CA2015757A1 - Instrument extracteur de puces semi-conductrices - Google Patents
Instrument extracteur de puces semi-conductricesInfo
- Publication number
- CA2015757A1 CA2015757A1 CA2015757A CA2015757A CA2015757A1 CA 2015757 A1 CA2015757 A1 CA 2015757A1 CA 2015757 A CA2015757 A CA 2015757A CA 2015757 A CA2015757 A CA 2015757A CA 2015757 A1 CA2015757 A1 CA 2015757A1
- Authority
- CA
- Canada
- Prior art keywords
- chip
- tool
- exteriorly
- removal
- accessible surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
- Y10T29/53283—Means comprising hand-manipulatable implement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US365,394 | 1989-06-13 | ||
US07/365,394 US4979287A (en) | 1989-06-13 | 1989-06-13 | Tool for semiconductor chip removal |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2015757A1 true CA2015757A1 (fr) | 1990-12-13 |
CA2015757C CA2015757C (fr) | 1993-12-14 |
Family
ID=23438733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002015757A Expired - Fee Related CA2015757C (fr) | 1989-06-13 | 1990-04-30 | Instrument extracteur de puces semi-conductrices |
Country Status (2)
Country | Link |
---|---|
US (1) | US4979287A (fr) |
CA (1) | CA2015757C (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420520A (en) * | 1993-06-11 | 1995-05-30 | International Business Machines Corporation | Method and apparatus for testing of integrated circuit chips |
US5502887A (en) * | 1993-07-08 | 1996-04-02 | Dell Usa, L.P. | Chip extraction tool |
US6360940B1 (en) | 2000-11-08 | 2002-03-26 | International Business Machines Corporation | Method and apparatus for removing known good die |
US6811072B2 (en) | 2001-01-09 | 2004-11-02 | International Business Machines Corporation | Known good die removal method and apparatus |
US20030196283A1 (en) * | 2002-04-23 | 2003-10-23 | Eyal Eliav | Powered toothbrush |
US6779256B2 (en) * | 2002-06-14 | 2004-08-24 | General Electric Company | Interposer extraction tool |
US6915563B2 (en) * | 2003-06-27 | 2005-07-12 | International Business Machines Corporation | Apparatus for removing attached die |
US6942137B2 (en) * | 2003-10-16 | 2005-09-13 | International Business Machines Corporation | Die removal method and apparatus |
US7350290B2 (en) * | 2004-11-12 | 2008-04-01 | Advanced Interconnections Corporation | Compression device for integrated circuit packages |
US20080079129A1 (en) * | 2006-09-29 | 2008-04-03 | Shankar Ganapathysubramanian | Shape memory based mechanical enabling mechanism |
US20080206960A1 (en) * | 2007-02-27 | 2008-08-28 | International Business Machines Corporation | Reworkable chip stack |
CN102513962A (zh) * | 2011-12-29 | 2012-06-27 | 中国科学院长春光学精密机械与物理研究所 | 一种芯片起拔器 |
US11065738B2 (en) * | 2017-05-09 | 2021-07-20 | Nonconductive Tool Company, LLC | Electrical device aligning tool and method of using same |
US11752608B2 (en) * | 2020-07-20 | 2023-09-12 | Dell Products L.P. | Systems and methods for insertion and removal of information handling resource module |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4141138A (en) * | 1977-05-31 | 1979-02-27 | King Radio Corporation | Tool for inserting and extracting integrated circuits |
US4174566A (en) * | 1978-05-30 | 1979-11-20 | Burroughs Corporation | Insertion tool for integrated circuit packages |
US4392301A (en) * | 1981-06-01 | 1983-07-12 | Western Electric Company, Inc. | Device for inserting and removing circuit modules with multiple leads |
US4461073A (en) * | 1982-10-27 | 1984-07-24 | At&T Technologies, Inc. | Device for inserting and extracting circuit modules with dual-in-line leads |
US4744140A (en) * | 1982-11-26 | 1988-05-17 | Amp Incorporated | Alignment and insertion tool for connectors |
US4521959A (en) * | 1983-07-05 | 1985-06-11 | Burroughs Corporation | Device for the controlled extraction of electronic circuit components |
US4583288A (en) * | 1983-07-12 | 1986-04-22 | Westinghouse Electric Corp. | Apparatus for the acquistion and insertion of dual in-line package components |
US4597174A (en) * | 1983-10-11 | 1986-07-01 | United Technologies Corporation | Integrated circuit chip insertion and removal tool |
US4507861A (en) * | 1983-12-12 | 1985-04-02 | Burroughs Corporation | Insertion device for an electronic circuit package assembly |
US4615110A (en) * | 1985-02-15 | 1986-10-07 | E. I. Du Pont De Nemours And Company | Hand tool for inserting and withdrawing a pin grid into and from a socket |
US4660281A (en) * | 1985-06-17 | 1987-04-28 | Omand Richard C | Component extracting tool |
US4583287A (en) * | 1985-07-12 | 1986-04-22 | Augat Inc. | Combination insertion-extraction tool for integrated circuits |
US4679319A (en) * | 1986-07-14 | 1987-07-14 | Amp Incorporated | Tool and method for removing connector housings from terminals mounted on a substrate |
US4723361A (en) * | 1986-08-18 | 1988-02-09 | At&T Teletype Corporation | IC insertion/extraction tool |
US4800647A (en) * | 1987-09-14 | 1989-01-31 | General Electric Company | Electric module insertion tool |
US4827607A (en) * | 1988-07-08 | 1989-05-09 | Amp Incorporated | Insertion tool |
-
1989
- 1989-06-13 US US07/365,394 patent/US4979287A/en not_active Expired - Fee Related
-
1990
- 1990-04-30 CA CA002015757A patent/CA2015757C/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2015757C (fr) | 1993-12-14 |
US4979287A (en) | 1990-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2015757A1 (fr) | Instrument extracteur de puces semi-conductrices | |
GB2232829B (en) | Semiconductor integrated circuit | |
AU2209492A (en) | Process for flip chip connecting semiconductor chip | |
EP0178227A3 (en) | Integrated circuit semiconductor device formed on a wafer | |
KR930002039B1 (en) | Semiconductor circuit | |
EP0244699A3 (en) | Substrate for a printed circuit board | |
EP0420582A3 (en) | Drive circuit for a semiconductor device | |
EP0411639A3 (en) | Electronic circuit substrate | |
EP0412561A3 (en) | Semiconductor integrated circuit device | |
EP0303193A3 (en) | Semiconductor integrated circuit device | |
EP0393682A3 (en) | Semiconductor integrated circuit device | |
EP0264892A3 (en) | Cooling objects, for example semiconductor devices | |
EP0246657A3 (en) | Integrated circuit chips cooling module having coolant leakage prevention device | |
EP0344764A3 (en) | Process for the wet-chemical surface treatment of semiconductor chips | |
HK176295A (en) | Semiconductor integrated circuit device | |
EP0257657A3 (en) | Substrate for high-frequency circuit and process for making the same | |
EP0405952A3 (en) | Semiconductor laser driving circuit | |
GB2239560B (en) | Compound semiconductor integrated circuit device | |
GB8721779D0 (en) | Integrated circuit chip carrier | |
GB9006943D0 (en) | Semiconductor integrated circuit | |
GB8620904D0 (en) | Forming circuits on base board | |
EP0200230A3 (en) | Logic integrated circuit device formed on compound semiconductor substrate | |
AU5396990A (en) | Locking handle for printed circuit board assemblies | |
EP0146330A3 (fr) | Dispositif à circuit intégré comprenant un corps de contact structuré | |
GB2208452B (en) | A semiconductor integrated circuit device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |