CA1250304A - Polysiloxane monomers and preparation thereof - Google Patents

Abstract

ABSTRACT OF THE DISCLOSURE

The present invention relates to a siloxane of formula where F1 is a functional group attached directly to Q or bonded via an intermediate group;
Q is a substituted or unsubstituted aromatic group;
D is unsubstituted or substituted hydrocarbylene;
R1, R2, R3, R4, R5 and R6 are each independently unsubstituted or substituted hydrocarbyl;
x, y and z each independently has a value from 0 to 100.
These polysiloxane monomers are prepared by reacting a compound of formula wherein F1, Q and Z are as defined above and M is an alkali or alkaline earth metal, with a disiloxane of formula ?ein R1 and D are as defined above and X is C1, Br or I, ? the presence of a dipolar aprotic liquid, a phase 1338 DIV. I

transfer catalyst or combination thereof. The monomers are useful in the preparation of polymers with improved solubility and adhesion and which are useful, among other things, as protective coatings.

Description

~2~ 3~

f FIELD OF THE_INVENTIGN

This invention relates to polymeric compositions containing a polysiloxane unit of formula R~ R2 Ri ~ R5 R' -Q-Z-D-Si-O-Si O-Si 1-li -O-Si-D-Z-Q
Rl R2 ~ R4 ~ R6 R' ' where the substituents are all as defined below.
The invention also relates to precursors of said polysiloxane unit and to metllods of making those precursor compounds.

~g r~;

ti3~)~

BACKGROUND OF THE INVENTION
Attempts have been made to modify the properties of various polymers by the incorporation of a polysiloxane.
These polysiloxanes have typically been alpha-omega-bis (alkylene) polysiloxanes and the results obtained therewith have not been entirely acceptable. These polysiloxanes are sensitive to elevated temperatures, which makes the synthesis of high molecular weight materials difficult and high temperature fabrication techniques unavailable.
Further, alpha-omega-bis (alkylene) polysiloxanes are not readily compatible with many polymers.

DESCRIPTION OF THE INVENTION
-This invention, which is divided out of parent copending application serial no. 391,385, relates to polysiloxane monomers of formula E`1-Q~Z-D-S - ~0-5~ 5 ~ 5.~- O-S -D-Z-Q-F1 as hereinafter defined, and to processes for preparing such monomers. The parent application is related to polymers including a siloxane containing unit of formula -Q-Z-D-S -~ r - S ~ s ~ - ~o - s l ~ - O-Sl-D-Z-Q-R L R2¦ l R4¦ L R6¦ Rl as hereinafter defined, derived from the above mentioned poly-siloxane monomers.

It has been found that the properties oE polymers can be improved by the presence of a unit of formula Rl ~ R2¦ ~ R31 ~ R5l R

~ 4 ~L l6 where Q is a substituted or unsubstituted aromatic group;

O o O O O O
Z is -O-, -S-, -S-, -S-, -SNH-, -HNS-, -HNC-, -CNH-, O O O
O O
ll ll -C-O- or -O-C-;

D is unsubstituted or substituted hydrocarbylene;
Rl, R2, R3, R4, R and R are each independently unsubstituted or substituted hydrocarbyl (hereinafter this expression should be understood to include compounds in which each of the groups Rl may be the same or different and each of the groups R may be the same or different); and x, y and z each independently has a value from O to 100.

-4a-and that polymers containing these units are suited for a variety of applications.
According to one aspect of the present invention there is provided a siloxane of formula ~ X r ~ ~Z
where Fl is a functional group attached directly to Q or bonded via an inter-mediate group;

Q is a substituted or unsubstituted aromatic group;
O O O O O O
Il 11 11 11 11 1~
Z is -SNH, -HNS-, -HNC-, -CNH, -C-O- or -O-C-;
O O
D is unsubstituted or substituted hydrocarbyiene;
R , R , R , R , R and R are each independently unsubstituted or sub-stituted hydrocarbyl; and x, y and æ each independently has a value from 0 to 100.
According to another aspect of the present invention there is provided a method for making a disiloxane which comprises reacting a compound of formula F -Q-Z-M
where Fl is a functional group attached directly to Q or bonded via an inter-mediate group;
Q is a substituted or unsubsti-tuted aromatic group;
O O O O O O
Z is -SNH, -HNS-, -HNC-, -CNH, -~-O- or -0-C-; and O O

M is an alkali or alkaline earth metal with a disiloxane of formula ~5~

R~
X-D-Si-o-Si D-X
R R
where X is Cl, Br or I;
D is unsubstituted or substituted hydrocarbylene; and R is unsubstituted or substituted hydrocarbyl in the presence of a di-polar aprotic liquid, a phase transfer catalyst or combination thereof.
According to a further aspect of the present invention there is provi-ded a method for making a disiloxane which comprises reacting a compound of form-ula F -Q-Z-M
where Fl is a functional group attached directly to Q or bonded via an inter-mediate group;

Q is a substituted or unsubstituted aromatic group;
O O O
Z iS -~NH, -CNH or -C-0-; and ~ is an alkali or alkaline earth metal with a disiloxane of formula R R
X-D- i-o-Si-D-X
~ ~1 Rl where X is Cl, Br or I;
D is unsubstituted or substituted hydrocarbylene; and R is unsubstituted or substitu-ted hydrocarbyl in the presence of a di-polar apro-tic liquid, a phase transfer catalyst or combination thereof.

-5a-According to another aspect of the present invention there is provided a process as defined above further comprising the step of heating the disiloxane so obtained with a cyclic polysiloxane of general formula ~1' wherein s is 3 or greater;
t is an integer of from 1 to 100 and when t is 2 or more, the R groups on any silicon atom are independent of any other R groups; and R indicates a member selected from the group consisting of R , R , R, R and R which are each independently unsubstituted or substituted hydrocar-byl, to a temperature of from about 85C to about 250C in the presence of a sui-table catalyst.
According to one aspect of the invention of the parent application there is provided a polymeric composition containing a thermally stable siloxane unit of formula Rl l; -/i - O-S'-D-Z-Q-where Q is a substituted or unsubstituted aromatic group;

Z is -0-, -S-, -~-, -S-, _IINH_, -HNII-, -HNC-, -CNH-, -C-O- or -0-C-i D is unsubstituted or substituted hydrocarbylene;
R , R , R , R , R and R each independently is unsubstituted or sub--5b-~ Z:~3t~

stituted hydrocarbyl; and x, y and z each independently has a value from 0 to 100.
In one aspect, the invention of the parent application relates to poly-meric compositions containing said polysiloxane. These compositions include poly-amide, polyimide, poly(amide-imide), polyphenylene sulfide, polyepoxide, polyphe-nolic, polycarbonate, polyester, polyurethane and polysulfone. In an embodiment of this aspect, the invention of the parent application relates to the reaction product of a bis(amino) polysiloxane with an acid or anhydride to form part of apolyamide, polyimide or poly(amide-imide), to the reaction product of a bis(amino) polysiloxane with an isocyanate to form part of a polyurethane and to the reaction of a bis(amino) polysiloxane or an anhydride with an oxirane group to form part of a polyepoxide. Additionally, the invention of the parent application relates to the reaction product of a bis(hydroxy) polysiloxane with phosgene to form part of a polycarbonate, with a polycarboxylic acid to form part of a polyester, withdichloro-diphenyl sulfone to form part of a polysulfone and with formaldehyde toform part of a polyphenolic polymer. This aspect is also embodied in the reaction of a bis(chloro) polysiloxane with sodium sulfide to form part of a polyphenylene sulfide and in a bis(chlorosulfonyl) polysiloxane reacted via the Friedel-Craftsreaction -to form part of a polyarylsulfone or part of a polyether sulfone.
In another aspect, the invention of the parent application relates to solutions of polymers containing said polysiloxane and to coatings applied, films cast and to fibers spun from solutions of these polymers. The invention of the parent application also relates to molding, extruding, laminating and calendering compositions containing said polysiloxane, as well as to formed, shaped, lamina-ted and coated articles.
In another aspect the invention of the present application relates to bis(functionally-substituted) polysiloxanes and to methods for making these comp-ounds.
-5c-: .

O~

The unit of formula R' R2 _ ~ R Rl -Q-Z-D-Si- O-Si O-Si -O-Si O-Si-D-Z-Q-R~ R2 R4l L 1 6 R' x y z is derived from a bis(functiona.l) polysiloxane of formula F,-Q-Z-D-Si ~-S ~ -Slj~O-S;~O-Si-D-Z-Q-F, x y z where Flis a functional group attached directly to Q
or bonded via an intermediate aliphatic group Q is a substituted or unsubstituted aromatic group O O O O O
Z is -O-, -S-, -S-, -S-, -SNH-, -HNS-, -HNC-, . O O O
-CNH-, -C-O- or -O-C-;
D is unsubstituted or substituted hydrocarbylene R~, R2, R3, R~, R5 and R~ each independently unsub-stituted or substituted hydrocarbyl; x, y and z each independently has a value from O to 100.
Fl can be hydrogen,^chlorine, bromine, iodine, fluorine, -NCO, -NCS, -N20 N3, -NO3, -NO2~ oCNJ -OCN, -O-(Cl-C8) alkyl, -SCN, -S-(Cl-C8) alkyl~ -S-(Cl-C8) alkyl, ~O-(cl-ca) alkyl, -S-S-(Cl-C8) alkyl, ~OC(Cl~Ca) alkyl, ,. .
_C(C1_CB~ alkyl, -CHO, -CO(C~-Ca) alkyl, -COOH, -COSH, -C-SH, -C-OH, -S020H, SOOH, -SOH, -CONH2, -OH, -SH, -NRaRb where Ra and Rb each independently is hydrogen or lower alkyl or together with N form part of a heterocyclic group;

~' ;3104 ~, or Fl is alpha-oxirane or O ~ where the O
carbonyl groups are located ortho to each other.

-7- ~5~3~

F can be directly bonded to Q or bonded via an inter-mediate alkyl or alkoxy group of from 1 to 8 carbon atoms, an aryl group, or via an interme~iate Q-Z- group.
Q is an aromatic nucleus and can be carbocyclic or heterocyclic; it can contain one or more rings and can be unsubstituted or substituted by one or more groups that do not interfere with the use to which the unit will be put. Thus, Q can be carbocyclic aromatic of 6 to 18 ring carbon atoms such as phenylene, naphthylene, anthra-( 10 cenylene and phenanthrylene. Q can be unsubstituted or substituted by from 1 to 4 of: alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl of 2 to 12 carbon atoms, cycloalkyl of 4 to 3 carbon atoms, alkoxy of 1 to 12 carbon atoms, alkylthio of 1 to 12 carbon atoms, phenyl, a~kylphenylene having 1 to 12 carbon atoms in the alkyl group, phenoxy, phenylthio, alkylcarbonyloxy of 2 to 12 carbon atoms, phenylalkylene of 1 to 12 carbon atoms in the alkylene group, alkylcar-bonyl of 2 to 12 carbon atoms, alko,.ycarbonyl of 2 to 12 carbon atoms, bromo, chloro, fluoro, iodo, nitro, cyano, cyanothio, carboxy, carbonyl, hydroxy, mercapto, formyl, thioformyl and mercaptocarbonyl.
Q can also be substituted or unsubstituted hetero-cyclic aromatic of ~ to 18 ring atoms, where the hetero atoms are selected from N, 0 and S, such as pyridinyl, pyridazinyl, pyrimidinyl, pyrazinyl, furanyl, thio-furanyl, pyrrolinyl, indenyl, benzofuranyl, benzothio-furanyl, indolinyl, quinolinyl and isoquinolinyl;

~30~

substituents on the heterocyclic aromatic nucleus are selected from the same group as the carbocyclic aromatic nuclei.
Q can also be an aliphatic group; these tend to re-sult in lo~er thermal resistance and are thus useful where thermal properties are not essential.
D is substituted or unsubstituted hydrocarbylene such as branched or linear alkylene of up to 12 carbon atoms or said alkylene interrupted in the chain by phenylene.
Rl, R2, R3, R~, R~ and R6 each independently is unsub-tituted or substituted hydrocarbyl such as alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl o~ 2 to 12 carbon atoms, cycloalkyl of 4 to 8 carbon atoms, phenyl, alkylphenylene where the alkyl group con-tains 1 to 12 carbon atoms, phenylalkylene where the alkylene group contains 1 to 12 carbon atoms, alkenyl-phenylene with 2 to 12 carbon atoms in the alkenyl group.
When substituted, these hydrocarbyl groups can be substi-tuted by Br, Cl, I, F, -NC, -NO2, -gCN, alkoxy of 1 to 8 carbon atoms, -S-(C~-Ce) alkyl, -S-(C,-C8) alkyl, ~-(C,-C8) alkyl,-S-S-(C~-C~) alkyl, -COOH, -COSH, -CSCH, ~CONHa, -CN, -CHO, -CHS, -OH, -SH and ~NR7Ra where R~
and R8 independently are hydrogen or lower alkyl.
x, y and z each independently has a value from O to 100.
In a narro~er embodiment, x, y and z are all zero, Q
is mono-carbocyclic aromatic and the polysiloxane unit has the formula -9- ~2~

(R9)v Rl Rl (Rg) ~ Z-Dl-Si-O-Si-Dl-Z ~ v where ~ is 0 to 4 Rg is lower alkyl, lower alkenyl, lower alkynyl, cycloalkyl of ~ to 8 carbon atoms, l~wer alkoxy, lower alkythio, phenyl, loweralkylphenylene, phenylloweralkylene, loweralkenylphenylene, phenoxy, phenythio, loweralkylcarbonyl, loweralkylcarbonyloxy, loweralkoxycarbonyl, bromo, chloro, fluoro, iodo, nitro, cyano, cyanthio, carboxyl, carbonyl, hydroxyl, mercapto~ and mercapto-carbonyl;
O O O O O
Il 11 ll 11 11 Z is -0-, -S-, -S-, -S-, -SNH-,-HNS-, -CNH-, ll 11 11 O o O o ~I I 1 11 -HNC-, -C0- or -OC-;
Dl is methylene or alkylene of 3 to 8 carbon atoms;
Rl is lower alkyl, lower alkenyl, lower alXynyl, phenyl, loweralkylphenylene, phenyllower-alkylene, or loweralkenylphenylene.
In this embodiment the units of particular interest are those units where v is 0 or 1 Dl is methylene or alkylene of 3 to 8 carbon atoms and notably those where v is 0 or l Dl is methylene or alkylene of 3 to 8 carbon atoms and Rl is lower alkyl In a particularly preferred configuration of this embodiment, v is O
D is methylene, propylene or butylene, and Rl is alkyl of 1 to 3 carbon atoms.

In a speciYic embodiment, polymers contai~ the unit of formula:
CH3 C~3 ~ 0-(CH2)4-S -0-9 -(CH2)4- ~

15In another embodiment, the unit has the formula:
Rl ~ Rl~ Rl R I Rl -Q-Z-D-Si~0-Si~0-Sl~0-Si~L0-Si-D-Z-Q

where Q, Z and D are as previously defined and x has a value from 0 to lO0 y has a value from 0 to 20 20z has a value from 0 to 20 S~3~4~

' R' is unsubstituted hydrocarbyl of 1 to 18 carbon atoms;
R2 ~s alkyl of l to 12 carbon atoms;
~3 iS phenyl or al~ylphenylene of 7 to 18 car-bon atoms;
R4 is alkyl of l to 12 carbon atoms, phenyl or alkylphenylene of 7 to 18 carbon atoms;
R' is alkenyl of 2 to 12 carbon atoms or substituted alkyl of l to 12 carbon atoms;
R~ is alkyl of l to 12 carbon atoms, phenyl, alkylphenylene of 7 to 18 carbon atoms, alkenyl o~ 2 to 12 carbon atoms or substituted alkyl o~ 1 to 12 carbon atoms.
In the narrower embodiments, Q is mono-carbocyclic aromatic and the polysiloxane unit has the formula (R9~v R~ ~ Rl~ R;l~ Rl R' (Rs)v -Dl-Si- O-Si 0-Si 0-Si -0-Si-D,-z Rl R~ - R4 R6 R
x y z where v is 0 to 4 Rg is as previously defined O O O O
Z is -0-, -S-, -S-, -S-, -SNH- , -HNS- -HNC-O O O
Il 11 t~
-CNH-, -C0- or -OC-;

-12~

{ DA is methylene or alkylene of 3 to 8 carbon atoms;
R~ is lower alkyl, lower alkenyl, lower alkynyl, phenyl, lower alkylphenylene or phenyl lower alkylene;
R~ is alkyl of 1 to 12 carbon atoms;
R3 is phenyl, alkyl phenylene of 7 to 18 carbon atoms or aIkyl of 1 to 12 carbon atoms;
R4 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenylene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl;
R' is alkenyl of 2 to 12 carbon atoms or sub-stituted alkyl of 1 to 12 carbon atoms;
R6 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenylene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms, where the substituents are as previously indicated;
x has a value from 0 to 100 y has a value from 0 to 20 and z has a value from 0 to 20.
In a narrower embodiment, v is 0 or 1 D, is methylene or alkylene of 3 to 8 carbon atoms~
R' is lower alkyl R2 is lower alkyl R3 is lower alkyl or phenyl R4 is lower alkyl, phenyl, lower alkenyl or substituted lower alkyl.

-13- ~5~

R5 is lower alkenyl or substituted lower alkyl.
R6 is lower alkyl, lower alkenyl or substituted lower alkyl, the substituents on R4, R~ and R6 lower alkyls being independently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto;
x has a value from 0 to 100 y has a value from 0 to 20 and z has a value from 0 to 20.
In a still narrower embodiment, v is 0 or 1 Z is -O- or -S-D~ is methylene, propylene or butylene;
R~ is alkyl of 1 to 3 carbon atoms;
R2 is alkyl of 1 to 3 carbon atoms;
R9 is alkyl of 1 to 3 carbon atoms or phenyl;
R is alkyl of 1 to 3 carbon atoms, alkenyl of 2 to 4 carbon atoms or said alkyl substi-tuted by amino, cyano, hydroxyl or -CONH2;
R' is alkenyl of 2 to 4 carbon atoms or alkyl of 1 to 3 carbon atoms substituted by amino, cyano, hydroxyl or -CONH2;
R6 is alkyl of 1 to 3 carbon atoms, alkenyl of

2 to 4 carbon atoms or alkyl o~ 1 to 3 carbon atoms substituted by amino, cyano, hydroxyl or -CON~2; and x, y and z are as previously defined.

-14- ~æ~3~

The preparation of some compounds of general formula Rl ~ R2~ R3~ R~ R;
Rl R2 L ~ ~6 R~
~ y z is known in the prior art. Thus, British Patent No.
1,062,418, published March, 1967 discloses that linear polysiloxanes of formula fAr 1 Z-Si-C~ O~Si-O~Si-Z
R LR R
r m where the R groups) which may be the same or different~
are mono-valent organic groups, Z is a mono-valent organic group, a nitroaryloxyalkyl group, an aminoaryloxyalkyl group or an aminonitroaryloxyalkyl group and r and m, which may be the same or different, are zero or positive integers, can be prepared by reacting together the sodium salt of a suitably substituted phenol or naphthol with a haloalkylsiloxane of suitable formula such as ~r -haloalkyl siloxane. The reaction is conducted at a temper-ature of 20 to Z00C in a solvent such as methanol or ethanol at pressures ranging from atmospheric to 40 at-mospheres.
It has been found that yields on the order of 85ao or -15- ~z5~30~

greater can be can be achieved when a compound of formula F,-Q-Z-M
where Fl, Q and Z are all as previously defined and ~
is an alkali or alkaline earth metal is reacted ~ith a bis (halohydrocarbyl) disiloxane of formula Rl Rl X-D-Si-0-Si-D-X

R' R
where D and R' are as previ~usly defined and X is C1, Br or I at ambient pressure, at a temperature of from ambient (20C) to 200C in the presence of a dipolar aprotic liquid.

This reaction is often highly exothermic and sensi-tive to the presence of oxygen. The reaction is there-fore preferably conducted under an inert atmosphere and in the absence of even trace amounts oi' water i~ one of the reactants is an alkoxy- or aryloxysilane or -poly-siloxane. The reaction medium contains a dipolar, apro-tic liquid such as dimethyl sulfoxide, N,N-dimethyl-formamide, tetramethylurea, N-methyl -2- pyrrolidone or hexamethylphosphoramide. The dipolar, aprotic liquid constitutes from 1 to 10070 by weight of the reaction medium, preferabiy from 20 to 50~0 by weight. Any re-maining portion of the reaction medium consists essen-tially of at least one liquid hydrocarbon boiling from 40 to about 200C under atmospheric pressure.

30~

The purpose of the liquid hydrocarbon is to facilitate the removal, by azeotropic distillation, of any water present in the reaction mixture. Preferably, the bis-(haloalkyl) siloxane is gradually added under anhydrous conditions to a reaction mixture containing the aforementioned metal salt and a dipolar, aprotic solvent.
When the addition is complete and any exothermic reaction has subsided, it is often desirable to heat the reaction mixture at from 70 to about 150C for seve-ral hours to ensure substantially complete conversion of the reactants to the desired product. The compounds, many of which are colorless, high-boiling, visc-ous oils, are soluble in the reaction medium and readily isolatable by removal of the aforementioned dipolar aprotic liquid and any liquid hydrocarbon present.
Some of the compounds may darken if exposed to light or air for extended periods of time.
It is believed that the dipolar aprotic liquids function by their abil-ity to solvate both salts and organic substrates. Further, these materials being cationic solvating compounds, leave the anion associated with the cation unencum-bered and reactive. The dipolar aprotic liquids, while effective, are often cos-tly, frequently hard to purify, dry and maintained in an anhydrous state, and they are difficult to recover once the reaction is complete. It has been found that the dipolar aprotic solvents can be eliminated and the disiloxanes can be prepared in virtually any non-polar solvent, such as a straight ~25~30~
hydrocarbon solvent, in the presence of a phase trans-fer catalyst.
Thus, the reaction can be conducted in aliphatic hydrocarbon liquids such as hexane, heptane and octane, and aromatic hydrocarbon liquids such as the alkylated aromatics including toluene, xylene and mixtures thereof.
The reaction can also be conducted in chlorinated hydro-carbon solvents such as chlorobenzene and dichlorobenzene.
The phase transfer catalyst is believed to proceed as follows. There are two immiscible phases, a hydro-carbon phase containing the disiloxane and a solid phase comprising the salt. Because the salt is insoluble in the hydrocarbon phase, there will be no reaction in the absence of interfacial phenomena. In the presence of a phase transfer Gatalyst, however, an exchange of anions between the catalyst and salt takes place; the anion capable of functioning as a nucleophile is brought into the hydrocarbon phase, where reaction can take place with product formation. Thus, the phase transfer process re-lies on the catalytic effect of certain compounds to solubilize, in organic solutions, otherwise insoluble anionic nucleophiles. The increased reactivity and solubility in nonpolar media allows the reaction to proceed at relatively mod~rate conditions.
~nown phase transfer catalysts include the quaternary onium compounds, macrocyclic crown ethers and cryptates.
The quaternary onium compounds are derivatives of phos-phorous, arsenic, nitrogen, antimony or bismuth and have -18~ 30~

the general formula:

(R~M)y (~) where each R is independently selected from alkyl of 1 to 20 carbon atoms, alkènyl of , to 20 carbon atoms aryl of 6 to 20 carbon atoms arylalkylene or alkylarylene of 7 to 40 carbon atoms;
M is P, As, N, Sb or 3i;
is an anion, and y is 1 or more, to balance the electron charge.
Quaternary phosphonium and ammonium compounds are generally the most available and therefore are preferred.
Typical anions include halide, sulfonate, sulfate, borate, fluoroborate, phosphate, bisul~ate and fluoro-phosphate. The halides are most generally available.

~epresentati~e quaternary onium compounds include tetrabutylammonium chloride tetrabutylammonium bisulfate cetyltrimethylammonium bromide triphenylbenzylphosphonium chloride tetrabutylammonium cyanicle tetrabutylammonium fluoride tetrabutylammonium iodide tetrabutylammonium hydrogen sulfate tetrabutylphosphonium chloride -19- ~5~3()~

benzyltriethylammonium bromide benzyltriethylammonium chloride benzyltrimethylammonium chloride benzyltrimethylammonium fluoride hexadecyltriethylammonium bromide hexadecyltriethylphosphonium bromide hexadecyltrimethylammonium bromide hexadecyltrimethylammonium chloride C dibutyldimethylammonium chloride decyltriethylammonium bromide hexadecyltributylphosphonium bromide hexyltriethylammonium bromide dodecyltriethylammonium bromide methyltrinonylammonium chloride methyltriphenylammonium bromide octyltriethylammonium bromide tricapylmethylammonium chloride tetraethylammonium chloride trioctylethylphosphonium bromide trioctylmethylammonium chloride trioctylpropylammonium chloride tetrapropylammonium bromide tetraphenylarsonium chloride -20- ~z5~0~

tetraphenylphosphonium chloride tetraphenylphosphonium iodide benzyltrimethylammonium hydroxide tetradecyltrimethylammoniu~ bromide tetraethylammonium p-toluene sulfonate tetramethyla~onium tetrafluoroborate C tetrapropylammonium hexafluorophosphate The phase txansfer catalyst can be a macrocylic crown ether.
Macrocyclic crown ethers are well-known to those skilled in the art. C.J. Petersen in an article entitled "Cyclic Polyethers And Their Complexes With Metal Salts", Journal of the American CheDical Society, 89: 26, December, 1967, Pages 7017-36, describes macrocyclic crown ethers which are cyclic structures ha~ing 12 to 30 ring members.
?~any of the ring members are oxygen. Macrocyclic crown ethers are known to complex cations, such as alkali metals.
Other articles describing macrocyclic crown ethers are "Chemistry of the Preparation of Some ~acrocycles", M.R. Crawford, S~E. Drewes and D.A. Scitton, Chemistry and Industry, October 17, 1970, Pages 1351-1352 and "Synthesis of New ~acrocycles Part 1, ~ono~eric and Di-meric O-Phthalate Esters", S.E. Drewes and P.C. Coleman, -21- ~3~4 C Journal Chemical Society Parkin I, 1972, Pages 2148-53.
The three crown ethers which have been most widely used are:
dibenzo-18-crown-6:
r-~O ~
`r~

~0 c dicyclohexyl-18-crown-6:

/--` --1 C~ ~0 ' ol, J
and 18-crown-6:

~0 0~
~1 Other crown ethers include benzo-15-crown-5, 12-crown-4, cyclohexyl-15-crown-5 and octamethylcyclo-tetrafur-furylene.

The phase transfer catalyst can also be a macrotri-cyclic diaminopolyether such as the 2.2.2.-cryptate of formula ~\~0~ , i / ~ ~Q~ ~

The amount of phase transfer catalyst material re-quired to effect the desired chemical reaction may vary 30~

from as little as 0.01 mole percent of the total starting material to lO0 mole percent or greater. There is no benefit derived by the employment of molar quan-tities of lO0 percent or greater, and such usage often becomes economically imp-ractical. It is preferred to use from about 0.1 mole percent to lO mole percent of phase transfer catalytic materials.
In practicing the process, the alkali metal salt F -Q-Z-M
is formed by reacting an appropriate precursor with an alkali metal hydroxide solution. Then an azeotroping solvent is added, the mixture refluxed and water removed to provide an anhydrous system. When no more water is being produced, the temperature is reduced to about 20C below the boiling point of the reactionmixture. At this point the phase transfer catalyst is added and the siloxane-containing halide is added dropwise to accomplish the coupling reaction. After addition is complete, the mixture is maintained at a temperature of 60 to 200Cfor from 3 to 12 hours to complete the reaction. The mixture is filtered to rem-ove salts and the product recovered by distillation.
The preparation techniques discussed to this point are related to disi-loxanes, i.e. the case where x, y and z is each 0. It is possible however to open the disiloxane chain and insert a plurality of - ~ 2i6 -23- ~5~3~4 units, where R indicates a member selected from the group defining, R2, R9, R4, R' and R6.
The technique is of interest where it is desired to modify the properties of the disiloxane unit. For ex-ample, as the value of x, y and z increases, the siloxane unit becomes more elastomeric and polymers containing the same will become more flexible. Further, by incor-porating an alkenyl or alkynyl-containing siloxy unit, the polysiloxane can be cross-linked to provide a tougher, less elastomeric polymer.
The siloxy groups of formula --S i--O--are obtained from cyclic polysiloxanes of gener21 formula ~ JD~\

where R is as previously defined s is 3 or greater ~5 t is O or an integer between 1 and 100 When t is 2 or more, the R groups on any silicon atom are independent of any other R groups.

-24- ~ 5~!3a4 Since a siloxy group of formula R~ -6 --S i--O

is being inserted into the disiloxane and these groups are obtained from a cyclic polysiloxane, it is apparent that the cyclic polysiloxane undergoes scission to be-come a source of the groups. Thus, for example, the molecule hexamethylcyclotrisiloxane cleaves according to the following pattern to provide three dimethylsiloxy groups:

H3C - Si ~ ~ Sl CH3 ________. ._____ I \
~ I ~ CH3 O ~" O
\ /' ' ,Si C~I 3 \ C}I 3 In practice, the disiloxane is simply heated at a temperature of from about 85 to about 250C with an appropriate source of siloxy groups, or mixture, in the presence of a catalyst. When the substituents on Q are basic, such as amino, or neutral such as halogen, the catalyst will be an alkali metal hydroxide, a quaternary ammonium hydroxide, a quaternary phosphonium hydroxide, a quaternary ammonium or phosphonium silanolate with c or without the incorporation of a macrocyclic crown ether.
Typical catalysts include potassium and sodium hydro~ide, tetramethyl ammonium hydroxide and tetrabutyl phosphonium hydroxide.
When the substituents on Q are acidic in character, such as carboxyl and phenolic hydroxyl, the catalyst will be a strong acid such as hydrogen chloride, sulfuric, tri-fluoroacetic, trifluoromethanesulfonic and other organo-c sùl~onic acids.
The catalyst can be used in an amount ranging from 30 to 50 parts of catalyst per million parts by weight of silicon compou~ds present to from 3 to 5 percent by weight of the silicon compounds.
To obta~n a unit of given value for x, y and z one reacts one mole of disiloxane with that amount of a com-pound capable of yielding x moles of the siloxy group:
RZ

--s i--o with that amount of a compound capable of yielding y moles of the siloxy group -Si-0 and with that amount of a compound capable of yielding z moles of the siloxy group --S i--O

-26- ~2~04 The chemical reaction is co~plete when the viscosity of the reaction mixture reaches a constant level or when the temperature of the reaction mixture can be raised to a level above that of the highest boiling cyclic poly-siloxane starting material. Another indication of com-plete reaction is the change in the solution from a two-phase or multi-phase mixture to a single phase reaction mixture.
When the reaction is complete, the catalyst is neu-tralized. Where the catalyst is a quaternary ammonium or phosphonium silanolate, heating to about 163-170~C
will effect decomposition. The basic catalysts can be neutralized with mineral acid while the acid catalysts can be neutralized with an alkali metal hydroxide or ~arbonate.
The reaction mixture is thereafter cooled, filtered and, if desired, distilled under reduced pressure to recover the product in pure form.
The percentage of functional groups in the final pro-duct is determined by titration, in known manner.
As indicated previously, the disiloxane is reacted with a compound capable of generating a desired siloxy group. Such compounds include:
hexamethylcyclotrisiloxane octaphenylcyclotetrasiloxane octamethylcyclotetrasiloxane 1, 3, 5, 7-tetramethyl-1, 3, 5, 7--27 ~`30g C tetravinylcyclotetrasiloxane and 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetraphenylcyclotetrasiloxane.
The polysiloxanes can be incorporated into a variety of polymeric compositions to modify the properties there-of. The polysiloxanes impart flexibility, elongation and impact resistance; they impart resistance to U.V.
and other radiation, resistance to ozone, resistance to corona discharge and resistance to oxidation; they lower the glass transition temperature (Tg) which facilitates processing and fabrication of high molecular weight materials; they lower the surface tension and reduce the coefficient of friction; they increase solubility, in-15 crease resistance to acid and increase permeability to gases.
Among the more significant properties contributed by these polysiloxane units is their surprising heat resis-tance. As a consequence of their thermal stability, one can obtain higher molecular weight compositions than is possible using prior art materials; further, these poly-siloxanes and compositions containing them can be pro-cessed at elevated temperatures. In addition, the pre-sence of th0 aromatic group imparts improved resistance to corrosion because there is a reduced tendency to form salts with metals and corrode or contaminate a given system.

, The relationship of the polysiloxane units to various polymeric compo-sitions will be discussed in detail with respect to each of these compositions.
1. Polyimides Polyimides are prepared by reacting a dianhydride with a diamine:
O O

0/ \A/ \0 +H2N-B-NH2 >
o lo lo ~ ~cY~c~ ~c~ c~ t Polyimides containing silicon have been prepared using bis-aminoalkyl-ene siloxanes as part or all of the diamine; such polyimides are illustrated by United States Patents 3,740,305 and 4,030,948. These polyimides, while useful as protective coatings for semiconductors and other electronic devices, suffer from the defect that they are insoluble in virtually all of the common organic solv-ents. The half-amide, however, is soluble and so it has been the practice to form the half-amide:

~ C ~ ~
- -C- - - -B- -C- -C-~-B-HOO OOH HOOC COOH

~304 and to provide the half-amide, in suitable solvent such as dimethyl sulfoxide or N-methyl pyrrolidone to the ultimate user. This solution is applied to the substrate and the coated substrate is thereafter heated to evaporate the solvent and to convert the half-amide to the corres-ponding polyimide:

O O

( -N-C-~-C-N-B~ -N~ ~ ~ -B-OC C0 0 0 +H 2 This procedure has several significant drawbacks.
First, is the requirement that the substrate be exposed to temperatures on Ihe order of 150 to 300C required to convert the half-amide to the imide; many semiconductor devices cannot accept these temperatures. Second is the proposition that if imidization is not complete, the amide linkages will gradually hydrolyze, causing degra-dation of the protective coating; this is particularly so under acid conditions. Third is the requirement that a protective coating be built up gradually from a succession of very thin coatings. If a thick coating is applied and heated to effect conversion of the half-amide to the imide, the water formed during the reaction can be converted to steam, which tends to produce voids in the coating.
Further, as the imidization proceeds from the surface down-ward, the bottom of the coating is insulated from the heat;

-30- ~ S~ ~04 this makes completion of the imidization reaction difficult to achieve, or even to identify. Thus, it is necessary for the ultimate user to engage in a series of coating, heating and cooling cycles in order to develop an acceptable protective coating. Additionally, incomplete imidization presents usage problems in con-nection with electrical and electronic devices; the poly (half-amide), because of the free carboxylic acid group, will conduct electricity and can contribute to leakage and to deterioration of a device. Stated a~other way, the electrical dissipation factor is higher for the poly (half-amide) than for the corresponding polyimide.
Finally, the presence of ~ater produced by the imidiza-tion reaction is unacceptable in a semiconductor environ-ment, where moisture can drastically reduce the useful life of a component.
It is now possible to have a polyimide capable of being applied as a protective coating in the form of an imide rather than in the form of a polyhalf-amide so as to eliminate the problems associated with applying and re-acting the half-amide.
Polyimides containing the unit R~ ~ R~ Rl~ Rl Rl -Q-Z-D-Si- 0-Si _ 0-Si _ 0-Si -0-Si-D-Z-Q-ll ,1' x 14 y 16 z ll display une~pected properties that make them suited for a variety of applications.

3~4 In one aspect, the invention of the parent application relates to poly-imide compositions containing said polysiloxane. One embodimen-t of this aspect relates to the polyimide reaction product of a dianhydride with a bis(amino)-polysiloxane of formula H2w-Q-z-D-si - L-~l _ O_5 :l - O-S -D-Z-~-WHz another embodiment of this aspect relates to the polyimide reaction product of a dianhydride, an organic diamine and the indicated bis(amino)polysiloxane.
It has been found that polyimides containing the siloxane unit descri-bed above are soluble in conventional solvents, such as halogenated aromatic hyd-rocarbons and dipolar solvents. Thus an embodiment relates to solutions of poly-imides, to polyimide coatings applied by evaporation of solvents, to films cast and to fibers spun from solutions of these polyimides.
In another aspect the siloxane-containing polyimides have been found to be thermoplastic, capable of being formed and shaped as by molding, extruding or calendering. An embodiment of this aspect relates to molding compositions com-prising a siloxane-containing polyimide.
In yet another aspect, the siloxane-containing polyimides have been found to possess improved adhesion to a variety of substrates. In one embodiment of this aspect the polyimides are employed as wire coatings and as coatings for filaments of metal, glass and ceramic. In another embodiment, the polyimides are used as adhesives. In still another embodiment, the polyimides are used as prim-ers or adhesion promoters between a substrate, such as glass, metal and ceramic, and a matrix such as epoxy, polyester, phenolic and rubber. They are also used as hot melt adhesives.

3~4 The reaction between the diamine and dianhydride proceeds stepwise, with the formation of the poly (half-amide) being the first step and cyclization to the polyimide being the second step. As indicated, the half-amide is more soluble than the polyimide and for certain coatings applications, where the poly-imide has been formulated to be highly resistant to solvents or even thermoset, it is necessary to apply the half-amide and thereafter cure in situ. One aspect therefore relates to the poly (half-amide) intermediate containing the indicated siloxane unit.
The siloxane-containing polyimides include the reaction product of an aromatic or aliphatic tetracarboxylic acid dianhydride with a polysiloxane of formula L ~X ~Y Z

i:~ 5~ 3~T 4 where the various elements are all as previously defined to pro-vide a polyimide containing the unit Rl R2 R R5 IRl _Q_Z~ ~li ~ 0-1. . O-Si -O~ DLZ-Q -Rl R2 3 R~ j R6 z Rl As indicated, Q can be carbocyclic arcmatic, such as phenylene, naphthylene, anthracenylene and phenanthr~Tlene, that is optionally substituted. The substituents on Q can be any that do not inter-10iere with the ability to rP~rt to ~orm an ~m1de. Thus, Q can be substituted by ~rcm 1 to 4 substituents, as previously de~ined.
As indicated, polyimides are prepared b~ the reaction of a dianhydride with a diamine. The dianhydride can be represented by the ~ormula ~ C ~ ~ C~

where A is the tetravalent residue of a tetracarboxylic acid anhydride. Thus, the polyimide will contain at least one unit of iorm~la: O
1) 11 - N~ / A ~ ~ -B -Il 11 O O
where -B_ is the unit RL ~ Ri ~ ~3- R~
~Z-~Si- O si ~si- ~ ~si ~i ~z~
_ 12 ~ 1 T

--3~--~30~
In the dianhydride of general fon~a O O

~C~ ~C' ll 11 A is a tetravalent radical selected fr~ substituted and unsu~
stituted aliphatic, cycloaliphatic, heterocyclic, ar~tic ~roups and canbinati~ns thereof. Thus, A, can be a tetravelent ben~ene or naphthalene nucleus or a tetravalent ~oup of foImula (E ) O O O
Il 11 11 where m lS O or 1 and E is ~, -S-, -S-, -S-, -C-, or-C~I2~-where y is an integer from 1 to 8.
In this embodiment, A is illustrated by:

~' .

~~
~

-35- ~æ~3~

~ ~
3~

3~1C ~

and specific anhydrides include pyromellitic dianhydride, 3,3J,4,4'-benzophenone tetracarboxylic d;~nhydride 2,2',3,3',-benzophenone tetracarboxylic dianhydride, 3,3',4,4',-diphenyl tetracarboxylic dianhydride, 2,2',3,3'-diphe~yl tetracarboxylic dl~nhydride~
2,2-bis-(3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis-(2,3-dicarboxyphenyl) porpane dianhydride, Bis-(3,4-dicarboxyphenyl) ether dianhydride, Bis-(3,4-dicarboxyphenyl) sul~one dianhydride Bis-(3,4-dicarboxyphenyl) sulfide dianhydride 1,1-bis-(2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis-(3,4-dicarboxyphenyl) ethane dianhydride, Bis-(2,3-dicarboxyphenyl) methane dianhydride Bis-(3,4-dicarboxypheQyl) methane dianhydride, 2,3,6,7-naphthalene tetracarboxylic dianhydride, 1,2,4,5-naphthalene tetracarboxylic dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, Ben~ene-1,2,3,4-tetracarboxylic dianhydride Perylene-3,4,9,10-tetracarboxylic dianhydride Pyrazine-2,3,5,6-tetracarboxylic dianhydride Thiophene-2,3,4,5-tetracarboxylic dianhydride C naphthalene-1,4,5,8-tetracarboxylic d;~nhydride decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride

4,8-dimethyl-1,2,3,5,6,7-hexahydroDaphthalene-1,2,5,6-tetracarboxylic dianhydride 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride 2,7-aichloronaphthalene-1,4,5,8-tetracarboxylic di~nhydride 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dia~hydride phenanthrene-1,8,9,lO~tetracarboxylic di~nhydride cyclopentane-1,2,3,4-tetracarboxylic dianhydride pyrrolidine-2,3,4,5-tetracarboxylic dianhydride pyrazine-2,3,5,6-tetracarboxylic dianhydride 1,2,3,4-butane tetracarbo~ylic dianhydride 3,4,3',4'-benzophenone tetracarboxylic dianhydride azobenzene tetracarboxylic dian_ydride 2,3,4,5-tetrahydro~uran di~nhydride p-phenylenebis(trimellitate) ~nhydride 1,2-ethylenebis(trimellitate) anhydride 2,2-propanebis~p-phenylene trimellitate) anhydride 4,4'-{p-phenylenebis(phenylimino)carbonyl diphthalic}
anhydride iL~5~`3a~

4,4'-diphenylmethacebis(trimellitamide) anhydride and miKtures thereof.

A can also be the tetravalent residue of formula ~ - G - ~
where G i~ phenylene or a group of formula ~k where ml is 0 or 1 and E~ is selected from the same group as E.
In this e~bodiment, A is illustrated by =~}~~'~~

~5 ~11 ~0 ~Z~30~

~ CH ~
oH3 ~-'~

~_O~o~O~

~~-~0 ~S~

Similarly, and by analogy, the ether linkage can be replaced by -S-, O O
-S-, -S- or -COO- to provide useful dianhydrides.
o Because of relative availability, some of the preferred species of aro-matic dianhydrides are:
pyromellitic dianhydride benzophenone tetracarboxylic acid dianhydride diphenyl tetracarboxylic acid dianhydride -39- ~5~30~

bis (3,4-dicarboxyphenyl) sulfone dianhydride { 2,2-bis(3,4-dicarboxyphenyl) propane dianhydride 2,2-bis[4,4'-di(3,4-dicarboxyphenoxy)phenyl~
propane dianhydride p-bis(3,4-dicarboxypenoxy) phenyl dianhydride 4,4'-bis(3,4-dicarboxyphenoxy) diphenyl dian-hydride bis-[4,4'-di(3,4-dicarboxyphenoxy)phenol]
sulfone dianhydride bis[4,4'-di(3,4-dicarboxyphenoxy)phenyl]
sulfide dianhydride The anhydride can also be aliphatic in nature, such as cyclopentane tetracarboxylic acid dianhydride, cyclo-hexane tetracarboxylic acid dianhydride and butane tetra-carboxylic acid dianhydride.
The ether containing anhydrides can be prepared by coupling an appropriate xylene derivative, such as 4-bromoxylene or the alkali metal phenoxide of 4-xylenol, with an appropriate halide or aryloxide, via the Ullman Synthesis, using copper catalyst, ~ollowed by oxidation of the aromatic methyl groups and dehydration to effect ring closure.

~o ~ 3~

2 ~ + NaO ~ ~ (El) 7~ ONa l ~C
Cu H ~ - O ~ (E )m~ ~ - O ~ CH3 v X~no4 HOOC ,~ ~ ~ ~ COOH
HOOC ~ O ~ r (El)m~ ~ ~ O I \_ " ~ COOH

Glacial HAc \ ~Acetic Anhyd.

O O

O --~ ~(E~ ~o ~C' ~e anhydride component can be used alone or in combination with one or more other anhydrides.

-40a~ 04 The anhydride can also contain a siloxane and in another embodiment wherein A is a tetravalent residue of formula ~ O - G - O ~ , G can be a poly-siloxane-containing group of formula - D Si ~ O-Si ~ O-Si ~ O-Sl ~ O-Sl D -R ~ R2 1 I R4~ L 16 ~ 11 or Rl ~ R2 ¦ ~ R3 ¦ R51 Rl - Q - Z - D - Si to- s i ~ o s ~ o s i ~o Si - D - Z -Q-where the various elements are as previously described.
There is thus provided a variety of polysiloxane-containing dianhydrides of formulae o~ 3 O-D-S jO-S ~ -S ~ O-Si 1 O-S -D-O - ~ ~, and 0_~ ~ O-Q-D-Si-~O-S ~ 0-9~1_0-Si -O-S -D-Z-Q-O ~ ,0 -40b-capable of incorporating the polysiloxane into a polyimide to provide the beneficial aspects of the siloxane unit therein, and capable of incorporating the polysiloxane unit into such other polymers as epoxy resins, where their presence provides for greater flexibility than is now possible, together with the surprising temperature sta-bility previously discussed. These anhydrides are believed to be new, and in connection therewith the anhydrides may be presented by the formula Rl R2 - - ~ Rl F3~~Q'~Z')P~Q~Z~D~Si~ 0-Si- _ --~i r -0-Si- _o-fi-D-Z-Q-~z -Q ~ F3 Rl - R2- x R4_1y R6 where p = 0 or 1;
Q' is selected from the same group as Q;
Z' is selected from the same group as Z; and F3 is o ~ C where the carbonyl groups are located ortho to each other on Q' or Q, an~ the other elements are as previously defined.
The preferred embodiments, because of relative ease of synthesis are these dianhydrides where p = 0 or 1 Q and Q', each, is a phenyl group Z and Z', each, is oxygen or sulfur D is methylene, propylene, or butylene -40c-x has a value from 0 to 100 y has a value from 0 to 20 z has a value from 0 to 20 Rl is lower alkyl;
R is lower alkyl;
R is lower alkyl or phenyl;
R is lower alkyl, phenyl, lower alkenyl or substituted lower alkyl;
R is lower alkenyl or substituted lower alkyl;
R6 is lower alkyl, lower alkenyl or substituted lower alkyl; the substituents on R4, R5 and R6 lower alkyls being independently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto.
As described, the polyimides are formed from the reaction of a dianhydride and a diamine. The diamine can comprise solely one or more bis-amino polysiloxanes, as described, or it can comprise one or more organic diamines in addition to a bis-aminopolysiloxane. The organic diamine can have the general formula H2N-Y-NH2 where Y
is the divalent residue. Y can be aliphatic, including alkylene of 1 to 20 carbon atoms or cycloalkylene of ~ to 8 carbon atoms. In the preferred embodiment, to provide superior properties, Y is the residue of an aromatic diamine. Thus, Y can be phenylene, diphenylene, naphthylene or a group of formula .

-40d~ 304 ~-- RS {~

Where R5 is branched or llnear alkylene of 1 to 20 carbon O O o Il 11 ll atoms, -S-, -S-, -S-, -C-, or -0-. The aryl nuclei can be substituted by lower alkyl, lower alkoxy or ther non-interfering groups.

- -41- ~Z~3~

Among the organic diamines that are useful are:
m~phenylenediamine;
p-phenylenediamane;
4,4'-diam nodiphenylpropane;

4,4'-diaminodiphenylmethane (hereinafter referred to as "methylen2dianiline");
benzidine;
4,4'-di~m~nodiphenyl sul~ide;
4,4'-diaminodiphenyl sulfone;
4,4'-diaminodiphenyl ether;
1,5-diaminonaphtha1ene;
3,3'-dimethylbenzidine;
3,3'-dimethoxybenzidine;
2,4-bis(~-amino-t-kutyl)toluene;

bis(p-~-amino-t-bu~yl~phenyl ether;
bis(p-~-methyl-o-a~inopentyl)benzene;

1,3-diamino-4-isopropylbenzene;
1,2-bis(3-aminopropoxy)ethane;
m-xylylenediamine;
p-xylylen~ ine;
bis(4-amanocyclohexyl)methane;
decamethylenediamine;
3-methylheptamethylenedi~ine;
4,4'-dimethylheptamethylenediamine;

2,11-dodecanediamine;
2,2-dimethylpropylenedi~mine;

octamethylenediamine;
3-methoxyhexamethylenediamine;

30~

2,5-dimethylhexamethylenediamine;
2,5-dimethylheptamethylenediamine;
3-me~hylheptamethylenediamine;

- 5-meth~lnonamethylenedia~line;
l,~-cyclohexanediamine;
1,12-octadecanediamine;
bis(3-aminopropyl)sulfide;
N-methyl-bis-(3-aminopropyl)amine;
~ hexamethylenedi~mine;

heptamethylenediamine;

nonamethylenediamine; and mixtures thereof.

R can also be the group of formula -O-G'-O- where G' is phenylene or a group of formula ~ E3 where m is 0 or 1 and O O O

E is -0-, -S-, -S-, -S-, -C- or linear or O
branched alkylene of 1 to 8 carbon atoms.
This embodiment, which is believed to be novel~ is illustrated`by the following diamines:

H2N ~ 0 ~l ~ N~2 ~2N~ ~} ~

-42a-H2N ~ O ~ --~ NH2 H N ~ o~3 ~~ NH2 H2N ~0~} NH2 H2N ~~S~O~ NH2 H2N ~ O ~ S ~ NH2 Similarly, and by analogy, the ether linkage can be O O
Il 11 .
replace by -S-, -S- or -S-, to provide amines.

The diamines impart solubility to polyimides fabri-cated with them. They can be used as the sole amine com-ponent of a polyimide, they can be used in conjunction with -42b~ 30~

other diamines and can be used in conjunction with the bis(amino) polysiloxane, with or without other diamines, to provide polyimides whose properties such as Tg and solubility can be tailored for specific applications.
Y can also be the residue of a diamine macrocyclic crown ether.
Additionally, one can use a functionally substituted diamine as part of the diamine component to provide func-tional sites for grafting and cross-linking, for modifying the polyimide to become photosensitive, hydrophilic, antiseptic, fungicidal and the like.
The functionally substituted amine will have the general formula ,NH2 - I NH2 F
or INH2 l 1 Y _ -X- y_~3 NHz Zl or ~ 1 F3 H2N-Y~ X ~Y-NH2 Z

or 2 ~ ~ Y I X ~ Y NH2 where Y is an aromatic nucleus, X and Xa, independently, o are -0-, -S-, -S-, linear or branched alkylene of 1 to 20 o :

-~3-~æ~

atoms, or a carbocyclic or heterocyclic group containing from 6 to 14 atoms in the nucleus and the hetero atoms are selected from N, S and 0.
Zl and Z2' each independently, is 0 or 1 and when Zl and/or Z2 is 0, the adjacent aromatic nuclei may be fused, and F3 is a functional group.
The term "functional group" is intended to denote atoms or groups of atoms that confer characteristic chemical properties on the molecule containing said atoms. Thus, it will be apparent that the chemical composition of the functional group F3 can vary, depending on the character-istic chemical properties desired. F3 can be acrylyl, methacrylyl or other unsaturated group capable of free-radical initiated cross-linking; it can be the naphtho-quinone-diazide radical to provide U.~. sensitivity'; it can be a quaternary ammonium group to provide fungicidal activity or increased hydrophilicity. F3 can also be -C~

-C-Rm ~Rm Cl, Br, I or F
o {:H

5~30~

SH
~Rm {~

~XX~
o O
E',r~
-C-N~Rp -CN
,.

or -N~Rn ~Rp where Rm is hydrogen, alkyl of 1 to 7 carbon atoms or alkenyl of 2 to 7 carbon atoms.
Rn and Rp each independently is hydrogen, alkyl of 1 to 7 carbon atoms, alkenyl of 2 to 7 carbon atoms, or -C-Rq where Rq is alkyl of 1 to 7 carbon atoms.
Aromatic nucleus Y can be mono-carbocyclic aromatic or polycarbocyclic aromatic of 6 to 1~ carbon atoms such as benzene, naphthalene anthracene etc. These nuclei can be further substituted by non-interfering groups, such as lower alkyl.
The nucleus Y can also be heterocyclic aromatic of

6 to 20 atoms while the hetero atoms are one or more of ~LZS~3Q~

N, O and S, such as pyridine, pyrimidine, pyrazine, oxadiazine, oxathiazine, triazine, benzofuran, thio-naphthene, indole, quinolïne, benzoxazole, benzothiophene>
and carbazole.
Specific compounds include 2,4-di~;no-chlorobenzene 2,4-diami~othiophenol 2,4-diaminophenol 3,5-diaminobenzoic acid methyl-2,4-diaminGbenzoate 2,4-diaminoacetamide l-~para-carbamethoxyphenoxy)-2,4-diaminobenzene p-(2,4-diaminophenoxy) acetamilide 3-mercapto-~ no-4-aminobiphenyl 1(2'-cyanophenyl)-2,5-diaminonaphthalene -46- ~2S~'i3~)4 C The polyimides containing the siloxane unit will contain the group of formula:
O

-N `A ~ ~ N-B-~ C~ ~ C~
Il 11 O O

where A and B are as previously defined. The imide is ~ormed from the corresponding half-amide:

O O
-N-C- - C-N-B-H ~A~ H
oC C

1~
It is apparent that there are a number of variables available to the chemist in formulating useful polyimides.
The variables include the anhydride, the siloxane and the amine.

As indicated previously, the anhydride can be di-ether containing:
O O

~ C_ ~ o - G - 0 ~ ~1 ~0 O O

-47~ 3~

where & has been defined, or non-diether containing:

~ ~ ~ ~ ~ and 0~ C - ~ ~ ~ -of`o o o o o where E and m have been defined.
As a general proposition~ the polyimide formed from a non-diether containing dianhydride and an aromatic dia-mine are thermoset in nature and are insoluble in organic solvents. In an attempt to work with these materials, the art has adopted several approaches. One involves preparing the poly(half-amide), which is solllble and tractable and, after the material is in place, or has been shaped or formed, heating to form the imide. The second approach has involved selection oi the diamine.
One researcher found that phenylindane diamines have a solubilizing effect on aromatic polyimides and that when as little as 20 mole percent of a diamine is replaced with a phenylindane diamine, a soluble polyimide is ob-tained. Bateman et al, U.S. Patsnt 3,856,752.

Other researchers have used a combination of twodifferent diisocyanates (methylene diphenyl diisocyanate and toluene diisocyanate), which because they react with 30~

anhydrides to form polyimides, are t~e functional equivalent of the amines. One may speculate that by reducing the symmetry of the polymer, the crystallinity is reduced and the solubility is correspondingly in-creased.
A third approach involves the use of diether con-taining anhydrides; prior art polyimides based on these anhydrides, although soluble and tractable, have de-~iciencies that detract from their use as films, fibers and protective coatings. Thus, they have poor adhesion to most substrates, poor elongation and poor flexibility.
They display very high leakage currents on semiconductor devices and virtually no resistance to corona and other radiation; embrittlement is possible and low temperature properties are poor.
It has been found that the polyimide obtained from an anhydride, whether diether containing or not, and a siloxane as described, displays properties that are totally unexpected. The polyimide is thermoplastic and soluble; in this context, solubility refers to both variety of solvents as well as to concentration. The polyimide is soluble in chlorinated hydrocarbon solvents such as dichlorobenzene and trichlorobenzene, as well as in polar solvents such as N,N-dimethyl.acetamide, N-methyl caprolactam, dimethylsulfoxide, N-methyl-2-pyrrolidone, tetramethyl urea, pyridine, dimethyl-sulfone, hexamethylphosphoramide, tetramethylene sulfone, formamide, N-methylformamide, butyrolactone and N-3~

acetyl-2-pyrrolidone. Concentrations of polyimide on the order of 0.05% to about 60% by weight of solids are achievable, depending on the composition of the particular system.
In addition to being soluble, these polyimides are resistant to high energy radiation including corona discharge, U.V. and nuclear radiation (alpha-particles) and display tenacious adhesion to a variety of sub-strates, organic and inorganic, without the use of primers.
These siloxane-containing polyimides adhere to glass, ceramic" metals, including gold, copper, stainless steel, nickel, aluminum, titanium and beryllium, and all manner of plastics, including phenolic, epoxy and poly-imide (eg, Kapton~).
One deficiency exhibited by the polyimides of the prior art is a noteable lack of adhesion. Films of polyimides containing the siloxane described herein will withstand immersion in boiling water for more than six hours; prior art polyimides lose adhesion and peel away from a substrate in less than 20 minutes.
The tenacious adhesion and resistance to thermal shock displayed by polyimides containin~ the siloxane unit are illustrated by a thermal cycling test whereby a polyimide coated onto a substrate is subjected to a temperature of -65C for two minutes followed by immediate exposure to a temperature of 150C for two minutes; the cycle is thereafter repeated. Polyimides containing the siloxane unit sur~ive one hundred cycles with no loss of ~'~S~3~

adhesion. Further, there is no loss of electrical properties when the substrate is a semiconductor component and the coated device is subjected to one hundred thermal cycles.
Polyimides containing the siloxane unit are far more flexible than are prior art polyimides. Thus, a siloxane-containing polyimide has an elongation on the order of 30% whereas other polyimides have an elongation of 6% to 18%. Bec~
ause of the higher elongation, these polyimides can be fabricated into useful films and fibers.
Polyimides containing the siloxane unit can be processed quite readily since they have much lower Tg (second order transition temperature) than prior art materials - on the order of 140C as compared with 350C for conventional polyimides. This means that they will melt and flow more readily than prior art polyimides; the polyimides containing the siloxane unit are thus particularly useful for potting and encapsu~ation, as well as for transfer molding applicat-ions. The Tg of a given polyimide containing the siloxane can be increased by increasing the amount of aromatic diamine in the polyimide.
One advantage of the siloxane unit is its remarkable heat stability.
Polyimides containing bis-alkylene disiloxanes are relatively heat sensitive, a factor that makes synthesis of high molecular weight polymers difficult since gelation tends to occur upon extended heating at about 200C. One would have ex--51- ~ 3~)~

pected the siloxanes described herein to be equally heat sensitive, if not more so. Surprisingly, the siloxane and polymers containing this unit exhibit impressive resistance to elevated temperature. ~or example, a polyimide derived from bis-aminophenoxy-butyl disiloxane and benzophenone tetracarboxylic di-anhydride resists temperatures up to 500C before ex-t~nsive degradation, as determined by thermogravimetric analysis.
A consequence of this temperature resistance is the ability to maintain coreactants for longer times at higher temperaturés to achieve higher molecular weights than is possible with polyimides containing the bis-alkylene disiloxane group.
The polyimide, and therefore the poly (half-amide), derived from an amine component and an acid or anhydride component can have part or all of the amine component replaced by the amine of formula Rl ~ R2- I ~ 7 I 1 H2N-Q-Z-D-7i ~-Si 0-Si 10-1Si 0-Si-D-Z-Q-NH2 R~ l R2 R4 ¦ R6 R~

Solubility of the resulting polyimide will be affected by the nature of the dianhydride, the concen-trations of the siloxane in the polymer and the value of x, y and z. For example, a diether-containing an-hydride will yield a polyimide soluble over all combi-nations of organic diamine and siloxane. Not only is the -52- ~Z~ 304 resulting polyimide soluble in the chlorinated hydro-carbon solvents and polar solvents previously described but, where it contains a siloxane unit, the polyimide is soluble in a solvent which is derived from monoalkyl and/or dialkyl ethers of ethylene glycol and condensed polyethylene glycols and/or cyclic ethers containing no less than a 5 member ring, such as diglyme (diethylene glycol dimethyl ether) at standard temperature and pressure.
Polyimides derived from a non-diether containing anhydride and a disiloxane have limited solubility in di-glyme but are moré soluble in the polar solvents previously discussed such as N-methyl-2-pyrrolidone and in phenolic liquids, such as cresylic acid (methyl phenol). Solu-bility increases, however, when a polysiloxane is pre-sent in the polyimide. ~or example, the polyimide de-rived from benzophenone tetracarboxylic dianhydride and the bis (aminophenoxybutyl) polysiloxane where R2 is methyl,x is 6 and y and z are 0 in the formula above, is soluble in warm diglyme to provide a 25% by weight solution.
When the solids content of the solution is 25% or greater at room temperature, the solubility of the pol~-imides in the solvent is best when the siloxane content of the polyimide is greater than 40 mole percent. The solubility of the polyimide increases considerably when the siloxane content is above 40 mole percent; as indica-ted one can prepare solutions wherein the polyimide has 53 ~5~)4 ^ included 100 mole percent siloxane.
At siloxane contents of less than 40 mole percent one may experience difficulty in achieving solubility at room temperature in a reasonable time for 25 percent solids solution. ~owever, with the application o~ heat, solution is achieved.
When the solids content is reduced to less than about 25 percent solids, solution of the polyimides c composition is more easily obtained at room temperature.
As the solids content increases above 25 percent in the solution, and the siloxane content of the poly-imide is below about 40 mole percent, dissolution of the solids becomes increasingly difficult to achieve at room temperature, but is readily achieved with heating to high temperatures.
~ne may conclude that the silicone in the polyimide tends to salubilize the system. That is the siloxane tends to make the polyimides soluble in a greater class of solvents. The greater the siloxane content of the polyimide, the more soluble it becomes in a given solvent.
Solubility in a solvent derived from monoalkyl and/
or dialkyl ethers of ethylene glycols and condensed poly-ethylene glycols and/or cyclic ethers containing no less than a 5 member ring such as diglyme has another advantage over the other solvents previously employed. It is now possible to prepare solutions of polyimides which can be applied to a substrate and thereafter dried to form a tough polyimide coating by solvent evaporation at tempera-~Z~;~304 tures significantly below those required ~or the polar solvents previously described. Thus, one can provide polyimide coatings by evaporating at temperatures be-low 150C and even below 100C. Yor example, a poly-imide obtained from 2,2-bis{4,4'-di(3,4-dicarboxyphenoxy) phenyl} propane dianhydride, m-phenylene dianiline and containing 40 mole percent of bis-aminophenoxybutyl tetramethyl disiloxane, dissolved in diglyme to provide a 25% solids solution can be applied as a coating to a substrate and dried by solvent evaporation at from about 75C to about 95C in from 20 to 30 minutes to provide a dry coating ~rom i to 2 millimeters thick. The solids content can be varied according to mode of application (dipping, spraying, painting, spinning, etc.) and final use. Repeated applications can be made to obtain a de-sired thickness.
It has been indicated that in connection with the polysiloxanes (ie, where R2 is methyl and x is large, for example, 10 to 100 or more) solubility of the poly-imide is increased. However, it is possible to convert this thermoplastic (flows at 140C) soluble polyimide to a thermoset material by heating at about 240C. It is believed that either methyl groups or hydrogen atoms are dislodged by the heating to generate free radicals and that crosslinking takes place via an irreversible bonding mechanism.
Further in connection with the polysiloxane con-taining polyimides, it has been found that tensile -55~ 5~3~

strength is improved when three or more diphenylsiloxane units (R3 and R4 are phenyl and y is 3 or more) are adjacent to one another.
The following table summarizes some of the variables and the properties of the resulting polyimide.

