BR102022020213A2 - OPTICAL IMAGING SYSTEM; CAMERA MODULE AND ELECTRONIC DEVICE - Google Patents

Abstract

An optical imaging system is described that includes an infrared light absorbing element, an infrared light reducing film, and a plate element in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. The plate element is disposed between the infrared light reducing film and the image surface, the plate element includes a translucent portion, a support portion and a conical structure coating. The conical structure coating is disposed on at least one of an incident surface and an exit surface of the translucent portion.

Description

OPTICAL IMAGING SYSTEM; CAMERA MODULE AND ELECTRONIC DEVICE FUNDAMENTALS Technical field

[0001] The present description refers to an optical imaging system and a camera module. More particularly, the present disclosure relates to an optical imaging system and a camera module applicable to portable electronic devices.

Description of Related Technique 2

[0002] In recent years, portable electronic devices have developed rapidly. For example, smart electronic devices and tablets have filled modern people's lives, and camera modules and optical imaging systems mounted on portable electronic devices have also thrived. However, as technology advances, the quality requirements of the optical imaging system and camera module are becoming increasingly higher.

[0003] In particular, the filter of the prior art camera module is disposed between the image lens assembly and the image sensor, wherein the filter may be configured to filter infrared light and ultraviolet light, but the present description is not limited to them. The filter can usually be configured to protect the image sensor to prevent fine dust from clinging to the photosensitive surface of the image sensor. However, the ghost image is easily formed under the condition of the filter radiated through the glow, and the dimension of the filter is limited due to the mounting requirement and the light filtering requirement, so the back focus of the optical imaging system is influenced and therefore imaging optical system with high quality and compact size is hardly designed. Therefore, an optical imaging system, which can promote design freedom, needs to be developed.

SUMMARY

[0004] According to one aspect of the present disclosure, an optical imaging system includes an infrared light absorbing element, an infrared light reducing film and a plate element in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. The plate element is disposed between the infrared light reducing film and the imaging surface, the plate element is integrally formed, the plate element includes a translucent portion and a support portion, wherein the translucent portion and the imaging surface image are arranged correspondingly and the support portion surrounds the translucent portion so as to maintain the translucent portion in a specific position in the paraxial path. The plate element further includes a conical structure coating disposed on at least one of an incident surface and an exit surface of the translucent portion, the conical structure coating is gradually spread toward the air, and a plurality of pores are formed at least least one between the incident surface and the exit surface of the translucent portion. The conical structure coating is mainly made of a ceramic material, and an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the conical structure coating. When an average crystal height of the conical structure coating is GH, a focal length of the imaging optical system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, and a distance between the infrared light reducing film and the conical structure coating along the paraxial path is L2, the following conditions are satisfied: 60 nm < GH < 400 nm; 0.0 < L1/f < 0.21; and 0.21 < L2/f.

[0005] According to an aspect of the present description, a camera module includes the optical imaging system of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on the imaging surface of the optical imaging system.

[0006] According to one aspect of the present description, an electronic device includes at least one camera module of the above-mentioned aspect.

[0007] According to one aspect of the present disclosure, an optical imaging system includes an infrared light absorbing element, an infrared light reducing film, a plate element and an anti-reflection multilayer film in order along a path paraxial. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. The plate element is disposed between the infrared light reducing film and the imaging surface, the plate element is integrally formed, the plate element includes a translucent portion and a support portion, wherein the translucent portion and the imaging surface image are arranged correspondingly and the support portion surrounds the translucent portion so as to maintain the translucent portion in a specific position in the paraxial path. The anti-reflective multilayer film is disposed on at least one of an incident surface and an exit surface of the translucent portion, wherein the anti-reflective multilayer film includes a plurality of high refractive index layers and a plurality of low refractive index layers. refraction, and the high refractive index layers and the low refractive index layers are stacked alternately. An average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the anti-reflective multilayer film. When a focal length of the optical imaging system is f, a distance between the infrared light-absorbing element and the infrared light-reducing film along the paraxial path is L1, and a distance between the infrared light-reducing film and the multilayer film antireflection along the paraxial path is L2', the following conditions are satisfied: 0.0 < L1/f < 0.21; and 0.21 < L2’/f.

[0008] According to an aspect of the present description, a camera module includes the optical imaging system of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on the imaging surface of the optical imaging system.

[0009] According to one aspect of the present description, an electronic device includes at least one camera module of the above-mentioned aspect.

[0010] According to one aspect of the present disclosure, an optical imaging system includes an infrared light absorbing element, an infrared light reducing film, a plate element and a low reflectance film in order along a path paraxial. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. The plate element includes a translucent portion and a support portion, wherein the translucent portion is disposed between the infrared light-reducing film and the image surface, the translucent portion and the image surface are arranged correspondingly, the support portion surrounds the paraxial path and the support portion and the translucent portion are formed integrally so as to maintain the translucent portion in a specific position in the paraxial path. The low reflection film is disposed on at least one of an incident surface and an exit surface of the translucent portion and simultaneously coated on at least a portion of the support portion. An average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film. When a focal length of the optical imaging system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, and a distance between the infrared light reducing film and the infrared light reducing film low reflectance along the paraxial path path is L2'', the following conditions are satisfied: 0.0 < L1/f < 0.21; and 0.21 < L2’’/f.

[0011] According to an aspect of the present description, a camera module includes the optical imaging system of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on the imaging surface of the optical imaging system.

[0012] According to one aspect of the present description, an electronic device includes at least one camera module of the above-mentioned aspect.

[0013] According to one aspect of the present disclosure, an optical imaging system includes an infrared light absorbing element, an infrared light reducing film, a prism element and a low reflectance film in order along a path paraxial. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. The prism member includes a prism portion and a support portion. The prism portion includes an incident surface, at least one reflecting surface and an exit surface in order along the paraxial path, and the exit surface of the prism portion and the imaging surface are arranged correspondingly. The support portion carries the prism portion so as to maintain the prism portion in a specific position in the paraxial path. The low reflection film is disposed on at least one of the incident surface and the exit surface of the prism portion. An average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film. When a focal length of the optical imaging system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, and a distance between the infrared light reducing film and the infrared light reducing film low reflectance along the paraxial path path is L2'', the following conditions are satisfied: 0.0 < L1/f < 0.21; and 0.21 < L2''/f.

[0014] According to an aspect of the present description, a camera module includes the optical imaging system of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on the imaging surface of the optical imaging system.

[0015] According to one aspect of the present description, an electronic device includes at least one camera module of the above-mentioned aspect.

[0016] According to one aspect of the present disclosure, a camera module includes an optical imaging system and an image sensor. The optical imaging system includes an imaging lens assembly, a plate element, and a low reflectance film. The imaging lens assembly includes a plurality of lens elements, an infrared light reducing film, and a lens holder. The lens elements are arranged in order along a paraxial path, wherein the lens elements include an infrared light-absorbing lens element and the infrared light-absorbing lens element is made of an infrared light-absorbing plastic material. The infrared light reducing film is disposed on an exit surface of the infrared light absorbing lens element. The lens holder accommodates the lens elements and infrared light-reducing film. The plate member includes a translucent portion and a support portion, wherein the support portion surrounds the paraxial path. The low reflectance film is disposed on at least one of an incident surface and an exit surface of the translucent portion. The image sensor is disposed on an imaging side of the lens carrier, the plate element is disposed between the imaging lens assembly and the image sensor, the translucent portion and the image sensor are correspondingly disposed, and the paraxial path passes through the imaging lens assembly and then travels to the image sensor. A specific distance between the translucent portion of the plate element and the image sensor is maintained through the support portion. An average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film. When a focal length of the imaging optical system is f, a distance between the infrared light-reducing film and the low-reflectance film along the paraxial path is L2'', and a thickness of the translucent portion is THI, the following conditions are satisfied : 0.21 < L2''/f; and 0.005 < THI/f < 0.35.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Fig. 1A is a cross-sectional view of a camera module in accordance with the 1st embodiment of the present description.

[0018] Fig. 1B is a partial three-dimensional view of the camera module according to the 1st embodiment in Fig. 1A.

[0019] Fig. 1C is a partial exploded view of the camera module according to the 1st embodiment in Fig. 1A.

[0020] Fig. 1D is a schematic view of the low reflectance film according to the 1st example of the 1st embodiment in Fig. 1A.

[0021] Fig. 1E is a scanning electron microscope image of the conical structure coating according to the 1st example of the 1st embodiment in Fig. 1D.

[0022] Fig. 1F is a graph of experimental wavelength reflectivity data according to the 1st example of the 1st embodiment in Fig. 1D.

[0023] Fig. 1G is a schematic view of the low reflectance film according to the 2nd example of the 1st embodiment in Fig. 1A.

[0024] Fig. 1H is a graph of experimental wavelength reflectivity data according to the 2nd example of the 1st embodiment in Fig. 1G.

[0025] Fig. 2A is a three-dimensional view of a camera module in accordance with the 2nd embodiment of the present description.

[0026] Fig. 2B is a cross-sectional view of the camera module according to the 2nd embodiment in Fig. 2A.

[0027] Fig. 2C is an exploded view of the camera module according to the 2nd embodiment in Fig. 2A.

[0028] Fig. 2D is a cross-sectional view of the plate element according to the 2nd embodiment in Fig. 2A.

[0029] Fig. 3A is a three-dimensional view of a camera module in accordance with the 3rd embodiment of the present description.

[0030] Fig. 3B is a cross-sectional view of the camera module according to the 3rd embodiment in Fig. 3A.

[0031] Fig. 3C is an exploded view of the camera module according to the 3rd embodiment in Fig. 3A.

[0032] Fig. 3D is another exploded view of the camera module according to the 3rd embodiment in Fig. 3A.

[0033] Fig. 3E is a cross-sectional view of the lens carrier and plate element according to the 3rd embodiment in Fig. 3A.

[0034] Fig. 4A is a three-dimensional view of a camera module in accordance with the 4th embodiment of the present description.

[0035] Fig. 4B is a cross-sectional view of the camera module according to the 4th embodiment in Fig. 4A.

[0036] Fig. 4C is an exploded view of the camera module according to the 4th embodiment in Fig. 4A.

[0037] Fig. 4D is another exploded view of the camera module according to the 4th embodiment in Fig. 4A.

[0038] Fig. 4E is a partial perspective view of the camera module according to the 4th embodiment in Fig. 4A.

[0039] Fig. 5A is a three-dimensional view of a camera module in accordance with the 5th embodiment of the present description.

[0040] Fig. 5B is a schematic view of the camera module according to the 5th embodiment in Fig. 5A.

[0041] Fig. 5C is a partial exploded view of the camera module according to the 5th embodiment in Fig. 5A.

[0042] Fig. 5D is an exploded view of the camera module according to the 5th embodiment in Fig. 5A.

[0043] Fig. 5E is another exploded view of the camera module according to the 5th embodiment in Fig. 5A.

[0044] Fig. 6A is a three-dimensional view of a camera module in accordance with the 6th embodiment of the present description.

[0045] Fig. 6B is a schematic view of the camera module according to the 6th embodiment in Fig. 6A.

[0046] Fig. 6C is a schematic view of camera module parameters according to the 6th embodiment in Fig. 6A.

[0047] Fig. 6D is an exploded view of the camera module according to the 6th embodiment in Fig. 6A.

[0048] Fig. 6E is another exploded view of the camera module according to the 6th embodiment in Fig. 6A.

[0049] Fig. 6F is a schematic view of the prism portion according to the 6th embodiment in Fig. 6A.

[0050] Fig. 7A is a schematic view of a camera module in accordance with the 7th embodiment of the present description.

[0051] Fig. 7B is a schematic view of camera module parameters according to the 7th embodiment in Fig. 7A.

[0052] Fig. 7C is a schematic view of the prism portion according to the 7th embodiment in Fig. 7A.

[0053] Fig. 8A is a schematic view of an electronic device according to the 8th embodiment of the present description.

[0054] Fig. 8B is another schematic view of the electronic device according to the 8th embodiment in Fig. 8A.

[0055] Fig. 8C is yet another schematic view of the electronic device according to the 8th embodiment in Fig. 8A.

[0056] Fig. 8D is a schematic view of an image captured through the electronic device according to the 8th embodiment in Fig. 8A.

[0057] Fig. 8E is another schematic view of an image captured through the electronic device according to the 8th embodiment in Fig. 8A.

[0058] Fig. 8F is yet another schematic view of an image captured through the electronic device according to the 8th embodiment in Fig. 8A.

[0059] Fig. 8G is another schematic view of an image captured through the electronic device according to the 8th embodiment in Fig. 8A.

DETAILED DESCRIPTION

[0060] The present description provides an optical imaging system, which includes an infrared light absorbing element and an infrared light reducing film in order along a paraxial path. The infrared light absorbing element is made of an infrared light absorbing plastic material and the infrared light absorbing element is configured to refract a light. The infrared light reducing film is closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. When a focal length of the optical imaging system is f, and a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, the following condition is satisfied: 0.0 < L1/ f < 0.21.

[0061] When L1/f satisfies the above-mentioned condition, the cooperation between the infrared light absorbing element and the infrared light reducing film can be promoted, so as to ensure the infrared light filtering effect of the optical imaging system.

[0062] It should be mentioned that the infrared light-absorbing plastic material can be made of plastic material doped (doping) with the infrared light-absorbing material, so that the infrared light-absorbing element is configured to absorb infrared light. Furthermore, the ultraviolet light-absorbing material can be further doped into the infrared light-absorbing plastic material, so that the infrared light-absorbing material is further configured to absorb ultraviolet light.

[0063] The infrared light-reducing film may be a multi-layer film, wherein the infrared light-reducing film includes alternating layers with a high refractive index and a low refractive index, and destructive interference with infrared light can be achieved.

[0064] The optical imaging system may further include a plate element, wherein the optical imaging system includes the infrared light absorbing element, the infrared light reducing film and the plate element in order along the paraxial path . The plate element is disposed between the infrared light-reducing film and the image surface, the plate element is formed integrally, and the plate element includes a translucent portion and a support portion. Furthermore, the translucent portion and the image surface are arranged correspondingly, and the support portion surrounds the translucent portion so as to maintain the translucent portion at a specific position in the paraxial path. Or, the translucent portion is arranged between the infrared light reducing film and the image surface, the translucent portion and the image surface are arranged correspondingly, the support portion surrounds the paraxial path, and the support portion and the translucent portions are formed integrally so as to maintain the translucent portion at the specific position in the paraxial path. In particular, an image light passes through a plurality of optical elements such as the infrared light absorption element and the object-side plate element along the paraxial path and travels to the image surface. In other words, the imaging light passes through the infrared light absorbing element, and then the imaging light passes through the infrared light reducing film. Therefore, large-angle incident light on the infrared light-reducing film to form color cast can be avoided.

[0065] The supporting portion of the plate element may be made of an opaque plastic material. Therefore, the incidence of non-image light on the image sensor through the support portion can be avoided. Furthermore, the plate element may be integrally formed by the insert molding process, wherein the translucent portion may be made of glass material or polymeric material, the supporting portion may be made of opaque polymeric material or ceramic material, and The present description is not limited to them. Or, the plate member may be formed integrally by the two-shot molding process, wherein the translucent portion may be made of transparent polymeric material, the support portion may be made of opaque polymeric material, the opaque polymeric material, and the polymer The transparent material may still be the same, and the dye is added to the transparent polymeric material to make the opaque polymeric material opaque, so as to promote the combination. Or, the supporting portion and the translucent portion of the plate element may be integrally formed by the reinforcing process, the hot riveting process and the fitting process, but the present description is not limited thereto.

[0066] The plate element may further include a light blocking portion and the light blocking portion and the translucent portion are disposed adjacently. Therefore, the incidence of non-image light on the image sensor can be avoided.

[0067] When the focal length of the optical imaging system is f, and the thickness of the translucent portion is THI, the following condition can be satisfied: 0.005 < THI/f < 0.35. Therefore, the design freedom of the imaging optical system can be promoted, so as to improve the image quality or reduce the volume of the camera module.

[0068] The optical imaging system may further include a prism element, wherein the optical imaging system includes the infrared light absorbing element, the infrared light reducing film and the prism element in order along the paraxial path . The prism element includes a prism portion and a support portion, wherein the prism portion includes an incident surface, at least one reflecting surface and an exit surface in order along the paraxial path, the exit surface of the portion prism portion and imaging surface are correspondingly arranged, and the support portion carries the prism portion so as to maintain the prism portion at the specific position in the paraxial path.

[0069] The supporting portion of the prism element may be made of an opaque plastic material.

[0070] The optical imaging system may further include a low reflectance film, wherein the optical imaging system includes the infrared light absorbing element, the infrared light reducing film, the plate element and the low reflectance film in order along the paraxial path; or, the optical imaging system includes the infrared light absorbing element, the infrared light reducing film, the prism element and the low reflectance film in order along the paraxial path. The low reflectance film is disposed on at least one of an incident surface and an exit surface of the translucent portion and coated simultaneously on at least a portion of the support portion, wherein the low reflectance film may be disposed simultaneously on at least at least one portion of a surface of the supporting portion; or, the low reflectance film is disposed on at least one of the incident surface and the exit surface of the prism portion. An average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film.

[0071] When the focal length of the optical imaging system is f, and the distance between the infrared light-reducing film and the low-reflectance film along the paraxial path is L2'', the following condition is satisfied: 0.21 < L2''/f. When L2''/f satisfies the above-mentioned condition, the ghost image, which is between the infrared light-reducing film and the low-reflectance film, formed by the large-angle incident light, can be avoided, so as to maintain the quality of image. Furthermore, the condition that the infrared light-reducing film is not arranged on the translucent portion can be achieved. Therefore, image ghosting due to reflection between the infrared light-reducing film and the image sensor surface can be avoided.

[0072] An average reflectivity of a light in a wavelength range between 400 nm and 900 nm can be less than 0.98% through the low reflectance film. Furthermore, the average reflectivity of light in the wavelength range between 400 nm and 900 nm can be less than 0.5% through the low reflectance film.

[0073] The plate element may further include a conical structure coating. In particular, the low reflectance film may include the tapered structure coating, wherein the tapered structure coating is disposed on at least one of the incident surface and the exit surface of the translucent portion, the tapered structure coating is gradually spread out in toward the air, and a plurality of pores are formed on at least one of the incident surface and the exit surface of the translucent portion. Furthermore, the conical structure coating can be disposed simultaneously on the incident surface and the exit surface of the translucent portion, and the conical structure coating can be simultaneously disposed on at least a portion of a surface of the support portion, so as to reduce the risk of glare formed by the support portion. The conical structure coating can be mainly made of a ceramic material, and the average reflectivity of light in the wavelength range between 420 nm and 680 nm is less than 0.98% through the conical structure coating, in which a height The average crystal structure of the conical coating structure is GH, and the following condition can be satisfied: 60 nm < GH < 400 nm. Furthermore, the following condition can be satisfied: 120 nm < GH < 300 nm. In particular, the lowest reflectivity can be less than 0.5% by conical structure coating.

[0074] Furthermore, the conical structure coating can be multilayer film and the ceramic material can be aluminum oxide, nitride and carbide, silicon, titanium, zirconium, tantalum, niobium, chromium and other elements, but the This description is not limited to them. In addition, the ceramic material can be aluminum oxide, silicon oxide, titanium oxide, the conical structure coating can be formed by the chemical etching process, the generation process, the electrochemical etching process, the laser process, the plasma process, the semiconductor process, which may include exposure, development, recording, but the present description is not limited to the same.

[0075] When the focal length of the optical imaging system is f, and the distance between the infrared light-reducing film and the conical structure coating along the paraxial path is L2, the following condition is satisfied: 0.21 < L2 /f. When L2/f satisfies the above-mentioned condition, the ghost image, which is between the infrared light-reducing film and the conical structure coating, formed by the large-angle incident light, can be avoided, so as to ensure the image quality . Furthermore, the condition that the infrared light-reducing film is not arranged on the translucent portion can be achieved. Therefore, image ghosting due to reflection between the infrared light-reducing film and the image sensor surface can be avoided.

[0076] The average reflectivity of light in the wavelength range between 400 nm and 900 nm can be less than 0.98% through the conical structure coating. Furthermore, the average reflectivity of light in the wavelength range between 400 nm and 900 nm can be less than 0.5% through the conical structure coating.

[0077] The optical imaging system may further include an intermediate layer. In particular, the low reflectance film may include the intermediate layer, wherein the intermediate layer is connected to the conical structure shell and the plate element, the intermediate layer is directly contacted with the plate element, and the intermediate layer is contacted with air passes through at least one of the pores. The adhesion of the funnel structure coating can be promoted through the intermediate layer so as to increase the service life of the funnel structure coating, wherein the intermediate layer can be the multilayer film to further increase the adhesion of the funnel structure coating . Furthermore, a substrate may be disposed on a surface of the plate element.

[0078] The optical imaging system may further include an anti-reflective multilayer film. In particular, the low reflectance film may include the anti-reflection multilayer film, wherein the optical imaging system includes the infrared light absorbing element, the infrared light reducing film, the plate element and the anti-reflection multilayer film in order along the paraxial path. The anti-reflective multilayer film is disposed on at least one of the incident surface and the exit surface of the translucent portion, wherein the anti-reflective multilayer film includes a plurality of high refractive index layers and a plurality of low refractive index layers. refraction, and the high refractive index layers and the low refractive index layers are stacked alternately. Therefore, the reflected light can be eliminated by the interference principle. Furthermore, the anti-reflective multilayer film can be simultaneously coated on at least a portion of the support portion and the average reflectivity of light in the wavelength range between 420 nm and 680 nm is less than 0.98% through the anti-reflective multilayer film.

[0079] The anti-reflective multilayer film can be disposed simultaneously on the incident surface and the exit surface of the translucent portion, and the anti-reflective multilayer film can be simultaneously disposed on at least a portion of a surface of the support portion.

[0080] When the focal length of the optical imaging system is f, and a distance between the infrared light-reducing film and the anti-reflection multilayer film along the paraxial path is L2', the following condition is satisfied: 0.21 < L2'/f. When L2'/f satisfies the above-mentioned condition, the ghost image, which is between the infrared light-reducing film and the anti-reflection multilayer film, formed by the large-angle incident light, can be avoided, so as to maintain the image quality. image . Furthermore, the condition that the infrared light-reducing film is not arranged on the translucent portion can be achieved. Therefore, image ghosting due to reflection between the infrared light-reducing film and the image sensor surface can be avoided.

[0081] The average reflectivity of light in the wavelength range between 400 nm and 900 nm can be less than 0.98% through the anti-reflective multilayer film.

[0082] The low reflectance film can be disposed simultaneously on the incident surface and the exit surface of the translucent portion, wherein the low reflectance film disposed on the incident surface of the translucent portion can include one of the anti-reflective multilayer film and the coating of conical structure, and the low reflectance film disposed on the exit surface of the translucent portion may include one of the anti-reflective multilayer film and the conical structure coating.

[0083] The low reflectance film can be disposed simultaneously on the incident surface and the exit surface of the prism portion, wherein the low reflectance film disposed on the incident surface of the prism portion includes one of the anti-reflective multilayer film and the conical structure coating, and the low reflectance film disposed on the exit surface of the prism portion includes an anti-reflective multilayer film and the conical structure coating. Furthermore, the conical structure coating can be arranged on at least one of the incident surface and the exit surface of the prism portion, and pores are formed on at least one of the incident surface and the exit surface of the prism portion.

[0084] The infrared light reducing film can be disposed on an exit surface of the infrared light absorbing element. In particular, when L1/f = 0, the number of optical elements can be further reduced to reduce the volume.

[0085] The optical imaging system may further include a film array element, wherein the film array element is disposed on one side of the image of the infrared light absorbing element, the infrared light reducing film is disposed on an incident surface and an exit surface of the film elimination element, and the film elimination element is immediately adjacent to the infrared light absorption element. Therefore, the absorption efficiency of the film array element for infrared light can be increased through the infrared light absorbing element.

[0086] The optical imaging system may further include an adhesive, wherein the infrared light absorption element and the film laying element are reinforced through the adhesive. Therefore, the absorption efficiency of the film array element for infrared light can be increased through the infrared light absorbing element, so as to further improve the optical quality of the optical imaging system.

[0087] Each of the above-mentioned features of the optical imaging system can be used in various combinations to obtain corresponding effects.

[0088] The present description provides a camera module, which includes an optical imaging system and an image sensor. The optical imaging system includes an imaging lens assembly, a plate element, and a low reflectance film. The imaging lens assembly includes a plurality of lens elements, an infrared light reducing film, and a lens holder. The lens elements are arranged in order along a paraxial path, wherein the lens elements include an infrared light-absorbing lens element and the infrared light-absorbing lens element is made of an infrared light-absorbing plastic material. The infrared light reducing film is disposed on an exit surface of the infrared light absorbing lens element. The lens holder accommodates the lens elements and infrared light-reducing film. The plate element is disposed between the image lens assembly and the image sensor, and the plate element includes a translucent portion and a support portion, wherein the translucent portion and the image sensor are correspondingly disposed. the support portion surrounds the paraxial path, so that a specific distance between the translucent portion of the plate element and the image sensor is maintained through the support portion. The low reflectance film is disposed on at least one of an incident surface and an exit surface of the translucent portion. The image sensor is disposed on one side of the image of the lens carrier and the paraxial path passes through the image lens assembly and then travels to the image sensor. The average reflectivity of light in the wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film. When a focal length of the imaging optical system is f, a distance between the infrared light reducing film and the low reflectance film along the paraxial path is L2'' and a thickness of the translucent portion is THI, the following conditions are satisfied : 0.21 < L2''/f; and 0.005 < THI/f < 0.35.

[0089] When L2''/f satisfies the above-mentioned condition, the ghost image, which is between the infrared light-reducing film and the low-reflectance film, formed by the large-angle incident light, can be avoided, so as to ensure image quality. Furthermore, the condition that the infrared light-reducing film is not arranged on the translucent portion can be achieved. Therefore, image ghosting due to reflection between the infrared light-reducing film and the image sensor surface can be avoided.

[0090] When THI/f satisfies the above-mentioned condition, design freedom of the imaging lens array can be promoted, so as to improve image quality or reduce the volume of the camera module.

[0091] The present description provides an electronic device, which includes the aforementioned camera module.

[0092] According to the above-mentioned embodiment, specific embodiments and examples are provided and illustrated by means of figures. 1st modality

[0093] Fig. 1A is a cross-sectional view of a camera module 10 in accordance with the 1st embodiment of the present description. Fig. 1B is a partial three-dimensional view of the camera module 10 according to the 1st embodiment in Fig. 1A. Fig. 1C is a partial exploded view of the camera module 10 according to the 1st embodiment in Fig. 1A. In Figs. 1A to 1C, the camera module 10 includes an optical imaging system (its reference number is omitted) and an image sensor 11, wherein the optical imaging system includes an imaging lens assembly (its reference number is omitted) and a plate element 110.

[0094] Furthermore, the optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 140, and the plate element 110 in order along a paraxial path L, wherein the light-reducing film infrared beam 140 is disposed on an output surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 1st modality. The infrared light reducing film 140 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system. It should be mentioned that the infrared light-absorbing plastic material can be made of plastic material doped with the infrared light-absorbing material, so that the infrared light-absorbing element is configured to absorb infrared light. Furthermore, the ultraviolet light-absorbing material can be further doped into the infrared light-absorbing plastic material, so that the infrared light-absorbing material is further configured to absorb ultraviolet light.

[0095] Furthermore, an imaging light (not shown) passes through a plurality of optical elements such as the infrared light absorption element and the plate element 110 on the object side along the paraxial path L and then travels to the image surface. In other words, the image light passes through the infrared light absorbing element, and then the image light passes through the infrared light reducing film 140. Therefore, the large-angle incident light on the infrared light reducing film 140 stops forming color cast can be avoided. Furthermore, the paraxial path L passes through the image lens assembly and then travels to the image sensor 11.

[0096] The infrared light-reducing film 140 may be a multi-layer film, wherein the infrared light-reducing film 140 includes alternating layers with a high refractive index and a low refractive index, and destructive interference with light infrared can be achieved.

[0097] The imaging lens assembly includes a plurality of lens elements, the infrared light reducing film 140, and a lens carrier 151. In detail, the imaging lens assembly includes a first lens element 121, a second lens element 122, the infrared light reducing film 140, a third lens element 123, a fourth lens element 124, a fifth lens element 125, a spacer 131, a sixth lens element 126, a seventh lens element 127, a spacer 132, an eighth lens element 128, and a retainer 133 in order along the paraxial path L, wherein the lens carrier 151 accommodates the first lens element 121, the second lens element 122, the third element lens element 123, the fourth lens element 124, the fifth lens element 125, the sixth lens element 126, the seventh lens element 127, the eighth lens element 128, the spacers 131, 132, the retainer 133, and the film infrared light reducer 140 and the image sensor 11 are disposed on an image side of the lens holder 151. It should be mentioned that the optical lens features such as numbers, structures, surface shapes and so on of the lens elements and the Optical elements can be arranged according to different imaging demands, and the optical characteristics are not limited to the same.

[0098] According to the 1st embodiment, the first lens element 121 is the infrared light absorption element. It should be mentioned that the thickness of the infrared light-reducing film 140 is not the actual thickness to clearly indicate the coating range of the infrared light-reducing film 140.

[0099] The optical imaging system further includes a film array element, wherein the film array element is disposed on one side of the image of the infrared light absorbing element and the infrared light reducing film 140 is disposed on an incident surface and an exit surface of the film elimination element. According to the 1st embodiment, the infrared light reducing film 140 is disposed on the incident surface of the third lens element 123 and the third lens element 123 is the film disposition element.

[0100] The plate element 110 is disposed between the infrared light-reducing film 140 and the image surface, the plate element 110 is integrally formed, and the plate element 110 is disposed between the eighth lens element 128 and the sensor image 11, wherein the plate element 110 includes a translucent portion 111, a support portion 112, a transparent plastic tracking gate 113, an opaque plastic tracking gate 114, and a light blocking portion 115. translucent portion 111 and the image surface are arranged correspondingly, and the support portion 112 surrounds the translucent portion 111 so as to maintain the translucent portion 111 in a specific position in the paraxial path L. The support portion 112 surrounds the paraxial path L, such that a specific distance between the translucent portion 111 of the plate element 110 and the image sensor 11 is maintained through the support portion 112. The light blocking portion 115 and the translucent portion 111 are disposed adjacently . Therefore, the incident of non-image light on the image sensor 11 can be avoided. The support portion 112 and the translucent portion 111 may be made of transparent plastic material, the light blocking portion 115 may be made of black plastic material, the plate element 110 may be integrally formed by the two-shot molding process, but the present description is not limited thereto. In particular, the transparent plastic tracking port 113 and the support portion 112 are correspondingly arranged, and the opaque plastic tracking port 114 and the light blocking portion 115 are correspondingly arranged.

[0101] In Figs. 1A and 1C, the plate member 110 further includes a tapered structure liner 171, wherein the tapered structure liner 171 is disposed simultaneously on an incident surface and an exit surface of the translucent portion 111 and the tapered structure liner 171 disposed on the incident surface of the translucent portion 111 is disposed simultaneously on the portion of a surface of the light-blocking portion 115. Therefore, glare reflected by the surface of the light-blocking portion 115 can be avoided to block non-image light.

[0102] The imaging lens assembly further includes a drive unit 152 and a conveyor 153. The lens conveyor 151 may be driven to move along at least one horizontal direction for the paraxial path L and the vertical direction for the paraxial path L e in relation to the image sensor 11 through the drive unit 152, so as to obtain the camera module 10 with the focusing function and the anti-vibration function. Carrier 153 may also be a printed circuit board, but the present description is not limited thereto. The support portion 112 is arranged on the carrier 153 so as to further maintain the translucent portion 111 in the specific position in the paraxial path L.

[0103] Fig. 1D is a schematic view of the low reflectance film according to the 1st example of the 1st embodiment in Fig. 1A. Fig. 1E is a scanning electron microscope image of the conical structure coating 171 according to the 1st example of the 1st embodiment in Fig. 1D. In Figs. 1D and 1E, the optical imaging system further includes a low reflectance film (its reference number is omitted), wherein the low reflectance film includes the conical structure coating 171 and an intermediate layer 172, the low reflectance film. has the anti-reflective function via the conical structure coating 171, the intermediate layer 172 is connected to the conical structure coating 171 and a substrate S on a surface of the plate element 110, and the intermediate layer 172 is directly in contact with the substrate S In addition, the intermediate layer 172 is a multilayer film, so as to increase the adhesion of the conical structure coating 171.

[0104] The conical structure coating 171 is gradually spread from the substrate S towards the air, a plurality of pores P are formed on the incident surface, and the exit surface of the translucent portion 111 and the intermediate layer 172 are contacted with a via air in at least one of the P pores. Therefore, the low reflection function of the conical structure coating 171 can be ensured.

[0105] It should be mentioned that the substrate S may be one of the translucent portion 111, the support portion 112 and the light blocking portion 115 of the plate element 110, the thickness and number of layers of the intermediate layer 172 in section partial cross-sectional view of Fig. 1D are only configured to be the schematic view, the thickness and number thereof can be adjusted according to the actual requirement, the thickness of the conical structure coating 171 is not the actual thickness to indicate only and clearly the coating strip of the tapered structure coating 171, and the present description is not limited thereto.

[0106] In Fig. 1D, the crystal heights of the funnel structure coating 171 are GH1, GH2, GH3 and GH4, respectively, and an average crystal height of the funnel structure coating 171 is GH, where GH1 is 189, 56 nm, GH2 is 303.28 nm, GH3 is 271.88 nm, GH4 is 112.67 nm and GH is 219.35 nm.

[0107] Fig. 1F is a graph of experimental wavelength reflectivity data according to the 1st example of the 1st embodiment in Fig. 1D. In Fig. 1F, an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is 0.022% through the conical structure coating 171, an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is 0.023% through the funnel structure coating 171, and a lower reflectivity of light in the wavelength range between 420 nm and 680 nm is 0.012% through the funnel structure coating 171.

[0108] Fig. 1G is a schematic view of the low reflectance film according to the 2nd example of the 1st embodiment in Fig. 1A. In Fig. 1G, the low-refraction film further includes the anti-reflective multilayer film (its reference number is omitted), wherein the anti-reflective multilayer film includes a plurality of high refractive index layers 173 and a plurality of layers of low refractive index 174 , and the high refractive index layers 173 and the low refractive index layers 174 are stacked alternately. Therefore, the anti-reflective function of low reflectance film can be achieved and the reflected light can be eliminated by the principle of interference.

[0109] It should be mentioned that the thickness and number of layers of the intermediate layer 172, the high refractive index layers 173 and the low refractive index layers 174 in the partial cross-sectional view of Fig. 1G are configured only to Being the schematic view, the thickness, number and order thereof can be adjusted according to the actual requirement, and the present description is not limited to them.

[0110] Fig. 1H is a graph of experimental wavelength reflectivity data according to the 2nd example of the 1st embodiment in Fig. 1G. In Fig. 1H, an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is 0.43% through the anti-reflective multilayer film, an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is 0.93% through the anti-reflective multilayer film and a lower reflectivity of light in the wavelength range between 420 nm and 680 nm is 0.23% through the anti-reflective multilayer film.

[0111] In Fig. 1A, a focal length of the optical imaging system is f, a distance between the infrared light-absorbing element (according to the 1st embodiment, the first lens element 121) and the light-reducing film infrared light 140 along the paraxial path L is L1, a distance between the infrared light reducing film 140 and the conical structure coating 171 disposed on the incident surface of the translucent portion 111 along the paraxial path L is L2-1, a distance between the infrared light reducing film 140 and the conical structure coating 171 disposed on the exit surface of the translucent portion 111 along the paraxial path L is L2-2, and a thickness of the translucent portion 111 is THI, the following conditions of Table 1A are satisfied.

[0112] Fig. 2A is a three-dimensional view of a camera module 20 in accordance with the 2nd embodiment of the present description. Fig. 2B is a cross-sectional view of the camera module 20 according to the 2nd embodiment in Fig. 2A. Fig. 2C is an exploded view of the camera module 20 according to the 2nd embodiment in Fig. 2A. In Figs. 2A to 2C, the camera module 20 includes an optical imaging system (its reference number is omitted) and an image sensor 21, wherein the optical imaging system includes an imaging lens assembly (its reference number is omitted) and a plate element 210.

[0113] Furthermore, the optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 240, and the plate element 210 in order along a paraxial path L, wherein the infrared light-reducing film infrared light 240 is arranged on an output surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 2nd modality. The infrared light reducing film 240 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0114] The imaging lens assembly includes a plurality of lens elements and the infrared light reducing film 240. In detail, the imaging lens assembly includes a first lens element 221, a second lens element 222, a spacer 231, a third lens element 223, a spacer 232, a fourth lens element 224, the infrared light-reducing film 240, a fifth lens element 225, and a spacer 233 in order along the paraxial path L. It should be mentioned that the optical characteristics such as numbers, structures, surface shapes and so on of the lens elements and the optical elements can be arranged according to different imaging demands, and the optical characteristics are not limited to them.

[0115] The optical imaging system further includes a film array element, wherein the film array element is disposed on an imaging side of the infrared light absorbing element and the infrared light reducing film 240 is disposed on an an incident surface and an exit surface of the film elimination element. According to the 2nd embodiment, the infrared light reducing film 240 is disposed on the incident surface of the fifth lens element 225, the fourth lens element 224 is the infrared light absorbing element, and the fifth lens element 225 is the infrared light absorbing element. film layout. Furthermore, the infrared light reducing film 240 is also disposed on the exit surface of the fifth lens element 225.

[0116] Furthermore, the film arrangement element is immediately adjacent to the infrared light absorbing element and the optical imaging system further includes an adhesive G, wherein the infrared light absorption element and the film arrangement element film are reinforced through adhesive G. Therefore, the absorption efficiency of the film array element for infrared light can be improved through the infrared light absorbing element, so as to further improve the optical quality of the camera module 20 In addition, the air gap is replaced by the arrangement of adhesive G between the infrared light absorption element and the film arrangement element, so as to reduce the ghost image formed through surface reflection.

[0117] Fig. 2D is a cross-sectional view of the plate element 210 according to the 2nd embodiment in Fig. 2A. In Fig. 2D, the plate member 210 includes a translucent portion 211 and a support portion 212, wherein the translucent portion 211 and the support portion 212 are integrally formed by the insertion molding process to form the plate member 210 . In detail, the translucent portion 211 and the image surface are arranged correspondingly, the support portion 212 surrounds the translucent portion 211, so as to maintain the translucent portion 211 in a specific position in the paraxial path L. The portion support portion 212 surrounds the paraxial path L, such that a specific distance between the translucent portion 211 of the plate element 210 and the image sensor 21 is maintained through the support portion 212. The support portion 212 of the plate element 210 is further configured to accommodate the first lens element 221, the second lens element 222, the third lens element 223, the fourth lens element 224, the fifth lens element 225 and the spacers 231, 232, 233.

[0118] The translucent portion 211 may be made of glass material or plastic material, the support portion 212 is the injection molding element, and the support portion 212 may be made of opaque plastic material, but the present description does not is limited to it. Non-image light can be prevented from entering the image sensor 21 through the support portion 212 through the support portion 212 made of opaque plastic material.

[0119] In Figs. 2B and 2C, the plate member 210 further includes a tapered structure coating 271, wherein the tapered structure coating 271 is disposed simultaneously on an incident surface and an exit surface of the translucent portion 211 and the tapered structure coating 271 disposed on the exit surface of the translucent portion 211 is simultaneously disposed on at least a portion of a surface of the support portion 212. Therefore, the risk of glare formed by the support portion 212 can be further reduced.

[0120] In Fig. 2B, a focal length of the optical imaging system is f, a distance between the infrared light-absorbing element (according to the 2nd embodiment, the fourth lens element 224) and the infrared light-reducing film. infrared light 240 along the paraxial path L is L1, a distance between the infrared light reducing film 240 and the conical structure coating 271 disposed on the incident surface of the translucent portion 211 along the paraxial path L is L2-1, a distance between the infrared light reducing film 240 and the conical structure coating 271 disposed on the exit surface of the translucent portion 211 along the paraxial path L is L2-2, and a thickness of the translucent portion 211 is THI, the following conditions of Table 2A are satisfied.

3rd modality

[0121] Fig. 3A is a three-dimensional view of a camera module 30 in accordance with the 3rd embodiment of the present description. Fig. 3B is a cross-sectional view of the camera module 30 according to the 3rd embodiment in Fig. 3A. Fig. 3C is an exploded view of the camera module 30 according to the 3rd embodiment in Fig. 3A. Fig. 3D is another exploded view of the camera module 30 according to the 3rd embodiment in Fig. 3A. In Figs. 3A to 3D, the camera module 30 includes an imaging optical system (its reference number is omitted) and an image sensor 31, wherein the imaging optical system includes an imaging lens assembly (its reference number is omitted) and a plate element 310.

[0122] Furthermore, the optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 340, and the plate element 310 in order along a paraxial path L, wherein the light-reducing film infrared beam 340 is arranged on an output surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 3rd modality. The infrared light reducing film 340 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0123] The imaging lens assembly includes a plurality of lens elements, the infrared light reducing film 340, and a lens holder 351. In detail, the imaging lens assembly includes a first lens element 321, a second lens element 322, a spacer 331, a spacer 332, a third lens element 323, a fourth lens element 324, a fifth lens element 325, the infrared light reducing film 340, a spacer 333, a sixth lens element lens 326, a seventh lens element 327, a spacer 334, and an eighth lens element 328 in order along the paraxial path L. It should be mentioned that optical features such as numbers, structures, surface shapes, and so on, of the lens elements and optical elements can be arranged according to different imaging demands, and the optical resources are not limited to them.

[0124] According to the 3rd embodiment, the fifth lens element 325 is the infrared light absorbing element and the infrared light reducing film 340 is disposed on an exit surface of the fifth lens element 325.

[0125] Fig. 3E is a cross-sectional view of the lens carrier 351 and the plate element 310 in accordance with the 3rd embodiment in Fig. 3A. In Figs. 3B and 3E, plate member 310 includes a translucent portion 311 and a support portion 312. In detail, the translucent portion 311 and the imaging surface are arranged correspondingly, the support portion 312 surrounds the translucent portion 311, so as to maintain the translucent portion 311 in a specific position in the paraxial path L. support 312 surrounds the paraxial path L, such that a specific distance between the translucent portion 311 of the plate element 310 and the image sensor 31 is maintained through the support portion 312.

[0126] In detail, the lens carrier 351 accommodates the first lens element 321, the second lens element 322, the third lens element 323, the fourth lens element 324 and the spacers 331, 332, and the portion of support 312 of the plate element 310 is further configured to accommodate the lens carrier 351, the fifth lens element 325, the sixth lens element 326, the seventh lens element 327, the eighth lens element 328 and the spacers 333, 334.

[0127] In Fig. 3B, the translucent portion 311 may be made of transparent glass material or transparent plastic material and the support portion 312 may be formed from black plastic material, wherein the translucent portion 311 and the support portion 312 are formed entirely using an adhesive G.

[0128] In Fig. 3B, the plate element 310 further includes a tapered structure coating 371, wherein the tapered structure coating 371 is disposed simultaneously on an incident surface and an exit surface of the translucent portion 311. Furthermore , the tapered structure coating 371 is simultaneously coated on at least a part of a surface of the supporting part 312. Therefore, the risk of glare formed by the supporting part 312 can be further reduced.

[0129] In Fig. 3B, a focal length of the optical imaging system is f, a distance between the infrared light-reducing film 340 and the conical structure coating 371 disposed on the incident surface of the translucent portion 311 along the paraxial path L is L2-1, a distance between the infrared light reducing film 340 and the conical structure coating 371 disposed on the exit surface of the translucent portion 311 along the paraxial path L is L2-2, and a thickness of the translucent portion 311 is THI , the following conditions in Table 3A are satisfied.

[0130] Fig. 4A is a three-dimensional view of a camera module 40 in accordance with the 4th embodiment of the present description. Fig. 4B is a cross-sectional view of the camera module 40 according to the 4th embodiment in Fig. 4A. Fig. 4C is an exploded view of the camera module 40 according to the 4th embodiment in Fig. 4A. Fig. 4D is another exploded view of the camera module 40 according to the 4th embodiment in Fig. 4A. In Figs. 4A to 4D, the camera module 40 includes an optical imaging system (its reference number is omitted) and an image sensor 41, wherein the optical imaging system includes an imaging lens assembly (its reference number is omitted) and a plate element 410.

[0131] Furthermore, the optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 440, and the plate element 410 in order along a paraxial path L, wherein the infrared light-reducing film infrared light 440 is arranged on an output surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 4th modality. The infrared light reducing film 440 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0132] The imaging lens assembly includes a plurality of lens elements and the infrared light reducing film 440. In detail, the imaging lens assembly includes a first lens element 421, the infrared light reducing film 440, a second lens element 422, a spacer 431, a third lens element 423, a spacer 432, a fourth lens element 424, a spacer 433, a fifth lens element 425, and a retainer 434 in order along the paraxial path L. It should be mentioned that the optical characteristics such as numbers, structures, surface shapes and so on of the lens elements and the optical elements can be arranged according to different imaging demands, and the optical characteristics are not limited to same.

[0133] According to the 4th embodiment, the first lens element 421 is the infrared light absorbing element and the infrared light reducing film 440 is disposed on an exit surface of the first lens element 421.

[0134] Fig. 4E is a partial perspective view of the camera module 40 in accordance with the 4th embodiment in Fig. 4A. In Figs. 4B to 4E, the optical imaging system includes

[0135] The plate element 410 includes a translucent portion 411 and a support portion 412, wherein the translucent portion 411 and the support portion 412 are integrally formed by the hot riveting process to form the plate element 410. In detail, the translucent portion 411 and the image surface are arranged correspondingly, the support portion 412 surrounds the translucent portion 411, so as to maintain the translucent portion 411 in a specific position in the paraxial path L. The support portion 412 surrounds the paraxial path L, such that a specific distance between the translucent portion 411 of the plate element 410 and the image sensor 41 is maintained through the support portion 412. The support portion 412 of the plate element 410 is further configured to accommodate the first lens element 421, the second lens element 422, the third lens element 423, the fourth lens element 424, the fifth lens element 425, the spacers 431, 432, 433 and the retainer 434.

[0136] The translucent portion 411 can be made from transparent glass material or transparent plastic material, the support portion 412 can be formed from black plastic material, but the present description is not limited thereto. Non-image light can be prevented from entering the image sensor 41 through the support portion 412 through the support portion 412 made of opaque plastic material.

[0137] The optical imaging system further includes a low-reflectance film (its reference number is omitted), wherein the low-reflectance film is disposed simultaneously on an incident surface and an exit surface of the translucent portion 411, the low-reflectance film disposed on the incident surface of the translucent portion 411 includes a tapered structure coating 471, and the low-refraction film disposed on the exit surface of the translucent portion 411 includes an anti-reflective multilayer film 475. Furthermore, the multilayer film Antireflection 475 includes a plurality of high refractive index layers and a plurality of low refractive index layers, and the high refractive index layers and the low refractive index layers are stacked alternately. Therefore, the anti-reflective function of low reflectance film can be achieved. Furthermore, the anti-reflective multilayer film 475 is simultaneously disposed on a portion of a surface of the support portion 412 so as to prevent glare reflected from the surface of the support portion 412 to block non-imaging light.

[0138] In Fig. 4B, a focal length of the optical imaging system is f, a distance between the infrared light reducing film 440 and the conical structure coating 471 along the paraxial path L is L2, a distance between the film infrared light reducer 440 and the anti-reflective multilayer film 475 along the paraxial path L is L2 ', and a thickness of the translucent portion 411 is THI, the following conditions of Table 4A are satisfied.

[0139] Fig. 5A is a three-dimensional view of a camera module 50 in accordance with the 5th embodiment of the present description. Fig. 5B is a schematic view of the camera module 50 according to the 5th embodiment in Fig. 5A. Fig. 5C is a partial exploded view of the camera module 50 in accordance with the 5th embodiment in Fig. 5A. Fig. 5D is an exploded view of the camera module 50 according to the 5th embodiment in Fig. 5A. Fig. 5E is another exploded view of the camera module 50 according to the 5th embodiment in Fig. 5A. In Figs. 5A to 5E, the camera module 50 includes an optical imaging system (its reference number is omitted) and an image sensor 51, wherein the optical imaging system includes an imaging lens assembly (its reference number is omitted) and a plate member 510, and the imaging lens assembly is disposed on the plate member 510 so as to relatively secure the imaging lens assembly and the image sensor 51.

[0140] The optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 540, and the plate element 510 in order along a paraxial path L, in which the infrared light-reducing film 540 is disposed on an exit surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 5th modality. The infrared light reducing film 540 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0141] The imaging lens assembly includes a plurality of lens elements, the infrared light reducing film 540, and a lens carrier 551. In detail, the imaging lens assembly includes a first lens element 521, the imaging lens assembly infrared light reducer 540, a second lens element 522, a third lens element 523, a fourth lens element 524, a spacer 531, a fifth lens element 525, a spacer 532, a sixth lens element 526 and a retainer 533 in order along the paraxial path L, wherein the lens holder 551 is configured to accommodate the first lens element 521, the second lens element 522, the third lens element 523, the fourth lens element 524 , the fifth lens element 525, the sixth lens element 526, the spacers 531, 532 and the retainer 533. It should be mentioned that the optical characteristics, such as numbers, structures, surface shapes and so on, of the lens elements Lens and optical elements can be arranged according to different imaging demands, and the optical characteristics are not limited to the same.

[0142] According to the 5th embodiment, the first lens element 521 is the infrared light absorbing element and the infrared light reducing film 540 is disposed on an exit surface of the first lens element 521.

[0143] The plate element 510 includes a translucent portion 511, a support portion 512, a transparent plastic tracking port 513, and a port 511 and the support portion 512 are integrally formed by the two-shot molding process to form plate element 510. In detail, the translucent portion 511 and the image surface are arranged correspondingly, the support portion 512 surrounds the translucent portion 511, so as to maintain the translucent portion 511 in a specific position in the paraxial path L. the support portion 512 surrounds the paraxial path L such that a specific distance between the translucent portion 511 of the plate element 510 and the image sensor 51 is maintained through the support portion 512.

[0144] The translucent portion 511 may be made of plastic material and the support portion 512 may be made of opaque plastic material, but the present description is not limited thereto. Furthermore, the opaque plastic material of the support portion 512 and the transparent plastic material of the translucent portion 511 may further be the same, wherein the dye is added to the transparent plastic material to make the opaque plastic material of the support portion 512 opaque. Non-image light can be prevented from entering the image sensor 51 through the support portion 512 through the support portion 512 made of opaque plastic material. In particular, the transparent plastic tracking port 513 and the translucent portion 511 are correspondingly arranged, and the opaque plastic tracking port 514 and the support portion 512 are correspondingly arranged.

[0145] The optical imaging system further includes a low reflectance film 570, wherein the low reflectance film 570 is disposed simultaneously on an incident surface and an exit surface of the translucent portion 511 and the low reflectance film 570 is the multilayer film. In addition, the low-reflectance film 570 includes a conical structure coating (its reference numeral is omitted) and an anti-reflective multilayer film (its reference numeral is omitted), the anti-reflective multilayer film includes a plurality of high-reflectance layers. refractive index and a plurality of low refractive index layers and the high refractive index layers and the low refractive index layers are stacked alternately. Therefore, the anti-reflective function of low reflectance film 570 can be achieved. Furthermore, the low-reflectance film 570 located on the exit surface is further disposed on a portion of a surface of the support portion 512 so as to prevent glare reflected from the surface of the support portion 512.

6ª modalidade[0146] In Fig. 5B, a focal length of the optical imaging system is f, a distance between the infrared light-reducing film 540 and the low-reflectance film 570 disposed on the incident surface of the translucent portion 511 along the paraxial path L is L2''-1, a distance between the infrared light-reducing film 540 and the low-reflectance film 570 disposed on the exit surface of the translucent portion 511 along the paraxial path L is L2''-2, and a thickness of the translucent portion 511 is THI, the following conditions of Table 5A are satisfied.

6th modality

[0147] Fig. 6A is a three-dimensional view of a camera module 60 in accordance with the 6th embodiment of the present description. Fig. 6B is a schematic view of the camera module 60 according to the 6th embodiment in Fig. 6A. Fig. 6C is a schematic view of parameters of the camera module 60 according to the 6th embodiment in Fig. 6A. Fig. 6D is an exploded view of the camera module 60 according to the 6th embodiment in Fig. 6A. Fig. 6E is another exploded view of the camera module 60 according to the 6th embodiment in Fig. 6A. In Figs. 6A to 6E, the camera module 60 includes an optical imaging system (its reference number is omitted) and an image sensor 61, wherein the optical imaging system includes an imaging lens assembly (its reference number is omitted) and a prism element 610.

