CA1268997A - Automatic lead wire tinning of tape-packaged components - Google Patents
Automatic lead wire tinning of tape-packaged componentsInfo
- Publication number
- CA1268997A CA1268997A CA000497081A CA497081A CA1268997A CA 1268997 A CA1268997 A CA 1268997A CA 000497081 A CA000497081 A CA 000497081A CA 497081 A CA497081 A CA 497081A CA 1268997 A CA1268997 A CA 1268997A
- Authority
- CA
- Canada
- Prior art keywords
- wave
- conductors
- station
- solder
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
ABSTRACT OF THE INVENTION
In combination, a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis which decreases in cross-sectional area with distance along the axis, apparatus transporting along the axis an electrical component having at least one linear conductor extending transverse to the axis to pass through the wave of solder, and heating and suction apparatus for removing excess solder from the conductor.
In combination, a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis which decreases in cross-sectional area with distance along the axis, apparatus transporting along the axis an electrical component having at least one linear conductor extending transverse to the axis to pass through the wave of solder, and heating and suction apparatus for removing excess solder from the conductor.
Description
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This invention relate to the field of electrical manufacturing, and particularly to means for tinning the conductors of components suppli~d on taped rolls, in situ on the tapes.
It is advantageous for commercial users of electrical components to be able to purchase much used components in large quantities, for later use as needed. To facilitate these large p~rchases, suppliers sometlmes package components by mounting them between long tapes wound on spools or reels,,which are easily .
~;~ stored by the purchasers, and from which the components are easily accessible.
In industr~al applications, components:are advantageously positioned physi~ally on circui:t boards ~ : with their conductors extending~through holc8 in :~ conductive patterns on the boards, to which patterns they are connected by wave solderlng. This means that the solderabllity~of the component conductors must~be good~at the;time of use~ regardless of how long~a period of s~orage~has occurred~
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Various suppliers use various finishes on the component conductors, however: coa~ings of gold, silver, and tin are known, which may be of different thicknesses, porosities, and surface contamination. It 5 has been ound that a considerable amount of "touch upi' action is often required after wave soldering, to perfect connections which were not made satisfactorily, and this is an expensive, manual process. The period of storage between purchase and use also has an 10 unpredictable affect on the solderability of the component's conductors.
One way of overcom.ing this is to hand-tin all the conductors as the components are taken from the storage reels and before they are mounted on the circuit boards, but this iæ also a very costly and time ~: consuming process.
RIEE ~MMA~Y OF TH~ I~V~NTIQ~
i~
The present invention comprises apparatus for:
: automatically tinning the leads of tape-stored electrical components, immediately upon receipt from the suppliers, without removing the components from the ; tapes. This has been found to overcome the tendency of the leads to become unsolderable with time, and can be : done rapidly, automatically, and ine*pensively irrespective~of the sur~ace treatment of ~he conductors . :
~ as supplied. ~he arrangemen~ is equally e~fective for , ` ; ~
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components with "axial leads" extending to tapes in opposite directions from opposite ends of the components, and for com-ponents with "radial leads", extending to a single tape in a single direction from the component. Practice of the invention results in a supply of components of consistent solderability at any time of use no matter how they were originally supplied.
In accordance with the present invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration trans~erse of an axis, which decreases in cross-sectional area with distance in a first direction along said axis; means transporting along said axis in said direction an electrical component haviny at least one linear conductor extending transverse to said axis to pass through said wave, and further means located heyond said wave for removing from said conductor any excessive solder remaining thereon, including heating means to maintain said excess solder in liquid phase, and suction means for drawing said excess solder from said conductor.
In accordance with another aspect of the invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distan¢e in a first direction along said axis; and means trans-porting along said axls in said direction an electrical compon-ent having at least one linear conductor extending transverse to said axis to pass through sald wave.
In accordance with another aspect of the invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration, trans-verse to an axis, which decreases in cross-sectional~area with . , .
39~7 - 3a - 6~159-~66 distance in a first direction along said axis; and means tran-sporting in said direction along said axis a succession of electrical components, each having conductors extending trans-verse to said axis, to initially pass through and subsequently emerge from said wave, said components being oriented so that said conductors slope downwardly from said components, and means located beyond said wave for removing from said conductors any excess solder remaining at the lower ends thereof.
In acco.rdance with another aspect of the invention, there is provided apparatus for tinning predetermined portions oE conductors extending transversely in opposite directions from a succession of electrical components carried on tape means orthogonally interconnecting the opposite ends of said conductors, comprising means movi~g said tape means and said components generally horizontally along a path including, in succession: a feed reel; a precleaning station having nozzle means applying cleaning solution to said conductors; a fluxing . ~ , station having foam head means for applying liquid flux to said ~: portions of said conductor; means orienting said tape means so that first conductors slope downwardly from first ends of said components; a first solder wave station establishing a wave ; of liquid solder having a convex configuration transverse io said path so that said chosen portions of said first conductors .; pass through and emerge from said wave, said wave station .~ including means for removing excess solder from the lower ends ~- of said first conductor; means reorienting said tape:means so : that second conductors slope down~ard from second ends of said components; a second solder ~ave station establishing a wave of liquid solder having a convex configuration transverse to - 30 said path so that said chosen portions of said second conductors ,: ~
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.
. . .
-3b - 6~159-866 pass through and emerge from said wave, said second solder wave station including means Eor removing excess solder from the lower ends of said second conductors; a cooling station; a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors; a drying station; and a take up reel.
In accordance with another aspect of the invention t there is provided apparatus for tinning predetermined portions of conductors extending transversely from a succession of electrical components carried on tape means orthogonally inter-connecting the ends of said conductors, comprising means moving said tape means and said components generally horizontally along a path including, in succession: a feed reel, a precleaning station having nozzle means applying cleaning solution to said predetermined portions of said conductor; a fluxing station having foam head means for applying liquid flux to said portions of said conductors; means orienting said tape means so that flrst conductors slope downwardly ~rom first ends of said components, a solder wave station establishing a wave of liquid solder ha~ing a convex configuration transverse -to said path so that said chosen portions of said conductors pass through an emerge from said wa~e, sald wave station including means for removing :"
;~ excess solder from the lower ends of said conductors; a cooling station; a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors; a drylng ; station; and a take up reel.
~arious advantages and features of novelty which characterize the invention are pointed out with particularity in the claims annexed hereto and forming a part thereoE. ~ow-ever, for a better understanding of the invention, its ~' ' ' '"
39~
.
- 3c - 6415~-866 advantages, and objects attained by its use~ reference should be had to the drawing which for.ms a further part hereof, and to the accompanying descriptive matter, in which there is illustrated and described a preferred embodiment of the inven-tion.
BRIEF DESCRIPTION OF THE DRAWING
In the drawing, in which like reference numerals identify corresponding parts throughout the several views, FIGURE 1 shows a portion of a supply of components as packaged with axial leads, FIGURE 2 is a block diagram of a lead wire tinning system according to the invention, FIGURE 3 is a plan view of a portion of the invention, FIGURE 4 is a fragmentary pl.an ~iew of a portion of FIGURE 3 to a larger scale, FIGURE
5 is a fragmentary sectional view along the line 5-5 of FIGURE
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4 showing a component in place, FIGURE 6 is a fragmentary section view along the line 6-6 of FIGURE 4 showing a component in place, FIGURE 7 is a view like FIGURE 5 but taken along the line 7-7 of FIGUR~ 3, and FIGURE 8 shows a portion of a supply of components as packaged with radial leads.
E~ D ~ESCRIPTI~ O~ THE P~EFER~D-E~Q~l~E~
Referring now to FIGURE 1, there is shown a portion of a supply of electrical components as packaged for tape storage. Here a plurality of diodes 11 have axial leads 12 and 13 extending from opposite ends thereof in opposite directions. A first adhesive support tape 14 extends orthogonally to the free ends o leads 12 and a second support tape 15 extends orthogonally to the free ends of leads 13, so that the assembly comprises what may be called a~ribbon" 16 of ~ ~ components. It is desired to retin or solder-coat the -~ ~ portions "ar of each lead, as these are the portions which will later be used in assembllng circuitry~ ~
2Q Liquid solder should not be applied to portions "b" as the resulting heat may be de~rimental to the components, and similarly portions "c" should not be contacted with solder to avold heat degredation of tapes 14 and 15~
; FIGURE 2 shows that in the apparatus ribbon 16 25 ~ is drawn from a fe~d reel 20 to a drlven take-up reel 21 along a path havlng a number of treatment stations.
