BR112014031757A2 - arc evaporation source - Google Patents

arc evaporation source

Info

Publication number
BR112014031757A2
BR112014031757A2 BR112014031757A BR112014031757A BR112014031757A2 BR 112014031757 A2 BR112014031757 A2 BR 112014031757A2 BR 112014031757 A BR112014031757 A BR 112014031757A BR 112014031757 A BR112014031757 A BR 112014031757A BR 112014031757 A2 BR112014031757 A2 BR 112014031757A2
Authority
BR
Brazil
Prior art keywords
magnetic field
guide magnet
target
field guide
rear side
Prior art date
Application number
BR112014031757A
Other languages
Portuguese (pt)
Other versions
BR112014031757B1 (en
Inventor
Yamamoto Kenji
Tanifuji Shinichi
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of BR112014031757A2 publication Critical patent/BR112014031757A2/en
Publication of BR112014031757B1 publication Critical patent/BR112014031757B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/358—Inductive energy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

resumo patente de invenção: "fonte de evaporação de arco". a presente invenção refere-se a uma fonte de evaporação de arco equipada com um alvo, um ímã de guia de campo magnético em forma de anel e uma fonte de geração de campo magnético de lado traseiro. o ímã de guia de campo magnético está alinhado em uma direção perpendicular à face de evaporação do alvo e tem uma polaridade que é a direção de magnetização que faceia para frente ou para trás. a fonte de geração de campo magnético de lado traseiro está disposta na traseira do ímã de guia de campo magnético, o qual é o lado do lado traseiro do alvo, e forma linhas de força magnética que correm na direção de magnetização do ímã de guia de campo magnético. o alvo está disposto de modo que a face de evaporação fique posicionada na frente do ímã de guia de campo magnético.Patent Summary: "Arc Evaporation Source". The present invention relates to a target evaporating arc source, a ring-shaped magnetic field guide magnet and a rear side magnetic field generation source. The magnetic field guide magnet is aligned in a direction perpendicular to the evaporating face of the target and has a polarity which is the magnetization direction facing forward or backward. the rear side magnetic field generation source is disposed on the rear of the magnetic field guide magnet, which is the rear side of the target, and forms magnetic force lines that run in the magnetization direction of the magnetic field guide magnet. magnetic field. The target is arranged such that the evaporation face is positioned in front of the magnetic field guide magnet.

BR112014031757-7A 2012-06-20 2013-06-11 arc evaporation source BR112014031757B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-139078 2012-06-20
JP2012139078A JP5946337B2 (en) 2012-06-20 2012-06-20 Arc type evaporation source
PCT/JP2013/066088 WO2013191038A1 (en) 2012-06-20 2013-06-11 Arc-type evaporation source

Publications (2)

Publication Number Publication Date
BR112014031757A2 true BR112014031757A2 (en) 2017-06-27
BR112014031757B1 BR112014031757B1 (en) 2021-05-25

Family

ID=49768638

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014031757-7A BR112014031757B1 (en) 2012-06-20 2013-06-11 arc evaporation source

Country Status (10)

Country Link
US (1) US9818586B2 (en)
EP (1) EP2865783B1 (en)
JP (1) JP5946337B2 (en)
KR (1) KR101629131B1 (en)
BR (1) BR112014031757B1 (en)
CA (1) CA2871419C (en)
IL (1) IL235153A0 (en)
MX (1) MX2014015146A (en)
TW (1) TWI491752B (en)
WO (1) WO2013191038A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6403269B2 (en) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 Arc evaporation source

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11269634A (en) * 1998-03-20 1999-10-05 Kobe Steel Ltd Vacuum arc evaporation source
TWI242049B (en) 1999-01-14 2005-10-21 Kobe Steel Ltd Vacuum arc evaporation source and vacuum arc vapor deposition apparatus
DE60105856T2 (en) 2001-03-27 2005-10-20 Fundación Tekniker BOW EVAPORATOR WITH INTENSIVE MAGNETIC GUIDE FOR LARGE-SIZED TARGETS
US7211138B2 (en) 2003-02-07 2007-05-01 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Hard film, method of forming the same and target for hard film formation
JP4456374B2 (en) * 2003-02-07 2010-04-28 株式会社神戸製鋼所 Hard film, method for producing the same, and target for forming hard film
EP1970464B1 (en) * 2005-12-16 2010-03-03 Fundacion Tekniker Cathode evaporation machine
RU2448388C2 (en) 2006-05-16 2012-04-20 Эрликон Трейдинг Аг, Трюббах Electroarc source and magnetic accessory
JP5063143B2 (en) * 2007-03-02 2012-10-31 株式会社リケン Arc type evaporation source
KR101641991B1 (en) 2007-04-17 2016-07-29 술저 메타플라스 게엠베하 Vacuum arc vaporization source, and an arc vaporization chamber with a vacuum arc vaporization source
WO2009090994A1 (en) * 2008-01-15 2009-07-23 Ulvac, Inc. Substrate stage, sputtering apparatus provided with substrate stage, and film forming method
DE112008004247T5 (en) * 2008-12-26 2012-04-12 Fundación Tekniker Arc evaporator and method for operating the evaporator
JP5649308B2 (en) 2009-04-28 2015-01-07 株式会社神戸製鋼所 Arc type evaporation source having high film forming speed and method for producing coating film using this arc type evaporation source
JP5318052B2 (en) 2010-06-23 2013-10-16 株式会社神戸製鋼所 Arc type evaporation source having high film forming speed, film manufacturing method and film forming apparatus using this arc type evaporation source
KR20130121955A (en) * 2011-02-23 2013-11-06 가부시키가이샤 고베 세이코쇼 Arc evaporation source
KR20130106575A (en) * 2012-03-20 2013-09-30 (주)유진에스엠씨 Vacuum arc evaporation unit and arc ion plating apparatus including the same

Also Published As

Publication number Publication date
EP2865783A4 (en) 2015-12-30
IL235153A0 (en) 2014-12-31
CA2871419C (en) 2019-03-12
EP2865783A1 (en) 2015-04-29
BR112014031757B1 (en) 2021-05-25
WO2013191038A1 (en) 2013-12-27
KR20150008494A (en) 2015-01-22
US20150122644A1 (en) 2015-05-07
KR101629131B1 (en) 2016-06-09
CA2871419A1 (en) 2013-12-27
JP5946337B2 (en) 2016-07-06
JP2014001440A (en) 2014-01-09
TWI491752B (en) 2015-07-11
US9818586B2 (en) 2017-11-14
EP2865783B1 (en) 2019-12-11
MX2014015146A (en) 2015-03-05
TW201414866A (en) 2014-04-16

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06I Publication of requirement cancelled [chapter 6.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 6.6.1 NA RPI NO 2462 DE 13/03/2018 POR TER SIDO INDEVIDA.

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/06/2013, OBSERVADAS AS CONDICOES LEGAIS.