CA2072030A1 - Electronic detonator component and method of assembling an electronic detonator - Google Patents
Electronic detonator component and method of assembling an electronic detonatorInfo
- Publication number
- CA2072030A1 CA2072030A1 CA002072030A CA2072030A CA2072030A1 CA 2072030 A1 CA2072030 A1 CA 2072030A1 CA 002072030 A CA002072030 A CA 002072030A CA 2072030 A CA2072030 A CA 2072030A CA 2072030 A1 CA2072030 A1 CA 2072030A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- enclosure
- dissipating device
- energy dissipating
- electronic detonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000002360 explosive Substances 0.000 claims abstract description 29
- 238000010276 construction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- 241001282736 Oriens Species 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/121—Initiators with incorporated integrated circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Air Bags (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A method of assembling an electronic detonator which includes an energy dissipating device formed on a substrate, wherein the energy dissipating device is located in an enclosure, a primary explosive is placed in the enclosure, and a force is applied to the primary explosive to compress the primary explosive into intimate contact with the energy dissipating device, the direction of the force which is applied being at any angle other than perpendicular relatively to the surface of the substrate in the region of the energy dissipating device.
A method of assembling an electronic detonator which includes an energy dissipating device formed on a substrate, wherein the energy dissipating device is located in an enclosure, a primary explosive is placed in the enclosure, and a force is applied to the primary explosive to compress the primary explosive into intimate contact with the energy dissipating device, the direction of the force which is applied being at any angle other than perpendicular relatively to the surface of the substrate in the region of the energy dissipating device.
Description
7~30 BAC~CGROUND OF THE INVENTION
This invention relates generally to an electronic detonator component and is particularly concerned with a method of assembiing an electronic detonator.
lt is known to fabricate a detonator firing element which includes an ener~y dissipation device and elsctrorlic control circuitry using int~gra~ed circuit techniques. As the 0nergy dissipatin~ device i$ relatively small it dissipates a small amount of energy, when actuated. This ener~y must b~ effecthrely transferred to a primary explosive to initiate detonation. nle primary explcsive must therefore be in good thermal contact with the energy dissipatin~ device.
A cletonator of the aforementioned kind is described for example in the specification ot U.K. patent No.2190730.
SUMMARY OF THE INVENTION
The invention is concerned in th~ tirst instance with a method of ass~mbling an electronic detonator, which is easy to implemen~, and which ensures that t~le primary explosive is brought into in~imate con~ac~ with the energy dissipating device.
.~
o The inven~ion provides a method of assembling an elec~ronic detonator which includes an energy dissipating device formed on a substrate, whsrein the energy ~issipating device is located in an enclosure, a primary explosive is placed in the enclosure, and a force is applied to the prirnary explosive to compress the primary explosive ints intimate curltact with ~he ener~y dissipating device, the direction of the force which is applied being at any angle other than perpendicular relatiYely to ~he surface of ~he subs~rate in the region ot the energy dissipating device.
Preferably the direction of the force which is applie~ to ~he primary explosive is substantially parallel to the surface of the substrate in the region of the en2rgy dissipating device.
The method may include the step of providing isola~ing means around the substrate within the enclosure to isolate a portion of the substrate wi~h the energy dissipating device, on one side of the isolating means, ~rom a portion of the substrate on an opposing side of the isolating means.
The invention also e~tends to an electronic detonator component which includes an enclosure, a substrate which is locate~ at least partia~ly inside the enclosure, and an energy dissipating devic@ which is formed on the substrate and which is loca~ed inside the enclosure, the surface of the substrate in the region of the energy dissipating device opposing an inner wa~l surface of the enclosure.
, .
This invention relates generally to an electronic detonator component and is particularly concerned with a method of assembiing an electronic detonator.
lt is known to fabricate a detonator firing element which includes an ener~y dissipation device and elsctrorlic control circuitry using int~gra~ed circuit techniques. As the 0nergy dissipatin~ device i$ relatively small it dissipates a small amount of energy, when actuated. This ener~y must b~ effecthrely transferred to a primary explosive to initiate detonation. nle primary explcsive must therefore be in good thermal contact with the energy dissipatin~ device.
A cletonator of the aforementioned kind is described for example in the specification ot U.K. patent No.2190730.
SUMMARY OF THE INVENTION
The invention is concerned in th~ tirst instance with a method of ass~mbling an electronic detonator, which is easy to implemen~, and which ensures that t~le primary explosive is brought into in~imate con~ac~ with the energy dissipating device.
.~
o The inven~ion provides a method of assembling an elec~ronic detonator which includes an energy dissipating device formed on a substrate, whsrein the energy ~issipating device is located in an enclosure, a primary explosive is placed in the enclosure, and a force is applied to the prirnary explosive to compress the primary explosive ints intimate curltact with ~he ener~y dissipating device, the direction of the force which is applied being at any angle other than perpendicular relatiYely to ~he surface of ~he subs~rate in the region ot the energy dissipating device.
Preferably the direction of the force which is applie~ to ~he primary explosive is substantially parallel to the surface of the substrate in the region of the en2rgy dissipating device.
The method may include the step of providing isola~ing means around the substrate within the enclosure to isolate a portion of the substrate wi~h the energy dissipating device, on one side of the isolating means, ~rom a portion of the substrate on an opposing side of the isolating means.
The invention also e~tends to an electronic detonator component which includes an enclosure, a substrate which is locate~ at least partia~ly inside the enclosure, and an energy dissipating devic@ which is formed on the substrate and which is loca~ed inside the enclosure, the surface of the substrate in the region of the energy dissipating device opposing an inner wa~l surface of the enclosure.
, .
2 ~
Pa~e 3 The sur~ace of the substrate, or of the inner wall, or bo~h surfaces, may be planar or curved, or have any other shape. These surfaces may be substantially parallel to one another, or extend generally in the same direction, or one surface may be relatively inclined to the other surface.
Preferably ~he surface of the substra~e in the region of the energy dissipating devlce is substan~ially parallel to an opposing inner wall surface of the enclosure.
The enclosure may have a moueh or opening and the energy dissipating device may be positioned inside the enclosure so that the surface of the subs~rate In the region ot the energy dissipating device is substantially at righl angles to a plane in which the opening or mouth lies.
The enclosure may be of any appropriate shape bu~ preferably is tubular.
The substrat~ may be rectangular in outline and extend longitudinally inside the enclosure. The substrate may ex~end from a first inner wall surface of the enclosure to an opposing inner wall sur~ace. The subs~rate preferably extends diametrically across the enclosure.
Isolating means may be provided around the substrate in contact with an opposing inner circumferential wall sufface of the enclosur~ and isolating a - : 2~7~
portion ot the substrate with the energy dissipating device on one side of the isolating means from a portion of the subs~rate on an opposing side of the isolatillg means.
Primary explosive may be located in a cavity which is formed be~ween a surface of the substrate in the region of the energy dissipa~ing device and an opposing inn~r wall suflace of the enclosure.
The cavity may be bounded at least partly by portion of the said isolating means.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention is further described by way of examples with reference to ~he accompanying drawings in which:
Figure 1 is a view in los~gitudinal cross seotion of an elec~ronio detonator component according to one form of th~ inven~ion, and Figure 2 is a lon~i~udinal vi~w in cross section, but at righ~ angles ~o the view of Fi~ure 1, of th~ electronic detonator componen~ engaged with a d~tona~or can, and 2~72~
Page ~
Figures 3 to 5 illustra~e in simplified form thre~ respe~ive techniqu~ fgr mounting a ~lexi~le substrate to a housing.
DESCRIPTION OF PREFERRED EMBODINIENTS
Fi0ures 1 and 2 of the accompanying drawin~s illustrate a de~onator component 10 which includes a tubular housin~ or enclosur~ 12, a substrate 14 on or in which ~s formed, or to which attached, integrated circuitry 16 and an energy ~issipating device 18, and an isolatin~ member 20.
The integra~ed circuit 16 can be formed in any appropriat~ way using techniques which are conventional and known per se. For this reason this aspect o~ the invention is not further described hereinafter.