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Except as will presently be pointed out, the conductors of the components remain generally horizontal while following this path. This may be conv~niently arranged by providing properly spaced and oriented rails in which tapes 14 and 15 are guided, the tapes being extended beyond the components at each end of the ribbon to lead the latter into and out of the equipment.
The path is identified by the general reference numeral 30, and includes in sequence a precleaning station 31, a fluxing station 32, a first twi ting station 33, a irst solder wave station 34, a reverse twisting station 35, a second solder wave station 36, a cooling and untwisting station 37, a post cleaning station 38, and a drying station 39.
Precleaning station 31 has nozzle means for :~ applyin~ cleaning solution to the condoctorsO Fluxing station 32 has foam head means ~or applying liquid flux .
to the conductors, particularly to portions "a'~
thereof. In twisting station 33 the tape is twisted to an angle of approximately~20 degrees so:that leads l~
slope downwardly from componentc 11. This orientation ~: is main~ained through first solder wave s~a~ion 34, wh~ich will b~ described~elow. In second twisting station 35 the twist~is:r;everced so~that leads 13 slope ;25~ ~ downwards from compon~nts~}I. After:passing solder wave station 36 the~ribbon pacses through coolin~ station 37 .,~.: :
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which, if desired, includes fan or blowing means, and in which the ribbon is restored to a normal horizontal orien~ation. Postcleaning station 38 has nozzle means directing a stream of water to flow against the soldered conductors, and the components and tapes are dried by suitable means in station 39 for discha ge to take-up reel 21, after which they may be stored until the components are needed for use. Except for stations 34 and 36, the stations are generally known structures.
Turning now to FIGURE 3, a satisfactory embodim~n of stations 33 to 37 is shown to comprise a chamber or tray 40, with heat-insulating walls, in which a supply of solder 38' is malntained molten by suitable heating means not shown. Liquid solder is con~inuously ~:~ lS pumped from chamber 40 by a first li~uid metal pump 41 to first solder wave station 34, and similarly liquid : solder i8 continuously supplied from ~ray 40 by a second liquid metal pump 42 to second solder wave station 36.
Ribbon 16 is drawn from left to right past station 34 in - tracks 43 and 44, which terminate just beyond station 34r Then the ribbon ~s drawn past station 36 in tracks : 45 and 46~, which begin jus~ before station 3~. Tracks 43 and 44 cause ribbon 16 ~o twist from a nominal horizontal orlentation by about 20 degrees in a first : 25~ direction, track 44~and tape 15 being higher than track 43~ and tape l4. On the other hand,~track 45 is higher ~ ~
- ~L26~9~
- 7 - 64159-~66 than track 46, 50 that in these tracks tape 14 is higher than tape 15 and the ribbon is twisted to an orientation displaced from the horizontal by about 20 degrees in the opposite direction. The gap between tracks 43, 44 and tracks 45, 46 comprises reverse twisting station 35. Tape 14 travels first in ~rack 43 and then in track 45, while tape l5 travels first in track 44 and then in track 46, so that a forty degree twist in ribbon 16 occurs. By this arrangement portions "a" of leads 12 are retinned at station 34, and then portions "a" of leads 13 are retinned at station 36, as will now be described.
Stations 34 and 36 are similar, and only one will be described in detail. Station 34 includes a vertical riser or chimney 50 in which upward flow of molten solder is maintained by a suitable pump: pumps of this sort are commercially available. At the top of a chimney one side 51 is lower than the other side 52, ana has a rolled edge as indicated at 53 over . , which the solder 38' flows. The ribbon 16 of components moves across the top of chimney 50 from end 5S to end 56, as indicated by the arrow 57.
