CA2066106A1 - Stabilized thermoplastic partly aromatic polyamide molding compositions - Google Patents
Stabilized thermoplastic partly aromatic polyamide molding compositionsInfo
- Publication number
- CA2066106A1 CA2066106A1 CA002066106A CA2066106A CA2066106A1 CA 2066106 A1 CA2066106 A1 CA 2066106A1 CA 002066106 A CA002066106 A CA 002066106A CA 2066106 A CA2066106 A CA 2066106A CA 2066106 A1 CA2066106 A1 CA 2066106A1
- Authority
- CA
- Canada
- Prior art keywords
- weight
- acid
- units derived
- hexamethylenediamine
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 238000000465 moulding Methods 0.000 title description 16
- 239000004760 aramid Substances 0.000 title description 3
- 229920001169 thermoplastic Polymers 0.000 title description 3
- 239000004416 thermosoftening plastic Substances 0.000 title description 3
- 229920003235 aromatic polyamide Polymers 0.000 title description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000000178 monomer Substances 0.000 claims abstract description 41
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 38
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 30
- 125000003118 aryl group Chemical group 0.000 claims abstract description 29
- -1 aromatic secondary amine Chemical class 0.000 claims abstract description 19
- 239000001361 adipic acid Substances 0.000 claims abstract description 15
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 15
- 239000002253 acid Substances 0.000 claims abstract description 13
- 238000009757 thermoplastic moulding Methods 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 125000003703 phosphorus containing inorganic group Chemical group 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 150000001721 carbon Chemical group 0.000 claims description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 3
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 description 27
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 26
- 239000005060 rubber Substances 0.000 description 16
- 229920002647 polyamide Polymers 0.000 description 15
- 239000004952 Polyamide Substances 0.000 description 14
- 229940035422 diphenylamine Drugs 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 11
- 239000000806 elastomer Substances 0.000 description 11
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 10
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 9
- 239000012071 phase Substances 0.000 description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Chemical class 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 239000006200 vaporizer Substances 0.000 description 8
- 229920002943 EPDM rubber Polymers 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 229940063559 methacrylic acid Drugs 0.000 description 6
- 230000006641 stabilisation Effects 0.000 description 6
- 238000011105 stabilization Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000000087 stabilizing effect Effects 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229920003231 aliphatic polyamide Polymers 0.000 description 4
- 230000002844 continuous effect Effects 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- 239000004953 Aliphatic polyamide Substances 0.000 description 3
- 239000004908 Emulsion polymer Substances 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 239000013065 commercial product Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229920006177 crystalline aliphatic polyamide Polymers 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- 150000002431 hydrogen Chemical group 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000012266 salt solution Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052882 wollastonite Inorganic materials 0.000 description 3
- 239000010456 wollastonite Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 229920006020 amorphous polyamide Polymers 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 229940116254 phosphonic acid Drugs 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000003336 secondary aromatic amines Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical class C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- HYBLFDUGSBOMPI-BQYQJAHWSA-N (4e)-octa-1,4-diene Chemical compound CCC\C=C\CC=C HYBLFDUGSBOMPI-BQYQJAHWSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- LTEMFFJEDCQUBR-UHFFFAOYSA-N 1-tert-butylcyclohexa-3,5-diene-1,3-dicarboxylic acid Chemical compound CC(C)(C)C1(C(O)=O)CC(C(O)=O)=CC=C1 LTEMFFJEDCQUBR-UHFFFAOYSA-N 0.000 description 1
- DSAYAFZWRDYBQY-UHFFFAOYSA-N 2,5-dimethylhexa-1,5-diene Chemical compound CC(=C)CCC(C)=C DSAYAFZWRDYBQY-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- BEWCNXNIQCLWHP-UHFFFAOYSA-N 2-(tert-butylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNC(C)(C)C BEWCNXNIQCLWHP-UHFFFAOYSA-N 0.000 description 1
- VQIKAPKIEUECEL-UHFFFAOYSA-N 2-phenoxyterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(OC=2C=CC=CC=2)=C1 VQIKAPKIEUECEL-UHFFFAOYSA-N 0.000 description 1
- KHZYMPDILLAIQY-UHFFFAOYSA-N 3-(3-carboxyphenyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(C=2C=C(C=CC=2)C(O)=O)=C1 KHZYMPDILLAIQY-UHFFFAOYSA-N 0.000 description 1
- UJAWGGOCYUPCPS-UHFFFAOYSA-N 4-(2-phenylpropan-2-yl)-n-[4-(2-phenylpropan-2-yl)phenyl]aniline Chemical compound C=1C=C(NC=2C=CC(=CC=2)C(C)(C)C=2C=CC=CC=2)C=CC=1C(C)(C)C1=CC=CC=C1 UJAWGGOCYUPCPS-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- LRDIEHDJWYRVPT-UHFFFAOYSA-N 4-amino-5-hydroxynaphthalene-1-sulfonic acid Chemical compound C1=CC(O)=C2C(N)=CC=C(S(O)(=O)=O)C2=C1 LRDIEHDJWYRVPT-UHFFFAOYSA-N 0.000 description 1
- NWPQAENAYWENSD-UHFFFAOYSA-N 5-butylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CCCC)CC1C=C2 NWPQAENAYWENSD-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-UHFFFAOYSA-N 5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CC)CC1C=C2 OJOWICOBYCXEKR-UHFFFAOYSA-N 0.000 description 1
- YSMODUONRAFBET-UHFFFAOYSA-N 5-hydroxylysine Chemical group NCC(O)CCC(N)C(O)=O YSMODUONRAFBET-UHFFFAOYSA-N 0.000 description 1
- DMGCMUYMJFRQSK-UHFFFAOYSA-N 5-prop-1-en-2-ylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C(=C)C)CC1C=C2 DMGCMUYMJFRQSK-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 101100439663 Arabidopsis thaliana CHR7 gene Proteins 0.000 description 1
- 101100244083 Arabidopsis thaliana PKL gene Proteins 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 125000006519 CCH3 Chemical group 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 101100425082 Emericella nidulans (strain FGSC A4 / ATCC 38163 / CBS 112.46 / NRRL 194 / M139) thiA gene Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241001441571 Hiodontidae Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- HFEFMUSTGZNOPY-UHFFFAOYSA-N OOOOOOOOOOOOOOOO Chemical compound OOOOOOOOOOOOOOOO HFEFMUSTGZNOPY-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical class C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- ISRJTGUYHVPAOR-UHFFFAOYSA-N dihydrodicyclopentadienyl acrylate Chemical compound C1CC2C3C(OC(=O)C=C)C=CC3C1C2 ISRJTGUYHVPAOR-UHFFFAOYSA-N 0.000 description 1
- 125000006182 dimethyl benzyl group Chemical group 0.000 description 1
- VVYDVQWJZWRVPE-UHFFFAOYSA-L dimethyltin(2+);diiodide Chemical compound C[Sn](C)(I)I VVYDVQWJZWRVPE-UHFFFAOYSA-L 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 229940063557 methacrylate Drugs 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- AEJAODBYKVKBDR-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;octan-3-yl prop-2-enoate Chemical compound COC(=O)C(C)=C.CCCCCC(CC)OC(=O)C=C AEJAODBYKVKBDR-UHFFFAOYSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 235000019799 monosodium phosphate Nutrition 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 150000003504 terephthalic acids Chemical class 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 101150063803 thi4 gene Proteins 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Abstract
O.Z. 0050/42361 Abstract of the Disclosure: Thermoplastic molding com-positions contain A) 40-99.9 % by weight of a partly aromatic and partly crystalline copolyamide having a triamine content of less than 0.5 % by weight composed of (A1) 20-90 % by weight of units derived from tereph-thalic acid and hexamethylenediamine, (A2) 0-50 % by weight of units derived from ?-caprolactam, (A3) 0-80 % by weight of units derived from adipic acid and hexamethylenediamine, (A4) 0-40 % by weight of further polyamide-forming monomers, the proportion of component (A2) or (A3) or (A4) or a mixture thereof being not less than 10 % by weight, B) 0.1-2 % by weight of at least one aromatic secondary amine, and C) 100-2000 ppm of at least one phosphorus-containing inorganic acid or a derivative thereof, the proportion of component C) being based on the total amount of components A) and B), and also D) 0-59.9 % by weight of a fibrous or particulate filler or a mixture thereof, E) 0-30 % by weight of an elastomeric polymer.
Description
O.Z. 0050/42361 Stabilized thermoplastic partlv aromatic PolYamide moldinq comeositions The pre~ent invention relates to thermoplastic molding compositions containing A) 40-99.9 % by weight of a partly aromatic and partly crystalline copolyamide having a triamine content of le~s than 0.5 % by weight composed of (Al) 20-90 ~ by weight of units derived from tereph-thalic acid and hexamethylenediamine, (A2) 0-50 % by weight of units derived from 6-caprolactam, (A3) 0-80 % by weight of units deri~ed from adipic acid and hexamethylenediamine, (A4) 0-40 % by weight of further polyamide-forming monomers, the proportion of component (A2) or (A3) or (A4) or a mixture thereof being not less than 10 % by weight, B) 0.1-2 % by weight of at least one aromatic secondary amine, and C) 100-2000 ppm of at least one phosphorus-containing inorganic acid or a derivative thereof, the proportion of component C) being based on the total amount of components A) and B), and also D) 0-59.9 % by weight of a fibrous or particulate filler or a mixture thereof, E) 0-30 ~ by weight of an elastomeric polymer.
The present invention also relates to the use of such partly aromatic copolyamides for producing fibers, films, sheets and molding3 and to the shaped articles obtainable from these partly aromatic copolyamides.
The stabilization of polyamide~ to oxidative and thermal degradation largely determines the possible uses of the3e polymers. Usually these stabilization systems also confer adequate protection against light.
EP-A-281 691, JP-A-63/142059, DE-A-2 643 204 and DE-A-2 516 565 disclose stabilizers based on copper iodide and potassium iodide for partly crystalline . ~
The present invention also relates to the use of such partly aromatic copolyamides for producing fibers, films, sheets and molding3 and to the shaped articles obtainable from these partly aromatic copolyamides.
The stabilization of polyamide~ to oxidative and thermal degradation largely determines the possible uses of the3e polymers. Usually these stabilization systems also confer adequate protection against light.
EP-A-281 691, JP-A-63/142059, DE-A-2 643 204 and DE-A-2 516 565 disclose stabilizers based on copper iodide and potassium iodide for partly crystalline . ~
2~6610~
- 2 - O.Z. 0050/42361 aliphatic polyamides.
The further possibility of stabilizing these partly crystalline aliphatic polyamides with 2terically hindered phenols i9 known from DE-A-2 522 833. The combination of these phenols with other compounds is known from the following publications: DE-A-2 158 014 (phosphorus-containing compounds~ and NL-A-8 602 807 (aromatic amine compounds).
GB-A-1 030 363 discloses nitrogen compounds combined with tran~ition metal amine complexes as stabil-izing system for partly crystalline aliphatic polyamide~.
Additionally, JP-A-63/105 057 discloses a stabil-izing system for partly aromatic but amorphous polyamides comprising a copper compound and phenolic or phosphorus-containing compounds with or without thioethers and aminecompound~.
Furthermore, CA-A-963 594 discloses a ~tabilizer combination of an aromatic amine and a phosphorus-containing compound for partly crystalline aliphatic polyamides.
Copolyamides which are partly aromatic and partly crystalline have the advantage of possessing a higher heat deflection temperature (and hence require higher processing temperatures). Consequently, these polyamides are used wherever a high sustained-use temperature in air is required (eg. electricals).
However, the prior art stabilizers are not usable for these polyamides, since for example copper compounds catalyze the degradation of polyamides in the course of processing. Phenolic antioxidants are likewise not suitable, since these compounds decompose when processed in an extruder at high temperatures.
Moreover, only a small proportion of the starting amount remains behind in the molding composition itself, since these compounds are too volatile at the processing temperatures customary for partly aromatic copolyamides.
Aromatic amine compounds generally have the ` 20~6106 - 3 - O.Z. 0050/42361 di~advantage that effective ~tabilization requires relatively large quantities, ~o that their u~e i~ not economical. Moreover, they have an adverse effect on the mechanical properties of the polyamide articles.
In addition, the problem with partly aromatic and partly cryqtalline copolyamide~ i8 that adequate oxida-tive and thermal stabilization do not guarantee effective light stabilization, since the aromatic moietie~ have a severe impairing effect on the light stability.
It iR an object of the present invention to provide a stabilizing ~y~tem for partly aromatic and partly crystalline copolyamides which ensures good thermal and oxidative stabilization at high proces ing temperature~.
We have found that this object i9 achieved by the molding compositions defined at the beginning. Preferred molding compo~ition~ of thi4 kind are revealed in the subclaims.
AR component A) the thermopla~tic molding compo-sitions of the pre~ent invention contain from 40 to 99.9, preferably from 50 to 99.5, in particular from 70 to 99.7, % by weight of a partly aromatic and partly cry~talline copolyamide having a triamine content of below 0.5 % by weight, preferably below 0.3 % by weight, composed of:
A~) 20 - 90 % by weight of unit~ derived from tereph-thalic acid and hexamethylenediamine, A2) 0 - 50 % by weight of unit~ derived from e-caprO-lactam, and A3) 0 - 80 ~ by weight of unit~ derived from adipic acid and hexamethylenediamine, A4) 0 - 40 % by weight of further poly d de-forming monomer~, the proportion of component (A2) or (A3) or (A4~ or mixture~ thereof being at least 10 % by weight.
Component ~l) contain~ 20 - 90 % by weight of unitq derived from terephthalic acid and hexamethylene-2066~0~
- 2 - O.Z. 0050/42361 aliphatic polyamides.
The further possibility of stabilizing these partly crystalline aliphatic polyamides with 2terically hindered phenols i9 known from DE-A-2 522 833. The combination of these phenols with other compounds is known from the following publications: DE-A-2 158 014 (phosphorus-containing compounds~ and NL-A-8 602 807 (aromatic amine compounds).
GB-A-1 030 363 discloses nitrogen compounds combined with tran~ition metal amine complexes as stabil-izing system for partly crystalline aliphatic polyamide~.
Additionally, JP-A-63/105 057 discloses a stabil-izing system for partly aromatic but amorphous polyamides comprising a copper compound and phenolic or phosphorus-containing compounds with or without thioethers and aminecompound~.
Furthermore, CA-A-963 594 discloses a ~tabilizer combination of an aromatic amine and a phosphorus-containing compound for partly crystalline aliphatic polyamides.
Copolyamides which are partly aromatic and partly crystalline have the advantage of possessing a higher heat deflection temperature (and hence require higher processing temperatures). Consequently, these polyamides are used wherever a high sustained-use temperature in air is required (eg. electricals).
However, the prior art stabilizers are not usable for these polyamides, since for example copper compounds catalyze the degradation of polyamides in the course of processing. Phenolic antioxidants are likewise not suitable, since these compounds decompose when processed in an extruder at high temperatures.
Moreover, only a small proportion of the starting amount remains behind in the molding composition itself, since these compounds are too volatile at the processing temperatures customary for partly aromatic copolyamides.
Aromatic amine compounds generally have the ` 20~6106 - 3 - O.Z. 0050/42361 di~advantage that effective ~tabilization requires relatively large quantities, ~o that their u~e i~ not economical. Moreover, they have an adverse effect on the mechanical properties of the polyamide articles.
In addition, the problem with partly aromatic and partly cryqtalline copolyamide~ i8 that adequate oxida-tive and thermal stabilization do not guarantee effective light stabilization, since the aromatic moietie~ have a severe impairing effect on the light stability.
It iR an object of the present invention to provide a stabilizing ~y~tem for partly aromatic and partly crystalline copolyamides which ensures good thermal and oxidative stabilization at high proces ing temperature~.
We have found that this object i9 achieved by the molding compositions defined at the beginning. Preferred molding compo~ition~ of thi4 kind are revealed in the subclaims.
AR component A) the thermopla~tic molding compo-sitions of the pre~ent invention contain from 40 to 99.9, preferably from 50 to 99.5, in particular from 70 to 99.7, % by weight of a partly aromatic and partly cry~talline copolyamide having a triamine content of below 0.5 % by weight, preferably below 0.3 % by weight, composed of:
A~) 20 - 90 % by weight of unit~ derived from tereph-thalic acid and hexamethylenediamine, A2) 0 - 50 % by weight of unit~ derived from e-caprO-lactam, and A3) 0 - 80 ~ by weight of unit~ derived from adipic acid and hexamethylenediamine, A4) 0 - 40 % by weight of further poly d de-forming monomer~, the proportion of component (A2) or (A3) or (A4~ or mixture~ thereof being at least 10 % by weight.
Component ~l) contain~ 20 - 90 % by weight of unitq derived from terephthalic acid and hexamethylene-2066~0~
- 4 - O.Z. 0050/42361 dlamine .
In addition to units derived from terephthalic acid and hexamethylenediamine, the copolyamides contain units derived from ~-caprolactam and/or units derived from adipic acid and hexamethylenediamine and/or units derived from further polyamide-forming monomer~.
The proportion of unit~ derived from -caprolac-tam i~ not more than 50 ~ by weight, preferably from 20 to 50 % by weiyht, in particular from 25 to 40 % by weight, while the proportion of units derived from adipic acid and hexamethylenediamine is up to 80 % by weight, preferably from 30 to 75 ~ by weight, in particular from 35 to 60 % by weight.
The copolyamides may contain not only units of e-caprolactam but also units of adipic acid and hexamethyl-enediamine; in this ca~e it i~ of advantage for the proportion of units which are free of aromatic groups to be not less than 10 % by weight, preferably not les~ than 20 % by weight. The ratio of units derived from 6 -capro-lactam and from adipic acid and hexamethylenediamine istherefore not subject to any special restriction.
Preference is given to copolyamides whose compo-sition in the ternary diagram lies within the pentangle defined by the corner points X~ to X5, where the points X
to X5 are defined as follows:
X1 40 % by weight of units Al) 60 % by weight of units A3) X2 60 ~ by weight of units A1) 40 % by weight of units A3) ~3 80 % by weight of units A1) 5 % by weight of unit~ A2) 15 % by weight of units A3) X4 80 % by weight of units A1) 20~6106 - 5 - O.Z. 0050/42361 20 ~ by weight of units A2) X5 50 % by weight of units A1) 50 % by weight of units A2) In the drawing, the pentangle defined by these points i~
shown in a ternary diagram.
Of particular advantage for many applications are polyamides containing from 50 to 80, in particular from 60 to 75, % by weiqht of units derived from terephthalic acid and hexamethylenediamine (units A1) and from 20 to 50, preferably from 25 to 40, % by weight of unit~
derived fro~ e-caprolactam (units A2).
In addition to the above-described units A1) to A3), the partly aromatic copolyamides may contain further poly d de-forming monomer~ A4) of the type known from other polyamides in amounts of up to 40, preferably 10 - 30, in particular 20 - 30, % by weight.
Aromatic dicarboxylic acids A4) preferably have from 8 to 16 carbon atoms. Suitable aromatic dicarboxylic acids are ~or example isophthalic acid, substituted terephthalic and isophthalic acids such as 3-t-butylisophthalic acid, polycyclic dicarboxylic acids, eg.
4,4'- and 3,3'-biphenyldicarboxylic acid, 4,4'- and 3,3'-diphenylmethanedicarboxylic acid, 4,4'- and 3,3'-~ulfodiphenyldicarboxylic acid, 1,4- or 2,6-naphthalenedicarboxylic acid and phenoxyterephthalicacid, of which isophthalic acid i8 particularly preferred.
Further polyamide-forming monomer3 A4) can be derived from dicarboxylic acid~ of from 4 to 16 carbon atoms and aliphatic or cycloaliphatic diamines of from 4 to 16 carbon atom~ and also from aminocarboxylic acids or corresponding lactams of from 7 to 12 carbon atoms. As suitable monomer~ of these types there may be mentioned here suberic acid, azelaic acid and sebacic acid a~
repre~entatives of aliphatic dicarboxylic acids, 2~6~06 . - 6 - O.Z. 0050/42361 1,4-butanediamine, 1,5-pentanediamine, piperazine, 4,4'-diaminodicyclohexylmethane, 2,2-(4,4'-diaminodicyclo-hexyl)propaneand3,3'-dimethyl-4,4'-diaminodicyclohexyl-methane as representatives of diamine~, and capryl-lactam, enantholactam, ~-aminoundecanoic acid and lauro-lactam aR representatives of lactam~ or amino-carboxylic acids.
The following compo~itions of component (A) are particularly preferred:
A~) from 65 to 85 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A4) from 15 to 35 % by weight of unit~ derived from isophthalic acid and hexamethylenediamine, or A1) from 50 to 70 % by weight of units derived from terephthalic acid and hexamethylenediamine, A3) from 10 to 20 % by weight of units derived from adipic acid and hexamethylenediamine, and A4) from 20 to 30 % by weight of units derived from i~ophthalic acid and hexamethylenediamine.
If component (A4) contains symmetrical 4,4'-3ub~tituted dicarboxylic acids (para position of the carboxyl groups), it is advisable to combine them with (A1) and (A2) or (Al) and (A3) to form ternary copolyamidesr since othexwise the copolyamide will have an exce~sively high melting point and will melt only with decompo~ition, which is not desirable.
Furthermore, tho~e partly aromatic copolyamides have proved particularly advantageous whose triamine content is less than 0.5, preferably less than 0.3, % by weight.
Partly aromatic copolyamides prepared by most existing pxocesses (cf. US-A 4 603 166) have triamine contents above 0.5 % by weight,-which leads to deteriora-tion in product quality and to problems with continuou~
production. A triamine which i8 in particular responsible for these problems is dihexamethylenetriamine, which is 2066~06 - 7 - O.Z. 0050/42361 formed from the hexamethylenediamine u~ed in the preparation.
Copolyamides having a low triamine content have lower melt viscosities than similarly composed products which have a higher triamine content, while the solution VigCoBity i8 the same. This improves not only the proces-sing properties but also the product propertie~
appreciably.
The melting points of the partly aromatic copoly-10amides lie within the range from 270C to 325C, prefer-ably from 280 to 310C, which high melting points are also associated with a high glasls transition temperature of in general more than 75C, in particular more than 85C (in the dry state).
15Binary copolyamides based on terephthalic acid, hexamethylenediamine and ~-caprolactam which contain about 70 % by weight of units derived from terephthalic acid and hexamethylenediamine have melting point~ in the 300C range and (in the dry state) a glass transition temperature of more than 110C.
Binary copolyamide~ based on terephthalic acid, adipic acid and hexamethylenediamine attain melting points of 300C or more at lower levels, about 55 % by weight, of units derived from terephthalic acid and hexamethylenediamine (HMD), although the glass transition temperature is not quite as high as with ~inary copoly-amide~ which in place of adipic acid or adipic acid/HMD
contain 6-caprolactam.
Partly aromatic copolyamides for the purposes of the present invention are those which have a degree of crystallinity > 10 %, preferably > 15 ~, and in par-ticular > 20 %.
The degree of crystallinity is a measure of the proportion of crystalline fragments in the copolyamide, and is determined by X-ray diffraction.
The preferred partly aromatic copolyamides of low triamine content can be prepared by the processes 2~66106 - 8 - O.Z. 0050/42361 described in EP-A-129 195 and EP-A-129 196.
In these processes, an aqueous solution of the monomers, ie. here the monomers which form the units A1) to A4), is heated under superatmospheric pressure to 250-300C with simultaneous evaporation of the water andformation of a prepolymer, then prepolymer and steam are continuously separated, the steam is rectified, and the entrained diamines are recycled. Finally, the prepolymer is passed into a polycondensation zone and polycondensed at 250 - 300C under a superatmospheric pressure of from 1 to 10 bar. The essential feature of the process is that the aqueou~ salt solution is heated under a superatmos-pheric pressure of from 1 to 10 bar in the course of a re~idence time of le~s than 60 seconds, and on exit from the vaporizer zone the degree of conversion is advantage-ously at least 93 % and the water content of the prepoly-mer is not more than 7 % by weight.
These short residence times substantially prevent the formation of triamines.
The aqueous solutions used generally have a monomer content of from 30 to 70 % by weight, in p~r-ticular from 40 to 65 % by weight.
The aqueous salt solution is advantageously pas~ed continuously at from 50 to 100C into a vaporizer zone, where the aqueou~ salt solution i~ heated to 250 -330C under a superatmospheric pressure of from 1 to 10, preferably from 2 to 6, bar. It will be readily under-stood that the temperature employed is above the melting point of the particular polyamide to be prepared.
As mentioned earlier, it is essential that the residence time in the vaporizer zone i9 not more than 60 seconds, preferably from 10 to 55 seconds, in par-ticular from 10 to 40 seconds.
The conversion on exit from the vaporizer zone is not less than 93 %, preferably from 95 to 98 %, and the water content i preferably within the range from 2 to 5, in particular from 1 to 3, % by weight.
