CA1220160A - Solutions for the fusion of one metal to another - Google Patents
Solutions for the fusion of one metal to anotherInfo
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- CA1220160A CA1220160A CA000393921A CA393921A CA1220160A CA 1220160 A CA1220160 A CA 1220160A CA 000393921 A CA000393921 A CA 000393921A CA 393921 A CA393921 A CA 393921A CA 1220160 A CA1220160 A CA 1220160A
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Abstract
ABSTRACT
This invention relates to solutions for use in the fusion or bonding of one metal to another. One metal is present in solid form, the other in a dissociable form in solution. Broadly, the solutions are aqueous, have a pH of about 0.4-14, a conductivity of 10 to 80 ohms cm and contain:
(1) a compound consisting of a dissociable poly-valent metal to be fused to the other metal;
(2) a compound which is capable of complexing with compound (1), compounds (1) and (2) being either soluble in water or forming a complex which is soluble in water;
(3) a stabilizer which functions to keep (1) and (2) and the complex thereof in solution; and (4) a catalyzer which functions to promote the speed of reaction and reduce the valency of the polyvalent metal to a lower valence and to catalyze the complexing action between (1) and (2).
This invention relates to solutions for use in the fusion or bonding of one metal to another. One metal is present in solid form, the other in a dissociable form in solution. Broadly, the solutions are aqueous, have a pH of about 0.4-14, a conductivity of 10 to 80 ohms cm and contain:
(1) a compound consisting of a dissociable poly-valent metal to be fused to the other metal;
(2) a compound which is capable of complexing with compound (1), compounds (1) and (2) being either soluble in water or forming a complex which is soluble in water;
(3) a stabilizer which functions to keep (1) and (2) and the complex thereof in solution; and (4) a catalyzer which functions to promote the speed of reaction and reduce the valency of the polyvalent metal to a lower valence and to catalyze the complexing action between (1) and (2).
Description
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The present invention is concerned with certain novel solutions which are particularly useful for bonding one materi-al to another, notably one metal to another, according to the process described and claimed in applicant's co-pending Cana-dian patent application Serial No. 393,920, filed January 11, 1982.
A process is described and claimed in the above-men-tioned application Serial No. 393,920 which involves fusing into or onto a first metal or other electrically conductive material, a second metal or electrically conductive material by the steps of:
placing the second conductive material in contact with an adjacent surface of the first conductive material, the second conductive material being in a dissociable form as part of a solution; and applying an interrupted electrical signal of a prede-termined frequency to the first and second materials, whereby the second material is fused to the first material.
According to said process, the solution of the second material may be aqueous or organic. Desirably an aqueous solu-tion is used which has a pH of 0.4 to 14, the amount of second material therein is in the range of 0.10 to 10% by weight of the solution and the resistivity of the solution is in the range of 10 to 80 ohms cm.
Preferably both the first and second materials are metal. For example, the first material may be iron or iron alloy and -the second material may be molybdenum, tungsten or .~
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indium. A wide variety of ferrous and/or non-ferrous combina-tions are contemplated.
As indicated, the process of the above-mentioned Ser-ial No. 393,920 contemplates the use of a solution containing the metal to be fused (hereinafter the "second metal") to an-other metal ~hereinafter the "first" metal), it being under-stood that the term "metal" is intended to embrace metal alloys as well as single metals.
It is to be noted that Serial No. 393,920 also dis-closes another process for fusing metals together wherein bothmetal components are in solid form. This other process may be called "solid-to-solid" fusion for convenience. The present invention~ however, is only concerned with the solutions for use in the alternative process wherein one of the metals to be fused is initially in solution form. This is called for conve-nience "liquid-to-solid" fusion.
Certain of the metal solutions disclosed in Serial No. 393,920 and others described herein are new and constitute the basis for the present invention. Broadly described, these solutions are aqueous, have a pH oE about 0.4-14, a resistivity of 10 to 80 ohms cm and contain:
(1) a compound of a dissociable polyvalent metal to be fused to the other metal;
The present invention is concerned with certain novel solutions which are particularly useful for bonding one materi-al to another, notably one metal to another, according to the process described and claimed in applicant's co-pending Cana-dian patent application Serial No. 393,920, filed January 11, 1982.
A process is described and claimed in the above-men-tioned application Serial No. 393,920 which involves fusing into or onto a first metal or other electrically conductive material, a second metal or electrically conductive material by the steps of:
placing the second conductive material in contact with an adjacent surface of the first conductive material, the second conductive material being in a dissociable form as part of a solution; and applying an interrupted electrical signal of a prede-termined frequency to the first and second materials, whereby the second material is fused to the first material.
According to said process, the solution of the second material may be aqueous or organic. Desirably an aqueous solu-tion is used which has a pH of 0.4 to 14, the amount of second material therein is in the range of 0.10 to 10% by weight of the solution and the resistivity of the solution is in the range of 10 to 80 ohms cm.
Preferably both the first and second materials are metal. For example, the first material may be iron or iron alloy and -the second material may be molybdenum, tungsten or .~
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indium. A wide variety of ferrous and/or non-ferrous combina-tions are contemplated.
As indicated, the process of the above-mentioned Ser-ial No. 393,920 contemplates the use of a solution containing the metal to be fused (hereinafter the "second metal") to an-other metal ~hereinafter the "first" metal), it being under-stood that the term "metal" is intended to embrace metal alloys as well as single metals.
It is to be noted that Serial No. 393,920 also dis-closes another process for fusing metals together wherein bothmetal components are in solid form. This other process may be called "solid-to-solid" fusion for convenience. The present invention~ however, is only concerned with the solutions for use in the alternative process wherein one of the metals to be fused is initially in solution form. This is called for conve-nience "liquid-to-solid" fusion.
Certain of the metal solutions disclosed in Serial No. 393,920 and others described herein are new and constitute the basis for the present invention. Broadly described, these solutions are aqueous, have a pH oE about 0.4-14, a resistivity of 10 to 80 ohms cm and contain:
(1) a compound of a dissociable polyvalent metal to be fused to the other metal;
(2) a compound which is capable of complexing with com-pound (1), compounds (1) and (2) being eithar soluble in wateror forming a complex which is soluble in water;
(3) a stabilizer which functions to keep (1) and (2) and the complex thereof in solution; and ~:2~6C~
(4) a catalyzer which functions to promote the speed of reaction and reduce the valency of the polyvalent metal to a lower valence and to catalyze the complexing action between (1) and (2). Acid and/or alkaline material may also be used to insure the approriate pH for the conditions of use and to help keep the metal compounds (1) and (2) in solution.
Certain of these solutions may include a sufficient quantity of an organic solvent to ensure dissolution of the metal and/or the complex.
Certain other solutions may require conductivity en-hancing agents. And depending upon the end result desired, brightening agents may also be present. Wetting agents or sur-factants may also be provided.
By the use of these solutions it has been found pos-sible to effect fusion of the dissolved metal, using the pro~
cess described in copending Canadian Application Serial No.
393,920, with a first metal with facility, economy and at ambi-ent temperatures without the attendant physical or chemical changes which usually occur with the usual fusion methods.
These and other objects and features of the present invention will be more apparent from the following description and drawings in which certain specific embodiments of these solutions are illustrative of the invention and in which:
Fig. 1 is a general perspective view of one embodi-ment of an apparatus in accordance with the invention may be employed;
Fig. 2 is a general perspective view of a second embodiment of an apparatus in accordance with the solutions in accordance with the invention may be employed;
Fig. 3 is a schematic electrical circuit employed in the present invention;
S Fig. 4 is a circuit diagram of an oscillator as em-ployed in accordance with one embodiment of the present inven-tion;
Fig. 5 is a composite SEM photomicrograph with right-hand and left-hand halves, of a copper matrix with which molyb-denum has been fused using the process of the present invention with a molybdenum solution. The left-hand half has a magnifi-cation x1250 and the right hand half is a x8 enlargement of the marked area of the left-hand half;
Fig. 6 is a graph of an SEM/EPMA scan across the sample shown in Fig. 5 and shows the fusion of molybdenum with copper;
Fig. 7 is a composite SEM photomicrograph, with right and left hand halves, oE a steel matrix with which molybdenum has been fused using the process of the present invention with a molybdenum solution. The left hand half has a magnification x1250 and the right hand half is a x8 enlargement of the marked area of the left hand half;
Fig. 8 is a graph of an SEM/EPMA scan across the sample shown in Fig. 7 and shows the fusion of molybdenum with steel;
Fig. 9 is a composite photomicrograph, with right and left hand halves, of a copper matrix with which tungsten has been fused using the process of the present invention with a ~2~
tungsten solution. The left hand half has a magnification x1250 and the right hand halE is a x8 enlargement of the marked area of the left hand half;
Fig. 10 is a further SEM photomicrograph of the sample of Fig. 9 with a magnification xlO,000 of part of the marked area of Fig. 9;
Fig. 11 is a graph of an SEM/EPMA scan across the sample shown in Figs. 9 and 10;
Fig. 12 is a composite photomicrograph, with right and left hand halves, of a steel matrix with which tungsten has been fused using the process of the present invention with a tungsten solution. The left hand half has a magnification x1310 and the right hand half is a x8 enlargement oE the marked area of the left hand half;
Fig. 13 is a graph of an SEM/EPMA scan across the sample shown in Fig. 12 and shows the fusion of tungsten with steel;
Fig. 14 is a composite photomicrograph with right and left hand halves, of a copper matrix with which indium has been fused using the process of the present invention with an indium solution. The left hand half has a magnification x1250 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 15 is a graph of an electron microprobe scan across the sample shown in Fig. 14;
Fig. 16 is a composite SEM photomicrograph, with right and left hand halves of a steel matrix with which indium has been fused using the process of the present invention with ~Lf2~
an indium solution. The left hand half has a magnification x625 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 17 is a graph of an SEM/EPMA scan across the sample shown in Fig. 1~;
Fig. 18 is a composite SEM photomicrograph, with right and left hand halves, of a copper matrix with which nickel has been fused using the process of the present inven-tion with a nickel solution. The left hand half has a magnifi-cation x1250 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 19 is a graph of an SEM/EPMA scan across thesample shown in Fig. 18;
Fig, 20 is a composite SEM photomicrograph with right and left hand halves, of a steel matrix with which nickel has been fused using the process of the present invention with a nickel solution. The left hand half has a magnification x1310 and the right hand half is a x8 enlargement of the marked sec-tion of the left hand half;
Fig. 21 is a graph of an SEM/EPMA scan across the sample shown in Fig. 20;
Fig. 22 is a composite photomicrograh of a copper matrix with which gold has been fused. The left hand half has a magnification x1310 and the right hand half is a x8 enlarge-ment of the marked section of the right hand half.
Fig,'23 is a graph of an SEM/EPMA scan across the sample shown in Fig. 22 showing gold fused in ~he copper matrix;
Fig. 24 is a composite photomicrograph with right and left hand halves, of a steel matrix with which gold has been fused using the process of the present invention with a gold solution. The left hand half has a magnification x1310, the right hand half is x8 magnification enlargement of the marked area of the left hand half;
Fig. 25 is a graph of an SEM/EPMA scan across the sample shown in Fig~ 23 showing gold fused in the steel matrix;
Fig. 26 is an SEM photomicrograph with a magnifica-tion xlO,000 of a copper matrix with which chromium has beenfused using the process of the present invention with a first chromium solution;
Fig. 27 is a graph of an SEM/EPMA scan across the sample shown in Fig. 26 and shows the fusion of chromium with copper;
Fig. 28 is an SEM photomicrograph with a magnifica-tion xlO,000 of a steel matrix with which chromium has been fused using the process of the present invention with the first chromium solution referred to above;
Fig. 29 is a graph of an SEM/EPMA scan across the sample shown in Fig. 28 and shows the fusion of chromium with steel;
Fig. 30 is a composite SEM photomicrograph, with right and left hand halves, of a copper matrix with which chromium has been fused using the process of the present inven-tion with a second chromium solution. The left hand half has a magnification x625 and the right hand half is a x8 enlargement of the marked area of the left hand half;
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Fig. 30A is a further enlarged SEM photomicrograph of the marked area of Fig. 30 at a magniEication of xlO,000;
Fig. 31 is a graph of an SEM/EPMA scan across the sample shown in Fig. 30 and shows the fusion of chromium with copper, Fig. 32 is a composite SEM photomicrograph, with right and left hand halves, of a steel matrix with which chromium has been Eused using the process of the present invention with a second chromium solution. The left hand half has a magnifica-tion x1250 and the right hand half is a x8 enlargement of the marked area of the left hand half;
Fig. 32A is a further enlarged SEM photomicrograph ofthe enlarged area of FigO 32 at a magnification of xlO,000;
Fig. 33 is a graph of an SEM/EPMA scan across the sample shown in Fig. 32 and shows the fusion of chromium with steel;
Fig. 34 is a composite photomicrograph with right and left hand halves, of a copper matrix with which cadmium has been fused using the process of the present invention with a first cadmium solution; the left hand halE has a magnification x1310 and the right hand half is a x5 enlargement of the marked area;
Fig. 35 is a graph of an SEM/EPMA scan across the sample shown in Fig. 34 and shows the fusion of cadmium with copper;
Fig. 36 is a photomicrograph at x11,500 magnification of a steel matrix with which cadmium has been fused using the process of the present invention with a second cadmium solution;
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E`ig. 37 is a graph of an SE~/EPMA scan across the sample shown in Fig. 36 and shows the fusion of cadmium with steel;
Fig. 38 i5 a composite photomicrograph with left and right hand halves, of a copper matrix with which tin has been fused using the process of the present invention with a first tin solution; the left hand half has a magnification of x655 and the right hand half is a x8 enlargement of the marked area;
Fig. 39 is an SEM/EPMA scan across the sample of Fig.
39 and shows the fusion of tin with copper;
Fig. 40 is a composite photomicrograph with left and right hand halves, of a copper matrix with which tin has been fused using the process of the present inven-tion with a second tin solution; the left hand half has a magnification x326 and the right hand half is x8 enlargement of the marked area;
Fig. 41 is an SEM/EPMA scan across the sample of Fig.
40 and shows fusion of tin with copper;
Figr 42 is a composite SEM photomicrograph with right and left hand halves, of a steel matrix with which tin has been fused using the process of the present invention with the sec-ond tin solution; the right hand half is a x1310 magnification and the left hand half is x8 magnification of the marked area;
Fig. 43 is a SEM/EPMA scan across the sample of Fig.
42 and shows fusion of tin with steel;
Fig. 44 is an SEM photomicrograph at a x5200 magnifi-cation of a copper matrix with which cobalt has been fused using the process of the present invention with a first cobalt solution;
9 _ Fig. 45 is an SEM/EPMA scan across the sample of Fig.
44 and shows fusion of cobalt with copper;
FigsO 46 and 46A are photomicrographs of a copper matrix with which silver has been fused using the process of the invention with a first silver solution;
Fig. 46 is a composite with the left hand side having a magnification of x625 and the right hand side being an x8 enlargement of the marked area;
Fig. 46A is a further enlarged SEM photomicrograph of the enlarged area of Fig. 47 at a magnification xlO,000;
Fig. 47 is an SEM/EPMA scan across the sample of Fig.
47 and shows Eusion of silver with copper;
Fig. 48 is an SEM photomicrograph at a magnification of xlO,000 of a copper matrix with which silver has been fused using the process of the present invention with a second silver solution;
Fig. 49 is an electron microprobe scan across the sample of Fig. 48 and shows fusion of silver with copper;
~ n those Figures which are graphs ! of Figs. 5 through 49, the vertical axis is logarithmic while the horizontal axis is linear. And in these graphs the surface layer has been taken as the point at which the concentration (wt~) of the matrix and the element which has been fused therewith are both at 50~ as indicated by the projections.
Referring now to drawings Figs. 1 and 2 these draw-ings illustrate in general perspective view apparatus in accordance with the invention which is employed to carry out the process of the invention.
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In Fig. 1, which exemplifies a solid-to-solid process the number 10 indicates a power supply and 11 an oscillator.
One side of the oscillator output is connected to an electrode 13 through a holder 12. Holder 12 is provided with a rotating chuck and has a trigger switch which controls the speed of rotation of the electrode 13. The speed of rotation is variable from 5,000 to 10,000 rpm.
The electrode 13 is composed of the material to be fused wlth the matrix. The matrix or substrate which is to be subjected to the process and which is to be treated is indicat-ed at 14. The matrix is also connected to the other side of the oscillator output by a clamp 15 and line 16.
By these connections the electrode is positively charged and the matrix is negatively charged when the signal is applied.
In Fig. 2 the corresponding components are corre-spondingly numbered. However, in this embodiment the process employed may be characterized as a liquid to solid process. In this apparatus the material to be fused is in the form of a solution and is held in a reservoir 17. Reservoir 17 is con-nected by a tube 18 to an electrode 19. Electrode 19 is a plate provided with an insulated handle 20 through which one side of oscillator 11 output is connected. This output is led into a main channel 21 in electrode 19. Channel 21 has a ser-ies of side channels 22 which open on to the undersurface ofelectrode 19. The flow from reservoir 17 is by gravity or by a pump and may be controlled by a valve such as 23 on the handle 20. For further control, more even distribution of the solution and to prevent the inclusion of foreign matter the surface of electrode 19 is preferably covered by a permeable membrane such as cotton or nylon.
It has been found that to effect fusion that the application of 50,000 watts/sq.cm. or alternatively the appli-cation of current of the order of 10,000 amps/sq.cm. is neces-sary.
From a practical standpolnt 10,000 amps/sq.cm. can not be applied constantly without damage to the matrix to be treated.
However, it has been found practical to apply a puls-ing signal of 2.5 microseconds to 28.6 nanoseconds having a magnitude of 3 amps to the electrode and this causes fusion to occur over an area of approximately 0,3 sq.mm.
To effect fusion over an area with the apparatus shown in Fig. 1 the electrode 13, matrix 14 and the oscillator output are connected as shown.
The operator passes the rotating electrode 13 in con-tact with the upper surface of the matrix over the matrix sur-face at a predetermined speed to apply the electrode materialto the matrix and fuse it therewith.
It has also been found that the continuous applica-tion of an alternating signal generates considerable heat in the substrate or matrix and to overcome this heat build-up and avoid weldments the signal generated in the present apparatus is a half-wave signal which permits dissipation of the heat.
As will be apparent to those skilled in the art each material, both the matrix and the material to be applied have ~2;~6~
speciEic resistance characteristics. Thus with each change in either one or both of these materials there is a change in the resistivity of the circuit.
In Fig. 3, R1 = the resistance of the electrode, R2 = the resistance of the ~atrix, and R3 = the resistance of the circuit of 10 and 11.
Variations in Rl and R2 will lead to variations in the frequency of the signal generated and the amplitude of that signal.
As mentioned previously a signal having an amplitudeof 3 amps is believed to be the preferred amplitude. If the amplitude i5 greater decarbonizing or burning of the matrix takes place and below this amplitude hydroxides are formed in the interface.
Fig. 4 is a schematic diagram of an oscillator cir-cuit used in apparatus in accordance with the present inven-tion.
In that circuit a power supply 30 is connected across the input, and across the input a capacitor 31 is connected, One side of the capacitor 31 is connected through the LC cir-cuit 32 which comprises a variable inductance coil 33 and capacitor 34 connected in parallel.
LC circuit 32 is connected to one side of a crystal oscillator circuit comprising crystal 35, inductance 36, NPN
transistor 37 and the RC circuit comprised of variable resis-tance 3~ and capacitance 39.
This oscillator circuit is connected to output 50 through, on one side capacitor 40, and on the other side diode 41, to produce a halfway signal across output 50.
In the apparatus actually used the several components had the following characteristics:
31 = 1.2 /~farad 32 = 0.3 picofarad 33 = 0-25 millihenrys 35 = 400 - 30 Khz 36 = 20 millihenrys 37 = NPN
38 = 3.5 /~farads 39 = 0 - 500 ohms 40 = 400 ~ farads 41 = diode To maintain the amplitude of the signal at 3 amps Rl resistance 38 is varied; to vary the frequency inductance 33 is varied.
If C = the capacitance of the circuit of Fig. 3 and Rl, R2 and R3 are the resistances previously characterized it is believed that the optimum frequency of the fusing signal Fo may be determined by the formula Fo = 1 FORMULA 1 2fi~
where L = Rl.R2.R3 and C = capacitance of the circuit L and C may be determined by any well-known method.
Fo depends on the material being treated and the material being applied but it is in the range 400Hz - 35MHz.
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The Erequency, it is believed, will determine the speed of the process.
To fuse a predetermined area, the area ls measured.
Since each discharge will fuse approximately 0.3 sq.mm. then the travel speed may be determined by the following formula:
Travel speed = Fl x ~3 x 60 /mm/minute ~ - FORMULA 2 Fl - Fn~ and A = area to be covered in sq. mm.
Fl is the number of discharges per second.
As mentioned previously the resistances R and R may be measured by any known means.
However it has been discovered that the measurement of resistance in the liquid phase may not he stable. In thi.s situation the resistance is measured in a standard fashion.
Two electroaes, 1 cm. apart and 1 cm. sq. in area are placed in a bath of the liquid phase and the resistance was measured after a 20 second delay. ~fter the variable parameters have been determined and the apparatus, matrix and probe have been connected as shown in Figs. 1 and 3, the probe 13 is passed over the surEace of the matrix in contact therewith at the pre-determined speed.
The speed of rotation is also believed to aEEect -the quality of -the fusion. With a rotation speed of 5,000 rpm the finish is an uneven 200 to 300 micro finish. With a speed of rotation of 10,000 rpm the finish is a substantially 15 micro finish.
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The apparatus of Fig. 2 is operated in the same man-ner as the apparatus of Fig. l and the process is essentially the same except for the use of a liquid with a solid electrode.
In the following specific examples the use of the solutions in association with the apparatus and in the process will be more clearly understood.
In each of these examples the electrode was so con-nected as will be apparent from the description, so that when charged the electrode is positively charged and the matrix is negatively charged.
With respect to the fusion of a second conductive chemical element into the solid matrix of a first conductive chemical element, using a solution of the second conductive chemical, with respect to each solution, the process was car-ried out at the ambient temperature, 20C, in the followingmanner.
The matrix 14 metal was connected into the circuit as previously described. The frequency was determined in accord-ance with the formula previously set forth and the solution in reservoir 17 applied by movement of the electrode over one sur-face of the first metal for varying periods of time as deter-mined by Form II. To ensure uniform distribution of the second metal solution over the surface of the first metal the elec-trode was covered with cotton gauze or nylon. It will be ap-parent that other materials may be employed. This arrangementalso served to limit contamination of the solution when graph-ite electrodes were employed. They had a tendency to release graphite particles in the course of movement~
The treated samples were -then sawn to provide a cross-sectional sample, washed in cold water, subjec-ted to ultrasonic cleaning, embedded in plastic and ground and pol-ished to produce a flat surface and an even edge. With samples of softer metals, since there may be a tendency to lose -the edge of the metal when grinding, two cross-sections were se-cured with the treated surfaces in face to face contiguous relationship. These samples were embedded as noted above, ground and polished.
Following embeddment the sample was etched using Nital* for steel, the ferrous substrate, and Ammonium Hydrogen Reroxide on the copper, the non-ferrous substra-te.
During the course o:E some applications it was found that adjustments were sometimes required in either the fre-quency, or speed of application. These were due to changes inthe solution composition or variations in the matrix.
A semiquantitative electron probe microanalysis of fused interfaces were performed using an Energy Dispersive X-Ray Spectroscopy (EDX) and a Scanning Electron Microscope (SEM).
The surface of the embedding plastic was rendered conductive by evaporating on it approxima-tely 20 um layer of carbon in a vacuum evaporator. This procedure was used to pre-vent buildup of electrical charges on an otherwise nonconduc-tive material and a consequent instability of the SEM image.Carbon, which does not produce a radiation de-tectable by the EDX, was used in preference to a more conventional metallic * A trade mark ' ~ ', 6C~
coating to avoid interEerence of such a coating with the ele-mental analysis.
Operating conditions of the SEM were chosen to mini-mize extraneous signals, fluorescent secondary emission and to yield at the same time the best possible spatial resolution.
The conditions typically used for the elemental ana-lyses by EDX were as follows-Accelerating potential 10-20 kV
Final Aperture 200-300 Spot size 50 nm Beam current 100-300 pA
Working distance 12-34 mm Magnification factor 5,000-10,000 Specimen angle normal to the beam Take-off angle 225 Count rate 800-2000 cps Live time 60-180 sec.
Energy calibration was tested using Al kd emission a-t 1.486 keV and cu K at 8.040 keV.
A standardless semiquantitative analyses was adopted for determination of elemental concen-tration, using certified reference materials (NBS 478, 78% Cu - 27% Zn and NBS 479a, Ni, 11~, Cr 18%, Fe) to verify results. Multiple analyses of ref-erence materials were in excellent agreernent with cer-tified values from NBS. Average precision of ~ 1% was achieved.
The diameter of analysed volume was calculated for typical elements analysed taking into consideration the mass range (the X-ray production volume) of the elemen-t.
~ 18 -~22C~60 For assessment of the diffusion depth a static beam was positioned across the interface at intervals greater than the above mentioned mass range thereby ensuring the accuracy of the analyses.
The results of elemental concentration were given in weight percentage (Wt%) for each of the measured points across the fusion interface.
As mentioned previously the metal solutions disclosed in Serial No. 319,~72 are new and constitute the basis for the present invention. Broadly described, these solutions are aqueous, have a pH of about 0.4-14, a resistivity of 10 to 80 ohms cm and contain:
(1) a compound of a dissociable polyvalent metal to be fused to the other metal;
(2) a compound which is capable of complexing with compound (1), compounds (1) and (2) being either soluble in water or forming a complex which is soluble in water;
(3) a stabilizer which functions to keep (1) and (2) and the complex thereof in solution; and (4) a catalyzer which functions to promote the speed of reaction and reduce the valency of the polyvalent metal to a lower valence and to catalyze the complexing action between (1) and (2). Acid and/or alkaline material may also be used to insure the appropriate pH for the conditions of use and to help keep the metal compounds (1) and (2) in solution.
Certain of these solutions may include a sufficient quantity of an organic solvent to ensure dissolution of the metal and/or the complex.
~22~3L~(33 Certain other solutions may require conductivity en-hancing agents. And depending upon the end result desired, brightening agents may also be present Wetting agents or sur-factants may also be provided.
A variety of dissociable polyvalent metal compounds, usually metallic salts or acids, may be used as component (1) provided they are soluble in the solution medium. Typical com-pounds include: sodium molybdate, sodium tungstate, indium sulphate, nickelous sulphate, nickelous chloride, chloroauric acid, chromium trioxide, chromium sulphate, chromic chloride, cadmium chloride, cadmium sulphate, stannous chloride, cobalt-ous sulphate, silver cyanide, silver nitrate.
Nor~nally component (1) will be used in an amount varying from 0.10 to 10% by weight based on the total weight of the solution. However, it will be appreciated that other amounts may be used, the particular amount used in any given situation depending on other conditions of use.
Representative metal complexing agents useful as com-ponent (2) include, such as, pyrophosphates, ethylene diamine tetracetic acid, citric acid, and potassium iodide and the like. The pyrophosphates also serve as stabilizing agents.
This component will usually consist of from 3 to 10%
of the weight of solution. However, the amount can be varied and should be selected to give optimum complexing with (1).
A wide variety of stabiliæers and catalysts may be used as components (3) and (4), respectively. Typical stabil-izers are the following: boric acid, citric acid or citrates, pyrophosphates, acetates and aluminum sulphate; while suitable catalysts include: metallic ions such as iron, nickel, anti-mony, and zinc, and organic compounds such as dextrine, hydro-quinone, gelatin, pepsin and acacia gum.
The amounts of these two components can be varied but usually each will fall in the range of 0.01 to 0.5~ by weight of the solution.
A wide variety of materials may be used to provide for the desired pH. Typical acids, and bases include the fol-lowing:
Acids: sulphuric, hydrochloric, hydrofluoric, orthophosphoric, citric and oxalic.
Bases: ammonium hydroxide, sodium hydroxide, potassium hydrox-ide and basic salts such as alkali carbonates and bicarbonates.
Typical brighteners are formaldehyde and carbon di-sulphide. A surEactant or wetting agent which is employed in some solutions is sodium lauryl sulphate. Others familiar to those in the art may be substituted.
In some solutions a conductivity enhancing agent such as sodium sulphate may be employed.
It will be noted that in Examples Il, III and IV
which follow, ferrous and ferric ions are provided in the solu-tion. While the iron was apparently transferred concurrently with molybdenum to the matrix there was no apparent material effect on the matrix or molybdenum which was fused with i-t.
It has been found that the transfer of molybdenum into the matrix was enhanced by the presence of the ferric and ferrous ions. The exact nature of the mechanism is not known but it is believed that the presence of these iron ions forms i ~
~2~1 6~
complexes which enhances the reduction of Mo~6 to lower valency states.
Certain further solutions require second chemical conductive element complexing agents which preclude precipita-tion of the second element. These agents were by way of ex-ample citric acid, or sodium pyrophospate, or ethylenediamine-tetracetic acid or their equivalents.
A suitable buffer is also provided in certain solu-tions, where required.
The water is always demineralized.
And for certain applications where the appearance of the product requires an elegant appearance small quantities of brighteners such as formaldehyde, carbon disulphide, benzene sulphonic acid or their equivalents may be employed. In these Examples, unless otherwise indicated the steel matrix was ASA 1018 and the copper was ASTM B-1333 Alloy 110.
~2~60 E X A M P L E
.
Atlas** A151 1020 steel was connected in the appa-ratus of Fig. 2 as the matrix 14 and a 10% solution of ammonium molybdate in water was placed in reservoir 17.
The following were the characteristics and conditions of treatment:
Matrix Resistance .0018 ohms Probe Resistance* 150 kiloohms Circuit Resistance .01 ohms Frequency 650 H~ at 0O4 picrofarad Contact Area 2 sq. cm.
Speed 60 cm./minute Depth of Treatment 0.5~m Surface Buildup 15 ~m *Determined by measurement across 1 sq. cm. plates spaced apart lcm. after a 20 second delay.
The sample of Example I was subject to a thermal cor-rosion test. 25% sulphuric acid was applied to the surface for 20 minutes at 325C without any surface penetration.
** A Trade Mark EXAMPLE II
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Sodium Molybdate 37.8 Ferrous Ammonium Sulphate 7 Ferric Ammonium Sulphate 8.6 Citric Acid 66.0 Water (distilled) 997 ml.
10 Sodium Lauryl Sulphate 0.5 Ammonium Hydroxide to required pH
Acacia (gum arabic) 0.1 - 0.2 E'ormaldehyde 7.5 ml.
The solution had the following characteristics:
15 pH = 7.5 Resistivity = 19 ohms cm Mo+6 concentration = 1.8% by wt.
Fe+2 = 0.10% by wt.
Fe+3 = 0.10% by wt.
The Mo+6 concentration may be varied from 1.5% to 2.5% by weight; the pH from 7.2 to 8.2 and the resistivity from 17 - 25 ohms cm.
REACTION CONDITIONS
Matrix : Copper 25 Electrode : Graphite Electrode Cover : Woven cotton Frequency : 9.09 KHz Rate of Application : 736.2 mm/minute Time of Application : 2 minutes ~2~
In the solutions set out in Examples II and III the presence of the ferrous and ferric ions are believed to serve to reduce the Mo+6 valency state to a lower valency state.
While iron is apparently concurrently transferred as illustrated in Fig. 6 the iron has apparently no material ef-fect on the characteristics of the matrix or the molybdenum.
An examination of the sample with an optical micro-scope shows a continuous coating of molybdenum free from pit-ting and with a dark silver colour.
As shown in the table below and Fig. 6 an SEM/EPMA
scan across the interface between the matrix and the applied metal, molybdenum is seen to be fused -to a depth of at least 4 um with a surface deposit of approximately 1 ~m.
TABLE
15 DEPTH um ELEMENT CONCENTRATION (WT%) 0.5 Mo 65.4 Fe 19.9 Cu 14.5 1.0 Mo 58.4 Fe 10~9 Cu 30.5 2.0 Mo 6.6 Fe 0.8 Cu 92.5 3.0 Mo 2.9 Fe 0.4 Cu 96.6 4.0 Mo 0.9 Fe 0.0 Cu 98.9 6~
EXAMPLE III
An aqueous solution of the same formulation as Example II was prepared and applied under the following conditions:
REACTION CONDITIONS
Matrix = Steel (ASA 1018) Electrode = Graphite Electrode Cover = Woven cotton Frequency = 4.11 KHz Rate of Application = 739.8 mm/minute Time of Application = 3 minutes Examination under the optical microscope showed a con-tinuous dark silver surface.
The photomicrograph Fig. 7, shows the deposition of a substantially uniEorm layer of molybdenum 1 micron thick of uniform density.
As shown in Fig. 8 an SEM/EPMA scan across the inter-fac0 between the substrate and the applied metal shows molyb-denum was present to a depth of at least 10 microns and a molybdenum gradient as set out below in Table.
TABLE
DEPTH um ELEMENT CONCENTRATION (WT~) 0.5 Mo 81.0 Fe 19.0 2 Mo 2.2 Fe 97.8 3 Mo 0.8 Fe 99.2 Mo 0.6 Fe 99 4 ~2;~3L6~
EXAMPLE III
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Sodium Tungstate 31.40 Ferric Ammonium Sulphate 8.63 Ferrous Sulphate 4.98 Citric Acid 66.00 Water (distilled) 1000 ml 10 Ammonium Hydroxide to required pH
Sodium Lauryl Sulphate 0.1 Formaldehyde 5 ml The solution had the following characteristics:
pH = 7.99 Resistivity = 22 ohms cm W+6 = 1 D 75% by wt.
Fe~2 = 0.1% by wt.
Fe+3 = 0.1% by wt.
The w+6 concentration may vary from 1.6% to 2.5%; the pH may vary from 7.5 to 8.5; and the resistivity may vary from 18 ohms cm to 24 ohms cm.
Reaction Conditions . .
Matrix = Copper Electrode = Graphite Cover = Cotton gauze Frequency = 3.83 KHz Rate of Application = 689.4 mm/minute Time of Application = 3 minutes :~22~
As shown by the photomicrographs Figs. 9 and 10, the sample showed a uniform deposit of tungsten approximately l micron thick. An SEM/EPMA scan showed fusion of tungsten on copper to a depth of at least 5.0 microns, as can be seen in the Table below and Fig. 11.
TABLE
DEPTH um CONCENTRATION (WT~) W Fe Cu 1.0 37.3 38.5 24.2 2.0 4.8 2.1 93.1 3.0 0.5 0.3 9902 4.0 0.7 0.2 99.1
Certain of these solutions may include a sufficient quantity of an organic solvent to ensure dissolution of the metal and/or the complex.
Certain other solutions may require conductivity en-hancing agents. And depending upon the end result desired, brightening agents may also be present. Wetting agents or sur-factants may also be provided.
By the use of these solutions it has been found pos-sible to effect fusion of the dissolved metal, using the pro~
cess described in copending Canadian Application Serial No.
393,920, with a first metal with facility, economy and at ambi-ent temperatures without the attendant physical or chemical changes which usually occur with the usual fusion methods.
These and other objects and features of the present invention will be more apparent from the following description and drawings in which certain specific embodiments of these solutions are illustrative of the invention and in which:
Fig. 1 is a general perspective view of one embodi-ment of an apparatus in accordance with the invention may be employed;
Fig. 2 is a general perspective view of a second embodiment of an apparatus in accordance with the solutions in accordance with the invention may be employed;
Fig. 3 is a schematic electrical circuit employed in the present invention;
S Fig. 4 is a circuit diagram of an oscillator as em-ployed in accordance with one embodiment of the present inven-tion;
Fig. 5 is a composite SEM photomicrograph with right-hand and left-hand halves, of a copper matrix with which molyb-denum has been fused using the process of the present invention with a molybdenum solution. The left-hand half has a magnifi-cation x1250 and the right hand half is a x8 enlargement of the marked area of the left-hand half;
Fig. 6 is a graph of an SEM/EPMA scan across the sample shown in Fig. 5 and shows the fusion of molybdenum with copper;
Fig. 7 is a composite SEM photomicrograph, with right and left hand halves, oE a steel matrix with which molybdenum has been fused using the process of the present invention with a molybdenum solution. The left hand half has a magnification x1250 and the right hand half is a x8 enlargement of the marked area of the left hand half;
Fig. 8 is a graph of an SEM/EPMA scan across the sample shown in Fig. 7 and shows the fusion of molybdenum with steel;
Fig. 9 is a composite photomicrograph, with right and left hand halves, of a copper matrix with which tungsten has been fused using the process of the present invention with a ~2~
tungsten solution. The left hand half has a magnification x1250 and the right hand halE is a x8 enlargement of the marked area of the left hand half;
Fig. 10 is a further SEM photomicrograph of the sample of Fig. 9 with a magnification xlO,000 of part of the marked area of Fig. 9;
Fig. 11 is a graph of an SEM/EPMA scan across the sample shown in Figs. 9 and 10;
Fig. 12 is a composite photomicrograph, with right and left hand halves, of a steel matrix with which tungsten has been fused using the process of the present invention with a tungsten solution. The left hand half has a magnification x1310 and the right hand half is a x8 enlargement oE the marked area of the left hand half;
Fig. 13 is a graph of an SEM/EPMA scan across the sample shown in Fig. 12 and shows the fusion of tungsten with steel;
Fig. 14 is a composite photomicrograph with right and left hand halves, of a copper matrix with which indium has been fused using the process of the present invention with an indium solution. The left hand half has a magnification x1250 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 15 is a graph of an electron microprobe scan across the sample shown in Fig. 14;
Fig. 16 is a composite SEM photomicrograph, with right and left hand halves of a steel matrix with which indium has been fused using the process of the present invention with ~Lf2~
an indium solution. The left hand half has a magnification x625 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 17 is a graph of an SEM/EPMA scan across the sample shown in Fig. 1~;
Fig. 18 is a composite SEM photomicrograph, with right and left hand halves, of a copper matrix with which nickel has been fused using the process of the present inven-tion with a nickel solution. The left hand half has a magnifi-cation x1250 and the right hand half is a x8 enlargement of the marked section of the left hand half;
Fig. 19 is a graph of an SEM/EPMA scan across thesample shown in Fig. 18;
Fig, 20 is a composite SEM photomicrograph with right and left hand halves, of a steel matrix with which nickel has been fused using the process of the present invention with a nickel solution. The left hand half has a magnification x1310 and the right hand half is a x8 enlargement of the marked sec-tion of the left hand half;
Fig. 21 is a graph of an SEM/EPMA scan across the sample shown in Fig. 20;
Fig. 22 is a composite photomicrograh of a copper matrix with which gold has been fused. The left hand half has a magnification x1310 and the right hand half is a x8 enlarge-ment of the marked section of the right hand half.
Fig,'23 is a graph of an SEM/EPMA scan across the sample shown in Fig. 22 showing gold fused in ~he copper matrix;
Fig. 24 is a composite photomicrograph with right and left hand halves, of a steel matrix with which gold has been fused using the process of the present invention with a gold solution. The left hand half has a magnification x1310, the right hand half is x8 magnification enlargement of the marked area of the left hand half;
Fig. 25 is a graph of an SEM/EPMA scan across the sample shown in Fig~ 23 showing gold fused in the steel matrix;
Fig. 26 is an SEM photomicrograph with a magnifica-tion xlO,000 of a copper matrix with which chromium has beenfused using the process of the present invention with a first chromium solution;
Fig. 27 is a graph of an SEM/EPMA scan across the sample shown in Fig. 26 and shows the fusion of chromium with copper;
Fig. 28 is an SEM photomicrograph with a magnifica-tion xlO,000 of a steel matrix with which chromium has been fused using the process of the present invention with the first chromium solution referred to above;
Fig. 29 is a graph of an SEM/EPMA scan across the sample shown in Fig. 28 and shows the fusion of chromium with steel;
Fig. 30 is a composite SEM photomicrograph, with right and left hand halves, of a copper matrix with which chromium has been fused using the process of the present inven-tion with a second chromium solution. The left hand half has a magnification x625 and the right hand half is a x8 enlargement of the marked area of the left hand half;
L6~
Fig. 30A is a further enlarged SEM photomicrograph of the marked area of Fig. 30 at a magniEication of xlO,000;
Fig. 31 is a graph of an SEM/EPMA scan across the sample shown in Fig. 30 and shows the fusion of chromium with copper, Fig. 32 is a composite SEM photomicrograph, with right and left hand halves, of a steel matrix with which chromium has been Eused using the process of the present invention with a second chromium solution. The left hand half has a magnifica-tion x1250 and the right hand half is a x8 enlargement of the marked area of the left hand half;
Fig. 32A is a further enlarged SEM photomicrograph ofthe enlarged area of FigO 32 at a magnification of xlO,000;
Fig. 33 is a graph of an SEM/EPMA scan across the sample shown in Fig. 32 and shows the fusion of chromium with steel;
Fig. 34 is a composite photomicrograph with right and left hand halves, of a copper matrix with which cadmium has been fused using the process of the present invention with a first cadmium solution; the left hand halE has a magnification x1310 and the right hand half is a x5 enlargement of the marked area;
Fig. 35 is a graph of an SEM/EPMA scan across the sample shown in Fig. 34 and shows the fusion of cadmium with copper;
Fig. 36 is a photomicrograph at x11,500 magnification of a steel matrix with which cadmium has been fused using the process of the present invention with a second cadmium solution;
~22~L6~
E`ig. 37 is a graph of an SE~/EPMA scan across the sample shown in Fig. 36 and shows the fusion of cadmium with steel;
Fig. 38 i5 a composite photomicrograph with left and right hand halves, of a copper matrix with which tin has been fused using the process of the present invention with a first tin solution; the left hand half has a magnification of x655 and the right hand half is a x8 enlargement of the marked area;
Fig. 39 is an SEM/EPMA scan across the sample of Fig.
39 and shows the fusion of tin with copper;
Fig. 40 is a composite photomicrograph with left and right hand halves, of a copper matrix with which tin has been fused using the process of the present inven-tion with a second tin solution; the left hand half has a magnification x326 and the right hand half is x8 enlargement of the marked area;
Fig. 41 is an SEM/EPMA scan across the sample of Fig.
40 and shows fusion of tin with copper;
Figr 42 is a composite SEM photomicrograph with right and left hand halves, of a steel matrix with which tin has been fused using the process of the present invention with the sec-ond tin solution; the right hand half is a x1310 magnification and the left hand half is x8 magnification of the marked area;
Fig. 43 is a SEM/EPMA scan across the sample of Fig.
42 and shows fusion of tin with steel;
Fig. 44 is an SEM photomicrograph at a x5200 magnifi-cation of a copper matrix with which cobalt has been fused using the process of the present invention with a first cobalt solution;
9 _ Fig. 45 is an SEM/EPMA scan across the sample of Fig.
44 and shows fusion of cobalt with copper;
FigsO 46 and 46A are photomicrographs of a copper matrix with which silver has been fused using the process of the invention with a first silver solution;
Fig. 46 is a composite with the left hand side having a magnification of x625 and the right hand side being an x8 enlargement of the marked area;
Fig. 46A is a further enlarged SEM photomicrograph of the enlarged area of Fig. 47 at a magnification xlO,000;
Fig. 47 is an SEM/EPMA scan across the sample of Fig.
47 and shows Eusion of silver with copper;
Fig. 48 is an SEM photomicrograph at a magnification of xlO,000 of a copper matrix with which silver has been fused using the process of the present invention with a second silver solution;
Fig. 49 is an electron microprobe scan across the sample of Fig. 48 and shows fusion of silver with copper;
~ n those Figures which are graphs ! of Figs. 5 through 49, the vertical axis is logarithmic while the horizontal axis is linear. And in these graphs the surface layer has been taken as the point at which the concentration (wt~) of the matrix and the element which has been fused therewith are both at 50~ as indicated by the projections.
Referring now to drawings Figs. 1 and 2 these draw-ings illustrate in general perspective view apparatus in accordance with the invention which is employed to carry out the process of the invention.
~2Z~
In Fig. 1, which exemplifies a solid-to-solid process the number 10 indicates a power supply and 11 an oscillator.
One side of the oscillator output is connected to an electrode 13 through a holder 12. Holder 12 is provided with a rotating chuck and has a trigger switch which controls the speed of rotation of the electrode 13. The speed of rotation is variable from 5,000 to 10,000 rpm.
The electrode 13 is composed of the material to be fused wlth the matrix. The matrix or substrate which is to be subjected to the process and which is to be treated is indicat-ed at 14. The matrix is also connected to the other side of the oscillator output by a clamp 15 and line 16.
By these connections the electrode is positively charged and the matrix is negatively charged when the signal is applied.
In Fig. 2 the corresponding components are corre-spondingly numbered. However, in this embodiment the process employed may be characterized as a liquid to solid process. In this apparatus the material to be fused is in the form of a solution and is held in a reservoir 17. Reservoir 17 is con-nected by a tube 18 to an electrode 19. Electrode 19 is a plate provided with an insulated handle 20 through which one side of oscillator 11 output is connected. This output is led into a main channel 21 in electrode 19. Channel 21 has a ser-ies of side channels 22 which open on to the undersurface ofelectrode 19. The flow from reservoir 17 is by gravity or by a pump and may be controlled by a valve such as 23 on the handle 20. For further control, more even distribution of the solution and to prevent the inclusion of foreign matter the surface of electrode 19 is preferably covered by a permeable membrane such as cotton or nylon.
It has been found that to effect fusion that the application of 50,000 watts/sq.cm. or alternatively the appli-cation of current of the order of 10,000 amps/sq.cm. is neces-sary.
From a practical standpolnt 10,000 amps/sq.cm. can not be applied constantly without damage to the matrix to be treated.
However, it has been found practical to apply a puls-ing signal of 2.5 microseconds to 28.6 nanoseconds having a magnitude of 3 amps to the electrode and this causes fusion to occur over an area of approximately 0,3 sq.mm.
To effect fusion over an area with the apparatus shown in Fig. 1 the electrode 13, matrix 14 and the oscillator output are connected as shown.
The operator passes the rotating electrode 13 in con-tact with the upper surface of the matrix over the matrix sur-face at a predetermined speed to apply the electrode materialto the matrix and fuse it therewith.
It has also been found that the continuous applica-tion of an alternating signal generates considerable heat in the substrate or matrix and to overcome this heat build-up and avoid weldments the signal generated in the present apparatus is a half-wave signal which permits dissipation of the heat.
As will be apparent to those skilled in the art each material, both the matrix and the material to be applied have ~2;~6~
speciEic resistance characteristics. Thus with each change in either one or both of these materials there is a change in the resistivity of the circuit.
In Fig. 3, R1 = the resistance of the electrode, R2 = the resistance of the ~atrix, and R3 = the resistance of the circuit of 10 and 11.
Variations in Rl and R2 will lead to variations in the frequency of the signal generated and the amplitude of that signal.
As mentioned previously a signal having an amplitudeof 3 amps is believed to be the preferred amplitude. If the amplitude i5 greater decarbonizing or burning of the matrix takes place and below this amplitude hydroxides are formed in the interface.
Fig. 4 is a schematic diagram of an oscillator cir-cuit used in apparatus in accordance with the present inven-tion.
In that circuit a power supply 30 is connected across the input, and across the input a capacitor 31 is connected, One side of the capacitor 31 is connected through the LC cir-cuit 32 which comprises a variable inductance coil 33 and capacitor 34 connected in parallel.
LC circuit 32 is connected to one side of a crystal oscillator circuit comprising crystal 35, inductance 36, NPN
transistor 37 and the RC circuit comprised of variable resis-tance 3~ and capacitance 39.
This oscillator circuit is connected to output 50 through, on one side capacitor 40, and on the other side diode 41, to produce a halfway signal across output 50.
In the apparatus actually used the several components had the following characteristics:
31 = 1.2 /~farad 32 = 0.3 picofarad 33 = 0-25 millihenrys 35 = 400 - 30 Khz 36 = 20 millihenrys 37 = NPN
38 = 3.5 /~farads 39 = 0 - 500 ohms 40 = 400 ~ farads 41 = diode To maintain the amplitude of the signal at 3 amps Rl resistance 38 is varied; to vary the frequency inductance 33 is varied.
If C = the capacitance of the circuit of Fig. 3 and Rl, R2 and R3 are the resistances previously characterized it is believed that the optimum frequency of the fusing signal Fo may be determined by the formula Fo = 1 FORMULA 1 2fi~
where L = Rl.R2.R3 and C = capacitance of the circuit L and C may be determined by any well-known method.
Fo depends on the material being treated and the material being applied but it is in the range 400Hz - 35MHz.
~2;~6C!
The Erequency, it is believed, will determine the speed of the process.
To fuse a predetermined area, the area ls measured.
Since each discharge will fuse approximately 0.3 sq.mm. then the travel speed may be determined by the following formula:
Travel speed = Fl x ~3 x 60 /mm/minute ~ - FORMULA 2 Fl - Fn~ and A = area to be covered in sq. mm.
Fl is the number of discharges per second.
As mentioned previously the resistances R and R may be measured by any known means.
However it has been discovered that the measurement of resistance in the liquid phase may not he stable. In thi.s situation the resistance is measured in a standard fashion.
Two electroaes, 1 cm. apart and 1 cm. sq. in area are placed in a bath of the liquid phase and the resistance was measured after a 20 second delay. ~fter the variable parameters have been determined and the apparatus, matrix and probe have been connected as shown in Figs. 1 and 3, the probe 13 is passed over the surEace of the matrix in contact therewith at the pre-determined speed.
The speed of rotation is also believed to aEEect -the quality of -the fusion. With a rotation speed of 5,000 rpm the finish is an uneven 200 to 300 micro finish. With a speed of rotation of 10,000 rpm the finish is a substantially 15 micro finish.
4 ~
,~. .~.
~22~6~
The apparatus of Fig. 2 is operated in the same man-ner as the apparatus of Fig. l and the process is essentially the same except for the use of a liquid with a solid electrode.
In the following specific examples the use of the solutions in association with the apparatus and in the process will be more clearly understood.
In each of these examples the electrode was so con-nected as will be apparent from the description, so that when charged the electrode is positively charged and the matrix is negatively charged.
With respect to the fusion of a second conductive chemical element into the solid matrix of a first conductive chemical element, using a solution of the second conductive chemical, with respect to each solution, the process was car-ried out at the ambient temperature, 20C, in the followingmanner.
The matrix 14 metal was connected into the circuit as previously described. The frequency was determined in accord-ance with the formula previously set forth and the solution in reservoir 17 applied by movement of the electrode over one sur-face of the first metal for varying periods of time as deter-mined by Form II. To ensure uniform distribution of the second metal solution over the surface of the first metal the elec-trode was covered with cotton gauze or nylon. It will be ap-parent that other materials may be employed. This arrangementalso served to limit contamination of the solution when graph-ite electrodes were employed. They had a tendency to release graphite particles in the course of movement~
The treated samples were -then sawn to provide a cross-sectional sample, washed in cold water, subjec-ted to ultrasonic cleaning, embedded in plastic and ground and pol-ished to produce a flat surface and an even edge. With samples of softer metals, since there may be a tendency to lose -the edge of the metal when grinding, two cross-sections were se-cured with the treated surfaces in face to face contiguous relationship. These samples were embedded as noted above, ground and polished.
Following embeddment the sample was etched using Nital* for steel, the ferrous substrate, and Ammonium Hydrogen Reroxide on the copper, the non-ferrous substra-te.
During the course o:E some applications it was found that adjustments were sometimes required in either the fre-quency, or speed of application. These were due to changes inthe solution composition or variations in the matrix.
A semiquantitative electron probe microanalysis of fused interfaces were performed using an Energy Dispersive X-Ray Spectroscopy (EDX) and a Scanning Electron Microscope (SEM).
The surface of the embedding plastic was rendered conductive by evaporating on it approxima-tely 20 um layer of carbon in a vacuum evaporator. This procedure was used to pre-vent buildup of electrical charges on an otherwise nonconduc-tive material and a consequent instability of the SEM image.Carbon, which does not produce a radiation de-tectable by the EDX, was used in preference to a more conventional metallic * A trade mark ' ~ ', 6C~
coating to avoid interEerence of such a coating with the ele-mental analysis.
Operating conditions of the SEM were chosen to mini-mize extraneous signals, fluorescent secondary emission and to yield at the same time the best possible spatial resolution.
The conditions typically used for the elemental ana-lyses by EDX were as follows-Accelerating potential 10-20 kV
Final Aperture 200-300 Spot size 50 nm Beam current 100-300 pA
Working distance 12-34 mm Magnification factor 5,000-10,000 Specimen angle normal to the beam Take-off angle 225 Count rate 800-2000 cps Live time 60-180 sec.
Energy calibration was tested using Al kd emission a-t 1.486 keV and cu K at 8.040 keV.
A standardless semiquantitative analyses was adopted for determination of elemental concen-tration, using certified reference materials (NBS 478, 78% Cu - 27% Zn and NBS 479a, Ni, 11~, Cr 18%, Fe) to verify results. Multiple analyses of ref-erence materials were in excellent agreernent with cer-tified values from NBS. Average precision of ~ 1% was achieved.
The diameter of analysed volume was calculated for typical elements analysed taking into consideration the mass range (the X-ray production volume) of the elemen-t.
~ 18 -~22C~60 For assessment of the diffusion depth a static beam was positioned across the interface at intervals greater than the above mentioned mass range thereby ensuring the accuracy of the analyses.
The results of elemental concentration were given in weight percentage (Wt%) for each of the measured points across the fusion interface.
As mentioned previously the metal solutions disclosed in Serial No. 319,~72 are new and constitute the basis for the present invention. Broadly described, these solutions are aqueous, have a pH of about 0.4-14, a resistivity of 10 to 80 ohms cm and contain:
(1) a compound of a dissociable polyvalent metal to be fused to the other metal;
(2) a compound which is capable of complexing with compound (1), compounds (1) and (2) being either soluble in water or forming a complex which is soluble in water;
(3) a stabilizer which functions to keep (1) and (2) and the complex thereof in solution; and (4) a catalyzer which functions to promote the speed of reaction and reduce the valency of the polyvalent metal to a lower valence and to catalyze the complexing action between (1) and (2). Acid and/or alkaline material may also be used to insure the appropriate pH for the conditions of use and to help keep the metal compounds (1) and (2) in solution.
Certain of these solutions may include a sufficient quantity of an organic solvent to ensure dissolution of the metal and/or the complex.
~22~3L~(33 Certain other solutions may require conductivity en-hancing agents. And depending upon the end result desired, brightening agents may also be present Wetting agents or sur-factants may also be provided.
A variety of dissociable polyvalent metal compounds, usually metallic salts or acids, may be used as component (1) provided they are soluble in the solution medium. Typical com-pounds include: sodium molybdate, sodium tungstate, indium sulphate, nickelous sulphate, nickelous chloride, chloroauric acid, chromium trioxide, chromium sulphate, chromic chloride, cadmium chloride, cadmium sulphate, stannous chloride, cobalt-ous sulphate, silver cyanide, silver nitrate.
Nor~nally component (1) will be used in an amount varying from 0.10 to 10% by weight based on the total weight of the solution. However, it will be appreciated that other amounts may be used, the particular amount used in any given situation depending on other conditions of use.
Representative metal complexing agents useful as com-ponent (2) include, such as, pyrophosphates, ethylene diamine tetracetic acid, citric acid, and potassium iodide and the like. The pyrophosphates also serve as stabilizing agents.
This component will usually consist of from 3 to 10%
of the weight of solution. However, the amount can be varied and should be selected to give optimum complexing with (1).
A wide variety of stabiliæers and catalysts may be used as components (3) and (4), respectively. Typical stabil-izers are the following: boric acid, citric acid or citrates, pyrophosphates, acetates and aluminum sulphate; while suitable catalysts include: metallic ions such as iron, nickel, anti-mony, and zinc, and organic compounds such as dextrine, hydro-quinone, gelatin, pepsin and acacia gum.
The amounts of these two components can be varied but usually each will fall in the range of 0.01 to 0.5~ by weight of the solution.
A wide variety of materials may be used to provide for the desired pH. Typical acids, and bases include the fol-lowing:
Acids: sulphuric, hydrochloric, hydrofluoric, orthophosphoric, citric and oxalic.
Bases: ammonium hydroxide, sodium hydroxide, potassium hydrox-ide and basic salts such as alkali carbonates and bicarbonates.
Typical brighteners are formaldehyde and carbon di-sulphide. A surEactant or wetting agent which is employed in some solutions is sodium lauryl sulphate. Others familiar to those in the art may be substituted.
In some solutions a conductivity enhancing agent such as sodium sulphate may be employed.
It will be noted that in Examples Il, III and IV
which follow, ferrous and ferric ions are provided in the solu-tion. While the iron was apparently transferred concurrently with molybdenum to the matrix there was no apparent material effect on the matrix or molybdenum which was fused with i-t.
It has been found that the transfer of molybdenum into the matrix was enhanced by the presence of the ferric and ferrous ions. The exact nature of the mechanism is not known but it is believed that the presence of these iron ions forms i ~
~2~1 6~
complexes which enhances the reduction of Mo~6 to lower valency states.
Certain further solutions require second chemical conductive element complexing agents which preclude precipita-tion of the second element. These agents were by way of ex-ample citric acid, or sodium pyrophospate, or ethylenediamine-tetracetic acid or their equivalents.
A suitable buffer is also provided in certain solu-tions, where required.
The water is always demineralized.
And for certain applications where the appearance of the product requires an elegant appearance small quantities of brighteners such as formaldehyde, carbon disulphide, benzene sulphonic acid or their equivalents may be employed. In these Examples, unless otherwise indicated the steel matrix was ASA 1018 and the copper was ASTM B-1333 Alloy 110.
~2~60 E X A M P L E
.
Atlas** A151 1020 steel was connected in the appa-ratus of Fig. 2 as the matrix 14 and a 10% solution of ammonium molybdate in water was placed in reservoir 17.
The following were the characteristics and conditions of treatment:
Matrix Resistance .0018 ohms Probe Resistance* 150 kiloohms Circuit Resistance .01 ohms Frequency 650 H~ at 0O4 picrofarad Contact Area 2 sq. cm.
Speed 60 cm./minute Depth of Treatment 0.5~m Surface Buildup 15 ~m *Determined by measurement across 1 sq. cm. plates spaced apart lcm. after a 20 second delay.
The sample of Example I was subject to a thermal cor-rosion test. 25% sulphuric acid was applied to the surface for 20 minutes at 325C without any surface penetration.
** A Trade Mark EXAMPLE II
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Sodium Molybdate 37.8 Ferrous Ammonium Sulphate 7 Ferric Ammonium Sulphate 8.6 Citric Acid 66.0 Water (distilled) 997 ml.
10 Sodium Lauryl Sulphate 0.5 Ammonium Hydroxide to required pH
Acacia (gum arabic) 0.1 - 0.2 E'ormaldehyde 7.5 ml.
The solution had the following characteristics:
15 pH = 7.5 Resistivity = 19 ohms cm Mo+6 concentration = 1.8% by wt.
Fe+2 = 0.10% by wt.
Fe+3 = 0.10% by wt.
The Mo+6 concentration may be varied from 1.5% to 2.5% by weight; the pH from 7.2 to 8.2 and the resistivity from 17 - 25 ohms cm.
REACTION CONDITIONS
Matrix : Copper 25 Electrode : Graphite Electrode Cover : Woven cotton Frequency : 9.09 KHz Rate of Application : 736.2 mm/minute Time of Application : 2 minutes ~2~
In the solutions set out in Examples II and III the presence of the ferrous and ferric ions are believed to serve to reduce the Mo+6 valency state to a lower valency state.
While iron is apparently concurrently transferred as illustrated in Fig. 6 the iron has apparently no material ef-fect on the characteristics of the matrix or the molybdenum.
An examination of the sample with an optical micro-scope shows a continuous coating of molybdenum free from pit-ting and with a dark silver colour.
As shown in the table below and Fig. 6 an SEM/EPMA
scan across the interface between the matrix and the applied metal, molybdenum is seen to be fused -to a depth of at least 4 um with a surface deposit of approximately 1 ~m.
TABLE
15 DEPTH um ELEMENT CONCENTRATION (WT%) 0.5 Mo 65.4 Fe 19.9 Cu 14.5 1.0 Mo 58.4 Fe 10~9 Cu 30.5 2.0 Mo 6.6 Fe 0.8 Cu 92.5 3.0 Mo 2.9 Fe 0.4 Cu 96.6 4.0 Mo 0.9 Fe 0.0 Cu 98.9 6~
EXAMPLE III
An aqueous solution of the same formulation as Example II was prepared and applied under the following conditions:
REACTION CONDITIONS
Matrix = Steel (ASA 1018) Electrode = Graphite Electrode Cover = Woven cotton Frequency = 4.11 KHz Rate of Application = 739.8 mm/minute Time of Application = 3 minutes Examination under the optical microscope showed a con-tinuous dark silver surface.
The photomicrograph Fig. 7, shows the deposition of a substantially uniEorm layer of molybdenum 1 micron thick of uniform density.
As shown in Fig. 8 an SEM/EPMA scan across the inter-fac0 between the substrate and the applied metal shows molyb-denum was present to a depth of at least 10 microns and a molybdenum gradient as set out below in Table.
TABLE
DEPTH um ELEMENT CONCENTRATION (WT~) 0.5 Mo 81.0 Fe 19.0 2 Mo 2.2 Fe 97.8 3 Mo 0.8 Fe 99.2 Mo 0.6 Fe 99 4 ~2;~3L6~
EXAMPLE III
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Sodium Tungstate 31.40 Ferric Ammonium Sulphate 8.63 Ferrous Sulphate 4.98 Citric Acid 66.00 Water (distilled) 1000 ml 10 Ammonium Hydroxide to required pH
Sodium Lauryl Sulphate 0.1 Formaldehyde 5 ml The solution had the following characteristics:
pH = 7.99 Resistivity = 22 ohms cm W+6 = 1 D 75% by wt.
Fe~2 = 0.1% by wt.
Fe+3 = 0.1% by wt.
The w+6 concentration may vary from 1.6% to 2.5%; the pH may vary from 7.5 to 8.5; and the resistivity may vary from 18 ohms cm to 24 ohms cm.
Reaction Conditions . .
Matrix = Copper Electrode = Graphite Cover = Cotton gauze Frequency = 3.83 KHz Rate of Application = 689.4 mm/minute Time of Application = 3 minutes :~22~
As shown by the photomicrographs Figs. 9 and 10, the sample showed a uniform deposit of tungsten approximately l micron thick. An SEM/EPMA scan showed fusion of tungsten on copper to a depth of at least 5.0 microns, as can be seen in the Table below and Fig. 11.
TABLE
DEPTH um CONCENTRATION (WT~) W Fe Cu 1.0 37.3 38.5 24.2 2.0 4.8 2.1 93.1 3.0 0.5 0.3 9902 4.0 0.7 0.2 99.1
5.0 0.3 0.2 99.5 :~2~L6~
EXAMPLE V
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Sodium Tungstate 34.00 Ferrous Sulphatel 4.98 Ferrous Ammonium Sulphate2 7.02 Ferric Ammonlum Sulphate 8.62 Citric Acid 66.00 10 Water (Distilled) 980 Ammonium Hydroxide to required pH
Sodium Lauryl Sulphate 0.10 NOTE: Either 1 or 2 may be employed The solution had the following characteristics:
pH = 8 Resistivity = 20.9 ohms cm.
w+6 = 1.9% by wt.
Fe+2 = 0.1% by wt.
Fe+3 = 0.1~ by wt.
The concentration of tungsten may be varied from 1.6% to 2.5%
by wt.; the pH from 7.5 to 8.5; and the conductivity from 18.8 ohms cm to 22.8 ohms cm.
Reaction Conditions Matrix = Steel (ASA 1018) 25 Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 4.78 Rate of Application = 860.4 mm/minute Time of Application = 3 minutes An inspection of the sample by SEM/EPMA, Fig. 12, showed a deposit of tungsten of approximately 0.5 um and as evident from Fig. 13 and the Table below tungsten was detected at a depth of at least 3 um.
TABLE
DEPTH um ELEMENT CONCENTRATION (WT%) _. .
0.5 W 52 3 W 1.1 ~2~6~
EXAMPLE VI
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Indium Sulphate 40.0 Aluminium Sulphate 9.6 Sodium Sulphate 3.5 Gelatin 0.05 - 0.1 Sodium Lauryl Sulphate 0.1 - 0.2 10 Water (distilled) 1000 ml.
The solution had the following characteristics:
pH = 1.60 Resistivity = 51.8 ohms cm.
Concentration In+3 = 1.75% by wt, Concentration Al+3 = 0.077 by wt.
The Indium concentration may vary from 0.2% to 2.2%;
the pH from 1.60 to 1.68; and the resistivity from 48.8 ohms cm to 54.8 ohms cm.
Reaction Conditions 20 Matrix = Copper Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 4.75 Rate of Application = 855 mm/minute Time of Applicaton = 3 minutes An examination of the sample under the optical micro-scope and the scanning electron microscope showed a continuous surface free from structural faults as shown in Fig. 14.
~Z;2~)161:) As shown in the following Table and Fi~. 15 and anSEM/EPMA scan across the interface between the copper matrix and the indium layer showed a deposit of approximately l um and fusion of indium to a depth of at least 4 um.
TABLE
DEPTH um ELEMENTCONCENTRATION INDIUM (WT%) .. . . _ ..
l In 90.3 2 In 5.5 3 In 4.3 4 In 3.6 ~;~2t~
EXAMPLE VII
The solution of Example VI was employed and applied to a steel matrix:
Reaction Conditions Matrix = Steel (ASA 1010) Electrode = Platinum Electrode Cover = Woven nylon Frequency = 6.29 KHz Rate of Application = 1132.2 mm/minute Time of Application = 3 minutes As shown in Figs. 16 and 17 an even continuous layer of Indium approximately 1 um thick was deposited on the surface of the matrix. An SEM/EPMA scan, Fig. 16 across the interface and the Table below indicated fusion to a depth of at least 3 um:
TABLE
DEPTH um In (Wt%) Fe (Wt%) _ 0.5 91.4 8.6 1.0 5.2 94.8 2.0 1.0 99.0 3.0 0.9 99.1 Fig. 18 shows a solid deposit of nickel of uniform density approximately 1.5 um thick. As shown in the following Table and Fig. 19 an SEM/EPMA scan across the interface between ~.~2~
the matrix and the nickel layer sho~s nickel to be fused to a depth of at least 4 um.
DEPTH_um ELEMENT WT~
1 Ni 92.6 2 Ni 4.5 3 Ni 3.3 4 Ni 1.0 ~z~
EXAMPLE VIII
An aqueous solution of the following f~rmulation was prepared:
NAME GRAM/LITRE
Nickelous Sulphate 248.9 Nickelous Chloride 37.3 Boric Acid 2~.9 Formaldehyde 3 ml/litre Benzene Sulphonic Acid 10 ml/litre 10 Sodium Lauryl Sulphate 0.1 Water (distilled) 900 The solution had the following characteristics:
ph = 3.10 Resistivity = 22.5 ohms cm.
Concentration of Ni+2 = 6% by wt.
The nickel concentration may vary from 2~ to 10~; pH
from 3.10 to 3.50; and resistivity from 17 ohms cm to 26 ohms cm.
Reaction Conditions . _ 20 Matrix = Copper Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 7.50 KHz Rate of Application = 1350 mm/minute Time of Application = 3 minutes ~2~
EXAMPLE IX
The same so~ution as was formulated for Example X was prepared and applied to a steel matrix:
Reaction Conditions Matrix = Steel ASA (1018) Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 7.50 KHz Rate of Application = 1350 mm/minute Time of Application = 3 min.
As shown in Fig. 20 the nickel layer is continuous and substantially uniform in thickness being about 1.5 um thick.
As shown in Fig. 21 and in the following Table nickel is shown to be fused to a depth of at least 3 um.
DEP_H um ELEMENT CONCENTRATION (Wt~) 1 Ni 95.9 2 Ni 28.0 3 Ni 0.7 ~2~
EXAMPLE X
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
_ Chloroauric acid 2.5 Potassium ferrocyanide 15.0 Potassium carbonate 15.0 Water (distilled) 1000 ml This solution had the following characteristics:
pH = 10.99 Resistivity = 40 ohms cm.
Concentration of = .14% by wt.
The pH may be varied from 3.70 to ll; the concentra-tion of Au+3 ions may vary from 0.1% to 0.5% by weight; and the resistivity from 40 ohms cm to 72 ohms cm.
REACTION CONDITIONS
MATRIX = Copper ELECT~ODE = Platinum ELECTRODE COVER = Cotton gauze FREQUENCY = 4.33 KHz RATE OF APPLICATION = 779.4 mm/minute TIME OF APPLICATION = 2 minutes observation with the optical and scanning electron microscope revealed a surface deposition of gold approximately 1.5 um thicko The deposit was continuous and uniformly dense as shown in Fig. 22.
An SEM/EPMA scan across the interface indicated fus-ion of gold to a depth of at least 3 um as shown on the Table below and Fig. 23.
DEPTH (um) ELEMENTCONCENTRATION (Wt%) 0.5 Au 61.3 1.0 Au 9.6 2.0 Au 0.9 3.0 Au 0.5 ~2~6~
EXAMPLE XI
An aqueous solution of the same formulation as that of Example X was prepared:
REACTION CONDITIONS
.
MATRIX = Steel ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 3.95 KHz RATE OF APPLICATION = 711.0 mm/minute TIME OF APPLICATION = 2.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of gold approximately 1.0 um thick. The deposit was uniformly thick and dense as shown in Fig. 24.
An SEM/EPMA scan across the interface indicated fus-ion of gold to a depth of at least ~.0 um as shown on the table below and Fig. 25.
DEPT~ um ELEMENTCONCENTRATION (Wt~) 0.5 Au 84.9 1.5 Au 10.6 2.0 Au 2.1 3.0 Au 0.8 4.0 Au 0.6 - 3~ -~2~
EXAMPLE XII
An aqueous solu-tion of the following formulation was prepared:
NAME GRAMS/LITRE
Chromium Trioxide 150 Chromium Sulphate 0.06 Sulphuric Acid 2.15 Sodium Silico Fluoride 0.2 Carbon Disulfide 2 - 3 ml Sodium Lauryl Sulphate 0.05 10 Water (distilled) to 1000 ml This solution had the following characteristics:
pH = 0.6 Resistivity = 12 ohms cm Concentration of Cr+6 = 7.~% by wt.
The pH may be varied from 0.6 to 1.0; the concentra-tion of Cr+6 ions may vary from 3% to 20% by weight; and the resistivity from 11 ohms cm to 14 ohms cm.
REACTION CONDITIONS
MATRIX = Copper 20 ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.25 KHz RATE OF APPLICATION = 1125 mm/minute TIME OF APPLICATION = 5.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-mately 1 um thick. The surface of the layer was irregular but the deposit appeared free of faults and was continuous as shown in Fig. 26.
~7~2~
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 3.0 um as shown on the table below and Fig. 27.
DEPTH um ELEMENTCONCENTRATION (Wt%) 0.5 Cr 94.0 1.0 Cr 32.0 2.0 Cr 1.8 3.0 Cr 1.0
EXAMPLE V
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Sodium Tungstate 34.00 Ferrous Sulphatel 4.98 Ferrous Ammonium Sulphate2 7.02 Ferric Ammonlum Sulphate 8.62 Citric Acid 66.00 10 Water (Distilled) 980 Ammonium Hydroxide to required pH
Sodium Lauryl Sulphate 0.10 NOTE: Either 1 or 2 may be employed The solution had the following characteristics:
pH = 8 Resistivity = 20.9 ohms cm.
w+6 = 1.9% by wt.
Fe+2 = 0.1% by wt.
Fe+3 = 0.1~ by wt.
The concentration of tungsten may be varied from 1.6% to 2.5%
by wt.; the pH from 7.5 to 8.5; and the conductivity from 18.8 ohms cm to 22.8 ohms cm.
Reaction Conditions Matrix = Steel (ASA 1018) 25 Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 4.78 Rate of Application = 860.4 mm/minute Time of Application = 3 minutes An inspection of the sample by SEM/EPMA, Fig. 12, showed a deposit of tungsten of approximately 0.5 um and as evident from Fig. 13 and the Table below tungsten was detected at a depth of at least 3 um.
TABLE
DEPTH um ELEMENT CONCENTRATION (WT%) _. .
0.5 W 52 3 W 1.1 ~2~6~
EXAMPLE VI
An aqueous solution of the following formulation was prepared:
NAME GRAM/LITRE
Indium Sulphate 40.0 Aluminium Sulphate 9.6 Sodium Sulphate 3.5 Gelatin 0.05 - 0.1 Sodium Lauryl Sulphate 0.1 - 0.2 10 Water (distilled) 1000 ml.
The solution had the following characteristics:
pH = 1.60 Resistivity = 51.8 ohms cm.
Concentration In+3 = 1.75% by wt, Concentration Al+3 = 0.077 by wt.
The Indium concentration may vary from 0.2% to 2.2%;
the pH from 1.60 to 1.68; and the resistivity from 48.8 ohms cm to 54.8 ohms cm.
Reaction Conditions 20 Matrix = Copper Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 4.75 Rate of Application = 855 mm/minute Time of Applicaton = 3 minutes An examination of the sample under the optical micro-scope and the scanning electron microscope showed a continuous surface free from structural faults as shown in Fig. 14.
~Z;2~)161:) As shown in the following Table and Fi~. 15 and anSEM/EPMA scan across the interface between the copper matrix and the indium layer showed a deposit of approximately l um and fusion of indium to a depth of at least 4 um.
TABLE
DEPTH um ELEMENTCONCENTRATION INDIUM (WT%) .. . . _ ..
l In 90.3 2 In 5.5 3 In 4.3 4 In 3.6 ~;~2t~
EXAMPLE VII
The solution of Example VI was employed and applied to a steel matrix:
Reaction Conditions Matrix = Steel (ASA 1010) Electrode = Platinum Electrode Cover = Woven nylon Frequency = 6.29 KHz Rate of Application = 1132.2 mm/minute Time of Application = 3 minutes As shown in Figs. 16 and 17 an even continuous layer of Indium approximately 1 um thick was deposited on the surface of the matrix. An SEM/EPMA scan, Fig. 16 across the interface and the Table below indicated fusion to a depth of at least 3 um:
TABLE
DEPTH um In (Wt%) Fe (Wt%) _ 0.5 91.4 8.6 1.0 5.2 94.8 2.0 1.0 99.0 3.0 0.9 99.1 Fig. 18 shows a solid deposit of nickel of uniform density approximately 1.5 um thick. As shown in the following Table and Fig. 19 an SEM/EPMA scan across the interface between ~.~2~
the matrix and the nickel layer sho~s nickel to be fused to a depth of at least 4 um.
DEPTH_um ELEMENT WT~
1 Ni 92.6 2 Ni 4.5 3 Ni 3.3 4 Ni 1.0 ~z~
EXAMPLE VIII
An aqueous solution of the following f~rmulation was prepared:
NAME GRAM/LITRE
Nickelous Sulphate 248.9 Nickelous Chloride 37.3 Boric Acid 2~.9 Formaldehyde 3 ml/litre Benzene Sulphonic Acid 10 ml/litre 10 Sodium Lauryl Sulphate 0.1 Water (distilled) 900 The solution had the following characteristics:
ph = 3.10 Resistivity = 22.5 ohms cm.
Concentration of Ni+2 = 6% by wt.
The nickel concentration may vary from 2~ to 10~; pH
from 3.10 to 3.50; and resistivity from 17 ohms cm to 26 ohms cm.
Reaction Conditions . _ 20 Matrix = Copper Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 7.50 KHz Rate of Application = 1350 mm/minute Time of Application = 3 minutes ~2~
EXAMPLE IX
The same so~ution as was formulated for Example X was prepared and applied to a steel matrix:
Reaction Conditions Matrix = Steel ASA (1018) Electrode = Graphite Electrode Cover = Cotton gauze Frequency = 7.50 KHz Rate of Application = 1350 mm/minute Time of Application = 3 min.
As shown in Fig. 20 the nickel layer is continuous and substantially uniform in thickness being about 1.5 um thick.
As shown in Fig. 21 and in the following Table nickel is shown to be fused to a depth of at least 3 um.
DEP_H um ELEMENT CONCENTRATION (Wt~) 1 Ni 95.9 2 Ni 28.0 3 Ni 0.7 ~2~
EXAMPLE X
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
_ Chloroauric acid 2.5 Potassium ferrocyanide 15.0 Potassium carbonate 15.0 Water (distilled) 1000 ml This solution had the following characteristics:
pH = 10.99 Resistivity = 40 ohms cm.
Concentration of = .14% by wt.
The pH may be varied from 3.70 to ll; the concentra-tion of Au+3 ions may vary from 0.1% to 0.5% by weight; and the resistivity from 40 ohms cm to 72 ohms cm.
REACTION CONDITIONS
MATRIX = Copper ELECT~ODE = Platinum ELECTRODE COVER = Cotton gauze FREQUENCY = 4.33 KHz RATE OF APPLICATION = 779.4 mm/minute TIME OF APPLICATION = 2 minutes observation with the optical and scanning electron microscope revealed a surface deposition of gold approximately 1.5 um thicko The deposit was continuous and uniformly dense as shown in Fig. 22.
An SEM/EPMA scan across the interface indicated fus-ion of gold to a depth of at least 3 um as shown on the Table below and Fig. 23.
DEPTH (um) ELEMENTCONCENTRATION (Wt%) 0.5 Au 61.3 1.0 Au 9.6 2.0 Au 0.9 3.0 Au 0.5 ~2~6~
EXAMPLE XI
An aqueous solution of the same formulation as that of Example X was prepared:
REACTION CONDITIONS
.
MATRIX = Steel ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 3.95 KHz RATE OF APPLICATION = 711.0 mm/minute TIME OF APPLICATION = 2.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of gold approximately 1.0 um thick. The deposit was uniformly thick and dense as shown in Fig. 24.
An SEM/EPMA scan across the interface indicated fus-ion of gold to a depth of at least ~.0 um as shown on the table below and Fig. 25.
DEPT~ um ELEMENTCONCENTRATION (Wt~) 0.5 Au 84.9 1.5 Au 10.6 2.0 Au 2.1 3.0 Au 0.8 4.0 Au 0.6 - 3~ -~2~
EXAMPLE XII
An aqueous solu-tion of the following formulation was prepared:
NAME GRAMS/LITRE
Chromium Trioxide 150 Chromium Sulphate 0.06 Sulphuric Acid 2.15 Sodium Silico Fluoride 0.2 Carbon Disulfide 2 - 3 ml Sodium Lauryl Sulphate 0.05 10 Water (distilled) to 1000 ml This solution had the following characteristics:
pH = 0.6 Resistivity = 12 ohms cm Concentration of Cr+6 = 7.~% by wt.
The pH may be varied from 0.6 to 1.0; the concentra-tion of Cr+6 ions may vary from 3% to 20% by weight; and the resistivity from 11 ohms cm to 14 ohms cm.
REACTION CONDITIONS
MATRIX = Copper 20 ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.25 KHz RATE OF APPLICATION = 1125 mm/minute TIME OF APPLICATION = 5.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-mately 1 um thick. The surface of the layer was irregular but the deposit appeared free of faults and was continuous as shown in Fig. 26.
~7~2~
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 3.0 um as shown on the table below and Fig. 27.
DEPTH um ELEMENTCONCENTRATION (Wt%) 0.5 Cr 94.0 1.0 Cr 32.0 2.0 Cr 1.8 3.0 Cr 1.0
6~
EX.AMPLE XIII
An aqueous solution of the same formulation as em-ployed in Example XII was prepared:
REACTION CONDITION_ MATRIX = Steel (ASA 1018) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.48 KHz RATE OF APPLICATION = 1166.4 mm/minute TIME OF APPLICATION = 5.0 minutes Observation with the optical and scanning electrode microscope revealed a surface deposition of chromium approxi-mately 3.0 um thick. This is as shown in Fig. 28.
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 5.0 um as shown on thetable below and Fig. 29.
DEPTH um ELEMENT WT~
1.0 Cr 100 2.0 Cr 97.2 3.0 Cr 20.8 4.0 Cr 2.8 5.0 Cr 2.1 EXAMPLE XIV
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Chromic Chloride 213 Sodium Chloride 36 Ammonium Chloride 26 Boric Acid 20 Dimethyl Formamide 400 ml 10 Sodium Acetate 3.0 Sodium Lauryl Sulphate 0.5 Water (distilled) to 1000 ml.
This solution had the following characteristics:
pH = 3.0 Resistivity = 17.4 ohms cm.
Concentration of Cr+3 = 2.5 to 3~5 The pH may be varied from 2.5 to 3.5; the concentra-tion of Cr+3 ions may vary from 1.8% to 5~ by weight; and the resistivity from 16 ohms cm to 20 ohms cm.
MATRIX = Copper ELECTRODE = Graphi-te ELECTRODE COVER = Cotton gauze FREQUENCY = 6.85 KHz RATE OF APPLICATION = 1251 mm/minute TIME OF APPLICATION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-6~
mately 0.5 um thick. The deposit was solid and continuous asshown in Figs. 30 and 30A.
An SEM/EPMA scan across the interface indicated fusion of chromium to a depth of at least 3.0 um as shown on the Table below and Fig. 31.
DEPTH um ELEMENTCONCENTRATION (Wt~) 1 Cr 21.2 2 Cr 4.0 3 Cr o.g ~L~2~0 EXAMPLE XV
An aqueous solution of the same formulation as pre-pared for Example XVII was employed:
REACTION CONDITIONS
MATRIX = Steel (ASA 1018) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.85 KHz RATE OF APPLICATION = 1251 mm/minute TIME OF APPLICATION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-mately 1.0 um thick. The surface of the deposit appeared slightly irregular but the deposit was solid and free of faults as shown in Figs. 32 and 32A.
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 3.0 um as shown on the table below and Fig. 33.
DEPTH um ELEMENT CONCENTRATION (Wt~) 0.5 Cr 97.2 1.0 Cr 97.6 1.5 Cr 22.2 2.0 Cr 1.5 3.0 Cr 0.8 EXAMPLE XVI
An aqueous solution oE the following formulation was prepared:
NAME GRAMS/LITRE
Cadmium Chloride 6.74 Tetrasodium Pyrophosphate 54 Water (distilled) 1000 ml.
This solution had the following characteristics:
pH = 10 Resistivity = 33 ohms cm.
Concentration of Cd+2 = 0.32~ by wt.
The pH may be varied from 10 to 10.2; the concentra-tion of Cd+2 ions may vary from 0.2~ to 0.5~ by weight; and the resistivity from 28 ohms cm to 35 ohms cm.
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = (1) 7.29 KHz; (2) 7.91 KHz RATE OF APPLICATION = (1) 1312.2 mm/min; (2) 1423.8 mm/min.
TIME OF APPLICATION = (1) 1.0 min; (2) 3.0 min.
In this Example the solution employed was initially as set out above, applied in accordance with the conditions identified as (1). A second solution, that set forth in Ex-ample XVII, was then applied under the conditions identiEied as (2).
Observation with the optical and scanning electron microscope revealed a surface deposition of cadmium approxi-6~
mately 4 um thick. This deposit was not homogenous as shown in Fig. 34 but an SEM/EPMA scan across the interface indicated fusion of cadmium to a depth of at least 9 um as shown on the Table below and Fig. 35.
5DEPTH um ELEMENTCONCENTRATION (Wt~) . _ 2 Cd 77.4 3 Cd 65.2 4 Cd 6.7 Cd 1.2 6 Cd 0.48
EX.AMPLE XIII
An aqueous solution of the same formulation as em-ployed in Example XII was prepared:
REACTION CONDITION_ MATRIX = Steel (ASA 1018) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.48 KHz RATE OF APPLICATION = 1166.4 mm/minute TIME OF APPLICATION = 5.0 minutes Observation with the optical and scanning electrode microscope revealed a surface deposition of chromium approxi-mately 3.0 um thick. This is as shown in Fig. 28.
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 5.0 um as shown on thetable below and Fig. 29.
DEPTH um ELEMENT WT~
1.0 Cr 100 2.0 Cr 97.2 3.0 Cr 20.8 4.0 Cr 2.8 5.0 Cr 2.1 EXAMPLE XIV
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Chromic Chloride 213 Sodium Chloride 36 Ammonium Chloride 26 Boric Acid 20 Dimethyl Formamide 400 ml 10 Sodium Acetate 3.0 Sodium Lauryl Sulphate 0.5 Water (distilled) to 1000 ml.
This solution had the following characteristics:
pH = 3.0 Resistivity = 17.4 ohms cm.
Concentration of Cr+3 = 2.5 to 3~5 The pH may be varied from 2.5 to 3.5; the concentra-tion of Cr+3 ions may vary from 1.8% to 5~ by weight; and the resistivity from 16 ohms cm to 20 ohms cm.
MATRIX = Copper ELECTRODE = Graphi-te ELECTRODE COVER = Cotton gauze FREQUENCY = 6.85 KHz RATE OF APPLICATION = 1251 mm/minute TIME OF APPLICATION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-6~
mately 0.5 um thick. The deposit was solid and continuous asshown in Figs. 30 and 30A.
An SEM/EPMA scan across the interface indicated fusion of chromium to a depth of at least 3.0 um as shown on the Table below and Fig. 31.
DEPTH um ELEMENTCONCENTRATION (Wt~) 1 Cr 21.2 2 Cr 4.0 3 Cr o.g ~L~2~0 EXAMPLE XV
An aqueous solution of the same formulation as pre-pared for Example XVII was employed:
REACTION CONDITIONS
MATRIX = Steel (ASA 1018) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 6.85 KHz RATE OF APPLICATION = 1251 mm/minute TIME OF APPLICATION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of chromium approxi-mately 1.0 um thick. The surface of the deposit appeared slightly irregular but the deposit was solid and free of faults as shown in Figs. 32 and 32A.
An SEM/EPMA scan across the interface indicated fus-ion of chromium to a depth of at least 3.0 um as shown on the table below and Fig. 33.
DEPTH um ELEMENT CONCENTRATION (Wt~) 0.5 Cr 97.2 1.0 Cr 97.6 1.5 Cr 22.2 2.0 Cr 1.5 3.0 Cr 0.8 EXAMPLE XVI
An aqueous solution oE the following formulation was prepared:
NAME GRAMS/LITRE
Cadmium Chloride 6.74 Tetrasodium Pyrophosphate 54 Water (distilled) 1000 ml.
This solution had the following characteristics:
pH = 10 Resistivity = 33 ohms cm.
Concentration of Cd+2 = 0.32~ by wt.
The pH may be varied from 10 to 10.2; the concentra-tion of Cd+2 ions may vary from 0.2~ to 0.5~ by weight; and the resistivity from 28 ohms cm to 35 ohms cm.
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = (1) 7.29 KHz; (2) 7.91 KHz RATE OF APPLICATION = (1) 1312.2 mm/min; (2) 1423.8 mm/min.
TIME OF APPLICATION = (1) 1.0 min; (2) 3.0 min.
In this Example the solution employed was initially as set out above, applied in accordance with the conditions identified as (1). A second solution, that set forth in Ex-ample XVII, was then applied under the conditions identiEied as (2).
Observation with the optical and scanning electron microscope revealed a surface deposition of cadmium approxi-6~
mately 4 um thick. This deposit was not homogenous as shown in Fig. 34 but an SEM/EPMA scan across the interface indicated fusion of cadmium to a depth of at least 9 um as shown on the Table below and Fig. 35.
5DEPTH um ELEMENTCONCENTRATION (Wt~) . _ 2 Cd 77.4 3 Cd 65.2 4 Cd 6.7 Cd 1.2 6 Cd 0.48
7 Cd 2.1
8 Cd 2.9
9 Cd 0.89 3L2;~
EXAMPLE XVII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Cadmium Sulphate 26.65 Sodium Chloride 8.7 Boric Acid 15.0 Aluminium Sulphate 17.5 Acacia (Gum Arabic) 0.25
EXAMPLE XVII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Cadmium Sulphate 26.65 Sodium Chloride 8.7 Boric Acid 15.0 Aluminium Sulphate 17.5 Acacia (Gum Arabic) 0.25
10 Sodium Tetraborate 5.0 Benzene Sulphonic Acid 2.5 Sodium Lauryl Sulphate 0.5 Water (distilled) 1000 ml This solution had the following characteristics:
pH = 3.40 Resistivity - 54 ohms cm.
Concentration of Cd+2 = 1.1%
The pH may be varied from 3.2 to 3.5; -the concentra-tion of Cd+2 ions may vary from 1% to 4% by weight; and the resistivity from 45 ohms cm to 55 ohms cm.
REACTION CONDITIONS
MATRIX = Steel ELECTRODE = Platinum ELECTRODE COVER = Nylon cloth 25 FREQUENCY = 13.7 KHz RATE OF APPLICATION = 2466 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of cadmium approxi-mately 1 um thick. The surfce of the deposit was irregular but it was solid and continuous as seen from Fig. 36.
An SEM/EPMA scan across the interface indicated fus-ion of cadmium to a depth of at least 4 um as shown on the Table below and Fig. 37.
DEPTH um ELEMENTCONCENTRATION (Wt~) 0.5 Cd 73.3 10 1.0 Cd 8.8 2.0 Cd 1.4 3.0 Cd 1.2 4.0 Cd 1.1 -~2;~6~
EXAMPLE XVIII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Stannous chloride 77.3 Sodium hydroxlde 66.0 Sodium acetate 14.7 Water (distilled) 1000 ml, This solutlon had the following characteristics:
pH = 12.4 Resistivity = 8.6 ohms cm.
Concentration of Sn~~2 ions = 4% by weight The pH may be varied from 11.2 to 12.7; the concen-tration of Sn+2 ions may vary from 2% to 5% by weight; and the resistivity from 6.2 ohms cm to 10.3 ohms cm.
REACTION CONDITIONS
. .
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze 20 FREQUENCY = 9.85 KHz RATE OF APPLICATION = 1773 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin approximately 1.2 um thick.
The deposit was uniformly thick and homogenous. This is shown in Fig. 38.
~22~6~
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth o:E at least 4 um as shown on the table below and Fig. 39.
DEPTH um ELEMENTCONCENTRATION (Wt%) 1 Sn 91.4 Sn 4.4 3 Sn 0.9 4 Sn 0.5 ~220~
EXAMPLE XIX
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Stannous chloride 9.4 Tetrasodium pyrophosphate 44.7 Dextrine 6.25 Water (distilled) 1000 ml Sodium lauryl sulphate 0.5 This solution had the following characteristics:
pH = 9.05 Resistivity = 34 ohms cm.
Concentration of Sn+2 = 0~50~ by weight The pH may be varied from 9 to 9.7; the concentration of Sn+2 ions may vary from 0.4% to 1~ by weight; and the resistivity from 30 ohms cm to 36 ohms cm.
REACTION CONDITIONS
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 9.85 KHz RATE OF APPLICATION = 1773 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin approximately 4 um thick.
This deposit appears to comprise a lower uniform and substantially homogenous layer of approximately 1 um thick and an outer slightly porous layer approximately 3 um thick asshown in Fig. 40.
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth of at least 5 um as shown on the Table below and Fig. 41.
DEPTH um ELEMENT CONCENTRATION (Wt%) 1 Sn 97 2 Sn 97.3 3 Sn 94.3 Sn 1.0 ~2~
EXAMPLE XX
. .
An aqueous solution oE the same as prepared for Ex-ample XIX was employed:
REACTION CONDITIONS
MATRIX = Steel (ASA 1010) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 10.61 KHz RATE OF APPLICATION = 1909.8 mm/minute TIME OF APPLICATION = 3 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin exceeding 2 um thick. This layer was porous but continuous as shown in Fig.
42.
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth of at least 2 um as shown on the table below and Fig~ 43.
DEPTH um ELEMENT WT%
0.5 Sn 96.2 1.0 Sn 81.4 2.0 Sn 2.5 6~
EXAMPLE XXI
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Cobaltous sulphate 252 Sodium fluoride 14 Boric acid 45 Dextrose 5 Sodium lauryl sulphate 0 r 2 10 Water (distilled) 1000 ml This solution had the following characteristics:
pH = 6.03 Resistivity = 28.5 ohms cm.
Concentration of Co-~2 = 5.3~ by wt.
The pH may be varied from 4.5 to 6.5; the concentra-tion of Co+2 ions may vary from 2% to 6~ by weight; and the resistivity from 25 ohms cm to 30 ohms cm.
REACTION CONDITIONS
.
MATRIX = Copper 20 ELECTRODE = Platinum ELECTRODE COVER = Nylon mesh FREQUENCY = 5.1 KHz RATE OF APPLICATION = 918 mm/minute TIME OF APPLICA~ION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of cobalt approximate-ly 6.5 um thick. This layer was uniEorm and continuous as shown in Fig. 44.
~;~2~6~3 An SEM/EPMA scan across the interface indicated Eus-ion oE cobalt to a depth of at least 20 um as shown on the Table below and Fig. 45.
DEPTH um ELEMENT CONCENTRATION (Wt~) Co 2.65 Co 1.6 Co 0.87 Co 0.44 It was evident by visual inspection and from the pre-vious experiments that the deposit of cobalt above the 10 um level was extremely dense.
:~22~
EXAMPLE XXII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Silver cyanide 26 Potassium cyanide 46 Potassium carbonate 37 Sodium lauryl sulphate Carbon disulphide 1-2 10 Water (distilled) 1000 ml.
This solution had the following characteristics:
pH = 11.55 Resistivity = 10.5 ohms cm.
Concentration of Ag+l = 2.09% by wt.
The pH may be varied from 11.2 to 11.7; the concen-tration of Ag+l ions may vary from 1~ to 3% by weight; and the resistivity from 8 ohms cm to 13 ohms cmO
REACTION CONDITIONS
MATRIX = Copper 20 ELECTRODE = Platinum ELECTRODE COVER = Nylon FREQUENCY = 7.7 KHz.
RATE OF APPLICATION = 1386 mm/minute TIME OF APPLICATION = 1.0 minute Observation with the optical and scanning electron microscope revealed a surface deposition of silver appro~imate-ly 5 um thick. The structure is shown in Figs. 46 and ~6A.
~2201 S [:) An SEM/EPMA scan across the interface indicated fus-ion of silver to a depth of at least 3 um as shown on the Table below and Fig. 47.
DEPTH um ELEMENTCONCENTRATION (Wt%) 1 Ag 98.7 2 Ag 91.4 3 Ag 46.3 4 Ag 2.4 Ag 1.0 gL~2~
EXAMPLE XXIII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Silver nitrate 29 Potassium iodide 398 Citric acid 6 Dextrose 5 Carbon disulfide 1.5 10 Ammonium hydroxide to pH
Water (distilled) 1000 ml.
This solution had the following characteristics:
pH - 5.6 Resistivity = 6.6 ohms cm.
Concentration of Ag+l = 1.84~
The pH may be varied from 1.5 to 2; the concentration Of Ag+l ions may vary from 0.5% to 2.5~ by weight; and the resistivity from 6 ohms cm to 12 ohms cm.
REACTION CONDITIONS
20 MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 9.5 KHz.
RATE OF APPLICATION = 1710 mm/minute TIME OF APPLICATION = 2.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of silver approximate-ly 2 um thick. The structure was as shown in Fig. 48.
An SEM/EPMA scan across the interface indicated fus-ion of silver to a depth of at least 2.00 um as shown on the Table below and Fig. 49.
DEPTH um ELEMENTCONCENTRATION (Wt~) 1 Ag 97.7 2 Ag 97.5 3 Ag 28.0 4 Ag 3.8 Ag 2.8 6 Ag 1.0 :3 ~2~
From the foregoing examples it will be seen that through the medium of these solutions a second metal in the solution may be fused with a first metal.
pH = 3.40 Resistivity - 54 ohms cm.
Concentration of Cd+2 = 1.1%
The pH may be varied from 3.2 to 3.5; -the concentra-tion of Cd+2 ions may vary from 1% to 4% by weight; and the resistivity from 45 ohms cm to 55 ohms cm.
REACTION CONDITIONS
MATRIX = Steel ELECTRODE = Platinum ELECTRODE COVER = Nylon cloth 25 FREQUENCY = 13.7 KHz RATE OF APPLICATION = 2466 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of cadmium approxi-mately 1 um thick. The surfce of the deposit was irregular but it was solid and continuous as seen from Fig. 36.
An SEM/EPMA scan across the interface indicated fus-ion of cadmium to a depth of at least 4 um as shown on the Table below and Fig. 37.
DEPTH um ELEMENTCONCENTRATION (Wt~) 0.5 Cd 73.3 10 1.0 Cd 8.8 2.0 Cd 1.4 3.0 Cd 1.2 4.0 Cd 1.1 -~2;~6~
EXAMPLE XVIII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Stannous chloride 77.3 Sodium hydroxlde 66.0 Sodium acetate 14.7 Water (distilled) 1000 ml, This solutlon had the following characteristics:
pH = 12.4 Resistivity = 8.6 ohms cm.
Concentration of Sn~~2 ions = 4% by weight The pH may be varied from 11.2 to 12.7; the concen-tration of Sn+2 ions may vary from 2% to 5% by weight; and the resistivity from 6.2 ohms cm to 10.3 ohms cm.
REACTION CONDITIONS
. .
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze 20 FREQUENCY = 9.85 KHz RATE OF APPLICATION = 1773 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin approximately 1.2 um thick.
The deposit was uniformly thick and homogenous. This is shown in Fig. 38.
~22~6~
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth o:E at least 4 um as shown on the table below and Fig. 39.
DEPTH um ELEMENTCONCENTRATION (Wt%) 1 Sn 91.4 Sn 4.4 3 Sn 0.9 4 Sn 0.5 ~220~
EXAMPLE XIX
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Stannous chloride 9.4 Tetrasodium pyrophosphate 44.7 Dextrine 6.25 Water (distilled) 1000 ml Sodium lauryl sulphate 0.5 This solution had the following characteristics:
pH = 9.05 Resistivity = 34 ohms cm.
Concentration of Sn+2 = 0~50~ by weight The pH may be varied from 9 to 9.7; the concentration of Sn+2 ions may vary from 0.4% to 1~ by weight; and the resistivity from 30 ohms cm to 36 ohms cm.
REACTION CONDITIONS
MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 9.85 KHz RATE OF APPLICATION = 1773 mm/minute TIME OF APPLICATION = 2 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin approximately 4 um thick.
This deposit appears to comprise a lower uniform and substantially homogenous layer of approximately 1 um thick and an outer slightly porous layer approximately 3 um thick asshown in Fig. 40.
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth of at least 5 um as shown on the Table below and Fig. 41.
DEPTH um ELEMENT CONCENTRATION (Wt%) 1 Sn 97 2 Sn 97.3 3 Sn 94.3 Sn 1.0 ~2~
EXAMPLE XX
. .
An aqueous solution oE the same as prepared for Ex-ample XIX was employed:
REACTION CONDITIONS
MATRIX = Steel (ASA 1010) ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 10.61 KHz RATE OF APPLICATION = 1909.8 mm/minute TIME OF APPLICATION = 3 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of tin exceeding 2 um thick. This layer was porous but continuous as shown in Fig.
42.
An SEM/EPMA scan across the interface indicated fus-ion of tin to a depth of at least 2 um as shown on the table below and Fig~ 43.
DEPTH um ELEMENT WT%
0.5 Sn 96.2 1.0 Sn 81.4 2.0 Sn 2.5 6~
EXAMPLE XXI
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Cobaltous sulphate 252 Sodium fluoride 14 Boric acid 45 Dextrose 5 Sodium lauryl sulphate 0 r 2 10 Water (distilled) 1000 ml This solution had the following characteristics:
pH = 6.03 Resistivity = 28.5 ohms cm.
Concentration of Co-~2 = 5.3~ by wt.
The pH may be varied from 4.5 to 6.5; the concentra-tion of Co+2 ions may vary from 2% to 6~ by weight; and the resistivity from 25 ohms cm to 30 ohms cm.
REACTION CONDITIONS
.
MATRIX = Copper 20 ELECTRODE = Platinum ELECTRODE COVER = Nylon mesh FREQUENCY = 5.1 KHz RATE OF APPLICATION = 918 mm/minute TIME OF APPLICA~ION = 3.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of cobalt approximate-ly 6.5 um thick. This layer was uniEorm and continuous as shown in Fig. 44.
~;~2~6~3 An SEM/EPMA scan across the interface indicated Eus-ion oE cobalt to a depth of at least 20 um as shown on the Table below and Fig. 45.
DEPTH um ELEMENT CONCENTRATION (Wt~) Co 2.65 Co 1.6 Co 0.87 Co 0.44 It was evident by visual inspection and from the pre-vious experiments that the deposit of cobalt above the 10 um level was extremely dense.
:~22~
EXAMPLE XXII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Silver cyanide 26 Potassium cyanide 46 Potassium carbonate 37 Sodium lauryl sulphate Carbon disulphide 1-2 10 Water (distilled) 1000 ml.
This solution had the following characteristics:
pH = 11.55 Resistivity = 10.5 ohms cm.
Concentration of Ag+l = 2.09% by wt.
The pH may be varied from 11.2 to 11.7; the concen-tration of Ag+l ions may vary from 1~ to 3% by weight; and the resistivity from 8 ohms cm to 13 ohms cmO
REACTION CONDITIONS
MATRIX = Copper 20 ELECTRODE = Platinum ELECTRODE COVER = Nylon FREQUENCY = 7.7 KHz.
RATE OF APPLICATION = 1386 mm/minute TIME OF APPLICATION = 1.0 minute Observation with the optical and scanning electron microscope revealed a surface deposition of silver appro~imate-ly 5 um thick. The structure is shown in Figs. 46 and ~6A.
~2201 S [:) An SEM/EPMA scan across the interface indicated fus-ion of silver to a depth of at least 3 um as shown on the Table below and Fig. 47.
DEPTH um ELEMENTCONCENTRATION (Wt%) 1 Ag 98.7 2 Ag 91.4 3 Ag 46.3 4 Ag 2.4 Ag 1.0 gL~2~
EXAMPLE XXIII
An aqueous solution of the following formulation was prepared:
NAME GRAMS/LITRE
Silver nitrate 29 Potassium iodide 398 Citric acid 6 Dextrose 5 Carbon disulfide 1.5 10 Ammonium hydroxide to pH
Water (distilled) 1000 ml.
This solution had the following characteristics:
pH - 5.6 Resistivity = 6.6 ohms cm.
Concentration of Ag+l = 1.84~
The pH may be varied from 1.5 to 2; the concentration Of Ag+l ions may vary from 0.5% to 2.5~ by weight; and the resistivity from 6 ohms cm to 12 ohms cm.
REACTION CONDITIONS
20 MATRIX = Copper ELECTRODE = Graphite ELECTRODE COVER = Cotton gauze FREQUENCY = 9.5 KHz.
RATE OF APPLICATION = 1710 mm/minute TIME OF APPLICATION = 2.0 minutes Observation with the optical and scanning electron microscope revealed a surface deposition of silver approximate-ly 2 um thick. The structure was as shown in Fig. 48.
An SEM/EPMA scan across the interface indicated fus-ion of silver to a depth of at least 2.00 um as shown on the Table below and Fig. 49.
DEPTH um ELEMENTCONCENTRATION (Wt~) 1 Ag 97.7 2 Ag 97.5 3 Ag 28.0 4 Ag 3.8 Ag 2.8 6 Ag 1.0 :3 ~2~
From the foregoing examples it will be seen that through the medium of these solutions a second metal in the solution may be fused with a first metal.
Claims (18)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A solution for the fusion of a second metal to a first metal in solid form characterized by:
0.10 to 10% by weight of a first compound including said second metal in a dissociable polyvalent form;
0.30 to 10% by weight of a second compound capable of complexing with the first compound, the first compound and the second compound being either soluble in water or forming a complex which is soluble in water, 0.1 to 0.5% by weight of a stabilizing agent which maintains the first compound, the second compound and the complex thereof in solution;
0.1 to 0.5% by weight of a catalysing agent for promoting the speed of reaction, reducing the valency of the polyvalent form of said second metal to a lower valency and catalyzing complexing action between the first and second compound and the remainder a solvent chosen from the group com-prising water, an organic solvent or a mixture thereof where-by said solution has a resistivity in the range of 10 to 80 ohms cm at room temperature.
0.10 to 10% by weight of a first compound including said second metal in a dissociable polyvalent form;
0.30 to 10% by weight of a second compound capable of complexing with the first compound, the first compound and the second compound being either soluble in water or forming a complex which is soluble in water, 0.1 to 0.5% by weight of a stabilizing agent which maintains the first compound, the second compound and the complex thereof in solution;
0.1 to 0.5% by weight of a catalysing agent for promoting the speed of reaction, reducing the valency of the polyvalent form of said second metal to a lower valency and catalyzing complexing action between the first and second compound and the remainder a solvent chosen from the group com-prising water, an organic solvent or a mixture thereof where-by said solution has a resistivity in the range of 10 to 80 ohms cm at room temperature.
2. A solution as claimed in claim 1 wherein said sta-bilizing agent is characterized by one or more of boric acid, citric acid, citrates, pyrophosphates, acetates and aluminum sulphate.
3. A solution as claimed in claim 1 wherein said cata-lyzing agent is at least one of the group comprising metallic ions consisting of iron, nickel, antimony and zinc, and organic compounds consisting of dextrine, hydroquinone, gelatin, pepsin and acacia gum.
4. A solution as claimed in claim 2 wherein said cata-lyzing agent is at least one of the group comprising iron, nickel, antimony and zinc, ions and organic compounds consisting of dextrine, hydroquinone, gelatin, pepsin and acacia gum.
5. A solution as claimed in claim 4 wherein the second compound is characterized by one of pyrophosphates, ethylene diamine tetracetic acid, citric acid, and potassium iodide, the pyrophosphates also serving as the stabilizing agent.
6. A solution as claimed in claim 5 wherein the dis-sociable polyvalent form of said second metal is character-ized by one of metallic salts and metallic acids, and com-prises sodium molybdate, sodium tungstate, indium sulphate, nickelous sulphate, nickelous chloride, chloroauric acid, chromium trioxide, chromium sulphate, chromic chloride, cadmium chloride, cadmium sulphate, stannous chloride, cobaltous sulphate, silver cyanide, silver nitrate.
7. A solution as claimed in claim 5 characterized by one of a wetting agent and surfactants.
8. A solution as claimed in claim 4 wherein the solution is characterized by having a pH in the range of 0.4 to 14.
9. A solution for the fusion of a second metal to a first metal characterized by:
0.10 to 10% by weight of a first compound including said second metal in a dissociable form;
at least one of the group of a stabilizing agent which maintains the first compound in solution and a catalysing agent for promoting the speed of reaction; and a solvent chosen from the group comprising water, an organic solvent or a mixture thereof whereby said solution has a resistivity in the range of 10 to 80 ohms cm at room temperature.
0.10 to 10% by weight of a first compound including said second metal in a dissociable form;
at least one of the group of a stabilizing agent which maintains the first compound in solution and a catalysing agent for promoting the speed of reaction; and a solvent chosen from the group comprising water, an organic solvent or a mixture thereof whereby said solution has a resistivity in the range of 10 to 80 ohms cm at room temperature.
10. A solution as claimed in claim 9 wherein said solvent is water and said solution has a pH in the range 0.4 to 14.
11. A solution as claimed in claim 10 wherein said solu-tion further includes a second metal complexing agent capable of complexing with said first compound.
12. A solution as claimed in claim 11 wherein said solution further includes both said stabilizing agent and said catalyzing agent.
13. A solution as claimed in claim 12 further including a wetting agent.
14. A solution as claimed in claim 13 wherein said sec-ond metal is present as a salt or an acid.
15. A solution as claimed in claim 14 wherein said sec-ond metal complexing agents are chosen from the group com-prising organic acids, organic salts and inorganic halogen salts.
16. A solution as claimed in claim 12 wherein said stabilizing agent is chosen from the group comprising organic salts and inorganic salts.
17. A solution as claimed in claim 12 wherein said catalyzing agent is chosen from the group comprising metallic ions.
18. A solution as claimed in claim 17 wherein said catalyzing agent is chosen from the group comprising a solu-ble organic compound chosen from the group comprising dex-trine, hydroquinone, gelatin, pepsin and acacia gum.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22476281A | 1981-01-13 | 1981-01-13 | |
| US224,762 | 1981-01-13 | ||
| US06/335,282 US4566992A (en) | 1981-12-28 | 1981-12-28 | Solutions for the fusion of one metal to another |
| US335,282 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1220160A true CA1220160A (en) | 1987-04-07 |
Family
ID=26919000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000393921A Expired CA1220160A (en) | 1981-01-13 | 1982-01-11 | Solutions for the fusion of one metal to another |
Country Status (5)
| Country | Link |
|---|---|
| BR (1) | BR8200155A (en) |
| CA (1) | CA1220160A (en) |
| GR (1) | GR77930B (en) |
| MX (1) | MX156764A (en) |
| PT (1) | PT74272A (en) |
-
1982
- 1982-01-11 CA CA000393921A patent/CA1220160A/en not_active Expired
- 1982-01-12 PT PT7427282A patent/PT74272A/en unknown
- 1982-01-12 GR GR66994A patent/GR77930B/el unknown
- 1982-01-12 MX MX19094782A patent/MX156764A/en unknown
- 1982-01-13 BR BR8200155A patent/BR8200155A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GR77930B (en) | 1984-09-25 |
| MX156764A (en) | 1988-09-30 |
| BR8200155A (en) | 1982-11-03 |
| PT74272A (en) | 1982-02-01 |
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