CA1059744A - Paraffin removal - Google Patents

Abstract

PARAFFIN REMOVAL
Abstract of the Disclosure A process of preventing, inhibiting and/or removing paraffin and similar deposits from petroleum systems such as oil wells, pipeline, etc. which comprises treating said systems with hot water containing a chemical which is an anionic, cationic, non-ionic or ampholytic surfactant, or a mixture thereof which in combination with hot water is capable of removing paraffin and similar deposits so as to improve the system's productivity and/or capacity.

Description

3S9~44 In many oil wells, deposits of paraffin, wax, asphaltic and bituminous organic solids and similar materials accumulate in objectionable quantities on the face of the pro-ducing formation, on the screen or liner, or in the pump, the casing or the tubing of the well. Such deposits operate to decrease materially the productivity of the wells in which they occur. Similarly, deposits of the same character are found in some oil flow lines and oil pipelines, where they effectively reduce the capacity of the pipes, sometimes to the point where little or no fluid can be passed through such conduits in the normal manner of operation.
The purpose of removing such deposits is obvious.

In some areas, wells decline in productivity at a more or less -- 1 -- ~
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` ~L0597~4 rapid rate, because of deposition of such deposits on the face o the producing formation. In some cases, the decline is sufficiently rapid that the wells must be serviced in some ~anner or other at a frequency ranging from several days to several weeks. In some instances, the deposition is so slow that servicing at long intervals is sufficient to maintain the well at a satisfactory level of productivity. The same is txue of the various conduits through which the oil travels from the well to the refinery; such as for example through tank batteries, tanX farms~ pipes, etc.; and perlodic servicing of such elements is also required. The capacity of a conduit of circular cross-section is reduced greatly by suCh deposits, usually well beyond the reduc~ion expected from the ratio of effective cross-sectional areas of the - conduit and the fouled conduit. Where organic deposits of the present type occur on ormation walls, well productivity ~ay fall substantially to zeroJ especially in lo~-pressure .
ieldsO Pipe capacities are frequently reduçed to a small :
fraction of their capacities when clean. Ultimately such pipes may be found completely clogg~d by such deposits. In the case- of pipelines, for exampleJ the operator may find himself burdened with the cost of a 6" or 8" line, yet benefiting from a capacity equal to th~ o a 3" or 4" line.
Tank capacities are also reduced by such deposits.
The process which constitutes the present invention consists in subjecting such clogging organic deposits of wax~

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~araff~n~ asp~altlc or bituminous s~lbstances and the like, to the action of hot a~ueous solution of a chemical reagent o the character described below) to the end that such deposits are removed from the surfaces to whicll they were originally adherent. B~ means of the process, t'ne productivit~
;of wells is restored as is the capacity ol flo~ linesg pipe-lines J traps9 tanks, pumps, and other equipment, thr~gh which such oil travels from formation to refinery.
;It will be o~vious that, if the first minute deposit of such organic materials is subjected to hot aqueous solution, and if such application is practised continuously or periodically with sufficient frequency, the operation is a preventive or inhibitive process rather than a corrective process. In addition, it should be noted that our process has a more real claim to acting as a preventive, in that suxfaces effectively cleaned by its application tend to resist x~newed deposition of such materials, and to xemain clean and operative for Ionger periods than if the process had not been appliea. m erefore, the present pro~ess is both a preventive and a corrective oneO It may obviously be applied in eithex sense, and achieve the same ultimate goal, the improvement of efficiency of operation of wells and equipment. Thus, when we have used the word "removing," it should be clearly undex-stood to include the prevention of organic deposits of the present kind.
Sometimes the deposit is located at some higher ox l~wer level in the tubing. For exampleJ passage of the well , ~sg74~

fiuids past a point in the well which lies opposite a water sand may produce a deposit at that point, beca~se suc'n a ~7ater sand co~only represents a point of cooling.
In some instances~ it is possible to introduce the hot solution into the tubing at the well head by unsc~ewing ; the stuffing box. (Usually the tubing does not stand entirely full of fluid because of slight leakage past the pump.~ ~ere the hot solution is introduced, it will settle relatively slowly do~Jn through the oil in the tubing until it reaches the deposit. After introducing ~he hot solution in any desirable mannsr, it may be allowed to stand in the tubing for any desired period of time before the well is replaced on production. In some instances it may be advisable to pump the well intermittently for very short periods of time, so as to pick up the hot solution and lift it above the deposit, letting it settle down past the deposit again during t~e next idle period. However5 one of the advantageous actors of our process is that it may not require shutting the well d~wn if one so desires.
Where the organic deposits in question occur in flow lines, the hot solution may be introduced and allowed to "soak" -the deposit. Thereafter, normal production may be resumed; and the dislodged deposit flushed from the line by the flow of well ~luids. In other instances, gas pressure is put on the soaXea line~ and the deposit flushed out in that manner. Sometimes, introduction of hot aqueous solution is effected intermittently 1~5974~
a~d the deposit progressively removed. Or the hot solution may be introduced in a continuous fashion, if desired.
In the case of pipelines, the diameter of the pipe and the length of the line maXe it necessary to apply the hot solution in the most economical fashion possible.
Soa~cing of the line, i.e., merely introducing the hot solu-; ~ion into it and allowing the line to lie idle for a period o~ tirne, is practicable~ Sometimes we prefer to prepare a xelatively large volume of hot aqueous solution in a tank at some convenient location at one end o the pipeline, and - interrupt the pumping of oil only long enough to switch to the solution tank and pump the volume of hot solution into the line. Then the pumping of oil is resumed, and the liquid ~ylinder of hot solution is thereby moved across the face of the deposit in the line, over the whole length of line. I~
desired, the dixection o pumping may be reversed when such liquid cylinder of hot solution reaches the opposite end of the line; and a second, or even a third pass or more may be made, of the hot solution over the deposit in the line.
Where deposits have been allowed to accumulate over a considerable period of timeg they may be of such proportions that application of hok solution would produce sloughing of su~ficien~ of the deposit to plug the conduit further d~n-stream, by forming a bridge with undislodged deposit at that point~ In such instances, we prefer to proceed more cautiousl~, introducing successive small portions of hot solution and 1~597~4 cces5fuily dislodging portions oi the deposit which are sufficiently small to pass freely through ~he limited freeway in the conduit.
Merely introducing our hot solution into an area containing a deposit, so that it contacts the deposit, is sometimes sufficient to cause the removai of the latter.
So~etimes agitation of the hot solution at the face of the deposit greatly accelerates removal of the latter. Any suitable agitation means may be employed in such instances.
Application of our hot solution upstream in any system, as, for example, into a well, results in an attack on any such organic deposits further downstream. For exampleJ wax or similar deposits, in traps and tanks, are freed and usually flowed out of such vessels in subsequent operation of the system. In the case of tan~s we have found that waxy tank bottoms may be removed by introduciny the hot solution into the tank containing such deposits and allowing the whole to soa} for any desired-period of time. ~ne depGsit is thereby made more lree and more readily removable.
Removal of deposits of organic matter ~rom oil pro~uction equipment, such as traps and tanks and the like, is o~viously contemplated by this process. -Because t~ere are so many conditions under which such organic deposits ~ay occurJ it is difficult to ~i~e a~y pre- I
~erred procedure for applying our process. The foregoing i;
descriptions have covered instances where such deposits t~ere to be remo~ed irom the face of the formatlon, the well tuhing ' ~6-~L~35974'~
or casing, flot~ lines, pipe]ines and tank batterie~. They ma~ be ta]~en as preferred metbods of oporating the process or the respoctive conditions outlined. All of them are exemplary only. ~,1~ process may be varied as condi~ions ; may require. In all cases, the process consists broadly in the application of the pro^ess to the organic deposits ~escribed ~bove.
In general3 the process is carried out by preparing a solution of paraffin chemical, heating the solution to an elevated temperature, an~ treating the system with the hot solution of paraffin chemical.
The temperature of the solution should he sufficient to enhance the effectiveness of the paraf~in chemical as compared to the effectiveness of the same solution at ambient temperature. In general, temperatures in excess of about 100 F. such as from abou~ 100 to steam temperature, for example from about 120 to 212 ~, but preferably from about 150 to 200 F. are employed.
The concentration o~ the paraf~in cheMical will vaxy widely depending on various factors, such as for example, the ~emperature of the solution, the severity of the paxafrin p~oblem, the particular paraffin chemical employed, the location of the paraffin problem, etc. In general a concen-tration of at least about 0.1% by ~eight, suc'n as from about 0.5 to 10%, for example from about 0.75 to 5% but preferaoly from about 1 to 3% in the hot aqueous solution.

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~ wide variety of paraffin chemicals can be employed.
In general, these chemicals are surfactants ~hich are capable of removing paraffin. Examples of surfactants ~hieh can be foxmul~ted into paraffins chemical nay include t'ne following typ~s.
I . Ani onic tA) Carbo~ylic acids:
(1) Carboxyl joined directly to the hydro~hobic group ~subclassification on basis of the hydrophobic ~ I D group~, e.g. fatty acids, soaps, resin soaps, etc.
; ~2~ Carbo~yl joined t'nrough an intermediate lin~age.
(a) Amide group as intermediate link~
(b) Ester group as intermediate link.
(c) Sulfoamide group as intermediate link.
td~ Miscellaneous intermediate linXs, ether, SO S
(B~ Sulfuric esters (sulfates):
(1) Sulfate ~oined directly to hydrophobic group.
(a~ Hydrophobic group contains no other polar structures (sulfated alcohol and sulfated olefin type).
- (b) Sulfuric esters with hydrophobic groups containing okher polar structures (sulfated oil type).

(2) Sulfate group joined through intermediate lin~sage.
(a) Ester li~age (Artic Syntex ~4 type).
(b) Amide linkage (Xynomine type).

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(c~ Ether linkage (Triton 770 ~yp~).
(d) Miscellaneous lin~ages (e.g., o~yal~ylimida7-ole sulfates).
(C) Alkane sulIonic acids:
(1) Sul~onic group directly linked (a) Hydroohobic group bears other polar substituents ("highly sulfated oil" typ~. Chloro, hydro;~y, acetoxy, and olefin sulfonic a~ids (Nytron~type~
~b~ Unsubstituted alkane sulfonic acids (MP 189 type;
¦C also cetan~ sulfo acid type).
tc~ Miscellaneous sul~onic acids of uncertain structure, e.g., oxidation products o~ sulfurized ~le~ins, sulronated rosin~ etc.
(2) Sul~onic groups joined through intermediate linkage.
(a) Estex linkage.
tl) RC00- X- S03H (Igepon AP type).
(2) ROOC - X~ S03H (Aerosol and sulfoacetate type).
(b~ Amide linkage.
RCON~ -X -S03H ~Igepon T type).
(2) ~NHOC- X -S03H (sulfosuccinamide type).
(c) Ether linkage (Triton 7aO type).
ta) Miscellaneous linkages and two or more linkages.

_9_ 11D59~44 (D) ~lXyl aror,latic sulfonic acids:
(1) Hydropnobic group joined directly to sulfonated aromatic nucleus (su~classes on basis of nature of hydrophobic group. Alkyl phenols, terpene, and rosin-aromatic condensates, alkyl aromatic XetonesJ
etc.).
t2) Hydrophobic group joined to sulfonated aromatic nucleus through an intermediate linkage.
(a) Ester linkage (sulfo~hthalates, sulfobenzoates).
(b) Amide and imide lin~ages.
(1) R- CO~H - ArS03H type.
(2) Sulfob~nzamide type.
(c) Ether linkage (alkyl phenyl ether type).
(d) Heterocyclic lin~age (Ultravon type, etc.).
te) Miscellaneous and two or more links.
(E~ Miscellaneous anionic hydrophillic groups:
(1) Phosphages and phosphonic acids.
(2) Persulfates, thiosulfatesJ etc~

(3) Sulfonamides.

(4) - Sulfamic acids, etcO

II. Cationic (A) Amine salts (primary, secondary, and tertiary amines) tl) Amino group joined directly to hydrophobic group.
ta) Aliphatic and aromatic amino groups.
(b) Amino group is part of a heterocycle _ I o--l~S97~
(2) Amino group joined through an intermediate link.
(a) Es~er link.
tb) Amide linX.
(c) Ether link.
(d) Miscellaneous links.
(B) ~uaternary ammonium compounds:
(1~ Nitragen joined directly to hydrophilic group.
(2) ~itrogen joined through an intermed'ate link.
(a~ Ester link.
(b) Amide link.
Ether link.
(d) Miscellaneous links.
r~? O~her nitrogenous bases:
(1) Non-quaternary bases tclassified as guanidine, thiuronium salts, etc.
~2~ Quaternary bases.
(D) ~on-nitrogenous bases:
(l? Phosphonium compounds.
(2) Sulfonium compounds, e~c. ,~

III. Non-ionic (A) Ether linkage to solubilizing groups.
~B) Ester linkage.
(C) Amide linkage.
(D) Miscellaneous linkages.
~E) Multiple linkages.

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IV. ~mpholytic (A) Amino and carboxy:
(1) Non-quaternary.
(2) Quaternary.
tB) ~mino and sulfuric ester:
tl) Non-quaternary.
(2) Quaternary.
IC) Amine and alkane sulfonic acid.
tD) Amine and aromatic sulfonic acid.
(E) Miscellaneous combinations of basic and acidic groups.

The preferred surfactants employed as paraffin chemicals contain a non-ionic surfactant, preferably an ~xyalkylate, In general/ the preferred compounds are oxyalkylated sur~actants of the general ~ormula æ toR)noH m wherein z is the oxyalkylatable material, R is the radical derived from the alkylene oxide which can be, for example, ethylene, propylene~ butylene, epichlorohydrin and tlle like, 2 o n iS a number determined by the moles of alkylene oxide reacfea, for example 1 to 2000 or more and m is a ~hole number determined by the number of reactive oxyalkylatable groups.
Where only one group i~ oxyalkylatable as in the case of a monofunctional phenol or alcohol R'OH, then m~ here Z is water, or a glycol, m=2. ~ere Z ~s glyceroI, n=~, etc.

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In certain cases, it is advantageous to react alkylene oxides with the oxyalkylatable material in a random fashion so as to form a random copolymer on the oxyalkylene chain, i.e., the (OR)n ~ chain such as AABAAABBABABBABBA. In addition, the alkylene oxides can be reacted in an alternate fashion to form block copolymers on the chain, for example ~ '; ' ' BBBAAABBBAAA~BBBB
.
or BBBBAAACCC~AAABBBB where A is the unit derived from one alkylene oxide, fox example ethylene oxide, and B is the unit derived from a second alky~ene oxide, for example propylene oxide, and C is the unit derived from a third alkylene oxide~ for example, butylene oxide, etc.
Ihusl these compounds include terpolymers or hig~er cvpol~mers polymerized ra~domly or in a blockwise fashion - ~ or many variations of sequential additions, ThUSJ ~OR)n in the above formula can be written AaBbCc or any variation thereof, wherein a, b and c are O or a number provided that at least.one of them is greater than O.

~0597~4 RE~ES~I~TT?~TIVE EY~1PI.ES OF Z
No. ~

. O
1 ............ Il RC -O -2 ............ Rn ~ O -- 3 ~........... R- O -4 ............ R- S -: 5 ... ,-~-M
R~ C- N -.

6 ... ~....... .....R- C -~

7 ~D~ H
R- ~ -....... 0.,- ~

~; : 9 .......... . .....Phenol-aldehyde resins.
l0 ......... . ....- O - (Ex: Alkylene oxide. block polyMers) R R

~ l o -~ x ~O _ - 11 .. I .

1l 0--9--S~ CH2--S--J etc.

.' . O

~597~

o 12 .........

13 ............ ~RP04H -14 ............. ~.RPO~=

; 15 .............. P04- H
i 16 .. -.-Rn ~ S02N -17 .. ~...... ~ ~ S02N=

O H
': 11 1 /
'~ ~ 'D ~ _ ~T -- ~ --.
....... Polyol-derived (Ex: glycerol, glucose, pentaaxithrytol).
20 ......... .Anhydrohexitan or anhydrohexide derived (Spans~
and Tween~ .
21 .. ~ Polycarboxylic derived.

22 .. ....-~IHC~2 ~n amine Examples of oxyalkyl2table materials derived fro~ the above radicals are legion and theseg as well as other oxy-alkylatable materials, are kno~n to the art. ~ good source of such oxyalkylatable materialsg as wel~ as others, can be found :lOS9744 in "Surface ~ctive ~gents and Detergents," vols. 1 and 2, by Schwartz et al~, Interscience Publishers (vol. 1, 1949, vol. 2, 1958) J and the patents and references referred to therein.
An e~ample of a formulation containing an o~yall~ylaLed material is descrlbed in U.S.P. 3,4~1,870 which contains the ~: following composition claims.
1. A composition of matter for inhibiting the forming of in and removing from oil wells and pipelines deposits of paraffin and paraffin-like solids consisting essentially of:
~- . (1) an alkanol selected from the group consisting of butanol, isobutanolJ sec-butanol~ amyl alcohol and isomers thereof, hexyl alcohol and isomers thereof, and cyclohexyl alcohol7 said alkanol being oxyethylat~dwith 1.5-3.5 moles of ethylene oxide~
(2) an oxyethylated substituted phenolic compound having the formula (0 Et~nOM
~y , ~: ~ R1_2 :
where n is an integex of 1-12, and R is a hydrocarbon group having 2-12 carbons atoms, the weight ratioof (13 to (2?

being from 1:5 to 6:1, (3) water in the amount of 0.5 to 20 times the weight of the sum of (1) and (2), and (43 an alcohol seleated from the group consisting o -lG-105974~
methanol, ethanolJ propanol, isopropanol, but and ethylene glycolf said alcohol being present in an amount suf~icient to be a pour point depressan~.
2. The composition OL claim 1 wherein (1) is an oxyalkylaksd ~utanol.
3. ~ne composition of claim 1 wherein (1) is an oxyal~lated butanol and (2) is an oxyethylated alkylphenol.
The composition of claim 1 wherein (1) is an oxy-alkylated butanol and ~2) is an oxyethylated alkylp~enol haviny 4-6 units of ethylene oxide~

5~ The composition of claim 1 wherein tl) is an oxy-alkylated butanol and (2) is an oxyethylated alkylphenol having 3-12 units of ethylen~ oxide.

6. The composition of claim 1 wherein (1) i5 n butyl - (OCH2CH2)20 and (2) is sec-butyl ~ ~0CH2cH2)40H
~he weight rakio of (1~ to (2~ being 2.5:19 and (3) is present in the amount or 1-1/7 times the weight of the sum of (1) and (2), and (~) is msthanol in the amount of times the weight o~ the sum of (1) and (2).
~ he following examples are presented for purposes of illustration and not of limitation.

Compo~lnd A - Sulfated fatty alsohol ethoxylake Trisodium phosphake Isopropanol I

~5~7~ , Compound B - Alkyl aryl sul~onate Aromatic Hydrocarbon Isopropanol Compound C - Sulfated phenol ethoxylate Trisodium ,~hosphate Eutyl carbitol Sul~ated fatty alcohol ethoxylate Amine ethoxylate Compound D - Ethox~lated phenol formaldehyde resin ; Aromatic H~drocarbon Compound E - Oxyalkylated phenol-amine-~ormaldehyde condensate Ethoxylated phenol-formaldehyde resin Aromatic solvent ~- ` Isopropanol ~ompound F - Oxyalkylated alkylphenol - Butyl carbitol Ethyl cellosolve ~ Exam~lè 1 ; 20 A flowing well having a paraffin problem in the ~lowline was treated by injecting into the flowline at the well , head, a mixture of 10 gallons of Compound A and 10 barrels ~f lO0~F. water. The well was shut in for one hour then returned tQ production. Parafin was removed as evidenced by a redu~-t1on in flowline pressuxe.

, Example 2 ~ flowing well having a paraffin problem in the tubing and flowline was treated by injecting into the tubing, a mixture of 10 gallons Compound B and 10 barrels of 200F. waker. m e well was immediately returned to production. To check for paraffin removal, a wireline cutter was run down the tubing and encountered no paraffin.

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~L1059744 Example 3 A gas lift well having a paraffin pro~lem in the tubing was treated by injecting into the tubing, a mixture ~f l0 gallons Compound C and 10 barrels of 50F. water.
~ne well was ret~rn~d to production. A wireline cutter run down ~he tubing found para~fin t~en production decreases again indicated a paraffin buildup. (Cold Treatment~
is well was then treated by injecting into the tubing a mixture of lO gallons Compound C and 10 barrels o~ 200~F. water. A wire line cutter run down the tubing encountered no paraffin. (Hot Treatment) Exam~le 4 A pumping well having a paraffin problem in the flowline was treated by injecting into the flowline at the well'head, a mixture of 20 gallons ~ornpound D and 20 barr~ls of 150F. water. Flow line pressure decrease and produc~ion increase indicated good paraffin removal.

Example 5 A gas lift w~ll produced 68 BOD through a 10,000 ft.
20 flowline. A mixture of 10 gallons CL~m~ound E and l0 barrels ~, 180F, water was pumped through the flowline. ~JO days later the same treatment was repeated. Production increased to 10~ ~OD.

Exam~le 6 , A gas lift well having paraffin buildup problems in -19- !

59~7~4 both ~he tubing and flowline was treated by in~ecting a mi~ture o 10 gallons Compound F and 10 barrels 165~F.
water into the flowline and then an equal chemical/hot water mixture into the tu~ing. The well returned ~o pro-~uction and showed a 250 psi drop in 1O~line pressure.

Example 7 A flowline thought to be restricted by paraffin ~uildup was opened at a point about 2500 ft. from the well headO mere was less than 1/2 inch opening in the 2 inch lin~. m e flowline was treated by pumping into it at the well head~ a mixture o~ 20 gallons Compound C and 20 barrels 200F. water. Ihe ne~t dayJ the line was opened at the same ,inspsction point and no paraffin was found.

, Exam~le 8 A well wi~h a history of paraffin buildup was treated with a mixture of 10 gallons Compound C'and 10 barrels 165F.
water and the well op~ned to the pit. A full 2 inch s~ream o ~lushy paraffin flowed out for 15 minutes.

~ he ~lowline o~ a well was completely plugged off with paraf~in. ,Attempts to pump 300F~ oil through the line were unsuccessful. One ~xum of Compound E pumped into line and allowed to soak under pressure for 24 hours with no change. Three barrels fluid drained rom flowline at well ~20-~059744 head and replaced witl~ three barrels of a 5% solution of Compound E in 200~F. water. Gradual reduction of p.ressure showed some action. Further chemical/hot water mi~ture pumped into tlle line. Within a couple of hours~ a trickle of fluid started coming out the end of the line. ~Jithin 24 hours, the line was clean~
As is quite evident, other s~rfactants which are use~ul as paraffin chemicals are known or will be developed which are useful in our invention. It is~ therefore, not only impossible to aktempt a comprehensive catalogue of such compositions, but to attempt to describe the invention in its broader aspects in terms of speci.fic chemical names of its components used would be too voluminous and unneces- :
sary since one skilled in the art could by following the : descriptioD of ~he invention herein select a useful surfactant useul as a paraffin chemical. m is invention lies in the .
use of suitable surfactants in hot aqueous systems in removing paraffin type deposits and their individual compo-sitions axe important only in the sense that their properties can a~fect this function. To precisely define each specific u~eful surfactant in light of the present disclosure would merely call for chemical Xnowledge within the skill of the .
art in a manner analogous to a mechanical engineer who prescribes in the construction of a machine the proper materials and the proper dimensions thereof. ~rom the ~L059~74~ ` -`

descxiption in this specification and with the kn~ledge of a chemist, one will know or deduce with confidence the applicability or speci~ic suxfactants suitable for ~his invention by applying them in the process set forth herein.
In anaIogy to the case of a machine, wherein the use of certain materials of construction or dimensions of parts wou~d lead to no practical useful result, various materials will be rejected as inapplicable where o~hers would be operative. We can obviously assume ~ha~ no one will wish ~o use a useless surfactant nor will be misled because it is possible to misapply the teachings of the present disclosure to do so. Thus, any surfactant in a hot aqueous sys~em ~hat can perform the function staked herein can be employed.

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Claims (6)

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1. A process of preventing, inhibiting and/or re-moving paraffin and similar deposits from a petroleum system such as oil wells and pipelines, which comprises treating said system with a mixture of 1) water at a temperature in excess of 100° F and 2) a surfactant which is selected from the group consisting of a) a sulfated fatty alcohol ethoxylate and the mixture includes trisodium phosphate and isopropanol;
b) an alkyl aryl sulfonate and the mixture includes an aromatic hydrocarbon and isopropanol;
c) a sulfated phenol ethoxylate, a sulfated fatty alcohol ethoxylate and an amine ethoxylate and the mixture includes trisodium phosphate and butyl carbitol;
d) an ethoxylated phenol formaldenhyde resin and the mixture includes an aromatic hydrocarbon;
e) an oxyalkylated phenol-amine-formaldehyde con-densate and an ethoxylated phenol formaldehyde resin and the mixture includes an aromatic solvent and isopropanol.

2. The process of claim 1 wherein the surfactant is a sulfated fatty alcohol ethoxylate and the mixture includes trisodium phosphate and isopropanol.

3. The process of claim 1 wherein the surfactant is an alkyl aryl sulfonate and the mixture includes an aromatic hydrocarbon and isopropanol.

4. The process of claim 1 wherein the surfactant is a sulfated phenol ethoxylate, sulfated fatty alcohol ethoxylate and amine ethoxylate and the mixture includes trisodium phosphate and butyl Carbitol.

5. The process of claim 1 wherein the surfactant is an ethoxylated phenol formaldehyde resin and the mixture includes an aromatic hydrocarbon.

6. The process of claim 1 wherein the surfactant is an oxyalkylated phenol-amine-formaldehyde condensate and an ethoxylated phenol-formaldehyde resin and the mixture includes an aromatic solvent and isopropanol.