206~6 - 9 - O.Z. 0050/42361 It is also advantageous to pas~ the mixture of prepolymer and steam immediately downstream of the vaporiæer zone, before the phases are separated, through a tubular mass transfer zone equipped with internal fitments. This is done under the temperature and pressure conditions employed in the vaporizer zone. The internal fitments, eg. packing such as Raschig rings, metal rings or in particular wire netting, ensure a large surface area. This ensures intimate contact between the phases, ie. prepolymer and steam, and ensures that the amount of diamine freed with steam is appreciably reduced. In general, the mass transfer zone is operated with a residence time of from 1 to 15 minutes. The mass transfer zone is advantageou~ly constructed as a tube bundle.
The two-phase mixture of steam and prepolymer emerging from the vaporizer or mas~ transfer zone is separated. Separation gen~rally takes place automatical-ly, owing to the physical differences, in a vessel the bottom part of which i9 advantageously con~tructed as a polymerisation zone. The freed vapors consist essentially of steam and diamines freed on evaporation of the water.
These vapors are passed into a column and rectified.
Suitable columns are for example packed columns, bell tray columns or qieve plate columns of from 5 to 15 theo-retical pl~tes. The column is advantageously operatedunder the same pressure conditions as the vaporizer zone.
The diamines contained in the vapor-q are separated off and returned into the vaporizer zone. It is also po~sible to pass the diamines into the downstream polymerization zone. The rectified steam obtained is withdrawn at the top of the column.
The prepolymer obtained, which accordin~ to its degree of conversion consists essentially of low molecular weight polyamide with or without residual amounts of unconverted ~alts and in general has a rela-tive viscosity of from 1.2 to 1.7, is passed into a polymerization zone. In the polymerization zone, the melt ~066~0~
- 10 - O.Z. 0050/42361 obtained is polycondensed at 250 - 330C, in particular 270 - 310C, under a ~uperatmospheric pressure of from 1 to 10 bar, in particular from 2 to 6 bar. Advantageously, the vapor3 freed here are rectified in the column to-gether with the abovementioned vapors, and preferably the polycondenaation zone is operated with a residence time of from 5 to 30 minutea. The polyamide thus obtained, which in general ha~ a relative viscosity of from 1.2 to 2.3, i8 continuou~ly removed from the conden~ation zone.
In a preferred proce~3, the polyamide thu3 obtained is passed as a liquid melt through a discharge zone with simultaneous removal of the residual water present in the melt. Suitable discharge zones are for example devolatilization extruders. The melt thus freed of water i9 then strand extruded and granulated. The granule3 obtained are advantageously condensed in solid phase by mean~ of superheated steam at a temperature below the melting point, eg. at from 170 to 240C, until the desired vigC08ity i3 obtained. Advantageously, this i8 done using the steam obtained at the top of tha column.
Following the solid pha~e postconden~ation the relative vi~cosity, measured in a 1 % by weight aolution in 96 % by weight H2SO4 at 23C, is in general within the range from 2.2 to 5.0, preferably from 2.3 to 4.5.
In a further preferred process, the polyamide melt discharged from the polycondensation zone i9 passed into a further polycondensation zone and condensed therein with continuou~ formation of new surfaces at from 285 to 310C, advantageou~ly under reduced pressure, for example at from 1 to 500 mbar, until the de~ired visco-~ity is obtained. Suitable vessels are known as finisher3.
A further proce~s, which is similar to that described above, iq deacribed in EP-A~129 196, incor-porated herein by reference.
2~661~6 ~ O.Z. OOS0/42361 As component A) it is also possible to use mixtures of different copolyamides, for which the mixing ratio is freely choosable.
As component B) the molding compositions of the present invention contain at lea~t one aroma~ic secondary amine in an amount of from 0.1 to 2, preferably from 0.5 to 1.5, in particular from 0.7 to 1, % by weight, accord-ing to the general formula I:
~ (A)m-NH-(B)~ ~ I
where m and n are each 0 or 1, A and B are each a C1-C4-alkyl- or phenyl-sub~tituted tertiary carbon atom, R1 and R2 are each hydrogen or ortho- or para-disposed Cl-C6-alkyl which may be monosubstituted, disubstituted or trisubstituted by phenyl, halogen, carboxyl or a transition metal salt of carboxyl, and R3 and R4 are each hydrogen or ortho- or para-di~po~ed methyl when m plus n is 1 or ortho- or para-disposed tertiary C3-Cg-alkyl which may be monosubstituted, disubstituted or trisubsti-tuted by phenyl when m plus n is 0 or 1.
Preferred radicals A and B are each symmetrically ~ubstituted tertiary carbon atoms, and dimethyl-substi-tuted tertiary carbon is particularly preferred. Prefer-ence i~ also given to tertiary carbons which have from 1 to 3 phenyl groups as substituents~
Preferred radical~ R1 and R2 are each para-t-butyl or tetramethyl-substituted n-butyl, although the methyl groups may preferably be replaced by from 1 to 3 phenyl groups. Preferred halogen~ are chlorine and bromine.
2~6~106 . - 12 - O.Z. 0050/42361 Preferred radicals R3 and R4 are each hydrogen in the case of m plus n = 2 or ortho- or para-dispo~ed t-butyl, which may be sub~tituted in particular by from 1 to 3 phenyl radicals, in the case of m plus n = 0 or 1.
Examples of secondary aromatic amines B) are 4,4'-bis(~,~'-tert-octyl)diphenylamine, 4,4'-bist~,~-dimethylbenzyl)diphenylamine, 4,4'-bis(~-methylbenzhydryl)diphenylamine, 4-(1,1,3,3-tetramethylbutyl)-4'-triphenylmethyldiphenyl-amine 4,4'-bis(~,~-p-trimethylbenzyl)diphenylamine 2,4,4'-tris(~,~-dimethylbenzyl)diphenylamine 2,2'-dibromo-4,4~-bis(~,~-dimethylbenzyl)diphenylamine 4,4'-bis(~,~-dimethylbenzyl)-2-carboxydiphenylamine-nickel-4,4'-bis(~,~-dimethylbenzyl)diphenylamine 2-sec-butyl-4,4'-biY(~,~-dimethylbenzyl)diphenylamine 4,4'-bis(~,~-dimethylbenzyl)-2-(~-methylheptyl)diphenyl-amlne 2-(~-methylpentyl)-4,4'-ditrityldiphenylamine 4-~,~-dimethylbenzyl-4~-isopropoxydiphenylamine 2-(~-methylheptyl)-4~ -dimethylbenzyl)diphenylamine 2-(~-methylpentyl)-4'-trityldiphenylamine 4,4'-bis(tert-butyl)diphenylamine and also:
~3~-0-NH~
~;C~ CH
>-I-NH~
2~6106 - 13 - O.z. 0050/42361 C~3 C ~ N ~ CH3 ~ Cl Cl ~
CH3 1 ~ N
/ ~ IH
CH3 ~
NH
CH3 ~
CH3-C ~ N ~ C-CH3 CH3-C-CH2-1 ~ NH ~ O_CH2_C_CH3 - 14 - O.Z. 0050/42361 CH3--C~ NH~ --0--CH3 -¢-NH~
CH3~1--NH--I~CH3 CH3--¢--1~>---NH----~
~3--l--~--NH--~> ~ 4 ~3 ~
~--NH--I~
They are prepared as described in 8E-A-67/0500120 and CA-A-963594.
Preferred secondary aromatic amine~ are diphenyl-amine and derivatives thereof, which are commerciallyavailable as Naugard (from Uniroyal).
As component C) tho molding compositions of the present invention contain from 100 to 2000, preferably 2~66~ 0~
- - 15 - O.Z. 0050/42361 200-500, in particular 200-400, ppm of at least one phosphorus-containing inorganic acid or a derivative thereof, ba~ed on the total amount of components A) and B) in the molding compositions.
Preferred acids are hypophosphorous acid, phos-phorous acid and phosphoric acid and also salts thereof with alkali metals, of which sodium and potassium are particularly preferred. Preferred mixtures are in parti-cular hypophosphorous and phosphorous acid or their alkali metal salts in a ratio of from 3 : 1 to 1 : 3.
Organic derivative~ of these acids are preferably to be understood as meaning ester derivatives of the above-mentioned acids.
As component D) the molding compositions of the present invention may contain from 0 to 59.9, in particular from 5 to 50, particularly preferably from 10 to 35, % by weight of a fibrous or particulate filler or of a mixture of such fillers.
Examples of fibrous fillers are glass fibers, carbon fibers, aramid fibers, potassium titanate fibers and fibrous silicates such as wollastonite.
If glass fiber~ and fillers based on silicate are used, they may have been dressed with a size and a coupling agent for better compatibility with the poly-amide.
In general, the glass fibers used have a diameterwithin the range from 6 to 20 ~m. They can be incor-porated not only in the form of short fibers but al o in the form of continuou~ strands or rovings. In the finished injection molding, the average length of the glass fibers is preferably within the range from 0.08 to 5 mm.
Suitable particulate fillers are for example glas~ balls, particulate wollastonite, quartz powder, boron nitride, kaolin, calcium carbonate, magne3ium carbonate (chalk) and titanium dioxide, of which wollas-tonite, titanium dioxide and kaolin are in general . - 16 - O.Z. 0050/42361 preferred.
As component E) the thermoplastic molding compo-sition~ according to the present invention contain from 0 to 30, preferably from 5 to 20, % by weight, based on the sum total of component~ A) to E), of an ela~tomeric polymer.
In general, thi~ will be a copolymer which i~
preferably compo~ed of at least two of the following monomers as main components: ethylene, propylene, isobu-tene, isoprene, chloroprene, vinyl acetate, styrene,acrylonitrile and acrylic and methacrylic ester~ having from 1 to 18 carbon atom~ in the alcohol component.
Rubbers of this kind are de~cribed for example in Houben-Weyl, Methoden der organischen Chemie, vol. 14/1 (Thieme-Verlag, Stuttgart, 1961), pages 392-406, and in the monograph by C.B. Bucknall, Toughened Pla3tics (Applied Science Publishers, London, 1977).
Preferred types of these elastomers are the ethylene-propylene monomer (EPM) and ethylene-propylene-diene monomer (EPDM) rubber~, which preferably have an ethylene unit to propylene unit ratio within the range from 40:60 to 90:10.
The Mooney viscosities (MLI+4/100C) of such uncro~linked EPM or EPDM rubbers (gel contents in general below 1 % by weight) are preferably within the range from 25 to 100, in particular from 35 to 90 (meas-ured with the large rotor after 4 minutes at 100C in accordance with German Standard Specification DIN 53 523).
EPM rubbers in general have virtually no double bonds left, while EPDM rubber~ can have from 1 to 20 double bonds/100 carbon atoms.
. As diene monomers for EPDM rubbers there may be mentioned for example conjugated dienes such as isoprene, nonconjugated dienes of from 5 to 25 carbon atom~ such as 1,4-pentadiene, 1,4-hexadiene, 1,5-hexadiene, 2,5-dimethyl-1,5-hexadiene and 1,4-octadiene, cyclic dienes 2~6~106 - 17 - O. Z . 005~/42361 such as cyclopentadiene, cyclohexadienes, cyclooctadienes and dicyclopentadiene and also alkenylnorbornenes such as 5-ethylidene-2-norbornene, 5-butylidene-2-norbornene, 2-methallyl-5-norbornene, 2-isopropenyl-5-norbornene and tricyclodiene such as 3-methyltricyclo [ 5 . 2 . 1. 0 . 2 . 6 ] -3, 8-decadiene or mixtures thereof . Pref erence is given to 1, 5-hexadiene, 5-ethylidenenorbornene and dicyclopentadiene. The diene content of the EPDM rubbers i9 preferably from 0.5 to 50, in particular from 1 to 8, % by weight, based on the total weight of the rubber.
EPM and EPDM rubbers can preferably also be grafted with reactive carboxylic acids or derivatives thereof. These include for example acrylic acid, meth-acrylic acid and derivatives thereof and also maleic anhydride.
A further group of preferred rubbers are copoly-mers of ethylene with acrylic acid and/or methacrylic acid and/or the esters of these acids. In addition, the rubbers may contain dicarboxylic acids such as maleic acid and fumaric acid or derivatives thereof, such as esters and anhydrides, and/or epoxy-containing monomers.
These dicarboxylic acid derivatives and epoxy-containing monomerc are pref erably incorporated in the rubber by adding dicarboxylic acid- or epoxy-containing monomers of the general formula II or III or IV or V to the monomer mixture 2~6~1~6 - 18 - O.Z. 0050/4236 R~C(COOR2~=C(COOR3)R4 Il \C C~
I I I
CO CO
`O' CHR7=CH--(CH2) ~(CHR6) --CH--CHR5 IV
m n CH2=CR9--COO--(--CH2)--CH--CHR8 V
n \o/
where Rl to R9 are each hydrogen or alkyl of from 1 to 6 carbon atoms, m is an integer from 0 to 20, n is an integer from 0 to 10 and p is an integer from 0 to 5.
