CA1278910C - Mounting a component to a substrate - Google Patents
Mounting a component to a substrateInfo
- Publication number
- CA1278910C CA1278910C CA000520800A CA520800A CA1278910C CA 1278910 C CA1278910 C CA 1278910C CA 000520800 A CA000520800 A CA 000520800A CA 520800 A CA520800 A CA 520800A CA 1278910 C CA1278910 C CA 1278910C
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- support
- component
- mounting
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Mechanical Light Control Or Optical Switches (AREA)
- Optical Couplings Of Light Guides (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Spectrometry And Color Measurement (AREA)
Abstract
MOUNTING A COMPONENT TO A SUBSTRATE
ABSTRACT
A method of mounting an optical component such as a laser chip (4) on a substrate (1) is described. The method comprises mounting the chip (4) on a bridge (9);
and positioning the bridge (9) on the substrate (1).
Locator means in the form of depending legs (10) are provided on the bridge (9) so that the bridge is located in the vertical direction relatively to the substrate (1) and hence the laser chip (4) is also located. Finally, the chip (4) is secured to the substrate (1) by, for example, soldering.
ABSTRACT
A method of mounting an optical component such as a laser chip (4) on a substrate (1) is described. The method comprises mounting the chip (4) on a bridge (9);
and positioning the bridge (9) on the substrate (1).
Locator means in the form of depending legs (10) are provided on the bridge (9) so that the bridge is located in the vertical direction relatively to the substrate (1) and hence the laser chip (4) is also located. Finally, the chip (4) is secured to the substrate (1) by, for example, soldering.
Description
~78~
MOUNTING A COMPONENT ~O A SUBSTRATE
The invention relates to a rnethod of mountinq a componer.t to a substrate, for example the mounting of ar.
optical component such as a laser chip to a substrate.
~ecent developments in optical technology have leac~
to the construction of laser chips and photosensor chips which have relatively small dimensions of the order of 200 ~,icrons. It is now proposed that these components should be mounted on substrates and accurately aligned ]0 with optical waveguides or other optical componerlts. One of the difficulties with this is that it is difficult to hold the component accurately using a micromanipulator or the like during mounting o~ the component on a substrate.
h paper by M. ~obayashi et al entitled "Guided-have op~ical gate matrix switch" in the Proc. 11th Europear.
Conference on Optical Communication (pages 73-76) describes the mounting of a laser diode to a silicon heat sink. The heat sink is a slab o~ silicon which is apparently laid on the substrate. The laser diode cannot, however, be accurately positioned on the substrate.
I~ accordance with one aspect of the present invention, a method of mounting a component or a substrate cornprises mountin~ the component on a sup?ort;
~ositioning the support Gn the substrate, wherein at least one of the support and the substrate includes loca~or means such that the support is located ir. at least one direction relatively to the substrate; and securing the component to the substrate.
~he location of the support in at least one direction relatively to the substrate automatically locates the component also in that direction. Thus, the locator rneans can be positioned remotely of the component and will not interfere with the mounting of the component.
~;~'78910 In accordance with a second aspect of the present invcntion we provide in combination a component secured to a substrate, the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
In one simple arrangernent, the locatGr means comprises two or more legs positioned on either the support or the substrate, the support being positioned on the legs spaced from the substrate by a predetermined amount determined by the length of the legs.
Preferably, however, complementary locating portions zre formed in the support and the substrate. This has 1s the advantage that the support is located in two directions relative to the substrate.
For exarnple, the ~ocating portions may comprise complernentary ridges and recesses. h1here the substrate comprises a single crystal such as silicon it is particularly convenient if the complementary ridges and recesses have a V-shaped cross-section since these can be formed using known masking and aniso-tropic etching techni~ues .
The component ~ay be directly bonded to the substrate, for example by solderin~, or indirectly by bonding the support to the substrate. Preferably, both the support and component are bonded to the substrate.
Some examples of methods and combinations in accordance with the invention will now be described with reference to the accornpanying drawings, in which:-Figure 1 is a side elevation of a firs-t example Wit}
some parts omitted for clarit~
Figure 2 is a plan of the first example with some parts omitted for clarity; and, 1;~7~
Figures 3, 4, and 5 are a side elevation, partial end elevation, and plan respectively of a second example.