~0 A wave shaper 60 is provided in chimney 50 to change the~shape of the solder wave emerging from the chi~ney: the wave shape near end 55 is indicated at 61 in FIGURE 5, and the :: :
~ wave shape near end 56 is indicated ., ., ~
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~ 8-at 62~ Tapes 14 and 15 move past chimney 50 in rails 43 and 44 so positione~ that when each component first enters the solder wave most of its length, portion "a"
is submerged, but as the ribbon proceeds the submerged length of conductor 12 decreases. By this arrangement any excess solder on conductor 12 runs toward the lower . end to form what may loosely be termed an nicicle" 65, although lt is in liquid rather than solid ætate.
If allowed to solidify, such icicles would seriously interfere with the subsequent incorporation of the components in the circuit boards, and so forth, 50 means is provided or removing the excess solder before it solidifies. Immediately adjacent to end 56 of chimney S0 there is provided a heated block 70 having a port 71 positioned for near passage by the components as they leave the chimney. A vacuum line 72 connects port 71 with a collection jar~73 which ls maintained at subatmospheric pressure by a suitable pump connection ; 74. As each conductor 12 passes port 71, any "icicle"
of excess liquid solder is pneumatically removed to ~ar . 73.
For most satis~actory flow of liqu~d solder, it~
ha~; been found helpful to modi~fy edge 51 by providing a slight surve 75, and to provide block 70 with a recess 25 76, to enable slight: flow of liquid metal in the : direction of movement o~ the ribbon.
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9 ~ 7 Station 36 is like station 34 except that the top of the chimney is bevelled in the opposite direction, and the rails lead conductors 13 through the solder instead of conductors 12~ It will be apparent : 5 that if components are being treated which have radial rather than axial leads, only one tape and one solder : wave station are necessary.
Numerous characteristics and advantages of the invention have been set forth in the foregoing description, together with details of the strucl:ure and function of the invention, and the novel features thereof are pointed out in the appended claims. The disclosure, however, is illu~trative only, and changes may be made in detail, especially in matters of shape, :: : 15 size, and arrangement of parts, within the principle of the invention, to the full~extent indicated by the ~road ~ general meaning of the terms in which the appended :~ : claims are expressed.
.,.~
E~E~
This invention relate to the field of electrical manufacturing, and particularly to means for tinning the conductors of components suppli~d on taped rolls, in situ on the tapes.
It is advantageous for commercial users of electrical components to be able to purchase much used components in large quantities, for later use as needed. To facilitate these large p~rchases, suppliers sometlmes package components by mounting them between long tapes wound on spools or reels,,which are easily .
~;~ stored by the purchasers, and from which the components are easily accessible.
In industr~al applications, components:are advantageously positioned physi~ally on circui:t boards ~ : with their conductors extending~through holc8 in :~ conductive patterns on the boards, to which patterns they are connected by wave solderlng. This means that the solderabllity~of the component conductors must~be good~at the;time of use~ regardless of how long~a period of s~orage~has occurred~
25 ;~
r '~.
:
~. ~
: ' , , ~' ~; .
Various suppliers use various finishes on the component conductors, however: coa~ings of gold, silver, and tin are known, which may be of different thicknesses, porosities, and surface contamination. It 5 has been ound that a considerable amount of "touch upi' action is often required after wave soldering, to perfect connections which were not made satisfactorily, and this is an expensive, manual process. The period of storage between purchase and use also has an 10 unpredictable affect on the solderability of the component's conductors.
One way of overcom.ing this is to hand-tin all the conductors as the components are taken from the storage reels and before they are mounted on the circuit boards, but this iæ also a very costly and time ~: consuming process.
RIEE ~MMA~Y OF TH~ I~V~NTIQ~
i~
The present invention comprises apparatus for:
: automatically tinning the leads of tape-stored electrical components, immediately upon receipt from the suppliers, without removing the components from the ; tapes. This has been found to overcome the tendency of the leads to become unsolderable with time, and can be : done rapidly, automatically, and ine*pensively irrespective~of the sur~ace treatment of ~he conductors . :
~ as supplied. ~he arrangemen~ is equally e~fective for , ` ; ~
/
~ , :. ~
~2~
components with "axial leads" extending to tapes in opposite directions from opposite ends of the components, and for com-ponents with "radial leads", extending to a single tape in a single direction from the component. Practice of the invention results in a supply of components of consistent solderability at any time of use no matter how they were originally supplied.