Preferably, each of Rl-R7 is hydrogen, m is 0 or 1, and n is 1. The corresponding compounds are maleic acid, fumaric acid, maleic anhydride, allyl glycidyl ether and vinyl glycidyl ether.
Preferred compounds of the formulae II, III and V
are maleic acid, maleic anhydride and epoxy-containing esters of acrylic acid and/or methacrylic acid, of which glycidyl acrylate, glycidyl methacrylate and the esters with tertiary alcohols, such as t-butyl acrylate, are particularly preferred. It i3 true that the latter have no free carboxyl groups, but their behavior is similar to that of the free acids and therefore they are referred to as monomers having latent carboxyl groups.
The ethylene content of the copolymers i3 in general-within the range from 50 to 98 % by weight, and the proportion of methacrylic esters is within the range from 2 to 50 % by weight. Advantageously, the copoly~ers consist of from 50 to 98 ~ by weight of ethylene, from 0.1 to 20 ~ by weight of epoxy-containing monomers and/or methacrylic acid and/or acid anhydride group-containing monomers and also methacrylic ester~ as remainder.
2~6~06 - 19 - O.Z. 0050/42361 Particular preference is given to copolymers of from 50 to 98.9, in particular from 60 to 95, % by weight of ethylene, from 0.1 to 40, in particular from 0.3 to 20, % by weight of glycidyl acrylate and/or glycidyl methacrylate, acrylic acid and/or maleic anhydride, and from 1 to 45, in particular from 10 to 35, % by weight of n-butyl acrylate and/or 2-ethylhexyl acrylate.
Further preferred esters of acrylic and/or methacrylic acid are the me~hyl, ethyl, propyl and i- or t-butyl esters.
In addition it is also pos~ible to use vinyl esters and vinyl ether~ as comonomer~.
The above-described ethylene copolymer~ can be prepared in a conventional manner, preferably by random copolymerization under high pressure at elevated temperature. Appropriate methods are common knowledge.
The melt index of the ethylene copolymers is in general within the range from 1 to 80 g/10 min (measured at 190C under a load of 2.16 kg).
Preferred elastomers E) are emulsion polymers whose preparation i8 described for example in Houben-Weyl, Methoden der organischen Chemie, volume XII. I
(1961), and also in Blackley~s monograph, Emulsion Polymerization. The emulsifiers and catalysts used are known per se.
In principle, it is possible to use elastomers which have a homogeneous structure or else elastomer~
which have a shell ~tructure. The shell-like ~tructure is determined by the order of addition of the individual monomers; the order of addition also has a bearing on the morphology of the polymers.
Merely representative examples of monomers for preparing the rubber part of the elastomer~ are acryl-ates, eg. n-butyl acrylate or 2-ethylhexyl acrylate, the 2~66~06 - 20 - O.Z. 0050/42361 corresponding methacrylates and isoprene and also mix-tures thereof. These monomers can be copolymerized with further monomer~ such as Ytyrene, acrylonitrile, vinyl ethers and further acrylates or methacrylates such as methyl methacrylate, methyl acrylate, ethyl acrylate and propyl acrylate.
The soft or rubber phase (having a glass transi-tion temperature of below 0C) of the elastomers can represent the core, the outer sheath or an interm~diate shell (in the case of elastomers having more than two shells); in the case of multishell elastomer it is also possible for more than one shell to be made of a rubber phase.
If ln addition to the rubber phase one or more hard component~ (having glass transition temperatures of more than 20C) are involved in the formation of the elastomer, they are in general prepared by polymerization of styrene, acrylonitrile, methacrylo-nitrile, ~-methylstyrene, p-methylstyrene, acrylic esters and methacrylic ester~ such as methyl acrylate, ethyl acrylate and methyl methacrylate as principal monomers.
Again, here too, minor amounts of further comonomers can be used.
In some cases it will be advantageous to use emulsion polymers which have reactive groups at the surface. Such groups are for example epoxy, carboxyl, latent carboxyl, amino or amide groups and also func-tional groups which can be introduced by using monomers of the general formula 7, l2 CH2=C--X--N--I_R3 where the substituents can have the following meanings:
Rl is hydrogen or C1-C4-alkyl, R2 is hydrogen, Cl-Cg-alkyl or aryl, in particular 2~6~1~6 - 21 - O.Z. 0050/42361 phenyl, R3 is hydrogen, C1-C10-alkyl, C6-C12-aryl or -oR4, R4 is C1-C8-alkyl or C5-C12-aryl, which may each be sub~tituted by O- or N-containing groups, X is a chemical bond, Cl-C~0-alkylene, C6-C12-arylene or --c--Y
Y is O-Z- or NH-Z and Z i~ C1-C10-alkylene or C8-C12-arylene.
It is also po~sible to use the graft monomers described in EP-A-208 187 for introducing reactive groups at the surface.
Further examples are acrylamide, methacrylamide and subatituted ester~ of acrylic acid or methacrylic acid such as (N-t-butylamino)ethyl methacrylate, (N,N-dimethylamino)ethyl acrylate, (N,N-dLmethylamlno)methyl acrylate and (N,N-diethylamino)ethyl acrylate.
-Furthermore, the particles of the rubber phase may also be crosslinked. Crosslinking monomers are for example divinylbenzene, diallyl phthalate and dihydrodi-cyclopentadienyl acrylate and also the compounds de-scribed in EP-A 50 265.
Furthermore, it is also possible to use graft-linking monomers, ie. monomers having two or more poly-merizable double bonds which react at different rates during the polymerization. Preference is given to tho~e compounds in which at least one reactive group polymer-izes at substantially the same rate aa the other mono-mers, while the other reactive group or groups polymer-izes or polymeriæe for example at a distinctly slower rate. The different polymerization rates introduce a certain proportion of unsaturated double bonds into the rubber. If such a rubber is subsequently grafted with a further phase, the double bonds present in the rubber react at leaRt partly with the graft monomers to form 2~6106 . - 22 - O.Z. 0050/42361 chemical bonds, so that the grafted-on phase ends up being linked at least to some extent to the grafting base via chemical bonds.
Examples of such graft-linking monomers are allyl-containing monomers, in particular allyl esters of ethylenically unsaturated carboxylic acids such as allyl acrylate, allyl methacrylate, diallyl maleate, diallyl fumarate, diallyl itaconate or the corresponding mono-allyl compounds of these dicarboxylic acids. There are many other suitable graft-linking monomers; for details reference should be made for example to US-A 4 148 846.
In general, the proportion of these crosslinking monomers in component E) i~ up to 5 ~ by weight, prefer-ably not more than 3 % by weight, based on E).
In what follows, some preferred emulsion polymers are listed. The firQt group to be mentioned here are graft polymers having a core and at least one outer shell which have the following structure:
2066~06 - 23 - O.Z. 0050/42361 Type Monomers for the core Monomers for the ~heath -A n-butyl acrylate, styrene,acrylonitrile, ethylhexyl acrylate methyl methacrylate or mixture~ thereof B as for A but with the a~ for A
use of crosslinkers C a~ for A or B n-butyl acrylate, ethyl acrylate, methyl acrylate, isoprene, ethylhexyl acrylate D as for A or B as for A or C but with the u8e of monomers having reactive groups a~ described herein E styrene, acrylo- first ~heath made of nitrile, methyl monomers as described methacrylate or under A and B for the mixtures thereof core second sheath as de~cribed under A or C
for the sheath In~tead of graft polymers having a multishell structure it is also possible to u3e homogeneous, ie.
single-shell, elastomers formet of isoprene and n-butyl acrylate or copolymer~ thereof. These product too can be prepared using crosslinking monomers or monomers having reactive groups.
Examples of preferred emul~ion polymers are n-butyl acrylate/(meth)acrylic acid copolymer , n-butyl acrylate/glycidyl acrylate or n-butyl acrylate/glycidyl methacrylate copolymers, graft polymers having an inner 206610~
- 24 - O.Z. 0050/42361 core of n-butyl acrylate and an outer sheath of the aforementioned copolymers and copolymers of ethylene with comonomers which provide reactive groups.
The above-described elastomers E) can also be prepared by other customary methods, for example by su~pension polymerization.
It is of course also possible to use mixtures of the aforementioned types of rubber.
Preference is given to using rubbers which contain no butadiene.
In addition to the essential components A) to C) and the optional components D) and E), the molding compositions of the present invention may contain custo-mary additives and processing aids. The proportion thereof i8 in general up to 20, preferably up to 10, 96 by weight, ba~ed on the total weight of components A) to E).
Customary additives are for example W stabil-izers, lubricants, demolding agents, colorants, dyes and pigments and plasticizers and also flame retardants.
Examples of W ~tabilizers are various substi-tuted resorcinols" salicylates, benzotriazoles and benzophenones, which in general are used in amounts of up to 2.0 % by weight.
Lubricants and demolding agents, which in general are added to the thermoplastic composition in amounts of up to 1 % by weight, are stearic acids, stearyl alcohol, alkyl stearates, N-alkylstearamides and also esters of pentaerythritol with long-chain fatty acids.
Flame xetardants can in general be present in the molding composition in amounts of up to 20 % by weight.
It is possible to use here any known flameproofing additives for polyamide, but preference is given to elemental red or black phosphorus.
The molding composition~ of the present invention can be prepared in a conventional manner by mixing the starting components in customary mixing apparatuse ~uch as screw extruders, Brabender mills or Banbury mills and - 25 - O.Z. 0050/42361 then extruding the mixture. After extrusion, the extru-date i8 cooled and comminuted. The mixing temperatures are in general within the range from 260 to 350C, preferably from 280 to 340C.
The thermoplastic molding compositions of the present invention score over thermoplastic molding compo~itions based on aliphatic or amorphous polyamides in particular on account of high and prolonged stability at elevated application and processing temperatures. In particular the impact toughness and light natural color of these stabilized copolyamides remain stable at high temperatures over prolonged periodsO Compared with stabilized articles shaped from aliphatic polyamides, the shaped articles formed from the molding composition~ of the present invention are notable for the significantly improved long-term effectiveness of the stabilizing effect.
Owing to this property spectrum, the molding compo~itions of the present invention are suitable in particular for manufacturing article~ which are to be subjected to high sustained-use temperatures. This ic true in particular of applications in the automotive vehicle sector, since engine compartments, built com-pactly and with increased soundproofing insulation, require higher use temperatures of the polyamide~ used therein.
EXANPLES
Component A/l A partly aromatic copolyamide composed of Al) 70 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A2) 30 % by weight of unit~ derived from 6-caprolactam.
The viscosity number as defined in ISO 307 was 141 ml/g (measured in a 0.5 % strength by weight solution in 96 % strength sulfuric acid at 25C).
Melting point: 298C
Glass tran~ition temperature: 113C
2 ~ 6 ~
- - 26 - O.Z. 0050/42361 Crystallinity: 26 %
Component A/2 A partly aromatic copolyamide composed of:
A1) 60 % by weight of unit~ derived from terephthalic S acid and hexamethylenediamine, and A2) 40 % by weight of units derived from ~-caprolactam.
Viscosity number as defined in ISO 307 : 137 ml/g Melting point : 281C
Gla~s tran~ition temperature : 100C
Crystallinity : 13 %
Component A/3 A partly aromatic copolyamide compo-~ed of A1) 50 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A3) 50 % by weight of units derived from adipic acid and hexamethylenediamine.
Visco~ity number as defined in ISO 307 : 142 ml/g Melting point : 292C
Glas~ tranqition temperature : 91C
Crystallinity : 28 %
Component A/Comparison 1 Polyhexamethyleneadipamide Vi~cosity number a~ defined in ISO 307 : 145 ml/g Melting point : 2629C
25 Glass transition temperature : 55C
Crystallinity : 43 %
Component B/l 4,4'-Bi~ dimethylbenzyl)diphenylamine (Naugard 445, from Uniroyal) Component B/2 Reaction product of diphenylamine and acetone (Naugard A, from Uniroyal) 20661~6 - 27 - O.Z. 0~50/42361 Component B/Comparison 1 A stabilizer based on sterically hindered phenols (Irganox~ 1098, from Ciba-Geigy) H~CH 2--CH ~--C--N--( CH 2 ) 6 - N - c - cH 2--CH 2~0H
Component C/l Na~2PO2 x 5 ~2O (commercial product from E. Merck) Component C/2 NaH2PO3 x 12 H2O (commercial product from E. Merck) Component C~3 NaH2PO4 x 1 H2O (commercial product from E. Merck) Component C/Comparison 1 A mixture of copper iodide and potas~ium iodide in a mixing ratio of 1 : 10.
Component D
Glas~ fiber~ in the form of chopped fibers having an average diameter of 10 ~m and a length of 4.5 mm (Gevetex~ P 537 from Vetrotex) Preparation of molding compositions Components A) to C) and, if used, D) were com-pounded on a twin-screw extruder (ZS~ 30, Werner &
Pfleiderer) at 320C with 250 rpm and a throughput of 20 kg/h, extruded in ~trand form, cooled down in a waterbath and granulated. The granules were dried and injection molded into test specimens at 320C.
The stability wa~ determined by storing the test specimens in air at 140 or 160C and subsequently deter-mining the notched impact strength a~l as defined in DIN 53 753 (at 23C, dry) as a function of the length of storage. The~e curve~ were used to determine the number of days (of storage) after which the notched impact strength drops to below 20 kJ/m2 (residual toughness), as a measure of the effectiveness of the stabilizer system.
In the case of the glas~ fiber reinforced molding compo-sitions, the impact toughness was measured by the method 2066~6 . - 28 - O.Z. 0050/42361 of Charpy ~DIN 53 453) as a function of the storage period until the limit of 20 kJ/m2 was reached.
The compositions of the molding material~ and the resultQ of the measurements are discernible from the tables.
2a~o~
- 29 - O.Z. 0050/42361 U U
o. P.
oo Ln U~
+ +
U ~ ~ C
~U~U~
o ~ UUU
N ~ Ei Ei ,C D~
.,1 ~ ~ ~ooo uuuu~uuuu e~uu uooo 3 Ei Ei E3 ii E3 5 E3 Ei Ei Ei E3 Ei .a ~P.O.~P.P. Q.~ P.+ + +
dP OOOOOOOOO OOO OOOO
U~ In U7 0 0 U~ In I O O O I In u~
.
.~.
~; c mmmmmmmmmm m _, .......... .
o oOoooooo~ O
o o ~q ~ C
~ c ~ ~
o o u~ ~
In addition to units derived from terephthalic acid and hexamethylenediamine, the copolyamides contain units derived from ~-caprolactam and/or units derived from adipic acid and hexamethylenediamine and/or units derived from further polyamide-forming monomer~.
The proportion of unit~ derived from -caprolac-tam i~ not more than 50 ~ by weight, preferably from 20 to 50 % by weiyht, in particular from 25 to 40 % by weight, while the proportion of units derived from adipic acid and hexamethylenediamine is up to 80 % by weight, preferably from 30 to 75 ~ by weight, in particular from 35 to 60 % by weight.
The copolyamides may contain not only units of e-caprolactam but also units of adipic acid and hexamethyl-enediamine; in this ca~e it i~ of advantage for the proportion of units which are free of aromatic groups to be not less than 10 % by weight, preferably not les~ than 20 % by weight. The ratio of units derived from 6 -capro-lactam and from adipic acid and hexamethylenediamine istherefore not subject to any special restriction.
Preference is given to copolyamides whose compo-sition in the ternary diagram lies within the pentangle defined by the corner points X~ to X5, where the points X
to X5 are defined as follows:
X1 40 % by weight of units Al) 60 % by weight of units A3) X2 60 ~ by weight of units A1) 40 % by weight of units A3) ~3 80 % by weight of units A1) 5 % by weight of unit~ A2) 15 % by weight of units A3) X4 80 % by weight of units A1) 20~6106 - 5 - O.Z. 0050/42361 20 ~ by weight of units A2) X5 50 % by weight of units A1) 50 % by weight of units A2) In the drawing, the pentangle defined by these points i~
shown in a ternary diagram.
Of particular advantage for many applications are polyamides containing from 50 to 80, in particular from 60 to 75, % by weiqht of units derived from terephthalic acid and hexamethylenediamine (units A1) and from 20 to 50, preferably from 25 to 40, % by weight of unit~
derived fro~ e-caprolactam (units A2).
In addition to the above-described units A1) to A3), the partly aromatic copolyamides may contain further poly d de-forming monomer~ A4) of the type known from other polyamides in amounts of up to 40, preferably 10 - 30, in particular 20 - 30, % by weight.
Aromatic dicarboxylic acids A4) preferably have from 8 to 16 carbon atoms. Suitable aromatic dicarboxylic acids are ~or example isophthalic acid, substituted terephthalic and isophthalic acids such as 3-t-butylisophthalic acid, polycyclic dicarboxylic acids, eg.
4,4'- and 3,3'-biphenyldicarboxylic acid, 4,4'- and 3,3'-diphenylmethanedicarboxylic acid, 4,4'- and 3,3'-~ulfodiphenyldicarboxylic acid, 1,4- or 2,6-naphthalenedicarboxylic acid and phenoxyterephthalicacid, of which isophthalic acid i8 particularly preferred.
Further polyamide-forming monomer3 A4) can be derived from dicarboxylic acid~ of from 4 to 16 carbon atoms and aliphatic or cycloaliphatic diamines of from 4 to 16 carbon atom~ and also from aminocarboxylic acids or corresponding lactams of from 7 to 12 carbon atoms. As suitable monomer~ of these types there may be mentioned here suberic acid, azelaic acid and sebacic acid a~
repre~entatives of aliphatic dicarboxylic acids, 2~6~06 . - 6 - O.Z. 0050/42361 1,4-butanediamine, 1,5-pentanediamine, piperazine, 4,4'-diaminodicyclohexylmethane, 2,2-(4,4'-diaminodicyclo-hexyl)propaneand3,3'-dimethyl-4,4'-diaminodicyclohexyl-methane as representatives of diamine~, and capryl-lactam, enantholactam, ~-aminoundecanoic acid and lauro-lactam aR representatives of lactam~ or amino-carboxylic acids.
The following compo~itions of component (A) are particularly preferred:
A~) from 65 to 85 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A4) from 15 to 35 % by weight of unit~ derived from isophthalic acid and hexamethylenediamine, or A1) from 50 to 70 % by weight of units derived from terephthalic acid and hexamethylenediamine, A3) from 10 to 20 % by weight of units derived from adipic acid and hexamethylenediamine, and A4) from 20 to 30 % by weight of units derived from i~ophthalic acid and hexamethylenediamine.
If component (A4) contains symmetrical 4,4'-3ub~tituted dicarboxylic acids (para position of the carboxyl groups), it is advisable to combine them with (A1) and (A2) or (Al) and (A3) to form ternary copolyamidesr since othexwise the copolyamide will have an exce~sively high melting point and will melt only with decompo~ition, which is not desirable.
Furthermore, tho~e partly aromatic copolyamides have proved particularly advantageous whose triamine content is less than 0.5, preferably less than 0.3, % by weight.
Partly aromatic copolyamides prepared by most existing pxocesses (cf. US-A 4 603 166) have triamine contents above 0.5 % by weight,-which leads to deteriora-tion in product quality and to problems with continuou~
production. A triamine which i8 in particular responsible for these problems is dihexamethylenetriamine, which is 2066~06 - 7 - O.Z. 0050/42361 formed from the hexamethylenediamine u~ed in the preparation.
Copolyamides having a low triamine content have lower melt viscosities than similarly composed products which have a higher triamine content, while the solution VigCoBity i8 the same. This improves not only the proces-sing properties but also the product propertie~
appreciably.
The melting points of the partly aromatic copoly-10amides lie within the range from 270C to 325C, prefer-ably from 280 to 310C, which high melting points are also associated with a high glasls transition temperature of in general more than 75C, in particular more than 85C (in the dry state).
15Binary copolyamides based on terephthalic acid, hexamethylenediamine and ~-caprolactam which contain about 70 % by weight of units derived from terephthalic acid and hexamethylenediamine have melting point~ in the 300C range and (in the dry state) a glass transition temperature of more than 110C.
Binary copolyamide~ based on terephthalic acid, adipic acid and hexamethylenediamine attain melting points of 300C or more at lower levels, about 55 % by weight, of units derived from terephthalic acid and hexamethylenediamine (HMD), although the glass transition temperature is not quite as high as with ~inary copoly-amide~ which in place of adipic acid or adipic acid/HMD
contain 6-caprolactam.
Partly aromatic copolyamides for the purposes of the present invention are those which have a degree of crystallinity > 10 %, preferably > 15 ~, and in par-ticular > 20 %.
The degree of crystallinity is a measure of the proportion of crystalline fragments in the copolyamide, and is determined by X-ray diffraction.
The preferred partly aromatic copolyamides of low triamine content can be prepared by the processes 2~66106 - 8 - O.Z. 0050/42361 described in EP-A-129 195 and EP-A-129 196.
In these processes, an aqueous solution of the monomers, ie. here the monomers which form the units A1) to A4), is heated under superatmospheric pressure to 250-300C with simultaneous evaporation of the water andformation of a prepolymer, then prepolymer and steam are continuously separated, the steam is rectified, and the entrained diamines are recycled. Finally, the prepolymer is passed into a polycondensation zone and polycondensed at 250 - 300C under a superatmospheric pressure of from 1 to 10 bar. The essential feature of the process is that the aqueou~ salt solution is heated under a superatmos-pheric pressure of from 1 to 10 bar in the course of a re~idence time of le~s than 60 seconds, and on exit from the vaporizer zone the degree of conversion is advantage-ously at least 93 % and the water content of the prepoly-mer is not more than 7 % by weight.
These short residence times substantially prevent the formation of triamines.
The aqueous solutions used generally have a monomer content of from 30 to 70 % by weight, in p~r-ticular from 40 to 65 % by weight.
The aqueous salt solution is advantageously pas~ed continuously at from 50 to 100C into a vaporizer zone, where the aqueou~ salt solution i~ heated to 250 -330C under a superatmospheric pressure of from 1 to 10, preferably from 2 to 6, bar. It will be readily under-stood that the temperature employed is above the melting point of the particular polyamide to be prepared.
As mentioned earlier, it is essential that the residence time in the vaporizer zone i9 not more than 60 seconds, preferably from 10 to 55 seconds, in par-ticular from 10 to 40 seconds.
The conversion on exit from the vaporizer zone is not less than 93 %, preferably from 95 to 98 %, and the water content i preferably within the range from 2 to 5, in particular from 1 to 3, % by weight.
206~6 - 9 - O.Z. 0050/42361 It is also advantageous to pas~ the mixture of prepolymer and steam immediately downstream of the vaporiæer zone, before the phases are separated, through a tubular mass transfer zone equipped with internal fitments. This is done under the temperature and pressure conditions employed in the vaporizer zone. The internal fitments, eg. packing such as Raschig rings, metal rings or in particular wire netting, ensure a large surface area. This ensures intimate contact between the phases, ie. prepolymer and steam, and ensures that the amount of diamine freed with steam is appreciably reduced. In general, the mass transfer zone is operated with a residence time of from 1 to 15 minutes. The mass transfer zone is advantageou~ly constructed as a tube bundle.
The two-phase mixture of steam and prepolymer emerging from the vaporizer or mas~ transfer zone is separated. Separation gen~rally takes place automatical-ly, owing to the physical differences, in a vessel the bottom part of which i9 advantageously con~tructed as a polymerisation zone. The freed vapors consist essentially of steam and diamines freed on evaporation of the water.
These vapors are passed into a column and rectified.
Suitable columns are for example packed columns, bell tray columns or qieve plate columns of from 5 to 15 theo-retical pl~tes. The column is advantageously operatedunder the same pressure conditions as the vaporizer zone.
The diamines contained in the vapor-q are separated off and returned into the vaporizer zone. It is also po~sible to pass the diamines into the downstream polymerization zone. The rectified steam obtained is withdrawn at the top of the column.
The prepolymer obtained, which accordin~ to its degree of conversion consists essentially of low molecular weight polyamide with or without residual amounts of unconverted ~alts and in general has a rela-tive viscosity of from 1.2 to 1.7, is passed into a polymerization zone. In the polymerization zone, the melt ~066~0~
- 10 - O.Z. 0050/42361 obtained is polycondensed at 250 - 330C, in particular 270 - 310C, under a ~uperatmospheric pressure of from 1 to 10 bar, in particular from 2 to 6 bar. Advantageously, the vapor3 freed here are rectified in the column to-gether with the abovementioned vapors, and preferably the polycondenaation zone is operated with a residence time of from 5 to 30 minutea. The polyamide thus obtained, which in general ha~ a relative viscosity of from 1.2 to 2.3, i8 continuou~ly removed from the conden~ation zone.
In a preferred proce~3, the polyamide thu3 obtained is passed as a liquid melt through a discharge zone with simultaneous removal of the residual water present in the melt. Suitable discharge zones are for example devolatilization extruders. The melt thus freed of water i9 then strand extruded and granulated. The granule3 obtained are advantageously condensed in solid phase by mean~ of superheated steam at a temperature below the melting point, eg. at from 170 to 240C, until the desired vigC08ity i3 obtained. Advantageously, this i8 done using the steam obtained at the top of tha column.
Following the solid pha~e postconden~ation the relative vi~cosity, measured in a 1 % by weight aolution in 96 % by weight H2SO4 at 23C, is in general within the range from 2.2 to 5.0, preferably from 2.3 to 4.5.
In a further preferred process, the polyamide melt discharged from the polycondensation zone i9 passed into a further polycondensation zone and condensed therein with continuou~ formation of new surfaces at from 285 to 310C, advantageou~ly under reduced pressure, for example at from 1 to 500 mbar, until the de~ired visco-~ity is obtained. Suitable vessels are known as finisher3.
A further proce~s, which is similar to that described above, iq deacribed in EP-A~129 196, incor-porated herein by reference.
2~661~6 ~ O.Z. OOS0/42361 As component A) it is also possible to use mixtures of different copolyamides, for which the mixing ratio is freely choosable.
As component B) the molding compositions of the present invention contain at lea~t one aroma~ic secondary amine in an amount of from 0.1 to 2, preferably from 0.5 to 1.5, in particular from 0.7 to 1, % by weight, accord-ing to the general formula I:
~ (A)m-NH-(B)~ ~ I
where m and n are each 0 or 1, A and B are each a C1-C4-alkyl- or phenyl-sub~tituted tertiary carbon atom, R1 and R2 are each hydrogen or ortho- or para-disposed Cl-C6-alkyl which may be monosubstituted, disubstituted or trisubstituted by phenyl, halogen, carboxyl or a transition metal salt of carboxyl, and R3 and R4 are each hydrogen or ortho- or para-di~po~ed methyl when m plus n is 1 or ortho- or para-disposed tertiary C3-Cg-alkyl which may be monosubstituted, disubstituted or trisubsti-tuted by phenyl when m plus n is 0 or 1.
Preferred radicals A and B are each symmetrically ~ubstituted tertiary carbon atoms, and dimethyl-substi-tuted tertiary carbon is particularly preferred. Prefer-ence i~ also given to tertiary carbons which have from 1 to 3 phenyl groups as substituents~
Preferred radical~ R1 and R2 are each para-t-butyl or tetramethyl-substituted n-butyl, although the methyl groups may preferably be replaced by from 1 to 3 phenyl groups. Preferred halogen~ are chlorine and bromine.
2~6~106 . - 12 - O.Z. 0050/42361 Preferred radicals R3 and R4 are each hydrogen in the case of m plus n = 2 or ortho- or para-dispo~ed t-butyl, which may be sub~tituted in particular by from 1 to 3 phenyl radicals, in the case of m plus n = 0 or 1.
Examples of secondary aromatic amines B) are 4,4'-bis(~,~'-tert-octyl)diphenylamine, 4,4'-bist~,~-dimethylbenzyl)diphenylamine, 4,4'-bis(~-methylbenzhydryl)diphenylamine, 4-(1,1,3,3-tetramethylbutyl)-4'-triphenylmethyldiphenyl-amine 4,4'-bis(~,~-p-trimethylbenzyl)diphenylamine 2,4,4'-tris(~,~-dimethylbenzyl)diphenylamine 2,2'-dibromo-4,4~-bis(~,~-dimethylbenzyl)diphenylamine 4,4'-bis(~,~-dimethylbenzyl)-2-carboxydiphenylamine-nickel-4,4'-bis(~,~-dimethylbenzyl)diphenylamine 2-sec-butyl-4,4'-biY(~,~-dimethylbenzyl)diphenylamine 4,4'-bis(~,~-dimethylbenzyl)-2-(~-methylheptyl)diphenyl-amlne 2-(~-methylpentyl)-4,4'-ditrityldiphenylamine 4-~,~-dimethylbenzyl-4~-isopropoxydiphenylamine 2-(~-methylheptyl)-4~ -dimethylbenzyl)diphenylamine 2-(~-methylpentyl)-4'-trityldiphenylamine 4,4'-bis(tert-butyl)diphenylamine and also:
~3~-0-NH~
~;C~ CH
>-I-NH~
2~6106 - 13 - O.z. 0050/42361 C~3 C ~ N ~ CH3 ~ Cl Cl ~
CH3 1 ~ N
/ ~ IH
CH3 ~
NH
CH3 ~
CH3-C ~ N ~ C-CH3 CH3-C-CH2-1 ~ NH ~ O_CH2_C_CH3 - 14 - O.Z. 0050/42361 CH3--C~ NH~ --0--CH3 -¢-NH~
CH3~1--NH--I~CH3 CH3--¢--1~>---NH----~
~3--l--~--NH--~> ~ 4 ~3 ~
~--NH--I~
They are prepared as described in 8E-A-67/0500120 and CA-A-963594.
Preferred secondary aromatic amine~ are diphenyl-amine and derivatives thereof, which are commerciallyavailable as Naugard (from Uniroyal).
As component C) tho molding compositions of the present invention contain from 100 to 2000, preferably 2~66~ 0~
- - 15 - O.Z. 0050/42361 200-500, in particular 200-400, ppm of at least one phosphorus-containing inorganic acid or a derivative thereof, ba~ed on the total amount of components A) and B) in the molding compositions.
Preferred acids are hypophosphorous acid, phos-phorous acid and phosphoric acid and also salts thereof with alkali metals, of which sodium and potassium are particularly preferred. Preferred mixtures are in parti-cular hypophosphorous and phosphorous acid or their alkali metal salts in a ratio of from 3 : 1 to 1 : 3.
Organic derivative~ of these acids are preferably to be understood as meaning ester derivatives of the above-mentioned acids.
As component D) the molding compositions of the present invention may contain from 0 to 59.9, in particular from 5 to 50, particularly preferably from 10 to 35, % by weight of a fibrous or particulate filler or of a mixture of such fillers.
Examples of fibrous fillers are glass fibers, carbon fibers, aramid fibers, potassium titanate fibers and fibrous silicates such as wollastonite.
If glass fiber~ and fillers based on silicate are used, they may have been dressed with a size and a coupling agent for better compatibility with the poly-amide.
In general, the glass fibers used have a diameterwithin the range from 6 to 20 ~m. They can be incor-porated not only in the form of short fibers but al o in the form of continuou~ strands or rovings. In the finished injection molding, the average length of the glass fibers is preferably within the range from 0.08 to 5 mm.
Suitable particulate fillers are for example glas~ balls, particulate wollastonite, quartz powder, boron nitride, kaolin, calcium carbonate, magne3ium carbonate (chalk) and titanium dioxide, of which wollas-tonite, titanium dioxide and kaolin are in general . - 16 - O.Z. 0050/42361 preferred.
As component E) the thermoplastic molding compo-sition~ according to the present invention contain from 0 to 30, preferably from 5 to 20, % by weight, based on the sum total of component~ A) to E), of an ela~tomeric polymer.
In general, thi~ will be a copolymer which i~
preferably compo~ed of at least two of the following monomers as main components: ethylene, propylene, isobu-tene, isoprene, chloroprene, vinyl acetate, styrene,acrylonitrile and acrylic and methacrylic ester~ having from 1 to 18 carbon atom~ in the alcohol component.
Rubbers of this kind are de~cribed for example in Houben-Weyl, Methoden der organischen Chemie, vol. 14/1 (Thieme-Verlag, Stuttgart, 1961), pages 392-406, and in the monograph by C.B. Bucknall, Toughened Pla3tics (Applied Science Publishers, London, 1977).
Preferred types of these elastomers are the ethylene-propylene monomer (EPM) and ethylene-propylene-diene monomer (EPDM) rubber~, which preferably have an ethylene unit to propylene unit ratio within the range from 40:60 to 90:10.
The Mooney viscosities (MLI+4/100C) of such uncro~linked EPM or EPDM rubbers (gel contents in general below 1 % by weight) are preferably within the range from 25 to 100, in particular from 35 to 90 (meas-ured with the large rotor after 4 minutes at 100C in accordance with German Standard Specification DIN 53 523).
EPM rubbers in general have virtually no double bonds left, while EPDM rubber~ can have from 1 to 20 double bonds/100 carbon atoms.
. As diene monomers for EPDM rubbers there may be mentioned for example conjugated dienes such as isoprene, nonconjugated dienes of from 5 to 25 carbon atom~ such as 1,4-pentadiene, 1,4-hexadiene, 1,5-hexadiene, 2,5-dimethyl-1,5-hexadiene and 1,4-octadiene, cyclic dienes 2~6~106 - 17 - O. Z . 005~/42361 such as cyclopentadiene, cyclohexadienes, cyclooctadienes and dicyclopentadiene and also alkenylnorbornenes such as 5-ethylidene-2-norbornene, 5-butylidene-2-norbornene, 2-methallyl-5-norbornene, 2-isopropenyl-5-norbornene and tricyclodiene such as 3-methyltricyclo [ 5 . 2 . 1. 0 . 2 . 6 ] -3, 8-decadiene or mixtures thereof . Pref erence is given to 1, 5-hexadiene, 5-ethylidenenorbornene and dicyclopentadiene. The diene content of the EPDM rubbers i9 preferably from 0.5 to 50, in particular from 1 to 8, % by weight, based on the total weight of the rubber.
EPM and EPDM rubbers can preferably also be grafted with reactive carboxylic acids or derivatives thereof. These include for example acrylic acid, meth-acrylic acid and derivatives thereof and also maleic anhydride.
A further group of preferred rubbers are copoly-mers of ethylene with acrylic acid and/or methacrylic acid and/or the esters of these acids. In addition, the rubbers may contain dicarboxylic acids such as maleic acid and fumaric acid or derivatives thereof, such as esters and anhydrides, and/or epoxy-containing monomers.
These dicarboxylic acid derivatives and epoxy-containing monomerc are pref erably incorporated in the rubber by adding dicarboxylic acid- or epoxy-containing monomers of the general formula II or III or IV or V to the monomer mixture 2~6~1~6 - 18 - O.Z. 0050/4236 R~C(COOR2~=C(COOR3)R4 Il \C C~
I I I
CO CO
`O' CHR7=CH--(CH2) ~(CHR6) --CH--CHR5 IV
m n CH2=CR9--COO--(--CH2)--CH--CHR8 V
n \o/
where Rl to R9 are each hydrogen or alkyl of from 1 to 6 carbon atoms, m is an integer from 0 to 20, n is an integer from 0 to 10 and p is an integer from 0 to 5.
Preferably, each of Rl-R7 is hydrogen, m is 0 or 1, and n is 1. The corresponding compounds are maleic acid, fumaric acid, maleic anhydride, allyl glycidyl ether and vinyl glycidyl ether.
Preferred compounds of the formulae II, III and V
are maleic acid, maleic anhydride and epoxy-containing esters of acrylic acid and/or methacrylic acid, of which glycidyl acrylate, glycidyl methacrylate and the esters with tertiary alcohols, such as t-butyl acrylate, are particularly preferred. It i3 true that the latter have no free carboxyl groups, but their behavior is similar to that of the free acids and therefore they are referred to as monomers having latent carboxyl groups.
The ethylene content of the copolymers i3 in general-within the range from 50 to 98 % by weight, and the proportion of methacrylic esters is within the range from 2 to 50 % by weight. Advantageously, the copoly~ers consist of from 50 to 98 ~ by weight of ethylene, from 0.1 to 20 ~ by weight of epoxy-containing monomers and/or methacrylic acid and/or acid anhydride group-containing monomers and also methacrylic ester~ as remainder.
2~6~06 - 19 - O.Z. 0050/42361 Particular preference is given to copolymers of from 50 to 98.9, in particular from 60 to 95, % by weight of ethylene, from 0.1 to 40, in particular from 0.3 to 20, % by weight of glycidyl acrylate and/or glycidyl methacrylate, acrylic acid and/or maleic anhydride, and from 1 to 45, in particular from 10 to 35, % by weight of n-butyl acrylate and/or 2-ethylhexyl acrylate.
Further preferred esters of acrylic and/or methacrylic acid are the me~hyl, ethyl, propyl and i- or t-butyl esters.
In addition it is also pos~ible to use vinyl esters and vinyl ether~ as comonomer~.
The above-described ethylene copolymer~ can be prepared in a conventional manner, preferably by random copolymerization under high pressure at elevated temperature. Appropriate methods are common knowledge.
The melt index of the ethylene copolymers is in general within the range from 1 to 80 g/10 min (measured at 190C under a load of 2.16 kg).
Preferred elastomers E) are emulsion polymers whose preparation i8 described for example in Houben-Weyl, Methoden der organischen Chemie, volume XII. I
(1961), and also in Blackley~s monograph, Emulsion Polymerization. The emulsifiers and catalysts used are known per se.
In principle, it is possible to use elastomers which have a homogeneous structure or else elastomer~
which have a shell ~tructure. The shell-like ~tructure is determined by the order of addition of the individual monomers; the order of addition also has a bearing on the morphology of the polymers.
Merely representative examples of monomers for preparing the rubber part of the elastomer~ are acryl-ates, eg. n-butyl acrylate or 2-ethylhexyl acrylate, the 2~66~06 - 20 - O.Z. 0050/42361 corresponding methacrylates and isoprene and also mix-tures thereof. These monomers can be copolymerized with further monomer~ such as Ytyrene, acrylonitrile, vinyl ethers and further acrylates or methacrylates such as methyl methacrylate, methyl acrylate, ethyl acrylate and propyl acrylate.
The soft or rubber phase (having a glass transi-tion temperature of below 0C) of the elastomers can represent the core, the outer sheath or an interm~diate shell (in the case of elastomers having more than two shells); in the case of multishell elastomer it is also possible for more than one shell to be made of a rubber phase.
If ln addition to the rubber phase one or more hard component~ (having glass transition temperatures of more than 20C) are involved in the formation of the elastomer, they are in general prepared by polymerization of styrene, acrylonitrile, methacrylo-nitrile, ~-methylstyrene, p-methylstyrene, acrylic esters and methacrylic ester~ such as methyl acrylate, ethyl acrylate and methyl methacrylate as principal monomers.
Again, here too, minor amounts of further comonomers can be used.
In some cases it will be advantageous to use emulsion polymers which have reactive groups at the surface. Such groups are for example epoxy, carboxyl, latent carboxyl, amino or amide groups and also func-tional groups which can be introduced by using monomers of the general formula 7, l2 CH2=C--X--N--I_R3 where the substituents can have the following meanings:
Rl is hydrogen or C1-C4-alkyl, R2 is hydrogen, Cl-Cg-alkyl or aryl, in particular 2~6~1~6 - 21 - O.Z. 0050/42361 phenyl, R3 is hydrogen, C1-C10-alkyl, C6-C12-aryl or -oR4, R4 is C1-C8-alkyl or C5-C12-aryl, which may each be sub~tituted by O- or N-containing groups, X is a chemical bond, Cl-C~0-alkylene, C6-C12-arylene or --c--Y
Y is O-Z- or NH-Z and Z i~ C1-C10-alkylene or C8-C12-arylene.
It is also po~sible to use the graft monomers described in EP-A-208 187 for introducing reactive groups at the surface.
Further examples are acrylamide, methacrylamide and subatituted ester~ of acrylic acid or methacrylic acid such as (N-t-butylamino)ethyl methacrylate, (N,N-dimethylamino)ethyl acrylate, (N,N-dLmethylamlno)methyl acrylate and (N,N-diethylamino)ethyl acrylate.
-Furthermore, the particles of the rubber phase may also be crosslinked. Crosslinking monomers are for example divinylbenzene, diallyl phthalate and dihydrodi-cyclopentadienyl acrylate and also the compounds de-scribed in EP-A 50 265.
Furthermore, it is also possible to use graft-linking monomers, ie. monomers having two or more poly-merizable double bonds which react at different rates during the polymerization. Preference is given to tho~e compounds in which at least one reactive group polymer-izes at substantially the same rate aa the other mono-mers, while the other reactive group or groups polymer-izes or polymeriæe for example at a distinctly slower rate. The different polymerization rates introduce a certain proportion of unsaturated double bonds into the rubber. If such a rubber is subsequently grafted with a further phase, the double bonds present in the rubber react at leaRt partly with the graft monomers to form 2~6106 . - 22 - O.Z. 0050/42361 chemical bonds, so that the grafted-on phase ends up being linked at least to some extent to the grafting base via chemical bonds.
Examples of such graft-linking monomers are allyl-containing monomers, in particular allyl esters of ethylenically unsaturated carboxylic acids such as allyl acrylate, allyl methacrylate, diallyl maleate, diallyl fumarate, diallyl itaconate or the corresponding mono-allyl compounds of these dicarboxylic acids. There are many other suitable graft-linking monomers; for details reference should be made for example to US-A 4 148 846.
In general, the proportion of these crosslinking monomers in component E) i~ up to 5 ~ by weight, prefer-ably not more than 3 % by weight, based on E).
In what follows, some preferred emulsion polymers are listed. The firQt group to be mentioned here are graft polymers having a core and at least one outer shell which have the following structure:
2066~06 - 23 - O.Z. 0050/42361 Type Monomers for the core Monomers for the ~heath -A n-butyl acrylate, styrene,acrylonitrile, ethylhexyl acrylate methyl methacrylate or mixture~ thereof B as for A but with the a~ for A
use of crosslinkers C a~ for A or B n-butyl acrylate, ethyl acrylate, methyl acrylate, isoprene, ethylhexyl acrylate D as for A or B as for A or C but with the u8e of monomers having reactive groups a~ described herein E styrene, acrylo- first ~heath made of nitrile, methyl monomers as described methacrylate or under A and B for the mixtures thereof core second sheath as de~cribed under A or C
for the sheath In~tead of graft polymers having a multishell structure it is also possible to u3e homogeneous, ie.
single-shell, elastomers formet of isoprene and n-butyl acrylate or copolymer~ thereof. These product too can be prepared using crosslinking monomers or monomers having reactive groups.
Examples of preferred emul~ion polymers are n-butyl acrylate/(meth)acrylic acid copolymer , n-butyl acrylate/glycidyl acrylate or n-butyl acrylate/glycidyl methacrylate copolymers, graft polymers having an inner 206610~
- 24 - O.Z. 0050/42361 core of n-butyl acrylate and an outer sheath of the aforementioned copolymers and copolymers of ethylene with comonomers which provide reactive groups.
The above-described elastomers E) can also be prepared by other customary methods, for example by su~pension polymerization.
It is of course also possible to use mixtures of the aforementioned types of rubber.
Preference is given to using rubbers which contain no butadiene.
In addition to the essential components A) to C) and the optional components D) and E), the molding compositions of the present invention may contain custo-mary additives and processing aids. The proportion thereof i8 in general up to 20, preferably up to 10, 96 by weight, ba~ed on the total weight of components A) to E).
Customary additives are for example W stabil-izers, lubricants, demolding agents, colorants, dyes and pigments and plasticizers and also flame retardants.
Examples of W ~tabilizers are various substi-tuted resorcinols" salicylates, benzotriazoles and benzophenones, which in general are used in amounts of up to 2.0 % by weight.
Lubricants and demolding agents, which in general are added to the thermoplastic composition in amounts of up to 1 % by weight, are stearic acids, stearyl alcohol, alkyl stearates, N-alkylstearamides and also esters of pentaerythritol with long-chain fatty acids.
Flame xetardants can in general be present in the molding composition in amounts of up to 20 % by weight.
It is possible to use here any known flameproofing additives for polyamide, but preference is given to elemental red or black phosphorus.
The molding composition~ of the present invention can be prepared in a conventional manner by mixing the starting components in customary mixing apparatuse ~uch as screw extruders, Brabender mills or Banbury mills and - 25 - O.Z. 0050/42361 then extruding the mixture. After extrusion, the extru-date i8 cooled and comminuted. The mixing temperatures are in general within the range from 260 to 350C, preferably from 280 to 340C.
The thermoplastic molding compositions of the present invention score over thermoplastic molding compo~itions based on aliphatic or amorphous polyamides in particular on account of high and prolonged stability at elevated application and processing temperatures. In particular the impact toughness and light natural color of these stabilized copolyamides remain stable at high temperatures over prolonged periodsO Compared with stabilized articles shaped from aliphatic polyamides, the shaped articles formed from the molding composition~ of the present invention are notable for the significantly improved long-term effectiveness of the stabilizing effect.
Owing to this property spectrum, the molding compo~itions of the present invention are suitable in particular for manufacturing article~ which are to be subjected to high sustained-use temperatures. This ic true in particular of applications in the automotive vehicle sector, since engine compartments, built com-pactly and with increased soundproofing insulation, require higher use temperatures of the polyamide~ used therein.
EXANPLES
Component A/l A partly aromatic copolyamide composed of Al) 70 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A2) 30 % by weight of unit~ derived from 6-caprolactam.
The viscosity number as defined in ISO 307 was 141 ml/g (measured in a 0.5 % strength by weight solution in 96 % strength sulfuric acid at 25C).
Melting point: 298C
Glass tran~ition temperature: 113C
2 ~ 6 ~
- - 26 - O.Z. 0050/42361 Crystallinity: 26 %
Component A/2 A partly aromatic copolyamide composed of:
A1) 60 % by weight of unit~ derived from terephthalic S acid and hexamethylenediamine, and A2) 40 % by weight of units derived from ~-caprolactam.
Viscosity number as defined in ISO 307 : 137 ml/g Melting point : 281C
Gla~s tran~ition temperature : 100C
Crystallinity : 13 %
Component A/3 A partly aromatic copolyamide compo-~ed of A1) 50 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A3) 50 % by weight of units derived from adipic acid and hexamethylenediamine.
Visco~ity number as defined in ISO 307 : 142 ml/g Melting point : 292C
Glas~ tranqition temperature : 91C
Crystallinity : 28 %
Component A/Comparison 1 Polyhexamethyleneadipamide Vi~cosity number a~ defined in ISO 307 : 145 ml/g Melting point : 2629C
25 Glass transition temperature : 55C
Crystallinity : 43 %
Component B/l 4,4'-Bi~ dimethylbenzyl)diphenylamine (Naugard 445, from Uniroyal) Component B/2 Reaction product of diphenylamine and acetone (Naugard A, from Uniroyal) 20661~6 - 27 - O.Z. 0~50/42361 Component B/Comparison 1 A stabilizer based on sterically hindered phenols (Irganox~ 1098, from Ciba-Geigy) H~CH 2--CH ~--C--N--( CH 2 ) 6 - N - c - cH 2--CH 2~0H
Component C/l Na~2PO2 x 5 ~2O (commercial product from E. Merck) Component C/2 NaH2PO3 x 12 H2O (commercial product from E. Merck) Component C~3 NaH2PO4 x 1 H2O (commercial product from E. Merck) Component C/Comparison 1 A mixture of copper iodide and potas~ium iodide in a mixing ratio of 1 : 10.
Component D
Glas~ fiber~ in the form of chopped fibers having an average diameter of 10 ~m and a length of 4.5 mm (Gevetex~ P 537 from Vetrotex) Preparation of molding compositions Components A) to C) and, if used, D) were com-pounded on a twin-screw extruder (ZS~ 30, Werner &
Pfleiderer) at 320C with 250 rpm and a throughput of 20 kg/h, extruded in ~trand form, cooled down in a waterbath and granulated. The granules were dried and injection molded into test specimens at 320C.
The stability wa~ determined by storing the test specimens in air at 140 or 160C and subsequently deter-mining the notched impact strength a~l as defined in DIN 53 753 (at 23C, dry) as a function of the length of storage. The~e curve~ were used to determine the number of days (of storage) after which the notched impact strength drops to below 20 kJ/m2 (residual toughness), as a measure of the effectiveness of the stabilizer system.
In the case of the glas~ fiber reinforced molding compo-sitions, the impact toughness was measured by the method 2066~6 . - 28 - O.Z. 0050/42361 of Charpy ~DIN 53 453) as a function of the storage period until the limit of 20 kJ/m2 was reached.
The compositions of the molding material~ and the resultQ of the measurements are discernible from the tables.
2a~o~
- 29 - O.Z. 0050/42361 U U
o. P.
oo Ln U~
+ +
U ~ ~ C
~U~U~
o ~ UUU
N ~ Ei Ei ,C D~
.,1 ~ ~ ~ooo uuuu~uuuu e~uu uooo 3 Ei Ei E3 ii E3 5 E3 Ei Ei Ei E3 Ei .a ~P.O.~P.P. Q.~ P.+ + +
dP OOOOOOOOO OOO OOOO
U~ In U7 0 0 U~ In I O O O I In u~
.
.~.
~; c mmmmmmmmmm m _, .......... .
o oOoooooo~ O
o o ~q ~ C
~ c ~ ~
o o u~ ~
8 8 ~
U U ~ ~ ~ ~ ~ ~ ~
.
o ~ o o o c~ a~ o o o n o o o o a~ o o o ,, l . ...
, " C ~ ~ ~, C
2~661~6 - 30 - O.Z. 0050/4236 o S
.,1 d~
o U U U U U U
oP , o o o o o o -.
.,~ h " ~ uuumm~m ", ~ mmmr~mr~
1 0 0 _1 0 E~ W
o e O oq .,1 ~ ~n ~ C
.,., ~ a.
o o U
o~ o~
U U
C
h ~
X a~ O _I N t~l ~ Lr) O
h U
o a~
W
__ ~ .a - 31 - .Z. 0o5o/42326o 6 6~ 0 Result~ of measurements Example Days (T = 140C) Days (T - 160C) Residual akl = 20 kJ/m2akl = 20 kJ/m2 loa, 8 3 11~ 4 12a) 4 13~) 3 14~ 2 ~1 15a) 35 9 16~ 37 10 17A) 38 9 18~) 40 8 19~) 3 20~) 4 21~ 3 a) for comparison b) decomposition :~
.
2 0 ~
. - 32 - O.Z. 0050/42361 The re~ults of the measurements show that, compared with other polyamides, a significantly better long-term tability at elevated temperatures is achieved for the same amount of stabilizer. The measurements also show that comparative stabilizers which are highly suitable for aliphatic polyamides do not provide effec-tive stabilization for partly aromatic copolyamides.
U U ~ ~ ~ ~ ~ ~ ~
.
o ~ o o o c~ a~ o o o n o o o o a~ o o o ,, l . ...
, " C ~ ~ ~, C
2~661~6 - 30 - O.Z. 0050/4236 o S
.,1 d~
o U U U U U U
oP , o o o o o o -.
.,~ h " ~ uuumm~m ", ~ mmmr~mr~
1 0 0 _1 0 E~ W
o e O oq .,1 ~ ~n ~ C
.,., ~ a.
o o U
o~ o~
U U
C
h ~
X a~ O _I N t~l ~ Lr) O
h U
o a~
W
__ ~ .a - 31 - .Z. 0o5o/42326o 6 6~ 0 Result~ of measurements Example Days (T = 140C) Days (T - 160C) Residual akl = 20 kJ/m2akl = 20 kJ/m2 loa, 8 3 11~ 4 12a) 4 13~) 3 14~ 2 ~1 15a) 35 9 16~ 37 10 17A) 38 9 18~) 40 8 19~) 3 20~) 4 21~ 3 a) for comparison b) decomposition :~
.
2 0 ~
. - 32 - O.Z. 0050/42361 The re~ults of the measurements show that, compared with other polyamides, a significantly better long-term tability at elevated temperatures is achieved for the same amount of stabilizer. The measurements also show that comparative stabilizers which are highly suitable for aliphatic polyamides do not provide effec-tive stabilization for partly aromatic copolyamides.
Claims (9)
1. A thermoplastic molding composition containing A) 40-99.9 % by weight of a partly aromatic and partly crystalline copolyamide having a triamine content of less than 0.5 % by weight composed of (A1) 20-90 % by weight of units derived from tereph-thalic acid and hexamethylenediamine, (A2) 0-50 % by weight of units derived from ?-caprolactam, (A3) 0-80 % by weight of units derived from adipic acid and hexamethylenediamine, (A4) 0-40 % by weight of further polyamide-forming monomers, the proportion of component (A2) or (A3) or (A4) or a mixture thereof being not less than 10 % by weight, B) 0.1-2 % by weight of at least one aromatic secondary amine, and C) 100-2000 ppm of at lea t one phosphorus-containing inorganic acid or a derivative thereof, the proportion of component C) being based on the total amount of components A) and B), and also D) 0-59.9 % by weight of a fibrous or particulate filler or a mixture thereof, E) 0-30 % by weight of an elastomeric polymer.
2. A thermoplastic molding composition as claimed in claim 1, containing as component B) an aromatic secondary amine of the general formula I
I
where m and n are each 0 or 1, A and B are each a C1-C4-alkyl- or phenyl-substituted tertiary carbon atom, -34- O.Z. 0050/42361 R1 and R2 are each hydrogen or ortho- or para-disposed C1-C6-alkyl which may be monosubstituted, disubstituted or trisubstituted by phenyl, halogen, carboxyl or a transition metal salt of carboxyl, and R3 and R4 are each hydrogen or ortho- or para-disposed methyl when m plu8 n is 1 or ortho- or para-disposed tertiary C3-C9-alkyl which may be monosubstituted, disubstituted or trisubsti-tuted by phenyl when m plus n is 0 or 1.
I
where m and n are each 0 or 1, A and B are each a C1-C4-alkyl- or phenyl-substituted tertiary carbon atom, -34- O.Z. 0050/42361 R1 and R2 are each hydrogen or ortho- or para-disposed C1-C6-alkyl which may be monosubstituted, disubstituted or trisubstituted by phenyl, halogen, carboxyl or a transition metal salt of carboxyl, and R3 and R4 are each hydrogen or ortho- or para-disposed methyl when m plu8 n is 1 or ortho- or para-disposed tertiary C3-C9-alkyl which may be monosubstituted, disubstituted or trisubsti-tuted by phenyl when m plus n is 0 or 1.
3. A thermoplastic molding composition as claimed in claim 1, wherein component C) comprises hypophosphorous acid, phosphorous acid, phosphoric acid, an alkali metal salt thereof or a mixture thereof.
4. A thermoplastic molding composition as claimed in claim 1, wherein the partly aromatic copolyamide A) contains A1) 50-80 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A2) 20-50 % by weight of units derived from ?-capro-lactam.
5. A thermoplastic molding composition as claimed in claim 1, wherein the partly aromatic copolyamide A) contains A1) 25-70 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A3) 30-75 % by weight of units derived from adipic acid and hexamethylenediamine.
6. A thermoplastic molding composition as claimed in claim 1, wherein the partly aromatic copolyzmide A) contains A1) 65-85 % by weight of units derived from terephthalic acid and hexamethylenediamine, and A4) 15-35 % by weight of units derived from isophthalic acid and hexamethylenediamine.
7. A thermoplastic molding composition as claimed in claim 1, wherein the partly aromatic copolyamide A) - 35 - O.Z. 0050/42361 contains A1) 50-70 % by weight of units derived from terephthalic acid and hexamethylenediamine, A3) 10-20 % by weight of units derived from adipic acid and hexamethylenediamine, and A4) 20-30 % by weight of units derived from isophthalic acid and hexamethylenediamine.
8. A thermoplastic molding composition as claimed in claim 1, wherein component A) has a melting point of from 270°C to 325°C.
9. A shaped article obtainable from a partly aromatic copolyamide as set forth in claim 1.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4112324.7 | 1991-04-16 | ||
DE4112324A DE4112324A1 (en) | 1991-04-16 | 1991-04-16 | STABILIZED THERMOPLASTIC PARTICULAR POLYAMIDE MOLDING |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2066106A1 true CA2066106A1 (en) | 1992-10-17 |
Family
ID=6429658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002066106A Abandoned CA2066106A1 (en) | 1991-04-16 | 1992-04-15 | Stabilized thermoplastic partly aromatic polyamide molding compositions |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0509282B1 (en) |
JP (1) | JPH05171037A (en) |
AT (1) | ATE140712T1 (en) |
CA (1) | CA2066106A1 (en) |
DE (2) | DE4112324A1 (en) |
ES (1) | ES2090392T3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9963591B2 (en) | 2012-12-18 | 2018-05-08 | Ems-Patent Ag | Polyamide molding material and moldings manufactured from same |
CN108192094A (en) * | 2018-02-06 | 2018-06-22 | 湖南文理学院 | The preparation method of PA (6-co-6T) copolymer |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4234710A1 (en) * | 1992-10-15 | 1994-04-21 | Basf Ag | Partly aromatic copolyamides |
US5852165A (en) * | 1994-05-31 | 1998-12-22 | Ube Industries, Ltd. | Terpolymer polyamide, polyamide resin composition containing the same, and automotive parts obtaining from these |
JP3476037B2 (en) * | 1995-04-21 | 2003-12-10 | 矢崎総業株式会社 | Polyamide resin composition |
EP0685505B1 (en) * | 1994-05-31 | 2000-08-16 | Ube Industries, Ltd. | Terpolymer polyamide, polyamide resin composition containing the same, and automotive parts obtained from these |
JP3472628B2 (en) * | 1994-08-12 | 2003-12-02 | 三菱エンジニアリングプラスチックス株式会社 | Polyamide resin composition and biaxially stretched film |
US5981692A (en) * | 1997-05-15 | 1999-11-09 | Du Pont Canada Inc. | Semi-crystalline, semi-aromatic terpolymers with superior post-molding shrinkage and balance of mechanical performance |
DE60006968T2 (en) * | 1999-06-18 | 2004-10-21 | Solvay Advanced Polymers Llc | METHOD FOR REDUCING THE FORMATION OF MOLD DEPOSITS DURING THE MOLDING OF POLYAMIDES AND THEIR COMPOSITIONS |
DE10009756B4 (en) | 2000-03-01 | 2004-03-25 | Ems-Chemie Ag | Colorless, highly transparent polyamide blends with improved stress crack resistance |
WO2010014795A1 (en) | 2008-07-30 | 2010-02-04 | E. I. Du Pont De Nemours And Company | Thermoplastic articles including polyhydroxy polymers |
US20110028621A1 (en) | 2009-07-30 | 2011-02-03 | E. I. Du Pont De Nemours And Company | Heat aging resistant polyamide compositions including polyhydroxy polymers |
US9765208B2 (en) | 2011-08-29 | 2017-09-19 | E I Du Pont De Nemours And Company | Composite wheel for a vehicle |
US20130048136A1 (en) | 2011-08-29 | 2013-02-28 | E I Du Pont De Nemours And Company | Copolyamide compositions derived from triacylglycerides |
US20140066568A1 (en) | 2012-08-28 | 2014-03-06 | E I Du Pont De Nemours And Company | Polyamide resin blends |
WO2014078137A1 (en) | 2012-11-19 | 2014-05-22 | E. I. Du Pont De Nemours And Company | Thermoplastic melt-blended compositions |
EP3848410A1 (en) | 2020-01-09 | 2021-07-14 | L. Brüggemann GmbH & Co. KG | Polyamide materials with improved long-term properties |
EP4127062B1 (en) | 2020-03-25 | 2024-05-08 | Basf Se | Heat-aging resistant polyamide molding compositions |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384615A (en) * | 1966-05-16 | 1968-05-21 | Grace W R & Co | Stabilization of polyamides |
NL6811195A (en) * | 1967-08-11 | 1969-02-13 | ||
US3644280A (en) * | 1968-11-12 | 1972-02-22 | Firestone Tire & Rubber Co | Stabilization of polycaprolactam with a mixture of a di-substituted phenylene diamine and a tri(alkylphenyl) phosphite |
CA963594A (en) * | 1969-03-03 | 1975-02-25 | George R. Ure | Heat stabilized polyamides |
DE3423291A1 (en) * | 1984-06-23 | 1986-01-02 | Bayer Ag, 5090 Leverkusen | HYDROPHOBIC POLYAMIDE |
EP0299444B2 (en) * | 1987-07-17 | 2007-02-14 | BASF Aktiengesellschaft | Partially aromatic polyamides with a reduced triamine content |
CA2056976A1 (en) * | 1990-12-05 | 1992-06-06 | Sanehiro Yamamoto | Aromatic polyamide resin composition |
-
1991
- 1991-04-16 DE DE4112324A patent/DE4112324A1/en not_active Withdrawn
-
1992
- 1992-03-26 EP EP92105178A patent/EP0509282B1/en not_active Expired - Lifetime
- 1992-03-26 DE DE59206799T patent/DE59206799D1/en not_active Expired - Fee Related
- 1992-03-26 ES ES92105178T patent/ES2090392T3/en not_active Expired - Lifetime
- 1992-03-26 AT AT92105178T patent/ATE140712T1/en not_active IP Right Cessation
- 1992-04-15 CA CA002066106A patent/CA2066106A1/en not_active Abandoned
- 1992-04-15 JP JP4094697A patent/JPH05171037A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9963591B2 (en) | 2012-12-18 | 2018-05-08 | Ems-Patent Ag | Polyamide molding material and moldings manufactured from same |
CN108192094A (en) * | 2018-02-06 | 2018-06-22 | 湖南文理学院 | The preparation method of PA (6-co-6T) copolymer |
Also Published As
Publication number | Publication date |
---|---|
EP0509282A3 (en) | 1993-09-15 |
DE4112324A1 (en) | 1992-10-22 |
ATE140712T1 (en) | 1996-08-15 |
DE59206799D1 (en) | 1996-08-29 |
EP0509282A2 (en) | 1992-10-21 |
ES2090392T3 (en) | 1996-10-16 |
JPH05171037A (en) | 1993-07-09 |
EP0509282B1 (en) | 1996-07-24 |
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