Figures 1 and 2 illustrate a lithi~m niobate substrate l. Titanium is diffused into a narrow rectilinear section 2 of the top surface of the substrate l to define an optical waveguide by modifying the refractive index of the substrate. A generally U-shaped recess or slot 3 is then cut in the surface of the substrate l orthogonal to the waveguide 2 by using a suitable technique such as ion beam milling or reactive ion etch. As can be seen ir. Figure l, the slot 3 has a rectangular cross-section. It will be seen that the formation of the slot 3 divides the optical waveguide 2 into two subsidiary optical waveguides 5, 6 which axe automatically in alignment with one another. A
conventional laser chip 4 is then mounted in the slot 3 (by a method to be descri~ed below) with opposite facets ; 7, 8 in alignment with the subsidiary waveguides 6, 5 respectively.
20The depth (D) of the slot 3 is chosen so that the ; light emitting stripe in the laser chip 4 is matched to the optical wzveguides S, 6. The length (L) of the slot 3 is chosen to allow the maximum possi~le light transmission between the laser chip 4 and the substrate 1 ; 25 and it can be tailored to suit a given chip length. Th~
third dimension (W) is not critical and is chosen to allow adjustment of the laser chip 4 along the slot 3 to enable the optimum position of the laser chip relatively to the optical waveguides 5, ~ to ~e found and to permit a number of chips to be mounted side ~y side.
Typically, L is about 200 ~m and D < 15 ~m.
To mount the laser chip 4, the laser chip is initially soldered to the undersurface of a metal bridge 9. The bridge 9 has a pair of integral depending legs lG
which rest on an upper surface of the substrate l with 1 ~78~
the laser chip 4 suspended inlthe slot 3. This locates the laser chip 4 in the vertical direction by controlling the extent to which the laser chip 4 is received in the slot 3. Furthermore, it is easier for a micromanipulator to hold the bridge 9 than the laser chip itself. Optimum aligr,ment of the laser chip 4 with the optical waveguides 5, 6 is achieved using an optical method ~y monitoring the power transmitted alony the waveguiàes while the activated laser chip is moved along the slot 3. Once ~he optirnum position has been found, corresponding to ma~imum power coupling with the waveguides-5, 6, the laser chip ~
and the legs 10 of the bridge 9 are soldered to tl-e substrate 1.
There are a nunlber of advantages in providing two optical waveguides 5,6. In seneral, the spectral performaJ)ce of conventional laser chips needs to be improved and this can be achieved by monitoring the laser output from the facet 8 while the main laser output is generated from the facet 7. In addition, this access to both facets could be used in a con~ineù
transmitter/receiver or simply to monitor the outp~t po~er.
A transverse lower connection 11 to the laser chip 4 extends alons the base of the slot 3 (Figure 2) ~ne of the advantages of providing an elonaate slot 3 is that a nur~er of laser chips could be mounted side by side. This is shown in Figure 2 where additional laser chips 12, 13 are provided in alignment with optical waveyuides 14, 15; 16, 17 respectively, each pair having a similar form to the optical waveguides 5, 6. In Pigure 2, bridges corresponding to the bridge 9 and supporting the laser chips 12, 13 have been omitted The advantage of lithium niobate is that it can be used to form electro-optic components which would be incorporated into areas of the substrate adjacent ~he slot 3 with suitable connections being made with the optical waveguides.
Figures 3 to 5 illustrate a second example in which a silicon substrate 18 is used. One of the advantages of silicon is that it can be very accurately etched using its anisotropic etching properties to produce grooves with depths accurate to 1 micron and with accurately determined included angles. In the example shown in Fiqures 3 to 5, initially a flat bottomed channel 19 is lQ formed having a generally ~-shzped cross-section with sloping sides by etching the 111 faces of the crystal.
Subsequently a pair of parallel V-shaped grooves 20 are etched parallel with the channel 19 and on either side of the channel 19. A V-shaped groove 21 is etched at right angles to the channel 19 and grooves 20, having a depth approximately equal to half the diameter of a monomode optical fibre 22 which is subsequently to be mounted in the groove.
A photodiode 23 is bonded (eg. soldered) to the sloping surface of the channel 19 facing the optical ~ibre 22.
A second silicon substrate or chip 24 is provided which corresponds to the bridge 9 in the previous example. The chip 24 has two pairs of depending, V-shaped ridges 25 and a central depending ridge 26. The included angle of each ridge 25 is substantially the same as the included angle of the V-shaped grooves 20 ir. the substrate 1&.
A laser diode 27 is bonaed to the ridge 26.