In accordance with the present invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration trans~erse of an axis, which decreases in cross-sectional area with distance in a first direction along said axis; means transporting along said axis in said direction an electrical component haviny at least one linear conductor extending transverse to said axis to pass through said wave, and further means located heyond said wave for removing from said conductor any excessive solder remaining thereon, including heating means to maintain said excess solder in liquid phase, and suction means for drawing said excess solder from said conductor.
In accordance with another aspect of the invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distan¢e in a first direction along said axis; and means trans-porting along said axls in said direction an electrical compon-ent having at least one linear conductor extending transverse to said axis to pass through sald wave.
In accordance with another aspect of the invention, there is provided in combination: a wave station establishing a wave of liquid solder having a convex configuration, trans-verse to an axis, which decreases in cross-sectional~area with . , .
39~7 - 3a - 6~159-~66 distance in a first direction along said axis; and means tran-sporting in said direction along said axis a succession of electrical components, each having conductors extending trans-verse to said axis, to initially pass through and subsequently emerge from said wave, said components being oriented so that said conductors slope downwardly from said components, and means located beyond said wave for removing from said conductors any excess solder remaining at the lower ends thereof.
In acco.rdance with another aspect of the invention, there is provided apparatus for tinning predetermined portions oE conductors extending transversely in opposite directions from a succession of electrical components carried on tape means orthogonally interconnecting the opposite ends of said conductors, comprising means movi~g said tape means and said components generally horizontally along a path including, in succession: a feed reel; a precleaning station having nozzle means applying cleaning solution to said conductors; a fluxing . ~ , station having foam head means for applying liquid flux to said ~: portions of said conductor; means orienting said tape means so that first conductors slope downwardly from first ends of said components; a first solder wave station establishing a wave ; of liquid solder having a convex configuration transverse io said path so that said chosen portions of said first conductors .; pass through and emerge from said wave, said wave station .~ including means for removing excess solder from the lower ends ~- of said first conductor; means reorienting said tape:means so : that second conductors slope down~ard from second ends of said components; a second solder ~ave station establishing a wave of liquid solder having a convex configuration transverse to - 30 said path so that said chosen portions of said second conductors ,: ~
, ~ , '':, '' ' .; ~
.
. . .
-3b - 6~159-866 pass through and emerge from said wave, said second solder wave station including means Eor removing excess solder from the lower ends of said second conductors; a cooling station; a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors; a drying station; and a take up reel.
In accordance with another aspect of the invention t there is provided apparatus for tinning predetermined portions of conductors extending transversely from a succession of electrical components carried on tape means orthogonally inter-connecting the ends of said conductors, comprising means moving said tape means and said components generally horizontally along a path including, in succession: a feed reel, a precleaning station having nozzle means applying cleaning solution to said predetermined portions of said conductor; a fluxing station having foam head means for applying liquid flux to said portions of said conductors; means orienting said tape means so that flrst conductors slope downwardly ~rom first ends of said components, a solder wave station establishing a wave of liquid solder ha~ing a convex configuration transverse -to said path so that said chosen portions of said conductors pass through an emerge from said wa~e, sald wave station including means for removing :"
;~ excess solder from the lower ends of said conductors; a cooling station; a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors; a drylng ; station; and a take up reel.
~arious advantages and features of novelty which characterize the invention are pointed out with particularity in the claims annexed hereto and forming a part thereoE. ~ow-ever, for a better understanding of the invention, its ~' ' ' '"
39~
.
- 3c - 6415~-866 advantages, and objects attained by its use~ reference should be had to the drawing which for.ms a further part hereof, and to the accompanying descriptive matter, in which there is illustrated and described a preferred embodiment of the inven-tion.
BRIEF DESCRIPTION OF THE DRAWING
In the drawing, in which like reference numerals identify corresponding parts throughout the several views, FIGURE 1 shows a portion of a supply of components as packaged with axial leads, FIGURE 2 is a block diagram of a lead wire tinning system according to the invention, FIGURE 3 is a plan view of a portion of the invention, FIGURE 4 is a fragmentary pl.an ~iew of a portion of FIGURE 3 to a larger scale, FIGURE
5 is a fragmentary sectional view along the line 5-5 of FIGURE
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4 showing a component in place, FIGURE 6 is a fragmentary section view along the line 6-6 of FIGURE 4 showing a component in place, FIGURE 7 is a view like FIGURE 5 but taken along the line 7-7 of FIGUR~ 3, and FIGURE 8 shows a portion of a supply of components as packaged with radial leads.
E~ D ~ESCRIPTI~ O~ THE P~EFER~D-E~Q~l~E~
Referring now to FIGURE 1, there is shown a portion of a supply of electrical components as packaged for tape storage. Here a plurality of diodes 11 have axial leads 12 and 13 extending from opposite ends thereof in opposite directions. A first adhesive support tape 14 extends orthogonally to the free ends o leads 12 and a second support tape 15 extends orthogonally to the free ends of leads 13, so that the assembly comprises what may be called a~ribbon" 16 of ~ ~ components. It is desired to retin or solder-coat the -~ ~ portions "ar of each lead, as these are the portions which will later be used in assembllng circuitry~ ~
2Q Liquid solder should not be applied to portions "b" as the resulting heat may be de~rimental to the components, and similarly portions "c" should not be contacted with solder to avold heat degredation of tapes 14 and 15~
; FIGURE 2 shows that in the apparatus ribbon 16 25 ~ is drawn from a fe~d reel 20 to a drlven take-up reel 21 along a path havlng a number of treatment stations.
.
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::
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Except as will presently be pointed out, the conductors of the components remain generally horizontal while following this path. This may be conv~niently arranged by providing properly spaced and oriented rails in which tapes 14 and 15 are guided, the tapes being extended beyond the components at each end of the ribbon to lead the latter into and out of the equipment.
The path is identified by the general reference numeral 30, and includes in sequence a precleaning station 31, a fluxing station 32, a first twi ting station 33, a irst solder wave station 34, a reverse twisting station 35, a second solder wave station 36, a cooling and untwisting station 37, a post cleaning station 38, and a drying station 39.
Precleaning station 31 has nozzle means for :~ applyin~ cleaning solution to the condoctorsO Fluxing station 32 has foam head means ~or applying liquid flux .
to the conductors, particularly to portions "a'~
thereof. In twisting station 33 the tape is twisted to an angle of approximately~20 degrees so:that leads l~
slope downwardly from componentc 11. This orientation ~: is main~ained through first solder wave s~a~ion 34, wh~ich will b~ described~elow. In second twisting station 35 the twist~is:r;everced so~that leads 13 slope ;25~ ~ downwards from compon~nts~}I. After:passing solder wave station 36 the~ribbon pacses through coolin~ station 37 .,~.: :
,:
'~ ' .
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--6~
which, if desired, includes fan or blowing means, and in which the ribbon is restored to a normal horizontal orien~ation. Postcleaning station 38 has nozzle means directing a stream of water to flow against the soldered conductors, and the components and tapes are dried by suitable means in station 39 for discha ge to take-up reel 21, after which they may be stored until the components are needed for use. Except for stations 34 and 36, the stations are generally known structures.
Turning now to FIGURE 3, a satisfactory embodim~n of stations 33 to 37 is shown to comprise a chamber or tray 40, with heat-insulating walls, in which a supply of solder 38' is malntained molten by suitable heating means not shown. Liquid solder is con~inuously ~:~ lS pumped from chamber 40 by a first li~uid metal pump 41 to first solder wave station 34, and similarly liquid : solder i8 continuously supplied from ~ray 40 by a second liquid metal pump 42 to second solder wave station 36.
Ribbon 16 is drawn from left to right past station 34 in - tracks 43 and 44, which terminate just beyond station 34r Then the ribbon ~s drawn past station 36 in tracks : 45 and 46~, which begin jus~ before station 3~. Tracks 43 and 44 cause ribbon 16 ~o twist from a nominal horizontal orlentation by about 20 degrees in a first : 25~ direction, track 44~and tape 15 being higher than track 43~ and tape l4. On the other hand,~track 45 is higher ~ ~
- ~L26~9~
- 7 - 64159-~66 than track 46, 50 that in these tracks tape 14 is higher than tape 15 and the ribbon is twisted to an orientation displaced from the horizontal by about 20 degrees in the opposite direction. The gap between tracks 43, 44 and tracks 45, 46 comprises reverse twisting station 35. Tape 14 travels first in ~rack 43 and then in track 45, while tape l5 travels first in track 44 and then in track 46, so that a forty degree twist in ribbon 16 occurs. By this arrangement portions "a" of leads 12 are retinned at station 34, and then portions "a" of leads 13 are retinned at station 36, as will now be described.
