BR102017006351A2 - ELECTRICAL CONDUCTION PATH SYSTEM AND METHOD OF MANUFACTURING THE SAME - Google Patents

Description

Report of the Invention Patent for "ELECTRICAL DRIVING WAY SYSTEM AND METHOD FOR MAKING THE SAME".

CROSS REFERENCE FOR RELATED ORDERS

The present request is a continuation in part and claims priority for pending request no. serial 14 / 138.120, filed December 22, 2013, entitled "STRUCTURES WITH PZT NANOPARTICLE INK BASED PIEZOELECTRIC ASSEMBLY SENSOR", having Protocol Representative No. 11-0195-US-CNT, and which is a continuation and claims priority for US non-provisional patent application serial number 13 / 212,037, filed August 17, 2011, now US Patent No. 8,614,724, issued December 24, 2013, entitled "METHOD AND SYSTEM OF MANUFACTURING PZT NANOPARTICLE INK BASED PIEZOELECTRIC SENSOR "having Representative Protocol No. 11-0195-US-NP, and which is related to non-provisional patent application US serial number 13 / 211.554, filed August 17, 2011, now US Patent No. 9,005 .465, issued April 14, 2015, entitled "ME-THODS FOR FORMING LEAD ZIRCONATE TITANATE NANOPAR-TICLES", having Representative Protocol Number UWOTL-1-37259, and which is also related to non-provisional US patent application. number s erial 13 / 212.123, filed August 17, 2011, now US Patent No. 8,766,511, issued July 1, 2014, entitled "METHOD AND SYSTEM FOR DISTRIBUTED NETWORK OF NANOPARTICLE INK BASED PIEZOELECTRIC SENSORS FOR STRUCTURAL HEALTH MONITORING" having Protocol No. 11-0839-US-NP. The contents of request serial number 14 / 138.120, request serial number 13 / 212.037, request serial number 13 / 211.544 and request serial number 13 / 212.123.

BACKGROUND

1) REVELATION FIELD

[002] The disclosure relates generally to systems and methods using conductive materials printed or deposited with direct etch printing processes, and more particularly to lightning protection systems and methods using conductive materials such as nanoparticle ink, printed or deposited with direct embossing printing processes. The disclosure also relates generally to methods and systems for making sensors, and more particularly to methods and systems for making piezoelectric nanoparticle sensors deposited on a structure.

2) DESCRIPTION OF RELATED TECHNIQUE

[003] Composite materials are used in a wide variety of component structures and parts, including the manufacture of aircraft, such as aircraft, spaceships and helicopters, and the manufacture of boats, automobiles, trucks and other vehicles, because of their high reasons. resistance to weight, corrosion resistance and other favorable properties. In particular, in aircraft construction, composite structures and component parts are used in increasing amounts to form the fuselage, wings, tail section, cladding panels and other aircraft component parts.

[004] However, composite materials are less conductive than metallic materials, and composite structures and component parts may have difficulty dissipating charge or electrical energy from a lightning strike or P-static (static precipitation) as quickly or as quickly as possible. as efficient as metal structures and component parts.

Known systems and methods have been developed to manage lightning strikes and static build-up, for example, P-static, in aircraft composite structures such as airplanes. Several known systems and methods add metal conductors or incorporate thin metal blade systems of various configurations into composite component structures and parts. Addition of such metal conductors may include metal diverter strips applied to composite structures and component parts. Incorporation of such thin metal blade systems may include the use of thin copper or aluminum foil in the form of metal mesh embedded in the composite component structures and parts. However, such known metal diverter strips and embedded metal meshes may have difficulty coping with the fatigue of a flexible surface, such as a flight control surface of an aircraft wing, and may affect the structure of the composite material or part. composite component within which they are applied or embedded.

In addition, known applique-based systems can be used to manage lightning strikes and static build-up, for example, P-static, in aircraft composite structures such as airplanes. Such known applique-based systems use alternating layers of dielectric and conductive materials applied as an applique on the composite structure surface and secured to the surface with an adhesive. However, such known appliqués may not be installed or applied during fabrication or assembly of part layers, and typically may be installed or applied after fabrication in a secondary operation. This can result in decreased productivity. Additionally, such known appliqués typically include a continuous layer applied with an adhesive and may be difficult to repair or replace in situ.

[007] Another difficulty with such known lightning strike and static accumulation management systems and methods is that they are not processed with direct engraving, and may require fabrication with a special layer assembly process, which can increase the manufacturing time and cost, or may require application to a less permanent secondary operation after fabrication.

Therefore, there is a need in the art for an improved electrical conduction path system and method for managing electrical charge, such as lightning strikes and P-static, on the surface of composite structures and component parts that provide advantages over known systems and methods.

Small sensors, such as microsensors, can be used in a variety of applications including structural health monitoring (SHM) systems and methods to continuously monitor structures, such as composite or metal structures, and to measure material characteristics. and stress and strain levels to assess performance, possible damage, and current state of structures. Known SHM systems and methods may include the use of small rigid ceramic disk sensors integrated with a polyimide substrate and connected to power and communication conductors. Such known sensors typically are manually attached to a structure with an adhesive. Such manual installation may increase labor and installation costs and such adhesive may degrade over time and may result in the sensor detaching from the structure. In addition, such known sensors may be made of rigid, flat and / or brittle materials that may limit their use; For example, use on a curved or non-flat substrate surface can be difficult. In addition, in a large array of such known sensors, the amount of power and communication conductors required can increase the complexity and weight of the structure.

In addition, known sensor systems and methods, such as microelectromechanical systems and methods (MEMS), may include the use of depositing piezoelectric sensors such as lead zirconate (PZT) sensors onto a substrate, having in particular in the particles. Known methods for making such MEMS may include PZT powder melt salt synthesis for direct etching inks. However, applications of PZT sensors manufactured using such known methods may be limited by the physical geometry of PZT sensors. Such physical geometry limitations may result in inadequate detection capabilities or inadequate triggering responses. Additionally, PZT sensors manufactured with such known methods may be unable to be applied or located in areas where their function may be important because of the PZT sensor manufacturing method. For example, known melt salt synthesis methods may require processing at higher temperatures than certain application substrates can tolerate.

Additionally, such known MEMS systems and methods may also include the use of sensors having nanoparticles that have not been crystallized and which may be less efficient than nanoparticles that have been crystallized. Uncrystallized structures typically have greater disorganization resulting in decreased response sensitivity to strain and stress, whereas crystallized structures typically have greater internal organization resulting in increased deformation response sensitivity and decreased energy requirements to operate. In addition, sensor nanoparticles may be too large for some known deposition processes and systems, such as an atomized jet deposition (JAD) process, and such nanoparticles may require a high temperature sintering / crystallization process that may result in damage to temperature sensitive substrates or structures.

Therefore, there is a need in the art for an improved method and system of fabricating PZT piezoelectric sensors having nanoparticles that can be used in structural health monitoring systems and methods for structures, where such improved method and system provide advantages over known methods and systems.

SUMMARY

Example implementations of this disclosure provide an improved electrical conduction path system and method. As discussed in the following detailed description, improved system modalities and electrical conduction path method can provide significant advantages over known systems and methods for managing electrical charge on a surface of a structure.

In a development mode an electric conduction path system is provided to divert an electric charge. The electrical conduction path system comprises a substrate having a first printable surface and having one or more ground points.

The direct recording conductive material pattern forms one or more electrical paths interconnected with one or more ground points. The one or more electrical paths interconnected with one or more ground points divert the electrical charge from the first surface to one or more ground points.

In another mode of development, an aircraft is provided. The aircraft comprises an aerial vehicle structure having an electric driving path system.

The electrical conduction path system comprises a prepared substrate having a printable surface and having one or more grounding points. The electrical conduction path system further comprises a direct embossing conductive material pattern comprising a grid pattern printed directly on the surface prepared by a direct embossing printing process. The direct-recording conductive material pattern forms one or more electrical paths interconnected with one or more ground points.

The electrical conduction path system additionally comprises a conductive coating applied over the direct etching conductive material standard. The electrical conduction path system further comprises an upper cover layer applied over the conductive coating. The one or more electrical paths interconnected with one or more ground points divert an electrical charge from a lightning strike or static (P-static) fall on an outside surface of the aircraft structure to one or more ground points. .

[0019] In another embodiment of the disclosure, a method of fabricating an electrical conduction path system for diverting an electrical charge into a structure is provided. The method comprises the step of providing the structure having a printable surface and having one or more grounding points. The method further comprises the step of printing, by means of a direct etch printing process, a pattern of direct etch conductive material on the surface of the structure to form one or more electrical paths. The method further comprises the step of interconnecting one or more electrical paths with one or more grounding points to divert the surface electrical charge to one or more grounding points.

Furthermore, this need for a method and system for manufacturing lead zirconate piezoelectric (PZT) piezoelectric sensors having nanoparticles that can be used in structural health monitoring systems and methods for structures is met. As discussed in the following detailed description, method and system embodiments may provide significant advantages over existing methods and systems.

In another embodiment of the disclosure, a method of fabricating a lead zirconate nanoparticle (PZT) ink-based piezoelectric sensor is provided. The method comprises formulating a PZT nanoparticle ink. The method further comprises depositing ink of PZT nanoparticles on a substrate by means of an ink deposition process to form a PZT nanoparticle ink-based piezo sensor.

In another embodiment of the disclosure, a method of manufacturing a piezoelectric lead zirconate nanoparticle (PZT) ink-based sensor is provided. The method comprises formulating a PZT nanoparticle ink comprising precrystallized PZT nanoparticles. The method further comprises suspending the ink of PZT nanoparticles on a sol-gel adhesion promoter. The method further comprises depositing the PZT nanoparticle ink onto a substrate by a direct etch printing process to form a PZT nanoparticle ink-based piezo sensor.

In another embodiment of the development, a system is provided for manufacturing a lead zirconate (PZT) nanoparticle ink-based piezoelectric sensor. The system comprises a formulated PZT nanoparticle paint. The system further comprises an ink deposition apparatus depositing ink of PZT nanoparticles on a substrate to form a PZT nanoparticle ink-based piezoelectric sensor. The structure may have an uncurved or flat surface, a curved or non-flat surface, or a combination of an uncurved or flat surface and a curved or non-flat surface. The PZT nanoparticle ink-based piezoelectric sensor may be deposited on a frame surface with one or more layers of insulation, coatings or paint between a body of the frame and the PZT nanoparticle ink-based piezoelectric sensor.

In another embodiment of the disclosure, a structure comprising a substrate and a lead zirconate titanate (PZT) ink-based piezoelectric nanoparticle sensor assembly deposited directly onto the substrate is provided. The PZT nanoparticle ink-based piezoelectric sensor assembly comprises a PZT nanoparticle ink-based piezoelectric sensor comprising a PZT nanoparticle ink deposited on the substrate by an ink deposition direct etch printing process. . PZT nanoparticle paint does not require a high temperature sintering / crystallization process once deposited. The PZT nanoparticle ink-based piezoelectric sensor assembly further comprises a power and communication conductive assembly coupled to the PZT nanoparticle ink-based piezoelectric sensor. The power and communication conductive assembly comprises a conductive ink deposited on the substrate by the direct ink deposition etching printing process.

In another embodiment of the disclosure, a composite structure is provided comprising a composite substrate and a lead zirconate (PZT) ink-based piezoelectric nanoparticle sensor assembly deposited directly onto the composite substrate. The PZT nanoparticle ink-based piezoelectric sensor assembly comprises a PZT nanoparticle ink-based piezoelectric sensor comprising a PZT nanoparticle ink deposited on the composite substrate by a direct deposition etching direct printing process. ink. PZT nanoparticle paint does not require a high temperature sintering / crystallization process once deposited. The PZT nanoparticle ink-based piezoelectric sensor assembly further comprises a power and communication conductive assembly coupled to the PZT nanoparticle ink-based piezoelectric sensor. The power and communication conductive assembly comprises a conductive ink deposited on the composite substrate by the direct ink deposition etching printing process.

In another embodiment of the disclosure, a metal frame comprising a metal substrate and a lead zirconate nanoparticle (PZT) ink-based piezoelectric sensor assembly deposited directly onto the metal substrate is provided. The PZT nanoparticle ink-based piezoelectric sensor assembly comprises a PZT nanoparticle ink-based piezoelectric sensor comprising a PZT nanoparticle ink deposited on the metal substrate by a direct deposition etching direct printing process. ink. PZT nanoparticle paint does not require a high temperature sintering / crystallization process once deposited. The PZT nanoparticle ink-based piezoelectric sensor assembly further comprises a power and communication conductive assembly coupled to the PZT nanoparticle ink-based piezoelectric sensor. The power and communication conductive assembly comprises a conductive ink deposited on the metal substrate by the direct ink deposition etching printing process. The PZT nanoparticle ink-based piezoelectric sensor assembly further comprises an insulating layer deposited between the metal substrate and the PZT nanoparticle ink-based piezoelectric sensor of the zirconate titanate nanoparticle ink-based piezoelectric sensor assembly lead (PZT) deposited by direct recording.

The features, functions and advantages that have been discussed may be independently achieved in various embodiments of the disclosure or may also be combined in other embodiments whose additional details may be seen with reference to the following description and drawings.

BRIEF DESCRIPTION OF DRAWINGS

The disclosure may be better understood by reference to the following detailed description taken in connection with the accompanying drawings which illustrate preferred and exemplary embodiments, but which are not necessarily drawn to scale, in which: Figure 1A is an illustration of a perspective view of an exemplary aircraft for which one embodiment of the development system and method may be used;

Figure 1B is an illustration of a flowchart of one embodiment of an aircraft manufacturing and service method;

Figure 1C is an illustration of a functional block diagram of one embodiment of an aircraft;

Figure 2 is an illustration of a cross-sectional view of one embodiment of a deposited PZT nanoparticle ink-based piezo sensor sensor assembly;

Figure 3 is an illustration of a cross-sectional view of another embodiment of embodiments of a deposited PZT nanoparticle ink-based piezo sensor sensor;

Figure 4 is an illustration of a perspective top view of one embodiment of a PZT nanoparticle ink-based piezoelectric sensor assembly deposited on a composite structure;

Figure 5 is a block diagram illustration of one embodiment of a system for manufacturing a PZT nanoparticle ink-based piezo sensor of the development;

Figure 6A is a schematic view illustration of one embodiment of an ink deposition process and apparatus for manufacturing a PZT nanoparticle ink-based piezo sensor of the disclosure;

Figure 6B is an enlarged view of the PZT nanoparticle ink-based piezoelectric sensor being deposited on the substrate;

Figure 7 is an illustration of a schematic diagram of one embodiment of a structural health monitoring system using the PZT nanoparticle ink-based piezo sensors of the disclosure;

Figure 8 is an illustration of a flowchart of one embodiment of a development method;

Figure 9 is an illustration of a flowchart of another embodiment of a development method;

Figure 10 is a block diagram illustration of modalities of ink deposition processes and ink deposition apparatus that can be used to fabricate the PZT nanoparticle ink-based piezo sensor of the development;

Figure 11A is an illustration of a perspective sectional top view of one embodiment of an electrical conduction pathway system of the disclosure;

Fig. 11B is an illustration of a cross-sectional view of the electrical conduction path system of Fig. 11A;

Figure 12A is an illustration of a perspective sectional top view of another embodiment of an electrical conduction pathway system of the invention;

Fig. 12B is an illustration of a cross-sectional view of the electrical conduction path system of Fig. 12A;

Figure 13A is an illustration of a perspective sectional top view also of another embodiment of an electrical conduction pathway system of the disclosure;

Figure 13B is an illustration of a cross-sectional view of the electrical conduction path system of Figure 13A;

Figure 14A is an illustration of a perspective sectional top view also of another embodiment of an electrical conduction pathway system of the invention;

Fig. 14B is an illustration of a cross-sectional view of the electrical conduction path system of Fig. 14A;

Fig. 15 is an illustration of a cross-sectional view of one embodiment of an electrical conduction path system having grounding points in the form of fasteners;

[0051] Figure 16A is a top view illustration of one embodiment of a direct recording conductive material pattern that may be used in one embodiment of an electric conduction pathway system;

Figure 16B is a top view illustration of another embodiment of a direct recording conductive material pattern that may be used in one embodiment of an electric conducting pathway system;

Figure 16C is an illustration of a top view also of another embodiment of a direct recording conductive material pattern that may be used in one embodiment of an electrical conduction pathway system;

Figure 17 is an illustration of a block diagram of one embodiment of a vehicle with an electric conduction pathway system of the disclosure; and Figure 18 is an illustration of a flowchart of one embodiment of another method of the disclosure.

DETAILED DESCRIPTION

Disclosed embodiments will be described in more detail below with reference to the accompanying drawings, in which some, but not all, disclosed embodiments are shown. Indeed, several different embodiments may be provided and should not be construed as limited to the embodiments set forth herein. In particular, these embodiments are provided so that this disclosure is judicious and complete and fully conveys the scope of the disclosure to those skilled in the art. The following detailed description is of the ways currently considered to be the best for performing the revelation. The description is not to be considered with a sense of limitation, and is given merely for the purpose of illustrating the general principles of disclosure, since the scope of disclosure is better defined by the appended claims.

Referring now to the figures, Figure 1A is an illustration of a perspective view of an exemplary prior art aircraft 10 for which one embodiment of a system 100 (see Figure 5), a method 200 ( see figure 8), or a method 250 (see figure 9) for fabricating a lead zirconate titanate (PZT) paint piezoelectric sensor 110 (see figure 2) for a frame 30, such as the composite frame 102 (see figure 1Α) or a metal frame 132 (see figure 3) may be used. As used herein, the term "PZT" means lead zirconate titanate - a piezoelectric and ferroelectric ceramic material composed of the lead and zirconium chemical elements and the titanate chemical compound that can be combined at high temperatures. PZT exhibits favorable piezoelectric properties. As used herein, the term "piezoelectric" with respect to PZT means that PZT develops a voltage or potential difference across two of its faces when deformed, which is advantageous for sensor applications, or it physically changes shape. when an external electric field is applied, which is advantageous for actuator applications. For purposes of this application, the term "ferroelectric" with respect to PZT means that PZT has a spontaneous electric polarization or electric dipole that can be inverted in the presence of an electric field.

Aircraft 10 comprises a fuselage 12, a nose 14, a cabin 16, wings 18 operably coupled to fuselage 12, one or more propulsion units 20, a vertical tail stabilizer 22 and one or more horizontal wing stabilizers. tail 24. Although aircraft 10 shown in Figure 1A is generally representative of a commercial airliner, the system 100 and methods 200, 250 disclosed herein may also be employed on other aircraft types. More specifically, the provisions of the disclosed embodiments may apply to other passenger aircraft, cargo aircraft, military aircraft, helicopters and other types of aircraft or air vehicles, as well as aerospace vehicles such as satellites, space launch vehicles, rockets. and other types of aerospace vehicles. It may also be appreciated that modalities of systems, methods and apparatus according to disclosure may be used in other vehicles, such as boats and other vessels, trains, automobiles, trucks, buses and other types of vehicles. It may also be appreciated that embodiments of systems, methods and apparatus according to the disclosure may be used in architectural structures, turbine blades, medical devices, electronic drive equipment, consumer electronic devices, vibrating equipment, passive and active dampers or in other suitable structures.

Referring now to Figures 1B and 1C, Figure 1B is an illustration of a flowchart of one embodiment of an aircraft manufacturing and service method 31. Figure 1C is an illustration of a functional block diagram of a Referring to FIGURES 1B-1C, embodiments of the disclosure may be described in the context of the aircraft manufacturing and service method 31 as shown in FIG. 1B, and of aircraft 46 as shown. in figure 1C. During pre-production, the exemplary aircraft manufacturing and service method 31 (see figure 1B) may include specification and design 32 (see figure 1B) of aircraft 46 (see figure 1C) and material procurement 34 (see figure 1B). During fabrication, fabrication of components and subassemblies 36 (see Figure 1B) and system integration 38 (see Figure 1B) of aircraft 46 (see Figure 1C) take place. Aircraft 46 (see Figure 1C) can then pass certification and delivery 40 (see Figure 1B) in order to be put into service 42 (see Figure 1B). While in service 42 (see figure 1B) by a customer, aircraft 46 (see figure 1C) may be scheduled for routine maintenance and service 44 (see figure 1B), which may also include modification, reconfiguration and figuration, restoration and other appropriate services.

Each of the aircraft manufacturing and service method processes 31 (see Figure 1B) may be performed or performed by a system integrator, an external entity and / or an operator (eg a customer). For the purposes of this description, a system integrator may include, without limitation, any number of aircraft manufacturers and main system subcontractors; an external entity may include, without limitation, any number of sellers, subcontractors and suppliers; and an operator may include an appropriate airline, leasing company, military entity, service organization and other appropriate operators.

As shown in Figure 1C, aircraft 46 produced by the exemplary aircraft manufacturing and service method 31 (see Figure 1B) may include an airplane structure 48 with a plurality of systems 50 and an interior 52. As further shown in Figure 1C, examples of systems 50 may include one or more of a propulsion system 54, an electrical system 56, a hydraulic system 58 and an environmental system 60. Any number of other systems may be included. Although an aerospace example is shown, the principles of revelation can be applied to other industries, such as the automotive industry.

[0062] Methods and systems incorporated herein may be employed during any one or more of the stages of aircraft manufacturing and service method 31 (see Figure 1B). For example, components or subassemblies corresponding to the manufacture of components and subassemblies 36 (see Figure 1B) may be manufactured or assembled in a similar manner to components or subassemblies produced while aircraft 46 (see Figure 1C) is in service. (see figure 1B). Also, one or more apparatus embodiments, method embodiments, or a combination thereof, may be used during component and sub-assembly fabrication 36 (see Figure 1B) and system integration 38 (see Figure 1B), for example, by substantially shipping assembly or reducing the cost of aircraft 46 (see Figure 1C). Similarly, one or more apparatus embodiments, method embodiments, or a combination thereof may be used while aircraft 46 (see Figure 1C) is in service 42 (see Figure 1B), for example, and without limitation for maintenance and service 44 (see Figure 1B).

In one embodiment of the disclosure, a system 100 is provided for manufacturing the lead zirconate nanoparticle (PZT) piezoelectric ink-based sensor 110. Figure 5 is an illustration of a one-block diagram of a of the embodiments of the system 100 for manufacturing the PZT 110 nano-particle ink-based piezoelectric sensor (see also Figure 2) of the development. As shown in Figure 5, the system 100 for making the PZT nanoparticle ink-based piezoelectric sensor 110 comprises a lead zirconate titanate (PZT) nanoparticle ink formulated 104. The PZT 104 nanoparticle ink comprises the particles or nanoscale PZT ink nanoparticles 106. Preferably, the nanoscale PZT ink nanoparticles are precrystallized. PZT 104 nanoparticle ink preferably has a nanoscale PZT particle size in the range of about 20 nanometers to about 1 micron. The nanoscale PZT ink particle size allows PZT 104 nanoparticle ink to be deposited using a wide range of ink deposition processes, devices and systems, and in particular allows PZT 104 nanoparticle ink to be deposited. using an atomized jet deposition process system 126 (see figures 6A and 10) and an atomized jet deposition apparatus 146 (see figures 6A and 10). The PZT 110 nanoparticle ink-based piezoelectric sensor can have a thickness in a range from about 1 micron to about 500 microns. The thickness of the PZT 110 nanoparticle ink-based piezoelectric sensor can be measured in terms of a nanoparticle size factor of the PZT nanoparticles and the thickness of the conductive electrodes 114, 118 (see Figure 2). PZT 110 nanoparticle ink-based piezoelectric sensor thickness may also depend on the size of the PZT 110 nanoparticle ink-based piezoelectric sensor, as an appropriate aspect ratio may increase the sensitivity of the PZT 110-inkjet piezoelectric sensor. PZT 110 nanoparticles.

PZT 104 nanoparticle ink may further comprise a sol-gel adhesion promoter 108 (see Figure 5) to promote adherence of PZT 104 nanoparticle ink to a substrate 101. Alternatively, the PZT ink PZT 104 nanoparticles may further comprise a polymer based tackifier such as an epoxy or other suitable polymer based tackifier. Nanoscale PZT ink nanoparticles 106 may be suspended in a silica sol gel and then deposited using an ink deposition process 122 such as a direct etch printing process 124. The silica sol gel in PZT nanoparticle ink formulation enables PZT 104 nanoparticle ink to bond to a wider variety of substrates than certain known tackifiers. The PZT 110 nanoparticle ink-based piezoelectric sensor preferably has modalities based on ultrasonic wave propagation and electromechanical impedance.

The lead zirconate titanate (PZT) nanoparticle ink formulated 104 may be formulated by methods disclosed in the non-provisional patent application US Serial Number 13 / 211.554 filed today entitled "METHODS FOR FORMING LEAD ZIRCONATE TITANATE NANOPARTICLES" , having Representative Protocol No. UWOTL-1-37259, filed August 17, 2011, which is incorporated herein by reference in its entirety.

In particular, in such a disclosure, methods for forming lead zirconate titanate (PZT) nanoparticles are provided. PZT nanoparticles are formed from a precursor solution - comprising a lead source, a titanium source, a zirconium source and a mineralizer - which undergoes a hydrothermal process according to the following reaction ("the hydrothermal process"). Pb2 + + xTi02 + (1-x) Zr02 + 20H '<-> PbTixZr, _x03 + H20 [0067] In the methods provided, the properties of the formed PZT nanoparticles are dictated by at least the concentration of mineralizer, time of processing, heating rate and cooling rate.

In one aspect, a method is provided for forming a plurality of PZT nanoparticles (also referred to herein as "nanocrystals"). In one embodiment, the method includes the steps of: (a) providing an aqueous precursor solution comprising a mineralizing solution, a titanium source, a zirconium source and a lead source; and (b) heating the precursor solution to produce PZT nanoparticles, wherein heating the precursor solution comprises a first heating schedule that includes at least the sequential steps of: (i) heating the precursor solution at a first rate to a first temperature. wherein said first rate is between about 1 ° C / min to about 30 ° C / min (degrees Celsius per minute), and wherein said first temperature is between about 120 ° C and about 350 IC; (ii) holding for a first holding time at the first temperature, wherein said first holding time is between about 5 to about 300 minutes; and (iii) cooling at a second rate to provide a nanoparticle PZT solution comprising a plurality of suspended perovskite PZT nanoparticles having a smaller dimension between about 20 nm (nanometer) and about 1,000 nm, wherein said second rate. is between about 1'C / min and about 30 XX min.

Precursor Solution: The precursor solution is defined by reagents that are processed to form PZT nanoparticles. Specifically, the precursor solution includes at least one titanium source, a zirconium source, a lead source and a mineralizer. The precursor solution optionally includes additional solvents or stabilizers as will be discussed in more detail below.

The precursor solution components may all be combined simultaneously in a single reaction vessel, or may be combined gradually, depending on the nature of the precursor solution components and a potential need to minimize interaction between the precursor components prior to the reaction. hydrothermal reaction to produce PZT nanoparticles. For example, the titanium source and the zinc source may be combined to form a precursor gel, which is then combined with an aqueous lead source and the mineralizer to provide the precursor solution. Such an approach allows for maximum control over the relative molar amounts of each of the reagents (ie, titanium, zirconium and lead sources).

Lead, titanium and zirconium sources are present in the precursor solution in molar quantities sufficient to obtain PZT nanoparticles having the formula PbxZiyTiz03, where x is between 0.8 and 2, where y is between 0.4 and 0.6, and wherein y plus z is 1. For example, a common formula for PZT perovskite nanoparticles is Pb (Zr0.52Ti0.48) O3. However, it will be appreciated by those skilled in the art that the relative amounts of lead, zirconium and titanium can be modified within the ranges provided to produce the desired characteristics of PZT nanoparticles.

The source of titanium in the precursor solution may be any titanium-containing compound that allows the formation of PZT particles according to the method provided herein. In one embodiment, the titanium source is Ti [OCH (CH3) 2] 4. Additional sources of titanium may comprise Ti02, Ti02 * H2O, Ti (OC4H9), Ti (NO3) 2, TiCl3, TiCl4.

The source of zirconium in the precursor solution may be any zirconium-containing compound that allows the formation of PZT particles according to the method provided herein. In one embodiment, the source of zirconium is Zr [0 (CH2) 2CH3] 4. Additional sources of zirconium may comprise Zr (NO3) 4 * 5H20, Zr0Cl2 * 8H20, Zr02 * nH20, Zr02.

The lead source in the precursor solution may be any lead-containing compound that allows the formation of PZT particles according to the method provided herein. In one embodiment, the lead source is Pb (CH3COOH) 2. Additional sources of lead may comprise Pb (NO3) 2, Pb (OH) 2, PbO, Pb203, Pb02.

In certain embodiments, excess lead is added to the precursor solution. As used herein, the term "excess lead" refers to an amount of ratio greater than one for the lead source. Excess lead is a feature to exert additional control over the characteristics of PZT nanoparticles. Typically, excess lead is achieved in the precursor solution by adding an excess amount of the same lead source as described above. For example, if the lead source is lead acetate trihydrate, any amount of lead acetate trihydrate added to the precursor solution that results in the ratio of lead acetate trihydrate being greater than one compared to zirconium source and the titanium source will be considered as an excess amount of lead. In certain embodiments, the excess amount of lead comes from a different second lead source.

Excess lead does not alter the chemical composition of PZT nanoparticles, and instead modifies hydrothermal reaction conditions to produce various desirable effects on the formed PZT nanoparticles. Although excess lead does not alter the fundamental crystal structure of PZT nanoparticles, it improves morphology, reduces amorphous by-products, and reduces the degree of particle agglomeration.

A less desirable side effect of excess lead is that it also results in the formation of a lead oxide compound that is an impurity. However, lead oxide impurity can be removed by washing PZT nanoparticles formed with an appropriate solvent (eg dilute acetic acid).

The mineralizer in the precursor solution facilitates the formation of PZT during the hydrothermal process. The mineralizer acts as a source of hydroxide ions to facilitate hydrothermal synthesis of PZT. Representative mineralisers include KOH, NaOH, LiOH, NH4OH and combinations thereof. The concentration of the mineralizer in a mineralizing solution before adding to the other components of the precursor solution is from about 0.2 M to about 15 M if the mineralizer is liquid such as NaOH. If the mineralizer is solid, such as KOH, water DI is first added to the mixture of Zr, Ti, Pb and then the solid mineralizer is added. The ideal mineralizer concentration depends on the conditions of the hydrothermal process as known to those skilled in the art.

The concentration of mineralizer affects the size of PZT nanoparticles produced. For example, similar PZT nanoparticles formed using 5 M and 10 M from the KOH mineralizer have similar morphology, but 5 M from mineralizer results in smaller nanoparticles than those formed with 10 M from mineralizer if all other processing conditions are the same.

In certain embodiments, a stabilizer is added to the precursor to prevent gelation and / or precipitation of certain precursor components prior to the hydrothermal process. That is, stabilizers may be required to hold all necessary components of the precursor in solution prior to the hydrothermal process. For example, in one embodiment, acetylacetone ("AcAc") is added to the titanium source (e.g. titanium isopropoxide) to prevent gelation and precipitation prior to the reaction to form PZT. In another embodiment, propoxide is added to the titanium source.

The precursor solution is typically aqueous, however it will be appreciated that any other solvent capable of creating solution with the precursor solution components and facilitating the formation of PZT nanoparticles may also be used. Alternatives to water may comprise aqueous solution, mixture of water and organic solvent, or weak organic acid, for example ethylenediamine, CH 2 Cl 2, ammonium salt, acetic acid or another suitable alternative.

In one exemplary embodiment, the precursor solution comprises KOH as the mineralizing solution, titanium isopropoxide as the source of titanium, zirconium n-propoxide as the source of zirconium, lead acetate trihydrate as the source. lead, acetylacetone as a stabilizer, and water. Lead acetate trihydrate, zirconium n-propoxide and titanium isopropoxide are present in the precursor in a weight ratio of from about 1 to about 2 parts of lead acetate trihydrate, from about 0, 5 to about 1 part zirconium n-propoxide, and from about 0.8 to about 1.6 part titanium isopropoxide. The KOH mineralizing solution is from about 0.2 to about 15 M.

Heating Planning: PZT nanoparticles are formed by hydrothermal processing of the precursor solution. The hydrothermal process includes a heating schedule comprising a first-temperature heating ramp, a first-temperature hold and a room-temperature cooling ramp.

Heating planning is performed under pressure greater than 1 atm (atmosphere). Consequently, the precursor solution is contained within an apparatus configured for both heating and pressurizing. In certain embodiments, the pressure applied during heating planning is from about 1 atm to about 20 atm. In an exemplary embodiment, the precursor solution is contained within an autoclave and autogenous pressure develops in the autoclave during the course of heating planning. Alternatively, a constant pressure may be provided by a pump or other apparatus known to those skilled in the art.

In one embodiment, heating the precursor solution to produce PZT nanoparticles includes at least the sequential steps of: (i) heating the precursor solution at a first rate to a first temperature, wherein said first rate is between about 2 ° C. 1 ° C / min and about 30 ° C / min (degrees Celsius per minute), and wherein said first temperature is between about 120 Ό and about 350 IC; (ii) holding for a first retention time at the first temperature, wherein said first retention time is between about 5 minutes to about 300 minutes; and (iii) cooling at a second rate to provide a nanoparticle PZT solution comprising a plurality of suspended perovskite PZT nanoparticles having a smaller size between about 20 nm (nanometers) and about 1,000 nm, wherein said Second rate is between about 1'C / min and about 30C / min.

The heating ramp rate ("first rate") is used to raise the temperature of the precursor solution from about room temperature (TRT) to the maximum hydrothermal processing temperature (Tmax). The first rate is about 1 ‘C / min and about 30 C / min.

The processing temperature ("first temperature"; Tmax) is between about 120 C (Celsius) and about 350 C. In certain embodiments, the first temperature is 200 C or less. Although heating planning is described primarily herein as including a single first temperature, for which the solution is heated, it will be appreciated that the disclosed method considers variations in the first temperature that may arise from hydrothermal reaction or inaccuracies in the heating equipment. In addition, the heating step of the heating schedule may include second, third or more temperatures to which the heated precursor solution is subjected. The second, third or more temperatures may be higher or lower than the first temperature as required to produce the desired PZT nanoparticles.

[0088] The first rate is particularly important for controlling the size of the produced PZT nanoparticles. In this regard, as the temperature of the precursor solution increases from TRT to Tmax. there is an intermediate temperature, TnUc. in which PZT crystals begin to nuclear ("Nucleation Zone"). Optimal PZT crystal development occurs at Tmax, and any nucleated crystals at a temperature lower than Tmax are likely to grow larger with larger and / or more agglomerated aggregates than Tmax-nucleated PZT crystals.

A low ramp rate results in a longer amount of time than the precursor solution spent between Tnuc and Tmax. Therefore, a low ramp rate results in more nucleation of PZT crystals at temperatures below Tmax, resulting in inconsistent crystal size and PZT crystal structure. As used herein, the term "low ramp rate" refers to a ramp rate below 1 C / min.

Conversely, a relatively high ramp rate results in nucleation of homogeneous PZT crystals by passing the precursor solution rapidly through the temperature range between Tnuc and Tmax. As used herein, the term "high ramp rate" refers to a ramp rate of 10 ‘C / min or greater. In certain embodiments, the high ramp rate is a ramp rate of 20 C / min or higher.

As a result of the nucleation dynamics described above, the higher the ramp rate, the smaller the PZT particles generated. Although the heating ramp rate affects the size and number of PZT crystals, it does not affect the crystal structure. Similarly, the cooling rate does not affect the crystal structure.

The "retention" step of the heating schedule allows time for PZT crystals to form and grow. The retention step is between about 5 minutes and about 300 minutes at the first temperature. Typically, a longer retention time results in larger crystals. Retention time is preferably to allow the crystals to develop. If the retention time is too short, the final product may not have PZT composition.

Following the retention step, heating planning proceeds to a "cooling" step. The cooling rate reduces the temperature from the maximum processing temperature to room temperature by a "second rate". The cooling rate range is from about 1 ‘C / min to about 30‘ C / m in. The cooling rate impacts various aspects of PZT nanoparticles. The cooling rate partially determines the morphology and size of the formed PZT nanoparticles. A relatively high cooling rate, for example a cooling rate greater than 20 Ό per minute, results in PZT nanoparticles in the range 100 nm to 500 nm and a distinct cubic shape.

Additionally, a relatively high cooling rate results in PZT nanoparticles that are physically bonded, as opposed to chemically bonded. Physically bonded PZT nanoparticles are preferable to those that are chemically bonded because separation of physically bonded nanoparticles is performed more easily than separation of chemically bonded nanoparticles (for example, by mechanical stirring). Finally, a higher cooling rate minimizes the presence of the PbTi03 phase in the final product. This is desirable because PbTi03 is not only an impurity that must be removed to obtain pure PZT nanoparticles, but forming PbTi03 also reduces the yield of the PZT formation reaction by consuming lead and titanium in a form other than PZT.

In certain embodiments, the second rate is large enough that PZT particles are created which are non-Perovskite forms of PZT. In this regard, in certain embodiments, the method further comprises a step of treating the nanoparticulate PZT solution to eliminate non-perovskite forms of PZT. Such a treatment may include chemically assisted dissolution, wet corrosion, acid scrubbing, basic scrubbing and combinations thereof. Any method that selectively eliminates (eg dissolves) non-perovskite PZT can be used. For example, a dilute acetic acid wash can be used to eliminate the non-perovskite component PbT103 from the hydrothermal PZT synthesis.

Alternatively, instead of eliminating non-perovskite PZT particles, in certain embodiments, the method further includes a step of separating the perovskite PZT nanoparticles from non-perovskite PZT forms in the PZT nanoparticle solution. The final suspension is washed with DI water, dilute acid, or ethanol to remove non-perovskite forms.

In certain embodiments, the second rate is large enough that the nanoparticle PZT solution becomes super-turbid. Nucleation and crystal development are allowed when the solution is supersaturated and they stop when the concentration reaches equilibrium. For all temperatures, there is an equilibrium concentration in response. Therefore, when the second rate is low, the solution may be supersaturated several times and the crystal may have a greater opportunity to grow larger. For a second high rate, the initial concentration may be above equilibrium and the high concentration may promote occurrence of second nucleation along with crystal development. Nucleation rate is high when concentration is high, so both nucleation and development are rapid. Because of this, secondary nucleation and development most likely will not form stable crystals or create amorphous, which can be removed.

The route to form the smallest and highest quality PZT nanoparticles is achieved using the shortest possible processing time for hydrothermal processing, which includes using the highest heating ramp rate, the cooling ramp rate. higher and an "average" mineralizer concentration since the required processing time will be different if the mineralizer concentration is changed. For example, if 5 M mineralizer is used, the processing time may be as short as one (1) hour, but for 2 M mineralizer the required processing time is three (3) hours. If the mineralizer concentration is less than 0.4 Μ, PZT will not be formed regardless of the processing time.

After the cooling step, a solution of PZT nanoparticles is obtained. The PZT nanoparticle solution contains a plurality of PZT nanoparticles suspended in water. The PZT nanoparticle solution may be filtered or otherwise manipulated to isolate the PZT nanoparticles. Depending on the efficiency of the hydrothermal process, the solution may also contain PbTi03, PbZr03, PbO, Ti02, Zr02, KOH or other potential impurities. Washing the solution with acetic acid is a method for removing PbO. Excess lead samples may be washed with acetic acid.

As shown in Fig. 5, system 100 further comprises an ink deposition apparatus 142 (see also Fig. 6A) which deposits the PZT 104 nanoparticle ink onto a substrate 101 to form the piezoelectric sensor based on PZT. PZT nanoparticle ink 110. Ink deposition apparatus 142 and an ink deposition process 122 using ink deposition apparatus 142 do not require development of the PZT 166 crystals (see Figure 6B) on substrate 101. Because Since PZT 166 crystals have already been developed in PZT nanoparticles, PZT 104 nanoparticle ink does not require a high temperature sintering process as it is deposited during the ink deposition process 122. The ink deposition apparatus 142 preferably comprises a direct recording printing device 144 (see figure 10). Figure 10 is a block diagram illustration of ink deposition apparatus modalities and processes that can be used to fabricate the PZT 110 nanoparticle ink-based piezo sensor of the disclosure. As shown in Figure 10, direct engraving printing apparatus 144 may comprise an atomised jet deposition apparatus 146, an inkjet printing apparatus 147, an aerosol printing apparatus 190, a laser evaporating apparatus 192, a flexo printing device 194, a micro-spraying printing device 196, a flat cradle silk screen printing device 197, a rotary silk screen printing device 198, or another suitable screen printing device, a gravure printing press 199 or another suitable press printing press, or another suitable direct recording press 144.

PZT nanoparticle ink 104 may be deposited onto substrate 101 with ink deposition apparatus 142 by an ink deposition process 122 (see Figures 6A and 10). Ink deposition process 122 preferably comprises a direct embossing printing process 124 (see Figure 10). As shown in Fig. 10, direct embossing printing process 124 may comprise an atomized jet deposition process 126, an inkjet printing process 128, an aerosol printing process 180, a laser evaporation process Pulsed 182, a flexo printing process 184, a micro-spray printing process 186, a flat cradle silk screen printing process 187, a rotary silk screen printing process 188 or another suitable screen printing process, a gravure printing process 189 or other suitable press printing, or another suitable direct engraving printing process 124.

As shown in Fig. 5, the substrate 101 may have an uncurved or flat surface 136, a curved or non-flat surface 138, or a combination of an uncurved or flat surface 136 and a curved or non-flat surface 138. As shown in Figure 2, substrate 101 may have a first surface 103a and a second surface 103b. The substrate 101 preferably comprises a composite material, a metallic material, a combination of a composite material and a metallic material, or another suitable material. As shown in Fig. 2, substrate 101 may comprise a composite structure 102. Composite structure 102 may comprise composite materials such as polymeric composites, fiber reinforced composite materials, fiber reinforced polymers, carbon fiber reinforced plastics ( CFRP), glass reinforced plastics (GRP), thermoplastic compounds, thermosetting compounds, epoxy resin compounds, shape memory polymer compounds, ceramic matrix compounds, or another suitable composite material. As shown in Figure 3, substrate 101 may comprise a metal frame 132. The metal frame 132 may comprise metal materials such as aluminum, stainless steel, titanium, alloys thereof, or another suitable metal or metal alloy. The substrate 101 may also comprise another suitable material.

Fig. 6A is a schematic view illustration of one embodiment of an ink deposition process 122 and an ink deposition apparatus 142 for manufacturing the PZT 110 nanoparticle ink-based piezo sensor of revelation. An exemplary direct embossing printing process 124 and exemplary direct embossing printing apparatus 144 are shown in Fig. 6A, which shows the atomized jet deposition process 126 and the atomized jet deposition apparatus 146. As shown in the figure 6A, the nanoscale PZT ink nanoparticles 106 may be transferred via an inlet 148 into a mixing vessel 150 containing a solvent 152. The nanoscale PZT ink nanoparticles 106 are preferably mixed with solvent 152 at the same time. mixing vessel to form a PZT 154 nanoparticle ink suspension. The PZT 154 nanoparticle ink suspension can be atomized by an ultrasonic mechanism 158 to form atomized PZT ink nanoparticles 156. Atomized PZT ink nanoparticles 156 may then be transferred through a nozzle body 160 and directed via a nozzle tip 162 to substrate 1 01 for deposition and printing of the PZT 110 nanoparticle ink-based piezo sensor on substrate 101.

[00104] Figure 6B is an enlarged view of the PZT nanoparticle ink-based piezoelectric sensor 110 being deposited on the substrate 101. Figure 6B shows the atomized PZT ink nanoparticles 156 within the nozzle body 160 and nozzle 162 being deposited on substrate 101 to form the PZT 110 nanoparticle ink-based piezoelectric sensor. As shown in Figure 6B, the PZT 110 nanoparticle ink-based piezoelectric sensor or sensors they may be deposited on substrate 101 in a custom shape 164, such as letters, designs, logos, or insignia, or geometric shapes such as circles, squares, rectangles, triangles, or other geometric shapes, or another desired custom shape. The ink deposition process 122 and the ink deposition apparatus 142 do not require development of the PZT 166 crystals on the substrate 101. In addition, the deposited nanoscale PZT ink nanoparticles 106 contain a crystalline particle structure that does not require any further processing steps to develop the crystals. The PZT 110 nanoparticle ink-based piezoelectric sensor may be deposited on a surface of frame 30 with one or more layers of insulation, coating or ink between a frame body 30 and the PZT nanoparticle ink-based sensor PZT 110.

Figures 2 and 3 show embodiments of a deposited PZT nanoparticle ink-based piezo sensor sensor assembly. Figure 2 is an illustration of a cross-sectional view of one embodiment of a piezoelectric sensor based piezoelectric sensor assembly. deposited PZT nanoparticle ink assembly 116 which is deposited on a substrate 101 comprising a composite structure 102. The deposited PZT nanoparticle ink-based piezo sensor sensor 116 comprises the coupled PZT 110 nanoparticle ink-based piezo sensor to a power and communication conductive assembly 140 acting as a driver 141 (see figure 4). The power and communication conductive assembly 140 is preferably formed of a conductive ink 168 (see Figure 4) which may be deposited by the ink deposition apparatus 142 and by the ink deposition process 122 on the substrate 101. The power and communication conductive assembly 140 acting as a driver 141 (see Figure 4) may comprise a first conductive electrode 114, a second conductive electrode 118, a first conductive trace wire 112a and a second conductive trace wire 112b. The first conductive electrode 114, the second conductive electrode 118, the first conductive trace wire 112a and the second conductive trace wire 112b may be adjacent to the PZT nanoparticle ink-based sensor 110.

Figure 3 is an illustration of a cross-sectional view of another embodiment of a deposited PZT nanoparticle ink-based piezo sensor sensor assembly 130 that is deposited on a substrate 101 comprising a metal frame 132. deposited PZT nanoparticulate ink-based piezoelectric sensor 130 comprises the PZT 110 nanoparticle ink-based piezoelectric sensor coupled to a power and communication conductive assembly 140 acting as a trigger 141 (see Figure 4) . The power and communication conductive assembly 140 is preferably formed of a conductive ink 168 (see Figure 4) which may be deposited by the ink deposition apparatus 142 and by the ink deposition process 122 on the substrate 101. The power and communication conductive assembly 140 acting as the driver 141 may comprise the first conductive electrode 114, the second conductive electrode 118, the first conductive trace wire 112a and the second conductive trace wire 112b. The first conductive electrode 114, the second conductive electrode 118, the first conductive trace wire 112a, and the second conductive trace wire 112b may be adjacent to the PZT nanoparticle ink-based sensor 110. As shown in Figure 3, the deposited PZT nanoparticle ink based piezo sensor 130 additionally comprises an insulating layer 134 deposited between the substrate 101 comprising the metal frame 132 and the PZT nanoparticle ink based piezo sensor 110 coupled to the conductive assembly of energy and communication 140. The insulating layer 134 may comprise an insulating polymer coating, a dielectric material, a ceramic material, a polymer material, or another suitable insulation material.

Figure 4 is a perspective top view illustration of the deposited PZT nanoparticle ink-based piezoelectric sensor assembly 115 deposited on a composite structure 102. Figure 4 shows a plurality of the piezoelectric sensors at the PZT nanoparticle ink base 110 coupled to a plurality of power and communication conductive assemblies 140, all deposited on composite structure 102. Similarly, for a metal frame 132, the ink-based piezoelectric sensor assembly of deposited PZT nanoparticle 130 may have a plurality of PZT nanoparticle ink-based piezo sensors 110 coupled to a plurality of power and communication conductive assemblies 140, all deposited on metal frame 132.

The deposition of PZT 110 nanoparticle ink-based piezoelectric sensors onto substrate 101 or structure 30 (see Figure 7) enables in situ installation of PZT 110 nanoparticle ink-based piezoelectric sensors for such applications. as structural health monitoring. PZT 110 nanoparticle ink-based piezoelectric sensors can be a key enabler of high-density structural health monitoring systems 170. Figure 7 is an illustration of a block diagram of one of the embodiments of a PZT 110 monitoring system. structural health 170 using the development PZT 110 nanoparticle ink-based piezoelectric sensors. Two or more nanoparticle paint-based piezoelectric sensors 110 may be used to enable the structural health monitoring system 170 to monitor the structural health 172 of a structure 30, such as a composite structure 102 (see Figure 1A) or a metal frame 132 (see Figure 3), or other suitable structure, and provide structural health data 174. Structural health data 174 may comprise shutdowns, weak bonding, strain levels, moisture ingress, material change, cracks, voids, delamination, porosity, or other appropriate structural health data 174 or electromechanical properties or other irregularities that may adversely affect structure performance 30.

The structural health monitoring system 170 preferably comprises a deposited PZT nanoparticle ink-based piezo sensor sensor 115 (see also figures 2 and 3). The deposited PZT nanoparticle ink-based piezo sensor sensor 115 may comprise the deposited PZT nanoparticle ink-based piezo sensor sensor 116 (see Figure 2), if used with composite structure 102, and may comprise the deposited PZT nanoparticle ink-based piezo sensor sensor 130 (see Figure 3), if used with a metal frame 132. The structural health monitoring system 170 may additionally comprise a voltage power supply 176 which may be used to adjust the polarity of the PZT 110 nanoparticle ink-based piezoelectric sensor prior to use in the structural health monitoring system 170. As used herein, the term "polarity adjustment" means a process by which a strong field Electricity is applied through a material, usually at elevated temperatures, to orient or align dipoles or domains. Voltage power supply 176 may also drive some PZT nanoparticle ink-based piezo sensors 110 so that they become the drivers 141 sending interrogation signals to other piezoelectric sensors 110.

As shown in Figure 7, structural health monitoring system 170 additionally comprises an electrical power source 178 for supplying electrical power to the PZT 110 nanoparticle ink-based sensors. The electrical power source 178 it may comprise batteries, voltage, radio frequency identification (RFID), magnetic induction transmission, or another suitable source of electrical power. Power source 178 may be wireless. As shown in Fig. 7, system 170 may additionally comprise a digital data communications network 179 for retrieving and processing structural health data 174 from PZT nanoparticle ink-based piezo sensors 110. The communications network 179 digital data can be wireless. Digital data communications network 179 can retrieve data received from PZT nanoparticle ink-based piezoelectric sensors 110, such as with a receiver (not shown), and can process data received from PZT nanoparticle ink-based piezoelectric sensors PZT 110, as with a computer processor (not shown). Digital data communications network 179 may be wireless.

[00111] In one embodiment of the disclosure, a method 200 of making a piezoelectric lead zirconate nanoparticle (PZT) ink-based sensor 110 is provided. Figure 8 is an illustration of a flowchart of a method 200 embodiment of revelation. Method 200 comprises the step 202 of formulating a lead zirconate titanate (PZT) nanoparticle ink 104. The PZT 104 nanoparticle ink comprises the nanoscale PZT ink nanoparticles 106. As discussed above, the nanoparticle ink nanoparticles of PZT 104 preferably has a nanoscale PZT particle size in the range of about 20 nanometers to about 1 micron. PZT 104 nanoparticle ink may comprise a sol-gel adhesion promoter 108 (see Figure 5) to promote adherence of PZT 104 nanoparticle ink to substrate 101. PZT 104 nanoparticle ink is formulated by middle of the process as discussed in detail above.

Method 200 further comprises the step 204 of depositing the PZT 104 nanoparticle ink onto the substrate 101 by means of an ink deposition process 122 to form the PZT 110 nanoparticle ink-based piezo sensor. ink deposition process 122 preferably comprises a direct embossing printing process 124 (see figure 10). As shown in Figure 10, direct embossing printing process 124 may comprise an atomized jet deposition process 126, an inkjet printing process 128, an aerosol printing process 180, an evaporation process laser pulse 182, a flexography printing process 184, a micropulverization printing process 186, a flat cradle silk screen printing process 187, a rotary silk screen printing process 188 or another screen printing process a suitable gravure printing process 189 or other suitable press printing, or another suitable direct engraving printing process.

Substrate 101 preferably comprises a composite material, a metallic material, a combination of a composite material and a metallic material, or another suitable material. The substrate 101 preferably comprises a first surface 103a and a second surface 103b. The substrate 101 may have an uncurved or flat surface 136 (see Figure 5), a curved or non-flat surface 138 (see Figure 5), or a combination of an uncurled or flat surface 136 (see Figure 5) and a curved or non-flat surface 138 (see figure 5). The ink deposition process 122 does not require development of the PZT 166 crystals on the substrate 101. In addition, the deposited nanoscale PZT ink nanoparticles 106 contain a crystalline particle structure that does not require any further processing steps to develop. the crystals. The PZT 110 nanoparticle ink-based piezoelectric sensor can be deposited onto substrate 101 in a custom shape 164 (see Figure 6B).

The PZT 110 nanoparticle ink-based piezoelectric sensor can undergo a polarity adjustment process with a voltage power supply 176 (see Figure 7) before being used in the structural health monitoring system 170. to monitor the structural health 172 of a frame 30. The PZT 110 nanoparticle ink-based piezoelectric sensor can be coupled to a power and communication conductive assembly 140 formed of a conductive paint 168 deposited on the substrate 101 via of ink deposition process 122 prior to use in the structural health monitoring system 170. Two or more PZT 110 nanoparticle ink-based pi-ezoelectric sensors may be used to power the structural health monitoring system 170.

In another embodiment of the disclosure, a method 250 of manufacturing a piezoelectric lead zirconate nanoparticle (PZT) ink-based sensor 110 is provided. Figure 9 is an illustration of a flowchart of another embodiment of the 250 method of development. Method 250 comprises step 252 of formulating a lead zirconate titanate (PZT) nanoparticle paint 104 comprising the nanoscale PZT paint nanoparticles 106 which are precrystallized.

Method 250 further comprises the step 254 of suspending the PZT 104 nanoparticle ink in a sol-gel adhesion promoter 108. Method 250 further comprises the step 256 of depositing the PZT 104 nanoparticle ink on a substrate 101 by means of a direct etch printing process 124 to form a PZT nanoparticle ink-based piezo sensor 110. As shown in Figure 10, the direct etch printing process 124 may comprise a process of atomized jet deposition 126, an inkjet printing process 128, an aerosol printing process 180, a pulsed laser evaporation process 182, a flexography printing process 184, a micro-spray printing process 186 , a flat-cradle silk screen process 187, a rotary silk screen process 188 or another suitable screen printing process, a printing process 189 or another suitable press, or other suitable direct write printing process 124.

Substrate 101 preferably comprises a composite material, a metallic material, a combination of a composite material and a metallic material, or another suitable material. The substrate 101 preferably comprises a first surface 103a and a second surface 103b. The substrate 101 may have an uncurved or flat surface 136 (see Figure 5), a curved or non-flat surface 138 (see Figure 5), or a combination of an uncurled or flat surface 136 (see Figure 5) and a curved or non-flat surface 138 (see figure 5). The ink deposition process 122 does not require development of the PZT 166 crystals on the substrate 101. In addition, the deposited nanoscale PZT ink nanoparticles 106 contain a crystalline particle structure that does not require any further processing steps to develop. the crystals. The PZT 110 nanoparticle ink-based piezoelectric sensor can be deposited onto substrate 101 in a custom shape 164 (see Figure 6B).

The PZT 110 nanoparticle ink-based piezoelectric sensor can undergo a polarity adjustment process with a voltage power supply 176 before being used in the structural health monitoring system 170 to monitor structural health 172 of a frame 30. The PZT nanoparticle ink-based piezo sensor 110 may be coupled to a power and communication conductive assembly 140 formed of a conductive ink 168 deposited on the substrate 101 by the ink deposition process 122 before to be used in the structural health monitoring system 170. Two or more PZT 110 nanoparticle ink-based piezo sensors can be used to power the structural health monitoring system 170.

The structure 30 may comprise an aircraft, a spaceship, an aerospace vehicle, a space launch vehicle, a rocket, a satellite, a helicopter, a boat, a ship, a train, an automobile, a truck. , a bus, an architectural structure, a turbine blade, a medical device, electronic drive equipment, a consumer electronic device, vibrating equipment, passive and active dampers, or another suitable structure. System 100 and methods 200, 250 can be used in many industries including, for example, wind power generation (turbine blade health monitoring), aerospace applications, military applications, medical applications, electronic drive equipment, electronic products. or any application where structures or materials require a monitoring system.

[00120] System 100 and Method 200, 250 Modalities disclosed herein for manufacturing PZT 110 nanoparticle ink-based piezoelectric sensors provide PZT 110 nanoparticle ink-based piezoelectric sensors that can be used in a variety applications including ultrasonic damage detection for composite and metal structures, crack propagation detection sensors, pressure sensors, or another suitable sensor. For example, system 100 PZT 110 piezoelectric ink-based sensors and methods 200, 250 provide cradles for recording multi-component health monitoring on aircraft such as damage detection for surrounding door parts, military platforms such as such as military aircraft crack development detection, and space systems such as cryogen tank health monitoring. PZT 110 nanoparticle ink-based piezoelectric sensors can provide data that was not previously available that can influence new and efficient designs that can reduce costs.

Using the direct engraving printing process 124 and, for example, the atomized jet deposition process 126, together with formulated PZT nanoparticle ink 104, allows many PZT nanoparticle ink-based piezoelectric sensors 110 are deposited on a substrate 101 or structure 30 and at a reduced cost compared to the use of known piezoelectric sensors. System 100 and method 200, 250 embodiments disclosed herein provide the PZT 110 nanoparticle ink-based piezoelectric sensors that allow placement of PZT 110 nanoparticle ink-based piezoelectric sensors in numerous areas of a structure and in large quantities, which can be difficult with known piezoelectric sensors.

In addition, embodiments of the system 100 and methods 200, 250 disclosed herein for manufacturing the PZT 110 nanoparticle ink-based piezoelectric sensors provide the PZT 110 nanoparticle ink-based piezoelectric sensors that are advantageous in compared to known sensors because they do not require an adhesive to stick them to the frame, and this lessens the possibility that PZT 110 nanoparticle ink-based piezoelectric sensors may peel off the frame. System 100 and methods 200, 250 embodiments disclosed herein for making PZT 110 nanoparticle ink-based piezoelectric sensors provide the PZT 110 nanoparticle ink-based piezoelectric sensors that are enabled by the availability of the nanoparticle ink nanoparticles. Nanoscale PZT 106 having favorable piezoelectric properties and which are deposited on a substrate or structure in a desired configuration for use without the use of adhesive. Because PZT 110 nanoparticle ink-based piezoelectric sensors can be deposited on a non-adhesive substrate or structure between PZT 110 nanoparticle ink-based piezoelectric sensors and the substrate or structure, improved signal coupling for structure being interrogated can be reached.

Additionally, embodiments of system 100 and methods 200, 250 disclosed herein for making PZT 110 nanoparticle ink-based piezoelectric sensors provide PZT 110 nanoparticle ink-based piezoelectric sensors that do not require placement or manual installation on the substrate or structure and which may be deposited or printed on the substrate or structure, together with all required power and communication conductive assemblies, thereby reducing labor and installation costs as well as decreasing the complexity and weight of the structure. In addition, PZT 110 nanoparticle ink-based piezoelectric sensors can be manufactured from a number of direct engraving printing processes, including the atomized jet deposition process 126; may be fabricated from pre-crystallized nanoparticle-sized particles and may be more efficient than known sensors that have not been crystallized; do not require a high temperature sintering / crystallization process and thus reduce or eliminate possible damage to temperature sensitive substrates or structures; may be deposited on curved or non-flat substrates or structures; they do not have or have minimal physical geometry limitations and thus diminish the possibility of inadequate detection capabilities or inadequate drive responses.

Finally, embodiments of system 100 and methods 200, 250 disclosed herein for making PZT 110 nanoparticle ink-based piezoelectric sensors provide the PZT 110 nanoparticle ink-based piezoelectric sensors that can be used to predict deterioration or weaknesses of a structure prior to actual development of such deterioration or weaknesses, and thus may increase the reliability of the structure or parts of structural components, and may reduce overall fabrication and maintenance costs over the life of the structure. or parts of structural components; and have the ability to predict, monitor and diagnose the integrity, health and condition of a structure without having to disassemble or remove the structure or drill holes in the structure for insertion of any measuring tools.

Referring now to Figures 11A-14B, exemplary embodiments of an electrical conduction path system 300 with a direct embossing conductive material pattern 320 (see Figures 11A-11B) printed or deposited by the process of direct write print 124 (see figures 10, 17) are shown. Figure 17 is an illustration of a block diagram of one embodiment of a vehicle 26, such as an aircraft 26a, incorporating the electrical conduction path system 300 (see figures 11A-11B) of the disclosure.

Electrical conduction path system 300 (see figures 11A-14B) is configured to divert an electrical charge 302 (see figure 17). The electrical charge 302 (see Figure 17) may comprise, for example, one from a lightning strike 302a (see Figure 17), one from static (P-static) precipitation 302b (see Figure 17), or another type of electrical charge 302 (see figure 17). As used herein, "static (P-static) precipitation" means electric charge developed on a surface. As used herein, "lightning strike" means electrical discharge to a surface.

The electrical conduction path system 300 (see figures 11A-14B) is preferably configured to divert electrical charge 302 (see figure 17) to an existing lightning protection system 356 (see figure 17) and acts as a lightning protection system 356 (see figure 17).

Figure 11A is an illustration of a perspective sectional top view of one embodiment of the electrical conduction path system 300, such as in the form of the electrical conduction path system 300a, of the disclosure. Figure 11B is an illustration of a cross-sectional view of the electric driving path system 300, as in the form of the electric driving path system 300a of Figure 11A.

As shown in FIGS. 11A-11B, the electrical conduction path system 300, as in the form of the electrical conduction path system 300a, comprises a substrate 304 having a first printable surface 306a, a second surface 306b and an interior 305. Substrate 304 (see Figures 11A-11B) may comprise one or more of a fiberglass material 311 (see Figure 17), a composite material 312 (see Figure 17), a material 314 (see Figure 17), a combination 316 (see Figure 17) of composite material 312 (see Figure 17) and metallic material 314 (see Figure 17), and other suitable materials.

Substrate 304 (see Figures 11A-11B) additionally has one or more grounding points 318 (see Figures 11A-11B). Ground points 318 (see Figures 11A-11B) may be defined ground points that are part of a lightning protection system 356 (see Figure 17) that is pre-existing or predetermined, or that are part of another system. 56 (see Figure 1C), environmental system 60 (see Figure 1C) or other pre-existing or predetermined system in a vehicle 26 (see Figure 17), such as an aircraft 26a (see Figure 17).

Grounding points 318 (see Figures 11A-11B) may be in the form of one or more than one or more grounding elements 319a (see Figure 11A) with one or more grounding connectors 319b (see Figure 11A). Figure 11A); one or more fasteners 348 (see figure 15); and other suitable grounding points 318 (see figure 17). Preferably, ground point 318 (see Figures 11A-15, 17) is made of or contains conductive material 336 (see Figure 17), such as conductive metal material 336a (see Figure 17), and It is a conductor 364 (see Figure 17) that effectively conducts and lands the electrical charge 302 (see Figure 17).

As shown in FIGS. 11A-11B, the electric conduction path system 300, as in the form of the electric conduction path system 300a, further comprises a direct etched conductive material pattern 320 printed or deposited directly onto. first surface 306a by direct embossing printing process 124 (see figures 10, 17) using a direct embossing printing apparatus 144 (see figures 10, 17). In particular, as shown in Fig. 11A, the direct embossing conductive material pattern 320 is applied directly to an outer surface 309, such as an outer shape line 310 of the outer surface 309, and may be embossed over the outer surface 309 rather than being embedded within 305 of substrate 304. The direct-etching conductive material pattern 320 (see Figures 11A, 17) preferably extends over and along one or more grounding points 318 ( see figures 11 A, 17) to divert or direct electrical load 302 (see figure 17) or current to ground.

As shown in Figs. 11A-11B, the direct recording conductive material pattern 320 has a first side 324a and a second side 324b. The direct recording conductive material pattern 320 (see figures 11A-11B) may preferably comprise a grid pattern 320a (see figures 11A-11B). The grid pattern 320a (see figures 11A-11B) is preferably formed from a series of geometrically repeating patterned units 322 (see figures 16A-16B), such as comprising one or more of the quadrangular units 322a (see figure 16A), hexagonal shaped units 322b (see figure 16B), triangular shaped units 322c (see figure 16C), circular shaped units 322d (see figure 17) and other suitable geometric shaped units 322 (see figure 17), and are discussed in more detail below.

The direct recording conductive material pattern 320 (see Figures 11A-11B), as in the form of grid pattern 320a (see Figures 11A-11B), comprises one or more grid lines 326 (see Figure 11A-11B). Figure 11A). Direct embossing printing process 124 (see figures 10, 17) preferably creates grid lines 326 (see figure 11 A), i.e. electric paths 334 (discussed below), with smooth edges rather than sharp edges extending along the grid lines 326 (see figure 11A) to form one or more straightened portions 335 (see figure 17). One or more gridlines 326 (see Figure 11A) may be gradually smoothed to the edge of gridline 326 (see Figure 11A), which preferably reduces discontinuities of grid pattern 320a (see Figure 11). THE).

The grid pattern 320a (see Figures 11A-11B, 17) may be in the form of a quadrangular grid having a size or dimensions, for example, of 5.08 centimeters (2) inches. ) wide by 2 inches (5.08 centimeters) long. However, grid pattern 320a (see figures 11A-11B) may have other suitable dimensions and may vary depending on the size and dimensions of substrate 304 (see figures 11 A, 17) or surface 28 (see figure 17 ), on which grid pattern 320a (see figures 11A-11B) is being printed or deposited.

Each grid line 326 (see Figure 11A), that is, the electrical path 334 (discussed below), preferably has a width 327a (see Figure 17) of about 2.54 millimeters (0, 1 inch) to about 7.62 millimeters (0.3 inch). However, another suitable width 327a (see figure 17) may be used. Each grid line 326 (see Figure 11A), that is, electrical path 334 (discussed below), preferably has a height 327b (see Figure 17) that is compatible and does not interfere with any aerodynamic or other conditions. surface conditions according to which the first surface 306a (see Figure 11A) of substrate 304 (see Figure 11A), or surface 28 (see Figure 17) of structure 30 (see Figure 17), opera.

The width 327a (see figure 17) and height 327b (see figure 17) may vary depending on substrate 304 (see figures 11 A, 17) or structure 30 (see figure 17) in the which direct etch conductive material pattern 320 (see figures 11A-11B), such as in the form of grid pattern 320a (see figures 11A-11B), is being printed or deposited. In addition, width 327a (see Figure 17) and height 327b (see Figure 17) may vary depending on the conductivity requirements 366 (see Figure 17) of the first surface 306a (see Figure 11 A) of the substrate. 304 (see Figure 11A), or surface 28 (see Figure 17) of structure 30 (see Figure 17), and the amount of flexibility 368 (see Figure 17) of first surface 306a (see Figure 11 A) of substrate 304 (see figure 11 A), or surface 28 (see figure 17) of structure 30 (see figure 17), that is, if a flexible surface 307 (see figure 17) is present.

Direct recording conductive material pattern 320 (see Figures 11A-11B), as in the form of grid pattern 320a (see Figures 11A-11B), is preferably made of conductive material 336 (see Figure 11A-11B). figure 17). Conductive material 336 (see Figure 17) may comprise a conductive metal material 336a (see Figure 17), such as copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof, or another metallic material. suitable conductive 336a. Conductive material 336 (see Figure 17) may further comprise a conductive paint 168 (see Figure 17) comprising a lead zirconate titanate (PZT) nanoparticle paint 104 (see Figure 17). Conductive material 336 (see Figure 17), as well as the shape, width 327a (see Figure 17), and height 327b (see Figure 17) of the direct etch conductive pattern 320 (see Figures 11A -11B), as in the form of grid pattern 320a (see Figures 11A-11B), can be varied to maximize conductivity 366 (see Figure 17) or flexibility 368 (see Figure 17).

The direct embossing conductive material standard 320 (see Figures 11A-11B) is printed or deposited by the direct embossing printing process 124 (see Figures 10, 17). Direct embossing printing process 124 (see Figures 10, 17) may comprise one of an atomized jet deposition process 126 (see Figure 10), an inkjet printing process 128 (see Figure 10) , an aerosol printing process 180 (see Figure 10), a pulsed laser evaporation process 182 (see Figure 10), a flexographic printing process 184 (see Figure 10), a micropulverization printing process 186 (see Figure 10), a flatbed silk screen printing process 187 (see Figure 10), a rotary silk screen printing process 188 (see Figure 10), an engraving printing process 189 ( see figure 10), a plasma spray process 352 (see figure 17), or another suitable direct engraving printing process 124 (see figures 10, 17).

With plasma spraying process 352 (see Figure 17), conductive material 336 (see Figure 17) can be deposited as a powder, liquid, suspension or wire, and is fed into a jet. of plasma emanating from a plasma torch. In the plasma jet, conductive material 336 (see figure 17) is driven toward substrate 304 (see figure 11 A). There the molten droplets level, rapidly solidify and form a deposit.

The direct recording printing process 124 (see figures 10, 17) is preferably carried out or performed using the direct recording printing device 144 (see figures 10, 17). Direct embossing printing apparatus 144 (see Figures 10, 17) may comprise one of an atomized jet deposition apparatus 146 (see Figure 10), an inkjet printing apparatus 147 (see Figure 10), an aerosol printing apparatus 190 (see Figure 10), a pulsed laser evaporating apparatus 192 (see Figure 10), an flexographic printing apparatus 194 (see Figure 10), a printing apparatus microporverization 196 (see Figure 10), a flat cradle silk screen printing machine 197 (see Figure 10), a rotary silk screen printing process 198 (see Figure 10), a gravure printing process 199 (see figure 10), a plasma spray apparatus 354 (see figure 17), or another suitable direct recording printing device 144 (see figures 10, 17).

Figures 11A-11B show one or more locations 328 on the first side 324a where the direct recording conductive material pattern 320 forms one or more electrical paths 334 interconnected with one or more ground points 318. The one or more electrical paths 334 (see figures 11A-11B) interconnected with one or more grounding points 318 (see figures 11A-11B) divert electric charge 302 (see figure 17) from first surface 306a (see figures 11A- 11B), or from outer surface 309 (see Figure 11A) to one or more grounding points 318 (see Figures 11A-11B). The one or more electrical paths 334 (see figures 11A-11B) form the interconnections 338 (see figure 17) with one or more ground points 318 (see figures 11A-11B) to divert or direct electrical charge 302. (see figure 17) for grounding. Preferably, electrical path 334 (see Figures 11A-11B) is a good conductor 364 (see Figure 17) that offers very little or no resistance to the flow of electrical charge 302 (see Figure 17).

[00143] Figure 12A is an illustration of a perspective sectional top view of another embodiment of the electrical conduction path system 300, such as in the form of the development electric conduction path system 300b, which includes a layer. Primer 330. Figure 12B is an illustration of a cross-sectional view of the electric conduction path system 300, such as in the form of the electric conduction path system 300b of Figure 12A.

As shown in FIGS. 12A-12B, the electric conduction path system 300, as in the form of the electric conduction path system 300b, comprises substrate 304 having the first print surface 306a and the second surface. 306b, and having one or more grounding points 318.

In this embodiment shown in FIGS. 12A-12B, substrate 304 has primer layer 330 applied over first surface 306a of substrate 304 to form a prepared substrate 304a having a prepared surface 308. Primer layer 330 ( see figures 12A-12B) comprises a first side 332a (see figures 12A-12B) and a second side 332b (see figures 12A-12B). As shown in figures 12A-12B, the second side 332b of primer layer 330 is adjacent to the first side 306a of substrate 304.

Primer layer 330 (see Figures 12A-12B) may comprise an epoxy primer such as a water-reducible epoxy primer, a solvent-based epoxy primer, or another suitable epoxy primer, a urethane primer or other suitable primer.

Substrate 304 (see figures 12A-12B) may also be subjected to, in addition to the application of primer layer 330 (see figures 12A-12B), or alternatively to the application of primer layer 330 (see figures 12A -12B), a preparation process for use 333 (see Figure 17), or surface preparation process, for priming or priming the first surface 306a of substrate 304 (see Figures 12A-12B), or for priming or preparing an outer surface 309 (see figure 11A) of a frame 30 (see figure 17) to obtain prepared substrate 304a (see figures 12A-12B). For example, the preparation process for use 333 (see figure 17), or surface preparation process, for priming or preparing first surface 306a (see figures 12A-12B), or for preparing or preparing outer surface 309 (see figure 11A) of frame 30 (see figure 17), such as an aircraft frame 350 (see figure 17), may comprise cleaning with a cleaning agent or solvent, sanding or abrasion, smoothing, polishing, notching, or another preparation process for use 333 (see figure 17) or suitable surface preparation process.

As shown in figures 12A-12B, the electric conduction path system 300, as in the form of the electric conduction path system 300b, further comprises the direct etching conductive material pattern 320 printed directly on the prepared surface. 308 by direct embossing printing process 124 (see figures 10, 17) using direct embossing printing apparatus 144 (see figures 10, 17).

The direct recording conductive material pattern 320 (see Figures 12A-12B), as in the form of grid pattern 320a (see Figures 12A-12B), comprises one or more grid lines 326 (see Figure 12A-12B). Figure 12A). As shown in FIGS. 12A-12B, the direct recording conductive material pattern 320 has first side 324a and second side 324b. First side 332a (see figures 12A-12B) of primer layer 330 (see figures 12A-12B) is adjacent to second side 324b (see figures 12A-12B) of direct etch conductive material pattern 320 (see Figures 12A-12B).

Figures 12A-12B show one or more locations 328 on the first side 324a where the direct recording conductive material pattern 320 forms one or more electrical paths 334 interconnected with one or more grounding points 318. The one or more electrical paths 334 (see figures 12A-12B) interconnected with one or more grounding points 318 (see figures 12A-12B) divert electric charge 302 (see figure 17) from first surface 306a (see figures 12A- 12B) or prepared surface 308 (see figures 12A-12B) to one or more grounding points 318 (see figures 12A-12B).

Figure 13A is an illustration of a perspective sectional top view also of another embodiment of the electrical conduction path system 300, such as in the form of the electrical conduction path system 300c of the disclosure, which includes a primer layer 330 and a conductive coating 340. Figure 13B is an illustration of a cross-sectional view of the electric conduction path system 300, as in the form of the electric conduction path system 300c of Figure 13A.

As shown in FIGS. 13A-13B, in this embodiment, the electric conduction path system 300, as in the form of the electric conduction path system 300c, further comprises conductive coating 340 applied over the conductive material pattern. direct embossing 320. Conductive sheath 340 (see figures 13A-13B) comprises a first side 342a (see figures 13A-13B) and a second side 342a (see figures 13A-13B). As shown in FIGS. 13A-13B, the second side 342b of conductive liner 340 is adjacent to the first side 324a of direct etch conductive material 320.

In one embodiment, the conductive coating 340 (see Figures 13A-13B) may be in the form of a conductive metal paint 340a (see Figures 13A-13B, 17) made of or containing a conductive metallic material. 336a (see Figure 17) comprising one or more of copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof and other suitable conductive metal materials 336a (see Figure 17). In another embodiment, conductive sheath 340 (see Figures 13A-13B) may be in the form of a conductive sealer 340b (see Figure 17) made from or containing a conductive metallic material 336a (see Figure 17) comprising one or more of copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof and other suitable conductive metal materials 336a (see Figure 17). Conductive sheath 340 (see Figures 13A-13B) provides full surface protection to dissipate or spread electrical charge 302 (see Figure 17), energy 362 (see Figure 17) from a lightning strike 302a ( see figure 17), or energy 362 (see figure 17) from static (P-static) 302b precipitation (see figure 17). Use of the metal-loaded conductive coating 340 (see Figures 13A-13B) applied or deposited onto the direct etch conductive material pattern 320 (see Figures 13A, 17) preferably increases the conductivity 366 (see Figure 17) of the electric conduction path system 300 and provides a continuous conductive surface over direct recording conductive material standard 320 (see figures 13A, 17) for increased lightning protection.

As shown in FIGS. 13A-13B, the electric conduction path system 300, as in the form of the electric conduction path system 300c, comprises substrate 304 having the first printable surface 306a and the second surface. 306b, and having one or more grounding points 318.

In this embodiment shown in Figures 13A-13B, substrate 304 has primer layer 330 applied on first surface 306a of substrate 304 to form prepared substrate 304a having prepared surface 308. Primer layer 330 (see Figures 13A-13B) comprises first side 332a (see Figures 13A-13B) and second side 332b (see Figures 13A-13B). As shown in figures 13A-13B, the second side 332b of primer layer 330 is adjacent to the first side 306a of substrate 304.

As shown in figures 13A-13B, the electric conduction path system 300, as in the form of the electric conduction path system 300c, further comprises the direct etching conductive material pattern 320 printed directly on the prepared surface. 308 by direct embossing printing process 124 (see figures 10, 17) using direct embossing printing apparatus 144 (see figures 10, 17).

The direct recording conductive material pattern 320 (see Figures 13A-13B), as in the form of grid pattern 320a (see Figures 13A-13B), comprises one or more grid lines 326 (see Figure 13A-13B). Figure 13A). As shown in FIGS. 13A-13B, the direct recording conductive material pattern 320 has first side 324a and second side 324b. First side 332a (see figures 13A-13B) of primer layer 330 (see figures 13A-13B) is adjacent to second side 324b (see figures 13A-13B) of direct etch conductive pattern 320 (see 13A-13B).

Figures 13A-13B show one or more locations 328 on the first side 324a where the direct recording conductive material pattern 320 forms one or more electrical paths 334 interconnected with one or more ground points 318. The one or more electrical paths 334 (see figures 13A-13B) interconnected with one or more grounding points 318 (see figures 13A-13B) divert the electrical charge 302 (see figure 17) from the first surface 306a (see figures 13A- 13B) or prepared surface 308 (see figures 13A-13B) to one or more grounding points 318 (see figures 13A-13B).

Figure 14A is an illustration of a perspective sectional top view also of another embodiment of the electrical conduction path system 300, such as in the form of the electrical conduction path system 300d, which includes a primer layer 330, a conductive coating 340 and an upper cover layer 344. Figure 14B is an illustration of a cross-sectional view of the electric conduction path system 300, such as in the form of the electric conduction path system 300d, of figure 14A.

As shown in FIGS. 14A-14B, in this embodiment, the electric conduction path system 300, as in the form of the electric conduction path system 300d, further comprises the upper cover layer 344 applied over the conductive coating. 340. Top cover layer 344 (see figures 14A-14B) comprises a first side 346a (see figures 14A-14B) and a second side 346b (see figures 14A-14B). As shown in FIGS. 14A-14B, the second side 346b of the upper cover layer 344 is adjacent to the first side 342a of the conductive sheath 340.

Upper cover layer 344 (see Figures 14A-14B) may function as a protective coating over all or substantially all of the conductive coating 340 (see Figures 14A-14B), or may be applied for visual purposes. or of aesthetic appearance. Upper cover layer 344 (see Figures 14A-14B) may comprise a polyurethane paint or coating, a urethane paint or coating, an acrylic paint or coating, an adhesive coating, a combination thereof, or another coating layer. adequate top cover 344 (see figure 17). Preferably, the topsheet 344 (see Figures 14A-14B) is durable, abrasion and chemical resistant, heat resistant and visually appealing.

As shown in FIGS. 14A-14B, the electric conduction path system 300, as in the form of the electric conduction path system 300d, further comprises conductive coating 340 applied over the direct etching conductive material standard. 320. Conductive sheath 340 (see figures 14A-14B) comprises first side 342a (see figures 14A-14B) and second side 342a (see figures 14A-14B). As shown in FIGS. 14A-14B, the second side 342a of conductive liner 340 is adjacent to the first side 324a of direct etch conductive material 320.

As shown in FIGS. 14A-14B, the electric conduction path system 300, as in the form of the electric conduction path system 300d, comprises substrate 304 having the first print surface 306a and the second surface. 306b, and having one or more grounding points 318.

In this embodiment shown in FIGS. 14A-14B, substrate 304 has primer layer 330 applied to first surface 306a of substrate 304 to form prepared substrate 304a having prepared surface 308. Primer layer 330 (see above). Figures 14A-14B) comprises first side 332a (see Figures 14A-14B) and second side 332b (see Figures 14A-14B). As shown in FIGS. 14A-14B, the second side 332b of primer layer 330 is adjacent to the first side 306a of substrate 304.

As shown in figures 14A-14B, the electric conduction path system 300, as in the form of the electric conduction path system 300d, further comprises the direct etching conductive material pattern 320 printed directly on the prepared surface. 308 by direct embossing printing process 124 (see figures 10, 17) using direct embossing printing apparatus 144 (see figures 10, 17).

The direct recording conductive material pattern 320 (see Figures 14A-14B), as in the form of grid pattern 320a (see Figures 14A-14B), comprises one or more grid lines 326 (see Figure 14A-14B). Figure 14A). As shown in FIGS. 14A-14B, the direct recording conductive material pattern 320 has first side 324a and second side 324b. First side 332a (see figures 14A-14B) of primer layer 330 (see figures 14A-14B) is adjacent to second side 324b (see figures 14A-14B) of direct etch conductive pattern 320 (see 14A-14B).

Figures 14A-14B show one or more locations 328 on the first side 324a where the direct recording conductive material pattern 320 forms one or more electrical paths 334 interconnected with one or more grounding points 318. The one or more electrical paths 334 (see figures 14A-14B) interconnected with one or more grounding points 318 (see figures 14A-14B) divert electric charge 302 (see figure 17) from the first surface 306a (see figures 14A- 14B) or prepared surface 308 (see figures 14A-14B) to one or more grounding points 318 (see figures 14A-14B).

Fig. 15 is an illustration of a cross-sectional view of one embodiment of the electric driving path system 300 having grounding points 318 in the form of fasteners 348. As shown in Fig. 15, one or more grounding points 318 in the form of fasteners 348, such as screws 348a, are used to secure substrate 304 to frame 30, such as an aircraft frame 350, for example, a panel frame 350b (see figure 17), a beam, a rib, stringer, or other suitable aircraft structure 350. Fasteners 348 (see Figure 15) may be inserted through a surface 28 (see Figure 15), such as a flight control surface 350a (see Figure 17) of substrate 304 for attachment to frame 30 (see Figure 15).

As shown in Figure 15, the electric conduction path system 300 is integrated with the aircraft structure 350, and the direct recording conductive material pattern 320, such as grid pattern 320a, is applied directly and if it extends over the fasteners 348 and is sealed with a conductive liner 340, such as in the form of a conductive sealer 340b. An optional upper cover layer 344 (see Figure 15) may be applied over conductive coating 340 (see Figure 15). An optional primer layer 330 (see Figure 15) may be applied to substrate 304 (see Figure 15).

As shown in Figure 15, substrate 304 has first surface 306a and second surface 306b. Frame 30 (see Figure 15), as in the form of aircraft frame 350 (see Figure 15), comprises a first side 351a (see Figure 15) and a second side 351b (see Figure 15). As shown in Figure 15, first side 351a of structure 30 is adjacent to second surface 306b of substrate 304.

As further shown in Figure 15, optional primer layer 330 has first side 332a and second side 332b, conductive sheath 340 has first side 342a and second side 342b, and optional top cover layer 344 has first side 346a and second side 346b. Figure 15 shows the locations 328 of the electrical paths 334 to the grounding points 318, as in the form of the fasteners 348.

Figure 16A is a top view illustration of one embodiment of a direct-recording conductive material pattern 320, such as in the form of grid pattern 320a, which is used in a conduction path system embodiment. 300 (see Figures 11A-14B, 17) of the disclosure. Figure 16A shows the first side 324a of grid pattern 320a comprising geometrically patterned repeating units 322, such as quadrangular units 322a, constituted of grid lines 326. As shown further in figure 16A, grid pattern 320a includes one or more locations 328 for electrical paths 334 (see figures 11A-11B) for grounding points 318 (see figures 11A-14B).

[00173] Figure 16B is a top view illustration of another embodiment of a direct recording conductive material pattern 320, such as in the form of grid pattern 320a, which is used in one embodiment of the path system. electrical conduction 300 (see figures 11A-14B, 17) of the disclosure. Figure 16B shows the first side 324a of grid pattern 320a comprising geometrically patterned repeating units 322, such as hexagonal shape units 322b, constituted of grid lines 326. As further shown in figure 16B, grid pattern 320a includes one or more locations 328 for electrical paths 334 (see figures 11A-11B) for grounding points 318 (see figures 11A-14B).

Figure 16C is a top view illustration also of another embodiment of a direct recording conductive material pattern that is used in one embodiment of the electrical conduction path system 300 (see Figures 11A-14B, 17). ) of revelation. Figure 16C shows the first side 324a of grid pattern 320a comprising geometrically patterned repeating units 322, such as triangular shaped units 322c, constituted of grid lines 326. As shown further in figure 16C, grid pattern 320a includes one or more locations 328 for electrical paths 334 (see figures 11A-11B) for grounding points 318 (see figures 11A-14B).

Figure 17 is an illustration of a block diagram of one embodiment of a vehicle 26, such as an aircraft 26a, with an electric conduction pathway system 300 of the disclosure. As shown in Fig. 17, vehicle 26, such as aircraft 26a, comprises a structure 30, such as an aircraft structure 350, having electric driving path system 300. Structure 30 (see Figure 17) has a surface 28 (see figure 17), such as a flight control surface 350a (see figure 17). The aircraft structure 350 (see figure 17) may comprise a panel structure 350b (see figure 17), a beam, a rib, a stringer, or other suitable aircraft structure 350 (see figure 17).

As shown in Figure 17, the electrical conduction path system 300 comprises a substrate 304 with one or more ground points 318. The substrate 304 (see Figure 17) may comprise one or more of a fiber material. glass 311 (see Figure 17), a composite material 312 (see Figure 17), a metallic material 314 (see Figure 17), a combination 316 (see Figure 17) of composite material 312 (see Figure 17 ) with metallic material 314 (see Figure 17), and other suitable materials.

One or more ground points 318 (see Figure 17) may be defined ground points that are part of a lightning protection system 356 (see Figure 17) that is pre-existing or predetermined, or which are part of from another electrical system 56 (see Figure 1C), environmental system 60 (see Figure 1C) or from another pre-existing or predetermined system on vehicle 26 (see Figure 17), such as aircraft 26a (see Figure 17) .

Grounding points 318 (see Figure 17) may be in the form of one or more than one or more grounding elements 319a (see Figure 11A) with one or more grounding connectors 319b (see Figure 11). THE); one or more fasteners 348 (see figure 17); and other suitable grounding points 318 (see figure 17). Preferably, grounding point 318 (see figure 17) is made of or contains conductive material 336 (see figure 17), such as conductive metal material 336a (see figure 17), and is a conductor 364 (see figure 17) that effectively conducts and lands electrical charge 302 (see figure 17).

Substrate 304 (see Figure 17) may comprise a prepared substrate 304a (see Figure 17) having a prepared surface 308 (see Figure 17) if a primer layer 330 (see Figure 17) applied to substrate 304 (see Figure 17), or if substrate 304 (see Figure 17) undergoes a preparation process for use 333 (see Figure 17).

As shown in Fig. 17, the electrical conduction path system 300 further comprises a direct etch conductive pattern 320 printed or deposited directly on the first surface 306a (see Fig. 11A) of substrate 304, or on surface 28 (see figure 17) of frame 30 (see figure 17) by direct embossing printing process 124 (discussed in detail above) using direct embossing printing apparatus 144 (discussed in detail above) ), for example, a plasma spray process 352 using a plasma spray apparatus 354. In particular, the direct etch conductive material pattern 320 (see Figure 17) can be applied directly to an external surface 309 (see Figure 17), such as an outer shape line 310 (see Figure 17) of the outer surface 309 (see Figure 17), and may be deposited or embossed on the outer surface. 309 (see Figure 17), rather than being embedded within 305 (see Figure 11A) of substrate 304 (see Figure 17).

As shown in Figure 17, the direct recording conductive material pattern 320 preferably comprises a grid pattern 320a having one or more grid lines 326 with a width 327a and a height 327b. The direct embossing printing process 124 (see figure 17) preferably creates grid lines 326 (see figure 17) with smooth edges rather than sharp edges, which extend along grid lines 326 (see figure 17). Figure 17) to form one or more straightened parts 335 (see Figure 17). As discussed above, the width 327a (see Figure 17) and height 327b (see Figure 17) of grid lines 326 (see Figure 17) may be varied depending on conductivity requirements 366 (see Figure 17) first surface 306a (see Figure 11A) of substrate 304 (see Figure 17), or surface 28 (see Figure 17) of structure 30 (see Figure 17), and if a flexible surface 307 (see Figure 17) is present.

The grid pattern 320a (see Figure 17) is preferably formed from a series of geometrically shaped recurrent units 322 (see Figure 17), as comprising one or more of the quadrangular units 322a (see Figure 17). Figure 17), hexagonal shaped units 322b (see Figure 17), triangular shaped units 322c (see Figure 17), circular shaped units 322d (see Figure 17) and other suitable geometric shaped units 322 (see Figure 17). Figure 17).

The direct-embossing conductive material pattern 320 (see figure 17), as in the form of grid pattern 320a (see figure 17), is preferably made of a conductive material 336 (see figure 17), as discussed in detail above. Conductive material 336 (see Figure 17) may comprise a conductive paint 168 (see Figure 17) comprising a lead zirconate titanate (PZT) nanoparticle paint 104 (see Figure 17). Conductive material 336 (see Figure 17) may be varied to maximize conductivity 366 (see Figure 17) or flexibility 368 (see Figure 17).

The direct recording conductive material pattern 320 (see Figure 17) forms one or more electrical paths 334 (see Figure 17) interconnected with one or more ground points 318 (see Figure 17). Direct recording conductive material pattern 320 (see Figure 17) has one or more locations 328 (see Figure 17), where one or more interconnections 338 (see Figure 17) are formed between one or more electrical paths 334 (see figure 17) and one or more grounding points 318 (see figure 17).

The one or more electrical paths 334 (see Figure 17) interconnected with one or more ground points 318 (see Figure 17) preferably divert an electrical charge 302 (see Figure 17) from a lightning strike. 302a (see figure 17) or from static (P-static) precipitation 302b (see figure 17) on outer surface 309 (see figure 17) of structure 30 (see figure 17), such as aircraft structure 350 (see figure 17) to one or more grounding points 318 (see figure 17). The one or more electrical paths 334 (see Figure 17) of the electrical conduction path system 300 (see Figure 17) may function as a lightning protection path 358 (see Figure 17), and preferably provide protection against lightning strikes. electromagnetic effects 360 (see figure 17) because of lightning strikes 302a (see figure 17).

The electrical conduction path system 300 preferably disperses and dissipates electrical charge 302, such as P-static 302b (see figure 17), thereby mitigating development of P-static 302b (see figure 17) in outer surface 309 (see Figure 17), or in a localized area, on vehicle 26 (see Figure 17), such as aircraft 26a (see Figure 17). This dispersion and dissipation reduces the possibility of electrical discharge 370 (see figure 17), which may be a source of electrical noise for various communication systems incorporated into aircraft 26a (see figure 17) during flight. This dispersion and dissipation also reduces the possibility of injury to persons if a person contacts external surface 309 (see figure 17), such as a panel structure 350b (see figure 17), or liner of aircraft 26a (see Figure 17), after aircraft 26a (see Figure 17) lands, but before aircraft 26a (see Figure 17) is electrically grounded.

As shown in Figure 17, the electrical conduction path system 300 may additionally comprise a conductive coating 340 applied over the direct etch conductive material pattern 320. Conductive coating 340 (see Figure 17) preferably has properties 343 (see Figure 17), and may comprise one or more of a conductive metal paint 340a (see Figure 17), a conductive sealer 340b (see Figure 17) and other suitable conductive coatings 340 (see Figure 17 ).

As shown in Figure 17, the electrical conduction path system 300 may additionally comprise an upper cover layer 344 applied to the conductive coating 340. As discussed above, the upper cover layer 344 (see Figure 17 ) may function as a protective coating over all or substantially all of the conductive coating 340 (see Figure 17) or may be applied for visual or aesthetic appearance purposes.

In another embodiment there is provided a method 400 (see Figure 18) of fabricating an electrical conduction path system 300 (see Figures 11A-15) to divert an electrical charge 302 (see Figure 17) in a surface 28 (see figures 15, 17) of a frame 30 (see figures 15, 17). Figure 18 is an illustration of a gram flow of one embodiment of method 400.

As shown in figure 18, method (400) comprises step 402 of providing structure 30 (see figures 15, 17) having surface 28 (see figures 15, 17) for receiving print and having a or more ground points 318 (see figures 15, 17). Frame 30 (see Figures 15, 17) may include substrate 304 (see Figure 11A) having first surface 306a (see Figure 11A), or prepared substrate 304a (see Figure 12A) having surface 308 (see Figure 12A), secured to frame 30 (see Figures 15, 17), as is aircraft frame 350 (see Figure 17). Surface 28 (see Figures 15, 17) may comprise a flight control surface 350a (see Figure 17) and preferably is an outer surface 309 (see Figure 17), as with an externally shaped line. 310 (see figure 17).

As shown in figure 18, method 400 may further comprise step 404 of optionally applying a primer layer 330 (see figures 12A-12B, 17) on surface 28 (see figures 15, 17 ) of frame 30 (see figures 15, 17). As discussed above, primer layer 330 (see Figures 12A-12B) may comprise an epoxy primer, such as a water reducible epoxy primer, a solvent based epoxy primer, or another epoxy primer. suitable, a urethane primer, or another suitable primer.

Substrate 304 (see Figures 12A-12B) may also be subjected, in addition to the application of primer layer 330 (see Figures 12A-12B), or alternatively to application of primer layer 330 (see Figures 12A -12B), a preparation process for use 333 (see Figure 17), or surface preparation process for priming or preparing the first surface 306a of substrate 304 (see Figures 12A-12B), or surface 28 (see figure 17) of structure 30 (see figure 17) to obtain prepared substrate 304a (see figures 12A-12B). For example, the preparation process for use 333 (see figure 17) or surface preparation process for priming or preparing first surface 306a (see figures 12A-12B), or for preparing or preparing surface 28 (see Figure 17), such as the outer surface 309 (see Figures 11A, 17) of the structure 30 (see Figure 17), such as an aircraft structure 350 (see Figure 17), may comprise cleaning with a cleaning agent. cleaning or solvent, sanding or abrasion, smoothing, polishing, notching, or any other preparation process for use or suitable surface preparation process.

As shown in Figure 18, method 400 further comprises step 406 of printing, by means of a direct embossing printing process 124 (see Figure 17), a direct embossing conductive material pattern 320 (see figures 15, 17) on surface 28 (see figures 15, 17) of structure 30 (see figures 15, 17) to form one or more electrical paths 334 (see figures 15, 17). Printing step 406 comprises printing the direct etch conductive material pattern 320 (see figures 15, 17) comprising a grid pattern 320a (see figures 15, 17) made from a conductive material 336 (see figure 17) comprising copper, aluminum, titanium, nickel, bronze, gold, silver, or an alloy thereof, or a lead zirconate titanate (PZT) nanoparticle paint 104 (see Figure 17), or other suitable conductive material 336 ( see figure 17).

Printing step 406 (see Figure 18) further comprises printing by direct embossing printing process 124 (see Figures 10, 17) comprising one of an atomized jet deposition process 126 (see Figure 10), an inkjet printing process 128 (see Figure 10), an aerosol printing process 180 (see Figure 10), a pulsed laser evaporation process 182 (see Figure 10), an flexographic printing 184 (see Figure 10), a micropulverization printing process 186 (see Figure 10), a flat cradle silk screen printing process 187 (see Figure 10), a silk printing process rotary screen 188 (see Figure 10), a gravure printing process 189 (see Figure 10), and a plasma spray process 352 (see Figure 17).

As shown in Fig. 18, method 400 further comprises step 408 of interconnecting one or more electrical paths 334 (see Figs. 15, 17) with one or more grounding points 318 (see Figures 15, 17) to divert the electrical charge 302 (see Figure 17) from surface 28 (see Figures 15, 17) to one or more grounding points 318 (see Figures 15, 17).

As shown in figure 18, method 400 may further comprise step 410 of optionally applying a conductive coating 340 (see figures 15, 17) over the direct etch conductive material 320 (see figures 15, 17). As discussed above, conductive coating 340 (see Figures 13A-13B) may be in the form of a conductive metal paint 340a (see Figures 13A-13B, 17) made of or containing conductive metal material 336a ( see figure 17) comprising one or more of copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof and other suitable conductive metal materials 336a (see figure 17). In another embodiment, conductive coating 340 (see Figures 13A-13B) may be in the form of a conductive sealer 340b (see Figure 17) made of or containing a conductive metallic material 336a (see Figure 17) comprising a or more of copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof and other suitable conductive metal materials 336a (see Figure 17). Conductive sheath 340 (see Figures 13A-13B) provides full surface protection to dissipate or spread electrical charge 302 (see Figure 17), energy 362 (see Figure 17) from a lightning strike 302a ( see figure 17) or energy 362 (see figure 17) from static (P-static) precipitation 302b (see figure 17). Use of the metal-loaded conductive coating 340 (see Figures 13A-13B) applied or deposited onto the direct etch conductive material pattern 320 (see Figures 13A, 17) preferably increases the conductivity 366 (see Figure 17) of the electric conduction path system 300 and provides a continuous conductive surface over direct recording conductive material standard 320 (see figures 13A, 17) for increased lightning protection.

As shown in figure 18, method 400 may further comprise step 412 of optionally applying an upper cover layer 344 (see figures 15, 17) on conductive coating 340 (see figures 15, 17 ). As discussed above, the upper cover layer 344 (see Figures 14A-14B) may function as a protective coating on all or substantially all of the conductive coating 340 (see Figures 14A-14B), or may be applied to visual or aesthetic appearance purposes. Upper cover layer 344 (see Figures 14A-14B) may comprise a polyurethane paint or coating, a urethane paint or coating, an acrylic paint or coating, a combination thereof, or another suitable upper covering layer 344 (see figure 17). Preferably, the topsheet 344 (see Figures 14A-14B) is durable, abrasion and chemical resistant, heat resistant and visually appealing.

[00198] Modalities of the electrical conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein provide one or more electrical paths 334 (see Figures 11A-15, 17) which are printed or deposited by a direct embossing printing process 124 (see figure 17) on a first surface 306a (see figure 11 A) of a substrate 304 (see figure 11 A), or a surface 28 (see figure 17) of a structure 30 (see figure 17), such as an outer surface 309 (see figure 17) of an aircraft structure 350 (see figure 17), and which carry the cargo 302 (see Figure 17), or electricity, from the first surface 306a (see Figure 11A) of substrate 304 (see Figure 11A), or from surface 28 (see Figure 17) of structure 30 (see Figure 17) to and between one or more ground points 318 (see Figures 11A-15, 17). The one or more electrical paths 334 (see figures 11A-15, 17) are preferably printed or deposited as a direct etching conductive material pattern 320 (see figures 11A-15, 17), in the form of a grid pattern. 320a (see figure 11A, 17). The one or more electrical paths 334 (see Figures 11A-15, 17) may be constructed of a conductive material 336, such as a conductive metal material 336a, or a conductive paint 168 (see Figure 17), such as a lead zirconate titanate (PZT) nanoparticle paint 104 (see Figure 17). Direct recording conductive material pattern 320 (see figures 11A-15, 17), such as a grid pattern 320a (see figures 11A-15, 17), is configured to maximize conductivity 366 (see figure 17 ) and flexibility 368 (see Figure 17). Optionally, a conductive coating 340 (see figures 13A, 15, 17) may be added over the direct etch conductive material pattern 320 (see figure 13A) to increase conductivity 366 (see figure 17) and provide a surface continuous conductive over grid pattern 320a (see figures 11A-15, 17) for increased lightning protection.

The direct embossing conductive material pattern 320 (see Figures 11A-15, 17), such as a grid pattern 320a (see Figures 11A-15, 17), is printed or deposited directly on an outer surface. 309, such as, for example, an outer shape line 310 (see figure 17) of outer surface 309 (see figure 17), such as a flight control surface 350a (see figure 17), which may be made of a fiberglass material 311 (see Figure 17), and does not require any special assembly of the fiberglass layers. Thus, the electrical conduction path system 300 (see figures 11A-14B, 17) does not affect the construction or design of structure 30 (see figure 17), such as a composite structure 102 (see figure 7) or a metal frame 132 (see figure 7), and decreases the chance of any micro-cracks forming. The use of direct embossing printing process 124 (see figure 17) can be applied directly to the outer shape line 310 (see figure 17) of the outer surface 309 (see figure 17) rather than embedded in the layers of glass fibers from the substrate 304 (see Figure 11A) or flight control surface 350a (see Figure 17).

The electrical conduction path system 300 (see Figures 11A-14B, 17) disclosed herein does not require fabrication with a special layer assembly process, which can result in reduced fabrication time and cost. In addition, the direct embossing conductive material pattern 320 (see Figures 11A-15, 17), as in the form of grid pattern 320a (see Figure 11A, 17), may be printed or deposited during manufacture. of structure 30 (see figure 17), such as an aircraft structure 350 (see figure 17), and does not require application in a less permanent secondary operation after fabrication.

In addition, embodiments of the electrical conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein provide protection against electromagnetic effects 360 (see Figure 17) because of lightning strikes 302a (see figure 17) and deflect electrical charge 302 (see figure 17), as well as lightning strikes 302a (see figure 17) and P-static 302b (see figure 17). Figure 17 on surface 28 (see Figures 15, 17.) The direct-etching conductive material pattern 320 (see Figures 11A-15, 17) in the form of a grid pattern 320a (see Figure 11A, 17 ), and optional conductive sheath 340 (see figure 17), can be used with one or more grounding points 318 (see figure 17) to provide one or more electrical paths 334 (see figure 17) for grounding to the electrical charge 302 (see figure 17) and energy 362 (see figure 17) from lightning strikes 302a (see figure 17) or P-static 302b (see figure 17). The electrical conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein further provide a conductive path for lightning current diversion and distribution which, in combination with the ground points 318 (see Figure 17), such as fasteners 348 (see Figure 17), and other features, provide a lightning protection path 358 (see Figure 17) and a lightning protection system 356 ( see figure 17) for frames 30 (see figure 17), such as composite frames 102 (see figure 7) or metal frames 132 (see figure 7), and provide protection for vehicle 26 (see Figure 17), such as aircraft 26a (see Figure 17), structures 30 (see Figure 17) and systems 50 (see Figure 1C). The disclosed embodiments of the electric conduction path system 300 (see figures 11A-14B, 17) and method 400 (see figure 18) advantageously divert electric charge 302 (see figure 17) from a lightning strike 302a. (see figure 17) or P-static 302b (see figure 17) to create a robust lightning protection system 356 (see figure 17) for a vehicle 26 (see figure 17), such as an aircraft 26a (see figure 17).

With embodiments of the electrical conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein, if there is a direct lightning strike 302a (see Figure 17 ) in the area or region of the direct recording conductive material pattern 320 (see figures 11A-15, 17), such as in the form of grid pattern 320a (see figure 11 A, 17), over one or more points. 318 (see figure 17), such as fasteners 348 (see figure 71), electrical conduction path system 300 (see figures 11A-14B, 17) protects the underlying structure 30 (see figure 17 ) of substrate 304 (see figure 17). The electrical conduction path system 300 (see Figures 11A-14B, 17) does not affect the construction of the composite material or component part to which it is applied.

In addition, embodiments of the electric conduction path system 300 (see figures 11A-14B, 17) and method 400 (see figure 18) disclosed herein provide an electric conduction path system 300 (see 11A-14B, 17) and lightning protection system 356 (see Figure 17) for flexible surfaces 307 (see Figure 17), such as flight control surfaces 350a (see Figure 17), more and installable than known lightning protection systems and methods. Direct embossing printing process 124 (see figure 17) preferably produces a very fine grid line 326 (see figure 17) of metallic particles of conductive material 336 (see figure 17), allowing grid pattern 320a (see figure 17) is printed or deposited on a flexible surface 307 (see figure 17). In addition, direct embossing printing process 124 (see Figure 17) results in a thin metallic deposit adhering to substrate 304 (see Figure 11A), such as flight control surface 350a (see Figure 17) made of fiberglass, and can better handle the fatigue of a flexible surface 307 (see figure 17) than known lightning protection systems and methods such as embedded wire mesh designs or layer overlays of known metal mesh.

In addition, embodiments of the electric conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein may have increased durability and repairability which may eliminate or decrease the amount of repairs that may be required. Direct embossing conductive material pattern 320 (see figures 11A-15, 17), such as grid pattern 320a (see figures 11A-15, 17), is discontinuous and can be reapplied or repaired in situ more easily. when compared to known lightning protection systems and methods such as known appliques which include a continuous layer applied with an adhesive and cannot be easily repaired or reapplied.

Additionally, embodiments of the electrical conduction path system 300 (see Figures 11A-14B, 17) and method 400 (see Figure 18) disclosed herein may be printed, deposited or applied directly to an external surface 309. (see figure 17) that requires protection, such as a flight control surface 350a, but is also a conductor 364 (see figure 17) that can achieve high conductivity 366 (see figure 17) and can be modeled to achieve such high conductivity 366 (see figure 17). The use of a metal-loaded conductive coating 340 (see Figure 17) applied over the direct etch conductive metal pattern 320 (see Figure 17) further increases conductivity 366 (see Figure 17). Finally, an upper cover layer 344 (see Figure 17) may be applied for visual appearance or additional protection.

Clause 1. An aircraft comprising: an aircraft structure having an electric conduction path system, the electric conduction path system comprising: a prepared substrate having a printable surface and having one or more grounding points;

A direct embossing conductive material pattern comprising a grid pattern printed directly on the surface prepared by means of a direct embossing printing process, the direct embossing conductive pattern forming one or more electrical paths interconnected with one another. or more grounding points;

[00210] a conductive coating applied over the direct etching conductive material standard; and an upper cover layer applied over the conductive coating, wherein the one or more electrical paths interconnected with one or more ground points divert an electrical charge from one or more of a lightning strike and static (P-static) precipitation on an external surface of the aircraft structure to one or more ground points.

Clause 2. The aircraft of Clause 1 wherein the direct etching conductive material pattern is made of a conductive material comprising one or more of copper, aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof. and a lead zirconate titanate (PZT) nanoparticle paint.

Clause 3. The aircraft of Clause 1 wherein the direct embossing printing process comprises one or more of an atomized jet deposition process, an inkjet printing process, an aerosol printing process, a pulsed laser evaporation process, a flexo printing process, a micropulverization printing process, a flat cradle silk screen printing process, a rotary silk screen printing process, an engraving printing process and a plasma spraying process.

Clause 4. The aircraft of Clause 1 wherein one or more grounding points comprise one or more of one or more fasteners made of a conductive metal material, and one or more grounding elements and one or more grounding connections. , both made of conductive metallic material.

Many modifications and other embodiments of the disclosure will arise in the minds of those skilled in the art to which this disclosure belongs having the benefit of the precepts set forth in the foregoing descriptions and associated drawings. The embodiments described herein are intended to be illustrative and not intended to be limiting or exhaustive. Although specific terms are used throughout this document, they are used only in a generic and descriptive sense and not for purposes of limitation.

Claims (15)

1. Electrical conduction path system for diverting an electrical charge means an electrical conduction path system characterized in that it comprises: a substrate (101) having a first printable surface and having one or more grounding points (318 ); and a direct embossing conductive pattern (320) printed directly to the first surface by a direct embossing printing process, the direct embossing conductive pattern (320) forming one or more electrical paths (334) interconnected with one or more ground points (318), wherein the one or more electrical paths (334) interconnected with one or more ground points (318) divert the electrical charge from the first surface to one or more ground points ( 318). A system according to claim 1, characterized in that the substrate (101) has a primer layer (330) applied on the first substrate surface (101) to form a prepared substrate (101) having a prepared surface. , and the direct etch conductive material pattern (320) is printed directly onto the prepared surface. System according to Claims 1 and 2, characterized in that the substrate (101) comprises one or more of a fiberglass material, a composite material, a metallic material and a combination of the composite material and the material. metallic. System according to any one of claims 1 to 3, characterized in that it further comprises a conductive coating applied over the direct etching conductive material pattern (320). A system according to claim 4, characterized in that the conductive coating comprises one or more of a conductive metal paint and a conductive sealer both of the conductive metal paint and the conductive sealant having a conductive metal material comprising one or more of copper, aluminum, titanium, nickel, bronze, gold, silver and an alloy thereof. System according to claim 4, characterized in that it further comprises an upper cover layer (344) applied to the conductive coating. A system according to any one of claims 1 to 6, characterized in that the direct etching conductive material pattern (320) is made of a conductive material comprising one or more of copper, aluminum, titanium, nickel, bronze. , gold, silver, an alloy thereof and a lead zirconate titanate (PZT) nanoparticle paint. A system according to any one of claims 1 to 7, characterized in that the direct embossing printing process comprises one or more of an atomised jet deposition process, an inkjet printing process, a process aerosol printing process, a pulsed laser evaporation process, a flexographic printing process, a micropulverization printing process, a flat cradle silk screen printing process, a rotary silk screen printing process, a gravure printing and a plasma spraying process. System according to any one of claims 1 to 8, characterized in that the electric charge comprises one or more of the electric charge from a lightning strike and the electric charge from static (P-static) precipitation. 10. A method of fabricating an electrical conduction path system for diverting an electrical charge into a structure, the method comprising the steps of: providing the structure having a printable surface and having one or more points. grounding (318); printing, by means of a direct embossing printing process, a direct embossing conductive material pattern (320) on the surface of the structure to form one or more electrical paths (334); and interconnecting one or more electrical paths (334) with one or more ground points (318) to divert the surface electrical charge to one or more ground points (318). Method according to claim 10, characterized in that it further comprises, prior to printing, applying a primer layer (330) on the surface of the structure. Method according to claim 11, characterized in that it further comprises, after interconnection, applying a conductive coating over the direct etching conductive material pattern (320). Method according to any one of claims 10 to 12, characterized in that it further comprises, after applying the conductive coating, applying an upper covering layer (344) on the conductive coating. A method according to any one of claims 10 to 13, characterized in that printing further comprises printing the direct embossing conductive material pattern (320) comprising a grid pattern made of a conductive material comprising one or more copper. , aluminum, titanium, nickel, bronze, gold, silver, an alloy thereof and a lead zirconate titanate (PZT) nanoparticle paint. A method according to any one of claims 10 to 14, characterized in that printing further comprises printing by direct embossing printing process comprising one or more of an atomised jet deposition process, a process of inkjet printing, an aerosol printing process, a pulsed laser evaporation process, a flexography printing process, a micropulverization printing process, a flat cradle silk screen printing process, a printing process rotary silk screen, a gravure printing process and a plasma spraying process.