The substrate 24 is then mounted on the substrate 18 with each pair of ridges 25 being received in the corresponding groove 20 and straddling the groove 21.
The depth of the grooves 20 and the height of the ridge 26 are chosen such that when the substrate 24 is mounted on the substrate 18, the laser diode 27 is accuratel~
~L~7~391(3 located and aligned with an optical fibre 22 in the groove 21 (Figure 4).
The provision of the grooves 20 and complementary ridges 25 assists in accurately positioning the laser 5 diode 27 in two directions and this should be contrasted with the previous example in which the bridge 9 permits a certain degree of movement transverse to the slot 3.
A feature of this example is that the position of the laser diode 2, with respect to the optical fibre 22 can be adjusted in the direction of the grooves 20 to obtain maximum power couplins into the optical fibre. In addition, the separation of the end cf the optical fibre 22 from the laser diode 27 can also be altered by sliding the fibre within the groove 21. Once the correct relative positions have beer. found, the upper and lower silicon substrates 18, 24 are bonded together in such a way that the laser diode attachment to the upper silicon chip 24 is unaffected. In addition, the optical fibre 22 is bonded into the groove 21. Bonding may be achieved 20 using soldering or any other known technique.
The photodiode 23 may be used for a variety of purposes similar to those outlined in the previous example for monitoring laser emission from the facet of the laser diode 27 opposite to the optical fibre 22.
In a modification of this example (not shown) the upper substrate 29 m2y include a further depending ridge which clamps the optical fibre 22 into the groove 21.
MOUNTING A COMPONENT ~O A SUBSTRATE
The invention relates to a rnethod of mountinq a componer.t to a substrate, for example the mounting of ar.
optical component such as a laser chip to a substrate.
~ecent developments in optical technology have leac~
to the construction of laser chips and photosensor chips which have relatively small dimensions of the order of 200 ~,icrons. It is now proposed that these components should be mounted on substrates and accurately aligned ]0 with optical waveguides or other optical componerlts. One of the difficulties with this is that it is difficult to hold the component accurately using a micromanipulator or the like during mounting o~ the component on a substrate.
h paper by M. ~obayashi et al entitled "Guided-have op~ical gate matrix switch" in the Proc. 11th Europear.
Conference on Optical Communication (pages 73-76) describes the mounting of a laser diode to a silicon heat sink. The heat sink is a slab o~ silicon which is apparently laid on the substrate. The laser diode cannot, however, be accurately positioned on the substrate.
I~ accordance with one aspect of the present invention, a method of mounting a component or a substrate cornprises mountin~ the component on a sup?ort;
~ositioning the support Gn the substrate, wherein at least one of the support and the substrate includes loca~or means such that the support is located ir. at least one direction relatively to the substrate; and securing the component to the substrate.
~he location of the support in at least one direction relatively to the substrate automatically locates the component also in that direction. Thus, the locator rneans can be positioned remotely of the component and will not interfere with the mounting of the component.
~;~'78910 In accordance with a second aspect of the present invcntion we provide in combination a component secured to a substrate, the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
In one simple arrangernent, the locatGr means comprises two or more legs positioned on either the support or the substrate, the support being positioned on the legs spaced from the substrate by a predetermined amount determined by the length of the legs.
Preferably, however, complementary locating portions zre formed in the support and the substrate. This has 1s the advantage that the support is located in two directions relative to the substrate.
For exarnple, the ~ocating portions may comprise complernentary ridges and recesses. h1here the substrate comprises a single crystal such as silicon it is particularly convenient if the complementary ridges and recesses have a V-shaped cross-section since these can be formed using known masking and aniso-tropic etching techni~ues .
The component ~ay be directly bonded to the substrate, for example by solderin~, or indirectly by bonding the support to the substrate. Preferably, both the support and component are bonded to the substrate.
Some examples of methods and combinations in accordance with the invention will now be described with reference to the accornpanying drawings, in which:-Figure 1 is a side elevation of a firs-t example Wit}
some parts omitted for clarit~
Figure 2 is a plan of the first example with some parts omitted for clarity; and, 1;~7~
Figures 3, 4, and 5 are a side elevation, partial end elevation, and plan respectively of a second example.