Stations 34 and 36 are similar, and only one will be described in detail. Station 34 includes a vertical riser or chimney 50 in which upward flow of molten solder is maintained by a suitable pump: pumps of this sort are commercially available. At the top of a chimney one side 51 is lower than the other side 52, ana has a rolled edge as indicated at 53 over . , which the solder 38' flows. The ribbon 16 of components moves across the top of chimney 50 from end 5S to end 56, as indicated by the arrow 57.
~0 A wave shaper 60 is provided in chimney 50 to change the~shape of the solder wave emerging from the chi~ney: the wave shape near end 55 is indicated at 61 in FIGURE 5, and the :: :
~ wave shape near end 56 is indicated ., ., ~
, .1, ' .
-.;
:''''~
' ' ~
~ 8-at 62~ Tapes 14 and 15 move past chimney 50 in rails 43 and 44 so positione~ that when each component first enters the solder wave most of its length, portion "a"
is submerged, but as the ribbon proceeds the submerged length of conductor 12 decreases. By this arrangement any excess solder on conductor 12 runs toward the lower . end to form what may loosely be termed an nicicle" 65, although lt is in liquid rather than solid ætate.
If allowed to solidify, such icicles would seriously interfere with the subsequent incorporation of the components in the circuit boards, and so forth, 50 means is provided or removing the excess solder before it solidifies. Immediately adjacent to end 56 of chimney S0 there is provided a heated block 70 having a port 71 positioned for near passage by the components as they leave the chimney. A vacuum line 72 connects port 71 with a collection jar~73 which ls maintained at subatmospheric pressure by a suitable pump connection ; 74. As each conductor 12 passes port 71, any "icicle"
of excess liquid solder is pneumatically removed to ~ar . 73.
For most satis~actory flow of liqu~d solder, it~
ha~; been found helpful to modi~fy edge 51 by providing a slight surve 75, and to provide block 70 with a recess 25 76, to enable slight: flow of liquid metal in the : direction of movement o~ the ribbon.
~''`
I
t ~ r ~
9 ~ 7 Station 36 is like station 34 except that the top of the chimney is bevelled in the opposite direction, and the rails lead conductors 13 through the solder instead of conductors 12~ It will be apparent : 5 that if components are being treated which have radial rather than axial leads, only one tape and one solder : wave station are necessary.
Numerous characteristics and advantages of the invention have been set forth in the foregoing description, together with details of the strucl:ure and function of the invention, and the novel features thereof are pointed out in the appended claims. The disclosure, however, is illu~trative only, and changes may be made in detail, especially in matters of shape, :: : 15 size, and arrangement of parts, within the principle of the invention, to the full~extent indicated by the ~road ~ general meaning of the terms in which the appended :~ : claims are expressed.
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Claims (5)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In combination:
a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
means transporting along said axis in said direction an electrical component having at least one linear conductor extending transverse to said axis to pass through said wave;
and further means located beyond said wave for removing from said conductor any excessive solder remaining thereon, including heating means to maintain said excess solder in liquid phase, and suction means for drawing said excess solder from said conductor.
a wave station establishing a wave of liquid solder having a convex configuration transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
means transporting along said axis in said direction an electrical component having at least one linear conductor extending transverse to said axis to pass through said wave;
and further means located beyond said wave for removing from said conductor any excessive solder remaining thereon, including heating means to maintain said excess solder in liquid phase, and suction means for drawing said excess solder from said conductor.
2. In combination:
a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
and means transporting along said axis in said direction an electrical component having at least one linear conductor extending transverse to said axis to pass through said wave.
a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
and means transporting along said axis in said direction an electrical component having at least one linear conductor extending transverse to said axis to pass through said wave.
3. In combination:
a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
and means transporting in said direction along said axis a succession of electrical components, each having conductors extending transverse to said axis, to initially pass through and subsequently emerge from said wave, said components being oriented so that said conductors slope downwardly from said components; and means located beyond said wave for removing from said conductors any excess solder remaining at the lower ends thereof.
a wave station establishing a wave of liquid solder having a convex configuration, transverse to an axis, which decreases in cross-sectional area with distance in a first direction along said axis;
and means transporting in said direction along said axis a succession of electrical components, each having conductors extending transverse to said axis, to initially pass through and subsequently emerge from said wave, said components being oriented so that said conductors slope downwardly from said components; and means located beyond said wave for removing from said conductors any excess solder remaining at the lower ends thereof.
4. Apparatus for tinning predetermined portions of conductors extending transversely in opposite directions from a succession of electrical components carried on tape means orthogonally interconnecting the opposite ends of said conductors, comprising means moving said tape means and said component: generally horizontally along a path including, in succession:
a feed reel;
a precleaning station having nozzle means applying cleaning solution to said conductors;
a fluxing station having foam head means far applying liquid flux to said portions of said conductor;
means orienting said tape means so that first conductors slope downwardly from first ends of said components;
a first solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said first conductors pass through and emerge from said wave, said wave station including means for removing excess solder from the lower ends of said first conductor;
means reorienting said tape means so that second conductors slope downward from second ends of said components;.
a second solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said second conductors pass through and emerge from said wave, said second solder wave station including means for removing excess solder from the lower ends of said second conductors;
a cooling station;
a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors;
a drying station and a take up reel.
a feed reel;
a precleaning station having nozzle means applying cleaning solution to said conductors;
a fluxing station having foam head means far applying liquid flux to said portions of said conductor;
means orienting said tape means so that first conductors slope downwardly from first ends of said components;
a first solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said first conductors pass through and emerge from said wave, said wave station including means for removing excess solder from the lower ends of said first conductor;
means reorienting said tape means so that second conductors slope downward from second ends of said components;.
a second solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said second conductors pass through and emerge from said wave, said second solder wave station including means for removing excess solder from the lower ends of said second conductors;
a cooling station;
a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors;
a drying station and a take up reel.
5. Apparatus for tinning predetermined portions of conductors extending transversely from a succession of electrical components carried on tape means orthogonally interconnecting the ends of said conductors, comprising means moving said tape means and said components generally horizontally along a path including, in succession:
a feed reel;
a precleaning station having nozzle means applying cleaning solution to said predetermined portions of said conductor;
a fluxing station having foam head means for applying liquid flux to said portions of said conductors;
means orienting said tape means so that first conductors slope downwardly from first ends of said components;
a solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said conductors pass through and emerge from said wave, said wave station including means for removing excess solder from the lower ends of said conductors;
a cooling station;
a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors;
a drying station; and a take up reel.
a feed reel;
a precleaning station having nozzle means applying cleaning solution to said predetermined portions of said conductor;
a fluxing station having foam head means for applying liquid flux to said portions of said conductors;
means orienting said tape means so that first conductors slope downwardly from first ends of said components;
a solder wave station establishing a wave of liquid solder having a convex configuration transverse to said path so that said chosen portions of said conductors pass through and emerge from said wave, said wave station including means for removing excess solder from the lower ends of said conductors;
a cooling station;
a post cleaning station having nozzle means applying rinsing liquid to said portions of said conductors;
a drying station; and a take up reel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000497081A CA1268997A (en) | 1985-12-06 | 1985-12-06 | Automatic lead wire tinning of tape-packaged components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000497081A CA1268997A (en) | 1985-12-06 | 1985-12-06 | Automatic lead wire tinning of tape-packaged components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1268997A true CA1268997A (en) | 1990-05-15 |
Family
ID=4132031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000497081A Expired - Fee Related CA1268997A (en) | 1985-12-06 | 1985-12-06 | Automatic lead wire tinning of tape-packaged components |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1268997A (en) |
-
1985
- 1985-12-06 CA CA000497081A patent/CA1268997A/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |