BR112020010287A2 - devices for reflecting, deflecting and / or absorbing electromagnetic radiation emitted from an electronic device and methods thereof - Google Patents

Abstract

These are devices used with mobile phones. Deployments can include: a metal-containing plate configured to be directly attached to a rear surface of a mobile phone, where the metal-containing plate includes a liner. The metal-containing plate can be configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile phone away from a mobile phone user.

Description

“DEVICES TO REFLECT, DEFLECT AND / OR ABSORB ELECTROMAGNETIC RADIATION ISSUED FROM AN ELECTRONIC DEVICE AND METHODS OF THE SAME ” FUNDAMENTALS

1. TECHNICAL FIELD

[001] The aspects of this document refer, in general, to mobile electronic devices. The most specific deployments involve accessories for mobile phones.

2. GROUNDS

[002] Mobile electronic devices that have wireless communication capabilities use radios (transceivers) that use electromagnetic radiation of various frequencies to transfer information, such as data and voice communication. Electromagnetic radiation is emitted and received using an antenna attached to the radio. Some mobile electronic devices use multiple radios and corresponding antennas to transmit using multiple frequencies.

SUMMARY

[003] Deployments of devices used with mobile electronic devices may include: a plate containing metal configured to be directly attached to a rear surface of a mobile electronic device, where the plate containing metal includes a coating. The metal-containing plate can be configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile electronic device away from a user of the mobile electronic device.

[004] Deployments of mobile electronic devices can include any, all or any of the following:

[005] The plate containing metal may be smaller than, substantially coextensive with, or the same dimension may be perimeter of the rear surface of the mobile electronic device.

[006] The plate containing metal can include a perimeter that forms any closed shape.

[007] The metal-containing plate may include a non-flat surface on a larger surface of the metal-containing plate.

[008] The metal-containing plate may include a material selected from the group consisting of copper, gold, silver, platinum, nickel, aluminum, ferrite, shungite, any attenuating material, absorbent or radio frequency reflector or any combination thereof .

[009] The coating can be selected from the group consisting of a galvanized coating, a non-electrical plated coating, a paint including a wet or dry carrier, a rubber coating, a metal coating, a metal charge coating, a magnetic coating, a transparent coating, a ceramic coating, a powder coating and any combination thereof.

[010] The metal-containing plate can include two or more layers, where one of the two or more layers can be a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material .

[011] The device may also include a coupling mechanism on the metal-containing plate, where the coupling mechanism is configured to couple the metal-containing plate directly to the rear surface of the portable electronic device. The coupling mechanism can be selected from the group consisting of an adhesive, hook and loop fasteners, screws, inserts, double-sided tape, polymers, suction cups, magnets or any combination thereof.

[012] Deployments of a device used with a mobile electronic device may include a plate configured to be directly attached to a rear surface of a mobile electronic device or coupled between a cover and the rear surface of the mobile electronic device. The plate can include at least two portions. A material from at least one of the at least two portions of the plate can be configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile electronic device away from a user of the mobile electronic device.

[013] Device deployments used with a mobile electronic device can include any, all, or any of the following:

[014] The plate can include at least two portions that contain metal.

[015] The at least two portions of the plate can be coupled through a non-metallic portion or metallic portion.

[016] The non-metallic portion can be selected from the group consisting of a binder, a support, a plastic support, a rubber support, a polymer support, a wooden support, a carbon fiber support, a resin support , a glass-reinforced epoxy laminate support, an adhesive, a glue, a molding compound and any combination thereof.

[017] The device may additionally include a coating that can be selected from the group consisting of a galvanized coating, a non-electrical plated coating, a paint including a wet or dry carrier, a rubber coating, a ceramic coating, a coating of metal, a metal charge coating, a magnetic coating, a transparent coating, a powder coating and any combination thereof.

[018] At least one of the at least two portions of the plate may include two or more layers, where one of the two or more layers is a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material.

[019] Deployments of a device used with a mobile electronic device may include a plate configured to be directly attached to a rear surface of a mobile electronic device or coupled between a cover and the rear surface of the mobile electronic device. The plate may include a mesh. A mesh material can be configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile electronic device away from a user of the mobile electronic device.

[020] Device deployments used with a mobile electronic device can include any, all, or any of the following:

[021] The mesh may include a plurality of members oriented substantially perpendicularly.

[022] The mesh may include a plurality of closed-shaped openings spaced through the material.

[023] The device may include a coupling mechanism on the plate. The coupling mechanism can be configured to attach the card directly to the rear surface of the portable electronic device. The coupling mechanism can be selected from the group consisting of an adhesive, hook and loop fasteners, screws, inserts, double-sided tape, polymers, suction cups, magnets or any combination thereof.

[024] The plate can include two or more layers, where one of the two or more layers can be a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material.

[025] One of the two or more layers that is a metallic material can be the mesh.

[026] Device deployments to deflect RF radiation away from a mobile phone user may include a metal plate configured to be positioned between the mobile phone and at least one of a decorative or protective cover. The metal plate can be positioned on a rear surface of the mobile phone. The metal plate can be removable and fixed non-permanently to the mobile phone and to at least one of a decorative or protective cover. The metal plate may include a copper plate and a powder coating formed on the copper plate.

[027] Deployments of devices to deflect RF radiation away from a mobile phone user may include any, all, or any of the following:

[028] The copper plate can be configured to cover an entire area of the back surface of the mobile phone.

[029] The metal plate may include a transparent coating formed on the powder coating.

[030] The metal plate may include a slip resistant material applied to at least one surface of the transparent coating.

[031] The metal plate may include evidence formed in the coating and powder.

[032] The copper plate may have wavy edges.

[033] The copper plate may have jagged edges.

[034] The copper plate can be 0.08 to 0.32 cm (1/32 to 1/8 inch) thick.

[035] Deployments of a device to deflect RF electromagnetic radiation away from a user of a mobile device may include a metal plate configured to be positioned between the mobile phone and a cover positioned on a rear surface of the mobile phone. The metal plate can be removable and fixed non-permanently to the mobile phone and the cover. The metal plate may include a copper plate configured to cover the back surface of the mobile phone where RF signals radiate from the mobile phone when the mobile phone receives / transmits RF signals. A powder coating can be formed on the copper plate.

[036] Deployments of a device to deflect RF electromagnetic radiation away from a user may include one, all, or any of the following:

[037] The metal plate can include a transparent coating formed on the powder coating.

[038] The metal plate may include a slip resistant material applied to at least one surface of the transparent coating.

[039] The metal plate may include evidence formed in the coating and powder.

[040] The copper plate may have wavy edges.

[041] The copper plate may have jagged edges.

[042] The copper plate can be 0.08 to 0.32 cm (1/32 to 1/8 inch) thick.

