BR112014031757A2 - arc evaporation source - Google Patents
arc evaporation sourceInfo
- Publication number
- BR112014031757A2 BR112014031757A2 BR112014031757A BR112014031757A BR112014031757A2 BR 112014031757 A2 BR112014031757 A2 BR 112014031757A2 BR 112014031757 A BR112014031757 A BR 112014031757A BR 112014031757 A BR112014031757 A BR 112014031757A BR 112014031757 A2 BR112014031757 A2 BR 112014031757A2
- Authority
- BR
- Brazil
- Prior art keywords
- magnetic field
- guide magnet
- target
- field guide
- rear side
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/358—Inductive energy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
resumo patente de invenção: "fonte de evaporação de arco". a presente invenção refere-se a uma fonte de evaporação de arco equipada com um alvo, um ímã de guia de campo magnético em forma de anel e uma fonte de geração de campo magnético de lado traseiro. o ímã de guia de campo magnético está alinhado em uma direção perpendicular à face de evaporação do alvo e tem uma polaridade que é a direção de magnetização que faceia para frente ou para trás. a fonte de geração de campo magnético de lado traseiro está disposta na traseira do ímã de guia de campo magnético, o qual é o lado do lado traseiro do alvo, e forma linhas de força magnética que correm na direção de magnetização do ímã de guia de campo magnético. o alvo está disposto de modo que a face de evaporação fique posicionada na frente do ímã de guia de campo magnético.Patent Summary: "Arc Evaporation Source". The present invention relates to a target evaporating arc source, a ring-shaped magnetic field guide magnet and a rear side magnetic field generation source. The magnetic field guide magnet is aligned in a direction perpendicular to the evaporating face of the target and has a polarity which is the magnetization direction facing forward or backward. the rear side magnetic field generation source is disposed on the rear of the magnetic field guide magnet, which is the rear side of the target, and forms magnetic force lines that run in the magnetization direction of the magnetic field guide magnet. magnetic field. The target is arranged such that the evaporation face is positioned in front of the magnetic field guide magnet.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-139078 | 2012-06-20 | ||
JP2012139078A JP5946337B2 (en) | 2012-06-20 | 2012-06-20 | Arc type evaporation source |
PCT/JP2013/066088 WO2013191038A1 (en) | 2012-06-20 | 2013-06-11 | Arc-type evaporation source |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112014031757A2 true BR112014031757A2 (en) | 2017-06-27 |
BR112014031757B1 BR112014031757B1 (en) | 2021-05-25 |
Family
ID=49768638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014031757-7A BR112014031757B1 (en) | 2012-06-20 | 2013-06-11 | arc evaporation source |
Country Status (10)
Country | Link |
---|---|
US (1) | US9818586B2 (en) |
EP (1) | EP2865783B1 (en) |
JP (1) | JP5946337B2 (en) |
KR (1) | KR101629131B1 (en) |
BR (1) | BR112014031757B1 (en) |
CA (1) | CA2871419C (en) |
IL (1) | IL235153A0 (en) |
MX (1) | MX2014015146A (en) |
TW (1) | TWI491752B (en) |
WO (1) | WO2013191038A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6403269B2 (en) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | Arc evaporation source |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11269634A (en) * | 1998-03-20 | 1999-10-05 | Kobe Steel Ltd | Vacuum arc evaporation source |
