BR112021018061A2 - Sistema de resfriamento para dispositivos de computação - Google Patents
Sistema de resfriamento para dispositivos de computaçãoInfo
- Publication number
- BR112021018061A2 BR112021018061A2 BR112021018061A BR112021018061A BR112021018061A2 BR 112021018061 A2 BR112021018061 A2 BR 112021018061A2 BR 112021018061 A BR112021018061 A BR 112021018061A BR 112021018061 A BR112021018061 A BR 112021018061A BR 112021018061 A2 BR112021018061 A2 BR 112021018061A2
- Authority
- BR
- Brazil
- Prior art keywords
- cooling
- cooling fluid
- computing devices
- cooling system
- tank
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 9
- 239000012809 cooling fluid Substances 0.000 abstract 6
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
sistema de resfriamento para dispositivos de computação. a presente invenção se refere a um sistema de resfriamento para dispositivos de computação submersos, compreendendo um tanque de banho de resfriamento que contém um fluido de resfriamento que flui através do seu interior de pelo menos uma saída para uma entrada, em que o referido tanque de banho de resfriamento é configurado e disposto para permitir pelo menos uma primeira porção de pelo menos um dispositivo de computação a ser resfriado seja inserido nele, o referido dispositivo de computação sendo pelo menos parcialmente submerso no fluido de resfriamento contido nele, e pelo menos uma unidade de resfriamento configurada para coletar e resfriar o fluido de resfriamento que flui para fora da dita pelo menos um entrada e para retornar o fluido de resfriamento, uma vez resfriado, através da referida pelo menos uma saída para o referido tanque de banho de resfriamento, caracterizado por a referida pelo menos uma unidade de resfriamento ser configurada para ser inserida no referido tanque de banho de resfriamento, sendo pelo menos parcialmente submersa no fluido de resfriamento contido nele, e deve ser removida dele.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/ES2019/070172 WO2020183038A1 (es) | 2019-03-13 | 2019-03-13 | Sistema de refrigeración para entidades de computación |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112021018061A2 true BR112021018061A2 (pt) | 2021-11-23 |
Family
ID=66397255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112021018061A BR112021018061A2 (pt) | 2019-03-13 | 2019-03-13 | Sistema de resfriamento para dispositivos de computação |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US11856727B2 (pt) |
| EP (1) | EP3941171B1 (pt) |
| JP (1) | JP7316372B2 (pt) |
| KR (1) | KR20220005450A (pt) |
| CN (1) | CN114026971A (pt) |
| AU (1) | AU2019434289B2 (pt) |
| BR (1) | BR112021018061A2 (pt) |
| CA (1) | CA3133173A1 (pt) |
| MX (1) | MX2021011112A (pt) |
| SG (1) | SG11202110028VA (pt) |
| WO (1) | WO2020183038A1 (pt) |
| ZA (1) | ZA202107495B (pt) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD989255S1 (en) * | 2020-10-29 | 2023-06-13 | Submer Technologies, S.L. | Fluid distribution equipment |
| US11924998B2 (en) | 2021-04-01 | 2024-03-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
| US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
| KR20230141282A (ko) | 2022-03-31 | 2023-10-10 | 주식회사 에이스이앤티 | 전자부품용 침수식 냉각 장치 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2500013C1 (ru) | 2012-03-19 | 2013-11-27 | Общество с ограниченной ответственностью "ЭКОФЛОПС" | Система жидкостного охлаждения для электронных устройств |
| AU2014262796A1 (en) * | 2013-05-06 | 2015-12-24 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
| US10398063B2 (en) | 2014-06-24 | 2019-08-27 | David Lane Smith | System and method for fluid cooling of electronic devices installed in an enclosure |
| EP3318954B1 (en) * | 2015-07-02 | 2021-03-17 | Exascaler Inc. | Liquid immersion cooling device |
| WO2017040217A1 (en) * | 2015-08-28 | 2017-03-09 | Miyoshi Mark | Immersion cooling system with low fluid loss |
| RU2698777C1 (ru) | 2015-12-02 | 2019-08-29 | Даунандер Геосолюшенз Птй Лтд | Система и способ охлаждения текучей среды для электронного оборудования |
| EP3236726B1 (en) | 2016-04-20 | 2020-10-14 | CGG Services SAS | Methods and system for oil immersion cooling |
| RU2621360C1 (ru) | 2016-05-20 | 2017-06-02 | Федеральное государственное унитарное предприятие "18 Центральный научно-исследовательский институт" Министерства обороны Российской Федерации | Модульная погружная система охлаждения |
| CN106912186A (zh) | 2017-04-24 | 2017-06-30 | 深圳绿色云图科技有限公司 | 机柜及微型数据中心 |
| CN107690268B (zh) * | 2017-09-30 | 2023-11-28 | 深圳绿色云图科技有限公司 | 一种数据中心冷却系统以及数据中心 |
| CN108323118A (zh) | 2018-03-06 | 2018-07-24 | 北京中热能源科技有限公司 | 一种电子设备的液冷系统 |
| US20190357378A1 (en) * | 2018-05-18 | 2019-11-21 | Tas Energy Inc. | Two-phase immersion cooling system and method with enhanced circulation of vapor flow through a condenser |
| CN108901187B (zh) | 2018-08-21 | 2020-01-07 | 葛俊 | 可自动抬升高密度服务器的液体浸没冷却机柜、系统及控制方法 |
| US10969842B2 (en) * | 2018-09-19 | 2021-04-06 | TMGCore, LLC | Chassis for a liquid immersion cooling system |
| US11357131B1 (en) * | 2021-08-03 | 2022-06-07 | Tmgcore, Inc. | Fluid breakdown detection systems and processes useful for liquid immersion cooling |
| US11160194B2 (en) * | 2019-11-14 | 2021-10-26 | Liquidstack Holding B.V. | Hot swap condensor for immersion cooling |
-
2019
- 2019-03-13 US US17/438,232 patent/US11856727B2/en active Active
- 2019-03-13 CN CN201980095474.XA patent/CN114026971A/zh active Pending
- 2019-03-13 BR BR112021018061A patent/BR112021018061A2/pt unknown
- 2019-03-13 SG SG11202110028VA patent/SG11202110028VA/en unknown
- 2019-03-13 AU AU2019434289A patent/AU2019434289B2/en active Active
- 2019-03-13 KR KR1020217033066A patent/KR20220005450A/ko not_active Application Discontinuation
- 2019-03-13 EP EP19721656.7A patent/EP3941171B1/en active Active
- 2019-03-13 JP JP2021555066A patent/JP7316372B2/ja active Active
- 2019-03-13 MX MX2021011112A patent/MX2021011112A/es unknown
- 2019-03-13 CA CA3133173A patent/CA3133173A1/en active Pending
- 2019-03-13 WO PCT/ES2019/070172 patent/WO2020183038A1/es unknown
-
2021
- 2021-10-05 ZA ZA2021/07495A patent/ZA202107495B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU2019434289A8 (en) | 2021-10-21 |
| US11856727B2 (en) | 2023-12-26 |
| ZA202107495B (en) | 2023-10-25 |
| CA3133173A1 (en) | 2020-09-17 |
| US20220183181A1 (en) | 2022-06-09 |
| EP3941171A1 (en) | 2022-01-19 |
| WO2020183038A1 (es) | 2020-09-17 |
| AU2019434289A1 (en) | 2021-10-07 |
| CN114026971A (zh) | 2022-02-08 |
| SG11202110028VA (en) | 2021-10-28 |
| JP2022531069A (ja) | 2022-07-06 |
| JP7316372B2 (ja) | 2023-07-27 |
| EP3941171B1 (en) | 2024-05-15 |
| KR20220005450A (ko) | 2022-01-13 |
| MX2021011112A (es) | 2022-01-18 |
| AU2019434289B2 (en) | 2023-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] |