CA1123490A - Electrical component and method of making same - Google Patents
Electrical component and method of making sameInfo
- Publication number
- CA1123490A CA1123490A CA385,019A CA385019A CA1123490A CA 1123490 A CA1123490 A CA 1123490A CA 385019 A CA385019 A CA 385019A CA 1123490 A CA1123490 A CA 1123490A
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- wire
- clamp
- lead
- fingers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
ABSTRACT
The specification describes an electrical component having a substrate, at least one electrical circuit element on the substrate, at least one contact pad on one edge of the substrate, a round lead wire with one end connected to the substrate and a clamp integrally formed in such a manner on the one end of the wire to provide the mechanical and electrical interface between the contact pad and the wire with the longitudinal center line of the wire being aligned with the center line of the edge thickness of the substrate when the clamp connects to the substrate. The specification also describes the method of forming the electrical component and, particularly, the clamp portion of the wire.
The specification describes an electrical component having a substrate, at least one electrical circuit element on the substrate, at least one contact pad on one edge of the substrate, a round lead wire with one end connected to the substrate and a clamp integrally formed in such a manner on the one end of the wire to provide the mechanical and electrical interface between the contact pad and the wire with the longitudinal center line of the wire being aligned with the center line of the edge thickness of the substrate when the clamp connects to the substrate. The specification also describes the method of forming the electrical component and, particularly, the clamp portion of the wire.
Description
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This is a division of cop~nding Canadian Pat~nt Application Serial No. 313,612 ~iled October 17, 1978 assigned to the present assignee.
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- - , 1 . Backqround of the Invention The present invention relates to a carrier strip assem- ' bly as well as the interface between the lead pins on the carrier.
strip assembly and an electrical component package. More parti-' ''''~
5 cularly, this'invention relates to a carrier strip assembly which has round lead wires with integrally formed clamps Qn the ree ends of the lead"wires for connection to electrical component p,ackages. The present invention is also directed to the method .
of ~abricating the carrier strip or iead frame assembly having ~' 10 the round lead wires with integrally formed clamps on their free . ends. - ' .s ' Inherent in the competitive environment o~ manufacturing electronic products is the utilization -of low-cost rapid hi~h .~ -'`, , -volume manufacturing processes. A widely practiced approach to. ,'~.`
1~ the assembly of electrical component packases having in-line pin devices for connection to various circuit assemblies or subassem~
-blies- is the attachment of a lead' ~rame carrier or carrier strip ; assembly to the electrical component substrate to facilita~o'a . continuoùs automated process.. The carrier strip assembly in~
20 cludes the leads which are to be attached to the electrical ,. "'~
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1 Generally, the carrier strip is made by stamping or etching some type of continuous band of thin gauge metal into a particular form wherein the strip becomes not only the carrying mechanism for the electrical component during its assembly, but 5 also a source of the lead piIIS for the electronic component de-vice. The typical presently used carrier strip assembly has the lead pins integrally formed thereon and they have a generally rectangular or square cross-sectional shape. However, in some instances it is desirable for the lead pins to have a round or 10 circular cross-sectional shape.
It is recognized that in some electrical component mod-ules straight round lead wire pins have been utilized. However, these pins are generally affixed to the large area surface of the -~
component substrate and are positioned along one edge of the sub-15 strate, so that the pin is offset from the centerline of the edge -thickness of the substrate. In the construction of electrical ;
component packages, having a substrate to which lead pins are connected, it is important that the longitudinal centerline of the lead pin be aligned with the centerline or center of the sub-20 strate edge thickness. Otherwise, the lead pins become offset from the center of the substrate edge thickness and present an unbalanced non-symmetrical lead pin arrangement with respect *o ~ -~
the edge of the component package. This offset arrangement of the lead pins requires more room on the board assembly to which ;`
25 the component is attached. Also, the offset pins may cause more stress on the pin/substrate connection when the lead pins are inserted into a board assembly.
The typical rectangular cross-sectionally shaped lead pins which are ormecl on the carrier strip normally require the 30 incorporation of tie bars adjacent the free ends of the lead . .
wires to maintain their proper location with respect to each .
This is a division of cop~nding Canadian Pat~nt Application Serial No. 313,612 ~iled October 17, 1978 assigned to the present assignee.
, ' ~
- - , 1 . Backqround of the Invention The present invention relates to a carrier strip assem- ' bly as well as the interface between the lead pins on the carrier.
strip assembly and an electrical component package. More parti-' ''''~
5 cularly, this'invention relates to a carrier strip assembly which has round lead wires with integrally formed clamps Qn the ree ends of the lead"wires for connection to electrical component p,ackages. The present invention is also directed to the method .
of ~abricating the carrier strip or iead frame assembly having ~' 10 the round lead wires with integrally formed clamps on their free . ends. - ' .s ' Inherent in the competitive environment o~ manufacturing electronic products is the utilization -of low-cost rapid hi~h .~ -'`, , -volume manufacturing processes. A widely practiced approach to. ,'~.`
1~ the assembly of electrical component packases having in-line pin devices for connection to various circuit assemblies or subassem~
-blies- is the attachment of a lead' ~rame carrier or carrier strip ; assembly to the electrical component substrate to facilita~o'a . continuoùs automated process.. The carrier strip assembly in~
20 cludes the leads which are to be attached to the electrical ,. "'~
..
component. ' :
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. . , ;,., .:
',, ~ .'' .
:` :
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1 Generally, the carrier strip is made by stamping or etching some type of continuous band of thin gauge metal into a particular form wherein the strip becomes not only the carrying mechanism for the electrical component during its assembly, but 5 also a source of the lead piIIS for the electronic component de-vice. The typical presently used carrier strip assembly has the lead pins integrally formed thereon and they have a generally rectangular or square cross-sectional shape. However, in some instances it is desirable for the lead pins to have a round or 10 circular cross-sectional shape.
It is recognized that in some electrical component mod-ules straight round lead wire pins have been utilized. However, these pins are generally affixed to the large area surface of the -~
component substrate and are positioned along one edge of the sub-15 strate, so that the pin is offset from the centerline of the edge -thickness of the substrate. In the construction of electrical ;
component packages, having a substrate to which lead pins are connected, it is important that the longitudinal centerline of the lead pin be aligned with the centerline or center of the sub-20 strate edge thickness. Otherwise, the lead pins become offset from the center of the substrate edge thickness and present an unbalanced non-symmetrical lead pin arrangement with respect *o ~ -~
the edge of the component package. This offset arrangement of the lead pins requires more room on the board assembly to which ;`
25 the component is attached. Also, the offset pins may cause more stress on the pin/substrate connection when the lead pins are inserted into a board assembly.
The typical rectangular cross-sectionally shaped lead pins which are ormecl on the carrier strip normally require the 30 incorporation of tie bars adjacent the free ends of the lead . .
wires to maintain their proper location with respect to each .
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other. This necessitates the additional step of cutting away the tie bars after the component has been assembled.
Summary Of The Invention The aforementioned application is directed to an electrical component carrier strip assembly for use in forming i.. .. .
an electrical component and to the method of forming the carrier strip assembly. The present invention is directed to the electrical component.
In accordance with the present invention, the electrical component comprises a substrate, at least one electrical circuit element on the substrate, at least one contact pad on one edge of the-substrate, a round lead wire with one end connected to the substrate and a clamp integrally formed in such a manner on the one end of the wire to provide ~`
the mechanical and electrical interface between the contact pad and the wire with the longitudinal centerline of wire being aligned with the centerline of the edge thickness of the substrate when the clamp connects to the substrate. ;~
The present invention is also directed to the method . .
of forming a carrier strip assembly having a thin band with - . .
round wire leads. The method comprises the steps of attaching `-the round wire leads to the thin band, each lead having at least o~e free end; flattening the free ends of the leads to form a flattened thin portion with a thickness less than the ~ ;
diameter of the leads; cutting the flattened thin portion to ;~
form a plurality of fingers; bending the fingers to form an ; !"
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integral clamp on the free end of the leads, at least two of ' the fingers opposing eàch other; and moving the clamp into ~;
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engagement with a component substrate in such a manner that the centerline of the wire lead is aligned with the center of the edge thickness of the component substrate. ;
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The utilization of the present invention provides for the placement of round lead wires on electrical components which are carried on a transporting carrier strip in such a manner that the longitudinal centerline of lead wires is aligned with the center of the edge thickness of the substrate. Once the assembly process is completed, the lead wires are cut from the carrier strip, resulting in each of the electrical component packages having one or more lead wires extending from its perimeter to provide connection into an assembly board.
Round lead wires allow the user to insert the wires in a board and bend them, not only at a right angle onto the board's opposing side, but also at any radial angle. On the other hana, rectangularly or square cross-sectionally shaped lead wires can be bent at a right angle onto the board's opposite side, but are limited in flexibility with respect to the radial direction they can be bent.
Round cross~sectional lead wires can be moved by aligning combs for proper positioning of the lead wires along the edge of the substrate, so that the need for tie bars is eliminated for round lead wires. Consequently, the additional step of removing the tie bars after completion of component assembly is eliminated.
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other. This necessitates the additional step of cutting away the tie bars after the component has been assembled.
Summary Of The Invention The aforementioned application is directed to an electrical component carrier strip assembly for use in forming i.. .. .
an electrical component and to the method of forming the carrier strip assembly. The present invention is directed to the electrical component.
In accordance with the present invention, the electrical component comprises a substrate, at least one electrical circuit element on the substrate, at least one contact pad on one edge of the-substrate, a round lead wire with one end connected to the substrate and a clamp integrally formed in such a manner on the one end of the wire to provide ~`
the mechanical and electrical interface between the contact pad and the wire with the longitudinal centerline of wire being aligned with the centerline of the edge thickness of the substrate when the clamp connects to the substrate. ;~
The present invention is also directed to the method . .
of forming a carrier strip assembly having a thin band with - . .
round wire leads. The method comprises the steps of attaching `-the round wire leads to the thin band, each lead having at least o~e free end; flattening the free ends of the leads to form a flattened thin portion with a thickness less than the ~ ;
diameter of the leads; cutting the flattened thin portion to ;~
form a plurality of fingers; bending the fingers to form an ; !"
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integral clamp on the free end of the leads, at least two of ' the fingers opposing eàch other; and moving the clamp into ~;
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engagement with a component substrate in such a manner that the centerline of the wire lead is aligned with the center of the edge thickness of the component substrate. ;
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The utilization of the present invention provides for the placement of round lead wires on electrical components which are carried on a transporting carrier strip in such a manner that the longitudinal centerline of lead wires is aligned with the center of the edge thickness of the substrate. Once the assembly process is completed, the lead wires are cut from the carrier strip, resulting in each of the electrical component packages having one or more lead wires extending from its perimeter to provide connection into an assembly board.
Round lead wires allow the user to insert the wires in a board and bend them, not only at a right angle onto the board's opposing side, but also at any radial angle. On the other hana, rectangularly or square cross-sectionally shaped lead wires can be bent at a right angle onto the board's opposite side, but are limited in flexibility with respect to the radial direction they can be bent.
Round cross~sectional lead wires can be moved by aligning combs for proper positioning of the lead wires along the edge of the substrate, so that the need for tie bars is eliminated for round lead wires. Consequently, the additional step of removing the tie bars after completion of component assembly is eliminated.
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3~0 1 Hence, the present invention combines the advantages of automated assembly of electrical component packages using a car-rier strip assembly with the unique feature of being able to in-corporate round lead wires in the carrier strip in such a manner 5 that they can be connected to the packages in alignment with the center of the edge thickness of the substrate. In addition, the present approach of utilizing round lead wires with integrally formed connecting clamps provides a more efficient and inexpen-sive method of forming the overall electrical component package.
Brief Description of the Drawinqs ,-~
Figure 1 is a plan view showing the band portion of the carrier strip in the first stage of its formation;
Figure 2 is a plan view of the carrier strip similar to Figure 1 wherein the lead wire holder portions have been formed;
Figure 3 is a sectional view taken along the lines 3-3 `
in Figure 2;
Figure 4 is a sectional view taken along the lines 4-4 ~ -in Figure 2; ~;
Figure 5 is a plan view of a portion of the carrier 20 strip band with the round lead wires traversely mounted on the ~
carrier strip; ~;
Figure 6 is an end view of the carrier strip band with ~ ;
the lead wire mounted thereon;
Figure 7 is an end view of the lead wire with its ends ;~
formed into thin portions to form clamps;
Figure 8 is a plan view of the carrier strip assemblywith the round lead wires having the ree ends formed into tri~
furcated clamps;
Figure 9 is an end view of the carrier strip showing the general shape of the clamped ends of the lead wires;
Figure 10 is a plan view of the carrier strip assembly showing the attachment of the clamps of the lead wires to the electrical component substrate; ~;
Brief Description of the Drawinqs ,-~
Figure 1 is a plan view showing the band portion of the carrier strip in the first stage of its formation;
Figure 2 is a plan view of the carrier strip similar to Figure 1 wherein the lead wire holder portions have been formed;
Figure 3 is a sectional view taken along the lines 3-3 `
in Figure 2;
Figure 4 is a sectional view taken along the lines 4-4 ~ -in Figure 2; ~;
Figure 5 is a plan view of a portion of the carrier 20 strip band with the round lead wires traversely mounted on the ~
carrier strip; ~;
Figure 6 is an end view of the carrier strip band with ~ ;
the lead wire mounted thereon;
Figure 7 is an end view of the lead wire with its ends ;~
formed into thin portions to form clamps;
Figure 8 is a plan view of the carrier strip assemblywith the round lead wires having the ree ends formed into tri~
furcated clamps;
Figure 9 is an end view of the carrier strip showing the general shape of the clamped ends of the lead wires;
Figure 10 is a plan view of the carrier strip assembly showing the attachment of the clamps of the lead wires to the electrical component substrate; ~;
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1 Figure 11 is an end view showing the interface betweer the clamp end of the lead wires and the substrate;
Figure 12 is a plan view of the carrier strip showing the encapsulation of the electrical component substrate and the
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1 Figure 11 is an end view showing the interface betweer the clamp end of the lead wires and the substrate;
Figure 12 is a plan view of the carrier strip showing the encapsulation of the electrical component substrate and the
5 clamp end of the lead wires; and Figure 13 is an end view showing the encapsulation of the interface between the clamp end of the lead wire and the com-ponent package.
Detailed Description of the Invention In the manufacture of the carrier strip assembly of the present invention, a long continuous band or strip of thin gauge metal 10 in Figure 1 is subjected to a stamping or etching process to form a plurality of precisely spaced indexing holes 12, as well as a plurality of precisely spaced holder tabs 14 which will ; ~-15 receive lead wires as will be explained. Each holder tab 14 con- -~-tains a neck portion 16 and two flange sides 18. The indexing holes 12 are utilized in the overall automatic assembly of elec-tronic components and interface with sprockets or other drive - `
means to propel and control the movement o~ the carrier strip 20 assembly.
As shown in Figure 2, in the next stage of the forma-tion of the carrier strip assembly the holder tabs 18 are bent , upward in a vertical direction to be somewhat perpendicula~ to -~ . .
the central portion 20 of the holder 14.
As shown in Figure 3, the neck portion 16 of the holder portion 14 is bent in a somewhat perpendicular direction with re-spect to the main portion 22 of the carrier strip assembly and also perpendicular to the bottom portion 20 of the holder 14.
Consequently, the bottom portion 20 o~ the carrier holder 14 is 30 slightly raised above and parallel to the main portion 22 of the carrier strip. - ;~
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l In Figure 4 the U-shaped or cup-shaped receptacle of the holder 14 is shown for receipt o~ the round lead wire 24. ~-Reference is made to Figure 5 showing the placement of lead wires 24 within -the holder members 14. The flange members 18 of each s holder 14 are crimped and pressed around the lead wires 24 to se-curely hold them in a precise location with respect to each other -in a transverse orientation ~ith respect to the carrier band or strip 10. The lead wires 24 have a round or circular cross-sec-tion. As the carrier strip 10 moves through the assembly process, ; `~
lO the lead wires 24 are Garried thereon with each lead wire 24 slightly raised above the main portion 22 of the carrier strip 10 as shown in Figure 6. -The free ends 26 of the lead wires are inserted into adie form press to flatten the end of the wire as shown in Figure 15 7 so that the flattened portion 28 is aligned with the longitudi-nal centerline 30 of the lead wire 24. The die is shaped-so that j ~`
the ends 26 of the wires are formed in the offset shape 31 as shown in Figure 8 with one side of the flattened portion extend-ing laterally further beyond the longitudinal centerline 30 of ;
20 the lead wire than the other side of the centerline of the leadwire. This offset flattened portion 31 is placed in alternating sequence with respect to each adjacent wire as shown in Figure 8. ~ ~
The next step which is accomplished within the same die forming ~`
process is to cut slits 32 into the flattened offset portion 31 ;
25 of the ends of the lead wires. The cut ends of the lead wires -- ~
are then formed to establish the clamp arrangement 34 shown in ;
Fiqure 9 with one or more bottom prongs or fingers 36 and one or more top prongs 38. Although a trifurcated clamp is shown in the Figures, it is envisioned that a two-prong or more than three-prong ,-type of clamp could be utilized if desired.
When the clamps 3~ are formed on the ends 26 of the lead wires, the carrier strip assembly 40 in Figure 8 is completed
Detailed Description of the Invention In the manufacture of the carrier strip assembly of the present invention, a long continuous band or strip of thin gauge metal 10 in Figure 1 is subjected to a stamping or etching process to form a plurality of precisely spaced indexing holes 12, as well as a plurality of precisely spaced holder tabs 14 which will ; ~-15 receive lead wires as will be explained. Each holder tab 14 con- -~-tains a neck portion 16 and two flange sides 18. The indexing holes 12 are utilized in the overall automatic assembly of elec-tronic components and interface with sprockets or other drive - `
means to propel and control the movement o~ the carrier strip 20 assembly.
As shown in Figure 2, in the next stage of the forma-tion of the carrier strip assembly the holder tabs 18 are bent , upward in a vertical direction to be somewhat perpendicula~ to -~ . .
the central portion 20 of the holder 14.
As shown in Figure 3, the neck portion 16 of the holder portion 14 is bent in a somewhat perpendicular direction with re-spect to the main portion 22 of the carrier strip assembly and also perpendicular to the bottom portion 20 of the holder 14.
Consequently, the bottom portion 20 o~ the carrier holder 14 is 30 slightly raised above and parallel to the main portion 22 of the carrier strip. - ;~
43D-627 can.
l In Figure 4 the U-shaped or cup-shaped receptacle of the holder 14 is shown for receipt o~ the round lead wire 24. ~-Reference is made to Figure 5 showing the placement of lead wires 24 within -the holder members 14. The flange members 18 of each s holder 14 are crimped and pressed around the lead wires 24 to se-curely hold them in a precise location with respect to each other -in a transverse orientation ~ith respect to the carrier band or strip 10. The lead wires 24 have a round or circular cross-sec-tion. As the carrier strip 10 moves through the assembly process, ; `~
lO the lead wires 24 are Garried thereon with each lead wire 24 slightly raised above the main portion 22 of the carrier strip 10 as shown in Figure 6. -The free ends 26 of the lead wires are inserted into adie form press to flatten the end of the wire as shown in Figure 15 7 so that the flattened portion 28 is aligned with the longitudi-nal centerline 30 of the lead wire 24. The die is shaped-so that j ~`
the ends 26 of the wires are formed in the offset shape 31 as shown in Figure 8 with one side of the flattened portion extend-ing laterally further beyond the longitudinal centerline 30 of ;
20 the lead wire than the other side of the centerline of the leadwire. This offset flattened portion 31 is placed in alternating sequence with respect to each adjacent wire as shown in Figure 8. ~ ~
The next step which is accomplished within the same die forming ~`
process is to cut slits 32 into the flattened offset portion 31 ;
25 of the ends of the lead wires. The cut ends of the lead wires -- ~
are then formed to establish the clamp arrangement 34 shown in ;
Fiqure 9 with one or more bottom prongs or fingers 36 and one or more top prongs 38. Although a trifurcated clamp is shown in the Figures, it is envisioned that a two-prong or more than three-prong ,-type of clamp could be utilized if desired.
When the clamps 3~ are formed on the ends 26 of the lead wires, the carrier strip assembly 40 in Figure 8 is completed
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234~0 1 and is ready for receipt of electrical component substrates. The carrier strip assembly 40 then moves the lead wires with their integrally formed trifurcated clamp ends 34 in Figure 10 to a position adjacent electrical component substrate 42 which have 5 contact pads 44 for interface with the clamp ends 34 of the lead wires in the carrier assembly 40. To insure the proper alignment between the clamps 34 and the contact pads 44, retractable COl:tlbS
or guide fingers are used to precisely position the lead wires to - provide the necessary alignment with each respective contact pad 10 44. The round configuration of the lead wires enhances the guide combs' ability to precisely align each lead wire clamp. The use -~
of guide combs to align the lead wires eliminates the need for ~ ;~
tie bars on the lead wires.
The clamp 34 in Figure 11 is designed in such a manner 15 that when it is attached to the substrate 42, the centerline 30 of the wire 34 is in alignment with the centerline 48 of the edge thickness 50 of the substrate 42. This is important with respect -~
to the formation of the clamp 34, because the fingers or prongs 36 and 38 of the clamp must be formed in such a manner that they 20 are equally spaced from the centerline 30 of the wire. This, therefore, provides ~he on-center alignment between the wire ~4 and the edge 50 of the substrate in the electrical component.
As previously discussed, the offset die formed shape 31 ~ ~`
of the lead wire end 26 which forms the clamp 34 is offset later-25 ally from the lead wire centerline 30. The direction of the-off set is alternated between successive lead wires 24 as shown in Figure 8. The utilization of this offset arrangement with any given lead spacing and using an even number of leads minimizes the substrate length required. In other words, a component could 30 be made so that the length of its substrate does not exceed the span between its first and last lead wire. The ultimate advan~
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234~0 1 and is ready for receipt of electrical component substrates. The carrier strip assembly 40 then moves the lead wires with their integrally formed trifurcated clamp ends 34 in Figure 10 to a position adjacent electrical component substrate 42 which have 5 contact pads 44 for interface with the clamp ends 34 of the lead wires in the carrier assembly 40. To insure the proper alignment between the clamps 34 and the contact pads 44, retractable COl:tlbS
or guide fingers are used to precisely position the lead wires to - provide the necessary alignment with each respective contact pad 10 44. The round configuration of the lead wires enhances the guide combs' ability to precisely align each lead wire clamp. The use -~
of guide combs to align the lead wires eliminates the need for ~ ;~
tie bars on the lead wires.
The clamp 34 in Figure 11 is designed in such a manner 15 that when it is attached to the substrate 42, the centerline 30 of the wire 34 is in alignment with the centerline 48 of the edge thickness 50 of the substrate 42. This is important with respect -~
to the formation of the clamp 34, because the fingers or prongs 36 and 38 of the clamp must be formed in such a manner that they 20 are equally spaced from the centerline 30 of the wire. This, therefore, provides ~he on-center alignment between the wire ~4 and the edge 50 of the substrate in the electrical component.
As previously discussed, the offset die formed shape 31 ~ ~`
of the lead wire end 26 which forms the clamp 34 is offset later-25 ally from the lead wire centerline 30. The direction of the-off set is alternated between successive lead wires 24 as shown in Figure 8. The utilization of this offset arrangement with any given lead spacing and using an even number of leads minimizes the substrate length required. In other words, a component could 30 be made so that the length of its substrate does not exceed the span between its first and last lead wire. The ultimate advan~
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1 tage of this arrangement is that the number of components that can be mounted in a board is maximized.
The electrical component substrates 42 are then moved by the carrier strip assembly ~0 through the remaining processes 5 in completing the construction of the electrical component. As shown in Figure 10, both ends of each lead wire 24 have the tri- ~ `
furcated clamps 34, so that an electronic component 42 is carried on each end of the lead wires.
As shown in Figures 12 and 13, the entire electrical 10 component substrate package is preferably encapsulated with an ;~
insulating layer or cover 46 which encloses the interface between ;~
the substrate 42 and the clamp ends 34 of the lead wires. The ` ~-elimination of the need for tie bars on the round lead wires er.~
hances the molding process of encapsulating the substrate package.
15 In the case of rectangular cross~sectional lead wires having tie ~ ~
bars any precision alignment of the individual lead wires with ~ :
the openings in the mold is not possible. Consequently, in some ~, instances the movement of the mold onto the substrate may pinch -or damage a nonaligned lead wire. However, the use of round lead 20 wires with no tie bars permits the use of additional aligning means for the individual lead wires prior to positioning of the mold around the substrate. The wires can be-properly aligned and~
will not be damaged by the mold.
In some instances the substrate may be simply coated or 25 dipped as opposed to complete molded encapsulation. After addi-tional processing and curing of the package, the lead wires are severed at the desired length and the main portion 22 of the - `~
carrier strip is removed, leaving the lead pins extending from the electrical component package. These lead pins are then util- ~ ;
30 ized to provide connection between the electrical component pac~
kage and its insertion or connection to some other electrical subassembly or board.
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43D-627 Can. ~ O
1 tage of this arrangement is that the number of components that can be mounted in a board is maximized.
The electrical component substrates 42 are then moved by the carrier strip assembly ~0 through the remaining processes 5 in completing the construction of the electrical component. As shown in Figure 10, both ends of each lead wire 24 have the tri- ~ `
furcated clamps 34, so that an electronic component 42 is carried on each end of the lead wires.
As shown in Figures 12 and 13, the entire electrical 10 component substrate package is preferably encapsulated with an ;~
insulating layer or cover 46 which encloses the interface between ;~
the substrate 42 and the clamp ends 34 of the lead wires. The ` ~-elimination of the need for tie bars on the round lead wires er.~
hances the molding process of encapsulating the substrate package.
15 In the case of rectangular cross~sectional lead wires having tie ~ ~
bars any precision alignment of the individual lead wires with ~ :
the openings in the mold is not possible. Consequently, in some ~, instances the movement of the mold onto the substrate may pinch -or damage a nonaligned lead wire. However, the use of round lead 20 wires with no tie bars permits the use of additional aligning means for the individual lead wires prior to positioning of the mold around the substrate. The wires can be-properly aligned and~
will not be damaged by the mold.
In some instances the substrate may be simply coated or 25 dipped as opposed to complete molded encapsulation. After addi-tional processing and curing of the package, the lead wires are severed at the desired length and the main portion 22 of the - `~
carrier strip is removed, leaving the lead pins extending from the electrical component package. These lead pins are then util- ~ ;
30 ized to provide connection between the electrical component pac~
kage and its insertion or connection to some other electrical subassembly or board.
-8 ..
Claims (7)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An electrical component comprising:
a substrate;
at least one electrical circuit element on said substrate;
at least one contact pad on one edge of said substrate;
a round lead wire with one end connected to said substrate; and a clamp integrally formed in such a manner on said one end of said wire to provide the mechanical and electrical interface between-said contact pad and said wire with the longitudinal centerline of wire being aligned with the centerline of the edge thickness of said substrate when said clamp connects to said substrate.
a substrate;
at least one electrical circuit element on said substrate;
at least one contact pad on one edge of said substrate;
a round lead wire with one end connected to said substrate; and a clamp integrally formed in such a manner on said one end of said wire to provide the mechanical and electrical interface between-said contact pad and said wire with the longitudinal centerline of wire being aligned with the centerline of the edge thickness of said substrate when said clamp connects to said substrate.
2. An electrical component comprising:
a substrate, at least one electrical circuit element on said substrate;
at least one contact pad on one edge of said substrate;
a round lead wire with one end connected to said substrate; and a clamp unitarily formed on said one end of said wire, said one end of said wire being flattened and slitted to establish at least two fingers, said fingers being shaped to form top and bottom fingers of said clamp in such a manner to provide the mechanical and electrical interface between said contact pad and said wire, the longitudinal centerline of the wire being substantially aligned with the centerline of the edge thickness of said substrate when said clamp connects to said substrate.
a substrate, at least one electrical circuit element on said substrate;
at least one contact pad on one edge of said substrate;
a round lead wire with one end connected to said substrate; and a clamp unitarily formed on said one end of said wire, said one end of said wire being flattened and slitted to establish at least two fingers, said fingers being shaped to form top and bottom fingers of said clamp in such a manner to provide the mechanical and electrical interface between said contact pad and said wire, the longitudinal centerline of the wire being substantially aligned with the centerline of the edge thickness of said substrate when said clamp connects to said substrate.
3. Method of forming a carrier strip assembly having a thin band with round wire leads, said method comprising the steps of:
attaching said round wire leads to said thin band, each lead having at least one free end;
flattening said free ends of said leads to form a flattened thin portion with a thickness less than the diameter of said leads;
cutting said flattened thin portions to form a plurality of fingers;
bending said fingers to form an integral clamp on said free end of said leads, at least two of said fingers opposing each other; and moving said clamp into engagement with a component substrate in such a manner that the centerline of said lead wire is aligned with the center of the edge thickness of said component substrate.
attaching said round wire leads to said thin band, each lead having at least one free end;
flattening said free ends of said leads to form a flattened thin portion with a thickness less than the diameter of said leads;
cutting said flattened thin portions to form a plurality of fingers;
bending said fingers to form an integral clamp on said free end of said leads, at least two of said fingers opposing each other; and moving said clamp into engagement with a component substrate in such a manner that the centerline of said lead wire is aligned with the center of the edge thickness of said component substrate.
4. The method defined in claim 3 and additionally comprising the steps of:
placing said clamp ends of said wire on said substrate in approximate position with terminal pads;
precisely aligning said unsupported free ends of said leads on said substrate; and encasing said substrate and said clamp end of said lead in a dielectric material.
placing said clamp ends of said wire on said substrate in approximate position with terminal pads;
precisely aligning said unsupported free ends of said leads on said substrate; and encasing said substrate and said clamp end of said lead in a dielectric material.
5. A method as defined in claim 3 and additionally comprising the step of encapsulating said component substrate and the clamp ends of each of said wires connected to said substrate.
6. A method as defined in claim 5 and additionally comprising the step of cutting said lead wires from said band.
7. An electrical lead assembly comprising:
a flat electrical component substrate having a plurality of spaced electrical contacts on its surface;
a plurality of spaced round wire conductors adapted to be in individual conducting relationship with the electrical contacts on the substrate surface, said round wire conductors lying in the plane of the substrate, substantially centered with respect to its adjacent edge;
the end of each round wire conductor adjacent to the substrate having a unitarily formed clamp, said end of each round wire conductor being flattened and slitted to establish a plurality of flat resilient clamping fingers, said fingers being shaped to form top and bottom fingers of said clamp, said fingers clamping the edge of the substrate; and insulating material encapsulating the substrate and the adjacent ends of the round wire conductors.
a flat electrical component substrate having a plurality of spaced electrical contacts on its surface;
a plurality of spaced round wire conductors adapted to be in individual conducting relationship with the electrical contacts on the substrate surface, said round wire conductors lying in the plane of the substrate, substantially centered with respect to its adjacent edge;
the end of each round wire conductor adjacent to the substrate having a unitarily formed clamp, said end of each round wire conductor being flattened and slitted to establish a plurality of flat resilient clamping fingers, said fingers being shaped to form top and bottom fingers of said clamp, said fingers clamping the edge of the substrate; and insulating material encapsulating the substrate and the adjacent ends of the round wire conductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA385,019A CA1123490A (en) | 1977-12-27 | 1981-09-01 | Electrical component and method of making same |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US864,184 | 1977-12-27 | ||
| US05/864,184 US4196959A (en) | 1977-12-27 | 1977-12-27 | Carrier strip for round lead pins and method for making the same |
| CA313,612A CA1112312A (en) | 1977-12-27 | 1978-10-17 | Carrier strip for round lead pins and method for making same |
| CA385,019A CA1123490A (en) | 1977-12-27 | 1981-09-01 | Electrical component and method of making same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1123490A true CA1123490A (en) | 1982-05-11 |
Family
ID=27165911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA385,019A Expired CA1123490A (en) | 1977-12-27 | 1981-09-01 | Electrical component and method of making same |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1123490A (en) |
-
1981
- 1981-09-01 CA CA385,019A patent/CA1123490A/en not_active Expired
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| Date | Code | Title | Description |
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| MKEX | Expiry |