Figures 1 and 2 illustrate a lithi~m niobate substrate l. Titanium is diffused into a narrow rectilinear section 2 of the top surface of the substrate l to define an optical waveguide by modifying the refractive index of the substrate. A generally U-shaped recess or slot 3 is then cut in the surface of the substrate l orthogonal to the waveguide 2 by using a suitable technique such as ion beam milling or reactive ion etch. As can be seen ir. Figure l, the slot 3 has a rectangular cross-section. It will be seen that the formation of the slot 3 divides the optical waveguide 2 into two subsidiary optical waveguides 5, 6 which axe automatically in alignment with one another. A
conventional laser chip 4 is then mounted in the slot 3 (by a method to be descri~ed below) with opposite facets ; 7, 8 in alignment with the subsidiary waveguides 6, 5 respectively.
20The depth (D) of the slot 3 is chosen so that the ; light emitting stripe in the laser chip 4 is matched to the optical wzveguides S, 6. The length (L) of the slot 3 is chosen to allow the maximum possi~le light transmission between the laser chip 4 and the substrate 1 ; 25 and it can be tailored to suit a given chip length. Th~
third dimension (W) is not critical and is chosen to allow adjustment of the laser chip 4 along the slot 3 to enable the optimum position of the laser chip relatively to the optical waveguides 5, ~ to ~e found and to permit a number of chips to be mounted side ~y side.
Typically, L is about 200 ~m and D < 15 ~m.
To mount the laser chip 4, the laser chip is initially soldered to the undersurface of a metal bridge 9. The bridge 9 has a pair of integral depending legs lG
which rest on an upper surface of the substrate l with 1 ~78~
the laser chip 4 suspended inlthe slot 3. This locates the laser chip 4 in the vertical direction by controlling the extent to which the laser chip 4 is received in the slot 3. Furthermore, it is easier for a micromanipulator to hold the bridge 9 than the laser chip itself. Optimum aligr,ment of the laser chip 4 with the optical waveguides 5, 6 is achieved using an optical method ~y monitoring the power transmitted alony the waveguiàes while the activated laser chip is moved along the slot 3. Once ~he optirnum position has been found, corresponding to ma~imum power coupling with the waveguides-5, 6, the laser chip ~
and the legs 10 of the bridge 9 are soldered to tl-e substrate 1.
There are a nunlber of advantages in providing two optical waveguides 5,6. In seneral, the spectral performaJ)ce of conventional laser chips needs to be improved and this can be achieved by monitoring the laser output from the facet 8 while the main laser output is generated from the facet 7. In addition, this access to both facets could be used in a con~ineù
transmitter/receiver or simply to monitor the outp~t po~er.
A transverse lower connection 11 to the laser chip 4 extends alons the base of the slot 3 (Figure 2) ~ne of the advantages of providing an elonaate slot 3 is that a nur~er of laser chips could be mounted side by side. This is shown in Figure 2 where additional laser chips 12, 13 are provided in alignment with optical waveyuides 14, 15; 16, 17 respectively, each pair having a similar form to the optical waveguides 5, 6. In Pigure 2, bridges corresponding to the bridge 9 and supporting the laser chips 12, 13 have been omitted The advantage of lithium niobate is that it can be used to form electro-optic components which would be incorporated into areas of the substrate adjacent ~he slot 3 with suitable connections being made with the optical waveguides.
Figures 3 to 5 illustrate a second example in which a silicon substrate 18 is used. One of the advantages of silicon is that it can be very accurately etched using its anisotropic etching properties to produce grooves with depths accurate to 1 micron and with accurately determined included angles. In the example shown in Fiqures 3 to 5, initially a flat bottomed channel 19 is lQ formed having a generally ~-shzped cross-section with sloping sides by etching the 111 faces of the crystal.
Subsequently a pair of parallel V-shaped grooves 20 are etched parallel with the channel 19 and on either side of the channel 19. A V-shaped groove 21 is etched at right angles to the channel 19 and grooves 20, having a depth approximately equal to half the diameter of a monomode optical fibre 22 which is subsequently to be mounted in the groove.
A photodiode 23 is bonded (eg. soldered) to the sloping surface of the channel 19 facing the optical ~ibre 22.
A second silicon substrate or chip 24 is provided which corresponds to the bridge 9 in the previous example. The chip 24 has two pairs of depending, V-shaped ridges 25 and a central depending ridge 26. The included angle of each ridge 25 is substantially the same as the included angle of the V-shaped grooves 20 ir. the substrate 1&.
A laser diode 27 is bonaed to the ridge 26.
The substrate 24 is then mounted on the substrate 18 with each pair of ridges 25 being received in the corresponding groove 20 and straddling the groove 21.
The depth of the grooves 20 and the height of the ridge 26 are chosen such that when the substrate 24 is mounted on the substrate 18, the laser diode 27 is accuratel~
~L~7~391(3 located and aligned with an optical fibre 22 in the groove 21 (Figure 4).
The provision of the grooves 20 and complementary ridges 25 assists in accurately positioning the laser 5 diode 27 in two directions and this should be contrasted with the previous example in which the bridge 9 permits a certain degree of movement transverse to the slot 3.
A feature of this example is that the position of the laser diode 2, with respect to the optical fibre 22 can be adjusted in the direction of the grooves 20 to obtain maximum power couplins into the optical fibre. In addition, the separation of the end cf the optical fibre 22 from the laser diode 27 can also be altered by sliding the fibre within the groove 21. Once the correct relative positions have beer. found, the upper and lower silicon substrates 18, 24 are bonded together in such a way that the laser diode attachment to the upper silicon chip 24 is unaffected. In addition, the optical fibre 22 is bonded into the groove 21. Bonding may be achieved 20 using soldering or any other known technique.
The photodiode 23 may be used for a variety of purposes similar to those outlined in the previous example for monitoring laser emission from the facet of the laser diode 27 opposite to the optical fibre 22.
In a modification of this example (not shown) the upper substrate 29 m2y include a further depending ridge which clamps the optical fibre 22 into the groove 21.
Claims (24)
1. A method of mounting a component on a substrate, the method comprising mounting the component on a support; positioning the support on the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the component to the substrate.
2. A method according to claim 1, further comprising prior to the positioning step, providing the locator means by forming complementary locating portions in the support and the substrate.
3. A method according to claim 2, wherein the substrate and support comprise single crystals, the method further comprising anisotropically etching the substrate and support to produce the complementary locating portions.
4. A method according to any of claims 1 to 3, wherein the securing step comprises securing the support to the substrate.
5. A method of mounting a component to a substrate according to any of claims 1 to 3, wherein the component is mounted on a bridge-shaped support.
6. In combination: a component secured to a substrate, the combination further comprising a support to which the component is mounted, at least one of the support and the substrate including locator means for locating the support in at least one direction relatively to the substrate.
7. A combination according to claim 6, wherein the locator means locates the support in two directions relatively to the substrate.
8. A combination according to claim 7, wherein the support and the substrate have complementary locating positions constituting the locator means.
9. A combination according to claim 8, wherein the locating portions comprise complementary ridges and recesses.
10. A combination according to claim 9, wherein the locating portions comprise complementary V-shaped ridges and V-shaped recesses.
11. A combination according to any of claims 7 to 9, wherein the component comprises an optical component.
12. A component according to claim 11, wherein the component comprises a laser chip or an optical sensor chip.
13. A combination according to any of claims 7 to 9, wherein one or both of the substrate and support comprise a single crystal.
14. A combination according to claim 13, wherein one or both of the substrate and support comprise silicon.
15. A combination according to any of claims 7 to 9, wherein the support is a bridge-like structure.
16. A method of mounting a component on a substrate, the method comprising:
mounting the component on an undersurface of a bridge-shaped support;
positioning the support on the substrate with the component located between the support and the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the support to the substrate.
mounting the component on an undersurface of a bridge-shaped support;
positioning the support on the substrate with the component located between the support and the substrate, wherein at least one of the support and the substrate includes locator means such that the support is located in at least one direction relatively to the substrate; and securing the support to the substrate.
17. A method according to claim 16, further comprising prior to the positioning step, providing the locator means by forming complementary locating portions in the support and the substrate.
18. A method according to claim 17, wherein the substrate and support comprise single crystals, the method further comprising anisotropically etching the substrate and support to produce the complementary locating portions.
19. A method according to any of claims 16 to 18, wherein the securing step comprises securing the support to the substrate.
20. A method of mounting a component to a substrate according to any of claims 16 to 18, wherein the component is mounted on a bridge-shaped support.