[043] Deployments of a device to deflect RF radiation away from a mobile phone user may include a metal plate configured to be positioned between the mobile phone and a cover positioned on a back surface of the mobile phone, where the metal plate is removable and non-permanently fixed to the mobile phone and the cover. The metal plate may include a copper plate configured to cover the back surface of the mobile phone where RF signals radiate when the mobile phone receives / transmits RF signals. A powder coating can be formed on the copper plate. A transparent coating can be formed on the powder coating. A slip resistant material can be applied to at least one surface of the transparent coating.

[044] Deployments of a device to deflect RF electromagnetic radiation may include any, all, or any of the following:

[045] The metal plate may include evidence formed in the coating and powder.

[046] The copper plate may have wavy edges.

[047] The copper plate may have jagged edges.

[048] The copper plate can be rectangular in shape.

[049] Implements of a device used with a mobile electronic device may include a metal plate configured to be arranged between the mobile electronic device and a cover. The metal plate may have a coating. The device can deflect RF electromagnetic radiation away from the user of the mobile electronic device.

[050] The implantation of a device used with a mobile electronic device may include any, all or any of the following:

[051] The device can be rectangular in shape.

[052] The device may be non-rectangular in shape.

[053] The device may be similar in shape to a credit card and sized to cover at least a portion of the rear surface of the mobile electronic device.

[054] The device can be removably attached to at least one of the mobile electronic device or the cover.

[055] The device can include at least one slot.

[056] The cover can be positioned on at least a portion of the device and at least a portion of a rear surface of the mobile electronic device.

[057] The device can be sized to cover at least a portion of an antenna of the mobile electronic device.

[058] The device can be configured to cover at least a portion of a rear surface of the mobile electronic device adjacent to an antenna of the mobile electronic device.

[059] The device is positioned to cover at least a portion of an area of the mobile electronic device that emits electromagnetic radiation.

[060] The device may have an edge of a shape selected from the group consisting of at least one straight, curved, wave, undulating or jagged.

[061] The device can be scaled in proportion to the size of the mobile electronic device.

[062] Deployments of a device used with a mobile phone may include a metal plate configured to be arranged between the mobile phone and a cover. The metal plate may have a coating. The cover can be positioned over at least a portion of the device. The device can deflect RF electromagnetic radiation away from the mobile phone user.

[063] Deployments of a device used with a mobile phone can include any, all, or any of the following:

[064] The device can be rectangular in shape.

[065] The device may have a non-rectangular shape.

[066] The device can be similar in shape to a credit card and sized to cover at least a portion of the back surface of the mobile phone.

[067] The device can be removably attached to at least one of the mobile phone or the cover.

[068] The device can include at least one slot.

[069] The cover can be positioned on a portion of the back surface of the mobile phone.

[070] The device can be sized to cover at least a portion of a mobile phone antenna.

[071] The device can be positioned to cover at least a portion of a mobile phone's back surface adjacent to a mobile phone antenna.

[072] The device can be configured to cover at least a portion of an area of the mobile phone that emits electromagnetic radiation.

[073] The device may have an edge of a shape selected from the group consisting of at least one of straight, curved, wave,

wavy and jagged.

[074] The device can be scaled in proportion to the size of the mobile phone.

[075] Deployments of a device to deflect electromagnetic radiation away from a mobile device user may include a metal plate that deflects electromagnetic radiation away from the user of the mobile electronic device and a coating that covers the metal plate.

[076] The previous and other aspects, characteristics and advantages will be evident to those of ordinary skill in the technique from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[077] The implantations will now be described together with the attached drawings, in which similar designations denote similar elements, and:

[078] Figure 1 is a perspective view of an implantation of an RF shielding device positioned inside a decorative and / or protective housing for a mobile phone;

[079] Figure 2 is a front view of another implantation of an RF shielding device positioned inside a decorative and / or protective housing for a mobile phone;

[080] Figure 3 is a front view of another implantation of an RF shielding device positioned inside a decorative and / or protective casing for a mobile phone;

[081] Figure 4 is a cross-sectional view of an implantation of an RF shielding device for a mobile phone;

[082] Figure 5 is a front view of a first implantation of an RF shielding device coupled directly to a portable electronic device;

[083] Figure 6 is a front view of a second implantation of an RF shielding device coupled directly to a portable electronic device;

[084] Figure 7 is a front view of a third implantation of an RF shielding device coupled directly to a portable electronic device;

[085] Figure 8 is a front view of a fourth implantation of an RF shielding device coupled directly to a portable electronic device;

[086] Figure 9 is a front view of a fifth implantation of an RF shielding device coupled directly to a portable electronic device;

[087] Figure 10 is a front view of a sixth implantation of an RF shielding device coupled directly to a portable electronic device;

[088] Figure 11 is a front view of a seventh implantation of an RF shielding device coupled directly to a portable electronic device;

[089] Figure 12 is a front view of an eighth implantation of an RF shielding device coupled directly to a portable electronic device;

[090] Figure 13 is a front view of a ninth implantation of an RF shielding device coupled directly to a portable electronic device;

[091] Figure 14 is a front view of a tenth implantation of an RF shielding device coupled directly to a portable electronic device;

[092] Figure 15 is a front view of an eleventh implantation of an RF shielding device;

[093] Figure 16 is a front view of a twelfth implantation of an RF shielding device;

[094] Figure 17 is a front view of a thirteenth implantation of an RF shielding device;

[095] Figure 18 is a front view of a first mesh implantation of an RF shielding device;

[096] Figure 19 is a front view of a second mesh implantation of an RF shielding device;

[097] Figure 20 is a cross-sectional view of a fourteenth implantation of an RF shielding device;

[098] Figure 21 is a cross-sectional view of a fifteenth implantation of an RF shielding device;

[099] Figure 22 is a cross-sectional view of a sixteenth implantation of an RF shielding device;

[0100] Figure 23 is a side view of a seventeenth implantation of an RF shielding device;

[0101] Figure 24 is a side view of an eighteenth implantation of an RF shielding device;

[0102] Figure 25 is a side view of a nineteenth implantation of an RF shielding device;

[0103] Figure 26 is a side view of a first implantation of an RF shielding device, an enclosure and a portable electronic device;

[0104] Figure 27 is a side view of a second implantation of an RF shielding device, an enclosure and a portable electronic device;

[0105] Figure 28 is a side view of a third implantation of an RF shielding device, an enclosure and a portable electronic device;

[0106] Figure 29 is a side view of a fourth implantation of an RF shielding device, an enclosure and a portable electronic device;

[0107] Figure 30 is a first cross-sectional view of an implantation of an RF shielding device;

[0108] Figure 31 is a second cross-sectional view of an implantation of an RF shielding device;

[0109] Figure 32 is a front view of a twentieth implantation of an RF shielding device directly coupled to a portable electronic device;

[0110] Figure 33 is a front view of a twenty-first implantation of an RF shielding device directly coupled to a portable electronic device;

[0111] Figure 34 is a perspective view of an implantation of a housing attached to a portable electronic device that has two RF shielding devices;

[0112] Figure 35 is a perspective view of another implantation of a housing coupled to a portable electronic device with an RF shielding device incorporated in it; and

[0113] Figure 36 is a perspective view of a flap of a roof implant.

