BRPI0909860A2 - dispositivo de resfriamento de um gabinete de computador e instalação de informática - Google Patents

dispositivo de resfriamento de um gabinete de computador e instalação de informática

Info

Publication number
BRPI0909860A2
BRPI0909860A2 BRPI0909860A BRPI0909860A BRPI0909860A2 BR PI0909860 A2 BRPI0909860 A2 BR PI0909860A2 BR PI0909860 A BRPI0909860 A BR PI0909860A BR PI0909860 A BRPI0909860 A BR PI0909860A BR PI0909860 A2 BRPI0909860 A2 BR PI0909860A2
Authority
BR
Brazil
Prior art keywords
computer
cooling device
installation
case
computer case
Prior art date
Application number
BRPI0909860A
Other languages
English (en)
Inventor
Audrey Julienroux
Lionel Coutancier
Thierry Fromont
Original Assignee
Bull Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull Sas filed Critical Bull Sas
Publication of BRPI0909860A2 publication Critical patent/BRPI0909860A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BRPI0909860A 2008-06-02 2009-05-28 dispositivo de resfriamento de um gabinete de computador e instalação de informática BRPI0909860A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0803013A FR2931961B1 (fr) 2008-06-02 2008-06-02 Dispositif de refroidissement d'une baie informatique et installation informatique comportant un tel dispositif
PCT/FR2009/050998 WO2009156647A1 (fr) 2008-06-02 2009-05-28 Dispositif de refroidissement d'une baie informatique et installation informatique comportant un tel dispositif

Publications (1)

Publication Number Publication Date
BRPI0909860A2 true BRPI0909860A2 (pt) 2015-10-06

Family

ID=40130931

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0909860A BRPI0909860A2 (pt) 2008-06-02 2009-05-28 dispositivo de resfriamento de um gabinete de computador e instalação de informática

Country Status (6)

Country Link
US (2) US8587941B2 (pt)
EP (1) EP2294498B1 (pt)
JP (1) JP5488934B2 (pt)
BR (1) BRPI0909860A2 (pt)
FR (1) FR2931961B1 (pt)
WO (1) WO2009156647A1 (pt)

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* Cited by examiner, † Cited by third party
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US20090310302A1 (en) * 2008-06-17 2009-12-17 Enermax Technology Corporation Heat-dissipating structure having an external fan
SG10201507946QA (en) 2010-06-23 2015-10-29 Inertech Ip Llc Space-saving high-density modular data center and an energy-efficient cooling system
DE102010051962B4 (de) * 2010-11-19 2017-03-02 Fujitsu Ltd. Kühlanordnung und Arbeitsverfahren für eine Lüftersteuerung
KR20140015416A (ko) 2011-03-02 2014-02-06 이너테크 아이피 엘엘씨 모듈식 it 랙 냉각 어셈블리들 및 어셈블리 방법들
WO2014051607A1 (en) * 2012-09-28 2014-04-03 Hewlett-Packard Development Company, L.P. Plenums for removable modules
GB2507958B (en) * 2012-11-08 2017-04-05 Cybula Ltd Computing devices that both intercommunicate and receive power by wireless methods
CN104423457A (zh) * 2013-09-11 2015-03-18 鸿富锦精密电子(天津)有限公司 电子装置及其固定架
JP5986064B2 (ja) * 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US20170311485A1 (en) * 2014-09-26 2017-10-26 Nec Corporation Cooling device and method of manufacturing the same
WO2016057854A1 (en) 2014-10-08 2016-04-14 Inertech Ip Llc Systems and methods for cooling electrical equipment
WO2016114791A1 (en) 2015-01-16 2016-07-21 Hewlett Packard Enterprise Development Lp Plenum to deliver cool air and route multiple cables
US9832912B2 (en) 2015-05-07 2017-11-28 Dhk Storage, Llc Computer server heat regulation utilizing integrated precision air flow
US10736239B2 (en) 2015-09-22 2020-08-04 Z-Impact, Inc. High performance computing rack and storage system with forced cooling
JP6034465B1 (ja) * 2015-10-15 2016-11-30 Ｎｅｃプラットフォームズ株式会社 冷却装置及び冷却システム
EP3430327A1 (en) 2016-03-16 2019-01-23 Inertech IP LLC System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
WO2018053200A1 (en) 2016-09-14 2018-03-22 Switch, Ltd. Ventilation and air flow control
CN111365940B (zh) * 2020-03-10 2022-01-04 淮北市华明工业变频设备有限公司 一种水冷散热器用固定装置及其使用方法
CN111587021B (zh) * 2020-05-09 2021-07-30 骏沣联锐商务咨询(深圳)有限公司 电力营销与配电业务数据同步设备的底座
US11729940B2 (en) * 2021-11-02 2023-08-15 Oracle International Corporation Unified control of cooling in computers
CN217509347U (zh) * 2022-03-16 2022-09-27 广运机械工程股份有限公司 热交换系统
TWI846153B (zh) * 2022-11-18 2024-06-21 英業達股份有限公司 機櫃系統與流管整理組件

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DE19804901C2 (de) * 1998-02-07 2003-04-17 Rittal Gmbh & Co Kg Schaltschrank
EP1266548B2 (en) * 2000-03-21 2015-07-29 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6579168B1 (en) * 2002-01-03 2003-06-17 Marconi Communications, Inc. Back-up DC vent system for equipment enclosure
US6775137B2 (en) * 2002-11-25 2004-08-10 International Business Machines Corporation Method and apparatus for combined air and liquid cooling of stacked electronics components
US7500911B2 (en) * 2002-11-25 2009-03-10 American Power Conversion Corporation Exhaust air removal system
US7752858B2 (en) * 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
US6819563B1 (en) * 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US20050061013A1 (en) * 2003-09-10 2005-03-24 Bond Richard C. Method and apparatus for cooling devices that in use generate unwanted heat
GB2419038B (en) * 2004-09-23 2010-03-31 Trox Cooling methods and apparatus
DE102005005296B3 (de) * 2005-02-04 2006-05-18 Knürr AG Anordnung zur Kühlung von elektronischen Moduleinheiten in Geräte- und Netzwerkschränken
US7385810B2 (en) * 2005-04-18 2008-06-10 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
US7862410B2 (en) * 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
US7477514B2 (en) * 2007-05-04 2009-01-13 International Business Machines Corporation Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US7963118B2 (en) * 2007-09-25 2011-06-21 International Business Machines Corporation Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack
EP2053911B1 (en) * 2007-10-22 2013-05-15 Sanyo Electric Co., Ltd. Electronic device cooling system
US7950244B2 (en) * 2007-11-14 2011-05-31 International Business Machines Corporation Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger
US8453713B2 (en) * 2008-01-27 2013-06-04 International Business Machines Corporation System and method for implementing a front door air to water heat exchanger
US7630795B2 (en) * 2008-02-15 2009-12-08 International Business Machines Corporation Method and air-cooling unit with dynamic airflow and heat removal adjustability
US20090225514A1 (en) * 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US7660116B2 (en) * 2008-04-21 2010-02-09 International Business Machines Corporation Rack with integrated rear-door heat exchanger
US20090260384A1 (en) * 2008-04-21 2009-10-22 International Business Machines Corporation Coolant Distribution System For A Rack Having A Rear-Door Heat Exchanger
JP2010041007A (ja) * 2008-08-08 2010-02-18 Hitachi Information & Communication Engineering Ltd 冷却ユニット、電子装置ラック、冷却システム及びその構築方法
US20100096105A1 (en) * 2008-10-20 2010-04-22 Vette Corp. Rear door heat exchanger transition frame
US8141621B2 (en) * 2008-12-11 2012-03-27 International Business Machines Corporation Apparatus and method for providing in situ cooling of computer data centers during service calls
US8120916B2 (en) * 2009-09-17 2012-02-21 International Business Machines Corporation Facilitating cooling of an electronics rack employing water vapor compression system

Also Published As

Publication number Publication date
JP5488934B2 (ja) 2014-05-14
US9066452B2 (en) 2015-06-23
FR2931961A1 (fr) 2009-12-04
US8587941B2 (en) 2013-11-19
FR2931961B1 (fr) 2010-06-11
JP2011524085A (ja) 2011-08-25
US20140043752A1 (en) 2014-02-13
EP2294498B1 (fr) 2015-07-08
EP2294498A1 (fr) 2011-03-16
US20110103009A1 (en) 2011-05-05
WO2009156647A1 (fr) 2009-12-30

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time