CA1231404A - Method of forming a bussing block - Google Patents

Method of forming a bussing block

Info

Publication number
CA1231404A
CA1231404A CA000465622A CA465622A CA1231404A CA 1231404 A CA1231404 A CA 1231404A CA 000465622 A CA000465622 A CA 000465622A CA 465622 A CA465622 A CA 465622A CA 1231404 A CA1231404 A CA 1231404A
Authority
CA
Canada
Prior art keywords
apertures
wafers
buss bars
collars
bussing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000465622A
Other languages
French (fr)
Inventor
Ernest F. Kloenne
Garry A. Stout
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Emhart Industries Inc
Original Assignee
Emhart Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emhart Industries Inc filed Critical Emhart Industries Inc
Application granted granted Critical
Publication of CA1231404A publication Critical patent/CA1231404A/en
Expired legal-status Critical Current

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  • Connecting Device With Holders (AREA)

Abstract

ABSTRACT
A method of forming a bussing block having wafers stacked one on top of the other and including apertures which are in alignment with each other. Buss bars are carried on the wafers and have apertures aligned with the apertures in the wafers. Electrically insulating collars extend from selected ones of the wafer apertures so that when electrical terminals are inserted through all of the aligned apertures of the wafers and buss bars, the electrical terminals will be electrically isolated from the buss bars by the collars.

Description

I
This invention pertains to a method of forming a bussing block, and more particularly a husking block which can be readily integrated with a terminal block for a timing mechanism.
Timing mechanisms are used to control the operation of appliances such as dryers, dishwashers, and washing machines by opening and closing electrical switches, which are opened and dosed, are comprised of movable and fixed contact blades the ends of which are integral with or serve as electrical terminals.
The electrical terminals are carried by -terminal blocks in some sort of spaced relationship. Depending upon the desired operational sequences, the electrical terminals are sometimes electrically connected in accordance with a predetermined pattern by some sort of bussing means. The bussing means, which are normally thin strips of electrically conductive Motorola, are usually carried by bussing blocks.
It is highly desirable that such bussing hocks be a unit in and of itself which may he easily connected and disconnected from the timing mechanism or terminal block such that a programmed sequence can be readily changed. Also if -there are many bussing means to be us edit is essential that the bussing means be electrically insulated from each other.
Moreover, means should be provided to readily allow the bussing means to be positioned according to a desired pattern.
Accordingly, the present invention is directed to a method of forming a bussing block which in general comprises at least one wafer, first apertures in the wafer, electrical bussing means carried on the wafer and including second apertures in alignment with the first apertures, electrical terminals extending through the first and second apertures, and electrical insulating means separating the bussing means from selected ones of the electrical -terminals.
According to a further broad aspect of the present invention, there is provided a method of forming a bussing block and which comprises a the steps of providing a plurality of wafers, each of which includes a plurality of first apertures and electrically insulative collars extending from each of the wafers around the first apertures. A
plurality of electrical buss bars are also provided with each of the buss bars having a plurality of second apertures therein and spring tabs extending in-to the second apertures. The method comprises also removing selected ones of the collars and selected ones of the spring tabs. The electrical buss bars are assembled on the wafers such -that those of the second apertures having their spring tabs removed fit around -the remaining collars.
According to a further broad aspect, there is provided the additional step of stacking the wafers with -the buss bars one on top of the other such that of the firs-t and second apertures are aligned.
Figure 1 is an exploded view of a bussing block showing the features of the invention in combination with a terminal block.
Figure 2 is an exploded isometric view of the terminal block in combination with electrical terminals used in the block.
Figure 3 is a view taken along the line 3-3 of Figure 2.
- 2 -I
referring to the drawings, there is shown a bussing block 10 as used in combination with a terminal block 12. Terminal block I includes a block 14 through which a plurality of electrical terminals 16 extend, -the electrical -terminals including electrical contact blades 18 and 20 with -their electrical contacts 22.
Bussing block 10 includes a plurality of wafers 24, 26 and 28, each having apertures 24', 26' and 28' provided therein, and buss bars typically shown at 29, 30, 32, 33 and 35. As shown, wafer 24 has sidewalls 36 extending therefrom which capture and hold wafers 26 and 28 during assembly. It is understood that as many wafers as are needed can be used. Typically of all the buss bars, buss bars 29, 30 and 32 include apertures 29' t Andy 32'. The buss bars, as better shown in Figure 3, lie flat on wafers 24, 26 and 28. The wafers are all fabricated from a suitable electrically insulative material such as plastic while the buss bars as well as electrical terminals are fabricated from a good electrically conductive material such as copper.
As best shown in figure 2, selected ones of the apertures in the wafers have collars I extending from their peripheries -to provide an electrical insulating means between electrical terminals 16 extending -through the apertures and the buss bars. The collars are also fabricated of plastic. As shown in Figure 2, spring tabs 38 extend into the apertures of the bussing bars.

Jo Prior -to assembly, collars 34 are removed at selected ones of the apertures in the wafers and enlarge the apertures 26" and 28", for example.
In addition, spring tabs 38 are removed in the apertures of the buss bars corresponding to the remaining collars to permit the apertures of the buss bars to fit around or accommodate -the collars where electrical bussing is not desired. When assembled, each wafer with its buss bars carried thereon are stacked one on top of the other. Referring to Figure 3, when electrical terminals 16 are inserted through the apertures of the wafers, those going through the collars 34 will be electrically isolated from the buss bars, while those terminals going through the apertures without the collars will deflect the spring tabs 38 of the buss bars causing them to bear against the terminals to provide a positive electrical connection between the terminals and the buss bars.

Claims (5)

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:
1. A method of forming a bussing block comprising:
1) providing a plurality of wafers, each of said wafers including a plurality of first apertures, and electrically insulative collars extending from each of said wafers around said first apertures, 2) providing a plurality of electrical buss bars, each of said buss bars having a plurality of second apertures therein and spring tabs extending into said second apertures, 3) removing selected ones of said collars, 4) removing selected ones of said spring tabs, 5) assembling said electrical buss bars on said wafers such that those of said second apertures having their spring tabs removed fit around the remaining collars, and 6) stacking said wafers with said buss bars one on top of the other such that all of said first and second apertures are aligned.
2. A method of forming a bussing block comprising 1) providing at least one wafer having a plurality of first apertures, and electrically insulative collars extending from said one wafer around said first apertures, 2) providing a plurality of electrical buss bars, each of said buss bars having a plurality of second apertures therein and spring tabs extending into said second apertures,
3) removing selected ones of said collars,
4) removing selected ones of said spring tabs, and
5) assembling said electrical buss bars on said one wafer such that those of said second apertures having their spring tabs removed fit around the remaining collars.
CA000465622A 1984-04-02 1984-10-17 Method of forming a bussing block Expired CA1231404A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59568484A 1984-04-02 1984-04-02
US06/595,684 1984-04-02

Publications (1)

Publication Number Publication Date
CA1231404A true CA1231404A (en) 1988-01-12

Family

ID=24384244

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000465622A Expired CA1231404A (en) 1984-04-02 1984-10-17 Method of forming a bussing block

Country Status (2)

Country Link
BR (1) BR8405844A (en)
CA (1) CA1231404A (en)

Also Published As

Publication number Publication date
BR8405844A (en) 1986-06-10

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