DESCRIPTION

[0114] This disclosure, its aspects and implementations are not limited to specific components, assembly procedures and method elements disclosed in this document. Many additional components, assembly procedures and / or method elements known in the art consistent with devices designed to reflect, deflect and / or absorb electromagnetic radiation emitted from a mobile electronic device and related methods will be made evident for use with particular deployments of this disclosure . Consequently, for example, although particular deployments are disclosed, such deployments and deployment components can comprise any shape, size, style, type, model, version, measurement, concentration, material, quantity, method element, step and / or the like as it is known in the art for such devices to reflect, deflect and / or absorb electromagnetic radiation emitted from a mobile electronic device and related methods, and implantation components and methods, consistent with the designed operation and methods.

[0115] Mobile phones transmit and receive data wirelessly over communication networks, such as a local area network (LAN), a general wide area network (WAN) and / or a public network. To communicate with these networks, the antenna inside these mobile phones receives and radiates Radio Frequency (RF) signals. Once the mobile phone is activated, the mobile phone is constantly transmitting and receiving RF electromagnetic frequency signals.

[0116] Many mobile phones are kept close to the user's bodies and / or heads when in use. For example, when talking on a mobile phone, the user can keep the mobile phone close to the user's head / ear / brain / eyes. Many users store and keep their mobile phones in their pocket close to their bodies. Thus, mobile phone antennas that radiate RF electromagnetic frequency signals can lead to increased exposure and absorption of radiation by the user's head and body.

[0117] Studies have been conducted and continue to be conducted on health issues of RF electromagnetic frequency signals that are radiated from mobile phones. These studies focused on the long-term negative effects of radiation on people and their medical complications. Some study results have shown that the level of radiation penetration is more dangerous and has more negative health effects in children than in adults. Children's nervous systems are still developing and are therefore more vulnerable to factors that could possibly be carcinogenic. Their heads are smaller than those of adults and have thinner brain tissues and bones and consequently have a greater proportional exposure to the radiofrequency radiation field that is emitted by mobile phones. Children also have the potential to accumulate more years of mobile phone exposure than adults. Several studies are currently being conducted regarding the potential health effects of radiation on brain electrical activity, joint pain, heart rate, blood pressure, immune system, possible carcinogenic effects. The World Health Organization has classified mobile phone radiation as a Possible Class 2B Carcinogen.

[0118] Due to the potential effect of radiation from mobile phones, the Federal Communications Commission (FCC) requires limiting radiation from a portable communication device (such as a mobile or cell phone) that is directed at the user's head (Rate of Specific Absorption or SAR). In addition, notices are placed inside the boxes of all mobile phone instruction sheets warning users to keep mobile phones at certain distances from users' heads and bodies due to the harmful effects of RF electromagnetic radiation.

[0119] In this document, various devices and methods are described that deflect, absorb and / or reflect RF radiation away from the body of a mobile phone user through the use of a plate or other structure as a shield. Such devices can significantly reduce the absorption by the user of a portable electronic device of RF electromagnetic radiation emitted by the portable electronic device. In some deployments, the device fits between the mobile phone and a decorative and / or protective casing. In other deployments, the device attaches directly to the portable electronic device. In still other deployments, the device attaches directly to the housing or forms a portion of the housing itself. In other deployments, the device can be attached to a sleeve attached to a housing or directly to the portable electronic device itself.

[0120] With reference to Figure 1, an implantation of an RF 10 shielding device is illustrated. The shielding device of

RF 10 can include a plate 12. The plate 12 can be formed by a sheet of metallic material. Different metallic materials can be used. For example, aluminum, pre-tin-plated steel, 770 alloy or similar materials can be used to form the RF shielding device plate 12. In various deployments, plate 12 can be formed of copper. Copper is highly effective in attenuating magnetic and electrical waves, thus allowing the RF shielding device 10 to reduce the electromagnetic radiation emitted from the mobile phone 30.

[0121] The RF 10 shielding device can be formed in different sizes. The size of the RF shielding device 10 can be based on the size of the mobile phone 30 and the location of antennas within the mobile phone 30. For example, some mobile phones 30 may have one or more antennas located in only one area, such as the top or bottom of the mobile phone 30. Thus, the RF shielding device 10 and hence the plate 12 can be sized to cover a lower and / or upper area of the mobile phone 30. In the illustrated deployment, the plate 12 can be sized similarly to a credit card format. However, some mobile phones 30 may have multiple antennas located at the top and bottom of the mobile phone 30. For example, some mobile phones have four antennas, where one antenna is located at each edge (top left, top right, bottom left and bottom right). For these types of mobile phones 30, the plate 12 can be sized to cover the entire rear surface of the mobile phone 30. The above dimensions and dimensions are given as non-limiting examples. Other configurations can be developed using the principles disclosed in this document. For example, a small cut may be formed on the RF shielding device 10 to prevent the RF shielding device 10 from obscuring a camera lens aperture formed on the mobile phone 30.

[0122] When copper is used to form plate 12, copper plate 12 may be prone to corrosion. Corrosion of copper can occur when copper plate 12 is exposed to the atmosphere / air. Oxidation of copper can cause the copper plate 12 to stain. After a while, copper plate 12 may turn dark brown or black and finally green. Oxidation of the copper plate 12 can cause the RF shielding device 10 to disfigure / damage the mobile phone 30.

[0123] With reference to Figure 4, due to the oxidation problem, the plate 12 can be coated with powder. Powder coating is a process in which a coating 14 can be electrostatically applied to the plate 12 and then cured under heat, forming the coating 14 on the plate

12. The coating 14 can be a thermoplastic or thermoset polymer and can be any color. The coating 14 can create a hard finish on the plate 12 which is harder and more effective at preventing corrosion than conventional paint.

[0124] Different textures, designs and / or other evidence 16 (Figure 1) can be formed on the plate 12 after the coating 14 has been applied. The texture, design and / or other evidence 16 may allow for customization of the RF shielding device 10. A transparent coating 18 can be applied over the coating 14.

[0125] A slip resistant material 20 can be applied to the transparent coating 18. A slip resistant material 20 can prevent the RF shielding device 10 from sliding and moving as can be disclosed below.

[0126] With reference to Figures 1 to 3, the RF 10 shielding device can be formed in different sizes, shapes and configurations. Figure 1 illustrates an implantation in which the RF shielding device 10 can be rectangular in shape and can be thick enough to keep the RF shielding device 10 positioned between the mobile phone 30 and a decorative and / or protective cover 22 as will be discussed below. According to one embodiment, the RF shielding device 10 can have a thickness of about 0.02 to about 0.32 centimeter (1/128 to about 1/8 inch). The device can also be formed by a metallic foil or a metallic ribbon in several implantations. According to one embodiment, the RF shielding device 10 can have a thickness of about 0.08 to 0.32 centimeter (1/32 to 1/8 inch). In such deployments, the thickness of the material can be between about 0.001 mm to about 6.5 mm. In some deployments, the thickness of the material can be greater than 6.5 mm.

[0127] The RF 10 shielding device can be formed to have a wave configuration 24 formed at the edges 10A (upper, lower, left and right edges) of the RF 10 shielding device, as can be seen in Figure 2. The RF shielding device 10 can be formed to have a toothed configuration 26 formed at the edges 10A (upper, lower, left and right edges) of the RF shielding device 10, as shown in Figure 3. The wave configuration 24 and the toothed configuration 26 formed at the edges 10A can affect the levels of electromagnetic radiation emitted from the mobile phone 30. The wave configuration can be present on one or more sides of the device in various deployments.

[0128] In operation, for those deployments where the RF shielding device is placed between the cover and a mobile phone, a user who wants to reduce the electromagnetic radiation emitted from the user's mobile phone 30 may need to determine the location of one or more more antennas within the mobile phone 30. When the user determines the location of the antennas, the user can position the RF shielding device 10 on a rear surface of the mobile phone 30, so that the RF shielding device 10 is positioned over the area where the antennas may be located. The user can position the RF shielding device 10 so that the slip resistant material 20 is positioned against the back surface of the mobile phone 30. This can prevent the RF shielding device 10 from moving and moving. The decorative and / or protective cover 22 can then be placed on the mobile phone 30, securing the RF shielding device 10 between the mobile phone 30 and the decorative and / or protective cover 22.

[0129] The RF 10 shielding device is designed to reflect and / or deflect electromagnetic radiation emitted from the mobile phone 30. The RF 10 shielding device fits between the mobile phone 30 and the decorative and / or protective cover 22 and it is easily transferable. This can allow a user of the RF shielding device 10 to exchange and use any decorative and / or protective cover 22 that he desires with the RF shielding device 10 so that he can deflect the electromagnetic radiation from the mobile phone 30.

[0130] Several deployments of RF shielding devices have been disclosed in this document up to this point. These deployments and the additional deployments disclosed in this document show boards where no part, part or portion of the board is located inside a housing of the portable electronic device itself. As discussed earlier, these devices can be sized to fit between a cover and a portable electronic device, they can attach to the portable electronic device itself, or they can be a part of a cover design. The electronic devices with which the devices disclosed in the present invention can be employed can be, by way of non-limiting example, mobile electronic devices, cell phones, mobile phones, phablet computers, desktop computers, laptop computers, watches smart phones, heart monitors, mobile medical devices and other mobile electronic devices that involve RF radiation. In the remaining portions of this document, several RF shielding device designs will be discussed. Although they can be discussed in the context of being attached directly to a portable electronic device or cover, it needs to be understood that these device designs could also be used between a cover and the portable electronic device as well.

[0131] With reference to Figure 5, a first implantation of an RF shielding device 32 is illustrated coupled with a portable electronic device 34 (which, in this case, is a mobile phone). In the illustrated deployment, the RF shielding device 32 is directly coupled to the surface of the portable electronic device 34 which does not include a cover in this deployment (although one can be used if desired). As illustrated, the RF shielding device 32 is positioned to cover at least one antenna of the portable electronic device 34, but is smaller than the perimeter of the portable electronic device 34. In this deployment of an RF shielding device (as in all the other RF shielding device deployments disclosed herein), the material of the RF shielding device can be any material that is capable of deflecting, absorbing or reflecting electromagnetic radio frequency radiation emitted and received by the portable electronic device. In particular deployments, the material of the RF shielding device can be, by way of non-limiting example, a metal, copper, gold, silver, platinum, nickel, aluminum, ferrite, any alloy of the foregoing and any combination of the foregoing. The RF shielding device takes the form of a plate in the implantation illustrated in Figure 5. In other deployments, metallic / non-metallic compounds such as ceramics, composites, graphene, carbon fiber, shungite, plastics, polymers and any other non-metallic materials capable of deflecting, absorbing or reflecting electromagnetic radiofrequency radiation emitted by the portable electronic device can be used in various deployments. For those materials that are metal or non-metal, crystallographic orientations and / or particular planes of the material can be used to maximize or otherwise create the desired deflection, absorption or reflection effect for RF radiation.

[0132] The implantation illustrated in Figure 5 can be attached to the rear surface of the portable electronic device through a wide variety of coupling mechanisms. Non-limiting examples of coupling mechanisms that can be used in various deployments include adhesives, hook and loop fasteners, screws, fittings, double-sided tape, polymers, suction cups, magnets, glue or any other capable coupling system or material to keep two pieces together. The RF 32 shielding device may not be coated in some deployments. In other deployments, device 32 may include any coating disclosed in this document, including, by way of non-limiting example, galvanized coating, an electro-plated coating, a ceramic coating, non-electrical plated coating, a paint that uses a wet or dry carrier , a rubber coating, a metal coating, a metal charge coating, a magnetic coating, a transparent coating or a powder coating. As previously discussed in this document, multiple layers of one or any of the coatings disclosed in this document can be used in various deployments. In addition, metals and other RF shielding materials can be applied as coatings, such as, by way of non-limiting example, metal in metal coatings, metal fillers embedded in a coating, conductive inks, non-conductive inks and a coating of any other type of material disclosed in this document that has an RF deflection, absorption or reflection effect. Fabrics and other woven materials could also be used as coatings in various deployments.

[0133] The design of the particular board used as the RF 32 shielding device can take many forms in various deployments. Referring to Figure 6, an implantation of an RF36 shielding device / plate is illustrated that is close to the same size as, or coextensive with, the perimeter of the rear surface of the portable electronic device 34. In other deployments, the format of the board may be the same size as the perimeter of the rear surface of the portable electronic device.

In other deployments, the board may actually overlap and extend around the rear surface on the side surfaces of the portable electronic device. In some deployments, the card can wrap around the front side of the portable electronic device through one or more sides of the portable electronic device. The actual shape of the board's perimeter can be any closed format, including any disclosed in this document. Figures 8 and 13 illustrate plate designs that are not polygonal and include protruding sections (in the case of plate 42 in Figure 8) and irregular shapes in the case of plate 54 in Figure 13. The plate can include one or more grooves through it . In some deployments, one or more slots can accommodate cameras, fingerprint readers, on / off buttons or other portions of the portable electronic device.