TWI242049B (en) | 1999-01-14 | 2005-10-21 | Kobe Steel Ltd | Vacuum arc evaporation source and vacuum arc vapor deposition apparatus |
DE60105856T2 (en) | 2001-03-27 | 2005-10-20 | Fundación Tekniker | BOW EVAPORATOR WITH INTENSIVE MAGNETIC GUIDE FOR LARGE-SIZED TARGETS |
US7211138B2 (en) | 2003-02-07 | 2007-05-01 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Hard film, method of forming the same and target for hard film formation |
JP4456374B2 (en) * | 2003-02-07 | 2010-04-28 | 株式会社神戸製鋼所 | Hard film, method for producing the same, and target for forming hard film |
EP1970464B1 (en) * | 2005-12-16 | 2010-03-03 | Fundacion Tekniker | Cathode evaporation machine |
RU2448388C2 (en) | 2006-05-16 | 2012-04-20 | Эрликон Трейдинг Аг, Трюббах | Electroarc source and magnetic accessory |
JP5063143B2 (en) * | 2007-03-02 | 2012-10-31 | 株式会社リケン | Arc type evaporation source |
KR101641991B1 (en) | 2007-04-17 | 2016-07-29 | 술저 메타플라스 게엠베하 | Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source |
WO2009090994A1 (en) * | 2008-01-15 | 2009-07-23 | Ulvac, Inc. | Substrate stage, sputtering apparatus provided with substrate stage, and film forming method |
DE112008004247T5 (en) * | 2008-12-26 | 2012-04-12 | Fundación Tekniker | Arc evaporator and method for operating the evaporator |
JP5649308B2 (en) | 2009-04-28 | 2015-01-07 | 株式会社神戸製鋼所 | Arc type evaporation source having high film forming speed and method for producing coating film using this arc type evaporation source |
JP5318052B2 (en) | 2010-06-23 | 2013-10-16 | 株式会社神戸製鋼所 | Arc type evaporation source having high film forming speed, film manufacturing method and film forming apparatus using this arc type evaporation source |
KR20130121955A (en) * | 2011-02-23 | 2013-11-06 | 가부시키가이샤 고베 세이코쇼 | Arc evaporation source |
KR20130106575A (en) * | 2012-03-20 | 2013-09-30 | (주)유진에스엠씨 | Vacuum arc evaporation unit and arc ion plating apparatus including the same |
-
2012
- 2012-06-20 JP JP2012139078A patent/JP5946337B2/en active Active
-
2013
- 2013-06-11 CA CA2871419A patent/CA2871419C/en not_active Expired - Fee Related
- 2013-06-11 BR BR112014031757-7A patent/BR112014031757B1/en active IP Right Grant
- 2013-06-11 EP EP13806135.3A patent/EP2865783B1/en active Active
- 2013-06-11 MX MX2014015146A patent/MX2014015146A/en unknown
- 2013-06-11 KR KR1020147035083A patent/KR101629131B1/en active IP Right Grant
- 2013-06-11 US US14/397,550 patent/US9818586B2/en active Active
- 2013-06-11 WO PCT/JP2013/066088 patent/WO2013191038A1/en active Application Filing
- 2013-06-19 TW TW102121731A patent/TWI491752B/en active
-
2014
- 2014-10-19 IL IL235153A patent/IL235153A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP2865783A4 (en) | 2015-12-30 |
IL235153A0 (en) | 2014-12-31 |
CA2871419C (en) | 2019-03-12 |
EP2865783A1 (en) | 2015-04-29 |
BR112014031757B1 (en) | 2021-05-25 |
WO2013191038A1 (en) | 2013-12-27 |
KR20150008494A (en) | 2015-01-22 |
US20150122644A1 (en) | 2015-05-07 |
KR101629131B1 (en) | 2016-06-09 |
CA2871419A1 (en) | 2013-12-27 |
JP5946337B2 (en) | 2016-07-06 |
JP2014001440A (en) | 2014-01-09 |
TWI491752B (en) | 2015-07-11 |
US9818586B2 (en) | 2017-11-14 |
EP2865783B1 (en) | 2019-12-11 |
MX2014015146A (en) | 2015-03-05 |
TW201414866A (en) | 2014-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06I | Publication of requirement cancelled [chapter 6.9 patent gazette] |
Free format text: ANULADA A PUBLICACAO CODIGO 6.6.1 NA RPI NO 2462 DE 13/03/2018 POR TER SIDO INDEVIDA. |
|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/06/2013, OBSERVADAS AS CONDICOES LEGAIS. |