BG104609A - Sulphate electrolyte for stannic-bismuth coating deposition - Google Patents
Sulphate electrolyte for stannic-bismuth coating depositionInfo
- Publication number
- BG104609A BG104609A BG104609A BG10460900A BG104609A BG 104609 A BG104609 A BG 104609A BG 104609 A BG104609 A BG 104609A BG 10460900 A BG10460900 A BG 10460900A BG 104609 A BG104609 A BG 104609A
- Authority
- BG
- Bulgaria
- Prior art keywords
- stannic
- electrolyte
- bismuth
- sulphate
- alkylpolyglycoester
- Prior art date
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
Abstract
The electrolyte is used in different spheres of the electronic and the electrical industry, instrumentation and mechanical engineering for the deposition of stannic-bismuth alloy. The electrolyte is based on stannic sulphate, sulphuric acid, bismuth nitrate, sodium chloride and contains a combination of non-ionogenous surfactants, including alkylpolyglycoester with the general formula CnH2 n+1 O(CH2CH2O)mH, wherein n has the values from 16 to 18, and m is 25, with a concentration of 1.0 to 2.0 g/l and alkylpolyglycoester, for which n has the value of 12 to 15, and m is 20, with concentration from 0.5 to 1.5 g/l and citric acid from 1.0 to 2.0 g/l. The electrodeposition of the stannic-bismuth alloy occurs in a wide range of cathode current density from 0.6 to 8.0 A/dm2 and operating temperature from 18 to 35 degrees C in stationary and drum conditions. From the sulphate electrolyte stannic-bismuth coating is deposited with bismuth content from 0.2 to 4 %. The depositions are light gray to gray, even, fine-crystallization with good fusion which is preserved during storage for 12 months and high electric conductivity. The electrochemical stability of the electrolyte ranges from 400 to 500 Ah/l. 1 claim
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BG104609A BG63642B1 (en) | 2000-07-14 | 2000-07-14 | Sulphate electrolyte for stannic-bismuth coating deposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BG104609A BG63642B1 (en) | 2000-07-14 | 2000-07-14 | Sulphate electrolyte for stannic-bismuth coating deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BG104609A true BG104609A (en) | 2002-02-28 |
| BG63642B1 BG63642B1 (en) | 2002-07-31 |
Family
ID=3928130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BG104609A BG63642B1 (en) | 2000-07-14 | 2000-07-14 | Sulphate electrolyte for stannic-bismuth coating deposition |
Country Status (1)
| Country | Link |
|---|---|
| BG (1) | BG63642B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111188069A (en) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | Tin-plated bismuth alloy solution and preparation method thereof |
-
2000
- 2000-07-14 BG BG104609A patent/BG63642B1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111188069A (en) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | Tin-plated bismuth alloy solution and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| BG63642B1 (en) | 2002-07-31 |
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