Similarly the ener~y dissipating device 18 may be formed in any one of a number of ways and may for example include thick fi~m bridges, thin film bridges, bridges formed by printing techniques, etching, laser cutting, spulttering, or vacuum deposition, and film bridges. Although the energy dissipating device is shown in the accompanying drawings as being formed together with an integrated electronic circuit 16, and this is ~he preferred form of construction, it is to be understoocl that this type of constru~ion is given on;y by way of example and the scope of the invention is not iimited ~o an electronic "` ~0~2~3~
detonator component which is based on the use ot an inte~rated electronic circuit nor on the use of an energy dissipating device which is ~ormed by in~egratecl circuit tec~niques.
Reference may be made to the specifica~ion of lJ.~. patent No.21~0730 for an exemplary description of a detonator firing elernent which includes an energy dissipatin~ device and electronic control circuitry formed by means of in~egrat~d circuit techlliques. The specification of this pa~ent also gives a number of examples of suitable energy dissipating d~vices.
The substrate 1~ is in ~he form of a prinited circuit board of rectangular outline.
The wid~h of ~he board is slightly less than the in~ernal diameter o~ ~he tubular enclosure 1~ and consequently when the board is inserted into the enclosure, as shown in the drawings, i~ extends longitudinally subs~antially for the length of the enclosure and diametrically across the interior of the enc~osure abufflng ~iametrically opposed inner wall sufla~es of the enclosure. The sur~ace of the substrate, in the region of the ener~y clissipating device 18, is approximately at righ~ angles ~o the plane which the mouth or opening of the tubular enclosure, acljacent the device 18, occupies.
The isola~iny member 20 is borlded to the substrate 14 and extends circumferentially around it tightly engaging with an inner ciroumferential wall surface of the enclosure. The isolating means therefore e~ectively separates that ~203~
portion of the suhstrate which carries the ener~y di~sipating rlevice 18 from the remainder of the substrate, designa~ed 22, on an oppssing side of the isslating means.
Th portion 22 o~ the substrate carries contact pads 24 by means o~ which a cable 26 ean be csnnected to the integra~ed circuit.
A shroud 30 engages with th~ cable and an outer surface of the tubular enclosur~. This is shown schematically only tor any other m~ans may be provided to protect the connections ot the cable to the substrate. For example it is common practice to use a can 36 for this purpose, in which event the tubular enclosure is completely located inside the can and ~he mouth of the can is then crimped closed, on ~o the cable.
Once the substrate has been positioned inside the enclosure 12, in the manner described, a primary explosive 32 is placed in a cavity 34 which is defined by the portion of the subs~rate which is above the isolating member 20, in the drawings, by the adjacent surface of the isolating member, and by a por~ion of the inner wall of the tubular housing. The primary explosive 32 is compressed into the cavity by means of a press pin ~0 under a force F whieh is directed as shown in Figure 1 i.e. in a direction which is parallel to the longitudina~ axis of ~he tubular housing. The primary explosive is in powder ~orm and, within the body of the primary explosive, laterally directed compressive forces arise which urge 2~7~
~he primary explosive into intimate contact with the energy dissipating device 18.
The construction of the electronic detonator component has the advantage that the isolating member 20 separates ~he lower portion 22 of the substrat2 from the primary explosive. Th~ componen7s and the circuitry on or connected to the lower por~ion 22 are therefore not exposed to ~he effects ot the primary explosive, nor to the compressive force of the press pin acting with tsrGe F on the explosive.
The orientation of the substrate 14 which is longitudinally aligned inside the tubular housing and which spans the diameter of the housing means that ample space is available to make connections to the substrate and where necessary to secure components to the su~stra~e. This must be contraste~ wi~h the situation which pertains when the substrate extends diametrically across the tubular housing and, in effect, has a surface area equal to ~he cross sectional area o~ the housing.
Significant benefits ~herefore arise when the substrate is orien~0d within the tubular enclosure as shown in the drawings. As the sub~trate carries the energy dissipatin~ device 18 it follows that the surface ot ~he substrate, adjacen~ the ener~y dissipating device, lies in the general plane o~ the entire substrate.
Access to the cavity 34 is limited and it is therefore not normally possible to appiy force to the primary explosive,in a direction which is perpendicular ts) the 0 3 ~
surface of the substrate adjacent the energy dissipating device, in order to force the explosive into intimate contact with the energy dissipating device. It has been found however that even when the force is applied in the direction shown in the drawings, which is in a direction parallel to the surFace of the substrate, that ~aterally directed compressive forces ariSe which ensure that the primary ~plosive is forced into intimate contact with the ener~y dissipating device. As a substantial amount of foroe can be exerted in the way described a good therrnal bond between the primary explosive and ~he energy dissipa~in~ device is achieved.
The isolating component 20 may be formed by any one of a number of techniques and, for example, may be over-moulded, cast with resin, press fmed, tormed in the same way as glass to metal sealed transistor headers ars formed, or in any other equivalent manner.
Once the component 10 has been formed a d~onator can 36 which con~ains a secondary explosive 38 is attached to the tubular enclo-~ure 12. The can 36 is engaged with the outer side of the enclosure.
The cable 26 which is attached to ~he substrat0 may be part of a cable hamess in a sequential blasting system. This aspect of the inven~ion is known per se and consequently is not further described herein.
2072~3~
The arrangement o~ Figures 1 and 2 makes use of substrate 14 which may be rigid. In the simpli~ied arrangemen~s of Figures 3, 4 and 5 the su~strate, designated 50, is flexible and thus can be curved, and carries integral conductors ~2 which replace the cable 26. The circuit 16 and energy clissipa~ing clevice 18, of Figures 1 and 2, are shown collectively as a component 5~, in Figures 3, ~ and 5.
In Figure 3 the substrate passes through an operling 56 in a wall of an enclosure 58 and then en~ers a hollow 60 via a mouth 62. The component 54 lies against an inner wall surface of the hol~ow and primary explosive, not shown, is compacte~ into the hollow in the manner which has been described with reference to Figures 1 and 2. The Figure 3 cons~ruction obviates the need ~or an isolating member of the kind designated 20 in Figures 1 and 2.
In the Figure 4 arrangement the substrate 50 passes through an isolating member 64 and lies on an inclined sur~ace 66 so that the component ~4 is slightly inclined to the direction 68 in which a force F is applie~ ~o compress primary explosive into the hollow 60.
Figure 5 shows a construction wherein the flexi~le substrate ~0 passes through arl isolatirlg member 64 and lies against, or close to, an inner wall surface of the hollow 60.
~203~
, It is to be understood that the use of a flexible substrate allows a variety ~f constructions to be implemented, all of which fall inside the scope of the invention.
, , .
Pa~e 3 The sur~ace of the substrate, or of the inner wall, or bo~h surfaces, may be planar or curved, or have any other shape. These surfaces may be substantially parallel to one another, or extend generally in the same direction, or one surface may be relatively inclined to the other surface.
Preferably ~he surface of the substra~e in the region of the energy dissipating devlce is substan~ially parallel to an opposing inner wall surface of the enclosure.
The enclosure may have a moueh or opening and the energy dissipating device may be positioned inside the enclosure so that the surface of the subs~rate In the region ot the energy dissipating device is substantially at righl angles to a plane in which the opening or mouth lies.
The enclosure may be of any appropriate shape bu~ preferably is tubular.
The substrat~ may be rectangular in outline and extend longitudinally inside the enclosure. The substrate may ex~end from a first inner wall surface of the enclosure to an opposing inner wall sur~ace. The subs~rate preferably extends diametrically across the enclosure.
Isolating means may be provided around the substrate in contact with an opposing inner circumferential wall sufface of the enclosur~ and isolating a - : 2~7~
portion ot the substrate with the energy dissipating device on one side of the isolating means from a portion of the subs~rate on an opposing side of the isolatillg means.
Primary explosive may be located in a cavity which is formed be~ween a surface of the substrate in the region of the energy dissipa~ing device and an opposing inn~r wall suflace of the enclosure.
The cavity may be bounded at least partly by portion of the said isolating means.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention is further described by way of examples with reference to ~he accompanying drawings in which:
Figure 1 is a view in los~gitudinal cross seotion of an elec~ronio detonator component according to one form of th~ inven~ion, and Figure 2 is a lon~i~udinal vi~w in cross section, but at righ~ angles ~o the view of Fi~ure 1, of th~ electronic detonator componen~ engaged with a d~tona~or can, and 2~72~
Page ~
Figures 3 to 5 illustra~e in simplified form thre~ respe~ive techniqu~ fgr mounting a ~lexi~le substrate to a housing.
DESCRIPTION OF PREFERRED EMBODINIENTS
Fi0ures 1 and 2 of the accompanying drawin~s illustrate a de~onator component 10 which includes a tubular housin~ or enclosur~ 12, a substrate 14 on or in which ~s formed, or to which attached, integrated circuitry 16 and an energy ~issipating device 18, and an isolatin~ member 20.
The integra~ed circuit 16 can be formed in any appropriat~ way using techniques which are conventional and known per se. For this reason this aspect o~ the invention is not further described hereinafter.
Similarly the ener~y dissipating device 18 may be formed in any one of a number of ways and may for example include thick fi~m bridges, thin film bridges, bridges formed by printing techniques, etching, laser cutting, spulttering, or vacuum deposition, and film bridges. Although the energy dissipating device is shown in the accompanying drawings as being formed together with an integrated electronic circuit 16, and this is ~he preferred form of construction, it is to be understoocl that this type of constru~ion is given on;y by way of example and the scope of the invention is not iimited ~o an electronic "` ~0~2~3~
detonator component which is based on the use ot an inte~rated electronic circuit nor on the use of an energy dissipating device which is ~ormed by in~egratecl circuit tec~niques.
Reference may be made to the specifica~ion of lJ.~. patent No.21~0730 for an exemplary description of a detonator firing elernent which includes an energy dissipatin~ device and electronic control circuitry formed by means of in~egrat~d circuit techlliques. The specification of this pa~ent also gives a number of examples of suitable energy dissipating d~vices.
The substrate 1~ is in ~he form of a prinited circuit board of rectangular outline.
The wid~h of ~he board is slightly less than the in~ernal diameter o~ ~he tubular enclosure 1~ and consequently when the board is inserted into the enclosure, as shown in the drawings, i~ extends longitudinally subs~antially for the length of the enclosure and diametrically across the interior of the enc~osure abufflng ~iametrically opposed inner wall sufla~es of the enclosure. The sur~ace of the substrate, in the region of the ener~y clissipating device 18, is approximately at righ~ angles ~o the plane which the mouth or opening of the tubular enclosure, acljacent the device 18, occupies.
The isola~iny member 20 is borlded to the substrate 14 and extends circumferentially around it tightly engaging with an inner ciroumferential wall surface of the enclosure. The isolating means therefore e~ectively separates that ~203~
portion of the suhstrate which carries the ener~y di~sipating rlevice 18 from the remainder of the substrate, designa~ed 22, on an oppssing side of the isslating means.
Th portion 22 o~ the substrate carries contact pads 24 by means o~ which a cable 26 ean be csnnected to the integra~ed circuit.
A shroud 30 engages with th~ cable and an outer surface of the tubular enclosur~. This is shown schematically only tor any other m~ans may be provided to protect the connections ot the cable to the substrate. For example it is common practice to use a can 36 for this purpose, in which event the tubular enclosure is completely located inside the can and ~he mouth of the can is then crimped closed, on ~o the cable.
Once the substrate has been positioned inside the enclosure 12, in the manner described, a primary explosive 32 is placed in a cavity 34 which is defined by the portion of the subs~rate which is above the isolating member 20, in the drawings, by the adjacent surface of the isolating member, and by a por~ion of the inner wall of the tubular housing. The primary explosive 32 is compressed into the cavity by means of a press pin ~0 under a force F whieh is directed as shown in Figure 1 i.e. in a direction which is parallel to the longitudina~ axis of ~he tubular housing. The primary explosive is in powder ~orm and, within the body of the primary explosive, laterally directed compressive forces arise which urge 2~7~
~he primary explosive into intimate contact with the energy dissipating device 18.
