en) | 1998-10-14 |
CA2145870C (en) | 2004-08-31 |
EP0662984A1 (en) | 1995-07-19 |
US5591488A (en) | 1997-01-07 |
DE59407091D1 (en) | 1998-11-19 |
DE4326079A1 (en) | 1995-02-02 |
ATE172217T1 (en) | 1998-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |