BR112012027737A2 - "METHOD FOR FORMING A MICRONEEDLE ASSEMBLY, INJECTION MOLDED MICRONEEDLE ASSEMBLY AND TRANSDERMAL PATCH" - Google Patents
"METHOD FOR FORMING A MICRONEEDLE ASSEMBLY, INJECTION MOLDED MICRONEEDLE ASSEMBLY AND TRANSDERMAL PATCH"Info
- Publication number
- BR112012027737A2 BR112012027737A2 BR112012027737A BR112012027737A BR112012027737A2 BR 112012027737 A2 BR112012027737 A2 BR 112012027737A2 BR 112012027737 A BR112012027737 A BR 112012027737A BR 112012027737 A BR112012027737 A BR 112012027737A BR 112012027737 A2 BR112012027737 A2 BR 112012027737A2
- Authority
- BR
- Brazil
- Prior art keywords
- microneedle assembly
- microneedles
- injection molded
- forming
- transdermal patch
- Prior art date
Links
Abstract
MÉTODO PARA FORMAÇÃO DE UM CONJUNTO DE MICROAGULHAS, CONJUNTO DE MICROAGULHAS MOLDADAS POR INJEÇÃO E EMPLASTRO TRANSDÉRMICO. A presente invenção descreve dispositivos moldados por injeção incluindo microagulhas em uma base de substrato. As microagulhas podem incluir uma pluralidade de estruturas nanodimensionadas fabricadas sobre elas. Os moldes usados para formar as microagulhas são montados a partir de uma pluralidade de segmentos de molde, cada um definindo porções das microagulhas. Quando da moldagem dos múltiplos segmentos de molde, são formadas cavidades negativas de microagulha. Os moldes podem ser usados em um processo de moldagem por injeção, para formar disposições de microagulhas. Os dispositivos podem ser utilizados para interação com um componente do tecido conectivo dérmico.METHOD FOR FORMING A MICRONEEDLE ASSEMBLY, INJECTION MOLDED MICRONEEDLE ASSEMBLY AND TRANSDERMAL PATCH. The present invention describes injection molded devices including microneedles in a substrate base. The microneedles can include a plurality of nanosized structures fabricated thereon. The molds used to form the microneedles are assembled from a plurality of mold segments, each defining portions of the microneedles. When molding the multiple mold segments, negative microneedle cavities are formed. The molds can be used in an injection molding process to form arrays of microneedles. The devices can be used to interact with a dermal connective tissue component.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41107110P | 2010-11-08 | 2010-11-08 | |
US201161435939P | 2011-01-25 | 2011-01-25 | |
PCT/IB2011/051860 WO2012020332A2 (en) | 2010-04-28 | 2011-04-27 | Injection molded microneedle array and method for forming the microneedle array |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012027737A2 true BR112012027737A2 (en) | 2017-08-15 |
Family
ID=85415084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012027737A BR112012027737A2 (en) | 2010-11-08 | 2011-04-27 | "METHOD FOR FORMING A MICRONEEDLE ASSEMBLY, INJECTION MOLDED MICRONEEDLE ASSEMBLY AND TRANSDERMAL PATCH" |
Country Status (1)
Country | Link |
---|---|
BR (1) | BR112012027737A2 (en) |
-
2011
- 2011-04-27 BR BR112012027737A patent/BR112012027737A2/en not_active IP Right Cessation
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Legal Events
Date | Code | Title | Description |
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B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2433 DE 22-08-2017 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
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B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B350 | Update of information on the portal [chapter 15.35 patent gazette] |