BR112014028034A2 - método para criar uma linha fendida em um substrato de múltiplas camadas e circuito impresso de múltiplas camadas compreendendo pelo menos uma linha fendida construída de acordo com o dito método e usada como uma fenda de isolamento ou antena - Google Patents

método para criar uma linha fendida em um substrato de múltiplas camadas e circuito impresso de múltiplas camadas compreendendo pelo menos uma linha fendida construída de acordo com o dito método e usada como uma fenda de isolamento ou antena

Info

Publication number
BR112014028034A2
BR112014028034A2 BR112014028034A BR112014028034A BR112014028034A2 BR 112014028034 A2 BR112014028034 A2 BR 112014028034A2 BR 112014028034 A BR112014028034 A BR 112014028034A BR 112014028034 A BR112014028034 A BR 112014028034A BR 112014028034 A2 BR112014028034 A2 BR 112014028034A2
Authority
BR
Brazil
Prior art keywords
slit
band
conductive layer
slit line
line
Prior art date
Application number
BR112014028034A
Other languages
English (en)
Portuguese (pt)
Inventor
Lo Hine Tong Dominique
Luc Robert Jean
Minard Philippe
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Publication of BR112014028034A2 publication Critical patent/BR112014028034A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/023—Fin lines; Slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/106—Microstrip slot antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguide Aerials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Details Of Aerials (AREA)
BR112014028034A 2012-05-14 2013-05-06 método para criar uma linha fendida em um substrato de múltiplas camadas e circuito impresso de múltiplas camadas compreendendo pelo menos uma linha fendida construída de acordo com o dito método e usada como uma fenda de isolamento ou antena BR112014028034A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1254368A FR2990591A1 (fr) 2012-05-14 2012-05-14 Procede de realisation d'une ligne-fente sur un substrat multicouche et circuit imprime multicouche comportant au moins une ligne-fente realisee selon ledit procede et utilisee comme fente isolante ou antenne
PCT/EP2013/059394 WO2013171087A1 (en) 2012-05-14 2013-05-06 Method for creating a slot-line on a multilayer substrate and multilayer printed circuit comprising at least one slot-line realized according to said method and used as an isolating slot or antenna

Publications (1)

Publication Number Publication Date
BR112014028034A2 true BR112014028034A2 (pt) 2017-06-27

Family

ID=46785566

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014028034A BR112014028034A2 (pt) 2012-05-14 2013-05-06 método para criar uma linha fendida em um substrato de múltiplas camadas e circuito impresso de múltiplas camadas compreendendo pelo menos uma linha fendida construída de acordo com o dito método e usada como uma fenda de isolamento ou antena

Country Status (12)

Country Link
US (1) US9660350B2 (enExample)
EP (1) EP2850692B1 (enExample)
JP (1) JP6329942B2 (enExample)
KR (1) KR20150009592A (enExample)
CN (1) CN104380528A (enExample)
AU (1) AU2013261937B2 (enExample)
BR (1) BR112014028034A2 (enExample)
ES (1) ES2662914T3 (enExample)
FR (1) FR2990591A1 (enExample)
PL (1) PL2850692T3 (enExample)
TW (1) TWI593164B (enExample)
WO (1) WO2013171087A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3163676B1 (en) * 2015-10-29 2019-04-24 Thomson Licensing Circuit board for an antenna assembly
WO2017082863A1 (en) * 2015-11-10 2017-05-18 Hewlett-Packard Development Company, L. P. Dual band slot antenna
US10910692B2 (en) 2017-11-28 2021-02-02 Taoglas Group Holdings Limited In-glass high performance antenna
US11108141B2 (en) 2018-09-12 2021-08-31 Taoglas Group Holdings Limited Embedded patch antennas, systems and methods
US20220029296A1 (en) * 2019-01-10 2022-01-27 Japan Aviation Electronics Industry, Limited Antenna and communication device
CN113594685B (zh) * 2020-04-30 2023-09-26 北京小米移动软件有限公司 一种移动终端的多层电路板及终端设备

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JPH11251829A (ja) 1998-02-27 1999-09-17 Kyocera Corp スロットアンテナ及びそれを具備する配線基板
US6343208B1 (en) * 1998-12-16 2002-01-29 Telefonaktiebolaget Lm Ericsson (Publ) Printed multi-band patch antenna
FI115343B (fi) * 2001-10-22 2005-04-15 Filtronic Lk Oy Sisäinen monikaista-antenni
US6624789B1 (en) 2002-04-11 2003-09-23 Nokia Corporation Method and system for improving isolation in radio-frequency antennas
US6850205B2 (en) * 2002-07-31 2005-02-01 Matsushita Electric Industrial Co., Ltd. Waveguide antenna apparatus provided with rectangular waveguide and array antenna apparatus employing the waveguide antenna apparatus
FI114836B (fi) 2002-09-19 2004-12-31 Filtronic Lk Oy Sisäinen antenni
JP4063729B2 (ja) * 2003-07-17 2008-03-19 株式会社日立製作所 アンテナ及び無線端末
FI120607B (fi) * 2003-10-31 2009-12-15 Pulse Finland Oy Monikaistainen tasoantenni
CN1773772A (zh) * 2004-11-10 2006-05-17 智捷科技股份有限公司 一种双极天线
WO2006097496A1 (en) * 2005-03-15 2006-09-21 Fractus, S.A. Slotted ground-plane used as a slot antenna or used for a pifa antenna
CN1885613B (zh) * 2005-06-24 2011-06-22 连展科技电子（昆山）有限公司 一种倒f型天线
JP2007013643A (ja) * 2005-06-30 2007-01-18 Lenovo Singapore Pte Ltd 一体型平板多素子アンテナ及び電子機器
JP4651110B2 (ja) * 2006-03-07 2011-03-16 国立大学法人横浜国立大学 無線受信用小型携帯端末装置
US7592968B2 (en) * 2006-03-23 2009-09-22 Tdk Corporation Embedded antenna
CN101106215B (zh) 2007-08-20 2011-04-20 哈尔滨工程大学 半u型开槽叠层宽频带微带天线
US7786942B2 (en) * 2008-01-04 2010-08-31 Chen Mexx Hybrid dual dipole single slot antenna for MIMO communication systems
JP2011512740A (ja) * 2008-02-14 2011-04-21 ジンウェーブ リミテッド 通信システム
FI20085907A7 (fi) * 2008-09-25 2010-03-26 Pulse Finland Oy Antenniyhdistelmä
FI20095085L (fi) * 2009-01-30 2010-07-31 Pulse Finland Oy Moniresonanssiantenni
JP4788791B2 (ja) 2009-02-27 2011-10-05 Ｔｄｋ株式会社 アンテナ装置
FR2942915A1 (fr) * 2009-03-06 2010-09-10 Thomson Licensing Systeme d'antennes compact
US8085202B2 (en) * 2009-03-17 2011-12-27 Research In Motion Limited Wideband, high isolation two port antenna array for multiple input, multiple output handheld devices
CN201754431U (zh) * 2010-03-31 2011-03-02 联想(北京)有限公司 微带馈电天线及移动终端
CN102280700B (zh) * 2011-05-05 2014-06-18 电子科技大学 印刷宽带终端天线
FR2986110A1 (fr) 2012-01-20 2013-07-26 Thomson Licensing Perfectionnement a l'isolation d'antennes montees sur une carte de circuit imprime

Also Published As

Publication number Publication date
AU2013261937A1 (en) 2014-11-27
KR20150009592A (ko) 2015-01-26
JP6329942B2 (ja) 2018-05-23
ES2662914T3 (es) 2018-04-10
JP2015520573A (ja) 2015-07-16
US9660350B2 (en) 2017-05-23
CN104380528A (zh) 2015-02-25
PL2850692T3 (pl) 2018-05-30
EP2850692A1 (en) 2015-03-25
EP2850692B1 (en) 2018-02-14
FR2990591A1 (fr) 2013-11-15
TWI593164B (zh) 2017-07-21
HK1208560A1 (en) 2016-03-04
WO2013171087A1 (en) 2013-11-21
TW201351780A (zh) 2013-12-16
AU2013261937B2 (en) 2017-04-13
US20150123861A1 (en) 2015-05-07

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2565 DE 2020-03-03