BR112017027837A2 - sistema de gerenciamento térmico - Google Patents

sistema de gerenciamento térmico

Info

Publication number
BR112017027837A2
BR112017027837A2 BR112017027837A BR112017027837A BR112017027837A2 BR 112017027837 A2 BR112017027837 A2 BR 112017027837A2 BR 112017027837 A BR112017027837 A BR 112017027837A BR 112017027837 A BR112017027837 A BR 112017027837A BR 112017027837 A2 BR112017027837 A2 BR 112017027837A2
Authority
BR
Brazil
Prior art keywords
management system
thermal management
base
extending away
portion extending
Prior art date
Application number
BR112017027837A
Other languages
English (en)
Inventor
Pieter Jacobus De Bock Hendrik
Kumar Bodla Karthik
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BR112017027837A2 publication Critical patent/BR112017027837A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)

Abstract

realizações de um sistema de gerenciamento térmico são fornecidas no presente documento. em algumas realizações, um sistema de gerenciamento térmico pode incluir uma placa de base; e uma pluralidade de aletas tridimensionais acopladas à base, sendo que cada uma dentre a pluralidade de aletas tridimensionais compreende uma primeira porção que se estende para longe da base em uma primeira direção e uma segunda porção que se estende para longe da primeira porção em uma segunda direção diferente da primeira direção.
BR112017027837A 2015-07-06 2016-07-06 sistema de gerenciamento térmico BR112017027837A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562188956P 2015-07-06 2015-07-06
PCT/US2016/041152 WO2017007828A1 (en) 2015-07-06 2016-07-06 Thermal management system

Publications (1)

Publication Number Publication Date
BR112017027837A2 true BR112017027837A2 (pt) 2018-09-04

Family

ID=56551563

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017027837A BR112017027837A2 (pt) 2015-07-06 2016-07-06 sistema de gerenciamento térmico

Country Status (5)

Country Link
US (1) US10598443B2 (pt)
EP (1) EP3320557A1 (pt)
BR (1) BR112017027837A2 (pt)
CA (1) CA2989645A1 (pt)
WO (1) WO2017007828A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3969829A4 (en) * 2019-05-14 2023-01-18 Holo, Inc. HEAT MANAGEMENT DEVICES, SYSTEMS AND METHODS

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3217793A (en) * 1962-11-30 1965-11-16 Wakefield Eng Inc Heat transfer
JPS5846660B2 (ja) 1980-08-22 1983-10-18 マツダ株式会社 内燃機関用ピストンのモデルの製造法
JPS5846660A (ja) * 1981-09-15 1983-03-18 Nippon Light Metal Co Ltd ヒ−トシンクの製造法
US4899810A (en) * 1987-10-22 1990-02-13 General Electric Company Low pressure drop condenser/heat pipe heat exchanger
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
EP0883179A3 (en) * 1997-06-04 2000-04-26 Lsi Logic Corporation Spiral pin-fin heatsink for electronic packages
US5946190A (en) * 1997-08-29 1999-08-31 Hewlett-Packard Company Ducted high aspect ratio heatsink assembly
JP2000021650A (ja) 1998-06-26 2000-01-21 Matsushita Electric Ind Co Ltd 冷却装置
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
MY126022A (en) * 2001-06-15 2006-09-29 Wong Chee Tieng Heat sink
US6453987B1 (en) * 2001-10-19 2002-09-24 Chunyao Cheng Unitary heat-dissipating fin strip unit with straight strip portions and U-shaped strip portions
CA2691738A1 (en) * 2007-07-05 2009-01-08 Fawoo Technology Co., Ltd. Heat dissipating device having linear heat dissipating unit and fanless led lamp using the device
US8235094B2 (en) * 2007-07-31 2012-08-07 Adc Telecommunications, Inc. Apparatus for transferring heat in a fin of a heat sink
US20110132570A1 (en) * 2009-12-08 2011-06-09 Wilmot George E Compound geometry heat exchanger fin
JP5297398B2 (ja) 2010-01-26 2013-09-25 株式会社日立製作所 全閉型電動機
TW201502459A (zh) 2013-07-10 2015-01-16 Hon Hai Prec Ind Co Ltd 散熱器
TW201509286A (zh) 2013-08-29 2015-03-01 Delta Electronics Inc 組合式鋁擠型散熱器
JP5846660B2 (ja) 2014-09-02 2016-01-20 サミー株式会社 スロットマシン

Also Published As

Publication number Publication date
US20170023313A1 (en) 2017-01-26
US10598443B2 (en) 2020-03-24
CA2989645A1 (en) 2017-01-12
WO2017007828A1 (en) 2017-01-12
EP3320557A1 (en) 2018-05-16

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]