CA2047780A1 - Cutting tool - Google Patents
Cutting toolInfo
- Publication number
- CA2047780A1 CA2047780A1 CA 2047780 CA2047780A CA2047780A1 CA 2047780 A1 CA2047780 A1 CA 2047780A1 CA 2047780 CA2047780 CA 2047780 CA 2047780 A CA2047780 A CA 2047780A CA 2047780 A1 CA2047780 A1 CA 2047780A1
- Authority
- CA
- Canada
- Prior art keywords
- cutter
- cutting tool
- segments
- grain
- abrasive grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
- B24D5/123—Cut-off wheels having different cutting segments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
Abstract
ABSTRACT
A cutting tool, for example, a saw or a drill bit that is used to cut rock, with a metallic carrier body (2) and cutter segments (1) that are secured to this at intervals, with a preferably metallic bond and diamond as the abrasive grain. The cutter segments (1) are heterogeneous in the direction of rotation. As an example, the quality of the abrasive grain and/or the concentration of the abrasive grain varies within the cutter segments (1) to the length of the cutter segment (1) and/or the size of the abrasive grain is different. Ahead of the actual cutter segment (1) there is a damping layer.
(Figure 6).
A cutting tool, for example, a saw or a drill bit that is used to cut rock, with a metallic carrier body (2) and cutter segments (1) that are secured to this at intervals, with a preferably metallic bond and diamond as the abrasive grain. The cutter segments (1) are heterogeneous in the direction of rotation. As an example, the quality of the abrasive grain and/or the concentration of the abrasive grain varies within the cutter segments (1) to the length of the cutter segment (1) and/or the size of the abrasive grain is different. Ahead of the actual cutter segment (1) there is a damping layer.
(Figure 6).
Description
2~77~
The present invention relates to a cutting tool, for example, a saw, in particular one used for cutting rock, which has a metallic carrier and an abrasive border that consists of cutter segments that are spaced apart from each other on this, with a bond that is preferably mstallic, and abrasive grain, ~or example, diamond, the grain concentration and/or the g~ain size and~or the type of grain and/or the hardness of the bond being different around the periphery of the abrasive border. The present invention can be used, in particular, for circular saws, although it is not confined to this particular area of use.
Cutter segments according to the present invention can also be used, for example, for borin~ bits.
The cutting tool according to the present invention satisfies the demands encountered when cutting rock in an optimal manner.
The present invention proceeds from the knowledge that in the case of a cutting tool of the type described in the introduction hereto each cutting segment incorporates periodically recurring work areas, namely a leading cutting zone and a trailing raker zone.
The cutter zone is used to loosen particles of stone (e.g~, minerals) *rom the rock body and to machine out and enlarge the volume of the resulting blade clearance (ker*). The abrasive grain is subjected to extremely high stress in the cutting zone.
Yi'~
If the forces that act on grain that is becoming dull become too great, the grain will break off, leaving a gap. Because of the missiny abrasive grain, the bond i5 subjected to a higher rate of erosion and is subjected to secondary wear until a new abrasive grain can protect the bond.
In contrast to the foregoing, the raker zone of the cutting segment is used to clear the rock particles from the kerf. When this is done, some of these particles are made even smaller. The abrasive grain is no longer subjected to such great stresses in this area. Here, it is mainly the bond that is eroded by the abrasive rock dust. If the bond is eroded to the point that the abrasive grain can no longer be held securely, then the abrasive grain will break off. Thus, within the raker zone, there is a primary binding wear and a secondary grain wear.
It is the task of the present invention to improve a cutting tool of the type described in the introduction hereto so that, in particular, the costly abrasive grain, generally diamonds, can be used to greater effect and so that the performance and/or the service life of the cutting tool is increased.
According to the present invention, this task has been solved in that individual cutter segments or all of the cutter segments are built up heterogeneously in the direction of rotation~
~7~
The cutter segments can be secured to the carrier body in the conventional manner, either by brazing or by welding.
It is advantageous that ths quality of the abrasive grain and/or the concentration of the abrasive grain within the cutter segments varies along the length of the cutting segment.
In one embodiment the size of the abrasive grain varies along the length of the cutter segments.
According to the present invention, provision can be made such that the size of the abrasive grain is greatest in the leading area of the cutter segment and then decreases along the length of the cutter segments.