[0134] Plate deployments used in RF shielding devices can include more than one portion / section. Referring to Figure 7, a plate with two sections 38, 40 is illustrated. Although two sections 38, 40 are illustrated as having the same size, or substantially the same size, in various deployments, the relative size of the two or more portions of the plate may differ. Figures 9, 10, 11 and 12 illustrate various multi-portion plate deployments, demonstrating that the portions can include curved sections / portions 44, 46 and that the various portions can be arranged on the rear surface of the portable electronic device 34 in various orientations vertically (portions 48) and horizontally (portions 50 and 52). Furthermore, although in the figures the portions are arranged symmetrically around a geometric axis of the portable electronic device, in other deployments, the portions may not be arranged symmetrically.

[0135] For those plate deployments where multiple portions are used, the multiple portions can be individually attached to the rear surface of the portable electronic device using any coupling system disclosed in this document. In other deployments, the portions can be coupled using other portions.

With reference to Figure 14, and an implantation of a plate 56 is illustrated, in which the plate 56 is formed by three coupled sections 58, 60 and 62. In this deployment, sections 58 and 60 are metallic and section 62 is made of a non-metallic material that acts to couple the two sections 58 and 60. In particular deployments, the sections can be made of any combination of metallic and / or materials not metallic. In various deployments, the non-metallic portion may include a variety of structures made of various materials, such as, by way of non-limiting example, a binder, a support, a plastic support / portion, a rubber support, a support of polymer, a wooden support, a carbon fiber support, a resin support, a glass-reinforced epoxy laminate support (FR-4), an adhesive, a glue, a molding compound or any other material or structure able to couple the multiple sections of the board. In various deployments, the portions can be joined using a wide variety of methods, including molding, forming, gluing, joining, injection molding and any other technique for coupling the sections with the material of the non-metallic portion. In various deployments, the non-metallic portion may actually include some metal components, such as metal fillers or layers of metal, as disclosed herein.

[0136] In several deployments where multiple sections are used, all sections can be manufactured from materials that contain metal. In these deployments, sections containing metal can be joined using, by way of non-limiting example, gluing, welding, bonding or any other technique for bonding materials containing metal.

[0137] The various plate designs disclosed in this document may also include completely flat portions substantially parallel to the rear surface of the portable electronic device. In other deployments, however, a wide variety of non-flat shapes can be incorporated into one or more surfaces of the plate. Referring to Figure 15, a plate 64 with a plurality of raised corrugated projections 66 on the plate material is illustrated. In several deployments, the wavy projections can be, by way of non-limiting example, lines, diagonals, partial lines, individual projections, projections irregularly arranged and any of the above can have any type of surface finish, including, by way of example, non-limiting, smooth, rough, irregular, angled, alternating and any other surface shape. The corrugated projections 66 can be formed by molding, casting, grinding, stamping, drilling or otherwise forming the surface of the plate 64. With reference to Figure 16, a plate 68 is illustrated with two zigzag depressions 70 formed in this document. using any of the techniques mentioned earlier. The depressions can take the form of any of the projection formats mentioned in this document and can include any of the types of surface finish of the projections mentioned in this document. The size and layout and other characteristics of the projections and depressions can be designed to assist in the attenuation / absorption / reflection of RF radiation. However, in other deployments, such as the one illustrated in Figure 17, the projections 72 can simply serve to raise the surface of the plate 74 above any surface on which the plate is at rest to prevent scratches of the plate 74 and / or the surface in contact with the plate. In other deployments, the projections like those illustrated in Figure 17 can be on both sides of the board to allow air or other circulation to occur beneath the board between the portable electronic device and the board.

[0138] Figures 20 to 25 illustrate several other non-planar formats that can be incorporated into board designs. Figure 20 illustrates a concave shape 76 embedded in / through the cross section of the plate

78. Figure 21 shows a convex shape 80 incorporated in the cross section of the plate 82. Figure 22 shows an alternate shape 84 incorporated in the cross section of the plate 86. The particular dimensions of the shapes 76, 80 and 84 incorporated in the cross section of the plate can assist in attenuating / absorbing / reflecting RF radiation from the portable electronic device. Figures 23 to 25 illustrate other non-flat shapes incorporated in a longer dimension of the plate (longitudinal dimension of the plate). Figure 23 illustrates a concave shape 88 incorporated in the longitudinal dimension of the plate 90. Figure 24 illustrates a wavy shape 92 incorporated in the longitudinal dimension of the plate 94. Figure 25 illustrates a valley shape 96 incorporated in the longitudinal dimension of the plate 98. In various deployments, any combination of cross-section and longitudinal shapes can be combined or used in various plate and plate portion designs. The particular dimensions of the various cross-sectional and longitudinal shapes can be determined / calculated by the desired degree of attenuation / absorption / reflection of the RF radiation from the plate to the portable electronic device. The various formats of the plates disclosed in this document can be manufactured via, by way of non-limiting example, stamping, perforation, casting, forming and any other method for molding a metallic or non-metallic material. The shapes, in several implantations of the plates, can be functional because they can affect RF radiation, or parts of the shapes can be decorative or ornamental, or both functional and decorative / ornamental.

[0139] Many of the various plate deployments disclosed in this document are manufactured from a single unitary material (such as a piece of metal). Various coatings have been disclosed that can be used to coat the plate. In several deployments, however, the board itself can be made of several materials in separate layers from the coatings applied to the board. Referring to Figure 30, a cross-sectional view of an implantation of a plate 100 is illustrated. As illustrated, in this deployment, plate 100 includes an inner layer 102 that is made of a non-metal / non-metallic material, such as any non-metal material disclosed in this document. Two layers 104, 106 of metal or metal-containing material (which can be any metal or metal-containing material disclosed in this document) sandwich the inner layer 102. The two layers 102, 106 can be, by way of non-limiting example, bonded , plated, spray painted, spray coated, deposited, painted, immersed, brushed, electrostatically coated or otherwise coupled to the inner layer 102. The use of the two distinct metal layers 102, 106 can assist in attenuation / reflection / absorption RF radiation from the portable electronic device in various deployments. Additional numbers of metal and non-metal layers (or additional metal layers can be used in various deployments. For example, with reference to Figure 31, five layers of metal 108, 110, 112, 114 and 116 are illustrated stacked in a cross section plate 118. Each layer can be of the same type of metal or a different type of metal or material containing metal, depending on the desired attenuation / reflection / absorption effect of plate 118. More than five layers of metal could be used in various In addition, in several deployments, several layers of stacked and sandwiched non-metal can be included in the cross section of various plate deployments. Any of the metal, metal and non-metal materials disclosed in this document can be used in For example, a layer of ferrite fillers can be painted on either side of the inner non-metal layer, or a layer of metallic tape can be applied on any surface. u either side of the inner layer.

[0140] Figure 30 illustrates the case where the inner layer is a non-metal material. In other deployments, the inner layer can be a metal material instead and the two outer layers can be formed by any of the coating materials disclosed in this document. In some deployments, both layers can be made of non-metal materials. Two or more layers of metals, not metals and any combination thereof used in some deployments.

[0141] The use of various types of coatings and layers of coatings has been disclosed in this document. In various plate deployments, the coatings can cover only a portion of the plate, such as plate 120 shown in Figure 32. Plate 120 has only a portion of the plate covered by coating 122. Partially coated plates can be useful when only a portion of the plate needs corrosion protection or when the coating material itself has an independent effect on the RF radiation from the portable electronic device 124 to which the plate 120 is attached (within a cover or directly attached). In some deployments, the use of multiple non-layered coatings can occur, as shown in Figure 33, when plate 126 has a first coating 128 and a second coating 130 that covers separate portions of plate 126. As the implantation in Figure 31, this technique can be used when the coatings have different purposes or different effects on RF radiation from the portable electronic device 132 to which the plate 126 is attached.

[0142] The various implantations of RF shielding devices and board disclosed in this document have been illustrated to be used between a cover and a rear surface of a portable electronic device or coupled directly to the rear surface of a portable electronic device. In particular deployments, a plate 134 can be attached directly to the cover 136 attached to the portable electronic device 138, as illustrated in Figure 26. The coupling can occur using any of the coupling systems and methods disclosed in this document. In other deployments, as shown in Figure 27, a plate 140 can be slidably coupled into a recess in a cover 142 which is then attached to the rear surface of a portable electronic device 144. When slidable, plate 140 can be held in position through, as a non-limiting example, locks, inserts, fasteners, clamps, flaps or any mechanism to keep a structure in a pocket permanently or non-permanently. Such deployments can provide flexibility for the user to identify the particular degree of RF shielding effect they want and use the corresponding card. Although the cover 142 in Figure 27 is illustrated as being larger than the portable electronic device 138, in other deployments, it may be smaller and attach the portable electronic device to the plate slid in cover 142. In other deployments, however, the plate may not be slid on cover 142, but may be positioned between the bottom cover and the phone similar to other deployments disclosed in this document. In these deployments, the cover can take the form of a plastic clamp that holds the plate against the rear surface of the portable electronic device as the clamp engages over the edges of the portable electronic device.

[0143] In still other deployments, no cover can be used, but instead, a sleeve 146 can be attached directly to the back surface of the portable electronic device 148, as shown in Figure 28. A plate 150 is then coupled to sliding mode on sleeve 146 (of any orientation in relation to the portable electronic device (top, bottom, left, right or diagonal). In some deployments, plate 158 can later be permanently attached to sleeve 152, leaving at least least a portion of the exposed plate 150. In other deployments, the plate 150 may not be exposed after being slid into the sleeve

146. In a similar way, a sleeve 152 can be attached directly to a cover 154 attached to a portable electronic device 156, as shown in Figure 29. A plate 158 is then slidably attached to sleeve 152 (of any orientation in relation to the portable electronic device (top, bottom, left, right or diagonally). In some deployments, plate 158 can later be permanently attached to sleeve 152. Any of the plate implantations disclosed in this document could be used in the implantations illustrated in Figures 26 to 29. A wide variety of materials can be used for the various glove implantations, including, by way of non-limiting example,

plastic, leather, cloth, rubber, which contains metal and any other material that can slide the plate in it.

[0144] In various coverings deployments, certain covers have been designed that allow a portion of the cover flap to rest on a front surface of a portable electronic device while the device is in use or not in use. The flap portion can be rotated away from the front surface when desired. Figure 34 illustrates an implantation of such a cover, in which the flap 160 is hingedly coupled via hinge 162 to the portion 164 of the cover which is coupled on the rear surface of the portable electronic device 166. As illustrated, in several deployments, a plate 168 can be slidably attached to tab 160 to provide RF shielding on the front side of portable electronic device 166 during use. In other deployments, the plate 168 can be sewn, glued or formed on the flap 160. In addition, as illustrated, a plate 170 can be attached directly to the rear of the portion 164 of the cover that is on the rear surface of the portable electronic device ( either inside the cover or between the cover and the rear surface of the portable electronic device). Although the use of plate 170 is illustrated in Figure 34, in other deployments, plate 170 can be omitted, and the function of this plate duplicated by allowing flap 160 (and plate 168) to rotate on the back surface of portion 164 of the cover while the portable electronic device is in use or not in use. In this way, the flexibility of using the board can be increased.

[0145] In other roofing deployments, the flap design 172 (as shown in Figure 35) may take the form of a housing that surrounds at least a portion of the front and side surfaces of the portable electronic device 174 when flap 172 is closed on the front surface of the device 174. As shown, a plate 176 can be included within the structure of the tab 172 (or slidably coupled as in the implantation illustrated in Figure 34). In some deployments, the RF shielding material of plate 176 may extend on one or more sides of the housing, thus providing an RF shielding effect on at least a portion of the sides of the portable electronic device 174. Although the use of a fixed, closed housing design for flap 172 is illustrated in Figure 35, in other deployments, the housing can be formed by one or more additional curved flaps 178 extending from main flange 180, as shown in Figure 36. The one or more additional curved tabs 178 may have openings therein. When the main flap 180 is closed on the front face of the portable electronic device, the curved tabs 178 then close on at least a portion of the sides of the portable electronic device. Since RF shielding materials may be included in curved flaps 178, the effect of curved flaps 178 may be similar to flap flap 172. In some deployments, flap hinge 172 may also include RF shielding materials. A plate 182 is included in the main flap structure 180. Any of the plate deployments disclosed in this document can be used in the cover deployments illustrated in Figures 34 to 36. In some deployments, the entire flap material 172 can be manufactured from one material containing metal. In other deployments, no separate plate can be used when the entire flap 172 is made of a material that contains metal, but flap 172 acts as the plate. In other deployments, a front face opposite the side of the flap that faces the front face of the portable electronic device can be made of, by way of non-limiting example, plastic, glass or any other optically transmissive material. In these deployments, the optically transmissive material may include a portion that contains metal as well.

[0146] The tabs in Figure 34 and 35 can be held on the front face of the portable electronic device using a magnetic coupler or other type of fastener.

[0147] Various plate deployments such as those disclosed in this document can be attached to the rear surface of any portable electronic device using clamps or foldable projections on the plate itself that engage around the sides of the portable electrical device. In these implantations, as in other implantations disclosed in this document, an impregnation material can be attached to the plate itself between the portable electronic device and the plate or on the external surface of the plate.

[0148] Although the use of materials continuously distributed in the form of plates and various supports has so far been disclosed in this document, RF shielding devices such as those disclosed in this document may use dispersed material designs. With reference to Figure 18, an example of such a dispersed material design in the form of a mesh 184 is illustrated. As illustrated, the mesh 184 is composed of a plurality of members oriented perpendicularly 186, 188 coupled through, by way of limiting example, braiding, gluing, welding, welding or any other method for coupling two materials arranged substantially perpendicularly. In various deployments, the plurality of perpendicularly oriented members 186, 188 may include a metallic or metal-containing material such as any disclosed herein. In some deployments, perpendicularly oriented members 186, 188 can be made of the same material; in others, a set of similarly oriented members can be made of a different material than the other set perpendicularly aligned, including non-metallic materials. In some deployments, some of each set of similarly aligned members can be manufactured from two or more different materials, including non-metallic materials. In some deployments, the extremities of the members that are perpendicularly oriented can be left free (such as the implant illustrated in Figure 18). In others, a frame, frame or border bar can be used to secure the ends of the particularly oriented members. In various deployments, the members may not be oriented perpendicularly or substantially perpendicular, but they may be oriented at a wide variety of angles with respect to each other.

[0149] Figure 19 illustrates a mesh 190 which is formed by a plurality of open-spaced openings 192 formed through a sheet of material 194. In the case illustrated in Figure 19, the openings are hexagons, although the openings can have any closed format, in several deployments, do not all need to have the same size or area on the sheet, in several deployments. The material sheet 194 can be any metal or material containing metal disclosed in this document or other material that affects the RF radiation from a portable electronic device disclosed in this document. The dimensioning of the openings formed in the various mesh deployments disclosed in this document can be determined by the desired degree of deflection, absorption or reflection of RF radiation from the desired portable electronic device.

[0150] The various mesh deployments disclosed in this document can be used in place of any of the plate and cover deployments in this document. In some deployments, a mesh implant can be used in combination with a plate implant, depending on the desired effect on RF radiation from the handheld electronic device. In addition, mesh deployments can be employed which are incorporated into any of the coating deployments disclosed also in several deployments. A wide variety of possible applications for various fabrics can be built using the principles disclosed in this document. Multiple meshes of the same or different types disclosed in this document may be used in accordance with any of the deployments disclosed in this document, including with one or more boards.

[0151] Where the above description refers to particular implantations of devices to reflect, deflect and / or absorb electromagnetic radiation emitted from a portable electronic device and related methods and implantation components, subcomponents, methods and sub-methods, it should be promptly It is evident that several modifications can be made without departing from the spirit of the same and that these implantations, components, subcomponents, methods and sub-methods of implantation can be applied to other devices to reflect, deflect and / or absorb electromagnetic radiation emitted from a portable electronic device and other related methods.

Claims (68)

