BR9908393A - Vertical integrated circuit layout - Google Patents

Vertical integrated circuit layout

Info

Publication number
BR9908393A
BR9908393A BR9908393-0A BR9908393A BR9908393A BR 9908393 A BR9908393 A BR 9908393A BR 9908393 A BR9908393 A BR 9908393A BR 9908393 A BR9908393 A BR 9908393A
Authority
BR
Brazil
Prior art keywords
integrated circuit
circuit layout
vertical integrated
vertical
circuits
Prior art date
Application number
BR9908393-0A
Other languages
Portuguese (pt)
Inventor
Martin Bader
Michael Smola
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of BR9908393A publication Critical patent/BR9908393A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/74—Masking faults in memories by using spares or by reconfiguring using duplex memories, i.e. using dual copies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Patente de Invenção: <B>"DISPOSIçãO DE CIRCUITO INTEGRADO VERTICAL<D>. Está prevista uma disposição de circuito integrado vertical com ao menos um primeiro circuito integrado e um segundo circuito integrado, que ficam dispostos superpostos, sendo que em ambos os circuitos integrados é executada uma funcionalidade idêntica. Ao menos em um dos circuitos integrados, é prevista uma instalação de controle, que controla uma cooperação dos circuitos com idêntica funcionalidade.Invention Patent: <B> "VERTICAL INTEGRATED CIRCUIT ARRANGEMENT <D>. A vertical integrated circuit arrangement with at least a first integrated circuit and a second integrated circuit is provided, which are arranged superimposed, and in both integrated circuits an identical functionality is performed, at least in one of the integrated circuits, a control installation is provided, which controls the cooperation of the circuits with identical functionality.

BR9908393-0A 1998-12-30 1999-12-21 Vertical integrated circuit layout BR9908393A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19860817 1998-12-30
PCT/DE1999/004055 WO2000041240A1 (en) 1998-12-30 1999-12-21 Vertically integrated circuit system

Publications (1)

Publication Number Publication Date
BR9908393A true BR9908393A (en) 2000-10-31

Family

ID=7893178

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9908393-0A BR9908393A (en) 1998-12-30 1999-12-21 Vertical integrated circuit layout

Country Status (6)

Country Link
EP (1) EP1060512A1 (en)
JP (1) JP2002534808A (en)
KR (1) KR20010083778A (en)
CN (1) CN1292151A (en)
BR (1) BR9908393A (en)
WO (1) WO2000041240A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730941B (en) 2014-04-09 2021-06-21 南韓商Ｉｃｔｋ控股有限公司 Apparatus and method for authenticating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
KR900008647B1 (en) * 1986-03-20 1990-11-26 후지쓰 가부시끼가이샤 A method for manufacturing three demensional i.c.
SG52794A1 (en) * 1990-04-26 1998-09-28 Hitachi Ltd Semiconductor device and method for manufacturing same
EP0695494B1 (en) * 1993-04-23 2001-02-14 Irvine Sensors Corporation Electronic module comprising a stack of ic chips
EP0732107A3 (en) * 1995-03-16 1997-05-07 Toshiba Kk Circuit substrate shielding device
US5824571A (en) * 1995-12-20 1998-10-20 Intel Corporation Multi-layered contacting for securing integrated circuits

Also Published As

Publication number Publication date
KR20010083778A (en) 2001-09-01
WO2000041240A1 (en) 2000-07-13
JP2002534808A (en) 2002-10-15
EP1060512A1 (en) 2000-12-20
CN1292151A (en) 2001-04-18

Similar Documents

Publication Publication Date Title
BR9807573A (en) Light element
BR9808609A (en) Construction system.
BR0010153A (en) Emergency gear installation for motor vehicles
BR9812288A (en) Scarf with a moisture barrier
BR9904900A (en) Playing cards
BR9908289A (en) Reviewer, authoring, and auditor workstations, and security server
BR9602566A (en) Product comprising a first substrate, an arrangement circuit, a multiplexer circuit and one or more integrated circuit structures
DE69941343D1 (en) Crosslinked elastomer foam based on polyolefin and composition therefor
BR9911436A (en) Dirt Dispersant
DE69800514D1 (en) Printed circuit board with primary and secondary through holes
BR0210892A (en) Elevator installation with virtual protection zone at the bottom of the well and / or top of the well and process for activating it
BR9902361A (en) Fault management system for a multifunctional printing machine.
DE69020684D1 (en) Electronic protective arrangement for electronic circuits against unwanted interruption of the ground connection.
BR0307909A (en) Shared memory distributed with fault resilient
BR9906571A (en) Integrated circuit and portable data device
KR910003898A (en) Monolithic Integrated Circuit for Power
BR0212040A (en) ceramic ignition device with sealed electrical contact part
BR9908393A (en) Vertical integrated circuit layout
KR910013975A (en) Heater control circuit
BR0111966A (en) Lock control assembly for an opening panel; and self-propelled vehicle opening panel
BR9801717A (en) Surge protection plug with a fail-safe device.
BR0109491A (en) Circuitry to provide a controlled signal to a drive system
DE59911331D1 (en) SYSTEM WITH INTEGRATED CIRCUIT AND VOLTAGE SOURCES
DE69822432D1 (en) Electronic bridge and half-bridge circuits with suppression of peak voltages on the supply line
BR9400119A (en) Exciter circuit for one or more bipolar transistors and ballast inverter

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTA A 4O, 5O, 6O E 7O ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007.