CA2080479A1 - Process for producing a thin-film magnetic tape head - Google Patents
Process for producing a thin-film magnetic tape headInfo
- Publication number
- CA2080479A1 CA2080479A1 CA002080479A CA2080479A CA2080479A1 CA 2080479 A1 CA2080479 A1 CA 2080479A1 CA 002080479 A CA002080479 A CA 002080479A CA 2080479 A CA2080479 A CA 2080479A CA 2080479 A1 CA2080479 A1 CA 2080479A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- layer
- thin
- magnetic tape
- prismoid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
There is no known feasible way of producing a true thin-film magnetic tape head with azimuth. A gap inclination (azimuth) can be made only by mechanically machining the substrate. The aim of the invention is to produce a thin-film magnetic tape head without putting two half-blocks together. According to the invention, a thin-film magnetic tape head (1, 6, 7, 8, 9) is produced in fifteen process stages in which the "hour-glass effect" is of prime importance. The process of the invention for producing a thin-film magnetic tape head combines the advantages of planar thin-film technology and gap production with the magnetic and mechanical advantages of conventionally manufactured heads. Magnetic tape devices, especially video recorders.
Description
r~ ~ PCT/EP91/00713 Proces~ for producing a ~hin-film magnetic tape head There is no promising approach known for manufacturing a true thin-film magnetic tape head with azimuth. ~nown metal-in-gap (e.g. Sony TSS, etc.) or lamelIar sendu~t-amorphous head~ are manufactured in blocks (non-planar) and the formation of ths air gap is carried out via through the putting together of two half-blocks. Thin-film blocks like, for example, the IMB Spiral ~ard Disk head, is, owing to the -small gap height, not suitàble for systems with tape-head contact as is required in magnetic tape devices.
A gap inclination (azimuth) can only be generated I through mechanically machining the backing material j (substrate).
- ..*
Apart from that, such a type of magnetic tape head cannot be considered for analog systems (long tape ' wavelengths and secondary gap effects). Systems with ;i azimuth are necessary for track-on-track writing without - lawns (separating areas bet~en the recording tracks~.
¦ It is the object of the invention to manufacture a magnetic tape head in ~hin-film technology without combining the ~wo half-blocks.
~ his task is solved according to the invention by the features o~ the first patent claim~ Advantageous further developments result from the subclaims.
, : The invention-type process for manufacturing heads de~cribed in the following combine~ the advantages of planar thin-film technology and gap production with the magnetic and mechanical advan~ages of heads manufactured .
.., ... .
, ~
. . . : . . .~.: . .. ~. ., , , , . - .
:. , ., . . . , . . .
.
.
A gap inclination (azimuth) can only be generated I through mechanically machining the backing material j (substrate).
- ..*
Apart from that, such a type of magnetic tape head cannot be considered for analog systems (long tape ' wavelengths and secondary gap effects). Systems with ;i azimuth are necessary for track-on-track writing without - lawns (separating areas bet~en the recording tracks~.
¦ It is the object of the invention to manufacture a magnetic tape head in ~hin-film technology without combining the ~wo half-blocks.
~ his task is solved according to the invention by the features o~ the first patent claim~ Advantageous further developments result from the subclaims.
, : The invention-type process for manufacturing heads de~cribed in the following combine~ the advantages of planar thin-film technology and gap production with the magnetic and mechanical advan~ages of heads manufactured .
.., ... .
, ~
. . . : . . .~.: . .. ~. ., , , , . - .
:. , ., . . . , . . .
.
.
2 0 ~ O ~ 7 9 PCT/EPgl/00713 conventionally. In the following one possible embodLment example is more closely explained by means of drawings. In khe drawings are illustrated:
Fig. 1 a section from a wafer according to the first and second procedure step, Fig. 2 ~he wafer section following a third procedure ~tep, Fig. 3 the wafer section following a fourth procedure step, Fig. 4 the wafer section following a fi~th procedure step, Fig. 5 the wafer section following a si~th and seventh procedure step, Fig. 6 the wafer section following a eighth and ninth procedure step, cmd Fig. 7 the wafer section following a tenth through fourteenth procedure step.
In a first procedure step for manufacturing a thin-film mag~etic tape head, a substrate 1 (wafer) is provided with coating 2 which is resistant to a caustic medium for the substrate 1. The coating 2 is deposited by means of vapor-deposition, sputtering or by an oxidation process.
In a ~econd named step, a window 3 i~ etched into the coating 2 by means of a photographic or photolithographic technique (Fig. lj.
I
¦ In the third step a cavity 4 is etched into the I substrate 1 through the windvw 3 ~Fig. 2~.
:', ,.
.. : :: . :: .. : . , .. , .,~, , .:
,, , , .. , . , .. , . .. . : :, 2 ~1 ~ 0 4 7 9 Following thisj a soft magnetic material 5, for e~ample, Sendust, is deposited onto the substrate. This is preferably carried out through sputtering of the window, whereby in the cavity 4, a prismoid 6 formed as a part projecting upwards ensues (hour-glass effect) (FigO 3).
After this, the coating 2 and the soft magnetic material 5 deposited on this are removed, for example, by stripping (Fig. 4).
In a sixkh procedure step the substrate 1 is etched away so far from both sides of the prismoid 6 until the prismoid projects out of the substrate surface.
In a seventh procedure step the substrate 1 is provided with a coating which serves as a gap layer 7. ~his is carried out by means of sputtering or vapor~deposition. The gap layer (gap spacer) later fonms the non-magnetic air gap (Fig. 5).
By using as~mmetric etching, for example, ~y inclining the wafer or the etching device, the gap coating is dione etched one-sidedly, i.e. sputtered parts are not etched.
Thereby, the gap coating only remains on one side of the pri~moid.
Following this, a further layer 8 is deposited on to the sl~bstrate 1 and said layer also consists of a soft magnetic material such as Sendust, for example (Fig. 6).
A~ter this, the ~arious parts of the magnetic tape head, for example, pole shoes, winding space, etc~, are shaped via a template by etching in the layer 8.
.
~ hen the substrate 1 is polished, whereby the prismoid apex (gusset ape~) is remo~ed.
... .
... .. :
~ - 4 -2 0 ~ ~ ~ 7 9 PCT/EP91/00713 After this, the head windings are manufactured in thin-film technology (not illustrated in the figures) which form the head legs of ~he thin-film magnetic tape head.
The return path of the head windings is closed via a further soft magnetic layer.
After this, the substrate or the wafer is provided with a further thick layer 9, for example, a metal oxide such as AL203, and thereby protected (Fig. 7).
Finally, the wafer is divided, ground and polished, and can then be passed on for further processing.
The process described above has the particular advantage that there are no limitations regarding the material and the track width of the tape for the magnetic tape head. Apart from that, a lamina~ion is possible, whereby eddy current osses can be prevented. In addition, only one polishing j procedure is required. Further, by using the process, pure silicon scanners can be manu~actured because always two magnetic tape heads are so arranged on the head drum that ; they are located opposite a certain azimuth in pairs.
,, .,. .,: ,:: . :. .. : .
,, ::,:, , .... . : ,.
Fig. 1 a section from a wafer according to the first and second procedure step, Fig. 2 ~he wafer section following a third procedure ~tep, Fig. 3 the wafer section following a fourth procedure step, Fig. 4 the wafer section following a fi~th procedure step, Fig. 5 the wafer section following a si~th and seventh procedure step, Fig. 6 the wafer section following a eighth and ninth procedure step, cmd Fig. 7 the wafer section following a tenth through fourteenth procedure step.
In a first procedure step for manufacturing a thin-film mag~etic tape head, a substrate 1 (wafer) is provided with coating 2 which is resistant to a caustic medium for the substrate 1. The coating 2 is deposited by means of vapor-deposition, sputtering or by an oxidation process.
In a ~econd named step, a window 3 i~ etched into the coating 2 by means of a photographic or photolithographic technique (Fig. lj.
I
¦ In the third step a cavity 4 is etched into the I substrate 1 through the windvw 3 ~Fig. 2~.
:', ,.
.. : :: . :: .. : . , .. , .,~, , .:
,, , , .. , . , .. , . .. . : :, 2 ~1 ~ 0 4 7 9 Following thisj a soft magnetic material 5, for e~ample, Sendust, is deposited onto the substrate. This is preferably carried out through sputtering of the window, whereby in the cavity 4, a prismoid 6 formed as a part projecting upwards ensues (hour-glass effect) (FigO 3).
After this, the coating 2 and the soft magnetic material 5 deposited on this are removed, for example, by stripping (Fig. 4).
In a sixkh procedure step the substrate 1 is etched away so far from both sides of the prismoid 6 until the prismoid projects out of the substrate surface.
In a seventh procedure step the substrate 1 is provided with a coating which serves as a gap layer 7. ~his is carried out by means of sputtering or vapor~deposition. The gap layer (gap spacer) later fonms the non-magnetic air gap (Fig. 5).
