CA1195431A - Electronic package and accessory component assembly - Google Patents

Abstract

ABSTRACT OF THE DISCLOSURE

Common printed circuit board area usage is provided for electronic packages and accessory com-ponents by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed por-tions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.

Description

This is a divisional application oE copending Canadian application Serial Number 382,051, filed July 20, 1981.
FIEID OF I~E ~NVrh~TION:
This invention relates generally to electrical assemblies and pertains more particularly to assemblies for interconnecting electronic packages and com~onents with support substrates.
B~CKGROUND OF THE INV~2~rION:

. _ . ... _ In recent years, the electronics industry has looked increasingly to so-called "stacking" of chip carriers and the like to meet information density requirements. Such practice, wherein plural packages overlie common printed circuit board (PCB) real estate, provides a doubling or m~re of infor~ation density, for example, ~emory capability~
Known efforts in this area, preceding that set forth in Canadian Patent 1~139J386r had looked to the stacking of chip carriers and dual-in-line packages (DIP) and had provided receptacles having contacts insertable in PCB apertures for soldering thereto and extending upwardly from the PCB to Erictionally receive and engage contacts of packages inserted into the receptacles.
Where it was desired to employ the stacked packages electrically independently of one another, the art preceding -the '386 patent had looked to several measures for separately addressing the packages.
Typically, the contacts of the stacked packages were vertically aligned and circuit paths to the PCB would be redundant -to -~le stac]sed packages for contacts thereof not involved in package selection. Thus, a single receptacle contact would engage vertically successive package contacts.
On -the other hand, a unique circuit path is required from -the PCB
to each package contact providing selec-tion or activation of a package.
In one csmj~

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1 know~ prior approach, receptacle con~acts were provided with break-away portions, whereby one would interrup-t continuity from the PCB to an upper package contact or a lower package contact/ despite vertical alignment thereof. In another known prior approach, package selection contacts were led from ~he receptacle ofE-board and were.tilus not available at the PCB as were all other package contacts. In still another prior approach, packages were customized to provide for vertically unaligned select/address contacts.
. While stacking presents little user dif~iculty where the stacked packages are used electrically depen-dently in parallel circuit relation to the PCB~ user difficult~ is seen in ~.he alternative situation wherein ~5 vertical address/select differentiation is required. In the first known prior approach discussed above~ bypassing of one of two verticall~ aligned package contacts pre-sented a problem in later accessing such bypassed con-tact from the PCB. Thus, one needed t~-define another usable circuit path, for example, from the bypassed package contact to an-unused package contact and thence to the RCB through a recep-tacle.co~tact servicing the unused package contact~ In the second discussed prior approachr the of~-board disposition o~ address/select packa~e contacts precluded accessiny from the PCB~ The last noted prior approach required the tailorins OL
package contact layout to the receptacle contacts and accordingly did not lend itself to standardiæation permitting commercial package substitution. Finally, ~0 all of the known approaches pricr to the 1386 paten-t adopted frictional contact interfitting and did not meet zero insertion force applica-tions.
In the '386 pa-tent, applican-ts herein set forth a receptacle for supporting electronic packages :in stacked relation and providin~ electrical

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1 connec~ion to package contacts without the disadvantages of the prio~ appro~ches. Such receptacle has an upstanding housing defining a channel and supports received packages in vertically spaced relation in the channel. Contacts a~e supported in the housing in verticall~ spaced relation and in noninterering dis-position with respec~ ~o ~he channel~ An actuator is supported in the housing for d.:isplacing the contacts from such noninterfering di.sposi~ion with respect to the channel into engagement with contacts of the pack-ages ~ As is se~ forth in more deta~l below, the '386 receptacle includes movable support means for the upper stacked package and provides selective spaci~gs of contact sets to facilitate accessing of the pacXages.
The objective of using common PCB real es tate for plural packages, as noted above, is reached by the ~386 receptacle with zero insertion force and other benefit. The present invention addresses a furthex ~nhancement in PC~ real estate usage, namely, disposition of electronic components which are accessory to elec-txonic packages stacked in receptacles. As an example of such an accessory componen-t, a decoupling capacitor typically is used for each separa-te voltage level supplied to a DIP. Presently, such capacitors are dis-posed on PCBs as sole consumers of PCB real estate, adjacent the DIP which they serve and are connected to PCB strips in turn electrically connected to package receptacle contacts.
SUMMARY OF THE INVENTION:
It is an object of this invention to provide for enhanced PCB real estate usage A more particular object of the inventi~n is to provide for common PCB real esta-te usage for elec-tronic packages and components accessoxy ~he.reto~

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A still more specific ob~ect of the invention is to provide assemblies interconnecting one or more electronic packages to PCB and like support substrates and having capaci-tive decoupling capability.
In attaining the foregoing and o~her objects, the inven-tion provides an assembly having a receptacle commonly housing koth an electronic p~c~age and a com~onent accessory there-to, both electrically cormected -to a co~mon electrical contact extending from the recep-tacle. In its preferred embcdiment, the invention is shown in usage of the '386 receptacle, expanding same -to provide integrally housed capaciti~e decoupling means.
Therefore, in acoordance with the present inverltion there is provided in an electrical assembly of the type including an electrical package ~aving a row of contacts, accessory com~onent means Ln electrical interconnection with t~he package contacts, comprising. a substrate of insulative material, a plurality of spaced conductive strips on the substrate and an electrical component supported by the substrate and electrically connected to selected conductive strips; and plural ear portions each including a portion of one of -the selected conducti~7e strips, project~lg outwardly from one side edge of -the substrate at spaced locations and defining therebetween an open region within which reside contacts of the package tha-t are not connected to the componen-t ~eans, the ear portions being electrically connected to selected contacts in the row that are no~ adjacent to each other.

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DESCI?IEYI'ION OF ~IE DR7~WINGS:
Fig. 1 is an exploded perspec-tive vlew of an interconnect assembly in acoordance wi-th the present application shc~Jn above a PCB
for use wi-th the assembly.
Figs~ 2(a)-2~f~ are side and front elevations of diverse receptacle contact configurations for the Fig. 1 receptac]e.
Figs. 3(a)-3(c~ are side and front elevdtions of con-tact actuators of the Fig. 1 recept~cle.
Fig. 4 is a front elevation of the housing of the Fig. 1 receptacle.
Fig. 5 is a top plan view of the Fiy. 4 housing.
Fig. 6 is a side elevation of the Fi~. 4 h~using.
Fig. 7 is a sec-tional view as seen from plane VII-VII of Fig. 5.
Fig. 8 is a sectional view as seen frcm plane VIII-VIII oE Fig. 5.
Figs. 9 and 10 are sectionkal views illustrating actuator-contact relations for the lower contacts of the Fig. 1 receptacle and omit-ting capacitive decou~ling asse~ly 100 of Fig. 1.

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1 Figs. 11 and 12 are sectional views illustrating actuator~contact rela~ions for the upper contacts of the Fi~ 1 receptacle for convenience.
. Fig. 13 is an expl.oded view showing the posi-.tional registration o. recep~acle contacts and a PCB
strip o~ capacitive decoupling assembly 100 o~ Fig. 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT:
~ eferring to Fig. 1, interconnect receptacle 10 includes housing 12 having elongate channel 14 extending between open ends of the housing and bordered by housing interior sidewalls 16 and 18. The channel is of top-open type to facilitate vertical insertion of electronic packages or components to be stacked within housing 12. O~enings are formed in bottom surface 20 of housing 12 for insertion of contacts 22 and 24 respectively into registry with lower contact slots 26 and upper contact slots 28. For purposes discussed in detail belowr each upper contact slot has an expanded portion 30 for receiving upper component support insert 32. ~ower component support is provided by interior base surfaces 34 and 36. Chamfered ~uides 38 lead from surfaces 34 and 36 into lower contact slots 26 to guide leads of the lower electronic component into registry with lower contacts 22.
Housing top surface openings 40 and 42 are continuous respectively with lower contact slots 26 anc~
uppex contac~ slots 28. Actuators 44 ~lower contact) and 46 (upper contact~ are supported in common by plate 48 for respective entry into openinc3s 40 and 42 and vertical movement in slots 26 and 28.
Upper contact slots 28 are uniformly spaced on centers by distance dl lon~itudinally along channel 14. Like spacing dl is provided between centers o lower contact slots 26~ A longitudinal offset distance d2 exists between re~pective centers of each lower slot 26 3~

1 and each adjacen-t upper slo-t 2%, spacing d2 being one-half o* spacing dl With spacing dl also a~plying between adjacent apertures 50 of pxinted circuit board 52, the Fig. 1 arrangement provides vertical nonalignment of upper and lower receptacle contacts, while permittin~
access to both such contacts between successive PCB
apertures. To this end, contact coniguration 54 supports lower contact 22 ~ointly with upper contact 24 with center spacing d2 and stem 56 provides PCB connec-tion for both contacts. Contact con-figuration 58 supports only a lower con~act 22 and stem 60 provides PCB connection there~or. Contact configuration 62 differs by supporting only an upper contact 24 and has its stem 64 offset to the opposi~e side of -the contact, all such contact configurations being illustrated in Figs. 2(a)-2~f) in de~ail showing these similarities and differences.
Contact configuration 54 is used throughout or collectively bringing to the PCB those package contacts not involved in address/select function. Con-tact configuration 48 is used to access the lower com-ponent received in receptacle 10 and contact configuration 60 is used to access the upPer co~ponent received in receptacle 10. PCB 52 is com~lemental to receptacle 10, and vice versa~ with quite slight departure -from customary PCB geometry ~or receiving a single DIP. Thus, board apertures 50 may run in t~`70 Parallel rows wîth uniorm spacing. An additional aPerture 66 is formed in the PCB, at longitudinal spacing d2 from ad~acent apertures 50, for upper component accessing. In instances where one ma~ look to stacking dynamic com~onents, e.g., where read/write access stroke~ are ne ded for each package~
a further aperture 68 may be formed outboard of apertures 50 and longitudinally staggered witn respect thereto, as in the case of aperture 66. ~5 wi11 be seen, all of s~
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1 apertures 50, 66 and 68 are inboard of the perimeter of receptacle 10 when the PCB and recep-tacle are assembled.
Capacitive decouPling asse~bly 100 is adapted for integral containment by receptacle 10 and includes board or substrate 102 having projecting ears 104, 106, 108 and 110, electrically conductive strips 112l 114, 116 and 118 and capacitors 120, 122 and 12~. The capacitors have first terminals 126, 128 and 130 and second terminals 132, 134 and 136. ~s indicated, con-ductive strip 112 is in registry with each of caPacitor first terminals 126, 128 and 130. Strips 114, 116 and 118 are in separate regis~ry wi-th ca~acitor second terminals 136, 132 and 134. In this exemplary accessory component: showing, it is assumed that three diverse d.c.
voltage levels are supplied to the ~ackages in the receptacle~ to be decoupled indlvidually by the three capacitors. As will be shown below 5Fig. 13), board 102 will be disposed flush with bottom surface 20 of housing 112, with the capacitors received i.n openings in surface 20 and recesses .n housing 12.
Housing interior structural detail is seen in Figs~ 4-8. ~he housing is upstanding from eet 70 and has transverse base ribs 72-78 extending between interior sidewalls 16 and ~8, openings/recesses 80-84 existing between the xihs for receipt of accessory components therein, e.g.~ capacitors 120~124~ Fig. 7 shows housing 12 sectionally through uoper contact slots 28 and illus trates openings 86 for insertion of contacts. Fig. 8 shows housing 12 sectionally through lower contact slots 26. O~enings 86 of Fig~ 7 are also seen in Fig. 8~ as such openings bridge slots 26 and 28 whereby a contact of configuration 54 of Fi~. 2(a) may be inserted with its contacts 22 and 24 seating in slots 26 and 28.
Openings 86 likewise p_rmit insertion of contacts oE
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Referrinq to Figs~ 3(a3-3(c~, lower contact actuator 44 has a horizontal flange 44a for securement to plate ~8 of Fig. 1, a vertical run 44b, a knee 44c, an inclined run 44d and a further vertical run 44e in spaced parallel relatio~ to run 44b. Wpper contact actuator 46 has a horizontal flange 46a, a first vertical xun 46b, an u~per knee 46c, an upper inclined run 46d, a second vertical run 46e, a lower inclined run 46f, a lower kn~e 46g and a third vertical run 46h. The operation of the actu~tors u~on respective lower and upper contacts will now be discussed in con~unction with Figs. 9~12~
. In Fig. 9, lower component package 90 is shown inserted in channel 14 of housing 12 with package con-tact 92/ in dependen~ leg form as for a DIP, seated in guiae 38. Vertical posi~ioning and support for the package is established by support surface 34. In the course of package insertion, actuator 44 is moved ver-tically uPward of its Fig. 9 Position, i.e,l above andout of engagement with contact 22, whereby the contact is self-biased leftwardly of its Fig. 9 position and insertion of package contact 92 is attained wlth zero insertion forceO In the Position of actuator 4~ in Fig. 9, following package insertion, contact 22 is forced, b~ engagement with actuator inclined run 44d, into elec-trical engagement with ~ackage contact 92~ In Fig. 10, actuator 44 is in fully inserted position, as will be the case (discussed below~ when an upper component package .is electrically engaged in the housing and all actuators ar~ fully 1nserted in the housing. In this 1 Fig. 10 actuator position, contact 22 is cn~age~ by actuator vertical run 44b which is forced rightwardl~
in slot 26 by reason of housing restraint on snaced vertical run 44e. The inserted extent of package con-tact 92 is captured against housing extent below surface34 and guide 38 by contact 22 pressure thereon.
Following insertion of lower component package 90 into housing 12, sup~ort inserts 32 (Fig. 11) are to be displaced outwardly of exPanded portions 30 of upper contact slots 28 to provide vertical positioning and support for upper component package 94. This may be done, prior to insertion of package 94, b~ downward movement of actuator 46 from its position shown in Fig. 11. Such movement forces actuator inclined run 46d into slc)t 28, urging contact 24 leftwardly against wall 32a of insert 32 and dis~lacing the insert outwardly.
Insert wall 32b bears against ac-tuator vertical run 46e to precisely measure insert displacement into such position as to underlie package 94 and sit le~twardly o~ package contact 96 on package insertion. Actuator

4~ is now elevated to slightly above its Fig. 11 posi-tion whereby contact 2d retuxns, under sel~-bias, to non-interfering relation to the zero ~orce insertion path of package contact 96. On package 94 insertion, actuator 46 is moved downwardly through its Fig. 11 position, whereupon contact 24 electrically engages packa~e conkack 96, and into its Fig. 12 position. In such fully inserted position, actuator ~ertical runs 46h bears a~ainst the base o contact 24 and its vertical run 46e 3~ bears against the rightward slot wall. This disposes actuator knee 46c against contact 24, compressing same against package contact 96.
Referring again to Fig. 1, in assembling receptacle 10/ inserts 32 are first placed in expanded 35 portions 30 o upPer contact slots 28. Contactt. are 3~

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1 next inser~ed through the receP~acle bottom sur:Eace and inserts 32, contact configuration being preselected in the three diverse varieties in accordance with the nature o-f the componen~ packages to be received and PC~ connections desired. On insertion of ~he actuators, the receptacle is readied for package insertion.
Based on the difference in configurations of actuators 44 and 46, upper package removal and suh-s~itution may be made at any time without interru~ting electrical continuity between the lower package and the PCB. As depicted in Figs. 11 and 12, vertical spacing is prescribed as between inserted ~ackages 90 and 94j chann~l 14 remaininy fully oPen in such inter-package ~olume~ Connection to PCB is readily made wihtout packages inserted/ thus isola~ing the packages from soldering heat and the like. As noted above, desired zero insertion force is afforded by selective actuator positioning.
The rece~tacle housing is Preferably comprised of molded plastic. The actuators and upper package support inserts ma~ also be o~ rigid syn~hetic matter, but are pre~erably metal. Contacts may be noble metal-plated, based on zero insertion forceO
Reference is now made to Fig. 13 t~ compleke discussion of the exemplary assembly herein. CaPacitive decoupling assembly 100 is shown in exploded fashion with receptacle 10, set downwardly therebelow to show the intellded reg.istry of ear 104 of board 102 with receptacle end contact 54. As will be seen, as board 102 is elevated i.nto ~lush relationship wi~h bottom surface 20 of housing 12~ contact land 56a and stri~ 112 are placed in registry, to be elec~rically interconnected9 as by soldering or the like. In this arrangement, as seen by re~erence again to Fig. 1, such end contact 56 is connected in common, through strip 1l2, to ground te~minals 126, 128 and 130 of capacitors 120, 122 and ~, ~ AM-2 1 124u Ears 106, 108 and 110 of Fig. 1 are similarly disposed in registry with other receptacle contacts and s-~rips 114, 116 and 113 are electrically connected thereto whereby capacitors 120, 122 and 124 are connected individually between ground and such o-ther receptacle contacts to affect capacitive decoupling of d.c~ voltages applied from ~he PCB to such other r~ceptacle contacts.
While the described assembly embodiment is inclusive of plural electronic packages, a single re~
ceived package may of course be assembled with zero insextion force in a single level receptacle also having an integrally packaged accessory component. In this connection, receptacle 10 above will be seen as fixedly supporting a first portion of contacts 56, i.e., lands 56a, for selective connection to the accessory component.
The remainder of contacts 56 may be considered as second portions vertically sPaced from such first portions and are supported by the receptacle for electrical engagemen~ I
with the package contacts. As will also be seen, the assembly is highly ventilated as the receptacle ends and top are ully open and airflow between packages and accessory com~onents is permitted ~y the spacings ~ro- I
vided therebetween.
Various modifications to the foregoing particu-larly set forth embodiment of the invention will now beevident to those skilled in the art. ~ccordingly, such preferred embodiment and the foregoing discussion thereof are intended in an illus-trative and no~ in a limiting sense. The true spirit and scope o-f -the invention is set ~or-th in the following claims.
Embodiments disclosed in this divisional application are also disclosed and claimed in copending Canadian applicatlon Serial Number 382,051.

Claims (3)

THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:

1. In an electrical assembly of the type including an electrical package having a row of contacts, accessory component means in electrical interconnection with said package contacts, comprising:
a substrate of insulative material, a plurality of spaced conductive strips on said substrate and an electrical component supported by said substrate and electrically connected to selected conductive strips; and plural ear portions each including a portion of one of said selected conductive strips, projecting outwardly from one side edge of said substrate at spaced locations and defining therebetween an open region within which reside contacts of said package that are not connected to said component means, said ear portions being electrically connected to selected contacts in said row that are not adjacent to each other.

2. The invention claimed in claim 1 wherein said substrate includes spaced portions projecting outwardly from said one side edge thereof, each corresponding in location with and supporting a respective portion of said selected conductive strips.

3. The invention claimed in claim 1 further including plural ear portions projecting outwardly from another side edge of said substrate opposite said one side edge, said further plural ear portions each including a portion of others of said plurality of conductive strips on said substrate, said further ear portions being electrically connected to other selected contacts of said package that extend in another row spaced from and parallel to said row of contacts.