21. A component mounted onto a substrate in accordance with the method of claim 16, 17 or 18.
22. A method of mounting a laser component on a substrate in accurate optical signal alignment with an optical waveguide component, said method comprising the steps of:
mounting said laser component between projecting legs of a support structure;
positioning said legs onto said substrate to accurately alien an optical signal output of said laser component with an optical waveguide component also supported by said substrate; and securing said support structure to said substrate in such aligned position with the laser component disposed between the support structure and the substrate.
mounting said laser component between projecting legs of a support structure;
positioning said legs onto said substrate to accurately alien an optical signal output of said laser component with an optical waveguide component also supported by said substrate; and securing said support structure to said substrate in such aligned position with the laser component disposed between the support structure and the substrate.
23. A method as in Claim 22 wherein said positioning step includes sliding said legs in one dimension along a matingly engaged guide path of said substrate which predefines accurate positioning of the laser component in at least one dimension transverse to said guide path.
24. A method as in Claim 22 or 23 wherein said legs have a predetermined length which predefines accurate positioning of the laser component in at least one dimension.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB858526189A GB8526189D0 (en) | 1985-10-23 | 1985-10-23 | Fabry-perot interferometer |
| GB8526189 | 1985-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1278910C true CA1278910C (en) | 1991-01-15 |
Family
ID=10587147
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000520800A Expired - Fee Related CA1278910C (en) | 1985-10-23 | 1986-10-17 | Mounting a component to a substrate |
| CA000520798A Expired - Fee Related CA1271552A (en) | 1985-10-23 | 1986-10-17 | Wavelength selection device and method |
| CA000520801A Expired - Fee Related CA1276781C (en) | 1985-10-23 | 1986-10-17 | Positioning optical components and waveguides |
| CA 520796 Expired - Fee Related CA1333452C (en) | 1985-10-23 | 1986-10-17 | Fabry-perot interferometer |
| CA000520799A Expired - Fee Related CA1277525C (en) | 1985-10-23 | 1986-10-17 | Movable member mounting |
| CA000520797A Expired - Fee Related CA1284372C (en) | 1985-10-23 | 1986-10-17 | Radiation deflector assembly |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000520798A Expired - Fee Related CA1271552A (en) | 1985-10-23 | 1986-10-17 | Wavelength selection device and method |
| CA000520801A Expired - Fee Related CA1276781C (en) | 1985-10-23 | 1986-10-17 | Positioning optical components and waveguides |
| CA 520796 Expired - Fee Related CA1333452C (en) | 1985-10-23 | 1986-10-17 | Fabry-perot interferometer |
| CA000520799A Expired - Fee Related CA1277525C (en) | 1985-10-23 | 1986-10-17 | Movable member mounting |
| CA000520797A Expired - Fee Related CA1284372C (en) | 1985-10-23 | 1986-10-17 | Radiation deflector assembly |
Country Status (2)
| Country | Link |
|---|---|
| CA (6) | CA1278910C (en) |
| GB (1) | GB8526189D0 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11226457B2 (en) * | 2020-05-28 | 2022-01-18 | Cisco Technology, Inc. | Laser and photonic chip integration |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6670208B2 (en) | 2000-06-23 | 2003-12-30 | Nec Corporation | Optical circuit in which fabrication is easy |
-
1985
- 1985-10-23 GB GB858526189A patent/GB8526189D0/en active Pending
-
1986
- 1986-10-17 CA CA000520800A patent/CA1278910C/en not_active Expired - Fee Related
- 1986-10-17 CA CA000520798A patent/CA1271552A/en not_active Expired - Fee Related
- 1986-10-17 CA CA000520801A patent/CA1276781C/en not_active Expired - Fee Related
- 1986-10-17 CA CA 520796 patent/CA1333452C/en not_active Expired - Fee Related
- 1986-10-17 CA CA000520799A patent/CA1277525C/en not_active Expired - Fee Related
- 1986-10-17 CA CA000520797A patent/CA1284372C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11226457B2 (en) * | 2020-05-28 | 2022-01-18 | Cisco Technology, Inc. | Laser and photonic chip integration |
| US20220075131A1 (en) * | 2020-05-28 | 2022-03-10 | Cisco Technology, Inc. | Laser and photonic chip integration |
| US11668886B2 (en) * | 2020-05-28 | 2023-06-06 | Cisco Technology, Inc. | Laser and photonic chip integration |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1276781C (en) | 1990-11-27 |
| GB8526189D0 (en) | 1985-11-27 |
| CA1271552A (en) | 1990-07-10 |
| CA1333452C (en) | 1994-12-13 |
| CA1284372C (en) | 1991-05-21 |
| CA1277525C (en) | 1990-12-11 |
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| JPH06337333A (en) | Optical coupling circuit |
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