[0148] Furthermore, the optical imaging system includes an infrared light-absorbing element, an infrared light-reducing film 640, and the prism element 610 in order along a paraxial path L, wherein the infrared light-reducing film infrared light 640 is arranged on an output surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 6th modality. The infrared light reducing film 640 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0149] The imaging lens assembly includes a plurality of lens elements, the infrared light reducing film 640, and a lens carrier 651. In detail, the imaging lens assembly includes a first lens element 621, the imaging lens assembly. infrared light reducer 640, a second lens element 622, a third lens element 623, and a fourth lens element 624 in order along the paraxial path L, wherein the lens carrier 651 is configured to accommodate the first lens element lens 621, the second lens element 622, the third lens element 623 and the fourth lens element 624. It should be mentioned that the optical characteristics such as numbers, structures, surface shapes and so on of the lens elements can be arranged according to different imaging demands, and the optical characteristics are not limited to the same.

[0150] According to the 6th embodiment, the first lens element 621 is the infrared light absorbing element and the infrared light reducing film 640 is disposed on an exit surface of the first lens element 621.

[0151] Fig. 6F is a schematic view of the prism portion 611 in accordance with the 6th embodiment in Fig. 6A. In Figs. 6B and 6F, the prism element 610 includes a prism portion 611, a support portion 612, and a reflection enhancing layer 613, wherein the support portion 612 carries the prism portion 611 so as to maintain the prism portion 611. of prism 611 at the specific position on the paraxial path L. The prism portion 611 includes an incident surface 611a, at least one reflecting surface 611b and an exit surface 611c in order along the paraxial path L, and the exit surface 611c of the prism portion 611 and the imaging surface are arranged correspondingly. Furthermore, the reflection intensifying layer 613 is disposed on the reflecting surface 611b, and a number of the reflection intensifying layer 613 corresponds to a number of the reflecting surface 611b, wherein the number of the reflecting surface 611b is four.

[0152] The prism portion 611 may be made of glass material or plastic material, and the support portion 612 may be made of opaque plastic material, but the present description is not limited thereto. Furthermore, the opaque plastic material of the support portion 612 and the transparent plastic material of the prism portion 611 may further be the same, wherein the dye is added to the transparent plastic material to make the opaque plastic material of the support portion 612 opaque. Non-image light can be prevented from entering the image sensor 61 through the support portion 612 through the support portion 612 made of opaque plastic material.

[0153] The optical imaging system further includes a low-reflectance film (its reference number is omitted), wherein the low-reflectance film is disposed simultaneously on the incident surface 611a and the exit surface 611c of the prism portion. 611, the low reflectance film disposed on the incident surface 611a and the exit surface 611c of the prism portion 611 both include a conical structure coating 671.

[0154] In Figs. 6D and 6E, the imaging lens assembly further includes a drive unit 652, a carrier 653, a cover 654, and two guide shafts 655, and the lens carrier 651 has pilot holes 651a, in which the drive unit 652 is arranged on the lens carrier 651 to drive the lens carrier 651 moves along an extension direction of the guide shafts 655, the guide shafts 655 are formed in the support portion 612, the support portion 612 and the sensor imagers 61 are arranged in the holder 653, the cover 654 is disposed in the lens holder 651, and the guide shafts 655 and pilot holes 651a are arranged correspondingly.

[0155] Furthermore, the drive unit 652 includes a drive magnet 652a and a drive coil 652b, wherein the drive magnet 652a and the drive coil 652b are arranged correspondingly and a magnetic drive force is formed by the interaction between the drive magnet 652a and the drive coil 652b.

[0156] In Fig. 6C, a focal length of the optical imaging system is f, a distance between the infrared light-reducing film 640 and the conical structure coating 671 disposed on the incident surface 611a of the prism portion 611 along the path paraxial L is L2-3, and a distance between the infrared light reducing film 640 and the conical structure coating 671 disposed on the exit surface 611c of the prism portion 611 along the paraxial path L is L2-4, the following conditions of Table 6A are satisfied.

[0157] Fig. 7A is a schematic view of a camera module 70 in accordance with the 7th embodiment of the present description. Fig. 7B is a schematic view of parameters of the camera module 70 according to the 7th embodiment in Fig. 7A. In Figs. 7A and 7B, the camera module 70 includes an imaging optical system (its reference number is omitted) and an image sensor 71, wherein the imaging optical system includes an imaging lens assembly (its reference number is omitted). is omitted) and a prism element 710.

[0158] The imaging optical system includes an infrared light absorbing element, an infrared light reducing film 740, and the prism element 710 in order along a paraxial path L, in which the infrared light reducing film 740 is disposed on an exit surface of the infrared light absorbing element. The infrared light-absorbing element is made of an infrared light-absorbing plastic material, the infrared light-absorbing element is configured to refract a light, and the infrared light-absorbing element may be an infrared light-absorbing lens element in accordance with the 7th modality. The infrared light reducing film 740 is closer to an imaging surface (its reference number is omitted) of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system.

[0159] The imaging lens assembly includes a plurality of lens elements, the infrared light reducing film 740, and a lens carrier 751. In detail, the imaging lens assembly includes a first lens element 721, a second lens element 722, a third lens element 723, a fourth lens element 724, and the infrared light-reducing film 740 in order along the paraxial path L, wherein the lens carrier 751 is configured to accommodate the first lens element. lens 721, the second lens element 722, the third lens element 723 and the fourth lens element 724. It should be mentioned that the optical characteristics such as numbers, structures, surface shapes and so on of the lens elements can be arranged according to different imaging demands, and the optical characteristics are not limited to the same.

[0160] According to the 7th embodiment, the second lens element 722 is the infrared light absorbing element and the infrared light reducing film 740 is disposed on an exit surface of the fourth lens element 724.

[0161] Fig. 7C is a schematic view of the prism portion 711 in accordance with the 7th embodiment in Fig. 7A. In Figs. 7A and 7C, the prism element 710 includes a prism portion 711, a support portion 712, and a reflection enhancement layer (its reference number is omitted), wherein the support portion 712 carries the prism portion 711. , so as to maintain the prism portion 711 at the specific position in the paraxial path L. The prism portion 711 includes an incident surface 711a, at least one reflecting surface 711b and an exit surface 711c in order along the paraxial path L and the exit surface 711c of the prism portion 711 and the image surface are arranged correspondingly. Furthermore, the reflection intensifying layer is disposed on the reflective surface 711b, and a number of the reflection intensifying layer corresponds to a number of the reflective surface 711b, wherein the number of the reflective surface 711b is four.

[0162] The optical imaging system further includes a low-reflectance film 770, wherein the low-reflectance film 770 is disposed simultaneously on the incident surface 711a and the exit surface 711c of the prism portion 711, wherein the low-reflectance film reflectance 770 includes a conical structure coating (its reference number is omitted) and an anti-reflective multilayer film (its reference number is omitted). Furthermore, the anti-reflective multilayer film includes a plurality of high refractive index layers and a plurality of low refractive index layers, and the high refractive index layers and the low refractive index layers are stacked alternately. Therefore, the anti-reflective function of 770 low reflectance film can be achieved.

[0163] In Fig. 7B, a focal length of the optical imaging system is f, a distance between the infrared light-absorbing element (according to the 7th embodiment, the second lens element 722) and the light-reducing film infrared light 740 along the paraxial path L is L1, a distance between the infrared light reducing film 740 and the low reflectance film 770 disposed on the incident surface 711a of the prism portion 711 along the paraxial path L is L2''-3 , and a distance between the infrared light reducing film 740 and the low reflectance film 770 disposed on the exit surface 711c of the prism portion 711 along the paraxial path L is L2''-4, the following conditions of Table 7A are satisfied.

[0164] It should be mentioned that the optical system and arrangement according to the 7th embodiment are the same as the optical system and arrangement according to the 6th embodiment and therefore the structures and arrangement of other structures will not be described again in this document. 8th modality

[0165] Fig. 8A is a schematic view of an electronic device 80 in accordance with the 8th embodiment of the present description. Fig. 8B is another schematic view of the electronic device 80 according to the 8th embodiment in Fig. 8A. Fig. 8C is yet another schematic view of the electronic device 80 in accordance with the 8th embodiment in Fig. 8A. In Figs. 8A to 8C, the electronic device 80 is a smart phone, wherein the electronic device 80 may also be a laptop, a tablet, or a dashcam, but the present description is not limited thereto. The electronic device 80 includes at least one camera module, wherein the camera module includes an optical imaging system (not shown) and an image sensor (not shown), and the image sensor is disposed on an imaging surface of the optical imaging system.

[0166] According to the 8th embodiment, the camera module includes ultra-wide-angle camera modules 821, 822, an ultra-telephoto camera module 823, wide-angle camera modules 824, 825, a telephoto camera module 826, a time of flight (TOF) 827, a macro camera module 828 and a biometric detection camera module 829, wherein the TOF module 827 and the biometric detection camera module 829 may be other image capture apparatus with other functions , but the provision is not limited to them. In particular, the camera module may be one of the camera modules according to the aforementioned 1st embodiment to the 7th embodiment, but the present description is not limited thereto.

[0167] In detail, according to the 8th embodiment, the wide-angle camera module 821, the wide-angle camera module 824, the TOF module 827 and the biometric detection camera module 829 are arranged on a front of the electronic device 80, the ultra-wide-angle camera module 822, the ultra-telephoto camera module 823, the wide-angle camera module 825, the telephoto camera module 826, and the macro camera module 828 are disposed on the rear of the device electronic 80.

[0168] The image control interface 810 can be a touch screen to display the scene and have touch function, and the shooting angle can be adjusted manually. In detail, the image control interface 810 includes an image playback button 811, an image capture switching button 812, a focus capture button 813, an integrated menu button 814, and a zoom control button. 815. In addition, users enter a shooting mode through the image control interface 810 of the electronic device 80, the image capture switch button 812 can be flexibly configured to switch one of the ultra-wide-angle camera modules 821, 822, the ultra-telephoto camera module 823, the wide-angle camera modules 824, 825, the telephoto camera module 826 and the macro camera module 82 8 to capture the image, the zoom control button 815 is configured To adjust the zoom, users use the focus capture button 813 to perform image capture after capturing images and confirming one of the ultra-wide-angle camera modules 821, 822, the ultra-telephoto camera module 823, the of wide-angle camera module 824, 825, the telephoto camera module 826 and the macro camera module 828, users can preview the images by the image playback button 811 after going through image capture, and the integrated menu button 814 is configured to adjust image capture details (such as timed photo, photo aspect ratio, etc.).

[0169] The electronic device 80 may further include a reminder light 83 and the reminder light 83 is disposed on the front of the electronic device 80 and may be configured to remind users of unread messages, missed calls, and the condition of the telephone.

[0170] Furthermore, after entering the shooting mode through the image control interface 810 of the electronic device 80, image light is collected at the image sensor through the optical imaging system and an electronic signal about an image is output to an image signal processor (ISP) (its reference number is omitted) of a single-chip system 85. The single-chip system 85 may further include a random access memory (RAM) (its reference number is omitted), a central processing unit (its reference number is omitted) and a storage unit (its reference number is omitted). Furthermore, the single-chip system 85 may further include, but not be limited to, a display, a control unit, a read-only memory (ROM), or a combination thereof.

[0171] To meet a specification of the electronic device 80, the electronic device 80 may further include an anti-vibration optical mechanism (not shown). Furthermore, the electronic device 80 may further include at least one focusing assist module 86 and at least one sensing element (not shown). The focusing assist module 86 may include a flash module 861 for compensating for a color temperature, an infrared distance measuring component (not shown), a laser focusing module (not shown), etc. The sensing element may have functions to detect physical momentum and kinetic energy, such as an accelerator, a gyroscope, a Hall effect element, a position finder, a signal transmitter module, to detect tremors or tremors applied by the user's hands or external environments. Accordingly, the electronic device 80 equipped with an autofocus mechanism and the anti-vibration optical mechanism can be improved to obtain superior image quality. Furthermore, the electronic device 80 according to the present description may have a capture function with various modes, such as taking optimized selfies, high dynamic range (HDR) under low light conditions, 4K resolution recording, etc. In addition, users can visually view an image captured from the camera through the image control interface 810 and manually operate the view finding range on the image control interface 810 to achieve the autofocus function of what you see is what you see. that you get.

[0172] Furthermore, the camera module, anti-vibration optical mechanism, sensing element, and focusing assist module 86 may be arranged on a circuit board 84 and electrically connected to associated components via a connector 841 to perform a capture process, wherein the circuit board 84 may be a flexible printed circuit board (FPC). Since today's electronic devices such as smartphones tend to be compact, the way to firstly dispose of the camera module and related components on the flexible printed circuit board and secondly integrate the circuitry of the same on the main board of the electronic device via the connector can satisfy the requirements of the mechanical design and circuit layout of the limited space inside the electronic device and obtain more margins. The autofocus function of the camera module can also be controlled more flexibly via the electronic device's touch screen. According to the 8th embodiment, the sensing elements and focusing auxiliary modules 86 are disposed on the circuit board 84 and at least one other flexible printed circuit board (not shown) and electrically connected to associated components, such as the image processor. image signal, through corresponding connectors to carry out the capture process. In other embodiments (not shown), the sensing elements and focusing auxiliary modules may also be arranged on the main board of the electronic device or carrier boards of other types in accordance with the requirements of the mechanical design and circuit layout.

[0173] Fig. 8D is a schematic view of an image captured through the electronic device 80 in accordance with the 8th embodiment in Fig. 8A. In Fig. 8D, comparing with the image captured through the wide-angle camera modules 824, 825, the image captured through the ultra-wide-angle camera modules 821, 822 has wider visual angle and greater depth of field, but the captured image via the ultra-wide-angle camera modules 821, 822 also have greater distortion. According to Fig. 8D, the visual angle is 105 degrees to 125 degrees, and the equivalent focal length is 11 mm to 14 mm.

[0174] Fig. 8E is another schematic view of an image captured through the electronic device 80 in accordance with the 8th embodiment in Fig. 8A. In Fig. 8E, the image of the certain range with the high resolution can be captured through the wide-angle camera modules 824, 825, and the wide-angle camera modules 824, 825 have the function of high resolution and low deformation. In particular, Fig. 8E is the enlarged partial view of Fig. 8D. According to Fig. 8E, the visual angle is 70 degrees to 90 degrees and the equivalent focal length is 22 mm to 30 mm.

[0175] Fig. 8F is yet another schematic view of an image captured through the electronic device 80 in accordance with the 8th embodiment in Fig. 8A. In Fig. 8F, comparing with the image captured through the wide-angle camera modules 824, 825, the image captured through the telephoto camera module 826 has a narrower visual angle and a narrower depth of field. Thus, the telephoto camera module 826 can be configured to capture moving targets, i.e., the telephoto camera module 826 can be actuated via an actuator (not shown) of the electronic device 80 for rapid and continuous autofocus. of moving targets, so as to make the image of moving targets not fuzzy due to blur. In particular, Fig. 8F is the enlarged partial view of Fig. 8E. According to Fig. 8F, the visual angle is 10 degrees to 40 degrees, and the equivalent focal length is 60 mm to 300 mm.

[0176] Fig. 8G is another schematic view of an image captured through the electronic device 80 in accordance with the 8th embodiment in Fig. 8A. In Fig. 8G, comparing with the image captured through the telephoto camera module 826, the image captured through the ultra-telephoto camera module 823 has a narrower visual angle and narrower depth of field, and the image captured by the module 823 ultra telephoto camera is easily confused due to shaking. Therefore, the actuator is configured to provide the driving force to make the ultra-telephoto camera module 823 focus on targets, and the actuator is also configured to provide feedback from modifying vibration to obtain the effect of optical image stabilization. In particular, Fig. 8G is the enlarged partial view of Fig. 8E. According to Fig. 8G, the visual angle is 4 degrees to 8 degrees and the equivalent focal length is 400 mm to 600 mm.

[0177] In Figs. 8D to 8G, the zoom function can be achieved through the electronic device 80, when the scene is captured through the camera modules with different focal lengths cooperated with the image processing function. It should be mentioned that the equivalent focal length is the value estimated by conversion, and the equivalent focal length may be different from the actual focal length due to the design of the camera module and the cooperation of the image sensor dimension.

[0178] The foregoing description, for purposes of explanation, has been described with reference to specific examples. It should be noted that the Tables show different data from the different examples; however, the data for the different examples are obtained from experiments. The examples have been chosen and described to better explain the principles of the description and their practical applications, so as to enable others skilled in the art to better utilize the description and various examples with various modifications suitable for the particular use contemplated. The examples described above and the accompanying drawings are exemplary and are not intended to be exhaustive or to limit the scope of the present description to the precise shapes described. Many modifications and variations are possible in view of the above teachings.

Claims (65)

Optical imaging system, characterized in that it comprises, in order along a paraxial path: an infrared light-absorbing element made of an infrared light-absorbing plastic material, the infrared light-absorbing element being configured to refract a light; an infrared light reducing film closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system; and a plate member disposed between the infrared light-reducing film and the imaging surface, the plate member integrally formed, the plate member comprising a translucent portion and a support portion, wherein the translucent portion and the imaging surface are arranged correspondingly and the support portion surrounds the translucent portion so as to maintain the translucent portion in a specific position in the paraxial path; wherein the plate element further comprises a conical structure coating disposed on at least one of an incident surface and an exit surface of the translucent portion, the conical structure coating is gradually spread toward an air direction and a plurality of pores are formed on at least one of the incident surface and the exit surface of the translucent portion; wherein the conical structure coating is mainly made of a ceramic material and an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the conical structure coating; wherein an average crystal height of the conical structure coating is GH, a focal length of the imaging optical system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1 , a distance between the infrared light reducing film and the conical structure coating along the paraxial path is L2, and the following conditions are satisfied: 60 nm ≤ GH ≤ 400 nm; 0.0 ≤ L1/f ≤ 0.21; and 0.21 ≤ L2/f. Optical imaging system according to claim 1, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.98% through the conical structure coating. Optical imaging system according to claim 1, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.5% through the conical structure coating. Optical imaging system according to claim 1, characterized by the fact that the average crystal height of the conical structure coating is GH and the following condition is satisfied: 120 nm ≤ GH ≤ 300 nm. Optical imaging system according to claim 1, characterized in that it additionally comprises: an intermediate layer connected to the conical structure shell and the plate element; wherein the intermediate layer is contacted with air through at least one of the pores. Optical imaging system according to claim 1, characterized in that the infrared light reducing film is disposed on an exit surface of the infrared light absorbing element. Optical imaging system according to claim 1, characterized in that it further comprises: a film arrangement element disposed on an image side of the infrared light absorption element; wherein the infrared light reducing film is disposed on an incident surface and an exit surface of the film disposition element. Optical imaging system according to claim 7, characterized in that the film arrangement element is immediately adjacent to the infrared light absorbing element. Optical imaging system according to claim 8, characterized in that it additionally comprises: an adhesive, the infrared light absorption element and the film laying element reinforced through the adhesive. Optical imaging system according to claim 1, characterized in that the supporting portion of the plate element is made of an opaque plastic material. Optical imaging system according to claim 10, characterized in that the plate element is integrally formed by an insertion molding process or a two-shot molding process. Optical imaging system according to claim 1, characterized in that the plate element further comprises a light-blocking portion and the light-blocking portion and the translucent portion are disposed adjacently. Optical imaging system according to claim 1, characterized in that the conical structure coating is arranged simultaneously on the incident surface and on the exit surface of the translucent portion. Optical imaging system according to claim 1, characterized in that the conical structure coating is simultaneously disposed on at least a portion of a surface of the support portion. Optical imaging system according to claim 1, characterized by the fact that the focal length of the optical imaging system is f, a thickness of the translucent portion is THI and the following condition is satisfied: 0.005 ≤ THI/f ≤ 0, 35. Camera module, characterized by the fact that it comprises: the optical imaging system, of the type defined in claim 1; and an image sensor disposed on the imaging surface of the optical imaging system. Electronic device, characterized by the fact that it comprises: at least one camera module, of the type defined in claim 16. Optical imaging system, characterized in that it comprises, in order along a paraxial path: an infrared light-absorbing element made of an infrared light-absorbing plastic material and the infrared light-absorbing element configured to refract a light; an infrared light reducing film closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system; a plate member disposed between the infrared light-reducing film and the imaging surface, the plate member integrally formed, the plate member comprising a translucent portion and a support portion, wherein the translucent portion and the imaging surface are correspondingly arranged and the support portion surrounds the translucent portion, so as to maintain the translucent portion in a specific position in the paraxial path; and an anti-reflective multilayer film disposed on at least one of an incident surface and an exit surface of the translucent portion, wherein the anti-reflective multilayer film comprises a plurality of high refractive index layers and a plurality of low refractive index layers. refraction, and the high refractive index layers and low refractive index layers are stacked alternately; wherein an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the anti-reflective multilayer film; wherein a focal length of the optical imaging system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, a distance between the infrared light reducing film and the infrared light reducing film antireflection multilayer along the paraxial path is L2', and the following conditions are satisfied: 0.0 ≤ L1/f ≤ 0.21; and 0.21 ≤ L2'/f. Optical imaging system according to claim 18, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.98% through the anti-reflective multilayer film. Optical imaging system according to claim 18, characterized in that the infrared light reducing film is disposed on an exit surface of the infrared light absorbing element. Optical imaging system according to claim 18, characterized by the fact that it further comprises: a film arrangement element disposed on an image side of the infrared light absorption element; wherein the infrared light reducing film is disposed on an incident surface and an exit surface of the film disposition element. Optical imaging system according to claim 21, characterized by the fact that the film arrangement element is immediately adjacent to the infrared light absorption element. Optical imaging system according to claim 22, characterized in that it additionally comprises: an adhesive, the infrared light absorption element and the film laying element reinforced through the adhesive. Optical imaging system according to claim 18, characterized in that the supporting portion of the plate element is made of an opaque plastic material. Optical imaging system according to claim 24, characterized in that the plate element is integrally formed by an insertion molding process or a two-shot molding process. Optical imaging system according to claim 18, characterized in that the plate element further comprises a light-blocking portion and the light-blocking portion and the translucent portion are disposed adjacently. Optical imaging system according to claim 18, characterized in that the anti-reflective multilayer film is arranged simultaneously on the incident surface and on the exit surface of the translucent portion. Optical imaging system according to claim 18, characterized in that the anti-reflective multilayer film is simultaneously disposed on at least a portion of a surface of the support portion. Optical imaging system according to claim 18, characterized in that the focal length of the optical imaging system is f, a thickness of the translucent portion is THI and the following condition is satisfied: 0.005 ≤ THI/f ≤ 0, 35. Camera module, characterized by the fact that it comprises: the optical imaging system, of the type defined in claim 18; and an image sensor disposed on the imaging surface of the optical imaging system. Electronic device, characterized by the fact that it comprises: at least one camera module, of the type defined in claim 30. Optical imaging system, characterized in that it comprises, in order along a paraxial path: an infrared light-absorbing element made of an infrared light-absorbing plastic material, the infrared light-absorbing element being configured to refract a light; an infrared light reducing film closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system; a plate element comprising a translucent portion and a support portion, wherein the translucent portion is disposed between the infrared light reducing film and the image surface, the translucent portion and the image surface are arranged correspondingly, the portion support portion surrounds the paraxial path and the support portion and the translucent portion are formed integrally so as to maintain the translucent portion in a specific position in the paraxial path; and a low reflectance film disposed on at least one of an incident surface and an exit surface of the translucent portion and simultaneously coated on at least a portion of the support portion; wherein an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film; wherein a focal length of the optical imaging system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, a distance between the infrared light reducing film and the infrared light reducing film low reflectance along the paraxial path is L2'', and the following conditions are satisfied: 0.0 ≤ L1/f ≤ 0.21; and 0.21 ≤ L2''/f. Optical imaging system according to claim 32, characterized by the fact that the low refractive index film comprises an anti-reflective multilayer film comprising a plurality of high refractive index layers and a plurality of low refractive index layers. and the high refractive index layers and low refractive index layers are stacked alternately. Optical imaging system according to claim 32, characterized in that the low reflectance film comprises a conical structure coating disposed on at least one of the incident surface and the exit surface of the translucent portion, the conical structure coating conical is gradually sparse towards the air, a plurality of pores are formed on at least one of the incident surface and the exit surface of the translucent portion, and the coating of the conical structure is mainly made of a ceramic material; wherein an average crystal height of the conical structure coating is GH, and the following condition is satisfied: 60 nm ≤ GH ≤ 400 nm. Optical imaging system according to claim 34, characterized in that the average crystal height of the coating of the conical structure is GH, and the following condition is satisfied: 120 nm ≤ GH ≤ 300 nm. Optical imaging system according to claim 34, characterized in that the low reflectance film further comprises an intermediate layer directly in contact with the plate element and at least a portion of the intermediate layer is contacted with an air through at least one of the pores. Optical imaging system according to claim 32, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.98% through the low reflectance film. Optical imaging system according to claim 37, characterized in that the average reflectivity of light in the wavelength range between 400 nm and 900 nm is less than 0.5% through the low reflectance film. Optical imaging system according to claim 32, characterized in that the infrared light reducing film is disposed on an exit surface of the infrared light absorbing element. Optical imaging system according to claim 32, further comprising: a film arrangement element disposed on an image side of the infrared light absorbing element; wherein the infrared light reducing film is disposed on an incident surface and an exit surface of the film disposition element. Optical imaging system according to claim 40, characterized by the fact that the film arrangement element is immediately adjacent to the infrared light absorbing element. Optical imaging system according to claim 41, characterized in that it additionally comprises: an adhesive, the infrared light absorption element and the film laying element reinforced through the adhesive. Optical imaging system according to claim 32, characterized in that the supporting portion of the plate element is made of an opaque plastic material. Optical imaging system according to claim 32, characterized by the fact that the low reflectance film is disposed simultaneously on the incident surface and on the exit surface of the translucent portion; wherein the low-reflectance film disposed on the incident surface of the translucent portion comprises one of an anti-reflective multilayer film and a conical structure coating; wherein the low reflectance film disposed on the exit surface of the translucent portion comprises one of the anti-reflective multilayer film and the conical structure coating. Optical imaging system according to claim 32, characterized in that the low reflectance film is simultaneously disposed on at least a portion of a surface of the support portion. Optical imaging system according to claim 32, characterized in that the focal length of the optical imaging system is f, a thickness of the translucent portion is THI and the following condition is satisfied: 0.005 ≤ THI/f ≤ 0, 35. Camera module, characterized by the fact that it comprises: the optical imaging system, of the type defined in claim 32; and an image sensor disposed on the imaging surface of the optical imaging system. Electronic device, characterized by the fact that it comprises: at least one camera module, of the type defined in claim 47. Optical imaging system, characterized in that it comprises, in order along a paraxial path: an infrared light-absorbing element made of an infrared light-absorbing plastic material and the infrared light-absorbing element configured to refract a light; an infrared light reducing film closer to an imaging surface of the optical imaging system than an incident surface of the infrared light absorbing element to the imaging surface of the optical imaging system; a prism element, comprising: a prism portion comprising an incident surface, at least one reflecting surface and an exit surface in order along the paraxial path, and the exit surface of the prism portion and the imaging surface arranged so as to corresponding shape; and a support portion carrying the prism portion, so as to maintain the prism portion in a specific position in the paraxial path; and a low reflectance film disposed on at least one of the incident surface and the exit surface of the prism portion; wherein an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film; wherein a focal length of the optical imaging system is f, a distance between the infrared light absorbing element and the infrared light reducing film along the paraxial path is L1, a distance between the infrared light reducing film and the infrared light reducing film low reflectance along the paraxial path is L2'', and the following conditions are satisfied: 0.0 ≤ L1/f ≤ 0.21; and 0.21 ≤ L2''/f. Optical imaging system according to claim 49, characterized by the fact that the low refractive index film comprises an anti-reflective multilayer film comprising a plurality of high refractive index layers and a plurality of low refractive index layers. and the high refractive index layers and the low refractive index layers are stacked alternately. Optical imaging system according to claim 49, characterized in that the low reflectance film comprises a conical structure coating disposed on at least one of the incident surface and the exit surface of the prism portion, the coating of conical structure is gradually sparse toward the air, a plurality of pores are formed on at least one of the incident surface and the exit surface of the prism portion, and the coating of the conical structure is mainly made of a ceramic material; wherein an average crystal height of the conical structure coating is GH and the following condition is satisfied: 60 nm ≤ GH ≤ 400 nm. Optical imaging system according to claim 51, characterized by the fact that the average crystal height of the conical structure coating is GH and the following condition is satisfied: 120 nm ≤ GH ≤ 300 nm. Optical imaging system according to claim 51, characterized in that the low reflectance film further comprises an intermediate layer directly in contact with the prism element and the intermediate layer is contacted with an air through at least one of the pores. Optical imaging system according to claim 49, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.98% through the low reflectance film. Optical imaging system according to claim 49, characterized in that an average reflectivity of a light in a wavelength range between 400 nm and 900 nm is less than 0.5% through the low reflectance film. Optical imaging system according to claim 49, characterized in that the infrared light reducing film is disposed on an exit surface of the infrared light absorbing element. Optical imaging system according to claim 49, characterized by the fact that it additionally comprises: a film arrangement element disposed on an image side of the infrared light absorption element; wherein the infrared light reducing film is disposed on an incident surface and an exit surface of the film disposition element. Optical imaging system according to claim 57, characterized by the fact that the film arrangement element is immediately adjacent to the infrared light absorption element. Optical imaging system according to claim 58, characterized in that it additionally comprises: an adhesive, the infrared light absorption element and the film laying element reinforced through the adhesive. Optical imaging system according to claim 49, characterized in that the supporting portion of the prism element is made of an opaque plastic material. Optical imaging system according to claim 49, characterized by the fact that the low reflectance film is disposed simultaneously on the incident surface and on the exit surface of the prism portion; wherein the low-reflectance film disposed on the incident surface of the prism portion comprises one of an anti-reflective multilayer film and a conical structure coating; wherein the low reflectance film disposed on the exit surface of the prism portion comprises one of the anti-reflective multilayer film and the conical structure coating. Optical imaging system according to claim 49, characterized in that the low reflectance film is simultaneously disposed on at least a portion of a surface of the support portion. Camera module, characterized by the fact that it comprises: the optical imaging system, of the type defined in claim 49; and an image sensor disposed on the imaging surface of the optical imaging system. Electronic device, characterized by the fact that it comprises: at least one camera module, of the type defined in claim 63. A camera module, characterized by the fact that it comprises: an optical imaging system comprising: an array of imaging lenses, comprising: a plurality of lens elements arranged in order along a paraxial path, wherein the lens elements comprise an infrared light-absorbing lens element and the infrared light-absorbing lens element is made of an infrared light-absorbing plastic material; an infrared light reducing film disposed on an exit surface of the infrared light absorbing lens element; and a lens carrier accommodating the lens elements and the infrared light reducing film; a plate element comprising: a translucent portion; and a support portion surrounding the paraxial path; and a low reflectance film disposed on at least one of an incident surface and an exit surface of the translucent portion; and an image sensor disposed on an imaging side of the lens carrier, the plate element disposed between the imaging lens assembly and the image sensor, the translucent portion and the image sensor correspondingly disposed, and the paraxial path passing through the imaging lens assembly and then traveling to the imaging sensor; wherein a specific distance between the translucent portion of the plate element and the image sensor is maintained through the support portion; wherein an average reflectivity of a light in a wavelength range between 420 nm and 680 nm is less than 0.98% through the low reflectance film; wherein a focal length of the imaging optical system is f, a distance between the infrared light reducing film and the low reflectance film along the paraxial path is L2'', a thickness of the translucent portion is THI and the following conditions are satisfied: 0.21 ≤ L2''/f; and 0.005 ≤ THI/f ≤ 0.35.

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