CA1088282A - Methode de fixation des conducteurs a des pastilles de circuits integres - Google Patents
Methode de fixation des conducteurs a des pastilles de circuits integresInfo
- Publication number
- CA1088282A CA1088282A CA333,383A CA333383A CA1088282A CA 1088282 A CA1088282 A CA 1088282A CA 333383 A CA333383 A CA 333383A CA 1088282 A CA1088282 A CA 1088282A
- Authority
- CA
- Canada
- Prior art keywords
- work station
- conductive filament
- continuous conductive
- predetermined
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA333,383A CA1088282A (fr) | 1975-06-26 | 1979-08-08 | Methode de fixation des conducteurs a des pastilles de circuits integres |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59057275A | 1975-06-26 | 1975-06-26 | |
US667,541 | 1976-03-16 | ||
US05/667,541 US4140265A (en) | 1975-06-26 | 1976-03-16 | Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element |
CA255,403A CA1088281A (fr) | 1975-06-26 | 1976-06-22 | Methode de fixation des conducteurs a des pastilles de circuits integres |
CA333,383A CA1088282A (fr) | 1975-06-26 | 1979-08-08 | Methode de fixation des conducteurs a des pastilles de circuits integres |
US590,572 | 1990-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1088282A true CA1088282A (fr) | 1980-10-28 |
Family
ID=27425923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA333,383A Expired CA1088282A (fr) | 1975-06-26 | 1979-08-08 | Methode de fixation des conducteurs a des pastilles de circuits integres |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA1088282A (fr) |
-
1979
- 1979-08-08 CA CA333,383A patent/CA1088282A/fr not_active Expired
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4821945A (en) | Single lead automatic clamping and bonding system | |
US4166562A (en) | Assembly system for microcomponent devices such as semiconductor devices | |
US3724068A (en) | Semiconductor chip packaging apparatus and method | |
US4140265A (en) | Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element | |
US5145099A (en) | Method for combining die attach and lead bond in the assembly of a semiconductor package | |
US4300715A (en) | Mechanical pulse reflow bonding process | |
US5979739A (en) | Semiconductor die bonding apparatus having multiple bonding system | |
US5890644A (en) | Apparatus and method of clamping semiconductor devices using sliding finger supports | |
KR101949334B1 (ko) | 반도체 패키지의 클립 본딩 장치 및 클립픽커 | |
US5062565A (en) | Method for combining die attach and wirebond in the assembly of a semiconductor package | |
KR101138218B1 (ko) | 이중 트랙 전달 메커니즘을 구비하는 접합 기계 | |
KR20030038342A (ko) | 하이브리드 칩본딩 머신에 사용되는 칩 이송판을 교환하기위한 메카니즘 | |
CA1088282A (fr) | Methode de fixation des conducteurs a des pastilles de circuits integres | |
US7259088B2 (en) | Apparatus for singulating and bonding semiconductor chips, and method for the same | |
CA1088281A (fr) | Methode de fixation des conducteurs a des pastilles de circuits integres | |
US3692225A (en) | Semiconductor device fabrication apparatus | |
US7431192B2 (en) | Wire bonding apparatus | |
EP0145216B1 (fr) | Machine et méthode pour la fabrication de harnais de câbles et peigne de câblage amélioré pour cela | |
US3918144A (en) | Bonding equipment and method of bonding | |
CN112805817A (zh) | 管芯附接系统以及将管芯附接到基板的方法 | |
US4597714A (en) | Robot gripper for integrated circuit leadframes | |
US5871610A (en) | Apparatus for automatically mounting a plurality of semiconductor chips on a lead frame | |
US7692440B2 (en) | Handler for semiconductor singulation and method therefor | |
EP1586111B1 (fr) | Procede et appareil de microcablage | |
US5951283A (en) | Substrate transporting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |