BR9910762A - Método para proporcionar uma conexão de aterramento elétrica entre uma placa de circuito impresso e um substrato metálico - Google Patents
Método para proporcionar uma conexão de aterramento elétrica entre uma placa de circuito impresso e um substrato metálicoInfo
- Publication number
- BR9910762A BR9910762A BR9910762-7A BR9910762A BR9910762A BR 9910762 A BR9910762 A BR 9910762A BR 9910762 A BR9910762 A BR 9910762A BR 9910762 A BR9910762 A BR 9910762A
- Authority
- BR
- Brazil
- Prior art keywords
- providing
- circuit board
- substrate
- printed circuit
- ground connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/033—Punching metal foil, e.g. solder foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
- Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Patente de Invenção: <B>''MéTODO PARA PROPORCIONAR UMA CONEXãO DE ATERRAMENTO ELéTRICA ENTRE UMA PLACA DE CIRCUITO IMPRESSO E UM SUBSTRATO METáLICO''<D>. Trata-se de um método (100) para proporcionar uma conexão de aterramento elétrica entre uma placa de circuito impresso (700) e um substrato metálico (200) que compreende as etapas de: (i) proporcionar uma abertura (204) no substrato (200); (ii) formar um plugue de aterramento (302) a partir de um material metálico a ser trabalhado (300); (iii) inserir o plugue de aterramento (300) na abertura no substrato (200); (iv) comprimir o plugue de aterramento (302) para dentro da abertura (204) no substrato (200); (v) posicionar a placa de circuito impresso (700) sobre o substrato (200); e (vi) aplicar solda na abertura e na placa de circuito impresso (700) e sobre o plugue de aterramento (302). As etapas de formar (104), inserir (106) e comprimir (108) são realizadas em uma única operação de perfuração (120). O método (100) proporciona, com eficiência, conexão de aterramento elétrica com alta qualidade e evita qualquer necessidade de maquinaria sofisticada.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/086,235 US6223431B1 (en) | 1998-05-28 | 1998-05-28 | Method for providing an electrical ground connection between a printed circuit board and a metallic substrate |
PCT/US1999/005318 WO1999062143A1 (en) | 1998-05-28 | 1999-03-11 | Pcb to metallic ground connection method |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9910762A true BR9910762A (pt) | 2001-02-13 |
Family
ID=22197176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9910762-7A BR9910762A (pt) | 1998-05-28 | 1999-03-11 | Método para proporcionar uma conexão de aterramento elétrica entre uma placa de circuito impresso e um substrato metálico |
Country Status (8)
Country | Link |
---|---|
US (1) | US6223431B1 (pt) |
EP (1) | EP1092248A4 (pt) |
JP (1) | JP2002517100A (pt) |
KR (1) | KR20010089125A (pt) |
CN (1) | CN1310859A (pt) |
AU (1) | AU3079899A (pt) |
BR (1) | BR9910762A (pt) |
WO (1) | WO1999062143A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6740824B2 (en) * | 2002-06-25 | 2004-05-25 | Motorola, Inc. | Ground connector assembly with substrate strain relief and method of making same |
CN100433321C (zh) * | 2005-07-29 | 2008-11-12 | 三洋电机株式会社 | 电路基板及使用该电路基板的电路装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB646314A (en) | 1948-06-22 | 1950-11-22 | James White Dalgleish | Improvements in electric wiring and coil forming |
US2854074A (en) * | 1952-09-06 | 1958-09-30 | Ite Circuit Breaker Ltd | Composite electrical conductor and method and apparatus for producing same |
US3264524A (en) * | 1963-05-17 | 1966-08-02 | Electro Mechanisms Inc | Bonding of printed circuit components and the like |
US3397453A (en) | 1965-08-12 | 1968-08-20 | Talon Inc | Method of forming composite electrical contacts |
US3489879A (en) * | 1967-02-09 | 1970-01-13 | Microtek Electronics Inc | Thermoswaging method for fixing pins to ceramic wafers |
US3484937A (en) * | 1967-08-29 | 1969-12-23 | Gen Electric | Methods and apparatus for fixing interface pins in electrical circuit boards |
US3494029A (en) * | 1968-03-28 | 1970-02-10 | Teletype Corp | Method of forming electrical connections through circuit boards |
US4110904A (en) | 1977-05-19 | 1978-09-05 | Allen-Bradley Company | Substrate with terminal connections and method of making the same |
DE2734461A1 (de) * | 1977-07-30 | 1979-02-08 | Grundig Emv | Verfahren zur gleichzeitigen herstellung einer vielzahl elektrischer kontaktstellen |
US5189261A (en) * | 1990-10-09 | 1993-02-23 | Ibm Corporation | Electrical and/or thermal interconnections and methods for obtaining such |
JP2629435B2 (ja) * | 1990-10-17 | 1997-07-09 | 日本電気株式会社 | アレイ状光素子用サブ基板の作製方法 |
US5237132A (en) | 1991-06-17 | 1993-08-17 | Nhk Spring Co., Ltd. | Metallic printed circuit board with countersunk mounting hole |
US5305523A (en) * | 1992-12-24 | 1994-04-26 | International Business Machines Corporation | Method of direct transferring of electrically conductive elements into a substrate |
US5661088A (en) | 1996-01-11 | 1997-08-26 | Motorola, Inc. | Electronic component and method of packaging |
-
1998
- 1998-05-28 US US09/086,235 patent/US6223431B1/en not_active Expired - Fee Related
-
1999
- 1999-03-11 JP JP2000551457A patent/JP2002517100A/ja active Pending
- 1999-03-11 CN CN99808924A patent/CN1310859A/zh active Pending
- 1999-03-11 AU AU30798/99A patent/AU3079899A/en not_active Abandoned
- 1999-03-11 KR KR1020007013399A patent/KR20010089125A/ko not_active Application Discontinuation
- 1999-03-11 EP EP99912421A patent/EP1092248A4/en not_active Withdrawn
- 1999-03-11 WO PCT/US1999/005318 patent/WO1999062143A1/en not_active Application Discontinuation
- 1999-03-11 BR BR9910762-7A patent/BR9910762A/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1999062143A1 (en) | 1999-12-02 |
AU3079899A (en) | 1999-12-13 |
JP2002517100A (ja) | 2002-06-11 |
EP1092248A1 (en) | 2001-04-18 |
EP1092248A4 (en) | 2001-08-22 |
KR20010089125A (ko) | 2001-09-29 |
CN1310859A (zh) | 2001-08-29 |
US6223431B1 (en) | 2001-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A, 7A E 8A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007. |