1. Device used with a mobile phone characterized by the fact that it comprises: a plate containing metal configured to be directly attached to a rear surface of a mobile phone, where the plate containing metal comprises a coating; which plate containing metal is configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile phone away from a mobile phone user. 2. Device according to claim 1, characterized by the fact that the metal-containing plate is one of less than, substantially coextensive with, or the same dimension as a perimeter of the rear surface of the mobile phone. 3. Device according to claim 1, characterized by the fact that the metal-containing plate comprises a perimeter that forms any closed shape. 4. Device according to claim 1, characterized in that the metal-containing plate comprises a non-flat surface on a larger surface of the metal-containing plate. 5. Device according to claim 1, characterized by the fact that the metal-containing plate comprises a material selected from the group consisting of copper; gold; silver; platinum; nickel; aluminum; ferrite; shungite; any attenuating, absorbent or radio frequency reflector material; and any combination thereof. 6. Device according to claim 1, characterized by the fact that the coating is selected from the group consisting of a galvanized coating, a non-electrical plated coating, a paint including a wet or dry carrier, a rubber coating, a coating metal, a metal charge coating, a magnetic coating, a transparent coating, a ceramic coating, a powder coating and any combination thereof. 7. Device according to claim 1, characterized by the fact that the metal-containing plate comprises two or more layers, in which one of the two or more layers is a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material. 8. Device according to claim 1, characterized by the fact that it additionally comprises a coupling mechanism on the metal-containing plate, the coupling mechanism configured to couple the metal-containing plate directly to the back surface of the mobile phone, the mechanism coupling selected from the group consisting of an adhesive, hook and loop fasteners, screws, inserts, double-sided tape, polymers, suction cups, magnets and any combination thereof. 9. Device used with a mobile phone characterized by the fact that tivo comprises: a plate configured to be directly attached to a rear surface of a mobile phone or coupled between a cover and the rear surface of the mobile phone, the plate comprising at least two servings; wherein a material from at least one of the at least two portions of the plate is configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile phone away from a mobile phone user. 10. Device according to claim 9, characterized in that the plate comprises at least two portions containing metal. 11. Device according to claim 9, characterized in that the at least two portions of the plate are coupled through a non-metallic portion or metallic portion. 12. Device according to claim 9, characterized by the fact that the non-metallic portion is selected from the group consisting of a binder, a support, a plastic support, a rubber support, a polymer support, a support of wood, a carbon fiber support, a resin support, a glass-reinforced epoxy laminate support, an adhesive, a glue, a molding compound and any combination thereof. 13. Device according to claim 9, characterized in that it additionally comprises a coating, wherein the coating is selected from the group consisting of a galvanized coating, a non-galvanized coating, a paint including a wet or dry carrier, a rubber coating, ceramic coating, metal coating, metal charge coating, magnetic coating, transparent coating, powder coating and any combination thereof. Device according to claim 9, characterized in that at least one of the at least two portions of the plate comprises two or more layers, wherein one of the two or more layers is a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material. 15. Device used with a mobile phone characterized by the fact that the device comprises: a plate configured to be directly attached to a rear surface of a mobile phone or coupled between a cover and the rear surface of the mobile phone, the plate comprising a mesh; wherein a mesh material is configured to deflect, absorb or reflect the electromagnetic radio frequency radiation emitted by the mobile phone away from a mobile phone user. 16. Device according to claim 15, characterized by the fact that the mesh comprises a plurality of members oriented substantially perpendicularly. 17. Device according to claim 15, characterized by the fact that the mesh comprises a plurality of closed-shaped openings spaced through the material. 18. Device according to claim 15, characterized in that it additionally comprises a coupling mechanism on the plate, the coupling mechanism configured to couple the plate directly to the back surface of the mobile phone, the coupling mechanism selected from the group that consists of an adhesive, hook and loop fasteners, screws, inserts, double-sided tape, polymers, suction cups, magnets and any combination thereof. 19. Device according to claim 15, characterized in that the plate comprises two or more layers, in which one of the two or more layers is a metallic material or a non-metallic material and a second of the two or more layers is a non-metallic material or a metallic material. 20. Device according to claim 19, characterized by the fact that one of the two or more layers that is a metallic material is the mesh. 21. Device to deflect RF radiation away from a mobile phone user characterized by the fact that the device comprises: a metal plate configured to be positioned between the mobile phone and at least one of a decorative or protective cover, the plate metal positioned on a back surface of the mobile phone, where the metal plate is removable and not permanently attached to the mobile phone and at least one of the decorative or protective cover and where the metal plate includes: a copper plate; and a powder coating formed on the copper plate. 22. Device according to claim 21, characterized in that the copper plate is configured to cover an entire area of the back surface of the mobile phone. 23. Device according to claim 21, characterized by the fact that the metal plate comprises a transparent coating formed on the powder coating. 24. Device according to claim 23, characterized in that the metal plate comprises a slip resistant material applied to at least one surface of the transparent coating. 25. Device according to claim 21, characterized by the fact that the metal plate comprises evidence formed in the powder coating. 26. Device according to claim 21, characterized by the fact that the copper plate has wavy edges. 27. Device according to claim 21, characterized by the fact that the copper plate has toothed edges. 28. Device according to claim 21, characterized by the fact that the copper plate has a thickness of 0.08 to 0.32 centimeters (1/32 to 1/8 inches). 29. Device for deflecting electromagnetic RF radiation away from a mobile phone user characterized by the fact that the device comprises: a metal plate configured to be positioned between the mobile phone and a portioned cover on a back surface of the mobile phone, where the metal plate is removable and not permanently attached to the mobile phone and the cover, where the metal plate includes: a copper plate configured to cover the back surface of the mobile phone where RF signals radiate from the mobile phone when the mobile phone receives / transmits RF signals; and a powder coating formed on the copper plate. 30. Device according to claim 29, characterized in that the metal plate comprises a transparent coating formed on the powder coating. 31. Device according to claim 30, characterized in that the metal plate comprises a slip-resistant material applied to at least one surface of the transparent coating. 32. Device according to claim 29, characterized by the fact that the metal plate comprises evidence formed in the powder coating. 33. Device according to claim 29, characterized by the fact that the copper plate has wavy edges. 34. Device according to claim 29, characterized by the fact that the copper plate has toothed edges. 35. Device according to claim 29, characterized by the fact that the copper plate has a thickness of 0.08 to 0.32 centimeters (1/32 to 1/8 inches). 36. Device to deflect RF radiation away from a mobile phone user characterized by the fact that the device comprises: a metal plate configured to be positioned between the mobile phone and a portioned cover on a back surface of the mobile phone, in that the metal plate is removable and not permanently attached to the mobile phone and the cover, where the metal plate includes: a copper plate configured to cover the back surface of the mobile phone where RF signals radiate when the mobile phone receives / transmits signals RF; a powder coating formed on the copper plate; a transparent coating formed on the powder coating; and a slip resistant material applied to at least one surface of the transparent coating. 37. Device according to claim 36, characterized by the fact that the metal plate comprises evidence formed in the powder coating. 38. Device according to claim 36, characterized by the fact that the copper plate has wavy edges. 39. Device according to claim 36, characterized by the fact that the copper plate has toothed edges. 40. Device according to claim 36, characterized by the fact that the copper plate is rectangular in shape. 41. Device used with a mobile phone characterized by the fact that the device comprises: a metal plate configured to be arranged between the mobile phone and a cover, in which the metal plate has a coating, and in which the device deflects electromagnetic RF radiation away from the mobile phone user. 42. Device according to claim 41, characterized by the fact that the device is rectangular in shape. 43. Device according to claim 41, characterized by the fact that the device is of a non-rectangular shape. 44. Device according to claim 41, characterized in that the device is similar in shape to a credit card and sized to cover at least a portion of the back surface of the mobile phone. 45. Device according to claim 41, characterized by the fact that the device is removably coupled to at least one of the mobile phone or the cover. 46. Device according to claim 41, characterized in that the device includes at least one groove. 47. Device according to claim 41, characterized in that the cover is positioned over at least a portion of the device and at least a portion of a rear surface of the mobile phone. 48. Device according to claim 41, characterized in that the device is sized to cover at least a portion of a mobile phone antenna. 49. Device according to claim 41, characterized in that the device is configured to cover at least a portion of an area of the mobile phone that emits electromagnetic radiation. 50. Device according to claim 41, characterized in that the device has an edge of a shape selected from the group consisting of at least one straight, curved, wave, undulating and notched. 51. Device according to claim 41, characterized by the fact that the device is sized in proportion to the size of the mobile phone. 52. Device used with a mobile phone characterized by the fact that the device comprises: a metal plate configured to be arranged between the mobile phone and a cover, where the metal plate has a coating, where the cover is positioned on at least a portion of the device, and the device deflects electromagnetic RF radiation away from the mobile phone user. 53. Device according to claim 52, characterized by the fact that the device is rectangular in shape. 54. Device according to claim 52, characterized by the fact that the device is of a non-rectangular shape. 55. Device according to claim 52, characterized in that the device is similar in shape to a credit card and sized to cover at least a portion of the back surface of the mobile phone. 56. Device according to claim 52, characterized in that the device is removably coupled to at least one of the mobile phone or the cover. 57. Device according to claim 52, characterized in that the device includes at least one groove. 58. Device according to claim 52, characterized in that the cover is positioned on at least a portion of a rear surface of the mobile phone. 59. Device according to claim 52, characterized in that the device is sized to cover at least a portion of a mobile phone antenna. 60. Device according to claim 52, characterized in that the device is configured to cover at least a portion of an area of the mobile phone that emits electromagnetic radiation. 61. Device according to claim 52, characterized in that the device has an edge of a shape selected from the group consisting of at least one straight, curved, wave, undulating and notched. 62. Device according to claim 52, characterized by the fact that the device is sized proportional to the size of the mobile phone. 63. Device for deflecting electromagnetic radiation away from a mobile phone user characterized by the fact that the device comprises: a metal plate configured to deflect electromagnetic radiation away from the mobile phone user; and a coating that covers the metal plate. 64. Device according to claim 9, characterized by the fact that the plate comprises a material selected from the group consisting of copper; gold; silver; platinum; nickel; aluminum; ferrite; shungite; any attenuating, absorbent or radio frequency reflector material; and any combination thereof. 65. Device according to claim 15, characterized by the fact that the plate comprises a material selected from the group consisting of copper; gold; silver; platinum; nickel; aluminum; ferrite; shungite; any attenuating, absorbent or radio frequency reflector material; and any combination thereof. 66. Device according to claim 15, characterized in that it additionally comprises a coating, in which the coating is selected from the group consisting of a galvanized coating, a non-galvanized coating, a paint including a wet or dry carrier, a rubber coating, ceramic coating, metal coating, metal charge coating, magnetic coating, transparent coating, powder coating and any combination thereof. 67. Device according to claim 9, characterized by the fact that the two portions of the plate each comprise a perimeter that forms any closed shape. 68. Device according to claim 15, characterized by the fact that the plate comprises a perimeter that forms any closed shape.