The construction of the electronic detonator component has the advantage that the isolating member 20 separates ~he lower portion 22 of the substrat2 from the primary explosive. Th~ componen7s and the circuitry on or connected to the lower por~ion 22 are therefore not exposed to ~he effects ot the primary explosive, nor to the compressive force of the press pin acting with tsrGe F on the explosive.
The orientation of the substrate 14 which is longitudinally aligned inside the tubular housing and which spans the diameter of the housing means that ample space is available to make connections to the substrate and where necessary to secure components to the su~stra~e. This must be contraste~ wi~h the situation which pertains when the substrate extends diametrically across the tubular housing and, in effect, has a surface area equal to ~he cross sectional area o~ the housing.
Significant benefits ~herefore arise when the substrate is orien~0d within the tubular enclosure as shown in the drawings. As the sub~trate carries the energy dissipatin~ device 18 it follows that the surface ot ~he substrate, adjacen~ the ener~y dissipating device, lies in the general plane o~ the entire substrate.
Access to the cavity 34 is limited and it is therefore not normally possible to appiy force to the primary explosive,in a direction which is perpendicular ts) the 0 3 ~
surface of the substrate adjacent the energy dissipating device, in order to force the explosive into intimate contact with the energy dissipating device. It has been found however that even when the force is applied in the direction shown in the drawings, which is in a direction parallel to the surFace of the substrate, that ~aterally directed compressive forces ariSe which ensure that the primary ~plosive is forced into intimate contact with the ener~y dissipating device. As a substantial amount of foroe can be exerted in the way described a good therrnal bond between the primary explosive and ~he energy dissipa~in~ device is achieved.
The isolating component 20 may be formed by any one of a number of techniques and, for example, may be over-moulded, cast with resin, press fmed, tormed in the same way as glass to metal sealed transistor headers ars formed, or in any other equivalent manner.
Once the component 10 has been formed a d~onator can 36 which con~ains a secondary explosive 38 is attached to the tubular enclo-~ure 12. The can 36 is engaged with the outer side of the enclosure.
The cable 26 which is attached to ~he substrat0 may be part of a cable hamess in a sequential blasting system. This aspect of the inven~ion is known per se and consequently is not further described herein.
2072~3~
The arrangement o~ Figures 1 and 2 makes use of substrate 14 which may be rigid. In the simpli~ied arrangemen~s of Figures 3, 4 and 5 the su~strate, designated 50, is flexible and thus can be curved, and carries integral conductors ~2 which replace the cable 26. The circuit 16 and energy clissipa~ing clevice 18, of Figures 1 and 2, are shown collectively as a component 5~, in Figures 3, ~ and 5.
In Figure 3 the substrate passes through an operling 56 in a wall of an enclosure 58 and then en~ers a hollow 60 via a mouth 62. The component 54 lies against an inner wall surface of the hol~ow and primary explosive, not shown, is compacte~ into the hollow in the manner which has been described with reference to Figures 1 and 2. The Figure 3 cons~ruction obviates the need ~or an isolating member of the kind designated 20 in Figures 1 and 2.
In the Figure 4 arrangement the substrate 50 passes through an isolating member 64 and lies on an inclined sur~ace 66 so that the component ~4 is slightly inclined to the direction 68 in which a force F is applie~ ~o compress primary explosive into the hollow 60.
Figure 5 shows a construction wherein the flexi~le substrate ~0 passes through arl isolatirlg member 64 and lies against, or close to, an inner wall surface of the hollow 60.
~203~
, It is to be understood that the use of a flexible substrate allows a variety ~f constructions to be implemented, all of which fall inside the scope of the invention.
, , .
Claims (14)
1. A method of assembling an electronic detonator which includes an energy dissipating device formed on a substrate, wherein the energy dissipating device is located in an enclosure, a primary explosive is placed in the enclosure, and a force is applied to the primary explosive to compress the primary explosive into intimate contact with the energy dissipating device, the direction of the force which is applied being at any angle other than perpendicular relatively to the surface of the substrate in the region of the energy dissipating device.
2. A method according to claim 1 wherein the direction of the force which is applied to the primary explosive is substantially parallel to the surface of the substrate in the region of the energy dissipating device.
3. A method according to claim 1 which includes the step of providing isolating means around the substrate within the enclosure to isolate a portion of the substrate with the energy dissipating device, on one side of the isolating means, from a portion of the substrate on an opposing side of the isolating means.
4. An electronic detonator component which includes an enclosure, a substrate which is located at least partially inside the enclosure, and an energy dissipating device which is formed on the substrate and which is located inside the enclosure, the surface of the substrate in the region of the energy dissipating device opposing an inner wall surface of the enclosure.
5. An electronic detonator component according to claim 4 wherein the surface of the substrate is curved.
6. An electronic detonator component according to claim 4 wherein the surface of the inner wall is curved.
7. An electronic detonator component according to claim 4 wherein the surface of the substrate in the region of the energy dissipating device is substantially parallel to an opposing inner wall surface of the enclosure.
8. An electronic detonator component according to claim 4 wherein the enclosure has a mouth or opening and the energy dissipating device is positioned inside the enclosure so that the surface of the substrate in the region of the energy dissipating device is substantially at right angles to a plane in which the opening or mouth lies.
9. An electronic detonator component according to claim 4 wherein the enclosure is tubular.
10. An electronic detonator component according to claim 4 wherein the substrate is rectangular in outline and extends longitudinally inside the enclosure.
11. An electronic detonator component according to claim 10 wherein the substrate extends from a first inner wall surface of the enclosure to an opposing inner wall surface.
12. An electronic detonator component according to claim 4 which includes isolating means around the substrate in contact with an opposing inner circumferential wall surface of the enclosure and isolating a portion of the substrate with the energy dissipating device on one side of the isolating means from a portion of the substrate on an opposing side of the isolating means.
13. An electronic detonator component according to claim 4 which includes primary explosive located in a cavity which is formed between a surface of the substrate in the region of the energy dissipating device and an opposing inner wall surface of the enclosure.
14. An electronic detonator component according to claim 4 wherein the substrate is flexible.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA91/4914 | 1991-06-26 | ||
| ZA914914 | 1991-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2072030A1 true CA2072030A1 (en) | 1992-12-27 |
Family
ID=25580770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002072030A Abandoned CA2072030A1 (en) | 1991-06-26 | 1992-06-23 | Electronic detonator component and method of assembling an electronic detonator |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0520360A1 (en) |
| CA (1) | CA2072030A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2103510A1 (en) * | 1992-09-11 | 1994-03-12 | Bradley D. Harris | Printed circuit bridge for an airbag inflator |
| EP0717259A1 (en) * | 1994-12-14 | 1996-06-19 | Altech Industries (Pty) Limited | Detonators |
| FR2790077B1 (en) * | 1999-02-18 | 2001-12-28 | Livbag Snc | ELECTRO-PYROTECHNIC IGNITER WITH INTEGRATED ELECTRONICS |
| US6598532B2 (en) * | 2001-08-14 | 2003-07-29 | Donald G. Gerard | Electric circuit for an electrically dischargeable primer |
| CN103090751A (en) * | 2013-02-27 | 2013-05-08 | 中国科学技术大学 | Concave-type variable cross-section detonator excitation device and detonator using same |
| CN108317918B (en) * | 2018-03-29 | 2024-03-22 | 贵州盘江民爆有限公司 | Full-automatic electronic detonator bayonet, detection, coding and laser coding production line |
| CN109489508B (en) * | 2018-12-17 | 2023-08-22 | 江西新余国泰特种化工有限责任公司 | Vertical type opening tightening device for automatic assembly of electronic detonator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2945803A1 (en) * | 1979-11-13 | 1981-05-27 | Heko - Elektronik GmbH & Co KG, 2804 Lilienthal | Hot wire igniter for explosives or propellants - has pressurised contact between resistance wire and ignition charge |
| US4858529A (en) * | 1988-07-01 | 1989-08-22 | The United States Of America As Represented By The Department Of Energy | Spark-safe low-voltage detonator |
-
1992
- 1992-06-23 CA CA002072030A patent/CA2072030A1/en not_active Abandoned
- 1992-06-23 EP EP92110529A patent/EP0520360A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0520360A1 (en) | 1992-12-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |