BRPI0703309A2 - hot melt adhesive - Google Patents
hot melt adhesiveInfo
- Publication number
- BRPI0703309A2 BRPI0703309A2 BRPI0703309-5A BRPI0703309A BRPI0703309A2 BR PI0703309 A2 BRPI0703309 A2 BR PI0703309A2 BR PI0703309 A BRPI0703309 A BR PI0703309A BR PI0703309 A2 BRPI0703309 A2 BR PI0703309A2
- Authority
- BR
- Brazil
- Prior art keywords
- present
- hot melt
- melt adhesive
- vinyl acetate
- application
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L57/00—Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
ADESIVO TERMOFUSÍVEL. A presente invenção se refere, de uma maneira geral, a adesivos termofusíveis úteis em aplicações industriais, tal como artigos que se ligam, por exemplo, a caixas de papelão, peças, plásticos, encadernação, fabricação de móveis e para aplicação em embalagens próprias para o congelamento de alimentos. A formulação compreende uma resina, um oligômero (cera) com ponto de amolecimento entre 100 e 120°C e um copolímero de etileno e acetato de vinila (EVA), possuindo, preferencialmente um teor de acetato de vinila igual ou superior a 28% e índice de fluidez igual ou superior a 800g/10 mm. Considerando-se que a adesivo termofusivel da presente invenção apresenta temperatura de amolecimento entre 100 e 115°C, e que a temperatura de aplicação do adesivo da presente invenção varia entre 120 - 140°C, a diferença entre a temperatura de aplicação do produto e seu ponto de amolecimento é entre 20 e 30°C.THERMOFUSE STICKER. The present invention relates generally to hot-melt adhesives useful in industrial applications, such as articles which bind, for example, to cardboard boxes, parts, plastics, binding, furniture making and for application in packaging suitable for the freezing of food. The formulation comprises a resin, a softening point oligomer (wax) between 100 and 120 ° C and an ethylene vinyl acetate (EVA) copolymer, preferably having a vinyl acetate content of 28% or greater and fluidity index of 800g / 10 mm or more. Since the hot melt adhesive of the present invention has a softening temperature between 100 and 115 ° C, and the application temperature of the adhesive of the present invention is between 120 - 140 ° C, the difference between the application temperature of the product and Its softening point is between 20 and 30 ° C.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0703309-5A BRPI0703309A2 (en) | 2007-07-24 | 2007-07-24 | hot melt adhesive |
PCT/US2008/069910 WO2009014924A1 (en) | 2007-07-24 | 2008-07-14 | Hot melt adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BRPI0703309-5A BRPI0703309A2 (en) | 2007-07-24 | 2007-07-24 | hot melt adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0703309A2 true BRPI0703309A2 (en) | 2009-03-10 |
Family
ID=40281717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0703309-5A BRPI0703309A2 (en) | 2007-07-24 | 2007-07-24 | hot melt adhesive |
Country Status (2)
Country | Link |
---|---|
BR (1) | BRPI0703309A2 (en) |
WO (1) | WO2009014924A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102796470B (en) * | 2012-09-11 | 2013-12-25 | 无锡市万力粘合材料有限公司 | High-temperature-resistant EVA (ethylene-vinyl acetate) hot-melt adhesive for woodwork coating and preparation method thereof |
CN103289607B (en) * | 2013-05-07 | 2015-11-25 | 安徽金门工贸有限公司 | A kind of aluminum alloy materials hot melt adhesive and preparation method thereof |
CN103571377B (en) * | 2013-10-24 | 2016-04-13 | 芜湖众力部件有限公司 | A kind of anti-aging hot melt adhesive |
PT3271436T (en) * | 2015-03-20 | 2019-11-18 | Henkel IP & Holding GmbH | Hot melt adhesive composition and use thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6664309B2 (en) * | 2000-12-07 | 2003-12-16 | Bostik Findley, Inc. | Antimicrobial hot melt adhesive |
US20040020589A1 (en) * | 2002-08-01 | 2004-02-05 | Good David J. | Hot melt adhesive |
US20040045666A1 (en) * | 2002-09-06 | 2004-03-11 | Lie-Zhong Gong | Hot melt adhesive and use thereof |
US6794443B2 (en) * | 2003-02-14 | 2004-09-21 | National Starch And Chemical Investment Holding Corporation | Hot melt adhesive composition |
US7166662B2 (en) * | 2003-10-07 | 2007-01-23 | National Starch And Chemical Investment Holding Corporation | Hot melt adhesive composition |
-
2007
- 2007-07-24 BR BRPI0703309-5A patent/BRPI0703309A2/en not_active Application Discontinuation
-
2008
- 2008-07-14 WO PCT/US2008/069910 patent/WO2009014924A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2009014924A1 (en) | 2009-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B03A | Publication of an application: publication of a patent application or of a certificate of addition of invention | ||
B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
B07A | Technical examination (opinion): publication of technical examination (opinion) | ||
B09B | Decision: refusal | ||
B09B | Decision: refusal |