3a~

o~ ~ ~ ~ o~ z o P. b i ~'x~l i Ix~
e l l t--r _ :~ _ _ _ _ _ :q :C ~ _ ~: _ _ _ ~ ~q ~' 5~ OZCI ~q ~ r~-r-~t~t~ ~t 3 ~o Ix xl Ixl Ixl I Ix~ I I Ixl ~
~ ~ ~ l~t~
~0 Xl IX IXI IXI I I ~ xlx~ xlxl lXI a) - ~ ttt tt Z 2 _ _ ~ ~ X ~X jX X ~X ~ ¦ ~ ~ d ~. ~ ~ ~ x ~ x~x~ o i ~S~3(~

A. Thermoset, insoluble, fair-to-poor adhesion, elongation 6 to 18~o, poor low temperature properties, difficult to incorporate fillers, not corona or radiation resistant.
B. Similar to A, but having improved solubility and flexibility.
C. Thermoplastic, soluble, good adhesion, elonga-tion 30%, good low temperature properties, stable to corona and other radiation improved wettability - can be filled, lower Tg than A.
D. Thermoplastic, soluble, good adhesion, superior low temperature properties, greater elongation and fl~xibility than C, resistant to embrittlement and fatigue, lower Tg than C, polysiloxane units allow control of properties of final product.
E. Thermoset, limited solubility, poor film, limited thermal stability.
F. High Tg, limited solubility, harder than C or D.
G. High Tg, more flexible than F, more soluble than F, harder than C or D.
H. Solubility better than F, higher Tg than C, stronger film than ~.
I. Better solubility than F or H, more ilexibility than F, lower Tg than H, better low temperature properties than F.
J. Vinyl, acrylyl and acetylenic functionality permits crosslinking to thermoset state.
E. Similar to J.

3~

L. Thermoplastic, soluble, poor adhesion, poor elongation, low resistance to corona and radiation.
M. Similar to L., better flexibility, greater solubility, Tg lower than L.
N. Thermoplastic, soluble, good film, excellent adhesion, lower Tg than L, more flexible than L, good low temperature properties.
0. Thermoplastic, very soluble, superior low temperature properties, good adhesion.
P. Thermoplastic, poor film, reduced heat re-sistance.
Q. Thermoplastic, soluble in all proportions of amine, higher Tg than N and film harder.
R. Similar to Q but with enha~ced solubility, greater flexibility and lower Tg.
S. Similar to Q but more soluble and flexible than Q, harder than R.
T. Similar to R but more flexible and lower Tg.
U. See J.
~. See J.
W. Similar to N but more flexible, lower Tg and better low temperature properties.

~` -58~ 0 ~

As can be seen from the foregoing, the properties of polyimide polymers containing the siloxane unit can be varied over a very broad range, at will. In addition to adjusting the reactants, one can also modify the S properties of siloxane-containing polyimides by blending different polyimides. Thus, di~ferent siloxane-con-taining polyimides can be mixed and blended to provide desired properties. Siloxane-containing polyimides C cannot easily be blended with non-silicone containing polyimides due to poor compatibility.
The reaction between amine component and anhydride is effected in a suitable solvent in the presence of a condensation catalyst. The solvent should dissolve the reactants as well as the product. Where combinations of materials will be employed, e.g. comb nations of anhydride, amine or siloxane and amine, attention should be paid to the reacti~ity of the components. Because of different reaction rates, it is generally preferrable to form a block copolymer rather than a random copolymer.
Since part or all of the amine component employed to fabricate a polyimide can be the amine-substituted siloxane unit described, the polyimide will contain from a trace of siloxane in addition to one or more other amine components to 100% siloxane and no other amine component. Thus, there can be used from 0 01 mole 70 to 100 mole 70 of bis-aminosiloxane; the ma~ority of appli-cations however, will call for polyimides containing from about 5 mole % to 100 mole % of siloxane and correspondingly ~3~)4 from 95 to 0 mole % of amine components, which can comprise one or mGre amines.
Where the polyimide will contain 100 mole ,0 of siloxane, the following sequence of reaction steps has been found to be effective:
(a) a reaction mixture of an anhydride and bis(aminosiloxane) is prepared and stirred in a suitable solvent.
(b) the reaction between the two reactants produces water in a refluxing reaction.
(c) the water produced by the refluxing reaction is removed by effecting azeo-tropic water removal.
(d) upon complete removal of the water, the resulting polymeric solution is cooled and recovered by a suitable process such as for example, by f iltering and pouring the polymeric solution into an excess amount of methanol to precipitate the product.
(e) the precipitated polymer material is separated by filtration, washed several times in fresh methanol and dried, pre-ferably at an elevated temperature of about 60C to 70C, under vacuum to effect volatization of the methanol and any ad-hering solvent.

-60- ~æ~3~

Where the polyimide will contain an amine component in addition to the siloxane, the following procedure is effective:
(a) the anhydride component is first reacted with the major of the siloxane and amine component materials in a suitable solvent.
This major component may be either an organic amine or a bis(aminosiloxane).
(b) the reaction between the anhydride material and the major component material is effec-ted at reflux, and water is produced.
(c) the water produced by the refluxing mix-ture is removed by effecting azeotropic water removal.
(d~ upon completion of the reaction and after removing all the water produced by the j~
refluxing reaction, the mixture is cooled, generally to room temperature or slightly above.
(e) the third component material, either an organic amine or a bis(aminosiloxane), is then added to the mixture and the mix-ture heated to an elevated temperature for a sufficient time to produce a poly-meric solution of the polyimide.
(f) upon completion of the last reaction, the resulting polyimide material is recovered by a suitable process such as, for example, `` ~2~30~

filtration and precipitation of the polyimide in an excess amount of methanol.
(g) the precipitated polymer is separated by filtration, washed several times in fresh methanol and dried, preferably at an elevated temperature of about 60C to 70C, under vacuum to effect volatization of the methanol and any adher-ing solvent.
Where the desired product is a poly(half-amide), the amine components, including the siloxane, are combined and cooled to 0C. The anhydride component is thereafter added gradually, over an extended period of time. The poly(half-amide) forms readily without the application of heat and without catalysts.
Because of the surprising heat stability possessed by the siloxanes and the reduced Tg, the polyimides can also be prepared by hot melt polymerization, in the absence of solvents. The materials are simply combined in equimolar amou-nts, mixed and heated. One method involves combining the materials in an extru-der heated to about 300C and extruding, on a continuous basis, the polyimide product.
As indicated, polyimides containing the siloxane unit are part ~ularly suitable for use as wire enamels, as conformal, protective, junction and passiva-tion coatings for electrical devices, printed circuit boards `` -62- ~ ~ ~0 ~

and semiconductor devices. They are suitable for use with electric devices since they have several desirable physical characteristics. The polyimide is one which can easily be applied and dried or cured in place. The polyimide will not degrade, and enhances the electrical characteristics of the device to which it is applied.
It adheres very tenaciously to the surface to which it is applied to prevent migration of ions on the surface of the device, particularly when employed with semi-conductor devices, and does not release any materials during drying or curing cycles which are deleterious to the operating characteristics of the device. The polyimide is impermeable to moisture and exhibits good abrasion resistance to protect the surfaces to which the coating is applied.
The polyimide is also capable of being applied in multiple layers to provlde a thick coating when required.
The polyimide is able to bond well to itself. Should the electronic device be employed in circuitry where corona is a problem, the material exhibits good corona resistance when cured.
When a polyimide is not capable of inherently ex-hibiting all of the desired characteristics to the degree necessary, it is capable of being modified to achieve the desired end result. Often times stray alkali and heavy metal ions cause undesirable degradation of elec-trical properties of semiconductor devices. Therefore, the polyimide can be modified with chelating materials -63~ 4 adm xed therewith or chemically bonded thereto. Ease of application to the surface to be protected and reasonably short curing or drying times are still re-tained. This is of particular interest when the coating material is employed in the manufacture of mass pro-duced electronic devices.
The polyimide is translucent. Such a material, when retaining the other desirable characteristics, is useful to fabricate photovoltaic devices. Particularly, it is desirable to bond a light emitting diode to the surface of another semiconductor device to turn the device "on" and "off" in response to the operation of the light emitting diode. The copolymer material of tkis invention is also applicable for use in bonding protective covers to exposed surfaces of photovoltaic devices such as solar cells.
The dielectric strength of the polyimide may be further enhanced by admixing suitable filler materials ~herein. Preferably, an electrically insulating material having a dielectric constant which is approximately the same as the polyimide is admixed therein. The filler material is uniformly distributed throughout the poly-imide coating as applied to a substrate. Other materials suitable as a filler material are those materials known to have a relatively good ability to resist electrical conduction although their dielectric constant is higher than that of the polyimide. Suitable electrically in-sulating filler materials have been found to include -64- ~ ~ ~ ~

aluminum oxide, silicon oxide, glass fibers, boron nitride, quartz, mica, magnesium oxide, activated polytetrafluorethylene and the like in a finely di-vided, or pulverized form.
Whether a filled or unfilled polyimide is employed, the electrical properties of a given device are en-hanced. The polyimide has an inherent elasticity to withstand repeated cycling from dipping in liquid gases in temperature ranges of approximately - 100~C to heat-ing in a furnace at approximately 300C and back into a liquid gas for a temperature excursion range of about 400C or more. Additionally, it has been found that the polyimides withstand short temperature excursions up to about 400~C to 500C without degradation of their electrical characteristics.
The polyimide can be applied over electrically in-sulating layers of silicon oxide, silicon nitride, alumi-num nitride and the like; it can also be applied as an insulating layer in place of those materials.
The properties of polyimides containing the siloxane unit make them useful for two other semiconductor application areas. Onè relates to the die bonding and wire bonding aspects wherein the finished chip is attached to the package, leads connected and the package sealed to form a semiconductor device ready for sale and use. Because of their superior adhesion and temperature resistance, the polyimides containing the siloxane unit are useful in preform bonding, whereby the polyimide is i~31)~

is applied to the die-attach area of a package and the solvent evaporated.
The chip or die is thereafter placed on the die-attach area of the package and, with moderate heating, the chip is firmly adhered to the package. The poly-imide can be filled with a conductive material, such as silver particles to provide a conductive bond.
Following die bonding is the wire bonding step wherein the chip is connected to the package leads by fine wlres of gold or aluminum. The interior of the package can then be filled with a flexible polyimide and the package coveréd and sealed. The flexible polyimide, either because of its flexibility or because of its thermal expansion properties, or both, results in a packaged device able to withstand thermal cycling without breaking the fine wires inside the package; other poly-imides tend to break the fine wires upon thermal cycling.
Another semiconductor application involves the use of a siloxane-containing polyimide as a passivation coating on a semiconductor device. This is the final outer coating on a device which, at present, is frequently glass.
A thermoplastic polyimide, being substantially inert, temperature resistant and yet capable of flowing upon heating and having superior dielectric properties, finds application as a passivation coating. Following application of the polyimide to the device, holes can be made in the polyimide, wires attached to the device and the device heated; the polyimide will flow to fill the voids around the wires, thus providing a sel r_ leveling passivation coating.
In an alternative mode of providing a polyimide passivation coating on a semiconductor device, one can apply by spin coating, a layer of poly(half-amide) to a device and thereafter heat the coated device to evaporate the solvent and partially advance the cure.
A microelectronic photoresist is then ap~lied over the poly(half-amide) and exposed to light through a mask. Following the developing step, the exposed poly(half-amide) can be dissolved away. Wires can be attached to the device and the device heated; the poly-1~ (half-amide) will flow to fill the voids aronnd the wires and will cure to provide a water impermeable, scratch-resistant, continuous passivation coating for the semiconductor device.

Because of their adhesive and dielectric properties, the polyimides containing the siloxane unit can be used to combine two or more layers of chips to provide multi-layer semiconductor devices.
The thermoplastic polyimides containing the siloxane 2~ unit are processible by compression molding, film casting and solution fiber spinning techniques. Because of their high elongation and ~ou~hness, they are particularly useful in thin-film products - films, enamels, adhesives, 1~7~

coatings and fibers. They can be molded and parts molded from these polyimides retain high strength at 300C and as high as 500C for short periods, for example, during processing of graphite and glass-fiber laminates and hot-draining of fibers. Laminates, films and coatings dis-play a minimum of voids or imperfections because no re-action products are formed at processing temperatures.
The thermoplastic polyimides containing the siloxane unit have the following general properties. They are molded simply be exceeding the glass transition temperature for sufficient time with application of pressure for good flow; their elongation imparts good machinability with low brittleness; the polyimides require no post-cure to develop full high-temperature properties; they can be reclaimed and used as re~uired, and defective laminates can often be corrected by reflowing; they can be cast into film from solution using conventional casting machines, the films being useful in both supported and unsupported applications; the films adhere well by heat-sealing to themselves as well as to other polyimides; they are solution-spun into fibers to pro-duce flame resistant, high temperature resistant fabrics;
they are molded with various fillers into parts having high strength at high service temperatures and flame resistance; unfilled molded parts have low coefficients of thermal expansion while glass-graphite and asbestos-filled parts give still lower coefficients of thermal -67- ~Z~3~

expansion; they provide parts that wear well with low friction and molding compounds filled with graphite powder, molybdenum or tungsten disulfide or PTFE produce parts with self-lubricating wear surfaces such as piston rings, valve seats, bearings, seals and thrust washers.
Laminates are made in high-pressure platen presses, lGw-pressure vacuum bags or moderate pressure vacuum autoclave bags. Solutions can be used as laminating varnish to impregnate glass, graphite or quartz clo~h, or glass, boron, graphite or aramid fibers to produce laminates with flame-resistance, high-temperature strength and good electrical properties having utility in radomes, printed circuit boards, radioactive waste containers and turbine blades and structural parts close t~ the hot engine enviro~ment.
Polyimide film ha.s good mechanical properties through a range from liquid helium temperature to 1100F. It has high tensile and impact strength and high resistance to tear initiation. Room temperature properties are comparable to those of polyester film while at -453F, the film can be bent around a 1/4-inch mandrel without breaking and at 932F it has a tensile strength on the order of 3500 4000 PSI.
The foregoing discussion of polyimides has dealt with the incorporation of a polysiloxane unit into a polyimide by means of a bis(amino)polysiloxane; it will be apparent, however, that the polysiloxane unit can be incorporated, with the same effect, into a polyimide via the polysiloxane dianhydride.

` -68- ~3~34 There should also be mentioned the polyesterimides, containing both imide and ester linkages. In one illus-tration, trimellitic anhydride is reacted with hydro-quinone diacetate to yield a dianhydride of formula:
R fi ~C ~~ coo-~i3 ooC~0~

This dianhydride is reacted with a diamine to provide a polyesterimide. Alternatively, one can react a diamine, such as m-phenylene diamine with trimellitic anhydride to an imide of formula:
" O O

HOOC ~ ~N ~ - N~ ~ ~COOH

O O
This imide can be further reacted with hydroxyl-functional materials, sucLl as hydroxyl-terminated poly-esters having a branched structure to allow crosslinking.
The siloxane unit can readily be incorporatecl into these polyesterimides by appropriate selection of functional group F.

2. Poly(Amide-Imide) Poly(amide-lmide) is the reaction product of an organic diamine with a tricarbo~ylic acid anhydride:

-68a- i ;~ 304 H2N-Y-NH2 +XOOC - A' ~ O

In -69- ~2~9~

The diamine component can be selected from the same groups as pr~viously described in connection with the polyimides.
In the tricarboxylic acid anhydride, A is a tri-valent organic radical, obtained from such compounds as:

trimelliti~ anhydride; 2,6,7-naphthalene tricærboxylic anhydride, 3,3',4-diphenyl tricarboxylic anhydride;
3,3',4-be~zophenone tricarboxylic anhydride; 1,3,4-cyclopentane tetracarboxylic anhydride; 2,2'3-diphenyl tricarboxylic anhydride; diphenyl sulfone-3,3'4-tri-carboxylic anhydride; diphenyl isopropylidene-3,3'4-tricarboxylic anhydride; 3,4,10-propylene tricarboxylic anhydride; 3,4-dicarboxyphenyl-3-carboxyphenyl ether anhydride; ethylene tricarboxylic anhydride; 1,2,5-naphthalene tricarboxylic anhydride, etc. Also useful are the corresponding acids of such anhydrides.
There can also be used the triacid anhydride analogues of the diether-containing anhydrides des-cribed above in connection with the polyimides.
Part or all of the amine component can be re-placed by a bis~amino-siloxane); part or all of the anhydride component can be replaced by a siloxane-containing triacid anhydride. Thus, there is provided a poly(amide-imide) containing a si~oxane unit of formula R~ R2l~ R3l~ Rl Rl -Q-Z-D-Si- 0-Si~0-Si~l~-Si¦-0-Si-D-Z-Q-Rl R2~ R4~l R6~ R' where the various elements have previously been described.
As in the case with the polyimides> the reaction proceeds stepwise, with the formation of the amide taking place by simply combining and mixing the amine com-C ponent with the triacid anhydride component. The imide is formed by heating at temperatures on the order of 180C to 2000C to effect cyclization.
Poly(amide-imides) containing the siloxane unit display excellent high temperature performance, being serviceable at temperatures from cryogenic to 500F
and capable o~ withstanding cycling; they have high tensile, Llexural, impact and compressive strengths, superior elongation and good resistance to creep.
Further, they display low coefficient of thermal ex-pansion, flame retardance, resistance to nuclear and U~ radiation and good electrical characteristics.
Chemical resistance and moisture absorption are im-proved by the presence of the siloxane units; the flow properties of molding compositions are improved by the siloxane unit, it being possible to use lower mold temperatures and pressure than are necessary to process poly(amide-imides) that do not contain the siloxane unit.

-71- i~3~

Poly(amide-imides) containing the siloxane unit ha~e a variety of uses. Because of their high tempera-ture resistance and corona resistance, they are suitable as insulation for electrical conductors. Solutions of the polyamide or the poly(amide-imide) can be applied to electrical conductors such as copper wire, aluminum, etc., and thereafter heated to evaporate the solvent and/or to complete the imidization. Thus, motor and C generator wire coatings can be formed having gGod electrical properties, heat resistance and flexibility.
Films and fibers can be extruded or can be cast from solutions of eithér the poly(amide-imide) or the poly (amide). Solvents which can be employed are, for ex-ample, N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylformamide, N,N-diethylacetamide, N,N-di-methylmethoxyacetamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, pyridine, dimethylsulfone, hexamethy]-phosphoramide, tetramethylenesulfone, phenol, phenol-water mixtures, and dimethyltetramethylenesulfone.
~ixtures of these solvents with other inert organic sol-vents such as benzene, benzonitrile, dioxane, beta-ethoxyethylacetate, butyrolactone, xylene, toluene and cyclohexane, can also be employed.
Since part or all of the amine component employed to fabricate a poly(amide-imide) can be the amine sub-stituted siloxane unit described, the poly(amide-imide) will contain from a trace of siloxane in addition to one or more other ami~e components to 100% siloxane and no other amine components. Thus, there can be used from 0.01 mole aO to 100 mole % of bistaminosiloxane); the majority of applications, however7 will be satisfied by poly(amide-imides) containing from about 5 mole %
to 100 mole % of siloxane and correspondingly from 95 mole % to 0 mole % o~ amine component, which can com-prise one or more amines. The corresponding relation-C ships apply when the siloxane unit is provided in the form of an acid or anhydride.
3. Polycarbonate Polycarbonate resin is a polymeric carbonate ester produced by the phosgenation of an organic dihydroxy compound. Commercial polycarbonate resin is produced by the reaction of phosgene with bisphenol A:

HO ~ -C ~ OH + ClCCl ~ - C- <~- O C

where n is from about 50 to about 400.

3~4 Although a versatile and widely use material, polycarbonate has certain drawbacks, such as poor resistance to chlorinated hydrocarbons and certain other solvents; a hygroscopic tendency; notch sensitivity; susceptibility to loop stre-sses; stress cracking accelerated by contact with oil or gasoline and a critical thickness limitation. In Izod impact tests with 1/8" bars, values of 12-16 ft.
lbs. per notched inch are attained. However, the polycarbonate mode of failure changes at about 0.2 inch -thickness from high energy-absorbing ductile fracture to low energy-absorbing brittle fracture with an attendant sharp drop in impact resistance above 0.2 inches in thickness.
The properties of polycarbonate resins can be improved by the incorpor-ation therein of a siloxane unit of formula Rl R R R Tl -Q-z-D-s - 0-5 x R _ 0-5 - O-Si-D-Z-Q-where the various elements are as previously described. More particularly, there can be incorporated from 0.01 74 ~Z ~ ~ ~

to 30 mole % of the siloxane, initially present in the form of the bisphenolic, or other phosgene-reactive derivative. In general, there will be present from 0.1 mole ,0 to 15 mole % of the siloxane, and at these levels there is seen improvement in the various proper-ties; impact resistance of thick sections improves, as does resistance to hydrocarbon and other solvents. Low temperature properties increase and there is seen a de-creased tendency to yellow upon exposure to UV radiation.
Thus, in one embodiment, there is provided the re-action product of phosgene and a siloxane of formula R ~ R 1~ R3ll R ~ R

R L RJL 1 ~
x y z and in another embodiment there is pro~ided the reaction product of phosgene, bisphenol A and the bisphenolic-siloxane described above.
The reaction takes place readily under standard con-ditions for phosgenation of bisphenol A; the phenolic substituted siloxane reacts at about the same rate as the bisphenol A.
The siloxane-containing polycarbonate is readily processed by all standard thermoplastic methods, in-cluding injection molding, extrusion and blow molding.

Sheets can be thermoformed using vacuum, pressure or drape heating methods. It can be solvent a~d adhesive bonded, painted, printed, hot-stamped, welded ultrasoni-cally and heat staked.
4. Polyphenylene Sulfide Polyphenylene sulfide is a crystalline, aromatic polymer prepared by the reaction of dichlorobenzene with sodium sulfide in a polar solvent.

Cl- ~ -Cl + Na 2 S

[~-S ~

The properties of polyphenylene sulfide resins can be improved by the incorporation therein of a siloxane unit of formula R~ ~ R2 ~ IRl~ IR' Rl -Q-Z-D-Si10-Si l~lS~l~SIi -O-Si-D-Z-~-R~ L R2 ¦ R4~ R6 R~

-76- ~2~3~

where the various elements are as previously defined.
There can be incorporated from 0.01 mole % to 30 mole %
of the siloxane unit, initially present in the form of the dihalide or other reactive derivative. In general, S there can be present from 0.1 mole ~0 to 15 mole ~O of the siloxane and at these levels there is seen improve-ment in the various properties. Thus, there is obtained a siloxane modified polyphenylene sulfide having good solvent and chemical resistance, low coefficient of friction, ease of molding, high temperature resistance, flame retardance and good electrical properties. The polymer has improved flexibility and superior tensile strength.
In one embodiment, there is contemplated the re-actio~ product of sodium sulfide with a siloxane of ~ormula Cl Q Z D lilO I ~ ~ 0 l;~0 li D Z Q-C1 Rl R R R Rl and in another embodiment there is contemplated the reaction product of dichlorobenzene, sodium sulfide and a dichlorosiloxane as described above.
The reaction proceeds readily in a dipolar, aprotic solvent and the reaction rates between dichlorosiloxane and dichlorobenzene and sodium sulfide are similar.
The resulting polymer is readily injection molded to provide parts that are dimensionally stable and heat resistant.

~;~3~

5. Sulfone Polymers Polysulfone is produced from a bisphenolic compound, such as bispher.ol A, and dichlorodiphenylsulfone:

NaO- ~ -C ~ -ONa + Cl ~ -S ~ -Cl CH
S ~ ~o-~-~

where n is 50 to 80.
The properties of polysulfone polymers can be im-proved by the incorporation therein of a siloxane unit of formula 10-Q-Z-D-Si ~ U-Si ~0 -Si ~O-S;~ O-Si-D-Z-Q-E~, L R 2J '- l R 1 X y Z
where the Various elements are as previously described.
There can be incorporated from 0.01 mole ~0 to about 30 mole ~0 of the siloxane unit, initially present as the alkali metal salt of the dihydro~ide. In general, there 15can be present from 0.1 mole ~0 to 15 mole ~0 of the siloxane and at these levels there is seen an improvement in the various properties. Thus, there is obtained a -78- ~ ~

siloxane-modified polysulfone polymer having improved solvent resistance, high thermal and oxidative resis-tance, hi~h resistance to hydrolysis and inorganic chemi-cals and improved electrical properties. They have low flammability and smoke emission and have improved flexibility and toughness. The siloxane unit reduces the Tg and so polysulfone polymers containing this unit display lower melt viscosity and correspondingly better moldability. Parts can be molded to extremely close tolerances and display very low creep. The coefficient o~ friction is reduced.
In one embodiment, there is contemplated the re-action product of a dichlorodiphenylsulfone with a siloxane of formula Rl ~ R21 ~ R31 ~ R1 R' li ~ 1 2~ 1 4~L I 6 1 1 X y Z
and in another embodiment there is contemplated the re-action product of dichlorodiphenylsulfone, the alkali metal salt of a bisphenolic compound and an alkali metal phenoxide derivative of a polysiloxane, as des-cribed above.
The reaction proceeds readily in a dipolar, aproticsolvent such as dimethylsulfoxide and the reaction rates between the bisphenol and the siloxane are similar.
The resulting polymer is readily injection molded to provide parts that are dimensionally stable and resi-~25~3~3~

tant to temperatures of 300 to 400F. They can be thermoformed, cast into ilms from solution, blow-molded and extruded into sheet, pipe and other pro-ducts. The polymer can also be formed into a membrane and used in reverse osmosis water purification.
6. Aromatic Polyester (Polyarylate) Polyarylate polymers are aromatic polyesters of aryl di~arboxylic-acids a~d bisphenols. The acids include iso-phthal1c, terephthatic and mixtures thereo~. The bis-phenols are illustrated by p,p'-biphenol and bisphenol A. The polymer can be modified by p-hydroxybenzoic acid.
The reaction product of bisphenol A with terephtha-lic and isopkthalic acids is illustrated by O O

)- ~ CI-~C I 3~3 ~

while the reaction product of p,p'-biphenol, p-hydroxy-benzoic acid and terephthalic acid is illustrated by {o~ -o + ~ f~

The properties of polyarylate polymers can be im-proved by the incorporation therein of a siloxane unit of formula .. ~"Z~

1 1 ~ 1 1 ~ 1 1 1 -Q-Z-D-Si~0-Sil 0-Si _ 0-Si- -0-Si-D-Z-Q-11 L 1 2 1 14 y _ 1 6_ z 11 where the various elements are as previously described.
There can be incorporated from 0.01 to about 30 mole % of the siloxane unit, initially present as either the dihydroxide or the diacid. In general, there can be present from 0.1 mole % to 15 mole ~0 of the siloxane an-l at these levels there is seen an improvement in the various properties. Thus, there is obtained a siloxane-modified polyarylate polymer having improved resistance ~o stress-cracking by organic solvents, to hydrolysis and having lower Tg resulting in lower melt viscosity and therefore, better molding properties. ~urther these polymers have better flexibility and toughness.
The matter of melt viscosity is a significant improve-ment. Previously, quantities of crystalline thermoplastics such as polyethylene had been used to improve flow during molding.
The polymers have high modules, flexural recovery, improved UV stability, and improved electrical properties.
They can be molded or extruded.
In one embodiment, there is contemplated the re-action product of an aromatic diacid with a dihydroxy-siloxane as described. In another embodiment, there is contemplated the reaction product of a bisphenolic com-pound with a bis(dicarboxysiloxane) as described.

r 7. Epoxy Polymers ~n epoxy resin is any molecule contzining more than one alpha-oxirane ~roup capable of being converted to a useful thermoset form. The general term "epoxy resin"
is applied to both the uncured, thermoplastic and cured, thermoset states.
The most widely used resins are diglycidyl ethers of bisphenol A, which are made by reacting epichlorohy-drin with bisphenol A in the presence of an alkaline catalyst. These materials are illustrated by the follow-ing formula:

r~ _ CH ~ _CH_C~, to~L C~ O-C}I, -CH-CH 2--~ C~O-CX, -CII -CI~, C~ 3 CH 3 By controlling the operating conditions and varying the ratio of epichlorohydrin to bisphenol A, products of different molecular weight can be made. For liquid resins, n in the above formula is generally less than l; for solid resins it is generally 2 or more.
Another class of epoxy resins is the novolacs, par-ticularly the epoxy phenol and epoxy cresol novolacs; an ZO epoxy cresol novolac is illustrated by the formula 30 ~

O- CH 2 -CH-CH 2 ¦ O-CH 2 -CH-C~ 2 O-CH 2 -CH-CH 2 ~ H 3 ~CH 3 ~CH 3 CH 2_ ~CH 2_ J

The resins are produced by reacting a phenol-formal-dehyde or cresol-formaldehyde reaction product with epichlorohydrin.
Another class of epoxy resins is denoted by the cycloaliphatic epoxy resins; these are produced by the peracetic epoxidation of cyclic olefins and by the con-densation of an acid, such as tetrahydrophthalic acid, with epichlorohydrin, followed by dehydrohalogenation:

0 ~ CH 2 --~

Another group of epoxy resins comprises the specialty polyfunctional epoxy resins, which are used in conjunction with graphite and glass fiber in composite materials and structural adhesives in the aerospace industry. These include epoxy derivatives of polynuclear phenols, pre-pared by reaction o~ glyoxal with phenol in the presence of HCl:

~:5g~;3Q~

CH -CH-CHZ 0~ CH 2-CH-&H2 CH CH
~20~ 2 0- CH 2 - C~H-5H 2 c triglycidyl derivatives of p-aminophenol, produced by the reaction of epichlorohydrin with phenolic and amino g~oups followed by dehydrohalogenation O-CH 2 -C\H-~ H 2 ~
/
CH ~ -CX-CH 2 CH 2 -CH-CH 2 O O
and the tetraglycidyl derivative of 4,4 -methylenediamiline O O
CH 2 - CH- C\ 2 C/ ~
N 3CH2 ON\

-84- 125~ 30~

r Other epoxy resins are based on heterocyclic ring structures, such as hydantoin P.' O
R ~ //
C~ 2 -5X-CH 2 -N\~/N-CH 2 -CH-/H~
O

while others are based on hydrogenated bisphenol A.
~poxy resins must be cured with crosslinking agents or catalysts to develop desirable properties; the epoxy and hydroxyl groups are the reaction sites through which crosslinking occurs. Crosslinking agents include amines, anhydrides, acids; aldehyde condensation products and Lewis Acid catalysts. The curing mechanisms have been studied extensively and are described in Handbook of Epoxy Resins, by Lee and Neville, Copyright 1967 by McGraw Hill, Inc.
Epoxy resins are versatile and widely used materials;
nevertheless they have certain drawbacks, such as poor ~lexibility, low thermal cycling and thermal shock re-sistance and poor weatherability.
The properties of epoxy resins can be improved by the incorporation therein of a siloxane unit of formula R1 - R2- R31 r R~ 1 RL

_Q_ Z_D_5 i_ 0_0 i S O-S i~O-S i ~O-S i-D- Z-Q-R~ R~ R~ R6 R1 .

~Z5Jv3~3~

where the various elements are as previously described.
More particularly, there can be incorporated from 1 to about 50 mole % of the siloxane, initially present in the form of an epoxide, amine or anhydride. In general, there will be present from about 10 mole ~ to about 40 mole % of the siloxane, and at these levels there is seen improvement in various properties; flexibility is improved without sacrificing other properties. Low temperature properties are enhanced, as is weatherability and resistance to various kinds of radiation.
Thus, in one embodiment, the epoxy component of an epoxy resin is replaced, in whole or in part, by a bis (epoxy) siloxane of formula 1- 1 ~ -i 1- 1 X2C-CH-CH2-Q-Z-D-Si- rO-~i _ -O-Si _ O-Si O-~i-D-z-Q-cH2-cH-cH2 1'' L 12 X 14 Y .16J 11 In another embodiment the amine component in a curable epoxy composition is partially or totally re-placed by a bis (amino) siloxane of formula 1 ~
H2N-Q-Z-D-Si- O-Si _ O-Si _ O-Si- -O-Si-D-Z-Q-NHz ll - 1~ x 1'~ Y - l6- z 1~

and there is thus provided a curable composition com-prising an epoxy resin and a bis (amino) siloxane.

~Z~

As indicated previously, epoxy resins can also be cured via an anhydride and it is now possible to intro-duce the siloxane unit by means of a dianhydride de-rivative thereof. Thus there is provided a curable epoxy composition comprising an epoxy resin and a bis (dianhydro) siloxane. The dianhydride groups can be attached directly R2l ¦ R'j, R'¦ Rl C~
O / Q-Z-D-Si- -O-Si tO-Si!~O-Si~ -O-Si-D-Z-Q / O
\C 11 R2 xl R~yL R6 Z Rl ~OCI' and more particularly:

~C - ~ Z-D-Sl _ -S ~ ~-S ¦ -S O_Si_D_Z. `~ ~ C~O
O Rl R L R R R~ ~5 O

or the dianhydride can be bonded via an intermediate group -~C~ Rl ¦ R2l I R31 ~ R'l Rl 1 1~ ~
~ ~ Q -Z -Q-Z-D-SIi- -O-Si tO-Sit O-Si -O-Si-D-Z-Q-Z -Q ~0 O 1 2 l 4~ - ~ Z O

Where Q' and Z' are selected from the same group as are Q and Z.

.

-87- _ 12 S~ 30 Q' can conviently be an aryl group:

~ ~ _ Z -Q-Z-D-Si jO-S ¦ -S j _S~I O-S~-D-Z-Q-Z

O Rl R R ¦ R6 R~ O

Because of ease of synthesis, Z' and Z in the above formula are preferably oxygen and Q is a phenylene group.
It is thus seen that the siloxane unit can be incor-porated into an epoxy resin in a variety of ways; the re-sulting cured epoxy resins are more flexible than before.
It is also apparent that the flexibility of epoxy resins can be adjusted to approach that of elastomeric composi-tions.

-8~- ~2~ 04 8. Polyester Polymers Polyester polymers are produced by the reaction of an acid with a~ alcohol. Thermoplastic polyesters such as polyethylene terephthalate and polybutylene terephthalate are produced by the polyesterification reaction between a single glycol and a single dibasic acid. The term "co-polyester" has been applied to polyester polymers fabri-cated from more than one glycol and/or more than one di-basic acid.
Thus, polyethylene terephthalate is prepared ~rom terephthalic acid or its functional equivalent, dimethyl terephthalate HOOC - ~ COOH + HOCH2CH20H --~ HO-(OC- ~ -COOCH2CH2)NH +2nH20 CH300C-- ~--COOCH3 + HOCH2CH20H---~HO-(OC- ~ COOCH2CH20)nH+2nCH30H

The polymerization is usually conducted by melt con-den-sation polymerization at elevated temperature, above 270 C, and vacuum.
Polyethylene terephthalate has many attractive pro-perties, including clarity and toughness when amorphous, adequate solvent resistance and relative impermeability to water vapor, oxygen and CO2. The polymer is, however, characterized by certain disadvantages, such as deteriora-tion oi mechanical characteristics at room temperature due to progressive crystallization, as evidenced by the `` -89- ~Z~30~

notched Izod impact strength test. The polymer has a lack of toughness when crystallized and moldings tend to stick to molds and have poor surface appearance.
Polybutylene terephthalate is made by a condensa-tion polymerization polymerization reaction between dimethyl terephthalate and 1,4-butamediol O O ~ O _ , H 3 C-O-C~--C-O-CH 9 + ~0- (CH 2 ) 4 -OH rC OE,-c-o- ( CH 2 ) 4 -O' +CX 3 OHl`

The reaction is conducted in two steps. In the first, excess diol is employed to ensure removal of me~hanol and to produce a prepolymer mixture. In the second step the molecular weight is increased by a re-equilibrium with removal of the excess diol.
The polymer, while useful, is attended by certain shortcomings, including low fracture resistance and high notch sensitivity, as well as limited resistance to hy-drolysis.
Other polyesters include polymers where cyclohexane-dimethanol is used as part or all of the diol. These polymers require processing temperatures on the order of 500 F and tend to have high melt viscosity. Further, they have poor resistance to hydrocarbon and Ketone sol-vents and poor U.V.-resistance.
In addition to the thermoplastic polyest,er polymers, there are the unsaturated polyester polymers which contain unsaturated sites for crosslinking to form thermoset materials.

-yo~ s~

The components of these compositions are a linear polyester resin, a crosslinking monomer and an inhibitor to provide shelf stability.
The linear polyester is typically the condensation product of an ethylenically unsaturated dibasic acid, a dibasic acid not containing ethylenic unsaturation an~ a saturated polyol. Representative unsaturated intermediates include maleic anhydride and ~umaric acid; "saturated"
acids include phthalic anhydride, isophthalic acid and adipic acid; the glycols include propylene glycol, ethylene glycol, diethylene glycol and dipropylene glycol.
Usual crosslinking monomers include styrene, vinyl toluene, methyl methacrylate, alpha-methyl styrene, and diallyl phthalate. Conventional inhibitors are hydroquinone, quinone and t-butyl catechol.
Crosslinking takes place by a free-radical initiated polymerization reaction and the usual free-radical source is a peroxide catalyst, such as methyl ethyl Ketone peroxide, cyclohexanone peroxide, benzoyl peroxide and cumene hydroperoxide.
The properties of polyester polymers can be improved by the incorporation therein of a siloxane unit of formula 1' ~ RZll R3¦l R~ Rl -Q-Z-D-f itO-f i~o-f iLo f i_o-f i-D-Z-Q-R' RZ ~ R~ly~ R6_ z Rl - --91- ~2~3~4 where the various substituents are as previously de-scribed. More particularly, part or all of the acid component of a polyester polymer can be replaced by an acid- or anhydride-functional siloxane. Thus, there can be incorporated from 0.01 mole % to 100 mole aO of the acid component, of the silox~ne unit, initially present as the acid, anhydride or other reactive derivative.
In general, there can be present from 0.1 to 65 mole % of the siloxane and at these levels there is seen improvement in the various properties. Thus, there is provided a modified thermoplastic polyester having im-proved solvent and chemical resistance, lower coefficient of friction and greater ease of molding including lower Tg and reduced tendency to adhere to the mold. The materials also have improved hydrolytic resistance and improved radiation resistance, including ~.V. Further, the toughness of the polymer is enhanced and the tendency oi the polymers to crystallize at room temperature and lose physical properties is reduced. In addition, there is provided a thermoset polyester composition having better toughness, greatly enhanced electrical properties and stability at elevated temperatures.
In one embodiment, there is contemplated the re-~ction product of an acid- or anhydride-functional siloxane with a polyol. Thus, there can be reacted with a polyol, a compound of formula -92- l~S~Q4 R' r R2 ¦ r R3l~ R'l R~
F-Q-z-D-siTo-sir -o-si~o-siro-si-D - z-Q-F
Ri 1 R~ R4~) R6~ R~

where ~ is COOH, dicarboxylic acid anhydride or the group F3-Q'-Z'- where Z' is selected from the same group as Z, Q' is selected from the same group as Q, a~d F3 is COOH
or dicarbocylic acid anhydride.
As indicated previously, the preferred embodiments, because of ease of synthesis, are those where Q and Q' are phenylene and Z and Z' are oxygen:

HOOC ~ O-D- .... etc.

HOOC ~ O ~ O-D- ................... etc.

o~ ~ O-D- .... etc.

o O~ ~ o ~ O-D- .... etc.

~93-~:~5~304 It is noted that for crosslinking applications appropriate functionality can be incorporated into the siloxane unit, either on the phenylene group or on the silicone atom, as has been previously described.

S2S~;~04 --Y'L--9. Polyurethane Pclymers The siloxane unit can be incorporated into urethane compositions to enhance the oil and ~ater repellent pro-perties with improved temperature resistance, to provide improved low temperature properties, improved electrical properties and, at higher siloxane content, mold release and other cha~acteristics associated with low free sur-face energy.
C The basic chemistry of the polyurethanes involves the addition polymerization reaction of a polyisocyanate with a polyfunctional hydrogen donor, and it has been found that this basic chemistry will accGmodate the in-corporation of a polysiloxane unit into a polyurethane polymer.
While the term "polyurethane polymer" generally refers to compositions which contain the characteristic urethane group, ,.

obtained by reacting a polyisocyanate with a polyol, polyurethane compositions can also contain urea groups . .
-N-C-N-obtained by reacting a polyisocyanate with an amine, and can contain amide groups o -N-C-obtained by reacting a polyisocyanate with an acld.

_95_ ~5~304 In one aspect, the properties of polyurethane polymers can be improved by incorporating therein the polysiloxane unit of formula -Q-Z-D-Si~0-Sl LO_S -Q-S; 0-Si-D-Z-Q-R'L RZll R~ L R6~ ll where the various elements have been previously described, and the preferred embodiments are also as previously de-scribed. The polyurethane can contain from about 0.5%
to 50~0 by weight of the polysiloxane, initially present as an amine-functional, hydroxy-functional, carboxylic acid-functional or isocyanate-functional compound.
Thus, the polysiloxane unit can be obtained from a compound of formula I 1 - I 2- ~ I 3 R51 Rl F,-Q-Z-D-Si 0-Slj- 0-Si l 0-Sir 0-Si-D-Z-Q-F, where F~ is amino, hydroxyl, isocyanato or carboxylic acid to provide a polysiloxane-modified polyurethane com-position. Fl can be connected to Q directly, or via an intermediate organic radical.
The polysiloxane unit can be incorporated into a polyurethane polymer in a variety of ways; there can be used the func~ionally substituted siloxanes where the functionality is isocyanate, amino, hydroxyl or carboxylic acid to make a wide variety o~ polyurethane intermediates and end products, including hydroxyl and isocyanate-~25~30~

terminated prepolymers, low molecular weight compositions used as textile coatings and finishes, and high molecular weight polyurethane compositions useful as elastomers, protective coatin~s and foams.
Polyurethane elastomers generally have remarkable resistance to most solvents, including gasoline, ali-phatic hydrocarbons and,to some degree, aromatic hydro-carbons. They also exhi~it excellent abrasion resistance.
By inclusion of the polysiloxane unit in an elastomer formulation, it is possible to maintain the solvent and water resistance, improve the thermal stability and en-hance the low temperature properties. The elastomers generally involve the reaction product of a dilsocyanate, a linear long chain diol and a low molecular weight chain extender, such as a glycol, diamine or polyol. Elasto-mers are generally prepared by a prepolymer technique whereby a diisocyanate is reacted with a hydroxyl-termi-nated polyester or polyether to form an isocyanate-termi-nated prepolymer. This prepolymer is then further reacted (chain extended) with a glycol, diamine or poly functional polyol (e.g. trimethylolpropane). Following the chain e~tension step, the liquid material solidifies, is re-moved from a mold and is cured at elevated temperatures.
Urethane foams are usually prepared from diisocya-nates and hydroxyl-terminated polyethers or polyesters.
Linear or slightly branched polymers are used to provide flexible foams, while more highly branched polymers pro-duce rigid foams. Foaming is often accomplished by in--97 ~2 5$ 30 ~

cluding water in the system, the reaction between iso-cyanate and water providing carbon dioxide for foaming.
For rigid foams a low boiling liquid, such as trichloro-fluoromethane, has bee~ used as a blowing agent.
Appropriate selection of catalysts, stabilizers, surfac-tants and other additives controls the foam formation, cell size and type, density, cure and the like. By in-corporating the polysiloxane unit into urethane foams, it is possible to achieve improved mold release proper-ties in rigid, semi-rigid and flexible foams. It is also possible to maintain the water and solvent resistance of `foams used as insulation and increase radiation resistance.
Incorporation of the polysiloxane unit into poly-urethane coatings such as paints and varnishes improves the water resistance thereof. Widely used systems include the two-component coatings wherein a non-volatile isocyanate derived from the reaction of tolylene diisocyanate with a polyol such as trimethylolpropaDe, is reacted with a polyfunctional polyester. Another system in use involves the one-component polyurethane coatings which are based on stable isocyanate-terminated pre-polymers obtained from a diisocyanate such as tolylene diisocyanate and a polyfunctional polyether. ~uch coatings dry by the reaction of the free isocyanate groups with water or atmospheric moisture. The reaction proceeds through the unstable carbamic acid, with C02 being eliminated, to give primary amine groups which further react with isocyanate groups to form ureas.

-98- ~s~-30~

Treatment of a textile with a polysiloxane con-taining polyurethane provides oil-and water-repellent characteristics thereto.
While it is possible to build up a high molecular weight polyurethane polymer from a functionally substi-tuted polysiloxane and a polyurethane co-reactant, most polyurethane compositions that are used commercially to any great extent are copolymers that contain only a relatively small number of urethane linkages. These co-polymers are prepared from a variety of segments, typically based on polyethers and polyesters and can have a molecular weight of from 200 to 10,000, generally from about 20G to about 4,000. By the inclusion of an appropriate amount of polysiloxane in the starting materials, it is possible to prepare prepolymers that, when incorporated as part of a polyurethane, favorably affect the properties thereof. Thus, the polysiloxane unit can be present in an amount ranging from about 0.5% to about 50% by weight of the polyurethane compo-sition~ generally from l~o to about 30% by weight.
In addition to providing the polysiloxane unit as part of a prepolymer, it is possible to incorporate a desired amount of the polysiloxane unit into the reaction mixture of a conventional prepolymer and polyisocyanate so as to obtain polyurethane compositions containing the polysiloxane unit; alternatively one can use a siloxane-containing prepolymer.

-99~ q~ 304 The polysiloxane unit can also be incorporated in a polyurethane composition in the form of an amine-~unction~l chain extender.
The polysiloxane~containing prepolymers can be hy-droxy-terminated or isocyanate-terminated and as indicated, can have a molecular weight as high as 10,000, although a molecular weight of 200 to 4,000 is more usual.
Hydroxy-terminated prepolymers can be prepared by reacting an excess of a polyhydroxy component with a polyfunctional hydroxy-reactive component such as a poly-isocyanate, an isocyanate-terminated prepolymer, a poly-basic carboxylic acid, anhydride or acyl halide, phosgene, or a bischloroformate.
The polyhydroxy compone~t can be a polyol, a bis (hydroxy) siloxane, a polyether, a polyester, a poly-siloxane-containing polyether, a polysiloxane-containing polyester, or mixture thereof.
The polyols are well-known in the urethane art and include Ethylene glycol 1,3-propanediol 1,4-butanediol 1,5-pentanediol 1,6-hexanediol l,9-nonanediol 1,10-decanediol di-,tri-,tetra-and pentaethylene glycol ~25~304 --100~-bis(4-hydroxybutyl)ether bis~2-hydroxybutyl thioether bis(4-hydroxybutyl) thioether 1,4-bis(3-hydroxypropyl)benzene glycerol trimethylopropane 1,2,6-hexanetriol sorbitol mannitol pentaerythritol 2-ethyl-1,3-butylene glycol octamethylene glycol 2-ethyl-1,3-hexanediol dodecamethylene glycol tetradecamethylene glycol hexadecamethylene glycol octadecamethylene glycol The polyol can also contain cycloaliphatic groups, e.g. 1,4-cyclohexane-diol, 1,4-bis(hydroxymethyl)cyclo-hexane, 4,4'-dihydroxyl-1,1'-dicyclohexyl and the like.
If desired, mixtures of polyols can be used.
Polyols, in addition to those described above, that are considered especially useful~ are those containing tertiary nitrogen atoms which can be quaternized with acids, thereby converting a water-insoluble urethane com-position into one that is water soluble or emulsi~iable.
Generally, an isocyanate-terminated prepolymer having a molecular weight of 200 to 10,000, preferably 400 to ~ ~æ~.3~

4,000, is reacted with a difunctional tertiary amine to provide a segmented polymer containing tertiary nitrogen atoms. The nitrogen atoms can be quaternized, for ex-ample, by alkylation with methyl chloride or dimethyl sulfate to yield ~ composition that in polar media yields a dispersion in water. The polyammonium polyurethane com-positions are obtained even more readily by neutralization of the basic polyurethane composition in a polar organic solvent such as acetone, methyl ethyl ketone, tetrahy drofuran, with a strong (HCl) or preferably weak (pK>4) acid such as the C2 - C9 alkanoic acids. Acetic acid is especially preferred because the acetic acid evaporates with the water on drying to leave the water-insoluble hy-drophobic starting polyurethane composition.
The neutralized polyurethane composition in a polar solvent spontaneously forms a dispersion when water is stirred in. The solvent can thereafter be distilled off to give a solvent-free latex whose film-forming qualities~
are comparable to those of organic solution.
In a convenient mode of preparing the water-dispers-ible basic polyurethane compositions, a polyester or poly-ether diol is reacted in a non-reactive polar solvent, such as tolylene diisocyanate or, preferably an aliphatic di-isocyanate which tends to give non-yellowing urethanes such as dimer acid derived diisocyanate tDDI. commercially available from Quaker Oats Company~ or another diisocya-nate which is described herein as providing non-yellowing 102- ~5~33~

urethanes, and the prepolymer partially chain extended with an alkyl diethanolamine to yield a urethane com-position containing tetiary amino groups. The urethane composition can then be acidified with a solution o~
aqueous weak acid (pK>4) such as acetic acid; the con-centration of acid is not critical. An emulsion immedi-ately forms when this composition is added to water.
The polyurethane compositions can contain from as - little as 5 to 800 milliequivalents of ammonium groups per 100 grams of polyurethane composition, preferably from about 50 to 500 milliequivalents of ammonium groups per 100 grams.
Some useful polyols containing tertiary nitrogen atoms can be represented by the formula H0 - RLO - N - R~1-QH
Rl2 where R,~ and R,, are aIkyl of 2 to 4 carbon atoms or a group of fo~a H
-R ,3- N-R ~4~
where R,3 and R ,4 are alkyl of 2 to 4 carbon atoms Rl, is alkyl of 1 to 18 carbon atoms, cyclohexyl, tolyl, xylyl, naphthyl, or with the nitrogen atom forms piperazyl or pyridyl.
Useful polyols that contain teritary nitrogen atoms include the alkoxylated aliphatic, cycloaliphatic aro-matic and heterocyclic primary amines:

N-methyl-diethanolamine N-butyl-diethanolamine N-oleyl diethanolamine N-cyclohexyl-diethanolamine N-methyl-diisopropanolamine N-cyclohexyl-diisopropanolamine N,N-dihydroxyethylaniline N,N-dihydroxyethyl-m-toluidine N,N-dihydroxyethyl-p-toluidine N,N-dihydroxypropyl-naphthylamine N,N-tetrahydroxyethyl-aminopyridine dihydroxyethylpiperazine polyethoxylated butyldiethanolamine polypropoxylated methyld ethanolamine (molecular wt. 1000) polypropoxylated methyldiethanolamine (molecular wt. 2000) polyesters with tertiary amino groups tri-2-hydroxypropyl-(1)-amine N,N-di-n-(2:3-dihydroxypropyl)-aniline N,N'-dimethyl-N-N'-bis-hydroxyethylhydrazine N,N'-bis-hydroxypropylethylenediamine N,N'-dimethyl-N-N'-bis(hydroxyethyl)-ethylenediamine ll-stearyldiethanolamine N,N'-bis(hydroxyethyl)-piperazine -1~4- ~25~04 The polysiloxane unit can be incorporated in the water-dispersible urethane compositions in an amount sufficient to provide the desired improvement in the surface properties of the polyurethane composition.
Useful polyethers are well-known and widely em-ployed in urethane technology.
The polyethers are generally prepared commercially from lower alkylene oxides e.g. ethylene, propylene and butylene oxide and di- or polyfunctional alcohols.
They have a molecular weight of from 400 to 5000. A list of commercially available polyethers, trade names, molecu-lar weight range and suppliers can be found in Volume II, Polyurethane, page 511, Encyclopedia of Polymer Science and Technology, John Wiley and Sons, Inc., 1969.
Hydroxy-terminated polyesters can be prepared from a polybasic acid, anhydride or aryl halide and a polyol, as described above. The polysiloxane unit can be incor-porated therein via the acid, anhydride and/or hydroxyl functionality.
Useful dicarboxylic acids are those derived from a saturated aliphatic dicarboxylic acid of 2 to 18 carbon atoms or an aromatic dicarboxylic acid of 8 to 18 carbon atoms, e.g. compounds of formula B(COOH) 2 where B is pre-ferably alkylene of 0-16 carbon atoms or arylene of 6 to 16 carbon atoms. Such acids include oxalic, malonic, succinic, glutanic, adipic, pirnelic, suberic, azelaic, sebacic, brassylic, thopsic, octadecanedioie, 1-4-cyclo-hexanedicarboxylic, 4,4'-dicyclohexyl-1'-dicarboxylic, 30d~

phthalic, isophthalic, terephthalic, methylphthalic, chlorophthalic, diphenyl-2,2'-dicarboxylic, diphenyl-4,~'-dicarboxylic, 1,4-naphthalene dicarboxylic, diphenyl-nethane-2,2'-dicarbosylic, diphenylmethane-3,3'-dicarboxylic, diphenylmethane-4,4'-dicarboxylic acid and the like.
Adipic acid and phthalic anhydride are the most common acid and anhydride. Of the polyols, the most commonly used include ethylene glycol, propylene glycol, 1,2-, 1,3- and 1,4-butylene glycol, 1,6-hexylene gly-col, trimethylolpropane, glycerol 1,2,6-hexanetriol and diethylene glycol.
Useful hydroxyl-terminated polyesters can also be derived from natural castor oil and glycerol or from caprolactones and ethylene glycol. Such hydroxy-termi-nated polyesters have hydroxyl numbers ranging from 40 to 500 and very low acid numbers ranging from 0 to 2.
Hydroxyl-terminated polycarbonates can be obtained by reacting an excess of a polyol with phosgene.
Hydroxy-terminated polybutadienes, or butadiene-styrenes and butadiene-acrylonitriles are useful herein, as are hydroxyl containing graft polymers of the poly-etherpolyacrylonitrile type.
Any convenient polyisocyanate can be used to react with the hydroxy-functional polysiloxane or with the polysiloxane-containing hydroxy-terminated prepolymer.
Myriads of useful isocyanates are well-known in the art.
Thus, one can use aromatic isocyanates, diisocyanates, -106~

triisocyanates and other polyisocyanates. Useful aro-matic diisocyanates can be represented by the formula AA(NC0) 2 where AA is phenylene that is unsubstituted or substitu-ted by one or two of alkyl of 1 to 4 carbon atoms, alkoxy of l to 4 carbon atoms, chloro, bromo and nitro, naphthylene that is unsubstituted or substi-tuted by one or two of alkyl of l to 4 carbon atoms, chloro bromo and nitro or where AA is a group of formula a' a'' ~-W-~

a ~,, where W is a direct bond, oxygen, methylene or ethylene and a, a', a'' and a''' each independently is hydrogen, alkyl of l to 4 carbon atoms alkoxy of l to 4 car-bon atomsl chloro or bromo Aromatic triisocyanates can be represented by the formula BB(NC0) 3 where BB is the benzene or toluene group. Aromatic di--107- ~2~30~

Aromatic di- and triisocyanates as described above include -Tolylene diisocyanate (TDI) (all isomers) 4,4'-diphenylmethane diisocyanate (~I) Tolidine diisocyanate Dianisidine diisocyanate m-Xylylene diisocyanate p-Phenylene diisocyanate C m-Phenylene diisocyanate 1-Chloro-2,4-phenylene diisocyanate 3,3'-Dimethyl-4,4'-bisphenylene diisocyanate 3,3'-Dimethoxy-4,4'-bisphenylene diisocyanate 4,4'-Bis(2-methylisocyanatophenyl) methane 4,4'-bisphenylene diisocyanate 4,4'-Bis(2-methoxyisocyanatophenyl) methane l-nitro-phenyl-3,5-diisocyanate 4,4'-diisocyanatodiphenyl ether 3,3'-dichloro-4'-diisocyanatodiphenyl ether 3,3'-dichloro, 4,4'-diisocyanatodiphenyl methane 4,4'-diisocyanatodibenzyl 3,3'-dimethyl-4,4'-diisocyanatodiphenyl 3,3'-dimethoxy-4,4'-diisocyanatodiphenyl 2,2'-dimethyl-4,4'-diisocyanatodiphenyl 2,2'-dichloro-5,5'-dimethoxy-4,4'-diisocyanatodiphenyl 3,3'-dichloro-4,4'-diisocyanatodiphenyl benzene-1,2,4-triisocyanate ` -108- ~5~30~

benzene 1,3,5-triisocyanate benzene-1,2,3-triisocyanate toluene 2,4,6-triisocyanate toluene 2,3,4-triisocyanate 1,2-naphthalene diisocyanate 4-chloro-1,2-naphthalene diisocyanate 4-methyl-1,2-naphthalene diisocyanate 1,5-naphthalene diisocyanate 1,6-naphthalene diisocyanate 1,7-naphthalene diisocyanate 1,8-naphthalene diisocyanate 4-chloro-1,8-naphthalene diisocyanate 2,3-naphthalnee diisocyanate 2,7-naphthalene diisocyanate 1,8-dinitro-2,7-naphthalene diisocyanate l-methyl-2,4-naphthalene diisocyanate 1-methyl-5,7-naphthalene diisocyanate 60methyl-1,3-naphthalene diisocyanate

7-methyl-1,3-naphthalene diisocyanate polymethylene polyphenyl isocyanate and co-products of hexamethylene diisocyanate and tolylene di-isocyanate Useful aliphatic diisocyanates include those of general formula AA(NC0) 2 wnere AA is alkylene of 2 to 16 carbon atoms. Useful aliphatic polyisocyanates include --109- ~2~6~304 1,2-ethane diisocyanate 1,3-propane diisocyanate 1,4-butane diisocyanate 2-chloropropane-1,3-diisocyanate pentamethylene diisocyanate propylene-1,2-diisocyanate 1,6-hexane diisocyanate 1,8-octane diisocyanate l,10-decane diisocyanate 1,12-didecane diisocyanate 1,16-hexandecane diisocyanate and other aliphatic diisocyanates such as 1,3-cyclohexane diisocyanate 1,4-cyclohexane diisocyanate cyclohexane triisocyanate 4,4'-methylene bis(cyclohexyl) isocyanate Additionally, the following diisocyanates are particularly preferred because urethane compositions made thereform tned to be non-yellowing:
1,6-hexamethylenediisocyanate (~DI) 2,2,4- and 2,4,4-trimethylhexamethylenediisocyanate (TMDI) dimeracid derived diisocyanate (DDI) obtained from dimerized fatty acids, such as linoleic acid 4,4'-dicyclohexylmethane diisocyanate (hydrogenated MDI) isophorone diisocyanate -110- ~Z ~

3-isocyanatomethyl-3,5,5-trimethylcyclohexylisoy-anate lysine methyl ester diisocyanate (LDIM) bis(2-isocyanatoethyl) fumerate (FDI~
bis(2-isocyanatoetbyl) carbonate Other useful isocyanates include polyisocyanates par-ticularly triisocyanates which are readily obtained by the reaction of an excess of the corresponding diiso-C syanate with water according to the following equation:

3 OCN-AA-NCO ~ H30 NH-AA-NCO
f=o N-~A-NCO
C=O
ND-AA -NCO
~here AA is the residue of a diisocyanate as described above; additional polyisocyanates include polymethylene polyphenylisocyanate (PAPI) and tris (isocyanatophenyl) thiophosphate (Desmodur R).
Additional isocyanate components can be prepared by reacting an excess of a diisocyanate as described above with a suitable hydroxyl component, such as a polyol described above or combination thereof, to ob-tain an isocyanate-terminated prepolymer.
In addition to the polyisocyanates, useful urethane compositions can be obtained from the aliphatic and aro-matic monoisocyanates. The low moiecular weight urethane z~3~

compositions obtained by reaeting a hydroxy-functional polysiloxane with a monoisocyanate are use~ul to impart soil and mold-release properties to a variety of natural and synthetie polymers.
Some useful aromatie monoisocyanates inelude -2-fluorophenyl isoeyanate 3-fluorophenyl isoeyanate 4-fluorophenyl isoeyanate m-fluorosulfonylphenyl isocyanate ~rans-2-pbenylcyclopropyl isocyanate m-tolyl isocyanate p-tolyl isoeyanate a, a, a-trifluoro-o-tolyl isocyanate a, , ~-trifluoro-m-tolyl ~socyanate p-bromophenyl isocyanate 2,5-dimethylphenyl isocyanate o-ethoxyphenyl isocyanate p-ethoxyphenyl isoeyanate o-methoxyphenyl isocyanate m-methoxyphenyl isoeyanate p-methoxyphenyl isoeyanate l-naphthyl isoeyanate o-nitrophenyl isoeyanate m~nitrophenyl isoeyanate p-nitrophenyl isoeyanate p-phenylazophenyl isoeyar.ate o-tolyl isoeyanate -112~ ' 3~

Useful aliphatic monoisocyanates include such alkyl isocyanates of 1 to 16 carbon atoms as methyl isocyanate ethyl isocyanate n-propyl isocyanate n-butyl isocyanate t-butyl isocyanate hexyl isocyanate octyl isocyanate dodecyl isocyanate octadecyl isocyanate hexadecyl isocyanate and mixtures thereof, as well as cyclohexyl isocyanate.
Isocyanate-terminated prepolymers typically having a molecular weight of from 200 to about 4000 can be pre-pared by reacting an excess of an isocyanate component with an polyhydroxy component. The isocyanate component can be a diisocyanate or polyisocyanate as previously described, or can be a low molecular weight isocyanate-terminated prepolymer.
The hydroxy component can be one or more of a polyol, polyester, polyether, polycarbonate and hydroxy-functional polysiloxane, all as described previously.
It can be seen that the properties of ultimate ure-thane compositions can be modified by appropriate modifi-cations in the compositions of the prepolymers.
The reaction between the isocyanate component and 1~ `304 the hydroxyl component can be carried out in bulk, i.e., without solvent, or in the presence of non-reactive, an-hydrous, organic solvents. Solvent media in which the reaction can be carried out include ketones, such as acetone, methyl ether ketone and methylisobutyl ketone;
esters such as ethyl acetate, butylacetate, 2-ethyl-hexyl acetate; hydrocarbons such as hexane, haptane, octane and higher homologs, cyclohexane, benzene, tolu-ene, xylene or blends of aliphatic, cycloaliphatic and aromatic hydrocarbons. It is also possible to employ ethers, both aliphatic and alicyclic including di-n-propyl ether, di-butyl ether, tetrahydrofuran and the diethers of polyalkylene oxides. In add-tion, chlori-nated solvents such as dichloroethyl ether, ethylene dichloride perchloroethylene and carbon tetrachloride can be used.
In all cases, the solvents should be anhydrous to avoid urea formation.
The reaction can, if desired, be catalyzed and those catalysts conventionally employed in the urethane art are useful herein. Useful catalysts fall principally in two groups -a. amino compounds and other bases:
triethylamine and other trialkylamines triethylenediamine 1,4-diaza-2,2,2-bicyclooctane N-(lower) alkyl morpholines N,N,N',N'-tetra-methylethelenediamine .. , `` -114- ~3~

~,N,N',N'-tetramethyl-1,3-butanediamine N,N,N',N'-substituted piperazines dialkylalkanolamines benzyltrimethylammonium chloride b. organometallic and inorganic compounds:
cobalt naphthenate stannous chloride stannous actoate stannous oleate dimethyl tin dichloride di-n-butyltin dilaurlmercaptide tetra-n-butyl tin trimethyl-tin hydroxide di-n-butylti~dilaurate Such catalysts may be used singly or in combination with each other. Beneficial synergistic catalysis may occur when combinations are used.
While it is possible to carry out the reaction with-out the use of a catalyst, it is preferable for reasons o~ economy and to assure a complete reaction, to utilize one or more catalysts as listed in amounts ranging from 0.001 to 1% based on the weight of the reactants. It is similarly advantageous to carry out the urethane synthesis at elevated temperature, usually between room temperature and 120C and preferably at 60 to 80C to obtain a com-plete reaction between 0.5 to 8 hours reaction time.
The reaction can be easily followed by titration of the isocyanate group or by IR analysis.

~`` -115- ~2-$~304 From the foregoing discussion it is seen that the siloxane unit can be incorporated into a polyurethane polymer in a variety of ways; the resulting polyurethane composition has improved properties that were previously unavailable via a siloxane-containing molecule.
10. Polyamide The term "nylon" generically describes a family of thermoplastic polyamide resins stemming from two basic chemical intermediate groups. The first in the con-:len-sation polymerization of a diamine and a diacid; :Eorexample, the reaction of hexamethylene diamine lvitlh adipic acid:
H2N-(CH2)6-NH2 + HOOC-(CH2)4 ~ ¦ -TI20 r H 0 ,0, t~- (CH2)6-N-C-(CH2)4-C ~

Hexamethylene diamine is a widely used diamine.
typical acids include adipic, azelaic, sebacic and dode-canedoic.
The second group utilizes amino acids or amino acid derivatives, such as caprolactam, aminoundecanoic acirl and lauryllactam:
o H ~ C ~CH ¦ H 0 ~21C CH ~t N-(CH2)5-C

H2C CH2 n -115a~ 30~

The properties of pol~amide polymers can be -nproved by the incorporation therein of a sil~xane unit of formula R~ ~ Rz¦¦ R~l ~ Rsl R~

R~ I 6 ~

where the various elements are as previously described.
There can be incorporated from 0.01 to about 30 mole % of the siloxane u~it, initially present as either the diamine or the diacid. In general, there can be pre-sent from 0.1 mole ~0 to 15 mole cO of the siloxane and at these levels there is seen an improvement in the various properties. Thus, there is oblained a siloxane-modified polyamide polymer having improved heat stability, lower surface friction, improved surfacé wear characteristics for moving contact mechanical applications and improved mold release. The polyamide also has improved resistance to hydrolysis and to chemicals.
The polymers have good impact strength and ductility as well as improved UV resistance. They can be molded or extruded.
In one embodiment there is contemplated the reaction product of a bis(amino)siloxane with a diacid; in another embodiment, there is contemplated the reaction product of a bis(carboxy)siloxane with a diamine to form part of a polyamide.

-115b_ ~30~

Throughout this specification the siloxane unit has been depicted as being divalent:
I 1 - I 2- R 9 ~ R~ 11 -Q-Z-D-Si- -0-Si- 0-Si ~L0-Si- -0-Si-D-Z-Q-It is apparent, however, that the unit can be bonded to a polymer matrix in a polyvalent fashion and thaL the depiction of the unit as divalent is merely a convenient simplification. Specifically, the dianhydride will yield a tetravalent unit while the acid-anhydride will yield a trivalent unit. Reactive groups on Q in addition to F, and reactive groups on the silicone substituents will provide a polyvalent unit. Thus, depiction of the siloxane unit as divalent is intended to be illustrative and not limiting.
The foregoing specification has described a variety of molecular configurations and applications of a poly-siloxane to whose surprising heat resistance and stability these are attributable. The properties and applications of some of these polysiloxanes are illustrated in the following Examples; it will be immediately apparent that the chemicals arts now have a new means for modifying a variety of polymers and for synthesizing compositions useful in a spectrum of applications.

-116- ~2S~3~4 EXAMPLE I
Preparation of Bis-(p-aminophenylthiobutyl)tetramethyl-Disiloxane A glass reactor is charged with 43.28 parts of a 50% aqueous sodium hydroxide solution, 112 parts dimethyl-sulfoxide (DMS0), 120 parts toluene and 68.75 parts p-aminothiophenol. The reaction is heated to the boiling point under a nitrogen atmosphere with rapid agitation.
The water present in the reactor is removed by azeo-tropic distillation and collected in a Dean Stark trap.
The organic solvent that collects in the trap is re-turned to the reaction mixture. The temperature of the reaction mixture increases from an initial 110C to about 122C while the reaction mixture is stirred for between 7 and 8 hours. At the end of this time period water is no longer evolved from the reaction mixture.
The reaction mixture is then cooled to about 80C, at which time 86.6 parts of bis-(chlorobutyl)tetramethyl-disiloxane is added dropwise to the reaction mixture.
The chemical reaction which occurs during this addition is slightly exothermic, and the rate of the addition is controlled to maintain the reaction mixture temperature at about 80C. Upon completion of the disiloxane addition, the reaction mixture is heated at a temperature of 80C
for a period of about 16 hours.
Samples from the reaction mixture are removed periodically and analyzed by means of vapor phase chroma-tography. When the amount of product, as indicated by ~25~;D30~

a new peak having a longer retention time relative to the starting materials reaches a maximum value,the reaction is considered to be complete. The reaction mixture is then filtered and the solvents, toluene and DMS0, are removed under a reduced pressure of about lOmm of mercury. The residue is then distilled and the desired end product is recovered at a tempera-ture of from about 310C to 315C at from O.lmm to C 0.5mm (Hg) pressure. The chemical structure is con-~irmed by analytical infrared spectroscopy, and corresponds to the structure of the desired product, bis-(p-aminophenylthiobutyl)tetramethyldisiloxane. The yield of this material is about 85 percent.

Z~$3~

EXA.~PL~ II
Preparation of Bis-(p-aminoPhenoxybutYl)Tetramethyl-Disiloxane The procedure described in ~xample I is repeated substituting 59.95 parts of p-aminophenol for the p-aminothiophenol and the f inal product is recovered by distillation at a temperature o~ from 295C to about 300C under a pressure of from 0.5mm to about 2mm C pressure o~ mercury. The ~inal product is identified as bis(p-aminophenoxybutyl~tetramethyldisiloxane.
This compound is initially a colorless liquid which eventually solidifies to a white solid which melted from 48C to 49C.

' ` -11 9-lZ~

EXAMPLE III
Pre~aration of Bis-~m-aminophenoxyprcpyl)Tetramethyl-Disiloxane The process described in Example I was repeated substituting 59.95 parts of m-aminophenol for the p-aminothiophenol and 78.9 parts of bis-(chloropropyl) tetramethyldisiloxane for the bis-(chlorobutyl)tetra-methyldisilGxa~e. ~he end product was recoYered ~y distillation within tke temperature range of from 245C to 260C under a pressure of from 0.5mm to 2.0mm of mercury. This product was ident if ied as bis-(amino-phenoxypropyl)tetramethyldisiloxane, a pale yellow liquid which did not solidify upon standing at 0C
for three days. Its pority, as determined by titra-tion with perchloric acid, exceeded 99%.

-120- ~ ,3~3~

EXA~PLE IV
Preparation of Bis-(p-aminophenylsulfoxobutyl_tetra-methyldisiloxane A quantity of bis-~p-aminophenylthiobutyl)tetra-methyldisiloxane, prepared as described in Example I, is dissolved in chloroform and the resultant solution is cooled in an ice bath. A solution of m-chloro-perbenzoic acid in chloroform (an equimolar amount C based on disiloxane) is then added dropwise to the reaction mixture with stirring, and stirring is con-tinued for lt2 hour following completion of the addition. The solid phase of the reaction mixture is removed by filtration and the chloroform present in the filtrate is evaporated under reduced pressure to iso'ate the desired product, which corresponds to the formula 0 CHg CH3 0 E 2 N ~ S - (CH 2 ) 4 -5 i -0-5 i- ( CH~) 4 -S ~ -NH 2 -121- ~b~ 3~

EXAMPLE V
Preparation of Bis-(~-aminophenYlsulfobutyl)tetrameth Disiloxane A reactor equipped with a reflux condenser, agita-tor and a nitrogen inlet is charged ~ith one mole of sodium p-aminobenzene sulfonate dissolved in dimethyl sulfoxide. To this solution is gradually added 0.5 mole of bis-(chlorobutyl~tetramethyldisiloxane. The rate of addition is controlled to maintain the tempera-ture of the reaction mixture at about 80C. Upon com-pletion of the disiloxane addition the reaction mixture is heated at a temperature of 80C ~or a period of about 16 hours. The reaction mixture is then filtered and the solvents evaporated as described in Example I
to obtain a product that corresponds to formula E 2 N - ~ -S-(C~ 2 ) 4 -S i -O-s i - ( C~ 2 ) 4 -S-~ -NH 2 -122- ~s~304 EXA~LE VI
A. Preparation of Bis(p-aminophenylsul am~lbut~l) tetramethyl disiloxane A glass reactor is charged with 34.4 grams of p-aminobenzensulfamide, 16 grams of sodium hydroxide, in the ~orm of a 50% aqueous solution, 60 mole of di-methylsulfoxide and 56 mole of toluene under nitrogen and heated to the boiling point in a nitrogen atmosphere with rapid agitation. Water formed is removed azeo-tropically and collected in a Dean Stark trap. When the reaction is complete, as evidenced by no further ev-olution of water, the reaction mixture is cooled to about 80 C and 31.5 grams of bis(chlorobutyl) tetramethyl disiloxane is added dropwise; the reaction is slightly exothermic and the addition rate is adjusted to maintain the reaction mixture at about 80 C. Upon completion of the addition, the mixture is stirred for about 16 hours at about 80 C.
When the reaction is complete, the solvents are re-moved and the product recovered in accordance with the procedure of Example 1.
B. Preparation of Bis(p-aminophenylcarbamoylpropyl) tetramethyl disiloxane Under nitrogen, a glass reactor is charged with 27.2 grams p-aminobenzamide, 16 grams sodium hydroxide as a 50aO aqueous solution, 60 mole dimethyl sulfoxide and 56 mole toluene and reacted as in Example VIA, above.

~ 12SU3~)4 When the reaction is complete, the mixture is cooled to about 80 C and 28.7 grams of bis(chloropropyl) tetra-methyl disiloxane are added dropwise.
The reaction conditions described in Example VIA are followed and the product is recovered; structurs is con-firmed by IR and NMR analysis.
C. Preparation of Bis(p-aminophenylcarbonyloxybutyl) tetramethyl disiloxane Following the procedure of Example VIA, there is reacted p-aminobenzoic acid 137 grams NaOH 40 grams in 200ml H2O
Xylene 1000ml When the system is anhydrous, the temperature is lowered to about 110C and 10 grams of tetrabutylphos-phonium chloride are added all at once. There is then initiated the dropwise addition of 157.5 grams of bis (chlorobutyl) tetramethyl disiloxane. Upon completion of the addition, the mixture was stirred overnight at 115C.
The product was worked up as indicated in Example VIA; it was a viscous oil whose structure was confirmed by IR and NMR analysis.
The product was purified by forming an ethanol so-lution of the bis (amine dihydrochloride) and recrys-tallizing it.

-1~4- ~Z~ 04 EXAMPLE VII
Preparation of Bis(aminophenoxymethyl? tetramethyl disiloxane Following the procedure described in Example 1, the following ingredients were combined and reacted in a glass reactor under nitrogen:
m-aminophenol 56.86 parts by wt.
toluene 120.0 parts by wt.
C dimethylsulfoxide 112.0 parts by wt.
50% NaOH solution 43.28 parts by wt.
When the reaction was complete, as indicated by termination of water evolution, the reaction temperature is reduced to 75C and dropwise addition of 63.5 parts by wt. of bis(chloromethyl) tetramethyl disiloxane initiated. After complete addition, the reaction mix-ture is stirred at 75C.
At the end of the reaction the mixture was filtered and the solvents removed under vacuum at 5-10 mm of mercury. The residue was distilled, the product coming over at 254C at 7 mm of mercury as a yellow oil; yield was about 85%. The chemical structure was confirmed by IR and NMR analysis as:

H~N~ CH 3 CH 3 ~ NH2 -O-CH2-~i-O-~i-CH2-O

lZ~3304 r EXAMPLE VIII
Preparation of Bis(aminoPhenoxyoctyl) tetramethyl disiloxane 1. Preparatio~ of bis(8-bromooctyl) tetramethyl di-siloxane. The Pt catalyzed addition of chlorodimethyl-silane to 1,7-octadiene provides 7-octenyldimethyl-chlorosilane. The peroxide-catalyzed addition of HBr to this intermediate yields 8-bromooctyl dimethyl chloro-C silane; this is hydrolyzed to provide bis(8-bromooctyl) tetramethyl disiloxane.
2. The reaction conditions of Example ~II are repeated, except that the bis (chloromethyl) tetramethyl disiloxane is replaced by 139.32 parts by weight of bis(8-bromooctyl) tetramethyl disiloxane.

3C)4 <
EXAMPLE IX
Preparation of Bis-(p-amino-o-chloro ~enoxybut~l)tetra-methyldisiloxane The procedure described in Example I is repeated substituting 2-chloro-4-aminophenol for the p-aminothio-phenol, which is reacted with a stoichiometric amount (1:1 molar ratio) of a 50% aqueous sodium hydroxide solution. The resultant sodium phenoxide solution is reacted with a stoichiometric amount of bis-(chlorobutyl) tetramethyldisiloxane to form a product of formula Cl / CH3 CH3 Cl H 2 N ~ -0-(CHz) 4 -S i-0-6i-(CH 2 ) 4 -~ -NH 2 2,~30~

EX~MPLE_X
Preparation of 1,3-Bis-~p-formylphenoxypropyl)tetrameth Disiloxane The procedure described in Example I was repeated using 67.1 parts of p-formylphenol in place of the p-aminothiophenol, and 91.57 parts of chloropropyldimethyl-methoxysilane in place of the bis-(chlorobutyl)tetra-methyldisiloxane. The end product was recovered by distillation at a temperature within the range of from 215C to 230C under a pressure of from O.lmm to 0.5mm of mercury. The recovered end product was a colorless liquid and was idéntified as p-formylphenoxypropyl-dimethylmethoxysilane. Its purity, as determined by vapor phase chromatography, was 99%. The product yield was 6070.
This material was then added to a large excess of methanol containing a 100% excess of the amount of water sufficient to convert all the alkoxysilane to the di-siloxane. A pellet of KOH was also added as a catalyst.
The reaction remained at ambient temperature for about 16 hours with constant stirring. The methanol and water were removed by distillation, and the disiloxane was recovered by a molecular distillation. The chemical structure of the product recovered was confirmed by in~
frared and nuclear magnetic resonance spectra and corres-ponded to 1,3-bis-(p-formylphenoxypropyl)-tetramethyl-disiloxane.

-12~-EXAMPLE XI
Preparation of 1,3-Bis-m-(N-MethylaminophenoxyproPyl~
Tetramethyldisiloxane The procedure of Example X was repeated substituting 67.65 parts of m-(N-methylamino)phenol for the p-formyl-phenol. The final product was recovered at a temperature within the range of from i70C to 175C under a pressure c of from about O.lmm to 0.5mm of mercury. This product was a very pale yellow liquid identified as m-(N-methyl-amino)phenoxypropyldimethylmethoxysilane. The silane product was hydrolyzed to l,3 bis-m(N-methylaminophenoxy-propyl)tetramethyldisiloxane in the same manner described in Example X.

-129- ~3~)4 EXAMPLE XI I
Preparation of 1,3-Bis(p-Carbomethoxyphenoxypropyl) Tetramethyldisiloxane The procedure of ~xample X was repeated substi-tuting 83.6 parts of p-carbomethoxyphenol for the p-formylphenol. The end product was recovered by dis-tillation at a temperature within the range of from 185C to 200C under a pressure of from 0.5mm to 2.0mm o~ mercury. This product was a colorless liquid identi-fied as p-carbomethoxyphenoxypropyldimethylmethoxysila~e.
The silane product was hydrolyzed to 1,3--~is-(p-carbo-methoxyphenoxypropyl)tetramethyldisiloxane in the same manner described in Example X.

30~
EXAMPLE ~III

Preparation of 1,3-Bis(m-Hydroxyphenoxybutyl)Tetramethyl-Disiloxane The procedure of Example I is repeated using 83.6 parts of resorcinol monoacetate in place of the p-amino-thiophenol. The stripped mixture is distilled at a temperature of 270C to 280C at ~rom 0.lmm to 0.5mm pressure. The product is 1,3-bis(m-acetoxyphenoxybutyl) tetramethyldisiloxane; this acetate ester is hydrolyzed with HCl to obtain the hydroxy compound.

304~

E~A~LE XIV

Preparation of 1,3-Bis~p-Carboxyphenoxybutyl)Tetramethyl-Disiloxane A reaction mixture consisting of 8 parts NaOH in 200 parts H20 and 54.6 parts of 1,3-bis(p-carbomethoxy-phenoxybutyl)tetramethyldisiloxane (see Example XII) were combined and heated to reflux. The mixture was initially heterogeneous but became homogeneous after three hours, at which time the reaction was terminated, extracted two times with 100ml. toluene and acidified with excess ~Cl. A white precipitate formed, which was filtered and recrystallized from pentane. The structure was confirmed by I.R. and N.M.R.

~2S~30~

EXAMPLE XV

Preparation of 1,3-Bis(p-8romophenoxybutyl)Tetramethyl-Disiloxane A three-necked flask is charged with 43.28 parts of 50% aqueous sodium hydroxide solution, 112 parts dimethylsulfoxide (DMS0), 120 parts toluene and 95.15 parts p-bromophenol. The reaction is brought to reflux C in a nitrogen atmosphere with rapid agitation. The water of the charged ingredients (the aqueous hydroxide solution) and the water formed during the neutralization reaction is removéd azeotropically and collected in a Dean Star~ trap. The refluxing solvent is returned to the reaction mixture. The pot temperature, that is the temperature of the reaction mixture, climbs from an initial 110C to about 118C during a period of from 7 to 8 hours of stirring. At the end of this time period water is no longer evolved from the reaction mix-ture.
The reaction mixture is then cooled to about 80C.
At this temperature of about 80C, 86.6 parts of bis-(chlorobutyl)tetramethyldisiloxane is added dropwise to the reaction mixture. The chemical reaction which occurs during the dropwise addition is slightly exothermic.
Therefore, the addition is controlled to retain the re-action temperature at about 80C. Upon completion of the siloxane addition, the reaction is allowed to proceed at about ~0C for a period of time which is usually over-r night.
The reaction is monitored such, for example, as by use of a GC analytical means. When GC analysis indicates a new peak having a long retention time is maximized, the reaction is complete.
The reaction mixture is filtered and the solvents, toluene and DMS0, are removed under a reduced pressure of about lOmm. The stripped mixture is distilled and the desired end product is recovered at a temperature o~ from about 170C to 180C at from O.lmm to 0.5mm pressure. The chemical structure is confirmed by chemical analysis using I.R. and ~.M.R.

-134- 12~3~)4 EXAMPL~ XVI

Preparation of 1 3-Bis(m-Ethylaminophenoxybutyl)Tetra-methyldisiloxane The procedure of Example XV is repeated using 75.35 parts of m-ethylaminophenol in place of the bromophenol.
The product is distilled at 180C to 190C at O.lmm to 0.5mm pressure.

135 1~30~
EXAMPLE XVII

Preparation of 1,3-Bis(Cyanophenoxybutyl)Tetramethyl-Disiloxane The procedure of Example XV is repeated using 65.45 parts o~ p-cyanophenol. The product is distilled at 285C to 300C at O.lmm to 0.5mm pressure.

-~36~ 3~'~

EXAMPLE XVIII

Preparation of 1,3-bis(p-acetylphenoxybutyl)Tetramethyl-Disiloxane The procedure of Example XV is repeated using 74.8 parts o~ p-acetylphenol. The product is distilled at reduced pressure.

-137 ~ 3~)~

~XAMPLE XIX

Preparation of_bis(p-aminophenylthiobutyl~tetramethyl-disiloxane usin~ phase transfer catalyst Example I illustrates the use of a dipolar aprotic solvent in the synthesis of a disiloxane. This example repeats that synthesis, using a phase transfer Gatalyst.
A three-necked flask was charged with 43.28 parts C of 50~ aqueous sodium hydroxide solution and 68.75 parts p-aminothiophenol. The charged ingredients were heated to 50C and stirred continuously for 1/2 hour to ensure complete neutralization of the ingredients.
232 parts toluene was added to the flask to form a reaction mixture. The reaction mixture was heated to reflux in a nitrogen atmosphere while being rapidly agitated. The water of the charged ingredients (the aqueous hydroxide solution) and the water formed during the neutralization reaction was removed azeotropically and collected in a Dean Stark trap. The refluxing sol-vent was returned to the reaction mixture. The pot temperature, that is the temperature of the reaction mixture, climbed from an initial 110C to about 120C
during a period of from 7 to 8 hours of stirring. At the end of this time period water was no longer being evolved from the reaction mixture.
The reaction mixture was then cooled to about 80C.
At this temperature of about 80C, there was added at ~Z~3(~4 once 4 grams te~rabutyl ammonium chloride and 86.6 parts of Bis-(chlorobutyl)tetramethyldisiloxane was also added dropwise to the reaction mixture. The chemical reaction which occurred during the dropwise addition was slightly exothermic. Therefore, it is preferred that the addition must be controlled to retain the reaction temperature at about 80C. Upon completion of the silane addition, the reaction was allowed to proceed at about 80C for C a period of time which extended overnight while being constantly agitated.
The reaction was monitored by use of a GC analytical means. When GC analysis indicated a new peak having a long retention time had become maximized, the reaction was complete.
The reaction mixture was filtered and the solvent, toluene was removed under a reduced pressure of about lOmm. The stripped mixture was distilled and the desired end product recovered at a temperature of from about 310C to 315C at from O.lmm to 0.5mm pressure. The chemical structure was confirmed by I.R. and N.M.R. means.

~2~3~)4 E2A~PLE XX

Preparation of bis-(p-aminophenoxybutyl)Tetramethyl-Disiloxane The same process of Rxample XIX was practiced ex-cept that 59.95 parts of p-aminophenol was substituted for p-aminothiophenol and the tetrabutyl ammonium chloride was replaced with 4 grams tetrabutyl phos-C phonium chloride and the end product was recovered at from 0.5mm to about 2mm pressure o~ mercury. The re-covered product was identified as Bi.s-(p-aminophenoxybutyl) tetramethyldisiloxane.

-l~U- ~;~3C)4 EXAMPLE XXI

Preparation of bis-(m-aminophenoxybutylitetramethyl-disiloxane using macrocyclic crown ether as phase transfer catalyst The process of Example XIX was again practiced except that 59.95 parts of m-aminophenol was substi-tuted for the p-aminothiophenol and 78.9 parts of Bis-(chloropropyl)tetramethyldisiloxane was substituted for the Bis-(chlorobutyl)tetramethyldisiloxane, and the phase transfer catalyst was 3 grams of 18 crown -6 ether. The end product was recovered at a temperature within the range of from 245C to 260C at from 0.5mm to 2.Omm of mercury. The recovered product was identified as Bis-(m-aminophenoxypropyl)tetramethyldisiloxane. The recovered product material was a pale yellow liquid which did not solidify upon standing in the cold at 0C
for 3 days. Its purity, as determined by titration with perchloric acid, was better than 99%.

~25~3~)~

r E~A~LE XXII

Pre~aration of 1,3-Bis~(p~formylphenoxypro~yl)tetra-meth~ldisiloxane using phase transfer catalyst The process of Example ~IX was again followed, ex-cept that 67.1 parts of p-formylphenol was substituted for the p-aminothiophenol and 91.57 parts of chloro-propyldimethylmethoxysilane was substituted for the C Bis-(chlorobutyl)tetramethyldisiloxane. The phase trans-fer catalyst was 5 grams cetyltrimethylammoniumbromide.
The end product was recovered at a temperature within the range of from 215C to 230C at from about O.lmm to 0.5mm of mercury. The recovered end product was a color-less li~uid and was identified as p-formylphenoxypropyl-dimethylmethoxysilane. Its purity, as determined by GG, was 99%. The product yield was 60%.
The end product was then added to a large excess of methanol containing 100% excess of water sufficient to convert all the alkoxysilane to the disiloxane. A
pellet of K0~ was also added to the reaction as a catalyst to facilitate the reaction. The reaction was carried out overnight at room temperature while being constantly stirred. The methanol and excess water was removed by distillation, and the disiloxane was recovered by a molecular distillation. The chemical structure of the product recovered was confirmed by I.R. and N.M.R. as 1,3-Bis-(p-~ormylphenoxypropyl)tetramethyldisiloxane.

-142- ~ 4 EXAI~PLE XXIII

Preparation of 1,3-Bis-(m-methylaminoPhenox~propyl)tetra-methy'disiloxane using phase transfer catalyst The process of Example XXII was practiced except that 67.65 parts of m(N-methylamino)phenol was substi-tuted for the p-formylphenol. The phase transfer catalyst was 5 grams of triphenylbenzylphosphonium chloride. The end product was recovered at a temperature within the range of from 170C to 175C at a pressure of from about O.lmm to 0.5mm of mercury. The recovered end product was a very pale yellow liquid identified as Bis-(m-methyl-amino)phenoxypropyldimethylmethoxysilane. The silane product was hydrolized to 1,3 Bis-(m-methylaminophenoxy-propyl)tetramethyldisiloxane in the same manner described in Example XXII.

-143- ~ 3~

EXAMPLE XXIV

Preparation of 1,3-Bis-(p-carbomethoxy~henoxypropyl) tetramethyldisiloxane The process of Example XXII was practiced except that 83.6 parts of p-carbomethoxyphenol was substituted for the p-formylphenol. The end product was recovered at a temperature within the range of from 185C to 200C
at a pressure of from 0.5mm to 2.Omm of mercury. The recovered end product was a colorless liquid identified as p-carbomethoxyphenoxypropyldimethylmethoxysilane. The silane product was hydrolized to 1,3-Bis-(p-carbomethoxy-phenoxypropyl)tetramethyldisiloxane in the same manner described in Example XXII.
In a similar manner, by employing the procedures of the preceeding examples, siloxanes containing a .variety of functional groups can be prepared; those groups have been discussed previously and their specific configuration will be determined by the characteristics desired.

-14~-gZS~3C~
EXAMPLE XXV
Preparation of the polysiloxane of formula H 2N O- ( C~2 ) 4 - 8 i - O ¦ S 1- ~ _S i - ~L s l _ ( CH ~ ) 4 - o- ~ N~2 CH3 CH3 6 o 3H3 C About 0.1 gram of potassium hydroxide was added to a reaction mixture containing 46 grams Bis(m-aminophenoxy-butyl)tetramethyldisiloxane, 44.4 grams octamethylcyclo-tetrasiloxane (hereinafter referred to as "phenyl tetramer") under a nitrogen atmosphere. The reaction mixture was then heated at the boiling point (178C) for 3 hours, at which time the boiling poin~ began to increase. When the boiling point reached 215C, the reaction mixture was maintained at this temperature for an additional 6 hours, then cooled to room temperature. A 1 gram por-tion of sodium bicarbonate was then added to the reaction mixture and the mixture was stirred rapidly for 15 minutes.
The reaction mixture was then filtered to obtain a product which was a homogeneous amber liquid. The amino content was determined by titration of an aliquot portion of the product using a O.OlN perchloric acid solution to a bromcresol purple end point. The titration indicated that 3.32% by weight of amine groups were present. Based on this amine content and the amount of starting materials, the general formula of the product was calculated.

~Z~

EXAMPLE XXVI
Preparation of the polysiloxane formula ~2 ~ 0-(C~2)4-Si-O~ 0 _ S -(CH~)~-0- ~ NHz A lcc portion of a solution containing 50ppm tetra-butyl phosphonium trimethylsilanolate in methyl tetramer was added to a reaction mixture containing 612 grams 1,3,5,7-tetramethyl, 1,3,5,7-tetraphenylcyclotetrasiloxane and 138 grams Bis(p-aminophenoxybutyl)tetramethyldisiloxane under a nitrogen atmosphere. The reaction mixture was heated at 115C for 4 hours. During this period of time, the viscosity of the reaction mixture was observed to increase and to then reach a stable value. At the end of the 4-hour period, the temperature of the reaction mix-ture was raised to 160C for 3 hours to effect destruction of the catalyst. The reaction mixture was cooled to room temperature and filtered to obtain an end product which had a deep amber color.
An aliquot of the end product was titrated with a O.lON perchloric acid solution to a bromcresol purple end point. The amount of perchloric acid required was equivalent to 1.2% by weight of amine groups in the pro-duct. Based on this value and the amount of starting materials, the general formula for the product was calcu-lated.

12`~3C~

EXAMPLE XXVII
Preparation of the polysiloxane of formula H ~ CH3 ~ IH3 1 ¦ IH3 IH3 ~H2 -(CH2)4-S -O~S -O~Si-O' I -(CH2)4-0-~

20- 1.6 The equilibrated amino functional polysiloxane of the general formula indicated above was prepared by the equilibration of Bis(m-aminophenoxybutyl)tetramethyldi-siloxane with octamethylcyclotetrasiloxane and 1,3,5,7-tetramethyl, 1,3,5,7-tetraphenylcyclotetrasiloxane.
Two pellets of potassium hydroxide, equivalent to about 0.1 gram, were added to a reaction mixture con-taining 4.6 grams Bis(m-aminophenoxybutyl)tetramethyl-disiloxane, 14.8 grams octamethylcyclotetrasiloxane, and 2.2 grams 1,3,5,7-tetramethyl, 1,3,5,7-tetraphenyl-cyclotetrasiloxane under a nitrogen atmosphere. The reaction mixture was heated to the boiling point which 15 gradually increased to 215C during a two hour period. The reaction mixture was maintained at this temperature for eight hours, after which it was cooled to room temperature and 1 gram of tris-chloroethylphosphite was added to de-stroy the potassium hydroxide catalyst.
2Q The reaction mixture was then filtered. An aliquot of the filtrate, a homogeneous amber fluid, was titrated with O.lON perchloric acid solution to a bromcresol purple -147- ~2~3~)4 end poi~t. The amount of perchloric acid required was equivalent to 1.32% by weight of amine groups in the product. Based on this value and the amou~t of starting materials, the general formula for the product was calcu-lated.

~, E~A~IPLE XXVI I I
Preparation o the polysiloxane of formula 2 ~ O-(CH ) -Si-O Si-O ~, Si-OI Si-(CH2)4-O ~ ~ NH2 CH3 ¦ CH3 I CH l CH3 L ~ LCH2 ~

The equilibrated amino functional polysiloxane of the general formula indicated above was prepared by the equilibration of Bis(p-aminophenoxybutyl)tetramethyldi-siloxane with octamethylcyclotetrasiloxane and 1,3,5,7-tetramethyl, 1,3,5,7-tetravinylcyclotetrasiloxane.
One half gram of tetræbutylammonium hydroxide was added to a reaction mixture containing 4.6 grams Bis (p-aminophenoxybutyl)tetramethyldisiloxane, 55.5 grams octamethylcyclotetrasiloxane and 6.4 grams 1,3,5,7 tetra-methyl, 1,3,5,7-tetravinylcyclotetrasiloxane under a nitrogen atmosphere. The reaction mixture was then main-tained at a temperature of 110C for 8 hours. The tempera-ture of the reaction mixture was then raised to 160C
and maintained at this level for 3 hours, following which the reaction mixture was cooled to room temperature and filtered. An aliquot of the filtrate, a homogeneous amber fluid, was titrated with a 0.01N perchloric acid solution to a bromcresol purple end point. The amount of perchloric -149- ~2~304 acid required was equivalent to 0. 43~o by weight of amine groups in the product. Based on this and the amount o~
starting materials, the general formu].a for the product was calculated.

~~ ~15~ 30~

EXA.~IPLE ~XIX

Preparation of the polysiloxane formula H N ~ I - . NH2 2 ~ CH3 ¦ IH3 IH3 ! IH

O-(CH2)4-S -O l Si-O - S -O - S -(CH2)4-0 ~ 8i 2 , 0.65 The equilibrated amino functional polysiloxane o~
the general formula indicated above was prepared by the equilibration of Bistm-aminophenoxybutyl)tetramethyldi-siloxane with l,3,5,7-tetramethyl-1,3,5,7-tetraphenyl-cyclotetrasiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraxiloxane.
One hal~ gram potassium hydroxide was added to a reaction mixture containing 184 grams Bis(m-aminophenoxy-butyl)tetramethyldisiloxane, 43S.2 grams of 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane and 22.36 grams 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclo-tetrasiloxane under a nitrogen atmosphere. The rea~tion mixture was then heated to the boiling point, which was gradually i~creased to 210C over a two hour period. The reaction mixture was maintained at this temperature for 10 hours, then cooled to room temperature and 2 grams sodium bicarbonate were added, with rapid agitation, which was continued for 15 minutes.

~L~2~1 3~

The reaction mixture was then filtered and an aliquot of the filtrate, a homogeneous amber fluid was titrated with a O.OlN perchloric acid solution to a bromcresol purple end point. The amount of perchloric acid required was equivalent to 1.84% by weight of amine groups in the product. Based on this value and the amount of starting materials, the formula was calculated.

-152- ~2$~304 E~AMPLE XXX
Preparation of the polysiloxane formula H2N ~ IH3 I ~ ~ H2 -(CX2)4-li- -Si-0 _ Si-OI Si-(CH2)4-O-CH3 CH3_ 20 C 2 I H3 < The equilibrated amino functional polysiloxane of the general formula indicated a~ove was prepared by the equilibration of Bis(m-aminophenoxybutyl)tetramethyldi-siloxane with octamethylcyclotetrasiloxane and a mixture of cyclic cyanoethylmethylsiloxanes.
Three pellets, equivalent to 0.15 gram of potassium hydroxide, were added under a nitrogen atmosphere to a reaction mixture containing 4.60 grams Bis(m-aminophenoxy-butyl)tetramethyldisiloxane, 14~ grams octamethylcyclo-tetrasiloxane, and 22.6 grams of a mixture of cyclic cyanoethylmethylsiloxanes containing from 3 to 10 silicon atoms in the ring. The reaction mixture was heated to the boiling point, which gradually increased to 210C
over a two hour period. This temperature was maintained for 10 hours, after which the reaction mixture was cooled to ambient temperature. Two grams of ammonium chloride were added and the reaction mixture was stirred rapidly for 1/2 hour.
The reaction mixture was then filtere An aliquot of the flltrate, a homogeneous amber iluid was titrated -153_ ~ S~ ~n 4 with a O.lON perchloric acid solution to a bromcresol purple end point. The amount o~ perchloric acid re-quired was equivalent to 1.32% by weight of amine groups in the product. Based on this value and the amount of starting materials, the general formula of the produ~t was calculated.

-154~ 3~4 EXAMPLE XXXI

Preparation of the polysiloxane of the formula ~:2 ~ O-~C~2)4-51-O+~-O ~ I 1-(C~ 4-O~ O ~NEI2 !INH2 _ 5 The equilibrated amino functional polysiloxane of the general formula indicated above was prepared by the equilibration of Bis(p-aminophenoxybutyl)tetramethyldi-siloxane with 1,3,5,7-tetramethyl-1,3,5,7-tetraphenyl-cyclotetrasiloxane and cyclic y-aminopropylmethylsiloxanes.
Two pellets, equivalent to about 0.1 gram, of po-tassium hydroxide were added under a nitrogen atmosphere to a reaction mixture containing 4.60 grams Bis(p-amino-phenoxybutyl)tetramethyldisiloxane, 13.6 grams 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane, and 5.8 grams of a mixture of cyclic y-aminopropylmethyl-siloxanes containing from 3 to 10 silicon axoms in the ring. The reaction mixture was heated to the boiling point, which gradually increased to 225C over a two hour period. The temperature was maintained for 10 hours, following which the reaction mixture was cooled to am-bient temperature. A one-gram portion of sodium bicar-S~3~)~

bonate was added to the reaction mixture with stirring, which was continued for l/2 hour to achieve neutraliza-tion of the potassium hydroxide catalyst.
The reaction was then filtered and an aliquot of the homogeneous fluid was titrated with a O.OlN perchloric acid solution to a bromcresol purple end point. The amount of perchloric acid required was equivalent to 1.32% by weight o~ amine groups in the product. Based on this value and the amount of starting materials, the general formula was calculated.

;330~

EXAMPLE XXXII

Preparation of the polysiloxane of formula H2 ~ H3 NH2 0-(CH2)4-li-o- -Si-~ - Si-0 - Si-0- Si-(CH2)4-0 CH3 CH3 _ ~ I CH CH3 The equilibrated amino functional polysiloxane of the general formula indicated above was prepared by the equilibration of Bis(m-aminophenoxybutyl)tetramethyldi-siloxane with cyclic vinylmethylsiloxanes, octaphenyl-cyclotetrasiloxane and octamethylcyclotetrasiloxane.
Two pellets, equivalent to 0.1 gram potassium hydroxide was added to a reaction mixture containing 4.6 grams Bis(m-aminophenoxybutyl)tetramethyldisiloxane, 14.8 grams octamethylcyclotetrasiloxane, 1.98 grams octaphenylcyclotetrasiloxane, and 4.3 grams of a mixture of cyclic vinylmethylsiloxane wherein the number of cyclic siloxane units per molecule was from 3 to 5. The reaction mixture was under a nitrogen atmosphere with constant agitation and was heated to the boiling point, which gradually increased to 215C during a two hour period. Heating at this temperature was continued for

8 hours, following which the reaction mixture was cooled zo to room temperature and l/2cc of concentrated aqueous hydrochloric acid was added. The reaction mixture was -157~

then stirred for 1/2 hour to ensure complete neutrali-zation of the potassium hydroxide catalyst.
The reaction mixture was then filtered. An aliquot portion of the filtrate, a homogeneous amber fluid, was titrated with a O.OlN perchloric acid solution to a bromcresol purple end point. The amount of perchloric acid required was equivalent to 1.43% by weight of amine groups in the product. Based on this value and the amount of starting materials, the general formula was calculated.

-158- ~2~3 EXA~IPLE XXXIII

Preparation of the polysiloxane of formula ~H3 C~3 1 , IH3 IIH3 1IH3 H2N ~ ~ 0-(C~2)4--Si-o---Si-O--Si-O l Si-OtSi-(CH2)4-- ~ H2 CH3 CH3 ¦ L I2 IH2 3 ¦ I H2 LNH2 ~

The equilibrated amino functional polysiloxane of the general formula indicated above was prepared by the equilibration of Bis(p-aminophenoxybutyl)tetramethyldi-siloxane with octamethylcyclotetrasiloxane, a mixture of cyclic methylphenylsiloxanes, and a mixture of cyclic aminopropylmethylsiloxanes.
A reaction mixture was prepared under a nitrogen atmosphere and with rapid agitation by combining 4.6 grams Bis(p-aminophenoxybutyl)tetramethyldisiloxane, 74 grams octamethylcyclotetrasiloxane, 2.72 grams of a mixture of cyclic methylphenylsiloxanes wherein the number of siloxane units in each ring was from 3 to 10,

9 grams of a mixture of cyclic aminopropylmethylsiloxanes, and 2 pellets, about 0.1 gram, of potassium hydroxide.
The resultant mixture was heated at the boiling point for 8 hours and then cooled to room temperature. The po-tassium hydroxide catalyst was then neutralized by adding -159_ ~ 30 4 1 gram sodium bicarbonate to the reaction mixture and stirring for 1/2 hour.
The reaction mixture was then filtered and an aliquot portion of the filtrate, a homogeneous amber fluid, was titrated with a O.OlN perchloric acid so-lution to a bromcresol purple end point. The amount of perchloric acid required was equivalent to 0.52% by C weight of amine groups in the product. Based on this value and the amount of starting material, the general ~ormula wàs calculated.

-160- ~2~304 E~A~IPLE ~XXIV

Preparation of the polysiloxane of formula X2N ~ S-(CH2)4-si-o ~Si-~ Si-(CH2)4-S ~ NH2 CH3 ¦CH3 CH3 The equilibrated amino functional polysiloxane of the above formula was prepared by the equilibration of Bis(p-aminophenylthiobutyl)tetramethyldisiloxane with methyl tetramer.
A lcc portion of a solution containing 50ppm tetra-butylphosphonium trimethylsilanolate in methyl tetramer was added to a reaction mixture consisting of 78 grams octamethylcyclotetrasiloxane and 49.2 grams Bis(p-amino-phenylthiobutyl)tetramethyldisiloxane under a nitrogen atmosphere. The reaction mixture was heated at 115C
for 4 hours. During this period of time, the viscosity of the reaction mixture was observed to increase until it reached a relatively constant value. At the end of the 4 hour period, the temperature of the reaction mix-ture was raised to 160C for 2 hours to effect destruc-tion of the catalyst. The reaction mixture was then cooled to room temperature and filtered.

An aliquot portion of the filtrate was titrated with a O.OlN perchloric acid solutlon to a bromcresol purple end point. The amount of perchloric acid re-- ~ Z~3~)~

quired was equivalent to 2.5S weight o~ amine groups in the product. Based on this value and the amount of starting material, the general formula for the product was calculated.

-1~2- ~ 30~

EXA~LE XXXV

Siloxane-containing poly(half-amide) containing 30 mole %_siloxane To a reaction mixture consisting of 54.64 grams 1,3-bis-(p-aminophenoxybutyl)tetramethyldisiloxane and ~9.94 grams m-phenylenediamine in 636g dry N-methyl-pyrrolidone and cooled to 0C was added portionwise, over a 4 hour period, 127.05 grams benzophenonetetra-carboxylic dianhydride. The solution became dark amber and its viscosity greatly increased toward the latter half of the reaction.
Upon complete anhydride addition, solution was not complete but stirring was maintained for 10 additional hours at ambient temperature. At this time, a dark amber clear viscous solution resulted which wet the sides of the flask well. The product obtained was a siloxane containing poly(half-amide) solution containing 30 mole % of 1,3-bis-(p-aminophenoxybutyl)tetramethyldisiloxane.
A portion of the above solution was disposed on the surface of a glass slide to form a coating about 0.2 mil in thickness. The coated slide was then placed in a fur-nace and heated to effect curing of the poly(half-amide) to the polyimide, in the following manner:
2 hours at 135C + 10C
2 hours at 185C + 10C
2 hours at 250C + 10C
1/2 hour at 300C 1 10C

~3~14 After curing and upon removal of the coated slide from the furnace, examination of the resulting film was performed. The cured film bonded very tenaciously to the glass slide. The coating still ~onded tenaciously to the glass slide even after immersion in boiling water for a period of 6 hours.
The polyimide of this example has proven to be an C excellent material for passivation and/or protective coatings for semiconductor devices including application oi the material to exposed portions of P-N junctions.
Very low leakage current <0.3 microamps has been observed at 0.31 microamps and 2000 volts.
The film of polyimide is capable of withstanding temperatures of the order of about 450C for periods of time up to 1 hour. This physical characteristic allows one to deposit a glass layer by chemical vapor deposition on the cured film of material. The glass layer adheres very well to film. For best results one should attempt to match the coefficient of thermal expansion of the material of the film and the material of the glass.

~2~304 EXAMPLE XXXVI

Siloxane-containing poly(half-amide~ containing 80 mole ~0 of siloxane Employing the procedure o~ Example XXXV, 34.56 parts 1,3-bis-(m-aminophenoxypropyl)tetramethyldisiloxane was combined with 3.96 parts methylenedianiline in 180ml anhydrous n-methyl-pyrrolidone~ The solution was cooled to 0C as 21.8 parts pyromellitic dianhydride was added in portions over a 3 hour period. A dark amber viscous solution resulted. The reaction mixture was then allowed to stand overnight at ambient temperature. The resulting solution was a siloxane-containing poly(half-amide) solu-tion containing 80 mole qO of 1,3-bis-(m-aminophenoxy-propyl)tetramethyldisiloxane.
A portion of this solution was applied to a se-lected surface area of several semiconductor devices.
Curing of the applied solution was accomplished in the same manner as described in the curing of the applied solution in Example XXXV.
The coated devices were subjected to a corona dis-charge test of 2500 volts. The coated devices continued to function electrically within the design specification parameters for well over 1,000 hours exposure.
Unprotected semiconductor devices of the same type failed within 10 hours when exposed to the same corona discharge test.

-165- 12~304 EXAMPLE XXXVII

Siloxane-containing ~ly(half-amide) containing thio linka~e The procedure of Example XXXV was practiced except that 58.44 grams 1,3-Bis-(p-aminophenylthiobutyl)tetra-methyldisiloxane was substituted for the 54.64 grams 1,3-Bis-(p-aminophenoxybutyl)tetramethyldisiloxane.
The product obtained was a siloxane-containing poly(half-amide) solution containing 30 mole 70 of 1,3-bis(p-aminophenoxythiobutyl)tetramethyldisiloxane.
In addition to the excellent physical properties obtained, which are the same as obtained in Example XXXV, the cured material has excellent antioxidant properties.
A coating applied to electrical wire and as ~hin as 1 millimeter in thickness has proven to be an excellent anti-tracking material and suitable for use iA manufac-turing the windings required for electric motors and electric generators.
The wire coating may be applied in a continuous operation and only a single application is necessary to meet desired requirements. However, should a thicker coating be required, one method of accomplishing the same is to apply a second coating layer and curing as before, as the material will adhere to itself.

~2~304 EXAh~LE XXXVIII

Polyimide containing 100 mole % siloxane A. Bis(p-aminophenoxy propyl) tetramethyldisiloxane The procedure of Example X~XV was repeated with a reaction mixture of 5.20 parts 2t2-bis{4-(3,4 dicarboxy-phenoxy)phenyl}propane dianhydride, 4.60 parts bis(p-aminophenoxypropyl)tetramethyldisiloxane and 0.1 part toluenesulfonic acid in 90ml o~ dichlorobenzene and re-fluxed; the water formed by the reaction was removed azeotropically with the solvent and passed over a solid desiccant which removed the water chemically and the solvent was returned back to the reaction site. When water was no longer evolved, the bath temperature was lowered to 175C and the reaction was allowed to continue overnight. The polymeric solution was then cooled and filtered. The filtered polymeric solution was then added to a ten-fold excess of methanol to preclpitate the polymer. The polymer was white and fibrous. The ~recipitated polymer was separated by filtration, washed several times with fresh methanol, and dried overnight in an oven maintained at a temperature of 65C.
A portion of the polymer was placed in a beaker and sufficient amount of N-methyl-pyrrolidone was added to the polymer to prepare a solution having a 25% solids content. A portion of the solution was applied to the -167~ 304 surface of a ceramic plate, which was placed in a pre-heated oven and maintained at 120C for a period of 60 minutes. Upon examination of the coated ceramic after it was removed from the oven, it was discovered that a strong transparent film of about 8 mils in thickness has been formed on the ceramic. The film was bonded tena-ciously to the ceramic substrate. The film was resistant to abrasion and could not be peeled off, or stripped from, the substrate in a continuous form.
The coated plate, with the cured film was immersed in the solvent methylene chloride for a period of 30 minutes. Upon removal from the solvent, the film had been removed from the ceramic. That is, the surface of the ceramic plate was completely free of the cured film of polymer material.
B. Bis (p-aminophenoxymethyl) tetramethyldisiloxane A reaction mixture of 37.6 grams bis(p-aminophenoxy-methyl)tetramethyl disiloxane, 32.2 grams benzophenone tetracarboxylic acid dianhydride, and 0.1 grams toluene sulfonic acid in 803 grams trichlorobenzene was heated to reflux; water formed by the reaction removed azeo-tropically with the solvent and passed over calcium hydride, which removed the water. The solvent was recycled. When water was no longer evolved the reaction mixture, now a clear solution, was stirred for an addi-tional four hours at 216C. The reaction mixture was -168- ~21~ 30 4 C then cooled and filtered; the filtered solution was then slowly added to a ten-fold excess of methanol to precipi-tate the polymer. The polymer was white and fibrous;
it was separated by filtration and dried overnight un~.er ~acuum in an oven at 60C.
The polymer was stable to 400C temperatures, as determined by thermogravimetric analysis and a film case on glass from a solution of the polymer in N-methyl-C pyrrolidone bonded tenaciously thereto.
C. Bis(p-aminophenoxyoctyl) tetramethyl disiloxane The procedure of Part B above is repeated, except that the bis(p-aminophenoxymethyl)tetramethyl disiloxane is replaced by 57.2 grams of bis(p-aminophenoxyoctyl)-tetramethyl disiloxane.
This polymer is found to be stable to about 300C
with little weight loss.

-169~ 3~

EXA~PLE XXXIX

Polyimide containing 30 mole % of siloxane To a mixture containing 10.4 parts 2,2-bis{4(3, 4-dicarboxyphenoxy)phenyl}propane dianhydride (0.02 moles), 2.772 parts methylene dianiline (0.014 mole), and 0.1 part toluenesulfonic acid was added 231 parts o-dichlorobenzene. The reacti.on mixture was placed in a silicone oil bath maintained at 240C, resulting in rapid reflux.
The refluxing liquid, incorporating water which was formed in the imidization reaction, was passed o~er a desiccant, such as calcium hydride, and resulting dichlorobenzene was returned back to the reaction.
After a period of 2-4 hours, water was no longer genera-ted as indicated by the clear solution bathing the calcium hydride.
The silicone oil bath temperature was lowered to 200C, followed by the addition of 2.76 grams 1,3-bis-(p-aminophenoxybutyl)tetramethyldisiloxane (0.006 mole).
The reaction was maintained at this temperature for four additional hours. Thereafter, the heating bath was removed. The polymeric solution was cooled, filtered and precipitated into a large volume of methanol. The resulting white fibrous polymer was collected by filtra-tion, washed five times with additional fresh methanol, and dried at 5mm pressure and 65C overnight. There ~X:5~3~

was obtained 15.2 grams polymer. To this polymer was added 45.6 parts freshly distilled N-methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide co-polymer material having 30 mole % 1,3-bis-~p-amino-phenoxybutyl)tetramethyldisiloxane in N-methyl-pyrroli-done.
A portion of the polyimide in solution was disposed on several glass slides and heated at 125C for 2 hours to completely dry the film. The resulting film bonded very tenaciously to the glass slide. Additionally, the ~ilm exhibited excellent resistance to abrasion and im-pact. When subjected to immersion in boiling water for 6 hours, the film remained very tenaciously bonded to the surface of the glass slide.
Several more glass slides were prepared and coated with another portion of the polyimide solution; the film was dried in the same manner as before. The coated slides were weighed to determine the weight of the polyimide applied.
These slides were placed in an air circulating oven and heated to 300C + 10C for a period of 8 hours and then removed from the oven and cooled to ambient tempera-ture.

~%~31~

Upon reweighing the slides, no loss in weight could be detected.
Thus, it is seen that the siloxane containing polyimide retains its stability in circulating air at high temperature.

-172- ~2 ~ 30 ~XAMPLE ~L

Polyimide containing 30 mole % of prior art siloxane The procedure of Example XXXIX was repeated except for the addition of 1.65 grams 1,3-bis-(delta-aminobutyl) tetramethyldisiloxane (0.006 mole) to the reaction mix-ture in place of the addition of 2.76 grams 1,3-bis-(p-aminophenoxybutyl)tetramethyldisiloxane (0.006 mole).
The total weight of the polymer material obtained was 14.3 grams. The polymer was added to 42.9 parts freshly distilled N-methyl-pyrrolidone to make the solution of polyimide for duplicating the tests run with the polyimide solution of Example XXXIX wherein each so-lution contained 30 mole % of disiloxane material.
The slides prepared with the disiloxane material of this example experienced a weight loss of 10% when heated in the air circulating oven for 8 hours at 300C + 10C.
It is believed that the amino alkyl linkage is the source of instability at high temperature. It is believed that free radical degradation of the alkylene chain is occurring at the high temperature and the byproducts such as X2, CX20, C02 and the like are escaping from the polymer. Therefore, the loss of weight of the coating material becomes appreciable in the 8 hours exposure to circulating air at 300C + 10C.
From experimentation it has been discovered that temperature stability decreases with increasing alkyl siloxane content.

-173- ~5~3Q4 EXAMPLE XLI

Polyimide containing a ~acrocyclic crown ether chelating agent To a mixture containing 5.20 parts 2,2-bis{4-(3,4-dicarboxyphenoxy)phenyl}propane dianhydride (0.01 mole) 3.22 parts bis(m-aminophenoxypropyl)tetramethyldisiloxane (0.07 mole), and 0.1 part toluenesulfonic acid was added C 231 parts o-dichlorobenzene. The reaction mixture was placed in a silicone oil bath maintained at 240C re-sulting in rapid reflux. The refluxing liquid, incor-porating water which was formed in the imidization re-action, was passed over a desiccant, such as calcium hydride, and the resulting dry liquid, dichlorobenzene, was returned back to the reaction. After a period of from 2 to 4 hours, water no longer was generated by the reaction as indicated by the clear solution bathing the calcium hydride.
The silicone oil bath temperature was lowered to 200C, followed by the addition of 1.17 grams diamino-dibenzo 18-crown-6-ether (0.003 mole). The reaction was maintained at this temperature for four additional hours.
Thereafter, the heating bath was removed.
The polymeric solution was cooled, filtered and precipitated into a large volume of methanol. The re-sulting white fibrous polymer was collected by ~iltration, washed five times with additional fresh methanol, and dried at 5mm pressure at 65C overnight. The weight of i~S4;~ 304 polymer material obtained was 9.1 grams. To this amount of polymer was added 27.3 parts freshly distilled N-methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
A glass slide, a titanium coupon and a copper panel were each coated with a portion of the solution of poly-imide by brushing a layer of the solution on a surface o~ each sample unit. The coated units were placed in a preheated oven maintained at 100C for a period of two hours. The units were then removed from the oven and examined. A thin coherent film was formed on the surface of each sample unit and was bonded tenaciously to the respective substrate material. Each film was very re-sistant to abrasion and remained bonded well to each sub-strate surface even after exposure to boiling water for a period of two hours. The chelating agent, chemically bonded into the structure of the polymer, did not affect the bonding and abrasion resistance properties of the cured polymer film.

~Z~i~304 EXAMPLE XLII

Polyimide from henzophenone tetracarboxylic dianhydride and 100 mole % siloxane To a reaction mixture charged with 46 parts by weight of Bistp-aminophenoxybutyl)tetramethyldisiloxane and 32.3 parts by weight benzophenone tetracarboxylic dianhydride in 975 parts by weight of dichlorobenzene was added 1 part by weight methane sulfonic acid. The reaction material was heated to reflux and the water formed by the resulting chemical reaction was removed azeotropically and eliminated in a CaH2 tower. When water was no longer evolved, the reaction material was kept at reflux for an additional 8 hours. The reaction material was then cooled to room temperature and poured into 2 gallons of methanol to produce a yellow powder material.
The yellow powder material was collected by filtra-tion, washed free of solvent with additional methanol and dried.
A 25qo solids solution was prepared by using an appropriate amount of ~-methyl-pyrrolidone. A portion of the solution was applied to the surface of a glass slide and dried by heating at 120C ' 5C in an air circulating oven. A tough film, having a deep yellow coloration, was produced which bonded tenaciously to the surface of the glass slide.

3~4 EXAMPLE XLIII

Polyimide from benzophenone tetracarboxylic dianhydride, siloxane and diamine The process of Example ~LII was repeated except that the reaction mixture included only 39.1 parts by weight Bis(p-aminophenoxybutyl)tetramethyldisiloxane and additionally 1.62 parts by weight of m-phenylene diamine, Complete solution occurred in 3 hours.
Upon drying, a deep yellow film was again formed on the surface of the glass slide. The ~ilm was bonded tenaciously to thé surfzce of the glass slide.
Chemical analysis of the reaction product material proved it to be a siloxane-containing polyimide copolymer material having a high Tg property. The deep yellow color of the material is advantageous to Ihose using lS the material as one is able to see where the material is applied to a surface. Upon drying, the resultant film is sol~ent resistant and exhibits excellent ad-hesion to the surface to which it is applied as well as to its own exposed surface so as to produce thick films by multiple solution applications and drying cycles.

-177~ 3~4 EXAMPLE ~LIV

Polyimide from Pyromellitic tetracarboxylic dianhydride and 100 mole % siloxane To a reaction mixture charged with 21.8 parts by weight of pyromellitic tetracarboxylic acid dianhydride, 46 parts by weight of bis-(p-amino-phenoxy~utyl)tetra-methyldisiloxane and 971 parts by weight of trichloro-benzene was added 1 part by weight toluenesulfonic acid.
The reaction material was heated to reflux and the water formed by the resulting chemical reaction was removed azeotropically and eliminated in a CaH2 tower. When water was no longer evolved, a period of about 4 hours thereafter, the reaction temperature was dropped to 215C
and maintained thereat overnight. The reaction material was then cooled to room temperature, filtered and poured into 5 gallons of methanol to produce a deep yellow powder material.
The deep yellow powder material was collected by filtration, washed free of solvent with additional methanol and dried.
A 25~ solids solution was prepared by using an appropriate amount of N-methyl-pyrrolidone. A portion of the solution was applied to the surface of a glass slide and dried by heating at 120C + 5C in an air cir-culating oven. A tough film, having a deep yellow coloration, was produced which bonded tenaciously to the surface of the glass slide.

-17~- ~zr~3~4 EXAMPLE XLV

Polyimide from thio-siloxane containing lOO mole %
siloxane The procedure of Example XLII was repeated except that the reaction mixture was 49.2 parts by weight Bis-(m-aminophenylthiobutyl)tetramethyldisiloxane, 32.2 parts by weight benzophenone tetracarboxylic acid di-anhydride (BTDA), l part by weight toluenesulfonic acid and 1300 parts by weight trichlorobenzene. Reflux temperature was 2l8C. Water formed by the reaction was removed azeotropically by absorption on a 3A
molecular sieve. Overnight reaction temperature a~ter all water was removed was 200C.
The reaction product was recovered in the same manner as a deep yellow powder. Make up and testing was performed in the same manner as before and proved the product to make a tough film which bonded tenaciously to the surface of the glass slide.

lX~304 EXAMPLE XLVI

Polyimide containing 50 mole %_Si xane and 50 mole %
diamine To a reaction mixture consisting of 7.67 grams (0.02883459) mole 5(6) amino-1-(4'-aminophenyl)-1,3,3 trimethylindane, 13.26 grams (0.02883459) mole Bis(m-aminophenoxybutyl)tetramethyldisiloxane, and 18.57 C grams t0.05766917) mole benzophenone tetracarboxylic acid dianhydride was added a catalytic quantity, 0.5 grams toluene sulfonic acid followed by 453 grams tri-chlorobenzene. The reaction mixture was heated to re-flux temperature of 218C. The solvent and water pro-duced by the chemical reaction were passed over a calcium hydride bed to eliminate water and produce a dry reaction mixture. The system was maintained at re-fluxing temperature until water was no longer being generated, a period of approximately 3 hours. The re-action mixture was then maintained at refluxing tempera-ture overnight.
The reacted reaction mixture was then cooled to room temperature and filtered. No solids were present.
The filtered reacted reaction mixture was then poured into 1 gallon of methanol to precipitate a stringy polymer material.
The resulting polymer was very soluble in methylene chloride, N-methyl-pyrrolidone (NMP), and dimethylformamid (DMF).

~2S6~3C)~

A sample of the polyimide was dissolved in N-methyl-pyrrolidone and the solids content of the poly-imide therein was 25~ by weight. A portion of the solution was disposed on the surface of a glass slide to form a coating about 0.2 mil in thickness. The coated slide was then placed in an air circulating oven for 1 hour at 110C + 5C. The slide was removed from the oven, cooled to room temperature and examined.

The film was transparent and bonded extremely well to the surface of the glass slide.

~3 EXAMPLE XLVII

Polyimide containing 30 mole % siloxane and 10 mole % diamine The process of Example XLVI was repeated except that the reaction mixture in the reactor was as follows:
32.2 grams (0.1 mole) benzophenone tetra-carboxylic acid dianhydride 41.4 grams (0.09 mole) Bistp-aminophenoxy-butyl)tetramethyldisiloxane 2.66 grams (0.01 mole) 5(6) amino-1-(4'~
aminophenyl)-1,3,3-trimethylindane 0.5 gram methane sulfonic acid 877 grams trichlorobenzene The resulting polymer product was again stringy in nature.
~ 'hen applied to a glass slide in the form of a solution and heated to evaporate the solvent, the re-sulting film was translucent and bonded very well to the glass slide.

3~

EXAMPLE XLVIII

Polyimide containing 30 mole % disiloxane and 70 mole % diamine _ _ The process of Example XL~I was repeated except that the reaction mixture in the reactor was as follows:

52 grams 4,4' Bisphenol A ether dianhydride (2,2-Bis{4-(3,4-dicarboxvphenoxy)phenyl}
c propane dianhydride), (0.1 mole).
13.8 grams Bis(m-aminophenoxybutyl)tetra-methyldisiloxane (0.03 mole).
18.62 grams 5(6) amino-1-(4'-aminophenyl)-1,3,3 trimethylindane (0.07 mole).
1 gram toluene sulfonic acid 971 grams dichlorobenzene The resulting polymer product was again stringy in nature. When applied to a glass slide in the form of a solution and heated to evaporate the solvent, the result-ing ~ilm was translucent and bonded very well to a glass slide.

l;~ii~3(~

EXAMPL~_XLIX

Polyimide containin~ 20 mole % siloxane and 80 mole % diamine The process of Example XLVI was repeated except that the reaction mixture in the reactor was as follows:

16.1 grams benzophenone tetracarboxylic acid dianhydride (0.05 mole).

10.64 grams 5(6) amino-1-(4'-aminophenyl)-1,3,3 trimethylindane (0.04 mole).
4.6 grams Bis(p-aminophenoxybutyl) tetra-methyldisiloxane (0.01 mole).
0.5 gram toluene sulfonic acid 361 grams dichlorobenzene The resulting polymer product was stringy in nature.
When applied to a glass slide in the form of a solution and heated to evaporate the solvent, the resulting film was translucent and bonded very well to the glass slide.

-1~4- 1 2 5~ 304 ~XAMPLE L

Polyimide containing 85 mole % siloxane and 15 mole % diamine . . =

The process of Example ~LVI was repeated except that the reaction mixture in the reactor was as follows:

52 grams 3,3' Bis-phenol A dianhydride, 2,2-Bis{4-(2,3-dicarboxyphenoxy)phenyl}
propane dianhydride, (0.1 mole).
391. grams Bis-(m-aminophenoxybutyl)tetra-methyldisiloxane (10.035 mole).
1 gram toluene sulfonic acid 1092 grams dichlorobenzene.

The oil bath temperature for the reaction was main-tained at ~ 200C. When the water of reaciion had been completely evolved, 3.99 grams of 5(6) amino-1-(4'-amino-phenyl)-1,3,3-trimethylindane (0.015 mole) was added to the reaction mixture. The reaction process was then contained overnight and evaluated as described in Example XLVI .
The resulting polymer product was stringy in nature.
When applied to a glass slide in the form of a solution and heated to evaporate the solvent, the resulting film was again translucent and bonded very well to the glass slide.

S~P3~

EXAMPLE LI

Polyimide containing 70 mole % siloxane and 30 mole % diamine ~ . _ To a mixture containing 10.4 parts 2,2-bis{4(3,4-dicarboxyphenoxy)phenyl}propane dianhydride (0.02 moles), 0.648 parts m-phenylene diamine ~0.006 mole), and 0.1 part toluenesulfonic acid was added 231 parts O-dichloro-benzene. The reaction mixture was placed in a silicone oil bath maintained at 240C resulting in rapid reflux.
The refluxing liquid, incorporating water which was formed in the imidization reaction, was passed over a desiccant, such as calcium hydride, and resulting dry dichlorobenzene was returned back to the reaction. .~fter a period of 2-4 hours, water was no longer generated as indicated by the clear solution bathing the calcium hy-dride.
The silicone oil bath temperature was lowered to 200~C, followed by the addition of 6.44 grams 1,3-bis-(p-aminophenoxybutyl)tetramethyldisiloxane (0.014 mole).
The reaction was maintained at this temperature for four additional hours. Thereafter, the heating bath was re-moved. The polymeric solution was cooled, filtered and precipitated into a large volume of methanol. The re-sulting white fibrous polymer was collected by filtration, washed five times with additional fresh methanol, and dried at 5mm pressure and 65 C overnight. There was ob-tained 15.2 grams polymer. To this polymer was added -18~_ 3(~
45.6 parts freshly distilled diglyme and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide having 70 mole % 1,3-bis-(p-aminophenoxybutyl)tetramethyl-disiloxane in diglyme.
A portion of the polyimide in solution was disposed on several glass slides and heated at 85C for 2 hours to evaporate the solvent. The resulting film bonded C very tenaciously to the glass slide. Additionally, the ~ilm exhibited excellent resistance to abrasion and impact. When subjected to immersion in boiling water for 6 hours, the film remained very tenaciously bonded to the surface of the glass slide.

Several more glass slides were prepared and coated with another portion of the polyimide solution and dried in the same manner as before. The coated slides were weighed to determine the weight of the material applied.
The preweighed slides were placed in an air circu-lating oven and heated to 300C + 10C for a period of 8 hours and then removed from the oven and cooled to ambient temperature.
Upon reweighing the slides, no loss in weight could be detected.

It is ~elieved that the aryl ether portion of the polymer inhibits free radical degradation. In other words, it is a free radical scavenger inhibiting de-struction by a radical propagation reaction. Therefore, 30~

no appreciable weight loss could be detected on weigh-ing the coated slide after the exposure to 300C for 8 hours.

EXAMPLE LII

Polyimide containing 30 mole ~ of functional group o R-C-_ 2,4-diaminoacetanilide, m.p.l61-163 C, was prepared by the catalytic reduction of 2,4-dinitro acetanilide.
To a mixture containing 26 parts 2,2-bis{4(3,3-dicarboxyphenoxy)phenyl}propane dianhydride (0.05 moles), 3.78 parts m-phenylene diamine (0.035 mole), and 0.1 part toluenesulfonic acid was added 231 parts o-dichloro-benzene. The reaction mixture was placed in a silicone oil bath maintained at 240C resulting in rapid reflux.
The refluxing liquid, containing water formed in the reaction, was passed over a desiccant, such as calcium hydride, and the resulting dry dichlorobenzene was returned back to the reaction. After a period of 2-4 hours, water was no longer generated as indicated by the clear solution bathing the calcium hydride.
The silicone oil bath temperature was lowered to 200C, followed by the addition of 2.48 grams 2,4-di-aminoacetanilide (0.015). The reaction was maintained 2G at this temperature for four additional hours. There-after, the heating bath was removed. The polymeric so-lution was cooled, filtered and precipitated into a large volume of methanol. The resulting white fibrous polymer was collected by filtration, washed five times with additional fresh methanol, and dried at 5mm pressure and -189- ~z~3~

650C overnight. There was obtained 29.3 grams polymer.
To this polymer was added 87.9 parts freshly distilled N-methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide having 30 mole percent 2,4-diaminoacetanilide in N-methylpyrrolidone.

~2S~;130~
EXAMPLE LIII

Polyimide containing 30 mole ~O of functional group -COOH

The procedure of Example LII was repeated except that 2.28 grams of 3,5-diaminobenzoic acid (0.015 mole) was used in place of the 0.015 moles of diaminoaceta-nilide.
There was obtained 30.1 grams polymer. To this polymer was added 90.3 parts freshly distilled N-methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide having 30 mole percent 3,5 diaminobenzoic acid in N-methyl-pyrrolidone.

~ 3~ 4 f EXA~lPLE LIV

Polyimide containin~ 50 mole % functional ~roup - sub-stituted ph-enoxy p-(2,4-diaminophenoxy) acetanilide was obtained by the condensation of sodium 4-acetamidophenolate with 2, 4-dinitro chlorobenzene and was catalytically hydrogenated to the corresponding diamine m.p. 144-145C.
C To a mixture containing 15.6 parts 2,2-bis{4(3,4-dicarboxyphenoxy)phenyl} propane dianhydride (0.03 moles), 2.97 parts methylene dianiline (0.015 mole), and 0.1 part toluenesulfonic acid was added 231 parts 0-dichlorobenzene.
The reaction mixture was placed in a silicone oil bath maintained at 240C resulting in rapid reflux.
The silicone oil bath temperature was lo~ered to 200C, ~ollowed by the addition of 3.86 grams p-(2,4-diaminophenoxy)acetanilide (0.015 mole). The reaction was maintained at this temperature fox four additional hours. Thereafter, the heating bath was removed. The polymeric solution was cooled, filtered and precipitated into a large volume of methanol. The resulting white fibrous polymer was collected by filtration, washed five times with additional fresh methanol and dried at 5mm pressure and 65C overnight. There was obtained 21.9 grams polymer. To this polymer was added 66 parts freshly distilled N-methyl-pyrrolidone and the resultin~ mixture was stirred until complete solution was obtained.

-192~

The resulting solution consisted of a polyimide having 50 mole % p(2,4-diaminophenoxy)acetanilide in N~methyl-pyrrolidone.

-193_ ~S~3~

EXAMPL~ L~

Polyimide containing 25 mole % of functional ~rcup -SE
To a mixture containing 10.4 parts 2,2-bis{4(3,4-dicarboY~yphenoxy)phenyl} propane dianhydride (0.02 moles), 6.9 grams Bis(m-aminophenoxybutyl)tetramethyldisiloxane (0.15 mole), and 0.1 part toluenesulfonic acid was added 231 parts o-dichlorobenzene. The reaction mixture was placed in a silicone oil bath maintained at 240C re-sulting in rapid reflux.
The refluxing liquid, containing water which was formed in the reaction, was passed over a desiccant, calcium hydride, and resulting dry dichlorobenzene was returned back to the reaction. After a period of 2-4 hours, water was no longer generated as indicated by the clear solution bathing the calcium hydride.
The silicone oil bath temperature was lowered to 200C, followed by the addition of 0.70 grams 2,4-di-aminothiophenol (.005 mole). The reaction was maintained at this temperature for four additional hours. There-after, the heating bath was removed. The polymeric so-lution was cooled, filtered and precipitated into a large volume of methanol. The resulting white ~ibrous polymer was collected by filtration, washed five times with additional fresh methanol and dried at 5mm pressure and 65C overnight. There was obtained 17.1 grams polymer.
To this polymer was added 61 parts freshly distilled N---194-- ~;d~ ;304 methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide having 25 mole percent 2,4-diaminothiophenol in N-methyl-pyrrolidone.
A portion of the solution was disposed on several glass slides and heated at 125C for 2 hours to evaporate the solvent. The resulting film bonded very tenaciously to the glass slide. Additionally, the film exhibited excellent resistance to abrasion and impact. When sub-jected to immersion in boiling water for 6 hours, the film remained very tenaciously bonded to the surface of the glass slide.
Several more glass slides were prepared and coated with another portion of the solution and heated in the same manner as before. The coated slides were weighed to determine the weight of the material applied.
The preweighed slides were placed in an air circu-lating oven and heated to 300C + 10C for a period of 8 hours and then removed from the oven and cooled to ambient temperature.
Upon reweighing the slides, no loss in weight could be detected.

~ 5 1~304 EXAMPLE L~I

Crosslinking of polyimide polymers The polyimides of Examples LII and LIII were each dissolved in N-methyl-pyrrolidone to form a 20 weight % solution. The two solutians were combined and mixed to form a homogeneous solution and the solvent was stripped by heating at 120C + 5C in an oven. A por-tion of the blend obtained was heated in an oven at 300C + 10C for three hours.
The odor of acetic acid could be detected during the early part of the heating cycle. The heated polymer blend was then cooled to room temperature and was placed in NMP but did not d~ssolve therein when stirred and heated to several hundred degrees Celsius.
A portion of the uncured polymer blend, dissolved readily in N-methyl-pyrrolidone.
The experimental results indicated that the origi-nal polymer blend was still soluble in NMP, but cross-linking occurred at the higher temperature range to pro-duce an intractable polymer material.

-196- i~S~3~'~

EXA~LE LVII

Photosensitive polyimide A hydroxyl-functional polyimide was prepared having the following composition:
60 mole percent m-phenylene diamine 40 mole percent 2,~-diaminophenol 100 mole percent 2,2-bis{4(3,4-dicarboxy-C phenoxy)phenyl}propane dianhydride Employing standard chemical process techniques, p-azidocinnamuyl chloride was prepared by first oxidiz-ing p-nitroto}uené to p-nitrobenzaldehyde. The p-nitrobenzaldehyde was then condensed with malonic acid,reduced with iron powder and hydrochloric acid to form p-aminocinnamic acid. Following diazotization and treat-ment with sodium azide, the p-aminocinnamic acid was con-verted to p-azidocinnamil acid which was then converted to the acid chloride with thionyl chlordie.
A solution of 20% by weight of the hydroxyl-functional polyimide in chloroform was prepared.
To the homogeneous solution was added triethylamine in an amount equivalent to the stoichemetric amount of the phenolic content of the polyimide. A solution of p-azio-docinnamyl chloride in chloroform was prepared and added dropwise to exactly equivalent amounts of the polyimide, based upon the phenolic content thereof. A

chemical reaction occurred immediately, producing the modified polymer and triethylamine hydrochloride.

-197- ~ 3~

The salts were removed by filtration. The chloro-form was removed from the solution by llash evaporation at a reduced pressure.
The resulting polymer proved to be a very photo-sensitive material. The minimum light energy requiredfor cross-linking of the polymer materials to make it intractable was less than 500 ergs per square centi-meter at 316 m~.
Cross-linking occurred by the release of molecular nitrogen and the formation of highly reactive nitrine intermediates, which then cross-link.
Other photosensitizers such, for example, as 5-nitroaccennapththene, 2-nitroflurene, and the like, may also be present in the polyimide to enhance the susceptibility of the exposed polyimide tG becoming intractable at low levels of energy exposure.

-19~-~ )304 EXAMPLE LVIII

Microbicidal Polyimide A mercapto-functional polyimide was prepared having the following composition:

50 mole % m-phenylene diamine 50 mole % 2,4-diaminothiophenol C 100 mole % 2,2-bis{4(3,4-dicarboxyphenoxy) phenyl} propane dianhydride A solution o~ 20 weight percent of this polyimide in chloroform was prepared.
Employing standard chemical reactions, the 2,4-diaminothiophenol was prepared by first reacting sodium hydrosulfide with 2,4-dinitrochlorobenzene to produce 2,4-dinitrophenylmercaptan. The 2,4-dinitrophenylmer-captan was reduced with zinc and hydrochloric acid to produce 2,4-diamino-thiophenol.
A solution of two equivalents of tributyl tin me-thoxide in chloroform was prepared based upon the mer-captan equivalent weights and added dropwise to the homo-geneous polymer solution. An exothermic reaction occurred.
Upon completion of the reaction, the chloroform was stripped-from the reacted solution by flash evaporation under reduced pressure resulting in a polymer material containing tin.
The structural composition of the polymer was con-firmed by standard I.R. and N.M.R.

-1 9 9 ~ 3~4 The resulting polymer has tin in the fundamental sites and is useful for imparting antifouling proper-ties to paints, and for other microbicidal applications.

~zS~3~4 ~XAMPLE LIX

Poly mlde containing flame-retardant functional organo-phos~hate To a mixture containing 10.4 parts 2,2-bis{4(3,4-dicarboxyphenoxy)phenyl~ propane dianhydride (0.02 moles), 1.62 parts m-phenylene diamine (0.015) mole~, and 0.1 part toluenesulfonic acid was added 231 parts o-dichloro-benzene. The reaction mixture was placed in a silicone oil bath maintained at 240C resulting in rapid reflux.
The refluxing liquid, incorporating water which was formed in the imidization reaction, was passed over a disiccant, such as calcium hydride, and resulting di-chlorobenzene was returned back to the reaction. After a period of 2-4 hours, water was no longer generated as indicated by the clear solution bathing the calcium hydride.
The silicone oil bath temperature was lowered to 200C, followed by the addition of 1.70 grams bis(p-aminophenyl)phenyl phosphate (0.005 mole). The reaction was maintained at this temperature for four additional hours. Thereafter, the heating bath was removed. The polymeric solution was cooled, filtered and precipitated into a large volume of methanol. The resulting white fibrous polymer was collected by filtration, washed five times with additional fresh methanol, and dried at 5mm pressure and 65C overnight. There was obtained 13.2 parts polymer. To this polymer was added 39.6 parts freshly ~Z ;~3~4 distilled N-methyl-pyrrolidone and the resulting mixture was stirred until complete solution was obtained.
The resulting solution consisted of a polyimide having 25 mole % Bis(p-aminophenyl)phenyl phosphate in N-methyl-pyrrolidone.
A portion of this solution was disposed on several glass slides and heated at 125C for 2 hours to evaporate the solvent. The resulting film bonded very tenaciously to the glass slide. Additionally, the film exhibited excellent resistance to abrasion and impact. When sub-jected to immersion in boiling water for 6 hours, the film remained very tenaciously bonded to the surface of the glass slide.
Several more glass slides were coated as before.
The coated slides were weighed to determine the weight of the material applied.
The preweighed slides were placed in an air circu-lating oven and heated to 300C ' 10C for a period of 8 hours and then removed from the oven and cooled to ambient temperature.
Upon reweighing the slides, no loss in weight could be detected.
A sample of the above polymer was molded. The molded sample was placed in the flame of a bunsen burner. Upon heating, the molded sample became incandescent and appeared to burn. However, upon removal from the bunsen burner flame, the molded sample stopped glowing, illustrating the inherent flame retardency property of the polymer material.

~S~3()~
EXA~LE LX

Preparation of polyimides from bis(amino)disiloxane and bis{4,4'-di(3.4-dicarboxyphenoxy)phenyl} sulfide dianhydride A. A reaction mixture of 5.10 grams of bis{4,4'-di(3,4-dicarboxyphenoxy)phenyl} sulfide dianhydride, 1.02 grams of 1,4-bis(3-aminophenoxy)benzene, 2.99 grams of bis(m-aminophenoxybutyl) tetramethyl disiloxane, 0.1 grams p-toluene sulfonic acid and 104 grams di-chlorobenzene was heated to reflux; water was removed azeotropically and reacted with calcium hydride. ~hen no more water was evolved the mixture was heated at 170C for six hours more. The reaction mixture was cooled, filtered and slowly added to excess methanol.
A white fibrous polymer precipitated; it was recovered 1~ and dried overnight at 65C under vacuum.
The polymer was soluble in N-methylpyrrolidone and exhibited no weight loss at 400C, as determined by thermogravimetric analysis. A film cast on glass adhered tenaciously.
B. The reaction of Part A above was repeated using 4.60 grams of 1,3-bis(m-aminophenoxybutyl)tetramethyl disiloxane as the sole amine component.
The white fibrous polymer recovered was thermally stable and more soluble than the polymer of Part A.

~f~ ~ 30~

C. Preparation of Bis-[4,4'-di(3,4-dicar~o~ypheno~y) phenyl~sulfide dianhydride A glass reactor is charged, under nitrogen, with 4,4'-thiobisphenol 52.93 grams 50% NaOH solution 38.8 grams toluene 250 ml dimethylsulfoxide 250 ml and heated to reflux under nitrogen with agitation.
Water present in the system and water formed during reaction are removed azeotropically and collected in a Dean Stark trap. ~Vhen the reaction mixture is completely anhydrous and no more water is being generated, the reaction temperature is lowered to 65C; at that point 100 grams of 4-nitro-N-methyl phthalimide are added, all at once. The mixture is stirred at 65C for about six hours, filtered hot and allowed to stand at room tempera-ture. The bis-imide crystallizes out on standing; it is filtered and dried. The bis-imide is converted to the tetraacid as follows:
A mixture of l part of the bis-imide, 1 part of 50a NaO~ solution and 2 parts H2O is heated to reflux and held until all the methylamine evolves. A clean solution results. This solution is acidified strongly; a white oil separates. Heating this mi~ture to reflux causes the oil to solidify; it is collected by filtration.
The tetraacid is cyclized by heating in a mixture -~4-~L2~i~3ct~
of glacial acetic acid-acetic anhydride until a clear solution results; upon cooling the anhydride crystallizes out and is collected and dried.

EXAMPLE LXI
A. Preparation of siloxane-containing dianhydride of formula O O

~Lo ( CH ~ S i-0-S i- ( CH 2 ) ~, _o_ ~lC~o C The procedure of Example XV is repeated using 74 grams of 3,4-xylenol in place of the p-bromophenol.
The product, bis(3,4-xylenyl oxybutyl)tetramethyl di-siloxane is oxidized as follows:
A solution of 48.6 grams of bis(3,4-xylenyloxybutyl) tetramethyl disiloxane, 400 ml. pyridine and 110 ml. water is heated to 94C. Heating continued to reflux and 190 grams of potassium permanganate were added slowly over one hour. Each incremental addition followed disappear-ance of the purple color. As the reaction proceeded, a black precipitate of MnO2 formed. Upon complete per-manganate addition, the reaction mixture was maintained at 98-110C for an additional hour. At that time, the purple color was discharged by addition of 10 ml. methanol.
The mixture was filtered and the filtrate washed with hot water. The remaining solution was evaporated to dryness;
the solids were dissolved in 200 ml. water and to this solution was added concentrated HCl to pH 1. A white precipitate formed. It was collected and dried.

-206- ~5~3~

The product was cyclized to the dianhydride by dissolving it in a solution of 100 ml. acetic acid, 100 ml. toluene and 50 ml. acetic anhydride, and heating to reflux. Upon stripping the solvent, the dianhydride was recovered as an oil. The structure was confirmed by analysis (IR and NMR).
B. Preparation of siloxane-containing polyimide 1. A reaction mixture containing 5.7 grams of the anhydride of part A above and 1.08 grams of m-phenylene diamine in 80.5 grams of trichloroben~ene and 0.1 gram of p-toluene sulfonic acid was heated to reflux until all water was azeotropically removed; the system was refluxed for three hours more at 216C. The mixture was cooled, filtered and poured into excess methanol to pre-cipitate the polymer, which was white and fibrous. The polymer was recovered and dried. It exhibited high ther-mal stability.
2. The reaction of part 1 above was repeated, except that the m-phenylene diamine was replaced by 4.6 parts of 1,3-bis(m-aminophenoxy-butyl)tetramethyl disiloxane.
The polymer was worked up, recovered from methanol and dried overnight at 50~C under vacuum. The pGlymer was stable to 400C.

-207- ~5~3~

EXAMPLE LXII

A. Preparation of siloxane-containing diether dianhydride_ of fo mula O O

~C ~0--~O-(CH2)~,-sl-o-si-(c~2)'~-o-(~o-~5 CH3 CH3 o 1. Preparation of bis{4-(3',4'-xylenoxy)phenoxybutyl}etra-methyl disiloxane.
This intermediate is prepared by an Ullman Reaction between the sodium salt of 3,4-xylenol and 1,3-bis(p-bromo-phenoxybutyl)tetramethyl disiloxane, whose preparation is described in Example XV, in the melt stage, about 140 C, using a copper catalyst. Purification is achieved via molecular distillation.
2. Oxidation and cyclization The product of Part 1 above is oxidized in a pyridine-water mixture with a five-fold excess of potassium per-magnate, followed by neutralization and cyclization, allas described in Example LXI. The structure of the white solid obtained is confirmed by instrumental analysis (IR and N~R~ and caustic titration to be bis{4-~3',4'-dicarboxyphenoxy)phenoxybutyl} tetramethyldisiloxane dian-hydride.

33~

B. Preparation of polyimide containing siloxane unit A mixture of 7.54 parts by weight of the dianhydride prepared in Part A above, 1.98 parts by weight of methylene dianiline, 0.1 part of p-toluene sulfonic acid and 100 parts of dichlorobenzene are combined and refluxed; water is removed azeotropically with the sol-vent and passed over calcium hydride to elimihate the water. The solvent is recycled. When water no longer forms, the mixture is refluxed for an additional four hours. The reaction mixture is cooled, filtered and slowly poured into excess methanol.
The polymer precipitates and is recovered at 60C.
The polyimide displays stability to temperatures o~ 425C.

-209- ~5~3~

EXAMPLE LXIII
Melt polymerization of siloxane-containing polyimide 4~ grams of equilibrated polysiloxane of formula H2~ CH3 CH3 1 CH3 ~2 0-~CH2)~-Si-0 -Si-0~ Si-(CH2)4-0-C prepared as described in Example ~XXIV and containing 3.094% NH2, as determined by perchloric acid titration, is carefully mixed with 14 grams of benzophenone tetra-carboxylic acid dianhydride in a Breybender mixer and brought to 300C at a heating rate of 20C per minute.
When the reaction chamber reaches 300C, the mixture is held at this temperature and agitated for 1/2 hour and then allowed to cool. The product is scraped from the chamber. It dissolves readily in N-methylpyrrolidone and can be reprecipitated into methanol.
A film cast onto a glass slide displays toughness and excellent adhesion. Molecular weight determination indicates MW = 60,000. The polyimide displays stability to temperatures of 400C.

-210- ~ZS~4 EXA~PLE LXIV

~ of formula H~CA-C-C ~ 0-(CH 2 ) 4 -5 i_0_5 i_ ( CH 2 ) ~ -- ~ C-C-CH~

Two moles of 2-alkyphenol sodium salt are coupled with 1 mole of bis (chlorobutyl) tetramethyldisiloxane in a solvent mixture of toluene-dimethylsulfoxide at about 70C to form an isomeric mixture of bis (2-propenyl-phenoxybutyl)tetramethyldisiloxane; the structu~e is confirmed analytically.
The product is epoxidized with m-chloroperbenzoic acid in chloroform solvent. The reaction mixture is initially clear and the reaction mildly exothermic. As the reaction proceeds, m-chlorobenzoic acid is pre-cipitated from solution. The reaction is monitored by gas chromatography; when the reaction is complete, the medium is filtered, and dissolved, m-chlorobenzoic acid is washed out with a 10% sodium carbonate solution.
The organic layer is dried, filtered and solvent stripped;
the product is recovered by distillation. It has a molecular weight of 542 and an epoxy content of 0.37.
27 grams of the above epoxide are placed in a vessel heated by an oil bath to 120C. 15 grams of molten phthalic anhydride are added and stirred into the resin. The mixture is held at 120C for one hour, at which point it is still soluble in acetone or chloroform.

-211- ~ ~,,5~30~

Howe~er, heating at 170-180C for two hours effects final cure and a clear, insoluble, somewhat flexible resin is obtained.

-212~ 04 EXAMPLE LgV
Crosslin~able Polyimide The fo~lowing materials were combined: grams benzophenone tetracarboxylic acid dianhydride 64.4 bis(m-aminophenoxybutyl)tetramethyl disiloxane 46.0 m-aminophenylacetylene 23.4 p-toluene sulfonic acid 0.1 Trichlorobenzene 153.0 and heated to reflux; water formed by the reaction was removed azeotropically with the solvent, which was lC passed over calcium hydride. Anhydrous solvent was re-cycled. When watér no longer formed, the system was refluxed for an additional six hours. The reaction mix-ture was cooled, filtered poured into excess methanol, recovered and dried overnight at 60C under vacuum.
This polyimide can be processed at temperatures on the order of 100-120C and then crosslinked at 325C.
A 25qo solution of the polyimide in N-methylpyrrolidone was prepared; films were cast from this solution onto glass slides. Slides were heated to 120C and held at that temperature for 30 minutes. When these slides are placed in boiling N-methylpyrrolidone, the polyimide is completely dissolved in about 3 minutes.
Other slides are expossd to 325C for five minutes;
the appearance of the film changes perceptably from opaque to clear. When these slides are immersed in boiling N-methylpyrrolidone, no effect is perceived after 24 hours of exposure.

3~4 -212a-In another embodiment of a cross-linkable polyimide, acetylenic functionality can be introduced in the form of a chain-stopper, by including in the polyimide reaction mixture monoamino acetylene or ethynylphthalic anhydride;
there is obtained a polyimide that can be processed at 100-120C and crosslinked at elevated temperatures.

~;2S~309~
,r E~AMPLE LXVI
Curing epoxy resins with bis(amino)siloxanes Two portions, each containing 5 parts by weight of a liquid bisphenol A-epichlorohydrin based epoxy resin (average equivalent weight 190) were prepared. To one portion was added 3 parts by weight of bis(p-amino-phenoxybutyl) tetramethyl disiloxane and to the other portion was added 3 parts by weight of bis(m-aminophenoxy-butyl) tetramethyl disiloxane. The compositions were each thoroughly mixed and heated to effect curing. Both portions were cured and each yielded a highly flexible, cured epoxy resin with good thermal and electrical pro-perties.
A difference in curing rate was noted; the bis-(p-amino) disiloxane was more reactive than the bis(m-amino) disiloxane, curing at 125 -130 C in two hours while the bis(m-amino)disiloxane cured in three hours at 150C.

EXA~PLE LXVII
Polyimides from ether-containing amines -1. From 1,3-bis(3-amino~henoxv)benzene The following materials were combined:
gms Benzophenone tetracarboxylic dianhydride 16.1 1,3-bis(3-aminophenoxy)benzene 4.38 c bis(m-amino)polysiloxane(l) 32.44 trichlorobenzene 598.0 (1) of formula:

N2~ ( 2)4_S _OtS _O~Sl-(ca2)4-{~ N2 and having 3 . 452~ amine The mixture was refluxed; water was removed azeo-tropically and eliminated via contact with calcium hydride.
When water was no longer being generated, the mixture was refluxed for an additional six hours. The mixture was lS then cooled, filtered and the polyimide recovered by pre-cipitation in methanol. The yellowish fibrous polymer was dried overnight at 60C under vacuum.
The polymer was soluble in N-me-thyl-2-pyrrolidone to the extent that a 25S by weight solution could be prepared.
A film cast from this solution onto glass was tough and adhered tenaciously.

-215- l~S~

2. From 2,2-bis[4-(p-aminophenoxy)phenyl] propane The react iOIl of Part 1 was repeated, exce~t that 4.38 grams of 2,2-bis[4-p-aminophenoxy)phenyl] propane were uséd in place of the 1,3-bis(3-aminophenoxy)benzene.
The yellowish fibrous polyimide recovered was quite soluble in dipolar aprotic solvents and provided tough, adherent films.
3. From 1,3-bis(3-aminophenoxy) benzene and bis-(amino) disiloxane The reaction of Part 1 was repeated, except tha-t 16.1 gms of bis(m-aminophenoxybutyl)tetramethyl disiloxane was used in place of the polysiloxane.
The yellowish, fibrous polyimide recovered was soluble in dipolar aprotic solvents. Films case onto glass, metal and ceramic substrates were tough and adherent.
4. Pre~aration of 2,2-bisr4-(p-aminophenoxy)Phenyl]
~ro~ane The following are charged into a 2 liter 3-necked flask under nitrogen atmosphere:
Bisphenol A 221.4 gms 5% NaOH solution 155.2 gms toluene 500 ml Dimethylsulfoxide 500 ml The system is heated to reflux and water is removed azeotropically. ~fter about 6 hours the system is anhy-drous and the bis-sodium salt begins to crystallize from solution.

-216~ 4 The reaction temperature is dropped to about ~0 C
and there is added, all at once, 306 gms of p-chloro-nitrobenzene; the reaction mixture is maintained at 70C overnight. Thereafter, the mixture is cooled and filtered. The toluene is stripped at reduced pressure.
Upon cooling, a yellow solid forms; it is recovered by filtration. Analysis confirms the structure to be 02N ~ 0 ~ C ~ - ~ ~2 Fifty grams ~f this intermediate are dissolved in dimethylformamide and to the solution are added 5 gms of Raney nickel. The entire contents are hydrogenated in a Paar hydrogenator at 50 PSI and 80C. When hydrogen uptake is complete (about 4 hours), the reaction mixture is filtered and poured slowly into a large excess of water. The product is redovered by filtration and re-crystallized from a toluene-hexane mixture. Analysis confirms the structure to be CH
2 ~ 0 ~ ~ C ~ ~ N~2 P3Q~

r E~Al~pLE--LxvIII
Preparation of the compound of formula ~ O-(CH2)4-Si-O-Si-(CH2)4-O ~ COO~

C 135 grams of 3,4-xylyloxybutyl dimethylchlorosilane and 128 grams of p-tolyloxybutyl dimethylchlorosilane are combined and added dropwise with rapid stirring to a solution of 40 gms NaOH in 1 liter of water. Stirring ls terminated upon completion of the addition; two layers appear. The top layer is separated and dried by addition of an equal volume of toluene followed by azeotropic water separation. Finally, the toluene is stripped.
The product is analyzed by gas chromatography and three peaks are detected; these correspond to two homo-coupled products and the cross-coupled product. Purification is effected by fractionation, and a clear liquid product is recovered having the structure:

H3C ~ O-(CH2)4-Si-O-Sl-(CH2) ~ ~ CH3 -?.18- 1z$0304 This intermediate is oxidized using a fivefold excess of potassium permanganate equivalence in a 4:1 pyridine:water mixture. ~inally, cyclization is effected to form the anhydride. Thus, 50 grams of the triacid are dissolved in a mixture of lOOml toluene, lOOml glacial acetic acid and 50ml acetic anhydride; the mixture is refluxed for two hours. The mixture is then cooled and c filtered; the product is dried overnight at 75C under vacuum.

~Lz5~30g EXAMPLE ~XIX

PREPARATION OF SILOXANE-MODIFIED
POLYPHENYLENE S~LFIDE

Polyphenylene sulfide is made by reacting dichlorobenzene with sodium sulfide at 250C in N-methyl-pyrrolidone under pressure.
Part of the dichlorobenzene is replaced by 1,3-bis(p-chlorophenoxy-butyl)tetramethyldisiloxane to obtain the siloxane-modified product.
The preparation was done by first charging 300 ml N-methyl-pyrrolidone to a stirred stainless steel 2-liter reaction vessel equipped with oil ~acket heating and a thermometer; then is added the sodium sulfide, which is in the form Na2S.5H2O. This was re-fluxed until all water had been removed. Thereafter, the dichloro-benzene and 150 ml of N-methylpyrrolidone are added, the system is sealed and heated; pressure increases to about 15 atmospheres. At the end, the polymer is suspended in N-methylpyrrolidone. It is recovered by washing in water, and acetone, and dried under vacuum.
When the disiloxane is added, it is dissolved in 150 ml of N-methylpyrrolidone.
The results are summarized in the following table.

Dichlorobenzene Siloxane Na2S(mol) Yield Run mol(gms) mol (gms) A 0.7(103g) - 0.7 92.5 B 0.68 (lOOg) 0.02 (lOg) 0.7 86 C 0.66 (97g) 0.04 (20g) 0.7 74 i,~

3L~3(~4 The standard product, run A, had a melt viscosity at 310C of 27 poise; the product of run B had a melt viscosity at 310~C of 6 poise and the product of run C had a melt viscosity at 310C of 1 poise. There is thus seen a substantial reduction in melt viscosity.
The adhesion of the modified polyphenylene sulfide pre~
pared in runs B and C above was compared to that of polyphenylene sulfide commerically available from Phillips Petroleum Company under trademark Ryton-P4. The following procedure was employed.
The resins were aged overnight in air at 300C. Five grams of resin were placed in a mold, pre-heated for five minutes at 310C
and molded at 200 atmospheres. At the end of five minutes the heat was shut off and when the mold temperature dropped to 200C
via water cooling, the mold was opened. The molded specimens were 150 x 150 x lmm.
A sample 20 x 25mm was cut from the molded specimens;
these samples were glued between two 1 inch wide aluminum plates on a common surface of 3.226cm2tO.5in2). The aluminum plates were heated for 10 minutes with ultrasound in 1,1,1-trichloroethane and then soaked for another 10 miuntes.
The molded samples of resin were glued to the aluminum plates with the following epoxy adhesive:

~ . ~
,.~ ~

~:5~304 -221.- 24133-609D
Parts by Weight Diglycidyl ether of Bisphenol A 10n Dicyandiamine 10 Diuron 3 Asbestos 5 Aluminum Powder 40 which was applied and cured at 150C for 20 minutes without pres-sure to form the following structure:
Al --~ EPOXY CEMENT

PPS - Al 5 ~0.5 in., The plates were pulled apart at a speed of lmm per minute; the following results were obtained:

PPS Product Tension at Break Ryton-P4 21.9 Kg/Cm2 (300PSI) Run B ~ 35.1 Kg/Cm (500PSI) Run C 35.1 Kg/Cm2 (500PSI) It is seen that there is a significant increase in ad-hesion of the siloxane-modified polyphenylene sulfide compared to the unmodified, comm~rcially available material.

~2S~)304 EXAMPLE LXX

PREPAR~TION OF SILOXANE-MODIFIED
POLYETHYLENE TEREPHTHALATE

Two runs were made, one using dimethyl terephthalate, the other replacing 10 mole ~ of the dimethyl terephthalate with 1,3-bis(p-carbomethoxyphenoxypropyl) tetramethyl disiloxane.
In a polymer tube bearing a side arm is placed 15.5g (0.08 mole~dimethyl terephthalate, 11.8g (0.19 mole)ethylene glycol, 0.025g calcium acetate dihydrate, and 0.006g antimony trioxide (80). The tube is partially immersed in a 197C metal bath to melt the mixture, and a capillary tube is introduced which reaches to the bottom of the tube. A slow stream of nitrogen is passed through the melt. Methanol is distilled from the mixture during the course of 1 hour, after which time the polymer tube is immersed as far as is practical in the heating bath. The mixture is heated another 2 hours at 197C. Removal of the last trace of methanol is a requisite for high polymer formation. It may be-come necessary to heat the side arm during this period to prevent clogging from the distillation of some dimethyl terephthalate.
The polymer tube is now heated by means of a 222C bath for 20 minutes, then is transferred to a 283C bath. After 10 minutes, the pressure is reduced to 0.3mm or less, over 15-20 minutes. Due safety precautions, especialiy as to adequate shield-ing should be observed. The polymerization is continued for 3 hours; the alteration in rate of bubble rise from the capillary -222a- 24133-609D
indicates the change in viscosity. The polymer tube is wrapped in a towel and is allowed to cool under nltrogen.
The siloxane-modified polymer was obtained in 89% yield;
it is compared to the reference polyester in the following table:

, , ,,i 30~

b"~
3~ ~ ~
U~ ~-~ ~ ~
H Q) O
~E D

~ ,1 o O ~ ~
H h ~1 ~ ~ ~ o ~r E~ o ~ O
U~-rl ~ ~4 H h ~
N Il-) O ~;

~ ~o E~ ~ Ln rl U~
~-~1 U~' ~
H~1) O ~ N
E~-l ~ Q

H I C) a ~ . O
h ~1 tll ~~r N
o ~ O ~ ~
,t ~q ~
h la t_~ N
e~ I` ' u~
.
S ~r ~ . ~
.,1 O O ~1 V
I V
a~ $ oP ~ ~ ~q ~ ~ o o ~ :, a.) -1 ~ Ql --I
s ~
~1 O Ql ~-I X ~ ~I Q
) 4 ~ ~ h t~o a) a) ~1 o ~ a~ H
t~`-q u~~ ~ h u~
, ~ . .

~2~304 EXAMPLE LXXI

P~EPARATION OF SILOXANE-MODIFIED
AROMATIC POLYESTERS

Aromatic polyesters are made by reacting aromatic acid chlorides with bisphenol A. Siloxane-modified polyesters are made by replacing 10 mole ~ of the bisphenol A by an oligomer of for-mula - O O

HO ~ U~cX~o~ls~lo--~11~ ~O(CH2)451 0 The oligomer is obtained by reacting one mole of bis(m-aminophenoxy-butyl)tetramethyl disiloxane with two moles of the diether dianhydride of diphenyl sulfide, and reacting the product with two moles of p-aminophenol. The aromatic acid chloride was a 50/50 mixture by weight of isophthaloyl/terephthaloyl chloride.
A solution of 11.40g (0.05 mole) of 2,2-bis(4-hydroxy-phenyl)propane and 4.0g of sodium hydroxide in 300ml of water was placed in a blender. Into this mixture 30ml of 10~ aqueous sodium lauryl sulfate was stirred gently to minimize frothing. Then 5.08g of isophthaloyl chloride and 5.08 of terephthaloyl chloride in 150ml of toluene was added rapidly with vigorous stirring and the stirring was continued for 5 minutes. The emulsion was poured into 3 3 o 4 an excess of acetone, the solid polymer was collected by filtration, wasned wellwith water and dried. The powdered polymer was recovered.
Results were as follows:
DTA
Yield 1 run 2 run Sample % inh* Tg C Tg C
Reference 85.8 0.51 194 185 10% Siloxane modified 86 0.37 109 147 * Inherent Viscosity ,, .~

~h~ 304 EXAMPLE LXXII
PREPARATION OF SILOXANE-MODIFIED
POLYCA~BONATE
.

A polycarbonate resin was prepared as follows:
Into a solution of 20 g of bisphenol ~ in 21.05g of anhy-drous pyridine and 90.35g of dry methylene chloride (methanol free) introduce at 25C 7g of gaseous phosgene with agitation and cooling within 90 minutes. Near the end of the addition the solution will become viscous. Add a solution of 1.95g of phosgene in 103.5g of methylene chloride dro~wise. ~fter one hour wash the reaction mixture first with 10% hydrochloric acid and then with water until chloride ions can no longer be detected in the wash water. Precipi-tate the resulting viscous solution of the polycarbonate in methyl-ene chloride by the addition of petroleum ether with agitation.
Filter the finely divided white precipitate and dry it at 120C
under vacuum.
~ he siloxane modification was accomplished by replacing 10 mole ~ of the bisphenol A with the diphenolic oligomer whose preparation was described in Example LXXI

Ol O

2 0 ~ N ~ C ~ 3~oJ~SJ ~ ~ C\ N~_ o ( Cl~2 ) i~

., ~Z~3~g The siloxane-modified polymer was washed as follows:
-washing (10 times) with water (400cc), this was not enough to eliminate chloride ions -precipitation in petroleum ether (2.5 liters) with vigorous agitation -drying at 80C under vacuum -washing of polycarbonate in powder form with hot water (50~ -60C) 3 times (400cc) to eliminate chloride ions -drying at 100C under vacuum.

The quantities of materials used are summarized:

Phenol-capped Sample Bisphenol Apolyimide oligomer COC12 mole g mole g mole g Reference 0.0876 20 0 0 0.905 8.9S

10% siloxane modification 0.0788 18 0.0114 18.49 0.0905 9.95 The reference product was obtained irl yield of 87.7% and had an inherent viscosity in 60/40 phenol/tetrachloroethane of 0.80-0.84. The siloxane-modified polycarbonatewas obtained in 79% yield and had an inherent viscosity of 0.48-0.49.

30a~

EXAMPLE LXXIII
PREPARATION OF SILOXANE-MODIFIED
ALIPHATIC POLYAMIDES

Nylon 6,6 was prepared from adipic acid and hexamethylene diamine; the siloxane modifieation was achieved by replaeing 15 mole ~ of the adipie acid with 1,3-bis(p-carboxyphenoxybutyl)tetramethyl disiloxane.
The salt of hexamethylenediamine and adipic acid is prepared as follows:

In a 250 ml Erlenmeyer flask is placed 14.60 g (0.100 mole) adipic acid. The acid is dissolved in 110 ml absolute ethyl alcohol by warming, and then is cooled to room temperature.
A solution of 11.83 g (0.102 mole) hexamethylen~diamine (b.p. 90--92C/14mm, m.p. 41-42C) in 20 ml absolute ethyl alcohol is added quantitatively to the adipic acid solution. The mixing is accom-panied by spontaneous warming. Crystallization soon occurs. After standing overnight, the salt is filtered, washed with cold absolute alcohol, and air-dried to constant weight. The yield is 25.5 g (97%). A 2% excess of diamine is used to promote a salt which is rieh in diamine, since this is the more volatile component and may be lost during salt drying or during polycondensation. The white erystalline salt melts at 196-197C and has a pH of about 7.6, determined on a 1% solution of salt in water, using a pH meter.
The mixed salt of adipic acid, carboxy-disiloxane and hexamethylenediamine was prepared in dimethylformamide by mixing:

~s~

0.05 mole hexamethylenediamine in ~0 cc dimethylformamide 0.0425 mole of adipic acid in 100 cc dimethylformamide 0.0075 mole of carboxy-disiloxane in 80 cc dimethylformamide After standing overnight the salt is filtered as a white powder, washed with dimethylformamide and dried 4 hours at 80C
under vacuum. The yield was 93.3~; the white crystalline salt melts at 190-192C.
The polycondensation reaction was performed with 1 mole % of chain regulator (acetic acid salt of hexamethylene diamine~ in an autoclave according to the following steps:
- heat 1-1/2 hours at 215-220C under pressure - release pressure and raise temperature to 290-300 C
for 1-1/2 hours - gradually apply vacuum to 1 mm ~g over 1 hour while heating at 290-300C
- continue vaccum and heating for 30 minutes.

Nylon 66 Nylon 66,.
Reference Modified SALT PREPARATION
Yield ~ 96.2~ 93.3%
Melting Point 196~C 190-192C
POLYCONDENSATION
Melting Point 260C 254C
Inherent Viscosity* 1.01 1.10 *0.5 g/lOOcc metacresol `~

~L2S~304 The thermal stability of the modified polyamide is about 15C higher (312C) than the nylon 6,6 reference (298C) when compared for onset of degradation temperature. The melting point of the modified polymer and the glass transition temperature are lowered, about five percent in each case. Siloxane-modified aliphatic nylons have also been made by interfacial emulsion poly-condensation and by solution polymerization (in chloroform) of hexamethylene-diamine, sebacoyl chloride and the carboxy-siloxane.
EXAMPLE LXXIV
SILOXANE-MODIFIED AROMATIC POLYAMIDES
An aromatic polyamide was prepared by interfacial poly-condensation as follows:
A dispersion was prepared in a home blender at room temp-erature from the following: 250 ml of water, 100 ml of chloroform, 2.0 gofsodium lauryl sulfate, 10.6 g (0.1 mole) of sodium car-bonate, and 0.025 mole of p-phenylene diamine. To this stirred dispersion was added over a 30-sec. period a solution of 0.025 mole terephthaloylchloride in 100 ml of chloroform. The mixture was stirred for 5 minutes and then an equal volume of hexane was added with moderate stirring. The product was washed and dried. The process was repeated, replacing 15 mole % of the terephthaloyl chloride with 1,3-bis(p-carboxyphenoxybutyl)-tetramethyl disiloxane.
The results are summarized in the following table:

~:~5~30~

-23l.- 24133-609D
TGA first YieldViscosity degradation Melting Sample (~)in S04E~2 _ (C)Point Reference 94 0.29 320more than Siloxane Modified 54 0.27 230more than

Claims (29)

THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:

1. A siloxane of formula where F1 is each selected from hydrogen, chlorine, bromine, iodine, fluorine, -NCO, -NCS, -N2, N3, -NO3, -NO2, -CN, -OCN, -O-(C1-C8)alkyl, -SCN, , -S-(C1-C8)-alkyl, -S-S-(C1-C8)alkyl, , -CHO, , -COOH, -COSH, , -SO2OH, SOOH, -SOH, -CONH2, -OH, -SH, -NRaRb where Ra and Rb each independently is hydrogen or lower alkyl or together with N form part of a hetero-cyclic group, alpha-oxirane and , where the carbonyl groups are located ortho to each other, and F1 is each bonded to Q
directly or via an intermediate alkyl or alkoxy group of 1 to 8 carbon atoms, an aryl group or an intermediate Q-Z- group;
Q is substituted or unsubstituted carbocyclic aromatic of 6 to 18 ring carbon atoms or substituted or unsubstituted hetero-cyclic aromatic of 5 to 18 ring atoms where the hetero atoms are selected from N, O and S, and where the substituents are alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl of 2 to 12 carbon atoms, cycloalkyl of 4 to 8 carbon atoms, alkoxy of 1 to 12 carbon atoms, alkylthio of 1 to 12 carbon atoms, phenyl, alkyl-phenylene having 1 to 12 carbon atoms in the alkyl group, phenoxy, phenylthio, alkylcarbonyloxy of 2 to 12 carbon atoms, phenylalkylene of 1 to 12 carbon atoms in the alkylene group, alkylcarbonyl of 2 to 12 carbon atoms, alkoxycarbonyl of 2 to 12 carbon atoms, bromo, chloro, fluoro, iodo, nitro, cyano, cyanothio, carboxy, carbonyl, hydroxy, mercapto, formyl, thioformyl and mercaptocarbonyl;

;
D is hydrocarbylene of 1 or 3 to 18 carbon atoms, unsub-stituted or substituted by Br, Cl, I, F, -NC, -NO2, -OCN, alkoxy of 1 to 8 carbon atoms, -S-(C1-C8)alkyl, alkyl, S-S-(C1-C8)alkyl, -COOH, -COSH, -CSOH, -CONH2, -CN, -CHO, -CHS, -OH, -SH, -NCO and -NR7R8 where R7 and R8 independently are hydrogen or lower alkyl, R1, R2, R3, R4, R5 and R6 each independently, is unsub-stituted or substituted alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl of 2 to 12 carbon atoms, cycloalkyl of 4 to 8 carbon atoms, phenyl, alkylphenylene where the alkyl group contains 1 to 12 carbon atoms, phenylalkylene where the alkylene group contains 1 to 12 carbon atoms, alkenylphenylene with 2 to 12 carbon atoms in the alkenyl group and when substituted, these hydro-carbyl groups are substituted by Br, Cl, I, F, -NC, -NO2, -OCN, alkoxy of 1 to 8 carbon atoms, -S-(C1-C8)alkyl, , -S-S(C1-C8)alkyl, -COOH, -COSH, -CSOH, -CONH2, -CN, -CHO, -CHS, -OH, -SH, -NCO and -NR7R8 where R7 and R8 independently are hydrogen or lower alkyl, x, y and z each independently has a value of from 0 to 100.

2. A siloxane according to claim 1, in which Q is unsubstituted or substituted carbocyclic aromatic of 6 to 18 ring carbon atoms, the substituents being those defined for Q in claim 1;
D is branched or linear alkylene of 1 or 3 to 12 carbon atoms.

3. A siloxane according to claim 2, in which Q is carbocyclic aromatic of 6 to 18 ring carbon atoms that is unsubstituted or substituted by from 1 to 4 of said sub-stituents.

4. A siloxane according to claim 3, in which Q is carbocyclic aromatic of 6 to 18 ring carbon atoms that is unsubstituted or substituted by from 1 to 4 of lower alkyl, lower alkenyl, lower alkynyl, cycloalkyl of 4 to 8 carbon atoms, lower alkoxy, lower alkylthio, phenyl, lower alkylphenylene, phenyl lower alkylene, lower alkenylphenylene, phenoxy, phenylthio, lower alkylcarbonyl, lower alkylcarbonyloxy, lower alkoxycarbonyl, bromo, chloro, fluoro, iodo, nitro, cyano, cyanothio, carboxyl, carbonyl, hydroxyl, mercapto, and mercaptocarbonyl;
D is methylene or alkylene of 3 to 8 carbon atoms;
R1 is lower alkyl, lower alkenyl, lower alkynyl, phenyl, lower alkylphenylene, phenyl lower alkylene, or lower alkenyl-phenylene;
R2 is alkyl of 1 to 12 carbon atoms;
R3 is phenyl, alkyl phenylene of 7 to 18 carbon atoms or alkyl of 1 to 12 carbon atoms;
R4 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl;
R5 is alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms;
R6 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms; the substituents on R4, R5 and R6 lower alkyls being independently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto.

5. A siloxane according to claim 4, in which Q contains up to 1 substituent as defined for Q in claim 4;

-235a-R1 is lower alkyl;
R2 is lower alkyl;
R3 is lower alkyl or phenyl;
R4 is lower alkyl, phenyl, lower alkenyl or substituted lower alkyl;

R5 is lower alkenyl or substituted lower alkyl;
R6 is lower alkyl, lower alkenyl or substituted lower alkyl; the substituents on R4, R5 and R6 lower alkyls being inde-pendently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto.

6. A siloxane according to claim 5, in which D is methylene or alkylene of 3 to 8 carbon atoms; and Z is .

7. A siloxane according to claim 6, in which D is methylene, propylene or butylene;
R1 is alkyl of 1 to 3 carbon atoms;
R2 is alkyl of 1 to 3 carbon atoms;
R3 is alkyl of 1 to 3 carbon atoms or phenyl;
R4 is alkyl of 1 to 3 carbon atoms, alkenyl of 2 to 4 carbon atoms, phenyl or said alkyl substituted by amino, cyano, hydroxyl or -CONH2;
R5 is alkenyl of 2 to 4 carbon atoms or alkyl of 1 to 3 carbon atoms unsubstituted or substituted by amino, cyano, hydroxyl or -CONH2;
R6 is alkyl of 1 to 3 carbon atoms, alkenyl of 2 to 4 carbon atoms or alkyl of 1 to 3 carbon atoms unsubstituted or sub-stituted by amino, cyano, hydroxyl or -CONH2.

8. A siloxane according to claim 7, in which Q is unsubstituted;

D is methylene or butylene;
R1 is methyl;
R2 is methyl;
R3 is methyl or phenyl;
R4 is methyl, vinyl or phenyl;
R5 is vinyl or methyl, ethyl or propyl unsubstituted or substituted by amino, cyano, hydroxyl or -CONH2;
R6 is methyl, vinyl or methyl, ethyl or propyl unsubsti-tuted or substituted by amino, cyano, hydrogen or -CONH2;
x has a value from 0 to 100;
y has a value from 0 to 20; and z has a value from 0 to 10.

9. A siloxane according to claim 1, 2 or 3, in which F1 is each selected from halogen, -NCO, -CN, -CHO, ,-OH, -COOH, , , and NRaRb where Ra and Rb is each independently hy-drogen or lower alkyl or Ra and Rb together with N form a hetero-cyclic group.

10. A siloxane according to claim 4, 5 or 6, in which F1 is each selected from halogen, -NCO, -CN, -CHO, -237a- -OH, -COOH, and NRaRb where Ra and Rb is each independently hydrogen or lower alkyl or Ra and Rb together with N form a hetero-cyclic group.

11. A siloxane according to claim 7 or 8, in which F1 is each selected from halogen, -NCO, -CN, -CHO, -OH, -COOH, and NRaRb where Ra and Rb is each independently hydrogen or lower alkyl or Ra and Rb together with N form a hetero-cyclic group.

12. A method for making a siloxane according to claim 1, which comprises a) for a compound according to claim 1 in which x, y and z are each zero, reacting a compound of formula wherein Fl, Q and Z are as defined in claim 1, and M is an alkali or alkaline earth metal, with a disiloxane of formula wherein X is Cl, Br or I, and - D and R1 are as defined in claim 1, and, b) for a compound according to claim 1 in which at least one of x, y and z is other than zero, heating a compound obtained from a) above with a cyclic polysiloxane of general formula wherein S is 3 or greater;
t is an integer of from 1 to 100 and when t is 2 or more, the R groups on any silicon atom are independent of any other R
groups; and R2-6 indicates a member selected from R2, R3, R 4, R5 and R6 which are as defined in claim 1, to a temperature of from about 85°C to about 250°C in contact with a catalyst.

13. A method for making a siloxane according to claim 1, in which x, y and z are each zero which comprises reacting a com-pound of formula Fl-Q--Z-M

wherein Fl, Q and Z are as defined in claim l; and M is an alkali or alkaline earth metal, with a disiloxane of formula where X is Cl, Br or I;
D and Rl are as defined in claim 1, in the presence of a dipolar aprotic liquid, a phase transfer catalyst or combination thereof.

14. A method according to claim 13, wherein in the starting materials

15. A method according to claim 13 or 14, in which the reac-tion is conducted at atmospheric pressure at a temperature of from 20° to 200°C.

16. A method according to claim 13 or 14, in which the reac-tion is effected with a dipolar aprotic liquid comprising dimethyl sulfoxide, N,N-dimethylformamide, tetramethylurea, N-methyl, -2-pyrrolidone or hexamethylphosphoramide.

17. A method according to claim 13 or 14, in which the reac-tion is effected with a dipolar aprotic liquid comprising from 1% to 100% by weight of the reaction medium.

18. A method according to claim 13 or 14, in which the reac-tion is effected with a phase transfer catalyst comprising a quaternary onium derivative of phosphorus, arsenic, nitrogen, anti-mony or bismuth, a macrocyclic crown ether or a cryplate.

19. A method according to claim 13, in which the reaction is effected with a phase transfer catalyst comprising a quaternary onium compound of formula (R4M)y (X)-Y

where each R is independently selected from alkyl of 1 to 20 carbon atoms, alkenyl of 2 to 20 carbon atoms, aryl of 6 to 20 carbon atoms, arylalkyene or alkylarylene of 7 to 40 carbon atoms;
M is P, As, N, Sb or Bi;
X is an anion; and y is 1 or more, to balance the electron charge.

20. A method according to claim 14 in which the reaction is effected with a phase transfer catalyst comprising a quaternary onium compound of formula (R4M)? (X)-y where each R is independently selected from alkyl of 1 to 20 carbon atoms, alkenyl of 2 to 20 carbon atoms, aryl of 6 to 20 carbon atoms, arylalkylene or alkylarylene of 7 to 40 carbon atoms;
M is P, As, N, Sb or Bi;
X is an anion; and y is 1 or more, to balance the electron charge.

21. A method according to claim 19 or 20, in which M is N or P; and X is a halide.

22. A method according to claim 19 or 20, in which there is present from 0.1 to 10 mole percent of phase transfer catalyst.

23. A method according to claim 19 or 20, in which the phase transfer catalyst comprises a macrocyclic crown ether selected from dibenzo-l8-crown-6, dicyclohexyl-18-crown-6, 18-crown-6, benzo-15-crown-5, 12-crown-4, cyclohexyl-15-crown-5 and octamethylcyclo-tetrafurfurylene.

24. A method according to claim 12 parts a) and b).

25. A method according to claim 12 parts a) and b) wherein, in the starting materials,

26. A method according to claim 13 or 14, wherein Q is carbocyclic aromatic of 6 to 18 ring carbon atoms that is unsubstituted or substituted by from l to 4 of lower alkyl, lower alkenyl, lower alkynyl, cycloalkyl of 4 to 8 carbon atoms, lower alkoxy, lower alkylthio, phenyl, lower alkylphenylene, phenyl lower alkylene, lower alkenylphenylene, phenoxy, phenylthio, lower alkylcarbonyl, lower alkylcarbonyloxy, lower alkoxycarbonyl, bromo, chloro, fluoro, iodo, nitro, cyano, cyanthio, carboxyl, carbonyl, hydroxyl, mercapto, and mercaptocarbonyl;
D is methylene or alkylene of 3 to 8 carbon atoms;
R1 is lower alkyl, lower alkenyl, lower alkynyl, phenyl, lower alkylphenylene, phenyl lower alkylene, or lower alkenylphenyl-ene;
R2 is alkyl of 1 to 12 carbon atoms;
R3 is phenyl, alkyl phenylene of 7 to 18 carbon atoms or alkyl of 1 to 12 carbon atoms;
R4 is alkyl of l to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl;
R5 is alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms;
R6 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms the substituents on R4, R5 and R6 lower alkyls being independently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto; and F1 is selected from halogen, -NCO, -CN, -CHO, -OH, -COOH and NRaRb where Ra and Rb is each independently hydrogen or lower alkyl or Ra and Rb together with N form a hetero-cyclic group.

27. A method according to claim 24 or 25 wherein Q is carbocyclic aromatic of 6 to 18 ring carbon atoms that is unsubstituted or substituted by from 1 to 4 of lower alkyl, lower alkenyl, lower alkynyl, cycloalkyl of 4 to 8 carbon atoms, lower alkoxy, lower alkylthio, phenyl, lower alkylphenylene, phenyl lower alkylene, lower alkenylphenylene, phenoxy, phenylthio, lower alkylcarbonyl, lower alkylcarbonyloxy, lower alkoxycarbonyl, bromo, chloro, fluoro, iodo, nitro, cyano, cyanthio, carboxyl, carbonyl, hydroxyl, mercapto, and mercaptocarbonyl;
D is methylene or alkylene of 3 to 8 carbon atoms;
Rl is lower alkyl, lower alkenyl, lower alkynyl, phenyl, lower alkylphenylene, phenyl lower alkylene, or lower alkenylphenyl-ene;
R2 is alkyl of 1 to 12 carbon atoms;
R3 is phenyl, alkyl phenylene of 7 to 18 carbon atoms or alkyl of 1 to 12 carbon atoms;
R4 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl;

R5 is alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms;
R6 is alkyl of 1 to 12 carbon atoms, phenyl, alkylphenyl-ene of 7 to 18 carbon atoms, alkenyl of 2 to 12 carbon atoms or substituted alkyl of 1 to 12 carbon atoms the substituents on R4, R5 and R6 lower alkyls being independently selected from halogen, amino, cyano, -CONH2, hydroxyl, and mercapto; and Fl is selected from halogen, -NCO, -CN, -CHO, -OH, -COOH and NRaRb where Ra and Rb is each independently hydrogen or lower alkyl or Ra and Rb together with N form a hetero-cyclic group.

28. A method for makinq a siloxane of formula wherein Fl is each selected from hydrogen, chlorine, bromine, iodine, fluorine, -NCO, -NCS, -N2, -N3, -N03, -N02, -CN, -OCN, -O-(Cl-C8)alkyl, -SCN, alkyl, -S-S-(Cl-C8)alkyl, -CHO, -COOH, -COSH, -SO2OH, SOOH, -SOH

-CONH2, -OH, -SH, -NRaRb where Ra and Rb each independently is hydrogen or lower alkyl or together with N form part of a hetero-cyclic group, alpha-oxirane and where the carbonyl groups are located ortho to each other, and Fl is each bonded to Q directly or via an intermediate alkyl or alkoxy group of 1 to 8 carbon atoms, an aryl group or an intermediate Q-Z- group;
Q is substituted or unsubstituted carbocyclic aromatic of 6 to 18 ring carbon atoms or substituted or unsubstituted hetero-cyclic aromatic of 5 to 18 ring atoms where the hetero atoms are selected from N, O and S, and where the substituents are alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl of 2 to 12 carbon atoms, cycloalkyl of 4 to 8 carbon atoms, alkoxy of 1 to 12 carbon atoms, alkylthio of 1 to 12 carbon atoms, phenyl, alkylphenylene having 1 to 12 carbon atoms in the alkyl group, . phenylthio, alkylcarbonyloxy of 2 to 12 carbon atoms, phenylalkylene of 1 to 12 carbon atoms in the alkylene group,alkyl-carbonyl of 2 to 12 carbon atoms, alkoxycarbonyl of 2 to 12 car-bon atoms, bromo, chloro, fluoro, iodo, nitro, cyano, cyanothio, carboxy, carbonyl, hydroxy, mercapto, formyl, thioformyl and -246a-mercaptocarbonyl;

Z is -O-, -S-, D is hydrocarbylene of 1 or 3 to 18 carbon atoms, unsub-stituted or substituted by Br, Cl, I, F, -NC, -NO2, -OCN, alkoxy of 1 to 8 carbon atoms, -S-(Cl-C8)alkyl, alkyl, -S-S-(Cl-C8)alkyl, -COOH, -COSH, -CSOH, -CONH2, -CN, -CHO, -CHS, -OH, -SH, -NCO and -NR7R8 where R7 and R8 independently are hydrogen or lower alkyl, R1, R2, R3, R4, R5 and R6 each independently, is unsub-stituted or substituted alkyl of 1 to 12 carbon atoms, alkenyl of 2 to 12 carbon atoms, alkynyl of 2 to 12 carbon atoms, cycloalkyl of 4 to 8 carbon atoms, phenyl, alkylphenylene where the alkyl group contains 1 to 12 carbon atoms, phenylalkylene where the alkylene group contains 1 to 12 carbon atoms, alkenylphenylene with 2 to 12 carbon atoms in the alkenyl group and when substituted, these hydrocarbyl groups are substituted by Br, Cl, I, F, -NC, -NO2, -OCN, alkoxy of 1 to 8 carbon atoms, -S-(Cl-C8)alkyl, (Cl-C8)alkyl, -S-S-(Cl-C8)alkyl, -COOH, -COSH, -CSOH, -CONH2, -CN, -CHO, -CHS, -OH, -SH, -NCO and -NR7R8 where R7 and R8 indepen-dently are hydrogen or lower alkyl, x, y and z each independently has a value of from 0 to 100 which method comprises a) for a siloxane defined above in which x, y and z are each zero, reacting a compound of formula wherein Fl, Q and Z are as defined above, and M is an alkali or alkaline earth metal, with a disiloxane of formula where X is C1, Br or I;
D and Rl are as defined above, either a) when Z is as defined above, in the presence of a phase transfer catalyst or b) when Z is other than -0-, -S-, in the presence of a dipolar aprotic liquid, and b) for a siloxane defined above in which at least one of x, y and z is other than zero, heating a compound obtained from a) above with a cyclic polysiloxane of general formula wherein S is 3 or greater;
t is an integer of from 1 to 100 and when t is 2 or more, the R groups on any silicon atom are independent of any other R
groups; and R2-6 indicates a member selected from R2, R3, R4, R5 and R6 which are as defined above, to a temperature of from about 85°C
to about 250°C in contact with a catalyst.

29. A method according to claim 28 part a).