The expressions "leading" and "trailing" relate to the direction of rotation of the cuttiny tool.
It is advantageous that the abrasive grain concentration is greatest in the leading area of the cutter segments and decrease~
along the length of the cutter segments.
In another embodiment, the bond is more flexible in the leading area of the cutter segments than in the trailing area.
~ 37~i In a further embodiment of the present invention, a plurality, preferably two, different cutter segment sections that are of homogeneous construction are secured to the carrier body directly behind each other, so that each forms a cutter segment.
There may be no space between the cutter segment sections, which is to say between the cutter zone and the raker zone, for otherwise the cutter segment section of the raker zone would once again be subjected to stress in the same way as a cutter segment section of the cutting zone.
The present invention will be described in greater detail below on the basis of the drawings appended hereto. These drawings show the following:
Figures 1 to 5: each show a side view of a section of a circular saw;
Figure 6: is a perspective drawing of a cutter segment according to the present invention and of a section of the carrier body.
As is shown in figure 1, the cutter segment 1 according to the present invention consists of a leading cutter zone and a trailing raker zone that follows this and which is immediately adjacent to the cutter zone, the cutter zone and the raker zone ~ 9 ~ 7 ~
differing from each other by different abrasive grain proportions and/or different bond characteristics.
The carrier body of the cutter tool bears the reference number 2.
The properties that are required in the cutting zone 1 can be achieved by the following features or by a combination of the following features:
a high concentration of abrasive grain ~diamond) coarse grain size good diamond qualities flexible and damping bonding (sandwich construction); this provides increased protection for the edges.
The properties that are required for the raker segments 4 can be achieved by the following features or by a combination thereof:
Diamond qualities of a lower hardness index the at least partial replacement of diamonds by other abrasive grain, for example, cubic borium nitride smaller grain sizes bonding that provides greater resistance to abrasion.
One manner in which the present invention can be realized is shown in figure 1. In this, a cutter segment section 3 is secured to the carrier body 2 immediately ahead of a raker segment section 4. The cutter segment section 3, which forms the 2q)L~ 7 ~ ~s~ ~
cutting zone, and the cutter segment section 4, that forms the raker zone, can each be of a completely different construction than the other cutter segment section. As has already been discussed, the function of protecting the bonding in the raker zone (cutter segment section 4) can also be ef~ected by mechanically resistant materials, or by mixtures of materials of these kinds with diamond.
The removal of the rock particles, which have been chipped off or removed, by the action of a cooling agent works better, the more open the structure of the bond in the raker zon~ (cutter segment section 4). An open structure of this kind in the raker zone (cutter segment section 4) can be achieved in the case of metal bonded systems, by soft additives, for example, by the addition of graphite. It is also possible to use a completely different bonding system for the raker zone (cutter segment section 4) than for the cutter zone (cutter segment section 3), for example, a ceramic bond or a bond of plastic.
In the embodiment shown in figure 2 the transition from the cutter zone 3 to the raker zonP 4 is not abrupt, but i~
continuous. The structure of the cutter segment 1 changes continuously from front to rear, so that each type of stress can be managed in the best way possible. This is effe~ted, for example, by a continuous change in the concenkration of the diamond grain and/or by a continuous change in the bond 2~7~
characteristics and/or hy a continuous change of the mixing proportions of diamond grain and mechanically resistant materials.
The characteristics of the bond in the rear section of cutter segment section 1, which is to say in the raker zone, can be changed ~y subsequent hardening and tempering or by infiltration.
As can be seen in figure 3, the continuous change of the stresses on the cutter segments can also be managed by incremental alteration of the segment construction. A plurality of segment sections 5, 6, 7, 8, 9, 10, which are of different structure, can be secured to the carrier body 2 one behind the other.
The changes in the structure of the segment sections 5 to 10 from the first segment section 5, the structure of which corresponds completely to that of the cutter zone, up to the last segment section 10, which is of a structure that corresponds completel~
to that of a raker zone, can be achieved by the measures described above.
Modification of the way in which the cutter tool operates can be achieved in that a plurality of cutter segment sections 3, 4 are incorporated in one cutter segment 1, when one cutter segment section 3, which forms a cutter zone, and a cutter segment section 4, which forms a raker zone, alternate with each other ~3~7~
and are combined to form a double unit 11. A plurality of these double units 11 are secured one behind the other to the carri~r body 2, and form the cutter segment 1. In contrast to the embodiments described above, in this embodiment the wear on the particular leading and the particular trailing halves of the double unit 11 is not equal. As is shown in figure 5, a peak and valley profile is formed by the working process. The valleys 13 that are formed provide for better removal of the rock that has been chipped off and the cooling agent.
Achievement of the different wear properties in the cutter zone and in the raker zone of a double segment 11 can be effected by the following features or a combination of the following features:
different bonding different abrasive grain (diamond) concentration different abrasive grain quality different secondary treatment of the bond.
In the example that is shown in figure 6, the abrasive se~ment 1, like that in the embodiment shown in figure 1, forms a cutter segment section 3, which forms the cutter zone, and a cutter segment section 4, which forms the raker zone. However, ahead of the cutter zone 3 there is a thin damping layer 12 that is, for example, of a non-ferrous metal.
2~a~7~
The cutter segment section 3 also has damping properties, this being achieved by a relatively soft bond and, possibly by means of a similarly damping layer of brazing 14.
Once again, the cutter segment section 4 of the raker zone has a lower concentration of abrasive grain, with the diamond grain being replaced in part by mechanically resistant substances. The bond here is harder than in the cutter zone. A solid lubricant body 15 is adjacent to the raker zone. As is normal, the carrier body 2 incorporates cooling slits 16 and has ridges 17 in the area of these cooling slits 16; these ridges improve the removal of rock chips.
The carrier body 2 can also be surface treated, at least in its peripheral area.
The present invention relates to a cutting tool, for example, a saw, in particular one used for cutting rock, which has a metallic carrier and an abrasive border that consists of cutter segments that are spaced apart from each other on this, with a bond that is preferably mstallic, and abrasive grain, ~or example, diamond, the grain concentration and/or the g~ain size and~or the type of grain and/or the hardness of the bond being different around the periphery of the abrasive border. The present invention can be used, in particular, for circular saws, although it is not confined to this particular area of use.
Cutter segments according to the present invention can also be used, for example, for borin~ bits.
The cutting tool according to the present invention satisfies the demands encountered when cutting rock in an optimal manner.
The present invention proceeds from the knowledge that in the case of a cutting tool of the type described in the introduction hereto each cutting segment incorporates periodically recurring work areas, namely a leading cutting zone and a trailing raker zone.
The cutter zone is used to loosen particles of stone (e.g~, minerals) *rom the rock body and to machine out and enlarge the volume of the resulting blade clearance (ker*). The abrasive grain is subjected to extremely high stress in the cutting zone.
Yi'~
If the forces that act on grain that is becoming dull become too great, the grain will break off, leaving a gap. Because of the missiny abrasive grain, the bond i5 subjected to a higher rate of erosion and is subjected to secondary wear until a new abrasive grain can protect the bond.
In contrast to the foregoing, the raker zone of the cutting segment is used to clear the rock particles from the kerf. When this is done, some of these particles are made even smaller. The abrasive grain is no longer subjected to such great stresses in this area. Here, it is mainly the bond that is eroded by the abrasive rock dust. If the bond is eroded to the point that the abrasive grain can no longer be held securely, then the abrasive grain will break off. Thus, within the raker zone, there is a primary binding wear and a secondary grain wear.
It is the task of the present invention to improve a cutting tool of the type described in the introduction hereto so that, in particular, the costly abrasive grain, generally diamonds, can be used to greater effect and so that the performance and/or the service life of the cutting tool is increased.
According to the present invention, this task has been solved in that individual cutter segments or all of the cutter segments are built up heterogeneously in the direction of rotation~
~7~
The cutter segments can be secured to the carrier body in the conventional manner, either by brazing or by welding.
It is advantageous that ths quality of the abrasive grain and/or the concentration of the abrasive grain within the cutter segments varies along the length of the cutting segment.
In one embodiment the size of the abrasive grain varies along the length of the cutter segments.
According to the present invention, provision can be made such that the size of the abrasive grain is greatest in the leading area of the cutter segment and then decreases along the length of the cutter segments.
The expressions "leading" and "trailing" relate to the direction of rotation of the cuttiny tool.
It is advantageous that the abrasive grain concentration is greatest in the leading area of the cutter segments and decrease~
along the length of the cutter segments.
In another embodiment, the bond is more flexible in the leading area of the cutter segments than in the trailing area.
~ 37~i In a further embodiment of the present invention, a plurality, preferably two, different cutter segment sections that are of homogeneous construction are secured to the carrier body directly behind each other, so that each forms a cutter segment.
There may be no space between the cutter segment sections, which is to say between the cutter zone and the raker zone, for otherwise the cutter segment section of the raker zone would once again be subjected to stress in the same way as a cutter segment section of the cutting zone.
The present invention will be described in greater detail below on the basis of the drawings appended hereto. These drawings show the following:
Figures 1 to 5: each show a side view of a section of a circular saw;
Figure 6: is a perspective drawing of a cutter segment according to the present invention and of a section of the carrier body.
As is shown in figure 1, the cutter segment 1 according to the present invention consists of a leading cutter zone and a trailing raker zone that follows this and which is immediately adjacent to the cutter zone, the cutter zone and the raker zone ~ 9 ~ 7 ~
differing from each other by different abrasive grain proportions and/or different bond characteristics.
The carrier body of the cutter tool bears the reference number 2.
The properties that are required in the cutting zone 1 can be achieved by the following features or by a combination of the following features:
a high concentration of abrasive grain ~diamond) coarse grain size good diamond qualities flexible and damping bonding (sandwich construction); this provides increased protection for the edges.
The properties that are required for the raker segments 4 can be achieved by the following features or by a combination thereof:
Diamond qualities of a lower hardness index the at least partial replacement of diamonds by other abrasive grain, for example, cubic borium nitride smaller grain sizes bonding that provides greater resistance to abrasion.
One manner in which the present invention can be realized is shown in figure 1. In this, a cutter segment section 3 is secured to the carrier body 2 immediately ahead of a raker segment section 4. The cutter segment section 3, which forms the 2q)L~ 7 ~ ~s~ ~
cutting zone, and the cutter segment section 4, that forms the raker zone, can each be of a completely different construction than the other cutter segment section. As has already been discussed, the function of protecting the bonding in the raker zone (cutter segment section 4) can also be ef~ected by mechanically resistant materials, or by mixtures of materials of these kinds with diamond.
The removal of the rock particles, which have been chipped off or removed, by the action of a cooling agent works better, the more open the structure of the bond in the raker zon~ (cutter segment section 4). An open structure of this kind in the raker zone (cutter segment section 4) can be achieved in the case of metal bonded systems, by soft additives, for example, by the addition of graphite. It is also possible to use a completely different bonding system for the raker zone (cutter segment section 4) than for the cutter zone (cutter segment section 3), for example, a ceramic bond or a bond of plastic.
In the embodiment shown in figure 2 the transition from the cutter zone 3 to the raker zonP 4 is not abrupt, but i~
continuous. The structure of the cutter segment 1 changes continuously from front to rear, so that each type of stress can be managed in the best way possible. This is effe~ted, for example, by a continuous change in the concenkration of the diamond grain and/or by a continuous change in the bond 2~7~
characteristics and/or hy a continuous change of the mixing proportions of diamond grain and mechanically resistant materials.
The characteristics of the bond in the rear section of cutter segment section 1, which is to say in the raker zone, can be changed ~y subsequent hardening and tempering or by infiltration.
As can be seen in figure 3, the continuous change of the stresses on the cutter segments can also be managed by incremental alteration of the segment construction. A plurality of segment sections 5, 6, 7, 8, 9, 10, which are of different structure, can be secured to the carrier body 2 one behind the other.
The changes in the structure of the segment sections 5 to 10 from the first segment section 5, the structure of which corresponds completely to that of the cutter zone, up to the last segment section 10, which is of a structure that corresponds completel~
to that of a raker zone, can be achieved by the measures described above.
Modification of the way in which the cutter tool operates can be achieved in that a plurality of cutter segment sections 3, 4 are incorporated in one cutter segment 1, when one cutter segment section 3, which forms a cutter zone, and a cutter segment section 4, which forms a raker zone, alternate with each other ~3~7~
and are combined to form a double unit 11. A plurality of these double units 11 are secured one behind the other to the carri~r body 2, and form the cutter segment 1. In contrast to the embodiments described above, in this embodiment the wear on the particular leading and the particular trailing halves of the double unit 11 is not equal. As is shown in figure 5, a peak and valley profile is formed by the working process. The valleys 13 that are formed provide for better removal of the rock that has been chipped off and the cooling agent.
Achievement of the different wear properties in the cutter zone and in the raker zone of a double segment 11 can be effected by the following features or a combination of the following features:
different bonding different abrasive grain (diamond) concentration different abrasive grain quality different secondary treatment of the bond.
In the example that is shown in figure 6, the abrasive se~ment 1, like that in the embodiment shown in figure 1, forms a cutter segment section 3, which forms the cutter zone, and a cutter segment section 4, which forms the raker zone. However, ahead of the cutter zone 3 there is a thin damping layer 12 that is, for example, of a non-ferrous metal.
2~a~7~
The cutter segment section 3 also has damping properties, this being achieved by a relatively soft bond and, possibly by means of a similarly damping layer of brazing 14.
Once again, the cutter segment section 4 of the raker zone has a lower concentration of abrasive grain, with the diamond grain being replaced in part by mechanically resistant substances. The bond here is harder than in the cutter zone. A solid lubricant body 15 is adjacent to the raker zone. As is normal, the carrier body 2 incorporates cooling slits 16 and has ridges 17 in the area of these cooling slits 16; these ridges improve the removal of rock chips.
The carrier body 2 can also be surface treated, at least in its peripheral area.
Claims (11)
1. A cutting tool, for example, a saw, in particular one used for cutting rock, which has a metallic carrier and an abrasive border that consists of cutter segments that are spaced apart from each other on this, with a bond that is preferably metallic and abrasive grain, for example, diamond, the grain concentration and/or the grain size and/or the type of grain and/or the hardness of the bond being different around the periphery of the abrasive border, characterized in that the individual cutter segments (1) are heterogeneous in the direction of rotation.
2. A cutting tool as defined in claim 1, characterized in that the quality of the abrasive grain and/or the concentration of the abrasive grain within the cutter segments (1) varies along the length of the cutter segments (1).
3. A cutting tool as defined in claim 1, characterized in that the size of the abrasive grain varies along the length of the cutter segments (1).
4. A cutting tool as defined in claim 3, characterized in that the size of the abrasive grain in the leading area of the cutter segment (1) as viewed in the direction of rotation is greatest, and decreases along the length of the cutter segments (1).
5. A cutting tool as defined in claim 2, characterized in that the concentration of the abrasive grain is greatest in the leading area of the cutting segments (1) as viewed in the direction of rotation and decreases along the length of the cutter segments (1).
6. A cutting tool as defined in claim 1, characterized in that the bond is more flexible in the leading area of the cutter segments (1) as viewed in the direction of rotation than it is in the trailing area.
7. A cutting tool as defined in at least one of the claims 1 to 6, characterized in that a plurality, preferably two, different cutter segment sections that are of homogeneous structure are secured one behind the other to the carrier body (2) so that each forms a cutter segment (1).
8. A cutting tool as defined in at least one of the claims 1 to 7, characterized in that the bond characteristic changes along the length of a cutter segment (1).
9. A cutting tool as defined in at least one of the claims l to 8, characterized in that a shock damping layer (12) that contains no cutting grain is located at the leading edge of the cutter segments (1) as viewed in the direction of rotation.
10. A cutting tool as defined in at least one of the claims 1 to 9, characterized in that a solid lubricant body (15) is arranged on the rear end of the cutting segments (1) as viewed in the direction of rotation.
11. A cutting tool as defined in at least one of the claims 1 to 10, characterized in that the cutter segments (1) incorporate areas of diamond grain and mechanically resistant substances of materials other than diamond, e.g., carbides.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA1559/90 | 1990-07-25 | ||
| AT155990 | 1990-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2047780A1 true CA2047780A1 (en) | 1992-01-26 |
Family
ID=3516019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2047780 Abandoned CA2047780A1 (en) | 1990-07-25 | 1991-07-24 | Cutting tool |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0540566B1 (en) |
| AU (1) | AU8107691A (en) |
| CA (1) | CA2047780A1 (en) |
| DE (1) | DE59101000D1 (en) |
| WO (1) | WO1992001542A2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518443A (en) * | 1994-05-13 | 1996-05-21 | Norton Company | Superabrasive tool |
| FR2722125A1 (en) * | 1994-07-06 | 1996-01-12 | Gantois Liliane Micheline | Diamond cable for concrete, rock or stone sawing |
| TW316868B (en) * | 1994-12-28 | 1997-10-01 | Norton Co | |
| CA2243694C (en) | 1996-03-15 | 2003-04-29 | Norton Company | Metal single layer abrasive cutting tool having a contoured cutting surface |
| US5868125A (en) * | 1996-11-21 | 1999-02-09 | Norton Company | Crenelated abrasive tool |
| DE10005064A1 (en) | 2000-02-04 | 2001-08-23 | Siegfried Goelz Gmbh & Co | Sintered metal bonded segments with abrasive action are made up of segment modules with from front to back in direction of movement alternating concentrations of hard material particles |
| KR20040102965A (en) * | 2003-05-30 | 2004-12-08 | 이화다이아몬드공업 주식회사 | wave type saw blade |
| ITPD20070097A1 (en) * | 2007-03-16 | 2008-09-17 | Adi S P A | CUTTING TOOL, PARTICULARLY FOR STONE MATERIALS AND RELATED |
| ES2951010T3 (en) | 2016-02-01 | 2023-10-17 | Schierholz Joerg Michael | Implantable health products, procedure for their preparation and use thereof |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1931363A (en) * | 1932-12-31 | 1933-10-17 | Norton Co | Grinding wheel |
| US2369068A (en) * | 1943-02-25 | 1945-02-06 | Hamilton Watch Co | Band lap |
| US3496973A (en) * | 1967-04-12 | 1970-02-24 | Robert L Ballard | Cutting tool edge construction |
| FR1568331A (en) * | 1968-03-29 | 1969-05-23 | ||
| DE1917957A1 (en) * | 1969-04-09 | 1970-10-29 | Pahlitzsch Dr Ing Gotthold | Circular saw blade with constant ovality |
| DE2438601A1 (en) * | 1974-08-10 | 1976-02-26 | Winter & Sohn Ernst | Rotating cut-off tools such as slitting wheels - where hard outer layer covers diamond or boron nitride grains in binder matrix |
| SU569440A1 (en) * | 1976-04-12 | 1977-08-25 | Предприятие П/Я А-3395 | Honing head |
| SE8004172L (en) * | 1979-06-26 | 1980-12-27 | Lippert H Gmbh | GRINDING ORGANIZATION FOR METAL WORKING |
| JPS5733969A (en) * | 1980-08-01 | 1982-02-24 | Niro Inoue | Manufacturing method of diamond blade for cutting building stone and the like |
| JPS57184674A (en) * | 1981-05-06 | 1982-11-13 | Niro Inoue | Stone cutting diamond blade |
| SU1189652A1 (en) * | 1983-02-07 | 1985-11-07 | Malyshev Aleksandr A | Method of cooling cutting zone |
| JPS6374567A (en) * | 1986-09-18 | 1988-04-05 | Micron Seimitsu Kk | Cbn grindstone |
| US4883500A (en) * | 1988-10-25 | 1989-11-28 | General Electric Company | Sawblade segments utilizing polycrystalline diamond grit |
-
1991
- 1991-07-23 WO PCT/AT1991/000088 patent/WO1992001542A2/en active IP Right Grant
- 1991-07-23 EP EP19910912940 patent/EP0540566B1/en not_active Expired - Lifetime
- 1991-07-23 DE DE91912940T patent/DE59101000D1/en not_active Expired - Fee Related
- 1991-07-23 AU AU81076/91A patent/AU8107691A/en not_active Abandoned
- 1991-07-24 CA CA 2047780 patent/CA2047780A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO1992001542A3 (en) | 1992-03-19 |
| WO1992001542A2 (en) | 1992-02-06 |
| AU8107691A (en) | 1992-02-18 |
| DE59101000D1 (en) | 1994-03-17 |
| EP0540566A1 (en) | 1993-05-12 |
| EP0540566B1 (en) | 1994-02-02 |
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