By using as~mmetric etching, for example, ~y inclining the wafer or the etching device, the gap coating is dione etched one-sidedly, i.e. sputtered parts are not etched.
Thereby, the gap coating only remains on one side of the pri~moid.
Following this, a further layer 8 is deposited on to the sl~bstrate 1 and said layer also consists of a soft magnetic material such as Sendust, for example (Fig. 6).
A~ter this, the ~arious parts of the magnetic tape head, for example, pole shoes, winding space, etc~, are shaped via a template by etching in the layer 8.
.
~ hen the substrate 1 is polished, whereby the prismoid apex (gusset ape~) is remo~ed.
... .
... .. :
~ - 4 -2 0 ~ ~ ~ 7 9 PCT/EP91/00713 After this, the head windings are manufactured in thin-film technology (not illustrated in the figures) which form the head legs of ~he thin-film magnetic tape head.
The return path of the head windings is closed via a further soft magnetic layer.
After this, the substrate or the wafer is provided with a further thick layer 9, for example, a metal oxide such as AL203, and thereby protected (Fig. 7).
Finally, the wafer is divided, ground and polished, and can then be passed on for further processing.
The process described above has the particular advantage that there are no limitations regarding the material and the track width of the tape for the magnetic tape head. Apart from that, a lamina~ion is possible, whereby eddy current osses can be prevented. In addition, only one polishing j procedure is required. Further, by using the process, pure silicon scanners can be manu~actured because always two magnetic tape heads are so arranged on the head drum that ; they are located opposite a certain azimuth in pairs.
,, .,. .,: ,:: . :. .. : .
,, ::,:, , .... . : ,.
Claims (6)
1. Process for producing a thin-film magnetic tape head, c h a r a c t e r i z e d b y the following steps:
a) A substrate (1) (wafer) is provided with a coating (layer) (2) which is resistant to a caustic medium for the substrate (1).
b) A window (3) is etched into the layer (2).
c) A cavity (4) is etched into the substrate (1) through the window (3).
d) A magnetic material (5) (e.g. Sendust) is deposited on to the substrate (1), whereby in the cavity (4), a prismoid (6) formed as a gusset (wedge) projecting upwards ensues.
e) The layer (2) and the magnetic material (5) deposited thereon are removed, for example, by stripping.
f) The substrate (1) is etched away so far from both sides of the prismoid (6) until the prismoid projects out of the substrate surface.
g) The substrate (1) is provided with a layer which serves as a gap coating (7).
h) By using asymmetric etching, for example, by inclining the wafer or the etching device, the gap layer (7) is partly removed, whereby the gap layer remains on one side of the prismoid (6).
i) A further layer (8), consisting of a magnetic material (e.g. Sendust), is deposited on to the substrate (1).
j) Various parts of the magnetic tape head, for example, pole shoes, winding space, etc., are shaped by etching in the further layer (8).
k) The substrate (1) is polished, whereby the prismoid apex (gusset apex) is removed.
l) Head windings are manufactured in thin-film technology which form the head legs of the thin-film magnetic tape head.
m) A further magnetic layer is deposited and this produces a return path for the head windings.
n) The substrate is provided with a further layer (9), for example, a metal oxide such as AL2O3, and thereby protected.
o) The wafer is divided, ground and polished.
a) A substrate (1) (wafer) is provided with a coating (layer) (2) which is resistant to a caustic medium for the substrate (1).
b) A window (3) is etched into the layer (2).
c) A cavity (4) is etched into the substrate (1) through the window (3).
d) A magnetic material (5) (e.g. Sendust) is deposited on to the substrate (1), whereby in the cavity (4), a prismoid (6) formed as a gusset (wedge) projecting upwards ensues.
e) The layer (2) and the magnetic material (5) deposited thereon are removed, for example, by stripping.
f) The substrate (1) is etched away so far from both sides of the prismoid (6) until the prismoid projects out of the substrate surface.
g) The substrate (1) is provided with a layer which serves as a gap coating (7).
h) By using asymmetric etching, for example, by inclining the wafer or the etching device, the gap layer (7) is partly removed, whereby the gap layer remains on one side of the prismoid (6).
i) A further layer (8), consisting of a magnetic material (e.g. Sendust), is deposited on to the substrate (1).
j) Various parts of the magnetic tape head, for example, pole shoes, winding space, etc., are shaped by etching in the further layer (8).
k) The substrate (1) is polished, whereby the prismoid apex (gusset apex) is removed.
l) Head windings are manufactured in thin-film technology which form the head legs of the thin-film magnetic tape head.
m) A further magnetic layer is deposited and this produces a return path for the head windings.
n) The substrate is provided with a further layer (9), for example, a metal oxide such as AL2O3, and thereby protected.
o) The wafer is divided, ground and polished.
2. Process according to claim 1, c h a r a c t e r -i z e d i n t h a t the prismoid is completely raised out of the substrate.
3. Process according to claim 1, characterized is that the window 3 is etched using a photographic or photolithographic technique.
4. Process according to claim 1 or 3, c h a r -a c t e r i z e d i n t h a t the window (3) is rectangular-shaped.
5. Process according to claim 1 or 2, c h a r -a c t e r i z e d i n t h a t the prismoid is formed as a prism.
6. Process according to claim 1, c h a r a c t e r -i z e d i n t h a t the magnetic materials (5, 8) are formed as soft magnetic materials.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4012823.7 | 1990-04-23 | ||
| DE4012823A DE4012823A1 (en) | 1990-04-23 | 1990-04-23 | METHOD FOR PRODUCING A THIN FILM MAGNETIC TAPE HEAD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2080479A1 true CA2080479A1 (en) | 1991-10-24 |
Family
ID=6404859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002080479A Abandoned CA2080479A1 (en) | 1990-04-23 | 1991-04-15 | Process for producing a thin-film magnetic tape head |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0526509B1 (en) |
| JP (1) | JP2977897B2 (en) |
| KR (1) | KR100198864B1 (en) |
| AT (1) | ATE117452T1 (en) |
| AU (1) | AU7673591A (en) |
| CA (1) | CA2080479A1 (en) |
| DE (2) | DE4012823A1 (en) |
| ES (1) | ES2069290T3 (en) |
| HK (1) | HK113796A (en) |
| WO (1) | WO1991016703A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4399479A (en) * | 1981-02-04 | 1983-08-16 | Eastman Kodak Company | Thin film magnetic head having good low frequency response |
| JPS5996527A (en) * | 1982-11-22 | 1984-06-04 | Olympus Optical Co Ltd | Production of magnetic head |
| DE3776359D1 (en) * | 1986-02-13 | 1992-03-12 | Sony Corp | Duennschichtmagnetkopf. |
| US4853080A (en) * | 1988-12-14 | 1989-08-01 | Hewlett-Packard | Lift-off process for patterning shields in thin magnetic recording heads |
| US5016342A (en) * | 1989-06-30 | 1991-05-21 | Ampex Corporation | Method of manufacturing ultra small track width thin film transducers |
-
1990
- 1990-04-23 DE DE4012823A patent/DE4012823A1/en not_active Withdrawn
-
1991
- 1991-04-15 EP EP91908072A patent/EP0526509B1/en not_active Expired - Lifetime
- 1991-04-15 CA CA002080479A patent/CA2080479A1/en not_active Abandoned
- 1991-04-15 AU AU76735/91A patent/AU7673591A/en not_active Abandoned
- 1991-04-15 ES ES91908072T patent/ES2069290T3/en not_active Expired - Lifetime
- 1991-04-15 WO PCT/EP1991/000713 patent/WO1991016703A1/en active IP Right Grant
- 1991-04-15 AT AT91908072T patent/ATE117452T1/en not_active IP Right Cessation
- 1991-04-15 DE DE59104338T patent/DE59104338D1/en not_active Expired - Fee Related
- 1991-04-15 JP JP3507476A patent/JP2977897B2/en not_active Expired - Fee Related
-
1992
- 1992-10-23 KR KR1019920702620A patent/KR100198864B1/en not_active IP Right Cessation
-
1996
- 1996-06-27 HK HK113796A patent/HK113796A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATE117452T1 (en) | 1995-02-15 |
| EP0526509B1 (en) | 1995-01-18 |
| KR100198864B1 (en) | 1999-06-15 |
| AU7673591A (en) | 1991-11-11 |
| EP0526509A1 (en) | 1993-02-10 |
| DE59104338D1 (en) | 1995-03-02 |
| ES2069290T3 (en) | 1995-05-01 |
| WO1991016703A1 (en) | 1991-10-31 |
| DE4012823A1 (en) | 1991-11-14 |
| JPH05508254A (en) | 1993-11-18 |
| JP2977897B2 (en) | 1999-11-15 |
| HK113796A (en) | 1996-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |